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DRV8833
SLVSAR1E JANUARY 2011 REVISED JULY 2015
3 Description
2 Applications
PART NUMBER
Battery-Powered Toys
POS Printers
Video Security Cameras
Office Automation Machines
Gaming Machines
Robotics
DRV8833
PACKAGE
TSSOP (16)
5.00 mm 4.40 mm
HTSSOP (16)
5.00 mm 4.40 mm
WQFN (16)
4.00 mm 4.00 mm
Simplified Schematic
2.7 to 10.8 V
1.5 A
nSLEEP
nFAULT
Controller
DRV8833
+
PWM
Stepper or
Brushed DC
Motor Driver
1.5 A
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV8833
SLVSAR1E JANUARY 2011 REVISED JULY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
5
5
5
5
6
7
Overview ................................................................... 8
Functional Block Diagram ......................................... 8
Feature Description................................................... 9
Device Functional Modes........................................ 11
10 Layout................................................................... 15
10.1
10.2
10.3
10.4
15
15
16
16
17
17
17
17
17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2015) to Revision E
Page
Added note back to Pin Functions regarding the different I/O types ..................................................................................... 3
Corrected the device name and current regulation description in Overview ......................................................................... 8
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
DRV8833
www.ti.com
12
11
10
AISEN
AOUT2
BOUT2
BISEN
nSLEEP
AOUT1
AISEN
AOUT2
BOUT2
BISEN
BOUT1
nFAULT
13
GND
(PPAD)
2
3
11
10
9
VINT
GND
VM
VCP
BOUT1
nFAULT
BIN1
BIN2
PW Package
16-Pin TSSOP
Top View
14
12
13
GND
(PPAD)
14
AOUT1
nSLEEP
AIN1
AIN2
AIN1
AIN2
VINT
GND
VM
VCP
BIN2
BIN1
15
15
16
16
nSLEEP
AOUT1
AISEN
AOUT2
BOUT2
BISEN
BOUT1
nFAULT
RTY Package
16-Pin WQFN
Top View
16
15
14
13
12
11
10
AIN1
AIN2
VINT
GND
VM
VCP
BIN2
BIN1
Pin Functions
PIN
NAME
WQFN
HTSSOP,
TSSOP
I/O (1)
DESCRIPTION
EXTERNAL COMPONENTS
OR CONNECTIONS
11
PPAD
13
VINT
12
14
VM
10
12
VCP
11
IO
AIN1
14
16
Bridge A input 1
AIN2
13
15
Bridge A input 2
BIN1
Bridge B input 1
BIN2
10
Bridge B input 2
nSLEEP
15
CONTROL
(1)
DRV8833
SLVSAR1E JANUARY 2011 REVISED JULY 2015
www.ti.com
EXTERNAL COMPONENTS
OR CONNECTIONS
WQFN
HTSSOP,
TSSOP
I/O (1)
OD
Fault output
AISEN
IO
BISEN
IO
AOUT1
16
Bridge A output 1
AOUT2
Bridge A output 2
BOUT1
Bridge B output 1
BOUT2
Bridge B output 2
NAME
DESCRIPTION
STATUS
nFAULT
OUTPUT
DRV8833
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
VM
(1)
MIN
MAX
UNIT
0.3
11.8
0.5
0.3
0.5
Internally limited
TJ
40
150
Tstg
Storage temperature
60
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
4000
1500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
VDIGIN
IOUT
(1)
(2)
MAX
UNIT
2.7
NOM
10.8
0.3
5.75
1.5
RDS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V.
VM = 5 V, power dissipation and thermal limits must be observed.
PWP
(HTSSOP)
RTY
(WQFN)
PW
(TSSOP)
UNIT
16 PINS
16 PINS
16 PINS
RJA
40.5
37.2
103.1
C/W
RJC(top)
32.9
34.3
38
C/W
RJB
28.8
15.3
48.1
C/W
JT
0.6
0.3
C/W
JB
11.5
15.4
47.5
C/W
RJC(bot)
4.8
3.5
N/A
C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
DRV8833
SLVSAR1E JANUARY 2011 REVISED JULY 2015
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
IVM
VM = 5 V, xIN1 = 0 V, xIN2 = 0 V
1.7
mA
IVMQ
VM = 5 V
1.6
2.5
VUVLO
VM falling
2.6
VHYS
VM undervoltage lockout
hysteresis
90
mV
LOGIC-LEVEL INPUTS
VIL
VIH
VHYS
Input hysteresis
RPD
IIL
IIH
tDEG
nSLEEP
0.5
0.7
nSLEEP
2.5
2
0.4
nSLEEP
500
150
VIN = 0
V
k
1
6.6
13
16.5
33
450
A
A
ns
IO = 5 mA
IOH
VO = 3.3 V
0.5
H-BRIDGE FETs
VM = 5 V, I
HS FET on resistance
200
325
250
RDS(ON)
VM = 5 V, I
LS FET on resistance
350
160
275
200
VM = 5 V, TJ = 25C, VOUT = 0 V
300
1
MOTOR DRIVER
PWM
50
kHz
tR
Rise time
180
ns
tF
Fall time
160
ns
tPROP
VM = 5 V
1.1
tDEAD
VM = 5 V
450
ns
PROTECTION CIRCUITS
IOCP
tDEG
tOCP
tTSD
(1)
3.3
A
s
1.35
Die temperature
150
160
ms
180
DRV8833
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
200
240
mV
CURRENT CONTROL
VTRIP
tBLANK
160
3.75
SLEEP MODE
tWAKE
Start-up time
ms
25.0
2.5
20.0
2.0
15.0
40C
25C
IVMQ (uA)
IVM (mA)
85C
1.5
10.0
5.0
1.0
40C
0.5
0.0
25C
85C
5.0
0.0
2.7
3.6
4.5
5.4
6.3
7.2
8.1
9.0
9.9
2.7
10.8
VVM (V)
3.6
5.4
6.3
7.2
8.1
9.0
9.9
VVM (V)
10.8
C002
800
2.7 V
700
5V
600
10.8 V
-40C
700
RDS(ON) (HS + LS) (m)
4.5
C001
500
400
300
200
100
25C
600
85C
500
400
300
200
100
0
40 30 20 10
10
20
30
40
50
Temperature (C)
60
70
80
2.7
C003
3.6
4.5
5.4
6.3
7.2
8.1
9.0
9.9
VVM (V)
10.8
C004
DRV8833
SLVSAR1E JANUARY 2011 REVISED JULY 2015
www.ti.com
7 Detailed Description
7.1 Overview
The DRV8833 device is an integrated motor driver solution for brushed DC or bipolar stepper motors. The device
integrates two NMOS H-bridges and current regulation circuitry. The DRV8833 can be powered with a supply
voltage from 2.7 to 10.8 V and can provide an output current up to 1.5-A RMS.
A simple PWM interface allows easy interfacing to the controller circuit.
The current regulation is a fixed frequency PWM slow decay.
The device includes a low-power sleep mode, which lets the system save power when not driving the motor.
2.2uF
VINT
VM
VM
VM
10uF
Internal
Ref &
Regs
Charge
Pump
VCP
0.01uF
VM
Drives 2x DC motor
or 1x Stepper
AOUT1
Gate
Drive
&
OCP
AIN1
AIN2
DCM
VM
Step
Motor
AOUT2
BIN1
BIN2
AISEN
ISEN
Logic
VM
nSLEEP
BOUT1
nFAULT
Gate
Drive
&
OCP
OverTemp
DCM
VM
BOUT2
BISEN
ISEN
GND
DRV8833
www.ti.com
OCP
VM
VCP, VINT
xOUT1
xIN1
Predrive
DCM
xOUT 2
xIN2
PWM
OCP
xISEN
Optional
REF (200mV)
xIN2
xOUT1
xOUT2
FUNCTION
Coast/fast
decay
Reverse
Forward
Brake/slow
decay
The inputs can also be used for PWM control of the motor speed. When controlling a winding with PWM, when
the drive current is interrupted, the inductive nature of the motor requires that the current must continue to flow.
This is called recirculation current. To handle this recirculation current, the H-bridge can operate in two different
states: fast decay or slow decay. In fast decay mode, the H-bridge is disabled and recirculation current flows
through the body diodes; in slow decay, the motor winding is shorted.
To PWM using fast decay, the PWM signal is applied to one xIN pin while the other is held low; to use slow
decay, one xIN pin is held high.
Table 2. PWM Control of Motor Speed
xIN1
xIN2
FUNCTION
PWM
PWM
PWM
PWM
DRV8833
SLVSAR1E JANUARY 2011 REVISED JULY 2015
www.ti.com
Figure 6 shows the current paths in different drive and decay modes.
VM
VM
1 Forward drive
1
xOUT2
xOUT1
1 Reverse drive
1
2 Fast decay
3 Slow decay
xOUT1
FORWARD
2 Fast decay
xOUT2
3 Slow decay
REVERSE
Figure 6. Drive and Decay Modes
(1)
Example: If a 1- sense resistor is used, the chopping current will be 200 mV/1 = 200 mA.
Once the chopping current threshold is reached, the H-bridge switches to slow decay mode. Winding current is
recirculated by enabling both of the low-side FETs in the bridge. This state is held until the beginning of the next
fixed-frequency PWM cycle.
If current control is not needed, the xISEN pins should be connected directly to ground.
10
DRV8833
www.ti.com
CONDITION
ERROR REPORT
H-BRIDGE
INTERNAL
CIRCUITS
RECOVERY
VM undervoltage
(UVLO)
VM < 2.5 V
None
Disabled
Disabled
VM > 2.7 V
Overcurrent (OCP)
FAULTn
Disabled
Operating
OCP
Thermal Shutdown
(TSD)
TJ > TTSD
FAULTn
Disabled
Operating
CONDITION
H-BRIDGE
INTERNAL CIRCUITS
Operating
Operating
Operating
Sleep mode
Disabled
Disabled
Fault encountered
Disabled
See Table 3
Submit Documentation Feedback
11
DRV8833
SLVSAR1E JANUARY 2011 REVISED JULY 2015
www.ti.com
IN1
IN2
12
16
AIN1
15
AIN2
9
BIN1
10
BIN2
1
VCP
C1
0.01uF
11
2
AOUT1 4
AOUT2
7
BOUT1
BOUT2 5
NSLEEP
NFAULT
PP
GNDP
13
GND
C4 +
10uF
VM
U1
DRV8833
From Controller
14
VINT
AISEN 3
BISEN 6
C2
2.2uF
R2
200m
REFERENCE
EXAMPLE VALUE
Motor voltage
VM
10 V
0.8 A
IRMS
ISTART
2A
ITRIP
2.5 A
DRV8833
www.ti.com
(2)
13
DRV8833
SLVSAR1E JANUARY 2011 REVISED JULY 2015
www.ti.com
Power Supply
Parasitic Wire
Inductance
Motor
Driver
GND
Local
Bulk Capacitor
IC Bypass
Capacitor
Figure 9. Example Setup of Motor Drive System With External Power Supply
The voltage rating for bulk capacitors should be higher than the operating voltage, to provide margin for cases
when the motor transfers energy to the supply.
14
DRV8833
www.ti.com
10 Layout
10.1 Layout Guidelines
The VM pin should be bypassed to GND using low-ESR ceramic bypass capacitors with a recommended value
of 10-F rated for VM. This capacitor should be placed as close to the VM pin as possible with a thick trace or
ground plane connection to the device GND pin.
A low-ESR ceramic capacitor must be placed in between the VM and VCP pins. TI recommends a value of 0.01F rated for 16 V. Place this component as close to the pins as possible.
Bypass VINT to ground with a 2.2-F ceramic capacitor rated 6.3 V. Place this bypass capacitor as close to the
pin as possible.
10.1.1 Heatsinking
The PowerPAD package uses an exposed pad to remove heat from the device. For proper operation, this pad
must be thermally connected to copper on the PCB to dissipate heat. On a multilayer PCB with a ground plane,
this can be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs
without internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area
is on the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and
bottom layers.
For details about how to design the PCB, refer to TI application report, PowerPAD Thermally Enhanced
Package (SLMA002) and TI application brief, PowerPAD Made Easy (SLMA004), available at www.ti.com.
In general, the more copper area that can be provided, the more power can be dissipated.
NOTE
The PW package option is not thermally enhanced and TI recommends adhering to the
power dissipation limits.
nSLEEP
AIN1
AOUT1
AIN2
AISEN
VINT
AOUT2
GND
BOUT2
VM
BISEN
VCP
BOUT1
BIN2
nFAULT
BIN1
2.2 F
RAISEN
.01 F
RBISEN
10 F
15
DRV8833
SLVSAR1E JANUARY 2011 REVISED JULY 2015
www.ti.com
where
(3)
RDS(ON) increases with temperature, so as the device heats, the power dissipation increases. This must be taken
into consideration when sizing the heatsink.
16
DRV8833
www.ti.com
11.3 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
17
www.ti.com
26-Apr-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
DRV8833PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
8833PW
DRV8833PWP
ACTIVE
HTSSOP
PWP
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DRV8833
DRV8833PWPR
ACTIVE
HTSSOP
PWP
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DRV8833
DRV8833PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
8833PW
DRV8833RTYR
ACTIVE
QFN
RTY
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DRV8833
DRV8833RTYT
ACTIVE
QFN
RTY
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DRV8833
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
www.ti.com
26-Apr-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
27-Apr-2015
Device
SPQ
DRV8833PWPR
HTSSOP
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
PWP
16
2000
330.0
12.4
6.9
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
5.6
1.6
8.0
12.0
Q1
DRV8833PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
DRV8833RTYR
QFN
RTY
16
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
DRV8833RTYT
QFN
RTY
16
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
Pack Materials-Page 1
27-Apr-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV8833PWPR
HTSSOP
PWP
16
2000
367.0
367.0
35.0
DRV8833PWR
TSSOP
PW
16
2000
367.0
367.0
35.0
DRV8833RTYR
QFN
RTY
16
3000
367.0
367.0
35.0
DRV8833RTYT
QFN
RTY
16
250
210.0
185.0
35.0
Pack Materials-Page 2
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