Beruflich Dokumente
Kultur Dokumente
ESD 503
Madhav Rao, ESD Program
IIIT-Bangalore
Evaluation
Design Criteria
2. Wires
nMOS
design
pMOS
Circuits
wires
transistors
Side view image of a chip
Technology scaling
If a pond lily doubles everyday and it takes 30 days to completely cover a
pond, on what day will the pond be 1/2 covered?
Moores Law. The number of transistors in an integrated
circuit doubles every 2 years.
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Semiconductor companies
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3. design
system
4. analyze/
model
system
if satisfactory
2. write
specifications
5. Fabrication
6. test / work as
modeled?
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Applications/Ideas
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Specifications
Instruction set
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Verification
compilation/
synthesis
design schematics
device layout
Fabrication
tapeout
mask writer
printing
test and
packaging
chip
masks
dice
die
wafer
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17
18
Agilent semiconductor
analyzer with Cascode probe
station
3D Makerbot Printer
Fume hood
www.iiitb.ac.in/hides/hides
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http://www.cense.iisc.ernet.in/infrastructure.htm
http://www.inup.iitb.ac.in/inup/index.php
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21
22
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Assignment-1(6 points)
1. Design your metal patterns in terms of material, length, width, and
thickness for developing a circuit shown in slide 22. Mention the
dimensions and material clearly in your drawing.
2. Capture different types of silicon wafers of 4 inch diameter and state the
significance of flat side wherever it is located on the wafer.
3. Design an R L C series circuit for values of 1K, 1 mH and 1F. For planar
spiral inductor you can refer the article uploaded in LMS.
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