Beruflich Dokumente
Kultur Dokumente
Manufacturing Technology
Chapter 1, Introduction
Hong Xiao, Ph. D.
hxiao89@hotmail.com
Hong Xiao, Ph. D.
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Objective
After taking this course, you will able to
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Topics
Introduction
IC Device and Design
Semiconductor Manufacturing Processes
Future Trends
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Introduction
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Photo courtesy:
AT&T Archive
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Moores Law
Intel co-founder Gorden Moore notice in 1964
Number of transistors doubled every 12 months
while price unchanged
Slowed down in the 1980s to every 18 months
Amazingly still correct, likely to keep until
2010.
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10M
80486
1M
80386
100K
10K
Pentium
8086
4040
80286
8080
1K
1975
Hong Xiao, Ph. D.
1980
1985
1990
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1995
2000
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IC Scales
Integration level
Abbreviation
SSI
2 to 50
MSI
50 to 5,000
LSI
5,000 to 100,000
VLSI
100,000 to 10,000,000
ULSI
10,000,000 to 1,000,000,000
SLSI
over 1,000,000,000
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1995
1997
1999
2001
2004
2007
0.35
0.25
0.18
0.13
0.10
0.07
64 M
256 M
1G
4G
16 G
64 G
0.017
0.007
0.003
0.001
0.0005
0.0002
4M
7M
13 M
25 M
50 M
90 M
0.5
0.2
0.1
0.05
0.02
2M
4M
7M
13 M
25 M
40 M
0.3
200
0.1
200
0.05
200 300
0.03
300
0.02
300
0.01
300
400 (?)
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Chip
or die
with 0.25 m
technology
200 mm
with 0.18 m
technology
300 mm
150 mm
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Source
n+
n+
Ultra shallow junctions
P-type substrate
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IC Design: First IC
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Vin
IC Design:
CMOS Inverter
(a)
Vdd
NMOS
PMOS
Vss
Vout
(b)
P-well
N-well
Metal 1
Contact
Metal 1, AlCu
W
PMD
n+
n+
STI
P-Well
p+
p+
N-Well
P-Epi
(c)
P-Wafer
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Mask 1, N-well
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11, contact
Mask 2, P-well
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Mask/Reticle
Pellicle
Chrome pattern
Quartz substrate
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A Mask
and
a Reticle
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IC Fab
Metallization
CMP
Dielectric
deposition
Test
Wafers
Thermal
Processes
Implant
PR strip
Etch
PR strip
Packaging
Masks
Photolithography
Final Test
Design
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