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RClamp7535M

Low Capacitance TVS for


LVDS Interfaces
PROTECTION PRODUCTS - RailClamp
Description

Features
Transient protection for high-speed data lines to

RailClamp TVS diode arrays are specifically designed


to protect sensitive components which are connected
to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast
transients).
The unique design incorporates surge rated, low
capacitance steering diodes and a TVS diode in a
single package. This allows the device to absorb large
amounts of energy while protecting downstream
components from harmful transient events.
The RClamp7535M is in a 10-pin MSOP package. The
leads are finished with lead-free matte tin. Each
device will protect up to eight high-speed lines. They
may be used to meet the ESD immunity requirements
of IEC 61000-4-2, Level 4 (15kV air, 8kV contact
discharge). The combination of small size, low capacitance, and high ESD surge capability makes them ideal
for use in applications such as next generation color
LCD displays and LVDS interfaces.

IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)


IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 25A (8/20s)
Array of surge rated diodes with internal TVS Diode
Small package saves board space
Protects up to eight I/O lines
Low capacitance (<5pF) for high-speed interfaces
Low leakage current and clamping voltage
Low operating voltage: 2.5V
Solid-state silicon-avalanche technology

Mechanical Characteristics

JEDEC MSOP-10L package


Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead Finish: Matte Sn
Molding compound flammability rating: UL 94V-0
Marking : Marking code + Date code
Packaging : Tape and Reel

Applications
LVDS Interfaces
LCD TV

Circuit Diagram

PIN Configuration

10

Line 1 1

Line 8

Line 2

Line 7

Line 3

Line 6

Line 4

Line 5

NC

GND

Pin Assignments
Revision 12/14/2010

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RClamp7535M
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating

Symbol

Value

Units

Peak Pulse Power (tp = 8/20s)

Pp k

300

Watts

Peak Pulse Current (tp = 8/20s)

IP P

30

ESD p er IEC 61000-4-2 (Air)


ESD p er IEC 61000-4-2 (Contact)

VESD

25
15

kV

TJ

-55 to +125

TSTG

-55 to +150

Op erating Temp erature


Storage Temp erature

Electrical Characteristics (T=25oC)


Parameter
Reverse Stand-Off Voltage

Symbol

Conditions

Minimum

Typical

VRWM

Maximum

Units

2.5

Punch-Through Voltage

V PT

IPT = 2A
Any I/O to GN D

2.7

Snap -Back Voltage

VSB

ISB = 50mA
Any I/O to GN D

2.0

Reverse Leakage Current

IR

VRWM = 2.5V, T=25C


Any I/O to GN D

0.5

Clamp ing Voltage

VC

IPP = 1A, tp = 8/20s


Any I/O to GN D

4.5

Clamp ing Voltage

VC

IPP = 10A, tp = 8/20s


Any I/O to GN D

6.5

Clamp ing Voltage

VC

IPP = 25A, tp = 8/20s


Any I/O to GN D

10

Junction Cap acitance

Cj

Between I/O p ins and Ground


VR = 0V - 2.5V, f = 1MHz

pF

Between I/O p ins


VR = 0V - 2.5V, f = 1MHz

2.0

pF

Note 1: I/O pins are pin 1, 2, 3, 4, 7, 8, 9, 10

2010 Semtech Corp.

www.semtech.com

RClamp7535M
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time

Power Derating Curve

10

110

90

% of Rated Power or PI P

Peak Pulse Power - PPP (kW)

100

0.1

80
70
60
50
40
30
20
10
0

0.01
0.1

10

100

1000

25

Pulse Duration - tp (us)

110

Percent of I PP

80
-t

50
40

125

150

8
Clamping Voltage -VC (V)

90

60

100

Waveform
Parameters:
tr = 8s
td = 20s

100

75

Clamping Voltage vs. Peak Pulse Current


Any I/O to GND (tp = 8/20us)

Surge Current Output Waveform


(tp = 8/20us)

70

50

Ambient Temperature - TA (oC)

td = IPP/2

30
20

7
6
5
4
3

Waveform
Parameters:
tr = 8s
td = 20s

2
1

10
0

10

15

20

25

30

Time (s)

10

15

20

25

Peak Pulse Current - IPP (A)

ESD Clamping
(8kV Contact per IEC 61000-4-2)

Normalized Capacitance vs. Reverse Voltage

1.5
1.4

Cj(VR) / Cj(VR=0V)

1.3
1.2
1.1
1
0.9
0.8
0.7
0.6

f = 1 MHz

0.5
0

0.5

1.5

2.5

Reverse Voltage - VR(V)

Note: Data is taken with a 10x attenuator


2010 Semtech Corp.

www.semtech.com

RClamp7535M
PROTECTION PRODUCTS
Typical Characteristics
Insertion Loss S21 (I/O to I/O)

Insertion Loss S21 (I/O to Gnd)


CH1 S21

LOG

6 dB / REF 0 dB

CH1 S21

LOG

6 dB / REF 0 dB
1: -.46620 dB
800 MHz

1: -.93040 dB
800 MHz
2: -1.0405 dB
900 MHz

0 dB

0 dB
12

12

-6 dB

3
5

-12 dB
4

-18 dB

3: -4.8955 dB
1.8 GHz

-12 dB

-30 dB

-36 dB

-36 dB

10
MHz

100
MHz

1
MHz

3
1
GHz GHz
STOP 3000. 000000 MHz

START . 030 MHz

3: -2.0869 dB
2.7 GHz

-24 dB

-30 dB

1
MHz

4: -1.1819 dB
2.5 GHz

-18 dB

3: -10.844 dB
2.7 GHz

-24 dB

3: -1.1235 dB
1.8 GHz

-6 dB

3: -13.740 dB
2.5 GHz

2: -.51950 dB
900 MHz

START . 030 MHz

10
MHz

100
MHz

3
1
GHz GHz
STOP 3000. 000000 MHz

Analog Crosstalk
CH1 S21

LOG

START . 030 MHz

2010 Semtech Corp.

20 dB /REF 0 dB

STOP 3000. 000000 MHz

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RClamp7535M
PROTECTION PRODUCTS
Applications Information
Device Connection Options for Protection of Eight
High-Speed Data Lines

The RClamp7535M is constructed using Semtechs


proprietary EPD process technology. The EPD process
provides low stand-off (turn-on) voltages with
significant reductions while maintaining good clamping
characteristics and high surge capability. They feature
a true operating voltage of 2.5 volts. The
characteristics of the RClamp7535M eliminate the
need to add an external resistor for protection of LVDS
interfaces.

This device is designed to protect high-speed data


lines. When the voltage on the protected line exceeds
the breakdown voltage of the internal TVS diode, the
steering diodes are forward biased, conducting the
transient current away from the sensitive circuitry to
ground.
Data lines are connected at pins 1 - 4 and 7 - 10. Pin
6 should be connected directly to a ground plane. The
path length is kept as short as possible to minimize
parasitic inductance. When configured as shown, a
LVDS chip may withstand up to 10A for a 2/10 us
impulse waveform.

I/O In 1

To Protected IC

I/O In 2

To Protected IC

I/O In 1

To Protected IC

I/O In 1

To Protected IC

RClamp7535M

I/O In 1

To Protected IC

I/O In 2

To Protected IC

I/O In 1

To Protected IC

I/O In 1

To Protected IC

Protection of Eight Data Lines

2010 Semtech Corp.

www.semtech.com

RClamp7535M
PROTECTION PRODUCTS
Applications Information - Spice Model

Spice Model

R Clamp7535M Spice Parameters

2010 Semtech Corp.

Parameter

Unit

D1 (LCR D)

D2 (LCR D)

D3 (T VS)

IS

Amp

1E-20

1E-20

1.66E-13

BV

Volt

100

100

2.89

VJ

Volt

0.72

0.67

0.53

RS

Ohm

0.329

0.241

0.06

IB V

Amp

1E-3

1E-3

1E-3

CJO

Farad

1.7E-12

1.7E-12

288E-12

TT

sec

2.541E-9

2.541E-9

2.541E-9

--

0.01

0.01

0.17

--

1.1

1.1

1.1

EG

eV

1.11

1.11

1.11

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RClamp7535M
PROTECTION PRODUCTS
Outline Drawing - MSOP-10L

e
A

DIM

A
A1
A2
b
c
D
E1
E
e
L
L1
N
01
aaa
bbb
ccc

N
SEE DETAIL
SIDE VIEW

2X E/2
E1

PIN 1
INDICATOR
ccc C
2X N/2 TIPS

H
12

GAGE
PLANE

0.25

01

(L1)
D
DETAIL

aaa C
A2
SEATING
PLANE
C

DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.043
.000
.006
.030
.037
.007
.011
.003
.009
.114 .118 .122
.114 .118 .122
.193 BSC
.020 BSC
.016 .024 .032
(.037)
10
0
8
.004
.003
.010

1.10
0.00
0.15
0.95
0.75
0.17
0.27
0.23
0.08
2.90 3.00 3.10
2.90 3.00 3.10
4.90 BSC
0.50 BSC
0.40 0.60 0.80
(.95)
10
0
8
0.10
0.08
0.25

A1
bxN
bbb

C A-B D

NOTES:
1.

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MO-187, VARIATION BA.

Land Pattern - MSOP-10L

DIM
(C)

C
G
P
X
Y
Z

DIMENSIONS
INCHES
MILLIMETERS
(.161)
.098
.020
.011
.063
.224

(4.10)
2.50
0.50
0.30
1.60
5.70

NOTES:
1.

2010 Semtech Corp.

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.


CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.

www.semtech.com

RClamp7535M
PROTECTION PRODUCTS
Marking

Ordering Information

7535

Part Number

Lead
Finish

Qty per
Reel

R eel Size

RClamp 7535M.TLT

Matte Sn

3000

13 Inch

RailClamp and RClamp are marks of Semtech Corporation

YYWW

YYWW = Date Code

Tape and Reel Specification

Device Orientation in Tape

A0
5.30 +/-0.20 mm

B0

K0

3.40 +/-0.20 mm

Tap e
Width

B, (Max)

12 mm

8.2 mm

1.5 + 0.1 mm
- 0.0 mm )

1.40 +/-0.10 mm

D1

0.5 mm
0.05

1.750.10
mm

K
(MAX)

P0

P2

T(MAX)

5.50.05
mm

4.5 mm

8.00.1
mm

4.00.1
mm

2.00.05
mm

0.4 mm

12.0 mm
0.3 mm

Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
2010 Semtech Corp.

www.semtech.com

Mouser Electronics
Authorized Distributor

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Semtech:
RCLAMP7535M.TLT

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