DANIEL J.

DUDKA
dandudka@msn.com

Nashua, NH 03064

SUMMARY
Manufacturing / Supplier Quality Engineer with proven leadership and problem solving
capabilities. Offering expertise in SMT, Thru-Hole, Electro-Mechanical Assembly, New Product
Introduction, Process and Product Development, and Root-Cause-Corrective-Action; supporting
the Medical Device, Automotive, Defense, and other related industries. Optimizing cost and ontime delivery. Formally a Certified IPC-A-610 / J-Std-001 Trainer. Lead Auditor with Medical
Device Focus (ISO 13485:2003), ASQ CQE. Familiarity with InFor, SAP, and MiniTab.

EXPERIENCE
St. Jude Medical, LightLab Imaging Inc., Westford, Massachusetts
2012 July 2015
Senior Supplier Quality Engineer - Cardiovascular and Ablation Technologies Division (CATD),
Quality Engineer for the Receiving Inspection Lab, Supported the Optical Coherence
Tomography Catheter and Systems production. Provided Engineering support for First Article
Inspection, developed / established inspection methods, monitored tooling calibration / preventive
maintenance. Coached, and mentored technical team.

Supported Supplier Development, Corrective Actions and Supplier Audits as required; Proper
control and disposition of non-conforming material.
During a 3 month period served as interim supervisor for the incoming inspection area. While
in this role interviewed and hired additional personnel, helped reduce area material backlog
by 29%, directed inspection priorities and reports.

Mercury Systems, Chelmsford, Massachusetts

2008 2012
Principal Process Engineer
Supported Printed Circuit Boards, Backplanes, Modules, and Chassis level product introductions
and follow-up. Provided documentation support, design reviews, process routings, material
handling, tooling, fixturing, vendor support, and packaging. Worked closely with
cross-functional teams to ensure 100% customer satisfaction, on-time and within budget.

Lead Process Engineer for the Patriot Radar (RDP) Module, this was the most strategic and
complex system the company had delivered to date. Working under a very aggressive timeline, ensured all initial systems were delivered on schedule; Supported de-bug and corrective
actions, trained assembly personnel to achieve steady-state production.
Completed Needs / Gap solder training analysis, became the Certified IPC-A-610 / J-Std-001
Trainer. Provided training for the Chelmsford and Salem locations, saved $9,000 in training
cost the first year.
Provided Industrial Engineering support during the 4,800 sq. ft. re-design/expansion of the
Services and Systems Integration (SSI) Lab. As Team Lead, this floor layout included proper
material flow, storage, and work space for optimized area utilization. Project was completed
on time and under budget.

Autoliv (Formally M/A-COM), Lowell, Massachusetts

1997 2008
Principal Manufacturing / Supplier Quality Engineer
Provided support for the Short-Range-Sensor, Collision Avoidance System, currently in high
volume production for Mercedes. Prior to this, was Lead Mfg. Eng. for the Filter, High Power
Amplifier and Multi-Function-Assembly Groups. Supported DFM initiatives, floor support, and
ECO reviews. Received Multiple Spot Bonus Awards by exceeding management expectations.

Oversaw the NPI and DFM process for the Short-Range-Sensor, and added critical Design
Recommendations. Lead and coordinated PPAP and 8D root cause analysis problem solving
with suppliers and internal development team. Completed Design Documentation Reviews
leading to many improvements in the overall reliability and safety of the product.

DANIEL J. DUDKA

Page two

Supported antenna layer process improvements which enabled the antenna layer to be
laminated into the FR4 layer of the RF board, providing superior RF board performance with
significant cost and labor reductions.
Lead an effort to convert from White-Tin to Electroless-Nickel-Immersion-Gold (ENIG) plating.
This greatly improved SMT soldering, minimized rework, and provided $60,000 annual PCB
material savings.
Used Process Maps, FMEA, DOE, and SPC tools, completed a Six Sigma Black Belt Project
for the Short-Range-Sensor, which saved $96,000 in the first 12 months.
Developed a unique board to board connector system, reducing connector material costs by
75%.
Developed and Qualified a Heat Staking Assembly process to install a Gortex Breather into a
plastic housing in order to meet stringent automotive environmental requirements.
Completed dozens of supplier audits both domestic and international, to ensure incoming
material met all design and manufacturing specifications.

OTHER RELEVANT EXPERIENCE

Benchmark Electronics, Nashua, New Hampshire
Principal Manufacturing Engineer
Responsible for Prototype and NPI in accordance with customer delivery schedules and
specifications. Provided DFM support to ensure the products met industry criteria. Supported all
phases of thru-hole and SMT assembly, provided detailed rework procedures as required.
Supported projects involving Thermally and Electrically Conductive Adhesives, Flexible Circuits,
Fine Pitch SMT, Double Sided SMT, Hot Bar soldering, Leadless Chip Carriers, and PCB Plating.

Supported the evaluation and implementation of a new bar code label able to withstand both
SMT and bottom side wave soldering, reducing material costs by 42%
Provided lead support for the review, revision, & release of the Design for Manufacturability
Manual. This provided potential customers critical design for assembly parameters.
Developed a computer program to optimize the panelization of small circuit boards, and
minimize material and assembly costs.
Developed a Circuit Board Drawing check list to ensure critical board design/assembly
parameters are properly covered during the early phase of product introduction.

Supervisor, Configuration Management & Drafting

Supervised 11 Configuration Managers, Draftsmen, and Reprographics personnel: managed the
control and release of all documentation, Printed Circuit Board Artwork, and production released
software: Supported the companys first efforts to control engineering drawings, received from an
outside customer, in a contract manufacturing environment.
Senior Manufacturing Engineer
Provided Methods engineering and Auto-insertion Area support, during the companys initial startup phase into production and for several years thereafter, Introduced the first use of CAD
generated auto-insertion data: developed a d-Base program to manage the spare parts inventory;
Simplified documentation deviation and change procedures by consolidating twelve forms into
two. These procedures have been widely used and have since been integrated as part of the ISO
9002 operating process.
IBM Corp. Burlington GTD, Essex Junction, Vermont
Associate Manufacturing Engineer
Responsible for the Chemical Mixing Area. Ensured proper engineering to control chemical
quality/supply, tools, documentation, and safety; provided timely process problem solving for
Mixing Area and semiconductor manufacturing line; overall direction planning, and work
assignments for technicians; engaged in process development and expansion projects.

EDUCATION
B.S., Chemical Engineering, University of Notre Dame, Notre Dame, IN
B.A., Liberal Arts, Saint Anselm College, Manchester, NH