Sheet metalworking

1) Sheet metalworking includes both forming and cutting operations true

2) Most sheet metalworking operations are performed as which of the following cold
working
3) Typical sheet-metal thicknesses are between 0.4 mm and 6 mm. When thickness
exceeds the upper limit of this range, the stock is usually referred to as plate
4) Most sheet metalworking operations are performed on machine tools called stamping
presses, and the associated tooling is called a punch and die true
5) In a sheet metal cutting used to produce a flat part with a hole in the center, the part
itself is called a blank, and the scrap piece that was cut out to make the hole is a
called a slug true
6) As sheet metal stock hardness increases in a blanking operation, the clearance
between punch and die should be remain the same
7) A circular sheet-metal slug produced in a hole punching operation will have the same
diameter as the die opening
8) The cutting force in a sheet metal blanking operation depends on which mechanical
property of the metal shear strength
9) Which of the following descriptions applies to a V-bending operation as compared to
an edge bending operation: all of the above
10) Sheet metal bending involves which of the following stresses and strains - all of the
above
11) Which one of the following is the best definition of bend allowance length before
bending on the straight sheet metal section to be bent
12) Springback in a sheet metal bending operation is the result of elastic recovery of
the metal
13) Which of the following is a variation of sheet metal bending operations hemming
14) The following are measures of feasibility for several proposed cup drawing
operations. Which of the operations are likely to be feasible - all of the above
15)
The holding force in drawing is most likely to be less than the maximum
drawing force
16) Which one of the following processes uses a thick rubber pad to form sheet metal
over a positive form block: Guerin process
17) Which one of the following stamping dies is the most complicated progressive die
18) In a blanket die, the device that clears the sheet metal from the punch after blanking
is called which one of the following stripper
19) Which one of the following press types is usually associated with the highest
production rates in sheet-metal-stamping operations open-back inclinable
20) Which of the following processes is classified as a high energy-rate forming processes
explosive forming
Processing of integrated circuits
1) Silicon is the most widely used semiconductor material for integrated circuits. Which
of the following are less common semiconductor materials used for ICs all of the
above
2) How many electronic devices would be contained in an IC Chip in order for it to be
classified in the VLSI category 10000 and 1 million (?)
3) An alternative name for chip in semiconductor processing is which one of the
following die
4) Which one of the following is the source of silicon for semiconductor processing
SiO2
5) Silicon that has been grown from a melt into a large single-crystal ingot by the
Czochralski process is called one of the following boule

6) The air in a clean room is passed through a HEPA filter. HEPA stands for Highefficiency particulate air
7) Which one of the following is the most common form of radiation used in
photolithography ultraviolet light
8) After exposure to a light, a positive resist becomes more soluble to the chemical
developing fluid
9) A silicon dioxide film formed on the surface of a silicon wafer by thermal oxidation
has a thickness that greater than is the layer of substrate silicon used to form it
10) Which one of the following is not one of the functions of silicon dioxide in
semiconductor processing Serves as a conducting path between levels in
multilevel metallization systems(?)
11) Epitaxial deposition refers to a process of growing a film a substrate so that the film
has a crystalline structure that is an extension of the substrares structure True
12) Vapor phase epitaxy is based on which one of the following chemical vapor
deposition
13) Which one of the following processes are used to add layers of various materials in IC
fabrication all of the above
14)
Which of the following are doping processes in IC fabrication thermal
oxidation
15) Which one of the following is the most common metal for metallization in a silicon
integrated circuit aluminum
16) Which etching process produces the more anisotropic etch in IC fabrication plasma
etching
17) Which of the following are the 2 principal materials used in IC packaging aluminum
oxide and epoxies
18) According to Rents rule of number of input/output terminals in an integrated circuit is
less than the number of devices in the IC
19) Which one of the following technologies in IC packaging provides the greater packing
densities in circuit board assembly surface mount technology
20) Which one of the following IC packaging styles provides the opportunity for the
largest number of terminals in the package pin grid array
21) Multiple testing is a computer-controlled testing method that is performed on the
integrated circuits immediately after they have been separated from the wafer
false
22) Which of the following metals are commonly used for wire bonding of chip pads to
the lead frame gold and silicon (?)
23) Which one of the following major phases in IC processing is the most important in
determining the overall yield of ICs wafer processing of the individual ICs on
the wafer
Quality control and inspection
1) Process capability is the limits of the random variation of the process when it is in
statistical control. The limits are defined as the process mean +-2 standart deviations
false (?)
2) The natural tolerance limits are when the tolerance on a part is set equal to the
process capability; that is +-3 of the process mean true (?)
3) In control charts for variables, measurements of the characteristic of interest are
made. In control charts for attributes, the characteristic of interest is identified as
being acceptable or not acceptable true
4) Which of the following quality aspects would be classified as examples of freedom
from deficiencies rather that product features components within tolerance and
no missing parts

5) When a design tolerance is set equal to the natural tolerance limits for the process
making the part, it means that the tolerance is equal to the process capability for the
process true (?)
6) If the product tolerance index is 1.0, then the percentage of parts that are within
tolerance will be closest to which one of the following - 100%
7) In a x-bar control chart, the upper control limit is set equal to which one of the
following process mean plus three standard deviations
8) The R chart is used for which one of the following product or part characteristics
range of sample values
9) Which one of the following best describes the situations for which the c chart is most
suited number of defects
10) Which of the following identify a likely out of control condition in a control chart all
of the above (?)
11) Which of the following are the main goals in a total quality management program
all of the above
12) Which of the following measures in a Six Sigma program allows products of different
complexity to be directly compared defects per million units
13) Which of the following principles and/or approaches is generally credited to G.
Taguchi loss function and robust design
14) Which of the following phrases relating to ISO 9000 are correct all of the above
15) The 2 basic types of inspection by variables and inspection by attributes. The second
of these inspections uses which of the following gaging
16) Automated 100% inspection can be integrated with the manufacturing process to
accomplish which of the following all of the above
17)
Which one of the following is an example of contact inspection coordinate
measuring systems
18) Which of the following is the most important application of vision systems inspection