MPM01 MPM04 Application Note

Application Information
MPM Series DC-to-DC Converter Modules
General Description
The MPM (Micro Power Module) series is a hybrid IC
which incorporates a non-isolated buck DC-to-DC converter
circuit with an inductor in a single fully molded package.
The IC enables designing a power supply circuit with fewer
external components. It is ideal for the replacement of a
discrete DC-to-DC converter IC, such as a local regulator
on various systems, to lower component count, and to save
space.
Features and Benefits
Fewer external components required: IC operates just by

connecting an input smoothing capacitor, an output smoothing capacitor, and output voltage setup resistance.
Built-in inductor: Built-in power inductor eliminates
requirement to evaluate and select the inductor separately.
Sanken proprietary fully molded and integrated package:
The full-mold package allows a screw clamp connection to
a heatsink. Depending on an output voltage setup and load
conditions, the IC can be operated without a heatsink.
Wide input voltage range, high efficiency: Input voltage
range of 9 VDC to output of 16 to 40 V. When VO = 12 V
at 3 A, the efficiency is 91% (typ).
Various protection functions: Protection functions such
as Overcurrent protection (OCP), Overvoltage protection
(OVP) and Thermal Shutdown (TSD) are built-in.
Built-in phase compensation: Eliminates the requirement
for an external constant clock; the reference voltage of the
IC output has 0.5 V 2% accuracy, and is a control drive
type phase compensation.
MPM-AN
January 31, 2013
Figure 1. MPM series packages are fully molded DIPs (3GR-S

package) with a tab for external heatsink screw clamp mounting.
The product lineup for the MPM series provides the following
options:
Input
Voltage
(VDC)
Output
Voltage
(VDC)
MPM01
9 to 40
1.8 to 12
250
MPM04
16 to 40
12 to 24
250
Part
Number
SANKEN ELECTRIC CO., LTD.

http://www.sanken-ele.co.jp/en/
Output
Current
(A)
Drive
Frequency
(kHz)
March 2012
Functional Block Diagram

8,9
MPM
SW
VIN
SVIN
BS
SW
High-side
MOSFET
EN_SS
MIC
FSET
Built-in coil
VO
FB
R3
AGND COMP PGND LS_GATE
Low-side
MOSFET
VIN
2
GND
FB
OUT
1,3
5,6,7
RFB
CIN
Pin-out Diagram
GND
GND
OUT
GND
VIN
Input power pin
GND
Ground pin
FB
5, 6, 7
OUT
Output pin
8, 9
SW
Oscillation frequency measuring pin
6
7
SW
SW
Name
OUT
OUT
Number
FB
8
9
Pin List Table
VIN
CO
Function
Ground
Feedback pin, and connection pin for resistor RFB for output voltage setup
Table of Contents
Package Diagram
Electrical Characteristics
Temperature Derating Curves
Typical Application Circuits
Setting Output Voltage
Minimum Input/Output Voltage Difference
Choosing the Input-Smoothing Capacitance, CIN
Choosing the Output-Smoothing Capacitance, CO
Evaluation Board for MPM0x Series
Static Performance Characteristics
Estimated Lift Characteristics
Temperature Difference versus Acceleration Factor
MPM-AN
3
4
6
7
7
8
8
9
11
12
13
14
15
March 2012
Package Diagram
3GR-S package
15.5 0.2
3
Gate protrusion
5 0.2
23 0.3
5 0.2
3.2 0.2
3.3 0.1
(At roots of pins)
(7)
R-End
R-End
+0.2
1.35 0.1
+0.2
0.85 0.1
+0.2
0.65 0.1
3.1 0.5
+0.2
2.15 0.1
2 - (R1.3)
10.1 0.5
3.3
3.3 0.5
4.5 0.7
(At tips of pins)
8xP2.540.1 = (20.32)
(At roots of pins)
24.20.2
Case centerline
Branding
Line A: MPMxx
Line B: Lot number
Pin centerline
0.4
Leadform: LF971
Pin material: Cu
Pin coating: Nickle and solder dip
Weight: Approximately 20 g
Screw clamp bolting torque: 0.588 to 0.785 N m
0.7
0.7
Front View
Pb-free. Device composition compliant

with the RoHS directive.
MPM-AN
March 2012
Electrical Characteristics
This section provides electrical characteristic data for each product.
The polarity value for current specifies a sink as "+ ," and a source as , referencing the IC.
Please refer to the datasheet of each product for additional details.
Absolute Maximum Ratings

Characteristic
Symbol
Notes
Rating
Unit
V
VIN Pin Voltage
VIN
0.3 to 41
FB Pin Voltage
VFB
0.3 to 6
MPM01
0.3 to 13
MPM04
0.3 to 28.8
55
20 to 150
Tstg
20 to 120
RJ-F
7.7
C/W
VO Pin Voltage
Voltage Between VIN and SW Pins
Operating Ambient Temperature
Storage Temperature
Thermal Resistance (MIC to
leadframe)
VO
VVIN-SW
Limited due to the overtemperature protection;

overtemperature protection detection
temperature is about 160C
Tj
Recommended Operating Conditions1

Characteristic
Symbol
Input Voltage Range2
VIN
Output Current Range3
IO
Operating Junction Temperature
TJOP
Operating Ambient Temperature3
TA
Test Conditions
Min.
Max.
Unit
MPM01
40
MPM04
16
40
20
125
20
85
With derating
1A
recommended operating conditions is an operating condition required in order to maintain the normal circuit functions shown in the
Electrical Characteristics table, and it is necessary to remain within the condition in actual use.
2Depending on the setup of the output voltage, V , V (min) < V condition may occur. Because this product is not a boost regulator,
O
IN
O
VIN > VO shall be a condition of operation. Please refer to the Minimum Input/Output Voltage Difference section.
3However, it is necessary to use it within a derating curve. Please refer to Temperature Derating curves.
MPM-AN
March 2012
Electrical Characteristics1 Unless specifically noted, TA is 25C

Characteristic
Symbol
Reference Voltage
VFB(REF)
Test Conditions
VIN = 33 V, set on IO = 1 A
Min.
Typ.
Max.
Unit
0.490
0.500
0.510
Efficiency2
VIN = 33 V, VO = 12 V, set on IO = 3 A
91
SW Frequency
fO
VIN = 33 V, VO = 12 V, set on IO = 3 A
212
250
288
kHz
Line Regulation3
VLINE
Input VIN = 16 to 40 V, set on VO = 12 V,

IO = 1 A
Load Regulation3
VLOAD
VIN = 33 V, VO = 12 V, set on IO = 0 to 3 A
3.2
5.60
12
mA
151
160
7.3
8.0
50
ms
Over Current Protection Starting

Current4
IS
Set VIN = 33 V, VO = 12 V, auto restart / voltage

drooping over current protection
Input Circuit Current
IIN
VIN = 33 V, IO = 0 A, VFB = 1 V
MIC Thermal Protection Start-up

Temperature5
TJ
Input VIN = 16 to 40 V
Supply Voltage Undervoltage

Protection
VUVLO
Start-up Delay Time
tSTART
1Values
VIN =16 to 40 V, start-up to VO reaching the

target voltage level
apply when the device is configured as shown in the Standard Connection Diagram.
is calculated by the following formula:
2Efficiency
(%) =
VO IO
VIN IIN
100
(1)
3The
value for VO cited here is nominal, and does not take take into consideration variance of the external resistor RFB (VO is set by RFB, please refer
to the Application section for details). To determine the actual load regulation, the user must check the variance of RFB in the application.
4Because the inductance of the built-in coil and the frequency of output are constant, the OCP operating point may vary when V is not 12 V. In using
O
the device at a VO other than 12 V, the user must check the actual OCP operating point in the application.
5Thermal protection has automatic restart.
MPM-AN
March 2012
Temperature Derating Curves

3.5
3.0
VO = 12 V, VIN = 33 V
VO = 15 V, VIN = 33 V
IO (A)
2.5
2.0
VO = 18 V, VIN = 33 V
1.5
VO = 20 V, VIN = 33 V
1.0
VO = 24 V, VIN = 36 V
0.5
0
-20
-10
10
20
30
40
50
60
70
80
90
100
TA (C)
Figure 2a. Ambient Temperature versus Output Current Derating (1), VIN = 33 V or 36 V
3.5
3.0
VO = 5 V, VIN = 24 V
IO (A)
2.5
VO = 12 V/15 V, VIN = 24 V
2.0
1.5
VO = 18 V, VIN = 24 V
1.0
0.5
0
-20
-10
10
20
30
40
50
60
70
80
90
100
TA (C)
Figure 2b. Ambient Temperature versus Output Current Derating (2), VIN = 24 V
Note 1: Traces for VO = 5 to 12 V indicate MPM01 performance, traces for VO = 15 to 24 V

indicate MPM04.
Note 2: Graphs are under these conditions: without heat sink and air cooling without fan.
(Screw clamp heatsink mounting is an option for the application.)
Note 3: To estimate performance for VO = 2.5 V and 3.3 V, please use the trace for
VO = 5 V, as shown in figure 4.
MPM-AN
March 2012
Typical Application Circuits
8
SW
SW
MPM Series
2
VIN
GND GND
1
C1
5
6
7
OUT
OUT
OUT
FB
C2
C3
Load
RFB
Pins 8 and 9 (SW) are test-only terminals for measuring oscillating

frequency. Please leave open for normal operation.
C1, C2, C3 recommended values switching mode power supply
applications, not for general electronic circuits:
C1: 50 V / 1000 F
C2, C3: 25 V / 1000 F 2 units
RFB is the resistance for setting output voltage. Refer to the Setting
Output Voltage section.
Figure 3. Standard connection diagram
RFB
MPM0x
2
1
4
3
6
5
8
7
(Top View)
VIN
GND
CIN
+
CO
(C2)
OUT
CO
(C3)
It is recommended that the traces between the negative side of the output
capacitors (CO) and the GND pins (1 and 3), be as short as possible in
order to minimize the impedance of the loop, including the IC internal
circuit.
Pins 8 and 9 (SW) are test-only terminals for measuring oscillating
frequency. Please leave open for normal operation. The pins should be
mounted only on isolated lands, and should not connect with traces of
other potentials. That might cause a failure.
Please place RFB as near the IC as possible, with the shortest trace
length. The circuit may malfunction if the RFB trace is too long.
GND
Figure 4. Recommended board layout
MPM-AN
March 2012
Setting Output Voltage

Output voltage is set by the value selected for RFB (see figure 7),
according to the following formula:
VO = VFB 1 +
R3
RFB
(2)
table, VIN must, however, be within the specified maximum and

the minimum values range. For example, although for MPM01, at
VO =2.5 V the recommended the minimum input-and-output voltage difference is 6.5 V (VIN 2.5 V + 4 V), keep in mind that the
Recommended Operating Condition is VIN 9 V minimum.
Figure 8 shows the value of VO for various RFB values. The limit
at VO = 12 V applies to the MPM01, which has an Absolute
Maximum Rating of 13 V.
The MPM series has fixed frequency and inductance. In the case
where the duty cycle exceeds 50%, there is a concern about the
occurrence of subharmonic oscillation. To ensure proper operation of the device, please refer to the input / output conditions
listed in the table 1 and check the operation of the device with
recommended input / output voltage ratings in the application.
Minimum Input/Output Voltage Difference

Table 1 shows the recommended value of the required input
voltage, VIN , to provide a specific VO value. Although the VIN
recommended value is shown as greater than the value in the
Although for the MPM04 a VIN more than 36 V is recommended

for VO = 24 V, because that would provide only a small margin
below the recommended maximum 40 V, the power supply voltage should be stabilized before being applied to the MPM04.
RFB for output voltage VO = 5 V can be calculated as 500 , and

for VO =12 V as 200 (typical value).
L1
9.1 H 20%
R3
4.6 k 1%
MIC
MPM
5,6,7
OUT
4
FB
Table 1. Input/Output Differences
VFB = 0.5 V 2%
Output
Voltage,VO
External
RFB Output
Voltage,VO
Setting
Resistor
Part
Number
VIN Voltage
(V)
VO Setting
(V)
Input Voltage
Recommended
Value
MPM01
9 to 40
1.8 to 12
VIN VO + 4 V
MPM04
16 to 40
12 to 18
VIN VO + 4 V
20
30 V VIN 40 V
24
36 V VIN 40 V
VO (V)
Figure 7. RFB placement for output voltage setting
26
24
22
20
18
16
14
12
10
8
6
4
2
0
MPM01 Typical VO Value
100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900
RFB ()
Figure 8. MPM04 RFB constant versus output voltage Vo setting curve
MPM-AN
March 2012
Choosing the Input-Smoothing Capacitance, CIN

For both the MPM01 and MPM04, there are three conditions
that must be taken into consideration for calculating a value for
the input smoothing capacitor CIN : supply ripple current, supply
ripple voltage, and rated voltage of the capacitor, described as
follows.
where L indicates the inductance of the IC built-in coil, and tON

indicates the on-time.
1. Determine Supply Ripple Current Conditions

Assuming zero impedance between the power supply and VIN,
the power supply would provide 100% of power to the VIN terminal and no ripple current would flow to the smoothing capacitor. But in the actual circuit, power supplied from the supply
source will vary due to impedance. When specifying the capacitor rating, this case assumes that the smoothing capacitor supplies
full power to VIN, as a worst case.
Ripple current valley equation
For the following discussion, refer to figures 9 and 10 for a typical input capacitor circuit and circuit current behavior.
Given:
ICIN(av) = IO D
(3)
where D indicates the capacitor duty cycle (ratio of tON to tOFF),

and IO indicates the load current.
IL =
( VIN VO ) tON
L
Ripple current peak equation

ILp' = IO +
ILv' = IO
IL
2
IL
2
ICIN(av)
(5)
ICIN(av)
(6)
Because the ripple current of the capacitor is an AC waveform,

it is calculated as the square root of the sum of the squares of the
discharge and charge ripple currents:
Ripple current during discharging equation
ICINRIPPLE(DIS) =
tON [I 2Lp' + (ILp' ILv' ) + I 2Lv' ]

3T
(7)
where T indicates the period of the combined charge-discharge

cycle.
Ripple current during charging equation
ICINRIPPLE(CHG) =
(4)
(8)
(1 D) I 2CIN(av)
Combined ripple current equation for input smoothing capacitor

MPM0x
VIN
GND
Charge
(tOFF)
ICINRIPPLE =
I 2CINRIPPLE(DIS) + I 2CINRIPPLE(CHG)
(9)
Example
Discharge
(tON)
Given: VIN = 24 V , VO = 12 V, IO = 3 A , charge-discharge cycle

frequency = 250 kHz, T = 4 s, D for VO / VIN = 0.5, tON = 2 s,
inductance of IC built-in inductor = 9.1 H.
Substituting into equation 3:
ICIN(av) = 3 (A) 0.5 = 1.5 A
Figure 9. Charge/discharge of an input capacitor

ILp'
IL =
IL
(24 (V) 12 (V)) 2 (s)

= 2.637 A
9.1 (s)
IO
CIN discharging
ILp' = 3 (A) +
2.637 (A)
2
1.5 (A) = 2.8185 (A)
ILv '
ICIN(av), 0
CIN charging
tON
ILv' = 3 (A)
2.637 (A)
2
1.5 (A) = 0.8185 (A)
Figure 10. The ripple current model of an input capacitor
MPM-AN
March 2012
From the calculated ILp' and ILv' , ICINRIPPLE(DIS) can be calculated

by substituting into equation 7:
ICINRIPPLE(DIS) =
2 (s) [2.81852 (A) + (2.8185 (A)

0.1815 (A)) + 0.18152 (A) ]
3 4 (s)
= 1.1894 (A)
Also, ICINRIPPLE(CHG) will be can be calculated by substituting into
equation 8:
voltage on a 24 VAC / 50 kHz voltage waveform.

To estimate the valley point of the ripple voltage that arises
when the smoothing capacitor is discharging to load from a VIN
with a peak 24 VACrms, the direct voltage should be doubled
to approximately 33 V, with a margin of 20%, or 6.6 V from
the valley point. Although the 20% margin is optional, and the
greater the value, the lower the circuit capacity, please keep in
mind that a large utility mains frequency component will also be
passed through as ripple on the output voltage, VO .
CIN can be calculated as follows:
ICINRIPPLE(CHG) = (1 0.5) 1.52 (A) = 1.0606 (A)
CIN
Therefore, the input smoothing capacitor combined ripple current

ICINRIPPLE(DIS) can be calculated by substituting into equation 9:
ICINRIPPLE =
1.1894 (A) + 1.0606 (A) = 1.594 (Arms)
It is required to select an input smoothing capacitor which can

support the above-calculated ripple current. Please refer to a
capacitor manufacturer catalog in order to select a capacitor rated
for this ripple current.
2. Determine Supply Ripple Voltage Conditions
This case explains how to determine ripple voltage, VIN , for
24 VAC / 50 Hz input. Refer to figure 11, which shows the ripple
IO D (1 D)
fr VIN
(10)
If D is the duty cycle, with VIN = 33 V and VO = 12 V,

D = 12 V / 33 V = 0.3636. Substituting into equation 10:
CIN
3 (A) 0.3636 (1 0.3636)

1051 (F)
100 (Hz) 6.6 (V)
(10)
A capacitance of 1051 F or more is required for the smoothing capacitor, CIN. Thus, when bridge-rectifying 24 VAC, the
required capacitance of the smoothing capacitor changes considerably according to the valley point of of the voltage ripple of the
utility mains.
Peak = 33 V
VIN
Valley = 26.4 V
0V
Figure 11. VIN ripple voltage resulting from smoothing the full wave rectification of utility mains
frequency with a CIN of 1000 F and a load after smoothing of 33 W. Blue trace is VIN ripple
(10 V / div.), red is VIN 24VAC, 50 Hz (10 V / div), time is 4.8 ms / div.
MPM-AN
March 2012
10
In the case where a user has a stable 24 VDC supply voltage, it

is not required to have a 1051 F capacitor. But we recommend
having a capacitor which can supply at least ICINRIPPLE (obtained
from equation 9). Because CIN has a role in avoiding operating
failure, please do not use the device without CIN .
3. Rated Voltage of the Capacitor
Assuming full wave rectification of the 24 VAC supply, because
there is no margin, the impedance beyond 50 V should be calculated at a 35 V impedance.
In summary, the value for the input smoothing capacitor, CIN ,
should be determined by considering the following conditions:
The capacitor, CIN, shall have sufficient ripple current calculated
by the formulas
When the device is used at 24 VAC / 50 Hz as introduced as a
case, a user should consider the valley point of the ripple voltage
and choose a capacitor which can match the voltage
A sufficiently high impedance that can provide an adequate
margin, rather than one based on just the maximum VIN
The selected capacitor should be from a series specified for
switching mode power supply use in the capacitor manufacturer
catalog.
VRIPPLE = 2.637 (A) 20 (m) = 52.7 (mVpp)

In order to calculate the ESR based on a ripple voltage of
100 mVpp , rearrange equation 11:
ESR = VRIPPLE / IL
Substituting into equation 12 :
ESR = 100 (mV) / 2.637(A) = 37.92 (m)
This, it is required to have electrolytic capacitance connected
which has the ESR characteristic not more than 37.9 m at room
temperature.
2. Determine Output Ripple Current Conditions
Next, the ripple current which flows into the output smoothing
capacitance, CO , is given by the equation 13, ICO(RIPPLE) , providing a practical means of calculating the critical current, IL of the
inductor:
ICO(RIPPLE) = IL / (23 )
(13)
Example
Choosing the Output-Smoothing Capacitance, CO

Neither the MPM01 nor the MPM04 have a built-in output
smoothing capacitor. The user should evaluate the application
requirements and mounting conditions to select and place an
external output smoothing capacitor.
Example
0.1
55C
25C
0.01
20C
85C
0.001

At room temperature conditions (see figure 12), assume ESR
temporarily set to 20 m, and IL = 2.637 A from equation 4,
substituting into equation 11:
MPM-AN
Impendance ()
1. Determine Output Ripple Current Conditions

Output ripple voltage is determined by the critical current, IL , of
the inductor, and the ESR (Equivalent Series Resistance), which
is a characteristic of the capacitor. Thus, ripple can be obtained
by the following formula:
VRIPPLE = IL ESR
(11)
Using IL = 2.637 A from equation 4, and multiplying that value
with the ESR of the smoothing capacitor, the output ripple voltage can be calculated.
(12)
0.1
10
100
1000
Frequency (kHz)
Figure 12. Temperature characteristics of aluminum electrolytic capacitor

impedance
March 2012
11
Calculate by substituting into equation 4.

IL =
( 24 (V) 12 (V ) 2 )
= 2.637 (A)
9.1 (H)

ICO(RIPPLE) = 2.637 (A) / (2
3 ) = 0.761 (Arms)
The selected capacitor should be specified with sufficient margin
above 0.761 (Arms) in the capacitor manufacturer catalog.
3. Determine Breakdown Voltage
Although in the above example, VO = 12 V, it is recommended
that the output smoothing capacitor be rated for more than 16 V
breakdown voltage
In summary, the value for the output smoothing capacitance, CO ,
should be determined by considering the following conditions:
the allowable ripple current performance that can provide a
margin beyond the calculated ripple current
the ESR characteristic during the room temperature conditions is
determined by what output ripple voltage is set, which must balance with the power supply specification of the load circuit
a sufficiently high impedance that can provide an adequate margin, rather than one base on just the maximum VO
The selected capacitor should be from a series specified for
switching mode power supply use in the capacitor manufacturer
catalog.
Table 2. Evaluation Board Parts List

(Valid at VIN = 33 V, VO = 5 V)
Symbol
Part Type
Description
Manufacturer
C1
Aluminum electrolytic
capacitor
ZLH,
50 V / 1000 F
Rubycon
C2
capacitor
YXG, 25 V /
680 F
Rubycon
C3
capacitor
LXZ, 25 V /
470 F
Chemi-con
CN1, CN2
Connector
B2P3-VH
JST
IC1
DC/DC module
MPM01
Sanken
JP1
Jumper wire
0.5 mm, Sn
Plated
PCB
Printed circuit board
One side of
CEM3
R1
Carbon resistance
R2
Carbon resistance
1/
4
W, 510
Open
Evaluation Board for MPM0x Series

The MPM0x evaluation board can be used for experimental use
for evaluation of MPM series. It is shown in figure 13, along with
the corresponding circuit schematic. The parts list for the board
is provided in table 2. The parts listed are for a reference only,
and should be replaced with application standard parts prior to
performing each experiment.
CO
VIN(+)
GND1
CN1
1
VIN
GND GND
1
C1
(CIN)
OUT
OUT
OUT
FB SW SW
IC1
(MPM01)
R1
(RFB)
R2
(RFB)
CN2
3
CIN
Output
GND
VO(+)
Input
GND
GND1
8 9
(Open)
C2
(CO)
C3
(CO)
JP1
MPM01
RFB
Figure 13. Evaluation board circuit diagram and photograph
MPM-AN
March 2012
12
Static Performance Characteristics

Test measurements for the MPM01 and MPM04 are provided in
this section. These are typical values taken in our measurement
environment, for reference.
100
MPM04: VO = 18 V, VIN = 24 V
MPM04: VO = 24 V, VIN = 36 V
(%)
95
90
MPM01: VO = 12 V, VIN = 24 V
85
MPM01: VO = 5 V, VIN = 24 V
80
MPM01: VO = 3.3 V, VIN = 12 V
75
70
0
0.5
1.5
2.5
2.5
IO (A)
VO (V)
Figure 14. Efficiency versus Output Current, measured at TA = 25C
26
24
22
20
18
16
14
12
10
8
6
4
2
0
MPM04: VO = 24 V, VIN = 36 V
MPM04: VO = 18 V, VIN = 24 V
MPM01: VO = 12 V, VIN = 24 V
MPM01: VO = 5 V, VIN = 24 V
MPM01: VO = 3.3 V, VIN = 12 V
0
0.5
1.5
IO (A)
Figure 15. Load Regulation versus Output Current, measured at TA = 25C
MPM-AN
March 2012
13
Estimated Lift Characteristics

Generally, an electronic component will have shorter life cycle
when used in high temperature. In order to use the IC for a long
time, it is most effective to avoid overheating. Input voltage also
dependency must be considered This section provides estimated
use lifes when the IC is run continuously and when it is powered
on and off repeatedly.
10000000
Mean Time to 0.1% Failure Rate (hours)
1000000
VIN = 24 VDC nominal

100000
10000
Temperature measurement
point on the front side of
the package temperature
6 mm
1000
13 mm
100
10
1
0
10
20
30
40
50
60
70
80
90
100
110
120
Package Surface Temperature (C)
Figure 16. Estimated life curve for input of 24VDC nominal continuous; and package
temperature measuring point
MPM-AN
March 2012
14
Failure Acceleration Factor
100000
10000
1000
100
10
1
0.1
1
10
100
1000
Package Surface Temperature Change, T (C)
Figure 17. Curve for mapping temperature change to Acceleration Factor for use in
calculating IC lifetimes when power is cycled repeatedly
Temperature Difference versus Acceleration Factor

For the purposes of this experiment, a standard product lifetime,
L0, was defined as 100 on-off cycles, and given the value 1. The
change in temperature, T, was calculated based on the package
temperature measured at the point shown in figure 16.
Although the package temperature can be lowered by derating

the output current, in order to extend the expected lifetime, it is
recommended to flow cooling air use over the device periodically, such as by assembling a heatsink to the device and forcing
airflow using a blower or a fan.
The estimated lifetime, L1 , is calculated using the following

acceleration conditions:
In addition, consider that it is required to connect electrolytic

capacitors to the input and output of this product. Therefore, the
life cycle of these electrolytic capacitors must be considered.
Preventive maintenance may be required for these capacitors,
according to the capacitor maker recommendations.
L1 L0 Acceleration Factor
(14)
If the change, T, is 60C, such as the temperature difference

between 25C and 85C, it can read from figure 17 that it corresponds to an Acceleration Factor of approximately 20 times.
To calculate the estimated lifetime, substitute into equation 14:
L1 100 20 2000 temperature cycles
MPM-AN
Note: Sanken products are occasionally updated in order to

provide better quality. Specification and application recommendations may be changed without a preliminary announcement to
support product improvements.
March 2012
15
The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
Anti radioactive ray design is not considered for the products listed herein.
Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
The contents in this document must not be transcribed or copied without Sanken's written consent.
MPM-AN
March 2012
16

MPM01 MPM04 Application Note

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MPM01 MPM04 Application Note

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Application Information

MPM Series DC-to-DC Converter Modules

Features and Benefits

Fewer external components required: IC operates just by

Figure 1. MPM series packages are fully molded DIPs (3GR-S

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Functional Block Diagram

AGND COMP PGND LS_GATE

Input power pin

Oscillation frequency measuring pin

Pin List Table

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Pb-free. Device composition compliant

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Absolute Maximum Ratings

VIN Pin Voltage

Limited due to the overtemperature protection;

Recommended Operating Conditions1

Input Voltage Range2

Output Current Range3

Operating Junction Temperature

Operating Ambient Temperature3

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Electrical Characteristics1 Unless specifically noted, TA is 25C

Input VIN = 16 to 40 V, set on VO = 12 V,

Over Current Protection Starting

Set VIN = 33 V, VO = 12 V, auto restart / voltage

Input Circuit Current

MIC Thermal Protection Start-up

Supply Voltage Undervoltage

Start-up Delay Time

VIN =16 to 40 V, start-up to VO reaching the

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Temperature Derating Curves

Note 1: Traces for VO = 5 to 12 V indicate MPM01 performance, traces for VO = 15 to 24 V

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Pins 8 and 9 (SW) are test-only terminals for measuring oscillating

Figure 3. Standard connection diagram

Figure 4. Recommended board layout

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Setting Output Voltage

table, VIN must, however, be within the specified maximum and

Minimum Input/Output Voltage Difference

Although for the MPM04 a VIN more than 36 V is recommended

RFB for output voltage VO = 5 V can be calculated as 500 , and

Table 1. Input/Output Differences

Figure 7. RFB placement for output voltage setting

MPM01 Typical VO Value

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Choosing the Input-Smoothing Capacitance, CIN

where L indicates the inductance of the IC built-in coil, and tON

1. Determine Supply Ripple Current Conditions

Ripple current valley equation

where D indicates the capacitor duty cycle (ratio of tON to tOFF),

Ripple current peak equation

Because the ripple current of the capacitor is an AC waveform,

tON [I 2Lp' + (ILp' ILv' ) + I 2Lv' ]

where T indicates the period of the combined charge-discharge

Combined ripple current equation for input smoothing capacitor

Given: VIN = 24 V , VO = 12 V, IO = 3 A , charge-discharge cycle

Figure 9. Charge/discharge of an input capacitor

Substituting into equation 4:

(24 (V) 12 (V)) 2 (s)

Substituting into equation 5: