Land Pattern Parameters for BGA

Collapsible/Eutectic Solder Balls

Package PCB Land DogBone Via Route
No. of
Mask on Mask on Pwr Plane Route
Ball Dia. Ball Pitch Land Dia. BGA side Drill Dia. Pad Size BGA side Antipad Trace Space Channels
0.75 1.50 0.61 0.75 0.34 0.63 0.41 0.86 0.13 0.13 2
0.75 1.27 0.61 0.75 0.34 0.63 0.41 0.86 0.13 0.13 2
0.60 1.00 0.45 0.56 0.30 0.61 0.36 0.81 0.13 0.13 1
0.50 1.00 0.40 0.51 0.30 0.61 0.36 0.81 0.13 0.13 1
0.50 0.80 0.40 0.51 0.25 0.48 0.00 0.69 0.10 0.10 1
0.45 1.00 0.35 0.46 0.30 0.61 0.36 0.81 0.13 0.13 1
0.45 0.80 0.35 0.46 0.25 0.48 0.00 0.69 0.10 0.10 1
0.45 0.75 0.35 0.46 0.13 * Micro via - N/A - - -
0.40 0.80 0.30 0.41 0.25 0.48 0.00 0.69 0.10 0.10 1
0.40 0.75 0.30 0.41 0.13 * Micro via - N/A - - -
0.40 0.65 0.30 0.41 0.13 * Micro via - N/A - - -
0.30 0.80 0.25 0.36 0.25 0.48 0.00 0.69 0.10 0.10 1
0.30 0.75 0.25 0.36 0.13 * Micro via - N/A - - -
0.30 0.65 0.25 0.36 0.13 * Micro via - N/A - - -
0.30 0.50 0.25 0.36 0.13 * Micro via - N/A - - -
Notes: NSMD (non-solder masked defined) Land Patterns are recommended.
Dimensions in millimeters (mm).
* Micro via (0.005"-0.006" blind via) in pad will be required with higher circuit densities.
Via in pad is not recommended if the component pitch allows a dog bone micro via with
0.005" minimum pad to pad spacing.
 Land Pattern Parameters for BGA
Collapsible/Eutectic Solder Balls
Package PCB Land DogBone Via Route
No. of
Mask on Mask on Pwr Plane Route
Ball Dia. Ball Pitch Land Dia. BGA side Drill Dia. Pad Size BGA side Antipad Trace Space Channels
0.030 0.059 0.024 0.030 0.013 0.025 0.016 0.034 0.005 0.005 2
0.030 0.050 0.024 0.030 0.013 0.025 0.016 0.034 0.005 0.005 2
0.024 0.039 0.018 0.022 0.012 0.024 0.014 0.032 0.005 0.005 1
0.020 0.039 0.016 0.020 0.012 0.024 0.014 0.032 0.005 0.005 1
0.020 0.031 0.016 0.020 0.010 0.019 0.000 0.027 0.004 0.004 1
0.018 0.039 0.014 0.018 0.012 0.024 0.014 0.032 0.005 0.005 1
0.018 0.031 0.014 0.018 0.010 0.019 0.000 0.027 0.004 0.004 1
0.018 0.030 0.014 0.018 0.005 * Micro via - N/A - - -
0.016 0.031 0.012 0.016 0.010 0.019 0.000 0.027 0.004 0.004 1
0.016 0.030 0.012 0.016 0.005 * Micro via - N/A - - -
0.016 0.026 0.012 0.016 0.005 * Micro via - N/A - - -
0.012 0.031 0.010 0.014 0.010 0.019 0.000 0.027 0.004 0.004 1
0.012 0.030 0.010 0.014 0.005 * Micro via - N/A - - -
0.012 0.026 0.010 0.014 0.005 * Micro via - N/A - - -
0.012 0.020 0.010 0.014 0.005 * Micro via - N/A - - -
Notes: NSMD (non-solder masked defined) Land Patterns are recommended.
Dimensions in inches.
* Micro via (0.005"-0.006" blind via) in pad will be required with higher circuit densities.
Via in pad is not recommended if the component pitch allows a dog bone micro via with
0.005" minimum pad to pad spacing.