Space Product Assurance: Manual Soldering of High-Reliability Electrical Connections

ECSS-Q-ST-70-08C
6 March 2009
Space product
assurance
Manual soldering of high-reliability
electrical connections
ECSS Secretariat
ESA-ESTEC
Requirements & Standards Division
Noordwijk, The Netherlands
ECSSQST7008C
6March2009
Foreword
This Standard is one of the series of ECSS Standards intended to be applied together for the
management, engineering and product assurance in space projects and applications. ECSS is a
cooperative effort of the European Space Agency, national space agencies and European industry
associationsforthepurposeofdevelopingandmaintainingcommonstandards.Requirementsinthis
Standardaredefinedintermsofwhatshallbeaccomplished,ratherthanintermsofhowtoorganize
and perform the necessary work. This allows existing organizational structures and methods to be
appliedwheretheyareeffective,andforthestructuresandmethodstoevolveasnecessarywithout
rewritingthestandards.
This Standard has been prepared by the ECSSQST7008 Working Group, reviewed by the ECSS
ExecutiveSecretariatandapprovedbytheECSSTechnicalAuthority.
Disclaimer
ECSSdoesnotprovideanywarrantywhatsoever,whetherexpressed,implied,orstatutory,including,
butnotlimitedto,anywarrantyofmerchantabilityorfitnessforaparticularpurposeoranywarranty
that the contents of the item are errorfree. In no respect shall ECSS incur any liability for any
damages,including,butnotlimitedto,direct,indirect,special,orconsequentialdamagesarisingout
of, resulting from, or in any way connected to the use of this Standard, whether or not based upon
warranty,businessagreement,tort,orotherwise;whetherornotinjurywassustainedbypersonsor
propertyorotherwise;andwhetherornotlosswassustainedfrom,oraroseoutof,theresultsof,the
item,oranyservicesthatmaybeprovidedbyECSS.
Publishedby:
Copyright:
ESARequirementsandStandardsDivision
ESTEC, P.O. Box 299,
2200 AG Noordwijk
The Netherlands
2009 by the European Space Agency for the members of ECSS
ECSSQST7008C
6March2009
Change log
ECSSQ7008
Firstissue
6August1999
ECSSQST7008C
Secondissue
6March2009
ThesignificantchangesbetweentheECSSQ7008Aandthisversionare:
Theenvironmentalconditionsoftheassemblyareahavebeenmodified.
Thefluxdesignationhasbeencompleted.
Theuseofnewsolventsisallowedsubjecttosuccessfultesting.
Theuseofdeviceswithnonbendableleadshasbeenimplemented.
Thewettingacceptancelimitshavebeenmodified.
Thevibrationlevelshavebeenmodified.
Moreguidancehasbeenincludedoncomponentmountingheightsand
staking.
FlatpackdeviceshavemigratedtoECSSQ7038.
ECSSQST7008C
6March2009
Table of contents
Change log .................................................................................................................3
Introduction..............................................................................................................11
1 Scope.....................................................................................................................12
2 Normative references ...........................................................................................13
3 Terms, definitions and abbreviated terms..........................................................14
3.1
Terms from other standards .....................................................................................14
3.2
Terms specific to the present standard ....................................................................14
3.3
Abbreviated terms .................................................................................................... 22
4 Principles of reliable soldered connections.......................................................23

5 Preparatory conditions ........................................................................................24
5.1
Calibration ................................................................................................................24
5.2
Facility cleanliness ...................................................................................................24
5.3
Environmental conditions .........................................................................................24
5.4
Lighting requirements ...............................................................................................25
5.5
Precautions against static discharges ...................................................................... 25
5.6
5.5.1
General.......................................................................................................25
5.5.2
Precautions against ESD during manufacturing......................................... 25
5.5.3
Protective Packaging and ESD Protection ................................................. 26
5.5.4
Packing and filler materials......................................................................... 27
Equipment and tools.................................................................................................27

5.6.1
General.......................................................................................................27
5.6.2
Brushes ......................................................................................................27
5.6.3
Cutters and pliers ....................................................................................... 27
5.6.4
Bending tools..............................................................................................28
5.6.5
Clinching tools ............................................................................................28
5.6.6
Insulation strippers .....................................................................................29
5.6.7
Soldering irons and resistance soldering equipment.................................. 30
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5.6.8
Soldering tools............................................................................................ 31
6 Materials selection ...............................................................................................32

6.1
General.....................................................................................................................32
6.2
Solder .......................................................................................................................32
6.3
6.2.1
Form ...........................................................................................................32
6.2.2
Composition................................................................................................33
Flux...........................................................................................................................33
6.3.1
Rosin-based fluxes ..................................................................................... 33
6.3.2
INH1 corrosive acid flux.............................................................................. 34
6.3.3
Application of flux .......................................................................................34
6.4
Solvents....................................................................................................................35
6.5
Flexible insulation materials .....................................................................................35
6.6
Terminals..................................................................................................................36
6.6.1
Materials .....................................................................................................36
6.6.2
Tin-, silver- and gold-plated terminals ........................................................ 36
6.6.3
Shape of terminals......................................................................................36
6.7
Wires ........................................................................................................................37
6.8
PCBs ........................................................................................................................37
6.9
6.8.1
Boards ........................................................................................................37
6.8.2
Gold finish on conductors ........................................................................... 37
Component lead finishes.......................................................................................... 37
6.10 Adhesives (staking compounds and heat sinking), encapsulants and

conformal coatings ................................................................................................... 38
7 Preparation for soldering.....................................................................................39

7.1
7.2
7.3
General.....................................................................................................................39
7.1.1
Tools...........................................................................................................39
7.1.2
Components ...............................................................................................39
Preparation of conductors, terminals and solder cups ............................................. 39

7.2.1
Insulation removal ......................................................................................39
7.2.2
Surfaces to be soldered..............................................................................40
7.2.3
De-golding of gold-plated leads and terminals ........................................... 41
7.2.4
Constraints on degolding and pretinning methods ..................................... 42
7.2.5
Pretinning of stranded wires ....................................................................... 43
7.2.6
Pre-tinning of component leads and solid-wire conductors ........................ 44
Preparation of the soldering bit ................................................................................44

7.3.1
Fit................................................................................................................44
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7.3.2
Maintenance ...............................................................................................44
7.3.3
Plated bits...................................................................................................45
7.3.4
Tip in operation...........................................................................................45
7.4
Maintenance of resistance-type soldering electrodes .............................................. 45
7.5
Handling (work station).............................................................................................45
7.6
Storage (work station) ..............................................................................................45
7.7
7.6.1
Components ...............................................................................................45
7.6.2
PCBs ..........................................................................................................46
7.6.3
Materials requiring segregation .................................................................. 46
Preparation of PCBs for soldering............................................................................ 46

7.7.1
Process.......................................................................................................46
7.7.2
Demoisturization methods .......................................................................... 46
7.7.3
Storage of prepared PCBs .........................................................................46
8 Mounting of components.....................................................................................47
8.1
8.2
General requirements...............................................................................................47
8.1.1
Introduction.................................................................................................47
8.1.2
Heavy components..................................................................................... 47
8.1.3
Metal-case components ............................................................................. 47
8.1.4
Glass-encased components ....................................................................... 48
8.1.5
Stress relief of components with bendable leads ....................................... 48
8.1.6
Stress relief of components with non-bendable leads ................................ 49
8.1.7
Reinforced plated-through holes ................................................................ 52
8.1.8
Lead and conductor cutting ........................................................................52
8.1.9
Solid hook-up wire ...................................................................................... 52
8.1.10
Location ......................................................................................................52
8.1.11
Conformal coating, cementing and encapsulation...................................... 52
Lead bending requirements...................................................................................... 53

8.2.1
General.......................................................................................................53
8.2.2
Conductors terminating on both sides of a non-plated-through hole.......... 53
8.3
Mounting of terminals to PCBs .................................................................................54
8.4
Lead attachment to PCBs ........................................................................................55

8.4.1
General.......................................................................................................55
8.4.2
Clinched leads ............................................................................................ 55
8.4.3
Stud leads...................................................................................................57
8.4.4
Lapped round leads....................................................................................58
8.4.5
Lapped ribbon leads ...................................................................................58
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8.5
Mounting of components to terminals ...................................................................... 58
8.6
Mounting of connectors to PCBs .............................................................................. 60
9 Attachment of conductors to terminals, solder cups and cables ....................61

9.1
9.2
9.3
9.4
General.....................................................................................................................61
9.1.1
Conductors .................................................................................................61
9.1.2
Terminals....................................................................................................61
Wire termination .......................................................................................................61

9.2.1
Breakouts from cables................................................................................61
9.2.2
Insulation clearance....................................................................................61
9.2.3
Solid hook-up wire ...................................................................................... 62
9.2.4
Stress relief.................................................................................................62
Turret and straight-pin terminals ..............................................................................62

9.3.1
Side route ...................................................................................................62
9.3.2
Bottom route ............................................................................................... 62
Bifurcated terminals..................................................................................................63
9.4.1
General.......................................................................................................63
9.4.2
Bottom route ............................................................................................... 63
9.4.3
Side route ...................................................................................................64
9.4.4
Top route ....................................................................................................65
9.4.5
Combination of top and bottom routes ....................................................... 66
9.4.6
Combination of side and bottom routes...................................................... 66
9.5
Hook terminals .........................................................................................................66
9.6
Pierced terminals...................................................................................................... 67
9.7
Solder cups (connector type) ...................................................................................68
9.8
Insulation sleeving....................................................................................................68
9.9
Wire and cable interconnections .............................................................................. 69

9.9.1
General.......................................................................................................69
9.9.2
Preparation of wires....................................................................................69
9.9.3
Preparation of shielded wires and cables................................................... 69
9.9.4
Pre-assembly..............................................................................................70
9.9.5
Soldering procedures ................................................................................. 70
9.9.6
Cleaning .....................................................................................................71
9.9.7
Inspection ...................................................................................................71
9.9.8
Workmanship..............................................................................................71
9.9.9
Sleeving of interconnections....................................................................... 72
9.10 Connection of stranded wires to PCBs..................................................................... 72
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10 Soldering to terminals and PCBs ......................................................................74

10.1 General.....................................................................................................................74
10.1.1
Securing conductors...................................................................................74
10.1.2
Thermal shunts...........................................................................................74
10.1.3
High-voltage connections ........................................................................... 74
10.2 Solder application to terminals ................................................................................. 75

10.2.1
Soldering of swaged terminals onto PCBs ................................................. 75
10.2.2
Soldering of conductors onto terminals (except cup terminals).................. 75
10.2.3
Soldering of conductors onto cup terminals ............................................... 76
10.3 Solder application to PCBs.......................................................................................76

10.3.1
Solder coverage .........................................................................................76
10.3.2
Solder fillets ................................................................................................76
10.3.3
Soldering of component leads to plated-through holes .............................. 76
10.3.4
Solder application ....................................................................................... 77
10.4 Wicking.....................................................................................................................78
10.5 Solder rework ...........................................................................................................78
10.6 Repair and modification............................................................................................ 78
11 Cleaning of PCB assemblies .............................................................................79

11.1 General.....................................................................................................................79
11.2 Ultrasonic cleaning ...................................................................................................79
11.3 Monitoring for cleanliness......................................................................................... 79
11.3.1
Cleanliness testing .....................................................................................79
11.3.2
Testing frequency .......................................................................................80
11.3.3
Test limits ...................................................................................................80
11.3.4
Test method................................................................................................80
12 Final inspection ..................................................................................................81

12.1 General.....................................................................................................................81
12.2 Acceptance criteria...................................................................................................81
12.3 Visual rejection criteria .............................................................................................82
13 Verification procedure........................................................................................83
13.1 General.....................................................................................................................83
13.2 Vibration ...................................................................................................................84
13.3 Temperature cycling................................................................................................. 86
13.4 Microsection .............................................................................................................86
14 Quality assurance...............................................................................................87
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14.1 General.....................................................................................................................87
14.2 Data..........................................................................................................................87
14.3 Nonconformance ...................................................................................................... 87
14.4 Calibration ................................................................................................................87
14.5 Traceability ...............................................................................................................88
14.6 Workmanship standards...........................................................................................88
14.7 Inspection .................................................................................................................88
14.8 Operator and inspector training and certification...................................................... 88
15 Workmanship standards....................................................................................90
15.1 Soldered clinched terminals ..................................................................................... 90
15.2 Soldered stud terminals............................................................................................ 91
15.3 Soldered turret terminals ..........................................................................................92
15.4 Solder turret terminals ..............................................................................................93
15.5 Soldered bifurcated terminals...................................................................................94
15.6 Soldered hook terminals........................................................................................... 95
15.7 Soldered cup terminals.............................................................................................96
15.8 Soldered wire to shielded cable interconnections .................................................... 97
Annex A (normative) Report on manual soldering of high-reliability

electrical connections - DRD............................................................................101
Annex B (informative) Solder melting temperatures and choice ......................105
Bibliography...........................................................................................................106
Figures
Figure 5-1: Profiles of correct and incorrect cutters for trimming leads.................................. 28
Figure 5-2 Examples of non-approved types of mechanical strippers .................................. 29
Figure 8-1: Assembly of underfilled TO-39 and TO-59, and adhesively staked CKR06 ............. 49
Figure 8-2: Methods for incorporating stress relief with components having bendable
leads ....................................................................................................................51
Figure 8-3: Methods for attaching wire extensions to non-bendable leads ............................ 52
Figure 8-4: Minimum lead bend.............................................................................................. 53
Figure 8-5: Leads with solder termination on both sides........................................................ 54
Figure 8-6: Types of terminal swaging ................................................................................... 55
Figure 8-7: Clinched-lead terminations - unsupported holes.................................................. 56
Figure 8-8: Clinched lead terminations - plated through-holes............................................... 56
Figure 8-9: Stud terminations .................................................................................................57
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Figure 8-10: Methods of through-hole lapped termination ..................................................... 59
Figure 8-11: Method of stress relieving parts attached to terminals....................................... 59
Figure 9-1: Side- and bottom-route connections to turret terminals ....................................... 63
Figure 9-2: Bottom-route connections to bifurcated terminal ................................................. 64
Figure 9-3: Side-route connection to bifurcated terminal ....................................................... 65
Figure 9-4: Top-route connection to bifurcated terminal ........................................................ 66
Figure 9-5: Connections to hook terminals.............................................................................67
Figure 9-6: Connections to pierced terminals......................................................................... 67
Figure 9-7: Connections to solder cups (connector type)....................................................... 68
Figure 9-8: Methods for securing wires .................................................................................. 71
Figure 9-9: Connection of stranded wires to PCBs ................................................................73
Figure 10-1: High voltage connection.....................................................................................75
Figure 10-2:Minimum acceptable wetting on component side ............................................... 77
Figure 15-1:Soldered clinched terminals................................................................................ 90
Figure 15-2: Soldered stud terminals .....................................................................................91
Figure 15-3: Soldered turret terminals with twin conductors .................................................. 92
Figure 15-4: Soldered turret terminals with single conductors ............................................... 93
Figure 15-5: Soldered bifurcated terminals ............................................................................ 94
Figure 15-6 Soldered hook terminals .................................................................................... 95
Figure 15-7: Soldered cup terminals ......................................................................................96
Figure 15-8: Hand-soldered wire to shielded cable interconnections..................................... 97
Figure 15-9: Hand-soldered wire to shielded wire interconnections....................................... 98
Figure 15-10: Hand-soldered wire interconnections - details of defects .............................. 100
Tables
Table 6-1: Chemical composition of spacecraft solders......................................................... 33
Table 6-2: Fluxes.................................................................................................................... 34
Table 7-1: Clearances for insulation.......................................................................................40
Table 7-2: Solder baths for degolding and pretinning ............................................................ 42
Table 9-1: Dimensions for Figure 9-9..................................................................................... 73
Table 13-1: Sine survey ......................................................................................................... 85
Table 13-2: Minimum severity for sine vibration testing ......................................................... 85
Table 13-3: Minimum severity for random vibration testing for all applications except
launchers .............................................................................................................85
Table 13-4: Minimum severity for random vibration testing for launcher................................ 86
Table B-1 : Guide to choice of solder types .........................................................................105
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Introduction
ThemainpartofthisStandardisbasedonrecommendationsfromtheNational
Aeronautics and Space Administration and European soldering technology
experts. Modifications have been incorporated into the text to provide for the
specificrequirementoflowoutgassingelectricalsystemswhicharerequiredby
scientificandapplicationsatellites.Otheradditionshavebeenmadeinthelight
of recent technological advances and the results of verification test
programmes. The methods and workmanship contained in this document are
consideredtobefullyapprovedfornormalspacecraftrequirements.
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1
Scope
This Standard defines the technical requirements and quality assurance
provisions for the manufacture and verification of manuallysoldered, high
reliabilityelectricalconnections.
The Standard defines acceptance and rejection criteria for high reliability
manufactureofmanuallysolderedelectricalconnectionsintendedtowithstand
normal terrestrial conditions and the vibrational gloads and environment
imposedbyspaceflight.
The proper tools, correct materials, design and workmanship are covered by
thisdocument.Workmanshipstandardsareincludedtopermitdiscrimination
betweenproperandimproperwork.
TheassemblyofsurfacemountdevicesiscoveredinECSSQST7038.
RequirementsrelatedtoprintedcircuitboardsarecontainedinECSSQST7010
andECSSQST7011.
Verification of manual soldering assemblies which are not described in this
standard are performed by vibration and thermal cycling testing. The
requirementsforverificationaregiveninthisStandard.
ThisstandarddoesnotcoverthequalificationandacceptanceofEQMandFM
equipmentwithhandsolderedconnections.
The qualification and acceptance tests of equipment manufactured in
accordancewiththisStandardarecoveredbyECSSEST1003.
The mounting and supporting of components, terminals and conductors
prescribed herein applies to assemblies designed to operate within the
temperaturelimitsof55Cto+85C.
For temperatures outside this normal range, special design, verification and
qualification testing is performed to ensure the necessary environmental
survivalcapability.
Special thermal heat sinks are applied to devices having high thermal
dissipation(e.g.junctiontemperaturesof110C,powertransistors)inorderto
ensurethatsolderjointsdonotexceed85C.
Thisstandardmaybetailoredforthespecificcharacteristicandconstrainsofa
spaceprojectinconformancewithECSSSST00.
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2
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references,subsequentamendmentsto,orrevisionofanyofthesepublications
donotapply,However,partiestoagreementsbasedonthisECSSStandardare
encouragedtoinvestigatethepossibilityofapplyingthemorerecenteditionsof
the normative documents indicated below. For undated references, the latest
editionofthepublicationreferredtoapplies.
ECSSSST0001
ECSSsystemGlossaryofterms
ECSSQST1009
Space product assurance Nonconformance control

system
ECSSQST20
SpaceproductassuranceQualityassurance
ECSSQST7002
SpaceproductassuranceThermalvacuumoutgassing
testforthescreeningofspacematerials
ECSSQST7010
Space product assurance Qualification of printed

circuitboards
ECSSQST7011
Space product assurance Procurement of printed

circuitboards
ECSSQST7028
Space product assurance Repair and modification of

printedcircuitboardassembliesforspaceuse
ECSSQST7071
Space product assurance Data for selection of space

materialsandprocesses
ESCC23500
Requirements for lead materials and finishes for

componentsforspaceapplication
EN6134051
Protection of electronic devices from electrostatic

phenomenaGeneralrequirements
EN6134052
Protection of electronic devices from electrostatic

phenomenaUserguide
MILSTD883Rev.G
Testmethodsandproceduresformicroelectronics
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3
Terms, definitions and abbreviated terms
3.1
Terms from other standards

ForthepurposeofthisStandard,thetermsanddefinitionsfromECSSST0001
apply.
For the purpose of this Standard, the following terms from ECSSQST7028
apply:
repair
rework
3.2
Terms specific to the present standard

3.2.1
approval authority
entitythatreviewsandacceptstheverificationprogramme,evaluatingthetest
resultsandgrantsthefinalapproval
3.2.2
base laminate
seesubstrate
3.2.3
bifurcated (split) terminal
terminal containing a slot or split in which wires or leads are placed before
soldering
3.2.4
bit
removableheatstoreofasolderingiron
3.2.5
blister
delaminationinadistinctlocalareaorareas
3.2.6
bridging
buildupofsolderorconformalcoatingbetweenparts,componentleadsorbase
substrateforminganelevatedpath
NOTE
Seefillet.
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3.2.7
clinched-lead termination
conductororcomponentleadwhichpassesthroughaprintedcircuitboardand
isthenbenttomakecontactwiththeprintedcircuitboardpad
NOTE
3.2.8
Theclinchedportionisnotforcedtolieflaton
the pad and some innate spring back is
desirable before this form of termination is
soldered.
cold flow
movementofinsulation,forexampleTeflon(PTFE),causedbypressure
3.2.9
cold solder joint
joint in which the solder has a blocky, wrinkled or piledup appearance and
showssignsofimproperfloworwettingaction
NOTE
3.2.10
It can appear either shiny or dull, but not

granular.Thejointnormallyhasabruptlinesof
demarcation rather than a smooth, continuing
filletbetweenthesolderandthesurfacesbeing
joined. These lines are caused by either
insufficientapplicationofheatorthefailureof
an area of the surfaces being joined to reach
solderingtemperature
component
device which performs an electronic, electrical or electromechanical function

and consists of one or more elements joined together and which cannot
normallybedisassembledwithoutdestruction
NOTE1 The terms component and part can be
interchanged.
NOTE2 Transistors,
capacitors.
3.2.11
integrated
circuits,
hybrids,
component lead
solidwirewhichextendsfromandservesasaconnectiontoacomponent
3.2.12
conductor
leadorwire,solidorstranded,orprintedcircuitpatchservingasanelectrical
interconnectionbetweenterminations
3.2.13
conformal coating
thin protective coating which conforms to the configuration of the covered

assembly
3.2.14
connection
electricaltermination
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3.2.15
contact angle
angle enclosed between halfplanes, tangent to a liquid surface and a solid

liquidinterfaceattheirintersection
NOTE
3.2.16
In particular, the contact angle of liquid solder

in contact with a solid metal surface. An
approximate value for this can be determined
by shadow projection or other means, by
measuring after the solder has solidified. The
contact angle is always the angle inside the
liquid
contamination
particles,liquids,gases,materialsandmicroorganismswhichbytheirpresence
candisturbtheperformanceofanitem
3.2.17
corrosion
deterioration of a metal by chemical or electrochemical reaction with its

environment
3.2.18
cracked solder joint
solderedconnectionwhichhasfracturedorbrokenwithinthesolder
3.2.19
dewetting
condition in a soldered area in which the liquid solder has not adhered
intimately,characterizedbyanabruptboundarybetweensolderandconductor,
orsolderandterminal/terminationarea
NOTE
3.2.20
Thisisoftenseenasadullsurfacewithislands
ofthickershinysolder.
disturbed solder joint
unsatisfactoryconnectionresultingfromrelativemotionbetweentheconductor
andterminationduringsolidificationofthesolder
3.2.21
electrical connection
conductiveconnectioninelectricalorelectroniccircuits
3.2.22
eutectic alloy
alloyoftwoormoremetalsthathasonedistinctmeltingpoint
NOTE
3.2.23
Oneeutecticsolderisatinleadalloycontaining
63%Snand37%Pbwhichmeltsat183C
fillet
smoothconcavebuildupofmaterialbetweentwosurfaces
NOTE
Example: A fillet of solder between a

component lead and a solder pad or terminal,
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orafilletofconformalcoatingmaterialbetween
acomponentandprintedcircuitboard
3.2.24
flux
material which, during soldering, removes the oxide film, protects the surface
fromoxidation,andpermitsthesoldertowetthesurfacestobejoined
3.2.25
flux activity
property of a flux which allows the smallest contact angle between molten
solderandasolidsurface
NOTE
3.2.26
Seealsorosin.
glass meniscus
glassfilletofaleadsealwhichoccurswhereanexternalleadleavesthepackage
body
3.2.27
haloing
conditionexistinginthebaselaminateofaprintedcircuitboardintheformofa
lightareaaroundholesorothermachinedareasonorbelowthesurfaceofthe
laminate
3.2.28
hook terminal
terminalformedinahookshape
3.2.29
icicles
seesoldericicle
3.2.30
interfacial connection
conductor which connects conductive patterns between opposite sides of a

printedcircuitboard
NOTE
3.2.31
Normallyaplatedthroughhole.
lap joint
joiningorfusingoftwooverlappingmetalsurfaceswithsolderwithoutuseof
anyothermechanicalattachmentorsupport
3.2.32
measling/measles
condition existing in the base laminate of printed circuit board in the form of
discrete white spots or crosses below the surface of the base laminate,
reflectingaseparationoffibresintheglassclothattheweaveintersection
NOTE
During soldering this can be caused by

excessiveheat.
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3.2.33
multi-layer circuit board
product consisting of alternate laminates of printed circuit substrates and

insulators, bonded together by simultaneous application of heat and pressure
priortodrillingandplatingholesforinterconnections
NOTE
3.2.34
Seealsoprintedcircuitboard.
pad
termination of a conducting surface on a printed circuit board to which leads

aresolderedtoformelectricalconnections
NOTE
3.2.35
These can be described as either functional,

where an active track is terminated, or non
functional,wherethepadisisolated.
pits
smallholesorsharpdepressionsinthesurfaceofsolder
NOTE
3.2.36
This can be caused by flux blowout due to

entrapmentoroverheating
plated-through hole
holeinwhichmetalisdepositedontheinsidesurface
NOTE1 AdaptedfromIECMultilingualdictionary.
NOTE2 Also known as a supported hole. The
configuration is used to provide additional
mechanicalstrengthtothesolderedtermination
ortoprovideanelectricalinterconnectionona
doublesided or multilayer printed circuit
board.
3.2.37
potting compound
compound, usually electrically nonconductive, used to encapsulate or as a

fillerbetweencomponents,conductorsorassemblies
3.2.38
printed circuit board (PCB)
productresultingfromtheprocessofselectivelyetchingunwantedcopperfrom
one or both surfaces of a copperclad insulating substrate to form a desired
circuitrypatternwhichissubsequentlysolderorgoldplated
NOTE
The term printed circuit board covers the

followingfamilies:
singlesided;
doublesided,rigidorflexible;
multilayer,rigidorflexrigid.
3.2.39
resin
natural substance that is usually transparent or translucent and yellowish to

brown
18
ECSSQST7008C
6March2009
NOTE
3.2.40
Resins are formed in plant secretions and are

solubleinorganicsolvents,butnotwater.This
is a generic term, rosin being the specific term
withregardtosoldering(seerosin).
resistance soldering
methodofsolderingbypassingacurrentbetweentwoelectrodesthroughthe
areatobesoldered
3.2.41
rosin
natural resin obtained as the residue after removal of turpentine from the
oleoresin of the pine tree, consisting mainly of abietic acid and related resin
acids,theremainderbeingresinacidesters
NOTE
3.2.42
It is noncorrosive and electrically non

conducting.Rosinisthebasicconstituentofthe
rosinfluxfamily(seeISOEN29454).
rosin-soldered joint
unsatisfactoryconnectionwhichhasentrappedrosinflux
3.2.43
selective plating
areaofaplatedcircuitboardthatisdesignedtohaveadifferentplatedfinish
thantherestoftheboard
NOTE
3.2.44
Example: A goldfinished RF board that

supportstinleadterminations(landareas).
shield
metallic sheath surrounding one or more wires, cables, cable assemblies, or a

combination of wires and cables that is used to prevent or reduce the
transmissionofelectromagneticenergytoorfromtheenclosedconductors
NOTE
3.2.45
The shield also includes an insulating jacket

thatcancoverthemetallicsheath
solder
nonferrousfusiblemetallicalloyoftwoormoremetals(usuallytinandlead)
used when melted to join or fuse metallic surfaces together and to provide a
lowresistanceelectricalpath
3.2.46
solderability
propertyofasurfacewhichallowsittobewettedbymoltensolder
NOTE
Standardtestsexisttoassessthesolderabilityof
conductors. Surfaces are considered to have a
good solderability if, following the
proceduresofthisstandard,solderwettingcan
be achieved within 3 seconds and dewetting
doesnotoccurbefore8seconds.
19
ECSSQST7008C
6March2009
3.2.47
solder coating
surfacecoatedwithathin,uniformlayerofsolder
3.2.48
solder-cup terminal
hollow, cylindrical terminal closed at one end to accommodate one or more

conductors
3.2.49
solder icicle
conicalpeakorsharppointofsolderusuallyformedbytheprematurecooling
andsolidificationofsolderuponremovaloftheheatsources
3.2.50
solder pad
terminationareaonaprintedcircuitconductor
3.2.51
soldering
process of joining metallic surfaces through the use of solder without direct
fusionofthebasemetals
3.2.52
soldering time
timerequiredforasurfacetobewettedbysolderunderspecifiedconditions
3.2.53
stress lines
threeformsofstresslinescanappearonafinishedsolderfillet:
a.
lines or folds running parallel to the mounting surface usually denote

excessive soldering times or temperatures and also rework. They are
probablycausedduringsolderingbydifferentialexpansions,i.e.between
the printed circuit board substrate which expands afar greater distance
thanthemetallicmaterialofthejoint
b.
lines running perpendicular to the mounting surface are commonly

causedwhenthesolderingironbitisremovedtooslowlyfromaliquid
solderjoint
c.
linesrunningcircumferentiallyaroundthemidsectionofthesolderfillet
causedbyshrinkageduringthelaststageofsolidification
3.2.54
stress relief
method or means to minimize stresses to the soldered termination or

component
NOTE
3.2.55
Generallyintheformofabendorserviceloop
in a component lead, solid or stranded wire to
providerelieffromstressbetweenterminations,
as that caused, for instance by movement or
thermalexpansion
stud termination
uprightconductorterminationthroughaprintedcircuitboard
20
ECSSQST7008C
6March2009
3.2.56
substrate
supporting dielectric material upon which the elements of a circuit are

depositedorinstalled
3.2.57
termination/terminal area
conductive surface on a printed circuit board used for making electrical

connections
NOTE
3.2.58
Also referred to as printed circuit pad, solder

pad.
thermal shunt
device with good heatdissipation characteristics used to conduct heat away

fromanarticlebeingsoldered
3.2.59
tinning
coatingofasurfacewithauniformlayerofsolderbeforeitisusedinasoldered
connection
3.2.60
tip
applicationsurfaceattheendofthesolderingironbit
3.2.61
turret terminal
round posttype grooved stud around which conductors are fastened before
soldering
3.2.62
wetting
flowandadhesionofaliquidtoasolidsurface,characterizedbysmooth,even
edgesandlowcontactangle
3.2.63
wicking
flowofmoltensolderorcleaningsolutionbycapillaryaction
NOTE
3.2.64
Occurs when joining stranded wire; solder is

drawn within the strands, but normally not
visibleonoutersurfaceofstrands.Wickingcan
also occur within the stress relief bend of a
componentlead.
wire
singlemetallicconductorofsolid,orstranded,construction,designedtocarry
current in an electric circuit, but which does not have a metallic covering,
sheathorshield
NOTE
For this standard, wire refers to insulated

electricwire.
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ECSSQST7008C
6March2009
3.3
Abbreviated terms
ForthepurposeofthisStandard,theabbreviatedtermsfromECSSSST0001
andthefollowingapply:
Abbreviation
Meaning
AWG
Americanwiregauge
ETFE
ethylenetetrafluoroethylene
ESD
electrostaticdischarge
FEP
fluorinatedethylenepropylene
INH1
IEC6119013(2002)fluxdesignation:inorganic,high
activation(>2%halide)
PCB
printedcircuitboard
PSD
powerspectraldensity
PTFE
polytetrafluoroethylene
RF
radiofrequency
Rg
resistancetoground
R s
surfaceresistance
ROH1
IEC6119013(2002)fluxdesignation:rosin,highactivation
(2%halide)
ROL0
IEC6119013(2002)fluxdesignation:rosin,verylow
activation(<0,01%halide)
ROL1
IEC6119013(2002)fluxdesignation:rosin,lowactivation
(<0,15%halide)
r.m.s.
rootmeansquare
SMT
surfacemounttechnology
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ECSSQST7008C
6March2009
4
Principles of reliable soldered connections
The following are the general principles to ensure reliable manuallysoldered
connections:
Reliable soldered connections are achieved by using proper design,

having control of tools,selecting the right materials, applying processes
with precaution in a controlled work environment and taking into
accountinspectionrequirements.
The basic design concepts to ensure reliable connections and to avoid

solderjointfailureareasfollows:
Stress relief is an inherent part of the design, which reduces

detrimental thermal and mechanical stresses on the solder
connections.
Where adequate stress relief is not possible, a method of solder

jointreinforcementisincorporated.
Materialsareselectedsuchthatthemismatchofthermalexpansion
coefficients is a minimum at the constraint points in the
componentmountingconfiguration.
Materials and processes which result in the formation of brittle

intermetallics, such as soldering to gold using tinlead alloy, are
avoided.
Theassembledsubstratesaredesignedtoallowinspection.
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ECSSQST7008C
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5
Preparatory conditions
5.1
5.2
Calibration
a.
Calibration status of tools and inspection equipments shall be verified

accordingtoclause14.4.
b.
Records of the calibration and verification of the tools and inspection

equipmentsshallbemaintained.
Facility cleanliness
a.
Personnelfacilitiesshallbeseparatedfromthesolderingareas.
NOTE
b.
Furnitureshallbearrangedtoallowthoroughcleaningofthefloor.
c.
Areasusedforsolderingshallbekeptfreefromcontaminants.
NOTE
5.3
Example: Washrooms, eating areas, smoking

facilities.
Loose material such as dirt, dust, solder

particles, oil or clipped wires can contaminate
solderedconnections.
d.
Working areas shall be kept free from any tools or equipment not used
forthecurrenttask.
e.
Working surfaces shall be covered with an easilycleaned hard top or

haveareplaceablesurfaceofclean,noncorrosive,siliconefreepaper.
f.
Tools used during soldering operations shall be free of visible

contaminant.
g.
Excesslubricantsshallberemovedfromtoolsbeforesolderingstarts.
Environmental conditions
a.
Thesolderingareashallhaveacontrolledenvironmenttolimittheentry
ofcontaminants.
NOTE
Itisgoodpracticetosolderinacleanroom(see
ISO146441).
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ECSSQST7008C
6March2009
5.4
5.5
b.
Areas used for assembly or cleaning of parts and areas where toxic or
volatile vapours are generated or released shall include a local air
extractionsystem.
c.
Theroomtemperatureofthefacilityshallbemaintainedat22C3C.
d.
The relative humidity at room temperature of the facility shall be

maintainedat55%15%.
e.
Thesolderingareashallnotbeexposedtodraughts.
f.
Airshallbesuppliedtotheroomthroughafilteringsystemthatprovides
apositivepressuredifferencewithrespecttoadjacentrooms.
Lighting requirements
a.
Lightingintensityshallbeaminimumof1080luxontheworksurface.
b.
At least 90 % of the work area shall be without shadows or severe

reflections.
Precautions against static discharges

5.5.1
General
a.
An ESD Control Program in accordance with EN 6134051 and EN

6134052shallbedevelopedandimplementedbythesupplier.
b.
Electrostaticsensitivecomponentsshallbeprepared,mounted,soldered
andcleanedinanESDprotectedarea.
c.
Electrostatic sensitive components shall be kept as shipped (e.g.in anti

statictubesorfoam)untilassemblypreparation.
d.
ContainersforESDsensitivecomponentsshallbesolabelled.
5.5.2
Precautions against ESD during

manufacturing
a.
The working bench shall have a static dissipative top with surface
resistance(Rs)intherange1104to11010.
b.
The working bench shall have a static dissipative top resistance to ESD
protectedareaground(Rg)intherange7,5105to1109.
c.
AwriststraphavingaresistancetoESDprotectedareaground(Rg)inthe
range7,5105to3,5107shallbewornbytheoperator.
d.
Seating shall have static dissipative surfaces with resistance to ESD

protectedareaground(Rg)lessthan11010.
NOTE
These measures prevent the buildup of static

charges and avoid potential differences by
keepingpersonnel,equipmentanddeviceleads
atthesameelectricalpotential,i.e.ground.
25
ECSSQST7008C
6March2009
e.
Poweredequipmentattheworkstationshallbegrounded.
NOTE
Thenormalvalueoftheresistancebetweenthe
tip of the soldering system and the ground of
the ESD protected area does not exceed 5 .
The measurement is generally performed at
solderingtemperature.
f.
Agroundfaultcircuitinterruptershallbeinstalled.
g.
Protectiveclothingshallbemadefromstaticdissipativematerial.
h.
Glovesandfingercotsshallbemadefromstaticdissipativematerial.
NOTE
i.
Tools, such as mounting aids, and

consumables, masking tape,are expected to be
conductiveorstaticdissipative.
Paperwork accompanying ESD sensitive components shall be contained

instaticdissipativebagsorenvelopes.
NOTE
Example of accompanying paperwork are

travellerlogs,drawingsandinstructions.
j.
PaperworkshallnotcomeintocontactwithESDsensitivecomponents.
k.
IonisedairinpresenceofhighvoltageorRFshallnotbeused.
NOTE
5.5.3
Static charges on isolated parts or tooling can

bedissipatedusingionisedair.
Protective Packaging and ESD Protection
a.
All ESDsensitive items shall be contained within ESDprotective

containersformovementbetweenandwithinESDprotectedareas.
b.
ESDprotectivepackagingshalldisplayESDwarningsigns.
c.
IfthepackagingisnotESDsafe,itshallbelabelledaccordingly.
NOTE
The objective of ESD protection is to prevent

ESD to the item contained within, to allow for
dissipation of charge, and to prevent charging
of the ESDS item by an external electrostatic
field.
d.
A container shall provide for mechanical and ESD protection whenever

the ESDsensitive electronic assembly is transported within a
manufacturingplantorduringshipmenttoexternaldestinations.
e.
Thecontainershallprovide:
1.
anoutershellthatprovidesadequatemechanicalprotectionforthe
contents;
2.
foam or bubble wrap shock absorbing liners that have static

shieldingcovers;
3.
ashieldingpackagefortheESDsensitivecontents.
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ECSSQST7008C
6March2009
f.
PinkPolyethylene(pinkpoly)bags,film,bubblewraporfoamnearany
ESDsensitiveitemorwithinanESDprotectedareashallnotbeused.
NOTE
5.5.4
a.
5.6
Pinkpolyethylene provides little protection

against ESD events and voltage fields and is a
contaminationsource.Thepreferredalternative
isthemetallizedstaticshieldingbag.
Packing and filler materials
Shipping popcorn, foam liners and polystyrene foam shall not be used
nearESDsensitiveitemsunlessshieldingoverwrapprotectsthem.
Equipment and tools

5.6.1
a.
General
Newequipmentsandtoolsshallbeinspectedtoensurethattheyarenot
defectivepriortouse.
5.6.2
Brushes
a.
Mediumstiffnaturalorsyntheticbristle,ESDsafe,brushesshallbeused
forcleaningprovidedthattheydonotdamageanysurfacetobecleaned
oradjacentmaterials.
b.
Brushesshallbecleanedinasolventinaccordancewithclause6.4.
c.
BrushesshallnotbedamagedbythesolventsusedforPCBcleaning.
d.
Wirebrushesshallnotbeused.
5.6.3
Cutters and pliers
a.
CuttingedgeprofilesandcutterusageshallbeinaccordancewithFigure51.
b.
Thecutterusedfortrimmingconductorwireandcomponentleadsshall
shearsharply,producingaclean,flat,smoothcutsurfacealongtheentire
cuttingedge.
NOTE1 These measures minimize the transmission of
mechanicalandshockloadstodelicateparts.
NOTE2 Smooth, longnose pliers or tweezers can be
usedforattachingorremovingconductorwires
andcomponentleads.
c.
Notwistingactionshalloccurduringthecuttingoperation.
d.
Cutting edges shall be checked for damage and maintained in a sharp

condition.
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ECSSQST7008C
6March2009
Cutter
Lead cut correctly
Lead cut incorrectly
Using correctly profiled cutters
Incorrect lead cutting using incorrectly profiled cutters
Figure51:Profilesofcorrectandincorrectcuttersfortrimmingleads
5.6.4
Bending tools
a.
Bare component leads shall be bent or shaped using tools, including

automaticbendingtools,whichdonotcut,nickordamagetheleadsor
insulation.
b.
Components shall not be damaged by the bending process (see also

clause8.2).
NOTE
c.
Bending tools shall haveno sharp edges in contactwith the component

leads.
5.6.5
a.
It is good practice to use bending tools with

polishedfinish.Thepreferredsurfacefinishfor
shapingtoolsishardchromiumplating.
Clinching tools
Clinching tools shall not damage the surfaces of printedcircuit

conductors,componentsorcomponentleads.
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ECSSQST7008C
6March2009
5.6.6
Insulation strippers
5.6.6.1
Thermal strippers
a.
Thetemperatureofthestrippershallnotburn,blisterorcauseexcessive
meltingoftheinsulation.
NOTE1 Thermal insulation strippers can be used for
wireinsulationtypessusceptibletodamageby
mechanicalstrippers.
NOTE2 Itisgoodpracticetoapplythermalstrippersfor
usewithAWG22andsmallerwiresizeswhere
there is a possibility of the wire stretching if a
mechanicalstripperisused.
NOTE3 Local air extraction units can be used during
thermalstripping.
5.6.6.2
a.
Precision mechanical cutting-type strippers
Mechanicalstrippersshallbeofthefollowingtypes:
1.
Automatic powerdriven strippers with precision, factoryset,

cuttingandstrippingdiesandwireguards,or
2.
Precisiontype hand strippers with accurately machined and

factorypresetcuttingheads.
NOTE
b.
of
Strippingtoolsormachinesshallfitthesizeofthewireconductor.
NOTE
c.
Figure 52 shows some examples

unacceptablemechanicalstrippers.
Itisgoodpracticetomaskoffthedieopenings
forwiresizesnotinuse.
The conductor shall not be twisted, ringed, nicked, cut orscoredby the
process.
Figure52Examplesofnonapprovedtypesofmechanicalstrippers
29
ECSSQST7008C
6March2009
5.6.6.3
a.
Enamel stripping
Theenamelshallberemovedbychemicalorthermalmeans.
NOTE
b.
Theenamelmayberemovedbymechanicalmeansprovidedthatvisual
inspectionusingaminimummagnificationofx40iscarriedouttoensure
thattheconductorisundamaged.
5.6.6.4
a.
Seealso6.7d.
Verification of stripping tools
Thermalandmechanicalstrippingtoolsshallbeverifiedbysamplingat
thestartofeachproductionrun.
5.6.7
Soldering irons and resistance soldering

equipment
a.
The size and shape of the soldering iron and bit shall not damage
adjacentareasorconnectionsduringsolderingoperations.
b.
Temperaturecontrolledsolderingironsshallbeused.
NOTE
It is good practice to verify periodically the

soldertiptemperature.
c.
Filesshallnotbeusedfordressingplatedcoppersolderingirontips.
d.
A selection of bit sizes and shapes appropriate to each soldering

operationenvisagedshallbeavailable.
e.
Thesolderingironorresistanceheatingelectrodeshallheatthejointarea
to the solder liquidus temperature in a time between 1 second and 2
seconds.
f.
The soldering iron or resistanceheating electrode shall maintain the

solderingtemperatureatthejointthroughoutthesolderingoperation.
g.
Thermal shunts (see 5.6.8.3) shall be used to protect thermallysensitive

components.
h.
For soldering of electronic components, the solderingbit temperature

shallbebetween280Cand350C.
i.
Asolderingbittemperaturelowerthan280Cmaybeused.
j.
A solderingbit temperature up to 380 C may be used for polyimide

PCBswithheatsinks,widetracksorgroundplanes.
k.
A soldering bit temperature up to 360 C may be used for PCBs other

thanpolyimidewithheatsinks,widetracksorgroundplanes.
l.
Asolderingironholdershallbeused.
NOTE
Itisgoodpracticetouseacagetypeholderthat
leavesthesolderingirontipunsupportedwhen
atemperaturecontrolledsolderingironisused.
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ECSSQST7008C
6March2009
5.6.8
Soldering tools
5.6.8.1
General
a.
Theleadsshallnotbedamagedduringpreparationandassembly.
5.6.8.2
a.
Holding tools used as soldering aids shall not be wetted by the solder
duringtheassembly.
5.6.8.3
a.
Holding tools
Thermal shunts
Thermal shunts shall be used for the degolding, pretinning and

solderingoftemperaturesensitivecomponents.
NOTE
An effective clamptype thermal shunt can be

constructedbysweatingsmallcopperbarsinto
thejawsofanalligatorclip.
b.
The heat sink shall be used when the nonthermal sensitivity of the
devicecannotbedemonstrated.
c.
The thermal shunt shall not disturb the solder joint by mechanical
interference.
d.
Shunts shall be applied and removed without mechanically damaging

thecomponentortheassembly.
NOTE
5.6.8.4
a.
Shunts can be held in place by friction, spring

tension, or any other means that does not
damagethefinishorinsulation.
Anti-wicking tools
The conductor gauge sizes of the antiwicking tools shall be marked on

thetool.
NOTE
Antiwicking tools can be used for pretinning

thestrandedwires.
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6
Materials selection
6.1
General
a.
MaterialselectionshallbeperformedinaccordancewithECSSQST7071.
b.
Components, subassemblies, assemblies and hardware for space flight

applicationsshallnothavetinfinishescontainingmorethan97%tin.
c.
Electrical/electroniccomponentsidentifiedashavingplatedormetallized
externalsurfaceswithatinfinishcontainingmorethan97%tinmaybe
pretinnedwithatinleadsolderinaccordancewith6.2.2b.
NOTE
d.
Pretinningshallnotdegradeordamagethecomponent.
NOTE
6.2
Tin whisker mitigation (barrier methods such

as coating or sleeving) is addressed in the
frameworkofanNRBorApprovalAuthority.
Seealso6.1c.
e.
Subassemblies, assemblies and mounting hardware identified as having

leadfreesurfaces(platedormetallised)shallbeprotectedbyprocessor
design to prevent metallic whisker formation in the expected enduse
application/environment.
f.
Operations carried out during degolding or pretinning shall not

contravenetheindividualdetailedspecificationforthecomponent,PCB
andterminations.
Solder
6.2.1
Form
a.
Forsoldering,ribbon,wireandpreformsshallbeusedprovidedthatthe
alloyandfluxmeettherequirementsofthisstandard.
b.
For degolding and pretinning, solder alloys shall be supplied as ingots

(withoutflux).
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ECSSQST7008C
6March2009
6.2.2
a.
Composition
ThesolderalloyshallhaveacompositionspecifiedinTable61.
NOTE1 SeeISO9453forfurtherdetails.
NOTE2 The solder alloy used depends on the
application.SeeAnnexTableB1forguidelines
forthechoiceofsoldertype.
b.
Thesolderalloyusedfordegoldingandpretinningshallbe60tinsolder,
62tinsilverloadedor63tinsolder.
Table61:Chemicalcompositionofspacecraftsolders
Ag
Sn
Pb
In
Sb
Bi
Cu
Fe
Zn
Al
As
Cd
Other
minmax
max
minmax
max
min
max
max
max
max
max
max
max
max
max
63tinsolder
62,563,5
Rem.
0,05
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
62tinsilverloaded
61,562,5
Rem.
0,05
1,82,2
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
60tinsolder
59,561,5
Rem.
0,05
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
96tinsolder
Rem.
0,10
0,05
3,54,0
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
9,010,5
Rem.
0,05
0,10
0,05
0,02
0,001
0,001
0,03
0,002
0,08
ESAdesignation
10tinlead
6.3
Flux
6.3.1
a.
Rosin-based fluxes
FluxesshallbeselectedinaccordancewithTable62.
NOTE
The preferred flux standard is IEC 6119013

(2002).
b.
For the pretinning of component leads, metallised terminations and

terminal posts mildlyactivated, rosinbased fluxes (e.g. ROL1) shall be
used.
c.
When pretinning with mildly activated rosinbased flux does not give
acceptablewetting,fullyactivatedrosinbasedfluxes(e.g.ROH1)maybe
used.
NOTE
d.
When pretinning with fully activated rosinbased flux does not give
acceptablewetting,INH1corrosive,watersoluble,acidfluxmaybeused
inaccordancewithclause6.3.2.
NOTE
e.
ROH1 flux is extremely aggressive and can

cause corrosion and damage to electronic
materials.
Difficulties in pretinning can arise from poor

solderability.
Forassemblythefollowingfluxesshallbeselected:
1.
Fornormalassembly,usepurerosinflux.
33
ECSSQST7008C
6March2009
NOTE
2.
Whenmildlyactivatedrosinfluxisused,monitortheeffectiveness
ofsubsequentcleaningoperationsinaccordancewithclause11.3.
NOTE
f.
Example:PurerosinfluxROL0.
Example:MildlyactivatedrosinfluxROL1.
Fully activated rosinbased fluxes shall be stored separately from pure

rosinfluxesandmildlyactivatedrosinfluxes.
NOTE
Example:FullyactivatedrosinfluxROH1.
Table62:Fluxes
IEC6119013
(2002)
designation
Equivalent
designationfrom
ISO29454(1994)
Nature
Nominal
composition
(Weight%)
Pretinning
Normalwetting
ROL1
1.1.2.WorX
Rosin
<0,15%halide
Difficult
wetting
ROH1
1.1.2.Z
Rosin
2,0%halide
InorganicWater
soluble
>2,0%halide
Verydifficult
wetting
INH1
Assembly
Preferred
ROL0
1.1.1
Rosin
<0,01%halide
Requiring
cleanliness
testing
ROL1
1.1.2.WorX
Rosin
<0,15%halide
6.3.2
INH1 corrosive acid flux
a.
INH1fluxresiduesshallberemovedimmediatelyafteruseinaccordance
withclause11,beforeanyfurthersolderingoperations.
b.
This flux shall not be used where vapours or residues of spattered flux
cancomeintocontactwithelectricalinsulationmaterial.
c.
INH1fluxshallbestoredseparatelyfrompurerosinfluxesandmildly
activatedrosinfluxes.
NOTE
6.3.3
a.
INH1 flux leaves residues that promote stress

corrosion cracking and general surface
corrosion.
Application of flux
The quantity of flux used shall be such that the solder joint is in
accordancewithclause12.
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ECSSQST7008C
6March2009
6.4
b.
When fluxcored solder isused, it shallbe positioned such that the flux
flowsandcoversthecomponentstobejoinedasthesoldermelts.
c.
When an external liquid flux is used in conjunction with fluxcored

solders,thefluxesshallbecompatible.
d.
Whenexternalfluxisused,liquidfluxshallbeappliedtothesurfacesto
bejoinedpriortotheapplicationofheat.
Solvents
a.
Solventsfortheremovalofgrease,oil,dirt,fluxandfluxresiduesshallbe
electricallynonconductiveandnoncorrosive.
b.
Solventsshallnotdissolveordegradethequalityofpartsormaterials.
c.
Solventsshallnotremovecomponentidentificationmarkings.
d.
Solventsshallbelabelled.
e.
Solventsshallbemaintainedinanuncontaminatedcondition.
f.
Solvents showing visual evidence of contamination or decomposition

shallnotbeused.
g.
Solventsshallnotbeusedsuchthatdissolvedfluxresiduecontaminates
electricalcontactsurfaces.
NOTE
h.
6.5
Examplesofelectricalcontactsurfacesarethose
inswitches,potentiometersorconnectors.
Thefollowingsolventsshallbeusedforcleaninginsolderingoperations:
1.
ethylalcohol,99,5%pureor95%purebyvolume,
2.
isopropylalcohol,99%pure,
3.
deionized water at a maximum temperature of 40 C is used for

removingcertainfluxesprovidedthattheassemblyisthoroughly
drieddirectlyaftercleaning,
4.
anymixtureof6.4h.1to3.
i.
Other solvents that pass a compatibility test programme agreed by the

Approvalauthoritymaybeused.
j.
Waterbasedsolventscontainingsaponifiersshallnotbeused.
k.
Solventsshallbeselectedsuchthattheydrycompletely.
Flexible insulation materials

a.
MaterialsshallhavelowoutgassingpropertiesinaccordancewithECSS
QST7002.
b.
The following flexible insulation materials may be used in a space

environment:
1.
ETFE,FEPandPTFE.
35
ECSSQST7008C
6March2009
c.
2.
Polyolefin and Kynar sleeving for heatshrinkable wire

terminations.
3.
Irradiatedpolyethylene,fluorinatedresinandpolyimide.
PTFEmaterialsshallnotbeheatedabove250C.
NOTE
6.6
Poisonous gases can be liberated above this

temperature.
Terminals
6.6.1
a.
Materials
Terminalsshallbemadefromoneofthefollowingmaterials:
1.
Bronze(copper/tin)alloys.
NOTE
2.
b.
Itisgoodpracticetousebronzeterminals.
Brass(copper/zinc)alloys.
When a brass terminal is used it shall be plated with a barrier layer of

copperornickelof3mto10m.
NOTE1 A barrier layer is necessary on brass items to
prevent the diffusion, and subsequent surface
oxidation,ofzinc.
NOTE2 Itisgoodpracticetouseacopperbarrierlayer
on brass terminals because nickel is magnetic
andcanhaveapoorsolderability.
c.
Terminalsshallbetin/leadcoatedwithanalloycontainingamaximumof
97%tin.
NOTE
d.
Example: Hotdipped or reflowed electro

depositedcoatings.
Terminalswithcoatingsonthemountingsurfaceshallberejectedifthe
coatingslooseninsubsequentsolderingoperations.
6.6.2
Tin-, silver- and gold-plated terminals
a.
TerminalsonPCBsshallnotbetin,silverorgoldplated.
b.
Tin, silver or goldplated finishes shall be replaced using one of the

methodsdescribedinclause7.2.
6.6.3
a.
Shape of terminals
Bifurcatedandturretterminalsshallhaveledgesorgroovestoallowboth
theaccuratelocationofconnectingwiresandtheflowofsolder.
36
ECSSQST7008C
6March2009
6.7
6.8
Wires
a.
Wireshallbemadefromhighpuritycopperorcopperalloy.
b.
Thewireshallhaveoneofthefollowingfinishes:
Silvercoating.
Wiredrawn,fusedpuretin.
Enamelled.
c.
Wiresshallbestrippedoftheirinsulationinaccordancewithclause7.2.1.
d.
When stripping the ends of enamel wires the complete removal of the
enamelshallbeverifiedbyvisualinspection.
e.
Chemical stripping materials shall be completely neutralised and be

cleanedsuchthattherearenoresiduesfromthestripping,neutralizing,
orcleaningsteps.
f.
Theenamelshallnotbevisuallycontaminatedbythestrippingprocess.
PCBs
6.8.1
Boards
a.
Boards shall be made of materials, and manufactured, according to the

requirementsofECSSQST7010andprocuredaccordingtoECSSQST
7011.
b.
For nonplatedthrough holes, interfacial connections shall be made

accordingtoclause8.2.2.
6.8.2
Gold finish on conductors
a.
Goldplatedconductorsshallnotbesoldered.
b.
Degoldingofconductorsshallbeinaccordancewithclause7.2.3.
NOTE
6.9
RF circuits with gold finishes can have their

terminalpadsselectivelyplatedwithatinlead
finish,seeECSSQST7011.
Component lead finishes

a.
Component lead finishes shall conform to the requirements of ESCC

23500.
NOTE
ESCC 23500 is only applicable for procured

components and the preassembly operations
as degolding and pretinning are out of its
scope.
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ECSSQST7008C
6March2009
6.10 Adhesives (staking compounds and heat sinking),

encapsulants and conformal coatings
a.
Limitedshelflifeitemsshallbestoredandcontrolledinaccordancewith
thematerialmanufacturersrecommendationsorinaccordancewiththe
manufacturers documented procedures for controlling shelf life and
shelflifeextensionswherepermitted.
b.
Adhesives shall be dispensable, nonstringing, and have a reproducible

dotprofileafterapplication.
c.
Theuncured(tack)strengthshallbecapableofholdingdevicesinplace
duringhandlingpriortocure.
d.
Adhesives, encapsulants and conformal coatings shall be noncorrosive

todevicesandsubstrates.
e.
No materials that emit acetic acid, ammonia, amines, hydrochloric acid

andotheracidsshallbeused.
NOTE
f.
Such compounds can cause stresscorrosion

crackingofpartleads.
The adhesives, encapsulants and conformal coatings used shall not

damagesubstratematerialsorattacheddevices.
NOTE1 The effects of some conformal coatings on the
reliability of solder joints are described in ESA
SP1173.
NOTE2 Adhesiontofusedtinleadfinishesispoor,see
alsoECSSQST7028.
g.
Adhesives, encapsulants and conformal coatings shall conform with the

outgassingrequirementsofECSSQST7002,clause7.
h.
Shrinkage of resin during cure and repair shall not degrade the coated
articles.
i.
Materials covered by this clause shall be individually assessed in

accordance with ECSSQST7071, clause 5.2.7 when flammability
requirementsareapplicable.
j.
Adhesives,encapsulantsandconformalcoatingsshallbeselectedonthe
basisoftheirthermalconductivityanddielectricproperties.
NOTE
k.
Some thermally conductive adhesives used to

dissipateJouleheatingarelistedinESASTM265.
Stress relief of device leads shall not be reduced by the encapsulant or

conformalcoating.
NOTE1
This is particularly important at low service

temperatures.
NOTE2
The coefficient of thermal expansion, glass

transitiontemperatureandmodulusofadhesives
used under devices for thermal reasons, for
achieving standoff heights or for mechanical
support during vibration, can be considered to
ensurethattheadditionalstressputonthesolder
jointsdoesnotdegradethesolderjointreliability.
38
ECSSQST7008C
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7
Preparation for soldering
7.1
General
7.1.1
a.
Operators shall use tools that are fit for the purpose and undamaged
priortouse.
7.1.2
a.
7.2
Tools
Components
The supplier shall ensure that degolding, pretinning and soldering

conditionsdonotexceedthevaluesgivenbytheindividualcomponent
datasheets.
Preparation of conductors, terminals and solder cups

7.2.1
Insulation removal
7.2.1.1
Stripping tools
a.
Strippingtoolsormachinesshallbeinaccordancewithclause5.6.6.
7.2.1.2
Damage to insulation
a.
The remaining conductor insulation shall not be damaged by the

insulationremovalprocess.
b.
Conductorswithdamagedinsulationshallnotbeused.
NOTE1 Example: Insulation damage includes nicks,
cuts,crushingandcharring.
NOTE2 Theoperationofmechanicalstrippingtoolscan
leaveslightpressuremarkingsintheremaining
conductor insulation. This effect is considered
tobenormal.
c.
Theinsulationmaterialshallnotbecharredbythermalstripping.
NOTE
Discoloration of the insulation material after

thermalstrippingisnormal.
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ECSSQST7008C
6March2009
7.2.1.3
a.
Damage to conductors
Theconductorshallnotbedamagedbytheinsulationremovalprocess.
NOTE
Example:Conductordamageincludestwisting,
ringing,nicks,cutsorscores.
b.
Part leads and other conductors that are reduced in crosssectional area
bytheinsulationremovalprocessshallnotbeused.
c.
Coatedwireswherethebasematerialisexposedshallnotbeused.
7.2.1.4
Insulation clearance
7.2.1.4.1
Maximum clearance
a.
Themaximuminsulationclearance,measuredfromthesolderjoint,shall
beasstatedinTable71.
b.
In the case of the assembly of coil winding wires, maximum insulation

clearances may be exceeded provided that electrical clearances are
maintained.
7.2.1.4.2
a.
Minimum clearance
For PTFEinsulated wire, the minimum distance between the insulation

andthesolderfilletshallbe1mm.
NOTE
The minimum clearance distance for PTFE

insulationaccommodatescoldflow.
b.
The minimum insulation clearance shall not result in insulation

imbeddedinthesolderjoint.
c.
The minimum insulation clearance shall not obscure the contour of the
conductorattheterminationendoftheinsulation.
Table71:Clearancesforinsulation
Wirediameter
(AmericanWireGauge)
Conductordiameter,d
(mm)
Insulationclearance
(maximum)
32to24
0,200to0,510
4d
22to12
0,636to2,030
3d
10
2,565
2d
7.2.2
Surfaces to be soldered
7.2.2.1
Cleaning
a.
Beforeassembly,devices,wire,terminalandconnectorcontactsshallbe
visuallyexaminedforcleanliness,absenceofoilfilmsandfreedomfrom
tarnishorcorrosion.
40
ECSSQST7008C
6March2009
b.
Conducting surfaces to be soldered shall be cleaned using solvents

specifiedinclause6.4.
c.
Abrasivesshallnotbeusedforsurfacepreparationexceptinthecaseof
goldplating on substrates and devices in accordance with clause
7.2.3.2.1.
NOTE
7.2.2.2
Abrasives can include pumice, pumice

impregnatederasersandemerypaper.
Wire lay
a.
Disturbed lay in strandedwire conductors shall be restored before

soldering.
b.
Restorationofthelayshallbedonewithoutcontaminatingtheconductor.
7.2.2.3
Terminals and solder cups
a.
Terminals and solder cup sizes shall be selected to match the size of
conductorsinaccordancewiththemanufacturersdatasheet.
b.
Thesizeofterminalsorsoldercupsshallnotbemodified.
7.2.3
De-golding of gold-plated leads and

terminals
7.2.3.1
General
a.
Tinleadalloysoldersshallnotbeusedtosoldertogold.
7.2.3.2
Methods for degolding
7.2.3.2.1
Removal of gold from PCB conductors by mechanical

abrasion
a.
RemovalofgoldfromPCBconductorsbymechanicalabrasionshallnot
beusedforremovinggoldplatinggreaterthan1mthick.
b.
Thegoldplatingshallberemovedusingapumiceimpregnatederaser.
c.
damagethesubstratematerials.
d.
impairthesolderabilityoftheconductor.
e.
reducethethicknessofthecopperconductor.
NOTE
ItisgoodpracticetodesignPCBswithselective
plating to avoid the necessity to remove gold
plating,seeclause6.8.2.
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ECSSQST7008C
6March2009
7.2.3.2.2
Solder baths
a.
Solder baths used for degolding and pretinning shall be in accordance

withTable72.
b.
Surfaceimpuritiesshallberemovedfromthebathsurfacebeforeuse.
c.
A controlled method shall be established and implemented for the

replacementofsolderbaths,basedoneither:
1.
Contamination: Replace the solder bath alloy when the

contaminationlimitsgiveninTable72areexceeded,or
2.
Time: Establish a schedule of solderbath replacement with

justificationofthereplacementfrequency.
d.
Goldplated component leads and terminals shall be dipped into solder

bath1forbetween2secondsand3seconds.
e.
Theleadsshallbepretinnedinbath2inaccordancewithclause7.2.6.
f.
Thecomponentleadsshallbeallowedtocoolbeforecleaning.
7.2.3.2.3
a.
Solder cup method: to dissolve the gold plating
Soldershallbemeltedwithinthegoldplatedsoldercup.
NOTE
b.
Theliquidsolderdissolvesthegoldplating.
Theliquidsoldershallbewickedoutusingstrandedwire.
7.2.3.2.4
Solder iron method
a.
Soldershallbemeltedontotheconductorusingaheatedsolderingiron.
b.
Soldershallbewickedoutusingstrandedwire.
Table72:Solderbathsfordegoldingandpretinning
Use
Temperaturerange
(C)
Contaminationlimits
(weight%)
7.2.4
Solderbath1
Solderbath2
Golddissolution
Pretinning
250to280
210to280
Au<1
Cu<0,25;Au<0,2;(Cu+Au)<0,3;
Zn,AlandFe:Trace.
Constraints on degolding and pretinning

methods
a.
The maximum soldering rating of the component, stated by the

manufacturer,shallnotbeexceeded.
b.
Thermalshunts,inaccordancewithclause5.6.8.3,maybeused.
c.
Components having glasstometal lead seals shall be preformed

accordingtoclause5.6.4beforepretinning.
42
ECSSQST7008C
6March2009
d.
Liquidsoldershallnotcomeintocontactwiththecomponentbodyorits
glassmeniscus.
e.
The limit of the pretinned coating shall not be less than 0,75 mm from
anyleadtoglasssealofthecomponentpackage.
7.2.5
Pretinning of stranded wires
7.2.5.1
Solder baths
a.
Solderbathsforpretinningshallbeinaccordancewithclause7.2.3.
b.
Stranded wires may also be pretinned by applying solder to the wire

usingaheatedsolderingirontip.
7.2.5.2
Solder bath method
a.
Theinsulationshallberemovedinaccordancewithclause7.2.1.
b.
Purerosinfluxshallbeappliedtotheendofthestrands.
c.
Thefluxedendofthewireshallbedippedintosolderbath2foratime
between2secondsand3seconds.
NOTE
7.2.5.3
Pretinningpromotessolderabilityandprevents
untwistingorseparationstrandedwires.
Constraints on pretinning of stranded wires
a.
Soldershallpenetratetotheinnerstrandsofstrandedwire.
b.
Solder shall not obscure the wire contour at the termination end of the
insulation.
c.
Antiwickingtoolsinaccordancewithclause5.6.8.4maybeused.
d.
Pretinningshallnotdegradethecharacteristicsofthewire.
NOTE
Flowofsolder(wicking)beyondtheinsulation
canreducetheflexibilityofthewire.
e.
Theinsulationshallnotbedamagedbythepretinning.
f.
Fluxshallberemovedbymeansofacleaningsolvent,seeclause6.4.
g.
Cleaningsolventshallnotflowundertheconductorinsulation.
NOTE
Applicationusingalintfreeclothcanlimitthe
flowofsolvent.
43
ECSSQST7008C
6March2009
7.2.6
Pre-tinning of component leads and solidwire conductors
7.2.6.1
Solder bath method:
a.
Solderbathsforpretinningshallbeinaccordancewithclause7.2.3.
b.
1. Componentleadswithunacceptablesolderabilityinaccordancewith
the component procurement specification and solid wires shall be pre
tinnedbydippingintosolderbath2(seeTable72)foraperiodbetween
2secondsand8seconds.
NOTE1 It is good practice to observe an immersion
periodofbetween3secondsand4seconds.
NOTE2 Aslow,verticalandsmoothwithdrawalofthe
component lead from the bath promotes an
evencoating.
c.
The crosssectional area of conductors shall not reduce by dissolution

intothesolderbath.
d.
Thecomponentshallcoolbeforecleaning.
NOTE
7.2.6.2
a.
7.3
Rapidcoolingbycontactwithcleaningsolvents
cancrackpackagesorglasstometalseals.
Soldering-iron method:
Soldershallbemeltedontotheconductorusingaheatedsolderingiron.
Preparation of the soldering bit

7.3.1
a.
Thebitshallbefittedinaccordancewiththeequipmentmanufacturers
specification.
7.3.2
a.
Fit
Maintenance
Oxidationproductsshallberemovedfromthebit.
NOTE
b.
Build up of oxidation products can reduce the

abilityofthetiptotransferheat.
Platedtipsshallbeexaminedforcracking.
NOTE
Cracked platings allow the liquid solder to

alloy with and erode the underlying copper,
forming intermetallics which reduce heat
transferandleadtounacceptablejoints.
c.
Prior to examination, solder obscuring the surface shall be removed

when the iron is hot by wiping the bit with moist, lintfree, sponge
material.
d.
Bitswithcrackedplatingsshallberemovedfromthesolderingarea.
44
ECSSQST7008C
6March2009
7.3.3
Plated bits
a.
Depositsshallberemovedusingamoistsponge.
b.
Adherentdepositsmayberemovedusingfineabrasivepaper(grainsize
600).
NOTE
7.3.4
a.
Tip in operation
The working surface of the tip shall be pretinned in accordance with

clause7.2.6.
NOTE
7.4
7.6
Pretinningpreventsoxidationofthebit.
Maintenance of resistance-type soldering electrodes

a.
7.5
The use of a file to remove the deposits is

forbidden.
The surfaces of electrodes shall be kept free of contamination or

corrosion.
Handling (work station)

a.
ESDsensitive components shall be handled in accordance with clause

5.5.
b.
Metal surfaces to be soldered that show visible evidence of

contaminationshallbecleanedwithasolventspecifiedinclause6.4.
c.
During assembly, component leads, terminals, wire ends and PCB

terminationareasshallnotbetouchedwithbarehands.
d.
After final cleaning, personnel working with PCBs shall wear lintfree
glovesorfingercots.
Storage (work station)

7.6.1
Components
a.
Storage facilities shall protect components from contamination and

damage.
b.
Storageboxesandbagsshallbemadeofmaterialswhichdonotdegrade
thesolderabilityofthecomponents.
c.
Storagematerialsshallnotcontainamines,amides,silicones,sulphuror
polysulphides.
d.
Packaging and containers for ESDsensitive devices shall be in

accordancewithclause5.5.
45
ECSSQST7008C
6March2009
7.6.2
a.
PCBs
PCBsshallbestoredinaccordancewithECSSQST7011,clause7.1.
7.6.3
Materials requiring segregation
a.
Soldersnotinaccordancewithclause6.2shallberemovedfromthework
area.
b.
Activatedfluxesshallbestoredinaccordancewithclause6.3.1f.
NOTE
c.
Corrosiveacidfluxesshallbestoredinaccordancewithclause6.3.2c.
NOTE
d.
Example:INH1flux.
Solvents that do not conform to clause 6.4 shall be removed from the
workarea.
NOTE
7.7
Example:ROH1flux.
Example:
Solvents
contaminated
impuritiessuchasinorganicacids.
with
Preparation of PCBs for soldering

7.7.1
Process
a.
PCBsshallbeCleanedusingsolventconformingtoclause6.4.
b.
PCBsshallbedemoisturizedinaccordancewithclause7.7.2.
c.
PreparedPCBsshallbestoredinaccordancewithclause7.7.3.
7.7.2
a.
Demoisturization methods
Theoventemperatureshallbebetween90Cand120C.
NOTE
b.
It is good practice to follow the PCB

manufacturersrecommendations.
Theprocesstimeshallbeaminimumof4hours.
NOTE1 Long baking periods at higher temperatures
can reduce the solderability of PCB
terminations.
NOTE2 A vacuum bake method can be selected for
temperatureslessthan90C.
7.7.3
Storage of prepared PCBs
a.
The demoisturization process shall be carried out again according to

clause 7.7.2 when prepared PCBs are stored in ambient conditions for
morethan8hourspriortosoldering.
b.
Dry nitrogen, dry air, vacuum or desiccants may be used to extend the
storageperiod.
46
ECSSQST7008C
6March2009
8
Mounting of components
8.1
General requirements
8.1.1
Introduction
a.
Componentsshallbemountedparalleltothemountingsurface.
b.
Componentsshallbemountedincontactwiththemountingsurface.
c.
Components may be mounted not more than 3,5 mm above the

mountingsurface,seeFigure81.
d.
Materials used to support components shall meet the requirements of

ECSSQST7071,clause5.
8.1.2
a.
Heavy components
Componentsweighingmorethan5gshallbesupportedbyeitherofthe
followingmethods:
1.
adhesivecompoundsinaccordancewithclause6.10,or
2.
mechanicalmethods.
NOTE
Forexample:Lacing.
b.
The support method shall not impose stresses that result in functional
degradationordamagetothepartorassembly.
c.
Thesupportmethodshallnotimpairstressreliefdesigns.
8.1.3
a.
Metal-case components
Metalcase components shall be electrically insulated using space

approvedmaterialsinaccordancewithECSSQST7071,AnnexCwhere
theymeetoneofthefollowingconditions:
1.
mountedoverprintedconductors;
2.
incontactwithanothermetalcasecomponent;
3.
incontactwithaconductivematerial.
47
ECSSQST7008C
6March2009
b.
Metalcased components shall not be mounted over soldered

connections.
c.
Componentidentificationmarksshallnotbeobscuredbytheinsulation.
NOTE
8.1.4
a.
Glass-encased components
Glassencasedpartsshallbeenclosedwithsleevingwhenepoxymaterial
isusedforstaking,conformalcoatingorencapsulating.
NOTE
b.
Epoxy material cannot be applied directly to

theglass.
Glassencased components may be enclosed in resilient transparent

sleevingorinheatshrinkablesleeving.
NOTE
8.1.5
a.
Forexampletheserialnumbers.
Heatingandshrinkageofsleevingcandamage
glassencasedcomponents.
Stress relief of components with bendable

leads
Stressreliefshallbeincorporatedinto:
1.
solderedleadsandconductors,
2.
interfacialconnections.
NOTE1 Stressreliefprovidesfreedomofmovementfor
componentleadsorconductorsbetweenpoints
ofconstraint.
NOTE2 Stresses can arise between points of constraint
due to mechanical loading or temperature
variations.
b.
Stress relief methods, shown in Figure 82, Figure 85, Figure 810 and
Figure811,shallapply.
c.
TheassemblyofTO39,TO59andCKR06packagesshallbeperformed
inaccordancewithFigure81whenassembledwithoutstressrelief.
d.
Stressreliefdesignsshallnotdamagetheassembly.
NOTE
e.
Long lead lengths or large loops between

constraint points can vibrate and damage the
assembly.
Leads shall not be temporarily constrained against springback force

duringsoldering.
NOTE
Residual stresses are produced in the lead

materialorsolderjoint.
f.
Solderfilletsshallnotimpairstressreliefbends.
g.
CKR06 and similar packages shall be adhesively staked in accordance

withFigure81.
48
ECSSQST7008C
6March2009
NOTE
h.
The use a filler (silica powder) can prevent

excessiveflowofadhesive.
TO39andTO59packagesmayhaveanunderfillasshowninFigure81.
Figure81:AssemblyofunderfilledTO39andTO59,andadhesivelystakedCKR06
8.1.6
a.
Stress relief of components with nonbendable leads
Stressreliefforcomponentswithnonbendableleadsmountedincontact
withthePCBoradhesivelybondedtothePCBshallusewireextensions,
seeFigure83.
49
ECSSQST7008C
6March2009
NOTE
b.
Bending can damage components when lead

diameters are large or components have
delicate seals or where leadmaterial
compositionmakesbendingimpracticable.
DIP devices up to DIP 24 may be assembled without additional stress

relief, provided that the tapered portions of the leads are clear of the
componentsidelandsoftheplatedthroughholes.
NOTE
Inordertoachieveacceptablestandoff,ashim
canbeused.
50
ECSSQST7008C
6March2009
SR
SR
C
(a) Clinched lead
(b) Stud-mounted lead
C
Pad
SR
C
(c) Offset lap joint
Transistor mounting pad
SR
C
Plated-through hole
(d) Stud-mounted leads

SR
C
SR
C
C
SR
C
SR
C
(e) Alternative methods
Figure82:Methodsforincorporatingstressreliefwithcomponentshaving
bendableleads
51
ECSSQST7008C
6March2009
Figure83:Methodsforattachingwireextensionstononbendableleads
8.1.7
a.
Clause6.8.1shallapplyforreinforcedplatedthroughholes.
8.1.8
a.
Reinforced plated-through holes
Lead and conductor cutting
Solderterminationsshallnotbecutafterthesolderingoperation.
NOTE
8.1.9
Componentleadsandwiresarecutandshaped
beforesoldering.
Solid hook-up wire
a.
Solidhookupwireshallbesupportedatintervalsnotexceeding30mm.
b.
Thesupportshallbeprovidedbystaking.
8.1.10
a.
Location
Component bodies shall not be located in contact with soldered or

weldedterminations.
8.1.11
Conformal coating, cementing and

encapsulation
a.
Coatingsandcementingcompoundsshallnotbridgestressreliefloopsor
bendsatterminationsincomponentleadsorconnectingwires.
b.
Stress relief of device leads shall not be impaired by encapsulants or

conformalcoatings.
52
ECSSQST7008C
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8.2
Lead bending requirements

8.2.1
General
a.
Duringbending,componentleadsshallbesupportedtoavoidaxialstress
anddamagetosealsorinternalbonds.
b.
The inside radius of a bend shall not be less than the lead diameter or
ribbonthickness.
c.
The distances between the bends and the end seals at either end of an
axialcomponentshallbesimilar.
d.
The minimum distance from the bend to the end seal shall be two lead
diametersforroundleadsand0,50mmforribbonleads.
e.
Wherethecomponentleadisweldedtheminimumdistancetothebend
shallbemeasuredfromtheweldinaccordancewithFigure84.
NOTE
f.
Example:Tantalumcapacitors.
Bendingtoolsshallnotimpingeontheweld.
Figure84:Minimumleadbend
8.2.2
Conductors terminating on both sides of a

non-plated-through hole
a.
Stressreliefshallbeprovidedinthecomponentleadonbothsidesofthe
PCBinaccordancewithFigure85(a).
b.
Whenasolidhookupwireisusedtointerconnectsolderterminationson
opposite sides of a PCB, stress relief shall be provided in the wire
betweenthetwoterminationsinaccordancewithFigure85(b).
53
ECSSQST7008C
6March2009
C
SR
C
SR
SR
(a)
(b)
Figure85:Leadswithsolderterminationonbothsides
8.3
Mounting of terminals to PCBs

a.
Swagetype terminals, designed to have the terminal shoulder soldered

to printed conductors, shall be secured to singlesided PCBs by a roll
swageinaccordancewithFigure86(a).
b.
Swagetypeterminalsthataremountedinaplatedthroughholeshallbe
secured to the PCB by an elliptical funnel swage in accordance with
Figure86(b).
NOTE
An elliptical funnel swage enables complete

fillingoftheplatedthroughholewithsolder.
c.
ThePCBshallnotbedamagedbytheswagingprocess.
d.
After swaging, the terminal shall be inspected for circumferential splits

orcracks.
e.
After swaging, the terminal shall be free from circumferential splits or

cracks.
f.
Afterswaging,theterminalmayhaveamaximumofthreeradialsplitsor
cracks, provided that the splits or cracks do not extend beyond the
swagedareaoftheterminalandareaminimumof90apart.
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Solder
Conductor
Board
Roll swage
(a) Single sided
Slight reflowed
solder fillet
Conductor
Board
Plated-through
hole
Solder
Elliptical swage
(b) Double sided
Figure86:Typesofterminalswaging
8.4
Lead attachment to PCBs

8.4.1
General
a.
Solderterminationsshallbevisibleforinspectionaftersoldering.
b.
ComponentleadsshallbeterminatedtoPCBsbyclinch,studorlapped
terminations.
8.4.2
Clinched leads
a.
Nonbendableleadsshallnotbeclinched,seealsoclause8.1.6.
b.
Clinched leads terminating at a PCB pad shall be bent to make contact

withtheprintedcircuitconductors.
c.
The clinched lead shall not extend beyond the edge of the conductor
pattern,seeFigure87andFigure88.
d.
Theleadshallnotbeforcedtolieflatatthebendradius,seeFigure87
andFigure88.
NOTE
Component leads can springback when

clinched.
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e.
Thesolderedlengthshallcomplywithclauses8.4.4and8.4.5.
f.
Roundedterminationareasshallbesuchthat:
1.
theleadextendsthroughandoverlapthesolderpad,
2.
the lead is bent in the direction of the longest dimension of the

solderpad,and
3.
theareaofthesolderpadpermitsasolderfillettobeformed.
Figure87:Clinchedleadterminationsunsupportedholes
Figure88:Clinchedleadterminationsplatedthroughholes
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8.4.3
Stud leads
a.
Forunsupportedholes,thecutstudleadsshallprotrudebeyondthePCB
surfaceby1,5mm0,8mm,seeFigure89(a).
b.
For platedthrough hole less than 2,2 mm in length, the cut stud leads
shall protrude beyond the PCB surface by 1,5 mm 0,8 mm, see Figure
89(b).
c.
Forcomponentswithshortleadsandplatedthroughholes,greaterthan
orequalto2,2mminlength,theprotrusionmaybezero,providedthat
the outline of the lead is visible, there is wetting between the lead and
padaroundtheentirecircumferenceandthereiscompletepenetrationof
soldertothecomponentside,seeFigure89(c).
d
Unsupported
hole
Functional pad,
0,4 mm min.
Plated-through
hole
Solder pad
0,4 mm min.
(1,5 0,8) mm
(a)
(b)
(1,5 0,8) mm
Zero protrusion
Acceptable
Outline of stud visible
Good wetting
Unacceptable
Outline of stud not visible
(c)
Figure89:Studterminations
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8.4.4
a.
Roundleadsshalloverlapthesolderpad:
1.
Minimum overlap: Either 3,5 times the lead diameter or 1,3 mm,
whicheveristhegreater.
2.
Maximumoverlap:5,5timestheleaddiameter.
b.
The distance from the cut end of the lead to the edge of the solder pad
shallbemorethan0,5timestheleaddiameter.
c.
No portion of the soldered lead termination shall project beyond the

edgesofthepad.
8.4.5
a.
8.5
Lapped round leads
Lapped ribbon leads
Ribbonleadsshalloverlapthesolderpad,seeFigure810(b):
1.
Minimum overlap: Either 3 times the lead width or 1,3 mm,

whicheveristhegreater.
2.
Maximumoverlap:5timestheleadwidth.
b.
No portion of the soldered lead termination shall project beyond the

edgesofthepad.
c.
The distance from the cut end of the lead to the edge of the solder pad
shallbeatleast0,25mm.
d.
Onesideoftheleadmaybeflushwiththeedgeofthesolderpad.
Mounting of components to terminals

a.
Componentsshallbemountedinaccordancewithclause8.1.
b.
Degree of wrap, routing and connection to terminals shall be in

accordancewithclause9andclause10.
c.
The lead length between the component and the terminals shall be
similar at both ends, except where component package shapes dictate
staggering.
NOTE
d.
Example:Tophatdiodeswithflanges.
StressreliefshallbeprovidedinaccordancewithFigure811.
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3,5d to3,5d
5,5d
to 5,5d
0,5d
min.
0,5d min.
dd
3d min.
1,5d toto3,0d
1,5d
3,0d
(1,3 mm
(1,3
mmmin.)
min.)
3d min.
(a)(a)
Round
lead
Round
lead
3w to
min.)
3w
to 5w
5w(1,3
(1,3mm
mm
min.)
0,25
mmmin.
min.)
0,25 mm
w ++0,4
min.
W
0,4mm
mm
min.
w
w
2,5 mm
3w
2,5 mm
3w min.
min. min.
min.)
(b) Ribbon
(b) Ribbon
lead
lead
Figure810:Methodsofthroughholelappedtermination
CC
2d min.
min.
SR
SR
CC
2d
min.
2d min.
CC
(a) Offset
(a)
Offsetmounting
mounting
SR
SR
d
In-line mounting
(b)(b)In-line
mounting
SR =SR
Stress
reliefrelief
bendbend
= Stress
C =C
Constraint
point
= Constraint
point
Figure811:Methodofstressrelievingpartsattachedtoterminals
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8.6
Mounting of connectors to PCBs

a.
Connectorsshallbemountedinaccordancewithclause8.1.
b.
PCBconnectorsshallbesuppliedwitheither:
1.
preformedleadssupportingstressreliefbends,or
2.
straight,epoxybondedleads.
c.
Degoldingandpretinningofleads,inaccordancewithclause7.2.3and
clause7.2.6,shallbeperformedbeforemechanicalfixingofconnectorsto
thePCB.
d.
Before soldering, the operator shall ensure that there is no contact

betweenthesolderfillettobeformedandthegoldplating.
e.
Connector leads shall protrude through the board in accordance with

clause8.4.3.
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9
Attachment of conductors to terminals,
solder cups and cables
9.1
General
9.1.1
a.
Aconductorshallbewrappedontoaterminalinthesamesenseasthe
finalcurvatureofthewire.
9.1.2
9.2
Conductors
Terminals
a.
Goldplated terminals and solder cups shall have the gold removed in
the conductor attachment area and be pretinned in accordance with
clause7.2.3.
b.
Terminalsshallbeselectedtofittheconductors.
Wire termination
9.2.1
a.
Breakouts from cables
The length of individualwires routed from a common cable to equally

spaced terminals shall beuniform (including wire endsandstressrelief
bends).
NOTE
9.2.2
Uniformlengthspreventstressconcentrationin
anyonewire.
Insulation clearance
a.
Wherecharacteristicimpedanceorcircuitparametersarenotaffected,the
insulationclearancevaluesstatedinclause7.2.1.4shallapply.
b.
Where characteristic impedance or circuit parameters are affected the

insulationclearancerequirementsmaybemodifiedandthemodification
shallbedocumentedintheprocessprocedures.
NOTE
Example: Highvoltage circuits or RF coaxial

lineterminations.
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9.2.3
Solid hook-up wire
a.
Solidhookupwireshallbesupportedatintervalsnotexceeding30mm.
b.
Supportshallbeprovidedbystakingorconformalcoating.
9.2.4
Stress relief
a.
Conductors terminating at solder connections shall incorporate stress

relief.
b.
Wickingshallbecontrolled.
NOTE
9.3
Antiwicking tools can be used for pretinning

thestrandedwires.
Turret and straight-pin terminals

9.3.1
Side route
a.
SiderouteconnectionsshallbemadeasshowninFigure91(a).
b.
Conductorsshallbewrappedaroundthepost(seeFigure91(c)):
1.
aminimumof1/2turn.
2.
amaximumof3/4turn.
c.
Forturretterminals,allconductorsshallbeconfinedtotheguideslots.
d.
Conductorsshallnotprojectbeyondthebaseoftheterminal.
e.
Wiresshallnotbewrappedoverotherwires.
f.
More than one wire may be installed in a single slot of a terminal post
provided that the combined diameters of the wires are less than the
widthoftheslot.
g.
Wiresterminatingatterminalsthatdonothaveamechanicalshoulderor
turretshallnotbeattachedcloserthanoneconductordiametertothetop
oftheterminal.
9.3.2
a.
Bottom route
Theconductorshallentertheterminalfromthebottom,passthroughthe
sideslotatthetop,andbewrappedasforthesideroute,seeFigure91(b).
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Insulation
clearance
Upper guide slot
Lower guide slot
Insulation
clearance
Base
(a)
(b)
turn maximum
turn minimum
(c)
Figure91:Sideandbottomrouteconnectionstoturretterminals
9.4
Bifurcated terminals
9.4.1
General
a.
Top,sideorbottomroutes,orcombinationsthereof,shallbeused.
b.
Toprouteandsiderouteshallnotbeusedtogetheronthesameterminal.
9.4.2
Bottom route
a.
BottomrouteconnectionsshallbeasshowninFigure92.
b.
Conductorsmayprojectbeyondthediameterofthebase,seeFigure92
(c),providedthatclearances,environmentalandelectricalcharacteristics
arenotcompromised.
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Post
Bend
Bend
Shoulder
(b)
(a)
(c) See subclause 9.4.2
Minimum insulation
clearance
Figure92:Bottomrouteconnectionstobifurcatedterminal
9.4.3
Side route
a.
SiderouteconnectionsshallbeasshowninFigure93.
b.
Theconductorshallenterthemountingslotperpendiculartotheposts.
c.
Whenmorethanoneconductorisconnectedtoaterminal,thedirection
of bend of each additional conductor shall alternate, see Figure 93 (b)
and(d).
d.
Siderouteconnectionsshallnotprojectabovethetopoftheterminal.
e.
Conductorsmayprojectbeyondthediameterofthebase,seeFigure93
(c),providedthatclearances,environmentalandelectricalcharacteristics
arenotcompromised.
f.
Conductorsshallbewrappedaminimumofturn(Figure93(a))toa
maximumofturn(Figure93(c))aroundthepost.
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Insulation
clearance
Insulation
clearance
Point of
entry
Point of entry is
same for upper
conductor
(b)
(a)
Insulation
clearance
Solder to post
and shoulder
(c)
(d)
Figure93:Siderouteconnectiontobifurcatedterminal
9.4.4
Top route
a.
Thetoprouteshallnotbeusedwheresideentryispossible.
b.
ToprouteconnectionsshallbeasshowninFigure94.
c.
Conductors shall be inserted between the vertical posts to the depth of

the shoulder, except for combined top and bottom routes (see clause
9.4.5).
d.
Conductorswhichdonotfillthegap,seeFigure94,shallbeeither:
e.
1.
accompanied by a tinned filler wire (solid or stranded), such that

thecombineddiametersfillthegap,or
2.
bentdouble,providedthatthecombineddiametersfillthegap.
Thetoprouteandsiderouteshallnotbeusedonthesameterminal.
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Insulation
Insulation
clearance
clearance
filler wire
TinnedTinned
filler wire
(stranded
or solid)
(stranded
or solid)
Figure94:Toprouteconnectiontobifurcatedterminal
9.4.5
a.
The bottom route conductor shall be installed before the top route
conductor.
b.
The toproute conductor shall be inserted to contact the bottomroute

conductor.
9.4.6
a.
9.5
Combination of top and bottom routes
Combination of side and bottom routes
The bottom route conductor shall be installed before the side route
conductor.
Hook terminals
a.
ConnectionstohookterminalsshallbeasshowninFigure95.
b.
Thebendtoattachconductorstohookterminalsshallbe:
1.
aminimumof1/2turn,
2.
amaximumof3/4turn.
c.
Protrusionofconductorendsshallnotdamageinsulationsleeving.
d.
Wheremorethanoneconductorisattachedtoaterminal,thedirectionof
bendofeachconductorshallalternate(seeFigure95(b)).
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Figure95:Connectionstohookterminals
9.6
Pierced terminals
a.
ConnectionstopiercedterminalsshallbeasshowninFigure96.
b.
Thebendtoattachconductorstopiercedterminalsshallbe:
c.
1.
aminimumof1/4turn,
2.
amaximumof3/4turn.
Protrusionofconductorendsshallnotdamageinsulationsleeving.
Insulation
Insulation
clearance
clearance
D
Insulation
Insulation
clearance
clearance
Insulation
Insulation
clearance
clearance
One conductor
One conduc
dia. max
tor dia. max.
entry
SideSide
entry
1/4
turn
turn
(a)(a)
1/2
turn
turn
(b)
(b)
(c) (c)
Figure96:Connectionstopiercedterminals
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9.7
Solder cups (connector type)

a.
ConductorsshallenterthesoldercupasshowninFigure97.
b.
Conductorsshallbebottomedinthecup.
c.
Conductorsshallbeincontactwiththeinnerwallofthecup.
d.
Multiple conductors may be inserted provided that each is in contact

withthefullheightoftheinnerwallofthecup.
e.
Fluxshallnotbetrappedwithinthesoldercup.
f.
Conductorsshallnotmisalignfloatingcontacts.
NOTE
Example: Solid, rigid conductor wire into

connectors.
Insulation
Insulation
clearance
clearance
Insulation
Insulation
clearance
clearance
Point
of entry
Point
of entry
Conductors
Conductors
shall bottomin
bottomed
cup
in cup
shall
WireWire
bottomed
bottom in cup
in cup
(b)
(b)
(a)
(a)
Figure97:Connectionstosoldercups(connectortype)
9.8
Insulation sleeving
a.
Connections that are not protected by insulation grommets, potting, or

conformalcoatingshallbeprotectedbyinsulatingsleeving.
NOTE
Example: Hook terminals, solder cupsand bus

wires.
b.
Insulationsleevingshallbetransparentandheatshrinkable.
c.
A component shall not move within the sleeving when the sleeving is
mechanicallysupported.
d.
Heatshrinkingofthesleeveshallnotdamagetheassembly.
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9.9
Wire and cable interconnections

9.9.1
General
a.
Interconnection methods shall not use fluxed solder preforms within

heatshrinkablesleeves.
b.
Soldered wire interconnection methods shall enable the removal of flux

andfluxresidue.
c.
Soldered wire interconnection methods shall enablevisual inspection of

theinterconnectionandsurroundingmaterials.
d.
After soldering, conductors shall be covered with heatshrinkable

sleeving.
e.
Fluorocarbonsleevesshallnotbeused.
NOTE
9.9.2
Fluorocarbon sleeves have high shrinkage

temperatures that can damage or reflow
solderedconnections.
Preparation of wires
a.
Wireinsulationshallberemovedusinginsulationstrippersinaccordance
withclause5.6.6.
b.
Wireinsulationclearancesshallbeinaccordancewithclause7.2.1.4.
c.
Pretinningshallbeinaccordancewithclauses7.2.5and7.2.6.
9.9.3
a.
b.
c.
Preparation of shielded wires and cables
Theareaofexposedshieldshallbeeither:
1.
attheendofthewireorcable(endtermination),or
2.
atanypositionalongthelengthofawireorcable(centresplice).
Theinsulationjacketshallberemovedfor:
1.
aminimumlengthof5mm,
2.
amaximumlengthof12mm.
Theinsulationjacketshallbescoredandremovedusingasharpcutting
tool.
NOTE
Example:Ascalpel.
d.
Thepreparationprocessshallnotdamagetheexposedshieldmaterialin
accordancewithclauses7.2.1.2and7.2.1.3.
e.
Theshieldmaterialshallbeofgoodsolderability.
f.
Theshieldmaterialshallnotbepretinned.
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g.
The shield material shall be cleaned using a solvent in accordance with

clause6.4.
9.9.4
Pre-assembly
9.9.4.1
Heat-shrinkable sleeving
a.
Heatshrinkable sleeving shall provide electrical insulation and

mechanicalsupporttothefinishedinterconnection.
b.
The sleeving shall be cut to a length that covers the finished soldered
joint and extends over the remaining insulation of each conductor for a
distanceof5mm2mm.
c.
Thecutsleevingshallbethreadedoveroneofthewirestobejoined.
9.9.4.2
a.
Conductors
Conductorsshallbesecuredtopreventdisturbanceduringsolderingand
solidificationusingone,oracombinationof,thefollowingmethods:
1.
A holding fixture that clamps the wires ensuring correct

alignment.
2.
A strand of binding wire, wrapped a minimum of 3 turns, as

showninFigure98(a).
NOTE
Example:Bare,tinnedcopperwire.
3.
Rings of heatshrinkable sleeving positioned over the ends of the

wireinsulations,seeFigure98(b)and(c).
4.
Atwistsplicearoundthebraid,seeFigure98(c).
b.
Theconductorstobejoinedshalllieparallelandincontact.
c.
Conductors may be preformed when the cable insulation prevents a

parallellay.
d.
Bending tools for the preforming of conductors shall be in accordance

withclause5.6.4.
e.
Wiresshallbesplicedusinglapjoints.
f.
For shield terminations, the conductor of the grounding wire shall be

positionedontheexposedshield.
g.
Insulation overlap shall not be greater than the diameter of the largest
conductoroftheinterconnection.
9.9.5
Soldering procedures
a.
Thesolderingironshallbeselectedinaccordancewithclause5.6.7.
b.
Thesolderalloyshallbeinaccordancewithclause6.2.
c.
Thefluxshallbeinaccordancewithclause6.3.
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d.
Solderingaidsshallbeusedtorestrictwickingoffluxorsolderunderthe
insulationinaccordancewithclause5.6.8.
e.
After solder solidification, the contour of each wire conductor shall be

visible.
f.
After solder solidification, adjacent conductors shall be connected by

concavesolderfillets.
5 mm - 12 mm
5 mm - 12 mm
(a) Use of fine (34 AWG) strand for binding
(b) Securing with shrink sleeving
(c) Twisted wire around braid
Figure98:Methodsforsecuringwires
9.9.6
a.
Theremovaloffluxandresiduesshallbeinaccordancewithclause11.
9.9.7
a.
Cleaning
Inspection
Interconnectionsshallbeinspectedinaccordancewithclause12.
9.9.8
Workmanship
a.
Jointsshallhaveasmooth,brightappearance.
b.
Theworkmanshipofsolderjointsshallbeinaccordancewithclause15.
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NOTE
9.9.9
The configurations in clause 15 can be applied

tosimilarinterconnections.
Sleeving of interconnections
a.
The heatshrinkable insulation sleeving (see clause 9.9.4.1) shall be

centredoverthecleanedandinspectedinterconnection.
b.
Thesleevingshallbeshrunkusingheatedgasorradiantenergy.
c.
Heatshallnotbeappliedformorethan8seconds.
d.
Theheatshrinkingtemperatureshallnotbeexceed140C.
9.10 Connection of stranded wires to PCBs

a.
StrandedwiresshallbesolderedtoPCBterminationsusinglapjointsor
platedthroughholesinaccordancewithFigure99(a),(b)and(c).
b.
The dimensions shown in Figure 99 shall be in accordance with Table

91.
c.
Stressreliefshallbeprovided.
d.
For PTFEinsulated wire, the minimum distance between the insulation

andthesolderfilletshallbe1mm.
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Figure99:ConnectionofstrandedwirestoPCBs
Table91:DimensionsforFigure99
r2d
=conductordiameter
r12D
=outerwirediameter
1mmH2mm
=insulationclearance
1,5mm0,8mm
LP
=leadprotrusionthroughboard
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10
Soldering to terminals and PCBs
10.1 General
10.1.1
Securing conductors
a.
There shall be no relative motion between conductors and terminals

duringsolderingorsoldersolidification.
b.
Conductors shall not be temporarily constrained against springback

forceduringsoldersolidification.
NOTE
10.1.2
a.
Thermal shunts
Thermalshuntsshallbeusedtoprotectthermallysensitivecomponents.
NOTE
10.1.3
a.
Residual stresses are produced in the lead

materialorsolderjoint.
Example: Conductors, insulation, components

andpreviouslysolderedconnections.
High-voltage connections
Solderedjointsforcoronasuppressionshallbeperformedintwostages
withanintermediateinspection:
1.
Thefirstsolderingstageproducesastandardsolderedconnection
inaccordancewithclause12;
2.
This connection is inspected for compliance with clause 12.2 and

12.3;
3.
Thejointthenhasadditionalsolderalloyadded;
4.
Thesecondsolderingstageproducesafinaljoint,seeFigure101,
having:
(a)
smoothconvexfillets,
(b)
nodiscontinuities,
(c)
noseverechangesincontour,
(d)
nosharpedgesorpoints.
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Figure101:Highvoltageconnection
10.2 Solder application to terminals

10.2.1
a.
Soldering of swaged terminals onto PCBs
Terminals swaged to a solid flat conductor shall be soldered to one

surfaceoftheconductor.
10.2.2
Soldering of conductors onto terminals

(except cup terminals)
a.
A concave fillet of soldershall be present between the terminaland the

sidesoftheconductor.
b.
Thecontouroftheconductorshallbevisibleaftersoldering.
c.
Terminalswithmorethanonewireshallhaveeachwireincontactwith,
andsolderedto,theterminal.
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10.2.3
Soldering of conductors onto cup terminals
a.
Theworkmanshipshallbeinaccordancewithclause15.7.
b.
The solder shall form a fillet between the conductor and the cup entry
slot.
c.
Thefilletshallfollowthecontourofthecupopening.
d.
Solder spillage may be present on the outside surface of the solder cup
provided that it does not interfere with the function or the assembly of
theconnector.
10.3 Solder application to PCBs

10.3.1
Solder coverage
a.
The molten solder shall flow around the conductor and over the
terminationarea.
b.
Except for highvoltage connections, the quantity of solder shall be in

accordancewithclause15.
c.
The solder for highvoltage connections shall be in accordance with

clause10.1.3.
d.
Solder shall not obscure the contour of the conductor at the end of the
insulation.
10.3.2
Solder fillets
a.
Solderfilletsshallbeinaccordancewithclause15.1and15.2.
b.
Aconductormountedasalapterminationshallhaveaheelfilletwhereit
bendsawayfromthepad.
c.
Onlapterminationswhereonesideofaconductorisflushwiththeedge
of the termination pad, a fillet of solder shall be present along at least
threeofthefoursidesofthelead.
d.
Thefilletofsolderalongtheleadshallextendupthesideoftheleadtoa
minimumdistanceofhalftheleadthicknessordiameter.
10.3.3
Soldering of component leads to platedthrough holes
10.3.3.1
Heat and solder side
a.
Thesolderfilletsshallbeinaccordancewithclause15.1and15.2.
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10.3.3.2
Component side
a.
Onthecomponentside,theterminalpadshallshowsolderflowthrough
andasolderfilletbetweentheleadandthepadforaminimumof25%of
thecircumference,seeFigure102(a).
b.
Absenceofcomponentsidepadwettingmaybeacceptablewhensolder
wettingisvisibleintheplatedthroughhole,seeFigure102(b).
(b)
(a)
Figure102:Minimumacceptablewettingoncomponentside
10.3.4
Solder application
a.
Soldershallbeappliedonlytothesoldersideofaplatedthroughhole.
b.
Thesolderingironbitshallbepretinned.
c.
Theheatedsolderingironbitshallbeappliedtothejoint.
d.
Soldershallbeintroduced:
1.
initiallyatthejunctionofthesolderingironbitandthejoint.
NOTE
2.
e.
Liquid solder between the tip and the

connectionpromotesheattransfer.
onceheattransferhasbeenachieved,onlytothejoint.
Where the rate of heat loss from the joint is too high to allow an
acceptablesolderjointonthecomponentside,additionalheatingshallbe
used.
NOTE1 Example:Highthermalmassesoradjacentheat
sinks.
NOTE2 Heatcanbeappliedtobothsidesoftheplated
throughholesimultaneously.
f.
Additionalheatingshallnotdamagecomponentsormaterials.
g.
Theprocessofadditionalheatingshallbedocumented.
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10.4 Wicking
a.
Solderingaidsshallbeusedtorestrictthewickingoffluxorsolderunder
insulationinaccordancewithclause5.6.8.4.
10.5 Solder rework

a.
ReworkofsolderedPCBassembliesshallbedonewhenthesolderjoint
doesnotmeettheacceptancecriteriaofclause12.
b.
Ajointshallnotbereworkedmorethanthreetimes.
NOTE
c.
For reworking, the solder can be completely

removedfromthetermination.
ToolsandaidsshallbeinaccordancewithECSSQST7028.
10.6 Repair and modification

a.
AnyrepairsormodificationsshallbeinaccordancewithECSSQST7028.
78
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11
Cleaning of PCB assemblies
11.1 General
a.
When the solder has solidified and cooled, flux and residue shall be
removed from soldered connections using a solvent in accordance with
clause6.4.
b.
Solvent shall be applied in such a manner that avoids its penetration

underwireinsulationandpreventsitsentryintotheinteriorofparts.
c.
Fluxandresidueshallberemovedwithinamaximumperiodof8hours
aftersolderingoperations.
NOTE
d.
It is good practice to remove flux as soon as

possible because even rosin fluxes are difficult
toremoveafterlongerageing.
PCBassembliesshallnotbeimmersedincleaningsolventsformorethan
30minutesforeachcleaningoperation.
NOTE
Long immersion times can promote galvanic

corrosionbetweenadjacentmetallicsurfaces.
11.2 Ultrasonic cleaning

a.
Ultrasonic cleaning shall not be used for PCBs populated with

components.
11.3 Monitoring for cleanliness

11.3.1
Cleanliness testing
a.
The effectiveness of the cleaning process employed for PCB assemblies

(postsoldering) shall be tested using a sodium chloride (NaCl)
equivalentioniccontaminationtestinaccordancewithclause11.3.4.
b.
Cleanlinesstestingmaybeomittedforsolderassembliesusingonlypure
rosin(ROL0)fluxes,seeclause6.3.1.
79
ECSSQST7008C
6March2009
11.3.2
a.
Testing frequency
Forfluxes,otherthanpurerosin,cleanlinesstestingshallbedone:
1.
atmaximumintervalsofsixmonths;
2.
followingachangeinfluxmaterials;
3.
followingachangeinprocessparameters;
4.
followingactionsaffectingcleanability.
NOTE
b.
Thesuppliershallimplementandmaintainrecordsoftestresults.
NOTE
c.
Test limits
Thesodiumchloride(NaCl)ioniccontaminationequivalencevalueshall
belessthan1,56g/cm2ofPCBsurfacearea.
11.3.4
a.
The records can aid early detection of a trend

towardsnonconformance.
Whenatestresultisunacceptable,allPCBassembliescleanedsincethe
lastsuccessfultestshallbesubjecttoreviewbytheApprovalauthorityin
accordancewithECSSQST20.
11.3.3
a.
Statistical control methods can be used to

controlcontinuoussolventcleaningprocesses.
Test method
Sodium chloride (NaCl) equivalent ionic contamination shall be

measuredasfollows:
1.
Useasolutionof75%isopropylalcoholand25%deionizedwater
forthesodiumchloride(NaCl)equivalentioniccontaminationtest.
2.
Calibrate the equipment using a sodium chloride solution of

knownquantityandcomposition.
b.
Testing shall be performed according to the equipment manufacturers

specification.
c.
Thecleanlinesstestvaluesshallbeasfollows:
1.
Startingresistivity:greaterthan20106cm.
2.
Endingvalue:lessthan1,56g/cm2.
NOTE
ESA STM 275 contains an evaluation of PCB

cleanlinesstesting.
80
ECSSQST7008C
6March2009
12
Final inspection
12.1 General
a.
Each component mounting and soldered connection shall be visually

inspectedforcompliancewithclause12.2and12.3andtheworkmanship
standardsofclause15.
b.
Inspectionshallbeaidedbymagnificationappropriatetothesizeofthe
connectionsbetween4timesand10times.
c.
Additionalmagnificationshallbeusedtoresolvesuspectedanomaliesor
defects.
d.
Partsandconductorsshallnotbephysicallymovedtoaidinspection.
e.
The substrate, component and component position, as well as fasteners

and mounting hardware, shall be inspected in accordance with the
requirementsofclause8,clause9andclause10.
12.2 Acceptance criteria

a.
Acceptablesolderconnectionsshallbecharacterisedby:
1.
aclean,smoothsatintobrightundisturbedsurface,
2.
solder fillets between conductor and termination areas as

describedandillustratedinclause15,
3.
forsolderfilletsofplatedthroughholeconnections,thecriteriain
clause10.3.3apply,
4.
visible contour of wires and leads such that their presence,

directionofbendandterminationendcanbedetermined,
5.
completewettingasevidencedbyalowcontactanglebetweenthe
solderandthejoinedsurfaces,
6.
acceptable amount and distribution of solder in accordance with

clause15,
7.
absenceofanyofthedefectsmentionedinclauses12.3,
8.
highvoltageconnectionsinaccordancewithclause10.1.3,
9.
stressrelief.
81
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6March2009
12.3 Visual rejection criteria

a.
The following are some characteristics of unsatisfactory conditions, any

ofwhichshallbecauseforrejection:
1.
charred,burnedormeltedinsulationofparts,
2.
conductorpatternseparationfromcircuitboard,
3.
burnsonbasematerials,
4.
continuousdiscolourationbetweentwoconductorpatterns.
NOTE
For example measling, delamination, halo

effect.
5.
excessivesolder(includingpeaks,iciclesandbridging),seeclause
15,
6.
contaminated solder joints (including flux, lint and extraneous

material),
7.
fluxresidue,soldersplatter,solderballs,orotherforeignmatteron
circuitry,beneathcomponentsoronadjacentareas,
8.
dewetting,
9.
insufficientsolder,seeclause15,
10.
pits,holesorvoids,orexposedbasemetal(excludingtheendsof
cutleads)inthesolderedconnection,
11.
granularordisturbedsolderjoints,
12.
fracturedorcrackedsolderconnection,
13.
cut,nicked,gougedorscrapedconductorsorconductorpattern,
14.
incorrectconductorlength,
15.
incorrectdirectionofclinchorlapterminationonaPCB,
16.
damagedconductorpattern,
17.
barecopperorbasemetal,excludingtheendsofcutwireorleads
orsidesoftracksandsolderingpadsonsubstrate,
18.
soldered joints made directly to goldplated terminals or gold

platedconductorsusingtinleadsolders,
19.
coldsolderjoints,
20.
componentbodyembeddedwithinsolderfillet,
21.
opensolderjoints,
NOTE
Forexampletombstoning.
22.
probemarkspresentonthemetallizationofchipdevicescausedby
electricaltestingafterassembly,
23.
glasssealdoesnotconformtoMILSTD883Method2009.8,
24.
impairedstressrelief.
82
ECSSQST7008C
6March2009
13
Verification procedure
13.1 General
a.
Any soldering configuration not covered by this standard shall be

verificationtestedinaccordancewiththisclause.
b.
Thesuppliershallestablishaverificationprogrammetobeapprovedby
theApprovalauthority.
c.
The supplier shall demonstrate verification for each combination of

substrateclass,stakingcompound,encapsulantandconformalcoatingas
usedonflightmodels.
d.
The devices and associated materials shall be documented in the

verificationprogramme,including:
1.
packagedesignation,
2.
solder alloy composition, adhesive, encapsulant, conformal

coating,andprintedcircuitboards.
e.
The verification test board shall support at least three devices for each
assemblyconfiguration.
f.
The repairability of each configuration, shall be demonstrated not to

damagetheprintedcircuitboard.
g.
Verificationtestingshallcomprisethefollowing:
1.
Vibrationtestinginaccordancewithclause13.2.
NOTE
Vibration testing can be performed before or

afterthermaltesting.
2.
200thermalcyclesinaccordancewithclause13.3.
3.
Visualinspectioninaccordancewithclause12.
4.
Microsectioninginaccordancewithclause13.4.
5.
Nocrackedsolderjointsordamagedparts.
83
ECSSQST7008C
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13.2 Vibration
a.
Thetestspecimenshallbevibrationtested.
b.
The PCB design and mounting (including fittings such as stiffeners,

framesorspacers)shallberepresentativeoftheflightmodel.
c.
The test levels and durations shall be derived from the system
requirements.
NOTE1 Thevibrationtestlevelsforlauncherhardwareare
moreseverethanthoseforotherflighthardware.
NOTE2 Vibration testing methodology From the input
levels required by the projects in progress, the
maximumdeformationoftheprintedcircuitboard
at the part level is established for each
configuration (part type, location on the printed
circuit board). The test specimen is representative
of these configurations and covers at least the
maximum deformations previously established,
with a margin either minimum for a specific
project or higher for generic applications.
Nevertheless, in order to take into account test
specimen imperfections, notching can be used to
reduce
nonrepresentative
mechanical
overstresses. The part assembly (mounting
condition) is defined in order to withstand the
vibration levels estimated at the part level. The
successofverificationofthetestspecimenandthe
successfulcompletionofQMqualificationvalidate
the assembly configuration and the implemented
methodology.
d.
A sine survey, as defined in Table 131, shall be performed before and

afterthehighlevelvibrationtestingdefinedinTable132,Table133,and
Table134.
e.
The severity of the vibration test shall not be less than that shown in
Table132,Table133,andTable134.
f.
Input vibration levels shall be measured at the interface between the

vibrationplateandthePCB.
g.
TheresponseaccelerationoftheassembledPCBshallbemonitoredand
recordedduringtesting.
h.
Vibration testing shall be performed in the three orthogonal axes: one

outofplaneandtwoinplane.
84
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Table131:Sinesurvey
Levelandfrequency
Amplitude
0,5g0topeak
Frequencyrange
10Hzto2000Hz
Sweeprate
2octaves/minute
Direction
X,Y&Zaxes
Table132:Minimumseverityforsinevibrationtesting
Range(Hz)
PSDLevel
Sweeprate
(0topeak)
(Oct/min)
Spacecraft
25to100
20g
100to200
15g
Duration:1cycleupfrom25Hzto200Hz
Launchers
10to16
10mm
1/3
16to60
10g
1/3
60to70
22,5g
1/3
70to200
22,5g
200to2000
10g
Duration:1cycleupfrom10Hzto2000Hz
Table133:Minimumseverityforrandomvibrationtestingforall
applicationsexceptlaunchers
PerpendiculartoPCB
ParalleltoPCB
Range(Hz)
PSDLevel
Range(Hz)
PSDLevel
20to100
+6dB/oct.
20to100
+6dB/oct.
100to500
1,0g/Hz
100to800
0,5g/Hz
500to2000
6dB/oct.
800to2000
3dB/oct.
Global:28,5gr.m.s.
Global:27,1gr.m.s.
Duration:5minutesperaxis
85
ECSSQST7008C
6March2009
Table134:Minimumseverityforrandomvibrationtestingforlauncher
Frequency
PSD
20to60
+3dB/oct.
60to1000
0,27g/Hz
1000to2000
6dB/oct.
Global:20gR.M.S.
Duration:5minutesperaxis
13.3 Temperature cycling

a.
The test specimen shall be temperature cycled in an air circulating or

inertgaspurgedoven.
b.
Before the start of the temperature cycling, the test specimen shall be
bakedouttoremovetheinternalhumidity.
c.
Thebakeouttemperatureshallbebetween60Cand80C
d.
Thetemperaturecycleshallbebetween55Cand+100C
e.
The rate of temperature change during the temperature cycle shall not
exceed10Cperminute.
f.
The soak time at each temperature extreme shall be a minimum of 15

minutes.
g.
The monitoring thermocouple shall be attached to the surface of the

printedcircuitboard.
13.4 Microsection
a.
At least one microsection shall be made on each configuration after

vibrationtestingandtemperaturecycling.
b.
The microsection shall be done on the device having the worst solder
jointappearanceidentifiedduringthevisualinspection.
c.
TheApprovalauthorityshallhaveaccesstothemicrosection.
d.
Themicrosectionshallbestoredforaperiodofatleasttenyears.
NOTE
Stored samples can assist the analysis of in

servicefailures.
86
ECSSQST7008C
6March2009
14
Quality assurance
14.1 General
a.
QualityassuranceshallbeinaccordancewithECSSQST20.
b.
Clause 15 shall be integrated into the quality assurance plan and

documentation.
a.
Quality records shall be retained for at least ten years, or in accordance

withtheprojectcontract.
14.2 Data
NOTE
b.
Example of quality records are travellers log,

workorders.
Quality records shall be gathered in a report in conformance with the

DRDinAnnexA.
14.3 Nonconformance
a.
Nonconformance in the soldering process shall be dispositioned in

accordancewithECSSQST1009.
14.4 Calibration
a.
Insulationstrippers,solderingirons,measuringequipmentandreference
standardsshallbecalibrated.
b.
Asuspectedorconfirmedtoolorequipmentfailureshallberecordedasa
projectnonconformance.
NOTE
The records can aid early detection of a trend

towardsnonconformance.
c.
Defective or out of calibration equipment or tools shall be labelled or

removedfromworkareas.
d.
TheApprovalauthorityshallbenotifiedofthenonconformance.
87
ECSSQST7008C
6March2009
14.5 Traceability
a.
ECSSQST20,clause5.4shallapply.
14.6 Workmanship standards

a.
Visualstandardsshallbeprepared.
b.
Thevisualstandardsshallbeavailabletoeachoperatorandinspector.
NOTE
c.
Examples are: Satisfactory work samples or

visual aids which illustrate the quality
characteristics of all types of soldered
connectioninvolvedinthetask.
Theworkmanshipstandardsinclause15shallbeincluded.
14.7 Inspection
a.
During all stages of the process, the inspection points shall be

implemented.
b.
Inspectionshallbeinaccordancewithclause12.
14.8 Operator and inspector training and certification

a.
Trained and certified personnel shall be employed for soldering

operationsandinspections.
b.
Atrainingprogrammeshallbedeveloped,maintainedandimplemented
bythesuppliertoprovideexcellenceofworkmanshipandpersonnelskill
inmanualsoldering.
c.
The training programme shall include procedures for the training,

certification, maintenance of certified status, recertification and
revocationofcertifiedstatusforsolderingandinspectionpersonnel.
d.
Trainedpersonnelperformingsolderingoperationsandinspectionsshall
becertified.
NOTE
e.
Certification is based on objective evidence of

soldering quality, resulting from test and
inspectionofsolderedjoints.
Personnel shall be retrained or reassessed in the following

circumstances:
1.
Repeatedqualitynonconformance.
2.
Changeinsolderingtechniques.
3.
Changeinsolderingparameters.
4.
Additionalprocessskills
88
ECSSQST7008C
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f.
Records of the training, testing and certification status of soldering

operators and inspection personnel shall be implemented and
maintained.
NOTE
g.
Therecordsaregenerallykeptforaperiodofat
leasttenyears.
Operatorsperforminghandsolderingandinspectorsshallbetrainedand
certifiedataschoolauthorizedbytheApprovalauthority.
89
ECSSQST7008C
6March2009
15
Workmanship standards
15.1 Soldered clinched terminals
Preferred solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Acceptable
Maximum solder
Preferred solder
Unacceptable
Excessive solder
Figure151:Solderedclinchedterminals
90
ECSSQST7008C
6March2009
15.2 Soldered stud terminals
Preferred solder
SeeFigure89andFigure102forotheracceptableconditions.
Figure152:Solderedstudterminals
91
ECSSQST7008C
6March2009
15.3 Soldered turret terminals
Preferred solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure153:Solderedturretterminalswithtwinconductors
92
ECSSQST7008C
6March2009
15.4 Solder turret terminals
Preferred solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure154:Solderedturretterminalswithsingleconductors
93
ECSSQST7008C
6March2009
15.5 Soldered bifurcated terminals
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Preferred solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Preferred solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure155:Solderedbifurcatedterminals
94
ECSSQST7008C
6March2009
15.6 Soldered hook terminals
Unacceptable
Excessive
solder
Acceptable
Maximum
solder
Preferred
solder
Acceptable
Minimum
solder
Unacceptable
Insufficient
solder
Figure156Solderedhookterminals
95
ECSSQST7008C
6March2009
15.7 Soldered cup terminals
Preferred solder
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure157:Solderedcupterminals
96
ECSSQST7008C
6March2009
15.8 Soldered wire to shielded cable interconnections
Unacceptable
Insufficient solder
Acceptable
Minimum solder
Preferred solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure158:Handsolderedwiretoshieldedcableinterconnections
97
ECSSQST7008C
6March2009
Unacceptable
Insufficient solder
Insulation overlap too great
Acceptable
Minimum solder
Maximum overlap
Preferred solder
Preferred solder
Acceptable
Maximum solder
Unacceptable
Excessive solder
Figure159:Handsolderedwiretoshieldedwireinterconnections
98
ECSSQST7008C
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99
ECSSQST7008C
6March2009
c)
b
)
a
)
a)Acceptablemaximuminsulationoverlap
b)Acceptablepitinsolderfilletcausedbyweaveofshieldmaterial
c)Unacceptablelackofsolderbetweenconductors
Unacceptable
Unacceptablemoltendielectricinsulation
Uncleanconnection(flux)
Figure1510:Handsolderedwireinterconnectionsdetailsofdefects
100
ECSSQST7008C
6March2009
Annex A (normative)
Report on manual soldering of highreliability electrical connections - DRD
A.1
DRD identification
A.1.1
Requirement identification and source document
ThisDRDiscalledfromECSSQST7008,requirement14.2b.
A.1.2
Purpose and objective
The purpose of this DRD is to provide in a single document all information on

materials, parts, processes, testing and inspections used before and during the
manual soldering of highreliability electrical connections. This document is
applicabletoensurethattheassemblyismadecomplianttotheECSSQST7008.
A.2
Expected response
A.2.1
<1>
a.
<2>
a.
<3>
b.
Scope and content

Originator
The report shall contain the name, organization and address of the
originator.
System/Subsystem
The report shall identify the system/subsystem in which the assembly
under inspection for compliance to manual soldering of highreliability
electricalconnectionsisembedded.
Manufacturer
The report shall identify the manufacturer of the assembly in which
manual soldering techniques for highreliability electrical connections
wereused.
101
ECSSQST7008C
6March2009
<4>
a.
Assemblyconfigurationitemlist
The report shall identify or refer to the assembly list detailing all the
elementsconstitutingthisassembly.
NOTE
Elementscanbematerials,processesandparts.
b.
ThereportshallidentifyorrefertotheDMPLoftheassemblyinwhich
wereused.
c.
The report shall identify or refer to the DML of the assembly in which
wereused.
d.
The report shall identify or refer to the DPL of the assembly in which
wereused.
<5>
a.
Engineeringdrawings
The report shall contain or refer to the engineering drawings of the
assembly on which manual soldering of highreliability electrical
connectionshasbeenperformed
<6>
a.
Applicabledocuments
The report shall contain the applicable document list and the reference
documentlistincluding:
1.
Theproblemreportandhandlingofnonconformanceprocedures
tobeapplied.
2.
Thelistofprocedurestobeapplied.
NOTE
3.
Thelistofstandardtocomplywith.
NOTE
<7>
a.
Procedures can be internal procedures not

described in ECSSQST7008 describing
varioussolderingoperations.
Standards can be workmanship standards

related to the acceptance and rejection criteria
of soldering, international standards for ESD
protection (EN 146441) or clean area (ISO or
ECSS Standards for the qualification and
procurementofPCBs.
Evidencesofcompliancetomanualsolderingprocesses
The report shall demonstrate evidences that the operations and
associated controls, when performing manual soldering of high
reliabilityelectricalconnectionsaredoneincompliancewithECSSQST
7008 or other customer approved internal standards and procedures,
includingasaminimum:
102
ECSSQST7008C
6March2009
1.
2.
3.
4.
<8>
a.
Recordsofcalibrationforalltools,equipmentandfacilities:
Solderingirons,
Ifsolderbittemperaturecontrolled,solderbitiscalibratedat
incominginspection,
Temperaturesofdegoldingandpretinningbaths.
Statementofcompliancefor
The controlled area with respect to cleanliness and

contaminationrequirements,
Theinternalassemblyprocedures,
Thedesignrulesappliedforthecorrectnessofthesoldering,
Operatorsandinspectorstrainingandcertifications,
CleanlinessofPCBassemblies,
Useofapprovedmethodsfor:
o
Thepreparationofsoldering,
Themountingofcomponents,
Theattachmentsofconductorstoterminals,solder
cupsandcables,
SolderingtoterminalsandPCBs.
ProtectionsagainstESDfor:
storage,assemblyline,inspectionlineandtestingareas,
Gloves,solderingaidsandotherusedtools.
Materialsselection:
Formandcompositionofthesolder,
Characterizationoffluxes,
Solvents,
Flexibleinsulationmaterials,
Chemicalscompositionofterminalsandshapes,
Wires,
PCBs,
Componentsleadfinishes,
Adhesives.
Verificationandtesting
Thereportshallcontainalltheinformationrelatedtotheoperationsand
associated controls performed when verifying or testing manual
soldering of highreliability electrical connections, including as a
minimumthefollowing:
103
ECSSQST7008C
6March2009
1.
Photographicevidencesofthemanualsolderingtobeinspected
2.
Visualinspectionfindings
3.
Listoftheacceptancecriterianotmet,
Listofrejectioncriteriasupportingthevisualinspection
findings.
Discrepancies with regards to applicable standards and test

specificationsandprocedures
o
CleanlinessofPCBassemblies(testreport),
thermalcycling(testreport),
mechanicaltesting(vibrationstestreport),
electricaltestingreport.
4.
Listofnonconformancereports.
5.
Preventivesandcorrectivesactionstobemanaged.
A.2.2
Special remarks
None.
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ECSSQST7008C
6March2009
Annex B (informative)
Solder melting temperatures and choice
TableB1:Guidetochoiceofsoldertypes
Soldertype
Meltingrange(C)
Solidus
63tinsolder
(eutectic)
183
Liquidus
Uses
183
Solderingprintedcircuitboardswhere
temperaturelimitationsarecriticalandin
applicationswithanextremelyshortmelting
range.Preferredsolderforsurfacemountdevices.
62tinsilver
loaded
179
190
Solderingofterminationshavingsilverandor
silverpalladiummetallization.Thissolder
compositiondecreasesthescavengingofsilver
surfaces.
60tinsolder
183
188
Solderingelectricalwire/cableharnessesor
terminalconnectionsandforcoatingor
pretinningmetals.
96tinsilver
(eutectic)
221
221
Canbeusedforspecialapplications,suchas
solderingterminalposts.
75indiumlead
145
162
Specialsolderusedforlowtemperaturesoldering
processwhensolderinggoldandgoldplated
finishes.Canbeusedforcryogenicapplications.
70indiumlead
165
175
Forusewhensolderinggoldandgoldplated
finisheswhenimpracticaltodegold.
10tinlead
268
290
Foruseinstepsolderingoperations,toavoid
reflowofinitialsolderonmakingthesecondjoint
(limitedtoconnectionsinternaltodevices).
105
ECSSQST7008C
6March2009
Bibliography
ECSSSST00
ECSSsystemDescription,implementationandgeneral
requirements
ECSSEST1003
SpaceengineeringTesting
ESASP1173
Evaluationofconformalcoatingforfuturespacecraft
applications
ESASTM265
Evaluationofthermallyconductiveadhesivesasstaking
compoundsduringtheassemblyofspacecraftelectronics
ESASTM275
EvaluationofcleanlinesstestmethodsforspacecraftPCB
assemblies
ISO9453
SoftsolderalloysChemicalcompositionsandforms
ISO146441
Cleanroomsandcontrolledenvironments
ISO29454
Softsolderingfluxes;classificationandrequirements
IEC6119013(2002)
AttachmentmaterialsforelectronicassemblyPart13:
Requirementsforelectronicgradesolderalloysandfluxedand
nonfluxedsolidsoldersforelectronicsolderingapplications
106

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ECSS-Q-ST-70-08C

Terms from other standards .....................................................................................14

Terms specific to the present standard ....................................................................14

Abbreviated terms .................................................................................................... 22

4 Principles of reliable soldered connections.......................................................23

Facility cleanliness ...................................................................................................24

Environmental conditions .........................................................................................24

Lighting requirements ...............................................................................................25

Precautions against static discharges ...................................................................... 25

Precautions against ESD during manufacturing......................................... 25

Protective Packaging and ESD Protection ................................................. 26

Packing and filler materials......................................................................... 27

Equipment and tools.................................................................................................27

Cutters and pliers ....................................................................................... 27

Clinching tools ............................................................................................28

Insulation strippers .....................................................................................29

Soldering irons and resistance soldering equipment.................................. 30

6 Materials selection ...............................................................................................32

Rosin-based fluxes ..................................................................................... 33

INH1 corrosive acid flux.............................................................................. 34

Application of flux .......................................................................................34

Flexible insulation materials .....................................................................................35

Tin-, silver- and gold-plated terminals ........................................................ 36

Gold finish on conductors ........................................................................... 37

Component lead finishes.......................................................................................... 37

6.10 Adhesives (staking compounds and heat sinking), encapsulants and

7 Preparation for soldering.....................................................................................39

Preparation of conductors, terminals and solder cups ............................................. 39

Insulation removal ......................................................................................39

De-golding of gold-plated leads and terminals ........................................... 41

Constraints on degolding and pretinning methods ..................................... 42

Pretinning of stranded wires ....................................................................... 43

Pre-tinning of component leads and solid-wire conductors ........................ 44

Preparation of the soldering bit ................................................................................44

Maintenance of resistance-type soldering electrodes .............................................. 45

Handling (work station).............................................................................................45

Storage (work station) ..............................................................................................45

Materials requiring segregation .................................................................. 46

Preparation of PCBs for soldering............................................................................ 46

Demoisturization methods .......................................................................... 46

Storage of prepared PCBs .........................................................................46

Metal-case components ............................................................................. 47

Glass-encased components ....................................................................... 48

Stress relief of components with bendable leads ....................................... 48

Stress relief of components with non-bendable leads ................................ 49

Reinforced plated-through holes ................................................................ 52

Lead and conductor cutting ........................................................................52

Solid hook-up wire ...................................................................................... 52

Conformal coating, cementing and encapsulation...................................... 52

Lead bending requirements...................................................................................... 53

Conductors terminating on both sides of a non-plated-through hole.......... 53

Mounting of terminals to PCBs .................................................................................54

Lead attachment to PCBs ........................................................................................55

Clinched leads ............................................................................................ 55

Lapped round leads....................................................................................58

Lapped ribbon leads ...................................................................................58

Mounting of components to terminals ...................................................................... 58

Mounting of connectors to PCBs .............................................................................. 60

9 Attachment of conductors to terminals, solder cups and cables ....................61

Wire termination .......................................................................................................61

Breakouts from cables................................................................................61

Solid hook-up wire ...................................................................................... 62

Turret and straight-pin terminals ..............................................................................62