2015-12-15

Silicon NPN Phototransistor in MIDLED package

Version 1.3

SFH 3600

Features:

Spectral range of sensitivity: (typ) 500 ... 1100 nm

Package: MIDLED, Silicone, colourless, clear

Special: Toplooker

Narrow angle ( 20)

Low profile component (1,6 mm)

Emitter in same package (SFH 46xx) available

The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
Applications

Interrupters, light curtains

Sensors (consumer and industrial applications)

Automotive applications

Proximity sensor
Ordering Information
Type:

Photocurrent

Ordering Code

IPCE [A]
= 950 nm, Ee = 0.1 mW/cm2,
VCE = 5 V
SFH 3600

100 ... 500

Q65110A1573

SFH 3600-2/3

100 ... 320

Q65110A2665

SFH 3600-3/4

160 ... 500

Q65110A2666

Note:

Only one bin within one packing unit (variation less than 2:1)

2015-12-15

Version 1.3

SFH 3600

Maximum Ratings (TA = 25 C)

Parameter

Symbol

Values

Operating and storage temperature range

Top; Tstg

-40 ... 100

Collector-emitter voltage

VCE

35

Collector current

IC

15

mA

Collector surge current

( < 10 s)

ICS

75

mA

Emitter-collector voltage

VEC

Total Power dissipation

Ptot

130

mW

ESD withstand voltage

(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)

VESD

2000

Thermal resistance junction - ambient 1) page 12

RthJA

340

K/W

RthJS

180

K/W

Thermal restistance junction

2) page 12

Unit

Characteristics (TA = 25 C)
Parameter

Symbol

Values

Unit

990

nm

Wavelength of max. sensitivity

(typ)

S max

Spectral range of sensitivity

(typ)

10%

Radiant sensitive area

(typ)

0.04

mm2

Dimensions of chip area

(typ)

LxW

(typ) 0.35 x
0.35

mm x
mm

Half angle

(typ)

20

Capacitance
(VCE = 5 V, f = 1 MHz, E = 0)

(typ)

CCE

1.3

pF

Dark current
(VCE = 20 V, E = 0)

(typ (max)) ICE0

1 ( 50)

nA

2015-12-15

(typ) 500
... 1100

nm

Version 1.3

SFH 3600

Grouping (TA = 25 C, = 950 nm)

Group

Min Photocurrent

Max Photocurrent Rise and fall time

Collector-emitter
saturation
voltage

Ee = 0.1 mW/cm2,
VCE = 5 V

Ee = 0.1 mW/cm2,
VCE = 5 V

IC = 1 mA, VCC = 5
V, RL = 1 k

IC = IPCEmin x 0.3, Ee
= 0.1 mW/cm2

IPCE, min [A]

IPCE, max [A]

tr, tf [s]

VCEsat [mV]

-2

100

200

30

150

-3

160

320

45

150

-4

250

500

70

150

Note.:

IPCEmin is the min. photocurrent of the specified group.

Relative Spectral Sensitivity 3) page 12

Srel = f(), axial direction
100
Srel %

Photocurrent 3) page 12
IPCE / IPCE(25C) = f(TA), VCE = 5 V

OHF02405

PCE

OHF01524

1.6

PCE 25
1.4

80
1.2

70
60

1.0

50

0.8

40

0.6

30
0.4

20
0.2

10
0
400 500 600 700 800 900

0
-25

nm 1100

2015-12-15

25

50

75 C 100
TA

Version 1.3

SFH 3600

Dark Current 3) page 12

ICEO = f(VCE), E = 0

IR

Dark Current 3) page 12

ICEO = f(TA), VCE = 20 V, E = 0
OHF02420

101
nA

OHF00380

10 3
nA

CEO

10 2

100

10 1

10-1
10 0

10-2

10

15

20

10 -1

25 V 30

VR
Collector-Emitter Capacitance 3) page 12
CCE = f(VCE), f = 1 MHz, E = 0

C CE

OHF00592

3.0
pF
2.5

2.0

1.5

1.0

0.5

0 -2
10

10-1

10 0

101

V 10 2

VCE

2015-12-15

20

40

60

80 C 100
TA

Version 1.3

SFH 3600

Directional Characteristics 3) page 12

Srel = f()
40
30
20

10

OHF02432

1.0

50
0.8
60

0.6

70

0.4

80

0.2
0

90

100

1.0

0.8

0.6

0.4

Package Outline

Dimensions in mm.

2015-12-15

20

40

60

80

100

120

Version 1.3

SFH 3600

Pinning
Pin

Description

collector

emitter

Package
MIDLED, Silicone, colourless, clear
Approximate Weight:
23.0 mg
Recommended Solder Pad

Dimensions in mm.

2015-12-15

Version 1.3

SFH 3600

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
OHA04525

300
C

T 250

Tp 245 C

240 C

tP

217 C
200

tL

150

tS

100

50
25 C
0

50

100

150

200

s 300

250

t
OHA04612

Profile Feature
Profil-Charakteristik

Symbol
Symbol

Pb-Free (SnAgCu) Assembly

Minimum

Ramp-up rate to preheat*)

25 C to 150 C
Time tS
TSmin to TSmax

tS

60

Ramp-up rate to peak*)

TSmax to TP

Recommendation

Maximum

100

120

Unit
Einheit
K/s
s
K/s

Liquidus temperature

TL

217

Time above liquidus temperature

tL

80

100

Peak temperature

TP

245

260

Time within 5 C of the specified peak

temperature TP - 5 K

tP

20

30

K/s

10

Ramp-down rate*
TP to 100 C

480

Time
25 C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

2015-12-15

Version 1.3

SFH 3600

Taping

Dimensions in mm (inch).
Note:
Pad 1 = Collector

Tape and Reel

8 mm tape with 2000 pcs. on 180 mm reel
W1
D0

P0

A
N

F
W

13.0 0.25

P2

Label

P1
Direction of unreeling

Direction of unreeling

W2

Leader: min. 400 mm *

Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324

2015-12-15

Version 1.3

SFH 3600

Tape dimensions [mm]

Tape dim ensions in m m

P0

P1

P2

D0

8 + 0.3 / -0.1

4 0.1

2 0.05
or
4 0.1

2 0.05

1.5 0.1

1.75 0.1

3.5 0.05

Reel dimensions [mm]

Reel dim ensions in m m

Nmin

W1

W2max

180

60

8.4 + 2

14.4

Barcode-Product-Label (BPL)
OSRAM Opto

EX
A

RoHS Compliant

(6P) BATCH NO: 1234567890

(1T) LOT NO: 1234567890

BIN1: XX-XX-X-XXX-X

LX XXXX

Semiconductors

MP

ML Temp ST
X XXX C X

(9D) D/C: 1234

Pack: RXX

LE

DEMY

XXX

X_X123_1234.1234 X

(X) PROD NO: 123456789(Q)QTY:

9999

(G) GROUP:

XX-XX-X-X

OHA04563

Dry Packing Process and Materials

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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot

WET

If wet,
examine units, if necessary
bake units

15%

If wet,
examine units, if necessary
bake units

10%
5%

If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835

AM
OSR

Desiccant

OHA00539

Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.

2015-12-15

Version 1.3

SFH 3600

Transportation Packing and Materials

Barcode label

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Packing
Sealing label

Dimensions of transportation box in mm

Width

Length

Height

200 5

195 5

30 5

2015-12-15

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OHA02044

Version 1.3

SFH 3600

Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.

2015-12-15

11

Version 1.3

SFH 3600

Glossary
1)

Thermal resistance: when mounted on PC-board (FR4), padsize 16 mm each

2)

Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)

3)

Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.

2015-12-15

12

Version 1.3

SFH 3600

Published by OSRAM Opto Semiconductors GmbH

Leibnizstrae 4, D-93055 Regensburg
www.osram-os.com All Rights Reserved.

2015-12-15

13