Beruflich Dokumente
Kultur Dokumente
74ABT161543
74ABTH161543
16-bit latched transceiver with
dual enable and master reset (3-State)
Product specification
Supersedes data of 1995 Sep 18
IC23 Data Handbook
1998 Feb 27
Philips Semiconductors
Product specification
FEATURES
74ABT161543
74ABTH161543
DESCRIPTION
Two options are available, 74ABT161543 which does not have the
Bus hold feature and 74ABTH161543 which inorporates the Bus
hold feature.
CONDITIONS
Tamb = 25C; GND = 0V
PARAMETER
tPLH
tPHL
Propagation delay
nAx to nBx
CL = 50pF; VCC = 5V
CIN
Input capacitance
VI = 0V or VCC
CI/O
I/O capacitance
VO = 0V or VCC; 3-State
ICCZ
Quiescent su
supply
ly current
ICCL
TYPICAL
UNIT
2.5
2.2
ns
pF
pF
500
mA
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
ORDER CODE
DRAWING NUMBER
40C to +85C
BT161543DL
SOT371-1
40C to +85C
BT161543DGG
SOT364-1
ORDERING INFORMATION
TEMPERATURE RANGE
NORTH AMERICA
DWG NUMBER
PACKAGES
40C to +85C
74ABT161543 DL
BT161543 DL
SOT371-1
40C to +85C
74ABT161543 DGG
BT161543 DGG
SOT364-1
40C to +85C
74ABTH161543 DL
BH161543 DL
SOT371-1
40C to +85C
74ABTH161543 DGG
BH161543 DGG
SOT364-1
PIN DESCRIPTION
PIN NUMBER
SYMBOL
1A0 1A7,
2A0 2A7
1B0 1B7,
2B0 2B7
Data inputs/outputs
1, 56
28, 29
1OEAB, 1OEBA,
2OEAB, 2OEBA
3, 54
26, 31
1EAB, 1EBA,
2EAB, 2EBA
2, 55
27, 30
1LEAB, 1LEBA,
2LEAB, 2LEBA
4, 25
MRab, MRba
Master reset
GND
Ground (0V)
7, 22, 35, 50
VCC
1998 Feb 27
853-1798 19026
Philips Semiconductors
Product specification
74ABT161543
74ABTH161543
PIN CONFIGURATION
1OEAB
56
1OEBA
1LEAB
55
1LEBA
1EAB
54
1EBA
MRab
53
GND
2C6
1A0
52
1B0
28
8EN10
1A1
51
1B1
2EAB
26
G8
VCC
50
VCC
2LEAB
27
8C12
1A2
49
1B2
MRba
25
R5/R11
1A3
48
1B3
1OEBA
56
1EN3
1A4
10
47
1B4
1EBA
54
G1
GND
11
46
GND
1LEBA
55
1C5
1A5
12
45
1B5
2OEBA
29
7EN9
1A6
13
44
1B6
2EBA
31
1A7
14
43
1B7
2LEBA
30
2A0
15
42
2B0
2A1
16
41
2B1
2A2
17
40
2B2
GND
18
39
GND
MRab
1OEAB
1EAB
G2
1LEAB
2OEAB
1A0
R6/R12
2EN4
G7
7C11
3
5D
6D
52
1B0
1A1
51
1B1
2A3
19
38
2B3
1A2
49
1B2
2A4
20
37
2B4
1A3
48
1B3
2A5
21
36
2B5
1A4
10
47
1B4
VCC
22
35
VCC
1A5
12
45
1B5
2A6
23
34
2B6
1A6
13
44
1B6
2A7
24
33
2B7
1A7
14
43
1B7
MRba
25
32
GND
2A0
15
42
2B0
2EAB
26
31
2EBA
2LEAB
27
30
2LEBA
2OEAB
28
29
2OEBA
11D
12D
10
2A1
16
41
2B1
2A2
17
40
2B2
2A3
19
38
2B3
2A4
20
37
2B4
2A5
21
36
2B5
2A6
23
34
2B6
2A7
24
33
2B7
SH00061
SH00060
1998 Feb 27
Philips Semiconductors
Product specification
LOGIC SYMBOL
74ABT161543
74ABTH161543
FUNCTIONAL DESCRIPTION
The 74ABT161543 contains two sets of eight D-type latches, with
separate control pins for each set. Using data flow from A to B as an
example, when the A-to-B Enable (nEAB) input and the A-to-B Latch
Enable (nLEAB) input are Low the A-to-B path is transparent.
10
12
13
14
1EAB
MRab
54
1EBA
1OEAB
1LEAB
1OEBA
56
55
1LEBA
MRba
25
52
51
49
48
47
45
44
43
15
16
17
19
20
21
23
24
2EAB
MRab
31
2EBA
2OEAB
28
27
2LEAB
2OEBA
29
30
2LEBA
MRba
25
42
41
40
38
37
36
34
33
SH00064
FUNCTION TABLE
INPUTS
nOEXX
H =
h =
L =
l =
X =
=
NC=
Z =
nMRXX
OUTPUTS
nEXX
nLEXX
nAx or nBx
STATUS
nBx or nAx
Clear
Disabled
Disabled
L
L
H
H
L
L
h
l
Z
Z
Disabled + Latch
L
L
H
H
L
L
h
l
H
L
Latch + Display
L
L
H
H
L
L
L
L
H
L
H
L
Transparent
NC
1998 Feb 27
Hold
Philips Semiconductors
Product specification
74ABT161543
74ABTH161543
LOGIC DIAGRAM
DETAIL A
D
LE
nB0
Q
R
nA0
D
R
LE
nA1
nB1
nA2
nB2
nA3
nA4
nB3
DETAIL A X 7
nB4
nA5
nB5
nA6
nB6
nA7
nB7
MRab
MRba
nOEBA
nOEAB
nEBA
nEAB
nLEBA
nLEAB
SH00062
SYMBOL
VCC
IIK
CONDITIONS
RATING
UNIT
0.5 to +7.0
18
mA
1.2 to +7.0
VO < 0
50
mA
0.5 to +5.5
128
mA
64
mA
65 to 150
DC supply voltage
DC input diode current
VI < 0
voltage3
VI
DC input
IOK
VOUT
DC output
IOUT
O
DC output current
Tstg
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Feb 27
Philips Semiconductors
Product specification
74ABT161543
74ABTH161543
PARAMETER
LIMITS
Min
VCC
DC supply voltage
UNIT
Max
4.5
5.5
VCC
VI
Input voltage
VIH
VIL
0.8
IOH
32
mA
IOL
64
mA
10
ns/V
40
+85
2.0
t/v
Tamb
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
VIK
VOH
Tamb = 40C
to +85C
Tamb = +25C
TYP
MAX
MIN
1.2
UNIT
MAX
1.2
2.5
3.0
2.5
3.0
3.6
3.0
2.0
2.7
2.0
VOL
0.36
0.55
0.55
VRST
0.13
0.55
0.55
Input leakage
g
current
VCC = 5
5.5V
5V; VI = GND or 5
5.5V
5V
0 01
0.01
1 0
1.0
1 0
1.0
II
IHOLD
Control
pins
35
35
75
75
800
1.0
100
100
Power-up/down 3-State
output current4
1.0
50
50
IIH + IOZH
1.0
50
50
IIL + IOZL
1.0
50
50
1.0
50
50
Output current1
100
200
200
mA
IOFF
IPU/PD
ICEX
IO
50
50
ICCH
0.50
1.5
1.5
mA
ICCL
19
19
mA
0.50
1.5
1.5
mA
Quiescent su
supply
ly current
ICCZ
ICC
5.0
100
100
ICC
0.20
mA
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. For valid test results, data must not be loaded into the flip-flops (or latches) after applying the power.
4. This parameter is valid for any VCC between 0V and 2.1V, with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V 10% a
transition time of up to 100sec is permitted.
5. This is the bus hold overdrive current required to force the input to the opposite logic state.
1998 Feb 27
Philips Semiconductors
Product specification
74ABT161543
74ABTH161543
AC CHARACTERISTICS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500
LIMITS
SYMBOL
PARAMETER
Tamb = +25oC
VCC = +5.0V
WAVEFORM
Tamb = 40 to +85oC
VCC = +5.0V 0.5V
MIN
TYP
MAX
MIN
MAX
UNIT
tPLH
tPHL
Propagation delay
nAx to nBx, nBx to nAx
1.2
1.0
2.5
2.2
3.4
2.9
1.2
1.0
3.9
3.5
ns
tPLH
tPHL
Propagation delay
LEBA to nAx, LEAB to nBx
1
2
1.2
1.2
3.0
2.6
4.1
3.5
1.2
1.2
5.1
4.1
ns
tPHL
1.2
2.6
3.4
1.2
4.2
ns
tPZH
tPZL
4
5
1.4
1.4
3.3
3.4
4.4
4.4
1.4
1.4
5.5
5.6
ns
tPHZ
tPLZ
4
5
1.4
1.4
3.5
2.7
4.8
3.5
1.4
1.4
5.4
4.0
ns
tPZH
tPZL
4
5
1.4
1.4
3.4
3.5
4.4
4.4
1.4
1.4
5.6
5.7
ns
tPHZ
tPLZ
4
5
1.3
1.3
3.5
2.7
4.4
3.5
1.3
1.3
5.4
4.0
ns
AC SETUP REQUIREMENTS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500
LIMITS
SYMBOL
PARAMETER
WAVEFORM
Tamb = +25oC
VCC = +5.0V
Tamb = 40 to +85oC
VCC = +5.0V 0.5V
MIN
TYP
MIN
UNIT
ts(H)
ts(L)
Setup time
nAx to LEAB, nBx to LEBA
1.5
2.0
0.3
0.1
1.5
2.0
ns
th(H)
th(L)
Hold time
nAx to LEAB, nBx to LEBA
1.5
2.0
0.1
0.1
1.5
2.0
ns
ts(H)
ts(L)
Setup time
nAx to EAB, nBx to EBA
1.5
2.0
0.1
0.2
1.5
2.0
ns
th(H)
th(L)
Hold time
nAx to EAB, nBx to EBA
1.5
2.0
0.1
0.1
1.5
2.0
ns
tw(L)
4.0
2.0
4.0
ns
tw(L)
3.0
1.0
3.0
ns
1998 Feb 27
Philips Semiconductors
Product specification
74ABT161543
74ABTH161543
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
VIN
VM
nOEAB, nOEBA,
nEAB, nEBA
VM
tPHL
VM
VM
tPZH
tPLH
tPHZ
VOH
VOUT
VM
VM
VOH 0.3V
VM
nAx, nBx
0V
SH00040
SH00043
VIN
VM
VM
tPLH
nOEAB, nOEBA,
nEAB, nEBA
VM
VM
tPHL
tPZL
VOUT
VM
tPLZ
VM
VM
nAx, nBx
VOL +0.3V
VOL
SH00041
SH00044
nAx, nBx
VM
VM
ts(H)
nLEAB, nLEBA,
nEAB, nEBA
VM
th(H)
VM
ts(L)
MR
th(L)
VM
VM
tW(L)
VM
tw(L)
VM
tPHL
nAx, nBx
VM
SH00042
SH00043
1998 Feb 27
Philips Semiconductors
Product specification
74ABT161543
74ABTH161543
PULSE
GENERATOR
VOUT
VIN
tW
90%
VM
NEGATIVE
PULSE
10%
0V
tTLH (tR)
tTHL (tF)
CL
tTLH (tR)
RL
tTHL (tF)
90%
POSITIVE
PULSE
AMP (V)
90%
VM
VM
10%
10%
tW
SWITCH POSITION
TEST
SWITCH
tPLZ
closed
tPZL
closed
All other
open
0V
VM = 1.5V
Input Pulse Definition
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
CL = Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
AMP (V)
VM
10%
RL
D.U.T.
RT
90%
FAMILY
74ABT/H16
Amplitude
Rep. Rate
tW
tR
tF
3.0V
1MHz
500ns
2.5ns
2.5ns
SA00018
1998 Feb 27
Philips Semiconductors
Product specification
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5mm
1998 Feb 27
10
74ABT161543
74ABTH161543
SOT371-1
Philips Semiconductors
Product specification
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm
1998 Feb 27
11
74ABT161543
74ABTH161543
SOT364-1
Philips Semiconductors
Product specification
74ABT161543
74ABTH161543
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 940883409
Telephone 800-234-7381
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