Murata Products Crystal Filters P51e

P51E.
pdf
Dec.25,2015
Ceramic Filters (CERAFILr)/

Crystal Filters
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
EU RoHS Compliant
F**2&#.0-"3!21',2&'1!2*-%!-+.*7
5'2& -@
F -'12&# 30-.#,'0#!2'4#
|z{{GG -,2&##120'!2'-,-$2&#
1#-$#02',80"-313 12,!#1',
*#!20'!*," *#!20-,'! /3'.+#,2@
FFor+-0#"#2'*1A.*#1#0#$#r2o-ur
5# 1'2#'Mur21A..roc&$o0 -'
H&22.BGG555@+302@!-+G#,#3G13..-02G!-+.*',!#G0-&1J@
P51E.pdf
Dec.25,2015
P51E.pdf
Dec.25,2015
Contents
Product specications are as of December 2015.
Selection Guide
Part Numbering
5 Ceramic Filters (CERAFILr)
Chip Type SFECF Series

Features/Appearance/Dimensions
Part Number List
Standard Center Frequency Rank Code
Standard Land Pattern Dimensions
Test Circuit
Frequency Characteristics
Spurious
Notice
Packaging
p6
p6
p7
p7
p7
p8
p10
p12
p14
p15
p15
p16
p16
p16
p16
p17
p18
p20
Chip Type SFSCE Series

Features/Applications/Appearance/Dimensions
Part Number List
Test Circuit
Notice
Packaging
p21
p21
p21
p21
p22
p23
p27
p34
p34
p35
p35
p36
p37
p38
p40
Chip Type TPSKA Series

Part Number List
Test Circuit
Spurious
Notice
Packaging
p41
p41
p41
p41
p41
p42
p43
p45
7 Ceramic Discriminator (CERAFILr)
Chip Type CDSCB Series

Part Number List
Test Circuit
Recovered Audio Curve
S Curve
Notice
Packaging
p46
p46
p46
p47
p47
p49
p50
p51
p53
8 Crystal Filters
Chip Type SFSKA Series

Part Number List
Test Circuit
Spurious
Notice
Packaging
Chip Type SFSKB Series

Part Number List
Test Circuit
Spurious
Notice
Packaging
6 Ceramic Trap (CERAFILr)
Chip Type SFECV/SFECK Series

Part Number List
Test Circuit
Spurious
Notice
Packaging
p2
p3
p28
p28
p28
p28
p29
p30
p31
p33
Chip Type XDCAF/XDCAG/XDCAH Series

p54
Series/Part Number List
p54
Test Circuit
p55
p56
Spurious
p57
Notice
p58
Packaging
p60
Please check the MURATA website (http://www.murata.com/)

if you cannot nd the part number in the catalog.
Selection Guides
Applications
Industrial
Audio Visual/Communications
Filters
Discriminators
Crystal Filters
SFECF
TPSKA
CDSCB
XDCAF
3.453.11.4mm
10.000-11.000MHz
8.53.82.0mm
4.500-6.500MHz
4.52.01.0mm
10.520-10.800MHz
7.05.01.1mm
2 pole
SFECV/SFECK
XDCAG
6.92.91.7mm
10.700-15.000MHz
7.05.01.1mm
4 pole
SFSCE
XDCAH
4.53.81.0mm
10.700-11.000MHz
7.05.01.1mm
4 pole
SFSKA
8.53.82.0mm
4.500-6.500MHz
SFSKB
5.23.81.5mm
2.300-5.700MHz
Traps
P51E.pdf
Dec.25,2015
P51E.pdf
Dec.25,2015
o Part Numbering
CERAFILr for FM
(Part Number)
SF
CF 10M7 F
5 6
A0 -R0
7
8
6Center Frequency/Tolerance
1Product ID
Product ID
SF
Ceramic Filters
2Oscillation/Number of Elements
Code
Oscillation/Number of Elements
2 Elements Thickness Expander Mode

(2nd Harmonic)

(3rd Overtone)
3Structure/Size
Code
Center Frequency
Tolerance
Center Frequency Mentioned by Specication
30kHz
Nominal Center Frequency
3dB bandwidth of "F" signies the frequency difference (both + and -)

from reference frequency, which is nominal center frequency.
7Series
Code
Series
A0
Two-digit Alphanumerics Express Series
8Packaging
Code
Packaging
-B0
Bulk
Code
Structure/Size
-R0
Embossed Taping 180mm
Cp
Chip Type
-R1
Embossed Taping 330mm
p is "A" or subsequent code, which indicates the structure/size.
4Nominal Center Frequency
Radial taping is applied to lead type and embossed taping to chip type.
With non-standard products, two-digit alphanumerics indicating
"Individual Specication" are added between "7Series" and
"8Packaging."
Expressed by four-digit alphanumerics. The unit is in hertz (Hz).

Decimal point is expressed by capital letter "M" in case of MHz.
53dB Bandwidth
Code
3dB Bandwidth
450kHz min
350kHz min
330kHz
280kHz
230kHz
180kHz
150kHz
110kHz
80kHz
50kHz
35kHz
CERAFILr
(Part Number)
SF
KA 4M50 CF
00 -R1
1Product ID
5Product Specication Code (1)
Product ID
Code
SF
Ceramic Filters
2Oscillation/Numbers of Element
Code
Oscillation/Numbers of Element
2 Elements Thickness Shear Mode
Product Specication Code (1)
BF
Tight Bandwidth Type
CF
Standard Bandwidth Type
DF
Broad Bandwidth Type
EF
Ultra-broad Bandwidth Type

3Structure/Size
Code
Structure/Size
Kp
Chip Type
Code
Product Specication Code (2)
00
Standard Type
7Packaging
Packaging
Code
-B0
Bulk

-R1
Embossed Taping =330mm
With non-standard products, two-digit alphanumerics indicating

"Individual Specication" is added between "6Product Specication
Code (2)" and "7Packaging."
Ceramic Traps
(Part Number)
TP
KA 4M00 B
00 -R0
5 6
1Product ID
Product ID
TP
Ceramic Traps
Code
Product Specication (1)
Broad Bandwidth Type
Low Capacitance Type
2Function
Code
Function
Single Traps

Code
Product Specication (2)
00
Standard Type
3Structure/Size
Code
Structure/Size
Kp
Chip Type

7Packaging
Code
Packaging
-B0
Bulk
-R1
With non-standard products, three-digit alphanumerics indicating

"Individual Specication" is added between "6Product Specication
Code (2)" and "7Packaging."
P51E.pdf
Dec.25,2015
P51E.pdf
Dec.25,2015
Discriminators for FM
(Part Number)
CD
CB 10M7 G
A 001 -R0
5 6
8
6Center Frequency/Tolerance
1Product ID
Product ID
CD
Discriminators
2Oscillation
Code
Center Frequency
Tolerance
Center Frequency Mentioned by Specication
30kHz
Nominal Center Frequency
3dB bandwidth of "F" signies the frequency difference (both + and -)

from reference frequency, which is nominal center frequency.
Code
Oscillation
Thickness Shear Mode

7IC
3Structure/Size
Code
Structure/Size
Cp
Chip Type
Code
IC
001
Applicable IC Control Code
8Packaging
Packaging
Code
-B0
Bulk
-R0
-R1
Radial taping is applied to lead type and embossed taping to chip type.
With non-standard products, an alphanumerics indicating "Individual
Specication" is added between "7IC" and "8Packaging."
5Series
Code
Series
Two-digit Alphanumerics Express Series
Crystal Filter
(Part Number)
XD
2 3 4
F 21M400 R
5
A A00 P0
6 7
1Product ID
9
7Number of Pole
Product ID
XD
Crystal Filter
2Type Lead Style

Code
Type Lead Style
Monolithic SMD
Code
Number of Pole
2 (1 Element)
4 (1 Element)
4 (2 Elements)
8Individual Specication
Code
3Size
Code
Size
7050
4Structure
***
Three-digit Alphanumeric Express

Individual Specication.
9Packaging (Packging quantity is expressed by one-digit number in "*")
Expressed by one-digit alphabet.
Code
Packaging
P*/L*
Plastic Taping 330mm

Expressed by six-digit alphanumeric. The unit is in hertz (Hz).
Decimal point is expressed by capital letter "M".
6Bandwidth
Code
Bandwidth (3dB)
6.800 to 8.199kHz
10.000 to 11.999kHz
12.000 to 14.999kHz
15.000 to 17.999kHz
P51E.pdf
Dec.25,2015
Ceramic Filters (CERAFILr)
RoHS
Chip Type SFECF Series

1.30.1
The SFECF10M7 series for FM receivers are small,

high-performance and super thin (1.4mm max.) filters.
The piezoelectric element is sandwiched by ceramic
substrate. They have 1.4mm max. thickness and a small
mounting area (3.45x3.1mm). The SFECF series and
CDSCB series (MHz Discriminator) enable customers to
make VICS/RKE/TPMS sets very thin and small.
3.10.2
3.450.2
Input electrode
marker
0 to 0.4 (0.6) (0.6) (0.6) 0 to 0.4
(1.28)(1.28)
0.3 min. 0.3 min.
Features
1. The filters are mountable by automatic placers.
2. They are slim, at only 1.4mm max. thickness, and have a
small mounting area (3.45x3.1mm) enabling flexible PCB
design.
3. Various bandwidths are available. Select a suitable type in
accordance with the desired characteristics.
4. Operating Temperature Range:
-20 to +80C (Standard Type)
-40 to +85C (High-reliability Type)
Storage Temperature Range:
(1)
(6)
(2) (3)
(5) (4)
(1.28)(1.28)
0 to 0.35
0.750.3
0.850.3 0.850.3
0.650.3 0.70.3 0.650.3

(1): Input
(2)(5): Ground
(3)(4): No connection
(6): Output
: EIAJ Monthly Code
( ): Reference
0 to 0.35
(in mm)
Standard Type
Part Number
Center Nominal Center

Frequency Frequency (fn)
(fo) (MHz)
(MHz)
3dB
Bandwidth
(kHz)
Attenuation Insertion Loss Ripple

(kHz)
(dB)
(dB)
SFECF10M7HA00-R0
10.700
30kHz
180 40kHz
470 max.
SFECF10M7HF00-R0
10.700
fn25 min.
510 max.
SFECF10M7GA00-R0
10.700
30kHz
230 50kHz
510 max.
SFECF10M7GF00-R0
10.700
fn45 min.
560 max.
SFECF10M7FA00-R0
10.700
30kHz
280 50kHz
590 max.
SFECF10M7FF00-R0
10.700
fn65 min.
620 max.
SFECF10M7EA00-R0
10.700
30kHz
330 50kHz
SFECF10M7DA0001-R0
10.700
30kHz
10.700
SFECF10M7DF00-R0
Spurious
Attenuation
(1) (dB)
Spurious
Attenuation
(2) (dB)
Input/Output
Impedance
(ohm)
30 min.
30 min.
[within 9MHz to fo] [within fo to 12MHz]
330
1.0 max.
30 min.
25 min.
[within 9MHz to fn] [within fn to 12MHz]
330
3.52.0dB 1.0 max.
30 min.
30 min.
330
1.0 max.
30 min.
25 min.
330
3.02.0dB 1.0 max.
30 min.
30 min.
330
1.0 max.
30 min.
25 min.
330
700 max.
3.02.0dB 1.0 max.
30 min.
30 min.
330
420 min.
950 max.
3.02.0dB 3.0 max.
35 min.
25 min.
330
fn150 min.
990 max.
20 min.
20 min.
330
4.02.0dB 1.0 max.

8.0max.
[at fn]
8.0max.
[at fn]
7.0max.
[at fn]
6.0max.
[at fn]
3.0 max.
Area of Attenuation: [within 20dB]

Area of Insertion Loss: at minimum loss point
Area of Ripple: within 3dB B.W.
Center frequency (fo) defined by the center of 3dB bandwidth.
For safety purposes, connect the output of filters to the IF amplifier through a D.C. blocking capacitor. Avoid applying a direct current to the output of ceramic
filters.
The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page.
P51E.pdf
Dec.25,2015
High-reliability Type
Center Nominal Center
3dB
Frequency Frequency (fn) Bandwidth
(fo) (MHz)
(MHz)
(kHz)
Part Number
Attenuation Insertion Loss

(kHz)
(dB)
Ripple
(dB)
Spurious
Attenuation
(1) (dB)
Spurious
Attenuation
(2) (dB)
Input/Output
Impedance
(ohm)
SFECF10M7HA00S0-R0
10.700
30kHz
180 40kHz
470 max.
4.02.0dB
1.0 max.
30 min.
30 min.
330
SFECF10M7HF00S0-R0
10.700
fn25 min.
510 max.
8.0max.
[at fn]
1.0 max.
30 min.
25 min.
330
SFECF10M7GA00S0-R0
10.700
30kHz
230 50kHz
510 max.
3.52.0dB
1.0 max.
30 min.
30 min.
330
SFECF10M7GF00S0-R0
10.700
fn45 min.
560 max.
8.0max.
[at fn]
1.0 max.
30 min.
25 min.
330
SFECF10M7FA00S0-R0
10.700
30kHz
280 50kHz
590 max.
3.02.0dB
1.0 max.
30 min.
30 min.
330
SFECF10M7FF00S0-R0
10.700
fn65 min.
630 max.
7.0max.
[at fn]
1.0 max.
30 min.
25 min.
330
SFECF10M7EA00S0-R0
10.700
30kHz
330 50kHz
700 max.
3.02.0dB
1.0 max.
30 min.
30 min.
330
SFECF10M7DF00S0-R0
10.700
fn145 min.
990 max.
6.0max.
[at fn]
3.0 max.
20 min.
20 min.
330

Area of Ripple: within 3dB B.W.
filters.

CODE
30kHz Step
25kHz Step
10.700MHz30kHz
10.700MHz25kHz
Test Circuit
0.1
(2)
0.1
(3)
0.1
0.8 0.6 0.8 0.6 0.8
Indicates solder resist land pattern.
0.1
0.3
(1)
1.05
0.1
(4)
R1
(1)
1.40
(5)
0.3
(6)
(4)
(5)
(6)
Rg
E1
R2
C2
E2
S.S.G.
RF
Voltmeter
1.05
0.3
0.1
(3)
(2)
(1): Input
(2)(5): Ground
(6): Output
(in mm)
(1): Input
(2)(5): Ground
(6): Output
Rg=50 R1=2805% R2=3305%

C2=102pF (Including stray capacitance and Input capacitance
of RF voltmeter)
E1: S.S.G. Output Voltage
P51E.pdf
Dec.25,2015
Frequency Characteristics Standard Type

0
7.0
6.0
6.0
5.0
5.0
4.0
4.0
3.0
3.0
2.0
2.0
1.0
1.0
10.700
Frequency (MHz)
10.900
7
10.300
0.0
11.100
0.0
11.100
SFECF10M7EA00-R0
7.0
6.0
6.0
5.0
5.0
4.0
4.0
3.0
3.0
2.0
2.0
1.0
1.0
10.500
10.700
Frequency (MHz)
10.900
Attenuation (dB)
0.0
11.100
7
10.300
SFECF10M7DA0001-R0
10.500
10.700
Frequency (MHz)
10.900
0.0
11.100
SFECF10M7DF00-R0
7.0
7.0
6.0
6.0
5.0
5.0
4.0
4.0
3.0
3.0
2.0
2.0
1.0
1.0
7
10.300
10.500
10.700
Frequency (MHz)
10.900
0.0
11.100
Attenuation (dB)
Group Delay Time ( sec.)
Attenuation (dB)
10.900
7.0
7
10.300
10.700
Frequency (MHz)
Attenuation (dB)
SFECF10M7FA00-R0/SFECF10M7FF00-R0
10.500
10.500
7
10.300
10.500
10.700
Frequency (MHz)
10.900
0.0
11.100
7
10.300
Attenuation (dB)
7.0
Attenuation (dB)
SFECF10M7GA00-R0/SFECF10M7GF00-R0
SFECF10M7HA00-R0/SFECF10M7HF00-R0
P51E.pdf
Dec.25,2015
Frequency Characteristics High-reliability Type

SFECF10M7GA00S0-R0/SFECF10M7GF00S0-R0
7.0
6.0
6.0
5.0
5.0
4.0
4.0
3.0
3.0
2.0
2.0
1.0
1.0
10.500
10.700
Frequency (MHz)
10.900
7
10.300
0.0
11.100
10.700
Frequency (MHz)
10.900
0.0
11.100
SFECF10M7EA00S0-R0
7.0
7.0
6.0
6.0
5.0
5.0
4.0
4.0
3.0
3.0
2.0
2.0
1.0
1.0
7
10.300
10.500
10.700
Frequency (MHz)
10.900
0.0
11.100
Attenuation (dB)
Attenuation (dB)
SFECF10M7FA00S0-R0/SFECF10M7FF00S0-R0
10.500
7
10.300
10.500
10.700
Frequency (MHz)
10.900
7
10.300
1
Attenuation (dB)
7.0
Attenuation (dB)
SFECF10M7HA00S0-R0/SFECF10M7HF00S0-R0
0
0.0
11.100
7.0
6.0
5.0
4.0
3.0
2.0
1.0
7
10.300
10.500
10.700
Frequency (MHz)
10.900
Attenuation (dB)
SFECF10M7DF00S0-R0
0
0.0
11.100
P51E.pdf
Dec.25,2015
Frequency Characteristics (Spurious) Standard Type

SFECF10M7HA00-R0/SFECF10M7HF00-R0
SFECF10M7GA00-R0/SFECF10M7GF00-R0
10
10
20
20
Attenuation (dB)
Attenuation (dB)
30
40
30
40
50
50
60
60
70
8.700
9.700
10.700
Frequency (MHz)
11.700
70
8.700
12.700
10
10
20
20
30
40
60
60
10.700
Frequency (MHz)
11.700
12.700
SFECF10M7DA0001-R0/SFECF10M7DF00-R0
0
Attenuation (dB)
10
20
30
40
50
60
70
8.700
10
9.700
10.700
Frequency (MHz)
11.700
12.700
11.700
12.700
40
50
9.700
11.700
30
50
70
8.700
10.700
Frequency (MHz)
SFECF10M7EA00-R0
Attenuation (dB)
Attenuation (dB)
SFECF10M7FA00-R0/SFECF10M7FF00-R0
9.700
12.700
70
8.700
9.700
10.700
Frequency (MHz)
P51E.pdf
Dec.25,2015
Frequency Characteristics (Spurious) High-reliability Type

SFECF10M7GA00S0-R0/SFECF10M7GF00S0-R0
0
10
10
20
20
Attenuation (dB)
Attenuation (dB)
SFECF10M7HA00S0-R0/SFECF10M7HF00S0-R0
0
30
40
30
40
50
50
60
60
70
8.700
9.700
10.700
Frequency (MHz)
11.700
70
8.700
12.700
10
10
20
20
30
40
11.700
12.700
11.700
12.700
40
50
60
60
10.700
Frequency (MHz)
10.700
Frequency (MHz)
30
50
9.700
9.700
SFECF10M7EA00S0-R0
0
Attenuation (dB)
Attenuation (dB)
SFECF10M7FA00S0-R0/SFECF10M7FF00S0-R0
0
70
8.700
11.700
12.700
11.700
12.700
70
8.700
9.700
10.700
Frequency (MHz)
SFECF10M7DF00S0-R0
0
Attenuation (dB)
10
20
30
40
50
60
70
8.700
9.700
10.700
Frequency (MHz)
11
P51E.pdf
Dec.25,2015
Notice
Ceramic Filters (CERAFILr) Chip Type SFECF Series

1. Standard Reow Soldering Conditions
(1) Reow
Filter is soldered twice within the following temperature
conditions.
Temperature (C)
e Soldering and Mounting e
Peak
(260C max.)
260
230
Pre-heating
(150-180C)
100
Heating
(230C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
40 sec.
max.
120 sec.
min.
(2) Soldering Iron

Filter is soldered at +3505C for 3.00.5 seconds. The
soldering iron should not touch the lter while soldering.
(3) Conditions for Placement Machines
The component is recommended for use with placement
machines that employ optical placement capabilities.
The component might be damaged by excessive
mechanical force. Please make sure that you have
evaluated by using placement machines before going into
mass production. Do not use placement machines that
utilize mechanical positioning. Please contact Murata for
details beforehand.
(4) Other
(a) The component may be damaged if excess
mechanical stress is applied to it mounted on the
printed circuit board.
(b) Design layout of components on the PC board to
minimize the stress imposed on the warp or exure of
the board.
(c) After installing components, if solder is excessively
applied to the circuit board, mechanical stress will
cause destruction resistance characteristics to
degrade. To prevent this, be extremely careful in
determining shape and dimension before designing
the circuit board diagram.
(d) When the positioning claws and pick-up nozzle are
worn, the load is applied to the components while
positioning is concentrated on positioning accuracy,
etc. Careful checking and maintenance are necessary
to prevent unexpected trouble.
(e) When correcting components with a soldering iron,
the tip of the soldering iron should not directly touch
the component. Depending on the soldering
conditions, the effective area of terminations may be
reduced. Solder containing Ag should be used to
prevent electrode erosion.
(f) Do not use strong acidity ux, more than 0.2wt%
chlorine content, in reow soldering.
[Component Direction]
Place the
component
lateral to the
direction in
which stress
acts.
[Component Layout Close to Board]

Perforation
Slit
Susceptibility to
stress is in the order
of: A>C>B
Continued on the following page.
12
P51E.pdf
Dec.25,2015
Notice
Continued from the preceding page.
2. Wash
Do not clean or wash the component as it is not
hermetically sealed.
3. Coating
In case of overcoating the component, conditions such as
material of resin, cure temperature, and so on should be
evaluated well.
e Storage and Operating Conditions e

1. Product Storage Conditions
Please store the products in a room where the
temperature/humidity is stable, and avoid places where
there are large temperature changes. Please store the
products under the following conditions:
Temperature: -10 to +40C
Humidity: 15 to 85% R.H.
2. Expiration Date on Storage
Expiration date (shelf life) of the products is six months
after delivery under the conditions of a sealed and
unopened package. Please use the products within six
months after delivery. If you store the products for a long
time (more than six months), use carefully because
solderability may be degraded due to storage under poor
conditions.
Please conrm solderability and characteristics for the
products regularly.
3. Notice on Product Storage
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas, Suldes
and so on), because quality and solderability may be
degraded due to storage in a chemical atmosphere.
(2) Please do not put the products directly on the oor

without anything under them to avoid damp places
and/or dusty places.
(3) Please do not store the products in places such as a
damp heated place or any place exposed to direct
sunlight or excessive vibration.
(4) Please use the products immediately after package is
opened, because quality and solderability may be
degraded due to storage under poor conditions.
(5) To avoid cracking of the ceramic element, please do
not drop the products.
4. Other
Please be sure to consult with our sales representative or
engineer whenever the products are to be used in
conditions not listed above.
e Rating e
The component may be damaged if excessive mechanical
stress is applied.
e Handling e
1. Accurate test circuit values are required to measure
electrical characteristics. Miscorrelation may be caused if
there is any deviation, especially stray capacitance, from
the test circuit in the specication.
2. The components, packed in a moisture proof bag (dry
pack), are sensitive to moisture. The following treatment
is required before applying reow soldering, to avoid
reliability degradation caused by thermal stress. When
unpacked, store the component in an atmosphere of
reow 30C and below 60%R.H., and solder within 1
week.
13
Packaging
Minimum Quantity/Dimensions of Reel

Embossed Tape 180mm
2,000
(pcs.)
Dimensions of Reel
Trailer
160 to 190
Leader
Cover lm
Empty
Empty
240 to 280
Components
400 to 560
180+0
-1.5
60+1.0
-0
13.00.5
2.00.5
17.01.0
13.0+1.0
-0
(in mm)
Dimensions of Carrier Tape
(3)
10 max.
12.00.2
5.50.05
1.840.1
Cover lm
3.35 +0.1
-0.05
(0.05)
4.00.1
Peeling strength
(0.1 to 0.7N)
0.30.05
4.10.1
Chip lter
4.10.1
4.00.1
1.550.05 2.00.05
3 max.
1.750.1
User direction of feed

F02,3+ #0+0)#"1'"#'1*571$!',%3.@
14
( ): Reference
(in mm)
P51E.pdf
Dec.25,2015
P51E.pdf
Dec.25,2015
RoHS
Chip Type SFECV/SFECK Series

6.90.3
4.050.4
The SFECV/SFECK10M7 series for FM receivers are

monolithic type ceramic filters that utilize the thickness
expander mode of piezoelectric ceramics. The SFECV series
enable customers to make an AM/FM set very thin, and it
can be useful to the total chip circuit.
2.90.3
1.20.5
1.20.5
(2)
(1)
1.50.2
1. The piezoelectric element is sandwiched by heat resistant

substrate, thus it has excellent mechanical strength, and
it is suitable for automatic mounting.
2. Various bandwidths are available. Select a suitable type in
accordance with the desired characteristics.
3. Operating Temperature Range:
Storage Temperature Range:
1.50.2
*
*
(3)
Features
1.20.3
: Marking
1.00.5
1.00.5
1.00.5
** : EIAJ Monthly Code

** : Center Frequency Rank Code
(1) : Input
(2) : Ground
(3) : Output
(in mm)
Applications
1. Small, thin radios
2. Automotive radios
3. Headphone stereos
Standard Type
Part Number
Center
3dB
Frequency Bandwidth
(kHz)
(dB)
(fo) (MHz)
(kHz)
SFECV15M0EQ0001-R0
15.000
50kHz
SFECV10M7KA00-R0
SFECV10M7JA00-R0
Spurious
Attenuation
(1) (dB)
Ripple
(dB)
Spurious
Attenuation
(2) (dB)
Input/Output
Impedance
(ohm)
7.0max.
1.0 max.
30 min.
30 min.
330
10.700
110 30kHz 320 max.
30kHz
6.02.0dB
1.0 max.
35 min.
35 min.
330
10.700
150 40kHz 380 max.
30kHz
5.52.0dB
1.0 max.
35 min.
35 min.
330
300 min.
750 max.

filters.
High-reliability Type
3dB
Bandwidth
(kHz)
(dB)
(kHz)
Spurious
Attenuation
(1) (dB)
Spurious
Attenuation
(2) (dB)
Input/Output
Impedance
(ohm)
Part Number
Center
Frequency
(fo) (MHz)
SFECK10M7KA00S0-R0
10.700
30kHz
110 30kHz 320 max.
6.02.0dB
1.0 max.
35 min.
35 min.
330
SFECK10M7JA00S0-R0
10.700
30kHz
150 40kHz 380 max.
5.52.0dB
1.0 max.
35 min.
35 min.
330
Ripple
(dB)

filters.
15
P51E.pdf
Dec.25,2015

CODE
30kHz Step
25kHz Step
10.700MHz30kHz
10.700MHz25kHz

1.2
Test Circuit
1.2
1.2
R1
(2)
Rg
E1
4.0
(3)
(1)
R2
C2
E2
S.S.G.
=-10dBm
1.65
1.65
2.85
2.85
RF
Voltmeter
(1): Input
(2): Ground
(3): Output
Land
Rg=50 R1=2805% R2=3305%

C2=102pF (Including stray capacitance and Input capacitance
of RF voltmeter)
(in mm)
Frequency Characteristics Standard Type
8.0
6.0
4.0
2.0
10
14.700
14.800
14.900 15.000 15.100

Frequency (MHz)
15.200
0.0
15.300
7.5
7.0
6.5
6.0
5.5
5.0
7
10.300
16
10.500
10.700
Frequency (MHz)
10.900
4.5
11.100
Attenuation (dB)
8.0
7.0
6.5
6.0
5.5
5.0
4.5
4.0
7
10.300
SFECV10M7JA00-R0
0
10.500
10.700
Frequency (MHz)
10.900
3.5
11.100
Attenuation (dB)
SFECV10M7KA00-R0
10.0
Attenuation (dB)
SFECV15M0EQ0001-R0
0
P51E.pdf
Dec.25,2015
Frequency Characteristics High-reliability Type

8.0
6.5
7.5
6.0
7.0
5.5
6.5
5.0
6.0
4.5
5.5
4.0
5.0
7
10.300
10.500
10.700
Frequency (MHz)
10.900
Attenuation (dB)
3.5
11.100
7
10.300
10.500
10.700
Frequency (MHz)
10.900
SFECK10M7JA00S0-R0
7.0
Attenuation (dB)
SFECK10M7KA00S0-R0
0
4.5
11.100
Frequency Characteristics (Spurious) Standard Type

SFECV15M0EQ0001-R0
SFECV10M7KA00-R0
10
10
Attenuation (dB)
Attenuation (dB)
20
30
40
50
30
40
50
60
60
70
80
13.000
20
14.000
15.000
Frequency (MHz)
16.000
17.000
11.700
12.700
70
8.700
9.700
10.700
Frequency (MHz)
11.700
12.700
11.700
12.700
SFECV10M7JA00-R0
0
Attenuation (dB)
10
20
30
40
50
60
70
8.700
9.700
10.700
Frequency (MHz)
Frequency Characteristics (Spurious) High-reliability Type

SFECK10M7JA00S0-R0
10
10
20
20
Attenuation (dB)
Attenuation (dB)
SFECK10M7KA00S0-R0
30
40
30
40
50
50
60
60
70
8.700
9.700
10.700
Frequency (MHz)
11.700
12.700
70
8.700
9.700
10.700
Frequency (MHz)
17
P51E.pdf
Dec.25,2015
Notice
Ceramic Filters (CERAFILr) Chip Type SFECV/SFECK Series

(1) Reow
conditions.
Temperature (C)
Peak
(240C max.)
240
230
Pre-heating
(150-180C)
100
Heating
(230C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
30 sec.
max.
120 sec.
min.
(2) Soldering Iron

Damage may result from excessive mechanical force.
Please make sure that you have evaluated by using
placement machines before going into mass production.
Do not use placement machines that utilize mechanical
positioning. Please contact Murata for details beforehand.
(4) Other
the board.
positioning is concentrated to one positioning
accuracy, etc. Careful checking and maintenance are
necessary to prevent unexpected trouble.
Put the
component
lateral to the
direction in
which stress
acts.

Perforation
Slit
Susceptibility to
of: A>C>B
18
P51E.pdf
Dec.25,2015
Notice
2. Wash
3. Coating
evaluated well.

Please store the products in room where the
Expiration date (Shelf life) of the products is six months
time (more than six months), use carefully because the
products may be degraded in solderability due to storage
under poor conditions.
products regularly.
degraded due to the storage in a chemical
atmosphere.

(3) Please do not store the products in the places such as
a damp heated place or any place exposed to direct
degraded due to storage under the poor conditions.
4. Other
e Rating e
stress is applied.
e Handling e
Accurate test circuit values are required to measure
electrical characteristics.
Miscorrelation may be caused if there is any deviation,
especially stray capacitance, from the test circuit in the
specication.
19
Packaging
Embossed Tape 180mm
2,000
(pcs.)
Dimensions of Reel
Trailer
160-190
Leader
Cover lm
Empty
240-280
400-560
Empty Components
180 +0
1.5
60 +1.0
0
13.00.5
2.00.5
+1.0
13.0 0
17.01.0
(in mm)
**
**
3.00.1
Peeling strength 0.1 to 0.7N

Cover lm
10 max.
&'.q*2#0
(3)
5.50.05
**
12.00.2
**
1.90.1
**
7.30.01
+0.1
4.00.1
4.00.1
1.7 0.05
2.00.05
0.30.05
+0.1
1.5 0.0
1.750.1
'+#,1'-,1-$00'#0.#
1#0"'0#!2'-,-$$##"
F02,3+ #0+0)#"1'"#'1*571$!',%3.@
20
) : Reference
(in mm)
P51E.pdf
Dec.25,2015
P51E.pdf
Dec.25,2015
RoHS
Chip Type SFSCE Series

4.5
(3.5)
*
(4.0)
(4-R0.3)
(0.3)
(1.8)
1. The filters are mountable by automatic placers.

2. They are slim, at only 1.0mm max. thickness, and
have a small mounting area (4.5x3.8mm) enabling
flexible PCB design.
3. Available lead (Pb) free solder reflow.
4. Operating temperature range:
-20 to +80C
Storage temperature range:
-40 to +85C
(4)
(3)
(1)
(2)
(2.25)
0.6 1.1
0.85 0.15 1.0 max.
(3)
(4)
Features
0.4
(2)
3.8
(1)
(1): Input
(2): Output
(3): No Connection
(4): Ground
* : EIAJ Monthly Code
Tolerance unless
otherwise specied: 0.1
( ): Reference
0.15
(in mm)
0.3
The SFSCE series are chip surface mount filters available

for 3dB bandwidth at 700kHz to 1.3MHz (more than twice
the width compared with current types).
They have 1.0mm max. thickness and small mounting area
(4.5x3.8mm).
Applications
1. SS digital communication system
2. Digital wireless audio
3. PHS Evolution system
4. RFID Reader Writer
5. RKE
Nominal Center
3dB
Frequency (fn) Bandwidth
(MHz)
(kHz)
Part Number
Stop
Bandwidth
(MHz)
Insertion Loss
(dB)
Spurious
Response
(dB)
Ripple
(dB)
GDT Deviation
(s)
Input/Output
Impedance
(ohm)
SFSCE10M7WF03-R0
10.700
fn500.0
min.
2.2 max. (Total)

6.0 max.
2.0 max.
30/25 min.
0.6 max.
[within 20dB] [at minimum loss point] [within 3dB Bandwidth] [within 5.7MHz to fn / fn to 15.7MHz] [within fn400kHz]
470
SFSCE10M7WF04-R0
10.700
fn400.0
min.
1.8 max. (Total)

6.0 max.
1.5 max.
35/25 min.
0.6 max.
470
SFSCE10M7WF05-R0
10.700
fn325.0
min.
1.7 max. (Total)

6.0 max.
1.5 max.
40/30 min.
0.6 max.
470
For safety purposes, connect the output of filters to the IF amplifier through a DC blocking capacitor. Avoid applying a direct current to the output of ceramic filters.
The order quantity should be an integral multiple of the "Minimum Quantity" shown in packaging page in this catalog.

1.05 1.4
0.1
(4) (3)
0.1
(4)
R1
0.1
(3)
Test Circuit
(2)
(1)
0.5
1.15 0.8 1.3
(1) (2)
(1): Input
(2): Output
(3): No Connection
(4): Ground
(in mm)
Indicates solder resist land pattern.
0.5
Rg
R2
S.S.G.
C2
RF
Voltmeter
(1): Input
(2): Output
(3): No Connection
(4): Ground
R1+Rg=R2=Input/Output Impedance, Rg=50
C2=10pF (Including stray capacitance and Input capacitance of RF Voltmeter)
21
P51E.pdf
Dec.25,2015
1.6
1.2
0.8
0.4
22
9.900
10.300 10.700 11.100

Frequency (MHz)
11.500
0.0
11.900
20
Attenuation (dB)
10
9.500
SFSCE10M7WF03-R0
2.0
Attenuation (dB)
SFSCE10M7WF03-R0
0
40
60
80
6.700
8.700
10.700
12.700
Frequency (MHz)
14.700
P51E.pdf
Dec.25,2015
Notice
SFSCE10M7WF03-R0 Notice
(1) Reow
conditions.
Peak
(240C max.)
Temperature (C)
240
230
Heating
(230C)
Pre-heating
100
(150-180C)
30 sec.
min.
Gradual
Cooling
60-120 sec.
30 sec.
max.
120 sec.
min.
(2) Soldering Iron

(3) Condition for Placement Machines
The component is recommended for placement
details beforehand.
(4) Other
the board.
the component.
Perforation
Susceptibility to
of: A>C>B
Slit
Place the component laterally to the
direction in which
stress acts.
23
P51E.pdf
Dec.25,2015
Notice
2. Wash
3. Coating
evaluated well.
1. Product Storage Condition

Temperature: -10 to + 40C
conditions.
products regularly.
and so on), because the characteristics may be
reduced in quality and may be degraded in
solderability due to storage in a chemical atmosphere.
e Rating e
stress is applied.
e Handling e
24

(4) Please use the products immediately after the
package is opened, because the characteristics may
be reduced in quality and/or be degraded in
solderability due to storage under poor condition.
(5) Please do not drop the products to avoid cracking of
the ceramic element.
4. Other
P51E.pdf
Dec.25,2015
Notice
SFSCE10M7WF04/05-R0 Notice
(1) Reow
conditions.
Peak
(260C max.)
Temperature (C)
260
230
Heating
(230C)
Pre-heating
100
(150-180C)
30 sec.
min.
Gradual
Cooling
60-120 sec.
40 sec.
max.
120 sec.
min.
(2) Soldering Iron

(3) Condition for Placement Machines
The component is recommended for placement
details beforehand.
(4) Other
the board.
the component.
Perforation
Susceptibility to
of: A>C>B
Slit
Place the component laterally to the
direction in which
stress acts.
25
P51E.pdf
Dec.25,2015
Notice
2. Wash
3. Coating
evaluated well.

conditions.
products regularly.
e Rating e
stress is applied.
e Handling e
26

solderability due to storage under poor condition.
4. Other
P51E.pdf
Dec.25,2015
Packaging
Embossed Tape 180mm
1,500
(pcs.)
Dimensions of Reel
Trailer
160 to 190
Empty
Leader
Cover lm
Components
Empty
240 to 280
13.00.5
180 +0
-1.5
400 to 560
2.00.5
17.01.0
13.0 +1.0
-0
(in mm)
~@zz@{
z@}z@z
{@z@z
@zz@{ }+6@
|@zz@z
{|@zz@|
@z@z
{@z@{
{@{z@{
@zz@{
##*',%120#,%2&
z@{2-z@
-4#0q*+ ~@}z@{ (3)
{z+6@
z@z
z@}z@z
{@z@z
1#0"'0#!2'-,-$$##"
F023+ #0+0)#"1'"#'1*571$!',%3.@
HJB#$#0#,!#
(in mm)
27
P51E.pdf
Dec.25,2015
RoHS
Chip Type SFSKA Series

The SFSKA_CF ceramic filter is a small and thin SMD
filter sealed with a metal cap.
The SFSKA_CF is recommended for LCD-TVs, and small and
thin tuners.
7.90.2
3.00.1
1.80.2
0.50.1
8.50.2
Features
0.60.2
1. High attenuation outside bandwidth

2. Small and thin package
3. Reflow-solderable
3.80.2
1.00.1
1.30.2
0.30.1
(1) : Input
(2) : Ground
(3) : Output
1.30.2
(1)
(2)
(3)
(in mm)
2.50.2 2.50.2
Part Number
Nominal Center
Frequency (fn)
(MHz)
3dB
Bandwidth
(kHz)
20dB
Bandwidth
(kHz)
Insertion
Loss
(dB)
Spurious
Attenuation(1)
(dB)
Spurious
Attenuation(2)
(dB)
Input/Output
Impedance
(ohm)
SFSKA4M50CF00-R3
4.500
fn60 min.
600 max.
6.0 max.
20 min.
[within 0 to fn]
15 min.
[within fn to 7.0MHz]
1000
SFSKA5M50CF00-R3
5.500
fn60 min.
600 max.
6.0 max.
25 min.
[within 0 to fn]
15 min.
600
SFSKA6M00CF00-R3
6.000
fn60 min.
600 max.
6.0 max.
25 min.
[within 0 to fn]
15 min.
470
SFSKA6M50CF00-R3
6.500
fn60 min.
600 max.
6.0 max.
25 min.
[within 0 to fn]
15 min.
470

For safety purposes, connect the output of filters to the IF amplifier through a D.C. blocking capacitor. Avoid applying a direct current to the output of ceramic filters.
Test Circuit
SFSKA4M50CF00-R3
(1) (2) (3)
1.0
1.5
1.0
1.5
R1
1.0
Rg
4.8
E1
(in mm)
R2
C2
E2
RF
Voltmeter
S.S.G.
(1): Input
(2): Ground
(3): Output
R1+Rg=R2=1000 5%, Rg=50
E1: S.S.G. Output voltage
28
P51E.pdf
Dec.25,2015
Test Circuit
SFSKA5M50CF00-R3
SFSKA6M00CF00-R3
(1) (2) (3)
(1) (2) (3)

R1
R1
Rg
Rg
R2
E1
C2
E2
RF
Voltmeter
E1
R2
C2 E2
RF
Voltmeter
S.S.G.
S.S.G.
(1): Input
(2): Ground
(3): Output
R1+Rg=R2=600 5%, Rg=50

(1): Input
(2): Ground
(3): Output
R1+Rg=R2=470 5%, Rg=50

SFSKA6M50CF00-R3
(1) (2) (3)
R1
Rg
E1
R2
C2 E2
RF
Voltmeter
S.S.G.
(1): Input
(2): Ground
(3): Output
R1+Rg=R2=470 5%, Rg=50

SFSKA5M50CF00-R3
0
10
10
20
20
Attenuation (dB)
Attenuation (dB)
SFSKA4M50CF00-R3
0
30
40
30
40
50
50
60
60
70
3.5
3.7
3.9
4.1
4.3
4.5
4.7
Frequency (MHz)
4.9
5.1
5.3
70
4.5
5.5
4.7
4.9
10
10
20
20
30
40
60
60
5.4
5.6
5.8
6.0
6.2
Frequency (MHz)
6.1
6.3
6.5
6.9
7.1
7.3
7.5
40
50
5.2
5.9
30
50
70
5.0
5.3
5.5
5.7
Frequency (MHz)
SFSKA6M50CF00-R3
Attenuation (dB)
Attenuation (dB)
SFSKA6M00CF00-R3
5.1
6.4
6.6
6.8
7.0
70
5.5
5.7
5.9
6.1
6.3
6.5
6.7
Frequency (MHz)
29
P51E.pdf
Dec.25,2015
Frequency Characteristics (Spurious)

SFSKA5M50CF00-R3
0
10
10
20
20
Attenuation (dB)
Attenuation (dB)
SFSKA4M50CF00-R3
0
30
40
30
40
50
50
60
60
70
0.0
2.0
4.0
6.0
Frequency (MHz)
8.0
70
10.0
2.0
10
10
20
20
30
40
60
60
30
2.0
4.0
6.0
Frequency (MHz)
8.0
10.0
40
50
10.0
30
50
70
8.0
SFSKA6M50CF00-R3
Attenuation (dB)
Attenuation (dB)
SFSKA6M00CF00-R3
4.0
6.0
Frequency (MHz)
8.0
10.0
70
2.0
4.0
6.0
Frequency (MHz)
P51E.pdf
Dec.25,2015
Notice
Ceramic Filters (CERAFILr) Chip Type SFSKA Series
(1) Reow
conditions.
Temperature (C)
Peak
(260C max.)
260
230
Pre-heating
(150-180C)
100
Heating
(230C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
40 sec.
max.
120 sec.
min.
(2) Soldering Iron


(4) Other
the board.
(c) After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause
destruction resistance characteristics to degrade. To
prevent this, be extremely careful in determining
shape and dimension before designing the circuit
board diagram.
(e) When correcting chips with a soldering iron, the tip of
the soldering iron should not directly touch the chip
component.
Perforation
Susceptibility to
of: A>C>B
Slit
Put the
component
lateral to the
direction in
which stress
acts.
2. Wash
31
P51E.pdf
Dec.25,2015
Notice
3. Coating
evaluated well.

products regularly.
atmosphere.
e Rating e
stress is applied.
e Handling e
specication.
32

4. Other
P51E.pdf
Dec.25,2015
Packaging
Embossed Tape 330mm
3,000
(pcs.)
Dimensions of Reel
Leader
Cover lm
Trailer
160 to 190
Empty Components
Empty
240 to 280 min.
2.20.5
801
3302
400 to 560
13.00.2
17.50.5
21.51.0
(in mm)
4.30.1
Chip lter
(3)
+0.1
8.00.1
10 max.
2.10.05
+0.1
Peeling strength 1.50.0
(0.1 to 0.7N)
Cover lm
0.30.05
16.00.2
9.00.1
7.50.1
2.00.1 4.00.1
2.30.1
+0.1
1.50.0
1.750.1

F02,3+ #0+0)#"1'"#'1*571$!',%3.1'"#@
) : Reference
(in mm)
33
P51E.pdf
Dec.25,2015
RoHS
Chip Type SFSKB Series

5.20.1
(4)
(3.5)
*
(2)
(3)
1.350.15
(4.93)
4-0.35
(4) (1)
0.250.1
(0.1) 1.00.1 (1.6)
(3) (2)
0.30.1
4-0.35
(0.1) 1.50.1 (2.0)
Features
(1)
3.80.1
The SFSKB series are SMD ceramic filters suitable

for IR headphone applications.
Center frequencies of 2.3, 2.8, 3.2, 3.8, 4.3, 4.8, 5.2,
5.7MHz are available.
Realized small, thin and lightweight package,
compared with conventional LC filters.
It helps to compose multi-channel circuit on one PCB.
No frequency adjustment is required on PCB and it
contributes to the reduction of production cost.
Terminal Connection
(1) : Input
(2) : Output
(3) : Ground
(4) : Terminal for external
capacitor
: EIAJ Monthly Code
Tolerance unless otherwise
specied : 0.1mm
( ) : Reference
(in mm)
1. SMD package in plastic emboss tape, available for

automatic placing.
2. They are slim, at only 1.5mm max. thickness, and have a
small mounting area (5.2x3.8mm) enabling flexible PCB
design.
3. Available for lead (Pb) free reflow soldering process.
4. Operating temperature range: 0 to +70C
Storage temperature range: -55 to +85C
5. No frequency adjustment is required in production
process.
6. Small, thin and lightweight package compared with
conventional LC filters
Applications
1. IR headphone
2. Set Top Box for satellite broadcasting
Part Number
Nominal Center
Frequency (fn)
(MHz)
3dB
Bandwidth
(kHz)
20dB
Bandwidth
(kHz)
Insertion
Loss
(dB)
Spurious
Attenuation(1)
(dB)
Spurious
Attenuation(2)
(dB)
Input/Output
Impedance
(ohm)
SFSKB2M30GF00-R1
2.300
fn75 min.
650 max.
6.0 max.
25 min.
23 min.
[within 1.3 to 1.8MHz] [within 2.8 to 3.3MHz]
1000
SFSKB2M80GF00-R1
2.800
fn75 min.
650 max.
6.0 max.
25 min.
25 min.
1000
SFSKB3M20FF00-R1
3.200
fn75 min.
650 max.
6.0 max.
30 min.
30 min.
1000
SFSKB3M80GF00-R1
3.800
fn75 min.
650 max.
6.0 max.
30 min.
30 min.
1000
SFSKB4M30GF00-R1
4.300
fn75 min.
650 max.
6.0 max.
30 min.
30 min.
1000
SFSKB4M80GF00-R1
4.800
fn75 min.
650 max.
6.0 max.
30 min.
30 min.
1000
SFSKB5M20GF00-R1
5.200
fn75 min.
650 max.
6.0 max.
30 min.
30 min.
1000
SFSKB5M70GF00-R1
5.700
fn75 min.
650 max.
6.0 max.
30 min.
30 min.
1000
filters.
34
P51E.pdf
Dec.25,2015
2.0
1.8
1.3
1.6
1.3
1.8
(in mm)
Test Circuit
(1): Input
(2): Output
(3): Ground
(4): Terminal for
external capacitor
(1): Input
(2): Output
(3): Ground
(4): Terminal for
external capacitor
R1+Rg=R2=1.0k
Cc=33pF5%
C2=10pF (Including stray capacitance and
Input capacitance of RF Voltmeter)
(2)
(3)
S.S.G.
R1+Rg=R2=1.0k
Cc=15pF5%
C2
E2
E2
(4)
C2
RF
Voltmeter
(1)
R2
Rg
S.S.G.
SFSKB4M80GF00-R1
E1
E1
E2
(3)
C2
(2)
RF
Voltmeter
(1): Input
(2): Output
(3): Ground
(4): Terminal for
external capacitor
R1+Rg=R2=1.0k
Cc=39pF5%
R1
R2
(4)
Cc
Rg
(1)
(3)
S.S.G.
SFSKB4M30GF00-R1/SFSKB5M70GF00-R1
R1
(2)
Cc
R1+Rg=R2=1.0k
Cc=22pF5%
(4)
E1
E1
S.S.G.
RF
Voltmeter
(1)
Cc
Rg
(3)
E2
(2)
R1
C2
(4)
R2
(1)
Cc
Rg
R1
SFSKB2M80GF00-R1/SFSKB3M20FF00-R1
R2
SFSKB2M30GF00-R1/SFSKB3M80GF00-R1
RF
Voltmeter
(1): Input
(2): Output
(3): Ground
(4): Terminal for
external capacitor
(2)
(3)
S.S.G.
R1+Rg=R2=1.0k
Cc=27pF5%
E2
(4)
C2
(1)
R2
E1
Rg
R1
Cc
SFSKB5M20GF00-R1
RF
Voltmeter
(1): Input
(2): Output
(3): Ground
(4): Terminal for
external capacitor
35
P51E.pdf
Dec.25,2015
SFSKB2M80GF00-R1
0
10
10
20
20
Attenuation (dB)
Attenuation (dB)
SFSKB2M30GF00-R1
0
30
40
30
40
50
50
60
60
70
1.300
1.800
2.300
Frequency (MHz)
2.800
70
1.800
3.300
10
10
20
20
30
40
60
60
3.200
Frequency (MHz)
3.700
70
2.800
4.200
10
10
20
20
30
40
60
60
4.800
70
3.800
5.300
10
10
20
20
30
40
36
4.800
Frequency (MHz)
5.300
5.800
6.200
6.700
40
50
60
60
5.200
Frequency (MHz)
4.300
30
50
4.700
4.800
SFSKB5M70GF00-R1
0
Attenuation (dB)
Attenuation (dB)
SFSKB5M20GF00-R1
0
70
4.200
4.300
40
50
4.300
Frequency (MHz)
3.800
Frequency (MHz)
30
50
3.800
3.300
SFSKB4M80GF00-R1
0
Attenuation (dB)
Attenuation (dB)
SFSKB4M30GF00-R1
0
70
3.300
3.800
40
50
2.700
3.300
30
50
70
2.200
2.800
Frequency (MHz)
SFSKB3M80GF00-R1
Attenuation (dB)
Attenuation (dB)
SFSKB3M20FF00-R1
2.300
5.700
6.200
70
4.700
5.200
5.700
Frequency (MHz)
P51E.pdf
Dec.25,2015

SFSKB2M80GF00-R1
0
10
10
20
20
Attenuation (dB)
Attenuation (dB)
SFSKB2M30GF00-R1
0
30
40
30
40
50
50
60
60
70
0.300
1.300
2.300
Frequency (MHz)
3.300
70
0.800
4.300
10
10
20
20
30
40
60
60
3.200
Frequency (MHz)
4.200
70
1.800
5.200
10
10
20
20
30
40
60
60
5.300
70
2.800
6.300
10
10
20
20
30
40
3.800
4.800
Frequency (MHz)
5.800
6.800
6.700
7.700
40
50
60
60
5.200
Frequency (MHz)
30
50
4.200
5.800
SFSKB5M70GF00-R1
0
Attenuation (dB)
Attenuation (dB)
SFSKB5M20GF00-R1
0
70
3.200
4.800
40
50
4.300
Frequency (MHz)
3.800
Frequency (MHz)
30
50
3.300
2.800
SFSKB4M80GF00-R1
Attenuation (dB)
Attenuation (dB)
SFSKB4M30GF00-R1
70
2.300
4.800
40
50
2.200
3.800
30
50
70
1.200
2.800
Frequency (MHz)
SFSKB3M80GF00-R1
Attenuation (dB)
Attenuation (dB)
SFSKB3M20FF00-R1
1.800
6.200
7.200
70
3.700
4.700
5.700
Frequency (MHz)
37
P51E.pdf
Dec.25,2015
Notice
Ceramic Filters (CERAFILr) Chip Type SFSKB Series
(1) Reow
conditions.
Temperature (C)
Peak
(260C max.)
260
200
Pre-heating
(150-170C)
100
Heating
(200C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
60 sec.
max.
120 sec.
min.
(2) Soldering Iron


(4) Other
the board.
prevent the electrode erosion.
Put the
component
laterally to the
direction in
which stress
acts.
Perforation
Susceptibility to
of: A>C>B
Slit
38
P51E.pdf
Dec.25,2015
Notice
2. Wash
3. Coating
evaluated well.

products regularly.
atmosphere.

4. Other
e Rating e
stress is applied.
e Handling e
specication.
39
Packaging
Embossed Tape 330mm
3,000
(pcs.)
Dimensions of Reel
Leader
Cover Film
Trailer
160 to 190
Empty Components
Empty
240 to 280
(80)
(330)
400 to 560
2.20.2
13.00.2
Label
13.51.0
17.51.5
): Reference
(in mm)
@zz@{
~@|z@{
{@z@{
-4#0
'*+
1#0"'0#!2'-,-$$##"
F023+ #0+0)#"1'"#'1*571$!',%3.1'"#@
40
@z@{
@z@{
z@{
{@ Sz@z
{|@zz@|
~@zz@{
|@zz@{
{@z@{
HJB#$#0#,!#
(in mm)
P51E.pdf
Dec.25,2015
P51E.pdf
Dec.25,2015
Ceramic Trap (CERAFILr)
RoHS
Chip Type TPSKA Series

The TPSKA_B ceramic trap is a small and thin SMD trap
sealed with a metal cap recommended for LCD-TVs and
small and thin tuners.
7.90.2
3.00.1
1.80.2
Features
0.50.1
8.50.2
1. High attenuation and high performance group delay time

2. Small and thin package
3. Reflow-solderable
0.60.2
3.80.2
1.00.1
1.30.2
0.30.1
1.30.2
(1)
(2)
(3)
(1) : Input
(2) : Ground
(3) : Output
(in mm)
2.50.2 2.50.2
Nominal Center Frequency (fn1)

(MHz)
Attenuation (fn1)
(dB)
30dB Attenuation BW (fn1)

(kHz)
TPSKA4M50B00-R3
4.500
35 min.
50 min.
TPSKA5M50B00-R3
5.500
35 min.
70 min.
TPSKA6M00B00-R3
6.000
35 min.
70 min.
TPSKA6M50B00-R3
6.500
35 min.
70 min.
Part Number
filters.
Test Circuit
L
1.0
1.0
1.5
1.0
R1
1.5
Rg
4.8
50
R2
RF
Voltmeter
S.S.G.
Rg=50
R1=330
R2=1.0k
(in mm)
L=15H
TPSKA5M50B00-R3
10
10
Attenuation (dB)
Attenuation (dB)
TPSKA4M50B00-R3
20
30
40
20
30
40
50
50
60
60
70
4.0
4.1
4.2
4.3
4.4
4.5
4.6
Frequency (MHz)
4.7
4.8
4.9
5.0
70
5.0
5.1
5.2
5.3
5.4
5.5
5.6
Frequency (MHz)
5.7
5.8
5.9
6.0
41
P51E.pdf
Dec.25,2015
TPSKA6M50B00-R3
10
10
Attenuation (dB)
Attenuation (dB)
TPSKA6M00B00-R3
20
30
40
20
30
40
50
50
60
60
70
5.5
5.6
5.7
5.8
5.9
6.0
6.1
Frequency (MHz)
6.2
6.3
6.4
70
6.0
6.5
6.1
6.2
6.3
6.4
6.5
6.6
Frequency (MHz)
6.7
6.8
6.9
7.0

TPSKA5M50B00-R3
700
600
10
800
20
500
20
600
30
400
30
400
40
300
40
200
50
200
50
60
100
70
1000
60
70
80
80
1.0
2.0
3.0
Frequency (MHz)
4.0
5.0
1.0
2.0
TPSKA6M00B00-R3
20
600
30
400
40
200
50
60
42
Attenuation (dB)
800
600
30
400
40
200
50
60
80
8.0
9.0
10.0
1000
800
70
4.0 5.0 6.0 7.0

Frequency (MHz)
10.0
20
80
3.0
9.0
10
70
2.0
8.0
1000
Attenuation (dB)
1.0
4.0 5.0 6.0 7.0

Frequency (MHz)
TPSKA6M50B00-R3
10
3.0
1.0
2.0
3.0
4.0 5.0 6.0 7.0

Frequency (MHz)
8.0
9.0
10.0
Attenuation (dB)
0
10
Attenuation (dB)
TPSKA4M50B00-R3
P51E.pdf
Dec.25,2015
Notice
Ceramic Trap (CERAFILr) Chip Type TPSKA Series
(1) Reow
conditions.
Temperature (C)
Peak
(260C max.)
260
230
Pre-heating
(150-180C)
100
Heating
(230C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
40 sec.
max.
120 sec.
min.
(2) Soldering Iron

(4) Other
the board.
(c) After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause
destruction resistance characteristics to degrade. To
prevent this, be extremely careful in determining
shape and dimension before designing the circuit
board diagram.
(e) When correcting chips with a soldering iron, the tip of
the soldering iron should not directly touch the chip
component.
Perforation
Susceptibility to
of: A>C>B
Slit
Put the
component
lateral to the
direction in
which stress
acts.
2. Wash
43
P51E.pdf
Dec.25,2015
Notice
3. Coating
evaluated well.

products regularly.
atmosphere.
e Rating e
stress is applied.
e Handling e
specication.
44

4. Other
P51E.pdf
Dec.25,2015
Packaging
Embossed Tape 330mm
3,000
(pcs.)
Dimensions of Reel
Leader
Cover lm
Trailer
160 to 190
Empty Components
Empty
240 to 280 min.
2.20.5
801
3302
400 to 560
13.00.2
17.50.5
21.51.0
(in mm)
10 max.
4.30.1
Chip lter
(3)
+0.1
8.00.1
2.10.05
+0.1
Peeling strength 1.50.0
(0.1 to 0.7N)
Cover lm
0.30.05
16.00.2
9.00.1
7.50.1
2.00.1 4.00.1
2.30.1
+0.1
1.50.0
1.750.1

F02,3+ #0+0)#"1'"#'1*571$!',%3.1'"#@
) : Reference
(in mm)
45
P51E.pdf
Dec.25,2015
Ceramic Discriminator (CERAFILr)
RoHS
0.30.2
Chip Type CDSCB Series
0.20.2
1.4 max.
4.50.1
2.00.1
The CDSCB10M7 series forms a resonator on a piezoelectric

ceramic substrate. In combination with ICs, this type
obtains stable demodulation characteristics in a wide
bandwidth.
They have 1.0mm max. thickness and small mounting area
(4.5x2.0mm).
0.40.05
1.0 max.
4.1 max.
0.4(ref.)
0.4(ref.)
0.80.1
0.80.1
Features
1. Compact and high reliability and recommended for
automotive applications.
2. Can be combined with various ICs. The IC is determined by
the last number in the part number.
3. Stable demodulation characteristics can be obtained
without adjustment.
4. Stable temperature characteristics.
5. Available lead (Pb) free solder reflow.
1.50.1
Recovered
Audio 3dB BW
(kHz)
Recovered
Audio Output
(mV)
Distortion
(%)
S Curve
(mV)
IC
CDSCB10M7GA105A-R0
10.700 30kHz
220 min.
110 min.
1.5 max.
TEA5757HL
CDSCB10M7GA113-R0
10.700 30kHz
300 min.
110 min.
1.0 max.
TA2154FN
CDSCB10M7GA119-R0
10.700 30kHz
500 min.
75 min.
1.0 max.
TRF6901
CDSCB10M7GA121-R0
10.700 30kHz
390 min.
80 min.
1.0 max.
LV23100V
CDSCB10M7GA135-R0
10.700 30kHz
155 min.
75 min.
TH71101
CDSCB10M7GA136-R0
10.700 30kHz
140 min.
120 min.
TH7122
CDSCB10M7GF072-R0
10.700 (fn)
fn150 min.
130 min.
2.0 max.
TA31161
CDSCB10M7GF107S-R0
10.700 (fn)
fn80 min.
52 min.
3.0 max.
TA31272FN
CDSCB10M7GF109-R0
10.700 (fn)
fn100 min.
170 min.
3.0 max.
TK14588V
CDSCB10M7GF123-R0
10.700 (fn)
900 min.
TA31275FN
CDSCB10M7GF123S-R0
10.700 (fn)
900 min.
TA31275FN
CDSCB10M7GF126-R0
10.700 (fn)
400 min.
NJM2295AV
(fn) indicates nominal center frequency (10.700MHz).

For safety purposes, avoid applying a direct current between the terminals.
46
(in mm)
Center
Frequency (fo)
(MHz)
Part Number
1.50.1

CODE
30kHz Step
25kHz Step
10.700MHz30kHz
10.700MHz25kHz
P51E.pdf
Dec.25,2015
2.6
3.0
1.0
2.0
1.0
(in mm)
Test Circuit
CDSCB10M7GA105A-R0
CDSCB10M7GA113-R0
36
35
34
33
32
31
TEA5757HL
(PHILIPS)
100k
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
S.S.G.
TA2154FN (TOSHIBA)
1
29
28
10
27
11
26
10 11 12 13 14 15
30
+
2.2
AF OUT
D.C. OUT
X: CDSCB10M7GA113-R0
S.S.G.
Unit C: F
R:
10
Unit C: F
R:
X: CDSCB10M7GA105A-R0
CDSCB10M7GA119-R0
CDSCB10M7GA121-R0
Vcc (3.0V)
0.01
AF Output
35
34
33
TRF6901
(TEXAS INSTRUMENTS)
1000p
30
29
28
100p 10
27
11
26
12
25
13 14 15 16 17 18 19 20 21 22 23 24
0.01
47p
31
0.01
0.047
+
0.47
3.3k
+
1
0.1
0.22
+
0.47
S.G.
100p
10k
PIC16F84 (Control IC)

1
PIC16F84
2
1k
2.2 +
10k
18 17 16 15 14 13 12 11 10
18 17 16 15 14 13 12 11 10
9 10 11 12 13 14 15 16 17 18
10k
10 +
32
100
48 47 46 45 44 43 42 41 40 39 38 37
36
LV23100V (SANYO)
1
36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19
82p
10
0.047
120p
4.7
22+
220k
0.047
15p
Vcc (3.2V)
0.01
0.015
10k
0.01
0.01
D.C. Output
AF Output
68p
75
IF Input
10p
AF OUT
100p
150
10p
AFC (n)
0.22
0.1
+
0.47
4.7
AFC (p)
330p
0.1
12
25
13 14 15 16 17 18 19 20 21 22 23 24
DC OUT
0.01
0.01
0.1
680p
0.01
48 47 46 45 44 43 42 41 40 39 38 37
+
100
0.01
10
+
0.01
0.1
0.01
Vcc (1.2V)
Vcc (3.0V)
10k
0.1
1k
Unit C: F
R:
L: H
2.2 + 10k
0.1
Unit
C: F
R:
47
P51E.pdf
Dec.25,2015
Test Circuit
CDSCB10M7GA135-R0
Vcc (5.0V)
AF-OUT
CDSCB10M7GA136-R0
Vcc (5.0V)
FKS-OUT
330p
0.1
0.1
24 23 22 21 20 19 18 17
0.01
100p 1000p 0.01

330k
0.01
25
16
26
15
27
14
TH71101, TH71102, 13
TH71111 or TH71112 12
29
(MELEXIS)
28
0.01
0.01
15
27
14
TH7122
13
[Internal AFC Enabled] 12
29
(MELEXIS)
30
11
24 23 22 21 20 19 18 17
330p
16
26
30
11
31
10
32
31
10
32
12p C.D.
0.01
FKS-OUT
9
1
0.01
0.1
1000p
0.033
330p
330p
S.G.
1000p
0.01
AF-OUT
100k
C.D.
3.3k
330p
9
1
330p
28
220k
0.01
25
100k 100p
18 17 16 15 14 13 12 11 10
0.01
PIC16F84 (Control IC)
S.G.
Unit C: F
330p
R:
+
10
1k
10k
Unit C : F
R:
+
2.2
CDSCB10M7GF072-R0
0.1
CDSCB10M7GF109-R0
Vcc (3V)
0.01
1.2
Vcc (3.0V)
4.7
0.01
AF OUT
X
10p
0.01
D.C. Output
16 15 14 13 12 11 10
51k
+
33
0.01
IF IN
16
15
Unit C: F
R:
L: H
13
12
11
10
TK14588V (TOKO)
S.S.G.
51
0.01
X: CDSCB10M7GF072-R0
R: 820
14
0.01
0.01
4.7
0.01
0.01
0.01
8p
12k
0.01
0.01
1000p
TA31161 (TOSHIBA)
1
AF Output
Unit C: F
R:
L: H
R: 820
CDSCB10M7GF126-R0
19
17
16
15
14
13
10
11
12
0.1
S.S.G.
48
0.1
0.1
0.01
0.1
18
17
16
15
1.8k
0.01
19
Unit C: F
R:
0.01
14
13
12
11
10
NJM2295AV (JRC)
1
TA31275FN (TOSHIBA)
4
20
100p
0.01
18
8p
C.D.
180
10+
20
0.01
21
0.01
22
10+
23
0.01
1000p
24
DC-OUT
DC-OUT
10
AF OUT
0.01
Vcc (5.0V)
0.01
Vcc (5.0V)
10
CDSCB10M7GF123-R0
3300p
S.G.
Unit C: F
R:
P51E.pdf
Dec.25,2015

CDSCB10M7GA105A-R0
CDSCB10M7GA113-R0
Distortion
1
10
10.3
0.1
Input=100dB
fdev.=75kHz
fmod.=1kHz
Vcc=3.0V
10.4
10.5
10.6 10.7 10.8

Frequency (MHz)
10.9
11.0
11.1
10
100
Distortion
10
10.3
10.4
10.5
Distortion
0.1
Input=100dB
fdev.=60kHz
fmod.=1kHz
Vcc=3.0V
10.5
10.6 10.7 10.8

Frequency (MHz)
10.9
11.0
100
11.1
10
Distortion
10
10.3
100
AF Output Voltage (mV)
100
10
Input=100dB
fdev.=50kHz
fmod.=1kHz
Vcc=5.0V
10.6
10.7
Frequency (MHz)
10.8
0.1
10.4
10.5
10.6 10.7 10.8

Frequency (MHz)
10.9
11.0
11.1
CDSCB10M7GA136-R0
1000
10.5
Input=100dB
fdev.=75kHz
fmod.=1kHz
Vcc=3.2V
CDSCB10M7GA135-R0
0.1
10.4
11.1
100
1000
11.0
AF Output
10
10.4
10.9
1000
Total Harmonic Distortion (%)
AF Output
100
10.3
10.6 10.7 10.8

Frequency (MHz)
CDSCB10M7GA121-R0
100
0.1
Input=100dB
fdev.=75kHz
fmod.=1kHz
Vcc=1.2V
CDSCB10M7GA119-R0
1000
10
AF Output
10
AF Output
100
100
1000
100
1000
10.9
11.0
10
Input=100dB
fdev.=50kHz
fmod.=1kHz
Vcc=5.0V
0.1
10.4
10.5
10.6
10.7
Frequency (MHz)
10.8
10.9
11.0
49
P51E.pdf
Dec.25,2015

CDSCB10M7GF072-R0
CDSCB10M7GF109-R0
10
0.1
Input=100dB
fdev.=80kHz
fmod.=1kHz
Vcc=3.0V
10.4
10.5
10.6 10.7 10.8

Frequency (MHz)
10.9
11.0
100
100
10
10
10.3
11.1
0.1
Input=100dB
fdev.=64kHz
fmod.=1kHz
Vcc=3.0V
10.4
10.5
10.6 10.7 10.8

Frequency (MHz)
10.9
11.0
10
100
10.3
1000
100
1000
11.1
S Curve
CDSCB10M7GF123-R0
CDSCB10M7GF126-R0
2.5
4.0
2.0
Volt (V)
Volt (V)
3.0
1.5
1.0
2.0
0.5
0.0
10.3
50
10.4
10.5
10.6
10.7
10.8
Frequency (MHz)
10.9
11.0
11.1
1.0
10.3
10.4
10.5
10.6
10.7
10.8
Frequency (MHz)
10.9
11.0
11.1
P51E.pdf
Dec.25,2015
Notice
Ceramic Discriminator (CERAFILr) Chip Type CDSCB Series
(1) Reow
conditions.
Temperature (C)
Peak
(260C max.)
260
230
Pre-heating
(150-180C)
100
Heating
(230C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
40 sec.
max.
120 sec.
min.
(2) Soldering Iron

details beforehand.
(4) Other
the board.
Place the
component
laterally to the
direction in
which stress
acts.

Perforation B
Slit
Susceptibility to
of: A>C>B
51
P51E.pdf
Dec.25,2015
Notice
2. Wash
3. Coating
evaluated well.

conditions.
products regularly.
degraded due to storage in a chemical atmosphere.
e Rating e
stress is applied.
7
e Handling e
52

degraded due to storage under poor conditions.
4. Other
P51E.pdf
Dec.25,2015
Packaging
Embossed Tape 180mm
2,000
(pcs.)
Dimensions of Reel
Trailer
160 to 190
Leader
Cover lm
Empty Components
Empty
240 to 280
400 to 560
180 +0.1
-1.5
60 -0
+0.1
13.00.2
2.00.5
+1.0
13.0 -0
17.01.0
(in mm)
2.20.1
Cover lm
(3)

F02,3+ #0+0)#"1'"#'1*571$!',%3.@
(
12.00.2
5.50.05
4.70.1
10
+0.1
1.5 -0
0.30.05
(9.0)
4.00.1
##*',%120#,%2&
0.1 to 0.7N
H{@+6@J
+0.1
1.5 -0
2.00.05
1.10.1
4.00.1
1.750.1
'+#,1'-,1-$00'#0.#
): Reference
(in mm)
53
P51E.pdf
Crystal Filters
Dec.25,2015
RoHS
Chip Type XDCAF/XDCAG/XDCAH Series
Lead
free
7.00.2
1.10.15
5.00.2
Murata's Crystal Filter with original thin wafer design

technology based on long experience and activity realizes
high reliability and is widely used in various applications such
as business radios.
Features
1.2
(GND)
(GND)
(Out)
2.54
1.0
1. Low profile surface mount

2. Customized design and matching service
3. 4-Pole type is a small size in one package
XDCAF
(In)
(GND)
(GND)
(in mm)
Applications
1. Radio communication
2. Base Station
3. Communication (IF) other
1.10.15
5.00.2
7.00.2
1.2
(GND)
(Out)
2.54
1.0
(GND)
XDCAG
(In)
(GND)
(GND)
(in mm)
5.00.2
7.00.2
Size
Center Frequency
(MHz)
Number
of Poles
7050
20 to 80
[Fundamental]
70 to 150
[3rd over tone]
XDCAG
XDCAH
1.2
(GND)
(GND)
(Out)
1.0
XDCAF
2.54
Series
1.10.15
Series
XDCAH
(In)
(GND)
(GND)
(in mm)
Part Number List

Series
54
Part Number
Center
3dB
Stopband Insertion Ripple Spurious Response Guarantee Attenuation Termination Number Operating
Frequency Bandwidth Width
Loss
(dB min.)
(dB min.)
Impedance
of
Temperature
(MHz) (kHz min.) (dB max.) (dB max.) (dB max.)
[fo1MHz]
[fo900kHz]
(//pF)
poles Range (C)
XDCAF XDCAF21M400RAA00P0 21.4000
7.5
18
[fo25kHz]
2.0
1.0
10
70
1500//2.5
20 to +70
XDCAF XDCAF21M700MAA00P0 21.7000
3.75
18
[fo20kHz]
2.0
1.0
18
70
850//8.0
20 to +70
XDCAG XDCAG38M850PGA00P0 38.8500
5.0
45
[fo25kHz]
5.0
1.0
40
70
610//3.0
[Cc=14.0pF]
20 to +70
XDCAG XDCAG58M050MGA00P0 58.0500
4.0
38
[fo20kHz]
5.0
1.0
40
70
250//5.5
[Cc=20.5pF]
20 to +70
XDCAH XDCAH50M850PHA00P0 50.8500
5.0
45
[fo25kHz]
5.0
1.0
60
80
560//4.0
[Cc=11.0pF]
20 to +70
XDCAH XDCAH73M350QHA03P0 73.3500
6.0
40
[fo25kHz]
4.0
1.0
60
80
450//4.0
[Cc=9.2pF]
20 to +70
Please be sure to consult with our sales representative or engineer if you require other center frequencies.
P51E.pdf
Dec.25,2015
Test circuit
XDCAF21M400RAA00P0/XDCAF21M700MAA00P0
XDCAG38M850PGA00P0/XDCAG58M050MGA00P0
C1
C1
G
OUT
IN
560
560
S.G 50
L1
C2
OUT
IN
L.M 50
C2 L1
3pF
14pF
3pF
Terminating Impedance: 1500//2.5pF
XDCAH50M850PHA00P0/XDCAH73M350QHA03P0
510
510
S.G 50
4pF
OUT
IN
11pF
L.M 50
4pF
55
XDCAF21M400RAA00P0
c1: LOG 1 dB/
c2: LOG 10 dB/
c1: CNF 21.4 MHz

c2: CNF 21.4 MHz
REF -29.825 dB
REF -29.825 dB
SPF 40 kHz
SPF 2 MHz
XDCAG38M850PGA00P0
c1: LOG 1 dB/
c2: LOG 10 dB/
c1: CNF 38.85 MHz

c2: CNF 38.85 MHz
REF -1.559 dB
REF -1.559 dB
SPF 20 kHz
SPF 2 MHz
XDCAH50M850PHA00P0
c1: LOG 1 dB/
c2: LOG 10 dB/
c1: CNF 50.85 MHz

c2: CNF 50.85 MHz
56
REF -2.641 dB
REF -2.641 dB
SPF 20 kHz
SPF 2 MHz
XDCAF21M700MAA00P0
c1: LOG 1 dB/
c2: LOG 10 dB/
c1: CNF 21.7 MHz

c2: CNF 21.7 MHz
REF -5.336 dB
REF -5.336 dB
SPF 20 kHz
SPF 2 MHz
XDCAG58M050MGA00P0
c1: LOG 1 dB/
c2: LOG 10 dB/
c1: CNF 58.05 MHz

c2: CNF 58.05 MHz
REF -3.634 dB
REF -3.634 dB
SPF 20 kHz
SPF 2 MHz
XDCAH73M350QHA03P0
c1: LOG 1 dB/
c2: LOG 10 dB/
c1: CNF 73.35 MHz

c2: CNF 73.35 MHz
REF -4.566 dB
REF -4.566 dB
SPF 30 kHz
SPF 2 MHz
P51E.pdf
Dec.25,2015
P51E.pdf
Dec.25,2015
Spurious
XDCAF21M400RAA00P0
c3: DLY 5 sec/
c3: CNF 21.4 MHz
REF 23.6 sec
SPF 40 kHz
XDCAG38M850PGA00P0
c3: DLY 20 sec/
c3: CNF 38.85 MHz
REF 66.2 sec
SPF 20 kHz
XDCAH50M850PHA00P0
c3: DLY 20 sec/
c3: CNF 50.85 MHz
REF 65.4 sec
SPF 20 kHz
XDCAF21M700MAA00P0
c3: DLY 10 sec/
c3: CNF 21.7 MHz
REF 50.7 sec
SPF 20 kHz
XDCAG58M050MGA00P0
c3: DLY 20 sec/
c3: CNF 58.05 MHz
REF 82.202379 sec
SPF 20 kHz
XDCAH73M350QHA03P0
c3: DLY 15 sec/
c3: CNF 73.35 MHz
REF 51.529 sec
SPF 30 kHz
57
P51E.pdf
Dec.25,2015
Notice
Crystal Filters Chip Type XDCAF/XDCAG/XDCAH Series
Peak
(260C max.)
260
Temperature (C)

(1) Reow
conditions.
Flux: Please use rosin based ux, but do not use water
soluble ux.
220
Heating
(220C)
120
Pre-heating
(150-180C)
10 sec. max.
120 sec. max.
60 sec. max.
360 sec. max.
(2) Soldering Iron

If compelled to mount the component by using a
soldering iron, please do not directly touch the
component with the soldering iron. The component
terminals or electrical characteristics may be damaged if
excessive thermal stress is applied.
Condition
Heating of the Soldering Iron
350C max.
Soldering Time
5 sec. max.
2. Wash
Do not clean or wash the component.

conditions.
products regularly.

solderability due to storage under poor conditions.
4. Other
(1) Please be sure to consult with our sales
representative or engineer whenever the products are
to be used in conditions not listed above.
58
P51E.pdf
Dec.25,2015
Notice
e Rating e
stress is applied.
e Handling e
(1) For safety purposes, connect the output of lters to the
IF amplier through a D.C. blocking capacitor. Avoid
applying a direct current to the output of lters.
(2) The component is recommended for placement
machines employing optical placement capabilities. The
component might be damaged by mechanical force
depending on placement machine and condition. Make
sure that you have evaluated by using placement
machines before going into mass production. Do not use
placement machines employing mechanical positioning.
Please contact Murata for details beforehand.
(3) Do not reuse components once mounted onto a circuit
board.
(4) Crystal Filter
You are requested to approve our data sheet and
conrm the environment surrounding a crystal lter as
well.
In order to demonstrate sufficient performance, please
read the following notes.
(4)-1 Necessity for LC Tuned Circuit
When the stray capacitance of the PCB that mounts a
crystal lter is large, a tuned circuit for offsetting the
stray capacitance may be needed.
(4)-2 Termination Impedance
The original characteristic in a pass band, insertion loss,
ripple and bandwidth characteristic are no longer
acquired when termination impedance differs from a
rated value. The circuit impedance shall be measured
accurately and it has consistency to match on
termination conditions.
Please keep in mind that a passage region will move in
particular, if termination impedance does not match.
(4)-3 Maximum Level

An input level shall be less than a rated value.
If the input level beyond a rated value impressed, a
crystal resonance characteristic will be deteriorated and
the original characteristic will no longer be acquired as a
crystal lter.
(4)-4 Separation between Input and Output
In order to prevent electromagnetic combination
between input and output, please have shielded
certainly. If it has the combination between input and
output, the incoming signal may go to the output side
directly in the attenuation domain. The amount of
guarantee attenuation will less achievable and the
original characteristic of crystal lter will no longer be
acquired.
There is grounding as one of the method. It enables to
have the crystal lter grounded with attachment screw
or grounding terminal.
The internal part of crystal lter may be damaged, if it
solders to a case directly. In addition the case of a
crystal lter is grounded certainly because potential
difference can be eliminated at the circuit side.
(4)-5 Direct-Current Superposition
When you charge direct-current, please do not have the
current beyond a rated current value. Internal
transformer will generate a heat and it will create a
cause of bad insulation or disconnection, if excess direct
current goes through lter than the rated value.
59
Packaging
Embossed Tape 330mm
3,000
(pcs.)
60
35
7-10
22
R135
1001
3302
130.2
R55
8-R10
2
12-R5
4-R8
30
17.50.5
21
21.51.0
13
(in mm)
1.80.1
0.30.05
Marking
7.50.1
4.00.1
16.00.3
8.00.1
IN
1.5+0.1
0.0
7.50.1
1.750.1
Drawing Out Direction

2.00.1
5 max.
5.50.1
R0.3 max.
1.5+0.1
0.0
(in mm)
60
P51E.pdf
Dec.25,2015
P51E.pdf
Cat. No. P51E
Global Locations
For details please visit www.murata.com
Note
1 Export Control
For customers outside Japan:
No Murata products should be used or
sold, through any channels, for use in the
design, development, production, utilization,
maintenance or operation of, or otherwise
contribution to (1) any weapons (Weapons of
Mass Destruction [nuclear, chemical or biological
weapons or missiles] or conventional weapons)
or (2) goods or systems specially designed or
intended for military end-use or utilization by
military end-users.
For customers in Japan:
For products which are controlled items subject
to the Foreign Exchange and Foreign Trade Law
of Japan, the export license specied by the law
is required for export.
2 Please contact our sales representatives or

product engineers before using the products in
this catalog for the applications listed below,
which require especially high reliability for the
prevention of defects which might directly
damage a third partys life, body or property, or
when one of our products is intended for use
in applications other than those specified in
this catalog.
1
Aircraft equipment
Aerospace equipment
Undersea equipment
Power plant equipment
Medical equipment
Transportation equipment (vehicles, trains,

ships, etc.)
Traffic signal equipment
Disaster prevention / crime prevention

equipment
Data-processing equipment
10
Application of similar complexity and/or

reliability requirements to the applications
listed above
Murata Manufacturing Co., Ltd.
www.murata.com
3 Product specications in this catalog are as of

December 2015. They are subject to change or
our products in it may be discontinued without
advance notice. Please check with our sales
representatives or product engineers before
ordering. If there are any questions, please contact
our sales representatives or product engineers.
4 Please read rating and CAUTION (for storage,
operating, rating, soldering, mounting and
handling) in this catalog to prevent smoking
and/or burning, etc.
5 This catalog has only typical specications.
Therefore, please approve our product
specications or transact the approval sheet
for product specications before ordering.
6 Please note that unless otherwise specied, we
shall assume no responsibility whatsoever for any
conict or dispute that may occur in connection
with the effect of our and/or a third partys
intellectual property rights and other related
rights in consideration of your use of our products
and/or information described or contained in our
catalogs. In this connection, no representation
shall be made to the effect that any third parties
are authorized to use the rights mentioned above
under licenses without our consent.
7 No ozone depleting substances (ODS) under the
Montreal Protocol are used in our manufacturing
process.
Dec.25,2015

Murata Products Crystal Filters P51e

Hochgeladen von

Dokumentinformationen

Copyright

Verfügbare Formate

Dieses Dokument teilen

Dokument teilen oder einbetten

Freigabeoptionen

Stufen Sie dieses Dokument als nützlich ein?

Sind diese Inhalte unangemessen?

Copyright:

Verfügbare Formate

Murata Products Crystal Filters P51e

Hochgeladen von

Copyright:

Verfügbare Formate

P51E.

Ceramic Filters (CERAFILr)/

Product specications are as of December 2015.

5 Ceramic Filters (CERAFILr)

1 Ceramic Filters (CERAFILr)

Chip Type SFECF Series

3 Ceramic Filters (CERAFILr)

Chip Type SFSCE Series

Chip Type TPSKA Series

7 Ceramic Discriminator (CERAFILr)

Chip Type CDSCB Series

4 Ceramic Filters (CERAFILr)

Chip Type SFSKA Series

Chip Type SFSKB Series

6 Ceramic Trap (CERAFILr)

2 Ceramic Filters (CERAFILr)

Chip Type SFECV/SFECK Series

Chip Type XDCAF/XDCAG/XDCAH Series

Please check the MURATA website (http://www.murata.com/)

2 Elements Thickness Expander Mode

3 Elements Thickness Expander Mode

2 Elements Thickness Expander Mode

2 Elements Thickness Expander Mode

Center Frequency Mentioned by Specication

Nominal Center Frequency

3dB bandwidth of "F" signies the frequency difference (both + and -)

Two-digit Alphanumerics Express Series

Embossed Taping 180mm

Embossed Taping 330mm

p is "A" or subsequent code, which indicates the structure/size.

4Nominal Center Frequency

Expressed by four-digit alphanumerics. The unit is in hertz (Hz).

5Product Specication Code (1)

2 Elements Thickness Shear Mode

Product Specication Code (1)

Tight Bandwidth Type

Standard Bandwidth Type

Broad Bandwidth Type

Ultra-broad Bandwidth Type

6Product Specication Code (2)

p is "A" or subsequent code, which indicates the structure/size.

Product Specication Code (2)

Expressed by four-digit alphanumerics. The unit is in hertz (Hz).

Embossed Taping =330mm

With non-standard products, two-digit alphanumerics indicating

5Product Specication Code (1)

Product Specication (1)

Broad Bandwidth Type

Low Capacitance Type

6Product Specication Code (2)

Product Specication (2)

p is "A" or subsequent code, which indicates the structure/size.

4Nominal Center Frequency

Embossed Taping =330mm

With non-standard products, three-digit alphanumerics indicating

Center Frequency Mentioned by Specication

Nominal Center Frequency

3dB bandwidth of "F" signies the frequency difference (both + and -)

Thickness Shear Mode

Applicable IC Control Code

p is "A" or subsequent code, which indicates the structure/size.

Embossed Taping =180mm

Embossed Taping =330mm

Two-digit Alphanumerics Express Series