Beruflich Dokumente
Kultur Dokumente
DATA SHEET
TDA6106Q
Video output amplifier
Product specification
File under Integrated Circuits, IC02
1997 Mar 03
Philips Semiconductors
Product specification
TDA6106Q
FEATURES
GENERAL DESCRIPTION
PACKAGE
TYPE NUMBER
NAME
TDA6106Q
DESCRIPTION
DBS9MPF
VERSION
SOT111-1
BLOCK DIAGRAM
feedback
output
supply voltage
6
n.c.
n.c.
n.c.
1
2
7
MIRROR 1
in
MIRROR 2
out
Vbias
out
in
8
TDA6106Q
CURRENT
SOURCE
5
inverting
input
DIFFERENTIAL +
STAGE
out
out
out
out
MIRROR 3
black current
measurement
output
in
gnd
4
ground
(substrate)
1997 Mar 03
cathode
output
MBG343
Philips Semiconductors
Product specification
TDA6106Q
PINNING
SYMBOL
PIN
DESCRIPTION
n.c.
not connected
n.c.
not connected
Vin
GND
ground, substrate
Iom
VDD
n.c.
handbook, halfpage
n.c.
n.c.
Vin
GND
supply voltage
Iom
not connected
VDD
Voc
n.c.
Vof
Voc
Vof
TDA6106Q
MBG342
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages with respect to pin 4 (ground) unless
otherwise specified; currents specified as in Fig.1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDD
supply voltage
250
Vin
Vom
Voc
VDD
Vof
VDD
Ioc(l)
Ioc(h)
10
Pmax
tbf
Tstg
storage temperature
55
+150
Tj
junction temperature
20
+150
Vesd
electrostatic discharge
note 3
2000
+2000
note 4
300
+300
Notes
1. The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance
flash) of 5 A maximum with a charge content of 100 C.
2. The cathode output is also protected against peak currents (caused by positive voltage peaks during low-resistance
flash) of 10 A maximum with a charge content of 100 nC.
3. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k resistor.
4. Machine model: equivalent to discharging a 200 pF capacitor through a 0 resistor.
1997 Mar 03
Philips Semiconductors
Product specification
TDA6106Q
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see Handling MOS Devices ).
QUALITY SPECIFICATION
Quality specification SNW-FQ-611 part E is applicable, except for ESD Human body model see Chapter Limiting
values, and can be found in the Quality reference handbook (ordering number 9397 750 00192).
THERMAL CHARACTERISTICS
PARAMETER(1)
SYMBOL
VALUE
UNIT
Rth j-a
56
K/W
Rth j-c
12
K/W
Note
1. External heatsink not required.
CHARACTERISTICS
Operating range: Tamb = 20 to +65 C; VDD = 180 to 210 V (see note 1), Vom = 1.4 to 6 V.
Test conditions: Tamb = 25 C; VDD = 200 V; Vom = 4 V; CL = 10 pF (CL consists of parasitic and cathode capacitance);
measured in test circuit of Fig.5; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
IDD
VocDC = 100 V
Ibias
Vint
Iom(os)
VTint
MIN.
TYP.
MAX.
UNIT
2.8
3.0
3.3
mA
VocDC = 100 V
20
2.5
Ioc = 0 A;
Vin = 1.5 to +3.5 V;
Vom = 1.4 to 6 V
10
+10
VocDC = 100 V
0.5
mV/K
I om
-----------I oc
Ioc = 10 A to 3 mA;
Vin = 1.5 to +3.5 V;
Vom = 1.4 to 6 V
0.9
1.0
1.1
Iof(max)
Voc = 20 V to VDD 30 V
25
Voc(min)
Vin = 3.5 V
12
Voc(max)
Vin = 1.5 V
VDD 14
VDD 10
GB
f = 500 kHz;
VocDC = 100 V
0.52
GHz
BWS
VocAC = 60 V (p-p);
VocDC = 100 V
MHz
BWL
4.7
5.7
MHz
1997 Mar 03
mA
Philips Semiconductors
Product specification
SYMBOL
PARAMETER
TDA6106Q
CONDITIONS
MIN.
TYP.
MAX.
UNIT
tpd
38
49
60
ns
tr
62
74
87
ns
tf
62
74
87
ns
ts
350
ns
SR
1200
V/s
OV
PSRR
60
dB
Notes
1. The rating of supply voltage is 250 V, but because of flash the maximum operating range for supply voltage is 210 V.
2. PSSR: The ratio of the change in supply voltage to the change in input voltage when there is no change in output
voltage.
1997 Mar 03
Philips Semiconductors
Product specification
TDA6106Q
x
Vi
0
t
x
ts
overshoot (in %)
Voc
151
150
140
149
100
60
50
t
tr
MGA974
t pd
1997 Mar 03
Philips Semiconductors
Product specification
TDA6106Q
x
Vi
0
t
x
ts
150
140
Voc
100
overshoot (in %)
51
60
50
49
t
tf
MGA975
t pd
Flashover protection
1997 Mar 03
Philips Semiconductors
Product specification
TDA6106Q
Cpar
Rfb
C1
Vin
R10 100 k
22 nF
R9
C2
866
200 V
C6
100 nF
22 F
Cn
560 pF
6
R1
50
0.98 mA
TDA6106Q 8
4
C8
5
C7
A
3.2 pF
Vom
4V
6.8 pF
R3
20 M
probe
C9
136 pF
R2
1 M
GND
MBG344
Dissipation
P dyn = V DD ( C L + C fb + C int ) f V o ( p p ) b
Where:
CL = load capacitance.
V of
= V DD I DD + V oc I oc V of --------
R fb
Where:
1997 Mar 03
Philips Semiconductors
Product specification
TDA6106Q
GND
VDD
from
input
circuit
TDA6106Q
esd
esd
esd
Vin
Vbias
from
reference
circuit
Vof
from
input
circuit
esd
flash
prot.
Iom
esd
from
pin 9
flash
prot.
from
pin 9
6.8 V
esd
from
reference
circuit
to BCS-circuit
output
MBG345
1997 Mar 03
Voc
Philips Semiconductors
Product specification
TDA6106Q
PACKAGE OUTLINE
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
D1
A2
q
P
P1
A3
q2
q1
seating plane
A4
pin 1 index
L
1
9
e2
Z
b2
w M
b1
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
18.5
17.8
A2
A3
max.
3.7
8.7
8.0
A4
b1
b2
D (1)
D1
E (1)
e2
15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54
15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
P1
3.9
3.4
2.75
2.50
3.4
3.2
1.75 15.1
1.55 14.9
q1
q2
Z (1)
max.
4.4
4.2
5.9
5.7
0.25
1.0
65o
55o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-03-11
SOT111-1
1997 Mar 03
EUROPEAN
PROJECTION
10
Philips Semiconductors
Product specification
TDA6106Q
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Mar 03
11
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
547047/1200/01/pp12