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NEW
OPTICAL MICROSCOPE
SEM
ROUGHNESS GAUGE
NEW
WIDE-Scan
FULLY-AUTOMATED
MEASUREMENTS
with one push of
a button
Measurement
AI-Scan
Disadvantages
OPTICAL MICROSCOPE
1 Poor resolution, low contrast
2 Shallow depth-of-eld
SEM
1 Monochrome image only
2 Time-consuming preparation
and observation
PREPARATION
Sample processing
Deposition
To stage
Approx. 20 min
OBSERVATION
Start-up Vacuuming
Observation
Approx. 25 min
ROUGHNESS GAUGE
1 Sample scratched due to
contact with probe
R: 2 m
0.08 Mil
Enlarged (1000x)
Hitting the desired
area of a target
with a stylus can
be problematic for
targets like screw
thread crests.
Aluminum surface
(200x)
2 Fully-focused image
3 Traceability compatible
Z
X-Y
National Institute of
Standards and Technology
(NIST)
JCSS Accredited
Laboratories
Height difference gauge
Coordinate measurement
instrument
Calibration block
Calibration chart
2 No sample preparation
PREPARATION
Place your sample directly
on the stage
0 min
OBSERVATION
Start-up Observation
Approx. 3 min
Laser microscope
2D image
3D image
R: 0.4 m
0.02 Mil
VK-X100/X200 Features.01
OBSERVATION
Observation of unparalleled clarity
Full-focus image
Optical observation
NEW
Full-focus observation
Capture fully-focused images, even on threedimensional objects or at high magnication.
IC pattern (1000x)
Industrys Best
Sandpaper (400x)
Color SEM-like
observation
Industrys Best
3D
observation
Optical image
Laser image
VK-X100/X200 Features.02
RECORDING
Intuitive and easy-to-use interface
Worlds First
1. AAG function
Automatically selects the two best settings for the laser light-receiving element to allow for accurate measurements to be
made on angled surfaces and targets with varying levels of contrast.
* AAG=Advanced Auto Gain
Conventional method
AAG function
Glare
CONVENTIONAL ALGORITHM
(1) Sensitivity adjustment
Exists
Field of View
AAG ORIGINAL
(2) Sensitivity readjustment*
Absent
AAG FUNCTION
Field of View
Measurement range
FULLY-AUTOMATED
MEASUREMENTS
with one push of
a button
Lower limit
3.
Adjusts the measurement and capture settings and automatically re-scans the target to obtain information
that wasnt detected during the rst scan.
Solder (200)
VK-X100/X200 Features.03
MEASUREMENT
Measure any surface shape
3D comparison view
Aligns two three-dimensional images to allow for comparative
evaluation.
Comparative measurement
Overlay and compare prole measurements on two different
targets. Differences in height are automatically displayed in
the prole graph.
Sample A
Sample A
10
Sample B
Sample B
Sample B: Ra 3.2 m
Optical lm (1000x)
11
Improved operability
VK-X100 Series
NEW
FULLY-AUTOMATED
MEASUREMENTS
16-bit
One-click AI-Scan
VK-8700 Series
14-bit
PHOTOMULTIPLIER
VK-9500 Series
VK-8500 Series
PHOTODIODE
8-bit
VK-7500 Series
CCD
12
10 nm
5 nm
0.01 m
0.005 m
NEW
NE
VK-X200 Series
Greatly improved
accuracy
VK-9700 Series
Further
er increases the versatility of observation
observat and
measurement functions and can be operated by
non-experienced users.
Measurement function
Recording function
Observation function
TYPE
Light-receiving
element
Magnication
Optical zoom
Laser scanning
method
HDR function
Linear scale module
resolution
Measurement method
setting
Detection algorithm
AI-Scan function
Image stitching
function
Navigation function
Traceability
compatible
Repeatability ()
Top surface lm
thickness of a
transparent object
Film thickness
measurement
VF-7500
VK-8500
VK-9500
Photodiode, 8-bit
Photomultiplier, 14-bit
VK-8700
Photomultiplier, 14-bit
VK-9700
VK-X100
Photomultiplier, 16-bit
VK-X200
250x to 2500x
None
200x to 8000x
1x, 2x, 4x
200x to 18000x
1x to 6x
200x to 12000x
200x to 18000x
1x to 6x
100x to 16000x
200x to 24000x
1x to 8x
None
None
10nm
(0.01m)
None
10nm
(0.01m)
Manual
Manual
Manual
Peak algorithm
None
Peak algorithm
None
Peak algorithm
None
None
None
None
None
None
None
Yes
None
Yes
Yes
Yes
Yes
0.03 m
0.03 m
0.02 m
None
0.03 m
0.014 m
0.02 m
0.012 m
None
None
None
Yes
Yes
1 nm
0.5 nm
0.001 m
0.0005 m
Resolution of
the linear scale module
13
Part.
Higher Precision
16 times the dynamic range of conventional laser scanning microscopes
Industrys Best
16-bit photomultiplier
When it comes to obtaining accurate data, the element responsible for detecting the reected laser light is the most important component
of a laser scanning microscope. Boasting the worlds greatest dynamic range, the 16-bit photomultiplier of the VK-X Series is able to
accurately detect both faint and strong reected light, even on highly-angular surfaces.
Conventional
256x
more than a CCD
16x
VK-X100/200
more than
conventional models
CCD
Conventional
8-bit
(256 levels)
12-bit
(4096 levels)
16-bit
(65536 levels)
AAG function*
This function automatically adjusts the sensitivity of the laser receiving element
throughout the entire measurement range to account for variations in material, shape
and reectance.
Glare
AAG ORIGINAL
(2) Sensitivity readjustment*
Absent
Detect position
information in the z-axis
with an ultra highprecision 0.5 nm linear
scale module that is 20x more accurate than conventional
systems. This newly developed linear scale module can
achieve high-resolution measurement and boasts a
reliability that can be traced back to national standards.
Resolution
14
[Conventional]
0.01m
[VK-X200]
0.0005m
Achieves an ultra high precision that is 20x
greater than conventional models.
Higher Speeds
Achieves measurement speeds that are at least 2x faster than conventional systems
NEW
Measurement speeds have been improved to 2x that of conventional systems while also improving the measurement accuracy. For
applications that require even higher speeds, a newly developed 120 Hz ultra high-speed scan mode can be equipped.
Conventional
Conventional
2x
faster than conventional
models
VK-X
10
8x
faster than conventional
models
VK-X
RPD* algorithm
The VK-Xs original algorithm detects the true peak position using the Z-I curve after measurement. It enables high resolution with a
signicant reduction in measurement time.
Z-I curve after measurement
Conventional method
Detected peak
Cannot detect the real peak.
Conventional method
RPD method
Detected peak
Can detect the real peak.
RPD method
15
Part.
Issue.1
WIDE-Scan
High-speed,
high-precision
Solution
16
Issue.2
Measuring only a single area often leads to incorrect data when applied to the
entire target.
Conventional measurement method
Each location being measured exhibits variations in the result.
20.5 m height
18.5 m height
22.5 m height
High-speed,
high-precision
Solution
17
Part.
High-speed,
high-precision
Solution
WIDE-Scan
Optional
NEW
conventional systems.
High-precision stitching
with the WIDE algorithm
Conventional
image stitching
Measurement,
processingVK-X100/X200
and stitchingimage stitching
speed are dramatically improved with
AI-Scan and WIDE algorithm.
PCB (200x)
Conventional
6x
faster than
conventional models
VK-X
60
18
Step.1
Step.2
Easy stitching
Free measurement
Built-in navigation
system
Use the wide-eld image that was stitched
together as a reference when navigating
around a target at higher magnication.
19
Part.
WO RLDS FI RST
Normal image
8-bit
HDR
16-bit
Conventional method
16-bit
Printing (400x)
(65536 levels)
HDR function
Gradations
obtained by
capturing
multiple images
Gradations obtained
by capturing a single
image
Low-contrast gradations are
shown in detail
Difficulties
The range of obtainable brightness is narrow, resulting in the
glaring of areas beyond the range.
Subtle contrast cannot be rendered because of coarse resolutions.
Conventional
256x levels
Solutions
The range of obtainable brightness is wide, diminishing the
perceived glare.
Subtle contrast can be rendered because of detailed gradation.
Differential observation and prole measurement without the need to remove and insert prisms or lters
20
Conventional model
VK-X100/X200
Capture data from the top, bottom and intermediate layers of a transparent object
Laser light
Front surface film
Transparent film
surface
Film thickness
Rear face
Rear surface film
Substrate
surface
Transparent
film thickness
Transparent
film surface
Substrate
surface
21
Principle structure
Half mirror
Short wavelength
laser light source
Condensing lens
X-Y scanning
optical system
Half
mirror
Pinhole
White light source for
illumination
Half
mirror
Objective
lens
Observed
target object
4 Measurement
complete.
22
Measurement range
Height information
Height-Color Map
CCD
Lens
PMT
Mirror
Lens
Mirror
Lens
Laser light
Laser light
Target
Target
Pinhole
Focal
position
Conventional system
VK-X100/X200 system
1 Device 4 Benefits
Disadvantages of Interferometers
With light interference, if the surface does not reflect well, measurement
is difficult to perform, so support for a variety of targets is not provided.
Measurement also cannot be performed if there is an extreme difference
between the reflected light from the reference surface and the reflected
light from the measurement surface (Works well with mirrored-surfaces,
but is difficult to measure samples with extreme projections and
depressions and samples without much of a reflective surface).
VK-X100/X200
VK-X100/X200
VK-X100/X200
VK-X100/X200
23
SOFTWARE OPTIONS
ISO 25178
PROJECTION MEASUREMENT
SPHERE MEASUREMENT
Microlens (1000x)
Bump (2000x)
Particle analysis
module VK-H1XG
Automatically counts and measures
circular objects within the microscope field.
Preprocessing such as automatic
separation of adjacent particles, counting,
diameter, etc can be performed.
When a standard sample has been registered and a different image is opened in a
template, the VK-Analyzer automatically adjusts the image position so that the image
opens at the same position as the registered sample. This function is effective when
measuring large sample populations.
AUTOMATIC POSITION COMPENSATION
Tilted
Automatically corrected
Metal surface
(1000x)
24
Industrys First
Adjustable-height stand
for the VK Series
Stand for
the VK Series
The unique structure of the VK-X allows for the measuring head to be
separated from the base, making targets that were previously too tall to
measure easily possible. (Max 128 mm 5.04") (OP-82693)
Turning the
knob adjusts
the height as
desired.
128 mm
5.04"
The spacer
improves the
stability.
Objective lenses
Motorized stage
Non-destructive examination and analysis of any point on largesized targets by mounting the head on a 3rd-party stage.
25
DIMENSIONS
Unit: mm inch
Measurement unit
VK-X210
3.93"
100
4.25"
108
3.05"
77.5
7.3 0.29"
270.5 10.65"
159
6.26"
Controller
VK-X200K
415.4
16.4"
171.3
6.74"
150 5.91"
155 6.10"
249.9
9.84"
Measuring head
14.9"
378.5
270.5 10.65"
13.3
0.52"
295.4 11.63"
398.4 15.33"
53.2
2.09"
405
15.94"
22 0.87"
4 x M6
1.38"
6.52"
Depth 10 0.39" 35
165.5
130 5.12"
20.5 0.81"
0.49"
12.5
190
7.48"
168
172
6.61"
6.07"
0.51"
13
4.69"
119.2
160 6.30"
164
6.46"
285 11.22"
357 14.06"
6
0.24"
0.28" 7
4.25"
108
2 x M6 Heli-Coil, 1.5D
(Depth 8 0.31")
70.2 2.76"
(40) 1.57"
6.52"
165.5
0.81" 20.5
Measurement unit
VK-X105/110
3.74"
95
7
0.28"
3.80"
96.5
63.5 2.50"
10.63"
270
159 6.26"
Controller
VK-X100K
416.4
16.39"
0.52"
13.3
171.3
6.74"
5.91"
150
155 6.10"
249.9
9.84"
295.4 11.63"
397.1 15.63"
52.2
2.06"
405
15.94"
22 0.87"
Measuring head
366.5 14.43"
166.5 6.56"
66.5
2.62"
23.5 0.93"
4 x M6
Depth 10
0.39"
182
7.17"
190
0.28" 80 7.48"
7 3.15"
3.80"
96.5
(40) (1.57")
2 x M6 Heli-Coil 1.5D
(Depth 8 0.31")
145 5.71"
0.26"
2 x 6.6 through hole
26
20.5 0.81"
63.5 2.50"
80
3.15"
4.41"
112
4.69"
119.2
160 6.30"
164
6.46"
183
17.20"
0.24"
6
56.5 2.22"
285 11.22"
357 14.06"
6
0.24"
SPECIFICATIONS
Measurement unit
Controller
Magnification on a 15 monitor
Objective lens magnification
Model
Observation/
measuring range 1.
Measurement unit
Controller
200x
10
1350
53.15
1012
39.84
16.5
0.65"
0.3
VK-X210
VK-X200K
400x
1000x
20
50
675
270
26.57
10.63
506
202
19.92
7.95
3.1
0.35
0.12"
0.01"
0.46
0.95
VK-X110
VK-X105
VK-X100K
VK-X100K
3000x
200x
400x
1000x
2000x
100x
200x
400x
150
10
20
50
100
5x
10x
20x
90
1350
675
270
135
2700
1350
675
3.54
53.15
26.57
10.63
5.31
106.30
53.15
26.57
67
1012
506
202
101
2025
1012
506
2.64
39.84
19.92
7.95
3.98
79.72
39.84
19.92
0.2
16.5
3.1
0.54
0.3
22.5
16.5
3.1
0.008"
0.65"
0.12"
0.02"
0.01"
0.89"
0.65"
0.12"
0.95
0.3
0.46
0.8
0.95
0.13
0.3
0.46
1x to 8x
200x to 24000x
200x to 16000x
100x to 8000x
Pinhole confocal optical system
7 mm 0.28"
7 mm 0.28"
7 mm 0.28"
0.0005 m 0.00002 Mil
0.005 m 0.0002 Mil
0.005 m 0.0002 Mil
2.
2.
0.02 m 0.0008 Mil
0.02 m 0.0008 Mil 2.
0.012 m 0.0005 Mil
0.001 m 0.00004 Mil
0.01 m 0.0004 Mil
0.01 m 0.0004 Mil
0.03 m 0.001 Mil 4.
0.05 m 0.002 Mil 5.
0.02 m 0.0008 Mil 3.
2048 x 1536, 1024 x 768, 1024 x 64
16-bit
8-bit for RGB each
24-bit
21-bit
21-bit
4 Hz to 120 Hz
7900 Hz
AAG (Auto gain), Auto focus, Auto upper/lower limit setting, Double Scan brightness settings
Violet laser, 408 nm
Red semiconductor laser, 658 nm
0.95 mW
Class 2 Laser Product (IEC 60825-1, FDA (CDRH) Part1040.10 6.)
PMT (Photoelectron Multiplier Tube)
1000x
50x
270
10.63
202
7.95
0.54
0.02"
0.8
SYSTEM CONFIGURATION
Measurement unit
VK-X105
Controller
VK-X110
VK-X100K
Control PC
Monitor (Optional)
VK-X210
Motorized XY stage for image stitching
VK-S105/S100K (50 mm 1.97")
VK-S110/S100K (100 mm 3.94")
Stage for 300 mm 11.81" wafer
OP-51498 (Optional)
VK Series stand
OP-82693 (Optional)
* Please contact KEYENCE for large-sized sample stage.
VK-X200K
Viewer software
VK-H1XVE
Analysis software
VK-H1XAE
Analysis expansion module
VK-H1XP (Optional)
27
The information in this publication is based on KEYENCEs internal research/evaluation at the time of release and is subject to change without notice.
Copyright (c) 2011 KEYENCE CORPORATION. All rights reserved.
VKX-KA-C-E 1033-4 611542 Printed in Japan
*