COMPUTER AIDED DESIGN

[ME F 342]

Training in FEA using

ANSYS
[P-6 Coupled Analysis]
dmk@goa.bits-pilani.ac.in

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

One Field Influences another Field

THERMAL FIELD

STRUCTURAL EFFECTS

MAGNETIC FIELD

ELECTRIC EFFECTS

THERMAL FIELD

FLUID EFFECTS

FLUID FIELD

STRUCTURAL EFFECTS

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

Coupled-field analysis
A coupled-field analysis is an analysis that takes into
account the interaction (coupling) between two or
more disciplines (fields) of engineering.
The procedure for a coupled-field analysis depends
on which fields are being coupled, but two distinct
methods can be identified sequential and direct.

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

Sequential Method (Ex: Thermal-Structural)

Thermal stress analysis using sequential method involves
two analyses

Thermal analysis
Jobname.rst
Structural analysis
Jobaname.rst

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

Sequential
First do a steady state thermal analysis

Model with thermal elements

Model thermal material properties
Apply thermal loading
Solve and review results

Then do static structural analysis

Switch element types to structural

Define structural material properties, including thermal expansion coefficient
Apply structural boundary conditions
Solve and review results

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

Direct Method
The direct method usually involves just one analysis that
uses a coupled-field element type containing all
necessary degrees of freedom.
Coupling is handled by calculating element matrices or
element load vectors that contain all necessary terms.
An example of this is a piezoelectric analysis using
the SOLID5 PLANE13, or SOLID98 elements.

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

Direct Method
Direct method usually involves just one analysis that
uses a coupled field element type containing all
necessary degrees of freedom

Thermal analysis
Structural analysis

Prepare the model and mesh using one of

the following coupled field element types

PLANE 13
SOLID 5
SOLID 98

Apply both the structural and thermal loads

and constraints to the model
Jobname.rst

Solve and review both thermal and structural

results

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

Coupled Analysis | Theory

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T1 | Coupled Analysis | Problem Statement

A steel link, with no internal stresses, is pinned between two solid structures
at a reference temperature of 0 oC (273 K). One of the solid structures is
heated to a temperature of 75 C (348 K). As heat is transferred from the solid
structure into the link, the link will attempt to expand. However, since it is
pinned this cannot occur and as such, stress is created in the link. A steadystate solution of the resulting stress will be found to simplify the analysis.

Loads will not be applied to the link, only a

temperature change of 75 degrees Celsius.
The link is steel with a modulus of elasticity
of 200 GPa, a thermal conductivity of 60.5
W/m*K and a thermal expansion coefficient
of 12e-6 /K.

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T1 | Coupled Analysis | Thermal Physics

!COUPLED ANALYSIS
/TITLE, THERMAL to STRUCTURAL EXAMPLE
/PREP7

! ENTER PREPROCESSOR

K,1,0,0
K,2,1,0
L,1,2

! KEYPOINTS

ET,1,LINK33
R,1,4E-4,
MP,KXX,1,60.5

! Thermal Elt which can support Thermal-Structural Effect)

! AREA
! THERMAL CONDUCTIVITY

ESIZE,0.1
LMESH,ALL

! ELEMENT SIZE
! MESH LINE

! LINE CONNECTING KEYPOINTS

PHYSICS,WRITE,THERMAL ! WRITE PHYSICS ENVIRONMENT AS THERMAL

PHYSICS,CLEAR
! CLEAR THE ENVIRONMENT

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T1 | Coupled Analysis | Structural Physics

! CHANGES ELEMENT TYPES TO THEIR CORRESPONDING TYPES
ETCHG,TTS

! ELEMENT TYPE (THERMAL TO STRUCTURAL)

! Automatic change from Thermal Elt to
!corresponding structural Elt

MP,EX,1,200E9
MP,PRXY,1,0.3
MP,ALPX,1,12E-6

! YOUNG'S MODULUS
! POISSON'S RATIO
! EXPANSION COEFFICIENT

PHYSICS,WRITE,STRUCT
PHYSICS,CLEAR

!WRITE PHYSICS ENVIRONMENT AS STRUCT

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T1 | Coupled Analysis | Perform Thermal

/SOLU
ANTYPE,0

! STATIC ANALYSIS

PHYSICS,READ,THERMAL

! READ IN THE THERMAL ENVIRONMENT

DK,1,TEMP,348

! APPLY A TEMP OF 75 TO KEYPOINT 1

SOLVE
FINISH

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T4 | Coupled Analysis | Coupling

/SOLU
PHYSICS,READ,STRUCT

! RE-ENTER THE SOLUTION PHASE

! READ IN THE STRUCT ENVIRONMENT

LDREAD,TEMP,,,,,,RTH
! APPLY LOADS DERIVED FROM THML ENV
!LDREAD, Lab, LSTEP, SBSTEP, TIME, KIMG, Fname, Ext,
!KIMG: When used with the TEMP label, KIMG indicates how temperatures are to
!be applied. KIMG = 0 is the only valid option for applying temperature loads.
TREF,273
DK,1,ALL,0
DK,2,UX,0

! APPLY STRUCTURAL CONSTRAINTS

SOLVE
FINISH
!ENTER POSTPROCESSOR
!List Results | Element Solution | Stress-X
Stress in the link should be a uniform 180 MPa in compression.
BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T2 | Coupled Analysis
This example will demonstrate how much heat can be
applied to create desired amount of radial deflection of
inner surface of outer cylinder to accommodate inner
cylinder.
Inner cylinder: Ri = 4 and RO = 5+0.025
Outer Cylinder: Ri = 5 and RO = 7. Find out radial
deflection at inner surface (Radius 5 unit)

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T2 | Coupled Analysis | Expansion of a Hollow Cylinder

!Expansion of CYLINDER for shrink fit purpose
/PREP7
PCIRC,5,7,0,90

!CREATING A ANNULAR QUARTER CIRCLE

ET,1,PLANE55

!Thermal Elt which can support Thermal-Structural Effect)

MP,KXX,1,60.5

!SETTING THE CONDUCTIVITY

ESIZE,0.1
AMESH, ALL

PHYSICS,WRITE,THERMAL
PHYSICS,CLEAR

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T2 | Coupled Analysis | Expansion of a Hollow Cylinder

ETCHG,TTS

! CHANGE ELT TYPE (Thermal to Structural)

MP,EX,1,200E9

! YOUNG'S MODULUS

MP,PRXY,1,0.3

! POISSON'S RATIO

MP,ALPX,1,12E-6

! EXPANSION COEFFICIENT

PHYSICS,WRITE,STRUCT

! WRITE PHYSICS ENVIRONMENT AS STRUCT

PHYSICS,CLEAR
FINISH

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T2 | Coupled Analysis | Expansion of a Hollow Cylinder

/SOLU
ANTYPE,0

! STATIC ANALYSIS

PHYSICS,READ,THERMAL
DL,3,,TEMP,1000

!APPLYING TEMP ON INNER ARC

DL,1,,TEMP,29

!APPLYING ROOM TEMP ON OUTER ARC

SOLVE
FINISH

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T2 | Coupled Analysis | Expansion of a Hollow Cylinder

/SOLU

!RE-ENTERING THE SOLVE MODE FOR STRUCT

ANALYSIS
PHYSICS,READ,STRUCT

LDREAD,TEMP,,,,,,RTH
TREF,29
DL,2,,UX,0
DL,4,,UY,0

SOLVE
FINISH
BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

T2 | Coupled Analysis | Expansion of a Hollow Cylinder

0.026 Unit deflection at inner radius 5

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

Sequential vs. Direct method

Sequential

Direct

1. For coupling situations which do not 1. Direct field analysis is advantageous

exhibit a higher degree of non linear
when the coupled field interaction is
interaction, the sequential method is
highly non linear and is best solved in
more efficient and flexible because
a single solution using a coupled
one can perform the two analysis
formulation.
independent of each other.
2. In a sequential thermal stress analysis
one can perform a non linear
transient thermal analysis followed by
a linear static stress analysis. One can
then use nodal temperatures from any
load step or time point in the thermal
analysis as loads for the stress
analysis.

2. Examples of direct coupling include

piezoelectric analysis, conjugate heat
transfer with fluid flow, and circuit
electromagnetic analysis.

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956

List of Elements Supporting Coupled Analysis

BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956