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FORME expertise
Chemistry
Deposition
Devices
Chemistry
Precursor design
Modelling
Synthesis
Analysis
Tyndall /
UCC
TCD / UCC
Physical characterisation
TCD / UCC
Deposition
Modelling
Growth
Process mechanism
illumination
Process development and
optimisation
Tyndall
Tyndall /
DCU / UCC
Tyndall /
UCD
Devices
Test structure development
Tyndall /
UCD
Fabrication
Tyndall /
DCU / UCD
Evaluation
Design
Tyndall /
UCD
Tyndall
Tyndall
UCC / TCD
UCC / TCD
Tyndall
Tyndall
Tyndall / UCD
Tyndall
Tyndall
Relevant Industry Partners Intel, Applied Materials, SAFC Hitech, Glebe Scientific
Test device
UCC
UCC
Tyndall
UCC / Tyndall
UCC / Tyndall
BCP patterning
Transfer to silicon
Nanostructured DSSC
Interface design theorisation
Substrate texturing with nanoarrays
Blocking layer atomic layer deposition
Thin film characterisation
DSSC fabrication
Electrical characterisation
UCD
DCU
Tyndall
Tyndall / UCD
UCD
UCD
Nanostructured DSSC
Multiferroics
Aurivillius material design and modelling
Multiferroic thin film deposition (AVD/CSD)
Thin film characterisation
Substrate patterning with BCP
Test structure fabrication
Electrical and magnetic characterisation
Tyndall / TCD
Tyndall
Tyndall
UCC
Tyndall
Tyndall
Multiferroics
Piezoresponse (phase)
Aurivillius phase structure
PZT nanostructure
AVD chamber