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PROCESS MAP

SMD ASSEMBLY
INPUTS PROCESS STEP OUPUTS
Board Handling (Loading)
JOT Magazine Loader Bare PCB Panel
Unload one panel at a time to the Screen
Bare PCB Panel
Printer
Operator
Solder Paste Printing
MPM AP25 HiE Stencil Printer
Solder Paste Printing Parameters
Screen Printer Operator PCB with Printed Solder Paste
Bare PCB Panel Stencil contaminated with Solder Paste
Print Solder Paste on PCB
Electroformed Stencil Squeegee Blades contaminated with Solder Paste
Stainless Steel Squeegee Blades Reject Solder Paste
MP100 Solder Paste
Inspector
MPM Paste Inspection
MPM AP25 Camera System PCB Panel with correct amount of solder paste
PCB with Solder Paste Inspect the PCB and accept or reject the
print process based on 70% coverage
Operator area

SPPC Paste Inspection


SPPC Paste Inspection System PCB Panel with correct amount of solder paste
Inspect the PCB Panel and accetp/reject
PCB with Solder Paste
the print process
Operator
Barcode Labeling
PMJ Barcode Labeling System PCB Panel with solder paste and bar code label
PCB with Solder Paste Apply barcode label at a predetermined
Operator location on the PCB Panel

Component Placement
Siemens HS50 Placement System
PCB with printed Solder Paste
Component Feeders
Components on Tape and Reels Automatically Place Components on the
PCB with Printed Solder Paste and Components
Components on Trays (optional) PCBs
Hand Placeable Components
Operator (Hand Placement)
Operator (Reel Changing)
Reflow Soldering
ERSA or BTU Reflow Soldering System (or equivalent)
Inspector PCB with Soldered Components
PCB with Printed Solder Paste and Components PCBs with paste flux residues
Components are soldered to the PCB in
Optimum Reflow Soldering Profile specific to a product a Reflow Oven

Conveyor System to transport the PCB


Center Board Support

PROCESS MAP
SMD ASSEMBLY

INPUTS PROCESS STEP OUPUTS


JOT Magazine Loader Bare PCB Panel
OSP or Ni/Au PCB Panel
Unload one panel at a time to PCB with Printed Solder Paste
the Screen Printer
Operator PCB Panel with solder paste and bar code label
MPM AP25 Camera System Stencil contaminated with Solder Paste
SPPC Paste Inspection System
Inspect the PCB and accept or Squeegee Blades contaminated with Solder Paste
reject the print process based
PMJ Barcode Labeling System Reject Solder Paste
on 70% coverage area
MPM AP25 HiE Stencil Printer PCB with Printed Solder Paste and Components
Solder Paste Printing Parameters PCB with Soldered Components
Screen Printer Operator
Inspect the PCB Panel and PCBs with paste flux residues
accetp/reject the print process
Electroformed Stencil
Stainless Steel Squeegee Blades Apply barcode label at a
MP100 Solder Paste predetermined location on the
Inspector PCB Panel
Siemens HS50 Placement System Print Solder Paste on PCB
PCB with printed Solder Paste Automatically Place
Component Feeders Components on the PCBs
Components on Tape and Reels Components are soldered to
Components on Trays (optional) the PCB in a Reflow Oven
Hand Placeable Components
Operator (Hand Placement)
Operator (Reel Changing)
ERSA or BTU Reflow Soldering System
Inspector
PCB with Printed Solder Paste and Components
Optimum Reflow Soldering Profile
Conveyor System to transport the PCB
Center Board Support

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