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Semiconductor
MSM9802/03/05-xxx
Semiconductor
ThisMSM9802/03/05-xxx
version: Sep. 1999
Previous version: May. 1997
GENERAL DESCRIPTION
The MSM9802/03/05 is a PCM voice synthesis IC with built-in mask ROM.
This IC has two user selectable playback algorithms, OKI Non-linear PCM and straight PCM. It
also contains a current mode 10-bit D/A converter and a low-pass filter.
External control has been made easy by the built-in edit ROM that can form sentences by linking
phrases. By using Oki's Sound Analysis and Editing Tool, ROM data such as Phrase Control
Table can be easily set, created, edited, and evaluated.
With the stand-alone mode/microcontroller interface mode switching pin, the MSM9802/03/
05 can support various applications.
FEATURES
Device
fSAM=6.4 kHz
fSAM=8.0 kHz
fSAM=16.0 kHz
512 Kbits
16.0
10.0
8.0
4.0
MSM9803
1 Mbit
32.4
20.2
16.2
8.1
MSM9805
2 Mbits
65.1
40.7
32.5
16.2
MSM9802
ROM size*
ROM custom
8-bit OKI nonlinear PCM method/8-bit straight PCM method
Built-in edit ROM
Random playback function
Sampling frequency
: 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/
16.0 kHz
Note: If RC oscillation is selected, 10.6 kHz, 12.8 kHz, and
16.0 kHz cannot be selected.
Maximum number of phrases
: 63 (Microcontroller interface mode)
56 (Stand-alone mode)
Built-in current mode 10-bit D/A converter
Built-in low-pass filter
Standby function
RC oscillation (256 kHz)/ceramic oscillation (4.096 MHz) selectable
Package options:
18-pin plastic DIP (DIP18-P-300-2.54) (Product name: MSM9802-xxxRS/MSM9803-xxxRS/
MSM9805-xxxRS)
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM9802-xxxGS-K/MSM9803-xxxGS-K/
MSM9805-xxxGS-K)
30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name: MSM9802-xxxGS-AK/MSM9803-xxxGSAK/MSM9805-xxxGS-AK)
xxx indicates code number.
Chip
Note: This data sheet explains a stand-alone mode and a microcontroller interface mode,
separately.
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Semiconductor
MSM9802/03/05-xxx
CONTENTS
(1) Stand-alone Mode
BLOCK DIAGRAM ............................................................................................................................. 3
PIN CONFIGURATION ..................................................................................................................... 4
PIN DESCRIPTIONS ........................................................................................................................... 6
ABSOLUTE MAXIMUM RATINGS ................................................................................................. 8
RECOMMENDED OPERATING CONDITIONS ........................................................................... 8
ELECTRICAL CHARACTERISTICS ................................................................................................ 9
TIMING DIAGRAMS ....................................................................................................................... 12
FUNCTIONAL DESCRIPTION ....................................................................................................... 14
1. Playback Code Specification ............................................................................................. 14
2. Pull-up/Pull-down Resistor .............................................................................................. 14
3. Stand-alone Mode ............................................................................................................... 14
APPLICATION CIRCUITS .............................................................................................................. 19
(2) Microcontroller Interface Mode
BLOCK DIAGRAM ...........................................................................................................................
PIN CONFIGURATION ...................................................................................................................
PIN DESCRIPTIONS .........................................................................................................................
ABSOLUTE MAXIMUM RATINGS ...............................................................................................
RECOMMENDED OPERATING CONDITIONS .........................................................................
ELECTRICAL CHARACTERISTICS ..............................................................................................
TIMING DIAGRAMS .......................................................................................................................
FUNCTIONAL DESCRIPTION .......................................................................................................
1. Playback Code Specification .............................................................................................
2. Address Data .......................................................................................................................
3. Stop Code .............................................................................................................................
4. Generating Pseudo - BUSY Signal through NAR pin....................................................
APPLICATION CIRCUIT.................................................................................................................
21
22
24
25
25
26
29
31
31
31
32
33
34
(3) Common
1. Sampling Frequency ...........................................................................................................
2. Recording/Playback Time .................................................................................................
3. Playback Method ................................................................................................................
4. Phrase Control Table ..........................................................................................................
5. RC Oscillation ......................................................................................................................
6. Ceramic Oscillation ............................................................................................................
7. Low-pass Filter ....................................................................................................................
8. Standby Transition ..............................................................................................................
9. Voice Output Unit Equivalent Circuit (AOUT, VREF Pins) ..........................................
D/A CONVERTER CURRENT CHARACTERISTICS ................................................................
PAD CONFIGURATION .................................................................................................................
35
35
36
37
39
40
42
43
44
45
46
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BUSY
Random
Circuit
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Address Counter
DATA
Controller
PCM
Synthesizer
I/O
Interface
10
OSC1
OSC2
OSC
XT/RC
Timing Controller
OSC3/TEST
3/51
XT/CR
RESET
VDD
GND
VREF
AOUT
MSM9802/03/05-xxx
10-Bit
DAC
&
LPF
Semiconductor
RND
512-Kbit (MSM9802)
1-Mbit (MSM9803)
2-Mbit (MSM9805)
ROM
(Including 11 Kbits of
Edit ROM & Address ROM)
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Multiplexer
CPU/STD
Address &
Switching
Controller
BLOCK DIAGRAM
A2
A1
A0
SW2
SW1
SW0
Semiconductor
MSM9802/03/05-xxx
A0
18 SW2
A1
17 SW1
A2
16 SW0
RESET
15 RND
XT/CR
14 CPU/STD
BUSY
13 OSC3/TEST
GND
12 OSC2
VREF
11 OSC1
AOUT
10 VDD
VDD
24 AOUT
OSC1
23 VREF
OSC2
22 GND
NC
21 NC
OSC3/TEST
20 BUSY
NC
19 NC
CPU/STD
18 XT/CR
RND
17 RESET
NC
16 NC
SW0 10
15 A2
SW1 11
14 A1
SW2 12
13 A0
NC: No connection
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MSM9802/03/05-xxx
VDD
30 AOUT
OSC1
29 VREF
OSC2
28 GND
NC
27 NC
NC
26 NC
OSC3/TEST
25 BUSY
NC
24 NC
CPU/STD
23 XT/CR
NC
22 NC
RND 10
21 RESET
NC 11
20 NC
NC 12
19 NC
SW0 13
18 A2
SW1 14
17 A1
SW2 15
16 A0
NC: No connection
30-Pin Plastic SSOP
Note: Applicable to MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, and MSM9805-xxxGS-AK.
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Semiconductor
MSM9802/03/05-xxx
PIN DESCRIPTIONS
Pin
DIP
SOP SSOP
Symbol
Type
Description
The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0mA and becomes GND
17
21
RESET
20
25
BUSY
18
23
XT/CR
14
CPU/STD
23
29
VREF
current is forced in. If this pin is set to VDD level, the minimum current
is forced in. A pull-down resistor of approx. 10 W is internally
connected to this pin during operation.
Voice output pin.
24
30
AOUT
The voice signals are output as current changes. In standby state, this
pin drives a current of 0 mA and becomes GND level.
7
10
22
1
28
1
GND
VDD
Ground pin.
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between
VDD and GND pins.
Ceramic oscillator connection pin when ceramic oscillation is selected.
11
OSC1
12
OSC2
13
OSC3/TEST
15
10
RND
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Semiconductor
Pin
DIP
SOP SSOP
Symbol
MSM9802/03/05-xxx
Type
Description
Phrase input pins corresponding to playback sound.
1-3
13-15 16-18
A0 - A2
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Semiconductor
MSM9802/03/05-xxx
Symbol
VDD
Input Voltage
VIN
Storage Temperature
TSTG
Condition
Ta=25C
Rating
Unit
0.3 to +7.0
0.3 to VDD+0.3
55 to +150
Symbol
Condition
Range
Unit
VDD
2.0 to 5.5
Operating Temperature
Top
40 to +85
fOSC1
fOSC2
Min.
Typ.
Max.
3.5
4.096
4.5
200
256
300
MHz
kHz
*1 The accuracy of the oscillation frequency when RC oscillation is selected depends largely on
the accuracy of the external R and C.
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Semiconductor
MSM9802/03/05-xxx
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD=5.0 V, GND=0 V, Ta=40 to +85C, unless otherwise specified)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
VIH
4.2
VIL
0.8
VOH
IOH=1 mA
4.6
VOL
IOL=2 mA
0.4
IIH1
VIH=VDD
10
30
90
200
15
*1
IIH2
IIH3
IIL1
VIL=GND
10
IIL2
200
90
30
0.4
mA
16
mA
Ta=40 to +70C
10
Ta=70 to 85C
50
9.5
15
mA
10
13
kW
*2
IDD1
VIH=VDD
VREF=VDD,
AOUT bias voltage=0V
At maximum output current
IDD2
VREF=GND,
AOUT bias voltage=0V
Standby Current
IDS
IAOUT
VREF=GND,
AOUT bias voltage=0V
*1
*2
*3
*4
RVREF
Applicable to SW0-SW2
Applicable to RESET, RND
Dynamic supply current (excluding DAC output current)
Dynamic supply current at maximum output current
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Semiconductor
MSM9802/03/05-xxx
DC Characteristics
(VDD=3.1 V, GND=0 V, Ta=40 to +85C, unless otherwise specified)
Parameter
"H" Input Voltage
Symbol
Condition
Min.
Typ.
Max.
Unit
VIH
2.7
VIL
0.5
VOH
IOH=1 mA
2.6
VOL
IOL=2 mA
0.4
IIH1
VIH=VDD
10
IIH2
10
30
100
15
*1
IIH3
IIL1
VIL=GND
10
*2
IIL2
100
30
10
IDD1
0.15
0.5
mA
IDD2
5.5
mA
Ta=40 to +70C
Ta=70 to 85C
20
1.4
3.2
mA
10
13
kW
VREF=VDD,
AOUT bias voltage=0V
At maximum output current
VREF=GND,
AOUT bias voltage=0V
Standby Current
IDS
IAOUT
RVREF
VREF=GND,
AOUT bias voltage=0V
*1
*2
*3
*4
Applicable to SW2-SW0
Applicable to RESET, RND
Dynamic supply current (excluding DAC output current)
Dynamic supply current at maximum output current
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Semiconductor
MSM9802/03/05-xxx
AC Characteristics
(VDD=5.0 V, GND=0 V, Ta=40 to +85C)
Parameter
Typ.
Max.
40
50
60
10
Symbol
Condition
Min.
fduty
tw(RST)
Unit
tD(RST)
tw(RAN)
100
tw(SW)
16
ms
tSBS
10
tCHA
(note)
14
15
16
ms
(note)
tCHB
(note)
16
ms
tDAR, tDAF
(note)
60
64
68
ms
(note)
200
250
300
ms
350
375
500
15
16
17
tSTB
tBLN
tRA
(note)
(Note) Proportional to master the periods of oscillation frequencies fOSC1 and fOSC2.
The rated values show values when the standard master oscillation frequency is used.
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,
,
,,,
Semiconductor
MSM9802/03/05-xxx
TIMING DIAGRAMS
AC Characteristics at Power-On
VDD
VDDMin
tD(RST)
RESET (I)
tW(RST)
BUSY (O)
SW2-SW0 (I)
First phrase
"000"
First phrase
"000"
tw(SW)
SW0 (I)
BUSY (O)
tCHA
tSBS
AOUT (O)
tDAR
Standby status
tSTB
tDAF
Standby status
First phrase
A2-A0 (I)
SW2-SW0 (I)
"000"
First phrase
"000"
SW0 (I)
BUSY (O)
AOUT (O)
Single phrase
playback
Single phrase
repeated playback
tBLN
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Semiconductor
MSM9802/03/05-xxx
SW2-SW0 (I)
Second phrase
First phrase
A2-A0 (I)
"000"
First phrase
"000"
Second phrase
"000"
tCHB
SW1 (I)
SW0 (I)
BUSY (O)
AOUT (O)
tBLN
First phrase
playback
Second phrase
playback
First phrase
playback
Oscillation start
Same phrase
repeated playback
tBLN
Second phrase
A2-A0 (I)
First phrase
First phrase
(Ex.)
Second phrase
tCHA
SW2-SW0 (I)
"000"
First phrase
(Second phrase)
"000"
SW0 (I)
BUSY (O)
AOUT (O)
tBLN
First phrase
playback
Second phrase
playback
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Semiconductor
MSM9802/03/05-xxx
FUNCTIONAL DESCRIPTION
1. Playback Code Specification
The user can specify a maximum of 56 phrases. Table 1.1 shows the settings by the A2-A0 and
SW2-SW0 pins.
Table 1.1 User-specified Phrases
A2-A0
SW2-SW0
Code Details
000
000
Inhibit code
001
111
User-specified phrase
(56 phrases)
111
2. Pull-up/Pull-down Resistor
The RESET and RND pins have internal pull-up resistors and the SW2-SW0 pins have internal
pull-down resistors.
3. Stand-alone Mode
In a stand-alone mode, the SW input interface function and the random playback function can
be used.
3.1 SW input interface
With the SW input interface, speech synthesis starts when the state of the SW2-SW0 pins has
changed. To prevent chattering, the address data is latched 16 ms (tCHA) after the state of SW2SW0 has changed. Voice synthesis does not start if the state of the A2-A0 pins has changed. Set
the RND pin to "H" level if the random playback function is not used.
Set the A2-A0 pins to "L" level at power-on or at reset.
The SW input interface is effective when the MSM9802/03/05 is operated using a push-button
switch. Voice synthesis starts when an address is changed by pressing the push-button switch.
If the push-button switch is released during playback, then playback stops after the current
phrase is completed.
A2-A0 (I)
SW2-SW1 (I) "L"
tw(SW)
SW0 (I)
BUSY (O)
tCHA
AOUT (O)
Oscillation start
Semiconductor
MSM9802/03/05-xxx
If playback is attempted at an unused address in the phrases, AOUT goes to 1/2 IAOUT and
playback does not occur. Figure 3.2 shows the timing.
A2-A0 (I)
SW2-SW1 (I) "L"
SW0 (I)
BUSY (O)
AOUT (O)
Oscillation start
In the SW input interface, no phrase is triggered when SW2 to SW0 are all set to "0". Therefore,
when the circuit consists of a diode matrices that use push-button switches, the maximum
playback phrases are 56 phrases.
A2-A0
SW2-SW0
000
001
002
(000)
001
002
= 56 Phrases
111
111
8 codes
Code Prohibited
7 codes
= 56
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Semiconductor
MSM9802/03/05-xxx
A0, SW2-SW0
Phrase
00
0001
sunny
0010
rainy
0011
cloudy
0100
snowy
0101
sunny
1110
rainy
1111
snowy
Random playback starts when the timing shown in Figure 3.3 is input to the RND pin. A random
address is fixed based on the "H" level time of the RND pin during IC oscillation. Random
address is captured at the fall of the RND pin, and voice playback commences. Therefore, when
power is turned on, or when RESET is input, the phrase at fixed address "0001" is played while
the random counter remains initialized until random playback is initiated.
RESET (I)
tW (RAN)
RND (I)
tRA
tW (RAN)
Random address fixed time
tRA
BUSY (O)
AOUT (O)
Oscillation start
Playback
(Address = 0001)
Playback
(Address = random)
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Semiconductor
MSM9802/03/05-xxx
00
0001
0010
0011
0100
Hit
Hit
Hit
Out
Hit
Out
Out
Out
1111
Out
0001
0010
0011
0100
White
Black
Red
Blue
1111
Green
0001
1111
0001
0010
0011
0100
11
Out
10
1111
01
A2, A1
For a random address, 15 phrases can be set for each logical condition of addresses A2 and A1
(i.e., "00", "01", "10", and "11").
In random playback, the four logic states ("000000", "010000", "100000" and "110000") in userspecified phrases cannot be used. Take it into consideration when creating ROM data.
A random address is set by the "H" level time of the RND pin, so if the same pulse width is input
by microcontroller, the random address fixed time becomes constant, and a random phrase may
not be played under these conditions. The random address fixed time must be inconsistent in
order to produce random playback.
RND (I)
Invalid pulse
Pulse input during this time period is invalid
BUSY (O)
AOUT (O)
Oscillation start
Figure 3.4 Timing when a Pulse is Input to the RND Pin During Random Playback
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Semiconductor
MSM9802/03/05-xxx
A0, SW2-SW0*
Code Details
0001
00
1111
01
0001
Stop address
SW0
SW1
SW2
A0
A1
A2
RND
An unused user-specified address is used as a stop address, therefore the IC can enter standby
without voice playback, as shown in Figure 3.2.
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Semiconductor
MSM9802/03/05-xxx
APPLICATION CIRCUITS
VDD
S3
S2
S1
SW0
AOUT
SW1
VREF
SW2
BUSY
RND
RESET
A0
S4
A1
A2
OSC3
OSC2
XT/CR
OSC1
CPU/STD
GND
A2
S4="L"
S4="H"
A1
A0
SW2
SW1
SW0
Address [HEX]
S1
01
S2
02
S3
04
S1
09
S2
0A
S3
0C
19/51
A2
A1
A0
RND
OSC1
OSC2
OSC3
RESET
BUSY
VREF
AOUT
GND
CPU/STD
XT/CR
SW2
SW1
SW0
VDD
Semiconductor
MSM9802/03/05-xxx
20/51
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Address Counter
DATA
Controller
PCM
Synthesizer
NAR
10
OSC1
OSC2
OSC
XT/RC
Timing Controller
OSC3/TEST
21/51
XT/CR
RESET
VDD
GND
VREF
AOUT
MSM9802/03/05-xxx
10-Bit
DAC
&
LPF
Semiconductor
ST
I/O
Interface
512-Kbit (MSM9802)
1-Mbit (MSM9803)
2-Mbit (MSM9805)
ROM
(Including 11Kbit of
Edit ROM & Address ROM)
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Multiplexer
CPU/STD
Address
Controller
BLOCK DIAGRAM
I5
I4
I3
I2
I1
I0
Semiconductor
MSM9802/03/05-xxx
I3
18 I2
I4
17 I1
I5
16 I0
RESET
15 ST
XT/CR
14 CPU/STD
NAR
13 OSC3/TEST
GND
12 OSC2
VREF
11 OSC1
AOUT
10 VDD
VDD
24 AOUT
OSC1
23 VREF
OSC2
22 GND
NC
21 NC
OSC3/TEST
20 NAR
NC
19 NC
CPU/STD
18 XT/CR
ST
17 RESET
NC
16 NC
I0 10
15 I5
I1 11
14 I4
I2 12
13 I3
NC: No connection
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Semiconductor
MSM9802/03/05-xxx
VDD
30 AOUT
OSC1
29 VREF
OSC2
28 GND
NC
27 NC
NC
26 NC
OSC3/TEST
25 NAR
NC
24 NC
CPU/STD
23 XT/CR
NC
22 NC
ST 10
21 RESET
NC 11
20 NC
NC 12
19 NC
I0 13
18 I5
I1 14
17 I4
I2 15
16 I3
NC: No connection
30-Pin Plastic SSOP
Note: Applicable to MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, and MSM9805-xxxGS-AK.
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Semiconductor
MSM9802/03/05-xxx
PIN DESCRIPTIONS
Pin
DIP
SOP SSOP
Symbol
Type
Description
The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0 mA and becomes GND
17
21
RESET
20
25
NAR
Diagram) is idle. NAR at "H" level indicates that the LATCH is empty
and ST input is enabled.
18
23
XT/CR
14
CPU/STD
23
29
VREF
current is forced in, and if set to VDD level, the minimum current is
forced in. An approx. 10 kW pull-down resistor is internally connected
to this pin during operation.
Voice output pin.
24
30
AOUT
The voice signals are output as current changes. In standby state, this
pin drives a current of 0 mA and becomes GND level.
22
28
GND
10
VDD
11
OSC1
Ground pin.
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between
this pin and the GND pin.
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Input from this pin if external clock is used.
Ceramic oscillator connection pin when ceramic oscillation is selected.
12
OSC2
13
OSC3/TEST
15
10
ST
at rise of ST. Input ST when NAR, the status signal, is at "H" level.
This pin has internal pull-up resistor.
16-18
1-3
10-15 13-18
I0 - I5
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Semiconductor
MSM9802/03/05-xxx
Symbol
VDD
Input Voltage
VIN
Storage Temperature
TSTG
Condition
Ta=25C
Rating
Unit
0.3 to +7.0
0.3 to VDD+0.3
55 to +150
Symbol
Condition
Range
Unit
VDD
2.0 to 5.5
Operating Temperature
Top
40 to +85
fOSC1
fOSC2
Min.
Typ.
Max.
3.5
4.096
4.5
200
256
300
MHz
kHz
*1 The accuracy of the oscillation frequency when RC oscillation is selected depends largely on
the accuracy of the external R and C.
25/51
Semiconductor
MSM9802/03/05-xxx
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD=5.0 V, GND=0 V, Ta=40 to +85C, unless otherwise specified)
Parameter
"H" Input Voltage
Symbol
Condition
Min.
Typ.
Max.
Unit
VIH
4.2
VIL
0.8
VOH
IOH=1 mA
4.6
VOL
IOL=2 mA
0.4
IIH1
VIH=VDD
10
IIH2
15
IIL1
VIL=GND
10
*1
IIL2
200
90
30
IDD1
0.4
mA
16
mA
Ta=40 to +70C
10
Ta=70 to 85C
50
9.5
15
mA
10
13
kW
VREF=VDD,
AOUT bias voltage=0V
At maximum output current
IDD2
VREF=GND,
AOUT bias voltage=0V
Standby Current
IDS
IAOUT
RVREF
VREF=GND,
AOUT bias voltage=0V
*1 Applicable to RESET, ST
*2 Dynamic supply current (excluding DAC output current)
*3 Dynamic supply current at maximum output current
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Semiconductor
MSM9802/03/05-xxx
DC Characteristics
(VDD=3.1 V, GND=0 V, Ta=40 to +85C, unless otherwise specified)
Symbol
Condition
Min.
Typ.
Max.
Unit
VIH
2.7
VIL
0.5
VOH
IOH=1 mA
2.6
VOL
IOL=2 mA
0.4
IIH1
VIH=VDD
10
15
Parameter
IIH2
IIL1
VIL=GND
10
IIL2
100
30
10
0.15
0.5
mA
5.5
mA
Ta=40 to +70C
Ta=70 to 85C
20
1.4
3.2
mA
10
13
kW
*1
IDD1
VIH=VDD
VREF=VDD,
AOUT bias voltage=0V
At maximum output current
IDD2
VREF=GND,
AOUT bias voltage=0V
Standby Current
IDS
IAOUT
VREF=GND,
AOUT bias voltage=0V
RVREF
*1 Applicable to RESET, ST
*2 Dynamic supply current (excluding DAC output current)
*3 Dynamic supply current at maximum output current
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Semiconductor
MSM9802/03/05-xxx
AC Characteristics
(VDD=5.0 V, GND=0 V, Ta=40 to +85C)
Symbol
Condition
Min.
Typ.
Max.
Unit
fduty
40
50
60
tw(RST)
10
tD(RST)
tSTP
At power-on
t(ST)
0.35
2000
tSS
40
tDW
Parameter
tWD
tSNS
fSAM=8 kHz
10
tNAA
350
375
400
tNAB
315
440
500
tNAC
350
375
500
tDAR, tDAF
(note)
60
64
68
ms
tSTB
(note)
200
250
300
ms
350
375
500
tBLN
(Note) Proportional to master the periods of oscillation frequencies fOSC1 and fOSC2.
The rated values show values when the standard master oscillation frequency is used.
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,
,
,,,
Semiconductor
MSM9802/03/05-xxx
TIMING DIAGRAMS
AC Characteristics at Power-On
VDD
VDDMin
tD(RST)
RESET (I)
tW(RST)
NAR (O)
tSTP
ST (O)
t(ST)
ST ( I )
NAR (O)
tDW
tWD
tSNS
AOUT (O)
tNAA
tDAR
Voice playback
tSTB
tDAF
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Semiconductor
Playback Timing
I5-I0 (I)
ST ( I )
tNAC
NAR (O)
tNAB
AOUT (O)
1st phrase
playback
tDAR
2nd phrase
playback
3rd phrase
playback
tBLN
Oscillation start
MSM9802/03/05-xxx
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Semiconductor
MSM9802/03/05-xxx
FUNCTIONAL DESCRIPTION
1. Playback Code Specification
The user can specify a maximum of 63 phrases. Table 1.1 shows the settings by the I5-I0 pins.
Table 1.1 User-specified Phrases
I5-I0
Code Details
000000
Stop code
000001
111111
User-specified phrase
(63 Phrases)
2. Address Data
If a phrase is input at I5-I0 pins by address data, and if a ST pulse is then applied, voice playback
starts. Figure 2.1 shows voice start timing. Figure 2.2 shows timing when an address other than
a phrase is input.
I5-I0 (I)
User phrase
ST ( I )
NAR (O)
AOUT (O)
Oscillation start
Voice end
I5-I0 (I)
ST ( I )
NAR (O)
AOUT (O)
Oscillation start
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3. Stop Code
If I5-I0 are set to "000000" during voice playback, and a ST signal is input, playback stops
regardless of whether NAR is at "H" or "L" level, then AOUT becomes 1/2 IAOUT. Stop code
becomes valid at the falling edge of ST.
Figure 3.1 shows stop code input timing.
I5-I0 (I)
"000000"
User phrase
tSS
ST ( I )
NAR (O)
AOUT (O)
Voice stop
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Semiconductor
MSM9802/03/05-xxx
02 (Phrase 2)
03 (Phrase 3)
ST
30ms or more
30ms or more
30ms or more
NAR
(Pseudo-BUSY)
AOUT
tDAR
Phrase 1
Phrase 2
tNAB
Phrase 3
tNAB
Silence
phrase
tSTB
tDAF
tSTB
tDAF
tNAB
ST
30ms or more
NAR
(Pseudo-BUSY)
AOUT
tDAR
Phrase 1
Phrase 2
tBLN
Phrase 3
tBLN
Silence
phrase
tNAB
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Semiconductor
MSM9802/03/05-xxx
APPLICATION CIRCUIT
VCC
P2.2
ST
P2.1
RESET
P3.0
NAR
RESET
XTAL1 XTAL2
OSC3
VREF
AIN
AOUT
CPU/STD
XT/CR
OSC2
OSC1
GND
STBY
VR
GND
I5
I4
I3
I2
I1
I0
MSM9802/03/05
MSM83C154 (MCU)
VDD
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
SP
SP
SEL
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Semiconductor
MSM9802/03/05-xxx
(3) Common
1. Sampling Frequency
As shown in Table 1.1, 7 sampling frequencies are available.
A sampling frequency can be selected and assigned to each phrase in ROM data.
Table 1.1 Sampling Frequency
Sampling Frequency
At standard
XT/CR="H"
XT/CR="L"
oscillation frequency
Ceramic Oscillation
CR Oscillation
4.0 kHz
fOSC1/1024
fOSC2/64
5.3 kHz
fOSC1/768
fOSC2/48
6.4 kHz
fOSC1/640
fOSC2/40
8.0 kHz
fOSC1/512
fOSC2/32
10.6 kHz
fOSC1/384
Unavailable
12.8 kHz
fOSC1/320
Unavailable
16.0 kHz
fOSC1/256
Unavailable
Note: When RC oscillation is selected, 10.6 kHz, 12.8 kHz, and 16 kHz cannot be selected.
2. Recording/Playback Time
Figure 2.1 below shows memory allocation of the on-chip Mask ROM. About 11 Kbits of data area
is allocated for the Phrase Control Table, Phrase Data Control and Test Data.
Therefore, actual data area for storing sound data equals the total Mask ROM capacity minus 11
Kbits.
4K bit
4K bit
3K bit
User's Area
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Semiconductor
MSM9802/03/05-xxx
The playback time is obtained by dividing the memory capacity by the bit rate.
The playback time for 8-bit PCM algorithm is obrained by using the following equation.
Memory capacity [bit]
For example, if all phrases are stored in the MSM9802 at 8 kHz sampling frequency, the
maximum playback time is as follows.
Playback time =
= 8.0 [sec]
Model
ROM capacity
User's area
MSM9802
512K bit
501K bit
16.0
10.0
8.0
4.0
MSM9803
1M bit
1013K bit
32.4
20.2
16.2
8.1
MSM9805
2M bit
2037K bit
65.1
40.7
32.5
16.2
3. Playback Method
This IC provides two kinds of playback methods, non-linear PCM algorithm and straight PCM
algorithm. When the 8-bit non-linear PCM algorithm is selected, sound quality can be improved
because a resolution equivalent to 10-bit straight PCM is available around the waveform center.
You can select either non-linear PCM algorithm or straight PCM algorithm for each phrase. Table
3.1 shows the relationship between playback methods and applicable sounds. It is recommended to evaluate the sound quality before actual use.
Table 3.1 Relationship between playback methods and applicable sounds
Playback method
Applicable sound
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Semiconductor
MSM9802/03/05-xxx
32 ms
2016 ms
32 ms
X-Address
Y-Address
(HEX)
(Up to 8 phrases)
Sound Data
It is (silence) fine today.
02
03
[01] [02] [10] [21] [11] [12] [22] [03] It is fine becoming cloudy, rainy in some areas today.
62
3E
63
3F
01
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Semiconductor
MSM9802/03/05-xxx
Phrase Addigned
No. Y-Address
Phrase
01
[01]
it
01
02
[02]
is
02
is
03
Silence (64ms)
03
today
04
[12]
rainy
05
[03]
today
16
10
fine
06
17
11
cloudy
07
18
12
rainy
08
19
13
snowy
09
Silence time setting
32
20
ocasionally
(32ms n)
33
21
becoming
34
22
in some areas
63
3F
63
3F
Silence time
32 ms
64 ms
63
2016 ms
it
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Semiconductor
MSM9802/03/05-xxx
5. RC Oscillation
Figure 5.1 shows an external circuit using RC oscillation. Figure 5.2 shows the RC oscillation
frequency characteristics.
R1
OSC1
R2
OSC2
C
OSC3
500
450
VDD=5 V
C=30 pF
R1=100 kW
400
350
VDD=5 V
C=47 pF
300
250
200
150
VDD=3 V
C=47 pF
VDD=3 V
C=30 pF
100
50
0
10
20
30
40
50
60
70
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Semiconductor
MSM9802/03/05-xxx
6. Ceramic Oscillation
Figure 6.1 shows an external circuit using a ceramic oscillator.
OSC1
C1
OSC2
C2
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Semiconductor
MSM9802/03/05-xxx
For example, the following table shows the optimum load capacitances, power supply voltage
ranges, and operating temperature ranges when ceramic oscillators made by Murata MFG Co.,
Ltd., Kyocera Co., Ltd. and TDK Co., Ltd. are used.
Ceramic oscillator
Murata MFG.
Maker
Type
CSA4.09MGU
CST4.09MGWU
CSTCC4.00MG
CSTCC4.00MGU
Frequency
(MHz)
4.096
4.0
Kyocera
PBRC4.00A
KBR-4.0MSB
PBRC4.00B
TDK
(Note)
C2 (pF)
30
30
Built in
Built in
15
15
33
33
4.0
KBR-4.0MKC
CCR4.00MC3
C1 (pF)
4.0
Built in
Built in
Built in
Built in
Operating
temperature range
(C)
3.0 to 5.5
3.6 to 5.5
40 to +85
2.7 to 5.5
3.1 to 5.5
20 to +80
2.4 to 5.5
40 to +85
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Semiconductor
MSM9802/03/05-xxx
7. Low-Pass Filter
In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 7.1 and Table
7.2 show the LPF frequency characteristics and LPF cutoff frequency respectively.
Only the voice output through LPF is enabled in this IC.
[dB] 20
10
0
10
20
30
40
50
60
70
80
100
10
1k
10k
[Hz]
4.0
5.3
1.2
1.6
6.4
2.0
8.0
2.5
10.6
3.2
12.8
4.0
16.0
5.0
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Semiconductor
MSM9802/03/05-xxx
8. Standby Transition
When playback of a phrase is finished, if playback of the next phrase does not start up within tSTB
(0.25 sec. typ.), the IC enters standby status and the entire operation stops.
A2 - A0
SW0
BUSY
AOUT
Figure 8.1 Timing for Voice Playback during D/A Converter Change Time
(Stand-alone Mode)
I5 - I0
ST
NAR
AOUT
Figure 8.2 Timing for Voice Playback during D/A Converter Change Time
(Microcontroller Interface Mode)
If playback is attempted during D/A converter change time as shown in figures 8.1 and 8.2, the
IC exits from standby status and the output from the D/A converter begins going to the
1/2 IAOUT level. When the output reaches 1/2 IAOUT, voice playback starts.
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Semiconductor
MSM9802/03/05-xxx
Current-Sourcing Type
D/A Converter
VDD
VREF
10kW
(TYP)
PCM Value
AOUT
IAOUT
Standby Signal
(The above switch positions show those when the circuit is active.)
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Semiconductor
MSM9802/03/05-xxx
25
25
50
75
100
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VREF [V]
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Semiconductor
MSM9802/03/05-xxx
PAD CONFIGURATION
MSM9802
Pad Layout
Chip size
Chip thickness
Pad size
Substrate potential
:
:
:
:
X=3.22mm Y=3.17mm
350m 30m
110m 110m
GND
Y-axis
3
18 17
16
15
MSM9802
14
X-axis
5
(NC)
6
13
10 11
12
Pad Coordinates
(Chip center is located at X=0 and Y=0)
(Unit: m)
Pad No.
Pad Name
X-axis
Y-axis
Pad No.
Pad Name
X-axis
Y-axis
I3/ (A0)
415
1385
10
VDD
462
1347
I4/ (A1)
816
1385
11
OSC1
742
1333
I5/ (A2)
1460
1385
12
OSC2
1349
1333
RESET
1460
1049
13
OSC3
1460
972
XT/CR
1458
20
14
CPU/STD
1389
183
NAR
1460
899
15
ST/(RND)
1389
1058
GND
1460
1375
16
I0/(SW0)
1389
1385
VREF
1135
1333
17
I1/(SW1)
719
1385
AOUT
585
1333
18
I2/(SW2)
276
1385
Semiconductor
MSM9802/03/05-xxx
MSM9803
Pad Layout
Chip size
Chip thickness
Pad size
Substrate potential
:
:
:
:
X=3.22mm Y=4.06mm
350m 30m
110m 110m
GND
Y-axis
3
18 17
16
15
MSM9803
14
5
X-axis
(NC)
6
13
10 11
12
Pad Coordinates
(Chip center is located at X=0 and Y=0)
(Unit: m)
Pad No.
Pad Name
X-axis
Y-axis
Pad No.
Pad Name
X-axis
Y-axis
I3/ (A0)
415
1829
10
VDD
452
1788
I4/ (A1)
816
1829
11
OSC1
742
1776
I5/ (A2)
1460
1829
12
OSC2
1349
1776
RESET
1460
1493
13
OSC3
1460
1415
XT/CR
1458
424
14
CPU/STD
1389
628
NAR
1460
1342
15
ST/(RND)
1389
1502
GND
1460
1818
16
I0/(SW0)
1389
1829
VREF
1135
1776
17
I1/(SW1)
720
1829
AOUT
585
1776
18
I2/(SW2)
276
1829
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Semiconductor
MSM9802/03/05-xxx
MSM9805
Pad Layout
Chip size
Chip thickness
Pad size
Substrate potential
:
:
:
:
X=3.22mm Y=5.96mm
350m 30m
110m 110m
GND
Y-axis
3
18 17
16
15
4
5
MSM9805
14
X-axis
(NC)
13
10 11
12
Pad Coordinates
(Chip center is located at X=0 and Y=0)
(Unit: m)
Pad No.
Pad Name
X-axis
Y-axis
Pad No.
Pad Name
X-axis
Y-axis
I3/ (A0)
415
2777
10
VDD
452
2723
I4/ (A1)
816
2777
11
OSC1
742
2726
I5/ (A2)
1460
2777
12
OSC2
1349
2726
RESET
1460
882
13
OSC3
1460
1532
XT/CR
1458
364
14
CPU/STD
1453
267
NAR
1460
1546
15
ST/(RND)
1455
1338
GND
1460
2768
16
I0/(SW0)
1432
2777
VREF
1136
2726
17
I1/(SW1)
754
2777
AOUT
585
2726
18
I2/(SW2)
312
2777
Semiconductor
MSM9802/03/05-xxx
PACKAGE DIMENSIONS
(Unit : mm)
DIP18-P-300-2.54
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.30 TYP.
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Semiconductor
MSM9802/03/05-xxx
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
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Semiconductor
MSM9802/03/05-xxx
(Unit : mm)
SSOP30-P-56-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.19 TYP.
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E2Y0002-29-62
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
4.
5.
Neither indemnity against nor license of a third partys industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third partys right which may result from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.
7.
Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior
permission.
9.