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Outline
2015 Year-to-Date Trends
Equipment and Materials Forecasts
Summary
Year-to-Date Trends
Yet
260
Index Value
240
220
Silicon shipments
are up 7% year to
date through July
200
180
160
140
Jul-15
Apr-15
Jan-15
Oct-14
Jul-14
Apr-14
Jan-14
Oct-13
Jul-13
Apr-13
Jan-13
Oct-12
Jul-12
Apr-12
100
Jan-12
120
SEMI North America Book-to-BillSteady booking and billings trends thru July
$3,118
$2,286
36%
North America
$3,474
$4,915
-29%
Korea
$5,414
$4,065
33%
Taiwan
$5,340
$5,841
-9%
China
$2,613
$3,039
-14%
ROW
$1,138
$1,120
2%
Total
$22,415
$22,603
-1%
SEAJ Billings ( B)
SEAJ Billings (US $M)
2013
2014
Y/Y %
Change
972
1,332
37%
9,993
12,012
26%
2013
2014
9,067
10,098
% Year-over-Year Change
Wafer Revenues ($ M)
% Year-over-Year Change
Source: SEMI Silicon Manufacturers Group
11%
7,538
7,626
1%
2013
2014
339,133
370,617
% Year-over-Year Change
Leadframe ($ M)
% Year-over-Year Change
Source: SEMI/NEDIA
9%
3,342
3,461
4%
2014=~106/US$
2015=~120/US$
Capital Equipment
($US Billion)
$50
150%
$40
$30
$20
100%
87%
66%
67%
66%
40%
28%
14%
5%
-7% -9%
$10
150%
50%
18%
23%
3%
12%
10%
9%
6%
5%
5% 0%
-11%
-21%
-14%
-30%
-31% -15%
-41%
-46%
-50%
17%
-100%
1987
1988
1989
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015F
2016F
$0
Capital Equipment
Source: SEMI/SEAJ. SEMI 2015 Mid-Year Forecast, August update
Annual Growth
Annual Growth
(%)
$60
Regional Semiconductor
Equipment Markets
Region
Taiwan
25%
China
12% Europe
6%
Japan
11%
ROW
6%
North
America
22%
Korea
18%
2014
$US B
2015F
$US B
%
Change
China
$4.37
$4.56
4%
Europe
2.38
2.50
5%
Japan
4.18
5.29
27%
Korea
6.84
8.13
19%
North America
8.16
6.26
-23%
SEA/ROW
2.15
2.14
-1%
Taiwan
9.41
9.56
2%
$37.50
$38.44
3%
Total
2010
y only-Source:
200mm
2.12
SEMI World Fab Forecast
2010
2011
2.19
2011
2012
2012
2.27
2013
2013
2.29
2014E
2014E
2.28
2015F
2016F
2015F
2.37
2016F
2.43
Forecast
2013
US$ M
2014
US$ M
2015
US$ M
2016
US$ M
Silicon Wafers1
$7,932
$7,990
$7,954
$8,278
Photomasks2
3,136
3,220
3,342
3,442
Photoresist
1,220
1,374
1,354
1,413
Photoresist Ancillaries3
1,428
1,711
1,777
1,850
995
1,059
1,121
1,104
3,319
3,481
3,577
3,721
598
629
653
696
1,436
1,569
1,618
1,722
Other/New Materials
2,588
2,945
3,178
3,415
$22,652
$23,977
$24,574
$25,641
6%
2%
4%
Wet Chemicals4
Gases
Sputter Targets4
Total
% Growth
Source: SEMI August 2015
7.
8.
Silicon wafers include merchant sales value only; includes SOI wafers; no
reclaim wafers
Includes captive market
Includes resist removal chemicals, developers, anti-reflective coatings,
contrast enhancers, edge bead removers, adhesion promoters, etc.
Source is Linx Consulting LLC, Sputter Targets includes precious metals
Estimates for IC applications only
Includes low k dielectrics, copper plating solutions, dielectric precursors,
organometallic precursors, etc.
All forecasts in current dollars
Source for all data is SEMI, unless otherwise indicated
Photomask Market
Taiwan
ROW
North America
Korea
Japan
Europe
China
$4,000
100%
Percent of Market
$3,500
US$ Million
$3,000
$2,500
$2,000
$1,500
80%
60%
40%
20%
0%
$1,000
2005
2015F
$500
Merchant
Captive
Source: SEMI March 2015
$0
2005
2007
2010
2015F
2016F
Source: SEMI March 2015
15/05: Photomask CAGR 1%, Semiconductor CAGR of 4% for the same period
2015F
$US B
2016F
$US B
%
Change
China
$1.77
$1.89
6%
Europe
2.49
2.57
3%
Japan
4.39
4.50
2%
Korea
4.65
4.95
6%
North America
4.46
4.59
3%
Taiwan
5.47
5.73
5%
SEA/ROW
1.34
1.42
7%
$24.57
$25.64
4%
Total
Forecast
2013
US$ M
2014
US$ M
2015
US$ M
2016
US$ M
$3,342
$3,461
$3,350
$3,346
Ceramic Packages
2,006
2,075
2,157
2,174
Encapsulation Resins
2,451
2,712
2,922
3,187
Bonding Wire2
4,151
3,385
3,176
3,099
666
704
734
752
Others
374
409
451
500
$20,398
$20,358
$20,986
$21,644
-0.2%
3%
3%
Leadframes
Major update
coming
7,408
7,612 in November
8,196
8,586
Organic Substrates1
Total
% Growth
Source: SEMI August 2015
Packaging Materials will be 46% of the 2015 Total Semiconductor Materials Market
Semiconductor Packaging
Materials Forecast Notes
1. Source is TechSearch International. Includes PBGA, PPGA,
LGA, and CSP laminate substrates and flex BGA and CSP
substrates
2. Assume gold value of $1,480/trz for 2013; $1,260/trz for
2014; $1,190/trz for 2015 - 2016
3. Includes die attach film (tape) materials
4. Other includes solder balls and wafer level package
dielectrics
5. Source for all data is SEMI, unless otherwise indicated
6. All forecasts in current dollars
Taiwan
21%
China
21%
Europe
3%
Japan
13%
SEA/ROW
26%
North Korea
America 13%
3%
2015F
$US B
2016F
$US B
%
Change
China
$4.34
$4.54
5%
Europe
0.72
0.75
3%
Japan
2.69
2.82
4%
Korea
2.66
2.72
2%
North America
0.66
0.66
0%
Taiwan
4.43
4.56
3%
SEA/ROW
5.50
5.60
2%
$20.99
$21.64
3%
Total
Summary
Summary
Uncertainty with the near-term outlook
Year-to-Date Trends
Silicon shipments are up through July
Equipment bookings and billings are comparable to 2014 levels
Exchange ratesweaker Yen & Eurowill dampen 2015 revenue
growth
Memory (Flash) and Foundry will lead fab investment this year
and next
Semiconductor Equipment & Materials Outlook
Materials market is expected to increase 3% in 2015 and 4% in 2016
Equipment market is expected to increase 3% in 2015 and 5% in 2016
!
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