Beruflich Dokumente
Kultur Dokumente
Buy
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
3 Description
The SN75LVCP601 device is a dual-channel, singlelane SATA redriver and signal conditioner supporting
data rates up to 6 Gbps. The device complies with
SATA physical link 2m and 3i specifications. The
SN75LVCP601 operates from one 3.3-V supply and
has 100- line termination with a self-biasing feature,
making the device suitable for ac coupling. The inputs
incorporate an out-of-band (OOB) detector, which
automatically squelches the output while maintaining
a stable common-mode voltage compliant to the
SATA link. The device design also handles spreadspectrum clocking (SSC) transmission per the SATA
specification.
2 Applications
Notebooks
Desktops
Docking Stations
Servers
Workstations
PACKAGE
WQFN (20)
4 Typical Application
R = SN75LVCP601
HDD
ICH
HDD
ICH
PC/Workstation
Motherboard
eSATA
connector
eSATA
Cable
Notebook
Dock Connector
PC/WS MB
Dock
Notebook Dock
eSATA
connector
iSATA
connector
eSATA Cable
(2m)
HDD
SATA 6G Host
DT MB
Desktop Main Board
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Typical Application ................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
1
1
1
1
2
4
5
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
17
17
18
18
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
27
27
27
27
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (January 2014) to Revision F
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Moved timing parameters out of Electrical Characteristics and into Timing Requirements .................................................. 8
Moved switching parameters out of Electrical Characteristics and into Switching Characteristics ....................................... 8
Page
Changed DJTX (UI = 333 ps) From: Max = 0.19 To: Max = 0.07 ........................................................................................... 8
Changed DJTX (UI = 167 ps) From: Max = 0.34 To: Max = 0.16 ........................................................................................... 8
Page
Corrected formatting of the Differential output-voltage swing dc level section of the Electrical Characteristics table ........... 7
SN75LVCP601
www.ti.com
Page
Deleted setting recommendations on pulse durations for DEW1 and DEW2 ...................................................................... 18
Page
Changed pin type from CML to VML for pins 4, 5, 14, 15...................................................................................................... 4
Page
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
111 RX2P
12
2 RX2N
14 TX1N
1
DE 2
GND 18
DE 1
VCC
LVCP601RTJ
VCC
DE 1
EQ 2 19
EN
VCC 20
DEW 2
TX2P
TX2N
DE 2
RX2P 11
RX2N 12
GND 13
TX1N 14
EQ 1 17
EN
GND
10
TX1P 15
DEW 1 16
10
RX1N
EQ 1 17
LVCP601RTJ
DEW 1 16
DEW 2
GND 18
RX1P
EQ 2 19
15 TX1P
1
TX2P
TX2N
4
GND
3
RX1N
2
RX1P
1
VCC 20
13 GND
1
Top View
Bottom View
Pin Functions
PIN
NAME
NO.
PIN TYPE
DESCRIPTION
CONTROL PINS
DE1, DE2 (1)
8, 9
I, LVCMOS
DEW1, DEW2
16, 6
I, LVCMOS
I, LVCMOS
17, 19
I, LVCMOS
EN
EQ1, EQ2 (1)
I, CML
RX1P
I, CML
RX2N
12
I, CML
RX2P
11
I, CML
TX1N
14
O, VML
TX1P
15
O, VML
TX2N
O, VML
TX2P
O, VML
GND
3, 13, 18
Power
Supply ground
VCC
10, 20
Power
Noninverting and inverting CML differential input for CH 1 and CH 2. These pins
connect to an internal voltage bias via a dual-termination resistor circuit.
Noninverting and inverting VML differential output for CH 1 and CH 2. These pins
connect internally to voltage bias via termination resistors.
POWER
(1)
Internally biased to VCC / 2 with >200-k pullup or pulldown. When 3-state pins are left as NC, board leakage at the pin pad must be
<1 A; otherwise, drive to VCC / 2 to assert mid-level state.
SN75LVCP601
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Voltage range
MIN
MAX
UNIT
0.5
Differential I/O
0.5
Control I/O
0.5
VCC + 0.5
Storage temperature
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the network ground terminal.
V(ESD)
Electrostatic discharge
10000
1500
Machine model
(1)
(2)
(3)
(3)
UNIT
200
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Tested in accordance with JEDEC Standard 22, Test Method A115-A.
Supply voltage
CCOUPLING
Coupling capacitor
MIN
NOM
MAX
3.3
3.6
UNIT
V
12
nF
85
RTJ (WQFN)
UNIT
20 PINS
RJA
38
C/W
RJC(top)
40
C/W
RJB
10
C/W
JT
0.5
C/W
JB
0.9
C/W
RJC(bot)
15.2
C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
215
288
mW
mW
DEVICE PARAMETERS
PD
PSD
ICC
65
80
mA
ICC_ALP
6.5
10
mA
ICC_STDBY
EN = 0 V
mA
Gbps
78
OUT-OF-BAND (OOB)
VOOB
150
mVpp
DVdiffOOB
f = 750 MHz
50
25
mV
DVCMOOB
50
mV
CONTROL LOGIC
VIH
VIL
VINHYS
Input hysteresis
IIH
IIL
1.4
V
0.5
115
mV
30
30
10
A
A
RECEIVER AC/DC
ZDIFFRX
Differential-input impedance
85
ZSERX
40
VCMRX
Common-mode voltage
RLDiffRX
RXDiffRLSlope
RLCMRX
VdiffRX
IBRX
Impedance balance
115
18
28
14
17
10
12
dB
10
17
23
16
12
120
dB/dec
dB
1600
30
41
30
38
20
32
10
26
10
25
f = 3 GHz to 5 GHz
20
17
13
1.8
Differential-mode RL slope
100
mVppd
dB
SN75LVCP601
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
100
122
TRANSMITTER AC/DC
ZdiffTX
85
ZSETX
Single-ended impedance
40
VTXtrans
RLDiffTX
TXDiffRLSlope
RLCMTX
IBTX
DE
DiffVppTX_DE
VCMAC_TX
Differential-mode RL slope
Impedance balance
TX AC CM voltage
VCMTX
Common-mode voltage
TxR/FImb
TX rise-fall imbalance
TxAmpImb
TX amplitude imbalance
1.2
1.2
14
24
19
14
10
10
dB
13
20
19
17
12
11
30
41
30
38
20
33
10
24
10
26
f = 3 GHz to 5 GHz
22
21
550
830
630
dB/dec
dB
dB
dB
mV
At 1.5 GHz
20
50
mVppd
At 3 GHz
12
26
At 6 GHz
13
30
dBmV
(rms)
At 3 Gbps
6%
20%
2%
10%
1.8
PSD
MIN
MAX
UNIT
215
288
mW
mW
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
NOM
MAX
UNIT
80
105
130
42
50
ns
DEVICE PARAMETERS
AutoLPENTRY
AutoLPEXIT
TRANSMITTER AC/DC
tDE
De-emphasis duration
DEW1 or DEW2 = 0
94
DEW1 or DEW2 = 1
215
ps
OUT-OF-BAND (OOB)
tOOB1
See Figure 4
ns
tOOB2
See Figure 4
ns
TYP
MAX
UNIT
323
400
ps
TEST CONDITIONS
MIN
DEVICE PARAMETERS
tPDelay
Propagation delay
tENB
EN 0 1
tDIS
EN 1 0
75
ps
30
ps
55
75
ps
20
ps
RECEIVER AC/DC
t20-80RX
tskewRX
Rise/fall time
Differential skew
62
TRANSMITTER AC/DC
t20-80TX
Rise/fall time
tskewTX
Differential skew
42
TRANSMITTER JITTER
DJTX
0.06
0.07
RJTX
0.01
DJTX
0.08
0.16
RJTX
0.09
(1)
UIp-p
ps-rms
UIp-p
ps-rms
TJ = (14.1 RJSD + DJ), where RJSD is one standard deviation value of RJ Gaussian distribution. Jitter measurement is at the SATA
connector and includes jitter generated at the package connection on the printed circuit board, and at the board interconnect as shown
in Figure 9.
SN75LVCP601
www.ti.com
IN+
50 mV
Vcm
IN-
tOOB2
tOOB1
OUT+
Vcm
OUT-
IN
tPDelay
tPDelay
OUT
RX1,2P
VCMRX
RX1,2N
tOOB1
AutoLPEXIT
TX1,2P
VCMTX
TX1,2N
AutoLPENTRY
Power Saving
Mode
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
1-bit
1 to N bits
1 to N bits
1-bit
tDE
0 dB
-2 dB
-4 dB
DiffVppTX_DE
DiffVppTX
tDE
0.8
40
12
0.7
35
0.5
0.4
0.3
2
0
2
10
12
14
Input Trace Length (in)
16
Residual DJ (ps)
0.6
Residual DJ (ps)
10
Residual DJ 3Gbps
Residual DJ 6Gbps 0.2
Eye Opening 3Gbps
Eye Opening 6Gbps
0.1
18
20
22
0.8
Residual DJ 3Gbps
Residual DJ 6Gbps
Eye Opening 3Gbps
Eye Opening 6Gbps
0.7
30
0.6
25
0.5
20
0.4
15
0.3
10
0.2
0.1
0
2
10
12
14
Output Trace Length (in)
16
18
20
10
0
22
G002
G001
14
SN75LVCP601
www.ti.com
With LVCP601
Agilent
ParBERT
LVCP601
TP4
TP3
TP2
TP1
Agilent
DCA -J
EQ = 14 dB
DE = 2 dB
Without LVCP601
16-in., 4-mil (40.6-cm, 0.101-mm) FR4 Trace +
4-in., 9.5-mil (10.1-cm, 0.241-mm) FR4 Trace +
8-in., 4-mil (20.3-cm, 0.101-mm) FR4 Trace
Agilent
ParBERT
Agilent
DCA -J
TP1
TP4
Figure 8. Performance Curve Measurement Setup
Jitter
Measurement
CP
8" 6 mil Stripline
12" 6mil
Stripline
1
AWG*
CP
AWG*
CP = Compliance point
Jitter
Measurement
Figure 9. Jitter Measurement Test Condition
11
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
TJ
(1e-12)
ps
29.0
DJ
(-)
ps
3.3
RJ
(rms)
ps
1.88
Eye
Amplitude
mv
412.4
Eye
Width
ps
159.2
Eye
Opening
mv
350.52
TJ
(1e-12)
ps
91.8
DJ
(-)
ps
65.4
TJ
(1e-12)
ps
42.0
DJ
(-)
ps
15.9
RJ
(rms)
ps
1.91
Eye
Amplitude
mv
788.8
12
Eye
Amplitude
mv
240
Eye
Width
ps
28.9
Eye
Opening
mv
81.24
Eye
Width
ps
141.3
RJ
(rms)
ps
1.93
Eye
Opening
mv
623.02
TJ
(1e-12)
ps
39.0
DJ
(-)
ps
12.7
RJ
(rms)
ps
1.92
Eye
Amplitude
mv
557.1
Eye
Width
ps
149.7
Eye
Opening
mv
459.62
SN75LVCP601
www.ti.com
TJ
(1e-12)
ps
56.7
DJ
(-)
ps
29.8
RJ
(rms)
ps
2.00
Eye
Amplitude
mv
165.4
Eye
Width
ps
101
Eye
Opening
mv
13.24
TJ
(1e-12)
ps
29.7
DJ
(-)
ps
3.8
RJ
(rms)
ps
1.89
Eye
Amplitude
mv
430.9
Eye
Width
ps
326
Eye
Opening
mv
392.84
TJ
(1e-12)
ps
72.7
DJ
(-)
ps
46.8
RJ
(rms)
ps
1.89
Eye
Amplitude
mv
314.9
Eye
Width
ps
237
Eye
Opening
mv
222.36
13
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
TJ
(1e-12)
ps
39.6
DJ
(-)
ps
12.8
RJ
(rms)
ps
1.96
Eye
Amplitude
mv
714.5
Eye
Width
ps
321
Eye
Opening
mv
611.62
TJ
(1e-12)
ps
47.9
TJ
(1e-12)
ps
128.6
DJ
(-)
ps
101.8
DJ
(-)
ps
20.3
RJ
(rms)
ps
1.99
Eye
Amplitude
mv
615.3
Eye
Width
ps
305.0
Eye
Opening
mv
463.42
RJ
(rms)
ps
1.96
Eye
Amplitude
mv
258.8
Eye
Width
ps
118
Eye
Opening
mv
122.26
14
SN75LVCP601
www.ti.com
TJ
(1e-12)
ps
34.3
DJ
(-)
ps
3.4
RJ
(rms)
ps
2.26
Eye
Amplitude
mv
448
Eye
Width
ps
659
Eye
Opening
mv
417.28
TJ
(1e-12)
ps
67.5
DJ
(-)
ps
38.6
DJ
(-)
ps
13.2
RJ
(rms)
ps
2.31
Eye
Amplitude
mv
753.1
Eye
Width
ps
649
Eye
Amplitude
mv
363.4
Eye
Width
ps
589
Eye
Opening
mv
318.48
TJ
(1e-12)
ps
44.9
RJ
(rms)
ps
2.11
Eye
Opening
mv
604.02
TJ
(1e-12)
ps
57.3
DJ
(-)
ps
21.5
RJ
(rms)
ps
2.62
Eye
Amplitude
mv
672.8
Eye
Width
ps
632.0
Eye
Opening
mv
442.42
15
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
TJ
(1e-12)
ps
113.3
DJ
(-)
ps
81.9
RJ
(rms)
ps
2.30
Eye
Amplitude
mv
322.8
Eye
Width
ps
493
Eye
Opening
mv
217.46
16
SN75LVCP601
www.ti.com
9 Detailed Description
9.1 Overview
The SN75LVCP601 device is a dual-channel, single-lane SATA redriver and signal conditioner supporting data
rates up to 6 Gbps.
This device complies with SATA physical link 2m and 3i specifications. The SN75LVCP601 device is designed to
handle interconnect losses at both its input and output. The input stage of each channel offers selectable
equalization settings that can be programmed to match the loss of the channel. The outputs provide selectable
de-emphasis to compensate for the distortion the SATA signal is expected to experience. The level of
equalization and de-emphasis settings depend on the length of interconnect and its characteristics. Equalization
for input trace and output trace are individually controlled by the setting of EQ1 and EQ2. De-emphasis levels for
input and output trace are individually controlled by the setting of DE1, DE2, DEW1 and DEW2 pins.
RX1P [1]
TX1P [15]
Driver
Equalizer
RT
RX1N [2]
TX1N [14]
OOB
Detect
VBB
SN75LVCP601
RT
RX2N [12]
TX2P [5]
RT
RX2P [11]
OOB
Detect
Driver
Equalizer
TX2N [4]
DEW1 [16]
CTRL
DEW2 [6]
EQ1[17]
DE1[9]
VCC[10,20]
EQ2[19]
DE2[8]
EN[7]
17
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
CH1 OR CH2
DE-EMPHASIS
dB (at 6 Gbps)
EQ1 OR EQ2
NC (default)
NC (default)
14
DEW1 OR DEW2
0
1 (default)
18
SN75LVCP601
www.ti.com
R = SN75LVCP601
ICH
Notebook
Dock Connector
HDD
eSATA
connector
eSATA Cable
(2m)
Dock
Notebook Dock
Figure 26. Typical SN75LVCP601 Placement in the System
19
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
DEW1
1.0 mF
16
17
18
19
20
Vcc
10 nF
1
RX1P
TX1P
15
RX1N
TX1N
14
10 nF
3
10 nF
10 nF
TX2N
RX2N
12
TX2P
RX2P
11
DE2 9
DE1
EN
DEW2
10 nF
Vcc 10
10 nF
10 nF
13
SATA
Connector
SATA Host
10 nF
1.0 mF
3.3 V
1.0 mF
EQ1
EQ2
(1)
(2)
With no external control is implemented, one can leave EN open or tie it to the supply .
(3)
Output de-emphasis setting is for 2 dB, EQ for 7 dB, and DE duration for SATA I/II/III operation for both channels.
(4)
Actual EQ/DE duration settings depend on device placement relative to host and SATA connector.
Output
SN75LVCP601
Lecroy PERT3
TP1
TP2
25-GHz Scope
TP3
TP4
SN75LVCP601
www.ti.com
NC
14
NC
21
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
22
SN75LVCP601
www.ti.com
23
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
24
SN75LVCP601
www.ti.com
12 Layout
12.1 Layout Guidelines
24 in. (61 cm)
Redriver
SATA Host
SATA
Connector
8 in.
(20.3 cm)
Redriver on Motherboard
24 in. (61 cm)
SATA Host
Redriver
Main Board
Dock Board
16 in. (40.6 cm)
SATA
Connector
8 in.
(20.3 cm)
25
SN75LVCP601
SLLSE41F JUNE 2010 REVISED JUNE 2015
www.ti.com
26
SN75LVCP601
www.ti.com
13.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
27
www.ti.com
19-Mar-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
SN75LVCP601RTJR
ACTIVE
QFN
RTJ
20
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
0 to 85
LVC601
SN75LVCP601RTJT
ACTIVE
QFN
RTJ
20
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
0 to 85
LVC601
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
www.ti.com
19-Mar-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
19-Mar-2015
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN75LVCP601RTJR
QFN
RTJ
20
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
SN75LVCP601RTJT
QFN
RTJ
20
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
Pack Materials-Page 1
19-Mar-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN75LVCP601RTJR
QFN
RTJ
20
3000
367.0
367.0
35.0
SN75LVCP601RTJT
QFN
RTJ
20
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
www.ti.com/automotive
Amplifiers
amplifier.ti.com
www.ti.com/communications
Data Converters
dataconverter.ti.com
www.ti.com/computers
DLP Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
www.ti.com/energy
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
www.ti.com/video
RFID
www.ti-rfid.com
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2015, Texas Instruments Incorporated