Evaluation Report – White Paper

Dalius Baranauskas
Denis Zelenin

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Pacific MicroCHIP Corp. 2008
OUTLINE

1. Test Objective. DUT Description

2. On-wafer Probing Setup For Static Frequency Divider
3. On-wafer Probing Equipment
4. Measurement Equipment Readings. DUT Input And Output
5. Measured Divider Input Power Level vs. Input Refered Working Frequency
6. Measured Divider Output Power Level vs. Input Refered Working Frequency
7. Measured Self-Oscillation Frequency over Power Supply Voltage
8. Measured Current Consumption over Power Supply Voltage
9. Measured Output Power over Power Supply Voltage in Self-Oscillation Mode
10.Conclusion

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Pacific MicroCHIP Corp. 2008
Test Objective. DUT Description

Objective: test and characterize 60GHz Frequency

divider By2. Device under test (DUT) was fabricated
on MPW runs at Jazz Semiconductor. DUT is a
3x1.3mm die on a 5x5mm MPW tile (Figure 1).

Figure 1. MPW tile and 60GHz divider location on the tile.

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Pacific MicroCHIP Corp. 2008
On-wafer Probing Setup For Static Frequency Divider

50

Spectrum
Analyser

G S G
Up to 40GHz
10 DUT Tiles from 2 MPW runs
mm are glued on a blank wafer.
mm

50 - 75GHz 1 2 3 4 5
Signal
Generator
G
Pitch 123um

S MPW A0816
Pitch 123um
G
G Pitch 123um

S +
Pad Opening
1 2 3 4 5
+3.3V
Dimensions
Power
m MPW A0686
m OPTIONAL
G S G Up to 40GHz
50
m

Spectrum
Analyser

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Pacific MicroCHIP Corp. 2008
On-wafer Probing Equipment

Equipment used:

1. Cascade Corp RF probe station and supporting equipment.

2. Agilent 83557A Source Module
3. Agilent 8565EC 50 GHz spectrum analyzer
4. HP 83650B Synthesizer

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Pacific MicroCHIP Corp. 2008
Measurement Equipment Readings.
DUT Input And Output

70GHz Input signal.

NOTE: in order to calculated power level seen by

the IC, subtract 8dB from the source reading.

Divided Output signal.

NOTE: in order to calculated power level at the

IC output, add 5dB from the spectrum analyzer
reading.

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Pacific MicroCHIP Corp. 2008
Measured Divider Input Power Level vs. Input
Refered Working Frequency
Divider input power level vs. Input refered working frequency
5
DUT #1 MPW A0806

0
50 55 60 65 70
Input Power, dBm

-5

-10

-15

-20
Input Reffered working frequency, GHz

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Pacific MicroCHIP Corp. 2008
Measured Divider Output Power Level vs. Input
Refered Working Frequency

Output Power, dBm

2
Output Pow er, dBm

0
50 52 54 56 58 60 62 64 66 68 70
-1
Power, dBm

-2

-3

-4

-5

-6
Frequency, GHz

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Pacific MicroCHIP Corp. 2008
Measured Self-Oscillation Frequency
over Power Supply Voltage
Self Oscillation frequency
73
Self Oscillation frequency
72

71

70
Frequency, GHz

69

68

67

66

65

64
2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4
Power Supply Voltage, V

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Pacific MicroCHIP Corp. 2008
Measured Current Consumption
over Power Supply Voltage
IC current consumption over power supply voltage
350
IC Current Consumption

300
Chip Current Consumption, mA

250

200

150

100

50

0
2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4
Power supply voltage, V

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Pacific MicroCHIP Corp. 2008
Measured Output Power over Power Supply Voltage
in Self-Oscillation Mode

Output power at Self-Oscillation Frequency vs Power Supply Volatage

0
Output power
-2

-4

-6
Output power, dBm

-8

-10

-12

-14

-16

-18

-20
2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4
Power supply voltage, V

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Pacific MicroCHIP Corp. 2008
 Conclusion
Divider DUTs are measured and found
operating at expected 60GHz frequency
with sufficient margin up to about 70GHz.

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Pacific MicroCHIP Corp. 2008