Beruflich Dokumente
Kultur Dokumente
Institute for Solid State Electronics, Vienna University of Technology, 1040 Vienna, Austria
Abstract
Advanced method to improve the sensitivity and selectivity of monolithically integrated mid
infrared sensor using distributed feedback laser as a radiation source has been proposed in this
paper. The sensor is based on quantum cascade laser/detector system built up in the same
material and in the same fabrication approach and a surface plasmon polariton (SPP)
waveguide with a twofold function: it provides a coupling of the light between emitter and
detector, as well as strong interaction of light with environment. The quantum cascade lasers
used in this work emit single mode between 1520 cm-1 and 1650 cm-1 (what corresponds to
the absorption peak of water) with threshold current density of 3 kA/cm2, and a collected
output power of 200mW in the pulsed mode at room temperature. A peak signal of xxxx at the
detector is measured, what corresponds to responsivity of xxxx. In parallel, the work on the
pulse-to-pulse fluctuation control by elimination of thermal and electrical tuning is performed.
the very same material and same fabrication procedure [10]. Dielectric Loaded surface
plasmon polariton waveguides (SPPW) introduced in [10] enable high efficient radiation
coupling between laser and detector, and in the same time it serves as a light-matter
interaction area. This development makes a huge step towards advanced solutions in on-chip
mid-infrared absorption spectroscopy.
The material used for the fabrication of laser/detector structure is based on bound to
continuum design of 37 cascades of In0.52Al0.48As/In0.53Ga0.47As lattice matched to n-doped InP
substrate grown by molecular beam epitaxy. The detailed description of the material is given
elsewhere [10]. Device fabrication started with the definition of the first order DFB grating
via electron beam lithography. According to the maximum of the electroluminescence
spectrum, the grating period was chosen to be 0.98 m (corresponds to emission of 1570 cm1) with a grating duty-cycle of 50 percent. First, 200 nm of SiN x was deposited on the sample
and serves as a grating hardmask. The grating was written in PMMA resist and transferred in
the SiN hardmask by reactive ion etching (RIE) in CHF 3 and 02 plasma. Afterwards, 500 nm
deep grating was etched into the upper cladding layer using SiCl 4 and Ar at 250C by means
of RIE. The 10 m wide and 2.5 mm long laser devices, and 15 m wide and 200 um long
detector devices with gap between them of 50 m were etched 6 m deep through the active
zone to the substrate by RIE after the deposition of a silicon nitride (SiN x) hard mask by
plasma enhanced chemical vapor deposition (PECVD). 500 nm of SiN x is deposited for
electrical isolation leaving the electrical contact area and the ridge facets towards the
waveguide uncovered. Then, layers of titanium and gold, 10 and 60 nm thick respectively,
were evaporated to form the SPP waveguides. The distance between the SPP waveguides and
the laser/detector facet was less than 1 um, what provides efficient light coupling. In order to
minimize electric crosstalk via a shared series resistance, adjacent contacts in the trenches
beside the ridges were used instead of a standard back side substrate contact [11]. The top and
bottom contacts were applied by sputter deposition of a Ti/Au (10/250 nm) layer. The back
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facets of laser and detectors devices were covered first with SiN x and then with a gold in order
to serve as a high reflection coating. In this way, the amount of light participating in detection
will be increased. The fabrication was finalized by deposition and pattering of 200 nm SiN x
used as a dielectric loaded SPP waveguide. The completed device is shown on Fig.1.
Open questions:
Is the figure with band structure necessary?
References
Fig.1.