Semiconductor Products

Application Bulletin
BUMPING BGA PACKAGES
SOLDER SPHERE / PASTE REFLOW
Reflow profiles used for solder sphere attachment are important to the solder bump joint integrity. Ideally,
a "hot plate style" reflow profile is the optimum where the profile consists of a straight ramp up to peak
temperature and then back down to room temperature. This is rarely an option, but with the uniform load
density entering a furnace in BGA bumping (figure 1), reflow profiles can be relatively simpler and quicker
than those used to assemble the package to a printed circuit board (figure 2). Examples of varying
profiles are noted below:

250

250

200

200

150

150

100

100

50

50

Figure 1

Figure 2

PLASTIC BALL GRID ARRAY (PBGA) REFLOW

Probably the largest concern in reflowing a PBGA is warpage of the substrate due to excessive heating or
too fast a heating or cooling rate. The following is recommended:

initial ramp of 60 to 120C per minute from room temperature to dwell temperature
dwell or package preheat temperature of 110 to 160C* for 1 minute or less**
90 to 120C per minute ramp to the peak reflow temperature of 210 to 225C for eutectic solders
(63Sn/37Pb or 62Sn/36Pb/2Ag)
time over liquidus (approximately 183C or 179C, respectively) of 30 to 45 seconds
cooling or quench rate of 90 to 120C per minute to room temperature

NOTE: *The actual dwell temperature is dependent on the flux type used and manufacturer's
recommendations as well as the mass of the parts to be processed.
**The dwell period may not be necessary depending upon substrate type, parts mass and
component fixturing. Experimentation is recommended for optimization; since heat exchange
efficiency of furnaces varies.
CERAMIC BALL GRID ARRAY (CBGA) REFLOW
In reflowing CBGA joints, a solder paste is the usual method to attach a higher melting temperature
solder sphere. In these cases, a key item in the process is the component mass and relatively slow
heating and cooling rate. The profile recommended is the same as for PBGAs; though the actual time
over liquidus may be difficult to control and exceed the 45 second guideline:

Semiconductor Products
Application Bulletin
CERAMIC BALL GRID ARRAY [CBGA] REFLOW cont

initial ramp of 60 to 120C per minute to dwell temperature

dwell or package preheat temperature of 110 to 160C* for 1 to 2 minutes
90 to 120C per minute ramp to the peak reflow temperature of 210 to 225C for eutectic solders
(63Sn/37Pb or 62Sn/36Pb/2Ag)
time over liquidus (approximately 183C or 179C, respectively) of 30 to 45 seconds**
cooling or quench rate of 90 to 120C per minute to room temperature

NOTE: *The actual dwell temperature is dependent on the flux type used and manufacturer's
recommendations as well as the mass of the parts to be processed.
**The time spent above liquidus could reach upwards to 200 seconds depending upon the mass
of the parts. (Historically, intermetallic components in a solder joint have been perceived as the weak
portion of the microstructure. Long times over liquidus and high peak temperatures create thicker
intermetallic component generation at the solder to pad interface. When the pads are nickel plated
versus bare copper, intermetallic growth is comparatively reduced.)
THERMOCOUPLES
As with any reflow process; the actual process should be designed with test loads and multiple
thermocouples on leading edges and the centers of components to determine the temperature variations
that actually occur in the components. It is not sufficient to operate solely by furnace set points. Regular
profiling as a process monitor helps prevent reflow defects.
FLUX VOIDS IN PBGA REFLOW TO PRINTED CIRCUIT BOARDS (PCB)
After the package has been assembled, the PBGA is picked and placed into printed solder paste on a
PCB. Flux voids (figure 3) have received much attention but do not appear to be a major concern. The
phenomenon was investigated in part by Motorola, Inc., and results were published in the proceedings of
Surface Mount International 1996, "The Effects of Solder Joint Voiding on Plastic Ball Grid Array
Reliability" by Donald R. Banks, et al. The results indicated void sizes of less than 0.002" (0.051mm) do
not seem to adversely affect the joint in long term reliability.
It has proven somewhat successful to examine and adjust the reflow profile should flux voids occur.
250
BGA Package

Flux voids

Solder Connection

Degrees C

200

150

100

Printed Circuit Board

50

Flux Voids at Sphere/Package Interface

0

3
Minutes

By decreasing the ramp up rate or increasing the preheat period (dwell time) of the reflow profile, one can
drive off more flux solvents before solder alloy melting. Once the solder alloy is molten and flux vapor is
still being driven off; there is only one way for the bubble to go. It will rise through the molten solder and
stop at the package "ceiling".
Figure 4 is an example of a common profile which has been extended to allow for more time at the
dwell/preheat portion of the cycle in which to "dry" out the solder paste.

The information contained herein is based upon data considered accurate and is offered at no charge. No warranty is expressed or
implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this
information or the use of any materials designated.
Rev. 3/00 DML

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