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Product Service Manual Level II

Service Manual for BenQ:


G2220HD
P/N: 9H.L07LB.QBx
Applicable for All Regions

Version: 001
Date:2008/12/05
Notice:
- For RO to input specific Legal Requirement in specific NS regarding to responsibility and liability
statements.
- Please check BenQs eSupport web site, http://esupport.benq.com, to ensure that you have the most
recent version of this manual.
First Edition (Dec., 2008)
Copyright BenQ Corporation 2008. All Right Reserved.

-1-

Content Index
Abbreviations & Acronyms .............................................................................. 3
1 About This Manual ........................................................................................ 3
1.1. Trademark............................................................................................................ 3

2 Introduction ................................................................................................... 4
2.1.
2.2.
2.3.
2.4.
2.5.

RoHS (2002/95/EC) Requirements ...................................................................... 4


Safety Notice........................................................................................................ 4
Compliance Statement ......................................................................................... 4
General Descriptions ........................................................................................... 4
Related Service Information................................................................................. 4

3 Product Overview.......................................................................................... 5
3.1. Specification......................................................................................................... 5
3.2. Customer Acceptance ........................................................................................ 17

4. Level 1 Cosmetic / Appearance / Alignment Service ............................... 24


4.1. Software / Firmware Upgrade Process .............................................................. 24
4.2. Alignment procedure (for function adjustment)................................................... 30

5. Level 2 Disassembly /Assembly Circuit Board and Standard Parts


Replacement ................................................................................................... 37
5.1. Exploded View ................................................................................................... 37
5.2. Disassembly /Assembly ..................................................................................... 38
5.3. Shielding Position............................................................................................... 47
5.4. Packing .............................................................................................................. 48
5.5. Block diagram .................................................................................................... 49
5.6. Trouble Shooting Guide ..................................................................................... 50
5.7. Circuit Operation Theory .................................................................................... 55

Appendix 1 Screw List / Torque.................................................................. 64


Appendix 2-Physical Dimension Front View and Side view ....................... 66

-2-

Abbreviations & Acronyms


1 About This Manual
This manual contains information about maintenance and service of BenQ products. Use this
manual to perform diagnostics tests, troubleshoot problems, and align the BenQ product.

1.1. Trademark
The following terms are trademarks of BenQ Corporation:

BenQ
Importance
Only trained service personnel who are familiar with this BenQ Product shall perform
service or maintenance to it. Before performing any maintenance or service, the
engineer MUST read the Safety Note.

-3-

2 Introduction
This section contains general service information, please read through carefully. It should be
stored for easy access place for quick reference.

2.1. RoHS (2002/95/EC) Requirements


Applied to all countries require RoHS.
The RoHS (Restriction of Hazardous Substance in Electrical and Electronic Equipment Directive)
is a legal requirement by EU (European Union) for the global electronics industry which sold in EU
and some counties also require this requirement. Any electrical and electronics products
launched in the market after June 2006 should meet this RoHS requirements. Products launched
in the market before June 2006 are not required to compliant with RoHS parts. If the original
parts are not RoHS complaints, the replacement parts can be non ROHS complaints, but if the
original parts are RoHS compliant, the replacement parts MUST be RoHS complaints.
If the product service or maintenance require replacing any parts, please confirming the RoHS
requirement before replace them.

2.2. Safety Notice


1. Make sure your working environment is dry and clean, and meets all government safety
requirements.
2. Ensure that other persons are safe while you are servicing the product. DO NOT perform any
action that may cause a hazard to the customer or make the product unsafe.
3. Use proper safety devices to ensure your personal safety.
4. Always use approved tools and test equipment for servicing.
5. Never assume the products power is disconnected from the mains power supply. Check that
it is disconnected before opening the products cabinet.
6. Modules containing electrical components are sensitive to electrostatic discharge (ESD).
Follow ESD safety procedures while handling these parts.
7. Some products contain more than one battery. Do not disassemble any battery, or expose it to
high temperatures such as throwing into fire, or it may explode.
8. Refer to government requirements for battery recycling or disposal.

2.3. Compliance Statement


Caution: This Optical Storage Product contains a Laser device. Refer to the product specifications
and your local Laser Safety Compliance Requirements.

2.4. General Descriptions


This Service Manual contains general information. There are 3 levels of service:
Level 1: Cosmetic / Appearance / Alignment Service
Level 2: Circuit Board or Standard Parts Replacement
Level 3: Component Repair to Circuit Boards

2.5. Related Service Information


BenQ Global Service Website: http://www.benq.com/support/
eSupport Website: http://bqpgsr.benq.corp.com/customize/asplogin.asp

-4-

3 Product Overview
3.1. Specification
3.1.1 Introduction
G2220HD is defined 21.5W LCD Monitor supports WXGA(1920x1080) resolution with DPMS
(Display Power Management System) and Senseye function. There are two different input types,
D-sub, DVI, of models. G2220HD adopts AUO panel, M215HW01 V0.
The features summary is shown as below,
*All panel spec. in C201 definition depends on the variance of panel source.
*All spec. of monitor need to warm up at least 1hr.
* To test the Contrast Ratio and Luminance functions, the color status must be User preset
mode.
* Contrast Ratio: Set brightness at 100, and contrast at 50.
* Luminance: Set brightness at 100, and contrast at 100.
Feature items
Specifications
Remark
Panel supplier & module name
AUO M215HW01 V0
TN, Normally white
Screen diagonal
21.5W
476.64(H) x268.11(V)
Display Format
1920(H) x 1080 (V)
Panel Display information
Pixel Pitch
248.25 um x 248.25 um per one triad
R/L:85/85 degrees (typ)
Viewing Angle (@ Contrast Ratio >= 10) and U/D: 80/80 degrees
(typ)
With 15-pin D-sub
Analog interface with Scaling supported Yes
connector
DVI interface with Scaling supported
Yes
HDMI interface with Scaling supported
No
Max resolution mode supported
1920 (H) x 1080 (V)@60Hz
Number of Display Colors supported
16.7 Millions
RGB 6-bit + FRC
Test
Condition:
Set
Contrast at 50, Brightness
Contrast Ratio
1000:1 (typ.),600:1(min)
at 100, Color at User
preset
Test
Condition:
Set
300 cd/m2 (typ.),240 cd/m2 contrast at 100, brightness
Luminance
(min)
at 100 , color at User
preset.
AC power input
Yes
90-264 Volts, 47-63 Hz.
DC power input (with AC power adapter)
No
DPMS supported
Yes
<1W
LED indicator for power status showed
Yes
Green/Amber/None
OSD for control & information supported Yes
Multi-language supported for OSD
Yes
17 languages.
Buttons control supported
Yes
Flywheel control supported
No
Scaling function supported
Yes
Auto adjustment function supported
Yes
I-Key function
DDC function supported (EDID ver. 1.3) Yes
DDC2B
DDC-CI support version 1.1 or later
Yes
DDC-CI
-5-

Audio speakers supported


Audio Jack (input connector) supported
Earphone Jack (input connector)
supported
Microphone function supported
Mechanical Tilt base design
VESA wall mounting design
Mechanical Rotate design
Mechanical Lift base design
Kensington compatible lock design
3.1.2
3.1.2.1
Item

No
No
No
No
Yes
Yes
No
No
Yes

From -5 to +23 degree

Operational Specification
Power supply

Input Voltage range


Input Current range
Power Consumption
DPMS
Inrush Current
Earth Leakage Current
Hi-Pot
Power Line Transient

Condition
Universal input full
range
90 ~ 264VAC
Normal On operation
DPMS Off state
110 VAC
220 VAC
264 VAC/50Hz
1. 1500VAC, 1 sec
2. Ground test: 30A,
1sec
IEC1000-4-4

Spec

OK N.A Remark

90~264VAC /50~76Hz
< 1.5 Arms
<47 W
<1W
< 30 A (peak)
< 60A (peak)
< 3.5 mA

LED: Green
LED: Amber

Cold-start

Without damage
< 0.1 ohm

1KV
Common: 2KV,
IEC1000-4-5 (Surge)
Differential: 1KV

CCFL operation range

90 ~ 264VAC

3~8mA

CCFL Frequency

90 ~ 264VAC

40KHz ~ 80KHz

Color: Black
Length: 1500 +/- 50
mm

Power cord

3.1.2.2
Item

Signal interface
Condition
15-pin D-Sub

Signal Cable
24-pin DVI-D
Pin assignment

15-pin D-sub
connector
24-pin DVI-D
connector

Spec
Color: Black
Length: 1500 +/- 30
mm
Color: Black
Length: 2000 +/- 50
mm
See Note-1
See Note-2

-6-

(on-line test)
(in-lab test)

Depends on panel
source
Depends on panel
source

OK N.A Remark

For 15-pin D-sub

For 24-pin DVI-D

19-pin HDMI
connector
Signal type
Level
Impedance

Analog input

See Note-3

Signal type

Level

Sync input

Impedance
Sync Pulse Width
(SPW)
Level
Digital input

Impedance

Separate analog R/G/B


700 mV (peak to peak)
75 Ohms +/- 1.5 Ohms
Separate H/V-sync
Composite H/V-sync

(Positive/Negative)
Logic High: 2.4V ~
5.5V

Logic Low: 0V ~ 0.5V


(TTL level)
Minimum 2.2K(pull

down)
0.7s < H-SPW

1H < V-SPW
600mV for each

differential line
50 Ohm TDR Scan

needed for DVI cable


and interface board

Note-1: The pin assignment of 15-pin D-sub connector is as below,

Pin
1
2
3
4
5
6
7
8

Signal Assignment
Red video
Green video
Blue video
Ground
Cable Detected
Red Ground
Green Ground
Blue Ground

-7-

Pin
9
10
11
12
13
14
15

Signal Assignment
PC5V (+5 volt power)
Sync Ground
Ground
SDA
H-Sync (or H+V)
V-sync
SCL

For 19-pin HDMI


For 15-pin D-sub

For 15-pin D-sub


Refer
VSIS
V1R1

to

VESA
Standard

10K
application

for

Note-2: The pin assignment of 24-pin DVI-D connector is as below,

Pin
1
2
3
4
5
6
7
8
9
10
11
12
3.1.2.3
Item

Signal Assignment
TMDS RX2TMDS RX2+
TMDS Ground
Floating
Floating
DDC Clock
DDC Data
Floating
TMDS RX1TMDS RX1+
TMDS Ground
Floating

Video performance
Condition

Pin
13
14
15
16
17
18
19
20
21
22
23
24

Signal Assignment
Floating
+5V Power
Ground
Hot Plug Detect
TMDS RX0TMDS RX0+
TMDS Ground
Floating
Floating
TMDS Ground
TMDS Clock+
TMDS Clock-

Spec
195 MHz/ Analog
165MHz / DVI

OK N.A Remark

Max. Resolution

1920x1080@60

Rise time + Fall time

<12 ns
(50% of minimum pixel
clock period)

Max. support Pixel rate

< 5% final full-scale


value

Settling
Time
after
overshoot /undershoot

< 12% of step function


voltage level over the
full voltage range

Overshoot/Undershoot

3.1.2.4
Scan range
Item
Horizontal
Vertical

Condition

Spec
31-83 KHz
55-76 Hz

3.1.2.5
Plug & Play DDC2B DDC-CI Support
Item
Condition
Spec
DDC channel type
EDID

DDC2B
Version 1.3

DDC-CI

Version 1.1 or Later


-8-

Both for analog and


digital inputs
1920 x 1080 @
60Hz
(max. support
timing)
Refer to VESA
VSIS Standard
V1R1
Refer to VESA
VSIS Standard
V1R1

OK N.A Remark

OK N.A Remark

Refer to BenQ LS

EDID definition.
Refer to BenQ
DDCCI requirement

definition.

3.1.2.6

Support Timings

-9-

3.1.3

Operational & Functional Specification

3.1.3.1
Video performance
*All spec. of monitor need to warm up at least 1hr.
Item
Condition
Spec
Any input resolution
modes which are under
1920x1080

Resolution

Contrast ratio

At R/G/B saturated
condition

Response time

Rising + Falling time

At Contrast ratio = 10
Viewing angle
At Contrast ratio = 10
CIE coordinate of White
Display colors
Average response time
Response time with AMA of gray level to gray
level

Brightness
range
3.1.3.3
Item

Brightness Adjustable Range


Condition
adjustable

Acoustical Noise

On/off:5 ms
(typ.),8ms(max)
R/L: 85/85 degrees (typ.)
70/70 degrees (min)
U/D: 80/80 degrees (typ.)
70/70 degress(min)
(0.313, 0.329) +/- (0.03,
0.03)
16.7 Millions colors

- 10 -

2ms(typ.), 2.9ms(max)

Spec

Spec

At 1 cm distance

Test Condition:
Set Contrast at
50, Brightness
at 100, Color at
User preset.
Test
Condition : Set
contrast at
100 ,
brightness at
100 , color at
User preset.
Test
Equipment:
Westar TRD
100 or equal
level
equipment ;

240 cd/m2 (typ.),300(min)

At default contrast level (Max. brightness value


(saturate point) & FullMin. brightness value)
white color pattern
100 cd/

Acoustical Noise
Condition

1920 x 1080

600(min),1000(typ)

Brightness

3.1.3.2
Item

OK N. Remark
A

28 dB/A

6 bit+FRC
Test Condition:
Set Contrast at
50, Brightness
at 90, Color at
User preset.

OK N. Remark
A

OK N. Remark
A
Refer to C326

3.1.3.4
Item

Environment

Temperature

Condition

Spec

Operating
Non-operating

0 ~ +40
-20 ~ +60

Operating

10 ~ 90%

Non-operating

10 ~ 90%

Humidity

Altitude

Operating

0~3048m (10,000ft)

Non-operating
3.1.3.5
Item

0~12,192m (40,000ft)

Transportation
Condition

Spec

OK N. Remark
A

Non
condensing
Non
condensing
Without

packing
With packing

OK N. Remark
A

(1) Sine wave


5~200Hz
1.5G,
1
octave/min, 15 min dwell
on
each
resonant
frequency, all primary
axis, one sweep (30 min
minimum)
per
orientation, total of 90+
min.
(2) Random
5 ~100 Hz, 0 dB/Oct.
0.015 g2/Hz
100 ~200 Hz, -6 dB/Oct.
200 Hz, 0.0038 g2/Hz
(1) Vibration
Package, Non-Operating Equivalent to 1.47 Grms,
All primary axis, 20 min
per- orientation, total is
60 min.
(3) Procedure:
Confirmed sample with
appearance and function
ready
before testing then
compare with after test
record as brightness,
uniformity and contrast
ratio. Perform random
vibration after sine-wave
vibration test.
Test Spectrum:
20 Hz 0.0185(g2/Hz)
200Hz 0.0185(g2/Hz)
Unpackaged, Non(2) Unpackaged Vibration
Duration : 5 Minutes

Operating
Axis : 3 axis
( Horizontal and Vertical
axis ,Z axis)
- 11 -

91 cm Height (MP stage)


Package, Non-Operating (1 corner, 3 edges, 6
faces)
Waveform: half sine
Faces: 6 sides/ per
Wooden package, Nonorientation

3 shocks.
Operating
Duration: <3ms
Velocity accelerate: 75g

(3) Drop

(4) Shock

3.1.3.6
Item

Electrostatic Discharge Requirements


Condition
Spec

OK N. Remark
A

Electrostatic Discharge

IEC801-2 standard

Contact: 8KV
Air: 15KV

3.1.3.7
Item

Condition

Spec

EMC

Electric
TCO03
Magnetic
FCC part 15J class B
EMI

EN55022 class B

3.1.3.8
Item

OK N. Remark
A

Band 1 < 10 V/m


Band 2 < 1 V/m
Band 1 < 200nT
Band 2 < 25nT
After Mass production
under 1dBuv for constant
measure. Besides DNSF
and VCCI class-2 are
optional.

Reliability
Condition

MTBF Prediction
CCFL Life time

Spec

Refer to MIL-217F
At 252, under 7.0mA

> 60,000 Hours


40,000 Hours (min)

OK N. Remark
A
Excluding

CCFL
See Note-4

Note-4: CCFL lifetime is determined as the time at which brightness of lamp is 50%. The typical
lifetime of CCFL is on the condition at 7.0mA lamp current.
3.1.3.9
Item

Audio performance
Condition

Spec

Preamp + Power amp


(1)Output power
(2)THD (@ 1W)
(3)S/N ratio
Speaker Driver
(1)Nominal impedance
(2)Rated input power
(3)Frequency response
(4)Output sound pressure
level
- 12 -

OK N. Remark
A

1 Wrms/CH @ 1KHz
<1%
>40dB

4 ohm
1 W/CH
180~20KHz SPL-10dB

84 3 dB (1W 0.5M)

284x60x27mm2

(5)Dimension of box
Audio Control
(1)Volume range
(2)Mute
3.1.4

0 ~100 levels
On/Off

LCD Characteristics

3.1.4.1 The Physical definition & Technology summary of LCD panel


Item
Condition
Spec
LCD Panel Supplier
AUO
Panel type of Supplier
M215HW01 V0
Display area
Unit=mm
476.64(H) x 268.11(V)
Physical Size
Unit=mm
495.6(W) x 292.2(H) x 16.35(D)
Weight
Unit=gram
2100(typ.)
Technology
TN type
Pixel pitch
Unit=um
248.25 x 248.25(Typ.)
Pixel arrangement
R/G/B vertical stripe
Display mode
Normally White
Support color
16.7Millions colors

OK N.A Remark

Per one triad

6 bit + HiFRC

3.1.4.2 Optical characteristics of LCD panel


AUO M190EG02 V.4
Item
Unit
Conditions
Min.
Typ.
Max.
Remark
[degree] Horizontal
70
85
[degree] (Right)
70
85
Viewing Angle
CR = 10 (Left)
[degree] Vertical (Up)
70
80
[degree] CR = 10 (Down)
70
80
Contrast ratio
Normal Direction
600
1000
[msec]
Rising Time
3.8
5.5
Response Time
[msec]
Falling Time
1.2
2.5
[msec]
Rising + Falling
5
8
Red x
0.618
0.648
0.678
Red y
0.309
0.339
0.369
Color / Chromaticity
Green x
0.252
0.282
0.312
Coordinates (CIE)
Green y
0.573
0.603
0.633
Blue x
0.113
0.143
0.173
Blue y
0.04
0.07
0.10
Color
Coordinates
(CIE)
White x
0.283
0.313
0.343
White
White y
0.299
0.329
0.359
[%]
9 points
Luminance Uniformity
75
80
measurement
2
White Luminance @ CCFL [cd/m ]
240
300
6.0mA (center)
Crosstalk (in 75Hz)
[%]
1.5
The test methods for the above items definition, please refer to the relative panel specification.

- 13 -

3.1.5

User Controls

3.1.5.1 Users hardware control definition


Item
Condition
Power button
Enter button
Right/Inc. button
Left/Dec. button
Menu button(Exit button)
Mode button
Input Select button
iKey button
Mute button
3.1.5.2 OSD control function definition
Item
Condition
Auto Adjust
Brightness
Contrast
Horizontal Position
Vertical Position
Pixel Clock
Phase

Spec

OK NA Remark

Spec
Auto-Geometry

OK NA Remark

Bluish
Reddish
Normal

User: Separate R/G/B


adjustment
Reset Color
OSD Horizontal position

OSD Vertical position


From 5 sec to 30 sec

17 languages

Recall All

Standard / Dynamics /

Movie / Photo/sRGB
D-sub

DVI

For input timing

Color

OSD Position
OSD Time
OSD Lock
Language
Recall
Mode
Input Select

Sharpness
Display Information
Volume

Mute

Hot key for Brightness

Hot key for Contrast

Hot key for Volume

Hot key for Input Select

Hot key for Mode

The detailed firmware functions specification, please refer to C212 S/W spec. document.
- 14 -

3.1.6

Mechanical Characteristics

3.1.6.1 Dimension
Item

Condition

Bezel opening
Monitor without Stand
Monitor with Stand
Carton Box (outside)

W x H x D mm
W x H x D mm
L x W x H mm

Tilt and Swivel range

3.1.6.2 Weight
Item
Monitor (Net)
Monitor
with
(Gross)

Spec
411.76*232.36 mm
443.68*281.68*61.98mm
443.68*342.34*61.98mm
504*417*134 mm
Tilt: -3.5 ~ +21.5 degree
Swivel: 0 degree

Condition
packing

3.1.6.3 Plastic
Item

Condition

Flammability
Heat deflection To
UV stability

ABS
ABS

Resin
Texture
Color
3.1.6.4 Carton
Item

OK N.A

Condition

Color
Material
Compression strength
Burst Strength
Stacked quantity

- 15 -

Remark

Spec

OK N.A Remark

3.2Kg

5.6Kg

Spec

OK N.A Remark

>ABS<,94-HB
65
Delta E < 8.0
MPRII: ABS
(SD0150/GP35/D350/PA
757)
MT-11010
BCS-Y7015A

Spec

OK N.A Remark

Kraft
C Flute
360 KGF
16 KGF/cm2
16 Layers

3.1.7

Pallet & Shipment

3.1.7.1 Container Specification


Stowing Type

Quantity of products
Container (sets)
(Every container)
20'

With pallet

950
1950

40'

20'
Without pallet

40'

Quantity of Products
(sets)
(Every Pallet)

Quantity of pallet
(sets)
(Every Container)

Pallet A: 80

Pallet A: 3

Pallet B: 90

Pallet B: 19

Pallet A: 80

Pallet A: 5

Pallet B: 90
Pallet C: 50
X

Pallet B: 5
Pallet C: 2
X

3.1.7.2 Carton Specification


Product:
Net Weight (Kg)

Gross Weight (Kg)

Dimension w/o Base


W*H*D (mm)

3.2Kg

5.6Kg

443.68*281.68*61.98mm 443.68*342.34*61.98mm

Package:
Carton Interior Dimension (mm)
L*W*H

Carton External Dimension (mm)


L*W*H

504*417*134 mm
3.1.8

Dimension w/ Base
W*H*D (mm)

494*395*124 mm

Certification

Item

Environment

PC-Monitor

Condition

Spec

Green design

API Doc. 715-C49

Blue Angel

German Standard

E-2000

Switzerland
USA Standard

EPA
TCO99
TCO03
Green Mark

OK N.A Remark
ISO14000

Requirement

Microsoft Windows

PC98/99

DPMS

VESA

DDC 2B
USB

Version 1.3
External

- 16 -

UL60950 3rd edition


CAN/CSA-C22.2 No.
60950
EN60950
EN60950
73/23/EEC
IEC60950
EN60950
EN60950 /
EK1-ITB 2000:2003
CB4943
EN60950
IEC60950
89/336/EEC
FCC Part 15 B
Class B
Class B
VCCI Class B
CNS 13438
AS/ NZS CISPR22
USA X- Ray Standard

UL (USA)
CSA (Canada)

Safety

Nordic / D.N.S.F
FIMKO
CE Mark
CB
CB
TUV/GS

EMC

XRequirement

Ergonomics

CCC (China)
GOST
SASO
CE Mark
FCC (USA)
EN55022
CISPR 22
VCCI (Japan)
BSMI (Taiwan)
C-Tick (Australia)
DHHS (21 CFR)
Ray DNHW

German X- Ray
standard

PTB

TUV / Ergo
ISO 13406-2
prEN50279

- 17 -

3.2. Customer Acceptance


3.2.1.
SCOPE
This document establishes the general workmanship standards and functional Acceptance
criteria for LCD color monitor model G2200HD Produced by BenQ Corporation.
3.2.2.
PURPOSE
The purpose of this publication is to define a procedure for inspection of the LCD
monitor by means of a customer acceptance test, the method of evaluation of defects
and rules for specifying acceptance levels.
3.2.3.
APPLICATION
The "Customer Acceptance Criteria" is applicable to the inspection of the LCD monitor,
completely packed and ready for dispatch to customers. Unless otherwise specified, the
customer acceptance inspection should be conducted at manufacturer's site.
3.2.4.
DEFINITION
The "Customer Acceptance Criteria" is the document defining the process of examining,
testing or otherwise comparing the product with a given set of specified technical,
esthetic and workmanship requirements leading to an evaluation of the "degree of
fitness for use", including possible personal injury or property damage for the user of
the product.
3.2.5.
CLASSIFICATION OF DEFECTS
The defects are grouped into the following classes:
Critical defect
A critical defect is a defect that judgment and experience indicate is likely to result in
hazardous or unsafe conditions for individuals using, maintaining or depending upon the
product.
Major defect
A major defect is a defect, other than critical, that is likely to result in failure, or to reduce
materially the usability of the product for its intended purpose.
Minor defect
A minor defect is a defect that is not likely to reduce materially the usability of the
product for its intended purpose, or is a departure from established standards having
little bearing on the effective use of operation of the product.

- 18 -

3.2.6.
CLASSIFICATION OF DEFECTIVES
A defective is a product which contains one or more defects. The defective will be
classified into following classes.
Critical defective
A critical defective contains one or more critical and may also contain major and/or minor
defects.
Major defective
A major defective contains one or more defects and may also contain minor defects but
contains no critical defect.
Minor defective
A minor defective contains one or more minor defects but contains no critical and major
defects.
3.2.7.

EXPRESSION OF DEFECTIVES
Number of defects
Percent of defects = ------------------------------------------ X 100%
Number of products inspected

3.2.8.
INSPECTION STANDARD
Unless otherwise specified, the inspection standard will be defined by MIL- STD105E(ISO-2859), SINGLE SAMPLING PLAN. level II is in use all the time , inspection
levels are normal ,reduce and tighten .
Acceptance Quality Level
When a critical defect is found, this must be reported immediately upon detection, the lot
or batch shall be rejected and further shipments shall be held up pending instructions
from the responsible person in relevant organization.
Major Defective: 0.4 AQL
Minor Defective: 1.50 AQL
3.2.9.
GENERAL RULES
The inspection must be carried out by trained inspectors having good knowledge of the
meaning of "fitness for use". The inspection must be based upon the documents
concerning the completely assembled and packed product when more defects appear
with the same cause only the most serious defect must be taken into account. Defects
found in accessories packed with the product as connecting cables, plugs, adapters and
the like, and being inspected as a part of the complete product, must be included in the
evaluation.
The evaluation must be within the limits of the product specification and, for not specified
characteristics, be related to the design model, limit samples or judgment of a jury of
experts. Faults must be demonstrable.

- 19 -

3.2.10.
TEST CONDITIONS
Unless otherwise prescribed, the test conditions are as follows:
. Nominal mains voltage
Temperature: +5~+35
. Warm up time : 30minutes minimum .
. Visual inspection shall be down with the distance from eyes to the sample 35-50 cm .
. Display mode: Primary mode 1280*1024
3.2.11.

TEST EQUIPMENTS
1. PC with display adapter or other specific
display adapter which is agreed upon by both parties
2. Test program by BenQ
3. Ruler
4. Power saving test tool
5. Minolta color analyzer ( CA-110 or BM 7 )

3.2.12. VISUAL INSPECTION CRITERIA


1. PACKING
2. ACCESSORIES
3. APPEARANCE
4. AC POWER AND SIGNAL CABLE
5. INTERIOR OF THE PRODUCT
No
Description
1 Packing
1.1 Wrong packing material
1.2 Carton damaged(over 6cm dia).wet, badly taped or stapled, product will not arrive
in good condition at customer
1.3 Carton damaged(3cm to 6cm dia), badly taped or stapled , product will arrive in
good condition at customer
1.4 Wrong marking of trade mark
1.5 Wrong marking of model number
1.6 Wrong serial # marking on carton
1.7 Product wrongly placed in box ( upside down )
1.8 Broken polyfoam or PU foam
1.9 Broken packing bag
1.10 Wrong size or poor printing for artwork/character
1.11 Bar-code wrong, missing, or damaged
1.12 Label on box missing or damaged
1.13 Strange object in the box
1.14 Unit not corresponding to model stated on external label
1.15 Superficial breaking 5 ~ 10 cm dia
2 Accessories
2.1 Missing accessory parts
2.2 Wrong Accessory parts
3 Appearance of product
3.1 Incorrect color of cabinet
3.2 Incorrect color of tilt/swivel base
3.3 Wrong logo or name plate

- 20 -

Class
Major
Minor
Minor
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Major
Minor
Major
Major
Major
Major
Major

No
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.20
3.21
3.22
3.20
3.21
3.23
3.24
3.25
3.26
3.27
3.28
3.29
4
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10

Description
Poor print of logo or name plate
Label on product Wrong or missing
Scratched or dirty but legible spec. label
GAP between LCD and front bezel is over 2.0 mm
Dot/area discolor over 1mm dia. in front or over 2mm dia. in other areas
Cabinet warped, sagged or bulging 0.5% of surface length
Cabinet warped, sagged or bulging noticeable but 0.5% of surface length
Sharp stud or edge, which can cause damage not safe
Finishing of piece parts will not arrived in good condition at the customer
Cabinet step ( between housing and bezel ) 1.0mm , < 1.5mm
Cabinet step ( between housing and bezel ) 1.5mm
Wiring or fixing cord comes out of cabinet or jammed
Auxiliary material used during production not removed
Cabinet parts come loose during normal handling, not safe
Cabinet parts come loose during normal handling, but safe
Tilt/swivel too flexible/not working
Tilt/swivel stiff
Dirty front bezel and housing cant remove
Dirty front bezel and housing removable easily
Sticker or loose user control switch which will not function correctly
Missing knob or switch, not safe
Missing knob or switch, but safe
Poor functional user controls in mechanical
Unreadable printing of user controls label
Rubber foot missing
LED wrong material or missing
LED sagged >1.0mm or bulging>0.5mm
Wrong S/N between spec. label and monitor display
AC power and signal cable
AC power or connector not correct or damaged, not safe
AC power or connector not correct or damaged, but safe
Signal cable contact pin dirty
Signal cable plug dirty or surface damaged, but safe
Cable crack
Cable scratch ( wire not exposed ), or dirty
AC-DC adapter no function
Signal cable contact pin dirty
Interior of the product
Use Non-QVL ( Qualify vendor list )component
Wrong parts, broken component, but safe
Foreign material
Conductive (Has potential to short circuit)
Non-conductive (Moveable)
Missing hardware, component or screw, stripped screw
Loose hardware/screw or insufficient torque
Poor wire routing, which is no concerned on EMI
Cold soldering/loose connections (Electrical)
Wires and mechanical structure do not meet UL/CSA or TUV
Wrong parts, broken component, not safe
Component burn
- 21 -

Class
Major
Major
Minor
Major
Major
Major
Minor
Major
Major
Minor
Major
Major
Major
Critical
Major
Major
Minor
Major
Minor
Major
Critical
Major
Major
Major
Major
Major
Minor
Major
Critical
Major
Minor
Minor
Major
Major
Minor
Major
Major
Major
Major
Minor
Major
Major
Minor
Major
Critical
Critical
Critical

3.2.13. OPERATIONAL INSPECTION CRITERIA


1. TEST PATTERN
2. SPECIFICATIONS
3. OPERATIONAL INSPECTION CRITERIA

3.2.13.1. List of test pattern


KEY
A

PATTERN
FULL WHITE

DARK

TEST ITEM
H - Size , V Size
.Viewing Angle
Light Output
Impurity, Spot check
Contrast Ratio
Brightness adjust Range
Background, Spot check

FULL W , R , G , B

Impurity, Spot check


.CIE Coordinate check

256 COLORS

Color Check

16 GREY

Gray Check

Electric characteristics

Black/White stripe pattern

- 22 -

3.2.13.2. Video performance


Item
Condition

Spec
195 MHz/ Analog
165MHz / DVI

OK N.A Remark

Max. Resolution

1920x1080@60

Rise time + Fall time

<12 ns
(50% of minimum pixel
clock period)

Max. support Pixel rate

Settling Time after


overshoot /undershoot

< 5% final full-scale


value

< 12% of step function


voltage level over the
full voltage range

Overshoot/Undershoot

Both for analog and


digital inputs
1920 x 1080 @
60Hz
(max. support
timing)
Refer to VESA
VSIS Standard
V1R1
Refer to VESA
VSIS Standard
V1R1

3.2.14. PANEL INSPECTION CRITERIA


Inspection Item

Specification

Line defect

Cant be seen

Bright Dot

<=2 dots

Green bright
dots

<=2 dots

Dark dots

<=4 dots

Total dots defect

<=5 dots

Continuous
Defect

Two continuous bright dots(vertical ,horizontal, oblique):<=1


pair
Exclude continuous green-green bright dots
Three or more continuous bright dots (vertical,
horizontal ,oblique):Not allowed
Two continuous dark dots(vertical ,horizontal, oblique):<=2
pairs
Three or more continuous dark dots(vertical, horizontal,
oblique):Not allowed
Distance between 2B dots:>=15mm
Distance between 2Ddots:>=15mm
Distance between B and D dot :>=10mm

Note:
This Panel Specification is subject to change. Please check it on eSupport system for latest update.

- 23 -

4. Level 1 Cosmetic / Appearance / Alignment Service


4.1. Software / Firmware Upgrade Process
4.1.1 Hardware Requirement:

1. I2C board x 1 (a.Print Board b. I2C Board)


2. DSUB VGA cables x 2
3. Printer cable (with one male connector and another female connector) x 1.
4. PC or Notebook with parallel (printer) port x1.

Print Cord

I2C Board

Check the Jumpers on the I2C circuit board (make sure J5/J6/J7/J8 are set at Pin 1 & Pin 2 short)

Connected to print
cord and PC

Connected to Display
Signal Cable

- 24 -

Link I2C BD, Power cable and Signal cable

4.1.2 Software prepare


1. Writer_t9.exe

Step 1: Press NOVATEK Tool


Step 2: Choose Load File

1.

- 25 -

Step 3: Click the Bank and Find the F/W

Step4: Choose Auto run the program

Step6: Check result. If the words showed in red, need to run the program again

- 26 -

4.1.3 EDID Upgrade Procedure


Step 1: Run the program Q-EDID-V016.exe, when the UI popped up

Note: If VGA choose 128bytes, and HDMI choose 256bytes

- 27 -

Step 2: Click Open File and select VGA or HDMI EDID file

Step 3: If load file is successful, it shows Open EDID Table OK.


And then, Click Write EDID button to update EDID

- 28 -

Step 4: If write EDID is successful, it shows Write EDID OK


And then, click Read EDID button to check if successful or not.

Step 5: If read EDID is successful, it shows Read EDID OK

- 29 -

4.2. Alignment procedure (for function adjustment)


A. Preparation:
1. Setup input timing ICL-605( 1280x1024@75Hz ), Pattern:5-Mosaic.
2. Setup unit and keep it warm up at least 30 minutes.
B. Timing adjustment:
1. Enter factory setting area (press ENTER, MENU and then press SOFTPOWER).
2. Check the settings to following values:
Contrast = 50
Brightness = 90
Color = User Mode
Senseye mode = Standard
Language = English
Burn In =ON
Then, turn off the monitor power.
3. Turn on power enter user area.

C. Color balance adjustment:


1. Enter factory setting area (press ENTER, MENU and then press SOFTPOWER).
2. Setup input timings WS7 (1280x1024@75Hz), Pattern: 5-Mosaic.
3. Setup Color mode User Mode.
4. Press I-KEY( or Left key directly), and then OSD will show White Balance item and then
press ENTER button to do auto color.

- 30 -

D. Color adjustment:
1. Setup input timing ICL-605, white pattern.
2. Confirm auto color adjustment had already done.
3. Measure color temperature by Minolta CA-110 (or equivalent equipment).
4. Check the color temperature Bluish, Reddish & Normal. The color temperature
specification as follows:
X+0.283+(-) 0.015
White Balance
(Bluish, 9300K set on OSD)
Y+0.297+(-) 0.015
White Balance
X+0. 326+(-) 0.015
(Reddish, 5800K set on OSD)
Y+0. 342+(-) 0.015
White Balance
X+0.313+(-) 0.015
(sRGB, 6500K set on OSD)
Y+0. 329 +(-) 0.015
5. Setup input timing, 32 -Gray pattern.
To check if there are any abnormal display problems of preset timing modes .
Check the following preset timings with General pattern:
No.
Mode
H
V
1
720400 @ 70Hz
31.468
70.8
2
640480 @ 60Hz
31.469
59.940
3
640480 @ 75Hz
37.500
75.000
4
800600 @ 60Hz
37.879
60.317
5
800600 @ 75Hz
46.875
75.000
6
1024768 @ 60Hz
48.363
60.004
7
1024768 @ 75Hz
60.023
75.029
8
1152x870@ 75Hz
68.680
75.060
12801024 @
9
63.981
60.020
60Hz
12801024 @
79.976
75.025
10
75Hz
11
1366x768 @ 60Hz
47.76
59.85
12
1440x900 @ 60Hz
55.94
59.89
1680x1050 @
13
65.29
60.00
60Hz
1920x1080 @
67.158
60.00
14
60Hz
6. Checking if the picture is no good, reject this monitor.
7. To check the power consumption by disabling burn-in mode setting
8. To clear user data and program complete DDC data to monitor by IIC bus communication.
E. Writing EDID file:
1. Setup a PC with DDC card.
2. Connect PC to monitor with a D-sub(DVI) signal cable.
3. Please refer to the C212 for the correct EDID file.
4. Runs the writing program to write the EDID file into EEPROM .
5. Read EEPROM data and confirm it to match with the C212 document definition.

- 31 -

F. Command definition :
PC Host will send 0x7C IIC slave address and then following 4 bytes command
Byte Byte
I2C Send Command
Byte1 2
3
Byte4 OK NA Remark
Write data to MCU RAM
Write Contrast to MCU RAM
CA 55 Data cksum
and update the related
Write Brightness to MCU RAM
CA 56 Data cksum
register to refresh the
Write Red Gain to MCU RAM
CA 57 Data cksum
screen immediately.
Write Green Gain to MCU RAM
CA 58 Data cksum
Dont store data to
Write Blue Gain to MCU RAM
Read Contrast from MCU RAM
Read Brightness from MCU RAM
Read Red Gain from MCU RAM by
color index
Read Green Gain from MCU RAM by
color index
Read Blue Gain from MCU RAM by
color index
Write C1 (Bluish) R-Gain Data to
EEPROM
Write C1 (Bluish) G-Gain Data to
EEPROM
Write C1 (Bluish) B-Gain Data to
EEPROM
Write C2 (sRGB) R-Gain Data to
EEPROM
Write C2 (sRGB) G-Gain Data to
EEPROM
Write C2 (sRGB) B-Gain Data to
EEPROM
Write C3 (Reddish) R-Gain Data to
EEPROM
Write C3 (Reddish) G-Gain Data to
EEPROM
Write C3 (Reddish) B-Gain Data to
EEPROM
Write User R-Gain Data to EEPROM
Write User G-Gain Data to EEPROM
Write User B-Gain Data to EEPROM
Write Cx R-Gain Data to EEPROM
Write Cx G-Gain Data to EEPROM
Write Cx B-Gain Data to EEPROM
Write Contrast to EEPROM
Write Brightness to EEPROM

Write C/T index to EEPROM


Write OSD-Hpos to EEPROM

CA
C3
C3

59 Data cksum
55 XX cksum
56 XX cksum

C3

57

XX cksum

C3

58

XX cksum

C3

59

XX cksum

AA

3C Data cksum

AA

3D Data cksum

AA

3E Data cksum

AA

4C Data cksum

AA

4D Data cksum

AA

4E Data cksum

AA

5C Data cksum

AA

5D Data cksum

AA
AA
AA
AA
AA
AA
AA
AA
AA

5E
6C
6D
6E
7C
7D
7E
92
93

AA
AA
- 32 -

Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum

EEPROM.

Base on current color


index to read back the
right gain value.

Reserved for some


model have extra color
temperature

94 1~4 cksum
95 Data cksum

1=C1/9300/Bluish,
2=C2/6500/sRGB/,
3=C3/5800/Reddish,
4=User, 5=Cx

Write OSD-Vpos to EEPROM

AA

96 Data cksum
(Also Update MCU RAM)

Write Language to EEPROM


Write EEPROM OSD Timer
Write EEPROM Volume

AA
AA
AA

97 0~17 cksum
98 Data cksum
99 Data cksum

Write EEPROM Gamma index


Write OSD Transparency to EEPROM
Write OSD Rotation to EEPROM
Read C1 (Bluish) R-Gain data from
EEPROM
Read C1 (Bluish) G-Gain data from
EEPROM
Read C1 (Bluish) B-Gain data from
EEPROM
Read C2 (sRGB) R-Gain data from
EEPROM
Read C2 (sRGB) G-Gain data from
EEPROM
Read C2 (sRGB) B-Gain data from
EEPROM
Read C3 (Reddish) R-Gain data from
EEPROM
Read C3 (Reddish) G-Gain data from
EEPROM
Read C3 (Reddish) B-Gain data from
EEPROM
Read User R-Gain data from EEPROM
Read User G-Gain data from EEPROM
Read User B-Gain data from EEPROM
Read Cx R-Gain data from EEPROM
Read Cx G-Gain data from EEPROM

AA
AA
AA

9A Data cksum
9E Data cksum
9F Data cksum

A3

3C

XX cksum

A3

3D

XX cksum

A3

3E

XX cksum

A3

4C

XX cksum

A3

4D

XX cksum

A3

4E

XX cksum

A3

5C

XX cksum

A3

5D

XX cksum

A3
A3
A3
A3
A3
A3

5E
6C
6D
6E
7C
7D

XX
XX
XX
XX
XX
XX

Read Cx B-Gain data from EEPROM


Read Contrast from EEPROM
Read Brightness from EEPROM

A3
A3
A3

7E
92
93

XX cksum
XX cksum
XX cksum

- 33 -

cksum
cksum
cksum
cksum
cksum
cksum

1=English, 3=French,
0=Deutsch, 4=Italian,
2=Spanish, 5=JAPAN,
6=, 7=
8=Hungarian,
9=Serbian, 0A=Russian,
0B=Dutch, 0C=Polish,
0D=Czech, 0E=Swedish,
0F=Portugese,
10=Romanian

For model with Gamma


curve selection function

Reserved for some


model have extra color
temperature

Read C/T index from EEPROM


Read OSD-Hpos EEPROM
Read OSD-Vpos from EEPROM

A3
A3
A3

94
95
96

1=C1/9300/Bluish,
2=C2/6500/sRGB/,
3=C3/5800/Reddish,
4=User, 5=Cx

XX cksum
XX cksum
XX cksum

1=English, 3=French,
0=Deutsch, 4=Italian,
2=Spanish, 5=JAPAN,
6=, 7=
8=Hungarian,
9=Serbian, 0A=Russian,
0B=Dutch, 0C=Polish,
0D=Czech, 0E=Swedish,
0F=Portugese,
10=Romanian

Read Language from EEPROM


Read OSD Timer from EEPROM
Read Volume from EEPROM

A3
A3
A3

97
98
99

XX cksum
XX cksum
XX cksum

Read Gamma index from EEPROM


Read OSD Transparency from
EEPROM
Read OSD Rotation from EEPROM
Change Color Temp. to
C1/9300K/Bluish
Change Color Temp. to
C2/6500K/sRGB
Change Color Temp. to
C3/5800K/Reddish
Change Color Temp. to User
Change Color Temp. to Cx
Change Input Source to D-Sub
Change Input Source to DVI
On burn in mode

A3

9A

XX cksum

A3
A3

9E
9F

XX cksum
XX cksum

CC

01

XX cksum

CC

02

XX cksum

CC
CC
CC
CD
CD
CE

03
04
05
01
02
01

XX
XX
XX
XX
XX
XX

cksum
cksum
cksum
cksum
cksum
cksum

Off burn in mode


Monitor is forced power saving
Monitor wake up from power saving
Change Sense-Eye mode to Standard
Change Sense-Eye mode to Movie1
Change Sense-Eye mode to Movie2

CE
CF
CF
C0
C0
C0

XX*
01
XX*
00
01
02

XX
XX
XX
XX
XX
XX

cksum
cksum
cksum
cksum
cksum
cksum

Change Sense-Eye mode to Photo


Set luminance sensor mode to Off
Set luminance sensor mode to Bright
Set luminance sensor mode to
Moderate

C0
C1
C1

03
00
01

XX cksum
XX cksum
XX cksum

C1

02

XX cksum

- 34 -

For model with Gamma


curve selection function

Change C/T immediately.


And store C/T index to
EEPROM.

Reserved

Store data to EEPROM


XX* = Non 1 value
Store data to EEPROM

XX* = Non 1 value


Change Sense-Eye
mode immediately. And
store the index to
EEPROM.
Change luminance
sensor mode
immediately. And store
the index to EEPROM.

Set luminance sensor mode to Dim


Increase ADC R-Offset2
Increase ADC G-Offset2
Increase ADC B-Offset2
Increase ADC R-Gain
Increase ADC G-Gain
Increase ADC B-Gain
Decrease ADC R-Offset2
Decrease ADC G-Offset2
Decrease ADC B-Offset2
Decrease ADC R-Gain
Decrease ADC G-Gain
Decrease ADC B-Gain
Read ADC R-Offset2
Read ADC G-Offset2
Read ADC B-Offset2
Read ADC R-Gain
Read ADC G-Gain
Read ADC B-Gain
User mode to factory mode
Auto Color (Offset1, Offset2, Gain)

C1
AC
AC
AC
AC
AC
AC
AD
AD
AD
AD
AD
AD
AE
AE
AE
AE
AE
AE
1A
1B

03
23
24
25
33
34
35
23
24
25
33
34
35
23
24
25
33
34
35
5A
5A

XX cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
Data cksum
XX cksum
XX cksum
XX cksum
XX cksum
XX cksum
XX cksum
XX cksum
XX cksum

For specified Industry


Customer model.

Copy EDID Serial number to EEPROM


Factory mode to User mode

1C
1E

5A
5A

XX cksum
XX cksum

Clear user mode and factory recall


Write EDID data to MCU DDC RAM
Copy DDC RAM data to EEPROM
Drive WP pin to low to enable write DDC
IC
Drive WP pin to high to disenable write
function

1F
55
BB

5A
NA
NA

XX cksum
NA
NA
NA
NA

55

NA

NA

NA

For stand alone DDC IC

BB

NA

NA

NA

Switch DDC bus to DVI-A DDC IC

44

NA

NA

NA

For stand alone DDC IC


For input signal with
multi-input source

Switch DDC bus to DVI-D DDC IC


Change Senseye Mode

Change Power Status

Change Language Type

33
C0

NA
0~3

NA
NA
XX cksum

Store data to EEPROM


For MTV312 MCU type
For MTV312 MCU type

PowerOFF: Data=AA
PowerON: Data=Other
Value

D0 Data XX cksum

D1 Data XX ckssum
- 35 -

For input signal with


multi-input source

Asia: Data=AA
European: Data=Other
Value

EEPROM Bank R/W (For Debug using only, not for Production Line Write EEPROM directly)
Addr
Read EEPROM Bank 0
B0 ess XX cksum
Addr
Read EEPROM Bank 1
B1 ess XX cksum
Addr
Read EEPROM Bank 2
B2 ess XX cksum

(For 24C08 type)


Addr
Read EEPROM Bank 3
B3 ess XX cksum

(For 24C08 type)


Addr
Write EEPROM Bank 0
B8 ess Data cksum
Addr
Write EEPROM Bank 1
B9 ess Data cksum
Addr
Write EEPROM Bank 2
BA ess Data cksum

(For 24C08 type)


Addr
Write EEPROM Bank 3
BB ess Data cksum

(For 24C08 type)


Note A: Byte4 (cksum) = Byte1 + Byte2 + Byte3
Note B: Data = The value write to MCU or EEPROM
Note C: XX = don't care, any value (<=0xFF).
When PC Host sends 0x7D command to MCU, MCU must return as following (2 bytes)
Return Code
Checksum error code
Normal return code
If normal return code is exact FCh

- 36 -

R-Byte1
FC

R-Byte2
AA

the above Byte3 (/data)

FC

FC

CF

5. Level 2 Disassembly /Assembly Circuit Board and Standard Parts Replacement


5.1. Exploded View
16
11

15
14

12
1

13

3
8
2
9
10

- 37 -

* This Service BOM is subject to change. Please check it on eSupport and SPO system before
service parts order release

- 38 -

5.2. Disassembly /Assembly


5.2.1 Disassembly SOP
Preparation before disassemble
1. Clean the room for disassemble
2. Identify the area for monitor
3. Check the position that the monitors be placed and the quantity of the monitor; prepare the area for
material flow; according to the actual condition plan the disassemble layout
4. Prepare the implement, equipments, material as bellow:
1) Press-fixture
2) working table
3) Screw-driver
4) knife*1
5) glove
6) cleaning cloth
7) ESD protection
ite
m

picture

Operation
Disassemble the stand
2 screws

disassembly the bezel


from the monitor, notice
the disassembly order :
1.Left (1) parts of bezel
2.Top (2) parts of bezel
3.Bottom (3) parts of
bezel
4. Right (4) parts of
bezel
Dont draw the BZL

- 39 -

Tool

Notes

Screw-driver

When disassembly
the bezel ,notice
dont bend the
C/B .man must wear
glove
The purpose is
loose the BZL

Turn over the


monitor ,dismantle the
Rear cover from the
monitor(if it have
earphone function, pull
the earphone wire out
of the connector)

Pull the c/b wire out of


the c/b connector.
Tear off the C/B wire
from panel ,move away
C/B and button

Tear off the big


aluminum foil.

- 40 -

Tear off the two acetic


tapes (if it have that )
Pull out the light wires
from connector .

Disassemble the SHD

Tear off all the tapes


sticked on the BKT
(including aluminum
foils and acetic tapes )

- 41 -

Tear off the yellow tape


on the LVDS FFC ,and
pull LVDS FFC out off
the panel .

10

Disassemble the
hexangular screws
( four or two )

10

Turn over the BKT , and Screw-driver


disassemble the power
board and I/F board .----7 screws

11

Pull out the connector

- 42 -

5.2.2 Assembly SOP


Preparation before assemble
1. Clean the room for work
2. Identify the area for material
3. Prepare the implement, equipments, material as bellow:
5)Press-fixture
6)working table
7)Screw-driver
8) knife*1
5) glove
6) cleaning cloth
7) ESD protection
ite
m

picture

Operation

Tool

Put panel on the


cushion carefully,

Fetch I/F board and


LVDS FFC ,insert FFC
into I/F .

Fetch power board and


put it into BKT, and put
the connector wire into
I/F connector ,then put
I/F into BKT (like the
pic. Showed )

Lock PCBA screw .-five or six PCBA


screw ,one earth
screw .

- 43 -

Screw driver :
71kg

Notes

Turn over the bkt, and


lock the hexangular
screws ( four or two )

Lock SHD on the


BKT ,to fixup the P/B

Insert LVDS FFC in the


panel

Fetch yellow tape, and


stick it on the LVDS
FFC

Use location
tool ,location the bkt on
panel

- 44 -

Screw
driver:5+0.6kg

location
tool:2201HD

10

Stick tapes follow


standard:
One tape stick on left
side ,one on angel side

11

Insert light wires ,and


make sure it connect
well .

12

Stick big aluminum foil


on the side (like left
PIC)

13

Fetch bezel ,and put


panel into bezel (dont
touch the LCD screen.

14

Put c/b in the button,


and put button in bezel.
Tear the tapes
on the back of c/b wire ,
insert c/b connector in
I/F ,stick c/b on panel .

- 45 -

15

Fetch cover ,cover the


monitor .
First cover bottom ,then
cover two sides ,last
cover the angel side .

3
2

16

Assay stand .(follow


picture on left .) put
hinge in front
cover ,and lock four
screws, then cover the
back cover ,last put the
clip in front cover.

Screw driver :
7.5+0.5kg

17

Put stand in monitor,


and lock two screws .

Screw driver :
9.0+1.0kg

18

Fetch base ,and assay


base on monitor .

- 46 -

5.3. Main-Shielding Position

Model Name
BenQ G900HD
BenQ G2220HD
BenQ G2020HD
BenQ G2410HD AUO
BenQ G2410HD CMO
BenQ T2200

Point A dimension
56.69mm
84mm
69mm
78.65mm
72.65mm
56.69mm

Point B dimension
40mm
44.5mm
42mm
57.2mm
55.85mm
40mm

Point C dimension
40mm
44.5mm
42mm
57.2mm
55.85mm
40mm

AL-Tape

AL-Tape
L Shape Tooling

- 47 -

5.4. Packing

- 48 -

5.5. Block diagram


G2220HD consists of a head and a stand (base). The head consists of a LCD module with 4 lamps,
a power board (include AC/DC, inverter power), a control board, a power key board, and an
interface BD.
The block diagram is shown as below.

- 49 -

5.6. Trouble Shooting Guide


5.6.1 No Display or display is unstable on analog or digital port:
5.6.1.1 Interface Board:
No picture or picture unstable on
analog port and DVI port
Power off

Y
Turn on power

N
Does cable plugs in connector?

Plug the cable then turn


on power again

Y
N
Does power stable?

Check Power Board DCDC circuit and regulator

Y
Is Power LED light Green or amber?
Y

Is Power LED status normal?


Y
Does crystal work correctly?

Check Key BD and Key


BD cable
Replace IF BD

Check crystal CKT or


replace it (Y1)

Y
Is interface BD normally?
Y

Replace interface BD

N
Plug LVDS cable again

Is LVDS cable connect OK (to J6


and Panel)?

or replace it

Y
Replace panel

- 50 -

5.6.2 BUTTON Function:


5.6.2.1 Control Board
OSD is not working
Yes

No
Plug control BD then retry

Is control BD connecting?
Yes
Yes
Is bottom key normally?

Replace control BD then retry

No
Replace Control BD
Is OSD working??

No
Check Interface BD

5.6.3 OSD Function:


OSD doesnt work

Is control BD working?

Replace control BD

Check interface BD

- 51 -

5.6.4 Power no work troubleshooting


5.6.4.1 DC/DC converter

- 52 -

5.6.4.2 AC/DC converter

- 53 -

5.6.4.3 Inverter

- 54 -

5.7. Circuit Operation Theory


A-1.) Interface board diagram:

(a) Circuit operation theory:


A basic operation theory for this interface board is to convert analog signals of Red, Green
and Blue to digital signals of Red, Green and Blue, and to provide DVI port equipped with
HDCP key, for receiving DVI signal to generate high quality image. The scaling IC has
internal A/D converter, internal OSD and auto detect input timing functions. A/D converter is
convert analog signal to digital data. OSD is offering adjustable functions to end-user. Detect
timing is for detect change mode. Scalar generates the pixel clock to the TCON. Finally
output the digital RGB data, the Hsync, Vsync and pixel clock to LCD panel driver IC.MCU
offers H/W DDC2BI function & controls system processing. EEPROM is stored DDC data,
OSD common data and user mode data.
(b) IC introduction:
(1) The NT68667UFG is a graphic processing IC for LCD monitor with panel resolution up to
WUXGA. It is configured with a triple-ADC/PLL, an integrated DVI receiver, a display
processing engine, an integrated micro-controller, and a LVDS interface. It also consist
power management control capability for green-mode requirement and spread-spectrum
support for EMI management.
(2) EEPROM: We use 24C16 to store all the adjustable data and user settings. The HDCP
KEY is stored in it.
- 55 -

(3) Serial Flash: It controls all the functions of this interface board, just like the OSD display
setting, the adjustable items, adjusted data storage, the external IIC communication, support
DDC2BI.
(4) DDC (Display Data Channel) function: We use DDC IC to support DDC2BI function and
connected to analog SDA/SCL for analog DDC data. DDC data is store in 24C02(EEPROM).
Those data related to LCD monitor specification. PC can read them by SDA and SCL
serial communication for IC communication for DDC2Bi.
A-2.) Power board diagram:

Fig.1
#1 EMI Filter
This circuit (fig. 2) is designed to inhibit electrical and magnetic interference for meeting FCC,
VDE, VCCI standard requirements.
2

TR601
NTC 5

L3

L4

3
N2

L602

C601
0.22U M

C604
2200PF

19MH
C602
0.22U M

C603
2200PF
N3

Fig. 2
- 56 -

#2 Rectifier and filter


AC Voltage (90-264V) is rectified and filtered by BD601, C605 (See Fig 3) and the DC
Output voltage is 1.4*(AC input). (See Fig.3)
E1
1

L6
~

+
1

C605
150U 450V
<Spec>

+
GSIB4A60-LF
BD601

~
3

R605
10K

Fig. 3
#3 Switching element and Isolation power transformer
When the Q601 turns on, energy is stored in the transformer. During Q601 turn-off period,
the stored energy is delivered to the secondary of transformer. R607, C607 and D601 are a
snubber circuit. R615 is current sense resistor to control output power. (See Fig.4)
L605

E2

Z45/100MHZ
C607
0.001U J

R607
68K

E3
K

T601

12

D601
UF4007-LF
2

E4
L604
Z45/100MHZ
E5

R611

10
11

L603

10

Q601
STP7NK80ZFP

Z45/100MHZ

C616
100P K

R615
0.22

A
D605
LL4148

Fig. 4
- 57 -

8
600UH

#4 Rectifier and filter


D701 and C703 C704 are to produce DC V-INVERTER output. (See Fig.5)
D702 and C707 C708 are to produce DC +5V output.
IC701 and C709 C712 are to produce DC +3.3V output.(DC to Dc convert)

D701
YG862C15R

C703
330U
35V

C704
330U
35V

R713
330

ZD701
BZV55C15

R715
100
A

A2

V-INVERTER

12

A1

R701
27

T601

C710
1000P K

C701
1000P K

10
11

+5V
E

Q701
2SC1213A

D702
YG862C15R
A1
J
A2

8
600UH

Fig. 5

- 58 -

C708
680U 16V

+
+

VIN

VOUT

+3.3V
2

C709
470U 10V M

+
2

1
+ C707
680U 16V

IC701
LD1117-3.3

R703
0.68

GN D

R702
27

C702
1000P K

PC702

C712
470U 10V M

#5 PWM Controller
The TEA1530(A)T can be used in Fixed Frequency converter designs for low voltage, high
current applications. At low power (standby) levels, the system operates in cycle skipping
mode which minimizes the switching losses during standby.
The proprietary high voltage BCD800 process makes direct start-up possible from the
rectified universal mains voltage in an effective and green way. A second low voltage
BICMOS IC is used for accurate, high speed protection functions and control.
The TEA1530(A)T enables highly efficient and reliable supplies to be designed easily.
L605

E1

E3

Z45/100MHZ
C607
0.001U J

R607
68K

C605
+
150U 450V
<Spec>

E2

T601

12

D601
UF4007-LF
2

E4
R605
10K

L604
Z45/100MHZ
E5

R606 10

Gnd

HVS

Protect Driv er

C608
2200P K

R612
10 J

6
PC611

C612
1U K

R620
100K F

Ctrl

Sense

C614

R614
1K F

100PF 50V J

R622
10K F

R615
0.22

90V58W Protection
A

R618
4.7K

K
ZD602
TZMC5V1

Fig. 6

- 59 -

R616 511K F

A
D605
LL4148

8
600UH

0.22 U

264V63W Protection
C610
3300P J

C616
100P K

R613 10K

5
C611

R617
10K F

Q601
STP7NK80ZFP

C613
1U 25V

ZD601
TZMC20

E6

Z45/100MHZ

IC601 TEA1530AP
1
8
Vcc
Drain

UF4007-LF

C606
47U 50V

11

L603

R611 10

10

D602
K

#6 Feedback circuit
PC123 is a photo-coupler and TL431 is a shunt regulation. They are used to detect the
output voltage change and be the primary and secondary isolation. When output voltage
changes, the feedback voltage will be compared and duty cycle will be decided to control the
correct output voltage. (See Fig.7)

R709
680 J
R711
10K F
1
2

R708
1K F

R710 10K F

4
IC602
PC123FY 1J00F

R619 27K

R
IC702

KA431AZT A_NL

C711
1U 50V K

R712
10K F

Fig. 7
A-3.) Inverter Circuit Operation Theory
An Intelligent CCFL Inverter Controller OZ9933
OZ9933 is a high performance, cost-effective CCFL controller designed for driving large-size
LCD applications requiring 2 to 6 CCFLs.
The controller converts unregulated DC voltages into a nearly sinusoidal lamp voltage and
current waveforms.
The OZ9933 supports full-bridge power conversion topologies while maintaining highefficiency operation, current and voltage regulation, over-voltage and over-current protection,
high drive capability.
The control logic provides s regulated ignition voltage and appropriate protection features for
over-voltage or over-current conditions.

- 60 -

Pin Assignment of OZ9933

C805
0.047U K

PC805
+5VDDA
+5V

N_B

R803
10 J

+
2

C803
47U 50V
<Spec>

IC801
N_D
9
10

K
ZD803
TZMC6V2

C804
1U K

R804
100K

11

R828
1K

12

C807
1U K

C817
1U K

BRT_ADJ
R829
100K
C811
1000P K

D804
LL4148

R805
1M F

13

15

C812
0.022U K

NDR2

PDR1

GNDP

VDDA

PDR2

TIMER

GNDA

8
7

16

PWM

RT1

ISEN

CT

OVPT

SST/CMP

ENA

VSEN

0.047U K

3
2
1

R807
1M F

C810
0.047U K

BL_ON

Fig.1

- 61 -

C813
0.1U K

R806
82K F

R808
1K

R809
100K

P_C

C806
6

OZ9933

14
K

NDR1

R810
1M F

C808
0.01U K

PR806

C809
220P J

K
R802
5.1K

ZD801
TZMC6V2

R801
5.1K

Q801

P_A

+ ZD802
TZMC6V2

C805
0.047U K

4
5
6
8
7

N_B
2

1
P_C

C806

C828
4.7U M

Q802

T801

1
2

C829
15P J
6
7

R811
10K

C827
4.7U M

3
4

0.047U K

5
6
8
7

N_D

C830
15P J

1J.26051.041

2
R812
10K

C801
470U 35V
RC1820

Full-Bridge Configuration

Fig. 2
The full-bridge switch is configured such that Q801 N-MOS and Q802 P-MOS are ON while
Q801 P-MOS and Q802 N-MOS are OFF in a half-cycle. During the next half cycle, Q801 NMOS and Q802 P-MOS are OFF while Q801 P-MOS and Q802 N-MOS are ON. This
develops an alternating current through the transformer primary. The result in T801 primary
coil has an AC square waveform. Certainly, the secondary of T801 will produce high voltage
AC sinusoidal waveform.

- 62 -

Feedback Circuit
F1

TP801
R831
3M

R819
100K

C820
470P J

A1

A2
J

C819
5PF D

C838
0.1U

1
2

C821
5PF D

C829
15P J

3
4

TP803
TP804
R832
3M

R816
2.2K
R822
20K F

A1

1J.26051.041

PD806

D806
BAV70

R810
1M F

C808
0.01U K

A2

PR827
C814
0.033U K

D805
BAV99
A

R827
365 F

Fig.3
Fig.3 shows a feedback circuit consists of a lamp, R816, D805, R827 and C814. With the
lamp current through D805, a half sin-waveform voltage signal is produced. We may get the
Maximum value through R827 and C814.
After OZ9933 gets the feedback voltage signal from PIN14, the duty of the PWM driver
outputs is decided.

- 63 -

1
2

CN802
1
2
2K62272102

C822
470P J

R815
2.2K

R821
100K
C830
15P J

CN801

2K62272102

C821-2

6
7

R820
20K F

F3
5

D801
BAV70
R841
33K

T801

TP802

Appendix 1 Screw List / Torque


STANDARD SCREW TORQUE SPEC.
ITEM

P/N

DESCRIPTION

1
8F.205B4.019 SCRW MACH HEX #4-40*0.3" N
2
8F.5A224.6R0 SCRW MACH FLATM3*0.5P*6L ZN
3

8F.EA324.6R0 SCRW TAP FH M3*6L ZN

4
8F.5A356.8R0 SCRW MACH FH M4*8L B-ZN NYL
5

ASSY SCREW M4*8L FP726A NLK


ISU
6K.L8810.001
(8F.5A456.8R0+4B.L7212.001)

6
8F.00273.6R0

SCRW TAP PH F/10WSH M3*6L CZN

8F.VZ524.6R0

SCRW TAP FLAT+EXT M3*6L CZN

8F.00518.100

SCRW TAP W/FL M3*10L(S3.8)ZN

8F.00003.143

SCRW TAP PAN #4-40*3/8

10
8F.VG234.6R0 SCRW TAP PH W/F M3*6 TP-S ZN
11

8F.VZ526.6R0

SCRW TAP FLAT+EXT M4*6L ZNW

12
SCRW TAP FPHM3*6(6/1)TP-S B8F.HA334.8R0 ZN
13
SCRW MACH FLAT M4*8L C-ZN
8F.5A456.8R0 NYLO
14
8F.WA324.6R0 SCRW TAP CAP M3*1.34P*6L B-NI
15

8F.XA324.5R0 SCRW TAP M3*5L B-ZB

16
8F.1A526.5R0 SCRW MACH PAN M4*5L NI

- 64 -

MOUNTING
MATERIAL
Metal;
D-SUB;DVI
Connector
Metal
Metal to metal
Plastic to metal
Metal
Metal
Metal to metal
Plastic to metal
Metal
Metal to metal
Plastic to metal
Metal
Metal to metal
Plastic to metal
PCB to metal
Metal
Metal to metal
Metal
Metal to metal
Plastic to metal
SPEAKER to
metal
Aluminum
(Heatsink)
Aluminum
(Heatsink)
Metal
Metal to metal
Metal
Metal to metal
Plastic to metal
Metal
Metal to metal
Plastic to metal
Metal
Metal to metal
Plastic to metal
Metal
Metal to Plastic
Metal
Metal to metal
Plastic to metal

TORQUE
(KG-CM)

HOLE SIZE
(MM)

Screw
Head

5.00.6

#4-40

Side mount: 30.6


Other: 40.6

M3*0.5

#2

None tread 810


Have tread: 68

2.680.03

#2

9.01.0

M4*0.7

#2

9.01.0

M4*0.7

#2

5.00.6

None tread 810


Have tread: 68 2.680.03
Aluminum: 4~5

#2

None tread 810


Have tread: 68 2.680.03
Aluminum: 4~5

#2

None tread810
Have tread: 68
Aluminum: 4~5

2.680.03

#2

3.30.3

2.60.03

#2

None tread 810


Have tread: 68
Aluminum: 4~5

2.680.03

#2

101.0

M4*0.7

#2

6~8

2.680.03

#2

9.01.0

M4*0.7

#2

5.01.0

2.350.05

#2

6~8

2.85~2.95

#2

8~10

M4*0.7P

#2

ITEM

P/N

DESCRIPTION

17
8F.1B524.3R0 SCRW MACH PAN W/SPG M3*3L NI
18
8F.5A524.4R0
19

SCRW MACH FLAT M3*4L NI(W2407


lift

8F.00573.5R0 SCRW TAP FPHM3*5 B-ZN

20
8F.5A456.7R0 SCRW MACH FLAT M4*7L B-ZN NYL
21
8F.XA326.150
SCRW TAP FLAT M4*15L B-ZN

MOUNTING
MATERIAL
Metal
Metal to metal
Plastic to metal
Metal
Metal to metal
Plastic to metal
Metal
Metal to Plastic
Metal
Metal to Metal
Plastic to Metal
Metal
Metal to metal
Plastic to metal

TORQUE
(KG-CM)

HOLE SIZE Screw


(MM)
Head

6~8

M3*0.5P

#2

6~8

M3*0.5P

#2

6~8

M3*0.5P

#1

8~10

M4*0.7P

#2

8~10

M4*0.7P

#2

4.50.5

2.350.05

4.00.5

2.00.05

#1

5.01.0

2.350.05

#2

4.50.5

2.350.05

#2

4.50.5

2.350.05

#2

4.00.5

2.680.03

#2

2.00.5

1.750.05

#1

2.00.5

1.750.05

#1

6~8

M3*0.5P

#2

8~10

3.450.05

#2

22
8F.00608.6R0

SCRW TAP PH F/10WSH M3*6L B-ZN

23
8F.XA313.8R0 SCRW TAP FLAT/PT M2.5*8L B-ZN
24
8F.WA314.8R0 SCRW TAP CAP M3*1.34P*8L B-ZN
25

8F.XA224.6R0 SCRW TAP FH M3*6L ZN

26
8F.XA314.8R0 SCRW TAP FLAT M3*1.34P*8L B-ZN
27
8F.00607.8R0

SCRW TAP FPH M3*8L(5/0.8) B-ZN

8F.5A322.2R4

SCRW MACH FLAT-P M2*2.4L B-ZN

28

29
8F.00551.3R0

SCRW M FPH M2*3L (6/1.4) NI

30
8F.MA324.5R5 SCRW TAP FPH M3*5.5L B-ZN
31
8F.XA326.100

SCRW TAP FLAT M4*10L B-ZN

- 65 -

PLASTIC
Plastic
Metal to plastic
Plastic to plastic
PCB to plastic
Plastic
Metal to plastic
Plastic to plastic
PLASTIC
Plastic
Metal to plastic
Plastic to plastic
Plastic
Metal to plastic
Plastic to plastic
PCB to plastic
Plastic
Metal to plastic
Plastic to plastic
PCB to plastic
Plastic
Metal to plastic
Plastic to plastic
PCB to plastic
Metal
Metal to metal
Plastic to metal
Plastic
Metal to plastic
Plastic to plastic

#2

Appendix 2-Physical Dimension Front View and Side view

Fig. 1 Physical Dimension Front View and Side view

- 66 -

Fig. 2 Appearance Description

- 67 -

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