Beruflich Dokumente
Kultur Dokumente
SC34063A, SC33063A,
NCV33063A
1.5 A, Step-Up/Down/
Inverting Switching
Regulators
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MARKING
DIAGRAMS
8
8
1
SOIC8
D SUFFIX
CASE 751
3x063
ALYWA
G
1
8
3x063V
ALYWA
G
Features
1
8
3x063AP1
AWL
YYWWG
PDIP8
P, P1 SUFFIX
CASE 626
1
8
33063AVP
AWL
YYWWG
1
1
Drive 8
Collector
Ipk
Sense
Q2
S Q
Q1
Switch
Collector
100
Switch
Emitter
DFN8
CASE 488AF
Ipk
Oscillator CT
6
VCC
3
Comparator
+
-
1
Timing
Capacitor
1.25 V
Reference
Regulator
Comparator 5
Inverting
Input
33063
ALYWA
G
x
A
L, WL
Y, YY
W, WW
G or G
4
GND
(Bottom View)
= 3 or 4
= Assembly Location
= Wafer Lot
= Year
= Work Week
= PbFree Package
Driver
Collector
Switch
Emitter
Ipk Sense
Timing
Capacitor
VCC
GND
Comparator
Inverting
Input
Switch
Collector
Switch Collector
Switch Emitter
Timing Capacitor
EP Flag
GND
(Top View)
(Top View)
Driver Collector
Ipk Sense
VCC
Comparator
Inverting Input
Symbol
Value
Unit
VCC
40
Vdc
VIR
0.3 to + 40
Vdc
VC(switch)
40
Vdc
VE(switch)
40
Vdc
VCE(switch)
40
Vdc
VC(driver)
40
Vdc
IC(driver)
100
mA
ISW
1.5
PD
1.25
RqJA
115
C/W
PD
625
mW
RqJA
160
C/W
Switch Current
Power Dissipation and Thermal Characteristics
Plastic Package, P, P1 Suffix
TA = 25C
Thermal Resistance
SOIC Package, D Suffix
TA = 25C
Thermal Resistance
DFN Package
TA = 25C
PD
1.25
mW
RqJA
80
C/W
TJ
+150
TA
Thermal Resistance
MC34063A, SC34063A
C
0 to +70
MC33063AV, NCV33063A
40 to +125
MC33063A, SC33063A
40 to + 85
Tstg
65 to +150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum package power dissipation limits must be observed.
2. This device series contains ESD protection and exceeds the following tests: Human Body Model 4000 V per MILSTD883, Method 3015.
Machine Model Method 400 V.
3. NCV prefix is for automotive and other applications requiring site and change control.
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2
Symbol
Min
Typ
Max
Unit
fosc
24
33
42
kHz
OSCILLATOR
Frequency (VPin 5 = 0 V, CT = 1.0 nF, TA = 25C)
Charge Current (VCC = 5.0 V to 40 V, TA = 25C)
Ichg
24
35
42
mA
Idischg
140
220
260
mA
Idischg/Ichg
5.2
6.5
7.5
Vipk(sense)
250
300
350
mV
VCE(sat)
1.0
1.3
VCE(sat)
0.45
0.7
hFE
50
75
IC(off)
0.01
100
mA
1.225
1.21
1.25
1.275
1.29
1.4
1.4
5.0
6.0
IIB
20
400
nA
ICC
4.0
mA
Vth
Regline
mV
TOTAL DEVICE
Supply Current (VCC = 5.0 V to 40 V, CT = 1.0 nF, Pin 7 = VCC,
VPin 5 > Vth, Pin 2 = GND, remaining pins open)
4. Tlow = 0C for MC34063, SC34063; 40C for MC33063, SC33063, MC33063V, NCV33063
Thigh = +70C for MC34063, SC34063; + 85C for MC33063, SC33063; +125C for MC33063V, NCV33063
5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible.
6. If the output switch is driven into hard saturation (nonDarlington configuration) at low switch currents ( 300 mA) and high driver currents
( 30 mA), it may take up to 2.0 ms for it to come out of saturation. This condition will shorten the off time at frequencies 30 kHz, and is
magnified at high temperatures. This condition does not occur with a Darlington configuration, since the output switch cannot saturate. If a
nonDarlington configuration is used, the following output drive condition is recommended:
IC output
w 10
Forced b of output switch :
IC driver 7.0 mA *
* The 100 W resistor in the emitter of the driver device requires about 7.0 mA before the output switch conducts.
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3
14
140
12
120
ON TIME (ms)
10
100
80
60
40
FREQUENCY (kHz)
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
20
200 mV/DIV
160
16
180
VCC = 5.0 V, Pin 7 = VCC
Pin 5 = GND, TA = 25C
VCC = 5.0 V
Pin 7 = VCC
Pin 2 = GND
Pins 1, 5, 8 = Open
CT = 1.0 nF
TA = 25C
0
5.0
10 ms/DIV
1.8
1.7
1.6
1.5
1.4
1.3
VCC = 5.0 V
Pins 1, 7, 8 = VCC
Pins 3, 5 = GND
TA = 25C
(See Note 7)
1.2
1.1
1.0
0
0.2
0.4
0.6
0.8
1.0
1.2
IE, EMITTER CURRENT (A)
1.4
1.1
1.0
0.9
0.7
0.6
0.4
0.3
0.2
0.2
0.4
0.6
0.8
1.0
1.2
IC, COLLECTOR CURRENT(A)
1.4
1.6
380
3.2
VCC = 5.0 V
Ichg = Idischg
Forced b = 20
0.1
0
1.6
400
320
300
280
260
240
220
200
-55
VCC = 5.0 V
Pin 7 = VCC
Pins 2, 3, 5 = GND
TA = 25C
(See Note 7)
0.5
360
340
Darlington Connection
0.8
2.8
2.4
2.0
1.6
1.2
CT = 1.0 nF
Pin 7 = VCC
Pin 2 = GND
0.8
0.4
0
-25
0
25
50
75
TA, AMBIENT TEMPERATURE (C)
100
125
5.0
10
15
20
25
30
VCC, SUPPLY VOLTAGE (V)
35
7. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible.
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4
40
8
180
S Q
Q2
Q1
2
1N5819
Ipk
Rsc
0.22
Vin
12 V
OSC
6
+
CT
3
CT
VCC
100
+
-
Comp.
1.25 V
Ref
Reg
1500
pF
4
1.0 mH
R2
R1
Vout
28 V/175 mA
47 k
2.2 k
Vout
+
330
CO
100
Optional Filter
Test
Conditions
Results
Line Regulation
30 mV = 0.05%
Load Regulation
Vin = 12 V, IO = 75 mA to 175 mA
10 mV = 0.017%
Output Ripple
Vin = 12 V, IO = 175 mA
400 mVpp
Efficiency
Vin = 12 V, IO = 175 mA
87.7%
Vin = 12 V, IO = 175 mA
40 mVpp
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5
Vout
Rsc
Vin
Vout
Rsc
Vin
R 0 for
constant Vin
Figure 10. External Current Boost Connections for IC Peak Greater than 1.5 A
9a. External NPN Switch
8. If the output switch is driven into hard saturation (nonDarlington configuration) at low switch currents ( 300 mA) and high driver currents
( 30 mA), it may take up to 2.0 ms to come out of saturation. This condition will shorten the off time at frequencies 30 kHz, and is magnified
at high temperatures. This condition does not occur with a Darlington configuration, since the output switch cannot saturate. If a
nonDarlington configuration is used, the following output drive condition is recommended.
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6
8
S Q
Q2
Q1
R
7
2
Ipk
Rsc
0.33
Vin
25 V
OSC
6
100
CT
1N5819
3
L
CT
VCC
+
-
1.25 V
Ref
Reg
Comp.
220 mH
470
pF
4
3.6 k
R1
1.0 mH
Vout
5.0 V/500 mA
R2
+
1.2 k
470
+
CO
Vout
100
Optional Filter
Test
Conditions
Results
Line Regulation
Vin = 15 V to 25 V, IO = 500 mA
12 mV = 0.12%
Load Regulation
Vin = 25 V, IO = 50 mA to 500 mA
3.0 mV = 0.03%
Output Ripple
Vin = 25 V, IO = 500 mA
120 mVpp
Vin = 25 V, RL = 0.1 W
1.1 A
Efficiency
Vin = 25 V, IO = 500 mA
83.7%
Vin = 25 V, IO = 500 mA
40 mVpp
Vout
Rsc
Vin
Rsc
Vin
Figure 12. External Current Boost Connections for IC Peak Greater than 1.5 A
11a. External NPN Switch
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7
8
S Q
Q2
Q1
2
Ipk
Rsc
0.24
OSC
6
Vin
4.5 V to 6.0 V
88 mH
CT
VCC
+
100
+
-
Comp.
1.25 V
Ref
Reg
1500
pF
1N5819
1.0 mH
R1
Vout
-12 V/100 mA
953
R2
1000 mf
8.2 k
Vout
CO
100
Optional Filter
Test
Conditions
Results
Line Regulation
3.0 mV = 0.012%
Load Regulation
0.022 V = 0.09%
Output Ripple
500 mVpp
910 mA
Efficiency
62.2%
70 mVpp
1
Vout
8
7
Vout
Vin
Vin
3 +
+
4
Figure 14. External Current Boost Connections for IC Peak Greater than 1.5 A
13a. External NPN Switch
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8
INDUCTOR DATA
Converter
Inductance (mH)
Turns/Wire
StepUp
170
StepDown
220
VoltageInverting
88
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9
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10
StepUp
ton/toff
V out ) V
V
in(min)
* V sat
in(min)
(ton + toff)
|V out| ) V
Ipk(switch)
2I
105
out(max)
4.0 x
t on
) 1
t
off
off
ton
) 1
t
off
ton
* V sat)
in(min)
I
pk(switch)
9
F
* V sat
t on ) t
off
ton
) 1
t
off
2I
0.3/Ipk(switch)
(V
in
1
f
t on ) t
1
f
off
ton
) 1
t
off
CT
CO
V out ) V
F
* V sat * V out
in(min)
t on ) t
ton
L(min)
VoltageInverting
1
f
toff
Rsc
* V
StepDown
on(max)
105
in(min)
I
I
I outt on
ripple(pp)
ton
2I
out(max)
0.3/Ipk(switch)
(V
* V sat * V out)
pk(switch)
(t
) t )
pk(switch) on
off
8V
ripple(pp)
on(max)
out(max)
t on
) 1
t
off
0.3/Ipk(switch)
(V
* V sat)
in(min)
I
pk(switch)
9
on(max)
I outt on
ripple(pp)
NOTE: For further information refer to Application Note AN920A/D and AN954/D.
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11
Shipping
SOIC8
98 Units / Rail
MC33063ADG
SOIC8
(PbFree)
98 Units / Rail
MC33063ADR2
SOIC8
MC33063ADR2G
SOIC8
(PbFree)
SC33063ADR2G
SOIC8
(PbFree)
PDIP8
50 Units / Rail
PDIP8
(PbFree)
50 Units / Rail
SOIC8
98 Units / Rail
MC33063AVDG
SOIC8
(PbFree)
98 Units / Rail
MC33063AVDR2
SOIC8
Device
MC33063AD
MC33063AP1
MC33063AP1G
MC33063AVD
MC33063AVDR2G
SOIC8
(PbFree)
NCV33063AVDR2*
SOIC8
NCV33063AVDR2G*
MC33063AVP
SOIC8
(PbFree)
PDIP8
50 Units / Rail
PDIP8
(PbFree)
50 Units / Rail
SOIC8
98 Units / Rail
MC34063ADG
SOIC8
(PbFree)
98 Units / Rail
MC34063ADR2
SOIC8
MC34063ADR2G
SOIC8
(PbFree)
SC34063ADR2G
SOIC8
(PbFree)
MC33063AVPG
MC34063AD
MC34063AP1
PDIP8
50 Units / Rail
MC34063AP1G
PDIP8
(PbFree)
50 Units / Rail
SC34063AP1G
PDIP8
(PbFree)
50 Units / Rail
MC33063MNTXG
DFN8
(PbFree)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
*NCV33063A: Tlow = 40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
change control.
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12
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
8
0.25 (0.010)
1
4
G
C
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
0.10 (0.004)
H
D
0.25 (0.010)
Z Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm
inches
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13
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
D1
E
8
E1
1
NOTE 5
c
E2
END VIEW
TOP VIEW
NOTE 3
e/2
L
A1
SEATING
PLANE
E3
e
8X
SIDE VIEW
b
0.010
C A
END VIEW
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14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSION E IS MEASURED WITH THE LEADS RESTRAINED PARALLEL AT WIDTH E2.
4. DIMENSION E1 DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
A1
b
C
D
D1
E
E1
E2
E3
e
L
INCHES
NOM
MAX
0.210
0.018 0.022
0.010 0.014
0.365 0.400
0.310 0.325
0.250 0.280
0.300 BSC
0.430
0.100 BSC
0.115 0.130 0.150
MIN
0.015
0.014
0.008
0.355
0.005
0.300
0.240
MILLIMETERS
MIN
NOM
MAX
5.33
0.38
0.35
0.46
0.56
0.20
0.25
0.36
9.02
9.27 10.02
0.13
7.62
7.87
8.26
6.10
6.35
7.11
7.62 BSC
10.92
2.54 BSC
2.92
3.30
3.81
PIN ONE
REFERENCE
2X
0.15 C
0.10 C
0.08 C
NOTE 4
DETAIL A
OPTIONAL
CONSTRUCTIONS
EXPOSED Cu
DETAIL B
(A3)
A1
A1
ALTERNATE
CONSTRUCTIONS
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.25
0.35
4.00 BSC
1.91
2.21
4.00 BSC
2.09
2.39
0.80 BSC
0.20
0.30
0.50
0.15
SOLDERING FOOTPRINT*
2.21
8X
SEATING
PLANE
A3
MOLD CMPD
DETAIL B
D2
TOP VIEW
SIDE VIEW
DETAIL A
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. DETAILS A AND B SHOW OPTIONAL
CONSTRUCTIONS FOR TERMINALS.
L1
0.15 C
2X
8X
8X
0.63
E2
8X
4.30 2.39
PACKAGE
OUTLINE
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
8X
0.80
PITCH
0.35
DIMENSIONS: MILLIMETERS
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15
MC34063A/D
Mouser Electronics
Authorized Distributor
ON Semiconductor:
NCV33063AVDR2G MC33063ADG MC33063ADR2G MC33063AP1G MC33063AVDG MC33063AVDR2G
MC34063ADG MC34063ADR2G MC34063AP1G SC33063ADR2G MC33063DFBSTGEVB MC34063SMDBKGEVB
MC34063LBBGEVB