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LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
3 Description
2 Applications
R2
VOUT = 1.25 V 1 +
+ I ADJ (R2 )
R1
Device Information(1)
PART NUMBER
LM117
LM317-N
PACKAGE
TO-3 (2)
38.94 mm x 25.40 mm
TO (3)
8.255 mm 8.255 mm
TO-3 (2)
38.94 mm x 25.40 mm
TO-220 (3)
14.986 mm 10.16 mm
TO-263 (3)
10.18 mm 8.41 mm
SOT-223 (4)
6.50 mm 3.50 mm
TO (3)
8.255 mm 8.255 mm
TO-252 (3)
6.58 mm 6.10 mm
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
5
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
5
5
5
5
6
6
7
8
35
35
35
35
35
35
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision O (January 2014) to Revision P
Page
Added, updated, or renamed the following sections: Description; Pin Configuration and Functions; Specifications;
ESD Ratings table; Application and Implementation; Power Supply Recommendations; Layout; Mechanical,
Packaging, and Ordering Information .................................................................................................................................... 1
Removed information regarding LM317A, formerly part of this data sheet. LM317A can now be found in the TI
catalog under literature number SNVSAC2 ........................................................................................................................... 1
Page
Changed Current Limit MIN from 0.112 to 0.15 and TYP from 0.3 to 0.4 for (VIN VOUT) = 40 V in the LM317A
and LM317-N Electrical Characteristics Section .................................................................................................................... 7
LM117, LM317-N
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TEMPERATURE
DESCRIPTION
PRODUCT FOLDER
LM317-N
0C to 125C
Click here
LM317A
40C to 125C
Click here
LM317HV
0C to 125C
Click here
LM317L-N
40C to 125C
Click here
LM117
55C to 150C
Click here
LM117HV
55C to 150C
Click here
LM117HVQML
55C to 125C
Click here
LM117HVQML-SP
55C to 125C
Click here
LM117JAN
55C to 125C
Click here
LM117QML
55C to 125C
Click here
LM117QML-SP
55C to 125C
Click here
Case is Output
Case is Output
TO-3
TO
I/O
DESCRIPTION
ADJ
Adjust pin
VOUT
CASE
3, CASE
VIN
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
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Pin Functions
PIN
NAME
I/O
DESCRIPTION
TO-263
TO-220
SOT-223
TO-252
ADJ
Adjust pin
VOUT
2, TAB
2, TAB
2, 4
2, TAB
VIN
LM117, LM317-N
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
MAX
Power dissipation
0.3
40
300
260
150
65
UNIT
Internally Limited
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Electrostatic
discharge
(1)
VALUE
UNIT
3000
Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as 3000 V may actually have higher
performance.
MIN
MAX
UNIT
55
150
125
NDS
(TO-3)
NDT
(TO)
UNIT
2 PINS
3 PINS
RJA
39
186
C/W
RJC(top)
21
C/W
(1)
(2)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
No heatsink.
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
(1) (2)
KTT
(TO-263)
NDE
(TO-220)
DCY
(SOT-223)
NDT
(TO)
NDP
(TO-252)
3 PINS
3 PINS
4 PINS
3 PINS
3 PINS
(3)
UNIT
RJA
41.0
23.3
59.6
186
54
C/W
RJC(top)
43.6
16.2
39.3
21
51.3
C/W
RJB
23.6
4.9
8.4
28.6
C/W
JT
10.4
2.7
1.8
3.9
C/W
JB
22.6
4.9
8.3
28.1
C/W
RJC(bot)
0.9
1.1
0.9
C/W
(1)
(2)
(3)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
When surface mount packages are used (SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing
the PCB copper area that is thermally connected to the package. See Heatsink Requirements for heatsink techniques.
No heatsink
TEST CONDITIONS
MIN
TYP
MAX
UNIT
1.2
1.25
1.3
TJ = 25C
0.01
0.02
0.02
0.05
TJ = 25C
0.1%
0.3%
0.3%
1%
0.03
0.07
%/W
Reference voltage
3 V (VIN VOUT) 40 V,
10 mA IOUT IMAX (1) (over full operating temperature range)
Line regulation
Load regulation
Thermal regulation
20-ms pulse
50
100
0.2
Temperature stability
1%
3.5
mA
(VIN VOUT) 15 V
Current limit
(VIN VOUT) = 40 V
RMS output noise, % of VOUT
Long-term stability
(1)
(2)
(3)
1.5
2.2
3.4
0.5
0.8
1.8
TO-3 package
0.3
0.4
TO-39 package
0.15
0.2
%/V
10 Hz f 10 kHz
0.003%
66
65
dB
80
dB
0.3%
1%
IMAX = 1.5 A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0 A for the DCY (SOT-223) package.
IMAX = 0.5 A for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA),
device maximum junction temperature (TJ), and package thermal resistance (JA). The maximum allowable power dissipation at any
temperature is : PD(MAX) = ((TJ(MAX) TA) / JA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
Specifications and availability for military and space grades of LM117/883 can be found in the LM117QML data sheet (SNVS356).
Specifications and availability for military and space grades of LM117 can be found in the LM117JAN data sheet (SNVS365).
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
LM117, LM317-N
www.ti.com
TEST CONDITIONS
MIN
TJ = 25C
TYP
MAX
1.25
Reference voltage
3 V (VIN VOUT) 40 V,
10 mA IOUT IMAX (1) (over Full Operating Temperature
Range)
Line regulation
Load regulation
Thermal regulation
20-ms pulse
1.2
1.25
1.3
TJ = 25C
0.01
0.04
0.02
0.07
TJ = 25C
0.1%
0.5%
0.3%
1.5%
0.04
0.07
%/W
50
100
mA
10 mA IOUT IMAX
3V (VIN VOUT) 40V
0.2
Temperature stability
TMIN TJ TMAX
1%
(VIN VOUT) = 40 V
3.5
10
(VIN VOUT) 15 V
Current limit
(VIN VOUT) = 40 V
1.5
2.2
3.4
SOT-223, TO-220
Packages (over full
operating temperature
range)
1.5
2.2
3.4
0.5
0.8
1.8
0.15
0.4
0.15
0.4
Long-term stability
(1)
(2)
UNIT
0.075
10 Hz f 10 kHz
%/V
0.2
0.003%
66
65
dB
80
dB
0.3%
1%
IMAX = 1.5 A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0 A for the DCY (SOT-223) package.
IMAX = 0.5 A for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA),
device maximum junction temperature (TJ), and package thermal resistance (JA). The maximum allowable power dissipation at any
temperature is : PD(MAX) = ((TJ(MAX) TA) / JA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
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LM117, LM317-N
www.ti.com
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
10
LM117, LM317-N
www.ti.com
8 Detailed Description
8.1 Overview
In operation, the LM317-N develops a nominal 1.25-V reference voltage, VREF, between the output and
adjustment terminal. The reference voltage is impressed across program resistor R1 and, because the voltage is
constant, a constant current I1 then flows through the output set resistor R2, giving an output voltage calculated
by Equation 1:
R2
VOUT = 1.25 V 1 +
+ I ADJ (R2 )
R1
(1)
LM317-N
11
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
12
LM117, LM317-N
www.ti.com
13
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
LM317-N
R2
VOUT = 1.25 V 1 +
+ I ADJ (R2 )
R1
D1 protects against C1
D2 protects against C2
Figure 17. Regulator With Protection Diodes
14
LM117, LM317-N
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15
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
16
LM117, LM317-N
www.ti.com
17
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
VIN
VOUT
ADJ
C1
0.1 F
R1
2k
5%
VOUT
10 V
R2
1.5 k
1%
LM329
R3
267
1%
18
LM117, LM317-N
www.ti.com
LM117
19
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
LM117
20
LM117, LM317-N
www.ti.com
LM117
21
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
LM317-N
22
LM117, LM317-N
www.ti.com
LM317-N
600 mV
, or 210 mA
R3
23
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
LM317-N
24
LM117, LM317-N
www.ti.com
LM317-N
LM317-N
25
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
(2)
26
LM117, LM317-N
www.ti.com
11 Layout
11.1 Layout Guidelines
Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.
Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the
feedback loop from VOUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can
be placed at the ADJ pin and must be located as close as possible to the IC. In cases when VIN shorts to ground,
an external diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and
protect the IC. Similarly, in cases when a large bypass capacitor is placed at the ADJ pin and VOUT shorts to
ground, an external diode must be placed from ADJ to VOUT to provide a path for the bypass capacitor to
discharge. These diodes must be placed close to the corresponding IC pins to increase their effectiveness.
27
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
(3)
Figure 38 shows the voltage and currents which are present in the circuit.
The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX) in Equation 4:
TR(MAX) = TJ(MAX) TA(MAX)
(4)
where TJ(MAX) is the maximum allowable junction temperature (150C for the LM117, or 125C for the LM317-N),
and TA(MAX) is the maximum ambient temperature that will be encountered in the application.
Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal
resistance (JA) can be calculated with Equation 5:
JA = (TR(MAX) / PD)
28
(5)
LM117, LM317-N
www.ti.com
where
CH is the thermal resistance of the contact area between the device case and the heatsink surface
JC is thermal resistance from the junction of the die to surface of the package case
(6)
When a value for HA is found using the equation shown, a heatsink must be selected that has a value that is
less than, or equal to, this number.
The HA rating is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots
temperature rise vs power dissipation for the heatsink.
11.3.2 Heatsinking Surface Mount Packages
The TO-263 (KTT), SOT-223 (DCY) and TO-252 (NDP) packages use a copper plane on the PCB and the PCB
itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to
the plane.
11.3.2.1 Heatsinking the SOT-223 (DCY) Package
Figure 39 and Figure 40 show the information for the SOT-223 package. Figure 40 assumes a JA of 74C/W for
1-oz. copper and 59.6C/W for 2-oz. copper and a maximum junction temperature of 125C. See AN-1028
(SNVA036) for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.
29
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
30
LM117, LM317-N
www.ti.com
Figure 42. Maximum Power Dissipation vs TAMB for the TO-263 Package
11.3.2.3 Heatsinking the TO-252 (NDP) Package
If the maximum allowable value for JA is found to be 54C/W (typical rated value) for the TO-252 package, no
heatsink is needed because the package alone will dissipate enough heat to satisfy these requirements. If the
calculated value for JA falls below these limits, a heatsink is required.
As a design aid, Table 2 shows the value of the JA of NDP the package for different heatsink area. The copper
patterns that we used to measure these JAs are shown in Figure 47. Figure 43 reflects the same test results as
what are in Table 2.
Figure 44 shows the maximum allowable power dissipation versus ambient temperature for the TO-252 device.
Figure 45 shows the maximum allowable power dissipation versus copper area (in2) for the TO-252 device. See
AN-1028 (SNVA036) for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.
31
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
(1)
COPPER AREA
Bottom Side (in2)
(JAC/W) TO-252
0.0123
103
0.066
87
0.3
60
0.53
54
0.76
52
1.0
47
0.066
0.2
84
0.066
0.4
70
0.066
0.6
63
10
0.066
0.8
57
11
0.066
1.0
57
12
0.066
0.066
89
13
0.175
0.175
72
14
0.284
0.284
61
15
0.392
0.392
55
16
0.5
0.5
53
32
THERMAL RESISTANCE
LM117, LM317-N
www.ti.com
Figure 45. Maximum Allowable Power Dissipation vs 2-oz. Copper Area for TO-252
Figure 46. Top View of the Thermal Test Pattern in Actual Scale
33
LM117, LM317-N
SNVS774P MAY 2004 REVISED OCTOBER 2015
www.ti.com
Figure 47. Bottom View of the Thermal Test Pattern in Actual Scale
34
LM117, LM317-N
www.ti.com
PRODUCT FOLDER
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LM117
Click here
Click here
Click here
Click here
Click here
LM317-N
Click here
Click here
Click here
Click here
Click here
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
35
www.ti.com
30-Sep-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
LM117H
ACTIVE
TO
NDT
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 150
( LM117HP+ ~
LM117HP+)
LM117H/NOPB
ACTIVE
TO
NDT
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 150
( LM117HP+ ~
LM117HP+)
LM117K STEEL
ACTIVE
TO-3
NDS
50
TBD
Call TI
Call TI
-55 to 150
LM117K
STEELP+
LM117K STEEL/NOPB
ACTIVE
TO-3
NDS
50
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 150
LM117K
STEELP+
LM317EMP
NRND
SOT-223
DCY
1000
TBD
Call TI
Call TI
0 to 125
N01A
LM317EMP/NOPB
ACTIVE
SOT-223
DCY
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 125
N01A
LM317EMPX/NOPB
ACTIVE
SOT-223
DCY
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 125
N01A
LM317H
ACTIVE
TO
NDT
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
0 to 125
( LM317HP+ ~
LM317HP+)
LM317H/NOPB
ACTIVE
TO
NDT
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
0 to 125
( LM317HP+ ~
LM317HP+)
LM317K STEEL
ACTIVE
TO-3
NDS
50
TBD
Call TI
Call TI
0 to 125
LM317K
STEELP+
LM317K STEEL/NOPB
ACTIVE
TO-3
NDS
50
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
0 to 125
LM317K
STEELP+
LM317MDT/NOPB
ACTIVE
TO-252
NDP
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 125
LM317
MDT
LM317MDTX/NOPB
ACTIVE
TO-252
NDP
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 125
LM317
MDT
LM317S/NOPB
ACTIVE
DDPAK/
TO-263
KTT
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
0 to 125
LM317S
P+
LM317SX/NOPB
ACTIVE
DDPAK/
TO-263
KTT
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
0 to 125
LM317S
P+
LM317T
NRND
TO-220
NDE
45
TBD
Call TI
Call TI
LM317T P+
LM317T/LF01
ACTIVE
TO-220
NDG
45
Pb-Free (RoHS
Exempt)
CU SN
Level-4-260C-72 HR
LM317T P+
LM317T/NOPB
ACTIVE
TO-220
NDE
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
Addendum-Page 1
0 to 125
LM317T P+
Samples
www.ti.com
30-Sep-2015
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
30-Sep-2015
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LM317EMP
SOT-223
DCY
1000
330.0
16.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
7.0
7.5
2.2
12.0
16.0
Q3
LM317EMP/NOPB
SOT-223
DCY
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM317EMPX/NOPB
SOT-223
DCY
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM317MDTX/NOPB
TO-252
NDP
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LM317SX/NOPB
DDPAK/
TO-263
KTT
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
Pack Materials-Page 1
30-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM317EMP
SOT-223
DCY
1000
367.0
367.0
35.0
LM317EMP/NOPB
SOT-223
DCY
1000
367.0
367.0
35.0
LM317EMPX/NOPB
SOT-223
DCY
2000
367.0
367.0
35.0
LM317MDTX/NOPB
TO-252
NDP
2500
367.0
367.0
38.0
LM317SX/NOPB
DDPAK/TO-263
KTT
500
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
NDT0003A
H03A (Rev D)
www.ti.com
MECHANICAL DATA
NDS0002A
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDG0003F
T03F (Rev B)
www.ti.com
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
MECHANICAL DATA
MPDS094A APRIL 2001 REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
0,10 (0.004) M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
0,84 (0.033)
0,66 (0.026)
2,30 (0.091)
4,60 (0.181)
3
010
0,10 (0.004) M
0,25 (0.010)
1,70 (0.067)
1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A.
B.
C.
D.
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
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