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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

D Low Power Consumption


D Wide Common-Mode and Differential

D
D
D
D

Voltage Ranges

D Low Input Bias and Offset Currents


D Output Short-Circuit Protection
D Low Total Harmonic

High Input Impedance . . . JFET-Input Stage


Latch-Up-Free Operation
High Slew Rate . . . 13 V/s Typ
Common-Mode Input Voltage Range
Includes VCC+

Distortion . . . 0.003% Typ

description/ordering information
The TL08x JFET-input operational amplifier family is designed to offer a wider selection than any previously
developed operational amplifier family. Each of these JFET-input operational amplifiers incorporates
well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. The devices feature
high slew rates, low input bias and offset currents, and low offset-voltage temperature coefficient. Offset
adjustment and external compensation options are available within the TL08x family.
The C-suffix devices are characterized for operation from 0C to 70C. The I-suffix devices are characterized
for operation from 40C to 85C. The Q-suffix devices are characterized for operation from 40C to 125C.
The M-suffix devices are characterized for operation over the full military temperature range of 55C to 125C.
ORDERING INFORMATION
TJ

VIOmax
AT 255C
PDIP (P)
PDIP (N)

SOIC (D)
0C to 70C

ORDERABLE
PART NUMBER

PACKAGE

15 mV
SOP (PS)
SOP (NS)

TSSOP (PW)

TOP-SIDE
MARKING

Tube of 50

TL081CP

TL081CP

Tube of 50

TL082CP

TL082CP

Tube of 25

TL084CN

TL084CN

Tube of 75

TL081CD

Reel of 2500

TL081CDR

Tube of 75

TL082CD

Reel of 2500

TL082CDR

Tube of 50

TL084CD

Reel of 2500

TL084CDR

Reel of 2000

TL081CPSR

T081

Reel of 2000

TL082CPSR

T082

Reel of 2000

TL084CNSR

TL084

Tube of 150

TL082CPW

Reel of 2000

TL082CPWR

Tube of 90

TL084CPW

Reel of 2000

TL084CPWR

TL081C
TL082C
TL084C

T082
T084

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated

  ! " #$%! "  &$'(#! )!%*


)$#!" # ! "&%##!" &% !+% !%"  %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/  (( &%!%"*

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$(%"" !+%-"% !%)*  (( !+% &)$#!" &)$#!
&#%""/ )%" ! %#%""(. #($)% !%"!/  (( &%!%"*

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

description/ordering information (continued)


ORDERING INFORMATION
TJ

VIOmax
AT 255C

PACKAGE

TL081ACP

TL081ACP

Tube of 50

TL082ACP

TL082ACP

Tube of 25

TL084ACN

TL084ACN

Tube of 75

TL081ACD

Reel of 2500

TL081ACDR

Tube of 75

TL082ACD

Reel of 2500

TL082ACDR

Tube of 50

TL084ACD

Reel of 2500

TL084ACDR

SOP (PS)

Reel of 2000

TL082ACPSR

T082A

SOP (NS)

Reel of 2000

TL084ACNSR

TL084A

Tube of 50

TL081BCP

TL081BCP

Tube of 50

TL082BCP

TL082BCP

Tube of 25

TL084BCN

TL084BCN

Tube of 75

TL081BCD

Reel of 2500

TL081BCDR

Tube of 75

TL082BCD

Reel of 2500

TL082BCDR

Tube of 50

TL084BCD

Reel of 2500

TL084BCDR

Tube of 50

TL081IP

TL081IP

Tube of 50

TL082IP

TL082IP

Tube of 25

TL084IN

TL081IN

Tube of 75

TL081ID

Reel of 2500

TL081IDR

Tube of 75

TL082ID

Reel of 2500

TL082IDR

Tube of 50

TL084ID

Reel of 2500

TL084IDR

Reel of 2000

TL082IPWR

Tube of 50

TL084QD

Reel of 2500

TL084QDR

CDIP (J)

Tube of 25

TL084MJ

TL084MJ

LCCC (FK)

Reel of 55

TL084FK

TL084FK

CDIP (JG)

Tube of 50

TL082MJG

TL082MJG

PDIP (N)

0C to 70C

SOIC (D)

PDIP (P)
PDIP (N)

3 mV
SOIC (D)

PDIP (P)
PDIP (N)

40C to 85C

6 mV
SOIC (D)

TSSOP (PW)
40C to 125C

9 mV
9 mV

55C to 125C
6 mV

TOP-SIDE
MARKING

Tube of 50
PDIP (P)

6 mV

ORDERABLE
PART NUMBER

SOIC (D)

081AC
082AC
TL084AC

081BC
082BC
TL084BC

TL081I
TL082I
TL084I
Z082
TL084QD

LCCC (FK)
Tube of 55
TL082MFK
TL082MFK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TL081, TL081A, TL081B


D, P, OR PS PACKAGE
(TOP VIEW)

OFFSET N1
IN
IN +
VCC

TL084, TL084A, TL084B


D, J, N, NS, OR PW PACKAGE
(TOP VIEW)

TL082, TL082A, TL082B


D, JG, P, PS, OR PW PACKAGE
(TOP VIEW)

NC
VCC +
OUT
OFFSET N2

1OUT
1IN
1IN +
VCC

VCC +
2OUT
2IN
2IN +

1OUT
1IN
1IN +
VCC +
2IN +
2IN
2OUT

NC No internal connection

14

13

12

11

10

4OUT
4IN
4IN +
VCC
3IN +
3IN
3OUT

TL084M . . . FK PACKAGE
(TOP VIEW)

1IN
1OUT
NC
4OUT
4IN

NC
1OUT
NC
VCC+
NC

TL082M . . . FK PACKAGE
(TOP VIEW)

3 2 1 20 19
18

17

16

15

14
9 10 11 12 13

NC
2OUT
NC
2IN
NC

1IN +
NC
VCC +
NC
2IN +

3 2 1 20 19
18

17

16

15

14
9 10 11 12 13

4IN +
NC
VCC
NC
3IN +

2IN
2OUT
NC
3OUT
3IN

NC
VCC
NC
2IN +
NC

NC
1IN
NC
1IN +
NC

NC No internal connection

NC No internal connection

symbols
TL081

TL082 (EACH AMPLIFIER)


TL084 (EACH AMPLIFIER)

OFFSET N1
IN +

IN

OUT

IN +

IN

OUT

OFFSET N2

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

schematic (each amplifier)


VCC +

IN +
64

IN

OUT
128
64
C1

1080

1080
VCC

OFFSET N2

OFFSET N1

TL081 Only
Component values shown are nominal.

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
TL08_C
TL08_AC
TL08_BC

TL08_I

TL084Q

TL08_M

UNIT

Supply voltage, VCC + (see Note 1)

18

18

18

18

Supply voltage VCC (see Note 1)

18

18

18

18

Differential input voltage, VID (see Note 2)

30

30

30

30

V
V

15

15

15

15

Unlimited

Unlimited

Unlimited

Unlimited

0 to 70

40 to 85

D package (8-pin)

97

97

D package (14-pin)

86

86

N package (14-pin)

76

76

NS package (14-pin)

80

P package (8-pin)

85

85

PS package (8-pin)

95

95

PW package (8-pin)

149

Input voltage, VI (see Notes 1 and 3)


Duration of output short circuit (see Note 4)
Continuous total power dissipation

See Dissipation Rating Table

Operating free-air temperature range, TA

Package thermal impedance, JA


(see Notes 5 and 6)

PW package (14-pin)
Operating virtual junction temperature

113

113

150

150

40 to 125

55 to 125

C/W

150

150

Case temperature for 60 seconds, TC

FK package

260

Lead temperature 1,6 mm (1/16 inch) from case


for 60 seconds

J or JG package

300

Storage temperature range, Tstg


65 to 150 65 to 150 65 to 150 65 to 150
C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC + and VCC .
2. Differential voltages are at IN+ with respect to IN .
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
4. The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the
dissipation rating is not exceeded.
5. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
DISSIPATION RATING TABLE
PACKAGE

TA 25C
POWER RATING

D (14 pin)

680 mW

FK
J
JG

DERATING
FACTOR

DERATE
ABOVE TA

TA = 70C
POWER RATING

TA = 85C
POWER RATING

TA = 125C
POWER RATING

7.6 mW/C

60C

604 mW

490 mW

186 mW

680 mW

11.0 mW/C

88C

680 mW

680 mW

273 mW

680 mW

11.0 mW/ C

88C

680 mW

680 mW

273 mW

680 mW

8.4 mW/C

69C

672 mW

546 mW

210 mW

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6
VO = 0

VO = 0
VO = 0

Temperature
coefficient of input
offset voltage

Input offset current

Input bias current

VIO

IIO

IIB

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25C

Common-mode
rejection ratio

CMRR

VO = 0,

No load

VCC = 15 V to 9 V,
VO = 0,
RS = 50

VIC = VICRmin,
RS = 50
VO = 0,

25C

25C

Full range

25C

Full range

12

70

70

15

25

10

1.4

86

86

80

75

1.4

86

86

200

12

13.5

1012

25

50

10

12

12

11

12
to
15

30

18

TYP

2.8

10

400

MIN

1012

200

12

13.5

11

12

12
to
15

30

200

20

15

MAX

TL081AC
TL082AC
TL084AC

2.8

200

100

7.5

MAX

80

75

25

50

10

12

12

11

MIN

1.4

86

86

1012

200

12

13.5

12
to
15

30

18

TYP

TLO81BC
TL082BC
TL084BC

2.8

200

100

MAX

80

75

25

50

10

12

12

11

MIN

1.4

86

86

1012

200

12

13.5

12
to
15

30

18

TYP

TL081I
TL082I
TL084I

2.8

20

200

10

100

MAX

mA

dB

dB

MHz

V/mV

nA

pA

nA

pA

V/C

mV

UNIT

VO1/ VO2 Crosstalk attenuation AVD = 100


25C
120
120
120
120
dB
All characteristics are measured under open-loop conditions with zero common-mode voltage, unless otherwise specified. Full range for TA is 0C to 70C for TL08_C, TL08_AC,
TL08_BC and 40C to 85C for TL08_I.
Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 17. Pulse techniques must be used
that maintain the junction temperature as close to the ambient temperature as possible.

ICC

Supply-voltage
rejection ratio
( VCC / VIO)
Supply current
(per amplifier)

25C

Input resistance

ri

kSVR

25C

Unity-gain bandwidth

B1

VO = 10 V,

VO = 10 V,
RL 2 k

Large-signal
differential voltage
amplification

AVD

RL 2 k

RL 10 k

VOM

25C

Maximum peak
output voltage swing

25C

Full range

25C

Full range

25C

TYP

18

MIN

TL081C
TL082C
TL084C

Full range

Full range

Common-mode input
voltage range

RL 2 k

RS = 50

RS = 50

25C

VICR
RL = 10 k

VO = 0

Input offset voltage

TEST CONDITIONS

VIO

PARAMETER

TA

electrical characteristics, VCC = 15 V (unless otherwise noted)

222 2 2 



2
2

32 2  
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

        



 
 

     
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

electrical characteristics, VCC = 15 V (unless otherwise noted)


PARAMETER

TEST CONDITIONS

TA

TL081M, TL082M

TL084Q, TL084M

MIN

MIN

25C

TYP

MAX

VIO

Input offset voltage

VO = 0,

RS = 50

Full range

VIO

Temperature
coefficient of input
offset voltage

VO = 0

RS = 50

Full range

18

Input offset current

25C

IIO

VO = 0

125C

IIB

Input bias current

VO = 0

125C

VICR

Common-mode input
voltage range

VOM

Maximum peak
output voltage swing

AVD
B1
ri
CMRR

kSVR
ICC

Large-signal
differential voltage
amplification

RL 10 k

100

200

30

50
11

12
to
15

11

12
to
15

25C

12

13.5

12

13.5

12

10

12

200

25

200

25C

25

VO = 10 V,

RL 2 k

Full range

15

100

pA

20

nA

200

pA

50

nA
V

12

RL 2 k

mV

V/C

12

10

VO = 10 V,

UNIT

18

20
30

MAX
15

25C

Full range

RL 2 k

25C

RL = 10 k

TYP

V/mV

Unity-gain bandwidth

25C

Input resistance

25C

15
3
1012

3
1012

MHz

Common-mode
rejection ratio

VIC = VICRmin,
VO = 0,
RS = 50

25C

80

86

80

86

dB

Supply-voltage
rejection ratio
(VCC /VIO)
Supply current
(per amplifier)

VCC = 15 V to 9 V,
VO = 0,
RS = 50

25C

80

86

80

86

dB

VO = 0,

25C

No load

1.4

2.8

1.4

2.8

mA

VO1/ VO2 Crosstalk attenuation AVD = 100


25C
120
120
dB
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in
Figure 17. Pulse techniques must be used that maintain the junction temperatures as close to the ambient temperature as possible.

operating characteristics, VCC = 15 V, TA = 25C (unless otherwise noted)


PARAMETER

TEST CONDITIONS
VI = 10 V,

RL = 2 k,

CL = 100 pF,

VI = 10 V,
TA = 55
55C
C to 125
125C,
C,

RL = 2 k,
See Figure 1

CL = 100 pF,

Overshoot factor

VI = 20 mV,

RL = 2 k,

CL = 100 pF,

Vn

Equivalent input noise


voltage

RS = 20

In

Equivalent input noise


current

RS = 20 ,

f = 1 kHz

THD

Total harmonic distortion

VIrms = 6 V,
f = 1 kHz

AVD = 1,

SR

Slew rate at unity gain

tr

Rise time

See Figure 1

TYP

13

See Figure 1

f = 10 Hz to 10 kHz

RL 2 k,

MAX

UNIT
V/s

f = 1 kHz

RS 1 k,

MIN

0.05

20

18

nV/Hz

0.01

pA/Hz

0.003

On products compliant to MIL-PRF-38535, this parameter is not production tested.

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

operating characteristics, VCC = 15 V, TA = 25C


PARAMETER

TEST CONDITIONS

SR

Slew rate at unity gain

tr

Rise time

VI = 10 V,

RL = 2 k,

Overshoot factor

VI = 20 mV,

RL = 2 k,

Vn

Equivalent input noise voltage

RS = 20

In

Equivalent input noise current

RS = 20 ,

f = 1 kHz

THD

Total harmonic distortion

VIrms = 6 V,
f = 1 kHz

AVD = 1,

MIN

CL = 100 pF,
CL = 100 pF,

See Figure 1

See Figure 1

f = 1 kHz
f = 10 Hz to 10 kHz

TYP

MAX

UNIT
V/ s

13
0.05

20

18

nV/Hz
V

RS 1 k,

RL 2 k,

0.01

pA/Hz

0.003

PARAMETER MEASUREMENT INFORMATION

10 k

1 k

OUT
VI

VI

OUT
CL = 100 pF

RL = 2 k

+
CL = 100 pF

RL

Figure 1

Figure 2

100 k
TL081

IN

C2

OUT
+

IN +

C1 500 pF

N2
N1

IN

100 k

N1
OUT

1.5 k
VCC

Figure 3

Figure 4

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE

VOM

AVD

Maximum peak output voltage

vs Frequency
vs Free-air temperature
vs Load resistance
vs Supply voltage

5, 6, 7
8
9
10

Large-signal differential voltage amplification

vs Free-air temperature
vs Frequency

11
12

Differential voltage amplification

vs Frequency with feed-forward compensation

13

PD

Total power dissipation

vs Free-air temperature

14

ICC

Supply current

vs Free-air temperature
vs Supply voltage

15
16

IIB

Input bias current

vs Free-air temperature

17

Large-signal pulse response

vs Time

18

VO
CMRR

Output voltage

vs Elapsed time

19

Common-mode rejection ratio

vs Free-air temperature

20

Vn
THD

Equivalent input noise voltage

vs Frequency

21

Total harmonic distortion

vs Frequency

22

MAXIMUM PEAK OUTPUT VOLTAGE


vs
FREQUENCY

MAXIMUM PEAK OUTPUT VOLTAGE


vs
FREQUENCY
15

VCC = 15 V

RL = 10 k
TA = 25C
See Figure 2

12.5

10

VCC = 10 V

7.5

VCC = 5 V

2.5

0
100

VOM Maximum Peak Output Voltage V

VOM Maximum Peak Output Voltage V

15

RL = 2 k
TA = 25C
See Figure 2

VCC = 15 V

12.5
10

VCC = 10 V
7.5
5
VCC = 5 V
2.5

0
1k

10 k

100 k

1M

10 M

100

f Frequency Hz

1k

10 k

100 k

1M

10 M

f Frequency Hz

Figure 5

Figure 6

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS
MAXIMUM PEAK OUTPUT VOLTAGE
vs
FREQUENCY

MAXIMUM PEAK OUTPUT VOLTAGE


vs
FREE-AIR TEMPERATURE

12.5

TA = 25C

10
TA = 55C
7.5

TA = 125C

2.5

0
10 k

15
VCC = 15 V
RL = 2 k
See Figure 2

VOM Maximum Peak Output Voltage V

VOM Maximum Peak Output Voltage V

15

40 k 100 k

400 k

1M

4M

RL = 10 kW

12.5

RL = 2 kW

10

7.5

2.5

VCC = 15 V
See Figure 2

0
75 50

10 M

25

Figure 7

75

100

10

7.5

2.5

RL = 10 k
TA = 25C

12.5

10

7.5

2.5

0
0.2

0.4

0.7

10

10

12

14

| VCC | Supply Voltage V

RL Load Resistance k

Figure 10

Figure 9

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

10

125

15
VCC = 15 V
TA = 25C
See Figure 2

VOM Maximum Peak Output Voltage V

VOM Maximum Peak Output Voltage V

50

MAXIMUM PEAK OUTPUT VOLTAGE


vs
SUPPLY VOLTAGE

15

0
0.1

25

Figure 8

MAXIMUM PEAK OUTPUT VOLTAGE


vs
LOAD RESISTANCE

12.5

TA Free-Air Temperature C

f Frequency Hz

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS
LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREE-AIR TEMPERATURE
1000
700
AVD Large-Signal Differential
Voltage Amplification V/mV

400
200
100
70
40
20
10
7
4

VCC = 15 V
VO = 10 V
RL = 2 k

2
1
75

50

25

25

50

75

100

125

TA Free-Air Temperature C

Figure 11
LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREQUENCY
106
VCC = 5 V to 15 V
RL = 10 k
TA = 25C

104

Differential Voltage
Amplification
(left scale)

103

102

45

Phase Shift

AVD Large-Signal Differential


Voltage Amplification V/mV

105

90
Phase Shift
(right scale)

101

135

1
1

10

100

1k

10 k

100 k

1M

180
10 M

f Frequency Hz

Figure 12
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREQUENCY WITH FEED-FORWARD COMPENSATION

TOTAL POWER DISSIPATION


vs
FREE-AIR TEMPERATURE
250

VCC = 15 V
C2 = 3 pF
TA = 25C
See Figure 3

105

104

103

102

10

VCC = 15 V
No Signal
No Load

225
PD Total Power Dissipation mW

AVD Differential Voltage Amplification V/mV

106

200
175

TL084, TL085

150
125
100

TL082, TL083

75
TL081

50
25

1
100

1k

10 k

100 k

1M

0
75

10 M

50

25

f Frequency With Feed-Forward Compensation Hz

SUPPLY CURRENT PER AMPLIFIER


vs
FREE-AIR TEMPERATURE

50

75

100

125

SUPPLY CURRENT
vs
SUPPLY VOLTAGE

2.0

2.0
VCC = 15 V
No Signal
No Load

1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2

TA = 25C
No Signal
No Load

1.8
I CC Supply Current mA

I CC Supply Current mA

25

Figure 14

Figure 13

0
75

TA Free-Air Temperature C

1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2

50

25

25

50

75

100

125

0
0

TA Free-Air Temperature C

10

12

14

| VCC | Supply Voltage V

Figure 16

Figure 15

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

12

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

16

        



 
 

     
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE

VOLTAGE-FOLLOWER
LARGE-SIGNAL PULSE RESPONSE
6

100

VCC = 15 V
RL = 2 k
CL = 100 pF
TA = 25C

Input and Output Voltages V

I IB Input Bias Current nA

V CC = 15 V

10

0.1

4
Output
2

2
Input
4

0.01
50

6
25

25

50

75

100

125

0.5

TA Free-Air Temperature C

CMRR Common-Mode Rejection Ratio dB

89

VO Output Voltage mV

24
20
VCC = 15 V
RL = 2 k
CL = 100 pF
TA = 25C
See Figure 1

4
0
4
0

0.2

0.4

2.5

3.5

COMMON-MODE REJECTION RATIO


vs
FREE-AIR TEMPERATURE

28

Figure 18

OUTPUT VOLTAGE
vs
ELAPSED TIME

12

1.5

t Time s

Figure 17

16

0.6

0.8

1.0

1.2

VCC = 15 V
RL = 10 k

88

87

86

85

84

83
75

50

t Elapsed Time s

25

25

50

75

100

125

TA Free-Air Temperature C

Figure 20

Figure 19

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

13

        



 
 

     

SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY

TOTAL HARMONIC DISTORTION


vs
FREQUENCY
1

VCC = 15 V
AVD = 10
RS = 20
TA = 25C

40

30

20

10

0.1
0.04

0.01
0.004

0.001

0
40

10

100

400 1 k

4 k 10 k

VCC = 15 V
AVD = 1
VI(RMS) = 6 V
TA = 25C

0.4
THD Total Harmonic Distortion %

Vn Equilvalent Input Noise Voltage nV/ Hz

50

40 k 100 k

10

400

1k

4k

10 k

40 k 100 k

f Frequency Hz

f Frequency Hz

Figure 22

Figure 21

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

APPLICATION INFORMATION
RF = 100 k
VCC +

Output

TL081
+

CF = 3.3 F

Input

R1

R2

C3

TL081
+

15 V
3.3 k

Output
VCC

1 k
15 V

R1 = R2 = 2(R3) = 1.5 M

R3
3.3 k
f=

C1
9.1 k

1
2 RF CF

Figure 23

14

C2

C1 = C2 = C3 = 110 pF
2
1
fo =
= 1 kHz
2 R1 C1

Figure 24

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

        



 
 

     
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

APPLICATION INFORMATION
VCC +
1 M

TL084

VCC +

Output A

+
1 F

TL084

VCC +

Input

TL084
100 k
100 k
100 F

Output B

100 k

VCC +
VCC +

100 k

TL084

Output C

Figure 25. Audio-Distribution Amplifier


6 sin t

1N4148
15 V

18 pF
18 pF

1 k

18 k
(see Note A)

VCC +

1/2
TL082

88.4 k

VCC+

88.4 k

1/2
TL082
VCC

6 cos t

18 pF

VCC

1 k
15 V

1N4148
88.4 k

18 k
(see Note A)

NOTE A: These resistor values may be adjusted for a symmetrical output.

Figure 26. 100-KHz Quadrature Oscillator

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

15

        



 
 

     

SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

APPLICATION INFORMATION
16 k

16 k
220 pF

220 pF

VCC +
43 k

43 k

1/4
TL084

VCC +
VCC +
43 k

1/4
TL084

1/4
TL084

1.5 k

1/4
TL084

220 pF

VCC +

Input

220 pF

30 k

43 k

43 k

30 k

1.5 k

VCC

43 k

VCC

VCC

VCC

Output A
Output A

Output B

2 kHz/div
Second-Order Bandpass Filter
fo = 100 kHz, Q = 30, GAIN = 4

2 kHz/div
Cascaded Bandpass Filter
fo = 100 kHz, Q = 69, GAIN = 16

Figure 27. Positive-Feedback Bandpass Filter

16

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

Output
B

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Device Marking

(3)

(4/5)

5962-9851501Q2A

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

59629851501Q2A
TL082MFKB

5962-9851501QPA

ACTIVE

CDIP

JG

TBD

A42

N / A for Pkg Type

-55 to 125

9851501QPA
TL082M

5962-9851503Q2A

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

59629851503Q2A
TL084
MFKB

5962-9851503QCA

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

5962-9851503QC
A
TL084MJB

TL081ACD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081AC

TL081ACDE4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081AC

TL081ACDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081AC

TL081ACDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081AC

TL081ACDRE4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081AC

TL081ACDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081AC

TL081ACJG

OBSOLETE

CDIP

JG

TBD

Call TI

Call TI

0 to 70

TL081ACP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL081ACP

TL081ACPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL081ACP

TL081BCD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081BC

TL081BCDE4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081BC

TL081BCDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081BC

Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Device Marking

(3)

(4/5)

TL081BCDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081BC

TL081BCDRE4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081BC

TL081BCDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

081BC

TL081BCP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL081BCP

TL081BCPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL081BCP

TL081CD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL081C

TL081CDE4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL081C

TL081CDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL081C

TL081CDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL081C

TL081CDRE4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL081C

TL081CDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL081C

TL081CP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL081CP

TL081CPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL081CP

TL081CPSR

ACTIVE

SO

PS

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T081

TL081CPSRE4

ACTIVE

SO

PS

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T081

TL081CPSRG4

ACTIVE

SO

PS

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T081

TL081CPWLE

OBSOLETE

TSSOP

PW

TBD

Call TI

Call TI

0 to 70

TL081ID

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Addendum-Page 2

TL081I

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Device Marking

(3)

(4/5)

TL081IDE4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL081I

TL081IDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL081I

TL081IDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL081I

TL081IDRE4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL081I

TL081IDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL081I

TL081IP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TL081IP

TL081IPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TL081IP

TL081MFKB

OBSOLETE

LCCC

FK

20

TBD

Call TI

Call TI

-55 to 125

TL081MJG

OBSOLETE

CDIP

JG

TBD

Call TI

Call TI

-55 to 125

TL081MJGB

OBSOLETE

CDIP

JG

TBD

Call TI

Call TI

-55 to 125

TL082ACD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082AC

TL082ACDE4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082AC

TL082ACDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082AC

TL082ACDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082AC

TL082ACDRE4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082AC

TL082ACDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082AC

TL082ACP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL082ACP

TL082ACPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL082ACP

TL082ACPSR

ACTIVE

SO

PS

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082A

Addendum-Page 3

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Device Marking

(3)

(4/5)

TL082ACPSRE4

ACTIVE

SO

PS

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082A

TL082ACPSRG4

ACTIVE

SO

PS

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082A

TL082BCD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082BC

TL082BCDE4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082BC

TL082BCDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082BC

TL082BCDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082BC

TL082BCDRE4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082BC

TL082BCDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

082BC

TL082BCP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL082BCP

TL082BCPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL082BCP

TL082CD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL082C

TL082CDE4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL082C

TL082CDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL082C

TL082CDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL082C

TL082CDRE4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL082C

TL082CDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL082C

TL082CJG

OBSOLETE

CDIP

JG

TBD

Call TI

Call TI

0 to 70

TL082CP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

Addendum-Page 4

TL082CP

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Device Marking

(3)

(4/5)

TL082CPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL082CP

TL082CPSR

ACTIVE

SO

PS

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082

TL082CPSRG4

ACTIVE

SO

PS

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082

TL082CPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082

TL082CPWE4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082

TL082CPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082

TL082CPWLE

OBSOLETE

TSSOP

PW

TBD

Call TI

Call TI

0 to 70

TL082CPWR

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082

TL082CPWRE4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082

TL082CPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T082

TL082ID

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL082I

TL082IDE4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL082I

TL082IDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL082I

TL082IDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL082I

TL082IDRE4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL082I

TL082IDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL082I

TL082IJG

OBSOLETE

CDIP

JG

TBD

Call TI

Call TI

-40 to 85

TL082IP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TL082IP

TL082IPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TL082IP

Addendum-Page 5

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Device Marking

(3)

(4/5)

TL082IPWR

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Z082

TL082IPWRE4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Z082

TL082IPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Z082

TL082MFK

OBSOLETE

LCCC

FK

20

TBD

Call TI

Call TI

-55 to 125

TL082MFKB

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

59629851501Q2A
TL082MFKB

TL082MJG

ACTIVE

CDIP

JG

TBD

A42

N / A for Pkg Type

-55 to 125

TL082MJG

TL082MJGB

ACTIVE

CDIP

JG

TBD

A42

N / A for Pkg Type

-55 to 125

9851501QPA
TL082M

TL084ACD

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084AC

TL084ACDE4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084AC

TL084ACDG4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084AC

TL084ACDR

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084AC

TL084ACDRE4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084AC

TL084ACDRG4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084AC

TL084ACN

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL084ACN

TL084ACNE4

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL084ACN

TL084ACNSR

ACTIVE

SO

NS

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084A

TL084ACNSRE4

ACTIVE

SO

NS

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084A

TL084ACNSRG4

ACTIVE

SO

NS

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084A

Addendum-Page 6

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Device Marking

(3)

(4/5)

TL084BCD

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084BC

TL084BCDE4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084BC

TL084BCDG4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084BC

TL084BCDR

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084BC

TL084BCDRE4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084BC

TL084BCDRG4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084BC

TL084BCN

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL084BCN

TL084BCNE4

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL084BCN

TL084CD

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084C

TL084CDE4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084C

TL084CDG4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084C

TL084CDR

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084C

TL084CDRE4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084C

TL084CDRG4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084C

TL084CJ

OBSOLETE

CDIP

14

TBD

Call TI

Call TI

0 to 70

TL084CN

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL084CN

TL084CNE4

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

TL084CN

TL084CNSLE

OBSOLETE

SO

NS

14

TBD

Call TI

Call TI

0 to 70

TL084CNSR

ACTIVE

SO

NS

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

Addendum-Page 7

TL084

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Device Marking

(3)

(4/5)

TL084CNSRG4

ACTIVE

SO

NS

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TL084

TL084CPW

ACTIVE

TSSOP

PW

14

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T084

TL084CPWE4

ACTIVE

TSSOP

PW

14

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T084

TL084CPWG4

ACTIVE

TSSOP

PW

14

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T084

TL084CPWLE

OBSOLETE

TSSOP

PW

14

TBD

Call TI

Call TI

0 to 70

TL084CPWR

ACTIVE

TSSOP

PW

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T084

TL084CPWRE4

ACTIVE

TSSOP

PW

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T084

TL084CPWRG4

ACTIVE

TSSOP

PW

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

T084

TL084ID

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL084I

TL084IDE4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL084I

TL084IDG4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL084I

TL084IDR

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL084I

TL084IDRE4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL084I

TL084IDRG4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

TL084I

TL084IJ

OBSOLETE

CDIP

14

TBD

Call TI

Call TI

-40 to 85

TL084IN

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TL084IN

TL084INE4

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TL084IN

TL084MFK

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

TL084MFK

TL084MFKB

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

59629851503Q2A

Addendum-Page 8

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Device Marking

(3)

(4/5)

TL084
MFKB
TL084MJ

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

TL084MJ

TL084MJB

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

5962-9851503QC
A
TL084MJB

TL084QD

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TL084Q

TL084QDG4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TL084Q

TL084QDR

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TL084Q

TL084QDRG4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TL084Q

(1)

The marketing status values are defined as follows:


ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 9

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL082, TL082M, TL084, TL084M :

Catalog: TL082, TL084


Automotive: TL082-Q1, TL082-Q1
Military: TL082M, TL084M
NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product


Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Military - QML certified for Military and Defense Applications

Addendum-Page 10

PACKAGE MATERIALS INFORMATION


www.ti.com

24-Apr-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins


Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

TL081ACDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL081BCDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL081CDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL081CPSR

SO

PS

2000

330.0

16.4

8.2

6.6

2.5

12.0

16.0

Q1

TL081IDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL082ACDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL082ACDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL082ACPSR

SO

PS

2000

330.0

16.4

8.2

6.6

2.5

12.0

16.0

Q1

TL082BCDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL082CDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL082CPWR

TSSOP

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

TL082IDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL082IDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TL082IPWR

TSSOP

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

TL084ACDR

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

TL084ACDR

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

TL084ACNSR

SO

NS

14

2000

330.0

16.4

8.2

10.5

2.5

12.0

16.0

Q1

TL084BCDR

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION


www.ti.com

24-Apr-2013

Device

Package Package Pins


Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

TL084CDR

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

TL084CDRG4

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

TL084CPWR

TSSOP

PW

14

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

TL084IDR

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

TL084QDR

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

TL084QDRG4

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

TL081ACDR

SOIC

2500

340.5

338.1

20.6

TL081BCDR

SOIC

2500

340.5

338.1

20.6

TL081CDR

SOIC

2500

340.5

338.1

20.6

TL081CPSR

SO

PS

2000

367.0

367.0

38.0

TL081IDR

SOIC

2500

340.5

338.1

20.6

TL082ACDR

SOIC

2500

340.5

338.1

20.6

TL082ACDR

SOIC

2500

367.0

367.0

35.0

TL082ACPSR

SO

PS

2000

367.0

367.0

38.0

TL082BCDR

SOIC

2500

340.5

338.1

20.6

TL082CDR

SOIC

2500

367.0

367.0

35.0

TL082CPWR

TSSOP

PW

2000

367.0

367.0

35.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION


www.ti.com

24-Apr-2013

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

TL082IDR

SOIC

2500

340.5

338.1

20.6

TL082IDR

SOIC

2500

367.0

367.0

35.0

TL082IPWR

TSSOP

PW

2000

367.0

367.0

35.0

TL084ACDR

SOIC

14

2500

367.0

367.0

38.0

TL084ACDR

SOIC

14

2500

333.2

345.9

28.6

TL084ACNSR

SO

NS

14

2000

367.0

367.0

38.0

TL084BCDR

SOIC

14

2500

333.2

345.9

28.6

TL084CDR

SOIC

14

2500

333.2

345.9

28.6

TL084CDRG4

SOIC

14

2500

333.2

345.9

28.6

TL084CPWR

TSSOP

PW

14

2000

367.0

367.0

35.0

TL084IDR

SOIC

14

2500

333.2

345.9

28.6

TL084QDR

SOIC

14

2500

367.0

367.0

38.0

TL084QDRG4

SOIC

14

2500

367.0

367.0

38.0

Pack Materials-Page 3

MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997

JG (R-GDIP-T8)

CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8

0.280 (7,11)
0.245 (6,22)

0.063 (1,60)
0.015 (0,38)

4
0.065 (1,65)
0.045 (1,14)

0.310 (7,87)
0.290 (7,37)

0.020 (0,51) MIN

0.200 (5,08) MAX


Seating Plane
0.130 (3,30) MIN

0.023 (0,58)
0.015 (0,38)

015

0.100 (2,54)

0.014 (0,36)
0.008 (0,20)

4040107/C 08/96
NOTES: A.
B.
C.
D.
E.

All linear dimensions are in inches (millimeters).


This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
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which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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