Beruflich Dokumente
Kultur Dokumente
Description
Applications
Package Type
Cellular Phones
Portable Computers
USB Powered Devices
Handheld Medical Instruments
Organizers and PDAs
10-Lead DFN
SHDN2 1
VIN2 2
VOUT2 3
PG 4
AGND 5
10 PGND
9 LX
8 VIN1
7 SHDN1
6 VFB1/VOUT1
10-Lead MSOP
SHDN2 1
VIN2 2
VOUT2 3
PG 4
AGND 5
10 PGND
9 LX
8
VIN1
7 SHDN1
6 VFB1/VOUT1
DS21949A-page 1
TC1303B
Functional Block Diagram
UVLO
Undervoltage Lockout
(UVLO)
VREF
PDRV
VIN2
LX
SHDN1
Driver
Control
NDRV
PGND
PGND
PGND
AGND
VOUT1/VFB1
PG
TC1303B
PG Generator with Delay
VREF
UVLO
VOUT2
LDO
SHDN2
DS21949A-page 2
AGND
TC1303B
Typical Application Circuits
TC1303B
Fixed Output Application
10-Lead MSOP
4.7H
VIN
2.7V to 4.2V
4.7 F
VIN1
VIN2
LX
SHDN1
SHDN2
VOUT2
PG
4.7 F
PGND 10
VOUT1
AGND
VOUT1
1.5V @ 500 mA
6
3
5
VOUT2
1 F
2.5V @ 300 mA
Processor
RESET
TC1303B
Adjustable Output Application
10-Lead DFN
4.7 H
Input
Voltage
4.5V to 5.5V
*Optional
Capacitor
VIN2
4.7 F
1.0 F
VIN1
VIN2
SHDN1
SHDN2
VOUT2
PG
AGND
VOUT1
PGND 10
VOUT1 6
4
Processor
RESET
LX
4.7 F
VOUT2
3
5
Note
200 k
1 F
3.3V @
300 mA
4.99 k
2.1V @
500 mA
33 pF
121 k
DS21949A-page 3
TC1303B
1.0
ELECTRICAL
CHARACTERISTICS
DC CHARACTERISTICS
Electrical Characteristics: VIN1 =VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1F, L = 4.7 H, VOUT1 (ADJ) = 1.8V,
IOUT1 = 100 ma, IOUT2 = 0.1 mA TA = +25C. Boldface specifications apply over the TA range of -40C to +85C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input/Output Characteristics
Input Voltage
VIN
2.7
5.5
IOUT1_MAX
500
mA
IOUT2_MAX
300
mA
Note 1
IIN_SHDN
0.05
IQ
65.0
110
Synchronous Buck IQ
38
46
Shutdown Current
Combined VIN1 and VIN2 Current
TC1303B Operating IQ
VIL
15
%VIN
SHDN1,SHDN2,
Logic Input Voltage High
VIH
45
%VIN
SHDN1,SHDN2,
Input Leakage Current
IIN
-1.0
0.01
1.0
Thermal Shutdown
Thermal Shutdown Hysteresis
Undervoltage Lockout
(VOUT1 and VOUT2)
Undervoltage Lockout Hysteresis
Note 1:
2:
3:
4:
5:
6:
7:
8:
TSHD
165
TSHD-HYS
10
UVLO
2.4
2.55
2.7
UVLO-HYS
200
mV
VIN1 Falling
The Minimum VIN has to meet two conditions: VIN 2.7V and VIN VRX + VDROPOUT, VRX = VR1 or VR2.
VRX is the regulator output voltage setting.
TCVOUT2 = ((VOUT2max VOUT2min) * 106)/(VOUT2 * DT).
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current.
Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e. TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to limit the junction temperature for these cases.
VIN1 and VIN2 are supplied by the same input source.
DS21949A-page 4
TC1303B
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN1 =VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1F, L = 4.7 H, VOUT1 (ADJ) = 1.8V,
IOUT1 = 100 ma, IOUT2 = 0.1 mA TA = +25C. Boldface specifications apply over the TA range of -40C to +85C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VOUT1
0.8
4.5
VFB1
0.78
0.8
0.82
IVFB1
-1.5
nA
VOUT1
-2.5
0.3
+2.5
VLINE-REG
0.2
%/V
VLOAD-REG
0.2
VIN VOUT1
280
mV
FOSC
1.6
2.0
2.4
MHz
TSS
0.5
ms
TR = 10% to 90%
RDSon P-CHANNEL
RDSon-P
450
650
IP=100 mA
RDSon N-CHANNEL
RDSon-N
450
650
IN=100 mA
ILX
-1.0
0.01
1.0
+ILX(MAX)
700
mA
VOUT2
-2.5
0.3
+2.5
Note 2
VIN =VR+1V to 5.5V,
ILOAD = 100 mA
VIN = VR + 1.5V, ILOAD = 100 mA to
500 mA (Note 1)
IOUT1 = 500 mA, VOUT1 = 3.3V
(Note 5)
Note 2
Temperature Coefficient
TCVOUT
25
ppm/C
Line Regulation
VOUT2/
VIN
-0.2
0.02
+0.2
%/V
VOUT2/
IOUT2
-0.75
0.1
+0.75
VOUT2/
IOUT2
-0.90
0.1
+0.90
VIN VOUT2
137
205
300
500
mV
PSRR
62
dB
eN
1.8
V/(Hz)
IOUTsc2
240
mA
7:
8:
Note 3
(VR+1V) VIN 5.5V
The Minimum VIN has to meet two conditions: VIN 2.7V and VIN VRX + VDROPOUT, VRX = VR1 or VR2.
VRX is the regulator output voltage setting.
TCVOUT2 = ((VOUT2max VOUT2min) * 106)/(VOUT2 * DT).
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current.
Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e. TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to limit the junction temperature for these cases.
VIN1 and VIN2 are supplied by the same input source.
DS21949A-page 5
TC1303B
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN1 =VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1F, L = 4.7 H, VOUT1 (ADJ) = 1.8V,
IOUT1 = 100 ma, IOUT2 = 0.1 mA TA = +25C. Boldface specifications apply over the TA range of -40C to +85C.
Parameters
Sym
Min
Typ
Max
Units
tWK
31
100
IOUT1 = IOUT2 = 50 mA
tS
100
IOUT1 = IOUT2 = 50 mA
Voltage Range PG
VPG
1.0
1.2
5.5
5.5
TA = 0C to +70C
TA = -40C to +85C
VIN 2.7 ISINK = 100 A
PG Threshold High
(VOUT1 or VOUT2)
VTH_H
94
96
% of
VOUTX
PG Threshold Low
(VOUT1 or VOUT2)
VTH_L
89
92
% of
VOUTX
PG Threshold Hysteresis
(VOUT1 and VOUT2)
VTH_HYS
% of
VOUTX
PG Threshold Tempco
VTH/T
30
ppm/C
PG Delay
tRPD
165
tRPU
140
262
560
ms
PG_VOL
0.2
PG_VOH
0.9* VOUT2
Conditions
Power-Good
Note 1:
2:
3:
4:
5:
6:
7:
8:
The Minimum VIN has to meet two conditions: VIN 2.7V and VIN VRX + VDROPOUT, VRX = VR1 or VR2.
VRX is the regulator output voltage setting.
TCVOUT2 = ((VOUT2max VOUT2min) * 106)/(VOUT2 * DT).
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current.
Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e. TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to limit the junction temperature for these cases.
VIN1 and VIN2 are supplied by the same input source.
DS21949A-page 6
TC1303B
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN = +2.7V to +5.5V
Parameters
Sym
Min
Typ
Max
Units
Conditions
TJ
-40
+125
TA
-65
+150
TJ
+150
JA
41
JA
113
Temperature Ranges
Steady state
Transient
DS21949A-page 7
TC1303B
2.0
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
80
IOUT1 = IOUT2 = 0 mA
SHDN1 = VIN2
SHDN2 = VIN2
76
VIN = 5.5V
72
VIN = 4.2V
68
64
VIN = 3.6V
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1 F, L = 4.7 H,
VOUT1 (ADJ) = 1.8V, TA = +25C. Boldface specifications apply over the TA range of -40C to +85C. TA = +25C. Adjustable or fixed
output voltage options can be used to generate the Typical Performance Characteristics.
60
-40 -25 -10
100
95
90
85
80
75
70
65
60
55
50
20 35 50 65 80 95 110 125
IOUT1 = 250 mA
IOUT1 = 500 mA
2.7
3.05
3.4
IOUT1 = 0 mA
SHDN1 = VIN2
SHDN2 = AGND
VIN = 5.5V
50
45
40
VIN = 4.2V
VIN = 3.6V
35
90
85
VIN1 = 3.6V
80
VIN1 = 4.2V
75
VIN1 = 3.0V
0.104
0.203
VIN = 3.6V
40
35
SHDN1 = AGND
SHDN2 = VIN2
30
VOUT1 Efficiency(%)
IQ LDO (A)
VIN = 4.2V
0.401
0.5
FIGURE 2-5:
VOUT1 Output Efficiency vs.
IOUT1 (VOUT1 = 1.2V).
95
45
0.302
100
50
5.5
IOUT1 (A)
VIN = 5.5V
IOUT2 = 0 mA
5.15
SHDN1 = VIN2
SHDN2 = AGND
55
4.8
95
70
0.005
20 35 50 65 80 95 110 125
FIGURE 2-2:
IQ Switcher Current vs.
Ambient Temperature.
4.45
100
30
-40 -25 -10
4.1
FIGURE 2-4:
VOUT1 Output Efficiency vs.
Input Voltage (VOUT1 = 1.2V).
VOUT1 Efficiency(%)
IQ Switcher (A)
55
3.75
FIGURE 2-1:
IQ Switcher and LDO
Current vs. Ambient Temperature.
SHDN1 = VIN2
SHDN2 = AGND
IOUT1 = 100 mA
SHDN1 = VIN2
SHDN2 = AGND
IOUT1 = 100 mA
90
IOUT1 = 250 mA
85
80
IOUT1 = 500 mA
75
70
65
60
20 35 50 65 80 95 110 125
FIGURE 2-3:
Temperature.
DS21949A-page 8
2.7
3.05
3.4
3.75
4.1
4.45
4.8
5.15
5.5
FIGURE 2-6:
VOUT1 Output Efficiency vs.
Input Voltage (VOUT1 = 1.8V).
TC1303B
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1 F, L = 4.7 H,
VOUT1 (ADJ) = 1.8V, TA = +25C. Boldface specifications apply over the TA range of -40C to +85C. TA = +25C. Adjustable or fixed
output voltage options can be used to generate the Typical Performance Characteristics.
1.21
SHDN1 = VIN2
SHDN2 = AGND
VIN = 3.0V
95
90
VIN = 4.2V
85
80
0.104
0.203
0.302
0.401
VIN1 = 3.6V
1.202
1.198
1.194
VIN = 3.6V
75
0.005
SHDN1 = VIN2
SHDN2 = AGND
1.206
VOUT1 (V)
VOUT1 Efficiency(%)
100
1.19
0.005
0.5
0.104
IOUT1 (A)
FIGURE 2-10:
(VOUT1 = 1.2V).
IOUT1 = 100 mA
IOUT1 = 250 mA
88
IOUT1 = 500 mA
1.81
1.805
1.8
1.795
80
3.60
3.92
4.23
4.55
4.87
5.18
1.79
0.005
5.50
0.104
0.203
0.302
FIGURE 2-8:
VOUT1 Output Efficiency vs.
Input Voltage (VOUT1 = 3.3V).
FIGURE 2-11:
(VOUT1 = 1.8V).
3.4
VIN1 = 3.6V
SHDN1 = VIN2
SHDN2 = AGND
3.36
VIN1 = 4.2V
75
VOUT1 (V)
90
SHDN1 = VIN2
SHDN2 = AGND
80
0.5
95
85
0.401
IOUT1 (A)
0.5
SHDN1 = VIN2
SHDN2 = AGND
VIN1 = 3.6V
1.815
84
100
0.401
1.82
SHDN1 = VIN2
SHDN2 = AGND
VOUT1 (V)
100
92
0.302
IOUT1 (A)
FIGURE 2-7:
VOUT1 Output Efficiency vs.
IOUT1 (VOUT1 = 1.8V).
96
0.203
VIN1 = 5.5V
70
VIN1 = 4.2V
3.32
3.28
3.24
65
60
0.005
0.104
0.203
0.302
0.401
0.5
3.2
0.005
0.104
IOUT1 (A)
FIGURE 2-9:
VOUT1 Output Efficiency vs.
IOUT1 (VOUT1 = 3.3V).
0.203
0.302
0.401
0.5
IOUT1 (A)
FIGURE 2-12:
(VOUT1 = 3.3V).
DS21949A-page 9
TC1303B
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1 F, L = 4.7 H,
SHDN1 = VIN2
SHDN2 = AGND
2.10
2.05
2.00
1.95
1.90
4.7
5.1
0.35
P-Channel
0.3
5.5
3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
Input Voltage (V)
SHDN1 = VIN2
SHDN2 = AGND
1.96
1.94
1.92
125
110
95
80
65
50
35
20
-10
-25
-40
1.90
0.55
P-Channel
0.5
N-Channel
0.45
0.4
0.35
0.3
0.805
0.800
0.795
125
110
95
80
65
50
35
20
-10
-25
-40
0.790
FIGURE 2-15:
VOUT1 Adjustable Feedback
Voltage vs. Ambient Temperature.
DS21949A-page 10
SHDN1 = VIN2
SHDN2 = AGND
0.35
0.3
0.25
0.2
VOUT1 = 3.3V
IOUT1 = 500 mA
0.15
0.1
-25
VIN1 = 3.6V
0.4
-40
SHDN1 = VIN2
SHDN2 = AGND
0.810
20 35 50 65 80 95 110 125
FIGURE 2-17:
Buck Regulator Switch
Resistance vs. Ambient Temperature.
FIGURE 2-14:
VOUT1 Switching Frequency
vs. Ambient Temperature.
0.815
0.820
SHDN1 = VIN2
SHDN2 = AGND
VIN1 = 3.6V
0.6
125
1.98
0.65
2.00
FIGURE 2-16:
vs. Input Voltage.
VOUT1 Switch Resistance ()
-10
FIGURE 2-13:
vs. Input Voltage.
110
4.3
N-Channel
0.4
95
3.9
0.45
80
3.5
0.5
65
3.1
SHDN1 = VIN2
SHDN2 = AGND
TA = 25 C
50
2.7
0.55
35
2.15
0.6
20
2.20
VOUT1 (ADJ) = 1.8V, TA = +25C. Boldface specifications apply over the TA range of -40C to +85C. TA = +25C. Adjustable or fixed
output voltage options can be used to generate the Typical Performance Characteristics.
FIGURE 2-18:
VOUT1 Dropout Voltage vs.
Ambient Temperature.
TC1303B
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1 F, L = 4.7 H,
VOUT1 (ADJ) = 1.8V, TA = +25C. Boldface specifications apply over the TA range of -40C to +85C. TA = +25C. Adjustable or fixed
output voltage options can be used to generate the Typical Performance Characteristics.
1.802
IOUT2 = 150 mA
1.800
SHDN1 = AGND
SHDN2 = VIN2
TA = + 85C
1.798
TA = + 25C
1.796
TA = - 40C
1.794
1.792
FIGURE 2-19:
VOUT1 and VOUT2 Heavy
Load Switching Waveforms vs. Time.
FIGURE 2-22:
VOUT2 Output Voltage vs.
Input Voltage (VOUT2 = 1.8V).
2.508
SHDN1 = AGND
SHDN2 = VIN2
IOUT2 = 150 mA
2.506
TA = + 85C
2.504
2.502
TA = + 25C
2.500
2.498
TA = - 40C
2.496
3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
Input Voltage (V)
FIGURE 2-20:
VOUT1 and VOUT2 Light
Load Switching Waveforms vs. Time.
IOUT2 = 150 mA
3.298
TA = + 85C
1.49
1.488
TA = + 25C
SHDN1 = AGND
SHDN2 = VIN2
1.486
TA = - 40C
1.484
1.482
2.7
3.05
3.4
3.75
4.1
4.45
4.8
5.15
5.5
FIGURE 2-21:
VOUT2 Output Voltage vs.
Input Voltage (VOUT2 = 1.5V).
1.492
VOUT2 Output Voltage(V)
FIGURE 2-23:
VOUT2 Output Voltage vs.
Input Voltage (VOUT2 = 2.5V).
SHDN1 = AGND
SHDN2 = VIN2
IOUT2 = 150 mA
3.297
TA = + 85C
3.296
3.295
TA = + 25C
3.294
TA = - 40C
3.293
3.292
3.60
3.92
4.23
4.55
4.87
5.18
5.50
FIGURE 2-24:
VOUT2 Output Voltage vs.
Input Voltage (VOUT2 = 3.3V).
DS21949A-page 11
TC1303B
SHDN1 = AGND
SHDN2 = VIN2
0.25
IOUT2 = 300 mA
0.20
IOUT2 = 200 mA
0.15
0.10
0.05
0.1
VIN2 = 3.6V
-0.1
-0.2
VOUT2 = 2.6V
VOUT2 = 1.5V
-0.3
0.3
SHDN1 = AGND
SHDN2 = VIN2
0.2
IOUT2 = 300 mA
0.1
IOUT2 = 200 mA
125
110
95
80
65
50
35
20
FIGURE 2-28:
VOUT2 Load Regulation vs.
Ambient Temperature.
FIGURE 2-25:
VOUT2 Dropout Voltage vs.
Ambient Temperature (VOUT2 = 2.5V).
-10
-25
125
110
95
80
65
50
35
20
-10
-25
-40
-0.4
350
VIN = 3.6V
325
SHDN1 = VIN2
SHDN2 = VIN2
300
275
250
225
200
0.0
-40 -25 -10
20 35 50 65 80 95 110 125
0.005
0.000
VOUT2 = 3.3V
SHDN1 = AGND
SHDN2 = VIN2
-0.005
IOUT2 = 100 A
-0.010
VOUT2 = 2.5V
-0.015
-0.020
-0.025
VOUT2 = 1.5V
-0.030
20 35 50 65 80 95 110 125
FIGURE 2-29:
PG Active Delay Time-out
vs. Ambient Temperature.
PG Threshold (% of V OUT2)
FIGURE 2-26:
VOUT2 Dropout Voltage vs.
Ambient Temperature (VOUT2 = 3.3V).
SHDN1 = AGND
SHDN2 = VIN2
VOUT2 = 3.3V
0.0
-40
0.30
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1 F, L = 4.7 H,
VOUT1 (ADJ) = 1.8V, TA = +25C. Boldface specifications apply over the TA range of -40C to +85C. TA = +25C. Adjustable or fixed
output voltage options can be used to generate the Typical Performance Characteristics.
96
SHDN1 = VIN2
SHDN2 = VIN2
VIN = 3.6V
95
PG Threshold Hi
94
93
92
PG Threshold Low
91
90
-0.035
-40 -25 -10
20 35 50 65 80 95 110 125
FIGURE 2-27:
VOUT2 Line Regulation vs.
Ambient Temperature.
DS21949A-page 12
20 35 50 65 80 95 110 125
FIGURE 2-30:
PG Threshold Voltage vs.
Ambient Temperature.
TC1303B
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1 F, L = 4.7 H,
VOUT1 (ADJ) = 1.8V, TA = +25C. Boldface specifications apply over the TA range of -40C to +85C. TA = +25C. Adjustable or fixed
output voltage options can be used to generate the Typical Performance Characteristics.
10
0.02
PG VOL (V)
0.018
0.016
SHDN1 = VIN2
SHDN2 = VIN2
VIN = 3.6V
IOL = 1.2 mA
0.014
0.012
125
95
110
80
65
50
35
20
-10
-25
-40
0.01
SHDN1 = AGND
SHDN2 = VIN2
0.1
VIN = 3.6V
VOUT2 = 2.5V
IOUT2 = 50 mA
0.01
0.01
0.1
10
100
1000
10000
Frequency (kHz)
FIGURE 2-31:
PG Output Voltage Level
Low vs. Ambient Temperature.
FIGURE 2-34:
FIGURE 2-35:
vs. Time.
FIGURE 2-36:
vs. Time.
VOUT2 = 2.8V
3.0
2.5
PG VOH (V)
VOUT2 = 2.5V
2.0
1.5
VOUT2 = 1.5V
1.0
0.5
VIN = 3.6V
IOH = 500 A
SHDN1 = VIN2
SHDN2 = VIN2
0.0
-40 -25 -10
20 35 50 65 80 95 110 125
FIGURE 2-32:
PG Output Voltage Level
High vs. Ambient Temperature.
0
VOUT2 PSRR (dB)
-10
-20
-30
SHDN1 = GND
VOUT2 = 1.5V
IOUT2 = 30 mA
CIN = 0 F
COUT2 = 1.0 F
-40
-50
COUT2 = 4.7 F
-60
-70
-80
0.01
0.1
10
100
1000
Frequency (kHz)
FIGURE 2-33:
VOUT2 Power Supply Ripple
Rejection vs. Frequency.
DS21949A-page 13
TC1303B
Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 F, COUT2 = 1 F, L = 4.7 H,
VOUT1 (ADJ) = 1.8V, TA = +25C. Boldface specifications apply over the TA range of -40C to +85C. TA = +25C. Adjustable or fixed
output voltage options can be used to generate the Typical Performance Characteristics.
FIGURE 2-37:
VOUT1 and VOUT2 Line Step
Response vs. Time.
FIGURE 2-38:
Waveforms.
DS21949A-page 14
FIGURE 2-39:
Waveforms.
FIGURE 2-40:
TC1303B
3.0
PIN DESCRIPTIONS
TABLE 3-1:
Pin No.
Name
SHDN2
VIN2
VOUT2
PG
AGND
3.1
Function
Active Low Shutdown Input for LDO Output Pin
Analog Input Supply Voltage Pin
VFB / VOUT1 Buck Feedback Voltage (Adjustable Version) / Buck Output Voltage (Fixed Version) Pin
SHDN1
VIN1
LX
10
PGND
EP
Exposed
Pad
SHDN2 is a logic level input used to turn the LDO Regulator on and off. A logic high (> 45% of VIN), will enable
the regulator output. A logic low (< 15% of VIN) will
ensure that the output is turned off.
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
DS21949A-page 15
TC1303B
4.0
DETAILED DESCRIPTION
4.1
Device Overview
4.2
The synchronous buck regulator is capable of supplying a 500 mA continuous output current over a wide
range of input and output voltages. The output voltage
range is from 0.8V (min) to 4.5V (max). The regulator
operates in three different modes and automatically
selects the most efficient mode of operation. During
heavy load conditions, the TC1303B buck converter
operates at a high, fixed frequency (2.0 MHz) using
current mode control. This minimizes output ripple and
noise (less than 8 mV peak-to-peak ripple) while maintaining high efficiency (typically > 90%). For standby or
light load applications, the buck regulator will automatically switch to a power-saving Pulse Frequency
Modulation (PFM) mode. This minimizes the quiescent
current draw on the battery, while keeping the buck
output voltage in regulation. The typical buck PFM
mode current is 38 A. The buck regulator is capable of
operating at 100% duty cycle, minimizing the voltage
drop from input to output for wide input batterypowered applications. For fixed-output voltage applications, the feedback divider and control loop compensation components are integrated, eliminating the need
for external components. The buck regulator output is
protected against overcurrent, short circuit and overtemperature. While shut down, the synchronous buck
N-channel and P-channel switches are off, so the LX
pin is in a high-impedance state (this allows for
connecting a source on the output of the buck regulator
as long as its voltage does not exceed the input
voltage).
DS21949A-page 16
4.2.1
4.2.2
PFM MODE
4.3
The LDO output is a 300 mA low-dropout linear regulator that provides a regulated output voltage with a
single 1 F external capacitor. The output voltage is
available in fixed options only, ranging from 1.5V to
3.3V. The LDO is stable using ceramic output capacitors that inherently provide lower output noise and
reduce the size and cost of the regulator solution. The
quiescent current consumed by the LDO output is
typically less than 20 A, with a typical dropout voltage
of 137 mV at 200 mA. The LDO output is protected
against overcurrent and overtemperature.
TC1303B
4.4
Power-Good
4.5
Soft Start
4.6
Overtemperature Protection
VTH_H
VOUT2
tRPU
VOH
PG
FIGURE 4-1:
tRPD
VOL
Power-Good Timing.
DS21949A-page 17
TC1303B
5.0
APPLICATION
CIRCUITS/ISSUES
5.1
Typical Applications
5.2
5.3
EQUATION 5-1:
V FB
R BOT = R TOP --------------------------------
VOUT1 V FB
5.4
TABLE 5-1:
TC1303B RECOMMENDED
CAPACITOR VALUES
C(VIN1)
C(VIN2)
COUT1
COUT2
min
4.7 F
none
4.7 F
1 F
max
none
none
22 F
10 F
Example:
RTOP = 200 k
VOUT1 = 2.1V
VFB
= 0.8V
DS21949A-page 18
TC1303B
5.5
Inductor Selection
For most applications, a 4.7 H inductor is recommended to minimize noise. There are many different
magnetic core materials and package options to select
from. That decision is based on size, cost and acceptable radiated energy levels. Toroid and shielded ferrite
pot cores will have low radiated energy but tend to be
larger and higher is cost. With a typical 2.0 MHz switching frequency, the inductor ripple current can be
calculated based on the following formulas.
TABLE 5-2:
Part
Number
TC1303B RECOMMENDED
INDUCTOR VALUES
Value
(H)
DCR
MAX
IDC (A)
(MAX)
Size
WxLxH (mm)
Coiltronics
SD10
2.2
0.091
1.35
SD10
3.3
0.108
1.24
SD10
4.7
0.154
1.04
2.2
0.075
1.80
SD12
3.3
0.104
1.42
SD12
4.7
0.118
1.29
Coiltronics
EQUATION 5-2:
SD12
V OUT
DutyCycle = ------------V IN
Sumida Corporation
Duty cycle represents the percentage of switch-on
time.
CMD411
2.2
0.116
CMD411
3.3
0.174
EQUATION 5-3:
CMD411
4.7
0.216
1008PS
4.7
0.35
1.0
3.8,3.8,2.74 max.
1812PS
4.7
0.11
1.15
1
T ON = DutyCycle ---------F SW
Where:
FSW = Switching Frequency.
The inductor ac ripple current can be calculated using
the following relationship:
EQUATION 5-4:
I L
V L = L -------t
Where:
VL = voltage across the inductor (VIN VOUT)
t = on-time of P-channel MOSFET
Solving for IL = yields:
EQUATION 5-5:
VL
I L = ------ t
L
When considering inductor ratings, the maximum DC
current rating of the inductor should be at least equal to
the maximum buck regulator load current (IOUT1), plus
one half of the peak-to-peak inductor ripple current
(1/2 * IL). The inductor DC resistance can add to the
buck converter I2R losses. A rating of less than 200 m
is recommended. Overall efficiency will be improved by
using lower DC resistance inductors.
Coilcraft
5.6
5.6.1
Thermal Calculations
BUCK REGULATOR OUTPUT
(VOUT1)
EQUATION 5-6:
OUT1 I OUT1
V
------------------------------------ Efficiency ( V OUT1 IOUT1 ) = PDissipation
DS21949A-page 19
TC1303B
As an example, for a 3.6V input, 1.8V output with a load
of 400 mA, the efficiency taken from Figure 2-7 is
approximately 84%. The internal power dissipation is
approximately 171 mW.
5.6.2
EQUATION 5-7:
AGND to PGND
PLDO
Input Voltage
VIN = 5V10%
LDO Output Voltage and Current
VOUT = 3.3V
PGND
CIN2
10
+VIN2
+VOUT2
COUT2
DS21949A-page 20
TC1303B 6
PGND Plane
FIGURE 5-1:
Component Placement,
Fixed 10-Pin MSOP.
There will be some difference in layout for the 10-pin
DFN package due to the thermal pad. A typical fixedoutput DFN layout is shown below. For the DFN layout,
the VIN1 to VIN2 connection is routed on the bottom of
the board around the TC1303B thermal pad.
- Via
+VOUT1
AGND to PGND
* CIN2 Optional
COUT1
AGND
L1
PGND
CIN2
COUT2
2
3
4
5
+VIN2
+VIN1
AGND Plane
PLDO = 684.8 mW
5.7
CIN1
AGND
IOUT = 300 mA
Internal Power Dissipation
COUT1
L1
AGND
5.6.3
+VOUT1
* CIN2 Optional
Where:
+VOUT2
AGND
10
9
8
7
6
PGND
CIN1
+VIN1
TC1303B
PGND Plane
AGND Plane
FIGURE 5-2:
Component Placement,
Fixed 10-Pin DFN.
TC1303B
5.8
Design Example
VOUT1 = 2.0V @ 500 mA
VOUT2 = 3.3V @ 300 mA
VIN = 5V10%
L = 4.7H
DS21949A-page 21
TC1303B
6.0
PACKAGING INFORMATION
6.1
10-Lead MSOP*
Example:
XXXXXX
YWWNNN
11H0/E
520256
1 = TC1303B
1 = 1.375V VOUT1
H = 2.6V VOUT2
0 = Default
VOUT1
Code
3.3V
Example:
XXXX
YYWW
NNN
11H0
0520
256
10-Lead DFN
VOUT2
Code
VOUT1
Code
VOUT2
3.3V
2.4V
1.5V
3.2V
2.3V
3.1V
2.2V
3.0V
2.1V
2.9V
2.0V
VOUT1
Code
2.4V
1.5V
3.2V
2.3V
1.4V
3.1V
2.2V
1.3V
3.0V
2.1V
1.2V
2.9V
2.0V
1.1V
2.8V
1.9V
1.0V
2.7V
1.8V
0.9V
Code
2.6V
1.7V
Adj
Default
+50 mV to V2
2.5V
1.6V
1.375V
+50 mV to V1
+50 mV to V1
and V2
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS21949A-page 22
VOUT1
Code
2.8V
1.9V
2.7V
1.8V
2.6V
1.7V
2.5V
1.6V
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week 01)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
TC1303B
10-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) Saw Singulated
p
b
n
L
PIN 1
ID INDEX
AREA
(NOTE 2)
D2
EXPOSED
METAL
PAD
E2
TOP VIEW
BOTTOM VIEW
A3
EXPOSED
TIE BAR
(NOTE 1)
A1
Number of Pins
Pitch
Overall Height
Standoff
Lead Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Lead Width
Lead Length
Units
Dimension Limits
n
e
(Note 3)
(Note 3)
A
A1
A3
E
E2
D
D2
b
L
MIN
.031
.000
.112
.055
.112
.047
.008
.012
INCHES
NOM
10
.020 BSC
.035
.001
.008 REF.
.118
-.118
-.010
.016
MAX
.039
.002
.124
.096
.124
.069
.015
.020
MILLIMETERS*
NOM
10
0.50 BSC
0.80
0.90
0.00
0.02
0.20 REF.
2.85
3.00
1.39
-2.85
3.00
1.20
-0.18
0.25
0.30
0.40
MIN
MAX
1.00
0.05
3.15
2.45
3.15
1.75
0.30
0.50
*Controlling Parameter
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Exposed pad dimensions vary with paddle size.
4. JEDEC equivalent: Not registered
Drawing No. C04-063
Revised 05/24/04
DS21949A-page 23
TC1303B
10-Lead Plastic Micro Small Outline Package (UN) (MSOP*)
E
E1
p
D
2
B
n
A2
A1
L
(F)
L1
Units
Dimension Limits
n
p
MIN
INCHES
NOM
10
.020 TYP
.033
.193 BSC
.118 BSC
.118 BSC
.024
.037 REF
.009
-
MAX
MILLIMETERS*
NOM
10
0.50 TYP.
0.85
0.75
0.00
4.90 BSC
3.00 BSC
3.00 BSC
0.60
0.40
0.95 REF
0
0.08
0.15
0.23
5
5
MIN
MAX
Number of Pins
Pitch
.043
Overall Height
A
.037
Molded Package Thickness
A2
.030
Standoff
.006
A1
.000
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
.031
L
.016
Footprint
F
Foot Angle
0
8
c
Lead Thickness
.009
.003
Lead Width
.012
B
.006
1.10
0.95
0.15
0.80
8
0.23
0.30
15
15
* The MSOP package for the TC1303B has not been qualified at the time of this publication.
Contact your Microchip sales office for availability.
DS21949A-page 24
TC1303B
APPENDIX A:
REVISION HISTORY
DS21949A-page 25
TC1303B
NOTES:
DS21949A-page 26
TC1303B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
TC1303
X-
XX
XX
Package
Tube
or
Tape &
Reel
Device:
Options
Code
VOUT1
Code
VOUT2
Code
+50 mV
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
1
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
1.8V
1.7V
1.6V
1.5V
1.4V
1.3V
1.2V
1.1V
1.0V
0.9V
Adjustable
1.375V
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
1
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
1.8V
1.7V
1.6V
1.5V
0
1
2
3
Default
+50 mV to V1
+50 mV to V2
+50 mV to V1
and V2
Examples:
a)
TC1303B-IA0EMF:
b)
TC1303B-ZA0EUN:
c)
TC1303B-PG0EMFTR:
Temperature
Range:
= -40C to +85C
Package:
MF
UN
Tube or
Tape and Reel:
Blank
TR
= Tube
= Tape and Reel
DS21949A-page 27
TC1303B
NOTES:
DS21949A-page 28
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Incorporated in the
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
DS21949A-page 29
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DS21949A-page 30