PROCESS FMEA
Process Name: Allu Board Assembly
Process Responsible: Riitta Hellman
FMEA Responsible: Erkki Rajala
Other Areas Involved/Effected:
Process Description and Potential
Process Purpose Failure Mode
Panel handling Humidity indicator missing
Panel packages are broken
Dirt (grease, finger prints,
dust etc.) on PCB
Humidity in Aramid layers
Panel picking from Panel gets dirty due to
stacker conaminated nozzles
Two panels are picked in
same time
Solder paste printing Panels are bended
(side 1)
FMEA Team:
Erkki Rajala
Minna Keränen
Anssi Saari
Ari Pullinen
Potential
Effect(s) of Failure
Voids in solder joints
Panels have to be dried
Voids in solder joints
Panels have to be dried
Poor solder joints
Voids in solder joints
de-lamination
Panel may be scrapped (at the
end of process)
Solder paste printing may fail
Solder paste printing and SMD
placements fail
Panels move during paste
printing
Stencil bottom gets dirty
Panel has to be rejected
Ranking Guidelines: [attached as copy] FMEA Worksheet Document No:
Retu Niemi Severity of failure effect: 1 = Minor/No effect 10 = Very high/Hazardous File Location:
Matti Huoponen Occurrence of failure cause: 1 = Remote/Unlikely 10 = Very high/Almost inevitable Date (Orig.): 23.9.1998
Jarmo U. Heinonen Detection of failure cause: 1 = Very high/Almost certainly 10 = Very low/Unlikely Date (Rev.): 15.6.1999
Risk Priority Number (RPN)Severity
= * Occurrence * Detection Page of
Severity Potential Occurrence Current Process Detection RPN Recommended Responsible Completion Status Action Results
of effect Cause(s) of Failure of cause Control(s) of cause (S*O*D) Action(s) Person Date Action Taken [S] [O] [D]
7 Handling failure (supplier, 8 Visual inspection 5 280 Work instruction updating, JH
transport or NMP) supplier information. Moisture
absorbtion study complete Complete
3 Handling failure (supplier, 7 Visual inspection 5 105 Work instruction updating, JH
transport or NMP) supplier information. Moisture
absorbtion study complete Complete
7 Handling failure (supplier, 7 Humidity indicator 3 147 Work instruction updating, JH
transport or NMP) supplier information. Moisture
absorbtion study complete Complete
3 Handling failure (supplier, 7 Humidity indicator 3 63
transport or NMP)
7 Handled with bare fingers 3 Work instructionn 4 84
7 brittle solder joints, poor 7 Humidity indicator, PCB 5 245
reliability handling instructions
7 inner layer separation 2 Humidity indicator, PCB 5 70 Pasi to check with ASPOCOMP for
handling instructions root cause and corrective action
Wk36/00
6 Grippers are dirty 2 Maintenace 2 24
6 Production stoppages 4 Work instruction 3 72
3 Extra dust generated from 2 None 10 60
packing cell at the end of the
line (near to paste printing)
4 Grippers are dirty 2 Maintenace 2 16
4 Production stoppages 4 Work instruction 3 48
3 Extra dust generated from 2 None 10 60
packing cell at the end of the
line (near to paste printing)
5 Panels are wet (stacked while 1 Panels are dried out and 2 10
still damp) hermetically packed. There is
silicagel and humidity
indicator in packages
6 Supplier process 2 Supplier is measuring the 2 24
straighness
6 Wrong way of storing 3 Work instructions 3 54
6 Inadequate material quality 2 Supplier is measuring the 2 24
straighness
6 Supplier process 2 Supplier process control 2 24
6 Wrong way of storing 3 Work instructions 3 54
6 Inadequate material quality 2 Supplier is measuring the 2 24
straighness
4 Supplier process 2 Supplier process control 2 16
4 Wrong way of storing 3 Work instructions 3 36
 4 Inadequate material quality 2 Supplier is measuring the 2 16
straighness

Printing result inaccurate 6 Supplier process 2 3D-Laser Inspection 3 36

6 Wrong way of storing 3 3D-Laser Inspection 3 54

6 Inadequate material quality 2 3D-Laser Inspection 3 36

Wrong handling of panels Open solderings 6 Fingerprints on PCB 3 Work instructions 4 72

6 Panel is set to dirty surface 2 Work instruction, training 4 48

about panel handling

6 Dirt stucked on panel 3 CR-inspection 3 54

Solder paste viscosity wrong Insufficient amount of solder 8 Wrong handling/storaging of 5 Work instruction, control of 2 80
on small pads paste the dates

Paste spreads (short circuits) 8 Production stoppages (paste 3 Supervising, PDM-system 2 48

dries out)

8 Viscosity varies in different 4 Supplier process control; 7 224 Metering of viscosity has been
batches Operator Visual Inspection, started in Merikaari. Updating
Monthly Audits work instruction about paste
handling. JH wk32/99
Humidity-% of paste is wrong Voids in solder joints 8 Over-aged paste 3 Work instructions 3 72

8 Wrong way of storing 5 Work instructions 2 80

Solder balls 8 Over-aged paste 3 Work instructions 3 72

8 Wrong way of storing 5 Work instructions 2 80

Wrong handling of paste Paste dries out 3 Use of partly dried out paste 3 Work instructions, marks in 3 27
paste containers'

3 Paste collecting from stencil 3 Work instruction 3 27

not done

3 Stencil washing not properly 3 Work instruction 3 27

done

Printer settings wrong Printing can't be done 3 Wrong program is selected 2 Program names are identical 2 12
with stencil and PCB

Positioning varies 5 Setting values in program are not 2 SMD Process Specification 3 30
correct defines parameters

Printing results vary 5 Locking of stencil is not working 1 Maintenance 1 5

5 Stencil tower is not adjusted 1 Maintenance 1 5

compared to printing base

5 Squeegee is not properly working 3 Maintenance, work 3 45

instructions

Printer in defective condition PCB's are not traveling well in the 3 Conveyor belts are in defective 2 Maintenance 2 12
conveyor condition (worn out, dirty)

3 Sencors are dirty 2 Maintenance 2 12

3 Conveyor is not rotating 1 Maintenance 2 6

Paste printing can't be done or 5 Squeegee system is not 3 Maintenance 2 30

printing result is not working properly (worn out,
satisfactory dirty, wrongly adjusted,
imbalanced)

Location failures of panels
Stencil in defective condition
Stencil dimensions are wrong Wrong amount of paste
Support table in defective
condition
0.5 mm pitch CSP solder paste open solder joint; poor
printing fails
Data matrix marking Line stops, PCB must be
manually removed and
scrapped
Can cause PCB failures on
module area
Paste location varies
Amount of paste varies
Place of paste varies
Printing result unclear
Solder bridges, tin balls,
incomplete or missing solder
joints
reliability
component may move after
placement
Data matrix laser marking
fails
Wrong laser power setting
5 Stencil mounting rail is not 2 Maintenance 2 20
clean, fastening is broken-
down, adjustments are wrong
5 Height sensor in wrong place 2 Maintenance 2 20
(moved) or is not clean or
wrongly adjusted
5 Support table worn out, dirty, 3 Maintenance 2 30
wrongly installed or
dimensioned
5 Coplanarity of stencil and 1 Maintenance 2 10
support table
5 Cleaning system functioning 3 Maintenance 2 30
not properly (too much/little
fluid, blade wrongly adjusted,
paper feeding not functioning
or mounting failure)
5 Focusing system not working 2 Maintenance 2 20
properly (camera and locating
rails dirty, adjustments wrong)
5 Printing program not working 2 Maintenance, SMD Process 2 20
properly (wrong parameters, Specification defines
software bugs) parameters
6 Fiducial marks are "wrong 3 Maintenance 4 72
colour", unclear, dirty or
damaged
6 Stencil or stencil version 2 Program names are identical 2 24
number is wrong with stencil and PCB
6 Camera dirty or lamp too 2 Maintenance 2 24
weak (=too old)
6 Camera out of its place 2 Maintenance 2 24
6 Holes for components in 1 Test panel, line verification 2 12
support table are not deep
enough or wrongly located
6 Support table is not properly 1 Test panel, line verification 2 12
installed (locking, straighness
6 Support table is not clean (tin, 3 Work instructions 3 54
components etc.)
6 Stencil worn-out, damaged or 2 Visual inspection 2 24
scratched
6 Stencil or stencil version 2 Program names are identical 2 24
number is wrong with stencil and PCB
6 Stencil screen not tight 2 Visual inspection 2 24
enough
6 Frame is not straight 2 Visual inspection 2 24
6 Stencil openings wrong size 2 Supplier process control 2 24
6 Stencil thickness wrong 2 Supplier process control 2 24
6 Dents on support table 3 Visual inspection 2 36
6 Support table is not clean 3 Work instruction 3 54
8 Variation in solder joint volume 4 3-D laser scanner inspection 3 96 AOI machine installed into line
machine
8 absence of solder paste. 4 3-D laser scanner inspection 3 96
machine
Line stops, panel must be EMC automatic board cleaner
manually removed
Internal failures in PCB Isolate data matrix on pcb,
I.e., do not connect to any
device.
3D Laser Inspection Incorrect Reading
For Paste and
Component
Board Loading Failure
SMD-placement CSP-components misaligned
SAW-filters placed in wrong
position
Coil component misplaced
Shield placement fails
Reflow soldering Metal shield bends during re-
flow soldering
Wrong soldering profile
Popcorning
Inaccurate data collection
Machine stops
Component moves on PCB
Already Placed components will
be moved
Filter does not function electrically
chip coil placement fails
Short circuits between
components and metal can
LEDs in short circuits with
shield
Shield coplanarity not within
specs
Connection area between
shield and PCB not big enough
due to LEDs
Shield is not soldering
properly
Open solder joints
Component Damage
7 Panel Warping 4 3 84
7 Optical Failure 4 3 84
7 Soldermask thickness/colour 4 3 84
varies
7 Wrong Software Program 4 3 84
5 Panel not positioned properly 3 1 15
5 Fiducial Not found 3 1 15
5 Optical Failure 3 1 15
5 Conveyor adjustment 3 1 15
6 Component moves in nozzle 3 Self Test at FLALI 3 54
during pick-up after camera
inspection
6 Incorrect part data 2 Tape board, test panels, line 3 36
verification
6 Camera inspection fails (Points in 2 Tape board, test panels, line 3 36
bottom of package are disturbing) verification
6 Component placed in wrong 3 Supplier process 3 54
position to tape
6 Table moves too fast 2 Software controls table speed 4 48
6 Component placement speed too 2 Software controls nozzle speed 4 48
high (in Z-direction)
6 Hitting existing components 5 2 60
7 Polarity not properly marked to 5 Tape board, test panels, line 5 175
component verification, AOI inspection
7 product fails in testing and 6 AOI ; test 5 210 AOI machine installed into line,
must be reworked Stencil thickness reduced to 100
um
7 Shield must be removed and 3 Testing 4 84
module reworked or whole
module scrapped
7 Shield must be removed and 3 Testing 4 84
module reworked or whole
module scrapped
7 shield perimeter not totally 6 Supplier process, Incoming 4 168
soldered, poor shield Audit
properties
7 Shield separates in drop 3 Testing 2 42
tested
7 Wrong reflow profile 2 Work instruction with standard 3 42
profile, oven calibration
7 Fan is switched off by 2 Work instruction 3 42
operator
8 Soldering temperature too low 2 Reflow profile measurements 3 48
8 Moisture Absorbtion 3 Handling procedure 8 192
Buffer Panel cracks while placing to Panel has to be scrapped 7 Wrong track width in rack 2 None 2 28
buffer

7 Racks damaged 2 Visual inspection 2 28

7 Sensor adjustment wrong or 2 None 2 28

sensor damaged

7 Pusher defective 2 None 2 28

Panel falls down Panel has to be scrapped 7 Wrong track width in rack 2 None 2 28

7 Racks damaged 2 Visual inspection 2 28

7 Sensor adjustment wrong or 2 None 2 28

sensor damaged

7 Pusher defective 2 None 2 28

Panel sticks Line stoppage 7 Wrong track width in rack 2 None 2 28

7 Racks damaged 2 Visual inspection 2 28

7 Sensor adjustment wrong or 2 None 2 28

sensor damaged

7 Pusher defective 2 None 2 28

Conveyors and gates Panel sticks Line Stops 3 Conveyor speeds not balanced 2 Setup and Maintenance 3 18
etc.

3 Conveyor width/height adjusted 3 Setup and Maintenance 3 27

wrongly

3 Misaligned components 3 Setup and Maintenance 3 27

Panel falls down Damaged Board 5 Conveyor speeds not balanced 2 Setup and Maintenance 3 30

5 Conveyor width/height adjusted 3 Setup and Maintenance 3 45

wrongly

5 Misaligned components 3 Setup and Maintenance 3 45

NMP 7 Problem Solving Steps:
1 Identify Problem
2 Analyse Problem
3 Determine Cause(s)
4 Develop Solution(s)/Model(s)
5 Plan Actions
6 Implement Solution
7 Evaluate Outcome
RPN