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ANTENNA INTEGRATION FOR

WIRELESS MODULES
WALTER DE RAEDT
STEVEN BREBELS

ANSYS REGIONAL CONFERENCE, LA HULPE


25 OCTOBER 2011

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

OUTLINE
Introduction
Design of active antenna package for 60
GHz
Antenna performance
Low interconnect loss between chip and
antenna elements
Shielding of chip and interconnect

Conclusion
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 2

INTRODUCTION
WHY INTEGRATED RF SYSTEMS?
Integrate miniaturised, truly autonomous systems for ambient
intelligence
Size reduction:

- Planar as thin as possible


- Cubic small footprint
Hetero-integration

- Reduction of amount and size of passives


- Actives in different technologies
ULP requirements
Modularity
Antenna integration

5.2GHz WLAN Front-End


IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 3

INTRODUCTION
17 GHZ SYSTEM INTEGRATION
Miniaturized 17 GHz wireless rf-front end module for a wireless
autonomous sensor
Project goals:
Realize compact hybrid integration of
microcontroler, radio chip and passive
devices
To be integrated with antenna patch,
sensors, power and power-management
components
-15

15

-30

30

-45

45

-60

60

-75

75

-90

90

-30

-105

P. van Engen et al. 3D


Si-level integration in
wireless sensor node
SSI2009

105

-20
-120

120
-10
-135
-150

Simulated Co-polarization
0
Measured Co-polarization
Measured X-polarization 150
-165

180

135

10 165

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 4

INTRODUCTION
60 GHz band for wireless HD
Unlicensed band between 57 and 66 GHz
Unidirectional link to High-Definition (HD) screen
Digital video

Set-top

Portable
Digital

Blu-ray

Game
console

Digital
Audio/Video
Audio/Video

PC

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

Digital
Video
SLIDE 5

INTRODUCTION
Characteristics of 60 GHz band
Available bandwidth is large
- High data rate applications

Strong attenuation (e.g. by walls)


- Frequency reuse
- Antenna gain should be sufficiently large

Wavelength about 5 mm
- Phased array antenna possible to improve link
budget
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 6

PROBLEM STATEMENT
Design of small active antenna package
with integrated phased-array antenna and
60 GHz CMOS chip
Good antenna performance
- Bandwidth
- Gain

Low interconnect loss between chip and


antenna elements

Shielding of chip and interconnect


IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 7

LTCC ANTENNA PACKAGE (1)


Cross-section
Stripline fed
waveguide
antenna

Antenna

Ground

package

Solder ball

Microstrip to
stripline
transition

60 GHz
CMOS chip

Printed-Circuit Board
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 8

LTCC ANTENNA PACKAGE (2)


Top view for transmit module
Size: 9.5 mm x 9.5 mm
DC circuit
Array of 4
waveguide
antenna
elements

60 GHz
CMOS
chip

Base band
(2 GHz)

DC circuit
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 9

LTCC ANTENNA PACKAGE (3)


Pictures of transmit module
Microstrip feed lines

Open waveguide antennas

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 10

PROBLEM STATEMENT
Design of small active antenna package
with integrated phased-array antenna and
60 GHz CMOS chip
Good antenna performance
- Bandwidth
- Gain
Low interconnect loss between chip and
antenna elements

Shielding of chip and interconnect


IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 11

OPTIMIZED ANTENNA SUBSTRATE


Material: Ferro A6-M
Low dielectric loss: tand@60 GHz<0.002
Dielectric constant: er@60GHz=5.7-6.1

Open waveguide antenna


No surface wave loss
Z
Antenna

X
386 m

GND 2

96.5 m

Stripline
GND 1

193 m
96.5 m

Microstrip

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 12

OPEN WAVEGUIDE ANTENNA


SINGLE ELEMENT

1.4 mm

3.4 mm

Waveguide
aperture
Y

Inductive
posts
Microstrip
feed of open
waveguide
antenna
X
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 13

SETUP FOR WAFER PROBED


ANTENNA MEASUREMENTS IN V-BAND

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 14

OPEN WAVEGUIDE ANTENNA


SINGLE ELEMENT

Antenna matching
Coplanar contact pad deembedded from
measurement

(Ansoft/HFSS simulation)
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 15

OPEN WAVEGUIDE ANTENNA


SINGLE ELEMENT

Radiation pattern at 61 GHz (E-plane = XZ)


Ripple due to diffraction at edges of small test sample
(9.8 mm x 9.8 mm)

(Ansoft/HFSS simulation)
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 16

OPEN WAVEGUIDE ANTENNA


SINGLE ELEMENT

Radiation pattern at 61 GHz (H-plane = YZ)


Ripple due to diffraction at edges of small test sample
(9.8 mm x 9.8 mm)

(Ansoft/HFSS simulation)
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 17

OPEN WAVEGUIDE ANTENNA ARRAY


4 ANTENNAS FED IN-PHASE

9.8 mm
1.84 mm

1.92 mm

9.8 mm
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 18

OPEN WAVEGUIDE ANTENNA ARRAY


4 ANTENNAS FED IN-PHASE

Antenna matching
Coplanar contact pad deembedded from
measurement

(Ansoft/HFSS simulation)
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 19

OPEN WAVEGUIDE ANTENNA ARRAY


4 ANTENNAS FED IN-PHASE

Radiation pattern at 63 GHz (E-plane = YZ)


Ripple due to diffraction at edges of small test sample
(9.8 mm x 9.8 mm)

(Ansoft/HFSS simulation)
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 20

OPEN WAVEGUIDE ANTENNA ARRAY


4 ANTENNAS FED IN-PHASE

Radiation pattern at 63 GHz (H-plane = XZ)


Ripple due to diffraction at edges of small test sample
(9.8 mm x 9.8 mm)

(Ansoft/HFSS simulation)
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 21

PROBLEM STATEMENT
Design of small active antenna package
with integrated phased-array antenna and
60 GHz CMOS chip
Good antenna performance
- Bandwidth
- Gain
Low interconnect loss between chip and
antenna elements

Shielding of chip and interconnect


IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 22

INTERCONNECT LOSS
BETWEEN CHIP AND ANTENNA

Picture of test sample


TRL structures for microstrip and stripline

136 m wide
microstrip
lines

80 m wide
striplines

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 23

INTERCONNECT LOSS
BETWEEN CHIP AND ANTENNA

136 m wide microstrip lines (Zc50 Ohm)


Extracted line loss: 0.08-0.12 dB/mm

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 24

PROBLEM STATEMENT
Design of small active antenna package
with integrated phased-array antenna and
60 GHz CMOS chip
Good antenna performance
- Bandwidth
- Gain
Low interconnect loss between chip and
antenna elements

Shielding of chip and interconnect


IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 25

SHIELDING OF CHIP AND


INTERCONNECT FROM RADIATION
Electrical field intensity (dB) in E-plane
Z

Maximum

Radiated
field

-20 dB
-40 dB
-60 dB

Minimum
microstrip
feed

Low field
intensity at
backside of
antenna
(except at feed)
(Ansoft/HFSS simulation)

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 26

SHIELDING OF CHIP AND


INTERCONNECT FROM RADIATION
Electrical field intensity (dB) in H-plane
Maximum

-20 dB

Radiated
field

-40 dB
X
-60 dB
Minimum

Low field
intensity at
backside of
antenna
(except at feed)
(Ansoft/HFSS simulation)

IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 27

CONCLUSION
An active phased array antenna is
realized in a 9.5 x 9.5 x 0.8 mm3 LTCC
package
The antenna package has
good antenna performance

low interconnect loss between chip and


antenna
excellent shielding of chip and interconnect
IMEC 2011 / 25 October 2011 Ansys Conf. La Hulpe, W. De Raedt - S. Brebels

SLIDE 28