Beruflich Dokumente
Kultur Dokumente
9.0
Unit objectives
After completing this unit, you should be able to:
Summarize the features of the IBM Flex System Enterprise Chassis
Identify the major elements of the IBM Flex System Enterprise Chassis
Explain the power features of the IBM Flex System Enterprise Chassis
Explain the cooling features of the IBM Flex System Enterprise Chassis
Explain the management features of the IBM Flex System Enterprise
Chassis
Power supplies
Fan modules
Fan logic module
Front information panel
Cooling
At a glance
Support for technology
advancements
Energy efficiency
System specifications
10U in size
14 horizontal, half-width bays
Support for x86 and Power Systems compute nodes
IBM Flex System Manager Node
Includes Chassis Management Module
Up to six 2500 W or 2100 W power supplies
Up to four I/O modules
Two 40 mm fan modules
Up to eight 80 mm fan modules
Two fan logic modules
Product overview (1 of 3)
IBM Flex System Enterprise
Chassis
10U server platform
Front access components
Seven (full-width) horizontally
oriented bays
Height of each bay is 57 mm
Each chassis bay supports
either:
> Two half-width nodes
> One full-width node
Product overview (2 of 3)
Rear access components
Four vertically oriented, I/O
module bays
Two Chassis Management
Module bays
Two fan logic modules
Two 40 mm fan module bays
Eight 80 mm fan module bays
Six power supply bays
Product overview (3 of 3)
IBM Flex System Enterprise Chassis major components include
Chassis Management Modules
IBM Flex System Manager Node
Compute nodes
Storage nodes
Expansion nodes
I/O modules
Power supply modules
Fan distribution cards
Fan modules
Fan logic modules
Front and rear LED panel
8721-LRx
Description
80 mm fan module
40 mm fan module
Front view
447 mm
800 mm
10U
(440 mm)
Chassis
bays
containing
half-width
node
Chassis
bays
containing
full-width
node
Front
information
panel
Copyright IBM Corporation 2012, 2013
Rear view
Two 40 mm
fan bays
Eight
80 mm fan
bays
Two Chassis
Management
Module bays
Six power
supply bays
Four I/O
module bays
Copyright IBM Corporation 2012, 2013
Management
connectors
I/O adapter
connectors
Copyright IBM Corporation 2012, 2013
Chassis
Management
Module
connectors
Power supply
connectors
Personality card
connector
Bay 14
Bay 11
Bay 12
Bay 9
Bay 10
Bay 7
Bay 8
Bay 5
Bay 6
Bay 3
Bay 4
Bay 1
Bay 2
Bay 14
Bay 11
Bay 12
Bay 9
Bay 10
Bay 7
Bay 5
Bay 6
Bay 3
Bay 1
Bay 2
Bay 14
Bay 11
Bay 12
Bay 7
Bay 5
Bay 6
Bay 3
Bay 1
Bay 2
Air
filter
Copyright IBM Corporation 2012, 2013
Component
Hot plug
Hot swap
Node
Yes
Noa
I/O module
Yes
Yesb
40 mm fan pack
Yes
Yes
80 mm fan pack
Yes
Yes
Power supply
Yes
Yes
Yes
Yes
Power supplies
Fan modules
Fan logic module
Front information panel
Cooling
Power supply
bay 6
Power supply
bay 3
Power supply
bay 5
Power supply
bay 2
Power supply
bay 4
Power supply
bay 1
Power policies
Five power management
policies can be applied.
AC power source redundancy
AC power source redundancy
with compute node throttling
allowed
Power module redundancy
Power module redundancy with
compute node throttling allowed
Basic power management
Power supply
LEDs (left to right)
AC power
DC power
Fault
Removal
latch
Pull handle
x220 TDP
processor
rating
N+1, N=5
6 power
supplies
N+1, N=4
5 power
supplies
N+1, N=3
4 power
supplies
N+N, N=3
6 power
supplies
N+1, N=5
6 power
supplies
N+1, N=4
5 power
supplies
N+1, N=3
4 power
supplies
N+N, N=3
6 power
supplies
50W
14
14
14
14
14
14
14
14
60W
14
14
14
14
14
14
14
14
70W
14
14
14
14
14
14
14
14
80W
14
14
14
14
14
14
14
14
95W
14
14
14
14
14
14
14
14
50W
14
14
13
14
14
14
14
14
60W
14
14
12
13
14
14
14
14
70W
14
14
11
12
14
14
14
14
80W
14
14
10
11
14
14
13
14
95W
14
13
10
14
14
12
13
x222 TDP
processor
rating
x240 TDP
processor
rating
N+1, N=5
6 power
supplies
N+1, N=4
5 power
supplies
N+1, N=3
4 power
supplies
N+N, N=3
6 power
supplies
N+1, N=5
6 power
supplies
N+1, N=4
5 power
supplies
N+1, N=3
4 power
supplies
N+N, N=3
6 power
supplies
60 W
14
14
14
14
14
14
14
14
70 W
14
14
13
14
14
14
14
14
80 W
14
14
13
13
14
14
14
14
95 W
14
14
12
12
14
14
14
14
115 W
14
14
11
12
14
14
14
14
130 W
14
14
11
11
14
14
13
14
135 W
14
14
10
11
14
14
13
14
95 W
115 W
130 W
x440 TDP
processor
rating
N+1, N=5
6 power
supplies
N+1, N=4
5 power
supplies
N+1, N=3
4 power
supplies
N+N, N=3
6 power
supplies
N+1, N=5
6 power
supplies
N+1, N=4
5 power
supplies
N+1, N=3
4 power
supplies
N+N, N=3
6 power
supplies
14
12
10
14
14
12
13
14
12
10
14
14
12
13
14
12
14
14
12
12
FSM
V7000
Power supplies
Fan modules
Fan logic modules
Front information panel
Cooling
Fan module
bay 9
Fan module
bay 4
Fan module
bay 8
Fan module
bay 3
Fan module
bay 7
Fan module
bay 2
Fan module
bay 6
Fan module
bay 1
Copyright IBM Corporation 2012, 2013
40 mm fan module
The 40 mm fan modules are
located at the top of the
chassis.
I/O modules
Removal latch
Chassis Management Modules
Pull handle
80 mm fan module
Location of 80 mm fan modules
Removal latch
Pull handle
Fan logic
module bay 2
Fan logic
module bay 1
Node bays
Cooling zone
Copyright IBM Corporation 2012, 2013
Cooling zone
Node bays
Cooling zone
Copyright IBM Corporation 2012, 2013
Cooling zone
Node bays
Cooling zone
Copyright IBM Corporation 2012, 2013
Cooling zone
Power supplies
Fan modules
Fan logic modules
Front information panel
Cooling
Power supplies
Fan modules
Fan logic modules
Front information panel
Cooling
Lower
cooling
apertures
Copyright IBM Corporation 2012, 2013
Installed
compute nodes
Cool
airflow in
Cool
airflow in
Warm
airflow out
Midplane
Copyright IBM Corporation 2012, 2013
Installed
compute nodes
Installed
compute nodes
Cool
airflow in
I/O
modules
Air flow
Chassis
Management
Modules
Copyright IBM Corporation 2012, 2013
Power supplies
Fan modules
Fan logic modules
Front information panel
Cooling
I/O module
bay 4
I/O module
bay 3
Copyright IBM Corporation 2012, 2013
I/O module
bay 2
Fabric
connector
I/O adapters
Management
connector
I/O adapters
Node
bay 1
I/O module 1
LOM
with LOM
I/O module 3
LOM
I/O module 2
I/O module 4
Node
Node
bay14
14
Bay
14 internal groups (of
four lanes each), one
to each node
Copyright IBM Corporation 2012, 2013
.. I/O module 1
.
A2
Node
A1
2
.. I/O module 2
.
A2
Node
A1
3
.. I/O module 3
.
A2
.. I/O module 4
.
A2
Copyright IBM Corporation 2012, 2013
Midplane
connector
PCIe
connector
P1
P2
LOM connector
LOM
P1
P2
P1
2-Port
I/O adapter
in slot 1
x1 Ports
P2
x1 Ports
Half-width
node
P1
P3
P5
P7
P2
P4
P6
P8
P1
P3
I/O adapter
in slot 2
P5
P7
P2
P4
4
P6
P8
I/O modules
Copyright IBM Corporation 2012, 2013
Identify
OK
Identify
Switch
error
Power supplies
Fan modules
Fan logic modules
Front information panel
Cooling
Chassis
Management
Module bay 1
Power control
Fan management
Chassis and compute node
initialization
Switch management
Diagnostics
Resource discovery and
inventory management
Resource alerts and monitoring
management
Chassis and compute node
power management
Network management
For connection to a
management network. The CMM
can be managed through this
Ethernet port.
Management
network
CMM capabilities
Chassis
status
Remote
control
Firmware
updates
Server &
chassis
tasks
Manage
chassis
events
CMM
Chassis
service
data
Copyright IBM Corporation 2012, 2013
Chassis
VPD
info
Chassis
problem
areas
Glossary
IBM Flex System Enterprise
Chassis
Half-width node
Full-width node
Chassis Management Module
IBM Flex System Manager Node
Midplane
Checkpoint
1. The IBM Flex System Enterprise Chassis supports which of the
following combinations of compute nodes?
a.
b.
c.
d.
Two
Three
Four
Six
Two
Four
Six
Eight
Checkpoint solutions
1.
The IBM Flex System Enterprise Chassis supports which of the following
combinations of compute nodes?
a.
b.
c.
d.
Two
Three
Four
Six
Two
Four
Six
Eight
Unit summary
Having completed this unit, you should be able to:
Summarize the features of the IBM Flex System Enterprise Chassis
Identify the major elements of the IBM Flex System Enterprise Chassis
Explain the power features of the IBM Flex System Enterprise Chassis
Explain the cooling features of the IBM Flex System Enterprise Chassis
Explain the management features of the IBM Flex System Enterprise
Chassis