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OR
gate
implements
is
logical
digital
logic
disjunction
gate
it
that
behaves
Symbol diagram
A+B
TRUTH TABLE
INPUT
OUTPUT
A OR B
of
logic
gates,
simple
electronic
Logic gate
A logic gate performs a logical operation on one
or more logic inputs and produces a single logic
output. The logic normally performed is Boolean
logic and is most commonly found in digital
circuits. Logic gates are primarily implemented
electronically using diodes or transistor, but can
also be constructed using electromagnetic relays,
fluidics, optics, molecules, or even mechanical
elements.
In electronic logic, a logic level is represented by a
voltage or current, (which depends on the type of
electronic logic in use). Each logic gate requires
power so that it can source and sink currents to
achieve the correct output voltage. In logic circuit
7
schematic,
power
connections
are
required.
They
can
be
built
from
relays
or
CIRCUIT DIAGRAM
10
J1
1
2
3
U1
L M 7 80 5H
+B A TT
R L M T 0 3 (M )
VCC
VCC
3
C2
C E L5
1 0M / 6 3V
C1
C CER
1 04 P F
VCC
J2
1
2
3
U2
R L M T 0 3 (M )
VCC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
D2
LED
R2
R
47 0E
1 4P IN IC
J3
1
2
3
R L M T 0 3 (M )
11
VCC
R1
D1
R
47 0E
LED
Components list
12
13
PCB LAYOUT
14
15
16
17
onto
non-conductive
substrate.
assembly
(PCBA).
PCBs
are
rugged,
18
The principal
19
20
substrate,
sometimes
on
both
sides,
with
photoplotter
from
data
manufacturing
transparencies
are
software.
typically
replace
phototools
requirements.
22
for
high-resolution
3. PCB
milling
uses
two
or
three-axis
Prototyper
is
extracted
from
files
23
traces.
The
additive
process
is
24
In
this
case,
25
the
vias
may
be
with
controlled-depth
drilling,
laser
holes
that
electrically
26
connect
the
are
typically
plated,
because
bare
solderable.
Traditionally,
any
exposed
28
the
component
screen
designators,
text
can
indicate
switch
setting
30
Populating
After the PCB is completed, electronic components
must be attached to form a functional printed
circuit
assembly,
or
PCA.
In
through-hole
of the PCB.Often,
through-hole
and
Again,
JEDEC
placement,
guidelines
soldering,
for
and
PCB
component
inspection
are
may
also
exercise
boundary
scan
test
33
conformal
coats
were
wax.
Modern
Even
bare
boards
are
sometimes
static
36
37
38
IC 7432
General Description
This device contains four independent gates each
of which performs the logic OR function.
Ordering Code:
Devices also available in Tape and Reel. Specify by
appending the suffix letter X to the ordering
code.
39
Connection Diagram
40
OUTPUT(Y) A B
H HIGH Logic Level
L LOW Logic Level
Function Table
Inputs
Output
41
define
the
conditions
for
actual
device
operation.
Electrical Characteristics
Over
recommended
operating
free
air
T
B A AND B
0 0
1 0
0 0
1 1
43
Desired Gate
44
Output(Q) =
The AND gate is a basic digital logic gate that
implements
logical
conjunction
it
behaves
46
of
logic
gates,
simple
electronic
schematic,
power
connections
are
required.
NAND and NOR logic gates are the two pillars of
logic, in that all other types of Boolean logic gates
(i.e., AND, OR, NOT, XOR, XNOR) can be created
from a suitable network of just NAND or just NOR
48
gate(s).
They
can
be
built
from
relays
or
49
50
CIRCUIT DIAGRAM
51
D2
1N 4007
12V
+V
D3
C2
C EL10
1 0 0 0 M /3 5 V
D4
1N 4007
D5
1N 4007
+V
+V
R1
R
4
D IS
R2
R
6
2
TH R
TR
12V
U1
R L M T 0 3 (M )
1N 4007
R4
D1
LED
CV
1
2
3
Q1
BC 547
J2
1
2
R L M T 0 2 (M )
R
4K7
LM 555
5
J1
C1
C CER
R3
R
1K5
C3
C C ER
103PF
VSS
1
2
SW 1
GND
VCC
+5V
VS
VDD
4
3
PB2PS
T it le
555
52
S iz e
A
D a te :
S u n d a y , J a n u a ry 0 1 , 2 0 0 6
R ev
1 .0
Sheet
of
Components list
53
54
PCB LAYOUT
55
56
onto
names
non-conductive
are
printed
substrate.
wiring
board
57
58
59
substrate,
sometimes
on
both
sides,
60
prepared
with
photoplotter
from
data
manufacturing
transparencies
are
software.
typically
replace
phototools
for
high-resolution
requirements.
3 PCB
milling
uses
two
or
three-axis
the
Prototyper
is
extracted
from
files
63
traces.The
additive
process
is
64
In
this
case,
the
vias
may
be
with
controlled-depth
drilling,
laser
holes
that
electrically
connect
the
are
typically
plated,
because
bare
solderable.
Traditionally,
any
exposed
67
the
component
screen
designators,
text
can
indicate
switch
setting
Test
Unpopulated boards may be subjected to a bareboard test where each circuit connection (as
defined in a netlist) is verified as correct on the
finished board. For high-volume production, a Bed
of nails tester or fixture is used to make contact
with copper lands or holes on one or both sides of
the board to facilitate testing. A computer will
instruct the electrical test unit to send a small
amount of current through each contact point on
the bed-of-nails as required, and verify that such
current can be seen on the other appropriate
contact points. For small- or medium-volume
boards, flying-probe testers use moving test
heads to make contact with the copper lands or
69
assembly,
or
PCA.
In
through-hole
of the PCB.Often,
through-hole
and
JEDEC
placement,
guidelines
soldering,
for
and
PCB
component
inspection
are
may
also
exercise
boundary
scan
test
71
72
conformal
coats
were
wax.
Modern
Even
bare
boards
are
sometimes
static
74
75
76
77
78
79
7408 IC
Digital
logic
devices
are
the
circuits
that
80
81
Integrated Circuits
82
83
84
Component description
85
Voltage Regulators
A voltage regulator is an electrical regulator
designed to automatically maintain a constant
voltage level. It may use an electromechanical
mechanism,
or
passive
or
active
electronic
element.
This
forms
negative
86
loop
must
be
carefully
designed
to
is
greatest
when
there
is
narrow
capacitor
conductors
are
often
called
plates.
An ideal capacitor is characterized by a single
constant value, capacitance, which is measured in
farads. This is the ratio of the electric charge on
each
conductor
to
the
potential
difference
88
current
to
pass,
to
filter
out
89
Theory of operation
90
simple
demonstration
of
parallel-plate
capacitor
A capacitor consists of two conductors separated
by a non-conductive region.The non-conductive
substance
is
called
the
dielectric
medium,
to
depletion
the
region
conductors.
chemically
capacitor
is
91
92
Energy storage
Work must be done by an external influence to
move
charge
capacitor.
between
When
the
the
conductors
external
in
influence
a
is
energy
is
released.
The
work
done
in
Current-voltage relation
The current i(t) through a component in an
electric circuit is defined as the rate of change of
93
charges
cannot
pass
through
the
equal
and
opposite
quantities
on
the
with
any
antiderivative,
constant
of
94
.
The dual of the capacitor is the inductor, which
stores energy in the magnetic field rather than the
electric
field.
Its
current-voltage
relation
is
95
If the
96
At t = 0,
likewise
demonstrates
97
exponential
is
the
molded-carbon
composition
Tinned
Material
99
Copper
Colour Coding
Composition
100
101
0 black
0 black
0 black
0 black
1 brown
1 brown
1 brown
1 brown
2 red
2 red
2 red
2 red
3 orange
3 orange
3 orange
3 orange
4 yellow
4 yellow
4 yellow
4 yellow
5 green
5 green
5 green
5 green
6 blue
6 blue
6 blue
6 blue
7 purple
7 purple
7 purple
7 purple
8 silver
8 silver
8 silver
8 silver
9 white
9 white
9 white
9 white
violet=7, orange=10,
=47K 5% =2.35K
103
gold=5%
and
gold
bands.
104
green,
silver
bands
represent
56 0.01 = 0.56
The fourth band of the colour code shows the
tolerance of a resistor. Tolerance is the precision of
the resistor and it is given as a percentage. For
example a 390 resistor with a tolerance of 10%
will have a value within 10% of 390 , between
390 - 39 = 351 and 390 + 39 = 429 (39 is 10%
of 390).
105
RESISTOR:
In
electronic
circuits,
in
other
applications,
the
smaller
Resistor shorthand:
Resistor
values
are
often
written
on
circuit
means
means
560
2.7
means
39
2700
k
Electrical
energy
converted
to
is
heat
when
resistor.
Usually
the
High
power
effect is resistors
negligible, but if the
(5W
top,
25W
resistance is low (or
bottom)
the
voltage
across
the
in
watts
(W)
or
P = V /
amps
(A)
ohms
( )
109
Examples:
A 470
A 27
CONNECTORS
Connectors
are
basically
used
for
interface
high
frequency
operation
the
average
eliminate
erratic
The
standardization
of
coaxial
111
types
of
microwave
112
coaxial
electro
luminescence.
Electro
transition
takes
place.
In
radiative
lower
wavelength
energy
level
releasing
corresponding
to
photon
the
of
energy
113
material.
On
forward
bias
condition,
electrons.
The
recombination,
that
number
take
of
place,
radiative
is
usually
high
probability
of
115
direct
transition
of
phosphide
is
an
indirect
band
gap
to
band
transitions
are
not
normally
observed.
Gallium Arsenide Phosphide is a tertiary alloy. This
material has a special feature in that it changes
from being direct band gap material.
Blue LEDs are of recent origin. The wide band gap
materials such as GaN are one of the most
promising LEDs for blue and green emission.
116
consumption
makes
Leds
compatible
with
conditions
where
other
light
ensures
a longer operating
117
lifetime,
thereby
improving
overall
reliability
and
lowering
to
orange,
yellow,
and
green-provides
the
118
1. Temperature
dependence
of
radiant
output
120
to
know
that
which
end
is
manufactures
actually
point
the
121
lens,
as
opposed
to
an
exposure
on
124
literature
is
literary
genre
aspects,
multimedia
content,
truth
table
as
proposition
5.101
of
127
References
1.
Mazedi,
The
8051
Microcontroller
and
Kenneth
Penram
International
Publishing,1996,
2nd
Edition
3. Embedded System using 8051 (E-book)
Lalit Kumar goel and Gaurav Sharma from
Meerut
4. Some Websites :
www.technowave.co.in
www.alldatasheets.com
www.datasheetcatalog.com
128
www.electronicscircuits.com
www.scielectronics.com
www.parallax.com
129