XDM-500 IMM ETSI B02 8.3 en

XDM-500
Version 8.3
Installation and Maintenance Manual

417006-2304-0H3-B02
XDM-500 (ETSI) Installation and Maintenance Manual

V8.3
Catalog No: X39171
November 2011
1st Edition
Copyright by ECI, 2004-2011. All rights reserved worldwide.

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Contents
About This Manual ................................................................... xv
Overview ............................................................................................................ xv
Intended Audience ............................................................................................. xv
Document Organization ..................................................................................... xvi
Document Conventions ..................................................................................... xvi
Related Documentation .................................................................................... xvii
Obtaining Technical Documentation ................................................................xviii
Technical Assistance........................................................................................xviii
Installing XDM-500: Before You Start Safety Guidelines ..... 1-1

Overview .......................................................................................................... 1-1
Warning Definition ............................................................................................ 1-2
Qualified Personnel Warning ............................................................................ 1-3
Installation Warning .......................................................................................... 1-4
General Safety Requirements .......................................................................... 1-5
Jewelry Removal Warning ................................................................................ 1-6
Grounding Requirements ................................................................................. 1-7
Power Supply Requirements .......................................................................... 1-11
TUV Statutory Warnings and Requirements .................................................. 1-17
ITU-T/Telcordia Statutory Warnings and Requirements ................................ 1-19
Laser Safety Requirements ............................................................................ 1-21
Protection Against Electrostatic Discharge .................................................... 1-26
Environmental and Health Concerns .............................................................. 1-31
Introduction to the XDM Platform .......................................... 2-1

Overview .......................................................................................................... 2-1
XDM Product Lines .......................................................................................... 2-2
Features and Functions.................................................................................... 2-3
Implementation Principles ................................................................................ 2-4
Cards and Modules .......................................................................................... 2-5
XDM-500 .......................................................................................................... 2-7
XDM-500 Installation Overview .............................................. 3-1

Overview .......................................................................................................... 3-1
Preliminary Preparations .................................................................................. 3-2
Stages of a Typical Installation ......................................................................... 3-3
Outline of Installation Procedure ...................................................................... 3-5
417006-2304-0H3-B02
ECI Telecom Ltd. Proprietary
Contents
XDM-500 Installation and

Maintenance Manual
Site Preparation and Rack Installation .................................. 4-1

Overview .......................................................................................................... 4-1
Tools and Test Equipment ............................................................................... 4-8
Unpacking and Visual Inspection ..................................................................... 4-9
XDM Rack Installation Options ....................................................................... 4-10
Cable and Fiber Preparation .......................................................................... 4-23
Installing Equipment Racks ............................................................................ 4-37
Installing Ancillary Units in Racks ................................................................... 4-44
XDM-500 Platform Installation ................................................ 5-1

Overview .......................................................................................................... 5-1
Assembling the XDM Platform in a Rack ......................................................... 5-2
Installing Air Filters ........................................................................................... 5-6
Connecting Power and Rack Alarm Cables to the Platforms ......................... 5-10
Card and Module Installation ................................................. 6-1

Overview .......................................................................................................... 6-1
Card Installation Precautions ........................................................................... 6-3
XDM-500 Slot Utilization .................................................................................. 6-4
Installation Data for XDM-500 I/O Cards and Associated Modules .................. 6-6
Using Electrical Interface Protection Modules .................................................. 6-9
Preparing Cards and Modules for Installation ................................................ 6-10
Installing CMBR40 and TRP40_2 Cards for Different Configuration Options 6-69
Installing xMCP Cards .................................................................................... 6-73
Installing xMCP-B/B2G Cards ........................................................................ 6-75
Installing MECP Cards ................................................................................... 6-78
Installing Aurora-G Cards ............................................................................... 6-79
Installing I/O Cards and Modules ................................................................... 6-90
Installing a Card in the CCP Cage ................................................................. 6-92
Optical Fiber and Cable Installation and Routing................. 7-1

Connecting Cables ........................................................................................... 7-1
Commissioning Tests ............................................................. 8-1

Overview .......................................................................................................... 8-1
Tools and Equipment ....................................................................................... 8-2
Prerequisites .................................................................................................... 8-3
Site Commissioning Tests ................................................................................ 8-5
Network Commissioning ................................................................................. 8-10
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Maintenance Manual
Contents
Maintenance ............................................................................. 9-1

Overview .......................................................................................................... 9-1
Required Test Equipment, Tools, and Materials .............................................. 9-2
Preventive Maintenance ................................................................................... 9-2
Troubleshooting.............................................................................................. 9-11
Replacing a Network Element ........................................................................ 9-40
Replacing Cards, Modules, Fans, and Other Components ............................ 9-43
XDM Accessories ................................................................... A-1
Typical Installation Setup ................................................................................. A-2

Rack Alarm Panel Power and Alarm Connection Options ............................... A-4
Rap Features.................................................................................................... A-5
xRAP-D ............................................................................................................ A-7
xRAP-B........................................................................................................... A-13
xRAP-HP ........................................................................................................ A-16
xRAP-100 ....................................................................................................... A-19
miniRAP ......................................................................................................... A-22
FST................................................................................................................. A-25
Heat Buffer ..................................................................................................... A-26
Cable and Fiber Guiding Accessories ............................................................ A-26
Optical Distribution Frames (ODFs) ............................................................... A-29
Digital Distribution Frames (DDF) .................................................................. A-33
Connector Pin Assignments ................................................. B-1
Overview .......................................................................................................... B-1

Platform Connectors......................................................................................... B-2
xECB Connectors ............................................................................................. B-5
MECP Connectors.......................................................................................... B-10
ACP Connectors............................................................................................. B-11
M2_84 Interface Module Connection Data ..................................................... B-12
Alarms Handling Principles ............................................................................ B-19
xRAP-D Connectors ....................................................................................... B-21
xRAP-HP Connectors..................................................................................... B-28
xRAP-100 Connectors.................................................................................... B-34
miniRAP Connectors ...................................................................................... B-40
Upgrades and Expansions .................................................... C-1
Overview ..........................................................................................................C-1
16- to 32-Channel Mux/DeMux Expansion ....................................................... C-2
Upgrading and Expanding Optical Networks .................................................... C-3
Matrix and SDH Data Card Upgrades .............................................................. C-7
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Contents

Maintenance Manual
Integrating XDM Equipment in SYNCOM Networks ............ D-1

Overview ..........................................................................................................D-1
Network Implementation Considerations .......................................................... D-2
Network Timing Considerations ....................................................................... D-5
Network Management Considerations ............................................................. D-5
Recommended Integration Procedures ............................................................ D-8
Slot Designation Conversion Table .......................................E-1
Slot Designation Conversion Table .................................................................. E-1
Standards and References ..................................................... F-1
Overview .......................................................................................................... F-1

Broadband Forum ............................................................................................ F-1
Environmental Standards ................................................................................. F-2
ETSI: European Telecommunications Standards Institute ............................... F-2
IEC: International Electrotechnical Commission .............................................. F-3
IEEE: Institute of Electrical and Electronic Engineers ...................................... F-4
IETF: Internet Engineering Task Force ............................................................ F-5
ISO: International Organization for Standardization ......................................... F-7
ITU-T: International Telecommunication Union ................................................ F-7
MEF: Metro Ethernet Forum ........................................................................... F-12
NIST: National Institute of Standards and Technology .................................. F-12
North American Standards ............................................................................. F-13
OMG: Object Management Group ................................................................. F-14
TMF: TeleManagement Forum ....................................................................... F-14
Web Protocol Standards ................................................................................ F-14
Index .......................................................................................... I-1
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List of Figures
Figure 1-1: Optical rack grounding bar and rack frame grounding post ........................ 1-8
Figure 1-2: Grounding the optical rack to the site grounding bar................................... 1-9
Figure 1-3: XDM shelves warning labels ..................................................................... 1-17
Figure 1-4: Power input warning label ......................................................................... 1-17
Figure 1-5: Basic ESD warning symbol ....................................................................... 1-26
Figure 1-6: Typical temporary EPA arrangement ........................................................ 1-29
Figure 1-7: Pollution control logos ............................................................................... 1-32
Figure 1-8: WEEE recycling symbol ............................................................................ 1-33
Figure 2-1: XDM-500 platform........................................................................................ 2-7
Figure 2-2: XDM-500 slot allocation ............................................................................... 2-8
Figure 3-1: A typical XDM-1000 product line installation components .......................... 3-4
Figure 4-1: Deep vs. standard door ............................................................................... 4-3
Figure 4-2: Optical rack components ........................................................................... 4-13
Figure 4-3: Type A ETSI rack general view ................................................................. 4-15
Figure 4-4: Type A ETSI rack internal view ................................................................. 4-16
Figure 4-5: ETSI A rack closed view ............................................................................ 4-18
Figure 4-6: XDM-1000 and XDM-500 shelves in a 2600 mm rack .............................. 4-21
Figure 4-7: Two XDM-500 shelves in a 2200 mm rack ................................................ 4-22
Figure 4-8: Rack and platform grounding posts on the XDM-1000 ............................. 4-25
Figure 4-9: Short boot characteristics .......................................................................... 4-32
Figure 4-10: Mounting diagrams for ETSI racks .......................................................... 4-38
Figure 4-11: Mounting diagrams for 19 in. and 23 in. racks ........................................ 4-39
Figure 4-12: Rack mounting diagram for attachment to suspended overhead
tray (2200 mm rack) ..................................................................................................... 4-41
Figure 4-13: Optical rack grounding bar and rack frame grounding post .................... 4-42
Figure 4-14: Grounding the optical rack to the site grounding bar............................... 4-43
Figure 4-15: xRAP-D power supply flow ...................................................................... 4-46
Figure 4-16: xRAP-D power supply with bridge, two variations ................................... 4-47
Figure 4-17: Location of xRAP-D grounding stud ........................................................ 4-48
Figure 4-18: xRAP-D power supply flow ...................................................................... 4-49
Figure 4-19: Identification of xRAP-D cable routes ...................................................... 4-50
Figure 4-20: Connecting DC power cables .................................................................. 4-51
Figure 4-21: xRAP-D power supply with bridge, two variations ................................... 4-53
Figure 4-22: Identification of xRAP-D cable routes ...................................................... 4-54
Figure 4-24: Side screws highlighted on left side of xRAP-D unit ............................... 4-57
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List of Figures

Maintenance Manual
Figure 4-25: Replacement spacer screw ..................................................................... 4-57

Figure 4-26: Replacement spacer screws in place in xRAP-D unit ............................. 4-58
Figure 4-27: Protection cover for xRAP-D ................................................................... 4-58
Figure 4-28: xRAP-D protective covers in place .......................................................... 4-59
Figure 4-29: Bottom panel for xRAP-D ........................................................................ 4-59
Figure 4-30: xRAP-D connectors ................................................................................. 4-60
Figure 4-31: Installation of xRAP-D circuit breakers .................................................... 4-61
Figure 4-32: Location of xRAP-B grounding stud ........................................................ 4-65
Figure 4-33: Identification of xRAP-B cable routes ...................................................... 4-65
Figure 4-35: Side screw highlighted on left side of the xRAP-B .................................. 4-67
Figure 4-36: Replacement spacer screw ..................................................................... 4-67
Figure 4-37: Replacement spacer screw in place in the xRAP-B ................................ 4-68
Figure 4-38: Protective cover for xRAP-B .................................................................... 4-68
Figure 4-39: xRAP-B protective cover in place ............................................................ 4-69
Figure 4-40: Bottom panel for xRAP-B ........................................................................ 4-70
Figure 4-41: xRAP-B connectors ................................................................................. 4-70
Figure 4-42: Installation of xRAP-B circuit breakers .................................................... 4-71
Figure 4-43: xRAP-HP slide switches .......................................................................... 4-74
Figure 4-44: Location of xRAP-HP grounding stud ...................................................... 4-77
Figure 4-45: Identification of xRAP-HP cable routes ................................................... 4-78
Figure 4-46: Connecting DC power cables to the xRAP-HP ....................................... 4-78
Figure 4-47: xRAP-HP circuit breakers installation ...................................................... 4-80
Figure 4-48: DC input power connectors pin functions ................................................ 4-81
Figure 4-49: Location of xRAP-100 grounding stud ..................................................... 4-84
Figure 4-50: Identification of xRAP-100 cable routes .................................................. 4-85
Figure 4-51: Connecting DC power cables to the xRAP-100 ...................................... 4-86
Figure 4-52: xRAP-100 connector identification .......................................................... 4-87
Figure 4-53: xRAP-100 circuit breakers installation ..................................................... 4-88
Figure 4-54: Location of miniRAP grounding stud ....................................................... 4-92
Figure 4-55: Identification of miniRAP cable routes ..................................................... 4-92
Figure 4-56: Connecting DC power cables to the miniRAP ......................................... 4-93
Figure 4-57: miniRAP connectors ................................................................................ 4-94
Figure 4-58: Installing miniRAP circuit breakers .......................................................... 4-95
Figure 4-59: Threading optical fibers in the FST.......................................................... 4-97
Figure 4-60: Attaching rack mount brackets to the ODF ............................................. 4-98
Figure 4-61: ODF front panel ....................................................................................... 4-99
Figure 4-62: ODF open view ........................................................................................ 4-99
Figure 4-63: ODF fiber routes .................................................................................... 4-100
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Maintenance Manual
List of Figures
Figure 5-1: XDM shelf and rack grounding (NEBS-compliant) ...................................... 5-5
Figure 5-2: Air filter and installation kit ........................................................................... 5-7
Figure 5-3: Installing the air filter frame ......................................................................... 5-8
Figure 5-4: Installing the air filter in its frame ................................................................. 5-9
Figure 5-5: Grounding connections at typical site ........................................................ 5-10
Figure 5-6: Auxiliary connector panel .......................................................................... 5-12
Figure 6-1: XDM-500 slots identification ........................................................................ 6-4
Figure 6-2: Inserting an SFP into an optical module .................................................... 6-12
Figure 6-3: Installing extractable OM01_4 and OM04_1 optical modules in
SIO1&4 cards ............................................................................................................... 6-14
Figure 6-4: Installing extractable OMS01_4 and OMS04_1 optical modules
in SIO1&4 cards ........................................................................................................... 6-16
Figure 6-5: Installing an extractable optical OM16_1 module in SIO16 card .............. 6-18
Figure 6-6: Installing an extractable optical OM16_1SFP module in SIO16 card ....... 6-20
Figure 6-7: Installing an OMSC16_4 module on SIO164 ............................................ 6-22
Figure 6-8: Installing an optical module on SIO164 ..................................................... 6-24
Figure 6-9: Installing extractable optical modules in the XIO192................................. 6-26
Figure 6-10: Installing an optical module on XIO384F ................................................. 6-28
Figure 6-11: Identifying the installation positions on the SIO1&4B card ...................... 6-30
Figure 6-12: Identifying the installation positions on the SIO16_2B card .................... 6-31
Figure 6-13: Identifying the installation positions on the SIO16_4B card .................... 6-32
Figure 6-14: Identifying the installation positions on the SIO64B card ........................ 6-33
Figure 6-15: Identifying the installation positions on typical EIS cards ........................ 6-35
Figure 6-16: Identifying the installation positions on DIO cards................................... 6-37
Figure 6-17: Identifying the installation positions on typical DIOB cards ..................... 6-39
Figure 6-18: Identifying the installation positions on typical MCS5/MCS10 cards....... 6-41
Figure 6-19: Identifying installation positions on the MCS30_X10G ........................... 6-43
Figure 6-20: Installing an extractable module in a CMBR10_D card ........................... 6-45
Figure 6-21: Identifying optical transceiver plug-in installation positions in
CMBR10_D/DO cards .................................................................................................. 6-46
Figure 6-22: Installing an extractable module in a CMBR10_B/BO card ..................... 6-47
CMBR10_B/BO cards .................................................................................................. 6-48
Figure 6-24: Installing a typical extractable optical module in a CMBR25_2 card....... 6-49
Figure 6-25: Installing extractable modules in a CMTR25 card ................................... 6-51
Figure 6-26: Identifying the installation positions on the CMBR40 card ...................... 6-53
Figure 6-27: Installing plug-in modules in a TRP10_2B card ...................................... 6-54
Figure 6-28: Identifying the installation positions on a TRP10_4R card ...................... 6-55
Figure 6-29: Identifying the installation positions on a TRP10_4M card ..................... 6-56
Figure 6-30: Installing plug-in modules in a TRP10_LAN card .................................... 6-57
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List of Figures

Maintenance Manual
Figure 6-31: Identifying the optical transceiver plug-in (XFP) position in

the TRP10_LAN card ................................................................................................... 6-58
Figure 6-32: Installing a typical plug-in module in a TRP25_4 card ............................ 6-59
Figure 6-33: Installing modules into the AoC card ....................................................... 6-61
Figure 6-34: Installing an optical module in the AoC (upper half) ................................ 6-62
Figure 6-35: Identifying SFP installation positions on AoC (lower half) ....................... 6-63
Figure 6-36: AUX_2X card, location of optical plug-in modules .................................. 6-64
Figure 6-37: AUX_2X card, installing a typical optical plug-in module ........................ 6-65
Figure 6-38: Installing an OADM plug-in module in an OADM1&4 card ...................... 6-67
Figure 6-39: Installing a typical plug-in in an MO_CW2 module .................................. 6-68
Figure 6-40: TRP40_2/2B front view ............................................................................ 6-70
Figure 6-41: TRP40_2/2B front view ............................................................................ 6-71
Figure 6-42: CMBR40/40B front view .......................................................................... 6-72
Figure 6-43: NVM card installation ............................................................................... 6-74
Figure 6-44: Installation of an NVM on xMCP-B card .................................................. 6-76
Figure 6-45: NVM card installation ............................................................................... 6-77
Figure 6-46: Aurora-G card insertion ........................................................................... 6-81
Figure 6-47: Aurora-G connectors ............................................................................... 6-83
Figure 6-48: Aurora-G with cover plate in place .......................................................... 6-84
Figure 6-49: Aurora-G LED indicators ......................................................................... 6-85
Figure 6-50: Management port default gateway .......................................................... 6-88
Figure 6-51: Inserting cards with reset control ............................................................. 6-91
Figure 7-1: Removing side covers of a Type A ETSI rack ............................................. 7-3
Figure 7-2: Type A ETSI rack cable routing details ....................................................... 7-4
Figure 7-3: Cable routing details for regular rack........................................................... 7-5
Figure 7-4: MECP_OSC card optical connections ......................................................... 7-8
Figure 7-5: Opening OFA_R protective cover.............................................................. 7-12
Figure 7-6: OFA_R connectors .................................................................................... 7-13
Figure 7-7: ODF_HP view with open panel.................................................................. 7-15
Figure 7-8: Detailed view of fiber tray with lid removed ............................................... 7-15
Figure 7-9: Fastening the fiber harness to the exit of the fiber tray ............................. 7-16
Figure 7-10: Reaching the ATS card RJ-45 connectors .............................................. 7-21
Figure 7-11: Management workstation and protection components ............................ 7-23
Figure 7-12: Connecting management workstation to MECP on the GNE .................. 7-23
Figure 8-1: Input sensitivity test setup ......................................................................... 8-14
Figure 8-2: Test setup modified to support LOS and sensitivity tests.......................... 8-32
Figure 9-1: Removing the filter for cleaning/replacement .............................................. 9-8
Figure 9-2: Installation of xRAP-D circuit breakers ...................................................... 9-44
Figure 9-3: Replacing xRAP-HP circuit breakers ......................................................... 9-45
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List of Figures
Figure 9-4: Replacing xRAP-100 circuit breakers ........................................................ 9-46

Figure 9-5: Installing miniRAP circuit breakers ............................................................ 9-47
Figure 9-6: Replacing xINF/xINF-H unit ....................................................................... 9-49
Figure 9-7: Replacing an NVM on xMCP card ............................................................. 9-52
Figure 9-8: Replacing an NVM on xMCP-B card ......................................................... 9-54
Figure 9-9: Replacing NVM on ATS card..................................................................... 9-56
Figure 9-10: Typical MECP_OSC card optical connections ........................................ 9-57
Figure 9-11: Replacing typical optical transceivers ..................................................... 9-60
Figure A-1: Typical installation of a single XDM-500 shelf ............................................ A-3
Figure A-2: xRAP-D power supply flow.......................................................................... A-7
Figure A-3: xRAP-D front panel ................................................................................... A-10
Figure A-4: xRAP-D connectors ................................................................................... A-11
Figure A-5: Y-cable connection ................................................................................... A-12
Figure A-6: Double-Y cable connection ....................................................................... A-12
Figure A-7: xRAP-B front panel.................................................................................... A-14
Figure A-8: xRAP-B connectors ................................................................................... A-15
Figure A-9: xRAP-HP front panel ................................................................................. A-17
Figure A-10: xRAP-HP connector panel ...................................................................... A-18
Figure A-11: xRAP-HP connector and slide switch panel ............................................ A-18
Figure A-12: xRAP-100 front panel .............................................................................. A-20
Figure A-13: xRAP-100 connectors ............................................................................. A-21
Figure A-14: miniRAP front panel ................................................................................ A-23
Figure A-15: miniRAP connectors ................................................................................ A-24
Figure A-16: Fiber Storage Tray front view .................................................................. A-25
Figure A-17: Fiber Storage Tray top view .................................................................... A-25
Figure A-18: Heat buffer.............................................................................................. A-26
Figure A-19: Typical cable guide ................................................................................. A-26
Figure A-20: Fiber guide for 19-inch rack ................................................................... A-27
Figure A-21: Fiber guide for ETSI rack ........................................................................ A-27
Figure A-22: Typical cable guiding rod ....................................................................... A-28
Figure A-23: Using the rod for guiding fibers .............................................................. A-28
Figure A-24: Using the rod for guiding cables............................................................. A-29
Figure A-25: ODF internal view ................................................................................... A-30
Figure A-26: ODF front panel ...................................................................................... A-30
Figure A-27: ODF_HP general view ........................................................................... A-31
Figure A-28: ODF_HP view with open panel .............................................................. A-32
Figure A-29: Detailed view of fiber tray with lid removed ............................................ A-32
Figure A-30: Typical 84-channel DDF unit for balanced E1 interfaces
general view ................................................................................................................. A-33
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List of Figures

Maintenance Manual
Figure A-31: DDF general view with cover closed ...................................................... A-34
Figure A-32: DDF general view with cover open ........................................................ A-34
Figure A-33: Typical 84-channel patch panel for balanced E1 interfaces
general views ............................................................................................................... A-35
Figure B-1: 3-pin power connector ................................................................................. B-2
Figure B-2: 5-pin power connector ................................................................................. B-2
Figure B-3: ALARMS connector pin identification .......................................................... B-3
Figure B-4: RAP connector pin identification ................................................................. B-4
Figure B-5: F-CHANNEL connector pin identification .................................................... B-5
Figure B-6: T3_1/T4_1 and T3_2/T4_2 connector pin identification.............................. B-6
Figure B-7: OW connector pin identification .................................................................. B-7
Figure B-8: OHA connector pin identification ................................................................. B-8
Figure B-9: MECP ETHERNET connector pin identification........................................ B-10
Figure B-10: ACP900 connector pin identification ....................................................... B-11
Figure B-11: M2_84 14-tributary connector pin identification ...................................... B-12
Figure B-12: Alarm In principle circuit .......................................................................... B-19
Figure B-13: Alarm Out principle circuit ....................................................................... B-20
Figure B-14: xRAP-D and xRAP-B shelf DC input power connector pin functions...... B-21
Figure B-15: SHELF alarm connector pin identification ............................................... B-21
Figure B-16: ALARMS connector pin identification ...................................................... B-23
Figure B-17: SHELF EXTERNAL ALARM/CONTROL connector pin identification..... B-28
Figure B-18: RAP connector pin identification ............................................................. B-30
Figure B-19: CONTROL CONNECTION connector pin identification.......................... B-31
Figure B-20: 3-pin power connector ............................................................................. B-34
Figure B-21: 5-pin power connector ............................................................................. B-34
Figure B-22: xRAP-100 SHELF ALARM connector pin identification .......................... B-35
Figure B-23: xRAP-100 ALARM IN/OUT connector pin identification ......................... B-36
Figure B-24: miniRAP shelf DC input connector pin functions .................................... B-40
Figure B-25: SEVERITY IN alarm connector pin identification .................................... B-40
Figure B-26: SEVERITY OUT alarm connector pin identification ................................ B-41
Figure C-1: Connections for 16- to 32-channel expansion ........................................... C-2
Figure D-1: Typical rack layout with a patch panel ....................................................... D-4
417006-2304-0H3-B02
List of Tables
Table 1-1:
XDM shelves circuit breaker rating...................................................... 1-11
Table 4-1:
Environmental requirements ................................................................. 4-2
Table 4-2:
Main equipment dimensions .................................................................. 4-2
Table 4-3:
Comparison deep vs. standard door ..................................................... 4-4
Table 4-4:
Maximum power consumption data....................................................... 4-6
Table 4-5:
Equipment rack data............................................................................ 4-11
Table 4-6:
Rack space requirements .................................................................... 4-12
Table 4-7:
Traffic cables, fibers, and mating connector data ............................... 4-32
Table 4-8:
xRAP input and output alarm allocation .............................................. 4-75
Table 5-1:
Connecting power and rack alarm cables ........................................... 5-12
Table 6-2:
Installation Data for XDM-500 I/O Cards and Associated Modules ...... 6-6
Table 6-3:
Aurora-G cables .................................................................................. 6-80
Table 6-4: Serial port parameters ................................................................................ 6-86

Table 6-5:
IP address command line parameters................................................. 6-89
Table 8-1:
Card and module inventory ................................................................... 8-5
Table 8-2:
Visual inspection and mechanical checks ............................................. 8-7
Table 8-3:
Measured optical levels ......................................................................... 8-8
Table 8-4:
Signal characteristics at monitoring points ............................................ 8-9
Table 8-5:
Throughput and latency test results .................................................... 8-29
Table 8-6:
Frame loss rate test results ................................................................. 8-29
Table 9-1:
Preventive maintenance inspection and checks ................................... 9-3
Table 9-2:
Preventive maintenance procedures via EMS-XDM ............................. 9-4
Table 9-3:
Preventive maintenance inspection and checks ................................... 9-5
Table 9-4:
General troubleshooting procedures for cards/modules ..................... 9-13
Table 9-5:
General troubleshooting procedures for optical
transceiver plug-ins ...................................................................................................... 9-15
Table 9-6:
Troubleshooting procedures for electrical interface modules.............. 9-16
Table 9-7:
Troubleshooting procedure for optical OADM and Mux/DeMux ......... 9-17
Table 9-8:
Troubleshooting procedures for EIS cards .......................................... 9-19
Table 9-9:
Troubleshooting procedures for DIO cards ......................................... 9-20
Table 9-10:
Troubleshooting procedures for DIOB cards ....................................... 9-22
Table 9-11:
Troubleshooting procedures for MCS5/MCS10 cards ........................ 9-23
Table 9-12:
Troubleshooting procedures for ROADM cards .................................. 9-25
Table 9-13:
Understanding the Aurora-G indicator lights ....................................... 9-27
417006-2304-0H3-B02
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List of Tables

Maintenance Manual
Table 9-14:
Diagnostic codes ................................................................................. 9-28
Table 9-15:
Management access troubleshooting.................................................. 9-29
Table 9-16:
Configuration troubleshooting ............................................................. 9-30
Table 9-17:
Traffic troubleshooting ......................................................................... 9-31
Table 9-18:
Certificate troubleshooting ................................................................... 9-32
Table 9-19:
Card failure troubleshooting ................................................................ 9-32
Table 9-20:
Troubleshooting procedures for ATS cards......................................... 9-33
Table 9-21:
Troubleshooting transmission and traffic alarms ................................. 9-34
Table 9-22:
Troubleshooting power problems ........................................................ 9-36
Table 9-23:
Troubleshooting procedures for timing subsystem ............................. 9-38
Table 9-24:
Table A-1:
Table A-2:
Table A-3:
Table A-4:
Table A-5:
Table A-6:
Table A-7:
Table A-8:
Table A-9:
Table A-10:
Table A-11:
Troubleshooting management communication ................................... 9-39

RAP features ......................................................................................... A-5
xRAP-D front panel component functions ........................................... A-10
xRAP-D connector functions ............................................................... A-11
xRAP-B front panel component functions ........................................... A-14
xRAP-B connector functions ............................................................... A-15
xRAP-HP front panel component functions ......................................... A-17
xRAP-HP connectors........................................................................... A-18
xRAP-100 front panel component functions ........................................ A-20
xRAP-100 connectors.......................................................................... A-21
miniRAP component functions ............................................................ A-23
miniRAP connector functions .............................................................. A-24
Table B-1:
ALARMS connector pin assignment...................................................... B-3
Table B-2:
RAP connector pin assignment ............................................................. B-4
Table B-3:
F-CHANNEL connector pin assignment ................................................ B-5
Table B-4:
T3_1/T4_1 and T3_2/T4_2 connector pin assignment ......................... B-6
Table B-5:
OW connector pin assignment .............................................................. B-7
Table B-6:
OHA connector pin assignment............................................................. B-8
Table B-7:
ETHERNET connector pin assignment ............................................... B-10
Table B-8:
ACP900 Ethernet connector pin assignments .................................... B-11
Table B-9:
M2_84B interface module, 14-tributary connector
pin assignment ............................................................................................................. B-12
Table B-10:
Patch panel wiring ............................................................................... B-15
Table B-11:
SHELF alarm connector pin assignment ............................................. B-22
Table B-12:
ALARMS connector pin assignment.................................................... B-24
Table B-13:
SHELF EXTERNAL ALARM/CONTROL connector
pin assignment ............................................................................................................. B-28
Table B-14:
xii
SHELF EXTERNAL ALARM/CONTROL - ALARMS cable wiring ...... B-29
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Maintenance Manual
List of Tables
Table B-15:
RAP connector pin assignments ......................................................... B-30
Table B-16:
RAP shelf cable wiring diagram .......................................................... B-30
Table B-17:
CONTROL CONNECTION connector pin assignment ....................... B-31
Table B-18:
xRAP-100 SHELF ALARM connector pin assignment ........................ B-35
Table B-19:
xRAP-100 ALARM IN/OUT connector pin assignment ....................... B-37
Table B-20:
SEVERITY IN alarm connector pin assignment .................................. B-40
Table B-21:
SEVERITY OUT alarm connector pin assignment .............................. B-41
Table E-1:
Conversion from XDM-1000 slot marking to slot codes ........................ E-1
Table E-2:
Conversion from XDM-500 slot marking to slot codes .......................... E-2
417006-2304-0H3-B02
xiii
List of Tables
xiv

Maintenance Manual
417006-2304-0H3-B02
About This Manual

In this chapter:
Overview .......................................................................................................... xv
Intended Audience ............................................................................................ xv
Document Organization ................................................................................... xvi
Document Conventions ................................................................................... xvi
Related Documentation .................................................................................. xvii
Obtaining Technical Documentation ............................................................. xviii
Technical Assistance ..................................................................................... xviii
Overview
The XDM-500 Installation and Maintenance Manual (IMM) describes how to
set up, configure, and install the XDM-500 and its components and accessories.
The manual also provides task-oriented instructions for testing, troubleshooting
hardware-related problems, and replacing hardware components (cards,
modules, accessories).
Intended Audience
This manual is intended for installation and other qualified service personnel
responsible for installing the system and its accessories.
The instructions require you to understand and follow the safety practices
included here, as well as any applicable national regulations and those enforced
at your site. They also require that you understand the physical, optical, and
electrical requirements of the installation site.
417006-2304-0H3-B02
xv
About This Manual

Maintenance Manual
Document Organization
This Installation and Maintenance Manual contains the following information:
Before you start/safety guidelines (page 1-1)
Introduction to the XDM Platform (page 2-1)
XDM-500 Installation Overview (page 3-1)
Installation procedures, including:
Site preparation and rack installation (page 4-1)
XDM-500 platform installation (page 5-1)
Card and module installation (page 6-1)
Optical fiber and cable installation and routing (page 7-1)
Commissioning Tests (page 8-1)
Maintenance (page 9-1)
XDM Accessories (page A-1)
Connector pin assignments (page B-1)
Upgrades and expansions (page C-1)
Standards and References (page F-1)
Document Conventions
When applicable, this manual uses the following conventions.
Convention
Indicates
Example
Bold
Names of windows, dialog On the Alarms menu...

boxes, menus, buttons, and
most other GUI elements
Menu > Option
Selection from a menu, or

leading to another
command
Italics
New terms, emphasized

Examples in text
text, and names of manuals
and documents
Borders around text
Notes, cautions, and

warnings
Select Update > View

Objects
See examples below
NOTE: Text set off in this manner presents clarifying

information, specific instructions, commentary, sidelights, or
interesting points of information.
xvi
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Maintenance Manual
About This Manual
CAUTION: Text set off in this manner indicates that failure

to follow directions could result in damage to equipment or
loss of information.
WARNING: Text set off in this manner indicates that failure
to follow directions could result in bodily harm or loss of life.
LASER WARNING: Text set off in this manner indicates

how to avoid personal injury. All personnel involved in
equipment installation, operation, and maintenance must be
aware that laser radiation is invisible. Therefore, although
protective devices generally prevent direct exposure to the
beam, personnel must strictly observe the applicable safety
precautions and, in particular, must avoid staring into optical
connectors, either directly or using optical instruments.
ESD: Text set off in this manner indicates information on
how to avoid discharge of static electricity and subsequent
damage to the unit.
TIP: Text set off in this manner includes helpful information
and handy hints that can make your task easier.
IMPORTANT: Text set off in this manner presents essential
information to which you must pay attention.
Related Documentation
The following publications may be of assistance to you in the installation and
commissioning processes. Some of these documents present information
supplied in this installation manual in greater or lesser detail.
XDM Multiservice Packet-Optical Transport Platform General Description
XDM-1000 Product Line Reference Manual
XDM System Specifications
EMS-XDM (Element Management System) User Manual
LightSoft Network Management System User Manual
IEC Publication 825-Laser Safety Requirements
417006-2304-0H3-B02
xvii
About This Manual

Maintenance Manual
Obtaining Technical
Documentation
To obtain technical documentation related to ECI products, contact:
ECI Ltd.
Documentation Department
30 Hasivim St.
Petach Tikva 49130
Israel
Fax: +972-3-9268060
Email: techdoc.feedback@ecitele.com
Technical Assistance
The configuration, installation, and operation of the XDM-500 and its
operation in a network are highly specialized processes. Due to the different
nature of each installation, some planning aspects may not be covered in this
manual.
If you have questions or concerns about your network design or if you require
installation personnel to perform the actual installation process, ECI maintains
a staff of design engineers and highly trained field service personnel. The
services of this group are available to customers at any time.
If you are interested in obtaining design assistance or a network installation
plan from ECI's Customer Support team, contact your ECI sales representative.
With any support related issues, technical or logistic, contact the ECI Customer
Support center at your location or our central customer support center action
line at:
Telephone
+972-3-9266000
Telefax
+972-3-9266370
Email
on.support@ecitele.com
ECI's XDM and BroadGate product lines are certified to

comply with MEF9 and MEF14 standards.
ECI Telecom's qualification lab is accredited by A2LA for

competence in electrical testing according to the International
Standard ISO IEC 17025-2005 General Requirements for the
Competence of Testing and Calibration Laboratories.
xviii
417006-2304-0H3-B02
1
Installing XDM-500: Before
You Start Safety Guidelines
In this chapter:
Overview ......................................................................................................... 1-1
Warning Definition .......................................................................................... 1-2
Qualified Personnel Warning .......................................................................... 1-3
Installation Warning ........................................................................................ 1-4
General Safety Requirements .......................................................................... 1-5
Jewelry Removal Warning .............................................................................. 1-6
Grounding Requirements ................................................................................. 1-7
Power Supply Requirements ......................................................................... 1-11
TUV Statutory Warnings and Requirements ................................................. 1-17
ITU-T/Telcordia Statutory Warnings and Requirements .............................. 1-19
Laser Safety Requirements ............................................................................ 1-21
Protection Against Electrostatic Discharge ................................................... 1-26
Environmental and Health Concerns ............................................................. 1-31
Overview
This chapter describes the XDM safety guidelines. The safety rules and
warnings in this chapter must be read before beginning any platform
installation or maintenance work. These safety guidelines must be adhered to
carefully.
WARNING: XDM equipment (the "XDM equipment" or the
"Equipment") is intended for installation in restricted access areas only.
417006-2304-0H3-B02
1-1
Installing XDM-500: Before You Start

Safety Guidelines

Maintenance Manual
WARNING: XDM equipment has two power sources. Disconnect both

before servicing.
Before starting installation, make sure that the DC power is not

connected to the rack, and that the circuit breakers in the xRAP or in
the user-provided power distribution panel are set to OFF.
NOTE: This chapter includes translations of some of the warnings that

appear in this guide. The translated warnings are presented with the
English text first, followed by these languages:
Danish
Dutch
Finnish
French
German
Italian
Portuguese
Spanish
Swedish
Warning Definition
WARNING: This symbol means danger. You are in a situation that
could result in severe bodily injury. Before you work on any
equipment, be aware of the potential electrical hazards and become
familiar with accident prevention measures.
ADVARSEL: Dette symbol betyder fare. Der er risiko for alvorlig
legemsbeskadigelse. Vr opmrksom p potentielle elektriske risici,

og st dig ind i forholdsreglerne til uheldsforebyggelse, fr du arbejder
p nogen form for udstyr.
WAARSCHUWING: Dit symbool betekent gevaar. U verkeert in een
situatie die ernstig lichamelijk letsel kan veroorzaken. Voordat u met de

apparatuur gaat werken dient u zich bewust te zijn van mogelijke
elektriciteitsrisicos en zich op de hoogte te stellen van maatregelen ter
voorkoming van ongelukken.
VAROITUS: Tm merkki tarkoittaa vaaraa. Olet tilanteessa, joka voi

johtaa vakavaan loukkaantumiseen. Ennen kuin kytt mitn laitetta,
ota huomioon mahdolliset shkiset vaaratekijt ja tutustu ennalta
onnettomuuden ehkisemisohjeisiin.
ATTENTION: Ce symbole est signe de danger. Vous risquez de
graves blessures corporelles. Avant de travailler sur un appareil, vous

devez avoir conscience des risques lectriques encourus et vous
familiariser avec les mesures de prvention des accidents.
1-2
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Safety Guidelines
WARNUNG: Dieses Symbol bedeutet Gefahr. Sie befinden sich in
einer Situation, die zu schwerwiegenden Verletzungen fhren kann.

Bedenken Sie vor dem Gebrauch der Gerte mgliche Gefahren durch
elektrischen Strom und machen Sie sich mit den Manahmen zur
Unfallverhtung vertraut.
AVVERTENZA: Questo simbolo indica una situazione di pericolo.
Tale situazione potrebbe provocare gravi danni fisici. Prima di

utilizzare qualsiasi dispositivo, fare attenzione ai potenziali rischi
elettrici e acquisire familiarit con le eventuali misure di prevenzione.
AVISO: Este smbolo significa perigo. Encontra-se numa situao em
que a sua sade corre srios riscos. Antes de comear a trabalhar com o
equipamento, verifique o risco potencial de choque elctrico e
familiarize-se com as medidas de preveno de acidente.
ADVERTENCIA: Este smbolo significa peligro. Est expuesto a sufrir

daos corporales serios. Antes de utilizar el equipo, tenga en cuenta la
posibilidad de riesgo elctrico potencial y lea atentamente las medidas
de prevencin de accidentes.
VARNING: Denna symbol betyder livsfara. Du befinner dig i en
situation som kan leda till allvarliga kroppsskador. Innan du arbetar

med utrustningen mste du vara medveten om potentiella faror och
knna till olycksfrebyggande tgrder.
Qualified Personnel Warning

WARNING: Only trained qualified personnel must install, maintain, or
replace the equipment.
ADVARSEL: Kun uddannet, kvalificeret personale m installere,

vedligeholde eller udskifte udstyr.
WAARSCHUWING: Installatie, onderhoud of vervanging van de
apparatuur mag uitsluitend worden uitgevoerd door opgeleid en
bevoegd personeel.
VAROITUS: Vain koulutettu, ptev henkilkunta saa asentaa,

yllpit tai vaihtaa laitteella.
ATTENTION: Seules des personnes formes et qualifies sont
habilites installer, entretenir ou changer l'quipements.
WARNUNG: Nur geschultes, qualifiziertes Personal sollte den

Ausrstung installieren, warten oder ersetzen.
AVVERTENZA: Il apparecchiature pu essere installato, controllato o

sostituito solo da personale qualificato.
AVISO: S pessoal especializado e qualificado deve instalar, fazer a

manuteno ou substituir o equipamento.
417006-2304-0H3-B02
1-3

Safety Guidelines

Maintenance Manual
ADVERTENCIA: La instalacin, el mantenimiento y la sustitucin de

este equipo slo deber realizarlo personal cualificado.
VARNING: Endast utbildad, kvalificerad personal fr installera,

underhlla eller erstta utrustning.
Installation Warning
WARNING: Before you connect the equipment to a power source, read
the installation information in this guide.
ADVARSEL: Gennemls installationsoplysningerne i denne

vejledning, fr udstyr sluttes til en strmkilde.
WAARSCHUWING: Lees de aanwijzingen voor de installatie in deze
handleiding voordat u de apparatuur aansluit op een voedingsbron.
VAROITUS: Ennen kuin liitt laitteella virtalhteeseen, lue

asennusohjeet tst oppaasta.
ATTENTION: Avant de brancher l'quipements une source
d'alimentation, lisez les instructions d'installation de ce manuel.
WARNUNG: Lesen Sie die Hinweise zur Installation in diesem
Handbuch, bevor Sie den Ausrstung an eine Stromquelle anschlieen.
AVVERTENZA: Prima di collegare il apparecchiature alla presa di

alimentazione, leggere le informazioni relative all'installazione
riportate in questa guida.
AVISO: Antes de ligar o equipamento a uma fonte de energia, leia as

instrues para instalao neste guia.
ADVERTENCIA: Antes de conectar el equipo a la fuente de
alimentacin, lea la informacin sobre instalacin en esta gua.
VARNING: Innan du ansluter utrustning till en strmklla ska du lsa

installationsinformationen i denna handbok.
1-4
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Maintenance Manual

Safety Guidelines
General Safety Requirements

XDM platforms contain power sources of varying voltages. Make sure to
install the platforms in compliance with the following guidelines:
Use the equipment in restricted access locations only.
Note that the equipment racks and XDM platforms are suitable for
mounting on concrete or other noncombustible surfaces only.
Ensure the integrity of the grounding connections.
XDM platforms must be installed in accordance with the National

Electrical Code.
Sufficient lighting is available while working on the equipment.
Do not work on any equipment connected to a voltage source (DC or AC),

except for inserting/removing cards or modules (these activities can be
performed on operating equipment).
Ensure that the maximum working temperature does not exceed 50C.
Use only insulated tools during installation.
Wear protective clothing as required by the requisite safety regulations.
Do not install or maintain equipment connected to external lines (for

example, electrical tributaries) during thunderstorms.
Avoid contact with high voltage sources when installing platforms, cards,
and modules.
Make sure you are familiar with the warning signals and labels affixed to
the equipment, and strictly observe the procedures to avoid the indicated
hazards.
417006-2304-0H3-B02
1-5

Safety Guidelines

Maintenance Manual
Jewelry Removal Warning

WARNING: Before you work on equipment that is connected to power
lines, remove all jewelry (including rings, necklaces, and watches).

When connected to power and ground, metal objects may heat up and
cause serious burns, or weld the objects to the terminals.
ADVARSEL: Fr du arbejder p udstyr, der er sluttet til
strmledninger, skal du tage evt. smykker af (f.eks. ringe, halskder og
ure). Ved tilslutning til strm og jord kan metalobjekter blive varme og
forrsage alvorlige forbrndinger, eller objekterne kan blive svejset
fast til terminalerne.
WAARSCHUWING: Voordat u aan apparatuur gaat werken die met
elektrische leidingen is verbonden, dient u sieraden (zoals ringen,
kettingen en horloges) af te doen. Metalen voorwerpen worden warm
wanneer deze met stroom en aarde verbonden zijn en kunnen ernstige
brandwonden veroorzaken of het metalen voorwerp aan de
aansluitklemmen vastlassen.
VAROITUS: Ennen kuin tyskentelet laitteella, joka on kytketty
virtajohtoihin, riisu kaikki korut (mukaanlukien sormukset, kaulanauhat
ja rannekellot). Ollessaan kosketuksissa sek shkvirtaan ett maahan,
metalliesineet saattavat kuumentua ja aiheuttaa vakavia palovammoja
tai hitsautua kiinni napoihin.
ATTENTION: Avant de travailler sur un quipement connect au
secteur, enlevez tous vos bijoux (y compris les bagues, les colliers et
les montres). Lorsque vous tes connect au secteur et la masse, les
objets mtalliques peuvent chauffer et causer de srieuses brlures ou
se souder l'appareil.
WARNUNG: Legen Sie jeglichen Schmuck (wie Ringe, Ketten und
Uhren) ab, bevor Sie bei bestehender Stromzufuhr an dem Gert
arbeiten. Wenn eine Verbindung zur Stromversorgung und zur Masse
besteht, knnen sich Gegenstnde aus Metall erhitzen und
Verbrennungen verursachen oder an die Anschlsse angeschweit
werden.
AVVERTENZA: Prima di utilizzare apparecchiature collegate
all'alimentazione, togliersi anelli, collane e orologi e altri oggetti. Dopo
aver eseguito il collegamento all'alimentazione e la messa a terra, tali
oggetti metallici possono riscaldarsi e provocare la fusione di oggetti
sui terminali.
AVISO: Antes de iniciar o trabalho com o equipamento que estiver
ligado corrente elctrica, retire qualquer tipo de artigos de joalharia
(tais como anis, colares e relgios). Quando esto ligados corrente e
terra, os objectos em metal podem aquecer e provocar graves
queimaduras ou at mesmo ficar soldados aos terminais de corrente.
ADVERTENCIA: Antes de trabajar con un equipo que est conectado a
la alimentacin, deber uitarse todas las joyas que lleve (incluidos
anillos, collares y relojes). Los objetos metlicos que estn conectados
a la alimentacin y a una toma de tierra, se podran calentar y causar
quemaduras graves o soldar objetos a los terminales.
1-6
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Safety Guidelines
VARNING: Innan du utfr arbete p utrustning som r ansluten till

ntsladdar ska du ta av smycken (inkl. ringar, halsband och klockor).
Nr apparaten r ansluten till strm och jord kan metallfreml bli heta
och orsaka allvarliga brnnskador eller svetsa fast fremlen till
terminalerna.
Grounding Requirements
All equipment, including XDM platforms, ancillary units, and equipment from
other vendors, must be properly grounded at all times. Good grounding is
necessary to protect personnel and equipment, minimize noise, and allow the
discharge of accumulated static charges to earth.
Proper operation of the XDM equipment requires that the positive supply line
be connected to the common ground (CGND) of the site at the power source, in
accordance with ETS300132-2.
WARNING: When installing the equipment, the ground connection must
always be made first and disconnected last.
ADVARSEL: Nr udstyr installeres, skal jordledningen altid monteres

frst og afmonteres sidst.
WAARSCHUWING: Bij het installeren van de apparatuur moet de aarde
als eerste worden aangesloten en als laatste worden afgekoppeld.
VAROITUS: Kun reititint asennetaan, maaliitnt pit aina tehd ensin

ja laitteella viimeisen.
ATTENTION: Lors de l'installation du quipements, la mise la terre

doit toujours tre effectue en premier et dconnecte en dernier.
WARNUNG: Bei der Installation des Ausrstung muss der Masseleiter

stets zuerst angeschlossen und zuletzt entfernt werden.
AVVERTENZA: Durante l'installazione del apparecchiature, la
connessione a terra deve essere eseguita per prima e disconnessa per

ultima.
AVISO: Ao instalar o equipamento, a ligao terra deve ser sempre a

primeira a ser ligada e a ltima a ser desligada.
ADVERTENCIA: Al instalar el equipo, la conexin de tierra se deber

hacer en primer lugar y se deber desconectar en ltimo lugar.
VARNING: Nr du installerar utrustning mste jordsladden kopplas in

frst och kopplas ur sist.
417006-2304-0H3-B02
1-7

Safety Guidelines

Maintenance Manual
Rack Grounding Requirements

The rack is supplied with a main copper or brass grounding bolt ('grounding
stud') welded to the rack frame. The grounding stud is identified on the rack by
the ground symbol label. The stud must be free of paint. The rack also has a
rack grounding bar, which includes a set of grounding connection points for
grounding all the different equipment used in the rack. The following figure
highlights the rack grounding stud and rack grounding bar on an optical rack
used in a typical XDM installation.
Figure 1-1: Optical rack grounding bar and rack frame grounding post
1-8
417006-2304-0H3-B02

Maintenance Manual

Safety Guidelines
A connection must be made between the rack grounding bar and the site
grounding bar in compliance with TUV/ETSI recommendations. For example,
grounding may be completed by means of a copper cable with green/yellow
insulation having the same diameter as the power feeding cables or thicker, and
as short as possible. A length of appropriate gauge grounding cable is included
with the platform accessories. A different connection bar may also be used, as
long as the grounding connection is in compliance with TUV/ETSI
recommendations. The rack grounding stud is connected to the rack grounding
bar by means of a metal panel. These rack grounding connections are
highlighted in the following figure.
Figure 1-2: Grounding the optical rack to the site grounding bar
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Equipment Grounding Requirements

XDM platforms and accessories are mounted on the rack mounting rails. Each
Equipment unit mounted on the rack is grounded to the rack frame by the
mounting brackets, retaining bolts, and nuts attaching the unit to the rack
frame. These rack mounting rails, as well as the mounting brackets' internal
surfaces facing the rails and the Equipment, must all be free of paint and
provide electrical continuity to the Equipment frame and to the rack grounding
stud and grounding bar.
Check that the resistance between any mounting bracket and the Equipment
frame (chassis), as well as the resistance between any rail and the rack
grounding stud, is lower than 0.1 .
Particular attention must be paid to the area in which the xRAP (when used) is
attached. Paint must be removed from this area of the rack to ensure efficient
electrical contact.
NOTES: ECI offers a few different types of Rack Alarm Panels
(xRAPs) for use with XDM platforms: PRAP, xRAP-D, xRAP-B,

xRAP-HP, xRAP-100, and miniRAP. The generic name xRAP is used
whenever the information applies to all types.
CAUTION: Connect the xRAP grounding bolt to the rack grounding
bar with a grounding cable in compliance with UL/ETSI

recommendations. The cable must include lug terminals on both ends
and be securely fastened with a flat washer, serrated lock washer, and
nut or bolt, depending on the connection point. If necessary, the gauge
of the grounding lead can be reduced to the gauge of the xRAP power
leads.
In addition to the basic grounding protection offered through the mounting

connection between the equipment and the rack, XDM grounding procedures
for the rack and for each component mounted within the rack are designed to
meet UL/ETSI grounding requirements. Detailed descriptions of the grounding
procedures for each piece of equipment, as well as the rack itself, are included
with the installation instructions in Site Preparation and Rack Installation (page
4-1) and XDM-500 Platform Installation (page 5-1).
WARNING: To prevent possible damage to XDM Equipment, all
racks and equipment must be completely grounded before

connecting to the platform any external devices powered from any DC
source (40.5 V - 75 V) or AC source (100 V - 230 V). All grounding
procedures described in Grounding the Platform (page 5-3) must be
completed before, for example, connecting an external PC to configure
and initialize the NE management system.
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Power Supply Requirements

Connection via RAP
XDM platforms require two power sources with voltage of -40.5 VDC ranging
to -72 VDC, with the positive line connected to the site ground. The nominal
feeding voltage is -48 VDC.
NOTE: The working voltage range for the USA market is 40.5 VDC to -60 VDC.
Each power source must be protected by a TUV-listed circuit breaker installed

in the RAP. These circuit breakers are included in the installation kit supplied
with the equipment, and their current ratings are therefore in accordance with
the order.
In addition, the site operator must provide a readily accessible TUV-listed
disconnect device incorporated in the fixed power wiring of the site. The
device limits the maximum delivered current to a safe value.
Connection via User-provided Power

Distribution Panel
The requirements described in Connection via xRAP (page 1-11) also apply
when a user-provided power distribution panel is used.
The circuit breakers to be used for the various XDM platforms must be
TUV-listed. Examples of TUV-listed circuit breakers are provided in the
following table.
Table 1-1:
XDM shelves circuit breaker rating
Platform
Circuit breaker
rating (A)
Circuit breaker example

Heineman (part no.)
XDM-40
20
AM1R-B3-AC-21-K-A-20-2
XDM-400
25
AM1R-B3-AC-21-K-A-25-2
XDM-450
16
AM1R-B3-AC-21-K-A-16-2
XDM-500
30
AM1R-B3-AC-21-K-A-30-2
XDM-1000
55
AM1R-B3-AC-21-K-A-55-2
XDM-2000
60
AM1R-B3-AC-21-K-A-60-2
XDM-3000
50
AM1R-B3-AC-21-K-A-50-2
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DC Power Warnings
WARNING: Follow this wiring sequence when connecting power:
ground to ground, positive lead to +RTN terminal, and negative lead to 48 V terminal. To disconnect power, perform the sequence in reverse
order. Always connect the ground wire first and disconnect it last.
ADVARSEL: Ledningsfring ved strmtilslutning: Jord til jord, positiv

ledning til +RTN-terminalen og negativ ledning til -48V-terminalen.
Foretag dette i omvendt rkkeflge ved frakobling af strmmen.
Jordledningen skal altid monteres frst og afmonteres sidst.
WAARSCHUWING: Houd u bij het aansluiten van de stroom aan de
volgende bedradingsvolgorde: aarde naar aarde, de positieve draad naar

de klem +RTN en de negatieve draad naar de klem -48 V. Voor het
afkoppelen past u de omgekeerde volgorde toe. De aarddraad moet altijd
het eerst worden aangesloten en het laatst worden afgekoppeld.
VAROITUS: Noudata seuraavaa johdotusjrjestyst kytkiesssi virtaa:

maasta maahan, positiivinen johdin +RTN-napaan ja negatiivinen johdin
-48 V -napaan. Tee edellinen knteisess jrjestyksess, kun olet
katkaisemassa virtaa. Maajohto tulisi aina kytke ensimmisen kiinni ja
viimeisen pois.
ATTENTION: Lorsque vous vous connectez au secteur, suivez les
instructions suivantes : terre la terre, cble positif vers connexion

+RTN et cble ngatif vers connexion 48V. Suivez ces instructions dans
l'ordre inverse pour vous dconnecter du secteur. Le cble la terre doit
toujours tre connect en premier et dconnect en dernier.
WARNUNG: Beachten Sie beim Anschluss an das Stromnetz folgende
Reihenfolge der Verkabelung: Masseleiter an Masseanschluss, positiver

Pol an +RTN-Anschluss und negativer Pol an -48 V-Anschluss.
Verwenden Sie bei der Unterbrechung der Stromversorgung die
umgekehrte Reihenfolge. Der Masseleiter sollte immer zuerst
angeschlossen und zuletzt entfernt werden.
AVVERTENZA: Quando si collega il router alla presa di alimentazione,

seguire la sequenza di fili elettrici indicata di seguito: terra a terra, polo
positivo sul terminale +RTN e polo negativo sul terminale -48 V. Per
scollegare il router dalla presa di alimentazione, seguire la sequenza
nell'ordine inverso. Il filo della terra deve essere sempre collegato per
primo e scollegato per ultimo.
AVISO: Ao ligar a corrente elctrica, observar a seguinte sequncia de

cablagem: fio de terra a fio de terra, plo positivo com terminal +RTN, e
plo negativo com terminal -48 V. Para desligar a corrente, executar a
sequncia em ordem inversa. O fio de terra deve ser sempre ligado em
primeiro lugar e desligado em ltimo lugar.
ADVERTENCIA: Cuando conecte la alimentacin, siga la secuencia de
cableado que se indica a continuacin: tierra a tierra, toma positiva a
terminal +RTN, y toma negativa a terminal -48 V. Para desconectar la
alimentacin, realice la secuencia en orden inverso. La toma de tierra
siempre deber conectarse en primer lugar y desconectarse en ltimo.
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VARNING: Nr du ansluter strmmen ska du flja denna sekvens: jord
till jord, positiv sladd till +RTN-terminalen och negativ sladd till -48 Vterminalen. Utfr dessa steg i motsatt ordning nr du kopplar frn
strmmen. Jordsladden br alltid kopplas in frst och kopplas ur sist.
WARNING: Ensure the DC input wiring is connected in the correct
polarity, as reversed polarity may trip the circuit breaker or damage the
equipment.
ADVARSEL: Kontrollr, at jvnstrmstilfrselsledningen er tilsluttet

med korrekt polaritet, da omvendt polaritet kan udlse brydekontakten
eller beskadige udstyr.
WAARSCHUWING: Controleer of de ingangsbedrading voor
gelijkstroom is aangesloten op de juiste polariteit, aangezien omgekeerde

polariteit de stroomonderbreker kan uitschakelen of de apparatuur kan
beschadigen.
VAROITUS: Varmista, ett tasavirran syttjohdotus on kytketty
oikeisiin napoihin, sill vastakkainen napaisuus saattaa suojalaukaista

katkaisijan (tripata) tai aiheuttaa vahinkoa laitteella.
ATTENTION: Assurez-vous que le cble de l'entre de courant continu

se trouve dans la bonne polarit, sinon vous risquez d'allumer le
disjoncteur ou d'endommager l'quipements.
WARNUNG: Vergewissern Sie sich, dass das Gleichstromkabel an die
richtige Polaritt angeschlossen ist. Andernfalls kann der Trennschalter

ausgeschaltet oder der Ausrstung beschdigt werden.
AVVERTENZA: Assicurarsi che i fili CC siano collegati alla polarit
corretta, in caso contrario pu scattare l'interruttore automatico o si pu

danneggiare il apparecchiature.
AVISO: Certifique-se de que a ligao de entrada de corrente feita com

a polaridade adequada, pois a polaridade invertida pode fazer com que o
circuito dispare ou danificar o equipamento.
ADVERTENCIA: Asegrese de que el cable de entrada de CC est
conectado con la polaridad adecuada ya que la polaridad contraria podra

provocar un cortacircuitos o daar el equipo.
VARNING: Kontrollera att ingngssladdarna fr likstrm r anslutna till

rtt pol. Fel pol kan leda till att strmbrytaren stngs av eller att
utrustning skadas.
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WARNING: When stranded wiring is used, make sure that no stray

strands protrude from the DC power entry terminals.
ADVARSEL: Nr der bruges flertrdede ledninger, skal det kontrolleres,

at der ikke stikker trde ud af stikkene.
WAARSCHUWING: Wanneer er geslagen bedrading wordt gebruikt,
moet u ervoor zorgen dat er geen lekdraden uit de
gelijkstroomingangsklemmen steken.
VAROITUS: Jos kytetn johdotusta, jossa on sikeit, varmista, ettei

yksikn sie harota tasavirran syttnavoista.
ATTENTION: Lorsque vous utilisez des cbles toronns, assurez-vous

qu'aucun brin ne dpasse des entres de courant continu.
WARNUNG: Achten Sie bei verseilten Kabeln darauf, dass keine Litzen
aus den Gleichstromanschlssen hervorstehen.
AVVERTENZA: Se si utilizzano cavi a connettori multipli, assicurarsi
che nessun cavo sporga dai terminali dell'alimentazione CC.
AVISO: Quando for utilizado fio entranado, certifique-se que no ficam

pontas soltas aparentes nos terminais de entrada de energia de CC.
ADVERTENCIA: Si se utiliza cable trenzado, asegrese de que no se ha
salido ningn hilo de los terminales de entrada de CC.
VARNING: Om du anvnder tvinnade kablar ska du kontrollera att inga

lsa filament sticker ut frn ingngsterminalerna fr likstrm.
WARNING: Before working on the equipment or near the power entries,

ensure that the power cables have been disconnected from both DC
power entry terminals. Do not touch the DC power entries while the
power cables are connected. Voltages may be present within the power
entries when the power is switched off and the power cables are
connected.
ADVARSEL: Fr der arbejdes p udstyr eller nr strmindgangene, skal

det kontrolleres, at ledningerne er taget ud af begge strmtilfrsler. Rr
ikke ved strmtilfrslerne, mens ledningerne er tilsluttet. Der kan vre
spnding i strmtilfrslerne, nr der er slukket for strmmen, og
strmledningerne er tilsluttet.
WAARSCHUWING: Controleer of de stroomkabels zijn afgekoppeld
van beide gelijkstroomingangen, voordat u aan de apparatuur of in de
buurt van de stroomingangen gaat werken. Raak de
gelijkstroomingangen niet aan terwijl de stroomkabels worden
aangesloten. De stroomingangen kunnen onder spanning staan wanneer
de stroom wordt uitgeschakeld en de stroomkabels worden aangesloten.
VAROITUS: Ennen laitteella tai sen virtalhteiden lhell tyskentely
varmista, ett virtakaapelit on irrotettu molemmista tasavirran

syttnavoista. l koske tasavirran syttkohtiin kun virtakaapelit on
kytketty kiinni. Virransyttkohdissa saattaa olla viel jnnitett silloin,
kun virta on kytketty pois ja virtakaapelit ovat kiinni.
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ATTENTION: Avant de travailler sur l'quipements ou prs de ses
entres lectriques, assurez-vous que les cbles d'alimentation sont

dconnects des deux entres de courant continu. Ne touchez pas les
entres de courant continu lorsque les cbles d'alimentation sont
connects. Il risque d'y avoir encore du courant dans les entres
d'alimentation lorsque l'interrupteur est teint et que les cbles sont
connects.
WARNUNG: Entfernen Sie vor allen Arbeiten am Ausrstung oder nahe

der Stromanschlsse die Stromkabel aus beiden Gleichstromanschlssen.
Berhren Sie die Gleichstromeingnge nicht, wenn die Stromkabel
angeschlossen sind. An den Stromeingngen knnen Spannungen
anliegen, wenn die Stromzufuhr unterbrochen ist und die Stromkabel
angeschlossen sind.
AVVERTENZA: Prima di eseguire interventi sul apparecchiature o di
avvicinarsi agli ingressi della corrente, assicurarsi che i cavi

dell'alimentazione siano stati scollegati da entrambi i terminali
dell'alimentazione CC. Non avvicinarsi agli ingressi dell'alimentazione
CC mentre i cavi dell'alimentazione sono collegati. possibile che la
tensione sia presente negli ingressi quando l'alimentazione scollegata
ma i cavi sono collegati.
AVISO: Antes de iniciar o trabalho com o equipamento que estiver

ligado corrente elctrica, retire qualquer tipo de artigos de joalharia
(tais como anis, colares e relgios). Quando esto ligados corrente e
terra, os objectos em metal podem aquecer e provocar graves
queimaduras ou at mesmo ficar soldados aos terminais de corrente.
ADVERTENCIA: Antes de trabajar en el equipo o cerca de las entradas
de alimentacin, compruebe que los cables de alimentacin estn

desconectados de los dos terminales de entrada de CC. No toque las
entradas de CC mientras que los cables de alimentacin estn
conectados. Es posible que haya corriente en las entradas de alimentacin
cuando el equipo est apagado y los cables de alimentacin estn
conectados.
VARNING: Innan du arbetar med utrustning eller i nrheten av
strmingngarna ska du kontrollera att ntsladdarna har kopplats ur frn

bda ingngsterminalerna fr likstrm. Rr inte ingngsterminalerna fr
likstrm nr ntsladdarna r inkopplade. Det kan finnas strm kvar i
strmingngarna nr strmmen r av och ntsladdarna r inkopplade.
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Electricity Safety Warning

WARNING: Do not touch uninsulated wiring or ports when they have
not been disconnected from a power source; doing so may result in
electrical shock.
ADVARSEL: Rr ikke ved uisolerede ledninger eller porte, nr de ikke

er koblet fra strmkilden, da det kan medfre elektrisk std.
WAARSCHUWING: Raak geen ongesoleerde bedrading of poorten aan
wanneer deze niet zijn afgekoppeld van de voeding, aangezien dit een
elektrische schok kan veroorzaken.
VAROITUS: l koske eristmttmiin johtoihin tai napoihin, jos ne

ovat kytkksiss virtalhteeseen, sill tst voi seurata shkisku.
ATTENTION: Ne touchez pas les cbles ou ports non isols lorsqu'ils ne
sont pas dconnects du secteur, car vous risquez de vous lectrocuter.
WARNUNG: Berhren Sie keine unisolierten Kabel oder Anschlsse,
wenn sie noch an eine Stromquelle angeschlossen sind, da dies zu einem

Stromschlag fhren knnte.
AVVERTENZA: Evitare di toccare i cavi o le porte non isolate quando

sono ancora collegati alla presa di alimentazione, poich si potrebbero
verificare scosse elettriche.
AVISO: No tocar na cablagem aparente ou nas portas de entrada de
corrente que no tiverem sido desligadas da fonte de energia, pois desse

facto podem resultar choques elctricos.
ADVERTENCIA: No toque los puertos ni los cables que no estn
aislados si no estn desconectados de la fuente de alimentacin ya que

podra provocar una descarga elctrica.
VARNING: Rr inte sladdar eller portar som inte r isolerade om de inte

har kopplats ur frn strmkllan. Det kan leda till elektriska sttar.
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TUV Statutory Warnings and

Requirements
This section outlines the TUV statutory warnings and requirements
applicable to XDM platforms.
MET/TUV Listing Identification

XDM platforms are MET/TUV-listed. Typical MET/TUV labels for XDM
platforms are shown in the following figure.
Figure 1-3: XDM shelves warning labels
Warning Label
The following warning label is affixed alongside the XDM power input
connectors and the RAP circuit breakers.
Figure 1-4: Power input warning label
CAUTION: XDM equipment has two power sources.

Disconnect both before servicing.
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Overcurrent Protection Requirements

NOTE: Rating and type of overcurrent protection are
according to Classification Level 5 (L5) for power supplies

having output circuits that meet the requirements for SELV
circuits.
WARNING: Observe the following precautions when

replacing circuit breakers:
Replace only with a circuit breaker of the same type and

rating.
Disconnect power before changing a circuit breaker.
ATTENTION: Pour ne pas compromettre la protection

contre les risques dincendie, remplacer par un fusible de
mme type et de mmes caractristiques nominales.

CAUTION: The equipment must have a connection between
the grounded conductor of the DC power supply circuit and
the equipment grounding conductor.
Connect the equipment directly to the DC supply system grounding electrode

conductor or to a bonding jumper from a grounding terminal bar or bus to
which the DC supply system grounding electrode is connected.
Locate the equipment in the same immediate area (for example, in adjacent
racks) as any other equipment that has a connection between the grounding
conductor of the same DC supply circuit and the grounding conductor, and as
the grounding point of the DC system. The DC system must not be grounded
elsewhere.
Position the DC supply source in the same premises as this equipment.
There must be no switching or disconnecting devices in the grounded circuit
conductor between the DC source and the point of connection of the grounding
electrode conductor.
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Grounded Conductors Requirements

Connect the equipment directly to the DC supply system grounding electrode
conductor or to a bonding jumper from a grounding terminal bar or bus to
which the DC supply system grounding electrode conductor is connected.
Locate the DC supply source within the same premises as the equipment. There
must be no switching or disconnecting devices in the grounded circuit
conductor between the DC source and the point of connection of the grounding
electrode conductor.
ITU-T/Telcordia Statutory
Warnings and Requirements
This section outlines the ITU-T and Telcordia statutory warnings and
requirements applicable to XDM platforms. The source for these requirements
can be found in IEC 60950-1/3.2.1.2.
Ethernet Port Precautions

WARNINGS:
417006-2304-0H3-B02
Ethernet ports must be cabled with shielded cables and the

shield grounded at both ends.
Intra-building ports of the equipment or subassembly are
suitable for connection to intra-building or unexposed
wiring or cabling only. Intra-building ports of the
equipment or subassembly MUST NOT be connected
metallically to interfaces that connect to the OSP or its
wiring. These interfaces are designed for use as
intra-building interfaces only (Type 2 or Type 4 ports as
described in GR-1089-CORE, Issue 4) and require
isolation from the exposed OSP cabling. The addition of
Primary Protectors is not sufficient protection in order to
connect these interfaces metallically to OSP wiring.
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Safety Guidelines

Maintenance Manual
DC Supply Circuit Connection to the

Grounding Conductor
WARNING: There must be a connection between the grounded
conductor of the DC power supply circuit and the equipment grounding

conductor. See installation instructions for more details.
When this connection is made, all the following conditions must be met:
The equipment is connected directly to the DC supply system

grounding electrode conductor or to a bonding jumper from a
grounding terminal bar/bus to which the DC supply system grounding
electrode is connected.
The equipment is located in the same immediate area (such as
adjacent cabinets) as any other equipment that has a connection
between the grounded conductor of the same DC supply circuit and
the grounding conductor, as well as the point of grounding of the DC
system. The DC system must not be grounded elsewhere.
The DC supply source is located within the same premises as this
equipment.
There is no switching or disconnecting devices in the grounded
circuit conductor between the DC source and the point of connection
of the grounding electrode conductor.
WARNING: Cet appareil est conu pour permettre le raccordement du

conducteur reli la terre du circuit dalimentation c.c. au conducteur
de terre de lappareil.
Pour ce raccordement, toutes les conditions suivantes doivent tre
respectes:
1-20
Ce matriel doit tre raccord directement au conducteur de la prise

de terre du circuit dalimentation c.c. ou une tresse de mise la
masse relie une barre omnibus de terre laquelle est raccorde
llectrode de terre du circuit dalimentation c.c.
Les appareils dont les conducteurs de terre respectifs sont raccords
au conducteur de terre du mme circuit dalimentation c.c. doivent
tre installs proximit les uns des autres (p.ex., dans des armoires
adjacentes) et proximit de la prise de terre du circuit
dalimentation c.c. Le circuit dalimentation c.c. ne doit comporter
aucune autre prise de terre.
La source dalimentation du circuit c.c. doit tre situe dans la
mme pice que le matriel.
Il ne doit y avoir aucun dispositif de commutation ou de
sectionnement entre le point de raccordement au conducteur de la
source dalimentation c.c. et le point de raccordement la prise de
terre.
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Laser Safety Requirements

Laser Classification
ECI equipment and components equipped with laser devices described in this
manual comply with the International Electrotechnical Commission (IEC)
safety standards, including IEC 60825-1 and IEC 60825-2 (AS/NZS
2211.2) - Safety of Laser Products.
Except for certain high power EDFA and Raman optical amplifiers, XDM
equipment is classified as Class 1 laser products. The product and its
accessories do not emit hazardous light and the beam is totally enclosed during
normal operating modes of customer operation. As long as the equipment is
operated in accordance with the applicable safety instructions, the Hazard
Level in equipment access locations is inherently Class 1M or lower.
The high power EDFA and Raman optical amplifiers are also classified as
Class 1M (or lower) laser products. However, note that these units emit power
within Hazard Level 3B and Hazard Level 4. The hazard level might be higher
than the product class, depending on network implementation and fiber
accessibility.
ECI provides product and installation information so that the products may be
installed and serviced safely.
Laser Information
See the XDM System Specification for information regarding the laser
transmitters of the various optical cards.
Warning Labels for Laser Products

The following labels are affixed near the
optical connectors of optical cards and
modules to indicate that the product is
classified as a Class 1 laser product.
The following labels are affixed near the

optical connectors of optical cards and
modules with a laser to indicate that the
product is classified as a Class 1M laser
product.
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Laser Safety Statutory Warning

All personnel involved in equipment installation, operation, and maintenance
must be aware that laser radiation is invisible. Therefore, although protective
devices generally prevent direct exposure to the beam, personnel must strictly
observe the applicable safety precautions and, in particular, must avoid staring
into optical connectors, either directly or using optical instruments.
Remember that observing safety precautions is not a matter of personal choice;
ignoring safety puts all the people within line of sight in danger!
Training for Laser Safety

Personnel must be trained for safety before being authorized to operate, install,
and/or maintain laser products. The IEC 60825 (AS/NZS 2211.2) standards
require organizations to appoint a laser safety officer who is responsible for
training personnel, establishing safe operational procedures, and supervising
the implementation of these procedures during routine work.
Untrained personnel must not be allowed to operate, install, and/or maintain
laser products.
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Laser Device Operating Precautions

In addition to the general precautions described in this section, be sure to
observe the following warnings when operating a product equipped with a laser
device. Failure to observe these warnings could result in bodily injury and
damage to equipment.
WARNING: To reduce the risk of exposure to hazardous radiation:
Protection goggles with nominal OD2 for the wavelength range of

1300 nm to 1600 nm are recommended. Protection goggles are
mandatory for tasks performed on equipment with up to 30 dBm
optical power lasers.
Hot insertion or swapping of a DWDM module or optical interface
module must be carried out only by authorized personnel.
During hot removal and insertion of a fiber termination, avoid
looking into the fiber to prevent irremediable damage to your eyes.
Place plastic covers on module fiber ports and fiber terminations not
currently in use.
Do not operate controls, make adjustments, or perform procedures
associated with the laser device other than those specified herein.
Only ECI authorized service technicians must repair the unit.
To avoid potential fiber fusing, burnt connectors, or loss of laser
power, ensure all high power connections are clean before you
power on the optical amplifier.
It is strictly forbidden to override any protective devices and interlocks

used to prevent direct exposure to the laser beam.
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WARNING: Invisible laser radiation may be emitted from the aperture

of optical ports when no fiber cable is connected. Avoid exposure and
do not stare into open apertures.
ADVARSEL: Der kan forekomme usynlige laserstrler fra de optiske

portes bninger, nr der ikke er tilsluttet et lyslederkabel. Undg at
blive udsat for disse strler, og kig ikke ind i bninger.
WAARSCHUWING: Er kan onzichtbare laserstraling uit de opening
van de optische poorten komen wanneer er geen fiberkabel is
aangesloten. Vermijd blootstelling aan straling en kijk niet in de
openingen.
VAROITUS: Optisten porttien aukoista saattaa steill nkymtnt
lasersteily silloin, kun niiss ei ole kuitukaapeleita kiinni. Vlt
altistumista ja l tuijota nihin avoimiin aukkoihin.
ATTENTION: Un rayonnement laser invisible peut tre mis partir
de l'ouverture des ports optiques lorsque aucun cble fibres optiques
n'est connect. vitez de vous y exposer et ne fixez pas les ouvertures.
WARNUNG: Wenn kein Faserkabel angeschlossen ist, knnen aus der
ffnung der optischen Anschlsse Laserstrahlen austreten. Vermeiden
Sie Bestrahlungen und schauen Sie nicht in diese ffnungen.
AVVERTENZA: Le aperture delle porte ottiche possono emettere
radiazioni laser invisibili quando i cavi in fibra non sono collegati.
Evitare lunghe esposizioni davanti alle aperture.
AVISO: Podem ser emitidas radiaes invisveis de laser a partir das
aberturas das portas pticas se no estiver ligado qualquer cabo de fibra

ptica. Evitar a exposio e no olhar directamente pelas aberturas
aparentes.
ADVERTENCIA: Es posible que la radiacin lser invisible se emita
desde la apertura de puertos pticos cuando no haya ningn cable de

fibra conectado. Evite la exposicin y no mire fijamente a las aberturas.
VARNING: Osynlig laserstrlning kan spridas frn ppningen p
optiska portar om ingen fiberoptikkabel r ansluten. Undvik exponering

och stirra inte in i ppningarna.
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Safety Guidelines
Additional Safety Precautions for High

Power Raman and EDFA Amplifiers
High Power Raman and EDFA amplifiers might generate up to 30 dBm of
optical power. This is considered within Hazard Level 3B (up to 27 dBm) or
Level 4 (beyond 27 dBm).
Since all the optical power generated by the optical amplifier is confined within
the fiber in normal operation, the amplifier is defined as a Class 1 (or
Class 1M) laser product. However, its Hazard Level is potentially 3B or 4.
Since a laser beam at this hazard level might cause irreparable eye and skin
damage, special attention is required when performing any task (whether
operation, installation, or maintenance) on these amplifiers, or in any part of a
system that carries signals from these amplifiers. Moreover, personnel must be
specifically trained for laser safety before being allowed to perform tasks on or
around these optical amplifiers.
This section provides additional safety instructions that will help you prevent
dangerous situations and possible injury to yourself and to your colleagues.
Always use protective goggles with minimum OD2 when working on OFA
cards or on parts of the system that carry their signals (such as fibers and
ODFs). Inspect the goggles for integrity (scratches, broken lenses, and any
other type of damage). Replace the goggles if in doubt.
Work on OFA cards must be carried out only in a restricted access area.
Only people trained in laser safety may be allowed to enter such an area.
The optical path carrying these amplifier signals must be fully installed
before starting to connect fibers to the OFA. All fibers carrying such
signals must be inspected to ensure that they are in good condition. Replace
any fiber section if in doubt as to its condition.
Alongside all the connectors of the fibers that carry OFA signals, affix
labels with the following warning:
HAZARD LEVEL 3B (or Level 4 if applicable)
DO NOT DISCONNECT UNDER OPERATION
Under all circumstances (installation, operation, measurements, and
maintenance activities), it is forbidden to apply power to these amplifiers
unless fibers are connected or protective caps are installed on its
connectors. Observe the following precautions:
Complete all optical connections between these amplifiers and an ODF,

another card, test jig, or test equipment, and so on, before applying
power.
If the connections to the amplifiers have not yet been made, for
example, during platform installation activities, always install
protective caps on the amplifier optical connectors.
When the time comes to connect fibers to the amplifiers, first make sure
the platform is not powered and cannot be powered while you work on
it.
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When it is necessary to disconnect a fiber or replace a component along the

path of the amplifier signals while the amplifier is powered, first disconnect
the fiber from the LINE connector, and only then disconnect the far end of
the fiber.
NOTE: A fiber might include optical power from both EDFA
and Raman amplifiers.
Whenever the APR mechanism is temporarily disabled, for example during

maintenance, place a warning label that notifies other persons and serves as
a reminder to reactivate APR after the maintenance activity has ended.
To avoid potential fiber fusing, burnt connectors, or loss of laser power,

ensure that all high power connections are clean before you power up the
optical amplifier.
Protection Against Electrostatic

Discharge
This section provides guidelines for protecting XDM equipment and its
components against damage from electrostatic discharge (ESD) during
handling, packaging/unpackaging, transportation, installation, commissioning,
inspection, servicing, and maintenance activities.
Items sensitive to ESD are identified by the basic ESD warning symbol shown
in the following figure.
Figure 1-5: Basic ESD warning symbol
The information in this section presents generally accepted workmanship

practices and procedures that, when properly applied, minimize the probability
of electrostatic damage to XDM equipment and its components.
The information is also in line with CENELEC Electronic Components
Committee (CECC) specification CECC 00 015 that deals with protection of
devices sensitive to electrostatic discharge (ESDS devices).
1-26
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Safety Guidelines
General
Most types of electronic equipment, assemblies, and components can be
damaged by ESDs. An ESD between two objects occurs when an object
carrying static electrical charges touches, or is brought near the other object.
Static electrical charges appear as a result of friction between surfaces of
insulating materials or separation of two such surfaces, and may also be
induced by electrical fields. Routine activities, such as walking across an
insulating floor, friction between garment parts, friction between objects, and
so on, can easily build up charges to levels that may cause damage, especially
when humidity is low.
In many cases, the buildup of charges can be avoided by using special
materials, for example, garments and packaging made of antistatic materials or
materials that have high resistivity but are not insulators.
The best approach to avoiding damage by ESD includes a combination of
means and procedures that:
Avoids build-up of electrostatic charges
Creates a protected work environment preventing ESD
Provides means for controlled discharge of any accumulated electrostatic

charges when entering the protected work environment
NOTE: An area in which ESDS devices can be handled with
minimum risk of damage and in which the operator is not
exposed to additional risks, is called an ESD Protected Area
(EPA).
Personnel Training
During production and assembly, equipment is handled in work spaces
especially prepared and certified to serve as a permanent EPA. However, in
many cases, the environment in which the same equipment is installed or
maintained cannot be assumed to form an EPA with a permanently controlled
boundary.
Therefore, all the work requiring the handling of unprotected ESDS devices
must be considered as field work.
Field work in this context includes activities such as service and maintenance,
installation, site inspection, and commissioning of components and assemblies
classified as ESDS, together with the packing and unpacking activities
associated with such activities.
All the staff involved in field work must be trained to perform field work in the
same way as work performed in permanent EPAs with respect to the material
quality and personal responsibilities, training, labeling, and packaging.
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Use of Temporary EPA

Where necessary, a temporary EPA must be used. A typical temporary EPA
arrangement suitable for field work on XDM Equipment is shown in the
following figure.
The EPA tool kit includes:
Wrist strap with 1 M series resistor
Bonding strap with 1 M series resistor
ESD carpet (work surface), m2 minimum
The temporary EPA must include temporary controlled work surfaces and/or
flooring capable of providing protection against ESD.
CAUTION: The temporary EPA must be constructed in a
way that ensures electrical bonding among all the materials

used, and prevents any sudden changes in potential within the
EPA that could cause unacceptable voltages or discharges to
be applied to the ESDS.
A means of equipotentially bonding the operator and any work surface and
flooring to ground must be used. For this purpose, the work surface and wrist
straps must be bonded, either to a designated ground bonding point or to the
Equipment being serviced, as shown in the following figure.
Whenever available, the main ground serves as the ESD grounding facility.
WARNING: While the operator is within the temporary EPA,
the minimum value of resistance used for bonding to ground
must limit the current to ground produced by voltages
accessible to the operator to limits specified as safe by the
applicable regulations (see, for example, CECC 00 015).
The same approach is applicable to the surface resistivity and

resistance to ground of materials used for temporary work
surfaces and flooring.
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To enable ESD bonding to ground of Equipment racks and any other

nonmovable Equipment including ESDS, an ESD ground bonding facility must
be located near such Equipment, or the Equipment must be fitted with a
designated ground bonding point presenting a resistance to ground not greater
than 1 M.
Figure 1-6: Typical temporary EPA arrangement
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Work Arrangements within a Temporary

EPA
To ensure that effective ESD protection is indeed achieved, the following
arrangements must be observed by persons entering and/or performing field
work within a temporary EPA:
1-30
All operators working within a temporary EPA must wear, as a minimum,

an antistatic protecting garment made of cotton.
If the extent of the temporary work area is such that the operator needs to
walk and move within that area, the floor must be capable of providing
protection against ESD.
The operator must be bonded to ground at all times when handling an

ESDS device.
If it becomes necessary to remove an ESDS device from equipment and

transfer it to a temporary work surface away from the equipment, the ESDS
device must be given protective packaging unless equipotential bonding of
the operator to ground is maintained.
An ESDS device must be placed directly into protective packaging upon

removal from equipment. A replacement ESDS device must be kept in its
protective packaging until required for immediate installation in the
equipment.
The field service operator must ensure that the materials and tools
necessary to maintain and control the temporary EPA are available at the
place of the field work at service time.
All tools intended for use within the EPA must, as far as is practical, be so
constructed that they do not generate or hold an induced electrostatic
charge.
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Safety Guidelines
Environmental and Health

Concerns
ECI is committed to achieving high standards of environmental quality and
product safety.
The International Standardization Organization (ISO) has developed the
internationally recognized standards ISO 9001 and ISO 14001. These are
quality management standards that are administered by independent
accreditation and certification bodies.
ISO 9000 is a family of standards for quality management systems that has
been accepted as a model when assessing the adequacy of quality management
systems. Some of the requirements in ISO 9001 (one of the standards in the
ISO 9000 family) include:
Procedures that cover all key business processes
Process monitoring to ensure effectiveness
Adequate record-keeping
Monitoring output for defects, with appropriate and corrective action where
necessary
Regular review of individual processes and the complete quality system as

a whole
Facilitating continual improvement
ISO 14000 is the international specification for an Environmental Management

System (EMS). It specifies requirements for establishing an environmental
policy, determining environmental aspects and impacts of products, activities,
and services, planning environmental objectives and measurable targets,
implementation and operation of programs to meet objectives and targets,
checking and corrective action, and management review. ECI Quality and
Environmental Management Systems were certified to these ISO standards and
are periodically audited by third-party organizations.
ECI policies and products meet the spirit of the U.S. Environmental Protection
Agency's Design for the Environment (DfE) Program to reduce risk to people
and the environment by preventing pollution and improving energy efficiency.
ECI is certified to OHSAS 18000, which was developed as a standard against
which occupational safety management systems can objectively be assessed.
OHSAS 18000 (compatible with ISO 9001 and ISO 14001) is being developed
through a concerted effort from a number of the world's leading national
standards bodies, certification bodies, and specialist consultancies.
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As a part of ECIs environmental commitment and in pursuit of compliance

with applicable environmental legislation, ECI makes every effort to ensure
that its products supplied to the EU market are compliant with the RoHS
Europe directive restricting use of certain hazardous substances in electrical
and electronic equipment. ECI also requires RoHS compliance from all its
suppliers. All new electrical and electronic equipment delivered to locations
within the EU do not contain any cadmium (Cd), lead (Pb), hexavalent
chromium compounds (Cr6+), mercury (Hg), polybrominated biphenyls (PBB),
or polybrominated diphenyl ethers (PBDE), subject to certain exemptions and
limitations as outlined in the RoHS directive.
Without limiting the generality of the preceding statement, we wish to stress
that use of lead in solders in network infrastructure equipment has been
exempted by the RoHS directive and may be found in certain ECI products.
All equipment delivered to locations within the EU complies with the
requirements of the RoHS Europe directive. Similarly, ECI equipment is
compliant with the RoHS California directive and RoHS Chinese directive
where relevant. All ECI equipment included in the Electronic Information
Products (EIP) category includes a table of Toxic and Hazardous Substances
and Elements, verifying hazardous substance levels in accordance with the
RoHS China directive. Equipment documentation includes the appropriate
Environmental Protection Use Period (EPUP) lifespan symbol indicating the
point in time when the equipment may be expected to enter the recycling
system. The following are examples of these pollution control symbols.
Figure 1-7: Pollution control logos
NOTE: The number in Logo 2 is for illustrative purposes
only. When in actual use, the number indicates the

corresponding environmental protection use period of the
product.
1-32
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Safety Guidelines
ECI adheres to the Waste Electrical and Electronic equipment (WEEE)

directive requiring that all new products introduced into the EU market be
labeled with the crossed-out wheeled bin recycling symbol defined by
CENELEC standard EN 50419 and accepted by the member states. Note that
specific WEEE procedures may differ from state to state, depending on the
local implementation of the WEEE requirements.
Figure 1-8: WEEE recycling symbol
Do not dispose of ECI equipment and accessories together with standard

household waste. Check with ECI technical support for information about
product disposal, including recycling and reuse. For more information about
ECI's environmental, healths, and safety policy, see the quality policy pages on
the ECI website. (Environmental, Health, and Safety Policy
http://www.ecitele.com/AboutECI/Quality/Pages/EnvironmentalHealthSafetyP
olicy.aspx)
For any further information regarding ECI's environmental and safety policies,
please contact technical support.
WARNING: The ultimate disposal of this product should be handled
according to national laws and regulations.
ADVARSEL: Endelig bortskaffelse af dette produkt skal ske i

overensstemmelse med nationale love og regler.
WAARSCHUWING: Dit product dient overeenkomstig de nationale
wetgeving en voorschriften te worden weggegooid.
VAROITUS: Tmn tuotteen lopullinen hvittminen tulee tehd
kansallisten lakien ja asetusten mukaisesti.
ATTENTION: La mise au rebut de ce produit devrait se faire

conformment aux lois et rglementations de chaque pays.
WARNUNG: Entsorgen Sie dieses Produkt entsprechend den geltenden

Gesetzen und Vorschriften.
AVVERTENZA: L'utilizzo di questo prodotto deve essere conforme

alle leggi e alle normative nazionali.
AVISO: A destruio final deste produto deve ser feita de acordo com
as leis e regulamentos nacionais.
ADVERTENCIA: Este producto debe utilizarse de acuerdo a las
normas y leyes nacionales.
VARNING: Slutlig kassering av denna produkt br hanteras enligt

nationella lagar och riktlinjer.
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2
Introduction to the XDM
Platform
In this chapter:
Overview ......................................................................................................... 2-1
XDM Product Lines......................................................................................... 2-2
Features and Functions .................................................................................... 2-3
Implementation Principles ............................................................................... 2-4
Cards and Modules .......................................................................................... 2-5
XDM-500 ........................................................................................................ 2-7
Overview
ECI's XDM is a family of next-generation converged optical networking
platforms that integrate all the transport functions of a complete Point of
Presence (POP) in a single shelf-size element. The XDM easily accommodates
the growing demand for bandwidth mainly driven by emerging data
applications, while maintaining the compatibility and the enhanced flexibility
needed to transport all types of traffic, including voice, ATM, Ethernet, IP, and
data.
Advances in access equipment bring increased bandwidth to the service-centric
customer, and regional networks are fleshing out capacity with Wavelength
Division Multiplexing (WDM). Connectivity has therefore become the
bottleneck in service provisioning.
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Maintenance Manual
The new XDM concept combines the wealth of bandwidth offered by WDM;
the manageability, fast protection, and restoration times of Time Division
Multiplexing (TDM); the enhanced connectivity and availability of cross
connects (DXC); and the efficient transport of Ethernet, IP, and ATM traffic.
Moreover, it provides an ideal platform for migration from ring to mesh
networks. These capabilities result in a single powerful, flexible, and highly
intelligent platform, with unparalleled basic functionality.
XDM platforms are equipped with high capacity nonblocking matrixes that
enable operators to build extremely flexible and transparent optical networks.
XDM Product Lines

The XDM product lines provide a comprehensive selection of platforms that
address all your networking needs, for all ranges of size, configuration, and
service level requirements. XDM platforms are organized into two groups:
XDM-100 product line, All-Native multiservice packet optical transport

system for metro aggregation and metro networks:
XDM-300: Compact high-capacity All-Native Packet-OTS for metro

aggregation
XDM-900: Compact high-capacity All-Native Packet-OTS for the
metro
XDM-1000 product line, All-Native multiservice packet optical transport

system for metro and metro-core networks:
XDM-40: WDM OTN for metro-access and inline amplifiers
XDM-450: ROADM extension shelf
XDM-500: Compact All-Native Packet-OTS for the metro
2-2
XDM-100: Compact All-Native Packet-OTS for metro aggregation
XDM-1000: All-Native all-range Packet-OTS for metro and

regional/long-haul networks
XDM-2000: Compact high-capacity All-Native Packet-OTS for the
metro
XDM-3000: High-capacity All-Native Packet-OTS for the metro and
metro-core
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Features and Functions

XDM shelves support a multitude of features for today's bandwidth-hungry
networks, including:
Transparent support of transmission channels for SDH, PDH, ATM, Fast

Ethernet, Gigabit Ethernet (GbE), MPLS, IP, SAN (FC, FICON, ESCON),
digital video, and more.
Supporting any service; VPWS, VPLS, IPTV MPLS multicast, 3G mobile

backhaul, bandwidth services, and Ethernet leased lines.
Transport of Ethernet traffic and support of Ethernet services over SDH.
Wavelength services for all bandwidth demands
Add and drop of any signal (SDH, PDH, data, wavelength) at any node
using a single shelf.
10 Gbps Add/Drop Multiplexer (ADM) service on a double card for GbE,

1GFC, 2GFC, OTU1, and STM-16 services. ADM on a Card (AoC)
benefits include the ability to route client signals to different locations
along the optical ring, as well as per-service selectable protection and
drop-and-continue features. The AoC can also be used as a multi-rate
combiner up to OTU2. The AoC combines the cost efficiency of an optical
platform with the granularity and flexibility previously available only in
SDH networks.
Up to 240 Gbps capacity with 10 Gbps per slot.
ATM capabilities for 3G access networks.
High Order (HO) and Low Order (LO) transmission paths available for
both high-order and low-order subnetworks, with a high-capacity matrix
that maintains LO connectivity.
Comprehensive MPLS Carrier Ethernet capabilities, including use of

MPLS technology to carry Ethernet services across the network metro and
core.
HO transmission paths for IP networks (for example, LAN-to-LAN

connectivity at the GbE-to-GbE level).
HO transmission paths for ATM networks.
GbE Layer 2 encryption for Ethernet traffic.
Multireach, for metro, regional, and national applications spanning up to

2000 km without electrical regeneration.
Flexible wavelength transport, with multidegree Reconfigurable Optical

Add/Drop Multiplexer (ROADM) capabilities that enable operators to
build a flexible and forecast-tolerant backbone.
Supporting cost-effective access CWDM applications and core networks of

up to 40/80 channels.
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Transport of Ethernet traffic over WDM.
Subrate traffic aggregation over optical cards.
Channel by channel, non-traffic-affecting upgrade, starting from a single

channel.
Full compliance with applicable ITU-T and Telcordia standards for optical
equipment and safety standards.
ASON architecture and GMPLS protocols that enable efficient planning

and intelligent optical network operation to greatly reduce CAPEX and
OPEX.
Extremely powerful management that renders the system easy to control,

monitor, and maintain.
Implementation Principles
The XDM platforms have a fully modular design based on a redundant routing
core implemented as a proprietary cross-connect matrix surrounded by I/O
ports located on plug-in I/O cards. The function of the I/O cards is to provide
interfaces to the various types of signals that can be transported by the
platforms. Internally, all the I/O cards exchange information with the routing
core using a proprietary format that does not depend on the characteristics of
the external interfaces.
The use of a single proprietary format for all the information flowing through
the XDM results in a highly flexible system that supports a wide range of
applications and can easily be expanded to suit virtually any customer need.
Moreover, support for new signal formats can be added simply by developing
new I/O cards. This protects customer investment in the XDM platform against
obsolescence, and ensures cost-effective upgrade paths.
The XDM platforms consist of the following main subsystems:
2-4
Traffic processing
Control and communication
Timing and synchronization
Routing core
Power feed
Cooling
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All the subsystems are modular and implemented as plug-in cards. Except for
the traffic interfaces, all the subsystems are fully redundant and/or are
implemented as distributed functions with no single point of failure, thereby
ensuring the high availability needed to meet the stringent requirements of
telecom operators.
Moreover, XDM platforms are designed to permit live insertion and hot
swapping of cards and modules, and their software can be downloaded from a
remote location. In addition to maintenance efficiency, these characteristics
enable non-traffic-affecting in-service upgrading and expansion of system
capabilities.
Cards and Modules

XDM shelves achieve unparalleled functionality and cost-effectiveness with an
assortment of cards and modules carefully designed for virtually every
application:
PDH I/O (PIO) cards: 2 Mbps, 34 Mbps, 45 Mbps.
SDH I/O (SIO) cards: STM-1e, STM-1o, STM-4, STM-16, STM-64.
MPLS and Ethernet cards: Data I/O (DIO and DIOB) cards for Layer 1
Ethernet (GbE/FE) services; Ethernet Interface Switch (EIS) cards for
Layer 2 Ethernet services; and MPLS Carrier-Class Switch (MCS) cards
for full MPLS as well as Carrier Ethernet services.
ATM Traffic Switch (ATS) cards for direct processing of ATM traffic,
addressing the requirements of 3G cellular networks. The ATS is a singleslot card that concentrates Node B traffic into VC-4s or large Inverse
Multiplexing over ATM (IMA) groups.
Optical (TRP and CMBR) cards: 10 GbE LAN, GbE, STM-256, STM-64,
STM-16, OTU1, OTU2, OTU3, 1G, 2G, 10G Fiber Channel, any rate.
Optical (OFA and ROADM) cards: metro and regional/long-haul amplifiers

as well as Raman amplifiers, multidegree WSS and PLC ROADMs,
Mux/DeMuxes, and OADMs.
Optical accessories: a wide range of accessories (including splitters,

couplers, splitter and coupler combination modules, variable optical
attenuators, auxiliary cards, and filters) available either as compact
standalone components or in a physical form that matches the physical
form of other XDM components.
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Aurora-G cards provide Layer 2 encryption for Ethernet traffic at a GbE

rate through a single encryption port, thereby replacing expensive
standalone encryption units.
ASON Control Plane cards implement ASON architecture and GMPLS

protocols that help carriers reduce CAPEX and OPEX by enabling efficient
optical network planning and operation, with automatic discovery and
distributed dynamic routing capabilities that enable rapid cost-effective
addition of new nodes and additional bandwidth.
For an introduction to XDM card and module functionality, see System

Architecture.
NOTE: The information in this book includes cards,
components, and modules that are at an EOL stage and no

longer marketed commercially. However, due to their high
quality, durability, reliability, and utility, some of these
components are still in use.
ECI continues to provide technical support when necessary.
As a result, we are leaving technical information about these
components in the reference documentation for the
convenience of users still working with these components.
2-6
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XDM-500
The XDM-500 is a compact multiservice Packet-OTS with integrated all-range
WSS ROADM, for high capacity aggregation of TDM and Ethernet/MPLS
services over optical infrastructure in metro and regional networks. The
XDM-500 is optimized for the metro-edge, where it collects multiple services
and delivers them to the COs and POPs in the core. The XDM-500 provides
traditional broadband services as well as sophisticated optical capabilities such
as multidegree ROADM technology and highly advanced data services such as
adaptive rate GbE, sophisticated Layer 2 Ethernet, and Packet over SDH (PoS).
It can be used either as a simple ADM or as a multi-ADM/TM for distributed
ring cross connectivity.
Figure 2-1: XDM-500 platform
The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide, and
725 mm high equipment cage. Platform components are arranged as follows:
Six slots (IC1 to IC6) flexibly allocated to I/O cards and/or transponders
(depending on the configuration)
Four slots (MC1 to MC4) allocated to electric interface connection modules

or DWDM/OADM modules
Two slots (X1 and X2) allocated to the HLXC or XIO matrix cards
Two slots (C1 and C2) allocated to the xMCP cards
One slot (C3) allocated to the MECP card, for connecting the OHA and
OW interfaces to the active xMCP card
Two xINFs designed for power supply redundancy
Three xFCUs to support cooling system redundancy
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The XDM-500 standard card layout is illustrated in the following figure.
Figure 2-2: XDM-500 slot allocation
Typical power consumption for the XDM-500 is 720 W.
2-8
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3
XDM-500 Installation
Overview
In this chapter:
Overview ......................................................................................................... 3-1
Preliminary Preparations ................................................................................. 3-2
Stages of a Typical Installation ....................................................................... 3-3
Outline of Installation Procedure ..................................................................... 3-5
Overview
The following sections provide general instructions for the installation of the
XDM-500 and auxiliary equipment.
The procedures for equipment replacement and upgrades are similar to those
described for installation of the equipment. When relevant, notes regarding live
replacement or upgrade are inserted in the installation procedure descriptions.
This manual contains important information that will help you carry out a safe
and trouble-free installation, including:
Safety guidelines
Protection against electrostatic discharge
Environmental, physical, and power requirements
Specific tools and test equipment for XDM equipment installation
Information regarding cable preparation
Outline of the main steps needed to install XDM equipment
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The information appearing in these sections should be used in conjunction with

specific site installation plans in the particular customer network. If you are
interested in obtaining design or installation assistance from the ECI Customer
Support team, or wish to prepare a network installation plan, contact your ECI
sales representative.
The XDM-500 platform, cards, modules, and ancillary equipment are described
in the XDM-1000 Product Line Reference Manual.
Preliminary Preparations
The installation procedures provided here assume that:
All technical personnel have read, understood, and are complying with the
safety guidelines in Before You Start/Safety Guidelines (page 1-1).
The sites in which the installation procedures are carried out comply with
the requirements listed in Site Preparation and Rack Installation (page 4-1).
The required preparations have been completed, including:
Selection of specific locations for each rack
Availability of grounding and power sources at the selected locations
Preparation and routing of cables under customer responsibility
Routing of traffic cables to the rack locations
Before you start, determine what equipment is to be installed in the rack by

referring to the site installation plan, and note the exact position of each unit.
To avoid errors, it is recommended that you mark the prescribed positions on
the rack rails using a soft pencil.
3-2
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Stages of a Typical Installation

The installation of XDM equipment at a typical network site comprises the
following general stages, listed in the required order of execution:
1. Unpacking and visual inspection (page 4-9)
2. Installing equipment racks (page 4-37)
3. Installing ancillary units in racks (page 4-44), including xRAP component
and heat buffers
4. XDM-500 platform installation (page 5-1)
5. Card and module installation (page 6-1) in XDM-500 platforms
Each component of the XDM-500 system is supplied separately and must be
installed in the correct sequence, according to the site plan.
The equipment illustrated in the following figure (using the the XDM-1000)
are components that might be used in a typical high-density installation. The
installation steps are described following the figure.
TIP:
If you are not installing an FST for a particular XDM-500

platform, it is recommended that you leave empty space in
the rack in case optical modules are added to the platform
in the future.
CAUTION:
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If additional equipment is used in the rack, a heat buffer or

a buffer plate must be installed between any such
additional equipment and the XDM-500 platform to
minimize the transfer of heat from platform to platform.
This heat buffer must be purchased from ECI.
During the installation of equipment in the rack, make
sure all the optical connectors are closed by protective
caps. Do not remove the cap until an optical fiber is
connected to the corresponding connector.
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Additional rack installation options are illustrated in Installing Equipment

Racks (page 4-37).
Figure 3-1: A typical XDM-1000 product line installation components
3-4
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Outline of Installation Procedure

The main steps to install XDM equipment at a typical network site are:
1. Prepare the installation site and check the physical location, environmental
compliance, and availability of power sources (see "Site Preparation" page
4-1).
2. Prepare and route power, alarm, management and transmission cables at the
installation site (see "Cable and Fiber Preparation" page 4-23).
3. Install the equipment racks in accordance with the site installation plans
(see "Installing Equipment Racks" page 4-37).
4. In each rack, install the power distribution and alarm panels (xRAP) and
other equipment needed, in accordance with the site installation plans (see
"Installing Ancillary Units in Racks" page 4-44).
5. Install the XDM platforms in the appropriate racks in accordance with the
site installation plans (see "XDM-500 Platform Installation" page 5-1).
6. Install the air filter units in the XDM shelves (see "Installing Air Filters"
page 5-6).
7. Install the cards and modules in each XDM platform, in accordance with
the rack installation plans (see "Card and Module Installation" page 6-1).
Card installation may include any of the following cards and modules,
depending on the site installation plan:
Installing common cards, including xMCP, MECP, XIO, and/or HLXC

cards (see "Card and Module Installation" page 6-1).
Installing Aurora-G Cards (page 6-79).
Installing I/O Cards and Modules (page 6-90).
Installing a Card in the CCP Cage (page 6-92).
8. Route the optical fibers among the connectors of the equipment installed in
each rack, in accordance with the site installation plans (see "Optical Fiber
and Cable Installation and Routing" page 7-1).
9. Connect coaxial and multipair cables to the electrical interface modules of
each XDM shelf installed in the rack, in accordance with the rack
installation plans (see "Connecting Traffic Cables to Electrical Interfaces"
page 7-17).
10. Connect management cables between the equipment installed in the racks
and the management station, in accordance with the site installation plans
(see "Connecting Management Cables" page 7-22).
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11. Connect power and alarm monitoring cables from the rack power
distribution and alarm panels to each equipment unit installed in the rack, in
accordance with the rack installation plans.
12. Connect power, alarm, and traffic cables to the new equipment racks, in
accordance with the site operational procedures.
13. Mount the door or doors on the XDM platform, and close it (see also Deep
doors vs. standard doors (page 4-3)). Note that this step only applies to
closed-cabinet installations, and may not be relevant at your site.
14. Perform power-on and initialization procedures.
15. Complete any relevant commissioning tests (page 8-1).
16. Install the LCT-XDM and element management station (EMS-XDM) and
configure the equipment. For more information, refer to the EMS-XDM
User Manual and the LCT-XDM User Manual.
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4
Site Preparation and Rack
Installation
In this chapter:
Overview ......................................................................................................... 4-1
Tools and Test Equipment ............................................................................... 4-8
Unpacking and Visual Inspection .................................................................... 4-9
XDM Rack Installation Options .................................................................... 4-10
Cable and Fiber Preparation .......................................................................... 4-23
Installing Equipment Racks ........................................................................... 4-37
Installing Ancillary Units in Racks ............................................................... 4-44
Overview
The following sections describe the conditions required for installing the
equipment at the site, including site preparation, power sources, rack
installation, preparing cables and fibers, installing ancillary units and more.
Site Preparation
Perform a preliminary survey of the installation site, taking into consideration
the following issues:
System environmental requirements
Physical location of the XDM equipment
Location of power sources
Types of interfaces used at the site (optical, electrical, management, alarm

monitoring, and so on)
Work and equipment safety requirements
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Environmental Requirements
The following environmental conditions are applicable to XDM equipment and
must be provided at the installation site.
Table 4-1:
Environmental requirements
Parameter
Compliance requirements
Electromagnetic interference
FTZ 1TR9, EN 55022-2/2003, EN 50082-1/97
Temperature
ETSI ETS 300-19-2-3 Test Spec. T3.1
Main Equipment Dimensions

The following table summarizes the dimensions and space requirements of the
XDM-500 and associated components.
Table 4-2:
4-2
Main equipment dimensions
Equipment type
Height
(mm)
Width
(mm)
Depth
(mm)
Max. weight
(kg)
XDM-500
725
450
285
60
xRAP-100
133
445
185
10
miniRAP
90
445
150
2.8
xRAP-B (EOL)/ xRAP-D
133
445
185
9.5
xRAP-HP (EOL)
125
450
120
10
FST
44.5
440
240
Heat buffer
70
437
285
Cable guide
100
450
80
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Deep Doors vs. Standard Doors

Two door options are available for the XDM platforms, standard doors and
deep doors. These two options are described in this section.
Starting from V5, expanded DWDM support entails use of an attenuator in
combination with certain optical modules. This combination utilizes more
space. For facilities working with closed-door cabinets, this combination leaves
less space available between the edge of the component and the internal side of
the door. The resulting mechanical interference may cause the door to press
onto the fibers and cause physical damage to equipment.
The current XDM platform door is affected in the following ways when new
optical modules are installed:
1. It is not possible to use boots with regular length (28 mm) on the patch
cords.
2. It is not possible to use short boots (19 mm) on the patch cords when
optical attenuators are installed directly on the XDM base card connectors.
3. Patch cords with regular boot length may not comply with the standard
bending angle of the fiber.
The only way to prevent mechanical interference is not to close the cabinet
door, an option that, in most cases, is not acceptable.
A deep door (illustrated in the following figure) protruding 22.3 mm beyond
the current door is offered by ECI. This solution can be supplemented by the
use of patch cords with the short boot.
Figure 4-1: Deep vs. standard door
However, the new design does not comply with ETSI rack standards as it
bulges beyond the depth allowed for equipment in ETSI racks. This prevents
the user from closing the rack door. In addition, the new design presents
thermal restrictions because airflow is less effective. It is thus less
recommended at sites with heavy power consumption.
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Door selection may require a trade-off, as presented in the following table. In

order to decide, check your specific system configuration against the table.
Choose the type of door best suited to your local installation configuration. Be
sure to note the appropriate door type when you complete your order. Specify
in your order if you wish a standard size door or a deep door.
Table 4-3:
4-4
Comparison deep vs. standard door
Type of
interface
Short boot
sufficient to
close
standard
XDM door
Compliance
with
standard
bending
angle
Deep door required

when using the
regular boot
without attenuators
on XDM cards
Deep door
required with
attenuators
on XDM cards
SDH card for

STM-1 with
SFP
Yes
Yes (with
short boot)
Yes
Yes (with
short boot)
SDH card for

STM-4 with
SFP
Yes
Yes (with
short boot)
Yes
Yes (with
short boot)
SDH card for

STM-16 with
SFP
No
Yes
No
Yes (with long

boot)
Combiners
Yes
Yes (with
short boot)
Yes
Yes (with
short boot)
Transponders
Yes
Yes (with
short boot)
Yes
Yes (with
short boot)
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Door Installation
For greater convenience, XDM platforms are shipped without any doors
attached. Doors of the appropriate type as selected in the site specifications are
packaged separately from the basic platform, and attached on site during
platform installation.
To install a platform door:
1. Lift the door and hold it carefully in front of the platform.
2. Align the holes on the hinge side of the door with the hinge posts on the
side of the platform.
3. Gently slide the door into place, with the hinge posts fitting smoothly into
the door holes.
4. The door should swing open and close easily.
To remove a platform door, simply open the door and lift the door gently from
the hinge posts.
The XDM-3000 platform is designed with two doors, one for the upper half of
the platform and one for the lower half. This design ensures that the door size
and weight is manageable when installing or removing a door, even though the
XDM-3000 platform is larger than the other platforms in the XDM product
line. When installing a new XDM-3000 platform, simply repeat the door
installation procedure for both platform doors.
Physical Location
WARNING: XDM platforms are intended for installation
only in restricted access areas.
Choose the physical location of the XDM equipment, taking the following
aspects into consideration:
Plan of equipment installation.
Required floor loading capacity of 200 kg/440 lb minimum.
Routing requirements for grounding, power, alarm monitoring,

management, coaxial, multipair, and fiber-optic cables. To ensure
convenient access to cables, whenever possible, it is recommended to use
overhead cable ladders to bring cables to the top of each rack.
When a network management station, for example, an EMS-XDM, is

installed on the site, consider the method of connection to the local network
management station and the maximum allowed distance.
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Power Consumption Data

XDM equipment must be powered only by DC sources in compliance with the
applicable sections of ETSI 300 132-2 and FTZ 19PFL1, and the SELV
requirements of EN 60950-1. The nominal supply voltage is -48 VDC (positive
lead grounded); the allowed supply voltage range is -40 VDC to -72 VDC. For
redundancy, two separate DC power sources should be available.
NOTE: If the input power connected to one of the xINFs
exceeds -72 VDC, all xINFs are shut down and the platform
is switched off.
The following table lists the maximum allowed power consumption data for the
XDM-500 platforms, the required xRAP type, and the supply line protection
circuit breaker.
Table 4-4:
Maximum power consumption data
Shelf type
Maximum power RAP type
FCU
Circuit breaker
XDM-500
950 W
Regular or HP
30A
HP, B, or D
The actual power consumption for each shelf is limited by the client power
infrastructure. Limiting factors may include the client power supply capacity,
circuit breaker size, and type of backplane, xRAP, FCU, and INF.
Beginning with V7.2, platform power supply limitations are enforced by the
EMS-XDM management software to protect against over-demand. Upper
bound limits for maximum platform power usage are defined through the
management configuration variables and enforced through software protection.
The preceding table lists maximum power consumption settings, based on a
typical combination of XDM-500 component types. The actual maximum
power limitation for each specific installation is calculated as follows:
1. The EMS-XDM identifies the backplane, xRAP, FCU, and INF type
automatically.
2. The circuit breaker size must be manually identified for the EMS-XDM by
a system administrator (by setting a configuration variable). By default,
circuit breakers for the XDM-500 are assumed to be 25A unless
explicitly defined otherwise. The software by default limits the maximum
XDM-500 shelf power consumption to 950 W.
3. The EMS-XDM calculates a tentative maximum platform power
capacity value for this platform, based on the backplane, xRAP, FCU, INF,
and circuit breaker information.
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4. The client's maximum input power capacity is calculated, based on the

client's power supply and circuit breakers.
5. A final value for the maximum power usage to be allowed by the
EMS-XDM is determined, using the lower of the two power capacity
values defined in Steps 3 and 4 (the tentative maximum platform power
capacity and the client's maximum input power capacity).
For more information, see the EMS-XDM User Guide.
NOTEs:
1. When a single shelf is installed in the rack, a miniRAP equipped
with the appropriate circuit breakers can also be used.
2. An xRAP-100 equipped with the appropriate circuit breakers can be
used instead of a regular xRAP-HP, xRAP-D, or xRAP-B.
3. A comprehensive table listing the power requirements of the main
equipment components is provided in the System Specifications.
Use this table to determine the expected power requirements of the
equipment installed in the shelf. If the planned power consumption
of the equipment installed in the shelf is 80% or more of the
maximum listed value, it is recommended to consult ECI's Transport
Networking Division Customer Support team.
4. An xFCU-HP is required when working with SIO1&4B, SIO164,
DIOB, or MCS5/MCS10 cards.
The XDM Element Management (EMS-XDM) station and the test equipment
are powered from an AC source; their nominal supply voltage may range from
100-230 VAC, 50/60 Hz.
Typical power consumption for the XDM-500 is 720 W. Typical power
dissipation of the XDM-500 shelf is 2460 Btu/hr.
Power consumption can range up to a maximum of 950 W, depending on the
installed components and platform configuration, as explained in this section.
Maximum power dissipation of the XDM-500 shelf is 3240 Btu/hr.
For more information about power consumption requirements, please refer to
the XDM System Specifications. Power consumption is monitored through the
management software.
WARNING: When replacing circuit breakers, observe the following
precautions:
For continued protection against risk of fire, replace only with a
circuit breaker of the same type and rating.
Disconnect power before changing a circuit breaker.
ATTENTION: Pour ne pas compromettre la protection contre les
risques dincendie, remplacer par un fusible de mme type et de mmes

caractristiques nominales.
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Tools and Test Equipment

No special purpose tools beyond a standard technician toolbox and those
described in the following sections are required for the installation of XDM
equipment.
Tools for Traffic Cable Assembly

Since traffic cables can be prepared on site, suitable tools kits should be
available. Make sure to include the following tools:
Tools for coaxial cables type NCX1 (typically include cable stripper, nipper
(cutter for center contact), and die)
Tools for the assembly of DIN 1.0/2.3 coaxial connectors on coaxial cables
(typically include cable stripper, center contact crimp tool (blue), and crimp
tool for outer contact)
Tools for the preparation of optical patch cords (including fiber splicing
and optical connector attachment)
Suitable tools are available from various manufacturers. If necessary, contact

ECI Customer Support Team.
Cleaning Optical Connectors

When handling optical fibers, clean the optical connectors using the standard
cleaning kits recommended by the optical connector manufacturers.
Extractor Tool for Optical Connectors

A special extractor tool is provided with each XDM platform to help you
disengage LC and SC optical plugs from the mating connectors in the various
cards where the connectors cannot conveniently be reached by hand. The
extractor tool is placed in a special holder, located in the external left-hand wall
of the XDM platform.
This tool has the general appearance of a pair of tweezers, with the tip of one of
its legs bent inwards.
4-8
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Unpacking and Visual Inspection

Before you start:
Before unpacking, make a preliminary inspection of the shipping boxes.
Evidence of damage should be noted and reported immediately to the carrier,
the project manager, and/or your local ECI representative.
CAUTION - STATIC SENSITIVE DEVICES
PROPER HANDLING AND GROUNDING PRECAUTIONS
REQUIRED
XDM equipment contains components sensitive to
electrostatic discharge (ESD). To prevent ESD damage,
strictly observe all the precautions listed in Protection Against
Electrostatic Discharge (page 1-26). Keep parts and cards in
their antistatic packaging material until you are ready to
install them.
The use of an antistatic wrist strap connected to a grounded
equipment frame or rack is recommended when handling
cards and modules during installation, removal, or connection
to internal connectors.
Unpack the equipment on a clean flat surface.

To unpack the equipment:
1. Place the shipping boxes with the top upwards. Cut the sealing tape using a
short knife so as not to damage the internal items, and then open the top
flaps.
2. Remove the items contained in the box, and inspect each one for damage.
Check for loose parts or any visual damage to the rack, platform, and
auxiliary equipment. Also check the integrity of all the connectors, leads,
and cables.
NOTE: Do not remove plastic covers from optical connectors
until the optical fibers are connected to them.
3. Search the shipping boxes for any additional small items that may be
present.
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4. Open each of the card packages (shipped separately from the XDM
platforms in which they will be installed) for inspection, but do not remove
the cards.
To protect the cards against possible damage, keep the cards in their
protective package until they can be inserted in the platform.
5. Check the contents of the shipping boxes against the packing list attached
to each box. If you detect any damaged or missing parts, notify the project
manager and/or your local ECI representative.
XDM Rack Installation Options

XDM platforms can be installed in the following rack types:
ECI's recommended enhanced ETSI optical racks (hereafter referred to as

the optical rack), or the improved ETSI racks (hereafter referred to as
ETSI A). These racks have been specially adapted by ECI and are tailored
to meet platform requirements and simplify platform installation and
maintenance, including the following benefits:
4-10
Removable rear and side panels for tidy routing and efficient
maintenance of all rack cables, including:
Control cables
Power cables
Data cables (where relevant)
Two channels on the racks front rails for routing up to 400 (ETSI A) or
800 (optical rack) optical fibers.
Open frame top and bottom for easy routing of cables from suspension
floors and/or ceiling ladders.
Perforated door for free air flow to the installed equipment (see
Environmental Requirements (page 4-2)).
Front door for left or right opening mounting.
Standard ETSI racks (hereafter referred to as ETSI B).

ISO 19 racks and standard US racks. These racks should be used only in
consultation with and when approved by ECI's Mechanical Department.
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XDM racks options are summarized in the following table.

Table 4-5:
Equipment rack data
Type
Height
Width
Depth
Available space
Optical Rack
2200 mm
600 mm
300 mm
47U (2100 mm)
ETSI A
2200 mm
600 mm
300 mm
46U (2050 mm)
ETSI A
2600 mm
600 mm
300 mm
55U (2450 mm)
ETSI B
2200 mm
600 mm
300 mm
46U (2050 mm)
ETSI B
2600 mm
600 mm
300 mm
55U (2450 mm)
US
7 ft
(2134 mm)
23 in.
(585 mm)
12 in.
(305 mm)
44U
(6.5 ft/1960 mm)
US
7 ft
(2134 mm)
19 in.
(483 mm)
12 in.
(305 mm)
44U
(6.5 ft/1960 mm)
ISO 19
7.25 ft
(2200 mm)
24 in.
(600 mm)
24 in.
(600 mm)
47U
(6.85 ft/2089 mm)
The loading of a fully equipped rack is 7.35 kn/m2, or 55.35 kn/ft.2.

NOTES:
Not all XDM platforms can be installed in all types of

racks. This section includes a general list of the rack
options available. The installation instructions for each
platform include a list of the racks appropriate for that
platform.
The installation instructions in this manual are written on
the basis of an installation using an ECI enhanced rack.
Some of these instructions may not be relevant if you are
using a standard rack supplied by other vendors.
Before any installation plan can be completed, a site
survey by ECI technical support team is required, to
verify rack accessibility and accessory compatibility at that
site. If you are working with standard racks from other
vendors, the site survey is also essential to determine what
changes are required to adapt the rack to XDM platform
installation requirements.
All ECI XDM equipment racks may be installed on wooden, concrete, or

suspended floors, or suspended from overhead mountings. Some of these
installation options are described in Installing Equipment Racks (page 4-37). If
your facility uses a different installation paradigm, contact the ECI Technical
Support team for additional information.
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Rack Space Requirements

The following table summarizes the dimensions and space requirements of the
XDM-1000 product line and its associated components.
Table 4-6:
Rack space requirements
Equipment type
Height (U)
Height (mm/in.)
XDM-40
256/10.1
XDM-450
8.5
374/14.72
XDM-500
18
800/31.5
XDM-1000
26
1100/43.3
XDM-2000
19
845/33.3
XDM-3000
35
1550/61
PRAP
133/5.25
xRAP-B/D
133/5.25
xRAP-HP
2.8
125/4.92
xRAP-100
133/5.25
miniRAP
90/3.5
Spooler
2.8
125/4.92
FST
44.5/1.75
Fiber optic guide
90/3.5
Heat buffer
70/2.7
Cable guide
120/4.7
In addition, make sure at least 1U (approximately 50 mm or 2 in.) free space is

left between the bottom of the last unit installed in the rack and the rack floor.
NOTE: The miniRAP is not used with XDM-1000 and
XDM-2000 shelves.
XDM systems can be installed in any of the racks listed in XDM Rack
Installation Options (page 4-10).
4-12
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Optical Rack
ECI offers a special optical rack designed to accommodate the potentially large
number of fiber cables that may be required for the installation of XDM
equipment. An added advantage of the optical rack is easy access to all the
components and cables during installation, maintenance, and when adding new
cards and modules. The following figure shows a general view of an optical
rack.
Figure 4-2: Optical rack components
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The rack has two side covers that cover the two cable conduits. These covers
are normally installed when using standalone racks or when the rack is the end
unit in a group. When two racks are installed side by side, the covers are
removed.
NOTE: When necessary, the rear cover of the rack can also
be removed.
In addition to the wide cable conduits, two easily accessible fiber channels are
located at the rack sides in front of the conduits.
ETSI A Rack
ECI offers a special ETSI rack with improved cable routing features. The
following figure shows a general view of a standalone rack with its door
closed.
NOTE: The rack is normally supplied with the door opening
to the right. However, when necessary, the opening direction

can be changed in the field. Contact ECI's Customer Support
for field modification instructions.
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An added advantage of the type A ETSI rack is easy closure of the rack door
even when the XDM shelf is equipped with an extended door (the extended
door occupies 22.3 mm more than the standard door - see Deep doors vs.
standard doors (page 4-3)). The only requirement is to ensure that the extended
door is not located directly behind the door lock (it can be higher or lower than
the lock).
Figure 4-3: Type A ETSI rack general view
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The following figure shows the same rack with the door open.
Figure 4-4: Type A ETSI rack internal view
The rack has two side covers that cover the two cable conduits at the rack sides.
These covers are normally installed when using standalone racks or when the
rack is the end unit in a group. When two racks are installed side by side, the
covers are normally removed.
NOTE: When necessary, the rear cover of the rack can also
be removed.
4-16
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In addition to the wide cable conduits, two fiber conduits are located at the rack
sides before the cable conduits. To protect fibers that have to cross from one
rack side to the other, two additional fiber conduits (the upper and lower
conduits) are provided.
The side fiber conduits can easily be reached. The front side of the right
conduit is exposed when the door is opened, and the left conduit is exposed
when the side panel is opened. (To open the side panel, turn the release handles
on the upper and lower fiber conduits.)
Environmental Considerations
Observe the following guidelines when installing the XDM-500 in racks:
1. Free airflow through the rack must be guaranteed at all times.
2. XDM-500 shelves can be installed in open or closed (with door) racks.
When installed in a closed rack, the door must be perforated. An example
of a rack with a perforated door is the ETSI A rack shown in the following
figure.
3. Always install the first XDM-500 platform in the lower part of the rack,
leaving a space of at least 1U from the bottom of the rack.
4. In mixed (horizontal and vertical airflow) equipment installations, always
install the equipment with the horizontal airflow in the lower part of the
rack, and the equipment with the vertical airflow above it.
5. Leave a space of at least 1U between the upper accessory of the XDM-500
and the next platform.
6. Leave as much space as possible between the racks cable supports and the
XDM-500 sidewalls.
7. Always consider the platform airflow requirements when organizing the
cable and fiber routes near the XDM-500 sidewalls.
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Figure 4-5: ETSI A rack closed view
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Considerations for Installing Multiple

Shelves in a Single Rack
The XDM shelf and the associated set of installation accessories do not
completely occupy the space available in a rack. Therefore, additional
equipment may be installed in the remaining rack space, provided that the
following requirements are met:
The additional heat can efficiently be dissipated, and thermal isolation is

provided between the various equipment units installed in the same rack.
For thermal isolation purposes, install a heat buffer (a 70 mm/2.7 in. high
unit) between any two shelves. When more room is available in the rack, a
larger heat buffer (125 mm/5 in. high unit) can be used. If there is not
enough room in the rack, a smaller buffer plate, which occupies only
50 mm (2 in.), can be used instead of a heat buffer.
Suitable arrangements are made for routing the cables connecting to the
equipment units installed in the rack. This aspect is particularly important
in installations handling E1 tributary lines (connected to M2_21 and
M2_84 interface modules), because a single XDM platform can easily
handle hundreds of E1 tributaries.
The following multiple shelf installation options have been evaluated by ECI
for compliance with the requirements listed above:
2600 mm ETSI racks can accommodate at least two XDM shelves within
the XDM-1000 product line. However, to install two XDM-1000 shelves, it
is necessary to install the xRAP using extendable installation rails.
One 2200 mm ETSI rack, or one 7 ft. (2134 mm) rack, can accommodate
two XDM-500 or XDM-2000 shelves. One XDM-1000 shelf and one
XDM-500 or XDM-2000 shelf can also be installed in this type of rack, but
this configuration requires a special version of the xRAP.
You can find typical rack layouts for several equipment configurations in
Typical XDM Installations in Racks (page 4-20). Contact ECI Customer
Support team or your ECI sales representative for help in meeting your specific
installation requirements.
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Typical XDM Installations in Racks

NOTES:
All the layouts shown include an xRAP (xRAP-D,

xRAP-B, xRAP-HP, or xRAP-100). However, a userprovided power distribution panel may also be used
instead of the ECI xRAP unit.
The xRAPs are specifically designed for XDM shelves.
They provide not only the power connection functions, but
also enable connection to the shelf alarm and alarm
monitoring interfaces. Such connections require special
protected interfaces and are only allowed when xRAPs are
used. If necessary, consult the ECI Customer Support
team.
XDM shelves may also be installed in 7 ft. US racks (see
"Rack Space Requirements" page 4-12). A different
installation accessories kit is used for this purpose.
If necessary, contact ECI Customer Support team or your ECI sales

representative for help with your specific installation requirements.
In a typical basic installation, a single XDM shelf (for example, an XDM-500)
is installed in one rack.
4-20
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The following figure shows one XDM-1000 shelf and one XDM-500 shelf
installed in a 2600 mm rack.
Figure 4-6: XDM-1000 and XDM-500 shelves in a 2600 mm rack
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The following figure shows two XDM-500 shelves installed in a 2200 mm

rack.
Figure 4-7: Two XDM-500 shelves in a 2200 mm rack
4-22
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Cable and Fiber Preparation

NOTE: This section provides information for preparing
cables. The necessary cables can also be ordered from ECI.

For details, contact ECI Customer Support team or your ECI
sales representative.
The following main types of cables are required for XDM installations:
Grounding cables (page 4-24)
DC power cables (page 4-28)
Alarm cables (page 4-30)
Management cables (page 4-31)
Timing (clock) cables (page 4-31)
Traffic cables (page 4-32)
DC power and traffic cables should be prepared on site. AC power cables

suitable for connection to the power outlet types specified when placing the
order (according to the site specifications) and the control and alarm cables
used within XDM equipment racks, are included in the shipment with power
outlets provided according to the site specifications.
The following sections provide information to enable you to prepare cables on
site. Refer to Connector Pin Assignments (page B-1) for a description of the
equipment connector types and cable wiring.
WARNING: When preparing cables, in particular power and
grounding cables, use only UL-listed components of the
specified types. Components must also comply with any
applicable national and local safety codes and regulations.
Only qualified trained personnel may be involved in the

preparation of the various cable types. Personnel must use
only approved procedures, in accordance with the applicable
workmanship practice.
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Grounding Cables
WARNING: To prevent possible damage to XDM
equipment, all racks and equipment must be completely

grounded before connecting to the platform any external
devices powered from any DC or any AC source
(100-230 V). All grounding procedures described in
Grounding the Platform (page 5-3) must be completed before,
for example, connecting an external PC to configure and
initialize the NE management system.
Equipment installed in a rack is bonded through the screws used to fasten the
equipment chassis to the frame of the rack, as described in Equipment
Grounding Requirements (page 1-10). Therefore, it is necessary to provide a
reliable low-impedance connection between the rack frame and the site
grounding bus using copper conductors. It is essential that the metal surfaces of
the rack installation elements, including the rack frame, the metal screws, and
the equipment mounting brackets, be completely clean and free of any paint or
any other coating that may impede the grounding connection, to provide
electrical continuity between the equipment and the rack frame. For more
information, see Grounding Requirements (page 1-7).
4-24
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A connection must be made between the rack grounding bar and the site
grounding bar in compliance with UL/ETSI recommendations. For example,
grounding may be completed by means of a copper cable with green/yellow
insulation having the same diameter as the xRAP input power cables or thicker.
A length of appropriate 50 mm2 grounding cable is included with the platform
accessories. Grounding cables are connected using two-hole compression lug
terminals on both ends, securely fastened with flat washers, serrated lock
washers, and nuts or bolts, depending on the connection point.
Figure 4-8: Rack and platform grounding posts on the XDM-1000
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WARNING: The thickness of the protecting grounding cable

must be at least the same thickness as the corresponding
power cable. This means:
The thickness of the rack grounding cable must at least

match the thickness of the xRAP power cable.
The thickness of the platform grounding cable must at least
match the thickness of the power cable from the xRAP to
the platform.
The end of the lead connected to the xRAP used in the rack must be terminated
in a lug suitable for the gauge of the lead in use. Typical grounding cable sizes
are as follows.
For the PRAP, xRAP-D, xRAP-B, and xRAP-HP power supply units,
0 AWG (50 mm2/.078 in.2) or thicker cable
For the xRAP-100 and miniRAP power supply units,

2 AWG (35 mm2/.054 in.2) or thicker cable
To prepare a grounding cable:

1. Route grounding conductors along the shortest possible route.
2. Cut appropriate cable lengths from the roll of grounding cable included
with the platform accessories.
3. Strip about 22 mm of the cable jacket from one end of the cable length.
4. Treat the bare portion of the conductor with antioxidant.
5. Connect a listed two-hole compression lug as follows:
a. Insert all the cable strands into the lug sleeve.
b. Press at two or three different points on the lug sleeve using an
appropriate crimping tool and die. The recommended tools are Panduit
CT-720 crimping tool with CD-720-2 die, Klauke K18 crimping tool
with D50 die, or equivalent.
6. If the lug is not plated, bring it to a bright finish and coat it with antioxidant
before connecting it to the grounding points.
7. Repeat Steps 3 to 6 for each cable lead.
8. Repeat these steps for each ground cable being used.
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WARNING: There must be a connection between the
grounded conductor of the DC power supply circuit and the

equipment grounding conductor. See installation instructions
for more details.
When this connection is made, all the following conditions
must be met:
The equipment is connected directly to the DC supply

system grounding electrode conductor or to a bonding
jumper from a grounding terminal bar/bus to which the
DC supply system grounding electrode is connected.
The equipment is located in the same immediate area
(such as adjacent cabinets) as any other equipment that
has a connection between the grounded conductor of the
same DC supply circuit and the grounding conductor, as
well as the point of grounding of the DC system. The DC
system must not be grounded elsewhere.
The DC supply source is located within the same premises
as this equipment.
There is no switching or disconnecting devices in the
grounded circuit conductor between the DC source and
the point of connection of the grounding electrode
conductor.
WARNING: Cet appareil est conu pour permettre le
raccordement du conducteur reli la terre du circuit

dalimentation c.c. au conducteur de terre de lappareil.
Pour ce raccordement, toutes les conditions suivantes doivent
tre respectes:
417006-2304-0H3-B02
Ce matriel doit tre raccord directement au conducteur

de la prise de terre du circuit dalimentation c.c. ou une
tresse de mise la masse relie une barre omnibus de
terre laquelle est raccorde llectrode de terre du circuit
dalimentation c.c.
Les appareils dont les conducteurs de terre respectifs sont
raccords au conducteur de terre du mme circuit
dalimentation c.c. doivent tre installs proximit les
uns des autres (p.ex., dans des armoires adjacentes) et
proximit de la prise de terre du circuit dalimentation c.c.
Le circuit dalimentation c.c. ne doit comporter aucune
autre prise de terre.
La source dalimentation du circuit c.c. doit tre situe
dans la mme pice que le matriel.
Il ne doit y avoir aucun dispositif de commutation ou de
sectionnement entre le point de raccordement au
conducteur de la source dalimentation c.c. et le point de
raccordement la prise de terre.
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DC Power Cables
NOTE: According to accepted industry standards for
connecting DC power, the positive lead (+48 V) should be

connected with a red cable, and the negative lead (-48 V) with
a black cable. However, according to the BS7671 (GB), and
HD 308 S2:2001 (EU) standards the positive lead (+48 V)
should be connected with a blue cable, and the negative lead
(-48 V) with a gray cable. In the sections that describe DC
power cable connections, use cables with appropriate colors
to comply with the standards in your area of residence.
DC power cables should be prepared on site. Two types of DC power cables

are needed:
Input power cables
Platform input power cables
Input Power Cables

The input power cables are prepared on site. They connect the input power
from the site power distribution subsystem to the DC input terminals of the
rack xRAP unit supplied by ECI, or to the user-provided power distribution
panel, when used instead of an ECI xRAP unit.
NOTE: The generic name xRAP is used when the text is
applicable for any one of the ECI xRAP units (PRAP,

xRAP-D, xRAP-B, xRAP-HP, xRAP-100, or miniRAP).
xRAP input power cables

Redundant sources of input power should be used for each rack, with one main
and one backup power source. Two sets of input power cables are required for
each rack, one for each source. The cables must use copper leads in compliance
with UL/ETSI recommendations. Use a red lead for the positive conductor and
a black lead for the negative conductor. The xRAP cable ends must be
terminated in cable lugs matching the conductor gauge. Input power cable
requirements are as follows.
PRAP, xRAP-D, xRAP-B, and xRAP-HP power supply units require

0 AWG (50 mm2/.078 in.2) or thicker
xRAP-100 and miniRAP, 2 AWG (35 mm2/.054 in.2) or thicker
This gauge ensures that the voltage drop across the rack power cable at full
power consumption does not exceed 2 V, even for cable runs up to 30 meters
(99 feet) connected to an xRAP providing power to two XDM platforms.
4-28
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When an xRAP is used to provide power to a single XDM-40/500/1000/2000

platform with lower power consumption values, lower lead gauges may be
used:
For cable runs not exceeding 20 meters (66 feet), it is sufficient to use
16 mm2 (.025 in.2) copper leads.
For cable runs not exceeding 30 meters (99 feet), it is sufficient to use
25 mm2 (.039 in.2) copper leads.
NOTES:
If necessary, the gauge of the grounding lead can also be

reduced to the gauge of the power leads, that is, 16 mm2
(.025 in.2) for lengths up to 20 meters (66 feet), and
25 mm2 (.039 in.2) for lengths up to 30 meters (99 feet).
The thickness of the protecting grounding cable must be at
least the same thickness as the corresponding power cable.
This means:
The thickness of the rack grounding cable must at
least match the thickness of the xRAP power cable.
The thickness of the platform grounding cable must
at least match the thickness of the power cable from
the xRAP to the platform.
Input power cables for user-provided distribution

panel
The cables used to connect to a user-provided power distribution panel must
have characteristics similar or superior to those specified for connection to an
xRAP.
Platform Power Cables

Use two appropriate cables to connect the input power from the rack xRAP
panel to each POWER IN connector of each platform installed in the rack. Two
cables are required for each platform.
Appropriate cables are available from ECI. The same cables must be used even
when connecting to a user-provided power distribution panel.
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Alarm Cables
When an xRAP unit is installed in the rack, it provides the special interfaces
needed for connecting to the platform alarm interfaces. In this case alarm
indications are carried by the following cables:
Platform alarm indication cable. One alarm indication cable is required

for each XDM platform installed in the rack. Cable length is 2 m/6.6 feet.
Refer to Appendix A for a description of this cable. One end of the cable is
always connected to the ALARM and RAP connectors on the XDM
platform. Connection of the other end depends on the cable type, as
follows:
xRAP-D/xRAP-B alarm cable. Connects to one of the SHELF

connectors on the xRAP-D/xRAP-B.
xRAP-HP alarm cable. The cable end is split into two cables, one of
which connects to one of the xRAP connectors on the xRAP, and the
other to one of the EXTERNAL ALARM/CONTROL connectors on
the xRAP.
xRAP-100 alarm cable. Connects to one of the SHELF connectors on
the xRAP-100.
miniRAP alarm cable. Connects to the SEVERITY IN connector on the
miniRAP.
Client alarms cable. Connects to the client's alarm collecting facility.
External alarm connection cable. One external alarm cable is required for
each rack. This cable carries the alarm indications and monitoring lines of
the rack. One end of the cable is connected to the xRAP, the other end is
open and connects to the client's alarm collecting facility. Three types of
this cable are available:
xRAP-D/xRAP-B bay alarm cable. Connects to the ALARMS

connector on the xRAP-D/xRAP-B.
xRAP-HP bay alarm cable. Connects to the CONTROL
CONNECTION on the xRAP-HP.
xRAP-100 bay alarm cable. Connects to the ALARM IN/OUT
connector on the xRAP-100.
In general, when a user-provided power distribution panel is used, it is not

allowed to connect to the platform alarm interfaces. For further information,
consult with the ECI Customer Support team.
4-30
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Management Cables
The connection of out-of-band management traffic to an XDM platform is
made to the RJ-45 ETHERNET connectors located on the MECP card.
Each ETHERNET connector is wired as a 10BaseT station port:
For direct connection to a port of a 10BaseT Ethernet hub, use one

RJ-45-to-RJ-45 straight cable (cable wired point-to-point).
For connection to the Ethernet port of a PC, use an RJ-45-to-RJ-45

cross-wired cable.
Suitable standard Ethernet station cables are available from many sources.
Category 3 or better cables must be used. In any case, the length of the cables
must not exceed the maximum recommended for the cable type and hub port in
use (up to a few dozens of meters or feet).
Timing (Clock) Cables

Each XDM platform has two timing reference connectors:
The connectors designated T3_1/T4_1 and T3_2/T4_2 are used for

2.048 Mbps signals and have balanced (120 ) G.703 interfaces.
The connectors designated BITS1 IN/OUT and BITS2 IN/OUT are used
for 1.544 Mbps signals and have balanced 100 interfaces.
The cables used to connect to these connectors are prepared on site, using
cables comprising individually shielded twisted pairs (the same type of pairs
needed for connection to the balanced E1 tributary interfaces).
If the site timing reference distribution subsystem has unbalanced (75 ) G.703
interfaces, a 120 /75 adapter can be supplied for mounting on the
T3_1/T4_1 and T3_2/T4_2 connectors. This permits using coaxial cables
(BT3002 or equivalent) of the same type used for connection to balanced E1
tributary interfaces.
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Traffic Cables
Traffic cables can be prepared on site. The following table lists the cables and
mating connectors needed for each XDM traffic interface type.
Use only 2 mm optical fibers for optical cables connecting to optical interfaces.
For each optical interface, ECI supplies patch cords with mating optical
connectors already attached to the fiber. Therefore, only the optical termination
on the Optical Distribution Frame (ODF) side, which is installation-dependent,
must be installed on site.
NOTE: ECI recommends using only fibers with short boots
(19 mm boot, instead of the 28 mm boot previously used for

patch cords). The following figure identifies the required boot
characteristics.
Figure 4-9: Short boot characteristics
Optical fibers for connecting to equipment installed in a given rack should

enter the rack from the top, and end at Fiber Storage Trays (FST). The storage
trays must contain enough fiber for routing within the rack (through cable
guides running along the rack side rails) down to the mating equipment
connectors, and for fiber replacement in case of damage (splicing repairs).
When routing fibers, make sure to observe the minimum bending radius
(35 mm).
Table 4-7:
Traffic cables, fibers, and mating connector data
I/O card
Interface type
Interface
unit/module
Cable type
Mating
connector
Qty/card
PIO2_84
E1 balanced
(2.048 Mbps)
M2_84B
Multipair cable
(14 pairs of
shielded 120
twisted pairs)
68-pin SCSI
male
6 cables
----------
----------
M2_84BR
E1 unbalanced M2_84U
(2.048 Mbps)
4-32
2 cables
84 pairs of 75
coaxial cables
BT43 male
6 cables
----------
----------
M2_84UR
2 cables
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Installation
I/O card
Interface type
Interface
unit/module
Cable type
Mating
connector
Qty/card
PIO2_21
E1 balanced
(2.048 Mbps)
M2_21B 1
Multipair cable
(14 pairs of
shielded 120
twisted pairs)
68-pin SCSI
male
2 cables
E1 unbalanced M2_21U 2
(2.048 Mbps)
21 pairs of 75
coaxial cables
BT43 male
2 cables
E3 and DS-3
(34/45 Mbps)
M345_16BT
---------M345_16DI
16 pairs of NCX
coaxial cables
BT43 male
---------DIN 1.6/5.6
mm male
2 cables
(multi-coax)
M345_8BT
---------M345_8DI
8 pairs of NCX
coaxial cables
BT43 male
---------DIN 1.6/5.6
mm male
---------BNC male
1 cable
(multi-coax)
M1_16BT
------------M1_16DI
16 pairs of NCX
coaxial cables
BT43 male
------------DIN 1.6/5.6
mm male
2 cables
(multi-coax)
M1_8BT
------------M1_8DI
8 pairs of NCX
coaxial cables
BT43 male
------------DIN 1.6/5.6
mm male
1 cable
(multi-coax)
M1_16SFP
and ETR
electrical SFP
32 single NCX
coaxial cables
DIN 1.023/3.5 32 cables

8 mm male
PIO345_16
PIO345M_16
---------M345_8BN
SIO1&4
SIO1&4M
STM-1
electrical
SIO1&4B
STM-1
electrical
SIO1&4
SIO1&4M
STM-1 optical OM1_4

OMS01_4
4 pairs of fiber
patch cords (one
pair per interface)
LC
8 fibers
STM-4 optical OM4_1

OMS04_1
1 pair of fiber
patch cords per
interface
LC or SC
male 3
4 fibers
STM-1 optical OTR1_S3

OTR1_L3
OTR1_L5
OTR1_X5
OTR1_VL5
1 pair of fiber
patch cords per
interface
LC
32 fibers 5
OTR_S3BD
OTR_S5BD
OTR_L3BD
OTR_L5BD
1 pair of fiber
patch cords per
interface
LC
16 fibers 6
SIO1&4B
(with
M1_16SFP) 4
M2_21 modules can also be used with PIO2_84 cards.

M2_21 modules can also be used with PIO2_84 cards.
3
Connector type depends on OM version.
4
SIO1&4B includes 16 STM-1 optical SFPs directly on the card itself. In addition, the corresponding M1_16SFP
module also supports 16 STM-1 optical or electrical SFPs.
5
No module. Direct SFP installation.
6
2
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8

Maintenance Manual
I/O card
Interface type
SIO1&4B
(without
M1_16SFP)
Interface
unit/module
Cable type
Mating
connector
Qty/card
STM-4 optical OTR4_S3

OTR4_L3
OTR4_L5
1 pair of fiber
patch cords per
interface
LC
32 fibers 7
SIO16
SIO16M
STM-16
optical
OM16_1
OM16_1SFP
1 pair of fiber
patch cords per
interface
LC or SC
male 8
4 fibers
SIO16_2B
SIO16_4B
STM-16
optical
OTR16_I3
OTR16_S3
OTR16_L3
OTR16_L5
OTR25_AVxx
OTR25_ABxx
OTC25_PSxx
1 pair of fiber
patch cords per
interface
LC male
4 fibers
(SIO16_2B)
8 fibers
(SIO16_4B)
SIO64
SIO64M
SIO64MF
STM-64
optical
OM64_1
1 pair of fiber
patch cords per
interface
SC male
2 fibers
SIO64B
STM-64
optical
OTR64_PI3
OTR64_PS5
OTR64_AL5
OTR10_ASxx
OTX10_ALxx
1 pair of fiber
patch cords per
interface
LC male
2 fibers
SIO164
STM-16/
OTU1 optical
OMSC16_4
1 pair of fiber
patch cords per
interface
LC male
8 fibers
STM-64
OMTX10_S
2 fibers
STM-64/
OTU2 optical
OMTX10
OMTX10_EF
2 fibers
DIO1_61
STM-16
optical
DOM16_I3
1 pair of
single-mode fiber
patch cords
DIO1_40,
DIO1_61 and
DIO1_80
Short-haul
GbE optical
OMGE-1 (SX)
1 pair of 50/125 or LC male

62.5/125 micron
multimode fiber
patch cords per
interface
Long-haul
GbE optical
OMGE-1
(LX, ZX)
1 pair of
single-mode fiber
patch cords per
interface
LC male
2 fibers
8, 12, or
16 fibers

4-34
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Installation
I/O card
Interface type
Interface
unit/module
Cable type
EIS2_8, EIS8_8,
EIS2_14
Short-haul
GbE optical
OMGE-1 (SX)

62.5/125 micron
multimode fiber
patch cords per
interface
Long-haul
GbE optical
OMGE-1
(LX, ZX)
1 pair of
single-mode fiber
patch cords per
interface
Electrical
(1000BaseT,
100BaseT,
10BaseT)
ME_8
---------ME_14
Category 5 twisted RJ-45 male

pairs, 1 cable per
port
8 cables
---------14 cables
Short-haul
GbE optical
OMGE-1 (SX)

62.5/125 micron
multimode fiber
patch cords per
interface
8 pairs
DIOB
MCS5
MCS10
Long-haul and OMGE-1

extended GbE (LX, ZX)
optical
Electrical
(10BaseT,
100BaseT,
1000BaseT)
ME16
Mating
connector
Qty/card
8, 12, or
16 fibers
1 pair of
single-mode fiber
patch cords per
interface
UTP 4-pairs with
overall shield
RJ-45 male
16 cables
MCS30_X10G
Long haul and OTR103

extended GbE (SR,LR, ZR,ER)
optical
1 pair of single
mode, or multi
mode (depends on
the transceiver
type) fiber patch
cords
LC male
2 fibers
ACP1000
Electrical
(10BaseT,
100BaseT)
Not applicable
UTP 4-pairs with

overall shield
RJ-45 male
(10-pin)
up to
4 cables
Aurora-G
DCN 10/100
Ethernet
management
port
Not applicable
Category 5
shielded straight
through cable
(STP)
RJ-45 male
1 cable
2 GbE
Ethernet ports
Dual fiber optical

SFPs
OTGBE_SX
OTGBE_LX
OTGBE_ZX
9/125 m single
mode duplex fiber
pair
or
62.5/125 m
multimode duplex
fiber or simplex
fiber pair
LC male
1 cable per
port
Electrical
1000BaseT SFP
ETGBL
UTP 4-pairs with

overall shield
RJ-45 male
1 cable per
port
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Installation
I/O card
XIO192
(I/O section)
Interface type
Interface
unit/module
Cable type
Mating
connector
Qty/card
Local PC port
Not applicable
RS-232 shielded
copper null model
cable
DB-9 male
1 cable
1 pair of fiber
patch cords per
interface
LC or SC
male 9
8 fibers
STM-1 optical OM1_4

OMS01_4
STM-4 optical OM4_1
OMS04_1
2 fibers
STM-16
optical
OM16_1
OM16_1SFP
2 fibers
STM-16/
OTU1 optical
OMSC16_4
STM-64
OMTX10_S
2 fibers
STM-64/
OTU2 optical
OMTX10
OMTX10_EF
2 fibers
MO_BAC
MO_PAC
MO_BAS
MO_PAS
optical
Not applicable
1 pair of fiber
patch cords per
module
LC
2 fibers
OFA_2
optical
OM_BAC
OM_ILC_23
OM_ILC29
1 pair of fiber
patch cords per
module
LC
4 fibers
OFA_M
optical
1st stage,
2nd stage
1 pair of fiber
patch cords
LX.5
4 fibers
MO_OFA_M
optical
MO_OFA_M
1 pair of fiber
patch cords per
module
2 LC
2 fibers
OFA_R
OFA_RM
OFA_HRM
optical
OM_OFA_R
1 fiber patch cord

of each connector
type
LX.5
E2000
2 fibers
MO_OFA_FBC
optical
OM_OFA_FBC
1 pair of fiber
patch cords
2 LC
2 fibers
MO_OFA_FHB
C
optical
MO_OFA_FHB
C
1 pair of fiber
patch cords
3 LC
3 fibers
MO_OFA_
PHBC
optical
OM_OFA_P
1 pair of fiber
patch cords
2 LC
2 fibers
OM_OFA_B
1 pair of fiber
patch cords
LC and LX.5
2 fibers
OM_OFA_B
1 pair of fiber
patch cords
LC and LX.5
2 fibers
XIO384F
(I/O section)
MO_OFA_
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optical
1 pair of fiber
patch cords per
interface
LC male
8 fibers
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I/O card
Interface type
Interface
unit/module
Cable type
Mating
connector
Qty/card
MO_OFA_
MH
optical
1st stage,
2nd stage
1 pair of fiber
patch cords per
stage
1st stage:
2 LC
2nd stage:
LC and LX.5
4 fibers
MO_OFA_MHe
optical
Through
1st stage,
2nd stage
1 pair of fiber
patch cords per
stage
Through
2 LC
1st stage:
2 LC
2nd stage:
LC and LX.5
6 fibers
Installing Equipment Racks

Marking the Rack Floor
You must mark out the rack floor plan before installing the rack.
Before you start:
1. Find the prescribed location of each equipment rack.
2. If you have not yet unpacked the rack and the associated mounting kits, do
it now (see Unpacking and Performing Visual Inspection).
To mark out the rack floor plan:
1. For each rack, mark out the floor at the rack location(s) according to the
floor plan template corresponding to the type of rack being installed:
ETSI use the template shown in Mounting diagrams for ETSI racks
(page 4-38) (diagram a).
23 in. use the template shown in Mounting diagrams for 19 in. and 23
in. racks (page 4-39) (diagram a).
19 in. use the template shown in Mounting diagrams for 19 in. and 23
in. racks (page 4-39) (diagram b).
The marked locations are a helpful guide for positioning the racks.
2. If the installation is located at a site with a raised floor, mark out all cable
entry slots as well.
3. For concrete or wooden floors, mark out all the points designated for
equipment bolting.
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Figure 4-10: Mounting diagrams for ETSI racks
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Figure 4-11: Mounting diagrams for 19 in. and 23 in. racks
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Installing Racks on Concrete Floors

See the relevant figures when performing this procedure.
To mount the rack on a concrete floor:
1. Plan where to drill holes by referring to the appropriate template figure.
Choose the relevant template sketch from the diagrams included in
Mounting diagrams for ETSI racks (page 4-38) (diagram a) and Mounting
diagrams for 19 in. and 23 in. racks (page 4-39) (diagram a or b).
2. Drill the mounting holes using a 5 mm (0.2 in.) drill bit.
3. Insert expansion shields into the holes.
4. Position the rack over the mounting holes.
5. Secure the rack to the floor with the bolts supplied in the mounting kit (see
diagram b of Mounting diagrams for ETSI racks (page 4-38) or diagram c
of Mounting diagrams for 19 in. and 23 in. racks (page 4-39)).
NOTE: ETSI racks have leveling points that can be adjusted
after installation to compensate for an uneven floor.
Installing Racks on Wooden Floors

To mount the rack on a wooden floor:
4. Secure the rack to the floor using appropriate wood screws (refer to
diagram d of Mounting diagrams for ETSI racks (page 4-38)).
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Installing Racks on Raised Floors

To mount the rack on a raised floor:
4. Secure the rack to the floor (see diagram c of Mounting diagrams for ETSI
racks (page 4-38)).
Attaching Suspended Overhead Trays

See the relevant figure when performing this procedure.
To mount the rack on a suspended overhead tray:
1. Refer to the following suspended overhead tray diagram and position the
overhead rack securing brackets.
Figure 4-12: Rack mounting diagram for attachment to suspended overhead

tray (2200 mm rack)
2. Secure the rack to the overhead cabling trays using the adjustable brackets.
Note that 2200 mm (87 in.) high racks may also be attached to the ceiling;
2600 mm (102.5 in.) racks are generally attached only to the ceiling.
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Installing Extendable Rails

In high-density installations it is necessary to install the xRAP above the rack,
using the extendable installation rails available from ECI.
In this case, attach the extendable installation rails to the top of the rack before
starting the equipment installation.
Grounding the Rack

Immediately after installing the rack, ground the rack as described here. The
optical rack grounding points are illustrated in the following figure.
Figure 4-13: Optical rack grounding bar and rack frame grounding post
Use a grounding cable that meets the grounding requirements listed in Rack
Grounding Requirements (page 1-8) and prepared appropriately, based on the
instructions in Grounding Cables (page 4-24). The relevant accessory washers
(both flat and serrated), nuts, and bolts are delivered attached to the
corresponding grounding points.
To ground the rack:
1. The rack is delivered with one grounding connection already in place. This
is a metal panel that connects the rack grounding stud to the first grounding
point on the far left side of the rack grounding bar. Verify that this panel is
in place and tightened. The nut over the lug on the rack grounding stud, and
the bolt over the grounding point in the rack grounding bar must both be
tightened with a torque of 450 N cm to 550 N cm.
2. Use the grounding cable to connect the first pair of grounding points on the
left side of the rack grounding bar to the site grounding bar. To secure the
grounding cable lug to the grounding bar, hold the cable lug against the
panel and place the flat washer above the cable lug, followed by the
serrated lock washer. Screw in the bolt to hold everything in place. Tighten
the bolt with a torque of 450 N cm to 550 N cm.
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The grounding mechanism is illustrated in the following figure. The metal

panel and the end of the grounding cable are both highlighted.
Figure 4-14: Grounding the optical rack to the site grounding bar
WARNINGS:
To prevent possible damage to XDM equipment, all racks and

equipment must be completely grounded before connecting any
external devices powered from any DC or AC source (100 V to
230 V) to the platform. All grounding procedures described in
Grounding the Platform (page 5-3) must be completed before, for
example, connecting an external PC to configure and initialize the
NE management system.
The thickness of the protecting grounding cable must be at least the
same thickness as the corresponding power cable. This means:
The thickness of the rack grounding cable must at least match
the thickness of the xRAP power cable.
The thickness of the platform grounding cable must at least
match the thickness of the power cable from the xRAP to the
platform.
For more information, see Grounding Cables (page 4-24).
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Installing Ancillary Units in

Racks
Before starting, determine the ancillary units to be installed in the specific rack
by referring to the specific site installation plan, and note the exact position of
each unit (to prevent errors, it is recommended to mark the prescribed positions
on the rack rails using a soft pencil). The equipment installed in a rack may
include:
Rack Alarm Panel (RAP) (not needed when a user-provided power

distribution panel is used), located at the top of the rack.
FSTs and ODFs for connecting fibers to the rack.
One or more XDM shelves.
DDF units for tributary cables.
Heat buffers. A heat buffer must be installed between each pair of shelves
to minimize the transfer of heat from shelf to shelf. Note that the heat
buffer for XDM-1000, XDM-500, and XDM-2000 shelves occupies 70 mm
(approx. 2U or 2.7 in.). If more room is available, a larger heat buffer of
125 mm (approx. 3U or 5 in.) can be used. If there is not enough space for
a heat buffer, a buffer plate, which occupies 50 mm (approx. 1U or 2 in.),
must be installed.
Dispersion compensation units (DCF) used on long-haul links to

compensate for fiber dispersion.
Ethernet hubs for management access.
VoIP gateway and VoIP terminal (IP phone).
Other customer-provided equipment units.

CAUTION: When installing equipment in the rack, make sure
all optical connectors are closed by protective caps or springloaded covers. Do not remove the cap until an optical fiber is
connected to the corresponding connector.
In general, ancillary units are attached to the rack side rails by four M6 Philips
screws. No preparations are required before installation.
The following sections provide mechanical installation instructions for units
that require additional procedures. Skip sections that are not relevant to your
particular application.
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Installing the xRAP-D

NOTE: Skip this section if the xRAP-D is not used.
Before connecting DC power cables, refer to DC Power Cables (page 4-28).

The installation of an xRAP-D unit includes the following steps:
1. Prepare DC power cables.
2. Install the xRAP-D in the prescribed location, either at the top of the rack
or on the extendable installation rails.
3. Ground the xRAP-D to the rack grounding stud.
4. Connect DC input power cables to the xRAP-D. Depending on the site
power requirements, one of the following cable connections options should
be chosen:
a. In most configurations, either one or two standard (25mm2) input power
cables are connected to each side of the xRAP-D unit. This option is
described in Connecting DC Input Power Cables to the xRAP-D (page
4-49).
b. Alternatively, a single power input cable may be connected to the
xRAP-D using a bridge component. This option is described in
Connecting DC Input Power Cable to the xRAP-D with a Bridge
Component (page 4-53).
5. Attach protective covers to the sides and bottom of the xRAP-D unit.
(From V7.15 only, required for NEBS; optional for all others.)
6. Connect the DC power cables of the XDM-500 shelves to the xRAP-D.
7. Install circuit breakers.
8. Check DC voltage polarity.
9. Connect the alarm cables.
For a description of the xRAP-D, refer to the XDM-100 or XDM-1000 Product
Line Reference Manual.
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Preparing DC Input Power Cables

The DC input power cables connect between the two DC power sources and
the xRAP-D source A and source B inputs. When working with the xRAP-D,
four sets of cables are typically required, two for each source.

a black cable. However, according to the BS7671 (GB) and
HD 308 S2:2001 (EU) standards, the positive lead (+48 V)
(-48 V) with a gray cable. In the following sections that
describe DC power cable connections, use cables with
appropriate colors to comply with the standards in your area
of residence.
Before you start:

In the xRAP-D, two 25 mm2 power cables are typically used for each power
source. When working in the recommended redundant mode with all power
cables connected, the xRAP-D works with a full set of input power cables and
backup power cables. This option, illustrated in the following figure, is
described in Connecting DC Input Power Cables to the xRAP-D (page 4-49).
Figure 4-15: xRAP-D power supply flow
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Another power configuration option supported by the xRAP-D enables use of a

single power input cable to support either one or two XDM platforms. The
single power cable is connected to the xRAP-D using a bridge component. Two
variations of this option are illustrated in the following figure. This option is
described in Connecting DC Input Power Cable to the xRAP-D with a Bridge
Component (page 4-53).
Figure 4-16: xRAP-D power supply with bridge, two variations
NOTE: When necessary, the xRAP-D is able to work with

only a single 25 mm2 power cable from each power source.
This supplies enough power to support a single XDM
platform with 2250 W, or two XDM platforms where each
platform is limited to a maximum of 1100 W for per platform.
In many cases, this configuration is sufficient.
However, it is recommended, if at all possible, to connect all
input power cables from all power sources to the xRAP-D
unit upon the initial system installation. Connecting all cables
from the beginning is an easy step that greatly simplifies any
later system upgrades, since the power cables are already in
place and ready to supply power to a second XDM platform,
if the network configuration is ever changed.
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Each input power cable consists of two stranded copper leads with a cross
section of 25 (or 50) mm2, one red and the other black. Each lead is terminated
with a two-hole compression lug from the installation parts kit supplied with
the equipment.
If appropriate leads have already been prepared at the prescribed rack location,
make sure that the leads are not connected to any live voltage source before
attaching the lugs.
To prepare a DC power cable:
1. Strip about 22 mm of the red lead jacket.
2. Insert all the lead strands into the lug sleeve.
3. Press at two or three different points on the lug sleeve using an appropriate
crimping tool and die. The recommended tools are Panduit CT-720
crimping tool with CD-720-2 die, Klauke K18 crimping tool with D50 die,
or equivalent.
4. Repeat Steps 1 to 3 for the black lead.
5. Repeat these steps for each DC power cable being used.
To install the xRAP-D:
Attach the xRAP-D to the rack side rails in the top position, and secure it
with the four screws, washers, and nuts supplied in the installation parts kit.
To ground the xRAP-D:

1. The xRAP-D grounding stud is located on its bottom cover. Use the
following figure of the xRAP-D to identify the grounding stud.
2. If necessary, prepare a grounding lead in accordance with the requirements
described in Grounding Requirements (page 1-7).
3. Connect the lug at one end of the grounding lead to the xRAP-D grounding
stud using a spring washer and nut.
4. Connect the lug at the other end of the grounding lead to the rack
grounding stud.
Figure 4-17: Location of xRAP-D grounding stud
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Connecting DC Input Power Cables to the

xRAP-D
In the xRAP-D, two 25 mm2 power cables are typically used for each power
source. When working in the recommended redundant mode with all power
cables connected, the xRAP-D works with four sets of input power cables. This
typical configuration option is described in this section.
Figure 4-18: xRAP-D power supply flow
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NOTE: When necessary, the xRAP-D is able to work with

only a single 25 mm2 power cable from each power source.
This supplies enough power to support a single XDM
platform with 2250 W, or two XDM platforms where each
platform is limited to a maximum of 1100 W for per platform.
In many cases, this configuration is sufficient. The
instructions in this section apply to this configuration option
also. (This configuration option is only available from V7.2,
when the management software enforces limitations on
maximum power consumption.)
However, it is recommended, if at all possible, to connect all
input power cables from the power sources to the xRAP-D
unit upon the initial system installation. Connecting all cables
from the beginning is an easy step that greatly simplifies any
later system upgrades, since the power cables are already in
place and ready to supply power to a second XDM platform,
if the network configuration is ever changed.
Alternatively, a single power input cable supporting two
XDM platforms may be connected to the xRAP-D using a
bridge component. This option is described in Connecting DC
Input Power Cable to the xRAP-D with a Bridge Component
(page 4-53).
To connect DC input power cables to the xRAP-D:

1. Before starting, identify the openings used to route power cables to the
xRAP-D by referring to the following figure.
Figure 4-19: Identification of xRAP-D cable routes
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2. Open the two captive screws fastening the xRAP-D front cover and remove
the cover.
Identify the various terminals located on the power source terminal board in
accordance with the following figure. This figure shows the terminals at the
source A side (main); the same board is used at the source B side
(protection).
Note that there are two complete sets of power terminals and circuit
breakers on each side. Separate input power cables from the user's input
power supply feed through the two sets of input power terminals into the
two circuit breakers on the source A side, supplying independent power
sources for up to two XDM shelves. Each circuit breaker feeds into a
separate power output connection for the power cable that connects to the
XDM platform.
Similarly, separate input power cables from the user's input power supply
feed through separate input terminals into the two circuit breakers on the
source B side, and from the circuit breakers feed into the additional power
output connections that provide an optional protective backup power
supply for up to two XDM shelves.
Figure 4-20: Connecting DC power cables
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The preceding figure portrays the electrical connections on the left side of
the xRAP-D, the side that connects to the user's main power supply for the
XDM shelves being powered. The right side of the xRAP-D contains a
mirror image of the connections illustrated in the preceding figure. The
right side connects to the user's (optional) backup protective power supply
for the shelves.
CAUTION: Before connecting the power leads, make sure to
identify the terminal polarity on the xRAP-D power terminal

board.
3. Bring the two leads of one DC source input power cable to the appropriate
xRAP-D opening.
4. Attach the lug of the red lead to the positive stud terminals, marked (+) on
the power terminal board. Note that the xRAP-D works with two sets of
positive terminals, used with two 25 mm2 power cables.
5. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 450 N cm to 550 N cm.
6. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminal board. Note that the xRAP-D works with two sets of
negative terminals, used with two 25 mm2 power cables.
7. Repeat Step 6 for the black lead lug.
8. If an additional power source (source B) is used, repeat Steps 3 to 8 for
source B.
9. Route the DC input power cables towards the cable retainers at the rear of
the xRAP-D (see To ground the xRAP-D (page 4-48)), and attach them to
the retainers with cable ties.
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Connecting DC Input Power Cable to the

xRAP-D with a Bridge Component
Users who prefer to work with a single power cable from their main power
supply (and optionally, a single power cable from the protective power supply)
can still work with a single cable if they either:
Work with a single 25 mm2 power cable to support a single XDM platform
only, with a maximum of 2250 W for that platform. This configuration
option is described in Connecting DC Input Power Cables to the xRAP-D
(page 4-49).
Work with a single 25 mm2 power cable to support two XDM platforms,
where each platform is limited to a maximum of 1100 W for per platform.
(Note that this configuration option is only available from V7.2, when the
management software enforces limitations on maximum power
consumption.) This configuration option requires the use of an optional
metal bridge component designed by ECI for this purpose.
Work with a single 50 mm2 power cable to support two XDM platforms,
with a maximum of 2250 W for each platform. This configuration option
requires the use of an optional metal bridge component designed by ECI
for this purpose.
Figure 4-21: xRAP-D power supply with bridge, two variations
This section describes the bridge-component configuration option.

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To connect DC input power cables to the xRAP-D using a

bridge component:
xRAP-D by referring to the following figure.
Figure 4-22: Identification of xRAP-D cable routes
2. Open the two captive screws fastening the xRAP-D front cover and remove
the cover.
accordance with the following figure. This figure shows the terminals at the
source A side (main); the same board is used at the source B side
(protection).
Note that there are two complete sets of power terminals and circuit
breakers on each side. Separate input power cables from the user's input
power supply feed through the two sets of input power terminals into the
two circuit breakers on the source A side, supplying independent power
sources for up to two XDM shelves. Each circuit breaker feeds into a
separate power output connection for the power cable that connects to the
XDM platform.
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Similarly, separate input power cables from the user's input power supply
feed through separate input terminals into the two circuit breakers on the
source B side, and from the circuit breakers feed into the additional power
output connections that provide an optional protective backup power
supply for up to two XDM shelves.
The preceding figure portrays the electrical connections on the left side of
the xRAP-D, the side that connects to the user's main power supply for the
XDM shelves being powered. The right side of the xRAP-D contains a
mirror image of the connections illustrated in the preceding figure. The
right side connects to the user's (optional) backup protective power supply
for the shelves.
identify the terminal polarity on the xRAP-D power terminal

board.
3. Unscrew the washers that come already attached to the negative power
terminals.
4. Attach the metal bridge unit to the xRAP-D board by placing the openings
on the bridge unit over the screw posts of the negative power terminals of
the xRAP-D.
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xRAP-D opening.
6. Attach the lug of the red lead to the positive input power stud terminals for
shelf 1, marked (+) on the power terminal board. Note that in this
configuration the xRAP-D works with one set of positive terminals, used
with one power cable. No cable is attached to the second set of positive
terminals.
8. Attach the lug of the black lead to the negative stud terminals on the back
of the bridge unit. Note that in this configuration the xRAP-D works with a
single set of negative terminals on the bridge unit, used with one power
cables.
10. If an additional backup power source (source B) is used, repeat Steps 3 to 9
for source B.
the xRAP-D (see To ground the xRAP-D (page 4-48)), and attach them to
the retainers with cable ties.
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Attaching Protective Covers

From V7.15 only, as required for NEBS. Optional for all others.
To attach protective covers on the xRAP-D:
1. From the open back end, look at the inside panel of the xRAP-D unit. Find
the four screws in the left and right sides of the power panel. The two
screws on the left side are highlighted in the following figure.
Figure 4-24: Side screws highlighted on left side of xRAP-D unit
2. Find the replacement spacer screws included in the protective cover kit.
Note that four replacement spacer screws are included with the xRAP-D. A
replacement spacer screw is illustrated in the following figure.
Figure 4-25: Replacement spacer screw
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3. Replace the side screws with the replacement spacer screws. The following
figure illustrates the inside of the xRAP-D unit, highlighting the left side
replacement spacer screws in place.
Figure 4-26: Replacement spacer screws in place in xRAP-D unit
4. Find the small L-shaped protective covers included in the kit. Four
protective covers are included for the xRAP-D. The protective covers are
illustrated in the following figure.
Figure 4-27: Protection cover for xRAP-D
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5. Place the protective covers into the xRAP-D, two covers on each side. For
each protective cover, the smaller hole fits onto the top of the spacer screw
on one side and the two larger holes are anchored on top of the two
terminals above the spacer screw. The jutting-out edge of the protective
cover fits into the opening on the edge of the xRAP next to the terminals.
The following figure illustrates protective covers inserted into the xRAP-D
unit.
Figure 4-28: xRAP-D protective covers in place
6. Secure the protective covers in place by screwing on the wing nuts supplied
in the kit onto the tops of the spacer screws on each side.
7. Find the protective bottom panel in the kit. The bottom panel for the
xRAP-D is illustrated in the following figure.
Figure 4-29: Bottom panel for xRAP-D
8. Secure the bottom panel into place with the four screws supplied in the kit.
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To connect the DC power cable for an XDM-500 platform:

1. Before starting, identify the platform power connectors on the xRAP-D
board in accordance with the following figure.
Figure 4-30: xRAP-D connectors
2. Insert the end of the DC power cable terminating with a 5-pin D-type male
connector near the SOURCE A power connectors and connect it to
connector Shelf 1 (see preceding figure).
3. Fasten the screws of the D-type connector.
4. If you are connecting an additional platform to the xRAP-D, repeat the
above steps for the second platform. Note that a maximum of 55A is
supplied from the power sources to each XDM platform. Power is supplied
independently to each XDM platform connected to the xRAP unit. Power is
not shared between XDM platforms.
5. If an additional power source is used, repeat the above steps to connect the
shelves to source B.
6. Route the DC power cables towards the cable retainers at the rear of the
xRAP-D and attach them to the retainers with cable ties (see To ground the
xRAP-D (page 4-48)).
7. Route each platform power cable along the rack side rails down to the
corresponding platform position, and securely attach the power cable to the
rack inner wall using cable ties. Attach a tag to each power connector in
accordance with its function.
NOTE: Connect the cables to the shelves only after
completing the installation of the shelves and all other

components.
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To install the xRAP-D circuit breakers:

1. If the xRAP-D front panel has not been removed, open the two captive
screws fastening the xRAP-D front cover to its chassis and remove the
cover (see the following figure).
Figure 4-31: Installation of xRAP-D circuit breakers
2. Identify the circuit breaker corresponding to the power circuit A of shelf 1

(the circuit breaker is included in the installation parts kit supplied with the
equipment); its rating is in accordance with the ordered platform
configuration.
3. Insert the circuit breaker into the circuit breaker sockets located on the
xRAP-D source A power terminal board, as shown in the previous figure.
4. If an additional platform is powered from source A, repeat Steps 2 and 3 to
insert the other circuit breaker into the corresponding platform position of
the power terminal board.
5. If an additional power source is used, repeat Steps 2, 3, and 4 for source B
circuit breakers.
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To check the DC voltage polarity:

1. Connect the DC input power to the xRAP-D.
2. Set all xRAP-D circuit breakers to ON.
3. Use a digital multimeter (DMM) to test the voltage between the positive
and negative pins of each power cable.
CAUTION: Pay attention not to short-circuit the multimeter
leads when checking the voltage.
NOTE: The power cable terminates with a 3-pin (3W3), or a

5-pin (5W5) connector in accordance with the connected
XDM shelf. For a 3W3 connector the positive pin is A3 and
the negative pin A2; for a 5W5 connector the positive pins are
A4, A5, and the negative pins A2, A3.
4. Make sure the voltage is within the allowed range (-40 VDC to -72 VDC)
and that it has the correct polarity.
5. Return all xRAP-D circuit breakers to OFF.
6. Disconnect the xRAP-D input power sources.
7. Reinstall the xRAP-D front cover and fasten it using the two captive
screws.
During the following procedure, refer to the figures illustrating the connectors
in Connecting DC Input Power Cables to the xRAP-D (page 4-49).
To connect the alarm cables to the xRAP-D:
1. Before starting, make sure you have all the necessary cables.
2. Connect the 68-pin SCSI connector of the facility alarm monitoring cable
to the ALARMS connector, and then securely attach the cable to the rack
inner wall using cable ties.
3. Connect the 36-pin SCSI connector of the alarm monitoring cable intended
for Shelf 1 to the Shelf 1 connector on the xRAP-D.
4. Route the alarm cables towards the cable retainers at the rear of the
xRAP-D (see the figure in To ground the xRAP-D (page 4-48)), and attach
them to the bracket with cable ties.
5. Route the alarm cables along the side of the rack down to the corresponding
platform position. Attach a tag to each connector in accordance with its
function.
6. If an additional platform is installed in the rack, repeat Steps 2, 3, 4, and 5
for the cables serving the additional platform. Make sure to attach
identification tags to each cable end.
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Installing the xRAP-B

NOTE: Skip this section if the xRAP-B is not used.

The installation of an xRAP-B unit includes the following steps:
2. Install the xRAP-B in the prescribed location, either at the top of the rack or
on the extendable installation rails.
3. Ground the xRAP-B to the rack grounding stud.
4. Connect DC input power cables to the xRAP-B.
5. Attach protective covers to the sides and bottom of the xRAP-B unit.
(From V7.15 only, required for NEBS; optional for all others.)
6. Connect the DC power cables of the XDM-500 shelves to the xRAP-B.
8. Check DC voltage polarity.
For a description of the xRAP-B, refer to the XDM-100 or XDM-1000 Product
Line Reference Manual.
NOTE: The xRAP-B is no longer included in new XDM
deliveries (EOL). This information is included here if needed
for a current installation.
the xRAP-B source A and source B inputs. When working with the xRAP-B,
two cables are required, one for each source.

should be connected with a blue cable and the negative lead
of residence.
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Before you start:

In the xRAP-B, a single 50 mm2 cable is used for each power source. Since the
xRAP-B is designed for redundancy through the use of two power sources, this
means that when working in the recommended redundant mode, the xRAP-B
works with two input power cables.
Each input power cable consists of two stranded copper leads with a cross
section of 50 mm2, one red and the other black. Each lead is terminated with a
two-hole compression lug from the installation parts kit supplied with the
equipment.
If appropriate leads have already been prepared at the prescribed rack location,
make sure that the leads are not connected to any live voltage source before
attaching the lugs.
1. Strip about 22 mm of the red lead jacket.
or equivalent.
5. Repeat these steps for each DC power cable being used.
To install the xRAP-B:
Attach the xRAP-B to the rack side rails in the top position, and secure it
To ground the xRAP-B:

1. The xRAP-B grounding stud is located on its bottom cover. Use the
following figure of the xRAP-B to identify the grounding stud.
3. Connect the lug at one end of the grounding lead to the xRAP-B grounding
stud using a spring washer and nut.
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grounding stud.
Figure 4-32: Location of xRAP-B grounding stud
To connect DC input power cables to the xRAP-B:

xRAP-B by referring to the following figure.
Figure 4-33: Identification of xRAP-B cable routes
2. Open the two captive screws fastening the xRAP-B front cover and remove
the cover.
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accordance with the following figures. These figures show the terminals at
the source A side; the same board is used at the source B side.
identify the terminal polarity on the xRAP-B power terminal

board.
xRAP-B opening.
4. Attach the lug of the red lead to the positive stud terminals, marked (+) on
the power terminal board. Note that the xRAP-B works with a single set of
positive terminals, used with a 50 mm2 power cable.
the power terminal board. Note that the xRAP-B works with a single set of
negative terminals, used with a 50 mm2 power cable.
source B.
the xRAP-B (see the figure in To ground the xRAP-B (page 4-64)), and
attach them to the retainers with cable ties.
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Attaching Protective Covers

From V7.15 only, as required for NEBS. Optional for all others.
To attach protective covers on the xRAP-B:
1. From the open back end, look at the inside panel of the xRAP-B unit. Find
the two screws in the center of the left and right sides of the power panel.
The screw on the left side is highlighted in the following figure.
Figure 4-35: Side screw highlighted on left side of the xRAP-B
2. Find the replacement spacer screws included in the protective cover kit.
Note that two replacement spacer screws are included with the xRAP-B. A
replacement spacer screw is illustrated in the following figure.
Figure 4-36: Replacement spacer screw
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3. Replace the side screws with the replacement spacer screws. The following
figure illustrates the inside of the xRAP-B unit, highlighting the left side
replacement spacer screw in place.
Figure 4-37: Replacement spacer screw in place in the xRAP-B
4. Find the small L-shaped protective covers included in the kit. Two
protective covers are included for use with the xRAP-B. The protective
covers are illustrated in the following figure.
Figure 4-38: Protective cover for xRAP-B
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5. Place the protective covers into the xRAP-B, placing one cover on each
side. For each protective cover, the smaller hole fits onto the top of the
spacer screw on one side and the two larger holes are anchored on top of
the two terminals above the spacer screw. The jutting-out edge of the
protective cover fits into the opening on the edge of the xRAP next to the
terminals. The following figure illustrates a protective cover inserted into
the xRAP-B unit.
Figure 4-39: xRAP-B protective cover in place
6. Secure the protective covers in place by screwing on the wing nuts supplied
in the kit onto the tops of the spacer screws on each side.
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7. Find the protective bottom panel in the kit. The bottom panel for the
xRAP-B is illustrated in the following figure.
Figure 4-40: Bottom panel for xRAP-B
8. Secure the bottom panel into place with the four screws supplied in the kit.
To connect the DC power cable for an XDM-500 platform:
1. Before starting, identify the platform power connectors on the xRAP-B
board in accordance with the following figures.
Figure 4-41: xRAP-B connectors
2. Insert the end of the DC power cable terminating with a 5-pin D-type male
connector near the SOURCE A power connectors and connect it to
connector Shelf 1 (see preceding figures).
4. If you are connecting an additional platform to the xRAP-B, repeat the
above steps for the second platform. Note that a maximum of 55A is
supplied from the power sources to each XDM platform. Power is supplied
independently to each XDM platform connected to the xRAP unit. Power is
not shared between XDM platforms.
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xRAP-B and attach them to the retainers with cable ties (see the figure in
To ground the xRAP-B (page 4-64)).
corresponding platform position, and securely attach the power cable to the

components.
To install the xRAP-B circuit breakers:

1. If the xRAP-B front panel has not been removed, open the two captive
screws fastening the xRAP-B front cover to its chassis and remove the
Figure 4-42: Installation of xRAP-B circuit breakers

configuration.
xRAP-B source A power terminal board, as shown in the previous figures.
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4. If an additional platform is powered from source A, repeat Steps 2 and 3 to

insert the other circuit breaker into the corresponding platform position of
circuit breakers.
1. Connect the DC input power to the xRAP-B.
2. Set all xRAP-B circuit breakers to ON.
and negative pins of each power cable.
CAUTION: Pay attention not to short-circuit the multimeter
leads when checking the voltage.
NOTE: The power cable terminates with a 3-pin (3W3), or a

5-pin (5W5) connector in accordance with the connected
XDM shelf. For a 3W3 connector the positive pin is A3 and
the negative pin A2; for a 5W5 connector the positive pins are
A4, A5, and the negative pins A2, A3.
5. Return all xRAP-B circuit breakers to OFF.
6. Disconnect the xRAP-B input power sources.
7. Reinstall the xRAP-B front cover and fasten it using the two captive
screws.
To connect the alarm cables to the xRAP-B:
Use the figures illustrating the xRAP-B connectors (in Connecting DC power
cables (page 4-66)) to identify the xRAP-B connector functions.
to the ALARMS connector, and then securely attach the cable to the rack
inner wall using cable ties.
for Shelf 1 to the Shelf 1 connector on the xRAP-B.
xRAP-B, (see figure in To ground the xRAP-B (page 4-64)), and attach
them to the bracket with cable ties.
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function.
6. If an additional platform is installed in the rack, repeat Steps 2, 3, 4, and 5
for the cables serving the additional platform. Make sure to attach
identification tags to each cable end.
Installing the xRAP-HP

NOTE: Skip this section if the xRAP-HP is not used.
Before connecting DC power cables refer to DC Power Cables (page 4-28).

For a description of the xRAP-HP, refer to the XDM-1000 Product Line
Reference Manual.
For Rev.C02, the input and output alarm lines are divided into two groups. The
first four alarms are assigned to the first XDM platform installed in the rack,
and the second four alarms are assigned to the second XDM platform installed
in the rack.
If you are using xRAP-HP units up to Rev.C01, alarm lines are allocated
through internal switch settings. This step, relevant only to this subset of
xRAP-HP units, is included in the following xRAP-HP installation instructions.
If you are using and xRAP-HP Rev.C02, skip the irrelevant step.
To install the xRAP-HP:
1. Check and/or change the internal switches that route alarm inputs and
outputs.
(Relevant for xRAP-HP units up to Rev.C01 only.)
3. Install the xRAP-HP in the prescribed location: either at the top of the rack
4. Ground the xRAP-HP to the rack grounding stud.
5. Connect input DC power cables to the xRAP-HP.
6. Connect the DC power cables of the XDM shelves to the xRAP-HP.
8. Check power wiring.
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NOTE: The xRAP-HP is no longer included in new XDM

Checking and/or Changing Slide Switch

Settings
NOTE: Skip this section if the xRAP-HP Rev.C02 is used.
The slide switches, located on the rear side of the xRAP-HP, are used to route
the facility alarm lines to the alarm input and output lines of the XDM shelves
installed in the rack.
Before you start:
When the xRAP-HP is shipped, the switches are already set to meet the site
planning specifications. Use the following procedure to check the settings
before installing the xRAP-HP, and/or change the settings in accordance with
the current requirements.
Figure 4-43: xRAP-HP slide switches
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To check and/or change slide switch settings:

1. Identify the four slide switches, designated 1&2, 3&4, 5&6, and 7&8, and
their positions, referring to the previous figure. Use the table to identify the
required switch settings, for example:
Setting switches 1&2 and 3&4 to position 1 connects the inputs and
outputs 1 through 4 in the CONTROL CONNECTION connector to
inputs and outputs 1 through 4 in the EXTERNAL
ALARM/CONTROL SHELF 1 connector.
Setting switch 5&6 to position 2 connects the inputs and outputs 5 and
6 in the CONTROL CONNECTION connector to the inputs and
outputs with the same numbers in the EXTERNAL
Setting switch 7&8 to position 3 connects the inputs and outputs 7 and
8 in the CONTROL CONNECTION connector to the inputs and
outputs with the same numbers in the EXTERNAL
2. Check the slide switch settings and verify that they meet the site planning
specifications.
3. If required, change the switch settings to the required position.
Table 4-8:
xRAP input and output alarm allocation
Slide switch
Input and output lines in

CONTROL CONNECTION
Switch
position
SHELF
connector
1&2
1, 2
SHELF 1
SHELF 2
SHELF 3
SHELF 1
SHELF 2
SHELF 3
SHELF 1
SHELF 2
SHELF 3
SHELF 1
SHELF 2
SHELF 3
3&4
5&6
7&8
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3, 4
5, 6
7, 8
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Preparing DC Input Power Cables


of residence.
The DC input power cables connect the two DC power sources and the
xRAP-HP source A and source B inputs. Two cables are required, one for each
source. Each cable consists of two stranded copper leads with a cross section of
50 mm2 (.078 in.2), one red and the other black. Each lead is terminated with a
equipment.
NOTE: When the xRAP-HP provides power to a single XDM
shelf, lower gauge cables may be used. Refer to DC Power
Cables (page 4-28) for DC power cable requirements.
CAUTION: If appropriate leads have already been prepared
at the prescribed rack location, before attaching the lugs make

sure that the leads are not connected to any live voltage
source.

1. Strip about 22 mm (1 in.) of the red lead jacket.
or equivalent.
It is recommended to use insulation tape (of same color as the lead jacket)
between the cable lug and the cable itself.
4. Repeat Steps 1 to 3 above for the black lead.
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Installing the xRAP-HP

The xRAP-HP is attached either to the rack side rails in the top position of the
rack or on the extendable installation rails.
To install the xRAP-HP:
Attach the xRAP-HP to the side rails and secure it with the four screws,
washers, and nuts supplied in the installation parts kit.
To ground the xRAP-HP:

1. The xRAP-HP grounding stud is located on its bottom cover. Use the
following figure to identify it.
3. Connect the lug at one end of the grounding lead to the xRAP-HP
grounding stud using a spring washer and nut.
grounding stud.
Figure 4-44: Location of xRAP-HP grounding stud
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To connect DC input power cables to the xRAP-HP:

xRAP-HP by referring to the following figure.
Figure 4-45: Identification of xRAP-HP cable routes
2. Open the two captive screws fastening the xRAP-HP front cover and
remove the cover.
3. Identify the various terminals located on the power source terminal board
by referring to the following figure (shows the terminals at the source A
side; the same board is used at the source B side).
Figure 4-46: Connecting DC power cables to the xRAP-HP
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identify the terminal polarity on the xRAP-HP power terminal

board.
xRAP-HP opening.
5. Attach the lug of the red lead to the positive stud terminal marked (+) on
the power terminal board (see the previous figure).
source B.
the xRAP-HP (see figure in To Ground the xRAP-HP (page 4-77)), and
11. Securely attach the DC input power cables to the rack inner wall using
cable ties.
During the following procedure, refer to the figures illustrating the connectors
in To connect DC input power cables to the xRAP-HP (page 4-78).
To connect the DC power cable for a platform:
xRAP-HP.
2. Insert the DC power cable end terminated in lugs of one XDM platform
through the source A xRAP-HP opening. If two shelves are installed in the
rack, start by connecting the shelf 1 cable.
3. Attach the red lead lug of the platform power cable to the positive stud
terminal of shelf 1 on the power terminal board.
5. Attach the black lead lug of the power cable to the negative stud terminal of
shelf 1 on the power terminal board.
7. Attach the grounding (shield) lead lug of the platform power cable to the
ground stud terminal located on the xRAP-HP side panel.
8. Repeat Step 3 for the grounding lead lug.
9. If a second XDM platform is installed in the rack, repeat Steps 2 to 7 for
the shelf 2 power cable.
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10. If an additional power source is used, repeat Steps 2 to 8 to connect the

the xRAP-HP (see figure in To Ground the xRAP-HP (page 4-77)), and
corresponding platform position, and then securely attach the power cable
to the rack inner wall using cable ties. Attach a tag to each power connector
in accordance with its function.
To install the xRAP-HP circuit breakers:
1. If the xRAP-HP front panel has not been removed, open the two captive
screws fastening the xRAP-HP front cover to the xRAP-HP chassis and
remove the cover (see the following figure).
Figure 4-47: xRAP-HP circuit breakers installation

configuration.
xRAP-HP source A power terminal board, as shown in the previous figure.
4. If two shelves are powered from source A, repeat Steps 2 and 3 to insert the
second circuit breaker into the shelf 2 position of the power terminal board.
5. If an additional power source is used, repeat Steps 2, 3, and 4 above for
source B circuit breakers.
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To check DC voltage polarity:

1. Make sure the correct site grounding test (see Checking site grounding
wiring (page 5-10)) has been passed successfully.
2. Connect the DC input power to the xRAP-HP.
3. Set all the xRAP-HP circuit breakers to ON.
and negative contacts of each power cable.
The following figure identifies the functions of the power cable connector
contacts, as seen when looking into the connector.
Figure 4-48: DC input power connectors pin functions
5. Make sure the voltage is within the allowed range (-40 VDC to -72 VDC),
6. Return all the xRAP-HP circuit breakers to OFF.
7. Disconnect the xRAP-HP input power sources.
8. Reinstall the xRAP-HP front cover and fasten it using the two captive
screws.
To connect the alarm cables to the xRAP-HP:
2. Refer to the figure in To connect DC input power cables to the xRAP-HP
(page 4-78) to identify the xRAP-HP connector functions.
3. Connect the 50-pin D-type connector of the facility alarm monitoring cable
to the xRAP-HP CONTROL CONNECTION connector, and then securely
attach the cable to the rack inner wall using cable ties.
4. Connect the 25-pin connector of the alarm monitoring cable for shelf 1 to
the xRAP-HP EXTERNAL ALARM/CONTROL SHELF 1 connector.
5. Connect the 9-pin D-type connector of the alarms indications cable for
shelf 1 to the xRAP-HP RAP SHELF 1 connector.
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6. Route the two cables along the side of the rack down to the corresponding
shelf position. Attach a tag to each connector in accordance with its
function.
7. If you are installing additional shelves in the rack, repeat Steps 2, 3, 4, and
5 for the cables serving them. Make sure to attach identification tags to
each cable end.
Installing the xRAP-100

NOTE: Skip this section if the xRAP-100 is not used.
Before connecting DC power cables refer to DC Power Cables (page 4-28).

The installation of an xRAP-100 unit consists of the following steps:
2. Install the xRAP-100 in the prescribed location: either at the top of the rack
3. Ground the xRAP-100 to the rack grounding stud.
4. Connect DC input power cables to the xRAP-100.
5. Connect the DC power cables of the XDM shelves to the xRAP-100.
7. Check power wiring.
For a description of the xRAP-100, refer to the XDM-1000 Product Line
Reference Manual.
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Preparing a DC Power Cable for xRAP-100


of residence.
the xRAP-100 source A and source B inputs. Two cables are required, one for
each source.
Each cable consists of two stranded copper leads with a cross section of
35 mm2 (.055 in.2), one red and the other black. Each lead is terminated with a
equipment.
at the prescribed rack location, before attaching the lugs make

sure that the leads are not connected to any live voltage
source.
To prepare a DC power cable for xRAP-100:

1. Strip about 22 mm (1 in.) of the red lead jacket.
or equivalent.
To install the xRAP-100:
Attach the xRAP-100 to the rack side rails in the top position and secure it
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To ground the xRAP-100:

1. Use the following figure to identify the xRAP-100 grounding stud that is
located on its bottom cover.
Figure 4-49: Location of xRAP-100 grounding stud

of Equipment Grounding Requirements (page 1-10).
3. Connect the lug at one end of the grounding lead to the xRAP-100
grounding stud.
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Connecting the DC Input Power Cables to

the xRAP-100
Before you start:
Before starting, identify the openings used to route power cables to the
xRAP-100.
To connect DC input power cables to the xRAP-100:
1. Open the two captive screws fastening the xRAP-100 front cover and
remove the cover.
Figure 4-50: Identification of xRAP-100 cable routes
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2. Identify the various terminals located on the power source terminal boards
in accordance with the following figure. This figure shows the terminals at
the source A side; the same board is used at the source B side.
Figure 4-51: Connecting DC power cables to the xRAP-100
CAUTION: Before starting the connection of the power

leads, make sure to identify the terminal polarity on the
xRAP-100 power terminal board.
xRAP-100 opening.
the power terminals board.
8. If an additional power source (source B) is used, repeat Steps 3 to 7 above
for source B.
the xRAP-100, and attach them to the bracket with cable ties.
10. Securely attach the DC input power cables to the rack inner wall using
cable ties.
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Connecting the DC Power Cable for an XDM

Platform
Before you start:
Before starting, identify the platform power connectors on the xRAP-100 board
in accordance with the following figure.
Figure 4-52: xRAP-100 connector identification
To connect the DC power cable for an XDM platform:

1. Insert the end of the DC power cable near the SOURCE A power
connectors and connect it to the prescribed SHELF power connector (see
previous figure).
CAUTION: The only connector that should be used to
connect power from the xRAP-100 to an XDM-1000 or

XDM-2000 platform is the 5-pin SHELF 4 connector. Other
shelves can be connected with either a 5-pin or 3-pin D-type
connector.
WARNING: It is strictly forbidden to simultaneously connect

two XDM shelves to the same SHELF 4 power connector.

3. If you are connecting additional shelves to the xRAP-100, repeat the above
steps for each platform.
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xRAP-100, and attach them to the retainers with cable ties.
corresponding platform position, then securely attach the power cable to the

components.
Installing the xRAP-100 Circuit Breakers

Before you start:
If the xRAP-100 front panel has not been removed, open the two captive
screws fastening the xRAP-100 front cover to its chassis and remove the cover
(see the following figure).
Figure 4-53: xRAP-100 circuit breakers installation
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To install the xRAP-100 circuit breakers:

(the circuit breaker is included in the installation kit supplied with the
configuration.
xRAP-100 source A power terminal board, as shown in the previous figure.
3. If more than one platform is powered from source A, repeat Steps 2 and 3
to insert the other circuit breaker into the corresponding platform position
of the power terminal board.
circuit breakers.
1. Make sure the correct site grounding test (see Checking site grounding
wiring (page 5-10)) has been passed successfully.
2. Connect the DC input power to the xRAP-100.
3. Set all xRAP-100 circuit breakers to ON.
(A3) and negative (A2) pins of each power cable.
5. Make sure the voltage is within the allowed range (-40 VDC to -72 VDC),
6. Return all xRAP-100 circuit breakers to OFF.
7. Disconnect the xRAP-100 input power sources.
8. Reinstall the xRAP-100 front cover and fasten it with the two captive
screws.
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Connecting Alarm Cables to the xRAP-100

Before you start:
1. Make sure you have all the necessary cables.
2. Use the figure in Connecting the DC Power Cable for an XDM Platform
(page 4-87) to identify the xRAP-100 connector functions.
To connect alarm cables to the xRAP-100:
to the ALARM IN/OUT connector, and then securely attach the cable to the
rack inner wall using cable ties.
for shelf 1 to the SHELF 1 connector on the xRAP-100.
xRAP-100 and attach them to the retainers with cable ties.
function.
5. If additional shelves are installed in the rack, repeat Steps 2, 3, and 4 for the
cables serving the additional shelves. Make sure to attach identification tags
to each cable end.
Installing the miniRAP

The installation of a miniRAP consists of the following steps carried out in this
order:
2. Install the miniRAP in the prescribed location, either at the top of the rack
3. Ground the miniRAP to the rack grounding stud.
4. Connect DC input power cables to the miniRAP.
5. Connect the DC power cables of the XDM-500 shelf to the miniRAP.
6. Install the circuit breakers.
7. Check the DC voltage polarity.
For a description of the miniRAP, refer to the XDM-100 or XDM-1000
Product Line Reference Manual.
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Preparing the DC Power Cables

Before you start:
The DC input power cables connect the two DC power sources to the miniRAP
source A and source B inputs. Two cables are required, one for each source.

should be connected with a blue cable and the negative lead (48 V) with a gray cable. In the following sections that
of residence.
Each cable consists of two stranded copper leads with a cross section of
35 mm2 (.055 in.2), one red and the other black. Each lead terminates with a
equipment.
at the prescribed rack location, make sure that the leads are
not connected to any live voltage source before attaching the
lugs. If appropriate leads have already been prepared at the
prescribed rack location, make sure that the leads are not
connected to any live voltage source before attaching the lugs.
To prepare the DC power cables:

1. Strip about 22 mm (.9 in.) of the red lead jacket.
crimping tool and die. (The recommended tools are Panduit CT-720 with
CD-720-2 die, Klauke K18 with D50 die, or equivalent.)
To attach the miniRAP to the rack:
Attach the miniRAP to the rack side rails in the top position of the rack,
and secure it with the four screws, washers, and nuts supplied in the
installation parts kit.
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To ground the miniRAP:

1. Use the following figure to identify the miniRAP grounding stud, which is
located on its bottom cover.
Figure 4-54: Location of miniRAP grounding stud

in Grounding Requirements (page 1-7).
3. Connect the lug at one end of the grounding lead to the miniRAP
grounding stud.

miniRAP
Before you start:
Identify the openings used to route power cables to the miniRAP by referring
to the following figure.
Figure 4-55: Identification of miniRAP cable routes
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Installation
To connect DC input power cables to the miniRAP:

1. Open the two captive screws fastening the miniRAP front cover and
remove the cover.
2. Identify the various terminals located on the power source terminal board
by referring to the following figure. This figure shows the terminals at the
source A side; the same board is used at the source B side.
Figure 4-56: Connecting DC power cables to the miniRAP
CAUTION: Before you start connecting the power leads,
make sure to identify the terminal polarity on the miniRAP

power terminal board.
miniRAP opening.
8. If you are using an additional power source (source B), repeat Steps 2 to 7
for source B.
9. Route the DC input power cables towards the cable supports at the rear of
the miniRAP (see Location of miniRAP grounding stud (page 4-92)), and
attach them to the supports with cable ties.
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Connecting the DC Power Cable

Before you start:
Identify the openings used to route power cables to the miniRAP by referring
to figure Identification of miniRAP cable routes (page 4-92).
To connect the DC power cable for the shelf:
1. Insert the end of the DC power cable terminating with a male 3-pin D-type
connector near the SOURCE A power terminals and connect it to the shelf's
power connector (see the following figure).
Figure 4-57: miniRAP connectors

3. If you are using an additional power source, repeat the above steps to
connect the shelf to source B.
4. Route the DC power cables towards the cable supports at the rear of the
miniRAP (see Location of miniRAP grounding stud (page 4-92)), and
5. Route each shelf power cable along the rack side rails down to the
corresponding shelf position, and then securely attach the power cable to
the rack inner wall using cable ties. Attach a tag to each power connector in
NOTE: Connect the cables to the shelf only after installing it
and all other components.
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Installation
To install the miniRAP circuit breakers:

1. If the miniRAP front panel has not been removed, open the two captive
screws fastening the miniRAP front cover to its chassis and remove the
Figure 4-58: Installing miniRAP circuit breakers
2. Identify the circuit breaker corresponding to the shelf's power circuit A.

The circuit breaker is included in the installation parts kit supplied with the
equipment, and its rating corresponds to the ordered shelf configuration.
miniRAP source A power terminal board, as shown in the previous figure.
4. If you are using an additional power source, repeat Steps 2 and 3 for source
B circuit breaker.
1. Connect the DC input power cable to the miniRAP.
2. Set all miniRAP circuit breakers to ON.
(pin A3) and negative (pin A2) pins of each power cable.
5. Return all miniRAP circuit breakers to OFF.
6. Disconnect the miniRAP input power sources.
7. Reinstall the miniRAP front cover and fasten it using the two captive
screws.
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Connecting the Alarm Cables to the miniRAP

Before you start:
Refer to the miniRAP connectors (page A-24) to identify their functions, and
make sure you have all the necessary cables.
To connect the alarm cables to the miniRAP:
1. Connect the 26-pin SCSI connector carrying the shelf's severity alarms to
the miniRAP SEVERITY IN connector.
2. Connect the 26-pin SCSI connector of the client's facility severity alarms
monitoring cable to the miniRAP SEVERITY OUT connector.
3. Route the alarm cables towards the cable supports at the rear of the
miniRAP (see Location of miniRAP grounding stud (page 4-92)), and
shelf position. Attach a tag to each connector in accordance with its
function.
Installing the FST

The installation of an FST unit consists of the following steps:
To mount the FST on the rack:
1. Attach the FST to the rack rails and secure it using the four supplied
screws, washers, and nuts.
2. Prepare the necessary fibers according to the site cabling diagram and the
detailed cabling diagrams or tables of each platform. When preparing the
fiber, refer also to the safety information appearing in Before You
Start/Safety Guidelines (page 1-1).
3. Label the cables in accordance with the cabling diagrams or tables.
4. Thread the optical fibers into the conduits running along the front supports
of the ECI's recommended rack.
5. Push the front panel of the FST to release the latch, and then pull the FST
towards you to open it.
NOTE: The FST has two opening positions. The tray latches
with a click at the halfway position. Pull it again to open it
fully so that you can thread the fibers.
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Installation
6. Thread the fibers into the FST, as illustrated in the following figure.
Figure 4-59: Threading optical fibers in the FST
7. Run the fibers up to the level of the corresponding optical connector.

8. Return the FST to the rack until it latches in place with a click.
CAUTION: Make sure that all the optical connectors are
closed at all times with the appropriate protective caps or with

the mating cable connector. Do not remove the protective cap
until an optical fiber is connected to the corresponding
connector, and immediately install a protective cap after a
cable is disconnected.
The minimum bending radius of optical fibers is 35 mm
(1.4 in.). Sharp bending of fibers may degrade the optical
transmission characteristics.
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Installing the ODF

Identify the prescribed ODF locations in the rack before performing the
following procedures.
The ODF is supplied with two sets of rack mount brackets: one for 19 in. and
ETSI racks, and the other for 23 in. 7 ft. racks. The 19 in./ETSI rack mount
brackets can be used for both ETSI and 19 in. racks.
To attach the rack mount brackets to the ODF:
1. Refer to the following figure to identify the required set of rack mount
brackets.
2. Attach each bracket with three screws to the corresponding ODF side
panel, as shown in the figure.
Figure 4-60: Attaching rack mount brackets to the ODF
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Installation
To connect optical fibers to the ODF:

1. Push the release button on the ODF front panel to the left to release the
latch and pull it towards you. The cover opens downwards.
Figure 4-61: ODF front panel
Figure 4-62: ODF open view
2. Hold the end of the swing-out tray and pull it out to gain access to the ODF
components.
3. Open the two cover thumb nuts and remove the protective cover from the
ODF splice support.
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4. Insert the external fibers cable through the protective tube.
Figure 4-63: ODF fiber routes
5. Route the fiber ends through the cable guides to the splice support area.
6. Identify the adapter panel pigtail to be spliced to each user fiber.
7. Insert splicing sleeves over the pigtail, splice the user fiber to the pigtail,
and slide the splicing sleeve over the splice.
8. Place the splicing sleeve in one of the slots in the splice support.
NOTE: When more than 12 fibers are connected to the ODF,
first start filling the slots of the lower splice support. After the
slots are occupied, reinstall the top splice support and
continue filling the support slots.
9. After splicing all the fibers, reinstall the protective cover removed in Step
3.
10. Push the swing-out tray back into the unit.
11. Close the ODF front cover by pushing it up till it clicks to the unit.
12. Refer to Attaching rack mount brackets (page 4-98) and secure the user
fibers with cable ties to the fiber-fastening bracket at the rear of the ODF.
CAUTION: To prevent damage to fibers, do not tighten the
cable ties.
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Installation
To install ODF units in a rack:
Install each ODF in the prescribed rack position and fasten it to the rack
side rails with four screws.
Installing DDF Units

The Digital Distribution Frame (DDF) is supplied with two sets of rack mount
brackets: one for 19 in. racks, and the other for ETSI racks.
To install the DDF units:
1. Attach the appropriate brackets to each DDF as explained for the ODF in
Installing the ODF (page 4-98).
2. Install the DDF units in the prescribed rack positions. Each DDF is
fastened to the rack side rails by four screws.
Each DDF has openings on its sidewalls for routing the cables to be
connected to its panel. Therefore, it is not necessary to leave free space
between stacked DDF units.
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5
XDM-500 Platform
Installation
In this chapter:
Overview ......................................................................................................... 5-1
Assembling the XDM Platform in a Rack ....................................................... 5-2
Installing Air Filters......................................................................................... 5-6
Connecting Power and Rack Alarm Cables to the Platforms ........................ 5-10
Overview
This section provides installation instructions for the XDM-200, XDM-500,
XDM-1000, and XDM-2000 platforms. As a standard, XDM platforms are
supplied with the INF, FCU, and ECB already installed. Therefore, the
installation activities covered in this section include:
1. Assembling an XDM platform in a rack.
2. Grounding.
3. Installing air filters in the platform.
4. Installing xMCP and MECP cards in the XDM platform.
5. Connecting power and rack alarm cables to the platform.
6. Installing heat buffers and cable guides (when relevant).
Once you have performed these activities, the XDM platform is ready for the
installation of the prescribed cards and modules. The platform front door will
be installed only after completing the installation of cards and modules, and
after connecting cables to the cards cage.
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WARNING: Before starting, make sure that the DC power is
not connected to the rack, and that the circuit breakers in the
xRAP or in the user-provided power distribution panel are set
to OFF.
CAUTION: Before installing the XDM platform, visually
inspect the pins of the backplane connectors for bent pins and
any other signs of physical damage. Do not install the
platform if connector pins are bent or touching, as this may
cause severe damage to the backplane.
Assembling the XDM Platform in

a Rack
Before you start:
NOTE: A dedicated installation kit (the US installation kit) is
needed for installing XDM platforms in 19 in. racks.
To assemble the XDM platform in the rack:

1. Identify the prescribed position of the XDM platform in the rack based on
the rack installation plan.
CAUTION: When installing the XDM platform at the bottom
of the rack, leave sufficient free space below the platform.
The minimum required space is obtained when you skip two
mounting holes from the bottom of the rack.
2. Locate the cage nut holes in the rack frame. The cage nut holes appear at
intervals running up and down the front of the two sides of the rack frame.
Cage nut holes are used to hold the cage nuts with which the different
accessories are attached to the rack frame.
3. Insert cage nuts into the holes located at intervals along the length of the
rack frame, on both sides of the rack. Install cage nuts in the holes at the
correct height for the equipment being installed in the rack, based on your
specific equipment installation plan.
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4. Obtain help from an additional person to place the XDM platform in its
prescribed position, and then insert the platform guide posts in the
matching holes in the rack side rails. This will help keep the platform in
position until fastened to the rack with the screws.
5. Have the other person hold the XDM platform in place, and fasten the
platform to the rack side rails with four M6 screws, washers, and nuts.
6. Repeat Steps 1 and 2 above for each platform to be installed in the rack
(when relevant).
Grounding the Platform

Before you start:
1. Review the instructions in Grounding Requirements (page 1-7) and
Grounding Cables (page 4-24).
2. Obtain the required materials and make sure to perform the grounding
connections according to these requirements.
NOTE: The information presented below is illustrated by
means of an XDM platform in a rack with an ECI xRAP unit.
If a user-provided power distribution panel is used, it is the
user's responsibility to meet the grounding requirements in
accordance with the instructions given below.
WARNINGS:
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To prevent possible damage to XDM equipment, all racks

and equipment must be completely grounded before
connecting to the platform any external devices powered
from any DC or AC source (100-230 V). All grounding
procedures described here must be completed before, for
example, connecting an external PC to configure and
initialize the NE management system.
The thickness of the protecting grounding cable must be at
least the same thickness as the corresponding power cable.
This means:
The thickness of the rack grounding cable must at least
match the thickness of the xRAP power cable.
The thickness of the platform grounding cable must at
least match the thickness of the power cable from the
xRAP to the platform.
For more information, see Grounding Cables (page 4-24).
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Maintenance Manual
To ground the connections:

1. Verify that the rack and xRAP are grounded correctly, as described in
Grounding the Rack (page 4-42) and the relevant grounding section in
Installing Ancillary Units in Racks (page 4-44).
2. For each XDM platform installed in the rack, prepare a 50 mm2 grounding
cable according to the instructions in Grounding Cables (page 4-24).
The grounding cable nuts, washers, lugs, and bolts are all included with the
XDM platform. These accessories are delivered attached to the
corresponding grounding points. Remove the parts as needed from the
grounding points. Attach the lugs to the cable ends, in accordance with the
instructions in Grounding Cables (page 4-24).
3. Connect the lug at the end of the grounding cable to one of the pairs of
grounding points on the right side of the rack grounding bar. To secure the
grounding cable lug to the grounding bar, hold the two holes in the cable
lug against the two grounding points on the bar and place the flat washers
above the cable lug, followed by the serrated lock washers. Screw in the
bolts to hold everything in place. Tighten the bolts with a torque of 450 N
cm to 550 N cm.
4. Run the platform grounding cable from the rack grounding bar to the right
side of the rack.
5. Thread the grounding cable through an opening into the cable conduit. The
cables should now run down the right side of the rack.
6. Draw the grounding cable out of the cable conduit by gently threading it
through one of the openings level with the grounding studs on the XDM
platform.
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7. Connect the lug at the free end of the grounding cable to the grounding
studs on the platform. Note that the lug at the end of the grounding cable
must be inserted over both grounding studs.
Figure 5-1: XDM shelf and rack grounding (NEBS-compliant)
8. Secure each lug connection using the flat washer, serrated lock washer, and
nut. Tighten the nuts with a torque of 450 N cm to 550 N cm.
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Installing Air Filters

This section describes the air filters offered by ECI and provides instructions
for installing them.
Air filters are available as an ordering option for XDM-500 platforms. They
can also be separately ordered for installation on platforms at customers
premises.
The purpose of the air filter is to reduce the accumulation on the internal
components of dust and dirt carried by the cooling air flowing through the
platforms. The combination of dust and humidity produces a
capacitive/conductive layer between components installed on cards that may
degrade equipment performance or even cause malfunctions. Moreover, the
insulating effect of a dust layer causes components to operate at higher
temperatures, and this may decrease equipment reliability.
An air filter reduces dirt accumulation preventing degradation of equipment
reliability and performance. On the other hand, filters increase the resistance to
airflow, and therefore the appropriate type should be selected in accordance
with the actual operating conditions. ECI offers two types of air filters (both
suitable for XDM-500 platforms):
Low-density foam filter, with a density of 10 pores per inch (PPI)
High-density foam filter (45 PPI), for extremely dusty sites and when
NEBS compliance is required
NOTE: It is not recommended to use air filters in
environments that enable normal operation without direct air

filtering, for example, in air-conditioned sites.
The air filter is attached under the platform below the xFCU units, using a
dedicated installation kit.
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The following figure shows a general view of the air filter and its installation
kit. This kit includes a frame with a removable front panel and the hardware
(seven spacers) needed for its installation under the platform.
Figure 5-2: Air filter and installation kit
Installing the Air Filter

Before you start:
1. Obtain the air filter and its installation kit.
2. Prepare a Philips screwdriver.
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Maintenance Manual
Installing the Filter Frame

For the procedure steps, refer to the following figure.
Figure 5-3: Installing the air filter frame
To install the air filter frame on the platform:

1. Open the installation kit and remove the supplied hardware.
2. Attach the front panel to the air filter frame, using the two captive screws
located on the panel.
3. Insert the seven spacers into the filter frame. When properly inserted, a
spacer snaps in place and is permanently locked.
4. Align the spacers located on the frame with the mating holes under the
platform, and then press the frame until the spacers snap in place and
secure the frame to the platform.
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To install the air filter in its frame:

1. Release the two captive screws fastening the filter front panel, and remove
the panel.
2. Identify the filter's air intake side, indicated by two coding tabs.
3. Insert the clean filter in the holding frame with the air intake side facing
downwards, and slide it backwards until its front edge is flush with the
front frame edges. For air filter maintenance please refer to Recommended
Cleaning Methods (page 9-7).
Figure 5-4: Installing the air filter in its frame
4. Reinstall the filter front panel and fasten it to the frame with its two captive
screws.
CAUTION: Install only a filter of the original type. Failure to
do so can impair equipment reliability and performance.
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Connecting Power and Rack

Alarm Cables to the Platforms
Checking Site Grounding Wiring
Proper operation of XDM equipment requires that the positive supply line be
connected to the common ground (CGND) of the site at the power source, in
accordance with ETS300132-2.
The following figure shows a simplified diagram of the connections to CGND
suitable for the installation of XDM platforms.
Figure 5-5: Grounding connections at typical site
Correct grounding is critical, and therefore it is necessary to check the

connections before applying power to the equipment installed in the rack.
When two independent power sources are used, the test must be performed
separately for each source.
If a problem is detected during the test, the site wiring must be repaired before
continuing.
The check is made with a standard DVM, using the following procedure.
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To check for proper grounding wiring:

1. Measure and record the output voltage of the power supply at the power
supply terminals. Make sure that it is within the specified limits (XDM
equipment can use -40 VDC to 72 VDC).
2. At the xRAP: Measure and record the voltage between the positive (red)
lead of the power source and the xRAP metallic body. The voltage
difference must not exceed 5 V.
3. At the xRAP: Measure and record the voltage between the negative (black)
lead of the power source and the xRAP metallic body. The voltage
difference must not exceed the supply voltage measured in Step 1, and must
be within 5 V of the measured voltage.
For example, if the power supply voltage is -48 VDC, the voltage measured
in this step cannot be more negative than -48 VDC, nor more positive than
-43 VDC.
Connecting via XDM-500 xRAP

Connect the power cables to the XDM-500 shelf through an xRAP unit through
the following steps.
To connect the power and bay alarm cables to the shelves:
Connect the power and bay alarm cables from the xRAP to the xINF and
xFCU units of each XDM platform. The xRAP-D installation procedure is
described in Installing the xRAP-D (page 4-45), the xRAP-B installation
procedure is described in Installing the xRAP-B (page 4-63), the xRAP-HP
installation procedure is described in Installing the xRAP-HP (page 4-73),
and the xRAP-100 installation procedure is described in Installing the
xRAP-100 (page 4-82).
As part of the xRAP installation procedure, cables are routed from the
appropriate xRAP connectors, as specified in the rack installation plan,
toward each XDM platform installed in the rack. At this stage, connect the
free ends of these cables, in accordance with the rack installation plan and
the cable tags, to the appropriate XDM platform connectors.
NOTE: At this stage, you may also install accessories such as
heat buffers and cable guides which sit above the XDM
platforms.
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Maintenance Manual
The complete list of cables connecting between the XDM platforms and the
xRAP unit is shown in Connecting power and bay alarm cables.
The DC power connectors are located on the xINF units.

The ALARM and RAP connectors of the XDM-500 shelves are located
on the auxiliary connectors panel. See XDM-500 slots identification
(page 6-4).
Figure 5-6: Auxiliary connector panel

Table 5-1:
Connecting power and rack alarm cables
XDM platform side
xRAP connector
xINF 1 POWER IN
Connection of DC power
from source A to the
XDM platform.
SOURCE A power terminal

board - PLATFORM 1
terminals
xINF 2 POWER IN
from source B to the
XDM platform.
SOURCE B power terminal

board - PLATFORM 1
terminals
ALARMS
Connection of platform
alarm inputs and outputs.
EXTERNAL
ALARM/CONTROL PLATFORM 1
RAP
alarm indications (relays
and buzzer).
RAP - SHELF 1
xINF 1 POWER IN
from source A to the
XDM platform.
SOURCE A power terminal

board - PLATFORM 2
terminals
xINF 2 POWER IN
from source B to the
XDM platform.
SOURCE B power terminal

board - SHELF 2 terminals
ALARMS
alarm inputs and outputs.
EXTERNAL
ALARM/CONTROL SHELF 2
RAP
alarm indications (relays
and buzzer).
RAP- SHELF 2
Connector
5-12
Cable function
Platform
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Connecting via Client-provided Power

Distribution Panel
The connection of power to the XDM platforms can also be made by means of
a client-provided power distribution panel. In this case make the connections in
accordance with the procedure given in Connecting via XDM-500 xRAP (page
5-11), but with appropriate modifications to your specific installation.
Note, however, that the XDM xRAP unit provides not only power connection
functions, but also enable connecting to the platform alarm and alarm
monitoring interfaces. Such connections require special protected interfacing,
and therefore are possible only when an XDM xRAP unit is used. Therefore
skip the rack alarm cable connection instructions given in Connecting via
XDM-500 xRAP (page 5-11).
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6
Card and Module Installation
In this chapter:
Overview ......................................................................................................... 6-1
Card Installation Precautions ........................................................................... 6-3
XDM-500 Slot Utilization ............................................................................... 6-4
Installation Data for XDM-500 I/O Cards and Associated Modules............... 6-6
Using Electrical Interface Protection Modules ................................................ 6-9
Preparing Cards and Modules for Installation ............................................... 6-10
Installing CMBR40 and TRP40_2 Cards for Different Configuration Options6-6
Installing xMCP Cards .................................................................................. 6-73
Installing xMCP-B/B2G Cards ...................................................................... 6-75
Installing MECP Cards .................................................................................. 6-78
Installing Aurora-G Cards ............................................................................. 6-79
Installing I/O Cards and Modules .................................................................. 6-90
Installing a Card in the CCP Cage ................................................................. 6-92
Overview
This chapter describes how to insert cards into XDM platform slots.
Card insertion is essentially not complicated. Take the card, make sure that all
pins and connectors are straight, and gently insert the card into the appropriate
slot. It should slide in easily. The same standard installation instructions
generally apply to all cards of the same type.
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This chapter explains standard installation of cards. One or more of the

following steps apply:
Identify the slot into which you wish to insert the I/O card. Specific
information about slot capacities and limitations are provided in XDM-500
Slot Utilization (page 6-4).
Prepare the electrical interface protection modules (if any) that you plan to
use, as described in Using Electrical Interface Protection Modules.
XDM I/O cards often work with a variety of slide-in or plug-in modules
and components. Most of these modules and components can be inserted
and replaced while the system is running (hot insertion). However, when
initially installing and starting a system, you should first prepare the I/O
cards by inserting the modules and components, and only afterwards insert
the cards into the appropriate slots. This simplifies the initial system setup
and configuration. Instructions for sliding these modules and components
into the relevant I/O cards are provided in Preparing Cards and Modules for
Installation (page 6-10). The CMBR40 and TRP40_2 cards can require
special installation steps when installed for certain configurations. These
steps are provided in Installing CMBR40 and TRP40_2 Cards for Different
Configuration Options (page 6-69)
Insert any xMCP or xMCP-B cards included with your system into the
selected C1 and/or C2 slots, as described in Installing xMCP Cards (page
6-73) and Installing MECP Cards (page 6-78).
Insert any Aurora cards included with your system into the selected I/O
card slots and configure the cards for use, as described in Installing AuroraG Cards (page 6-79).
Insert any I/O cards included with your system into the selected I/O card
slots, as described in Installing I/O Cards and Modules (page 6-90).
Insert any CCP cards included with your system into the selected modules
cage slots, as described in Installing a Card in the CCP Cage (page 6-92).
Before you begin to install cards, be sure to read the precautions in Card
Installation Precautions (page 6-3).
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Card Installation Precautions

After the platform has been installed and grounded, you can install the cards.
Before you start:
When installing cards, make sure to carefully align the card with the platform
guide rails. Hold the card straight during insertion and removal, and pull or
push it slowly and carefully to avoid touching components located on adjacent
cards/modules.
CAUTION: If you feel resistance when inserting cards,
immediately retract the card and repeat the process.
CAUTION:
Do not use excessive torque when tightening the card

fastening screws.
Do not exert excessive torque when tightening the screws
that secure the optical transceiver plug-in modules to the
base card.
Excessive tightening torque may cause permanent damage

to the equipment.
CAUTION: STATIC SENSITIVE DEVICES

PROPER HANDLING AND GROUNDING
PRECAUTIONS REQUIRED
electrostatic discharge (ESD). To prevent ESD damage, avoid
touching the internal components, and before handling cards,
touch the frame of a grounded equipment or rack. Keep parts
and cards in their antistatic packaging material until you are
ready to install.
The use of an antistatic wrist strap connected to a grounded
equipment frame or rack is recommended when handling
cards during installation, removal, or connection to internal
connectors.
NOTE: Do not remove plastic covers from optical connectors

until optical fibers are connected to them.
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Maintenance Manual
XDM-500 Slot Utilization

The following figure shows a general view of the XDM-500 shelf and
identifies its slots. For more information, see the XDM-1000 Product Line
Reference Manual and the XDM System Specifications.
Figure 6-1: XDM-500 slots identification
Most optical I/O slot cards can be installed in any I/O slot. Some optical cards
are double I/O slot cards that can only be installed in specific pairs of slots. For
more information about slot requirements for optical cards, see each card's
description in the XDM-1000 Product Line Reference Manual.
NOTE: If you are installing two TRP40_2 or CMBR40 cards as
an OCH 1 + 1 protection pair, see Installing Two TRP40_2 or
CMBR40 Cards as an OCH 1+1 Protection Pair (page 6-71) for
slot information and other installation instructions.
If you are installing two TRP40_2 cards in regenerator mode, see
Installing TRP40_2 Cards for Regenerator Mode (page 6-69) for
slot information and other installation instructions.
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Common cards, such as HLXC and XIO cards, affect the capacity of each I/O
slot. The following table provides installation data for certain XDM-500 I/O
cards and associated modules. Use this data to determine which slots you can
use for each type of card. For more information about DWDM modules, see the
XDM Reference Manual and the XDM System Specifications.
NOTE: When an XIO card is installed in the shelf, the table
lists the slots that enable PIO and SIO cards to use their full
service bandwidth. However, PIO and SIO cards may also be
installed in slots with a lower service bandwidth, provided the
bandwidth configured for the card does not exceed the slot
service bandwidth.
NOTE: The information in this book includes cards,
components, and modules that are at an EOL stage and no

longer marketed commercially. However, due to their high
quality, durability, reliability, and utility, some of these
components are still in use.
ECI continues to provide technical support when necessary.
As a result, we are leaving technical information about these
components in the reference documentation for the
convenience of users still working with these components.
417006-2304-0H3-B02
6-5
XDM-500 Installation and Maintenance Manual
Installation Data for XDM-500 I/O Cards and

Associated Modules
Table 6-2:
Installation Data for XDM-500 I/O Cards and Associated Modules
Service type
Card
Slots with HLXC192
Slots with XIO192 10
Slots with XIO384F 11
Electrical interface
module type
Protection module type
SDH
SIO1&4, SIO1&4M optical
IC1 to IC6
IC1 to IC6
IC1 to IC6
None (optical interface)
Not applicable
SIO1&4, SIO1&4M electrical 12
IC1, IC2, IC5, IC6
IC1, IC2, IC5, IC6
IC1, IC2, IC5, IC6
M1_16BT, M1_16DI
M1_16P
M1_8BT, M1_8DI
None
13
SIO1&4B optical
IC1 to IC6
IC2 to IC5
With xMCP-B:
IC1 to IC6
With xMCP:
IC3 and IC4 only
Not applicable
SIO1&4B with CCP module
IC1, IC2, IC5, IC6
IC2, IC5
With xMCP-B:
IC1, IC2, IC5, IC6
With xMCP:
not available
M1_16SFP
Not applicable
SIO16, SIO16M
IC1 to IC6
IC2 to IC5
IC1 to IC6
Not applicable
SIO16_2B
IC1 to IC6
IC2 to IC5
IC1 to IC6
Not applicable
SIO16_4B
Not applicable
Not applicable
IC3 and IC4
Not applicable
10
XIO192 supports two configurations; one STM-16 with one STM-4 interface, or one STM-16 with four STM-1 interfaces.
XIO384F supports one STM-64/OTU2 or four STM-16/OTU1 ports in each slot.
PIO345 and SIO1&4 (DS-3 and E3 electrical interfaces) can only be installed in slots IC2 or IC5.
13
SIO1&4B requires use of xMCP-B or regular xMCP with minimum of 256 MB RAM memory. A Regular xMCP with only 128 MB RAM cannot support the SIO1&4B.
11
12
6-6
417006-2304-0H3-B02
Service type
Card
Slots with HLXC192
module type
SIO64, SIO64M, SIO64MF
IC2+IC3 or IC4+IC5
(double-slot card)
IC2+IC3 and/or
IC4+IC5 (double-slot
card)
IC2+IC3 and/or
card)
Not applicable
Not applicable
SIO64B
PDH
SIO164
Not applicable
Not applicable
card)
Not applicable
PIO2_21
IC1, IC2, IC5, IC6
IC1, IC2, IC5, IC6
IC1, IC2, IC5, IC6
M2_21B, M2_21U,
M2_84
M2_84P
M2_84P
Not applicable
M2_84B, M2_84U
M2_84P
M2_84BR, M2_84UR
Not applicable
PIO2_84
PIO345_16, PIO345M_16
IC1, IC2, IC5, IC6
IC1, IC2, IC5, IC6
IC1, IC2, IC5, IC6
IC1, IC2, IC5, IC6
IC1, IC2, IC5, IC6
IC1, IC2, IC5, IC6
M345_16BT, M345_16DI M345_16P

M345_8BT, M345_8DI,
M345_8BN
Data/MPLS
14
DIO1_40
IC1 to IC6
IC2 to IC5
Not applicable
Not applicable
DIO1_61
IC1 to IC6
IC1 to IC6
Not applicable
Not applicable
DIO1_80
IC1 to IC6
IC2 to IC5
Not applicable
Not applicable
EIS2_8, EIS2_14 (optical interfaces IC1 to IC6

only)
IC2 to IC5
IC1 to IC6
Not applicable
EIS2_8, EIS2_14 (optical and

electrical interfaces)
IC1, IC2, IC5, IC6
IC2, IC5
IC1, IC2, IC5, IC6
ME_8, ME_14 14
Not applicable
EIS8_8 (optical interfaces only)
IC1 to IC6
IC2 to IC5
IC1 to IC6
Not applicable
EIS8_8 (optical and electrical

interfaces)
IC1, IC2, IC5, IC6
IC2, IC5
IC1, IC2, IC5, IC6
ME_8, ME_14
Not applicable
To use the full EIS capacity, use ME_14.
417006-2304-0H3-B02
6-7
Card
Slots with HLXC192
module type
DIOB (optical interfaces only)
IC1 to IC6
IC2 to IC5
IC1 to IC6
Not applicable
DIOB (optical and electrical

interfaces)
IC1, IC2, IC5, IC6
IC2, IC5
IC1, IC2, IC5, IC6
ME16
Not applicable
DIOBH 15 (optical interfaces only)
IC1 to IC6
IC2 to IC5
IC1 to IC6
Not applicable
DIOBH (optical and electrical

interfaces)
IC1, IC2, IC5, IC6
IC2, IC5
IC1, IC2, IC5, IC6
ME16
Not applicable
MCS5 (optical interfaces only)
IC1 to IC6
IC2 to IC5
IC1 to IC6
Not applicable
MCS5 (optical and electrical

interfaces)
IC1, IC2, IC5, IC6
IC2, IC5
IC1, IC2, IC5, IC6
ME16
Not applicable
MCS10 (optical interfaces only)
Not applicable
Not applicable
IC3, IC4
Not applicable
MCS30_x10G (optical interfaces

only)
Not applicable
Not applicable
IC3, IC4
Not applicable
ASON
ACP1000
MC1 to MC4
MC1 to MC4
MC1 to MC4
Not applicable
Not applicable
Encryption
Aurora-G
IC1 to IC6
IC1 to IC6
IC1 to IC6
Not applicable
Not applicable
ATM
ATS
IC1 to IC6
IC1 to IC6
IC1 to IC6
Not applicable (no

external interfaces)
Not applicable
Service type
15
DIOBH is a software configuration of DIOB for use in 2.5 Gbps slots.
6-8
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Maintenance Manual
Using Electrical Interface

Protection Modules
Protection modules are available for I/O cards with electrical interfaces. The
protection module enables the automatic replacement of a malfunctioning I/O
card with an I/O card of the same type associated with the slot in which the
protection card is installed.
The protection capabilities for XDM-500 shelves equipped with HLXC/XIO
cards are as follows:
Protection for E1 I/O cards. The protection module for this type of I/O
interface, designated M2_84P, can serve both balanced and unbalanced
interfaces. The M2_84P module can be installed in any one of the M1 to
M6 slots, and the associated PIO2_84 card protects all the other PIO2_84
cards. For an XDM-500 fully equipped with PIO2_84 cards, the resulting
protection ratio is 1:4; higher protection ratios are achieved when the
number of PIO2_84 cards installed in the shelf is lower than 4.
Protection for E3/DS-3/STS-1 I/O cards. The protection module for this
type of interface is designated M345_16P. The M345_16P module can be
installed in slots M1 or M2 or M5 or M6; in this case, the PIO345_16 card
installed in slot I1, I2, I5 or I6 protects all the other PIO345_16 cards.
For an XDM-500 fully equipped with PIO345_16 cards, the resulting
protection ratio is 1:4; higher protection ratios are achieved when the
number of PIO345_16 cards installed in the shelf is less than 4.
Protection for STM-1 electrical I/O cards. The protection module for this
type of interface is designated M1_16P. The M1_16P module can be
installed in slots M1 or M2 or M5 or M6; in this case, the SIO1_16e card
installed in slot I1, I2, I5 or I6 protects all the other SIO1_16e cards.
NOTE: In the XDM-500 there is no option to protect a
PIO345 card and a SIO1&4 card on the same shelf. Unlike
the XDM-1000, the XDM-500 has only one high order
protection for STM-1 or DS-3/E3 interfaces.
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Maintenance Manual
Preparing Cards and Modules for

Installation
In order to provide cost-effective performance in various application
environments, ECI offers different types of optical transceivers for I/O cards
with optical interfaces. The optical transceivers are provided as plug-in
modules that are installed directly in the base card or on extractable optical
modules. If not yet installed, the optical transceiver plug-in modules must be
installed on the I/O base card before inserting the card in the platform. The
auxiliary (AUX_2X) and OADM1&4 cards can also be equipped with various
types of plug-in modules.
Some of the plug-in and extractable modules can be installed in operating
cards, provided the appropriate safety precautions (see "Installing XDM-500:
Before You Start Safety Guidelines" page 1-1) are strictly observed. This
enables field upgrading of installed equipment, either by adding new interfaces
to increase the number of ports or by replacing the optical transceivers with
units having improved performance or higher capacity.
The following sections provide instructions for installing optical transceivers
and extractable plug-in modules in the various types of cards that support this
capability.
6-10
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Maintenance Manual
Installing and Removing Optical

Transceivers
This section provides general instructions for installing SFP and XFP plug-in
transceivers on optical modules and base cards.
The instructions are illustrated for SFPs. However, the same procedure applies
to XFPs as well.
CAUTION: During the installation of SFP or XFP
transceivers, make sure that all optical connectors are closed

by protective caps.
Do not remove the covers until an optical fiber is connected
to the corresponding connector. Be aware that the SFP/XFP
transmitter may start transmitting as soon as it is inserted into
a working card.
To install an SFP transceiver:

1. Identify the prescribed SFP installation position according to the site
installation plan.
2. Check that the SFP has not been physically damaged during shipment, and
that the antistatic protection bag of the original packaging is sealed.
3. Remove the SFP from its antistatic protection packaging and perform a
visual inspection to detect damage during shipping. Report any problems.
4. Record the hardware and software versions indicated on the SFP
identification labels.
5. Remove the protective covers from the SFP cage and from the SFP
electrical connector.
6. Open the bail wire/tab to serve as a handle. This is illustrated in Step 1 in
the following figure.
7. Insert the rear end of the SFP into the cage, and push slowly backwards to
mate the connectors until the SFP clicks into place. This is illustrated in
Step 2 in the following figure.
If you feel resistance before the connectors are fully mated, retract the SFP
and repeat the procedure.
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Maintenance Manual
8. Push up the bail wire/tab. This is illustrated in Step 3 in the following

figure.
Figure 6-2: Inserting an SFP into an optical module
NOTE: SFP installation follows the same procedure no
matter what type of base contains the SFP cage and

connector. SFPs are modular components used on a wide
range of cards and modules that all share the same installation
method.
To remove an SFP transceiver:

1. Open the bail wire/tab to serve as a handle.
2. Gently remove the SFP from the slot, using the special extractor tool
provided with each XDM platform.
This tool has the general appearance of a pair of tweezers, with the tip of
one of its legs bent inwards. Use the extractor tool to help you disengage
LC and SC optical plugs from the mating connectors in the various cards
where the connectors cannot conveniently be reached by hand. The
extractor tool is placed in a special holder, located in the external left-hand
wall of the XDM platform.
6-12
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Maintenance Manual
Preparing SIO1&4 Cards for Installation

SIO1&4 cards intended for use with optical interfaces can be equipped with up
to four extractable optical modules. Live insertion and hot swapping are
allowed. Two main types of optical modules are available for SIO1&4 cards:
Quad STM-1 extractable optical module with four independent transceivers
STM-4 extractable optical module with a single transceiver
Each type of extractable module is available in two versions: with built-in

transceivers, or with transceivers located on removable SFPs.
Installing Extractable Modules in SIO1&4

Cards
The following figure shows how to install extractable modules (quad STM-1
optical modules in positions 1 and 2, and STM-4 optical modules in positions 3
and 4).
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Maintenance Manual
To install an extractable optical module:

1. Identify the prescribed position on the base card (see the following figure).
Figure 6-3: Installing extractable OM01_4 and OM04_1 optical modules in

SIO1&4 cards
2. Insert the rear end of the module into the card guides, and push slowly
backward to mate the connectors. Make sure the fastening screw is free to
move backward as the module slides in. If resistance is felt before the
connectors are fully mated, retract the module and repeat the insertion.
3. Fasten the module with its captive screw.
6-14
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Maintenance Manual
Upgrading to Optical Modules with

Removable SFPs
The optical modules with removable SFPs are available from V5. These
modules can be installed as an upgrade on existing SIO1&4 cards. The upgrade
involves:
1. Removing the existing optical module.
2. Installing the replacement.
3. Inserting the required SFP(s) in the module.
NOTE: The optical modules with removable SFPs are
slightly longer and it is therefore recommended to connect

only patch cords with short boots. Install optical attenuators
only at the ODF but not on the transceiver connectors
(placing the attenuators on the transceiver may require using
the special extended door on the shelf, as explained in Deep
doors vs. standard doors (page 4-3)).
The upgrade procedure can be performed on working SIO1&4 cards. However,

after installing the new extractable modules, it is necessary to perform a cold
reset to the card (including the interfaces located on the modules that have not
been replaced).
With regard to the OM16, it is necessary to reassign the OM16-1SFP and the
OTR16.
NOTE: If the interfaces to be replaced are protected, it is
recommended to switch to protection before starting the
upgrade procedure.
To upgrade to optical module with removable SFPs:

1. Before replacing any transceiver, prepare a sketch identifying each fiber
connected to the transceiver for use when reconnecting the fibers.
2. Identify the position of the optical module to be replaced on the base card
3. Disconnect the fibers connected to the optical module.
4. Release the captive screw fastening the optical module to the base card.
5. Pull out the optical module to be replaced and remove it.
6. Insert the rear end of the replacement optical module into the card guides
and push slowly backward to mate the connectors. Make sure the fastening
screw is free to move backward as the optical module slides in. If you feel
resistance before the connectors are fully mated, retract the optical module
and repeat the insertion.
417006-2304-0H3-B02
6-15

Maintenance Manual
7. Fasten the optical module with its captive screw.

8. Insert the prescribed SFPs in the optical module positions as explained in
Installing and removing optical transceivers (page 6-11).
9. Reconnect the fibers disconnected in Step 3.
Figure 6-4: Installing extractable OMS01_4 and OMS04_1 optical modules in

SIO1&4 cards
6-16
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Maintenance Manual
Preparing SIO16 Cards for Installation

NOTE: See Installing and removing optical transceivers
(page 6-11) for instructions regarding the installation of
optical transceivers and extractable optical modules on
SIO164 cards.
SIO16 cards can be equipped with one or two extractable optical modules. Live
insertion and hot swapping of modules is allowed.
CAUTION: Do not install an OM16 optical transceiver
equipped with an LC connector (I3 or S3 interfaces) in the

lower position when the transceiver in the upper position is
equipped with an SC connector. If, for any reason,
transceivers with SC and LC connectors are installed in the
upper and lower positions respectively, contact ECI's
representative.
The extractable module is available in two versions: with built-in transceiver or

with the transceiver located on a removable SFP.
417006-2304-0H3-B02
6-17

Maintenance Manual
Installing Extractable Modules in SIO16

Cards
The following figure shows how to install an extractable module on the SIO16.
To install an optical module:
1. Identify the module position on the base card (see the following figure).
Figure 6-5: Installing an extractable optical OM16_1 module in SIO16 card
2. Insert the rear end of the transceiver into the card guides, and push slowly
backward to mate the connectors. If resistance is felt before the connectors
are fully mated, retract the transceiver and repeat the insertion.
3. Fasten the transceiver with its captive screw.
6-18
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Maintenance Manual
Upgrading to an Optical Module with a

Removable SFP
The optical module with removable SFP is available from release 5. This
module can be installed as an upgrade on existing SIO16 cards. The upgrade
involves:
1. Removing the existing optical module.
2. Installing the replacement.
3. Inserting the required SFP in the module.
NOTE: The OM16_1SFP module is slightly longer than the
OM16_1 and it is therefore recommended to connect only

patch cords with short boots. Install optical attenuators only at
the ODF and not on the transceiver connectors (placing
attenuators on the transceiver connectors may require using
the special extended door on the platform, as explained in
Deep doors vs. standard doors (page 4-3)).
The upgrade procedure can be performed on working SIO16 cards. However,

after installing the new extractable module, it is necessary to perform a cold
reset on the card.
upgrade procedure.
417006-2304-0H3-B02
6-19

Maintenance Manual
To upgrade to an optical module with a removable SFP:

1. Before replacing any transceiver, prepare a sketch identifying each fiber
connected to the transceiver for use when reconnecting the fibers.
2. Identify the position of the optical module to be replaced on the base card
Figure 6-6: Installing an extractable optical OM16_1SFP module in SIO16 card
3. Disconnect the fibers connected to the optical module.

4. Release the captive screw fastening the optical module to the base card.
5. Pull out the optical module to be replaced and remove it.
6-20
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Maintenance Manual
6. Insert the rear end of the replacement optical module into the card guides
and push slowly backward to mate the connectors. Make sure the fastening
screw is free to move backward as the optical module slides in. If you feel
resistance before the connectors are fully mated, retract the optical module
NOTE: A special SFP locker may be installed on the
OM16_1 SFP. This locker prevents SFP extraction and

insertion and must be removed before performing these
activities. Contact ECI Customers Support Team for
additional details.

9. Install the locker, if applicable.
10. Reconnect the fibers disconnected in Step 3.

SIO164 includes a single position for an extractable module. The type of the
installed module determines the configuration:
An STM-16/OTU1 card providing four STM-16/OTU1 interfaces, working

with an OMSC16_4 module.
An STM-64 card providing one STM-64 interface, working with an

OMTX10_S module.
An STM-64/OTU2 card providing one STM-64/OTU2 interface, working

with an OMTX10 or OMTX10_EF module.
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6-21

Maintenance Manual
Installing Extractable Modules in SIO164 in

4 x STM-16/OTU1 Configuration
When the SIO164 is configured as a 4 x STM-16/OTU1 card, an OMSC16_4
optical module is installed in the module position. Live insertion and hot
swapping is allowed.
NOTE: If you are replacing interfaces that are protected, it is
upgrade procedure.
The following figure shows how to install an extractable module on the

SIO164.
Figure 6-7: Installing an OMSC16_4 module on SIO164
6-22
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Maintenance Manual
To install an OMSC16_4 module on SIO164:

1. If the card is installed in a working platform, turn the reset control to the
reset (up) position. This causes switching to the protection module (if this
option is used).
2. Fully release the screws until the two extractors of the optical module are in
the horizontal position.
3. Inspect the connectors of the optical module and the mating connector on
the base card, and clean any foreign matter and dust.
4. Insert the rear end of the optical module into the guides of the module
installation position and push slowly backward to mate the connectors. If
resistance is felt before the connectors are fully mated, retract the module
5. Press the two extractors to lock the optical module in place. When the
module is properly inserted, the extractors are vertical and touch the
module edge.
6. Secure the optical module extractors with the two screws.
7. If the card is installed in a working platform, you can return the reset
control to the normal (horizontal) position.
Installing Extractable Modules in SIO164 in

1 x STM-64 or OTU2 Configuration
When the SIO164 is configured as a 1 x STM-64 card, an OMTX10_S optical
module is installed in the module position. When the SIO164 is configured as a
1 x STM-64/OTU2 card, an OMTX10 or OMTX10_EF optical module is
installed in the module position. See the XDM-1000 Product Line Reference
Manual and the XDM Technical Specifications for a description of the module
capabilities.
Live insertion and hot swapping is allowed.
NOTE: If you are replacing interfaces that are protected, it is
upgrade procedure.
417006-2304-0H3-B02
6-23

Maintenance Manual
The following figure shows how to install the extractable module (the figure
uses the OMTX10_S for illustration).
Figure 6-8: Installing an optical module on SIO164
6-24
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Maintenance Manual
To install an optical module on SIO164:

option is used).
module edge.
417006-2304-0H3-B02
6-25

Maintenance Manual
Installing Optical Transceivers in XIO192

Cards
NOTE: If you are replacing interfaces, it is recommended to
switch to protection before starting.
To install OM16_1 optical plug-in transceivers:

1. Identify the prescribed position in the base card (see the following figure).
Figure 6-9: Installing extractable optical modules in the XIO192
2. Insert the rear end of the module into the card guides and push slowly
backward to mate the connectors. If resistance is felt before the connectors
are fully mated, retract the transceiver and repeat the insertion.
3. Fasten the transceiver with its captive screw.
6-26
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Maintenance Manual
To install optical modules:

NOTE: The optical modules with removable SFPs are
slightly longer and it is therefore recommended to connect

only patch cords with short boots. Install optical attenuators
only at the ODF and not on the transceiver connectors
(placing the attenuators on the transceiver may require using
the special extended door on the platform, as explained in
Deep doors vs. standard doors (page 4-3)).
1. Identify the prescribed position in the base card.

2. Insert the rear end of the optical module into the card guides and push
slowly backward to mate the connectors. Make sure the fastening screw is
free to move backward as the optical module slides in. If resistance is felt
before the connectors are fully mated, retract the transceiver and repeat the
insertion.
4. If you are installing an OMS01_4, OMS04_1, or OM16_1SFP, insert the
prescribed SFPs in the optical module positions as explained in Installing
and removing optical transceivers (page 6-11).
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Maintenance Manual
Installing Extractable Modules in XIO384F

Cards
XIO384F can be equipped with one extractable optical module. The following
extractable module versions are offered: OMSC16_4, OMTX10_S, OMTX10,
and OMTX10_EF. See the XDM-1000 Product Line Reference Manual and the
XDM Technical Specifications for a description of their capabilities.
Live insertion and hot swapping is allowed.
NOTE: If the interface to be replaced is protected, it is

upgrade procedure.
The following figure shows how to install an extractable module (the figure
uses the OMTX10_EF for illustration).
Figure 6-10: Installing an optical module on XIO384F
6-28
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Maintenance Manual
To install an optical module on XIO384F:

option is used).
module edge.
Installing Optical Transceivers in SIO1&4B

Cards
SIO1&4B cards can be equipped with the desired types of optical interfaces
and/or electrical interfaces. For a description of the cards and interface module
characteristics, refer to the XDM-1000 Product Line Reference Manual and the
XDM System Specification.
NOTE: The M1_16SFP modules, which include the
SIO1&4B electrical interfaces, are located in the

corresponding slot of the platform modules cage. These
modules are used in the XDM-500 and XDM-1000 platforms
only.
SIO1&4B cards have 16 positions for the installation of optical transceiver

plug-ins (SFPs). The optical transceiver plug-ins can be installed and replaced
in the field as required.
Do not install optical transceiver plug-ins for ports that are served by electrical
interfaces located in the M1_16SFP module (where relevant).
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Maintenance Manual
To install an optical transceiver plug-in module in SIO1&4B

cards:
1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figure).
Figure 6-11: Identifying the installation positions on the SIO1&4B card
2. To install or replace a transceiver, see Installing and removing optical

transceivers (page 6-11).
6-30
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Maintenance Manual
Installing Optical Transceivers in SIO16_2B

Cards
SIO16_2B cards have two positions for the installation of optical transceiver
To install an optical transceiver plug-in module in SIO16_2B
cards:
Figure 6-12: Identifying the installation positions on the SIO16_2B card

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Maintenance Manual
Installing Optical Transceivers in SIO16_4B

Cards
SIO16_4B cards have four positions for the installation of optical transceiver
To install an optical transceiver plug-in module in SIO16_4B
cards:
Figure 6-13: Identifying the installation positions on the SIO16_4B card

6-32
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Maintenance Manual
Installing Optical Transceivers in SIO64B

Cards
SIO64B cards have one position for the installation of an optical transceiver
plug-in (XFP). The optical transceiver plug-in can be installed and replaced in
the field as required.
To install an optical transceiver plug-in module in an
SIO64B card:
Figure 6-14: Identifying the installation positions on the SIO64B card

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Maintenance Manual
Installing Optical Transceivers in EIS Cards

EIS cards are available in three versions: EIS2_8, EIS2_14, and EIS8_8. Each
version can be equipped with the desired types of optical interfaces and/or
electrical interfaces. For a description of the cards and interface module
characteristics, refer to the XDM-1000 Product Line Reference Manual and the
XDM System Specifications.
NOTE: The ME_8 or ME_14 modules, which include the
EIS electrical interfaces, are located in the corresponding slot

of the platform modules cage.
All the EIS card versions have eight positions for the installation of optical
transceiver plug-ins (SFPs). The following figure identifies these positions.
The optical transceiver plug-ins can be installed in the various positions:
Fast Ethernet or GbE for the four upper positions (1 to 4)
Fast Ethernet only for the four lower positions (5 to 8)
The optical transceiver plug-ins can be installed and replaced in the field as
required.
Do not install optical transceiver plug-ins for ports that are served by electrical
interfaces located in the ME_8 module.
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To install an optical transceiver plug-in module in EIS cards:

Figure 6-15: Identifying the installation positions on typical EIS cards

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Installing Optical Transceivers in DIO Cards

DIO cards are available in the following versions: DIO1_61, DIO1_80, and
DIO1_40.
For DIO1_40: GbE optical interface modules in the two upper positions,
each equipped with two optical transceiver plug-ins (SFPs).
For DIO1_80: GbE optical interface modules in all of the four positions,
each equipped with two optical transceiver plug-ins (SFPs).
For DIO1_61: one STM-16 optical interface module (DM16) in position 1,

and GbE optical interface modules in the other three positions. The STM16 optical interface module can be equipped with only one optical
transceiver plug-in (SFP).
NOTE: Earlier versions of the DIO card have been replaced
with the current versions: the DIO1_20 has been replaced
with the DIO1_40, the DIO1_31 with the DIO1_61, and the
DIO1_40F with the DIO1_80.
The optical transceiver plug-in can be installed and replaced in the field as
required. You cannot replace the optical interface modules.
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To install an optical transceiver plug-in module in DIO

cards:
plug-in (see the following figure).
2. To replace or install a transceiver, see Installing and removing optical
Figure 6-16: Identifying the installation positions on DIO cards
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Installing Optical Transceivers in DIOB

Cards
Each DIOB version card can be equipped with the desired types of optical
interfaces and/or electrical interfaces. For a description of the cards and
interface module characteristics, refer to the XDM-1000 Product Line
Reference Manual and the XDM System Specification.
NOTE: The ME16 modules, which include the electrical
interfaces, are located in the corresponding slot of the

platform modules cage. These modules are used in the XDM500 and XDM-1000 platforms only.
The DIOB card has eight positions for the installation of optical transceiver
plug-ins (SFPs). The following figure identifies these positions.
The optical transceiver plug-ins can be installed and replaced in the field as
required.
To install an optical transceiver plug-in module in DIOB
cards:
2. To install or replace a transceiver, refer to Installing and removing optical
NOTE: If you replace a transceiver on a card installed in a
working platform, first turn the reset control to the reset (up)
position. After inserting the SFP, you can return the reset
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Figure 6-17: Identifying the installation positions on typical DIOB cards
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Installing Optical Transceivers in

MCS5/MCS10 Cards
Each MCS5/MCS10 card version can be equipped with the desired types of
optical interfaces and/or electrical interfaces. For a description of the cards and
interface module characteristics, refer to the XDM-1000 Product Line
NOTE: The ME16 modules, which include the electrical
interfaces, are located in the corresponding slot of the

platform modules cage. These modules are used in the XDM500 and XDM-1000 platforms only.
The MCS5/MCS10 card has eight positions for the installation of optical
transceiver plug-ins (SFPs). The optical transceiver plug-ins can be installed
and replaced in the field as required.
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MCS5/MCS10 card:
Figure 6-18: Identifying the installation positions on typical MCS5/MCS10

cards
2. To install or replace a transceiver, refer to Installing and removing optical

position. After inserting the SFP, you can return the reset
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MCS30_X10G Cards
MCS30_X10G cards can be equipped with the desired types of optical
interfaces and/or electrical interfaces. For a description of the cards and
interface module characteristics, see the XDM-1000 Product Line Reference
Manual and the XDM System Specification. MCS30_X10G cards have one
position for the installation of an optical transceiver plug-in (XFP). The optical
transceiver plug-in can be installed and replaced in the field as required.
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MCS30_X10G card:
Figure 6-19: Identifying installation positions on the MCS30_X10G

position. After inserting the XFP, you can return the reset
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Maintenance Manual
Preparing Transponders and Combiners for

Installation
Most of the transponders and combiners offered by ECI are based on the
CHTR_B base card. This base card has two installation positions for two
extractable optical modules. These modules are installed in accordance with the
required functionality, for example, TRP10_2B, TRP10_LAN, TRP25_4, and
so on. Refer to the XDM-1000 Product Line Reference Manual and the XDM
System Specifications of the platform for information on the optical modules
that need to be installed for each functionality.
The following sections includes examples of installation procedures for the
CMBR10_B/BO, CMBR10_D/DO, CMBR10_T, CMBR25_2/2O, TRP10_2B,
TRP10_LAN, TRP25_4, CMTR25, and AoC components. For simplicity, this
manual sometimes refers to the whole group of 10 Gbps combiners as
CMBR10_x.
Preparing CMBR10_x Cards for Installation

CMBR10_x cards have one or two modules according to the specific card
version. The module plugs into a mating connector located in the base card.
You select and install an extractable module according to the required
functionality. After installing an extractable module, install the desired optical
transceiver plug-ins (SFPs) in the prescribed positions.
To install an extractable module in a CMBR10_D/DO card:
1. Fully release the screws until the two extractors of the module are in the
horizontal position.
2. Inspect the connectors of the module and the mating connector on the base
card, and clean any foreign matter and dust.
backwards to mate the connectors. If resistance is felt before the connectors
are fully mated, retract the module and repeat the insertion.
4. Press the two extractors to lock the module in place. When the module is
properly inserted, the extractors are vertical and touch the module edge.
5. Secure the module extractors with the two screws.
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This installation procedure is illustrated in the following figure.
Figure 6-20: Installing an extractable module in a CMBR10_D card
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To install an optical transceiver plug-in module:

plug-in module (refer to the following figure).

CMBR10_D/DO cards

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To install an extractable module in a CMBR10_B/BO or

CMBR10_T card:
1. Identify the prescribed installation position of the module on the base card.
2. Install the module using the same procedure as for the CMRB10_D/DO
card (see To install an extractable module in a CMBR10_D/DO card (page
6-44)).
The following figure shows a typical module before and after it is installed in
position. Note that the following figure depicts a CMBR10_B/BO card. A
comparable illustration for the CMBR10_T card would be almost identical,
with only slight differences apparent in the spacing of the SFP plug-in
modules.
Figure 6-22: Installing an extractable module in a CMBR10_B/BO card
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plug-in (refer to the following figure). Note that the following figure
depicts the optical transceiver plug-in positions for the CMBR10_B/BO
cards. A comparable illustration for the CMBR10_T card would be almost
identical, with only slight differences apparent in the spacing of the SFP
plug-in modules.

CMBR10_B/BO cards
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Preparing CMBR25_2/2O Cards for

Installation
The CMBR25_2/2O cards house two extractable optical modules. Each module
plugs into a mating connector located in the base card. You can install the
desired extractable optical modules according to the required functionality.
After installing the extractable optical modules, install the desired optical
transceiver plug-ins (SFPs) in the prescribed positions.
Installation of an optical module in a CMBR25_2 card is shown in the
following figure.
Figure 6-24: Installing a typical extractable optical module in a CMBR25_2 card
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To install an extractable optical module in a CMBR25_2

card:
1. Identify the prescribed installation position of the extractable optical
module in the base card.
2. Fully release the screws until the two extractors of the extractable optical
module are in the horizontal position.
3. Inspect the connectors of the extractable optical module and the mating
connector on the base card, and clean any foreign matter and dust.
4. Insert the rear end of the extractable optical module into the guides of the
module installation position, and push slowly backwards to mate the
connectors. If resistance is felt before the connectors are fully mated, retract
the module and repeat the insertion.
5. Press the two extractors to lock the extractable optical module in place.
When the module is properly inserted, the extractors are vertical and touch
the module edge.
6. Secure the extractable optical module extractors with the two screws.
7. If necessary, repeat the procedure for the second extractable optical
module.
To install the optical transceiver plug-in (SFP) module:
6-50
Follow the instructions in Installing and removing optical transceivers

(page 6-11).
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Preparing CMTR25 Cards for Installation

The CMTR25 cards house two extractable optical modules. Each module plugs
into a mating connector located in the base card. You can install the desired
extractable optical modules according to the required functionality. After
installing the extractable optical modules, install the desired optical transceiver
plug-ins (SFPs) in the prescribed positions.
Installation of an optical module in a CMTR25 card is shown in the following
figure.
Figure 6-25: Installing extractable modules in a CMTR25 card
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To install an extractable optical module in a CMTR25 card:

the module edge.
module.
6-52

(page 6-11).
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Preparing CMBR40 Cards for Installation

CMBR40 cards have four positions for the installation of optical transceiver
plug-ins (XFPs). The optical transceiver plug-ins can be installed and replaced
in the field as required. For a description of the optical transceiver plug-in
modules supported by the CMBR40, refer to the XDM-1000 Product Line
To install an optical transceiver plug-in module in a CMBR40
card:
Figure 6-26: Identifying the installation positions on the CMBR40 card

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Preparing TRP10_2B Cards for Installation

TRP10_2B cards have one or two modules according to the specific card
You can install an extractable module according to the required functionality.
After installing an extractable module, install the desired optical transceiver
The installation of an extractable module in a TRP10_2B card is shown in the
following figure.
Figure 6-27: Installing plug-in modules in a TRP10_2B card
To install an extractable module in a TRP10_2B card:

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Preparing TRP10_4M/R Cards for

Installation
TRP10_4M/R cards have four positions for the installation of optical
transceiver plug-ins (XFPs). The optical transceiver plug-ins can be installed
and replaced in the field as required. For a description of the optical transceiver
plug-in modules supported by the TRP10_4M/R, refer to the XDM-1000
Product Line Reference Manual and the XDM System Specification.
To install an optical transceiver plug-in module in a
TRP10_4M/R card:
plug-in module (see the following figures).
Figure 6-28: Identifying the installation positions on a TRP10_4R card
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Figure 6-29: Identifying the installation positions on a TRP10_4M card

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Preparing TRP10_LAN Cards for Installation

TRP10_LAN cards have one or two modules according to the specific card
You can install an extractable module according to the required functionality.
After installing an extractable module, install the desired optical transceiver
plug-ins (XFPs) in the prescribed positions.
The installation of an extractable module in a TRP10_LAN card is shown in
the following figure.
Figure 6-30: Installing plug-in modules in a TRP10_LAN card
To install an extractable module in a TRP10_LAN card:

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Figure 6-31: Identifying the optical transceiver plug-in (XFP) position in the
TRP10_LAN card
2. Follow the instructions in Installing and removing optical transceivers

(page 6-11).
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Preparing TRP25_4 Cards for Installation

The TRP25_4 cards house two extractable optical modules in accordance with
the specific card version (see the XDM-1000 Product Line Reference Manual
for a description of TRP25_4 versions).
Each module plugs into a mating connector located in the base card. You can
install the desired extractable optical modules according to the required
functionality. After installing the extractable optical modules, install the
desired optical transceiver plug-ins (SFPs ) in the prescribed positions.
Installation of an optical module in a TRP25_4 card is shown in the following
figure.
Figure 6-32: Installing a typical plug-in module in a TRP25_4 card
To install an extractable optical module in a TRP25_4 card:

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the module edge.
module.
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(page 6-11).
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Maintenance Manual
Preparing the AoC Card for Installation

The AoC cards house one extractable optical module, located on the upper half
of the AoC card, plus up to eight SFP plug-in modules inserted directly into
slots built into the lower half of the AoC card. The extractable module plugs
into a mating connector located in the AoC card. You can install the desired
extractable optical module according to the required functionality. After
installing the extractable optical module, install the desired optical transceiver
Figure 6-33: Installing modules into the AoC card
To install an extractable optical module in the upper half of

an AoC card:
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the module edge.
Figure 6-34: Installing an optical module in the AoC (upper half)
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To install an optical transceiver plug-in module in the lower

half of an AoC card:
2. To replace or install a transceiver, see Installing and removing optical
Figure 6-35: Identifying SFP installation positions on AoC (lower half)
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Installing Extractable Modules in AUX Cards

AUX cards are available in two main versions:
AUX_2I for installation in I/O slots
AUX_2X for installation in X1 and X2 slots
Refer to XDM-1000 Product Line Reference Manual for a description of the

cards.
Both AUX card versions have two positions for optical auxiliary plug-in
modules. The card construction is similar and both accept the same optical
plug-in modules. The position of the plug-in modules is identified in the
following figure (the figure shows an AUX_2X card).
Figure 6-36: AUX_2X card, location of optical plug-in modules
By following the following instructions, you can install the desired plug-in
modules according to the required functionality.
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To install an optical plug-in module:

1. Identify the prescribed installation position of the optical plug-in module
(see the previous figure).
2. Insert the rear end of the optical plug-in module into the card guides, and
push slowly backward to mate the connectors. Make sure the fastening
screws are free to move backward as the module slides in. If resistance is
felt before the connectors are fully mated, retract the module and repeat the
insertion.
3. Fasten the optical plug-in module with its captive fastening screws.
Figure 6-37: AUX_2X card, installing a typical optical plug-in module
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Installing Extractable Modules in OADM1&4

Cards
OADM1&4 cards house an OADM plug-in module. Two main types of
OADM plug-in modules are available: single-channel OADM and four-channel
OADM. For a description of the OADM1&4 characteristics, refer to the XDM1000 Product Line Reference Manual and the XDM System Specifications.
The OADM module plugs into an optical connector located in the base card. If
the OADM module is not installed, or the currently installed module must be
replaced, install the desired plug-in module according to the following
procedure. Refer to Installing a typical OADM plug-in module in an
OADM1&4 card (page 6-67).
To install an OADM plug-in module:
1. Fully release the two extractors of the plug-in module.
2. Remove the protective cover of the optical connectors located in the base
card and on the plug-in module by pulling the attached tape.
CAUTION: Failure to remove the protective cover before
module insertion may damage the card.
3. Inspect the rear optical connector of the plug-in module, and clean foreign
matter and dust using an approved cleaning compound.
4. Insert the rear end of the plug-in module into the card guides, and push
slowly backward to mate the connector.
Make sure the fastening screws are free to move backward as the module
slides in. If resistance is felt before the connectors are fully mated, retract
5. Fasten the plug-in module with its two captive screws.
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Figure 6-38: Installing an OADM plug-in module in an OADM1&4 card
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Installing Extractable Modules in MO_CW2

Modules
The MO_CW2 base module houses two plug-in modules (refer to the XDM1000 Product Line Reference Manual for a description of the various versions).
Each plug-in plugs into a mating connector located in the base module. You
can install the desired plug-in modules according to the required functionality,
as shown in the following figure.
Figure 6-39: Installing a typical plug-in in an MO_CW2 module
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To install a plug-in in the MO_CW2 module:

1. Identify the prescribed installation position of the plug-in on the module.
2. Inspect the connectors of the plug-in and the mating connector on the base
MO_CW2 module, and clean any foreign matter and dust.
3. Retract the two screws on the plug-in panel to ensure that they will not
prevent full insertion into the base MO_CW2 module.
4. Insert the rear end of the plug-in into the guides of the prescribed
installation position, and push slowly backwards to mate the connectors. If
resistance is felt before the connectors are fully mated, retract the plug-in
5. Secure the plug-in with the two screws.
6. If necessary, repeat the procedure for the second plug-in.
Installing CMBR40 and TRP40_2

Cards for Different Configuration
Options
If you need to install two TRP40_2 or CMBR40 cards as an OCH 1+1
protection pair or a pair of TRP40_2 cards to be used in regenerator mode, read
the following sections.
Installing TRP40_2 Cards for Regenerator

Mode
To install a pair of TRP40_2 cards to be configured in regenerator mode, you
need an optical fiber cable.
To install two TRP40_2 cards for use in regenerator mode:
1. Insert one of the TRP40_2 cards in slots IC2 and IC3.
2. Insert the other TRP40_2 card in slots IC4 and IC5.
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3. Connect an optical fiber from the client port of one of the cards to the client
port of the other card. The following figure shows the position of the client
port on each card:
Figure 6-40: TRP40_2/2B front view
The two TRP40_2 cards are now installed correctly for configuration in
regenerator mode.
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Installing Two TRP40_2 or CMBR40 Cards as

an OCH 1+1 Protection Pair
To install two TRP40_2 or CMBR40 cards as an OCH 1+1 protection pair, you
need an IOP cable.
To install two TRP40_2 or CMBR40 cards as a protection
pair:
1. Insert one of the cards in slots IC2 and IC3.
2. Insert the other card in slots IC4 and IC5.
3. Connect the IOP cable from the IOP cable port on one card to the IOP cable
port on the other card. The following figure shows the position of the IOP
cable port on the TRP40_2 card.
Figure 6-41: TRP40_2/2B front view
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The following figure shows the position of the IOP cable port on the
CMBR40 card.
Figure 6-42: CMBR40/40B front view
The cards are now installed correctly to be configured as an OCH 1+1

protection pair. The card on the right can be configured as the main card.
The card on the left can be configured as the standby card.
CAUTION: If you need to remove either of the cards in the
protection pair, disconnect any optical fiber connecting the

card to a client transceiver before disconnecting the IOP
cable. Disconnecting the IOP cable before disconnecting the
optical fiber can cause unnecessary protection switching.
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Installing xMCP Cards

Before you start:
Visually inspect the cards and the mating backplane connectors to make sure
there are no signs of physical damage. In particular, check for bent or damaged
connector pins.
xMCP cards are installed in slots C1 and C2.
NOTES:
When the XDM platform is equipped with a single xMCP

card, always install it in slot C1.
You may install xMCP cards in slot C2 only when the
card supports redundancy.
If two xMCP cards are installed in the XDM platform they
must be of the same type.
CAUTION: When inserting cards, make sure to carefully
align the card with the platform guide rails. If resistance is felt
during insertion, immediately retract the card/module and
repeat the process.
Hold the card straight during insertion and removal, and pull
or push it slowly and carefully to avoid touching components
located on adjacent cards.
Do not use excessive torque when tightening fastening
screws.
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To install the xMCP:

1. Check that the card has not been physically damaged during shipment.
2. Remove the card from its antistatic protection packaging and perform a
visual inspection to detect damage during shipment. Report any problems.
3. Record the hardware and software versions as indicated on the card
4. If the NVM card is not installed in the xMCP module, install it as follows:
a. Check that the NVM card has not been physically damaged during
shipment.
b. Remove the NVM card from its antistatic protection packaging and
perform a visual inspection to detect damage during shipping. Report
any problems.
c. Orient the NVM card as shown, and then insert its rear end (the end
with the connector) in the card guides. Push it in until it is locked in
place.
Figure 6-43: NVM card installation
5. Bring both extractor handles of the card to the horizontal position.

6. Identify the assigned slot (C1 or C2) and insert the rear end of the card in
the corresponding card guides.
7. Push the card in until it mates the chassis connectors. If resistance is felt
before the connectors are mated, pull the card out and repeat the procedure.
8. Press the ends of the two extractor handles to fully insert the card and lock
it in place.
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Installing xMCP-B/B2G Cards

Before you start:
Visually inspect the cards and the mating backplane connectors to make sure
there are no signs of physical damage. In particular, check for bent or damaged
connector pins.
xMCP-B/B2G cards are installed in slots C1 and C2.
NOTES:
When the XDM platform is equipped with a single xMCP

card, always install it in slot C1.
If two xMCP cards are installed in the XDM platform they
must be of the same type.
repeat the process.
screws.
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Refer to the following figure when performing the procedure.
Figure 6-44: Installation of an NVM on xMCP-B card
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To install the xMCP-B/B2G:

4. If the NVM card is not installed in the xMCP-B/B2G card, install it as
follows:
a. Check that the NVM card has not been physically damaged during
shipment.
b. Remove the NVM card from its antistatic protection packaging and
perform a visual inspection to detect damage during shipping. Report
any problems.
c. Orient the NVM card in front of the card guides, and then insert its rear
end (the end with the connector) in the card guides. Push it in until it is
locked in place (the release push button is flush with the NVM).
Figure 6-45: NVM card installation
d. Place the NVM cover on the NVM and close it with its two captive
screws, as illustrated.
NOTE: If the NVM cover is not closed properly the system
will not operate.
5. Bring both extractor handles of the card to the horizontal position.

6. Identify the assigned slot (C1 or C2) and insert the rear end of the card in
the corresponding card guides.
8. Press the ends of the two extractor handles to fully insert the card and lock
it in place.
9. Push the reset control and rotate it counter-clockwise to lock the lower
extractor handle.
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Installing MECP Cards

Before you start:
Visually inspect the cards and the mating backplane connectors and make sure
that there are no signs of physical damage. In particular, check for bent or
damaged connector pins.
MECP cards are installed in dedicated slots located above slots C1 and C2.
then repeat the process.
screws.
To install the MECP:

4. Bring the extractor handle of the MECP to the horizontal position.
5. Identify the assigned slot (located above slots C1 and C2), and insert the
rear end of the MECP in the corresponding card guides.
6. Push the MECP in until it mates the chassis connector. If resistance is felt
7. Press the end of the extractor handle to fully insert the MECP and lock it in
place.
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Installing Aurora-G Cards

The following sections describe the steps of a typical Aurora-G installation.
Before you begin installation, verify that you have all required components, as
described in Unpacking and Visual Inspection (page 4-9). Review the safety
guidelines provided in Before You Start/Safety Guidelines (page 1-1). When
working with the Aurora-G card, be sure to keep the following safety
guidelines in mind.
CAUTION: STATIC SENSITIVE DEVICES. PROPER
HANDLING AND GROUNDING PRECAUTIONS
REQUIRED.

electrostatic discharge (ESD). To prevent ESD damage, avoid
touching the internal components, and before handling cards,
touch the frame of a grounded equipment or rack. Keep parts
and cards in their antistatic packaging material until you are
ready to install. The use of an antistatic wrist strap connected
to a grounded equipment frame or rack is recommended when
handling cards during installation, removal, or connection to
internal connectors. For more information, see Protection
Against Electrostatic Discharge (page 1-26).
CAUTION: During the installation of SFP transceivers, make

sure that all optical connectors are closed by protective caps.
Do not remove the covers until an optical fiber is connected
to the corresponding connector. Be aware that the SFP
transmitter may start transmitting as soon as it is inserted into
a working card.
WARNING: The Aurora-G contains a lithium battery, which
users should not attempt to replace. Battery replacement must

be performed by qualified ECI personnel. There is a risk of
explosion if a battery is replaced by the incorrect type.
Dispose of used batteries according to the instructions.
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Unpacking and Visual Inspection

Before you start:
Verify that you have the correct cables and SFP modules.
The standard SFPs and cables used by the Aurora-G are listed in the following
table. The listed connector type indicates only what is required to connect
directly to the Aurora-G ports, and may or may not be the same connector type
required for the other end of the cable.
Table 6-3:
Aurora-G cables
Aurora-G port
SFP
Cable
Mating
connector
Quantity
per card
RS-232 local PC
port
---
RS-232 shielded copper null

modem cable
DB-9 male
Gigabit Ethernet
local and remote
ports
Dual fiber optical SFPs

OTGBE_SX: 1000BaseSX
(850 nm MM)
OTGBE_LX: 1000BaseLX
(1310 nm SM) 10 km
OTGBE_ZX: 1000BaseZX
(1550 nm SM) 80 km
9/125 m single mode duplex LC male

fiber pair
(1 transmit, 1 receive)
or
62.5/125 m multimode
duplex fiber or simplex fiber
pair
(1 transmit, 1 receive)
ETGBE: Electrical 1000BaseT

SFP
UTP 4-pairs with overall

shield
RJ-45 male
---
Shielded Category 5 straight

through cable (STP) 16
RJ-45 male
10/100 Ethernet
Management ports
2
(1 per port)
NOTE: To meet the requirements of FCC Part 15 and the EU

EMC Directive 89/336/EEC, use only shielded cables (DB-9
null modem cables and Category 5 STP cables).
16
The 10/100 Management port is autosensing for polarity. You can use either a crossover cable or a shielded
Category 5 straight through cable when connecting to this port.
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Installing the Aurora-G Card

Standard Aurora-G installation includes the following steps.
To install the Aurora-G card:
1. Install SFP transceivers in the Aurora-G card.
For detailed SFP installation instructions, see Installing and removing
optical transceivers (page 6-11).
2. Install the Aurora-G card in the I/O card cage.
For detailed Aurora-G card installation instructions, see Installing I/O
Cards and Modules (page 6-90). During installation, you may refer to the
following figure.
Figure 6-46: Aurora-G card insertion
Aurora-G cards can be installed in any I/O slot of the XDM-500 cage. The
procedures in this section can also be used to replace cards in an operating
platform, provided the safety precautions are strictly obeyed. Refer to the
safety guidelines provided in Before You Start/Safety Guidelines (page
1-1).
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3. Connect the cables to the Aurora-G ports.

When connecting the card cables, you may refer to the port labels included
in the following figure.
a. Connect the RS-232 port (located at the bottom of the front panel)
directly to a PC using a DB-9 null modem cable.
b. Connect the 10/100 Ethernet management port (located at the top of the
front panel) to the DCN or directly to a management station using a
Category 5 STP cable with an RJ-45 connector. If connecting directly,
the workstation and management port IP addresses must be on the same
subnet.
c. Connect the remote port fiber cable (located on the upper SFP module)
to the XDM Layer 1 or Layer 2 card (EIS, DIOB, etc.).
d. Connect the local port fiber cable (located on the lower SFP module) to
the local network router or switch.
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Figure 6-47: Aurora-G connectors
4. Set the management IP address.

The IP address of the management port must be set to an IP address
suitable for your network. Setting the IP address of the management port is
described in detail in Configuring the Management IP Address (page 6-86).
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5. Install the cover plate.

After assigning the management IP address, disconnect the serial port cable
and install the cover plate. The cover plate is necessary to comply with
electromagnetic compatibility (EMC) requirements. To install the cover
plate on the Aurora-G front panel:
a. Disconnect the serial port cable from the Aurora-G.
b. Guide the remaining three cables from the remote, local, and
management ports to the top of the card.
c. Using the two screws provided, attach the cover plate to the front panel,
as illustrated in the following figure.
Figure 6-48: Aurora-G with cover plate in place
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Understanding the Aurora-G LED Indicators

Whenever the Aurora-G is initialized or reset it reports a failure until it has
successfully completed a (re)boot. While (re)booting, the Aurora-G runs a
series of built-in diagnostic tests. As the tests are run, the diagnostic code
displayed on the card's front panel cycles through codes 01-09, reflecting the
number of the test currently being run. Note that the diagnostic code display is
only visible when the Aurora-G cover plate is removed.
After (re)booting, the Aurora-G card alarm indicators should accurately reflect
the results of the built-in diagnostic tests. The Aurora-G indicator lights are
identified in the following figure.
Figure 6-49: Aurora-G LED indicators
A successful (re)boot is indicated as follows:
Green power LED illuminated
Red card failure LED off
Diagnostic code set to 00
EMS-Aurora reports no card alarms
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A failed (re)boot is indicated as follows:
Red card failure LED illuminated
Diagnostic code indicates the number of the test that failed
EMS-Aurora reports the appropriate card alarm
In case of a card failure, refer to Troubleshooting procedures for Aurora-G

cards (page 9-26).
NOTE: While (re)booting, the Aurora-G discards all traffic
on its data ports. Traffic is discarded until the Aurora-G
successfully negotiates a secure tunnel with its peer.
Configuring the Management IP Address

Before you put the Aurora-G into operation in the network, you must change
the IP address of the management port from its factory default to an IP address
suitable for your network. Management port configuration is performed
through a serial link to the RS-232 port.
To log in to the CLI via a serial link:
1. Connect the RS-232 port directly to the terminals serial port using a DB-9
null modem cable.
2. Open a terminal session through a VT-100 terminal emulation program
such as HyperTerminal. Enter the connection name, the appropriate serial
port (usually COM1 or COM2), and the serial port parameters defined in
the following table.
Table 6-4: Serial port parameters
6-86
Parameter
Value
Baud speed
115,200
Parity
None
Data bits
Stop bits
Flow control
None
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3. In the terminal session window, press ENTER. The CLI Username:

prompt appears.
User Access Verification
Username:
NOTE: User names and passwords are case sensitive.
4. At the Username: prompt, type the user name admin and press
ENTER. The CLI Password: prompt appears.
Username: admin
Password:
5. At the Password: prompt, type the default password admin and press
ENTER.
When you have successfully logged in, the admin> prompt appears as
follows.
Username: admin
Password:
admin>
Note that the password text is not displayed.
Management IP Address Guidelines

Management port configuration involves the following components:
IP address: This is the 10/100 Ethernet management port IP address that

identifies the Aurora-G to the management workstation.
Subnet mask: This is the portion of the IP address that identifies the
network or subnetwork for routing purposes.
Default gateway: This is used to route packets to the workstation if you
manage the Aurora-G remotely and the Aurora-G and the management
workstation are on different subnets. When the management port and the
workstation are on the same subnet, a default gateway is not needed to
route packets between the two devices.
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The default gateway identifies the local router port on the same subnet as
the Aurora-G 10/100 management port. The Aurora-G sends all packets to
the specified router for forwarding to the management station. The
following figure illustrates a default gateway when the Network
Management Host and Aurora-G are on different subnets. The Network
Management Hosts IP address is 192.168.1.10, and the management port
IP address is 192.168.10.10. To send packets between the two devices, the
local port on Router #1 is specified as the default gateway (192.168.10.1).
The gateway address must match the subnet of the management port.
Figure 6-50: Management port default gateway
NOTE: If the Aurora-G management port is directly
connected to the management workstation, the host IP address

and the management port IP address must be on the same
subnet.
To configure the management port IP address after the first

initial installation:
1. At the CLI admin> prompt, type configure terminal to enter
configuration mode.
2. At the config> prompt, type interface management.
3. At the config-ifMan> prompt, type the following command line:
ip address <ip address> <subnet mask> <gateway>
Replace the command line parameters in the preceding command line with
the appropriate values, as explained in the following table.
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Table 6-5:
IP address command line parameters
Parameter
Description
<ip address>
Management port IP address, entered in dotted decimal notation.
<subnet mask>
IP subnet mask, entered in dotted decimal notation.
<gateway>
Specifies how to route traffic between the Aurora-G and the

management station. If the two devices are on the same subnet,
specify none as the gateway. When the Aurora-G and
management station are on different subnets, specify the IP
address of the routers local port on the same subnet as the
Aurora-G management port.
1. Type the exit command twice to return to the command prompt.

2. To save the configuration, type the following command:
copy system:running nvram:config
You can also use the command shortcut copy s n.
3. Type exit to log off.
The following example illustrates how to define and save an IP address
configuration. The values used in this example match the management port IP
address, subnet mask, and gateway for the Aurora-G configuration illustrated in
Management IP address guidelines (page 6-87).
admin> configure terminal
config> interface management
config-ifMan> ip address 192.168.10.10 255.255.255.0
192.168.10.1
config-ifMan> exit
config> exit
admin> copy s n
admin: exit
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Installing I/O Cards and

Modules
Before you start:
Make sure that all the cards specified for this XDM platform are available.
Identify the relevant XDM-500 slots (page 6-4). You may also need blank
panels to cover unused slots in the modules cage, for your safety and to comply
with electromagnetic compatibility (EMC) requirements (where relevant).
The following procedures can also be used to replace cards in an operating
platform, provided the safety precautions are strictly obeyed (see "Installing
XDM-500: Before You Start Safety Guidelines" page 1-1).
CAUTION: Visually inspect the card and the mating
backplane connectors and make sure that there are no signs of

physical damage. In particular, check for bent connector pins.

align the card or module with the platform guide rails. If
resistance is felt during insertion, immediately retract the
card/module and repeat the process.
Hold the card/module straight during insertion and removal,

and pull or push it slowly and carefully to avoid touching
components located on adjacent cards.
Do not use excessive torque when tightening the fastening
screws.
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To install a card in the cards cage:

2. Remove the card from its antistatic protection packaging and inspect it
visually for damage incurred during shipment. Report any problems.
4. For cards with reset control, for example HLXC, SIO164, Aurora-G, and so
on, first turn the reset control to the vertical position as shown in the
following figure
Figure 6-51: Inserting cards with reset control
5. The cards have either one or two extractors. Move all extractor handles to
the horizontal position before inserting the card in its slot.
6. Identify the assigned slot and insert the rear end of the card in the
corresponding card guides.
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8. For cards with reset control, for example HLXC, SIO164, Aurora-G, and so
on, return the reset control to the horizontal position to release the extractor
handle.
9. Press the ends of all extractor handles to fully insert the card and lock it in
place.
10. After inserting all the cards, check the card insertion diagram that
everything is correct.
Installing a Card in the CCP Cage

Before you start:
Before starting, make sure that all the cards and modules specified for
installation in this XDM platform according to the platform card installation
plan are available.
Identify the relevant XDM-500 slots (page 6-4). You may also need blank
panels to cover unused slots in the CCP cage, for your safety and compliance
with electromagnetic compatibility (EMC) requirements.
The following procedures can also be used to replace cards and modules in an
operating platform, provided the safety precautions are strictly obeyed (see
"Installing XDM-500: Before You Start Safety Guidelines" page 1-1).

CAUTION: When inserting cards and modules, make sure to
carefully align the card or module with the platform guide

rails. If resistance is felt during insertion, immediately retract
the card/module and repeat the process.
Hold the card/module straight during insertion and removal,
and pull or push it slowly and carefully to avoid touching
components located on adjacent cards/modules.
Do not use excessive torque when tightening the fastening
screws of cards and modules.
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To install a card in the CCP cage:

2. Remove the card from its antistatic protection packaging and inspect it
visually for damage incurred during shipment. Report any problems.
4. The modules have two extractors. Bring both extractor handles to the
horizontal position before inserting the module in its slot.
5. Identify the assigned slot, and insert the rear end of the module in the
corresponding card guides.
6. Push the module in until it mates the chassis connectors. Make sure the two
fastening screws are free to move backward as the module slides in. If
resistance is felt before the connectors are mated, pull the module out and
repeat the procedure.
7. Press the ends of the two card extractors to fully insert the module, and then
fasten the module to the chassis by tightening the two fastening screws.
8. After inserting all the modules, check for correct installation against the
module insertion diagram. Install blank panels over all the free slots.
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7
Optical Fiber and Cable
Installation and Routing
In this chapter:
Connecting Cables ........................................................................................... 7-1
Connecting Cables
This section provides instructions for connecting cables to XDM platforms.
The information presented in this section supplements the information
regarding the connection of power, alarm, traffic, and grounding cables given
in Installing Ancillary Units in Racks (page 4-44).
Connect the cables to the equipment connectors according to the information
appearing in the relevant cabling diagrams or tables. To identify the physical
location of connectors, use the equipment panel figures appearing in this
section and in the XDM-1000 Product Line Reference Manual.
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Maintenance Manual
Connecting Traffic Cables to Optical

Interfaces
Routing Guidelines for Type A ETSI Rack
The Type A ETSI rack offered by ECI (see description in the XDM-1000
Product Line Reference Manual) has been designed to enable efficient and
clean routing of cables and optical fibers.
The cables and optical fibers are routed through easily reached conduits
identified in the general view of the rack.
Before you start:
1. Obtain the site cabling diagram and the detailed cabling diagrams or tables.
For shelves with optical interfaces, you also need the internal cabling
diagrams for each platform.
2. Prepare the necessary cables. During cable preparation, refer to the
information appearing in Site Preparation (page 4-1) and Connector Pin
Assignments (page B-1). Cables should be labeled according to the cabling
diagrams or tables.
To reach the fiber conduits:
1. Open the front door.
2. Release the two side panel locking handles.
3. Turn the side panel to the left.
To remove the side covers and reach the cable conduits:
1. Hold the cover by its handle, and raise it slightly (about 1.5 cm or in.)
until its three bolts clear the matching slots.
2. Retract the cover and place it in a safe position.
3. Repeat the procedure for the other cover.
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Figure 7-1: Removing side covers of a Type A ETSI rack
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4. At the desired exit point, route the fibers through one of the conduit slots.
The following figure shows details of cable and fiber routing within the
rack:
Cables are pulled through the cable conduit down to the level of the
connectors to which they will be connected.
Fibers are taken from the nearest FST and routed through the side fiber
conduit. To open the conduit, temporarily remove the relevant sections
of its cover.
Figure 7-2: Type A ETSI rack cable routing details
NOTE: It is recommended to fasten the group of fibers with

Velcro strips. Make sure to avoid stressing the fibers,
especially while bending.
5. When done, close the conduit covers.
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and Routing
Routing in Standard Racks

The following figure shows how cables are routed in standard racks, using the
accessories described in the XDM-1000 Product Line Reference Manual.
Figure 7-3: Cable routing details for regular rack
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Routing and Connecting Optical Fibers

This section describes the general optical fiber routing and connection
procedure. The following sections present specific connection procedures for
optical components that require special attention.
Before you start:
Make sure to use the special extractor tool for optical connectors (page 4-8).
Before installing optical fibers, it is recommended to thoroughly clean their
connectors using an approved cleaning kit.
NOTE: The LINE connector of the OFA_R, as well as the
mating connector on the fiber connected to this connector and

any other connectors handling this optical within the site, for
example, at ODF panels, require thorough cleaning. A
microscope must be used to enable more complete cleaning.
Imperfect cleaning may cause the OFA_R APR mechanism to

operate as a result of excessive back reflections. This will
shut down the link, until a restart command is given.
All external optical fibers are terminated on FSTs. The fibers are then routed
through the fiber guides that run along the rack sides down to the level of the
equipment to which they are connected.
CAUTION: Make sure that all the optical connectors are
closed at all times by the appropriate protective caps or by the

mating cable connector. Do not remove the protective cap
until an optical fiber is connected to the corresponding
connector, and immediately install a protective cap after a
cable is disconnected.
Some optical connectors, mainly connectors in which

high-level optical signals may be present, have spring-loaded
covers. For your protection, do not impede the free movement
of the covers, and make sure the covers are free to return to
their normal position (over the connector opening) as soon as
the optical fiber is disconnected.
The minimum bending radius of optical fibers is 35 mm
(1.4 in.). Sharp bending of fibers may degrade the optical
transmission characteristics.
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and Routing
To bring an optical fiber to the desired location:

1. Slowly pull the fiber end or remove the desired length from the FST.
2. Insert the end in the appropriate fiber guide, and route it to the desired
level.
3. At the desired level, pass the fiber through one of the slots in the fiber
guide, and bring its end to the designated connector. Leave some slack to
prevent stress.
NOTE: Some of the LC connectors installed in the optical
cards and plug-in modules have spring-loaded covers. Make

sure to open the cover and hold it in the open position until
the mating fiber is connected.
4. Connect the fiber connector to the designated equipment connector. For LC

and SC connectors, use the special extractor tool to ensure reliable mating
of the connectors (see "Extractor Tool for Optical Connectors" page 4-8).
Connecting Fibers to the MECP_OSCxx and

MECP_OCxxOW
The optical connectors of the MECP_OSCxx and MECP_OCxxOW card are
installed on a swivel mechanism. This facilitates connection of the fibers.
NOTE: The following procedure is illustrated on an
MECP_OSC card.
To connect the fibers to the MECP_OSCxx/MECP_OCxxOW

card:
1. Install the MECP_OSCxx/MECP_OCxxOW card according to instructions
in Installing MECP Cards (page 6-78).
2. Refer to the following figure and press the handle to bring the optical
connector assembly to the CONNECTION position.
3. Connect the prescribed optical fibers to the MECP_OSCxx or
MECP_OCxxOW connectors.
4. Raise the handle to return the connector assembly to the NORMAL
position.
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Figure 7-4: MECP_OSC card optical connections
Connecting Fibers to the OADM1&4

The upper set of optical connectors of OADM1&4 cards (designated ADD IN,
ADD OUT, DROP IN, DROP OUT) are also installed on a swivel mechanism
similar to that of the MECP_OSCxx/MECP_OCxxOW card (see "Connecting
Fibers to the MECP_OSCxx and MECP_OCxxOW" page 7-7). Therefore, you
can use the procedure described above to connect fibers to these connectors.
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and Routing
Connecting Fibers to the SIO16

A very large number of fibers need to be connected to a fully equipped SIO16
card. It is therefore very important to carefully plan their routing.
The best approach is to split the fibers in several bundles, for example three,
and route each bundle through a separate cable exit slot of the platform cards
cage.
Connecting Fibers to the OFA_R/RM/HRM

The OFA_R, OFA_RM, and OFA_HRM each require three fibers:
Fiber for connecting the OFA_R/RM/HRM EDFA connector to the LINE

connector of an OFA_M or OFA_2 card
Fiber for connecting the OFA_R/RM/HRM SVC connector to the

prescribed SVC connector
Fiber for connecting the external line to the OFA_R/RM/HRM LINE

connector
NOTE: The connection to the external line should pass
through an ODF capable of handling the high-power signals
generated by the OFA_R card. ECI offers a special ODF
version, ODF-HP, for this purpose.
The additional OFA_R/RM/HRM connector, MON, is used only during

maintenance activities.
The OFA_R/RM/HRM card is shipped with caps installed on all the
connectors. Make sure to keep the caps on until the fibers are connected. Keep
the removed caps for use, in particular the caps of the SVC and MON
connectors.
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Specific safety precautions for OFA_R/RM/HRM

cards
This section provides additional safety instructions related to the
OFA_R/RM/HRM that supplement the general laser safety information (see
"Laser Safety Requirements" page 1-21).
These instructions will help you prevent dangerous situations and possible eye
injury to yourself and to your colleagues.
Always use protective goggles with minimum OD6 when working on

OFA_R/RM/HRM cards or on parts of the system that carry
OFA_R/RM/HRM signals (fibers, ODFs, and so on). Inspect the goggles
for integrity (scratches, broken lenses, and any other type of damage);
replace the goggles if in doubt.
Work on OFA_R/RM/HRM cards must be carried out only in a restricted

access area. Only people trained in laser safety may be allowed to enter the
work area.
The optical path carrying OFA_R/RM/HRM signals must be fully installed

before starting to connect fibers to the OFA_R/RM/HRM. All the fibers
carrying such signals must be inspected to ensure that they are in good
condition. Replace any fiber section if in doubt.
Place warning labels alongside all the connectors of fibers that carry
OFA_R/RM/HRM signals, in particular on the ODF connectors, as follows:
HAZARD LEVEL 3B.
DO NOT DISCONNECT UNDER OPERATION.
Under no circumstances (installation, operation, measurements, and

maintenance activities) should you apply power to an OFA_R/RM/HRM
card unless fibers are connected or protective caps are installed on its
connectors. Observe the following precautions:
Complete all the optical connections between the OFA_R/RM/HRM

and an ODF, another card, test jig, or test equipment before applying
power.
If the connections to the OFA_R/RM/HRM have not yet been made, for
example during platform installation activities, always install protective
caps on the OFA_R optical connectors.
When time comes to connect fibers to the OFA_R/RM/HRM, first
make sure the platform is not powered and cannot be powered while
you work on it.
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and Routing

path of the OFA_R/RM/HRM signals while the OFA_R/RM/HRM is
powered, first disconnect the fiber from the LINE connector and only then
disconnect the far end of a fiber.
NOTE: Opening the protective cover of the
OFA_R/RM/HRM LINE connector automatically turns off

the OFA_R/RM/HRM pump lasers. However, when the
OFA_R is used in the forward mode, significant optical
power (generated by the EDFA amplifier connected to the
OFA_R) may still be present until the ALS function turns the
EDFA amplifier off.
When the APR mechanism is temporarily disabled, for example during

maintenance, place a warning label that notifies other persons and serves as
a reminder to reactivate APR after the maintenance activity has ended.
Connection instructions
Before you start:
1. Use a microscope to check that the LINE connector and the mating fiber
connector are clean.
2. Familiarize yourself with the items identified in the following figures.
3. Read the OFA_R/RM/HRM specific safety instructions.
To connect fibers to the SVC and EDFA connectors:
1. Bring the end of the fiber intended for connection near the SVC connector.
2. Remove the SVC connector cap and immediately connect the fiber to the
connector.
3. Route the fiber intended for connection to the EDFA connector along the
right-hand side of the card, through the upper fiber guide, and bring its end
near the connector.
4. Remove the EDFA connector cap and immediately connect the fiber to the
connector.
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To connect the fiber to the LINE connector:

1. Open the lock screw of the LINE connector cover.
2. Open the protective cover of the LINE connector.
3. Route the fiber intended for connection to the LINE connector along the
right-hand side of the card, through the upper and lower fiber guides, and
bring its end near the LINE connector.
4. Remove the LINE connector cap and immediately connect the fiber to the
connector.
5. Close the protective cover and fasten it with its lock screw.
Figure 7-5: Opening OFA_R protective cover
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Figure 7-6: OFA_R connectors
Connecting Fibers to the ODF_HP

Specific safety precautions
ODF_HP is an optical distribution frame for fibers carrying high-power optical
signals (Hazard Level 3B). A typical application for the ODF_HP is to handle
the connections to the line side of the OFA_R Raman amplifiers offered by
ECI.
This section provides additional safety instructions relating to the ODF_HP and
OFA_R that supplement the general laser safety information (see "Laser Safety
Requirements" page 1-21).
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These instructions will help you prevent dangerous situations and possible eye
injury to yourself and to your colleagues.
Always use protective goggles with minimum OD6 when working on the
ODF_HP, on the fibers that connect to the ODF_HP, and on any parts of
the system that carry OFA_R signals. Inspect the goggles for integrity
(scratches, broken lenses, and any other type of damage); replace the
goggles if in doubt.
Work on the ODF_HP must be carried out only in a restricted access area.
Only people trained in laser safety may be allowed to enter the work area.
Do not connect fibers to the LINE connector of an OFA_R until the

ODF_HP and the optical paths carrying OFA_R signals are fully installed.
All the fibers carrying such signals must be inspected to ensure that they
are in good condition. Replace any fiber section if in doubt.
Place warning labels alongside the connectors of the fibers that carry
OFA_R signals, in particular on the ODF_HP front panel and near the
connectors, as follows:
HAZARD LEVEL 3B.
DO NOT DISCONNECT UNDER OPERATION.

path of the OFA_R signals while the OFA_R is powered, first disconnect
the fiber from the LINE connector of the OFA_R, and only then disconnect
the far end of a fiber.
Connection instructions
Before you start:
1. Use a microscope to check that the ODF_HP fiber tray connectors and the
mating fiber connectors are clean.
2. Bring the ends of the fibers to be interconnected at the ODF_HP to the
level of the ODF_HP: the fibers terminated in connectors must be routed
along the right-hand side of the rack, and fibers to be spliced along the
left-hand side.
3. Familiarize yourself with the items identified in the following figures.
4. Read the ODF_HP and OFA_R specific safety instructions.
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To splice fibers to the ODF_HP pigtails:

1. Open the two locks securing the front panel of the ODF_HP.
2. If the ODF_HP has two fiber trays, identify the fiber tray on which you will
work in accordance with the site installation plan, and then pull the fiber
tray out to the position shown in the following figure.
Figure 7-7: ODF_HP view with open panel
3. Open the lid of the fiber tray (see internal details in the following figure).
Figure 7-8: Detailed view of fiber tray with lid removed
4. Route each fiber to be spliced to a pigtail through the fiber harness exit into
the ODF_HP.
5. Route each fiber to the splices comb, as shown in the previous figure. Make
sure to leave enough slack.
6. Splice the fiber to the pigtails connecting to the prescribed connector in
accordance with the site installation plan. Record the fiber identification
data on the label located on the fiber tray lid.
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7. Repeat the process until all the fibers have been spliced.
8. Form the fibers into a harness, and secure the harness with cable ties as
shown in the following figure.
Figure 7-9: Fastening the fiber harness to the exit of the fiber tray
To connect the fibers from the OFA_R to the tray:

1. Route each fiber to be connected to a tray connector into the ODF_HP
through the fibers entry on the right-hand side.
2. Identify the appropriate fiber tray connector in accordance with the site
installation plan.
3. Bring the end of the fiber intended for connection near the corresponding
connector.
4. When ready to connect, remove the connector cap and immediately connect
the fiber connector to the tray connector.
5. Repeat the process until all the fibers have been connected.
To reinsert the fiber tray into the ODF_HP:
1. After completing all the connections to the fiber tray, inspect the work and
then reinstall the fiber tray lid.
2. Neatly arrange the fibers and then raise the fiber tray to the horizontal
position.
3. Slowly push the tray inward until it is fully inserted. At all times, observe
the fibers and guide them so as to prevent sharp bends.
To connect fibers to the additional tray of the ODF_HP:
If the ODF_HP has an additional fiber tray, make the necessary

connections as explained above.
If not, skip directly to Closing the ODF_HP procedure.
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To close the ODF_HP:

1. Make sure the ODF_HP fiber trays are fully inserted and that the fibers
attached to each tray are properly routed, with enough slack and without
any sharp bends.
2. Raise the front panel of the ODF_HP and lock it in place.
Connecting Traffic Cables to Electrical

Interfaces
Routing and Connecting Multipair Cables
Multipair cables are used to connect to the balanced E1 (2.048 Mbps)
interfaces in M2_21B and M2_84B electrical connection modules. Up to six
cables can be connected to each M2_84B module, and up to two cables to each
M2_21B module.
Each multipair cable consists of 14 quads (a quad comprises two twisted pairs),
for a total of 28 twisted pairs per cable. The cable end connecting to the XDM
platform is terminated in a 68-pin SCSI male connector.
As part of the site preparations, suitable cables should be routed from the
relevant DDF to the intended rack location. Sufficient length should be
available to permit routing the cables to the appropriate level in the rack.
To route and connect multipair cables:
1. Arrange the multipair traffic cables in two groups and route them through
the cables guides (combs) attached to the rack side rails.
2. Pull each multipair cable down to the level of the corresponding electrical
connection module.
3. Bend the cable and thread it through the side cable combs of the rack and
through the appropriate opening of the special cable guide serving the
platform, until the cable connector is positioned against the appropriate
slot. Use cable ties as required to fasten the cable to the rack side rails.
4. Use a cabling diagram of the site to associate module connectors with the
appropriate DDF connections. Cut excess cable length if necessary.
5. Assemble 68-pin SCSI male connectors on the multipair cables (see
"Connector Pin Assignments" page B-1).
6. Connect the cable connector to the corresponding electrical connection
module connector.
CAUTION: Exerting excessive tightening torque to secure
the cable connector may damage the electrical connection
module.
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7. Secure the cable connector to the module connector by means of the two
cable connector screws. Tighten the screws by hand. If the screws cannot
be reached with your bare hand, use an adjustable-torque flatblade
screwdriver (maximum blade size 0.6). Set the tightening torque to 40-44
Newton-cm.
Routing and Connecting Multicoax Cables

Multicoax cables are used to connect to the unbalanced E1 (2.048 Mbps)
interfaces in M2_21U and M2_84U electrical connection modules. Up to six
cables can be connected to each M2_84U module and up to two cables to each
M2_21U module.
Each cable consists of 14 pairs of 2-mm 75 coaxial cables, and the cable end
connecting to the XDM platform is terminated in a 68-pin SCSI male connector
supporting multicoax cables.
available to permit routing the cables to the appropriate level in the rack.
To route and connect multicoax cables:
1. Arrange the multicoax cables in two groups and route them through the
cables guides (combs) attached to the rack side rails.
2. Pull each multicoax cable down to the level of the corresponding electrical
connection module.
5. Assemble the appropriate type of 68-pin SCSI male connectors on the
multicoax cables (see "Connector Pin Assignments" page B-1).
module connector.
module.
7. Secure the cable connector to the module connector by means of the two
Newton-cm.
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Routing and Connecting Coaxial Cables

Individual coaxial cables are used to connect to the electrical interfaces in
M1_8 and M1_16 electrical connection modules. Use 2-mm (.08-in.) 75
coaxial cables terminated in coaxial connectors matching those of the electrical
interface module (BT-43 or DIN 1.6/5.6 mm/.22 in.).
Considering the large number of coaxial cables, it is recommended to form a
separate harness from the cables connecting to the same module, and route the
harness as explained previously for multipair and multicoax cables to the level
of the required slot. Use cable ties as required to fasten the harnesses to the
rack side rails.
Routing and Connecting Ethernet Cables

Ethernet cables are used to connect to electrical interfaces on data cards and
electrical interface connection modules. Each cable consists of 4 twisted pairs.
The cable end connecting to the XDM platform is terminated in a RJ-45 plug.
available to permit routing the cables to the appropriate level in the rack. In any
case, the length of the cables must not exceed the maximum recommended for
the cable type (up to 100 meters).
NOTE: To support the Autonegotiation feature on electrical
ports, use CAT5E SFTP 2-pair or 4-pair straight cable to
connect 10/100BaseT ports, or CAT5E SFTP 4-pair straight
cable to connect 1000BaseT ports.
To route and connect Ethernet cables:
1. Based on the site cabling diagram, arrange the Ethernet cables in two
groups according to the designated data cards or modules, and route them
through the cables guides (combs) attached to the rack side rails.
2. Pull each Ethernet cable down to the level of the corresponding electrical
connection module.
platform, until the cable edge is positioned against the appropriate slot. Use
cable ties as required to fasten the cable to the rack side rails.
5. Assemble RJ-45 connectors on the Ethernet cables.
module connector.
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Routing and Connecting Clock Cables

The clock cables are connected to the T3_1/T4_1 and T3_2/T4_2 connectors of
the xECB. Each cable is terminated in a 9-pin D-type female connector.
To route and connect clock cables:
1. Arrange the clock cables in two groups and route them through the cables
guides (combs) attached to the rack side rails.
2. Pull each clock cable down to the level of the corresponding electrical
connection module.
appropriate xECB connections. Cut excess cable length if necessary.
5. Assemble the appropriate type of 68-pin SCSI male connectors on the clock
cables (see "Connector Pin Assignments" page B-1).
6. Connect the cable connector to the prescribed connector.
module.
7. Secure the cable connector to the mating connector by means of the two
Newton-cm.
Use cable ties as required to fasten the cables to the rack side rails.
the cable connector may damage the xECB.
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Connecting Electrical Cables to ATS Cards

The ATS card has two RJ-45 connectors located on its edge. One of the
connectors is located under a protective cover, as shown in the following
figure.
When it is necessary to connect a cable to this connector, open the cover
carefully, making sure to prevent the cover from touching the lower RJ-45
connector.
Figure 7-10: Reaching the ATS card RJ-45 connectors
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Connecting Management Cables

The EMS-XDM management software is run on a workstation. The
workstation is connected to a gateway network element (GNE). The other NEs
communicate with the EMS-XDM through the network link. For more
information, refer to the EMS-XDM User Guide.
Ethernet cables are used to connect the workstation to the GNE. The
connection of out-of-band management traffic to an XDM platform is made to
the RJ-45 ETHERNET connectors located on the MECP card.
Each ETHERNET connector is wired as a 10BaseT station port:
For direct connection to a port of a 10BaseT Ethernet hub, use one

RJ-45-to-RJ-45 straight cable (cable wired point-to-point).
For connection to the Ethernet port of a PC, use an RJ-45-to-RJ-45

cross-wired cable.
Suitable standard Ethernet station cables are available from many sources.
Category 3 or better cables must be used. In any case, the length of the cables
must not exceed the maximum recommended for the cable type and hub port in
use (up to a few dozens of meters or feet).
Management cables are run from the workstation to the MAIN MNG and
PROT MNG ports on the MECP card installed in the XDM platform.
Protective components for the power supply and hard drive disks are also
recommended, and included in the following connection procedure description.
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To connect the UPS to the EMS-XDM computer, terminal,

and RAID:
As part of a comprehensive approach to network resiliency and protection,
network operators should always work with power supply protection (such as
an Uninterrupted Power Supply (UPS) unit), as well as with hard drive/data
backup protection (such as a Redundant Array of Independent Disks (RAID)
unit).
Arrange and connect each component as illustrated in the following figure.
Figure 7-11: Management workstation and protection components
To connect the EMS-XDM to the GNE through an Ethernet

cable:
Route the cables from the workstation to the MECP card on the designated
GNE.
The management network connection can either be direct from the
workstation to the GNE, or via a switch and through the internal IP
Ethernet network onsite, as illustrated in the following figure.
Figure 7-12: Connecting management workstation to MECP on the GNE
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8
Commissioning Tests
In this chapter:
Overview ......................................................................................................... 8-1
Tools and Equipment ....................................................................................... 8-2
Prerequisites .................................................................................................... 8-3
Site Commissioning Tests ............................................................................... 8-5
Network Commissioning ............................................................................... 8-10
Overview
After completing the installation and preliminary configuration of a new
network, a formal commissioning test procedure should be followed to ensure
the network has been properly installed and operates according to
specifications.
The Field Engineering Department of ECI's Transport Networking Division
usually prepares detailed commissioning test procedures for each specific
project, as well as the related acceptance forms.
The procedures in this section serve as the basis for the preparation of specific
commissioning tests for any particular network.
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If problems are detected during the tests, refer to Troubleshooting (page 9-11)
for instructions that will help you identify the source of the problem and take
corrective actions.
NOTES:
Personnel involved in the execution and supervision of

commissioning tests must be familiar with the applicable
safety precautions and requirements (see "Installing XDM500: Before You Start Safety Guidelines" page 1-1).
Unless otherwise indicated, the tests described in these
sections apply to all XDM platforms and to both SDH and
SONET.
Tools and Equipment

The following test equipment is required for the commissioning test
procedures:
PDH transmission analyzer for testing PDH transmission performance
SDH transmission analyzer for testing SDH transmission performance
Data transmission test equipment for testing GbE and 10/100 Mbps
transmission performance
Optical Power Meter (OPM)
Optical Laser Source (OLS)
Optical spectrum analyzer (recommended for measurements at points

carrying multiple wavelengths, for example, inputs and outputs of optical
amplifiers)
Optical BER tester
Set of optical attenuators with various values
Variable optical attenuator
FC-to-LC and FC-to-SC adapters
FC/FC optical patch cords
Multimeter
Equipment with suitable characteristics is available from a wide range of

manufacturers, and therefore no specific test equipment models are listed. If
necessary, contact ECI's Field Engineering Department for specific
recommendations.
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Commissioning Tests
In general, you can use any equipment model meeting the applicable
international standards and having satisfactory measurement accuracy over the
range of operating parameters and environmental conditions that apply to the
network.
In addition to test equipment, make sure that the tools and materials used for
equipment installation are also available during the commissioning test
procedures.
Prerequisites
Management Requirements
Before performing the commissioning test procedures, it is necessary to set up
the management network needed to control the installed equipment. The
management network must include the functionality of ECI's network
management system.
When the network also has SYNCOM equipment, the XDM management
network may be integrated within the SYNCOM management network. For a
description of XDM integration in SYNCOM networks, see Integrating XDM
equipment in SYNCOM networks (page D-1).
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Customer Assistance
The commissioning tests perform all the tests that can be done in the customer's
network.
You may need to provide certain specific parameters to integrate the network
into existing operations. In particular, you may have to provide IP addresses for
the management of the network's equipment. Two types of IP addresses can be
used:
Global addresses: addresses unique in the whole Internet and managed by

IANA.
Private addresses: addresses allocated for internal use only and not usable
on the Internet.
Although no restrictions need to be imposed on private IP addresses except
that they conform to standardized IP address structure, the following
address spaces have been specifically put aside by IANA for use as private
addresses:
Class A addresses in the range of 10.0.0.0 to 10.255.255.255 (this

group of addresses is formally referred to as 10/8). This address space
is actually one Class A network number.
Class B addresses in the range of 172.16.0.0 to 172.31.255.255 (this
group of addresses is formally referred to as 172.16/12). This address
space defines 16 contiguous Class B network numbers.
Class C addresses in the range of 192.168.0.0 to 192.168.255.255 (this
group of addresses is formally referred to as 192.168/16). This address
space defines 256 contiguous Class C network numbers.
For its own purposes, including internal XDM IP addressing, ECI uses the
following IP Class C networks:
192.168.10.0
192.168.11.0
192.68.1.0
192.9.90.0
To prevent possible addressing conflicts and ensuing malfunctions, it is

forbidden to assign NEs and gateways any IP addresses within these
networks.
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Commissioning Tests
Site Commissioning Tests

The purpose of the site commissioning tests is to verify the normal operation of
the XDM NEs. The following procedures should be performed on each NE at
each site.
1. Checking cards and modules installed in each platform (page 8-5).
2. Performing visual inspection and mechanical checks (see "Unpacking and
Visual Inspection" page 4-9).
NOTE: It is recommended to document the final installation
using a digital camera. The information collected in this way

may be useful during troubleshooting and maintenance
activities.
3. Measuring optical levels (page 8-8). Use the reference data in the XDM
System Specification.
4. Measuring signals at monitoring points.
5. Performing the platform power-on test procedure (page 8-10).
Any problems detected during the site commissioning tests must immediately
be corrected before proceeding to other commissioning tests.
Checking Cards and Modules Installed in

Each Platform
The purpose of this check is to confirm that the required cards and modules
have been installed in each site, and to record their firmware versions and serial
numbers.
The following table provides a typical form for manually recording the cards
and modules installed in an XDM platform.
Table 8-1:
Card and module inventory
Card/Module type
Slot
Boot version
Serial number
1
2
3
4
5
6
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NOTES:
Make sure that the boot version of each card matches the
embedded version.
If the equipment is already connected to a management
station, you may use the Inventory window to collect the
information and print the relevant data. Refer to the ECI
management system user's manual for detailed
instructions.
Visual Inspection and Mechanical Checks

The purpose of the visual inspection is to check for proper installation of the
equipment, check correct routing and connection of cables, and other tasks
related to equipment installation.
The criteria for proper execution of the installation works is according to the
instructions in the Installation chapter.
The criteria for proper cabling routing are according to the site cabling
diagram.
A typical list for recording the results of a typical set of checks performed on
an XDM shelf is described in the following table. Use the table as follows:
1. Perform the visual inspection (items 1 to 9 in the following table).
2. Power on the XDM shelves and execute the acceptance tests (items 10 to
13 in the following table). These tests check the functions needed for
continuing the execution of the network commissioning tests.
3. Perform the remaining tests (items 14 to 21 in the following table). The
criteria for normal LED indications (items 17 and 18), as well as a
description of the various card indicators and their functions, are provided
in the XDM-1000 Product Line Reference Manual.
NOTE: If user-provided power distribution panels are used
instead of xRAP/xRAP-100, perform the steps related to the
xRAP/xRAP-100 on the power distribution panels.
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Table 8-2:
Commissioning Tests
Visual inspection and mechanical checks
No.
Description of inspection/check
Mechanical mounting of the rack
DC power cable installation (main fuse to xRAP/xRAP-100;

xRAP/xRAP-100 fuse to shelf)
Ground cable connections
2, 34, 45, 52, 140, 155 Mbps tributary cables installation and
routing between the shelf connector panel and the DDF
622 Mbps, 2.5 Gbps, 10 Gbps optical interface fiber

installation, connections, and routing to the ODF
DDF installation and cable connections
ODF installation and cable connections
Network manager station installation (when applicable)
Unpacking of cards and insertion in shelves
10
DC supply voltage provision by the first DC source to the

xRAP/xRAP-100 (-40 V to -57.6 V)
___V
11
DC supply voltage provision by the second DC source to the

xRAP/xRAP-100 (-40 V to -57.6 V)
___V
12
Shelves power-on
13
Checking proper operation of both xRAP/xRAP-100 power

sources by disconnecting one source at a time
14
Checking communication between the shelf and the

LCT-XDM via the shelf SLIP interface
15
Checking proper operation of all the xFCU units
16
Checking increase in speed of remaining xFCU units when

one xFCU is removed (not relevant when SIO16_1 cards are
inserted)
17
Checking LED operation by pressing the LED TEST

pushbutton on the MECP
18
Visual testing of normal LED indications
19
Checking installation of Cisco ATA-186/Cisco 2600/Call

Manager (when applicable)
20
Checking slot assignment for all the relevant cards
21
Checking there are no abnormal alarms
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Measuring Optical Levels

The purpose of these measurements is to check for proper optical signal levels
at the various equipment ports. Proper optical levels, within the limits specified
in the XDM System Specification, must be achieved for each optical component
before starting any other commissioning tests.
The measurements are made using an OPM configured in accordance with the
wavelength at the measurement port. For reliable measurement, do not connect
the OPM directly to a port but use a 2-meter/6.6-foot cable. When measuring
high optical power levels, use attenuators to ensure that the power does not
exceed the maximum OPM input level.
The following table provides a typical data form for recording the results of the
optical level measurements on an XDM platform.
Table 8-3:
Slot
Measured optical levels
Card type
Port (1 to 16 or
lower/upper)
Wavelength
Optical transmit
level (dBm)
Receive level
(dBm)
The measured power levels must be evaluated against two types of criteria:
It is within the range of minimum and maximum levels specified in the

XDM System Specification for the transceiver plug-in type installed on the
corresponding port.
It is within the range expected in accordance with the optical network

planning.
If necessary, contact ECI's Field Engineering Department for relevant port and
optical transceiver plug-in specifications and network planning data. An OK
result means that the port meets both criteria.
To minimize the number of measurements, it is usually sufficient to measure
only the optical levels at the transmit and receive ports of I/O cards,
transponders, and optical amplifiers installed in each platform. A good port
receive level also indicates that the components in the optical path up to that
port are properly connected and operate normally. If the result is not
satisfactory, make the additional measurements at all the other ports along the
optical signal paths.
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Measuring Signals at Monitoring Points

These measurements may be used to supplement the formal measurements
needed to ensure compliance with the network design objectives. Their main
purpose is to collect additional information that may be used to facilitate
troubleshooting in case of unsatisfactory performance.
The measurement of signals at monitoring points is performed only when ECI's
technical support personnel determine that they are needed.
Since these measurements check signal levels and waveforms at the monitoring
ports (electrical or optical) defined as internal equipment points, they are not
subject to customer acceptance.
The following table lists the relevant monitoring points for the cards and
modules that support this function, the measurement method and, where
applicable, the expected signal characteristics. For the physical identification of
each monitoring point, refer to the XDM-1000 Product Line Reference Manual.
Table 8-4:
Signal characteristics at monitoring points
Card/Module
Monitoring point function
PIO2_21, PIO2_84
Test jack for monitoring the drop path of a selected tributary.

Expected signal: in accordance with ITU-T Rec. G.772.
PIO345 (all types)
Test jack for monitoring the drop path of a selected tributary.

Expected signal: in accordance with ITU-T Rec. G.772.
SIO1&4 (all types)
SMA connector (75 ) for monitoring the drop path of a

selected tributary. Expected signal: in accordance with
Deutsche Telekom V.99.
SIO16 (all types)
Two SMA connectors (75 ), one for each transceiver.

Expected signal: in accordance with Deutsche Telekom V.99.
SIO64 (all types)
One SMA connector (75 ) for monitoring 622.08 clock

signal. Expected signal: in accordance with Deutsche
Telekom V.99.
Optical monitoring connector through 95%/5% splitter.
TRP10_2 (all types)
OFA_2 cards and

optical amplifier
modules (all types)
MO_OFA_M/OFA_M
cards (all types)
MO_OFA_HBC
MO_OFA_PHBC
MUX
Optical monitoring connector through 95%/5% or 50%/50%

splitter, depending on the version.
DEMUX (all types)
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Note that the SIO1&4B and SIO164 cards do not include any physical
monitoring points. Optical Rx and Tx power levels for the SIO1&4B and
SIO164 cards are monitored through the EMS-XDM management system.
Refer to the EMS-XDM User Manual for more information.
Platform Power-On Test Procedure

For each platform, perform the platform power-on test as follows:
1. Perform slot assignments for all the relevant cards in the platform.
2. Turn the platform circuit breaker off.
3. After 30 seconds, turn the platform circuit breaker on.
The equipment should return to normal operation automatically, without user
intervention and without any abnormal alarm on any card in the system.
Network Commissioning
SDH Network Commissioning Tests
The SDH network commissioning includes functional tests that check network
operation at the PDH/SDH level to ensure its functional objectives are
achieved.
Perform these tests only after the site acceptance tests have successfully been
completed.
Required Test Equipment

The tests require the use of test equipment capable of measuring the stated
performance parameters. For additional information, see Tools and Equipment
(page 8-2).
Standard test conditions for E1 ports
8-10
Framing
Unframed
Coding
HDB3
Pattern
215-1 PRBS
Signal rate
Nominal rate 2.048 Mbps
Timing
Received clock
Inject error
Code error
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Commissioning Tests

Framing
Unframed
Coding
HDB3
Pattern
215-1 PRBS
Signal rate
Timing
Received clock
Inject error
Code error
Standard test conditions for DS-3 ports

Framing
Framed
Coding
DS-3 framing mode C-bit

X-bit 11
Pattern
215-1 PRBS
Signal rate
Timing
Received clock
Inject error
Code error
Standard test conditions for SDH ports

Signal and bitrate
According to the interface type being tested:

STM-1: 155.520 Mbps
STM-4: 622.08 Mbps
STM-16: 2488.32 Mbps
STM-64: 9953.28 Mbps
Mapping
Any mapping (preferably bulk)
Framing
Off
Pattern
223-1 PRBS
Timing
Received clock
Inject error
Code error
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Standard test conditions for SONET ports

Signal and bitrate
According to the interface type being tested:

STS-1: 51.84 Mbps
OC-3: 155.520 Mbps
OC-12: 622.08 Mbps
OC-48: 2488.32 Mbps
OC-192: 9953.28 Mbps
Mapping
Any mapping (preferably bulk)
Framing
Off
Pattern
223-1 PRBS
Timing
Received clock
Inject error
Code error
Preparations for Test

Before you start:
1. Perform the preliminary configuration using an LCT-XDM terminal
connected directly to each XDM platform.
2. After completing the preliminary configuration and throughout the network
commissioning tests, use the management station to manage the XDM
platforms under test.
Test Sequence
The list of tests performed at the network commissioning stage depends on the
network functionality. Procedures for the following tests are listed below:
8-12
Network Timing Synchronization Test (page 8-13)
Loss of Signal (LOS) Detection Test (page 8-14)
Input Sensitivity Test (page 8-14)
Equipment Power-on Test (page 8-16)
Stability Test (page 8-17)
Path Protection and Nonretrieval Operation Test (page 8-18)
MSP 1+1 Test (page 8-19)
IOP Hardware Protection Test (page 8-20)
Severity Assignment Test (page 8-21)
Handling Transmission Alarms Test (page 8-22)
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Maintenance Handling Test (page 8-23)
xMCP Redundancy Test (page 8-24)
HLXC/XIO Redundancy Test (page 8-25)
Cisco ATA 186/Cisco2600/CallManager test (page 8-25)
MS-SPRing protection test (page 8-26)
Network Timing Synchronization Test

The purpose of this test is to verify that the XDM platforms synchronize
properly and switch to the next priority timing source when the original timing
source fails.
No.
Test procedure
1.
Configure one of the

interconnected XDM platforms to
use its internal clock as the
timing source (an external source
may also be used).
2.
Configure all the other XDM

platforms in the network to
synchronize to the XDM
platform using the internal clock.
3.
Configure several priorities for

the timing source.
4.
For each XDM platform,

disconnect the Rx fiber arriving
from the XDM platform serving
as the main timing source.
417006-2304-0H3-B02
Expected results
If the platform has a single timing

source:
Check the reporting of the alarm
regarding loss of main timing
source.
Check for switching to holdover
mode.
If XDM platform has several timing
sources:
Check for switching to the second
priority timing source.
Check the reporting of the alarm
regarding loss of main timing
source.
8-13
Commissioning Tests

Maintenance Manual
Loss of Signal (LOS) Detection Test

The purpose of this test is to verify that the XDM platforms recognize alarms
and send the proper alarm notification to the management station for viewing.
No.
Test procedure
1.
Create the NEs and links using

the management station.
2.
Disconnect the optical fiber from The management station receives a LOS
the receive input connector of the alarm at the SPI level of the
port to be tested.
corresponding optical port. Additional
alarms caused by the LOS condition also
After completing the test,
appear.
reconnect the optical fiber.
3.
Expected results
Input Sensitivity Test

The purpose of this test is to verify that the input sensitivity of the XDM
optical cards and/or modules is according to their technical specifications (as
listed in the XDM System Specification). See test setup in the following figure.
Figure 8-1: Input sensitivity test setup
8-14
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Maintenance Manual
Commissioning Tests
No.
Test procedure
1.
Create an unprotected trail at a

rate supported by one of the
tributary cards in use between
two interconnected XDM
platforms.
2.
Connect test equipment to a trail

endpoint on one of the two XDM
platforms.
3.
Connect a loopback at the other

endpoint of the trail on the other
XDM platform.
4.
Insert a variable optical

attenuator in series with the
receive input of the XDM
platform connected to the PDH
analyzer.
5.
Set the optical attenuation to

0 dB.
6.
Slowly increase the attenuation

until the PDH analyzer starts
displaying bursts of errors.
Record the attenuation at which
this occurs.
No alarms at the SPI, MS, and RS levels

are activated when the test equipment
first starts displaying bursts of errors.
7.
Connect an optical power meter

to the first Rx port after the
optical attenuator and measure
the total power.
The measured optical power is the input

sensitivity of the card. Check that the
results equal those defined in the XDM
System Specification.
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Expected results
8-15
Commissioning Tests

Maintenance Manual
Equipment Power-on Test

This test checks that, after being turned on, the XDM equipment automatically
returns to operation in accordance with the last configuration.
8-16
No.
Test procedure
Expected results
1.
Create an unprotected trail at any

rate supported by the tributary
cards in use between two
interconnected XDM platforms.
Make sure that neither XDM
platform serves as a management
gateway.
2.
Connect test equipment to a trail

endpoint on one of the two XDM
platforms.
3.
Connect a loopback at the other

endpoint of the trail on the other
XDM platform.
The test equipment displays no errors.
4.
Turn off one of the XDM

platforms on the trail (make sure
that this platform does not serve
as a gateway).
The test equipment displays errors and

reports an AIS alarm.
5.
Wait approximately seven

minutes.
An NE Disconnected alarm appears in

the current alarm log, and the NE icon
on the management station is gray (no
management communication).
6.
Power on the XDM platform

again.
7.
Wait for the XDM platform to

perform initial software
download, and complete the
tributary cards software
downloading (this may take 20
minutes).
8.
Check for alarms on the test

equipment.
The test equipment reports no alarms.
9.
Wait for management

communication to be established
with all the XDM platforms that
were disconnected from the
management station while the
XDM platform was off.
The equipment returns to normal

operation automatically, without
operator intervention.
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Maintenance Manual
Commissioning Tests
Stability Test
The purpose of this test is to verify that the XDM network carries traffic in
accordance with the ITU-T standards.
No.
Test procedure
1.
Create a trail at any rate supported by

the tributary cards in use between two
interconnected XDM platforms in the
network.
2.
Connect the test equipment to one

endpoint of the trail, and perform a
loopback at the other endpoint of the
trail.
3.
Check for alarms on the test equipment.
The test equipment reports no

alarms.
4.
Run this test for time specified below:

2 Mbps: 14 hours
34 Mbps and 45 Mbps: 7 hours
STM-1: 120 minutes
STM-4: 30 minutes
STM-16: 8 minutes
STM-64: 2 minutes
These intervals check for error rate
lower than 1x10-11 at 2 Mbps, and
1x10-12 at the other rates.
Neither the test equipment nor

the management station report
any alarms throughout the test
interval.
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Expected results
8-17
Commissioning Tests

Maintenance Manual
Path Protection and Nonretrieval Operation

Test
The purpose of this test is to verify that SNCP traffic in the XDM network
continues smoothly during a network failure.
8-18
No.
Test procedure
1.
Create one protected trail at any

rate supported by the tributary
2.
Connect test equipment to one

endpoint of the trail, and perform
a loopback at the other endpoint
of the trail.
3.
Disconnect one of the optical

fibers in the active path of the
trail.
4.
Check that the trail carries traffic

properly on the protection path.
5.
Reconnect the previously

disconnected optical fiber.
Expected results
Switching to the protection path occurs,

and short bursts of errors (less than 50
msec) are reported by the test
equipment. The management station
reports an alarm on the active path of the
trail.
The trail continues using the protection

path, and the test equipment indicates no
alarm.
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Maintenance Manual
Commissioning Tests
MSP 1+1 Test

The purpose of this test is to verify that MSP traffic in the XDM network
continues smoothly during a network failure.
MSP can also be used in point-to-point configurations.
No.
Test procedure
1.
Create one unprotected trail at

any rate supported by the
tributary cards in use between
two interconnected XDM
platforms.
2.

of the trail.
3.

trail.
4.
Check that the trail carries traffic

properly on the protection path.
5.

417006-2304-0H3-B02
Expected results

reports an alarm on the active path of the
trail.

alarm.
8-19
Commissioning Tests

Maintenance Manual
IOP Hardware Protection Test

The purpose of this test is to verify that the traffic carried by an XDM card with
hardware protection is properly handled when a failure occurs.
8-20
No.
Test procedure
Expected results
1.
Create one unprotected trail at

any rate between two
interconnected XDM platforms
on a card with hardware
protection.
You may use either a card with a
trail passing through it (SIO
card), or one that terminates the
trail (PIO card).
2.

end of the trail.
3.
Perform a loopback at the other

end of the trail, and check
whether the test equipment
detects alarms.
The test equipment detects no alarms.
4.
Extract the protected (working)

card.

reports an alarm on the trail.
5.
Check that the trail carries traffic The orange PROT indicator on the
properly on the protection
electrical interface module lights up.
(standby) card.
6.
Reinsert the protected (working)

card.
After 5 minutes (a default value, which

may be changed), the traffic reverts to
the protected card.
reports no alarm on the trail.
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Maintenance Manual
Commissioning Tests
Severity Assignment Test

The purpose of this test is to determine the urgency assigned to each alarm and
to create an alarm-handling protocol.
When detecting or removing a fault, the XDM platform updates the status of
the LEDs and reports the alarm activation/clearing to the management station.
This test is performed on one XDM platform.
CAUTION: To prevent disruption of data stored on the NVM
card, in the following procedures make sure you do not press

the NVM release pushbutton while the xMCP accesses the
NVM. Before attempting to remove the NVM card, monitor
the yellow xMCP indicator. Press the release pushbutton only
after the yellow xMCP indicator is off for at least 2 minutes.
When removing/inserting an NVM card, hold the card
straight and make sure to prevent accidental contact between
the NVM card and the printed circuit board of the xMCP
card; such contact may cause the xMCP card to be reset.
No.
Test procedure
Expected results
1.
Extract an NVM card from the

xMCP.
The management station displays an

NVM Card Out alarm with Major
severity.
2.
Reinsert the NVM card into the

xMCP.
The management station no longer

displays the NVM Card Out alarm
severity.
3.
Change the severity of the Card

out alarm to Minor.
4.
Extract an NVM card from the

xMCP.
The management station displays an

NVM Card Out alarm with Minor
severity.
5.
Reinsert the NVM card into the

xMCP.
The management station no longer

displays the NVM Card Out alarm
severity.
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8-21
Commissioning Tests

Maintenance Manual
Handling Transmission Alarms Test

The purpose of this test is to verify that the XDM platforms can recognize an
alarm and send an alarm notification to the management station, and that the
management station displays it properly.
This procedure tests the following alarms: PDH-LOS, PDH-AIS, and SPI-LOS.
8-22
No.
Test procedure
Expected results
1.

rate supported by PDH tributary
2.

of the trail.
3.
Disconnect the transmit cable

from the test equipment.
4.
Reconnect the transmit cable to

the test equipment.
5.
Configure the test equipment to

send an AIS.
6.
Disconnect the receive fiber of an The management station reports an

optical port.
SPI-LOS alarm for the corresponding port.
If ALS is off, the management station
reports a far-end optical port MS-RDI.
If ALS is on, the management station
reports a far-end optical port LOS
alarm.
The management station reports a LOS

alarm for the corresponding port.
The management station reports an AIS

alarm for the corresponding port.
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Maintenance Manual
Commissioning Tests
Maintenance Handling Test

The purpose of this test is to verify that maintenance actions can be performed
on the XDM platforms using the management station.
This procedure tests the following functions:
Near-end loopback
Forced PDH AIS
Forced low-rate RDI (SDH only)
Forced high-rate RDI
Forced MS-RDI
No.
Test procedure
1.

rate supported by tributary cards
in use between two
2.

of the trail.
3.
Perform a near-end loopback at

the other end of the trail.
4.
Using the management station,

The test equipment detects an AIS
activate a forced AIS on the PDH alarm.
port connected to the test
equipment.
5.

An LP-RDI or VC-12 RDI alarm is
activate a forced low-rate RDI on detected at the far-end port of the trail.
the port connected to the test
equipment. (SDH only)
6.

activate a forced high-rate RDI
on the port connected to the test
equipment.
An HP-RDI or VC-4 RDI alarm is

detected at the far-end node.
7.

activate a forced MS-RDI on the
port connected to the test
equipment.
An MS-RDI alarm is detected at the

far-end node.
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Expected results
8-23
Commissioning Tests

Maintenance Manual
xMCP Redundancy Test

The purpose of this test is to verify that the backup xMCP operates properly
and that the database is not lost when the xMCP fails.
No.
Test procedure
1.

in use between two
2.

of the trail.
3.
Select an XDM platform that

carries the trail, and extract the
xMCP card installed in slot C1.
Expected results
8-24
No traffic alarm is detected by

either the test equipment or the
management station, but a Card
Out alarm for the xMCP card is
displayed by the management
station.
After several minutes, the XDM
platform disconnects from the
management station (becomes
gray), and then reconnects to the
management with the same
database (after switching to the
redundant xMCP). The Info
windows of both xMCP cards show
the correct status.
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Maintenance Manual
Commissioning Tests
HLXC/XIO Redundancy Test

The purpose of this test is to verify that the matrix protection mechanism in the
XDM network operates properly when a failure occurs.
NOTE: For XIO cards, the test trail should not pass through
an XIO I/O port.
No.
Test procedure
1.

in use between two
2.

of the trail.
3.
Select an XDM platform that

carries the trail, and extract the
active HLXC/XIO card (the card
with the lit orange indicator)
from the XDM platform.
Expected results
The management station displays a

Card Out alarm.
The test equipment detects a burst of
errors of less than 50 msec.
Cisco ATA 186/Cisco2600/CallManager Test

The purpose of this test is to verify that the Voice Over IP network operates
properly.
No.
Test procedure
1.
Select two sites with Cisco ATA 186, The Cisco ATA 186 in site B rings.
and dial from site A to site B.
2.
Pick up the Cisco ATA 186 handset

at site B.
417006-2304-0H3-B02
Expected results
The speakers at the two sites can

converse via the Cisco ATA 186
without noise.
8-25
Commissioning Tests

Maintenance Manual
MS-SPRing Protection Test

The purpose of this test is to verify that the MS-SPRing traffic in the XDM
network continues smoothly during a network failure.
This procedure uses SIO16M or SIO64M I/O modules.
No.
Test procedure
1.
Define the ring as MS-SPRing

(nodes linked east and west in a
clockwise direction).
2.

in use between two
3.

of the trail.
4.
Disconnect one of the fibers in

the path of the trail.
Expected results
5.
Reconnect the disconnected fiber.
8-26
The duration of the errors and

alarms reported by the test
equipment should be less than 50
msec. After 50 msec, the trail should
return to normal operation over the
protection path.
The management station reports an
alarm in the active path of the trail,
together with alarms related to the
disconnected fibers (LOS).
The trail operates properly after
switching to the protection path.
The alarms related to the
disconnected fibers disappear.
After the retrieve time (can be
defined by the customer), the trail
switches back to the main path.
The test equipment detects a short
alarm burst of less than 50 msec,
and the trail switches to the
protection path.
The trail operates properly after
switching back to the main path.
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Maintenance Manual
Commissioning Tests
Data Network Commissioning Tests

The data network commission tests include various functional tests at the data
transport level to ensure proper functionality of the integrated network.
All tests are performed according to RFC-2544.
The tests listed below are applicable to all the types of XDM data cards (DIO,
EIS, DIOB, and MCS).
Required Test Equipment

The tests require the use of test equipment capable of measuring the stated
performance parameters. The test equipment must be configured as follows:
Frame size:
Random (64 bytes to 1518 bytes)
Data/Payload:
Random
Destination address:
Fixed and unique
Source address:
Fixed and unique
Line rate:
According to customers router (default automatic

selection)
Test Sequence
The list of tests performed at the data network commissioning stage depends on
the network functionality. Procedures for the following tests are listed below:
Throughput and latency
Frame loss rate
System recovery and reset
Stability
Alarm handling
417006-2304-0H3-B02
8-27
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Maintenance Manual
Throughput and Latency Tests

The purpose of these tests is to determine the maximum amount of data that
can pass through the network before frames start to be discarded, and the time
required for frames to pass through the network.
No.
Test procedure
Expected results
1.
Create two unprotected trails at any

rate supported by data cards in use
between two interconnected XDM
platforms.
2.
Connect the test equipment to the

two ports of the trails on one of the
two XDM platforms.
3.
Connect a cross cable between the

two ports of the trails on the other
XDM platform.
4.
Configure the test equipment for

measurement of throughput and
latency in accordance with
RFC-2544.
5.
Inject traffic in accordance with the When calculating the latency, take into
assigned bandwidth (one VC-12 =
consideration:
2.048 Mbps), and measure
The measured latency is measured for
throughput and latency for the
the forward and return paths. The
following frame sizes: 64 bytes, 128
latency for a single path is half the
bytes, 256 bytes, 512 bytes, 1024
total.
bytes, 1280 bytes, and 1518 bytes.
The latency result depends on the
throughput results. For example, when
testing at 10 Mbps and the throughput
is 40%, the latency test is made for 4
Mbps (the bandwidth of two VC-12s
is 4 Mbps).
NOTES:
8-28
Measured latency is for both the forward and return paths.

For a single path, the latency is 50% of the measured
value.
The latency test is dependent on the throughput results.
For example, if 10 Mbps is tested and the throughput is
4%, the latency test is for 4 Mbps (2 x VC-12 = 4 Mbps).
Inject traffic according to the assigned bandwidth
(VC-12 = 2.048 Mbps).
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Maintenance Manual
Table 8-5:
Commissioning Tests
Throughput and latency test results
LAN port and 64 bytes/ 128

speed
frame
bytes/
frame
256
bytes/
frame
512
bytes/
frame
1024
bytes/
frame
1280
bytes/
frame
1518
bytes/
frame
Throughput
Latency
Frame Loss Rate Test

The purpose of this test is to determine the rate of lost frames when the system
is overloaded.
No.
Test procedure
1.
Create two unprotected trails at

any rate supported by data cards
in use between two interconnected
XDM platforms.
2.

two ports of the trails on one of
the two XDM platforms.
3.

XDM platform.
4.

measurement of frame loss in
accordance with RFC-2544. Set
for 100%.
Table 8-6:
Frame size
Expected results
The measured frame loss rate is calculated

as follows:
Frame Loss Rate = [(Input fps) (Output
fps)] x 100/(Input fps)
where fps stands for frames per second.
Frame loss rate test results

64 bytes/
frame
128
bytes/
frame
256
bytes/
frame
512
bytes/
frame
1024
bytes/
frame
1280
bytes/
frame
1518
bytes/
frame
Frame rate
(% MFR)
100%
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8-29
Commissioning Tests

Maintenance Manual
System Recovery and Reset Test

The purpose of this test is to determine the time needed for recovery from a
buffer overflow condition and from power failures.
No.
Test procedure
Expected results
1.
Create two unprotected trails at

any rate supported by data cards
in use between two interconnected
XDM platforms.
2.

3.

XDM platform.
4.

manual testing at the port rate,
and for any frame size.
5.
Power off one of the XDM

platforms.
Check for the ensuing frame loss, using

the test equipment.
6.
Turn the XDM platform on and

wait for two minutes.
The test equipment no longer reports

errors.
Stability Test
The purpose of this test is to check that no errors occur in the network for a
defined period of time.
8-30
No.
Test procedure
1.
Create two unprotected trails at any

rate supported by data cards in use
between two interconnected XDM
platforms.
2.

two ports of the trails on one of the
two XDM platforms.
3.

XDM platform.
4.

manual testing at the port rate, and
for any frame size.
5.
Run the test for two hours.
Expected results
Check that the test equipment reports

no errors.
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Maintenance Manual
Commissioning Tests
Alarm Handling Test

The alarm handling test checks the alarm report and the subsequent action
undertaken by the XDM platform under the following forced fault conditions:
Signal loss at the data LAN port
Signal loss at the optical interfaces
No.
Test procedure
Expected results
1.
Create two trails at any rate

supported by data cards in use
between two interconnected
XDM platforms.
2.

3.
Connect a cross cable between

the two ports of the trails on the
other XDM platform.
4.
Disconnect the test equipment to

create a signal loss at the data
LAN port.
A 10/100Mbps Link Down alarm is

reported (provided a VLAN has been
created).
5.
Disconnect the optical cable to

create a signal loss at the optical
interface.
An SPI-LOS alarm is reported for the

optical interface.
Optical Network Commissioning Tests

The optical network commissioning tests include various functional tests at the
optical level to ensure proper functionality of the integrated network.
The signal levels measured during the optical network commissioning tests
should be within the limits specified in the XDM System Specification.
Network Configuration
Before starting the optical network commissioning tests, configure the XDM
equipment for operation according to the specific customers requirements and
for using the network management station assigned to manage the XDM
equipment.
417006-2304-0H3-B02
8-31
Commissioning Tests

Maintenance Manual
Test Setup and Required Test Equipment

The tests performed during optical network commissioning check the
performance of transmission paths within the network. The tests require the use
of test equipment capable of measuring the stated performance parameters (see
"Tools and Equipment" page 8-2).
Connect the test equipment to each transponder installed at one end of the
tested transmission path. The test equipment must be configured to operate
at the transponder transmission rate (for example, STM-16 when connected
to a TRP25, and STM-64 when connected to a TRP10).
Connect a short section of patch fiber between the transmit and receive
ports of the corresponding transponder located at the other end of the tested
path to form an optical loopback. It is recommended to insert an
appropriate attenuator in the loopback path to ensure that the received
signal is within the normal operating range of the port.
When testing sensitivity and LOS, modify the test setup to include a variable
optical attenuator. The resulting test setup is shown in the following figure.
Figure 8-2: Test setup modified to support LOS and sensitivity tests
After completing the tests on a specific transponder, make sure to restore the
original connections.
8-32
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Maintenance Manual
Commissioning Tests
Measuring Optical Power

Perform the following checks for each optical card or module of each NE
installed on the site.
No.
Test procedure
Expected results
1.
Using an OPM, measure the input and

output optical levels of each optical
component (card, module, and so on).
Record the results of all the
measurements; these results provide the
information needed to evaluate the
optical budget of the network.
The measurement results are

within the range of minimum and
maximum levels specified for
each type of optical component
(see XDM System Specification).
2.
Using an optical spectrum analyzer,

measure the following parameters for
each link:
Spectrum of the composite line
signal
Power per channel
OSNR (Optical Signal to Noise
Ratio)
Gain tilt
For this purpose, measure the optical
signals at the input and output of each
active and passive optical component
(optical booster, preamplifier, OADM,
Mux, DeMux, supervisory channel
interfaces, and so on).
The measured levels are within

the range expected in accordance
with the planned optical network
power budget.
417006-2304-0H3-B02
8-33
Commissioning Tests

Maintenance Manual
Equipment Power-on Test

The purpose of this test is to verify that the XDM platforms continue operating
smoothly without operator intervention after power failure.
No.
Test procedure
1.
Select one of the optical

transmission paths in the
network.
2.
Connect the test equipment at the

input of a transponder, and
connect an optical loopback to
the corresponding transponder at
the remote location.
3.
Check for correct optical levels,

and make sure the test equipment
does not detect errors.
4.
Turn off the DC power of one of

the NEs along the path, and wait
at least seven minutes.
5.
Turn the DC power on again,

wait for the completion of the
initial software downloading
(may take up to about 20
minutes), and then repeat the
checks.
Expected results
The test equipment must indicate

alarms while the DC power is off.
The management station reports an
NE Disconnected alarm, and then
displays the NE icon in gray
(signifying no management
communication).
After the NE is powered up and completes

downloading, it is reconnected to the
management station. The test equipment
and the management station should detect
no alarm.
LOS Detection Test

The purpose of this test is to verify that the XDM platforms recognize alarms
and send alarm notifications to the management system for viewing.
8-34
No.
Test procedure
Expected results
1.
Disconnect the optical fiber from An SPI-LOS alarm appears for each
the receive input (Rx line) of
optical card, together with other alarms
each optical card.
caused by the disconnection.
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Maintenance Manual
Commissioning Tests
Input Sensitivity Test

The purpose of this test is to verify that the input sensitivity of the XDM
optical cards is according to their technical specifications (see XDM System
Specification for reference).
No.
Test procedure
1.
Select one of the optical

transmission paths in the
network.
2.

input of a transponder, and
connect an optical loopback to
the corresponding transponder at
the remote location.
3.
Insert a variable optical

attenuator in series with one of
the fibers of the selected path.
4.
Set the optical attenuation to

0 dB.
5.
Slowly increase the attenuation

until the test equipment displays
a burst of errors.
6.
Connect an OPM to the first Rx

port after the variable optical
attenuator and measure the total
power.
417006-2304-0H3-B02
Expected results
The measured optical power is the input

sensitivity of the card. Check that the
results equal those defined in the XDM
System Specification document.
8-35
Commissioning Tests

Maintenance Manual
Path Protection Test

The purpose of this test is to verify that the protected traffic in the XDM
network is properly handled when a failure occurs.
8-36
No.
Test procedure
1.
Select one of the protected

optical transmission paths in the
network.
2.

input of a transponder serving the
selected path, and connect an
optical loopback to the
corresponding transponder at the
remote location.
3.

optical channel.
4.
Check that the optical channel

carries traffic properly on the
protection path.
5.

Expected results

msec) are reported by the test equipment
and the management station.

alarm.
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Maintenance Manual
Commissioning Tests
Maintenance Test
The purpose of this test is to verify that maintenance actions can be performed
on XDM platforms using the management system.
This procedure tests the following functions:
Manual switch
Forced switch
Switch lockout
No.
Test procedure
1.

network.
2.

remote location.
3.
On the management station, send Switching to the protection path occurs,

a manual switch command.
msec) are reported by the test equipment
and the management station.
4.

protection path.
5.
Disconnect the line input of the

nonactive transponder from its
Mux.
6.
On the management station, send Switching to the main (protected) path

occurs, and short bursts of errors (less
than 50 msec) are reported by the test
equipment and the management station.
7.

main (protected) path.
8.

inactive transponder from its
DeMux.
417006-2304-0H3-B02
Expected results
8-37
Commissioning Tests

Maintenance Manual
No.
Test procedure
Expected results
9.
On the management station, send Switching to the main (protected) path

occurs, and the test equipment reports a
LOS alarm.
10.
On the management station, send

a switch lockout command.
11.

active transponder from its
DeMux.
Check that the active path has not

changed.
The active path changes only when
the other path is not operating
properly.
No switching to the main (protected)

path; a LOS alarm is reported by the test
equipment.
BER and Stability Test

The purpose of this test is to verify that the optical channels in the XDM
optical network operate properly without errors (according to the ITU-T
performance standards).
8-38
No.
Test procedure
Expected results
1.

network.
2.

remote location.
3.
Check for alarms on the test

equipment.
The test equipment reports no alarms.
4.
Run this test for the time

specified below:
STM-1: 120 minutes
STM-4: 30 minutes
STM-16: 8 minutes
STM-64: 2 minutes
These intervals check for error
rate lower than 1x10-12.
Neither the test equipment nor the

management station report any alarms
throughout the test interval.
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Maintenance Manual
Commissioning Tests
Management Commissioning Tests

The purpose of these tests is to verify that all management stations and the
applications installed on them, LightSoft, and EMS in the customer XDM
network, work properly, and all features operate as required.
Management to NEs Communication Test

The purpose of this test is to verify communication between the management
station and the XDM NEs.
No.
Test procedure
Expected results
1.
Select three XDM NEs from the

network.
2.
Activate the PING feature for the Make sure packet loss for all three XDM
three NEs simultaneously.
NEs is less than 1%.
Security Test
The purpose of this test is to verify that the user can define a user with different
capabilities.
No.
Test procedure
1.
Create a new user with limited

resources and capabilities.
2.
Log out from the management.
3.
Log in using the new user.
Expected results
Make sure the resources and capabilities

are defined for this user only.
Alarm Log Test

The purpose of this test is to verify that the user can define any filter in the
alarm log.
No.
Test procedure
Expected results
1.
Open the Alarm Log window.
All alarms are shown according to the

default filter.
2.
Set the filter to events only.
Only events are shown.
417006-2304-0H3-B02
8-39
Commissioning Tests

Maintenance Manual
Management Power-off and Recovery Test

The purpose of this test is to verify that all the management stations can start
properly after power-off (same database).
No.
Test procedure
1.
Shut down all management stations

- NMS server, client, and EMSs.
2.
Start the management stations.
Expected results
Verify that all the management stations

start from the last database.
Trail Creation Test

The purpose of this test is to verify that any trail can be created using the
management station.
No.
Test procedure
1.
Create one trail of any rate between

two NEs.
2.
Connect test equipment to one NE

and perform loopback at the other
NE (in the relevant endpoint ports).
Expected results
Verify that there are no alarms in the test

equipment and at the management station
related to the relevant trail.
Trail Consistency Indication (TCI) Test

The purpose of this test is to verify that every cross connect created at the EMS
level is automatically reflected in the NMS and can be imported into the NMS
database.
8-40
No.
Test procedure
Expected results
1.
Create one trail of any rate between

two NEs.
2.
Connect test equipment to one NE

and perform loopback at the other
NE (in the relevant endpoint ports).
Confirm there are no alarms in the test

equipment and at the management station
related to the relevant trail.
3.
Operate the TCI feature.
Make sure no inconsistency is found in

the network.
4.
Create any kind of cross connect

from the EMS-XDM.
5.
Open the TCI window.
Verify inconsistency is found in the

network.
6.
Operate the TCI feature.
Make sure that the cross connect created

from the EMS-XDM appears in the trail
list after completion of the TCI test.
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Maintenance Manual
Commissioning Tests
Optical Parameters Test

The purpose of this test is to verify that the user can view the optical parameter
levels (applicable only for cards that support this feature).
No.
Test procedure
1.
Select an optic card.
2.
Open the optical parameters of

this card from the management
station.
Expected results
Verify that the optical parameters

obtained from the management are the
same as those measured in the field
(deviation of up to 2 dB permissible).
RDR Test
The purpose of this test is to verify that the RDR station replicates the NMS
database and works properly.
No.
Test procedure
1.
Configure the RDR application.
2.
Shut down the primary

management station.
3.
Start the mirror management

station.
Expected results
Verify the mirror management station

starts from the last database.
Modem Connection Test

The purpose of this test is to verify that the modem operates properly.
No.
Test procedure
1.
Connect the modem to serial port

B of the Sun station.
2.
Connect the modem to the phone

line.
3.
Make sure the PPP is configured

and running.
4.
Perform the connection test with

ECI Customer Support.
417006-2304-0H3-B02
Expected results
ECI Customer Support logs in properly

to the Sun station.
8-41
Commissioning Tests

Maintenance Manual
Go-Global Test
The purpose of this test is to verify that the Go-Global software operates
properly.
No.
Test procedure
1.
Make sure the modem is working

properly.
2.
Configure the Go-Global package.
3.
Ask ECI Customer Support to log

in to the Sun station using the
Go-Global application.
Expected results
Customer Support logs in properly to

the Sun station and sees management
topology as per the Go-Global
application.
Orderwire Test
The purpose of this test is to verify that the orderwire network operates
properly.
No.
Test procedure
Expected results
1.
Create an OW connection between

two XDM NEs A and B.
2.
Use management to configure the

OW.
3.
Dial from site A to site B.
Make sure a ring sound is heard in site

B. The ring generates at the xECB or
Cisco ATA 186.
4.
Pick up the handset in site B.
Ring in site B stops.
5.
Check audio communication

between the two sites.
Make sure both engineers at site A and

B can converse freely via the OW
network without any noise.
External Alarm Test

The purpose of this test is to verify that the external alarm works properly.
8-42
No.
Test procedure
1.
Connect an external alarm relay

box to an XDM NE.
2.
Define the external alarm from the

XDM platform view in the EMS.
3.
Close the relay.
Expected results
A corresponding alarm is reported in the

management.
417006-2304-0H3-B02
9
Maintenance
In this chapter:
Overview ......................................................................................................... 9-1
Required Test Equipment, Tools, and Materials ............................................. 9-2
Preventive Maintenance .................................................................................. 9-2
Troubleshooting ............................................................................................. 9-11
Replacing a Network Element ....................................................................... 9-40
Replacing Cards, Modules, Fans, and Other Components ............................ 9-43
Overview
This chapter describes the maintenance procedures for XDM equipment.
Personnel involved in maintenance must be thoroughly familiar with the safety
issues (see "Installing XDM-500: Before You Start Safety Guidelines" page
1-1).
NOTE: Unless otherwise indicated, the procedures described
in these sections apply to all XDM platforms and to both
SDH and SONET.
CAUTION: XDM equipment has two power sources.

Disconnect both power sources before servicing.
417006-2304-0H3-B02
9-1
Maintenance

Maintenance Manual
Required Test Equipment, Tools,

and Materials
For most maintenance activities described in this chapter, only an LCT-XDM
terminal and a multimeter are required. If you need to make measurements, it is
recommended to use equipment of the same type and models used for
commissioning and acceptance (see "Tools and Test Equipment" page 4-8).
The tools and materials necessary for equipment installation must also be
available during maintenance.
Preventive Maintenance
This section describes the XDM preventive maintenance procedures to be
performed periodically by network administrators. The purpose of these
procedures is to ensure optimal and uninterrupted operation of your network.
The information presented in this section includes:
Preventive Maintenance Procedures via EMS-XDM (page 9-4)
Hardware Preventive Maintenance (page 9-5)
Air Filter Preventive Maintenance (page 9-7)
Preventive Maintenance Checklists (page 9-9)
The procedures are software oriented and performed by the network

administration staff.
NOTES:
Many of the preventive procedures may affect traffic.

On-screen warnings alert you when necessary.
The information presented is based on EMS-XDM and
end management stations. Refer to the corresponding user
manuals for detailed explanations.
The purpose of the preventive maintenance activities is to keep the XDM

hardware in good condition, and as soon as possible to detect and correct any
condition that may lead to deterioration and equipment malfunction. Record the
execution of the various activities and their results according to the procedures
used in your organization.
The following table lists the preventive maintenance inspection and checks,
and specifies recommended intervals for execution. The frequency of checks
for equipment installed in unprotected environments should be increased as
required.
9-2
417006-2304-0H3-B02

Maintenance Manual
Legend:
Table 9-1:
Item
Maintenance
W weekly
M monthly
Q quarterly
Preventive maintenance inspection and checks
Inspection/Check
Intervals
W
1.
Visually inspect the condition of cables and fibers. Check

for correct routing (no sharp bends) and proper support to
avoid stress. Avoid touching fibers during the inspection,
except as required to correct problems.
2.
Check condition of rack front doors and RFI fingers. Clean

as necessary with approved cleaning agents.
3.
Check that all unused optical connectors are covered by

protective covers. Add covers as necessary.
4.
Check that cards and modules are securely attached: all

extractor handles must be in the storage position (parallel to
the card edge), and all module fastening screws appear tight
(tighten only manually).
5.
Check for proper operation of the xFCU unit (no abnormal

noise and vibrations).
6.
Check that the xFCU unit is fully inserted in their chassis

positions and that the screws are tight.
7.
Clean the xFCU unit and inspect the air filter.

CAUTION: To avoid overheating of the XDM-400
platform, do not remove its xFCU4 unit for more than 2-3
minutes.
While cleaning, check increase in speed of remaining xFCU
units when one xFCU is removed (not applicable to
xFCU4).
If necessary, clean or replace the air filters.
8.
Check proper attachment of xINF units to the platform.
9.
Check the DC supply voltage.
10.
Check DC power sources (main and backup), and make

sure that all the circuit breakers serving active equipment
units (located on the xRAP-D, xRAP-B, xRAP-HP,
xRAP-100, or user-provided power distribution panels) are
in the ON position.
11.
Check that there are no alarm indications on the cards and

modules.
417006-2304-0H3-B02
X
X
X
9-3
Maintenance
Item

Maintenance Manual
Inspection/Check
Intervals
W
12.
Check that all xRAP-D, xRAP-B, xRAP-HP, or xRAP-100 X

LEDs turn on and the buzzer sounds while the POWER ON
pushbutton on the xRAP-D, xRAP-B, xRAP-HP or
xRAP-100 panel is pressed.
Note: The buzzer will not sound if ACO (alarm cut-off) is
active.
13.
Check that all card and module LEDs turn on when the
LED TEST pushbutton on the MECP panel is pressed.
14.
Perform a visual check of LED indications according to

Chapter 5.
15.
Inspect equipment racks and cases, connection terminals,

grounding, and so on, and pay special attention to any signs
of corrosion.
16.
Whenever applicable, inspect ancillary equipment (air

conditioners, lighting, distribution panels, and so on) and
their power sources.
Preventive Maintenance Procedures via

EMS-XDM
The following table outlines the preventive maintenance procedures performed
via the EMS-XDM.
Table 9-2:
Preventive maintenance procedures via EMS-XDM
Procedure
Should be performed
Save the NE database

configuration to hard
disk.
Once a week, or following

major changes in network
topology
Check version
correspondence.
Once a week, or whenever

major changes are made to the
system configuration
Delete old system files.

topology
Check performance.
Once a week or according to

working procedures
Check EMS-XDM to NE Once a week or according to

communication.
working procedures
9-4
Comments
Only in networks that

have a DCN (Data
Communication Network)
between the EMS-XDM
and the NEs
417006-2304-0H3-B02

Maintenance Manual
Maintenance
Procedure
Should be performed
Save the EMS-XDM

configuration to hard
disk.

topology
Check switching to
protection.
Once a quarter, according to

the network administrator's
instructions
Comments
Traffic-affecting
Export cross-connections Once per month or according

data to XML files.
to the working procedures
Check optical parameters. Once per month or according
Export topology data to
an XML file.
Once per month or according

Export card inventory

data to an XML file.
Once per month or according

Hardware Preventive Maintenance

The scope of the preventive maintenance activities is to keep the XDM
hardware in good condition, and as quickly as possible to detect and correct
any condition that may lead to deterioration and equipment malfunction.
Record the execution of the various activities and their results in accordance
with the organizational procedures.
The following table lists preventive maintenance inspections and checks and
specifies recommended intervals. The frequency of checks for equipment
installed in unprotected environments should be increased as required.
Table 9-3:
Item
Preventive maintenance inspection and checks
Inspection/Check
Intervals
W
1.
Visually inspect the condition of cables and fibers.

Check for correct routing (no sharp bends) and proper
support to avoid stress.
Avoid touching fibers during the inspection, except as
required to correct problems.
2.
Check condition of rack front doors and RFI fingers.

Clean as necessary with approved agents.
3.
Check that all unused optical connectors are covered by

protective covers. Add covers as necessary.
4.
Check that cards and modules are securely attached: all

extractor handles must be in the storage position (parallel
to the card edge), and all module fastening screws must
be tight (tighten only by hand).
417006-2304-0H3-B02
X
X
X
9-5
Maintenance
Item

Maintenance Manual
Inspection/Check
Intervals
W
9-6
5.
Check for proper operation of the xFCU unit, without

abnormal noise and vibrations.
6.
Check that the xFCU unit is fully inserted in its chassis

position and the screws are tight.
7.
Clean the xFCU unit and inspect the air filter.

CAUTION: To avoid overheating of the XDM-400
platform, do not remove its xFCU4 unit for more than
2-3 minutes.
When cleaning, check increase in speed of remaining
xFCU units when one xFCU is removed (not applicable
to xFCU4).
Clean or replace the air filters if necessary.
8.
Check proper attachment of xINF, xINF-H, and xINF40

units to the platform.
9.
Check the DC supply voltage.
10.
Check DC power sources (main and backup) and make

X
sure that all the circuit breakers serving active equipment
units (located on the xRAP-D, xRAP-B, xRAP-HP or
xRAP-100 or on user-provided power distribution
panels) are in the ON position.
11.
Check that there are no alarm indications on the cards

and modules.
12
Check that all xRAP LEDs turn on and the buzzer

sounds while the POWER ON pushbutton on the xRAP
panel is pressed.
13.
Check that all card and module LEDs turn on when the
LED TEST pushbutton on the MECP panel is pressed.
14.
Perform a visual check of LED indications (see

"Commissioning Tests" page 8-1).
417006-2304-0H3-B02

Maintenance Manual
Maintenance
Air Filter Preventive Maintenance

Air particles trapped by the air filter increase the resistance to airflow, and can
eventually decrease the airflow below the minimum required for proper cooling
of internal components. The resulting increase in the internal temperature of the
equipment reduces the equipment reliability and performance. Therefore,
whenever an air filter is installed, it must periodically be cleaned or replaced
with a clean filter.
It is accepted throughout the electronics equipment industry to recommend
cleaning or replacing air filters approximately every 90 days. However, the
cleaning intervals depend on the specific environmental conditions. In dusty
environments more frequent cleaning is required. Note that foam filters, which
are the type used in XDM platforms, efficiently trap particles without showing
face loading of contaminants, and therefore visual inspection cannot be used to
determine cleaning intervals.
CAUTION: Filter cleaning intervals must strictly be
observed, as clogging by trapped particles can severely impair

equipment reliability and performance.
Recommended Cleaning Methods

Use the following methods (listed in order of ascending efficiency) to clean air
filters:
1. Vacuum clean: A few passes of a vacuum cleaner remove accumulated
dust and dirt in seconds. Point the air nozzle in the direction of operating
airflow (vacuum from intake side toward exhaust side).
2. Blow with compressed air: Point a compressed air nozzle in the opposite
direction of the operating airflow (blow from the exhaust side toward the
intake side).
NOTE: Oily residues and moisture reduce cleaning efficiency
of the above methods; in such cases, clean the filter using
method No. 4, or replace the filter.
3. Cold water rinse: Under normal service conditions, the foam media used
in the filters require no oily adhesives. Therefore, collected dust and dirt
can be washed away using a standard hose nozzle with plain water. Stand
the filter until completely dry and free of moisture, and return to service.
4. Immersion in warm soapy water: Where stubborn airborne dirt is present,
the filter may be dipped in a solution of warm water and mild detergent.
Then simply rinse in clear water, stand until completely dry and free of
moisture, and return to service.
The recommended method is No. 4, as it ensures thorough cleaning of all types
of contaminants under any reasonable service conditions.
417006-2304-0H3-B02
9-7
Maintenance

Maintenance Manual
Cleaning Procedure
For the procedure steps, refer to the following figure.
NOTE: The air filter can be removed and reinstalled while
the XDM platform operates, without opening its front door.

However, for clarity, the figure below shows the platform
without its front door.
Figure 9-1: Removing the filter for cleaning/replacement
To clean the air filter:

1. Release the two captive screws fastening the filter front panel, and remove
the panel. Keep the panel in a safe place until it can be reinstalled.
2. Pull the filter out.
3. Inspect the filter for damage. If any damage is evident (such as holes or
torn material), replace the filter with a new one.
4. Clean the filter using the method selected by your organization.
5. Identify the filter's air intake side, indicated by two coding tabs.
CAUTION: Replace the filter only with a filter of the original
type. Failure to do so can impair equipment reliability and
performance.
6. Insert the clean filter in the holding frame and reinstall the front panel.
9-8
417006-2304-0H3-B02

Maintenance Manual
Maintenance
Preventive Maintenance Checklists

This section provides preventive maintenance checklists for the EMS-XDM,
LightSoft, and the hardware.
EMS-XDM Checklists
Weekly checklist
Procedure
Date
Result
Date
Result
Date
Result
Save NE database configuration to hard disk.

Check version correspondence.
Delete old system files.
Check performance.
Check EMS-XDM to NE communications.
Save EMS-XDM configuration to hard disk.
Monthly checklist
Procedure
Export cross-connection data to XML files.

Check optical parameters.
Export topology data to an XML file.
Export card inventory data to an XML file.
Quarterly checklist
Procedure
Check switch to protection.
417006-2304-0H3-B02
9-9
Maintenance

Maintenance Manual
LightSoft Checklists
Weekly checklist
Procedure
Date
Result
Save LightSoft database.

Check NE status.
Synchronize LightSoft database with EMS
database.
Check LightSoft's hard drive capacity.
Quarterly checklist
Procedure
Date
Result
Perform batch trail operations.
Hardware Checklists
Weekly checklist
Procedure
Date
Result
Check that all unused optical connectors are

covered.
Check for proper operation of xFCU.
Check DC supply voltage.
Check DC power sources and xRAPs.
Check for alarms indications on cards and
modules.
Check the operation of xRAP alarm indications
and buzzer.
Check activation of LEDs on all cards and
modules.
Perform visual check of LED indications on
cards and modules.
Monthly checklist
Procedure
Date
Result
Inspect condition of rack front doors and RFI

fingers.
9-10
417006-2304-0H3-B02

Maintenance Manual
Maintenance
Quarterly checklist
Procedure
Date
Result
Visually inspect condition of cables and fibers.

Check cards and modules attachment.
Check xFCU attachment.
Clean xFCU.
Check xINF attachment.
Troubleshooting
The purpose of onsite troubleshooting is to identify the hardware causing the
malfunction and return the equipment to normal operation as soon as possible.
Troubleshooting is usually initiated in response to one of the following
conditions:
Alarm or performance degradation reported by the management station.
Alarm or malfunction detected on site by maintenance personnel, either as

a result of a troubleshooting activity initiated by the management center
personnel or as a result of a periodical inspection or preventive
maintenance action. Many problems can be detected via the various
indicators available on the XDM system components.
This chapter assumes familiarity with the XDM and with SDH and DWDM
equipment, and with the LightSoft and EMS-XDM management stations. Refer
to the respective user manuals for details on the various capabilities of the
management stations, and for instructions on performing the desired activities.
The following sections provide procedures for performing onsite
troubleshooting for various trouble categories as well as for specific
subsystems, such as OADMs and Mux/DeMux subsystems. For each category,
you will find a troubleshooting table that provides the instructions for
identifying the problem.
417006-2304-0H3-B02
9-11
Maintenance

Maintenance Manual
To use the troubleshooting table:

1. Identify the closest description of the trouble symptoms under Trouble
Symptoms.
2. Perform the required corrective actions listed under Corrective Actions in
the table in the order in which they appear until the problem is corrected.
The following index will help you find the troubleshooting information covered
in this chapter.
9-12
General troubleshooting procedures for cards and modules (page 9-13)
General troubleshooting procedures for optical transceiver plug-ins (page

9-15)
Troubleshooting procedures for electrical interface modules (page 9-16)
Troubleshooting procedure for optical OADM and Mux/DeMux (page

9-17)
Troubleshooting procedures for EIS cards (page 9-19)
Troubleshooting procedures for DIO cards (page 9-20)
Troubleshooting procedures for DIOB cards (page 9-22)
Troubleshooting procedures for MCS5/MCS10 cards (page 9-23)
Troubleshooting procedures for ROADM cards (page 9-25)
Troubleshooting procedures for Aurora-G cards (page 9-26)
Troubleshooting procedures for ATS cards (page 9-33)
Troubleshooting transmission and traffic alarms (page 9-34)
Troubleshooting power problems (page 9-35)
Troubleshooting the timing subsystem (page 9-38)
Troubleshooting management communication (page 9-39)
417006-2304-0H3-B02

Maintenance Manual
Maintenance
Troubleshooting Using Component

Indicators
The management station will usually provide onsite personnel with a list of
suspected components.
Start troubleshooting a suspected component by checking its indicators. These
indicators, located on the various cards and modules, can help you to rapidly
and efficiently identify a malfunctioning component in accordance with the
procedures outlined in General troubleshooting procedures for cards and
modules (page 9-13) and General troubleshooting procedures for optical
transceiver plug-ins (page 9-15).
NOTE: The indicator functions and normal indicator states
are described in the XDM-1000 Product Line Reference

Manual.
CAUTION: All corrective actions listed below affect traffic.
General Troubleshooting Procedures for

Cards and Modules
The following table describes the general troubleshooting procedure for cards
and modules.
Table 9-4:
General troubleshooting procedures for cards/modules
No.
Symptoms
Probable cause
1.
Green ACTIVE
indicator off.
Defective
card/module
1. Pull the component out and

wait a minute before
reinserting. Make sure that
you fully insert the card or
module in its slot.
2. If the ACTIVE indicator
does not turn on after
reinsertion, replace the
component.
2.
Red FAIL indicator Defective

not turning off after card/module
software download
(following power-on
and resetting).
1. Check the card assignment.

2. Reset the component by
removing and then
reinserting it after a few
minutes. Make sure the
ACTIVE indicator turns on
after the component is
reinserted.
417006-2304-0H3-B02
Corrective measures
9-13
Maintenance
No.

Maintenance Manual
Symptoms
Probable cause
Corrective measures
3. The FAIL indicator flashes

while software is
downloaded to the
component. Wait until the
software download is
complete and check that the
FAIL indicator turns off.
4. If the FAIL indicator turns
on again, replace the
component.
3.
Orange (traffic
carrying) indicator
off (when indicator
supported).
Card not configured

to carry traffic
1. Check with the management

station operator whether the
card has already been
configured and provisioned;
if not, ignore the state of the
orange indicator.
CAUTION: Before checking fiber break problems using an
OTDR (Optical Time-Domain Reflectometer), it is the user's

responsibility to disconnect the receiver port. Failure to do so
may damage the receiver irreparably.
9-14
417006-2304-0H3-B02

Maintenance Manual
Maintenance

Optical Transceiver Plug-ins
The following table describes the procedures for troubleshooting optical
transceiver plug-ins.

Table 9-5:
General troubleshooting procedures for optical transceiver plug-ins
No.
Symptoms
Probable cause
1.
Green transceiver
state indicator off.
Corresponding
optical transmitter
may have been
turned off by the
ALS function (see
note below).
1. When available, press the

laser-on pushbutton of the
card to activate the
corresponding laser.
2. If the problem still persists,
the laser automatically turns
off again after a few
seconds. Check that all the
fibers are properly connected
to the corresponding optical
transceiver.
3. Replace the transceiver if the
problem is not corrected
after the transceiver is
reinserted.
2.
Transceiver state
indicator lights in
red.
Test equipment
connected to the
monitoring connector
of the corresponding
plug-in.
1. For plug-in transceivers with

monitoring connector; the
test equipment is connected
to the monitoring connector.
This indication is provided
for identification purposes,
and does not necessarily
indicate a malfunction.
Defective
transceiver.
1. Remove the transceiver and

then reinsert it in position,
paying attention to fully
engage its connector to the
mating card connector.
2. Check the correction of the
transceiver assignment.
3. Replace the transceiver if the
problem persists.
417006-2304-0H3-B02
Corrective measures
9-15
Maintenance

Maintenance Manual
NOTE: An optical port with ALS capability turns off its
transmitter when the corresponding receive signal is lost.

Turning the transmitter off may cause a chain reaction that
turns the optical signals off in a whole section of the network
and generates a large number of alarms.
As a result, it may be difficult to identify the real cause of the
problem. Use the management station log records to identify
the port.
Troubleshooting Procedures for Electrical

Interface Modules
The following table describes the procedure for troubleshooting electrical
interface modules.
Table 9-6:
9-16
Troubleshooting procedures for electrical interface modules
No.
Symptoms
Probable cause
Corrective measures
1.
Green ACTIVE
indicator off.
Defective
card/module
1. Check the card assignment.

2. Pull the module out and wait a
minute before reinserting it.
Make sure that you fully insert
the module in its slot.
3. If the ACTIVE indicator does
not turn on after reinsertion,
replace the module.
2.
Red FAIL
Defective
indicator not
card/module
turning off after
software download
(following
power-on and
resetting).
1. Reset the module by removing

and then reinserting it after a
few minutes. Make sure the
after the module is reinserted.
2. The FAIL indicator must flash
while software is downloaded
to the module. Wait until the
software download ends and
check that the FAIL indicator
turns off.
3. If the FAIL indicator turns on
again, replace the module.
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Maintenance Manual
Maintenance
No.
Symptoms
Probable cause
3.
Orange PROT
indicator lights.
Problem on protected
card/module
Corrective measures
1. Check for proper connection

of cables to the module front
panel connectors and to
remote distribution frame.
Whenever possible, disconnect
and then reconnect each cable
to verify positive contact.
2. Use test equipment to check
the signals at the monitoring
points of the I/O card
connected to this interface
module.
3. Check the cable wiring.
Replace cables if in doubt.
4. Identify the I/O card
connected to this interface
module and check its proper
operation. Replace the card or
the interface module as
necessary.
Troubleshooting Procedure for Optical

OADM and Mux/DeMux
The following table describes the procedures for troubleshooting optical
OADM and Mux/DeMux.

Table 9-7:
Troubleshooting procedure for optical OADM and Mux/DeMux
No.
Symptoms
Probable cause
1.
Green ACTIVE
indicator off.
Defective
card/module
417006-2304-0H3-B02
Corrective measures
1. Pull the component out, and

reinserting it. Make sure that
you fully insert the card or
module in its slot.
not turn on after reinserting,
replace the component.
9-17
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9-18

Maintenance Manual
No.
Symptoms
Probable cause
Corrective measures
2.
Red FAIL
Defective
indicator not
card/module
turning off after
software download
(following
power-on and
resetting).
1. Reset the component by

removing and then reinserting
it after a few minutes. Make
sure the ACTIVE indicator
turns on after the component is
reinserted.
to the component. Wait until
the software download ends
and check that the FAIL
indicator turns off.
again, replace the component.
3.
ERROR indicator
lights.
Loss of input signal
1. Check for proper connection

of all the fibers connected to
it. In particular, make sure that
the color of the optical
transceiver providing the input
signal matches the
corresponding input channel.
Incorrect channel
1. For dual-channel transceivers

and tunable transponders, you
must also check the optical
channel configured via the
management station.
Defective
card/module
1. If the problem persists, replace

the card.
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Maintenance
Troubleshooting Procedures for EIS Cards

The following table describes the troubleshooting procedures for EIS cards.
Table 9-8:
Troubleshooting procedures for EIS cards
No.
Symptoms
Probable cause
1.
Green ACTIVE
indicator on base
card off.
Defective card

you fully insert the card in its
slot.
2.
Red FAIL
Defective card
indicator on base
card not turning off
after software
downloading
(following
power-on and
resetting).
1. Reset the card by removing

reinserted.
to the card. Wait until the
software download is
completed and check that the
FAIL indicator turns off.
again, replace the card.
3.
Orange TRAFFIC
CARRYING
indicator on base
card off.
Card not configured

to carry traffic

configured and provisioned; if
not, ignore the state of the
orange indicator.
4.
Green LINK
STATE indicator
of an Ethernet
optical port or
ME_8/ME_14
electrical port off.
Problem related to
port
1. Check port configuration.

2. Check connections to LAN.
3. Make sure at least one LAN
station is active.
4. Replace the ME_8/ME_14.
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Corrective measures
9-19
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Maintenance Manual
No.
Symptoms
Probable cause
LINK STATE
indicator of an
ME_8/ME_14
10/100BaseT
Ethernet port off.
Problem related to
port
Orange
Problem related to
ACTIVITY
port
indicator of an
Ethernet port lights
steadily.
Corrective measures

station is active.
4. Replace the ME_8/ME_14.
2. Check that the indicator color
corresponds to the required
data rate:
--Yellow for 10 Mbps
--Green for 100 Mbps
--Blue for 1000 Mbps
Troubleshooting Procedures for DIO Cards

The following table describes the procedures for troubleshooting the DIO
cards.
Table 9-9:
9-20
Troubleshooting procedures for DIO cards
No.
Symptoms
Probable cause
Corrective measures
1.
Green ACTIVE
indicator on base
card off.
Defective card
1. Pull the component out and wait

a minute before reinserting it.
Make sure you fully insert the
card in its slot.
2.
Red FAIL
indicator on base
card not turning
off after software
downloading
(following
power-on and
resetting).
Defective card
1. Reset the card by removing and

then reinserting it after a few
minutes. Make sure the ACTIVE
indicator turns on after the
component is reinserted.
while software is downloaded to
the card. Wait until the software
download ends and check that
the FAIL indicator turns off.
3. If FAIL indicator turns on again,
replace the card.
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Maintenance Manual
Maintenance
No.
Symptoms
Probable cause
3.
Orange (traffic
carrying)
indicator on base
card off.
Card not
configured to carry
traffic

station operator whether the card
has already been configured and
provisioned; if not, ignore the
state of the orange indicator.
4.
Red FAIL
indicator of
plug-in module
lights.
Defective plug-in
module
1. Remove the plug-in module and

reinsert it after about one
minute.
2. If the red FAIL indicator lights
again, replace the plug-in
module.
5.
Status indicator of Loss of optical

GbE port lights
input signal
steadily in red.
1. This may be caused by a

problem at the remote peer GbE
port (for example, it may have
been turned off), or by a fault in
the interconnecting fiber. Check
state of GbE port link indicator
(Step 7 below) to collect
additional information on cause
of problem.
6.
Status indicator of Transmit problem

GbE port lights
steadily in red.
1. Remove the plug-in module and

reinsert it after about one
minute.
2. If the status indicator lights in
red again, replace the plug-in
module.
7.
Link indicator of
GbE port off.
1. Check for following sequence of

indications after power-on or
reset, or after reconnecting the
fiber to the port:
2. The indicator starts flashing in
red to indicate execution of the
autonegotiation process. After a
short time, the indicator must
turn green; this can happen only
when the port status indicator is
also green.
3. Continued red flashing means
that the autonegotiation process
failed. One of the reasons could
be incompatible configuration of
the remote peer port.
4. Steady red flashing means that
the peer port does not support
flow control. This does not
enable normal operation. Check
and reconfigure the peer port.
417006-2304-0H3-B02
Link is down
Corrective measures
9-21
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Maintenance Manual
Troubleshooting Procedures for DIOB Cards

The following table describes the troubleshooting procedures for DIOB cards.
Table 9-10: Troubleshooting procedures for DIOB cards
9-22
No.
Symptoms
Probable cause
Corrective measures
1.
Green ACTIVE
indicator on base
card off.
Defective card

reinserting it. Make sure you
fully insert the card in its slot.
2.
Red FAIL
indicator on base
card not turning
off after software
downloading
(following
power-on and
resetting).
Defective card

reinserted.
turns off.
3. If FAIL indicator turns on
3.
Orange (traffic
carrying)
indicator on base
card off.
Card not configured

to carry traffic

configured and provisioned; if
not, ignore the state of the
orange indicator.
4.
Orange, Green, or Problem related to

Blue (link state)
port
indicator of an
Ethernet optical
port or ME16
electrical port is
off.

data rate:
--Orange for 10 Mbps
station is active.
5. Replace the ME16.
5.
Orange (activity)
indicator of an
Ethernet port
lights steadily.
Problem related to
port
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Maintenance Manual
Maintenance
NOTE: The DIOB includes a reset control with a rotable
wing locking the card extractor handle. The card will not
operate if the reset control is not closed. If the card is not
working, be sure to verify that the reset control is closed
properly. After inserting the card and securing it in its slot
with the extractor handle, turn the reset control
counter-clockwise to enable the card to start operating.
Troubleshooting Procedures for

MCS5/MCS10 Cards
The following table describes the troubleshooting procedures for
MCS5/MCS10 cards.
Table 9-11: Troubleshooting procedures for MCS5/MCS10 cards
No.
Symptoms
Probable cause
1.
Green ACTIVE
indicator on base
card off.
Defective card

reinserting it. Make sure you
fully insert the card in its slot.
2.
Red FAIL
Defective card
indicator on base
after software
downloading
(following
power-on and
resetting).

reinserted.
turns off.
3. If FAIL indicator turns on
3.
Orange (traffic
carrying) indicator
on base card off.
Check with the management

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Card not configured

to carry traffic
Corrective measures
9-23
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Maintenance Manual
No.
Symptoms
Probable cause
4.
Orange, Green, or
Blue (link state)
indicator of an
Ethernet optical
port or ME16
electrical port is
off.
Problem related to
specific port
5.
Orange (activity)
Problem related to
indicator of an
port
Ethernet port lights
steadily.
Corrective measures

data rate:
--Orange for 10 Mbps
station is active.
5. Replace the ME16.
Check port configuration.
NOTE: The MCS5/MCS10 includes a reset control with a
rotable wing locking the card extractor handle. The card will
not operate if the reset control is not closed. If the card is not
working, be sure to verify that the reset control is closed
properly. After inserting the card and securing it in its slot
with the extractor handle, turn the reset control
counter-clockwise to enable the card to start operating.
9-24
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Maintenance
Troubleshooting Procedures for ROADM

Cards
The following table describes the troubleshooting procedures for ROADM
cards.
Table 9-12: Troubleshooting procedures for ROADM cards
No.
Symptoms
Probable cause
1.
Green ACTIVE
indicator on base
card off.
Defective card
1. Pull the component out and wait

a minute before reinserting it.
Make sure you fully insert the
card in its slot.
2.
Red FAIL
Defective card
indicator on base
after software
downloading
(following
power-on and
resetting).
1. Reset the card by removing and

then reinserting it after a few
minutes. Make sure the ACTIVE
indicator turns on after the
component is reinserted.
while software is downloaded to
the card. Wait until the software
download ends and check that
the FAIL indicator turns off.
3. If FAIL indicator turns on again,
replace the card.
3.
Orange (traffic
carrying) indicator
on base card off.
Card not
configured to carry
traffic

4.
Red LOS ADD

lights.
Loss of input
signal for ADD
unit
1. Check for proper connection of

all the fibers connected to it. In
particular, make sure that the
color of the optical transceiver
providing the input signal
matches the corresponding input
channel.
2. Use an OPM (described in
Measuring Optical Levels (page
8-8)) to check the ADD input
power level of the fibers. Verify
that the input power level meets
the required optical power
standard.
the card.
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Corrective measures
9-25
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Maintenance Manual
No.
Symptoms
Probable cause
5.
Red LOS DROP

lights.
Loss of input
signal for DROP
unit
Corrective measures
1. Check for proper connection of

all the fibers connected to it. In
particular, make sure that the
color of the optical transceiver
providing the input signal
matches the corresponding input
channel.
2. Use an OPM (described in
Measuring Optical Levels (page
8-8)) to check the DROP input
power level of the fibers. Verify
that the input power level meets
the required optical power
standard.
the card.
Troubleshooting Procedures for Aurora-G

Cards
Regular periodic maintenance is recommended for all cards and system
components. Keep components free of dust and other particulate matter.
Examine cables for damage and ensure that airflow requirements have been
met. The Aurora-G card does not require any special maintenance.
The Aurora-G card does not include any field-replaceable parts. If you
experience a card failure, contact customer support for a replacement. Install
the replacement card as described in Installing Aurora-G Cards (page 6-79).
This section provides detailed troubleshooting guidelines, grouped into the
following categories: LED indicator lights, built-in tests, diagnostic codes,
management access, configuration, traffic, certificates, and card failure. Topics
include a list of symptoms together with possible solutions.
9-26
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Maintenance
LED indicator lights

Table 9-13: Understanding the Aurora-G indicator lights
Symptom
No power light.
Explanation and possible solutions
Make sure the card is correctly seated in the cage.

Check the power to the XDM rack.
Card failure light

is lit.
The device diagnostics detected a critical error during the boot

process. Try rebooting again to clear the error. If the failure
persists, do one of the following:
If the operating system boots, check the Alarms view in
EMS-Aurora and the syslog server, if configured, for
information about the BIT error.
If the error occurs before the operating system boots, make
note of the diagnostic code (Diagnostic codes (page 9-28)) and
contact ECI for service.
No card activity
light.
Indicates the presence of a port alarm on the local or remote port.

Check the Alarms view in EMS-Aurora to verify the port alarm.
Then check the syslog server for details on the cause of the alarm.
No link status
lights.
No link activity
lights.
Check the network cable. Verify correct transmit and receive

cable polarity.
Check the operational status of the equipment being
connected.
Verify that the auto-negotiation and flow control settings on
the local or remote port in question match the settings of the
equipment to which they are connected.
If the problem is not resolved, the network may not be
functioning properly. Consult a local network administrator.
Check physical connectivity.
Check with the local network administrator to ensure proper
placement in the network.
Built-in tests
The Aurora-G embedded software performs a series of built-in tests to verify
that the Aurora-G hardware components are functioning properly and operating
under the correct conditions. Some of the BIT procedures are performed when
the card's software boots. Some BIT procedures are performed on a periodic
basis. The tests that run on a periodic basis are non-service affecting.
If any of the BIT procedures fail, a card failure alarm is generated. Details
about the failure are displayed in the EMS-Aurora Alarms view and, if
configured to do so, the alarms are sent to a syslog server.
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Maintenance Manual
The following areas are tested by the built-in procedures:
Memory modules
Compact flash
Application code integrity
Encryption and keying functions
Card operating temperature
Network processing unit
Real-time clock
Ethernet management interface
Diagnostic codes
When the Aurora-G powers up, the diagnostic code LED displays 88 to verify
that the diagnostic display segments are functioning. As the Aurora-G cycles
through the built-in test sequence, the corresponding diagnostic code is
displayed. After the tests are completed successfully, the diagnostic code
display is solidly illuminated with the code 00.
If a test fails, the card failure LED illuminates, which indicates that the
Aurora-G is in an error state. If the Aurora-G fails to boot properly, make a
note of the error code and contact customer support.
If the failure occurs after the serial port has been initialized, a card failure
alarm is sent to EMS-Aurora and a text message describing the boot failure is
displayed on the terminal. A message is also sent to the syslog server if the card
has been configured to send alarms to a syslog server.
The diagnostic code display indicates the number of the failed test. The
following table lists the test error codes.
Table 9-14: Diagnostic codes
Code
Built-in test
Terminal output
88
Diagnostic display test
None
01
Bootrom CRC
None
02
RAM test portion 1
None
03
RAM test portion 2
None
04
Network Processor initialization test
None
05
RDRAM initialization test
None
06
RDRAM test
None
Application image authentication
Code authentication
.... FAILED
Random Number test
Error. Detected two sets of

identical "random" number
07
9-28
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Maintenance Manual
Code
Maintenance
Built-in test
Terminal output
BCM5821 self test
Testing BCM 5821

.... FAILED
File system missing
File system missing
08
CAM test
Initializing CAM .... FAILED
09
AES/SHA-1 algorithm test
Testing AES/SHA1 BCM584X

.... FAILED
00
Successful completion of all tests
Up and operational
NOTE: Remove the Aurora-G cover plate to expose the

diagnostic code display.
Management access
Table 9-15: Management access troubleshooting
Symptom
Administrator
password is forgotten
or lost.
Not able to log in to

the CLI.
The management
workstation cant
communicate with the
Aurora-G.
Aurora-G is not
sending SNMP objects
to the management
workstation.
417006-2304-0H3-B02
Clear the configuration to restore factory defaults.

Contact ECI for service.
Verify the password.
Only one user at a time can access the CLI.
Check for a user conflict between the RS-232 port and
10/100 Ethernet management port.
Verify that the network connection to the management
port is in place (see Installing Aurora-G Cards (page 679)).
Check the management interface default gateway
configuration. Assign a default gateway if the
management workstation is on a different subnet than the
Aurora-G management port.
Verify that the Aurora-G is configured properly for the
management option you are using (IPSec and Telnet
enabled/disabled).
Enable SNMP functionality by setting the community
string.
Verify that the management workstations IP address is
configured as the SNMP trap host address.
9-29
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Maintenance Manual
Symptom
Cannot Telnet to the

management port.
Verify that the correct management port IP address is

being entered for the connection.
Verify that Telnet is enabled.
If IPSec is disabled on management port, make sure that
the IPSec client on the workstation is disabled.
If IPSec is enabled on the management port, verify that
the IPSec client is enabled on the workstation and that
matching policy settings have been configured on each.
Ensure the management port is connected to the network.
Verify that the default gateway is properly configured on
the 10/100 management port.
Configuration
Table 9-16: Configuration troubleshooting
Symptom
The device on the

WAN side (remote port
connection) of the
Aurora-G is dropping
packets.
Set the PMTU size to a number that doesnt exceed the

MTU of the device with the smallest MTU in the path.
To get this number, run diagnostics on the device in
question or check with your network administrator.
Cannot download files

from an FTP server.
Verify that the FTP server software is active on the

specified host.
Verify the FTP client configuration and make any
necessary corrections, save the configuration, and retry
the command.
Ping the FTP server and Aurora-G management port. If
not successful, contact the Network Administrator.
Verify that the configuration of IPSec on the
management port is compatible with the FTP server.
Aurora-G configuration
settings revert to their
previous setting after
the unit is rebooted.
9-30
Save configuration changes (copy s n). Unsaved

configuration changes are lost when the unit is
rebooted.
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Maintenance
Traffic
Table 9-17: Traffic troubleshooting
Symptom
Encrypt All mode is

not passing packets
as expected.
Explanation and possible solution
Traffic is not being

passed.
Cannot establish a
link.
417006-2304-0H3-B02
Check the shared keys. In a point-to-point configuration,

make sure that precisely the same shared key is configured
on both Aurora-Gs in the pair. In a mesh configuration, the
cipher secret and hash secret must be entered identically
on each participating Aurora-G.
Check the Aurora-G roles. In a point-to-point
configuration, verify that the two Aurora-Gs have different
roles. One Aurora-G should be configured as primary
and the other secondary. In a mesh configuration, all
Aurora-Gs should be configured as mesh.
Check the group IDs. All Aurora-Gs in the group must
have the same ID. If the IDs are different or missing,
packets will be discarded.
Determine whether the network requires that a specific
VLAN tag be applied to all Ethernet traffic. If so, make
sure the vlan command is configured appropriately on the
Aurora-G.
Verify that the local and remote port SFP transceivers and
cables are properly seated. The Link status LEDs
illuminate when the link is active. The Link traffic LEDs
blink at a steady rate when traffic is passing on the port.
Ping end-to-end through the encrypted connection to
verify a valid end-to-end connection.
Check for alarm conditions on the local and remote ports.
If an alarm is present, determine the cause and try to
correct the condition that is triggering the alarm.
Set the Aurora-G to the Pass All security mode and verify
that it is able to pass unencrypted packets.
Check physical connectivity to ensure proper signal path.
Verify that compatible SFP transceivers and fiber type is
being used for connectivity.
Ensure that the auto-negotiation and flow control settings
on the local or remote port and the device to which they
connect have compatible settings.
9-31
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Maintenance Manual
Certificates
Table 9-18: Certificate troubleshooting
Symptom
Policies that use

certificates for
authentication are not
establishing SAs.
IKE negotiations are

failing when CRLs are
used.
Check the certificate expiration date in the Certificate

Editor.
Check for a corrupted certificate. When Aurora-G
detects a bad certificate it generates a message to the
console at boot time. Replace the corrupted certificate
with a valid one.
Verify that the IPSec peers certificate or CA certificate
is installed as an external certificate on the Aurora-G.
Issue the debug crl command and look for the following:
Verify that the URL for the CRL server is correct.
Check that the dns command is configured.
Make sure that the CRL URL is in the correct field in
the peers certificate (in the CRL distribution point
field).
Card failure
Table 9-19: Card failure troubleshooting
9-32
Symptom
The Card failure

LED is
illuminated and
Card alarm is
issued.
If the Aurora-G enters an error state, a card alarm is sent to

EMS-Aurora and the card failure LED illuminates. The
Aurora-G can be configured while it is in an error state. To
recover:
Check the EMS-Aurora Alarm view for information about
the failure.
Reboot the Aurora-G.
If a failure occurs during the boot process, refer to
Diagnostic codes (page 9-28) for additional troubleshooting
information.
If rebooting the Aurora-G does not clear the error, contact
customer support.
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Troubleshooting Procedures for ATS Cards

The following table describes the troubleshooting procedures for ATS cards.
Table 9-20: Troubleshooting procedures for ATS cards
No.
Symptoms
Probable cause
1.
Green ACTIVE
indicator on base
card off.
Defective card

you fully insert the card in its
slot.
2.
Red FAIL indicator Defective card

on base card not
turning off after
software
downloading
(following
power-on and
resetting).

reinserted.
turns off.
3.
Orange (traffic
carrying) indicator
on base card off.
Check with the management

provisioned; if not, ignore the state
of the orange indicator.
417006-2304-0H3-B02
Card not configured

to carry traffic
Corrective measures
9-33
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Maintenance Manual
Troubleshooting Transmission and Traffic

Alarms
Before any other troubleshooting activity, check the management station log to
find whether a specific component is reported as faulty, and then replace it.

Table 9-21: Troubleshooting transmission and traffic alarms

No.
Symptoms
Probable cause
1.
Alarm related to External problem

a tributary
signal
I/O card handling

the tributary signal
defective
9-34
Corrective measures
1. Check the proper operation of

the equipment providing the
tributary signal and its
connections to the XDM I/O
port.
2. Use the results of the
commissioning and acceptance
tests as a reference for the
required signal levels, and make
measurements of current levels
at all the relevant monitoring
points.
3. Compare the reference levels
with the measured values; a
significant discrepancy may
point to the failed component
(for example, low transmit
level, excessive fiber
attenuation due to physical
damage, and so on).
1. Force switching to the
protection path and reset the I/O
card. Use the results of the BIT
test to identify the faulty
component.
2. Replace the I/O card if suspect.
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Maintenance Manual
Maintenance
No.
Symptoms
2.
Alarm related to External problem

an aggregate
signal
417006-2304-0H3-B02
Probable cause
Corrective measures
1. Check the proper operation of

the equipment providing the
aggregate signal and its
connections to the XDM port.
2. Use the network and site
documentation to identify the
path associated with the
reported alarm and all related
optical and/or electrical
components.
Use the results of the
commissioning and acceptance
tests as a reference for the
measurements of current levels
at all the relevant monitoring
points.
3. Compare the reference levels
with the measured values; a
significant discrepancy may
point to the failed component
(for example, low transmit
level, excessive fiber
attenuation due to physical
damage, and so on).
4. Force switching to the
protection path, and reset each
component. Use the results of
the BIT test to identify the
faulty component.
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Maintenance Manual
Troubleshooting Power Problems

The following table describes the troubleshooting procedures for power
problems.
Table 9-22: Troubleshooting power problems
9-36
No.
Symptoms
Probable
cause
Corrective measures
xRAP-D,
xRAP-B,
xRAP-HP, or
miniRAP
POWER ON
indicator on
Both the main

and backup
power sources
failed
Check the site power distribution system.

Check the DC voltage at the main and
backup power terminals of the xRAP-D,
xRAP-B, xRAP-HP, or miniRAP.
If not within the correct range, check cable
connections up to the DC power distribution
panel, and make sure no circuit breakers are
blown.
Check the voltage supplied by the main and
backup power sources.
Check the power connections to the
xRAP-D, xRAP-B, xRAP-HP, or miniRAP.
Check the circuit breakers in the xRAP-D,
xRAP-B, xRAP-HP, or miniRAP and
replace if necessary.
Check for correct input polarity.
Equipment
problem
Check the voltage at the xINF end of each

power cable. Replace the cable or repair the
xRAP-D, xRAP-B, xRAP-HP, or miniRAP
if there is no voltage present.
If the xINF ACTIVE (green) indicator does
not light, check for input voltage presence
and correct polarity.
If after checking (as explained above) and
reconnecting a cable to the equipment, the
circuit breaker trips again, replace the
corresponding xINF unit.
If the problem occurs again after Step 3,
remove all the cards and modules from the
platform and reinsert them one by one until
the component causing the circuit breaker to
trip is found. Replace that component.
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Maintenance
Probable
cause
Corrective measures
No.
Symptoms
2.
xINF ACTIVE No input power

indicator off
to the
corresponding
unit
Note: If an xRAP-D, xRAP-B, xRAP-HP,

or miniRAP is not used, perform Steps 1 and
2 on the circuit breakers on the power
distribution panel providing power to the
corresponding xINF.
Check the corresponding circuit breaker in
the xRAP-D, xRAP-B, xRAP-HP, or
miniRAP; reset any tripped breaker.
Check the circuit breakers in the xRAP-D,
xRAP-B, xRAP-HP, or miniRAP and
replace if necessary.
If the circuit breaker trips again, disconnect
the cable protected by the corresponding
circuit breaker from the equipment and
check voltage polarity.
Check the power cable condition and make
sure that the cable is not damaged and does
not cause short circuits.
Check proper cable connection at both ends.
3.
xINF FAIL
Technical
indicator lights failure in the
corresponding
unit
Replace the unit.
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Maintenance Manual
Troubleshooting the Timing Subsystem

The following table describes the troubleshooting procedures for the timing
subsystem.
Table 9-23: Troubleshooting procedures for timing subsystem
9-38
Symptoms
Probable cause
Corrective measures
Switching to
standby TMU
Technical failure
Force switching of traffic to the other HLXC

or XIO card, and then replace the HLXC or
XIO card with the defective TMU.
Missing T3 external
reference signal
1. Check the equipment providing the

external reference signal and make sure it
operates normally.
2. Check the cable connected to the
corresponding xECB connector. Make
sure both ends are properly connected to
the mating connector.
3. Check the cable wiring. Replace the cable
if in doubt.
4. Replace the corresponding xECB.
Missing T4 external
reference signal
1. Check the cable connected to the

corresponding xECB connector. Make
sure both ends are properly connected to
the mating connector.
2. Check the cable wiring. Replace the cable
if in doubt.
3. Replace the corresponding xECB.
4. Force switching of traffic to the other
HLXC or XIO card, and then replace the
HLXC or XIO card with the defective
TMU.
Loss of reference
clock source
provided by a
tributary
Troubleshoot the corresponding card and

replace if found faulty.
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Maintenance Manual
Maintenance
Troubleshooting Management
Communication
When it is not possible for the management station to manage an XDM
platform, use the following table to identify the cause of the problem.
NOTE: Whenever problems are detected during
commissioning and acceptance tests and also when

troubleshooting a new installation, the possibility of
configuration and/or provisioning errors must not be
overlooked. Under such circumstances, always start the
troubleshooting procedures by making a complete review of
all equipment configuration and provisioning parameters
against the original network design, and correct as necessary.
Table 9-24: Troubleshooting management communication

Symptoms
Probable cause
Management
traffic path
Defective card in
management traffic
path
1. Check for fault indications on the cards

processing the management communication.
2. Force switching to the protection path and
reset each component. Use the results of the
BIT test to identify the faulty component.
Problem in
transmission path
1. Use the network and site documentation to

identify the path of the management
communication to the corresponding XDM
platform and all the related optical and/or
electrical components.
2. Use the results of the commissioning and
acceptance tests as a reference for the
measurements of current levels at all the
relevant monitoring points.
3. Compare the reference levels with the
measured values; a significant discrepancy
may point to the failed component (for
example, low transmit level, excessive fiber
attenuation due to physical damage, and so
on).
Other problems
Replace suspected components in the following

sequence:
1. Hubs and Ethernet cables used for
management traffic.
2. MECP card.
3. xMCP card.
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Maintenance Manual
Replacing a Network Element

This section describes the procedure for replacing a network element.
NOTES:
This procedure is traffic-affecting. There should be no

traffic going through the platform being replaced for at
least one hour.
This procedure is applicable to systems supplied from
version 4.0 of the product.
Backing Up the LightSoft Database

Backing up the LightSoft database involves the following steps:
Saving EMS-XDM configuration files (page 9-40)
Uploading the NE database from the XDM-500 (page 9-40)
Backing up the database with the DBBackup function (page 9-41)
Saving EMS-XDM Configuration Files

To save the EMS-XDM configuration files:
1. In the EMS-XDM menu bar, select System > Save Configuration to File.
The Save File Name dialog box opens.
2. In the dialog box, enter the name of the file to be saved and click OK.
Uploading the NE Database from the XDM500

To upload the NE database from the XDM-500:
1. In the EMS-XDM menu bar, select System > NE Software Downloads >
Selected NE. The Software Download dialog box opens.
2. In the dropdown list, select Get DB from NE.
3. On the File menu, select Activate. A message appears asking you to
confirm the operation.
4. Click OK to confirm.
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Maintenance
Backing up the Database with the DBBackup

Function
Before you start:
The DBBackup function was released with LightSoft version V01.141.

This function will not operate with prior versions of the application.
Only administrators can perform this operation.
To back up the database using the DBBackup function:

1. On the Unix workspace, right-click anywhere on the screen to open the
Root Menu.
2. In the Root Menu, select Unix Window.
3. At the # prompt, type su nms.
4. At the nms prompt, type DBBackup. The following text appears.
5. Verify the backup has been completed successfully.
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Maintenance Manual
Installing/Replacing the XDM-500 Platform

Follow these instructions to install or replace an XDM-500 platform.
To install the new XDM-500 platform:
1. Make sure the new unit is the same as the one to be replaced and install the
platform with all its cards.
2. Perform the Commissioning Tests (page 8-1).
3. Copy the contents of the NVM from the replaced platform to the new
platform.
4. Perform the following tests:
Test procedure
Expected results
Select one of the cross connects.

Connect the test equipment to one side
and make a fiber loopback on the other
side.
The test equipment shows no alarms.
Extract the central cross-connect matrix

card, for example, the HLXC with the
active TMU.
Insert the central cross-connect matrix

card, for example, the HLXC.
Extract the other central cross-connect

matrix card, for example, the HLXC.
Insert the central cross-connect matrix

card, for example, the HLXC.
The test equipment displays a short burst

of alarms (less than 50 msec).
The TMU switches to the other central
cross-connect matrix card, for example,
the HLXC.
The TMUs orange LED remains active.
The test equipment shows a short burst of
alarms (less than 50 msec).
The TMW switches to the other central
cross-connect matrix card, for example,
the HLXC.
The TMUs orange LED remains active.
To replace the XDM-500 platform:

1. Verify that all the fibers in the ODF are marked correctly.
2. Disconnect the fibers that connect to the XDM-500 you want to replace and
connect them to the replacement XDM-500 in the proper place in the ODF.
3. Verify traffic passes correctly.
4. Verify the replaced XDM-500 uploads LightSoft data.
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Maintenance Manual
Maintenance
Replacing Cards, Modules, Fans,

and Other Components
This section provides instructions for replacing faulty XDM components
identified in troubleshooting procedures (page 9-11).
Safety and Workmanship

For safety and workmanship instructions, refer to Before You Start/Safety
Guidelines (page 1-1).
Replacing xRAP-D Circuit Breakers

xRAP-D circuit breakers can be replaced without disconnecting the power (hot
swapping).
To replace the xRAP-D circuit breakers:
1. Open the two captive screws fastening the xRAP-D front cover to its
chassis and remove the cover (see the following figure).
2. Identify the faulty circuit breaker and remove it by pulling it straight out of
its socket.
3. Check the replacement circuit breaker ratings against those of the replaced
circuit breaker.
WARNING: For continued protection against risk of fire,
replace only with a circuit breaker of the same type and
rating.

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Maintenance Manual
4. Insert the replacement circuit breaker into the circuit breaker sockets of the
corresponding xRAP-D power terminal board, as shown in the following
figures.
5. Reinstall the xRAP-D front cover and fasten it with its two captive screws.
Figure 9-2: Installation of xRAP-D circuit breakers
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Maintenance Manual
Maintenance
Replacing xRAP-HP Circuit Breakers

xRAP-HP circuit breakers can be replaced without disconnecting the power
(hot swapping).
To replace xRAP-HP circuit breakers:
1. Open the two captive screws fastening the xRAP-HP front cover to the
xRAP-HP chassis and remove the cover.
Figure 9-3: Replacing xRAP-HP circuit breakers
its socket.
circuit breaker.
rating.

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Maintenance Manual
4. Insert the replacement circuit breaker into the circuit breaker sockets
located on the corresponding xRAP-HP power terminal board as shown in
the previous figure.
5. Reinstall the xRAP-HP panel and fasten it with its two captive screws.
Replacing xRAP-100 Circuit Breakers

xRAP-100 circuit breakers can be replaced without disconnecting the power
(hot swapping).
To replace xRAP-100 circuit breakers:
1. If the xRAP-100 front panel has not been removed, open the two captive
screws fastening the xRAP-100 front cover to its chassis and remove the
cover (refer to the following figure).
Figure 9-4: Replacing xRAP-100 circuit breakers
2. Identify the circuit breaker and remove it by pulling it straight out of its
socket.
circuit breaker.
rating.

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Maintenance Manual
Maintenance
4. Insert the replacement circuit breaker into the circuit breaker sockets
located on the corresponding xRAP-100 power terminal board, as shown in
the previous figure.
5. Reinstall the xRAP-100 cover and fasten it with its two captive screws.
Replacing miniRAP Circuit Breakers

miniRAP circuit breakers can be replaced without disconnecting the power (hot
swapping).
To replace miniRAP circuit breakers:
1. Open the two captive screws fastening the miniRAP front cover to its
chassis, and remove the cover (see the following figure).
its socket.
circuit breaker.
replace only with the same type and rating of circuit breaker.
4. Insert the replacement circuit breaker into the circuit breaker sockets of the
corresponding miniRAP power terminal board, as shown in the following
figure.
5. Reinstall the miniRAP front cover and fasten it with its two captive screws.
Figure 9-5: Installing miniRAP circuit breakers
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Replacing XDM-500 Components

This section provides replacement procedures for the common components
installed in XDM-500 platforms. Replacement procedures for cards, modules,
and optical transceivers are provided in Replacing Cards (page 9-50) and
Replacing Modules in the Modules Cage (page 9-62).
Replacing the FCU

FCU units can be replaced without disconnecting the power from the XDM
platform.
CAUTION: To prevent platform overheating, the replacement
must be completed within 2 to 3 minutes.
IMPORTANT: In the XDM-3000 platform, if one FCU3000

unit is not working, it is essential that the working
FCU3000 unit be located in the lower FCU slot in the
platform.
The XDM-3000 platform can continue to operate for a short
period of time as long as there is a working FCU3000 unit in
the lower slot of the platform. Replace the nonfunctional
FCU3000 as soon as possible. In the meantime, if the
FCU3000 unit that is working is located in the upper FCU
slot, move the working FCU3000 unit down to the lower
FCU slot. Insert the replacement FCU3000 unit into the
empty upper FCU slot as soon as possible.
To replace the FCU:

1. Prepare the replacement FCU unit so you can install it immediately after
removing the old FCU unit. In particular, carefully inspect the interior of
the FCU unit to ensure that no foreign matter, such as packaging chips, is
present inside the unit.
2. Check that at least one FCU unit works properly.
3. Open the front panel door of the XDM platform.
4. Remove the FCU unit to be replaced from the platform by slowly pulling it
out. Be careful, as the internal fans may still be rotating.
5. Insert the replacement FCU unit in the corresponding platform guides, and
push it carefully in until the FCU unit fully engages the mating internal
connector of the XDM platform. Make sure that the FCU front panel is
flush with the platform frame front edges. As the FCU unit is plugged into
its mating connector, the green ACTIVE indicator on its panel should turn
on.
6. Close the XDM platform front door with its fasteners.
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Maintenance Manual
Maintenance
Replacing xINF/xINF-H Units

xINF/xINF-H units can be replaced without disconnecting the power from the
XDM platform (hot swapping). Refer to the following figure while performing
the following procedure.
Figure 9-6: Replacing xINF/xINF-H unit
To replace xINF/xINF-H units:

1. Before starting, check that the second xINF/xINF-H unit of the same XDM
platform is connected to the power and working.
2. Disconnect the power cable from the xINF/xINF-H unit to be replaced.
3. Unscrew the three top screws fastening the xINF/xINF-H unit to be
replaced, and then remove the unit by pulling it straight up.
4. Orient the replacement unit as shown in the previous figure, slide it in
position, and push downward carefully to plug it into the mating internal
connector on the top printed circuit board of the XDM platform. Make sure
the unit is fully inserted in its place.
5. Secure the unit using its three captive screws.
6. Reconnect the power cable to the xINF/xINF-H unit POWER IN connector.
The green ACTIVE indicator on its front panel should turn on, indicating
that the xINF/xINF-H unit is operating properly.
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Maintenance Manual
Replacing the xECB

The xECB unit can be replaced without stopping XDM operation. However,
the replacement process must be completed as soon as possible because the
xECB is used to connect the external reference clock signals to the platform.
Whenever possible, configure the XDM platform to use an alternative
reference source until the xECB unit is replaced.
To replace the xECB:
1. Disconnect the cables connected to the xECB connectors.
2. Unscrew the screws fastening the xECB unit to be replaced, and then
remove the unit by pulling it straight out.
3. Insert the replacement xECB unit in the platform guides, and push it
carefully in until the xECB unit fully engages the mating internal connector
of the XDM platform. Make sure that the xECB front panel is flush with
the platform frame front edges.
4. Secure the replacement unit using its captive screws.
5. Reconnect the cables disconnected in Step 1 above.
Replacing Cards
CAUTION: - STATIC SENSITIVE DEVICES
PROPER HANDLING AND GROUNDING
PRECAUTIONS REQUIRED
XDM equipment contains components sensitive to electrostatic
discharge (ESD). To prevent ESD damage, strictly observe all the
precautions listed in Protection against Electrostatic Discharge (page 126). Keep parts and cards in their antistatic packaging material until
you are ready to install them.
The use of an antistatic wrist strap connected to a grounded equipment
frame or rack is recommended when handling cards and modules
during installation, removal, or connection to internal connectors.
CAUTION: When inserting cards and modules, make sure to carefully

align the card with the platform guide rails. If resistance is felt during
insertion, immediately retract the card and then repeat the process.
Hold the card straight during insertion and removal, and pull or push it
slowly and carefully to avoid touching components located on adjacent
cards.
Do not use excessive torque when tightening the fastening screws of
cards and modules.
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Maintenance

Before you start:

Before replacing any card, module, NVM, or optical transceiver:
1. Check that the replacement component has not been physically damaged
during shipment.
2. Remove the replacement component from its antistatic protection
packaging and visually inspect the component for any damage during
shipment. Report any problems.
3. Record the hardware and software versions as indicated on the component
identification labels, and make sure they are compatible with those of the
component to be replaced.
After replacing a component:
1. Place the component in its antistatic protection packaging and close it.
2. Attach to the packaging a report explaining the reason for the replacement,
and identify the network site, physical location, platform, and time of
replacement.
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Maintenance Manual
Replacing the NVM in the xMCP Card

CAUTION: To prevent disruption of data stored on the NVM,
make sure you do not press the NVM release pushbutton

while the xMCP accesses the NVM. Monitor the yellow
indicator before attempting to remove the NVM. Press the
release pushbutton only after the yellow xMCP indicator has
been off for at least two minutes.
straight and be careful to prevent accidental contact between
the NVM card and the printed circuit board of the xMCP.
Such contact may reset the xMCP card.
Figure 9-7: Replacing an NVM on xMCP card
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Maintenance
To replace the NVM in the xMCP card:

1. If the platform has two xMCP cards, first force switch to the other xMCP
card.
2. Wait until the yellow indicator of the xMCP (on which the NVM is
located) turns off and remains off for at least two minutes.
3. Press the NVM release pushbutton and carefully retract the card while
ensuring that it does not touch the xMCP PCB.
4. Position the replacement NVM card correctly and push it straight into its
socket, ensuring that it does not touch the xMCP.
This completes the NVM card replacement. At this stage, check your
instructions. You may decide to wait for the automatic updating of the database
stored on the new NVM card (this may take up to one hour), or immediately
force switch to the xMCP/xMCP-B on which the NVM card has been replaced.
Replacing the xMCP

CAUTION: If the platform has a single xMCP card, organize
your work to replace it as rapidly as possible. Management

communication with this platform is not possible when the
xMCP card is removed. Monitor its yellow indicator before
attempting to remove the card. Remove the card only after the
yellow xMCP indicator has been off for at least two minutes.
To replace the xMCP:

1. If the platform has two xMCP cards, first initiate a forced switching to the
other xMCP card.
2. Wait until the yellow indicator of the xMCP to be replaced turns off and
remains off for at least two minutes, and then remove the NVM card. It is
recommended to wait until the orange indicator of the other xMCP card
also turns off.
3. Remove the card to be replaced by bringing both its extractor handles to the
4. If the NVM card is to be transferred from the replaced xMCP card to its
replacement, do this now (see "Replacing the NVM in the xMCP Card"
page 9-52).
5. Bring both extractor handles of the replacement card to the horizontal
position before inserting the card in its slot.
6. Insert the rear end of the replacement card into the corresponding card
guides.
7. Push the card in until it mates the chassis connectors. If you feel resistance
8. Press the ends of the two extractor handles to fully insert the card.
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Replacing the NVM in the xMCP-B Card

CAUTION: To prevent disruption of data stored on the NVM,
make sure you do not press the NVM release pushbutton

while the xMCP-B accesses the NVM. Monitor the yellow
indicator before attempting to remove the NVM. Press the
release pushbutton only after the yellow xMCP-B indicator
has been off for at least two minutes.

straight and be careful to prevent accidental contact between
the NVM card and the printed circuit board of the xMCP-B.
Such contact may reset the xMCP-B card.
Figure 9-8: Replacing an NVM on xMCP-B card
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To replace the NVM in the xMCP-B card:

1. If the platform has two xMCP-B cards, first force switch to the other
xMCP-B card.
2. Open the two captive screws fastening the NVM cover to the chassis, and
remove the cover.
3. Use the thin edge of the NVM cover to press the NVM release pushbutton,
and carefully retract the card while ensuring that it does not touch the
xMCP-B PCB.
4. Position the replacement NVM card correctly and push it straight into its
socket, ensuring that it does not touch the xMCP-B PCB (when the card is
in place the release pushbutton is flush with the NVM).
5. Replace the NVM cover and fasten it with its two captive screws.
This completes the NVM card replacement. At this stage, check your
instructions. You may decide to wait for the automatic updating of the database
stored on the new NVM card (this may take up to one hour), or immediately
force switch to the xMCP-B on which the NVM card has been replaced.
Replacing the xMCP-B

CAUTION: If the platform has a single xMCP-B card,
organize your work to replace the xMCP-B as rapidly as

possible. Management communication with this platform is
not possible when the xMCP-B card is removed. Monitor its
yellow indicator before attempting to remove the card.
Remove the card only after the yellow xMCP-B indicator has
been off for at least two minutes.
To replace the xMCP-B:

1. If the platform has two xMCP-B cards, first force a switch to the other
xMCP-B card.
2. Push the card reset control and rotate it clockwise to unlock the lower
extractor handle.
3. Remove the card to be replaced by bringing both its extractor handles to the
4. If the NVM card is to be transferred from the replaced xMCP-B card to its
replacement, do this now (see "Replacing the NVM in the xMCP-B Card"
page 9-54).
position before inserting the card in its slot.
guides.
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Maintenance Manual
9. Push the card reset control and rotate it counter-clockwise to lock the lower
extractor handle.
Replacing the NVM in the ATS Card

Refer to the following figure while performing the procedure.
Figure 9-9: Replacing NVM on ATS card
To replace the NVM in the ATS card:

1. Release the screw that prevents NVM removal.
2. Press the NVM release pushbutton, and carefully retract the NVM while
ensuring that it does not touch the ATS PCB.
3. Orient the replacement NVM card in the correct position and push it
straight into its socket, while ensuring that it does not touch the PCB.
4. Reinstall the screw removed in Step 1.
This completes the NVM replacement.
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Maintenance Manual
Maintenance
Replacing the MECP

This section provides replacement instructions for all the MECP versions:
MECP, MECP_OW, MECP_OSCxx, and MECP_OCxxOW. Refer to the
following figure while performing the procedure.
NOTE: The following figure illustrates the procedure on an
MECP_OSC card. The same procedure applies to the
MECP_OCxxOW cards.
Figure 9-10: Typical MECP_OSC card optical connections
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CAUTION: Organize your work to replace the MECP card as
rapidly as possible. While the MECP card is out, management

and OW communication with the platform and other tasks
supported by this card are not possible.
Moreover, when the replaced MECP_OSC5 or
MECP_OC5OW card is operating on a link with OFA_R
Raman optical amplifiers, these amplifiers may turn off while
no OSC signal is present. If you need additional details on
this issue, contact ECI' Customer Support team.
Before attempting to remove the card, monitor the yellow and
orange indicators of the xMCP card(s) installed in the
platform. Remove the MECP only after the xMCP indicators
have been off for at least two minutes.
To replace the MECP:

1. Prepare a sketch identifying each cable and, for the
MECP_OSCxx/MECP_OCxxOW, each fiber connected to the card.
2. When ready, disconnect the cables connected to the MECP.
3. For the MECP_OSCxx/MECP_OCxxOW, refer to the previous figure.
Press the handle to bring the optical connector assembly to the
CONNECTION position, and then disconnect the optical fibers connected
to the card.
4. Remove the card to be replaced by bringing its extractor handle to the
5. Insert the rear end of the replacement card in the corresponding card
guides.
7. Press the end of the MECP extractor handle to fully insert the card.
8. Reconnect the cables disconnected in Step 2 above to the replacement card.
9. For the MECP_OSCxx/MECP_OCxxOW, refer to the previous figure.
Press the handle to bring the optical connector assembly to the
CONNECTION position, and then reconnect the optical fibers to the
MECP_OSCxx/MECP_OCxxOW connectors.
10. Raise the handle to return the optical connector assembly to the NORMAL
position.
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Maintenance
Replacing I/O Cards

The following procedure applies to all I/O cards.
For cards with electrical interfaces that use electrical interface protection
modules, force a switch to the protection card (IOP) before replacing the card.
To replace an I/O card:
1. For cards with optical ports, prepare a sketch identifying each fiber
connected to the card.
2. For cards with reset control, for example HLXC, SIO164, DIOB, first turn
the reset control to the vertical position.
3. Disconnect any fibers from the card to be replaced.
4. Remove the card by bringing both extractor handles to the horizontal
position.
position before inserting the replacement card in its slot.
guides.
8. For cards with reset control, return the reset control to the horizontal
position to release the extractor handle.
10. Reconnect any fibers that were disconnected from the replaced card to the
replacement card.
Replacing Optical Transceivers

The following procedure explains how to replace an optical transceiver.
To replace an optical transceiver:
1. Identify the position of the transceiver to be replaced.
2. Disconnect the fibers connected to the transceiver. Refer to the following
figure.
4. Reconnect the fibers disconnected in Step 2 above.
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Maintenance Manual
Optical transceiver replacement guidelines

ECI's Transport Networking Division supplies field-replaceable optical
transceivers in three versions as shown in the following figure. The optical
transceivers are designated OM1_4, OMS1_4, OM4_1, OMS4_1, OM16_1,
and OM16_1SFP.
Hot swapping is allowed, provided you observe all the safety precautions (see
"Installing XDM-500: Before You Start Safety Guidelines" page 1-1) during
the replacement procedure.
Before replacing any transceiver, prepare a sketch identifying each fiber
connected to the transceiver and use it as a guide when reconnecting the fibers.
upgrade procedure.
Figure 9-11: Replacing typical optical transceivers
9-60
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Maintenance
To replace a typical optical transceiver module:

1. Identify the position on the base card of the transceiver to be replaced.
2. Disconnect the fibers connected to the transceiver.
3. If necessary, remove the SFP(s) installed on the optical module in
accordance with the instructions in Installing and removing optical
4. Release the captive screws fastening the transceiver to the base card guides.
5. Pull out the transceiver to be replaced and remove it.
6. Insert the rear end of the replacement transceiver into the card guides and
push slowly backward to mate the connectors. If you feel resistance before
the connectors are fully mated, retract the transceiver and repeat the
insertion.
7. Fasten the transceiver with its captive screws.
8. For modules with removable SFP(s), install the required SFP(s) in
accordance with the instructions in Installing and removing optical
9. Reconnect the fibers disconnected in Step 2 above.
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Replacing Modules in the Modules Cage

Before you start:
When replacing the electrical connection module of an I/O card, whenever
possible force a switch to the protection card (IOP) before replacing the
module.
To replace a module located in the modules cage of an XDM
platform:
1. Remove the replacement module from its antistatic protection packaging
and visually inspect the replacement module to detect damage during
shipment. Report any problems.
2. Inspect the module and record its hardware and software versions.
3. Disconnect any cables or fibers connected to the module to be replaced.
Make a sketch identifying each cable and fiber and where it is connected.
4. Release any screws fastening the module to be replaced to the platform, and
then remove the module to be replaced by bringing both its extractor
handles to the horizontal position.
5. Insert the rear end of the replacement module in the corresponding guides.
6. Push the module in until it mates the chassis connectors. Make sure the two
fastening screws are free to move backward as the module slides in. If you
feel resistance before the connectors are mated, pull the module out and
repeat the procedure.
7. Press the ends of the two card extractors to fully insert the module, and then
fasten the module to the platform by tightening the two fastening screws.
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In this appendix:
Typical Installation Setup ............................................................................... A-2
Rack Alarm Panel Power and Alarm Connection Options ............................. A-4
Rap Features ................................................................................................... A-5
xRAP-D .......................................................................................................... A-7
xRAP-B ........................................................................................................ A-13
xRAP-HP ...................................................................................................... A-16
xRAP-100 ..................................................................................................... A-19
miniRAP ....................................................................................................... A-22
FST ............................................................................................................... A-25
Heat Buffer ................................................................................................... A-26
Cable and Fiber Guiding Accessories .......................................................... A-26
Optical Distribution Frames (ODFs) ............................................................ A-29
Digital Distribution Frames (DDF) .............................................................. A-33
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Typical Installation Setup

The following figure shows a typical installation of a single XDM-500 shelf in
a rack, together with a minimal set of installation accessories. In addition to the
XDM shelf itself, the equipment installed in the rack includes:
One XDM rack alarm panel (xRAP-D, xRAP-B, xRAP-HP, or xRAP-100)

installed at the top of the rack. The xRAP module connects external power
and alarm monitoring lines to the XDM shelves installed in the rack.
xRAP-D, xRAP-B, and xRAP-HP are each able to fully support two
shelves. The xRAP-HP also has the capability to chain alarm
monitoring lines from a third shelf.
xRAP-100 supports up to four XDM shelves, one of them a fully
equipped XDM-1000.
miniRAP supports one XDM shelf (not high-power).
In addition to the space needed for installing the xRAP unit, leave at
least 50 mm (2 in.) free space under the xRAP unit for routing cables.
Fiber Storage Trays (FSTs) for storing optical fiber. The FSTs are 1 U (44
mm/1.75 in.) high units that can store up to 48 2-mm (.08-in.) optical
fibers, each up to 2.5 meters (2.75 yards) long.
In general, FSTs are installed under the RAP. However, when there is not
enough space in the rack, install them just above the rack. For this purpose
ECI offers extendable installation rails.
A-2
ODF units, as required.
Cable guide. The cable guide is used to help route the coaxial cables neatly,
and is used in addition to the standard rack cable guides attached to the
rack side rails.
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Figure A-1: Typical installation of a single XDM-500 shelf
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Rack Alarm Panel Power and

Alarm Connection Options
The xRAP product family supports power supply and alarms connection to the
various types of XDM platforms. A mixture of big and small XDM platforms is
possible in accordance with the platforms power consumption and the xRAP
total power. All xRAPs support redundancy through connections to two
separate power sources for each protected platform (i.e., two independent
circuit breakers are provided on the xRAP for each connected platform).
NOTE: The generic name xRAP is used when the text is
applicable for any one of the ECI xRAP units (PRAP,

xRAP-D, xRAP-B, xRAP-HP, xRAP-100, or miniRAP).
NOTE: Beginning with V7.2, platform power supply
limitations are enforced by the management software. Upper

bound limits for total platform power usage are defined
through the management configuration variables. The upper
bound limits are enforced through software protection. For
more information, see the EMS-XDM User Manual.
A-4
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Rap Features
The following table lists the characteristics of the available xRAPs:
Table A-1: RAP features
Features
miniRAP
xRAP-100
PRAP
xRAP-D
xRAP-B (EOL)
xRAP-HP (EOL)
Number of XDM platforms with

redundant power support 17
(2 circuit breakers per platform 18)
1 + 3 19
Total power consumption
1.2 KW
3.2 KW
4.8 KW
4.5 KW
4.5 KW
4 KW
Severity alarms 20
Four alarms for Integrated, four

one platform
alarms from four
platforms (OR
gate)
Two separated groups Two separated groups

of four alarms each
of four alarms each
from one XDM-3000 from two platforms
Two separated groups

of four alarms each
from two platforms
Integrated, four alarms

from two platforms (OR
gate)
Separate buzzer signals
---
---
One buzzer signal that

reports on "Critical"
alarms toward the
user central monitor
system
Two separate buzzer

signals that report on
"Critical" alarms toward
the user central monitor
system
--Two separate buzzer

signals that report on
"Critical" alarms toward
the user central monitor
system
Separate buzzer shut-off signals
---
---
One buzzer shut off

signal that mutes the
buzzer in the user
central monitor
system
Two separate buzzer

shut off signals that
mute the buzzer in the
system
Two separate buzzer

shut off signals that
mute the buzzer in the
system
---
17
The number of supported shelves depends on their total power consumption.

The same type of circuit breaker is used in all xRAP versions. The value of the circuit breaker is defined by the power consumption requirements of the shelf and not by the type of
xRAP.
19
The 3-pin connectors for three shelves (shelf#1, shelf#2, and shelf#3) can only be used for the lower power consumption shelves. The 5-pin connectors for shelf#4 can be used either
for the lower power consumption shelves or for the higher power consumption shelves.
20
Critical, Major, Warning, and Minor alarms toward the customer central monitoring system.
18
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Features
XDM Accessories
miniRAP
xRAP-100
---
Fixed, four inputs Total eight inputs to

the XDM-3000
per platform,
total 16 per
xRAP-100
Number of output External alarms 23
---
Fixed, two
outputs per
platform, total
eight per
xRAP-100
Connector type
for power cable between xINF and
xRAP (xRAP side)
Cable size between xRAP and batteries
(connects with terminal lugs)
Number of input External alarms
21
xRAP-D
xRAP-B (EOL)
xRAP-HP (EOL)
Fixed, four inputs per

platform, total eight
inputs per xRAP-D
Fixed, four inputs per

inputs per xRAP-B
Flexible 22, total eight

inputs per xRAP-HP
(up to Rev.C01)
For Rev.C02, fixed,
four inputs per platform,
total eight inputs
Total eight outputs

from the XDM-3000
Fixed, four outputs per

outputs per xRAP-D
Fixed, four outputs per

outputs per xRAP-B
Flexible 24, total eight

outputs per xRAP-HP
(up to Rev.C01)
For Rev.C02, fixed,
four outputs per
outputs
3 pin connector 3 pin and 5 pin

connector
5 pin connector
5 pin connector
5 pin connector
Terminal lug
35 mm2
(1+1)
25 mm2
(1+1), (1+1), & (1+1)
Three inputs for side
A and three inputs for
side B
25 mm2 25
(1+1) & (1+1)
Two inputs for side A
and two inputs for side
B
50 mm2
(1+1)
50 mm2
(1+1)
35 mm2
(1+1)
PRAP
21
External Alarms input via Opto coupler.

Using dip switches.
23
External Alarms output via dry contacts.
24
Using dip switches.
25
Bridge option to work with a single 50mm2 power cable available.
22
A-6
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xRAP-D
The xRAP-D is a power distribution and alarm panel for XDM platforms
installed in racks. The xRAP-D performs the following main functions:
Redundant power distribution for one or two XDM platforms. The

xRAP-D can support either one or two XDM platforms. Each platform can
work with either one or two power inputs, where one is the main power
input (A) and the second is an optional protective backup power input (B).
The xRAP-D can work with up to two redundant input power sources,
depending on the user's electric infrastructure.
In the default configuration, the xRAP-D supplies independent streams of
power to two separate XDM platforms. Input power for one XDM platform
is kept completely separate from the input power for the second XDM
platform. Separate input power cables from the power sources feed into
independent circuit breakers on the xRAP-D unit. (There are a total of four
circuit breakers on the xRAP-D, supporting redundant power supplies for
up to two XDM platforms.) The power supply flow for two platforms is
illustrated in the following figure.
Figure A-2: xRAP-D power supply flow
The xRAP-D has four 5-pin DC output connectors for supplying redundant
power to any platform in the XDM-1000 or XDM-100 family of products.
The maximum power supplied to each XDM platform is up to 2250 W, in
accordance with the platform type and version.
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Note that with the default configuration, the power cables from the user's
power supply sources to the xRAP-D do not have to be more than 25 mm2
thick, and the circuit breakers do not have to be more than 55A, because the
maximum power consumption per cable is never more than 2250 W.
Previous xRAP units used a single heavy duty power cable to supply power
for up to two XDM platforms. The xRAP-D enables independent power
delivery to two shelves through separate cables, enabling use of thinner
cables and smaller circuit breakers. The xRAP-D was developed in
response to the needs of customers who are not able to support large
aggregate power feeding requirements when supporting two XDM
platforms.
NOTE: Users who prefer to work with a single power cable
from their main power supply (and optionally, a single power

cable from the protective power supply) can still work with a
single cable if they either:
Work with a single 25 mm2 power cable to support a single

XDM platform only, with a maximum of 2250 W for that
platform.
Work with a single 25 mm2 power cable to support two
XDM platforms, where each platform is limited to a
maximum of 1100 W for per platform. This configuration
option requires the use of an optional metal bridge
component designed by ECI for this purpose. (Note that
this configuration option is only available from V7.2, when
the management software enforces limitations on
maximum power consumption.)
Work with a single 50 mm2 power cable to support two
XDM platforms, with a maximum of 2250 W for each
platform. This configuration option requires the use of an
optional metal bridge component designed by ECI for this
purpose.
For more information about the bridge-component

configuration options, see Connecting DC Input Power Cable
to the xRAP-D with a Bridge Component (page 4-53).
The nominal DC power voltage is -48 VDC, ranging to -72 VDC. The
internal circuits of the xRAP-D are powered whenever at least one power
source is connected. The presence of DC power within the xRAP-D is
indicated by a POWER ON indicator.
Each DC power circuit of each platform is protected by a circuit breaker
that also serves as a power on/off switch for the corresponding circuit. The
required circuit breakers are included in the installation parts kit supplied
with the XDM-500 shelves, and therefore their current rating is in
accordance with the order requirements.
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The circuit breakers are installed during the xRAP-D installation. To

prevent accidental changing of a circuit breakers state, the circuit breakers
can be reached easily after opening the front cover of the xRAP-D. The
circuit breaker state (ON or OFF) can be seen through translucent covers.
Bay alarm indications. The xRAP-D includes four alarm indicators, one
for each alarm severity. When alarms of different severities are received
simultaneously, the corresponding alarm indications light simultaneously.
A buzzer is activated whenever a Critical alarm is present in XDM
platforms connected to the xRAP-D.
Connecting external alarms from two XDM platforms, each platform

supporting up to four alarm inputs and four alarm outputs (via dry contacts)
to the customer's central alarm monitoring system. Customers who wish to
define external alarms should refer to the explanation of electrical capacity
requirements for external alarms in the XDM System Specification.
Note that the xRAP-D supports up to eight external alarms. These alarms
are by default allocated four to each platform. ECI offers the option, when
working with a single XDM-1000 platform, to define up to eight external
alarms for that XDM-1000 platform. A second XDM platform cannot be
used with the xRAP-D when working with this configuration, and a special
alarm connection cable must be used. Contact ECI technical support for
more information.
Exporting severity alarms. Two separate groups of severity alarms (a

group of four for each XDM platform) are provided via dry contacts for the
customer's central alarm monitoring system.
Exporting Critical buzzer signals. The Critical alarm signal is provided
via dry contacts to the customer's central alarm monitoring system for
activation of a Critical buzzer. A separate line is provided as well for
muting this buzzer, by connecting the line to a ground with a momentary
switch.
NOTE: Note that the xRAP-D supports the same alarm and
power functions as the xRAP-B and xRAP-HP. When
replacing an existing xRAP-HP with an xRAP-D you must
also use the appropriate xRAP-D accessory kit, including
cables.
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The following figure shows the front panel of the xRAP-D, and the table lists
the functions of the front panel components corresponding to the figure callout
numbers.
Figure A-3: xRAP-D front panel

Table A-2: xRAP-D front panel component functions
A-10
No.
Designation
Function
SOURCE A
Translucent cover for the two circuit breakers (designated

Shelf 1 and Shelf 2 one per XDM platform installed in
the rack). These circuit breakers are used as ON/OFF
power switches and overcurrent protection for the DC
power source A.
TEST
Pushbutton, pressing it activates the buzzer and turns the

indicators on for test purposes.
POWER ON
Green indicator, lights whenever at least one DC power

source is connected to the xRAP-D.
CRITICAL
Red indicator, lights when the severity of an

unacknowledged alarm in the platforms connected to the
xRAP-D is Critical.
MAJOR
Orange indicator, lights when the severity of an

xRAP-D is Major.
MINOR
Yellow indicator, lights when the severity of an

xRAP-D is Minor.
WARNING
White indicator, lights when the severity of an

xRAP-D is Warning.
Buzzer
(concealed under
cover)
Operates when at least one unacknowledged Major or

Critical alarm is present in the platforms connected to the
xRAP-D.
SOURCE B
Same as Item 1 for DC source B.
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The xRAP-D connectors are located on the circuit board, as shown in the
following figure. The table lists the connector functions. The index numbers in
the table correspond to those in the figures.
Figure A-4: xRAP-D connectors

Table A-3: xRAP-D connector functions
No.
Designation
Function
1, 2
Shelf 1 and Shelf 2 Two 5-pin D-type connectors, designated Shelf 1

DC input power
and Shelf 2, used to connect DC power to the
XDM platforms.
ALARMS
68-pin SCSI connector, used to connect an alarm

cable to the customer alarm monitoring system.
This alarm cable transmits the received from the
XDM platforms by the SHELF 1 and SHELF 2
connectors, including external alarm inputs,
external alarm outputs, and XDM severity alarms.
4, 5
SHELF 1 and
SHELF 2
Two 36-pin SCSI connectors, designated SHELF 1

and SHELF 2, used to connect alarm cables to the
XDM platforms installed in the rack. These cables
transmit alarms from the XDM platform to the
xRAP unit.
Alarm signals arrive at a SHELF connector on the xRAP unit from two
different connector sources on the XDM platform using a Y-Cable.
A 9-pin connector on the XDM platform labeled xRAP is used for the four
XDM severity alarms. (CRITICAL, MAJOR, MINOR, and WARNING)
A 50-pin connector on the XDM platform labeled ALARMS is used for

any external alarms defined by client request.
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Maintenance Manual
A Y-Cable is used to link these two connector sources to the single SHELF
connection point on the xRAP, as illustrated in the following figure.
Figure A-5: Y-cable connection
The xRAP-D supports up to eight input plus eight output external alarms.
These alarms are by default allocated four to each platform. ECI offers the
option, when working with a single XDM-1000 platform, to define up to eight
external input plus eight external output alarms for that XDM-1000 platform.
When working with this configuration, a second XDM platform cannot be
connected to the xRAP-D and a special double-Y alarm connection cable
must be used, as illustrated in the following figure. Contact ECI technical
support for more information.
Figure A-6: Double-Y cable connection
A-12
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xRAP-B
NOTE: The xRAP-B is no longer included in new XDM
The xRAP-B is a power distribution and alarm panel for XDM platforms
installed in racks. The xRAP-B performs the following main functions:
Power distribution for one or two XDM-500 platforms. The nominal

DC power voltage is -48 VDC, ranging to -72 VDC. Since XDM-500
platforms can use redundant power sources, the xRAP-B supports
connection to two separate DC power circuits. The internal circuits of the
xRAP-B are powered whenever at least one power source is connected.
The presence of DC power within the xRAP-B is indicated by a POWER
ON indicator.
The xRAP-B has two 5-pin DC output connectors for supplying power to
any platform in the XDM-1000 or XDM-100 family of products. The
maximum power that can be supplied to each XDM platform is up to 2250
W, in accordance with the platform type and version. The xRAP-B uses a
single 50 mm2 power cable to supply up to 4500 W in total to two XDM
platforms.
Each DC power circuit of each platform is protected by a circuit breaker
that also serves as a power on/off switch for the corresponding circuit. The
with the XDM-500 platform, and therefore their current rating is in
The circuit breakers are installed during the xRAP-B installation. To
can be reached only after opening the front cover of the xRAP-B. The
circuit breaker state (ON or OFF) can be seen through translucent covers.
Bay alarm indications. The xRAP-B includes four alarm indicators, one
simultaneously, the corresponding alarm indications light simultaneously.
A buzzer is activated whenever a Major or Critical alarm is present in
XDM platforms installed in the rack.
Connecting alarms from two XDM platforms, each platform with

maximum four alarm inputs and four alarm outputs (via dry contacts) to the
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Maintenance Manual
Exporting severity alarms. Two separate groups of severity alarms (a

group for each XDM platform) are provided via dry contacts for the
Exporting Critical buzzer signals. The Critical alarm signal is provided
via dry contacts to the customer's central alarm monitoring system for
activation of a Critical buzzer. A separate line is provided as well for
muting this buzzer, by connecting the line to a momentary switch.
NOTE: The xRAP-B is backwards compatible with the
xRAP-HP.
The following figure shows the front panel of the xRAP-B, and the table lists
numbers.
Figure A-7: xRAP-B front panel

Table A-4: xRAP-B front panel component functions
A-14
No.
Designation
Function
SOURCE A

SHELF 1 and SHELF 2 one per XDM platform installed
in the rack). These circuit breakers are used as ON/OFF
power switches and overcurrent protection for the DC power
source A.
TEST

POWER ON

source is connected to the xRAP-B.
CRITICAL

xRAP-B is Critical.
MAJOR

xRAP-B is Major.
MINOR

xRAP-B is Minor.
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No.
Designation
Function
WARNING

xRAP-B is Warning.
Buzzer
(concealed under
cover)

Critical alarm is present in the platforms connected to the
xRAP-B.
SOURCE B
The xRAP-B connectors are located on the circuit board, as shown in the
the table correspond to those in the figures.
Figure A-8: xRAP-B connectors

Table A-5: xRAP-B connector functions
No.
Designation
Function
1, 2
Shelves DC input
power
Two 5-pin D-type connectors designated SHELF 1

and SHELF 2 for connecting DC power to XDM
platforms.
ALARMS
68-pin SCSI connector for connecting external

alarm inputs, external alarm outputs, and severity
alarms to the customer alarm monitoring system.
4, 5
SHELF alarms
Two 36-pin SCSI connectors designated SHELF 1

and SHELF 2 for connecting alarm input 26 and
output lines to XDM-500 platforms installed in the
rack.
26
Alarm input lines arrive through the ALARM connector and are connected to the corresponding SHELF
connector.
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Maintenance Manual
xRAP-HP
NOTE: The xRAP-HP is no longer included in new XDM
The xRAP-HP is a power distribution and alarm panel for any two XDM-500
platforms installed in racks. The xRAP-HP performs the following main
functions:
Power distribution to one or two XDM-500 platforms: The nominal DC

power voltage is -48 VDC, ranging to -72 VDC. Since XDM-500 platforms
can use redundant power sources, the xRAP-HP supports connection to two
separate DC power circuits. The internal circuits of the xRAP-HP are
powered whenever at least one power source is connected. The presence of
DC power within the xRAP-HP is indicated by a POWER ON indicator.
Each DC power circuit of each platform is protected by a circuit breaker,
which also serves as a power on/off switch for the corresponding circuit.
The required circuit breakers are included in the installation parts kit
supplied with the XDM-500 platforms, and therefore their current rating is
in accordance with the order requirements. The maximum current that can
be supplied to each XDM-500 platform is 60A.
The circuit breakers are installed during xRAP-HP installation. To prevent
the accidental changing of the circuit breaker state, the circuit breakers can
be reached only after opening the front cover of the xRAP-HP. The circuit
breaker state (ON or OFF) can be seen through translucent covers.
Bay alarm indications: The xRAP-HP includes four alarm indicators, one
for each alarm severity. At any time, only the indicator corresponding to
the highest unacknowledged alarm severity present in the XDM-500
platforms installed in the rack lights.
A buzzer is activated whenever an unacknowledged alarm is present in
XDM-500 platforms installed in the rack.
Connection of maximum eight external alarm sources to XDM-500

platforms installed in the rack, and maximum eight alarm outputs of XDM500 platforms to external alarm monitors, for example, an operator console.
In xRAP-HP units up to Rev.C01, alarm lines are allocated through internal
switches that are set during xRAP-HP installation.
The ground references of the input and output alarm lines on the two sides
of the xRAP-HP are isolated by active circuits located within the
xRAP-HP.
A-16
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The following figure shows the front panel of the xRAP-HP, and the table lists
the functions of the front panel components corresponding to the figure
callouts.
Figure A-9: xRAP-HP front panel

Table A-6: xRAP-HP front panel component functions
No.
Designation
Function
SOURCE A

SHELF 1 and SHELF 2 one per XDM-500 platform installed
in the rack). These circuit breakers are used as ON/OFF power
switches and overcurrent protection for the DC power source A.
Buzzer
Operates when at least one unacknowledged alarm is present in

the platforms connected to the xRAP-HP.
POWER ON
(TEST)
Pushbutton with green indicator, which lights whenever at least

one DC power source is connected to the xRAP-HP.
Pressing the pushbutton activates the buzzer and turns the
CRITICAL
Red indicator, lights when the severity of an unacknowledged

alarm in the platforms connected to the xRAP-HP is Critical.
MAJOR

xRAP-HP is Major.
MINOR

xRAP-HP is Minor.
WARNING
White indicator, lights when the severity of an unacknowledged

alarm in the platforms connected to the xRAP-HP is Warning.
SOURCE B
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Maintenance Manual
The following figure shows the xRAP-HP connectors located on the rear side.
Figure A-10: xRAP-HP connector panel
Note that if you are using an xRAP-HP unit up to Rev.C01, the unit includes
slide switches used to allocate alarm lines. The following figure shows the
xRAP-HP connectors and slide switches located on the rear side.
Figure A-11: xRAP-HP connector and slide switch panel
The following table lists the xRAP-HP connector functions. The index numbers
in the table correspond to those in the preceding figures.
Table A-7: xRAP-HP connectors
No.
Designation
Function
1, 2, 3
EXTERNAL
Three 25-pin D-type connectors, designated SHELF 1,
ALARM/CONTROL SHELF 2, and SHELF 3, for connecting alarm input and output
lines to XDM-500 platforms and other equipment installed in
the rack.
4, 5, 6
RAP
Three 9-pin D-type connectors, designated SHELF 1, SHELF 2,

and SHELF 3, for connecting alarm relays and buzzer activation
lines to XDM-500 platforms and other equipment installed in
the rack.
CONTROL
CONNECTION
50-pin D-type connector for connecting alarm indications and

input and output alarm lines to the customer alarm monitoring
facility.
8, 9, 10, 11
(up to Rev.C01)
1 & 2, 3 & 4, 5 & 6,

7&8
Four slide switches used to route the facility alarm lines to the
input and output lines of the XDM platforms connected to the
xRAP-HP.
Connector pin assignments are defined in detail in Connector Pin Assignments

(page B-1).
A-18
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xRAP-100
The xRAP-100 is a power distribution and alarm panel for XDM and BG
shelves installed in racks. The xRAP-100 performs the following main
functions:
Power distribution for up to four XDM or BG shelves: The nominal DC

power voltage is -48 VDC or -60 VDC. Since XDM and BG shelves can
use redundant power sources, the xRAP-100 supports connection to two
separate DC power circuits. The internal circuits of the xRAP-100 are
powered whenever at least one power source is connected. The presence of
DC power within the xRAP-100 is indicated by a POWER ON indicator.
Each DC power circuit of each shelf is protected by a circuit breaker, which
also serves as a power on/off switch for the corresponding circuit. The
with the XDM or BG shelves, and therefore their current rating is in
The xRAP-100 is designed to support three XDM or BG regular shelves
and one high-power XDM shelf, or four regular XDM or BG shelves. It has
three 3-pin D-type connectors and one 5-pin D-type high-power connector
for feeding the shelves. Each 3-pin connector can supply power to one of
the following regular shelves:
XDM-50
XDM-100
XDM-500
XDM-40
Any BG shelf
The 5-pin high-power connector can supply power to one of the above
regular shelves, or to one of the following high-power shelves:
XDM-300
XDM-900
XDM-1000
XDM-2000
NOTE: When a regular XDM or BG shelf has to be
connected to the 5-pin connector, use a 5-pin D-type male to
3-pin D-type female adapter cable.
The circuit breakers are installed during the xRAP-100 installation. To

can be reached only after opening the front cover of the xRAP-100. The
circuit breaker state (ON or OFF) can be seen through the cover.
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Maintenance Manual
Bay alarm indications: The xRAP-100 includes four alarm indicators, one
simultaneously, the different alarm indications light simultaneously.
NOTE: BG shelves support only two alarm indications:
Major and Minor.
A buzzer is activated whenever a Major or Critical alarm is present in
XDM shelves connected to the xRAP-100. In case of BG shelves connected
to the xRAP-100, the buzzer is activated whenever a Major alarm is present
in the BG shelves.
Connection of alarms from up to four XDM or BG shelves, each shelf

with maximum four alarm inputs and two alarm outputs.
The following figure shows the front panel of the xRAP-100, and the table lists
numbers.
Figure A-12: xRAP-100 front panel

Table A-8: xRAP-100 front panel component functions
A-20
No.
Designation
Function
SOURCE A
Four circuit breakers (designated SHELF 1, SHELF 2,

SHELF 3, and SHELF 4 one per XDM-500 shelf installed
in the rack). These circuit breakers are used as ON/OFF
power switches and overcurrent protection for the DC power
source A.
--
Buzzer
(Concealed under Critical alarm is present in the shelves connected to the
cover)
xRAP-100.
TEST

POWER ON

source is connected to the xRAP-100.
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No.
Designation
Function
CRITICAL
Red indicator, lights when the severity of an alarm in the

shelves connected to the xRAP-100 is Critical.
MAJOR
Orange indicator, lights when the severity of an alarm in the

shelves connected to the xRAP-100 is Major.
MINOR
Yellow indicator, lights when the severity of an alarm in the

shelves connected to the xRAP-100 is Minor.
WARNING
White indicator, lights when the severity of an alarm in the

shelves connected to the xRAP-100 is Warning.
SOURCE B
The xRAP-100 connectors are located on its circuit board, as shown in the
the table correspond to those in the figure.
Figure A-13: xRAP-100 connectors

Table A-9: xRAP-100 connectors
No.
Designation
Function
1, 2, 3, 4
Shelf alarms
Four 36-pin SCSI connectors designated SHELF 1,

SHELF 2, SHELF 3, and SHELF 4, for connecting
alarm input and output lines to XDM or BG shelves
and other equipment installed in the rack
ALARM IN/OUT
68-pin SCSI connector, for connecting alarm input

and output lines to the customer alarm monitoring
facility
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Maintenance Manual
No.
Designation
Function
6, 7, 8
Shelves DC input
power
Three 3-pin D-type connectors designated Shelf 1,

Shelf 2, and Shelf 3 for connecting DC power to
XDM or BG shelves
Shelf DC input,
high power
5-pin D-type connector designated Shelf 4 for

connecting a high-power XDM, or a regular XDM
or BG shelf
miniRAP
The miniRAP is a power distribution and alarm panel for low-power XDM
shelves and other low-power communication shelves installed in racks. The
miniRAP supports the following main functions:
Power distribution for a single shelf. The nominal DC power voltage is

-48 VDC, ranging to -72 VDC. To provide power input redundancy, the
miniRAP supports connection to two separate DC power circuits. The
internal circuits are powered whenever at least one power source is
connected. The presence of DC power within the miniRAP is indicated by
a POWER ON indicator.
Each DC power circuit of the shelf is protected by a circuit breaker, which
also serves as a power on/off switch for the corresponding circuit. The
with the shelf, and therefore their current rating is in accordance with the
order requirements. The maximum current that can be supplied to the shelf
fed from the miniRAP is 30A.
The circuit breakers are installed with the miniRAP. To prevent an
accidental change to their state, they can be reached only after opening the
front cover of the miniRAP. The state (ON or OFF) can be seen through
translucent covers.
Bay alarm indications. The miniRAP has four alarm indicators, one for
each alarm severity. When alarms of different severities are received
simultaneously, the different indicators light simultaneously.
A buzzer is activated when a Major or Critical alarm is present in the shelf
installed in the rack.
A-22
Connection of the shelf's severity alarms. These alarms can also be

connected to a customer's alarm collection facility.
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The following figure shows the front panel of the miniRAP, and the table lists
numbers.
Figure A-14: miniRAP front panel

Table A-10: miniRAP component functions
No.
Designation
Function
SOURCE A
Translucent cover for the circuit breaker. The circuit breaker

is used as an ON/OFF power switch and overcurrent
protection for DC power source A.
TEST

POWER ON
Green indicator, lights when at least one DC power source is

connected to the miniRAP.
CRITICAL

unacknowledged alarm in the shelf connected to the
miniRAP is Critical.
MAJOR
Orange indicator, lights when an unacknowledged alarm

severity present in the shelf connected to the miniRAP is
Major.
MINOR

miniRAP is Minor.
WARNING

miniRAP is Warning.
SOURCE B
Same as Item 1 for DC power source B.
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Maintenance Manual
The miniRAP connectors are located on its circuit board. The table lists the
connector functions. The index numbers in the table correspond to those in the
figure.
Figure A-15: miniRAP connectors

Table A-11: miniRAP connector functions
A-24
No.
Designation
Function
1, 4
Shelf DC input power
3-pin D-type connectors, for connecting DC

power to the communication shelf.
SEVERITY IN
9-pin D-type connector, for connecting the

shelf severity alarms output.
SEVERITY OUT
9-pin D-type connector, for connecting the

severity alarms to the customer's alarm
collecting facility.
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FST
The Fiber Storage Tray (FST) is used to store surplus optical fiber. The FST
can hold up to 48 2-mm (.08 in.) fibers, where each stored fiber can be up to
2.5 meters (8.1 feet) long.
The following figure shows a front view of the FST. The Fiber Storage Tray
top view (page A-25) shows a top view of the FST, together with typical paths
to be followed when fibers are inserted for storage in the tray.
Figure A-16: Fiber Storage Tray front view
The FST is opened simply by momentarily pressing on its panel. For

convenience, it can be opened in two positions:
Halfway, the first click when pulling the tray out
Completely, by pressing the release handles at the two sides (to enable
threading the fibers in the tray)
Figure A-17: Fiber Storage Tray top view
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Maintenance Manual
Heat Buffer
Heat buffers must always be used in the following circumstances:
With the XDM-450 shelf
When using more than one shelf in a single rack
The heat buffer used for XDM-500 shelves is a 1U high unit installed below
the XDM-500 equipment shelf to provide thermal isolation. The heat buffer is
fastened to the rack rails under the shelf.
The following figure shows a typical XDM-500 heat buffer.
Figure A-18: Heat buffer
Cable and Fiber Guiding

Accessories
Different guides are available for the various XDM platforms.
Cable Guide
The cable guides for XDM-500 platforms are used to help neatly route E1
tributary cables connecting to the panels of M2_21 and M2_84 electrical
interface modules.
The cable guide is fastened to the rack side rails just over the top of the lower
card cage. To ease cable insertion, the top bar can be removed by pulling out
two spring-loaded knobs at the two sides.
Figure A-19: Typical cable guide
A-26
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XDM Accessories
Optical Fiber Guides

The optical fiber guides for XDM-500 platforms are used to help neatly route
the fibers that connect to the panels of the optical cards and modules installed
in the platforms and prevent sharp bends.
Two types of optical fiber guides are available: one for 19 in. racks, and
another for ETSI racks. Each of these guides is illustrated here.
The fiber guides are fastened to the rack side rails over the top of the lower
card cage.
Figure A-20: Fiber guide for 19-inch rack
Figure A-21: Fiber guide for ETSI rack
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Maintenance Manual
Cable Guiding Rods

To keep the cables neatly arranged between the rack rails and prevent sharp
bends, ECI offers cable guiding rods. The following figure shows a typical
cable guiding rod, as supplied by ECI.
The supplied items include:
Clamp, attached with two screws to the rear rack rail.
The rod itself, which is inserted through the front rack rail into the clamp.
Plastic drum, needed only when the rod is used to route fibers. The drum,
which fits snugly over the rod, must be inserted over the rod before its rear
end is inserted into the clamp.
Figure A-22: Typical cable guiding rod
The following figure shows how to use the rod with fibers.
Figure A-23: Using the rod for guiding fibers
A-28
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The following figure shows how to use the rod with cables (in this case, the
plastic drum is not used and may be discarded).
Figure A-24: Using the rod for guiding cables
Optical Distribution Frames

(ODFs)
The large number of optical fibers that are typically connected to an XDM
platform requires reliable connection arrangements. ECI recommends using
ODFs installed in the XDM racks to terminate the external fibers with the
desired type of optical connectors. Two units are offered: a standard unit and a
high power unit.
Standard ODF
When there are a large number of optical fibers connected to an XDM,
additional connection arrangements may be required.
ECI recommends using an ODF installed in the XDM racks to terminate the
external fibers with the proper optical connectors.
The ODF provides a flexible and reliable solution for interfacing between
outside plant optical fiber cables and fiber optical terminal equipment. It is
designed to handle termination, splicing, and storage for excess length of
pigtails and patch cords.
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Maintenance Manual
The unit is 1U high, and can be installed in ETSI A racks, as well as in 19"
racks using its configurable rack mounting brackets. An additional set of
brackets supplied with the installation kit enables installation in 23 in. 7 ft. bay
racks. The ODF is available with 12 or 24 ports, and SC, FC, or LC connectors.
Figure A-25: ODF internal view
All fiber connections are made on a swing-out tray that opens to the right at 90
and houses the splicing trays, optical adapter panels, and the fiber support. Left
side tray opening is available per order. The swing-out tray enables quick and
easy access to all internal parts for connection or maintenance activities. The
fiber connections are protected by a front cover, which latches to the assembly
and prevents unintended disconnection of fibers.
Figure A-26: ODF front panel
Optical terminal fibers can enter the ODF from the right or left side and be
connected to the optical adapters from one side. Pigtails connect to the adapters
from the other side. Excess length of pigtails and patch cords are threaded on a
fiber support that maintains the minimum bend radius to prevent fiber breaks.
A durable and robust tube leads the external fibers cable to the swing-out tray
and protects them from breaks. The adapters are arranged on panels in groups
of four or two (depending on the total number of ports). A large space between
the adapters enables easy access to each individual fiber and quick
reconfiguration.
A-30
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XDM Accessories
ODF_HP
Overview
ODF_HP is an optical distribution frame for fibers carrying high-power optical
signals (Hazard Level 3B). A typical application for the ODF_HP is to handle
the connections to the line side of the OFA_R Raman amplifiers.
The ODF_HP is a 1U high unit, ready for installation in 19 in. racks. ECI also
offers adapter brackets for installation in ETSI racks.
The following figure shows a general view of an ODF_HP ready for
installation in rack.
Figure A-27: ODF_HP general view
For safety, all fiber connections are made within the ODF_HP on special fiber
trays behind a lockable front panel.
The ODF_HP can be ordered with 1 or 2 fiber trays.
A fiber tray has twelve 250 mm (10 in.) fiber pigtails, each one terminating in
an E2000HP connector. The free ends of the pigtails are ready for splicing.
Therefore, ODF_HP has a capacity of up to 24 fibers in the 1U rack space.
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Maintenance Manual
Physical description
The following figure shows a general view of a typical ODF_HP with its front
panel open, and identifies the various components.
Figure A-28: ODF_HP view with open panel
After the panel is opened, it is possible to slide out the internal fiber trays (the
previous figure shows the top tray in the fully retracted position). Fibers enter
the ODF_HP through a wide opening located on the right-hand side, and
connect to the connectors located on the fiber tray. Make sure the protective
caps are installed on the connectors at all times until fibers are connected to
them.
The connectors are terminated in pigtails stored within the tray (see detail in
the following figure). The other set of fibers, usually formed in a harness, enter
the ODF_HP through an opening on the left-hand side, and are spliced to the
pigtails. The tray has a support comb for splices.
For convenience, the fibers can be identified on the labels located on the lid of
the fiber tray.
Figure A-29: Detailed view of fiber tray with lid removed
A-32
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XDM Accessories
Digital Distribution Frames

(DDF)
fSThe DDF units offered by ECI are a convenient and reliable method for
connecting the large number of tributary cables that are typically connected to
an XDM platform, especially when handling E1 tributaries. All DDF versions
can be installed in both ETSI and 19 in. racks, and feature cable identification
arrangements.
DDF for Balanced Interfaces

ECI offers a 3U high DDF unit for connection to balanced E1 interfaces. The
following figure shows a general view of this unit.
Figure A-30: Typical 84-channel DDF unit for balanced E1 interfaces general view
This DDF has a capacity of 84 E1 lines. The E1 cables are terminated in

standard blocks; the blocks can also be ordered with terminations for the cable
shields.
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Maintenance Manual
DDF for Unbalanced Interfaces

ECI offers 2U and 4U high DDF units for connection to unbalanced E1
interfaces. The following figure shows general views of a typical 2U high unit.
As seen in part B of the figure, the functions of the various connectors are
clearly marked.
Figure A-31: DDF general view with cover closed
Figure A-32: DDF general view with cover open
The 2U high DDF has a capacity of 14 E1 lines; the 4U high unit has a capacity
of 28 E1 lines. Each DDF can be ordered with BNC, BT43, or DIN 1.6/5.6 mm
connectors. The DDF has internal balanced/unbalanced (120 /75 )
impedance converters, and therefore allows connecting user's equipment with
unbalanced interfaces to the balanced interfaces of M2_84 electrical interface
modules. U links terminated in the appropriate connectors (BNC, BT43, or
DIN 1.6/5.6 mm) can be used to connect directly between the corresponding
sets of connectors. U links with monitoring connectors can also be ordered.
A-34
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XDM Accessories
DDF Units with Built-in Patch Panel

The DDF with built-in patch panel is available as 2U high units with a capacity
of 28 E1 lines. This DDF is similar to the regular DDF described previously,
except that it includes two sets of connectors for each E1 line: one set for the
user's equipment side and the other set for the XDM side. Customers can then
use short coaxial patch panels to route any incoming E1 line to any XDM E1
interface.
Patch Panel for Balanced Interfaces

ECI offers a 3U high patch panel unit for connection to balanced E1 interfaces.
The following figure shows general front and rear views of this unit.
Figure A-33: Typical 84-channel patch panel for balanced E1 interfaces general
views
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Maintenance Manual
This patch panel has a capacity of 84 E1 lines:
The user's E1 cables are connected to standard 25-pin D-type male

connectors located on the front panel. Twelve pairs of connectors are used,
where each pair carries seven channels. For each group of channels, the
OUT/ab connector carries the transmit pairs and the IN/an connector
carries the receive pairs.
The E1 cables routed within the rack to E1 tributary modules, for example,
to the connectors located on the M2_84 panels, are connected to six 68-pin
SCSI female connectors. Each connector supports 14 E1 interfaces. The
tributaries supported by each connector are marked near each connector:
1-14, 15-28, 29-42, 43-56, 57-70, and 71-84.
For information on connector pin allocation, refer to Connector Pin

Assignments (page B-1).
A-36
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B
Connector Pin Assignments
In this appendix:
Overview ........................................................................................................ B-1
Platform Connectors ....................................................................................... B-2
xECB Connectors ........................................................................................... B-5
MECP Connectors ........................................................................................ B-10
ACP Connectors ........................................................................................... B-11
M2_84 Interface Module Connection Data .................................................. B-12
Alarms Handling Principles.......................................................................... B-19
xRAP-D Connectors ..................................................................................... B-21
xRAP-HP Connectors ................................................................................... B-28
xRAP-100 Connectors .................................................................................. B-34
miniRAP Connectors .................................................................................... B-40
Overview
This appendix provides connection data for user connectors located in XDM
platforms and associated ancillary equipment supplied by ECI. Optical and
coaxial connectors are described in the XDM-1000 Product Line Reference
Manual.
Any connectors not described in this appendix are reserved for use by ECI's
technical support personnel and/or for future expansion, and therefore no user
equipment may be connected to them.
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Maintenance Manual
Platform Connectors
This section presents information on the platform connectors. See other
sections for information on connectors of the various cards and modules.
DC Input Power Connectors

The DC input power connectors, designated POWER IN, are 3-pin or 5-pin
D-type male connectors located on the xINF panel. The following figures
identify the functions of the POWER IN connector pins as seen when looking
into the connector.
Figure B-1: 3-pin power connector
B-2
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Maintenance Manual
ALARMS Connector
This connector is a 50-pin D-type male connector that carries two groups of
lines:
Eight platform alarm output lines referenced to the platform ground. Each
output is provided by the open collector of an optocoupler, and its active
state is the low logic level.
Eight platform alarm input lines referenced to the platform ground

monitored by the XDM management subsystem. Each input is connected to
the input diode of an optocoupler.
The ALARMS connector connects to one of the SHELF EXTERNAL

ALARM/CONTROL connectors (page B-28).
The following figure identifies the connector pins as seen when looking into
the connector. The following table lists the pin assignment for the ALARMS
connector.
Figure B-3: ALARMS connector pin identification

Table B-1: ALARMS connector pin assignment
Pin
Designation
Function
Pin
Designation
Function
Direction
ALM_OP1
Alarm output 1 Output
Direction
34
ALM_IP1
Alarm input 1
Input
GND
Ground
35
GND
Ground
ALM_OP2
36
ALM_IP2
Alarm input 2
Input
GND
Ground
37
GND
Ground
ALM_OP3
38
ALM_IP3
Alarm input 3
Input
GND
Ground
39
GND
Ground
ALM_OP4
40
ALM_IP4
Alarm input 4
Input
GND
Ground
41
GND
Ground
ALM_OP5
42
ALM_IP5
Alarm input 5
Input
10
GND
Ground
43
GND
Ground
11
ALM_OP6
44
ALM_IP6
Alarm input 6
Input
12
GND
Ground
45
GND
Ground
13
ALM_OP7
46
ALM_IP7
Alarm input 7
Input
14
GND
Ground
47
GND
Ground
15
ALM_OP8
48
ALM_IP8
Alarm input 8
Input
16
GND
Ground
49
GND
Ground
17-33
Not connected
50
Not connected
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Maintenance Manual
xRAP Connector
The xRAP connector is a 9-pin D-type female connector that carries the
platform alarm outputs and a buzzer control line. All the outputs are referenced
to a common line, which is floating relative to the chassis ground.
This connector is intended for connection to one of the xRAP connectors.
the connector. The following table lists the pin assignment for the xRAP
connector.
Figure B-4: RAP connector pin identification

Table B-2: RAP connector pin assignment
B-4
Pin
Designation
Function
Direction
Critical
Critical alarm
Output
Not connected
Major
Major alarm
Output
Not connected
Minor
Minor alarm
Output
Common
Common reference for all the outputs
Warning
Warning
Output
Not connected
Buzzer
Audio alarm activation line
Output
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Maintenance Manual
xECB Connectors
This section provides information on the connectors located on the xECB
panels.
F-CHANNEL Connector
The F-CHANNEL connector is a 9-pin D-type male connector that provides a
serial RS-232 communication channel supporting the SLIP protocol. This
connector is intended for connection to an LCT-XDM service terminal. The
connection is made using a crossed cable to one of the serial RS-232 ports of
the PC serving as an LCT-XDM terminal.
the connector. The following table lists the connector pin assignment, together
with the corresponding pin in the LCT-XDM serial RS-232 port (assuming that
this port uses a 9-pin connector).
Figure B-5: F-CHANNEL connector pin identification

Table B-3: F-CHANNEL connector pin assignment
Pin
Name
Function
Direction
LCT-XDM serial port pin
Not connected
Not connected
COM-F-RX
F-channel receive
Input
Pin 3 (transmit output)
COM-F-TX
F-channel transmit
Output
Pin 2 (receive input)
Not connected
Not connected
GND
Ground
Pin 5 (ground)
6, 7,
8, 9
Not connected
Not connected
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Maintenance Manual
T3_1/T4_1 and T3_2/T4_2 Connectors

The T3_1/T4_1 and T3_2/T4_2 connectors are 9-pin D-type male connectors,
each with two groups of lines:
Clock input (T3 2.048 MHz/2.048 Mbps signal)
Clock output (T4 2.048 MHz/2.048 Mbps signal)
The MAIN connector serves the main TMU, and the PROTECT connector
serves the standby (protection) TMU. These connectors are intended for
connection to the site timing reference distribution subsystem.
the connector. The following table lists their pin assignment.
Figure B-6: T3_1/T4_1 and T3_2/T4_2 connector pin identification

Table B-4: T3_1/T4_1 and T3_2/T4_2 connector pin assignment
B-6
Pin
Name
Function
Direction
SHIELD
Shield
CK_2M_MIL
Clock input, low
Input
SHIELD
Shield
CK_2M_MOL
Clock output, low
Output
Not connected
CK_2M_MIH
Clock input, high
Input
SHIELD
Shield
CK_2M_MOH
Clock output, high
Output
Not connected
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Maintenance Manual
OW Connector
The OW connector is an RJ-11 connector that provides access to the 4W
analog interface to the platform's engineering orderwire facility. The analog
signals are digitized using standard 64 kbps PCM for transmission in the SDH
overhead (bytes E1 and E2, as configured by the management station).
This connector enables the connection of a standard handset or other voice
frequency equipment serving the OW.
The following figure identifies the connector pins. The following table lists the
pin assignment for the OW connector.
Figure B-7: OW connector pin identification

Table B-5: OW connector pin assignment
Pin
Name
Function
Direction
OW_TX1
Orderwire transmit pair, wire +
Output
OW_TX2
Orderwire transmit pair, wire -
Output
OW_RX1
Orderwire receive pair, wire +
Input
Not connected
OW_RX2
Orderwire receive pair, wire -
Input
Not connected
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Maintenance Manual
OHA Connector
The OHA connector is a 50-pin D-type male connector with the following
hardware interfaces:
Two data channels with V.11 interface operating at rates up to 768 kbps
(software configurable). These channels are intended to provide access to
the auxiliary DCC bytes in the SDH overhead, and therefore provide a clear
transmission path for user payload, for example, for carrying traffic of
management stations using proprietary protocols.
Two 64 kbps G.703 codirectional channels. These channels are intended to

provide digital access to the OW, subject to the corresponding management
station configuration.
the connector. The following table lists the pin assignment for the OHA
connector.
NOTE: Current XDM software versions do not support any
of the protocols of the OHA connector. This section is for
informative purposes only.
Figure B-8: OHA connector pin identification

Table B-6: OHA connector pin assignment
B-8
Pin
Name
Function
Direction
OHA-GRP1
OHA G.703 channel 1, receive pair, wire +
Input
OHA-GTN1
OHA G.703 channel 1, transmit pair, wire -
Output
GND
Ground
OHA-VTA1
OHA V.11 channel 1, transmit pair, wire A
Output
OHA-VTB1
OHA V.11 channel 1, transmit pair, wire B
Output
OHA-VIA1
OHA V.11 channel 1, indicator pair, wire A
Output
OHA-VTA2
OHA V.11 channel 2, transmit pair, wire A
Output
OHA-VTB2
OHA V.11 channel 2, transmit pair, wire B
Output
OHA-VIA2
OHA V.11 channel 2, indicator pair, wire A
Output
10
OHA-VDA2
OHA V.11 channel 2, clock pair, wire A
Output
11-17
Reserved for future use
18
OHA-GRP1
Input
19
OHA-GRN1
OHA G.703 channel 1, receive pair, wire -
Input
20
OHA-GRN2
OHA G.703 channel 2, receive pair, wire -
Input
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Maintenance Manual
Pin
Name
Function
Direction
21
OHA-VRA1
OHA V.11 channel 1, receive pair, wire A
Input
22
OHA-VRB1
OHA V.11 channel 1, receive pair, wire B
Input
23
OHA-VIB1
OHA V.11 channel 1, indicator pair, wire B
Output
24
OHA-VRA2
OHA V.11 channel 2, receive pair, wire A
Input
25
OHA-VRB2
OHA V.11 channel 2, receive pair, wire B
Input
26
OHA-VIB2
OHA V.11 channel 2, indicator pair, wire B
Output
27
OHA-VDB2
OHA V.11 channel 2, clock pair, wire B
Output
28-33
34
OHA-GTP2
OHA G.703 channel 2, transmit pair, wire +
Output
35
OHA-GTN2
OHA G.703 channel 2, transmit pair, wire -
Output
36
OHA-GRP2
Input
37
OHA-VCA1
OHA V.11 channel 1, control pair, wire A
Input
38
OHA-VCB1
OHA V.11 channel 1, control pair, wire B
Input
39
OHA-VDA1
OHA V.11 channel 1, timing pair, wire A
Output
40
OHA-VDB1
OHA V.11 channel 1, timing pair, wire B
Output
41
OHA-VCA2
OHA V.11 channel 2, control pair, wire A
Input
42
OHA-VCB2
OHA V.11 channel 2, control pair, wire B
Input
43-46
47
SHIELD
Shield
48-50
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B-9

Maintenance Manual
MECP Connectors
This section provides information on the connectors located on the MECP
panels.
Ethernet Connectors
The two ETHERNET connectors on the MECP panel, designated MNG MAIN
and MNG PROT, are 8-pin RJ-45 connectors that provide two Ethernet
10BaseT management interfaces (one for each xMCP card installed in the
XDM platform). At any time, only the interface connected to the xMCP card
serving as the current main card is active; the interface connected to the xMCP
card serving as the protection card is in standby to provide protection for the
out-of-band management traffic.
Each ETHERNET connector is wired as a station port for direct connection
through a straight cable to a port of a 10BaseT Ethernet hub.
the connector.
Figure B-9: MECP ETHERNET connector pin identification
The following table lists the pin assignment for a typical connector.
Table B-7: ETHERNET connector pin assignment
B-10
Pin
Designation
Function
Direction
TX+
Transmit + wire
Output
TX-
Transmit - wire
Output
RX+
Receive + wire
Input
4, 5
N/C
Not connected
RX-
Receive - wire
FGND
Frame ground
N/C
Not connected
Input
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Maintenance Manual
OW Connector (MECP_OW and

MECP_OCxxOW)
The OW connector, included only on the MECP_OW and MECP_OCxxOW
versions, is an RJ-11 connector that is functionally connected in parallel with
the OW connector located on the xECB panel. For a description refer to OW
Connector (page B-7).
ACP Connectors
The Ethernet connectors on the ACP card are 10-pin RJ-45 connectors.
the connector.
Figure B-10: ACP900 connector pin identification
The following table lists the pin assignment for a typical connector.
Table B-8: ACP900 Ethernet connector pin assignments
Pin
Designation
Function
Direction
RX+
Receive + wire
Input
RX-
Receive - wire
Input
3, 4
VCC
Power 3.3 V
TX+
Transmit + wire
Output
TX-
Transmit - wire
Output
LED_RA
Indicator light
LED_RC
Indicator light
LED_LA
Indicator light
10
LED_LC
Indicator light
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B-11

Maintenance Manual
M2_84 Interface Module

Connection Data
M2_84 Interface Module Connectors
The M2_84 electrical interface modules, which provide 84 balanced or
unbalanced E1 tributary interfaces for PIO2-84 cards, have six 68-pin SCSI
female connectors. Each connector supports 14 E1 interfaces. The tributaries
supported by each connector are marked alongside the connector: 1-14, 15-28,
28-42, 43-56, 57-70, and 71-84.
the connector.
Figure B-11: M2_84 14-tributary connector pin identification
The following table lists the pin assignment for a typical connector (for
unbalanced interfaces, wire A is the center (tip) conductor, and wire B is the
shield or ring). The table also lists the color of the wire connected to the
corresponding pin in the cables offered by ECI for connecting between the
tributary connector and a distribution frame.
The tributary numbers appearing in the table are given for the 1-14 connector.
To obtain the correct tributary numbers for other connectors, interpret the
numbers as representing the number of the tributary in its group (for example,
in connector 43-56, 6 represents E1 tributary 48).
Table B-9: M2_84B interface module, 14-tributary connector pin assignment
B-12
Pin
Name
Function
Direction
Wire color
RX1-A
Receive, tributary 1, wire A
Input
Brown
RX1-B
Receive, tributary 1, wire B
Input
Brown/gray ring
TX2-A
Transmit, tributary 2, wire A
Output
Red
TX2-B
Transmit, tributary 2, wire B
Output
Red/gray ring
GND
Shield
Light-gray/yellow ring
TX3-A
Output
Orange
TX3-B
Output
Orange/gray ring
RX4-A
Input
Yellow
RX4-B
Input
Yellow/gray ring
10
GND
Shield
White/yellow ring
11
RX5-A
Input
Green
12
RX5-B
Input
Green/gray ring
13
TXG-A
Output
Blue
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Maintenance Manual
Pin
Name
Function
Direction
Wire color
14
TXG-B
Output
Blue/gray ring
15
GND
Shield
Brown/blue ring
16
TX7-A
Output
Violet
17
TX7-B
Output
Violet/gray ring
18
RX8-A
Input
White
19
RX8-B
Input
White/gray ring
20
GND
Shield
Red/blue ring
21
RX9-A
Input
Pink
22
RX9-B
Input
Pink/gray ring
23
TX10-A
Output
Brown/white ring
24
TX10-B
Output
Red/white ring
25
Not connected
26
TX11-A
Output
Orange/white ring
27
TX11-B
Output
Yellow/white ring
28
RX12-A
Input
Green/white ring
29
RX12-B
Input
Blue/white ring
30
Not connected
31
RX13-A
Input
Violet/white ring
32
RX13-B
Input
Light-gray/white ring
33
TX14-A
Output
Red/brown ring
34
TX14-B
Output
Yellow/brown ring
35
TX1-A
Transmit pair, tributary 1, wire A
Output
Orange/brown ring
36
TX1-B
Output
Green/brown ring
37
RX2-A
Input
Blue/brown ring
38
RX2-B
Input
Violet/brown ring
39
Not connected
40
RX3-A
Input
Light-gray/brown ring
41
RX3-B
Input
Pink/brown ring
42
TX4-A
Output
Brown/red ring
43
TX4-B
Output
Light-gray/red ring
44
Not connected
45
TX5-A
Output
Yellow/red ring
46
TX5-B
Output
Green/red ring
47
RX6-A
Input
Blue/red ring
48
RX6-B
Input
Violet/red ring
49
Not connected
50
RX7-A
Input
White/red ring
51
RX7-B
Input
Pink/red ring
52
TX8A
Output
Brown/green ring
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B-13

Maintenance Manual
Pin
Name
Function
Direction
Wire color
53
TX8-B
Output
Light-gray/green ring
54
Not connected
55
TX9A
Output
Yellow/green ring
56
TX9-B
Output
Orange/green ring
57
RX10-A
Input
Violet/green ring
58
RX10-B
Input
Blue/green ring
59
Not connected
60
RX11-A
Input
Pink/green ring
61
RX11-B
Input
White/green ring
62
TX12A
Output
Brown/yellow ring
63
TX12-B
Output
Red/yellow ring
64
Not connected
65
TX13A
Output
Orange/yellow ring
66
TX13-B
Output
Green/yellow ring
67
RX14-A
Input
Blue/yellow ring
68
RX14-B
Input
Violet/yellow ring
E1 Patch Panel Data

ECI offers a dedicated patch panel for balanced E1 interfaces. This panel
supports all the 84 E1 interfaces available on M2-84B modules. The
connections to the patch panel are organized as follows:
B-14
Each group of 14 E1 interfaces is supported by one 68-SCSI female

connector on the rear wall of the patch panel for a total of six connectors.
Each of these connectors uses the same pin assignment as the 68-pin SCSI
connectors of the M2_84B modules.
Each 68-pin SCSI connector is connected to two pairs of 25-pin D-type

male connectors on the front side of the patch panel. Each pair supports
seven interfaces, with the transmit lines located in the OUT/ab connector
and the receive line in the IN/an connector.
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Maintenance Manual
The following table lists the patch panel wiring, that is, the connections
between the 68-pin SCSI connectors and the 25-pin D-type connectors.
Table B-10: Patch panel wiring
SCSI pin
Name
Function
Direction
D-type pin
RX1-A
Receive, tributary 1,
wire A
Input
IN/an (1-7)
Pin 2
RX1-B
wire B
Input
IN/an (1-7)
Pin 1
TX2-A
Transmit, tributary 2,
wire A
Output
OUT/ab (1-7)
Pin 16
TX2-B
wire B
Output
OUT/ab (1-7)
Pin 15
GND
Shield
OUT/ab (8-14)
Pin 13
TX3-A
wire A
Output
OUT/ab (1-7)
Pin 5
TX3-B
wire B
Output
OUT/ab (1-7)
Pin 4
RX4-A
wire A
Input
IN/an (1-7)
Pin 19
RX4-B
wire B
Input
IN/an (1-7)
Pin 18
10
GND
Shield
IN/an (8-14)
Pin 13
11
RX5-A
wire A
Input
IN/an (1-7)
Pin 8
12
RX5-B
wire B
Input
IN/an (1-7)
Pin 7
13
TXG-A
wire A
Output
OUT/ab (1-7)
Pin 22
14
TXG-B
wire B
Output
OUT/ab (1-7)
Pin 21
15
GND
Shield
OUT/ab (1-7)
Pins 3, 6, 9,
13, 14, 17, 20,
23
16
TX7-A
wire A
Output
OUT/ab (1-7)
Pin 11
17
TX7-B
wire B
Output
OUT/ab (1-7)
Pin 10
18
RX8-A
wire A
Input
IN/an (8-14)
Pin 2
19
RX8-B
wire B
Input
IN/an (8-14)
Pin 1
417006-2304-0H3-B02
B-15
B-16

Maintenance Manual
SCSI pin
Name
Function
Direction
D-type pin
20
GND
Shield
IN/an (1-7)
Pins 3, 6, 9,
13, 14, 17, 20,
23
21
RX9-A
wire A
Input
IN/an (8-14)
Pin 16
22
RX9-B
wire B
Input
IN/an (8-14)
Pin 15
23
TX10-A

wire A
Output
OUT/ab (8-14)
Pin 5
24
TX10-B

wire B
Output
OUT/ab (8-14)
Pin 4
25
Not connected
26
TX11-A

wire A
Output
OUT/ab (8-14)
Pin 19
27
TX11-B

wire B
Output
OUT/ab (8-14)
Pin 18
28
RX12-A Receive, tributary 12,

wire A
Input
IN/an (8-14)
Pin 8
29
RX12-B

wire B
Input
IN/an (8-14)
Pin 7
30
Not connected
31

wire A
Input
IN/an (8-14)
Pin 22
32
RX13-B

wire B
Input
IN/an (8-14)
Pin 21
33
TX14-A

wire A
Output
OUT/ab (8-14)
Pin 11
34
TX14-B

wire B
Output
OUT/ab (8-14)
Pin 10
35
TX1-A
Transmit pair,
tributary 1, wire A
Output
OUT/ab (1-7)
Pin 2
36
TX1-B
wire B
Output
OUT/ab (1-7)
Pin 1
37
RX2-A
wire A
Input
IN/an (1-7)
Pin 16
38
RX2-B
wire B
Input
IN/an (1-7)
Pin 15
39
Not connected
40
RX3-A
wire A
Input
IN/an (1-7)
Pin 5
41
RX3-B
wire B
Input
IN/an (1-7)
Pin 4
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Maintenance Manual
SCSI pin
Name
Function
Direction
D-type pin
42
TX4-A
wire A
Output
OUT/ab (1-7)
Pin 19
43
TX4-B
wire B
Output
OUT/ab (1-7)
Pin 18
44
Not connected
45
TX5-A
wire A
Output
OUT/ab (1-7)
Pin 8
46
TX5-B
wire B
Output
OUT/ab (1-7)
Pin 7
47
RX6-A
wire A
Input
IN/an (1-7)
Pin 22
48
RX6-B
wire B
Input
IN/an (1-7)
Pin 21
49
Not connected
50
RX7-A
wire A
Input
IN/an (1-7)
Pin 11
51
RX7-B
wire B
Input
IN/an (1-7)
Pin 10
52
TX8A
wire A
Output
OUT/ab (8-14)
Pin 2
53
TX8-B
wire B
Output
OUT/ab (8-14)
Pin 1
54
Not connected
55
TX9A
wire A
Output
OUT/ab (8-14)
Pin 16
56
TX9-B
wire B
Output
OUT/ab (8-14)
Pin 15
57

wire A
Input
IN/an (1-7)
Pin 5
58
RX10-B

wire B
Input
IN/an (1-7)
Pin 4
59
Not connected
60

wire A
Input
IN/an (8-14)
Pin 19
61
RX11-B

wire B
Input
IN/an (8-14)
Pin 18
62
TX12A

wire A
Output
OUT/ab (8-14)
Pin 8
63
TX12-B

wire B
Output
OUT/ab (8-14)
Pin 7
64
Not connected
417006-2304-0H3-B02
B-17

Maintenance Manual
SCSI pin
Name
Function
Direction
D-type pin
65
TX13A

wire A
Output
OUT/ab (8-14)
Pin 22
66
TX13-B

wire B
Output
OUT/ab (8-14)
Pin 21
67

wire A
Input
IN/an (8-14)
Pin 11
68
RX14-B

wire B
Input
IN/an (8-14)
Pin 10

The M2_21 electrical interface modules, which provide 21 balanced or
unbalanced E1 tributary interfaces for PIO2-21 cards, have two 68-pin SCSI
female connectors. One connector, designated 1-14, supports 14 E1 interfaces,
and the other connector, designated 15-21, supports the remaining 7 E1
interfaces.
M2_21 connectors are similar to those of the M2_84 modules. The table there
lists the pin assignment for the 1-14 connector (for unbalanced interfaces, wire
A is the center (tip) conductor, and wire B is the shield, or ring); the wiring of
the 15-21 connector is similar, except that only the pins of the first 7 interfaces
are actually connected.
The table also lists the color of the wire connected to the corresponding pin in
the cables offered by ECI for connecting between the tributary connector and a
distribution frame.
B-18
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Maintenance Manual
Alarms Handling Principles

In order to facilitate understanding of alarms connection, the following sections
describe the principles of alarms handling in XDM platforms.
Alarm Input
Alarm input is implemented by an optocoupler circuit shown in the following
figure.
Figure B-12: Alarm In principle circuit
When an alarm is detected at the client side, it provides a closed dry contact at
the input (between the optocoupler's LED and ground), causing the LED to
conduct and light. The light activates the optocoupler's transistor output stage,
resulting in a low logic level at the collector. The output signal connected to the
XDM processor is handled as an input alarm.
The client's dry contact ratings are 12 V in open state, and 0.5A in closed state.
417006-2304-0H3-B02
B-19

Maintenance Manual
Alarm Output
Alarm output is implemented by a change-over dry contact circuit shown in the
following figure.
Figure B-13: Alarm Out principle circuit
When an alarm is detected in the XDM, the processor sends a low logic level to
the relay, activating it. The state of the dry contact connected to the client side
changes and provides an alarm output signal to client's facility.
The relay contact ratings are 57.6 V in open state, and 1A in closed state.
B-20
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Maintenance Manual
xRAP-D Connectors
This section provides information on the connectors located on the xRAP-D
unit.
Platform DC Input Power Connectors

The SHELF DC input power connectors, designated Shelf 1 and Shelf 2, are
5-pin D-type male connectors. The following figure identifies the functions of
the platform DC input connector pins, as seen when looking into the connector.
Figure B-14: xRAP-D and xRAP-B shelf DC input power connector pin functions
SHELF Alarm Connectors

The SHELF alarm connectors are 36-pin SCSI female connectors. Each
connector is connected to the ALARMS connector of an XDM-500 platform.
Refer to ALARMS Connector (page B-3) for description. The following figure
identifies the connector pins as seen when looking into the connector, and the
table lists the pin assignment for this connector.
Figure B-15: SHELF alarm connector pin identification
417006-2304-0H3-B02
B-21

Maintenance Manual
Table B-11: SHELF alarm connector pin assignment
B-22
Pin
Name
Function
Direction
N/C
Not connected
--
ALM_IP1
Alarm input 1, + wire
Input
ALM_IN1
Alarm input 1, wire
Input
ALM_IP2
Input
ALM_IN2
Alarm input 2, wire
Input
ALM_IP3
Input
ALM_IN3
Alarm input 3, wire
Input
ALM_IP4
Input
ALM_IN4
Alarm input 4, wire
Input
10
ALM_O4
Alarm output 4
Output
11
N/C
Not connected
--
12
GND
Ground
--
13
ALM_O1
Alarm output 1
Output
14
N/C
Not connected
--
15
GND
Ground
--
16
ALM_O2
Alarm output 2
Output
17
N/C
Not connected
--
18
BUZZ
Buzzer
Input
19
N/C
Not connected
--
20
GND
Ground
--
21
CRIT_COM
Critical alarm
Output
22
N/C
Not connected
--
23
MAJ_COM
Major alarm
Output
24
GND
Ground
--
25
N/C
Not connected
--
26
GND
Ground
--
27
MIN_COM
Minor alarm
Output
28
N/C
Not connected
--
29
WARN_COM
Warning alarm
Output
30
GND
Ground
--
31
ALM_O3
Alarm output 3
Output
32
GND
Ground
--
33
N/C
Not connected
--
34
N/C
Not connected
--
35
GND
Ground
--
36
N/C
Not connected
--
417006-2304-0H3-B02

Maintenance Manual
ALARMS Connector
The ALARMS connector is a SCSI 68-pin female connector that carries the
following groups of lines to the customer equipment:
Eight external alarm inputs connected to the ALARM inputs of the XDM500 platforms. Four inputs are allocated to each XDM-500 platform. Each
input is activated by closing a dry contact provided from the customers
facility.
Eight sets of change-over relay contacts floating with respect to platform

ground, which serve as rack (bay) status outputs. Four outputs are allocated
to each XDM-500 platform connected to the xRAP-B/xRAP-D.
Eight sets of change-over relay contacts (four per platform) floating with
respect to platform ground, which serve as rack (bay) alarm indication
lines. The relays, identified as critical, major, minor, and warning, are
activated by the corresponding alarm relays of XDM-500 platforms.
Two sets of change-over relay contacts floating with respect to platform

ground, which serve as Critical alarm buzzer activation signal. The relay is
activated whenever a Critical alarm is detected in the corresponding
platform. The signal can be used to activate a local buzzer (Critical buzzer)
in the customer's alarms collecting system.
Two lines for muting the Critical buzzer in the customer's alarms collecting
system.
Relay contact ratings are 72 V in open state, and 1A in closed state.

The following figure identifies the ALARMS connector pins as seen when
looking into the connector. The table lists the pin assignment for the ALARMS
connector. This table also lists the color of the wire connected to the
corresponding pin in the cables offered by ECIs Network Solutions Division
for connecting between the ALARMS connector and a distribution frame.
Figure B-16: ALARMS connector pin identification
417006-2304-0H3-B02
B-23

Maintenance Manual
Table B-12: ALARMS connector pin assignment
B-24
Assignment
Pin
Designation
Function
Shelf 2
CRIT_NC
Critical alarm relay, Output

normally closed
contact
Black
CRIT_COM

common contact
Brown
CRIT_NO

normally open
contact
Red
MAJ_NC
Major alarm relay,

normally closed
contact
Output
Orange
MAJ_COM
Major alarm relay,

common contact
Output
Yellow
MAJ_NO
Major alarm relay,

normally open
contact
Output
Green
MIN_NC
Minor alarm relay,

normally closed
contact
Output
Blue
MIN_COM
Minor alarm relay,

common contact
Output
Violet
MIN_NO
Minor alarm relay,

normally open
contact
Output
Gray
10
WARN_NC
Warning alarm
relay, normally
closed contact
Output
White
11
WARN_COM
Warning alarm
relay, common
contact
Output
Pink
12
WARN_NO
Warning alarm
Output
relay, normally open
contact
Light green
13
BUZZ_NC
Buzzer relay,
normally closed
contact
Output
Black/white
14
BUZZ_COM
Buzzer relay,
common contact
Output
Brown/
white
15
BUZZ_NO
Buzzer relay,
normally open
contact
Output
Red/white
16
ALMO1_NC
Output relay 1,
normally closed
contact
Output
Orange/
white
17
ALMO1_COM
Output relay 1,
common contact
Output
Green/
white
Direction
Wire color
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Maintenance Manual
Assignment
417006-2304-0H3-B02
Pin
Designation
Function
Direction
Wire color
18
ALMO1_NO
Output relay 1,
normally open
contact
Output
Blue/white
19
ALMO2_NC
Output relay 2,
normally closed
contact
Output
Violet/
white
20
ALMO2_COM
Output relay 2,
common contact
Output
Red/black
21
ALMO2_NO
Output relay 2,
normally open
contact
Output
Orange/
black
22
ALMO3_NC
Output relay 3,
normally closed
contact
Output
Yellow/
black
23
ALMO3_COM
Output relay 3,
common contact
Output
Green/
black
24
ALMO3_NO
Output relay 3,
normally open
contact
Output
Gray/black
25
ALMO4_NC
Output relay 4,
normally closed
contact
Output
Pink/black
26
ALMO4_COM
Output relay 4,
common contact
Output
Pink/green
27
ALMO4_NO
Output relay 4,
normally open
contact
Output
Pink/red
28
ALMIN_1
External alarm input Input

1
Pink/violet
29
ALMIN_2

2
Light blue
30
GND
ground
Light
blue/brown
31
ALMIN_3

3
Light blue/red
32
ALMIN_4

4
Light
blue/violet
33
GND
ground
Light
blue/black
34
BUZZ_OFF
Buzzer mute
Output
Gray/green
B-25
B-26

Maintenance Manual
Assignment
Pin
Designation
Function
Shelf 1
35
CRIT_NC

normally closed
contact
Gray/red
36
CRIT_COM

common contact
Gray/violet
37
CRIT_NO

normally open
contact
Light
green/black
38
MAJ_NC
Major alarm relay,

normally closed
contact
Output
Violet/black
39
MAJ_COM
Major alarm relay,

common contact
Output
Black/white
dots
40
MAJ_NO
Major alarm relay,

normally open
contact
Output
Brown/
white dots
41
MIN_NC
Minor alarm relay,

normally closed
contact
Output
Red/white
dots
42
MIN_COM
Minor alarm relay,

common contact
Output
Orange/
white dots
43
MIN_NO
Minor alarm relay,

normally open
contact
Output
Green/
white dots
44
WARN_NC
Warning alarm
relay, normally
closed contact
Output
Blue/white
dots
45
WARN_COM
Warning alarm
relay, common
contact
Output
Violet/
white dots
46
WARN_NO
Warning alarm
Output
relay, normally open
contact
White/
black dots
47
BUZZ_NC
Buzzer relay,
normally closed
contact
Output
Yellow/
black dots
48
BUZZ_COM
Buzzer relay,
common contact
Output
Green/
black dots
49
BUZZ_NO
Buzzer relay,
normally open
contact
Output
Light blue/
black dots
50
ALMO1_NC
Output relay 1,
normally closed
contact
Output
Pink/black
dots
51
ALMO1_COM
Output relay 1,
common contact
Output
Red/black
dots
52
ALMO1_NO
Output relay 1,
normally open
contact
Output
Orange/
black dots
Direction
Wire color
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Maintenance Manual
Assignment
417006-2304-0H3-B02
Pin
Designation
Function
Direction
Wire color
53
ALMO2_NC
Output relay 2,
normally closed
contact
Output
Violet/black
dots
54
ALMO2_COM
Output relay 2,
common contact
Output
Gray/black
dots
55
ALMO2_NO
Output relay 2,
normally open
contact
Output
Orange/red
dots
56
ALMO3_NC
Output relay 3,
normally closed
contact
Output
Yellow/red
dots
57
ALMO3_COM
Output relay 3,
common contact
Output
Green/red
dots
58
ALMO3_NO
Output relay 3,
normally open
contact
Output
Blue/red dots
59
ALMO4_NC
Output relay 4,
normally closed
contact
Output
Violet/red
dots
60
ALMO4_COM
Output relay 4,
common contact
Output
Gray/red dots
61
ALMO4_NO
Output relay 4,
normally open
contact
Output
White/red
dots
62
ALMIN_1

1
Pink/red dots
63
ALMIN_2

2
Yellow/
white
64
GND
ground
Gray/white
65
ALMIN_3

3
Pink/white
66
ALMIN_4

4
Brown/
black
67
GND
ground
Blue/black
68
BUZZ_OFF
Buzzer mute
Output
Gray/white
dots
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Maintenance Manual
xRAP-HP Connectors
This section provides information on the connectors located on the xRAP-HP
units.
SHELF EXTERNAL ALARM/CONTROL

Connectors
The three SHELF EXTERNAL ALARM/CONTROL connectors are 25-pin
D-type female connectors. Each connector is intended to be connected to the
ALARMS connector of an XDM platfprm. The following figure identifies the
connector pins as seen when looking into the connector.
Figure B-17: SHELF EXTERNAL ALARM/CONTROL connector pin identification
The following table lists the pin assignment for this connector.
Table B-13: SHELF EXTERNAL ALARM/CONTROL connector pin assignment
B-28
Pin
Designation
Function
Direction
ALM_IP1
Connection to XDM alarm input 1
Output
ALM_IP2
Output
ALM_IP3
Output
ALM_IP4
Output
ALM_IP5
Output
ALM_IP6
Output
ALM_IP7
Output
ALM_IP8
Output
Not connected
10
GND
Ground
11-13
Not connected
14
ALM_OP1
Connection to XDM alarm output 1
15
ALM_OP2
Input
16
ALM_OP3
Input
17
ALM_OP4
Input
18
ALM_OP5
Input
19
ALM_OP6
Input
20
ALM_OP7
Input
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Maintenance Manual
Pin
Designation
Function
Direction
21
ALM_OP8
Input
22
Not connected
23
GND
Ground
Not connected
24, 25 -
The connection between each SHELF EXTERNAL ALARM/CONTROL

connector and the corresponding ALARMS connector is performed by means
of a cable terminated in a 25-pin D-type male connector at the RAP side, and a
50-pin D-type female connector at the XDM platform side. Cable wiring is
listed in the following table.
Table B-14: SHELF EXTERNAL ALARM/CONTROL - ALARMS cable wiring
xRAP-HP side
Line function
XDM side
XDM alarm input 1
34
XDM alarm input 2
36
XDM alarm input 3
38
XDM alarm input 4
40
XDM alarm input 5
42
XDM alarm input 6
44
XDM alarm input 7
46
XDM alarm input 8
48
Not connected
10
Ground
35, 37, 39, 41, 43, 45, 47, 49
11-13
Not connected
14
XDM alarm output 1
15
XDM alarm output 2
16
XDM alarm output 3
17
XDM alarm output 4
18
XDM alarm output 5
19
XDM alarm output 6
11
20
XDM alarm output 7
13
21
XDM alarm output 8
15
22
Not connected
23
Ground
2, 4, 6, 8, 10, 12, 14, 16
24, 25
Not connected
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Maintenance Manual
RAP Connectors
The three RAP connectors are 9-pin D-type female connectors. Each of these
connectors is intended to be connected to an xRAP connector (page B-4) that
carries the alarm relay outputs and buzzer control line of the platform.
the connector.
Figure B-18: RAP connector pin identification
The following table lists the pin assignment for the RAP connector.
Table B-15: RAP connector pin assignments
Pin
Designation
Function
Direction
Critical
Critical alarm relay
Input
Major
Major alarm relay
Input
Minor
Minor alarm relay
Input
Warning
Warning relay
Input
Buzzer
Input
6-8
Not connected
Common
Common reference for all the outputs
The connection between each RAP connector and the corresponding XDM
platform connector is performed by means of a cable terminated in a 9-pin
D-type female connector at the xRAP-HP side, and a 9-pin D-type male
connector at the XDM platform side. Cable wiring is listed in the following
table.
Table B-16: RAP shelf cable wiring diagram
B-30
xRAP-HP side
Function
XDM side
Critical alarm indication
Major alarm indication
Minor alarm indication
Warning indication
6, 7, 8
Not connected
2, 4, 8
Common reference for all the inputs
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Maintenance Manual
CONTROL CONNECTION Connector

The CONTROL CONNECTION connector is a 50-pin D-type female
connector that carries three groups of lines:
Eight external alarm inputs, connected through optocouplers in the

xRAP-HP to the ALARM inputs of the XDM platform. Each input is
connected to the input diode of an optocoupler, referenced to the platform
ground.
Eight sets of change-over relay contacts, floating with respect to platform

ground, that serve as rack (bay) status outputs. Internal xRAP-HP switches
can be used to assign each of the eight relays to one of the output alarm
lines of any XDM platform connected to the xRAP-HP.
Four sets of change-over relay contacts, floating with respect to platform

ground, that serve as rack (bay) alarm indication lines. The relays,
identified as critical, major, minor, and warning, are activated by the
corresponding alarm relays of XDM shelves.
Relay contact ratings are 57.6 V in open state, and 1A in closed state.
The following figure identifies the CONTROL CONNECTION connector pins
as seen when looking into the connector.
Figure B-19: CONTROL CONNECTION connector pin identification
The following table lists the pin assignment for the CONTROL
CONNECTION connector. The table also lists the color of the wire connected
to the corresponding pin in the cables offered by ECI for connecting between
the CONTROL CONNECTION connector and a distribution frame.
Table B-17: CONTROL CONNECTION connector pin assignment
Pin
Designation
Function
Direction
Wire color
ALARM_IN1
External alarm input 1
Input
Brown
ALARM_IN4
Input
Brown/gray-ring
ALARM_IN7
Input
Red
Not used
Red/gray-ring
OUT1_COM
Output relay 1, common

contact
Output
Orange
OUT2_COM

contact
Output
Orange/gray-ring
OUT3_COM

contact
Output
Yellow
OUT4_COM

contact
Output
Yellow/gray-ring
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Maintenance Manual
Pin
Designation
Function
Direction
Wire color
OUT5_COM

contact
Output
Green
10
OUT6_COM

contact
Output
Green/gray-ring
11
OUT7_COM

contact
Output
Blue
12
OUT8_COM

contact
Output
Blue/gray-ring
13
Not used
Violet
14
CRIT_COM
Critical alarm relay,

common contact
Output
Violet/gray-ring
15
MAJOR_COM
Major alarm relay, common Output

contact
White
16
MINOR_COM
Minor alarm relay, common Output

contact
White/gray-ring
17
WARN_COM
Warning relay, common

contact
Output
Pink
18
ALARM_IN2
Input
Pink/gray-ring
19
ALARM_IN5
Input
Brown/white-ring
20
ALARM_IN8
Input
Red/white-ring
21
Not used
Orange/white-ring
22
OUT1NO
Output relay 1, normally

open contact
Output
Yellow/white-ring
23
OUT2NO

open contact
Output
Green/white-ring
24
OUT3NO

open contact
Output
Blue/white-ring
25
OUT4NO

open contact
Output
Violet/white-ring
26
OUT5NO

open contact
Output
Light-gray/white-rin
g
27
OUT6NO

open contact
Output
Red/brown-ring
28
OUT7NO

open contact
Output
Yellow/brown-ring
29
OUT8NO

open contact
Output
Orange/brown-ring
30
CRIT_NC

normally closed contact
Output
Green/brown-ring
31
MAJOR_NC
Major alarm relay,

Output
Blue/brown-ring
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Maintenance Manual
Pin
Designation
Function
Direction
Wire color
32
MINOR_NC
Minor alarm relay,

Output
Violet/brown-ring
33
WARN_NC
Warning relay, normally

closed contact
Output
Light-gray/brown-ri
ng
34
ALARM_IN3
Input
Pink/brown-ring
35
ALARM_IN6
Input
Brown/red-ring
36
GNDPS
Ground
Light-gray/red-ring
37
Not used
Yellow/red-ring
38
OUT1NC

closed contact
Output
Green/red-ring
39
OUT2NC

closed contact
Output
Blue/red-ring
40
OUT3NC

closed contact
Output
Violet/red-ring
41
OUT4NC

closed contact
Output
White/red-ring
42
OUT5NC

closed contact
Output
Pink/red-ring
43
OUT6NC

closed contact
Output
Brown/green-ring
44
OUT7NC

closed contact
Output
Light-gray/green-rin
g
45
OUT8NC

closed contact
Output
Yellow/green-ring
46
Not used
Orange/green-ring
47
CRIT_NO

normally open contact
Output
Violet/green-ring
48
MAJOR_NO
Major alarm relay,

Output
Blue/green-ring
49
MINOR_NO
Minor alarm relay,

Output
Brown/blue-ring
50
WARN_NO
Warning relay, normally

open contact
Output
Red/blue-ring
417006-2304-0H3-B02
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Maintenance Manual
xRAP-100 Connectors
This section provides information on the connectors located on the xRAP-100
units.
SHELF DC Power Connectors

The SHELF DC power connectors, designated SHELF 1, SHELF 2, SHELF 3,
and SHELF 4, are 3-pin D-type male connectors.
The SHELF 4 connector lines are also connected to a 5-pin D-type connector
for connecting to an XDM-1000 or XDM-2000 platform. The following figure
identifies the functions of the connector pins, as seen when looking into the
connector.
B-34
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Maintenance Manual
SHELF ALARM Connectors

The four ALARMS connectors are 36-pin SCSI female connectors. Each
connector can be connected to the ALARMS connector of an XDM platform or
to a BG platform. The following figure identifies the connector pins (as seen
when looking into the connector).
Figure B-22: xRAP-100 SHELF ALARM connector pin identification
The following table lists the pin assignment for this connector.
Table B-18: xRAP-100 SHELF ALARM connector pin assignment
Pin
Name
Function
Direction
N/C
--
--
ALM_IP1
Input
ALM_IN1
Alarm input 1, - wire
Input
ALM_IP2
Input
ALM_IN2
Input
ALM_IP3
Input
ALM_IN3
Input
ALM_IP4
Input
ALM_IN4
Input
10
N/C
--
--
11
N/C
--
--
12
GND
Ground
--
13
ALM_O1
Alarm output 1 common
Output
14
N/C
--
--
15
GND
Ground
--
16
ALM_O2
Alarm output 2 common
Output
17
N/C
--
--
18
BUZ_COM
Buzzer common
Input
19
N/C
--
--
20
GND
Ground
--
21
CRIT_COM
Critical alarm common
--
22
N/C
--
--
23
MAJ_COM
Major alarm common
Input
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Maintenance Manual
Pin
Name
Function
Direction
24
GND
Ground
--
25
N/C
--
--
26
GND
Ground
--
27
MIN_COM
Minor alarm common
Input
28
N/C
--
--
29
WARN_COM
Warning alarm common
--
30
GND
Ground
--
31
N/C
--
--
32
N/C
--
--
33
N/C
--
--
34
N/C
--
--
35
GND
Ground
--
36
N/C
--
--
ALARM IN/OUT Connector

The ALARM IN/OUT connector is a 68-pin SCSI female connector that carries
three groups of lines to the customer equipment:
Sixteen external alarm inputs connected to the ALARM inputs of the XDM
shelves. Four inputs are allocated to each XDM platform. Each input is
activated by closing a dry contact provided from the customer's facility.
Eight sets of change-over relay contacts, floating with respect to platform

ground, which serve as rack (bay) status outputs. Each couple of the eight
relays is assigned to the two output alarm lines of each XDM platform
connected to the xRAP-100.
Four sets of change-over relay contacts, floating with respect to platform

ground, which serve as rack (bay) alarm indication lines. The relays,
identified as critical, major, minor, and warning, are activated by the
corresponding alarm relays of XDM shelves.
Relay contact ratings are 72 V in open state, and 1A in closed state.

The following figure identifies the ALARM IN/OUT connector pins, as seen
when looking into the connector.
Figure B-23: xRAP-100 ALARM IN/OUT connector pin identification
The following table lists the pin assignment for the ALARM IN/OUT
connector.
B-36
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Maintenance Manual
Table B-19: xRAP-100 ALARM IN/OUT connector pin assignment

Assignment
Pin
Designation
Function
Shelf 1
ALM_01NO
Output relay 1, normally open Output

contact
Black
ALM_01COM

contact
Output
Brown
ALM_01NC

closed contact
Output
Red
ALM_02NO

contact
Orange
ALM_02COM

contact
Output
Yellow
ALM_02NC

closed contact
Output
Green
ALM_03NO

contact
Blue
ALM_03COM

contact
Output
Violet
ALM_03NC

closed contact
Output
Gray
10
ALM_04NO

contact
White
11
ALM_04COM

contact
Output
Pink
12
ALM_04NC

closed contact
Output
Light Green
13
ALM_05NO

contact
Black/White
14
ALM_05COM

contact
Output
Brown/White
15
ALM_05NC

closed contact
Output
Red/White
16
ALM_06NO

contact
Orange/White
17
ALM_06COM

contact
Output
Green/White
18
ALM_06NC

closed contact
Output
Blue/White
19
ALM_07NO

contact
Violet/White
20
ALM_07COM

contact
Output
Red/Black
21
ALM_07NC

closed contact
Output
Orange/Black
22
ALM_08NO

contact
Yellow/Black
23
ALM_08COM

contact
Output
Green/Black
24
ALM_08NC

closed contact
Output
Gray/Black
Shelf 2
Shelf 3
Shelf 4
417006-2304-0H3-B02
Direction
Wire color
B-37
Assignment
Pin
Designation
Function
Direction
Wire color
All shelves
25
CRIT_NC
Critical alarm relay, normally

closed contact
Output
Pink/Black
26
CRIT_NO
Critical alarm relay, normally

open contact
Output
Pink/Green
27
CRIT_COM
Critical alarm relay, common

contact
Output
Pink/Red
28
MAJ_NC
Major alarm relay, normally

closed contact
Output
Pink/Violet
29
MAJ_NO
Major alarm relay, normally

open contact
Output
Light Blue
30
MAJ_COM
Major alarm relay, common

contact
Output
Light Blue/Brown
31
MIN_NC
Minor alarm relay, normally

closed contact
Output
Light Blue/Red
32
MIN_NO
Minor alarm relay, normally

open contact
Output
Light Blue/Violet
33
MIN_COM
Minor alarm relay, common

contact
Output
Light Blue/Black
34
WARN_COM
Warning alarm relay,

common contact
Output
Gray/Green
35
ALMIN1
Input
Gray/Red
36
ALM_IN1
Input
Gray/Violet
37
ALMIN2
Input
Light Green/Black
38
ALM_IN2
Input
Violet/Black
39
ALMIN3
Input
Black/White dots
40
ALM_IN3
Input
Brown/White dots
41
ALMIN4
Input
Red/White dots
42
ALM_IN4
Input
Orange/White dots
43
ALMIN5
Input
Green/White dots
44
ALM_IN5
Input
Blue/White dots
45
ALMIN6
Input
Violet/White dots
46
ALM_IN6
Input
White/Black dots
47
ALMIN7
Input
Yellow/Black dots
48
ALM_IN7
Input
Green/Black dots
49
ALMIN8
Input
Light Blue/Black dots
50
ALM_IN8
Input
Pink/Black dots
Shelf 1
Shelf 2
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Maintenance Manual
417006-2304-0H3-B02

Maintenance Manual
Assignment
Pin
Designation
Function
Direction
Wire color
Shelf 3
51
ALMIN9
Input
Red/Black dots
52
ALM_IN9
Input
Orange/Black dots
53
ALMIN10
Input
Violet/Black dots
54
ALM_IN10
Input
Gray/Black dots
55
ALMIN11
Input
56
ALM_IN11
Input
Orange/Red dots
57
ALMIN12
Input
Yellow/Red dots
58
ALM_IN12
Input
Green/Red dots
59
ALMIN13
Input
Violet/Red dots
60
ALM_IN13
Input
Gray/Red dots
61
ALMIN14
Input
White/Red dots
62
ALM_IN14
Input
Pink/Red dots
63
ALMIN15
Input
Yellow/White
64
ALM_IN15
Input
Gray/White
65
ALMIN16
Input
Pink/White
66
ALM_IN16
Input
Brown/Black
67
WARN_NC

Output
Blue/Black
68
WARN_NO

Output
Gray/White dots
Shelf 4
All shelves
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Maintenance Manual
miniRAP Connectors
Shelf DC Input Power Connectors
The shelf DC input power connectors are 3-pin D-type female connectors. The
following figure identifies the functions of the shelf DC input connector pins,
as seen when looking into the connector.
Figure B-24: miniRAP shelf DC input connector pin functions
SEVERITY IN Connector
The SEVERITY IN alarm connector is a 9-pin D-type female connector. It is
connected to the ALARMS connector of an XDM-500 shelf (see ALARMS
Connector (page B-3) for a detailed description). The following figure
identifies the connector pins, as seen when looking into the connector, and the
table lists its pin assignments.
Figure B-25: SEVERITY IN alarm connector pin identification

Table B-20: SEVERITY IN alarm connector pin assignment
B-40
Pin
Name
Function
Critical
Critical alarm input
Major
Major alarm input
Minor
Minor alarm input
Warning
Warning alarm input
Buzzer
Buzzer activation input
N/C
Not used
N/C
Not used
N/C
Not used
GND
Ground
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Maintenance Manual
SEVERITY OUT Connector

The SEVERITY OUT alarm connector is a 9-pin D-type female connector. It is
connected to the customer's alarm collecting facility. The following figure
identifies the connector pins as seen when looking into the connector, and the
table lists its pin assignments.
Figure B-26: SEVERITY OUT alarm connector pin identification

Table B-21: SEVERITY OUT alarm connector pin assignment
Pin
Name
Function
Critical_com
Critical alarm common
Critical_NO
Critical alarm NO
Major_NC
Major alarm NC
Major_com
Major alarm common
Major_NO
Major alarm NO
Critical_NC
Critical alarm NC
Minor_NO
Minor alarm NO
Minor_com
Minor alarm common
Minor_NC
Minor alarm NC
417006-2304-0H3-B02
B-41
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Maintenance Manual
417006-2304-0H3-B02
C
Upgrades and Expansions
In this appendix:
Overview ........................................................................................................ C-1
16- to 32-Channel Mux/DeMux Expansion ................................................... C-2
Upgrading and Expanding Optical Networks ................................................. C-3
Matrix and SDH Data Card Upgrades ............................................................ C-7
Overview
Various upgrade and expansion options are always available, given the
modular, build-as-you-grow nature of the XDM product line. This includes
matrix upgrades, SDH data card upgrades, and optical component upgrades. A
few examples are provided in this section. For more information, contact the
ECI technical support team.
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C-1

Maintenance Manual
16- to 32-Channel Mux/DeMux

Expansion
To expand the number of channels from 16 to 32, the two units are operated in
tandem. For this purpose, the 16-channel red band Mux/DeMux has a
Mux/DeMux for the blue band signal, which connects the blue band
Mux/DeMux to the line signal.
The following figure shows the connections needed for expanding the number
of Mux/DeMux channels from 16 to 32.
Figure C-1: Connections for 16- to 32-channel expansion
To expand from 16 to 32 channels:

1. When expansion is foreseen, design the initial configuration to include one
red band 16-channel Mux/DeMux with an expansion port.
2. When making the actual expansion, install the blue band 16-channel
Mux/DeMux, and then connect it to the expansion (UPGR) ports of the red
band Mux/DeMux (see previous figure).
3. Connect the additional channels to the blue band Mux/DeMux.
The connections can be made without disrupting the traffic transported by the
red band unit.
C-2
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Maintenance Manual
Upgrading and Expanding

Optical Networks
ECI's Transport Networking Division XDM systems are modular systems that
have been specifically designed to permit incremental expansion of their
traffic-handling capacity without any disruption to the flow of traffic already
carried by the system.
Any increase in the traffic-handling capacity includes two main activities:
Expansion of the optical transport capacity among XDM sites. This is a

critical stage requiring advance planning.
Addition of equipment needed to support additional users at each site. For

example:
In XDM networks, additional users are supported by adding the

appropriate types of I/O cards (PDH, SDH, and/or data).
In integrated XDM/SYNCOM networks, additional users are supported
by adding SYNCOM platforms with appropriate optical aggregate
interfaces.
In networks with equipment from other vendors, additional users are
supported by adding equipment platforms with appropriate optical
aggregate interfaces. SDH I/O cards may also have to be added to
consolidate traffic from lower-level aggregates before transmission
over the optical network.
Software upgrading, when required. The standard implementation of
XDM sites ensures that, after the optical transport capacity expansion
has been installed, any additional user-support equipment can be added
at any time without disrupting existing traffic.
This section describes recommended procedures for preparing and

implementing the expansion of the XDM optical transport capacity in a way
that takes advantage of its built-in non-traffic-affecting capabilities. These
procedures primarily apply to XDM systems and integrated XDM/SYNCOM
networks.
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Maintenance Manual
Outline of Optical Traffic Capacity Expansion

Activities
To take advantage of the XDM non-traffic-affecting expansion capabilities, it
is necessary during the initial system planning stages to plan ahead and prepare
the infrastructure needed for future expansion.
Planning activities must consider the following aspects:
Planning the optical network for the capacity required initially. This must
take into consideration the allocation of wavelengths necessary to meet the
initial traffic capacity requirements and the power budget for optical
amplifiers.
Planning the network for the additional capacity envisioned at each

expansion stage with respect to additional wavelengths and power budget,
up to the maximum available capacity.
Planning the external infrastructure needed at each stage. An important

aspect of this activity is to lay out enough fibers to support the maximum
planned capacity, because in networks using large numbers of wavelengths
it is not possible to add fibers without disrupting existing traffic.
NOTE: One possible approach to expansion is to start
network operation using only channels in the red band, and

then add channels in the blue band. See, for example, the 16
to 32 channels expansion method explained in the XDM-1000
Product Line Reference Manual.
C-4
Planning the equipment installation requirements at each site in accordance

with the site installation plans. This includes:
Number and type of XDM platforms and equipment racks needed for
the initial site capacity.
Number and type of XDM platforms and equipment racks needed for
the final (maximum) site capacity.
Distribution of transponders and ancillary units in the platforms, taking

into consideration that it is necessary to leave enough empty slots to
accommodate the number of wavelengths that must be added at each
expansion stage.
Number of ODFs needed for the final (maximum) site capacity.
Planning and installing the full optical cabling for the final (maximum)
site capacity. This includes the fibers needed to carry the local
customer's signals to the ODFs, the fibers between the ODFs and the
transponders, and from the transponders to the optical support modules
(OADMs and DWDM modules).
Planning the site power and cooling requirements for the final
(maximum) site capacity.
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The site configurations for each expansion stage must be fully documented in
the network and site installation manuals, in accordance with the standard
procedures.
NOTE: ECI recommends documenting the installation details
for each site and network installation. The documentation

should include the site survey information, rack and platform
diagrams, connections table, platform slot assignment
information, and network planning inputs. The documentation
should be updated after each change in the network.
If you are interested in obtaining design assistance or a network installation

plan from ECI's Customer Support team, contact your ECI sales representative.
Expansion Process
The actual expansion process is based on the preplanned expansion steps
described in the installation procedures. The following required activities are
listed in the order of execution.
To expand your system:
1. Insert additional transponder cards in the XDM platforms in accordance
with the installation procedures.
2. Perform a preliminary configuration of the transponders (slot assignment
definition and wavelength setting) using the LCT-XDM.
3. Use an OPM to measure optical output power (see "Measuring Optical
Levels" page 8-8).
NOTE: Record all the measurement results in the
commissioning document.
4. Connect the transponder to the required channel to the OADM by

connecting the corresponding fibers to the appropriate OADM connectors,
according to the wavelength indicated in the connector labels.
5. Perform an optical measurement of the link optical levels at the optical
monitor points, using an OPM card or an optical spectrum analyzer.
6. Before connecting live traffic, perform a 12-hour stability test for each new
optical trail.
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Expansion Checklist
The following checklist is provided to help execute the expansion activities:
1. Check wavelength availability on the optical link.
2. Check that the link power budget does not exceed the specification of any
optical trail.
3. Check slot availability in the XDM platforms.
4. Check the installation records.
5. Check the required optical fibers:
Between the customer's equipment and the ODF
Between the ODF and each transponder card
Between each transponder card and the corresponding OADM

6. Insert each transponder card in the prescribed slot.
7. Use the LCT-XDM to configure the slot assignment and wavelength setting
of each transponder card.
8. Check the optical output power of each transponder with an OPM.
9. Connect the customer's equipment to the transponders.
10. Update the power control parameters in accordance with the new
equipment configuration.
11. Connect the transponders to the OADM or Mux/DeMux connectors.
12. Using an optical spectrum analyzer or an OPM card, check each output for
proper wavelength and required power, and check the OSNR on the line.
Record the test results in the commissioning document.
13. Perform the 12-hour stability check. Record the results in the
commissioning document.
14. Record the changes at each site in the installation documentation.
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Matrix and SDH Data Card

Upgrades
ECI offers the option of upgrading your current HLXC384 to the more
powerful HLXC768 matrix. Similarly, you could choose to increase capacity
by replacing up to four SIO16_2 cards with the greater capacity of an SIO164
card. The data card upgrade is non-traffic affecting, and has been simplified
with the XDM's automatic Move Trails feature, with which active traffic trails
can be moved automatically from the old cards to the new card.
The SDH advanced service cards support a convenient trail shift capability that
enables operators to transfer SDH links (STMx) from one slot to another within
the same platform. All SDH link configurations and XCs are preserved. SDH
links are moved to a new service card by an on-site ECI technical team, with no
interruption in service, leaving the original service card free for other use or for
upgrading, depending on operator preferences.
The ability to easily move SDH links to a different service card allows
operators to allocate their platform slots more efficiently. More important, the
move trails feature allows operators to replace their current cards with
higher-capacity cards and increase bandwidth as needed, based on service
demand, with no interruption to service and no need to add extra platforms for
more slots. For example, the move trails feature would allow operators to
increase the line rate from STM-16 (2.5 Gbps) to STM-64 (10 Gbps), simply
by switching the STM-16 trails in a single movement to one STM-64 link. Note
that link trails must be moved simultaneously on both sides of the link. For
more information, speak to the ECI technical support team.
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D
Integrating XDM
Equipment in SYNCOM
Networks
In this appendix:
Overview ........................................................................................................ D-1
Network Implementation Considerations ....................................................... D-2
Network Timing Considerations .................................................................... D-5
Network Management Considerations ........................................................... D-5
Recommended Integration Procedures ........................................................... D-8
Overview
This appendix provides recommendations and guidelines for integrating XDM
equipment in existing SYNCOM networks.
The information presented in this appendix assumes familiarity with the
technical characteristics and management capabilities of SYNCOM and XDM
equipment. Refer to the equipment management user manuals for additional
information and detailed management procedures.
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Integrating XDM Equipment in

SYNCOM Networks

Maintenance Manual
Network Implementation
Considerations
Existing SYNCOM networks can benefit from the addition of XDM equipment
in two ways:
By using the optical transport capabilities of the XDM to carry SYNCOM

payload. This approach leads to limited integration between the XDM and
SYNCOM networks (see "Using XDM Equipment to Transport SYNCOM
Traffic" page D-2).
By using the whole range of XDM capabilities to carry and distribute

payload traffic originating at SYNCOM equipment, as well as traffic
originating at XDM equipment. This approach leads to full integration of
XDM equipment into the existing SYNCOM network, and results in an
integrated network with expanded capabilities and flexibility.
Using XDM Equipment to Transport SYNCOM

Traffic
The XDM can be used to transparently transport traffic originating in
SYNCOM equipment. In a typical implementation, the SYNCOM optical
aggregate ports are connected to the XDM transport network through an
OADM facility.
SYNCOM equipment has STM-4 and STM-16 optical aggregate ports (these
ports are located on ASF4 and ASF16 cards, respectively). Both types of ports
can be connected to TRP25_2 transponders. When XDM and SYNCOM
equipment is located at the same site, the XDM transponders and the
SYNCOM optical ports can be equipped with low-cost intra-office interfaces.
When the SYNCOM equipment is connected through an OADM, the
SYNCOM optical aggregate signals are transparently transferred without
passing through an HLXC or XIO card in the XDM platform. Since the XDM
HLXC or XIO cards do not process the SYNCOM signals, the XDM platform
need not be equipped with such cards for the sole purpose of supporting
SYNCOM signals. Therefore, XDM-2000 shelves can also be used for housing
the OADM.
The implementation described above is suitable for applications in which XDM
equipment is phased in parallel with the existing SYNCOM network, or when
an XDM network is overlaid on the existing SYNCOM network. The only
XDM network planning requirement specific for this application is to provide
the capacity needed for transporting the SYNCOM signals.
D-2
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Building an Integrated Network

In an integrated network, XDM shelves are installed at various locations and
connected to SYNCOM equipment. Given the topological characteristics of
communication networks that concentrate equipment in communication nodes,
the XDM equipment is effectively inserted into links between existing
SYNCOM network nodes.
In integrated networks, therefore, the SYNCOM aggregate signals are handled
as payload connected to XDM I/O cards and routed through the HLXC or XIO
cards. As a result, XDM-1000, XDM-500, and XDM-400 shelves are
recommended for installing the XDM cards, although XDM-2000 shelves can
also be used if necessary.
The following are the cards needed for interconnecting SYNCOM and XDM
equipment:
At the STM-16 level: Connect an ASF16 optical aggregate port to an I/O

port of the SIO16_XX card.
At the STM-4 level: Connect an ASF4 optical aggregate port to an STM-4

I/O port of an SIO1&4_XX or XIO card.
At the STM-1 level:
For optical interfacing: Connect an ATRO or SDM-1 optical

aggregate port or TRSO optical tributary port to an optical I/O port of
an SIO1&4_XX or XIO card.
For electrical interfacing: Connect an ATRE electrical aggregate port or
TRSE electrical tributary port to an electrical I/O port of the
SIO1&4_XX card. The connection requires the installation of an
MI1_16 electrical interface module.
At the E1 level: Connect SYNCOM E1 interfaces to XDM E1
interfaces (via M2_84 or M2_21 interface modules). The physical
connection can be facilitated using patch panels of the type described in
the XDM-1000 Product Line Reference Manual and XDM System
Specifications. The following figure shows a rack layout with a typical
patch panel.
A link through the XDM network is not necessarily symmetrical, that is,
between endpoints at the same level. For example, an SYNCOM STM-4
endpoint can be connected through an ASF16 aggregate to an XDM
SIO16_XX or XIO card and dropped through an XDM SIO1&4_XX or XIO
STM-4 port.
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The XDM equipment used in an integrated network permits consolidation of

SYNCOM traffic, and in particular enables better utilization of existing fibers
as XDM equipment using SIO64_XX cards can transmit at up to 10 Gbps
(STM-64/OC-192) per fiber.
Figure D-1: Typical rack layout with a patch panel
D-4
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Network Timing Considerations

When XDM equipment is integrated into an existing SYNCOM network (see
"Building an Integrated Network" page D-3), the existing flow of timing
signals should not be changed. Therefore, the XDM network must be
configured to lock its timing to the SYNCOM network timing.
This can readily be achieved by supplying T3 timing signals from the
SYNCOM equipment to one of the XDM shelves, and configuring the XDM
network for using this timing reference.
For reliability, it is recommended to select two points of connection to
SYNCOM timing signals to ensure that, in case of a transmission fault in the
network (for example, fiber damage), an alternative path for timing signals is
available. Therefore, each XDM platform must be configured to use the signal
from the preferred source as the highest priority source, and the signal from the
alternative source as the next priority.
Network Management
Considerations
An XDM network has its own management facilities, and therefore it can
always be managed independently of the SYNCOM network. However, any
existing SYNCOM network has a management infrastructure deployed with
significant investments in establishing the required facilities and procedures.
Therefore, when XDM equipment is integrated into the network, it is necessary
to integrate the XDM management functions as smoothly as possible into those
of the existing network.
Follow these main guidelines:
Provide appropriate management communication paths.
Provide compatible management functionality and integrate the

management functionality of the two networks.
Prevent problems that may occur when the traffic flows through different
types of equipment.
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Flow of Management Traffic

SYNCOM NEs support two basic types of management communication:
Inband management communication through the DCC SDH overhead

channel. Each SYNCOM NE can be configured to use either the RS-DCC
or the MS-DCC; this selection applies to all its ports.
Out-of-band management communication. This approach uses an

independent DCN to provide communication paths between the
out-of-band management ports of SYNCOM shelves and SYNCOM
management facilities.
XDM NEs support the same basic types of management communication and in
addition has an optical supervisory channel (OSC) that uses a separate optical
carrier to carry the management channel through the fibers used to carry the
payload, without occupying wavelengths in the payload bands. Note, however,
that for XDM NEs, the type of DCC used for management (RS-DCC or
MS-DCC) is independently selected for each port.
Most SYNCOM networks use the DCC for management communication.
Therefore, when an XDM NE is integrated in an SYNCOM network, it must
also use the DCC for management communication. This is always possible,
provided the following conditions are met:
D-6
An XDM NE is inserted in a SYNCOM link that carries the DCC

accessed by the management station (that is, one of the XDM platform
ports is connected to a SYNCOM port that carries the DCC accessed by the
management station).
The XDM NE is configured to cross connect the DCC between the relevant
ports. Make sure to check the type of DCC used by the SYNCOM NE RS-DCC or MS-DCC.
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Management Facilities for Integrated

Networks
SYNCOM NEs are managed by the EMS-SYNCOM management system and
XDM NEs are managed by the EMS-XDM. EMS-SYNCOM and EMS-XDM
may be integrated under the LightSoft NMS. Information regarding these
management systems is provided in the related documentation listed in the
section About This Manual.
To support integrated networks, the latest software versions should be used:
SYNCOM NEs require embedded software version 8.0.
SDM-1 NEs require embedded software version 7.5.
EMS-XDM systems require software version 4.0 or higher.

NOTE: The preliminary configuration of XDM NEs is
performed using an LCT-XDM terminal. The LCT-XDM

terminal functionality is described in the LCT-XDM User
Manual.
The EMS-XDM can be installed on a separate station or on the same station

running the EMS-SYNCOM or LightSoft applications. If a separate EMSXDM station is used, it must be configured as a slave manager of LightSoft.
Because of the critical functions performed by management facilities, it is
necessary to use special methods based on equipment redundancy and
alternative management communication facilities to increase their availability,
and ensure that management capabilities are not affected by transmission or
equipment faults.
Networks integrating SYNCOM and XDM NEs can use the remote database
replication (RDR) approach. The RDR uses two management stations:
At any time, one of these stations serves as the primary station and actively
manages the NEs.
The other station, the mirror station, does not manage the NEs but is
continuously in session with the primary station. The primary station
updates the mirror station database to keep it synchronized with its
database.
Therefore, at any time only one station manages the network, but the other
station can take over immediately when the primary station or its management
communication links fail.
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Preventing Configuration Problems in the

Integrated Network
This section presents several issues related to the configuration of the
SYNCOM and XDM equipment to ensure interoperability. This is in addition
to the standard configuration and management procedures for each equipment
family.
The first issue is ensuring continuity of the DCC throughout the integrated
network (see "Flow of Management Traffic" page D-6).
The second issue is related to alarm severity configuration requirements for

XDM ports. XDM NEs, which are used in networks with large numbers of
trails, support the J0 trace string (part of the SDH overhead) because it can
help detect routing errors.
SYNCOM NEs do not support the J0 trace string. Therefore, any XDM
port carrying traffic from SYNCOM ports must be specifically configured
to ignore the J0 string because this is not the default. If the detection of the
J0 string is not cancelled, the port generates a Trace Id Mismatch alarm
and stops transferring the traffic received from the SYNCOM equipment.
The relevant alarm configuration parameter is RS-Snk, appearing in the
port alarm Severity Assignment window. Make the following selections:
Set the Trace Id Mismatch alarm to NonRep.

Select Inhibit for all the Consequent Actions (for example,
downstream AIS and RDI).
Recommended Integration
Procedures
This section presents a checklist of the tasks needed for a smooth integration of
XDM equipment in SYNCOM networks.
Use this checklist to supplement the normal network planning activities.
1. Update the embedded software versions of the various equipment units as
follows:
SYNCOM NEs to version 8.0
SDM-1 NEs to version 7.5
XDM NEs to version 4.0 or higher

2. Update the software versions of the various management applications as
follows:
All the eNM applications to EMS-SYNCOM
EMS-XDM applications to version 4.0 or higher
Install LightSoft if needed

D-8
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SYNCOM Networks
3. If the current management backup configuration is not based on the RDR

method, plan and implement the required changes.
4. Install any additional infrastructure needed for expanding the management
network to include the XDM equipment.
5. Install the XDM equipment in accordance with the network expansion plan.
6. Perform the preliminary configuration of the XDM equipment by means of
the LCT-XDM.
7. Perform the activities needed to enable the EMS-XDM station to manage
the XDM NEs in the integrated network.
8. Create the additional NEs (the XDM NEs) on the LightSoft station to
reflect the new network topology.
9. Create the new trails in the integrated network. This activity is facilitated
by enabling the use of automatic creation of server trails in response to the
insertion of an NE in an existing link.
10. Configure the timing sources and their priorities for each element in the
integrated network.
11. Perform a check of the management capabilities in the integrated network.
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E
Slot Designation
Conversion Table
In this appendix:
Slot Designation Conversion Table .................................................................E-1
Slot Designation Conversion

Table
This appendix provides the recommended list of codes for identifying XDM
platform slots instead of the standard slot designations.
Table E-1: Conversion from XDM-1000 slot marking to slot codes
Actual slot
marking
Slot code number
Actual slot
marking
Slot code number
PW1
101
13
304
PW2
102
14
305
M1
201
15
306
M2
202
16
307
M3
203
C1
308
M4
204
C2
309
M5
205
17
310
M6
206
18
311
M7
207
19
312
M8
208
110
313
M9
209
111
314
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Slot Designation Conversion Table

Maintenance Manual
Actual slot
marking
Slot code number
Actual slot
marking
Slot code number
M10
210
112
315
M11
211
X2
316
C0
300
F1
401
X1
301
F2
402
11
302
F3
403
12
303
Table E-2: Conversion from XDM-500 slot marking to slot codes
E-2
Actual slot marking
Slot code number
PW1
101
PW2
102
X1
201
C1
202
C2
203
IC1
204
IC2
205
IC3
206
MC1
207
MC2
208
MC3
209
MC4
210
IC4
211
IC5
212
IC6
213
X2
214
C0
300
F1
301
F2
302
F3
303
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F
Standards and References
In this appendix:
Overview ......................................................................................................... F-1
Broadband Forum ............................................................................................ F-1
Environmental Standards ................................................................................. F-2
ETSI: European Telecommunications Standards Institute .............................. F-2
IEC: International Electrotechnical Commission ............................................ F-3
IEEE: Institute of Electrical and Electronic Engineers.................................... F-4
IETF: Internet Engineering Task Force ........................................................... F-5
ISO: International Organization for Standardization ....................................... F-7
ITU-T: International Telecommunication Union ............................................ F-7
MEF: Metro Ethernet Forum ......................................................................... F-12
NIST: National Institute of Standards and Technology................................. F-12
North American Standards ............................................................................ F-13
OMG: Object Management Group ................................................................ F-14
TMF: TeleManagement Forum ..................................................................... F-14
Web Protocol Standards ................................................................................ F-14
Overview
The following is a list of standards and reference documents that relate to the
XDM platform families. The standards are listed alphabetically by groups.
Broadband Forum
Af-phy-0064.000 ATM Forum E1 Physical Layer Interface.
Af-phy-0086.000 ATM Forum IMA V1.0.
Af-phy-0086.001 ATM Forum IMA V1.1.
Af-phy-00121.00 ATM Forum Traffic Management Specifications V4.1.
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Environmental Standards
EuP Directive 2005/32/EC: Ecodesign Requirements for Energy-Using

Products.
OHSAS 18001: Occupational Health and Safety Management Systems Requirements.
REACh Directive 2005/32/EC: Registration, Evaluation, Authorization,

and Restriction of Chemicals.
RoHS Directive 2005/747/EC: Restriction of the Use of Certain Hazardous

Substances in Electrical and Electronic Equipment.
WEEE Directive 2002/96/EC: Waste from Electrical and Electronic

Equipment.
ETSI: European
Telecommunications Standards
Institute
F-2
EN 300 019-1-1 Class 1.2: Environmental Engineering (EE);

Environmental Conditions and Environmental Tests for
Telecommunications Equipment; Part 1-1: Classification of Environmental
Conditions; Storage.

Conditions; Transportation.
EN 300 019-1-3 Classes 3.2 and 3.3: Environmental Engineering (EE);

Conditions; Stationary use at weather-protected locations.

Telecommunications Equipment; Part 2-4: Specification of Environmental
Tests; Stationary use at non-weather-protected locations.
EN 300 132 -2: Environmental Engineering (EE); Power Supply Interface

at the Input to Telecommunications Equipment.
EN 300-166: Physical and electrical characteristics of hierarchical digital

interfaces for equipment using the 2 048 kbit/s based plesiochronous or
synchronous digital hierarchies.
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EN 300 386: Electromagnetic compatibility and Radio spectrum Matters

(ERM); Telecommunication network equipment; Electromagnetic
Compatibility (EMC) requirements.
EN 300-417-2-1: Transmission and Multiplexing (TM); Generic

requirements of transport functionality of equipment.
EN 300-417-5-1: Generic requirements of transport functionality of

equipment.
EN 300-462-5-1: Transmission and Multiplexing (TM); Generic

requirements for synchronization networks.
EN 300-689: 34 Mbit/s digital leased lines (D34U and D34S); Terminal

equipment interface.
EN 301-164: SDH leased lines connection characteristics.
EN 301-165: SDH leased lines Network and Terminal interface

presentation.
EN 55022: Radio Disturbance Characteristics of Information Technology

Equipment.
ETR 114: Functional Architecture of SDH Transport Networks.
ETR 275: Considerations on Transmission Delay and Transmission Delay

value for components on connections supporting speech communication
over evolving digital networks.
FTZ 1TR9: Deutsche Telekom A.G. EMC Requirements.
FTZ 153 TL 1part 1: Synchronous Multiplexing Equipment (SM) for

Synchronous Multiplex Hierarchy.
IEC: International
Electrotechnical Commission
IEC 68: Environmental Testing.
IEC 917: Modular Order for the Development of Mechanical Structures for
Electronic Equipment Practices.
IEC 3309: Information Technology Telecommunications and Information

Exchange between Systems High-Level Data Link Control (HDLC)
Procedures Frame Structure.
IEC 9314-3: Information Processing Systems - Fiber Distributed Data

Interface (FDDI) Multiplex.
IEC 9595, Information Technology: Open Systems Interconnection,

Common Management Information Services.
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IEC 9596, Information Technology: Open Systems Interconnection,

Common Management Information Protocol.
IEC 13239: Information technology Telecommunications and

information exchange between systems High-level data link control
(HDLC) procedures.
IEC 17025: General Requirements for Competence of Testing and

Calibration Laboratories.
IEC 60825-1: Safety of Laser Products Part 1: Equipment Classification

and Requirements.
IEC 60825-2 (AS/NZS 2211.2): Safety of Laser Products Part 2: Safety

of Optical Fiber Communication System (OFCS).
IEC/EN/UL 60950-1: Information Technology Equipment - Safety General Requirements.
IS 1249-1: Safety of Laser products: Equipment classification requirements

and users guide.
IEEE: Institute of Electrical and

Electronic Engineers
F-4
IEEE 802.1ad: Virtual Bridged Local Area NetworksRevision

Amendment 4: Provider Bridges.
IEEE 802.1ag: Virtual Bridged Local Area Networks Amendment 5:

Connectivity Fault Management.
IEEE 802.1D: Media access control (MAC) Bridges (Incorporates IEEE

802.1t and IEEE 802.1w).
IEEE 802.1P: Traffic Class Expediting and Dynamic Multicast Filtering.
IEEE 802.1Q: Virtual Bridged Local Area NetworksRevision.
IEEE 802.1w: Rapid Reconfiguration of Spanning Tree.
IEEE 802.3: Carrier Sense Multiple Access with Collision Detection

(CSMA/CD) Access Method and Physical Layer Specifications.
IEEE 802.3ad: Link Aggregation.
IEEE 802.3ah: Ethernet in the First Mile (Link OAM).
IEEE 802.3x: Full Duplex Operation and Flow Control Protocol.
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IETF: Internet Engineering Task

Force
RFC 1493: Definition of Managed Objects for Bridges.
RFC 1643: Ethernet-like Interfaces.
RFC 1662: PPP in HDLC-Life Framing.
RFC 1757: Remote Network Monitoring Management Information Base.
RFC 1823: LDAP Application Program Interface (API).
RFC 1901: Introduction to Community-based SNMPv2.
RFC 2108: Definitions of Managed Objects for IEEE 802.3 Repeater

Devices using SMIv2.
RFC 2251: Lightweight Directory Access Protocol (v3) [specification of

the LDAP on-the-wire protocol].
RFC 2252: Lightweight Directory Access Protocol (v3): Attribute Syntax

Definitions.
RFC 2253: Lightweight Directory Access Protocol (v3): UTF-8 String

Representation of Distinguished Names.
RFC 2254: The String Representation of LDAP Search Filters.
RFC 2255: The LDAP URL Format.
RFC 2256: A Summary of the X.500(96) User Schema for use with
LDAPv3.
RFC 2401: Security Architecture for the Internet Protocol.
RFC 2409: Internet Key Exchange Protocol (IKE).
RFC 2474: Definition of the Differentiated Services Field (DS Field) in the
IPv4 and IPv6 Headers.
RFC 2597: Assured Forwarding PHB Group.
RFC 2615: PPP over SONET/SDH.
RFC 2665: Definitions of Managed Objects for the Ethernet-like Interface

Types.
RFC 2674: Bridge MIB with VLAN/Traffic Classes/Multicast Extensions.
RFC 2702: Requirements for Traffic Engineering Over MPLS.
RFC 2737: Entity MIB (Version 2).
RFC 2819: Remote Network Monitoring Management Information Base.
RFC 2829: Authentication Methods for LDAP.
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RFC 2830: Lightweight Directory Access Protocol (v3): Extension for

Transport Layer Security.
RFC 2863: Interfaces Group MIB.
RFC 3014: Notification Log MIB.
RFC 3031: Multiprotocol Label Switching Architecture.
RFC 3032: MPLS Label Stack Encoding.
RFC 3246: An Expedited Forwarding PHB (Per-Hop Behavior).
RFC 3270: Multi-Protocol Label Switching (MPLS) Support of

Differentiated Services.
RFC 3377: Lightweight Directory Access Protocol (v3): Technical

Specification.
RFC 3411: SNMP Framework MIB.
RFC 3414: SNMP User-Based SM MIB.
RFC 3415: SNMP Vies-Based ACM MIB.
RFC 3443: Time To Live (TTL) Processing in Multi-Protocol Label

Switching (MPLS) Networks.
RFC 3812: Multiprotocol Label Switching (MPLS) Traffic Engineering

(TE) Management Information Base (MIB).
RFC 3813: Multiprotocol Label Switching (MPLS) Label Switching Router

(LSR) Management Information Base (MIB).
RFC 3916: Requirements for Pseudo-Wire Emulation Edge-to-Edge

(PWE3).
RFC 3985: Pseudo Wire Emulation Edge-to-Edge (PWE3) Architecture.
RFC 4090: Fast Reroute Extensions to RSVP-TE for LSP Tunnels.
RFC 4125: Maximum Allocation Bandwidth Constraints Model for

Diffserv-aware MPLS Traffic Engineering.
RFC 4126: Max Allocation with Reservation Bandwidth Constraints Model

for Diffserv-aware MPLS Traffic Engineering & Performance
Comparisons.
RFC 4379: Detecting Multi-Protocol Label Switched (MPLS) Data Plane

Failures.
RFC 4448: Encapsulation Methods for Transport of Ethernet over MPLS

Networks.
RFC 5462: Multiprotocol Label Switching (MPLS) Label Stack Entry:

"EXP" Field Renamed to "Traffic Class" Field.
417006-2304-0H3-B02

Maintenance Manual
IETF Drafts:
draft-ietf-l2vpn-vpls-ldp.
draft-ietf-l2vpn-vpls-mcast-reqts.
draft-ietf-magma-snoop.
draft-ietf-mpls-rsvp-te-p2mp.
draft-ietf-mpls-tp-nm-framework.
draft-ietf-mpls-tp-nm-req.
draft-ietf-pwe3-ethernet-encap.
draft-martini-l2circuit-encap-mpls.
draft-sajassi-l2vpn-vpls-multicast-congruency.
draft-vasseur-mpls-backup-computation.
ISO: International Organization

for Standardization
A2LA: Accredited Laboratory for Electrical and Mechanical Testing.
ISO 9001: Quality Management System Requirements.
ISO 14001: Environmental Management Systems Requirements With

Guidance for Use.
ISO 27001: Information Security Management Systems Requirements.
TL 9000, QuEST Forum: Quality Management System Requirements &

Measurements Handbooks for the Telecom Industry.
ITU-T: International
Telecommunication Union
G.650: Definition and Test Methods for the Relevant Parameters of

Single-Mode Fibers.
G.651: Characteristics of a 50/125 m Multimode Graded Index Optical

Fiber Cable.
G.652: Characteristics of a Single-Mode Optical Fiber Cable.
G.653: Characteristics of a Dispersion-Shifted Single-Mode Optical Fiber

Cable.
G.654: Characteristics of a Cut-off Shifted Single-Mode Optical Fiber

Cable.
417006-2304-0H3-B02
F-7
F-8

Maintenance Manual
G.655: Characteristics of a Non-Zero Dispersion Shifted Single-Mode

Optical Fiber Cable.
G.661: Definition and Test Methods for the Relevant Generic Parameters of
Optical Amplifier Devices and Subsystems.
G.662: Generic Characteristics of Optical Fiber Amplifier Devices and

Subsystems.
G.663: Application Related Aspects of Optical Fiber Amplifier Devices

and Subsystems.
G.664: Optical Safety Procedures and Requirements for Optical Transport

Systems.
G.671: Transmission Characteristics of Passive Optical Components.
G.691: Optical Interfaces for Single Channel SDH Systems with Optical
Amplifiers and STM-64 Systems (Draft).
G.692: Optical Interfaces for Multi-Channel Systems with Optical

Amplifiers.
G.694.1: Spectral Grids for WDM Applications: DWDM Frequency Grid.
G.694.2: Spectral Grids for WDM Applications: CWDM Wavelength Grid.
G.695: Optical Interfaces for Coarse Wavelength Division Multiplexing

Applications.
G.703: Physical/Electrical Characteristics of Hierarchical Digital

Interfaces.
G.704: Synchronous Frame Structures Used at 1544, 6312, 2048, 8448 and
44 736 kbps Hierarchical Levels.
G.706: Frame Alignment and CRC Procedures Relating to Basic Frame

Structure Defined in Rec G.704.
G.707: Network Node Interface for the Synchronous Digital Hierarchy.
G.709: Interfaces for the Optical Transport Network (OTN).
G.752: Characteristics of digital multiplex equipments based on a second

order bit rate of 6312 kbit/s and using positive justification.
G.772: Protected Monitoring Points Provided on Digital Transmission

Systems.
G.774 & G774.n: SDH Information Model.
G.775: Loss of Signal (LOS), Alarm Indication Signal (AIS) and Remote
Defect Indication (RDI) defect detection and clearance criteria for PDH
signals.
G.781: Synchronization Layer Functions.
G.783: Characteristics of SDH Equipment Functional Blocks.
G.784: Synchronous Digital Hierarchy (SDH) Management.

417006-2304-0H3-B02

Maintenance Manual
G.798: Characteristics of OTN Hierarchy Equipment Functional Blocks.
G.803: Architectures of Transport Networks based on the Synchronous

Digital Hierarchy.
G.805: Generic Functional Architecture of Transport Networks.
G.806: Characteristics of Transport Equipment Description Methodology

and Generic Functionality.
G.809: Functional Architecture of Connectionless Layer Networks.
G.811: Timing Characteristics of Primary Reference Clocks.
G.812: Timing Requirements of Slave Clocks Suitable for Use as Node

Clocks in Synchronization Networks.
G.813: Timing Characteristics of SDH Equipment Slave Clocks (SEC).
G.823: The Control of Jitter and Wander within Digital Networks Based on
the 2048 kbit/s Hierarchy.
G.825: The Control of Jitter and Wander within Digital Networks Based on
the SDH (Draft).
G.8251: The Control of Jitter and Wander within the Optical Transport
Network (OTN).
G.826: Error Performance Parameters and Objectives for International,

Constant Bit Rate Digital Paths at or above the Primary Rate.
G.828: Error Performance Parameters and Objectives for International,

Constant Bit Rate Synchronous Digital Paths.
G.829: Error Performance Events for SDH Multiplex and Regenerator

Sections.
G.831: Management Capabilities of Transport Networks Based on the

Synchronous Digital Hierarchy (SDH).
G.841: Types and Characteristics of SDH Network Protection

Architectures.
G.842: Inter-Working of SDH Protection Architectures.
G.872: Architecture of Optical Transport Networks.
G.874: Management Aspects of the Optical Transport Network Element.
G.874.1: Optical Transport Network (OTN): Protocol-Neutral Management

Information Model for the Network Element View.
G.957: Optical Interfaces for Equipment and Systems relating to the

Synchronous Digital Hierarchy.
G.959.1: Optical Transport Network Physical Layer Interfaces.
G.975: Forward Error Correction for Submarine Systems.
G.985: 100 Mbit/s point-to-point Ethernet based optical access system.
417006-2304-0H3-B02
F-9
F-10

Maintenance Manual
G.7041: Generic Framing Procedure (GFP).
G.7042: Link Capacity Adjustment Scheme (LCAS) for Virtual

Concatenated Signals.
G.7713: Distributed Connection Management.
G.7713.2: RSVP-TE Implementation.
G.7714: Generalized Automatic Discovery Techniques.
G.7714.1: Protocol for Automatic Discovery in SDH & OTN network.
G.7715: ASON Routing.
G.7715.1: Based on PNNI, OSPF or IS_IS.
G.8001/Y.1354: Terms and definitions for Ethernet frames over transport.
G.8010/Y.1306: Architecture of Ethernet Layer Networks.
G.8011/Y.1307: Ethernet Services Framework.
G.8011.1/Y.1307.1: Ethernet Private Line Service.
G.8011.2/Y.1307.2: Ethernet Virtual Private Line Service.
G.8012/Y.1308: Ethernet UNI and Ethernet NNI.
G.8080/Y.1304: Architecture for the automatically switched optical

network (ASON)
G.8201/Y.1354: Error performance parameters and objectives for multioperator international paths within the Optical Transport Network (OTN)
G.8261/Y. 1361: Timing and synchronization aspects in packet network.
G.8262/Y. 1362: Timing characteristics of synchronous Ethernet

equipment slave clock (EEC).
G.8080: Architecture for ASON.
I.356: ATM Layer Cell Transfer Performance.
I.361: ATM Layer Specification.
I.371: Traffic Control and Congestion Control.
I.610: ATM Operation and Maintenance Principles.
M.2140: Transport Network Event Correlation.
M.3010: Principles for a Telecommunications Management Network.
M.3013: Considerations for a Telecommunications Management Network.
M.3016.0: Security for the management plane: Overview.
M.3017: Framework for the integrated management of hybrid circuit/packet

networks.
417006-2304-0H3-B02

Maintenance Manual
M.3100: Generic Network Information Model.
M.3180: Catalogue of TMN Management Information.
M.3200: TMN Management Services and Telecommunications Managed

Areas: Overview.
M.3300: TMN F Interface Requirements.
M.3400: TMN Management Functions.
Q.821: Alarm Surveillance.
Q.822: Performance Monitoring.
X.217: Open Systems Interconnection, Service Definition for the

Association Control Service Element.
X.219: Remote Operations - Model, Notation and Service Definition.
X.227: Open Systems Interconnection, Connection-Oriented Protocol for

the Association Control Service Element - Protocol Specification.
X.229: Remote Operations: Protocol Specification.
X.710: Open Systems Interconnection, Common Management Information

Service.
X.720: Open Systems Interconnection, Structure of Management

Information - Management Information Model.
X.721 Information Technology: Open Systems Interconnection, Structure

of Management Information - Definition of Management Information.
X.722: Open Systems Interconnection, Structure of Management

Information - Guidelines for the Definition of Managed Objects.
X.731: Open Systems Interconnection, Systems Management - State

Management Function.
X.733: Open Systems Interconnection, Systems Management - Alarm

Reporting Function.
X.743: Open Systems Interconnection, Systems Management - Time

X.744: Open Systems Interconnection, Systems Management - Software

Y.1311: Network-based VPNs - Generic architecture and service

requirements.
Y.1710: Requirements for Operation & Maintenance functionality for

MPLS networks.
417006-2304-0H3-B02
F-11

Maintenance Manual
Y.1711: Operation & Maintenance mechanism for MPLS networks.
Z.351: Data oriented human-machine interface specification technique

introduction.
Z.352: Data oriented human-machine interface specification technique

scope, approach and usage.
Z.361: Design guidelines for Human-Computer Interfaces (HCI) for the

management of telecommunications networks.
MEF: Metro Ethernet Forum
MEF4 Metro Ethernet Network Architecture Framework Part 1: Generic

Framework.
MEF6 Metro Ethernet Services Definitions.
MEF7 EMS-NMS Information Model.
MEF9 Test Suite for Ethernet Services at the UNI.
MEF10 Ethernet Service Attributes.
MEF11 User Network Interface (UNI) Requirements and Framework.
MEF12 Metro Ethernet Network Architecture Framework Part 2: Ethernet

Services Layer.
MEF14 Test Suite for Ethernet Traffic Management.
MPLS-TP Network Management requirements (draft-ietf-mpls-tp-nm-req)
MPLS-TP NM Framework (draft-ietf-mpls-tp-nm-framework)
NIST: National Institute of

Standards and Technology
F-12
FIPS PUB 197: Advanced Encryption Standard (AES).
FIPS PUB 140-2: Security Requirements for Cryptographic Modules.
417006-2304-0H3-B02

Maintenance Manual
North American Standards
ANSI FCF1-2: Fiber Channel Physical Interface REV 10.
ANSI T1.102: Digital hierarchy electrical interface.
ANSI T1.105: Synchronous Optical Network (SONET) - Basic Description

including Multiplex Structure, Rates, and Formats.
ANSI X3.296: Single-Byte Command code sets CONnection (SBCON)

architecture.
FCC CFR Title 47 Part 15: Radio Emission.
FCC Part 101.147 Fixed microwave services: (i8, i7, K7, 7)
NEBS GR1089 and GR63 (temperature aspect)
NEBS Level 3 support for N.A. platforms.
Rural Utility Service (RUS) Certification.
Telcordia GR-63-CORE: Network Equipment Building System (NEBS)

Requirements: Physical Protection.
Telcordia GR-253-CORE: Synchronous Optical Network (SONET)

Transport Systems: Common Generic Criteria.
Telcordia GR-383-CORE: COMMON LANGUAGE Equipment Codes

(CLEI Codes) Generic Requirements for Bar Code Labels.
Telcordia GR-487-CORE: Generic Requirements for Electronic Equipment

Cabinets.
Telcordia GR-499-CORE: Transport System Generic Requirements

(TSGR): Common Requirements.
Telcordia GR-1089-CORE: Electromagnetic Compatibility and Electrical

Safety Generic Criteria for Network Telecommunications Equipment.
Telcordia GR-1209-CORE: Generic Requirements for Passive Optical

Components.
Telcordia GR-1230-CORE: SONET Bidirectional Line-Switched Ring

Equipment Generic Criteria.
Telcordia GD-1244-CORE: Clock for the synchronization network:

Common generic criteria.
Telcordia GR-1312-CORE: Generic Requirements for Optical Fiber

Amplifiers and Proprietary Dense Wavelength-Division Multiplexed
Systems.
Telcordia GR-1400-CORE: SONET Dual-Fed Unidirectional Path

Switched Ring (UPSR) Equipment Generic Criteria.
Telcordia GD-2979-CORE: Common Generic Requirements for Optical

Add-Drop Multiplexers (OADMs) and Optical Terminal Multiplexers
(OTMs).
417006-2304-0H3-B02
F-13

Maintenance Manual
OMG: Object Management Group
Notification Service Specification V 1.0.
The Common Object Request Broker: Architecture and Specification V 2.6.
TMF: TeleManagement Forum
TMF 513: MTNM Business Agreement Release 3.5.
TMF 518: Framework Document Delivery Package (DDP) Business

Agreement (BA) V1.1.
TMF 518: Resource Provisioning DDP BA V1.0.
TMF 608: Multi Technology Network Management Information

Agreement V 2.1 and V 3.5.
TMF 814: Multi Technology Network Management Solution Set V 2.1 and
V 3.5.
TMF 854: The MTOSI XML Solution Set Package Release 1.1.
Web Protocol Standards

W3C: World Wide Web Consortium
SOAP 1.1: Simple Object Access Protocol.
WSDL 1.1: Web Services Description Language.
WS-I: Web Services Interoperability Organization
F-14
WS-I Basic Profile 1.1: Web Services Interoperability.
417006-2304-0H3-B02
Index
16- to 32-Channel Mux/DeMux
Expansion C-2
Attaching Protective Covers 4-57, 4-67

Attaching Suspended Overhead Trays
4-41
AUX, installation 6-64
About This Manual xv

ACP Connectors B-11
Additional Safety Precautions for High
Power Raman and EDFA Amplifiers
1-25
Air Filter Preventive Maintenance 9-7
Air filters, installation 5-6
description 5-6
procedure 5-7
installing air filter in frame 5-9
installing filter frame 5-8
Alarm cables
connecting to XDM shelves 5-10
connecting to xRAP 4-81
connecting to xRAP-100 4-90
preparation 4-30
Alarm Cables 4-30
Alarm Handling Test 8-31
ALARM IN/OUT Connector B-36
Alarm Input B-19
Alarm Log Test 8-39
Alarm Output B-20
ALARMS Connector B-3, B-23
Alarms Handling Principles B-19
Ancillary units
installing DDF units 4-101
installing the FST 4-96
installing the xRAP 4-73
installing the xRAP-100 4-82
Assembling the XDM Platform in a Rack
5-2
ATS cards 7-21
417006-2304-0H3-B02
Backing up the Database with the

DBBackup Function 9-41
Backing Up the LightSoft Database
9-40
BER and Stability Test 8-38
Broadband Forum F-1
Building an Integrated Network D-3
Built-in tests 9-27
C
Cable and fiber guiding accessories
A-26
cable guide A-26
cable guiding rods A-28
optical fiber guides A-27
Cable and Fiber Guiding Accessories
A-26
Cable and Fiber Preparation 4-23
Cable Guide A-26
Cable Guiding Rods A-28
Cable preparation
alarm 4-30
DC power 4-28
grounding 4-24
management 4-31
timing (clock) 4-31
Cable routes, xRAP-100 4-82
Card and Module Installation 6-1
Card failure 9-32
Card Installation Precautions 6-3
Cards and modules
installation, general 6-1
preparation 6-10
I-1
Index

Maintenance Manual
Cards and Modules 2-5

Certificates 9-32
Checking and/or Changing Slide Switch
Settings 4-74
Checking Cards and Modules Installed in
Each Platform 8-5
Checking Site Grounding Wiring 5-10
Circuit breakers
xRAP, installation 4-80
xRAP, replacing 9-45
xRAP-100, installation 4-88
xRAP-100, replacing 9-46
Cisco ATA 186/Cisco2600/CallManager
Test 8-25
Cleaning Optical Connectors 4-8
Cleaning Procedure 9-8
Client-provided power distribution panel
5-13
Clock cables 7-20
Coaxial cables 7-19
Commissioning test 8-1
prerequisites 8-3
site commissioning tests 8-5
installed cards and modules 8-5
optical level measurement 8-8
shelf power-up 8-10
tools and equipment 8-2
Commissioning Tests 8-1
Configuration 9-30
Configuring the Management IP Address
6-86
Connecting Alarm Cables to the xRAP100 4-90
Connecting Cables 7-1
Connecting DC Input Power Cable to the
xRAP-D with a Bridge Component
4-53
miniRAP 4-92
xRAP-D 4-49
Connecting Electrical Cables to ATS
Cards 7-21
I-2
Connecting Fibers to the MECP_OSCxx

and MECP_OCxxOW 7-7
Connecting Fibers to the OADM1&4
7-8
Connecting Fibers to the ODF_HP 7-13
Connecting Fibers to the
OFA_R/RM/HRM 7-9
Connecting Fibers to the SIO16 7-9
Connecting Management Cables 7-22
Connecting Power and Rack Alarm
Cables to the Platforms 5-10
Connecting the Alarm Cables to the
miniRAP 4-96
Connecting the DC Input Power Cables to
the xRAP-100 4-85
Connecting the DC Power Cable 4-94
Connecting the DC Power Cable for an
XDM Platform 4-87
Connecting Traffic Cables to Electrical
Interfaces 7-17
Connecting Traffic Cables to Optical
Interfaces 7-2
Connecting via Client-provided Power
Distribution Panel 5-13
Connecting via XDM-500 xRAP 5-11
Connection data B-1
M2_84 interface module connection
data B-12
E1 patch panel B-14
M2_84 interface module B-12
MECP connectors B-10
ETHERNET B-10
shelf connectors B-2
ALARMS B-3
DC input power B-2
RAP B-4
xECB B-5
F-CHANNEL B-5
OHA B-8
OW B-7
T3_1/T4_1 B-6
T3_2/T4_2 B-6
xRAP connectors B-28
417006-2304-0H3-B02

Maintenance Manual
Index
CONTROL CONNECTION B31

RAP B-30
SHELF EXTERNAL
ALARM/CONTROL B-28
xRAP-100 connectors B-34
ALARM IN/OUT B-36
SHELF ALARM B-35
SHELF DC power B-34
Connection instructions 7-11, 7-14
Connection via RAP 1-11
Connection via User-provided Power
Connector Pin Assignments B-1
Considerations for Installing Multiple
Shelves in a Single Rack 4-19
CONTROL CONNECTION Connector
B-31
Customer Assistance 8-4
D
Data network commissioning tests 8-27
required equipment 8-27
test sequence 8-27
tests
alarm handling 8-31
frame loss rate 8-29
stability 8-30
system recovery and reset 8-30
throughput and latency 8-28
Data Network Commissioning Tests
8-27
DC Input Power Connectors B-2
DC power cables 4-28
input power cables
connecting to xRAP 4-78
connecting to xRAP-100 4-85
preparation 4-76
preparation for xRAP-100 4-83
shelf power cables
xRAP 4-79
xRAP-100 4-87
DC Power Cables 4-28
417006-2304-0H3-B02
DC Power Warnings 1-12

DC Supply Circuit Connection to the
Grounding Conductor 1-20
DDF A-33
installation 4-101
DDF for Balanced Interfaces A-33
DDF for Unbalanced Interfaces A-34
DDF Units with Built-in Patch Panel
A-35
Deep Doors vs. Standard Doors 4-3
Diagnostic codes 9-28
Digital Distribution Frames See DDF
Digital Distribution Frames (DDF) A-33
Document Conventions xvi
Document Organization xvi
Door Installation 4-5
E
E1 Patch Panel Data B-14
EIS 6-34
optical transceiver installation 6-34
Electrical interface, connecting traffic
cables 7-17
Electricity Safety Warning 1-16
EMS-XDM Checklists 9-9
Environmental and Health Concerns
1-31
Environmental Considerations 4-17
Environmental requirements 4-2
Environmental Requirements 4-2
Environmental Standards F-2
EPA 1-28
Equipment grounding 1-10
1-10, 1-18
Equipment Power-on Test 8-16, 8-34
Equipment racks, installation 4-37
extendable rails 4-42
floor marking 4-37
installation on concrete floors 4-40
installation on raised floors 4-41
installation on wooden floors 4-40
I-3
Index

Maintenance Manual
suspended overhead tray assembly

4-41
ESD protection
general 1-27
personnel training 1-27
Ethernet Connectors B-10
Ethernet Port Precautions 1-19
ETS1 racks 4-14
ETSI
European Telecommunications
Standards Institute F-2
ETSI A Rack 4-14
Expansion Checklist C-6
Expansion Process C-5
Expansions See Upgrades and
Expansions
External Alarm Test 8-42
Extractor Tool for Optical Connectors
4-8
F
F-CHANNEL Connector B-5
Features and Functions 2-3
Fiber Storage Tray See FST
Flow of Management Traffic D-6
Frame Loss Rate Test 8-29
FST A-25
installation 4-96
G
General 1-27
General Safety Requirements 1-5
Cards and Modules 9-13
Optical Transceiver Plug-ins 9-15
Go-Global Test 8-42
Grounded Conductors Requirements
1-19
Grounding
cable preparation 4-24
equipment 1-10
requirements 1-7
I-4
xRAP 4-77
xRAP-100 4-84
Grounding Cables 4-24
Grounding Requirements 1-7
Grounding the Platform 5-3
Grounding the Rack 4-42
H
Handling Transmission Alarms Test
8-22
Hardware Checklists 9-10
Hardware Preventive Maintenance 9-5
Heat Buffer A-26
HLXC/XIO Redundancy Test 8-25
I
I/O cards and modules 6-90
IEC
International Electrotechnical
Commission F-3
IEEE
Institute of Electrical and Electronic
Engineers F-4
IETF
Internet Engineering Task Force F-5
Implementation Principles 2-4
Input Power Cables 4-28
Input power cables for user-provided
distribution panel 4-29
Input Sensitivity Test 8-14, 8-35
Installation Data for XDM-500 I/O Cards
and Associated Modules 6-6
Installation Warning 1-4
Installing
AUX 6-64
cards and modules installation,
general 6-1
EIS 6-34
equipment racks 4-37
FST 4-96
I/O cards 6-90
MECP 6-78
modules 6-92
417006-2304-0H3-B02

Maintenance Manual
Index
OADM1&4 6-66
safety 1-1
XDM accessories A-1
DDF 4-101, A-33
ETSI rack 4-14
FST A-25
ODF A-29
ODF_HP A-31
xRAP A-4
XDM Shelf
connecting cables to electrical
interfaces
ATS cards 7-21
clock cables 7-20
coaxial cables 7-19
multicoax cables 7-18
multipair cables 7-17
connecting cables to optical
interfaces 7-2
connecting fibers to
MECP_OSC 7-7
connecting fibers to
OADM1&4 7-8
connecting fibers to ODF_HP
7-13
connecting fibers to OFA_R
7-9
connecting fibers to SIO16
7-9
ETSI 7-2
optical fibers 7-6
racks 7-5
connecting cables, general 7-1
installing 5-1
air filters 5-6
assembling in rack 5-2
connecting power and bay
alarm cables 5-10
xMCP 6-73
xRAP installation 4-73
xRAP-100 installation 4-82
Installing a Card in the CCP Cage 6-92
Installing Air Filters 5-6
417006-2304-0H3-B02
Installing Ancillary Units in Racks 4-44

Installing and Removing Optical
Transceivers 6-11
Installing Aurora-G Cards 6-79
Installing CMBR40 and TRP40_2 Cards
for Different Configuration Options
6-69
Installing DDF Units 4-101
Installing Equipment Racks 4-37
Installing Extendable Rails 4-42
Installing Extractable Modules in AUX
Cards 6-64
Installing Extractable Modules in
MO_CW2 Modules 6-68
OADM1&4 Cards 6-66
SIO1&4 Cards 6-13
Cards 6-18
in 1 x STM-64 or OTU2
Configuration 6-23
in 4 x STM-16/OTU1 Configuration
6-22
XIO384F Cards 6-28
Installing I/O Cards and Modules 6-90
Installing MECP Cards 6-78
Installing Optical Transceivers in DIO
Cards 6-36
Installing Optical Transceivers in DIOB
Cards 6-38
Installing Optical Transceivers in EIS
Cards 6-34
MCS30_X10G Cards 6-42
MCS5/MCS10 Cards 6-40
SIO1&4B Cards 6-29
SIO16_2B Cards 6-31
I-5
Index

Maintenance Manual

SIO16_4B Cards 6-32
Installing Optical Transceivers in SIO64B
Cards 6-33
Installing Optical Transceivers in XIO192
Cards 6-26
Installing Racks on Concrete Floors
4-40
Installing Racks on Raised Floors 4-41
Installing Racks on Wooden Floors 4-40
Installing the Air Filter 5-7
Installing the Aurora-G Card 6-81
Installing the Filter Frame 5-8
Installing the FST 4-96
Installing the miniRAP 4-90
Installing the ODF 4-98
Installing the xRAP-100 4-82
Installing the xRAP-100 Circuit Breakers
4-88
Installing the xRAP-B 4-63
Installing the xRAP-D 4-45
Installing the xRAP-HP 4-73, 4-77
Installing TRP40_2 Cards for
Regenerator Mode 6-69
Installing Two TRP40_2 or CMBR40
Cards as an OCH 1+1 Protection Pair
6-71
Installing XDM-500
Before You Start Safety Guidelines
1-1
Installing xMCP Cards 6-73
Installing xMCP-B/B2G Cards 6-75
Installing/Replacing the XDM-500
Platform 9-42
SYNCOM Networks D-1
Intended Audience xv
Introduction to the XDM Platform 2-1
IOP Hardware Protection Test 8-20
ISO
International Organization for
Standardization F-7
I-6
ITU-T
International Telecommunication
Union F-7
ITU-T/Telcordia Statutory Warnings and
Requirements 1-19
J
Jewelry Removal Warning 1-6
L
Laser
classification 1-21
information 1-21
operating precautions 1-23
safety 1-22
Raman amplifiers 1-25
statutory warning 1-22
training 1-22
Laser Classification 1-21
Laser Device Operating Precautions
1-23
Laser Information 1-21
Laser Safety Requirements 1-21
Laser Safety Statutory Warning 1-22
LED indicator lights 9-27
LightSoft Checklists 9-10
LOS Detection Test 8-34
Loss of Signal (LOS) Detection Test
8-14
M
B-18
M2_84 interface module B-12
M2_84 Interface Module Connection
Data B-12
B-12
Main Equipment Dimensions 4-2
Maintenance 9-1
air filter preventative maintenance
9-7
preventative maintenance 9-2
417006-2304-0H3-B02

Maintenance Manual
Index
procedures performed via EMS-XDM

9-4
Maintenance Handling Test 8-23
Maintenance Test 8-37
Management access 9-29
Management cable preparation 4-31
Management Cables 4-31
Management commissioning tests 8-39
Management Commissioning Tests 8-39
Management Facilities for Integrated
Networks D-7
Management IP Address Guidelines
6-87
Management Power-off and Recovery
Test 8-40
Management Requirements 8-3
Management to NEs Communication Test
8-39
Marking the Rack Floor 4-37
Matrix and SDH Data Card Upgrades
C-7
Measuring Optical Levels 8-8
Measuring Optical Power 8-33
Measuring Signals at Monitoring Points
8-9
MECP
connectors B-10
installation 6-78
MECP Connectors B-10
MECP_OSC, connecting fibers 7-7
MEF
Metro Ethernet Forum F-12
MET/TUV Listing Identification 1-17
miniRAP A-22
miniRAP Connectors B-40
Modem Connection Test 8-41
Modules
installing 6-92
replacing 9-62
Monthly checklist 9-9, 9-10
MSP 1+1 Test 8-19
MS-SPRing Protection Test 8-26
417006-2304-0H3-B02
Multicoax cables 7-18

Multipair cables 7-17
N
Network Commissioning 8-10
Network commissioning tests 8-10
Network Configuration 8-31
Network Implementation Considerations
D-2
Network Management Considerations
D-5
Network Timing Considerations D-5
Network Timing Synchronization Test
8-13
NIST
National Institute of Standards and
Technology F-12
North American Standards F-13
O
OADM1&4
connecting fibers 7-8
installation 6-66
Obtaining Technical Documentation
xviii
ODF A-29
ODF_HP A-31
overview A-31
physical description A-32
ODF_HP A-31
instructions 7-14
safety 7-13
Optical Distribution Frames See
ODF
overview A-31
physical description A-32
OFA_R, connecting fibers 7-9
instructions 7-11
safety precautions 7-10
OHA Connector B-8
OMG
Object Management Group F-14
I-7
Index

Maintenance Manual
Optical connectors
extractor tool 4-8
Optical Distribution Frames (ODFs)
A-29
Optical Fiber and Cable Installation and
Routing 7-1
Optical Fiber Guides A-27
Optical Fibers
connecting to MECP_OSC 7-7
connecting to OADM1&4 7-8
connecting to ODF_HP 7-13
connecting to OFA_R 7-9
connecting to SIO16 7-9
Optical fibers installation and routing,
general 7-1
routing and connecting 7-6
Optical interface, connecting traffic
cables 7-2
Optical network commissioning tests
8-31
network configuration 8-31
test setup and required equipment
8-32
tests
BER and stability 8-38
equipment power-up 8-34
input sensitivity 8-35
LOS detection 8-34
maintenance action 8-37
optical power measurement 8-33
path protection 8-36
Optical Network Commissioning Tests
8-31
Optical Networks, upgrading and
expansion C-3
expansion checklist C-6
expansion process C-5
optical traffic capacity C-4
Optical Parameters Test 8-41
Optical Rack 4-13
optical transceiver 9-15
Optical transceiver replacement
guidelines 9-60
I-8
Optical Transceiver, replacing

optical plug-in transceiver 9-60
Orderwire Test 8-42
Outline of Installation Procedure 3-5
Outline of Optical Traffic Capacity
Expansion Activities C-4
Overcurrent Protection Requirements
1-18
Overview xv, 1-1, 2-1, 3-1, 4-1, 5-1,
6-1, 8-1, 9-1, A-31, B-1, C-1, D-1,
F-1
OW Connector B-7
OW Connector (MECP_OW and
MECP_OCxxOW) B-11
P
Patch Panel for Balanced Interfaces
A-35
Path Protection and Nonretrieval
Operation Test 8-18
Path Protection Test 8-36
Personnel Training 1-27
Physical description A-32
Physical location 4-5
Physical Location 4-5
Platform Connectors B-2
Platform DC Input Power Connectors
B-21
Platform Power Cables 4-29
Platform Power-On Test Procedure 8-10
Power
consumption 4-6
Power cables
connecting to XDM shelves 5-10
DC input to xRAP-100 4-82
Power Consumption Data 4-6
Power supply requirements 1-11
Connection via User-Provided Power
Connection via xRAP/xRAP-100
1-11
Power Supply Requirements 1-11
Preliminary Preparations 3-2
417006-2304-0H3-B02

Maintenance Manual
Index
Preparations for Test 8-12

Preparing a DC Power Cable for
xRAP-100 4-83
Preparing Cards and Modules for
Installation 6-10
Preparing CMBR10_x Cards for
Installation 6-44
Preparing CMBR25_2/2O Cards for
Installation 6-49
Preparing CMBR40 Cards for Installation
6-53
Preparing CMTR25 Cards for Installation
6-51
Preparing DC Input Power Cables 4-46,
4-76
Preparing SIO1&4 Cards for Installation
6-13
6-17
6-21
Preparing the AoC Card for Installation
6-61
Preparing the DC Power Cables 4-91
Preparing Transponders and Combiners
for Installation 6-44
Preparing TRP10_2B Cards for
Installation 6-54
Preparing TRP10_4M/R Cards for
Installation 6-55
Preparing TRP10_LAN Cards for
Installation 6-57
Preparing TRP25_4 Cards for Installation
6-59
Prerequisites 8-3
Preventing Configuration Problems in the
Integrated Network D-8
Preventive Maintenance 9-2
Preventive Maintenance Checklists 9-9
Preventive Maintenance Procedures via
EMS-XDM 9-4
Protection Against Electrostatic
Discharge 1-26
417006-2304-0H3-B02
Q
Qualified Personnel Warning 1-3
Quarterly checklist 9-9, 9-10, 9-11
R
Rack
assembling XDM shelves 5-2
cable routing 7-5
ETS1 4-14
installing 4-37
Rack Alarm Panel Power and Alarm
Connection Options A-4
Rack Grounding Requirements 1-8
Rack Space Requirements 4-12
RAP Connectors B-30
Rap Features A-5
RDR Test 8-41
Recommended Cleaning Methods 9-7
Recommended Integration Procedures
D-8
Related Documentation xvii
Replacement
components
cards, modules, fans , and other
components 9-43
I/O cards 9-59
MECP 9-57
NVM 9-52, 9-56
optical transceivers 9-59
optical plug-in transceiver
9-60
xECB 9-50
xFCU 9-48
xINF 9-49
xINF-H 9-49
xMCP 9-53
xRAP circuit breakers 9-45
xRAP-100 circuit breakers
9-46
modules 9-62
network element 9-40
Replacing a Network Element 9-40
I-9
Index

Maintenance Manual
Replacing Cards 9-50

Replacing Cards, Modules, Fans, and
Other Components 9-43
Replacing I/O Cards 9-59
Replacing miniRAP Circuit Breakers
9-47
Replacing Modules in the Modules Cage
9-62
Replacing Optical Transceivers 9-59
Replacing the FCU 9-48
Replacing the MECP 9-57
Replacing the NVM in the ATS Card
9-56
Replacing the NVM in the xMCP Card
9-52
Replacing the NVM in the xMCP-B Card
9-54
Replacing the xECB 9-50
Replacing the xMCP 9-53
Replacing the xMCP-B 9-55
Replacing XDM-500 Components 9-48
Replacing xINF/xINF-H Units 9-49
Replacing xRAP-100 Circuit Breakers
9-46
Replacing xRAP-D Circuit Breakers
9-43
Replacing xRAP-HP Circuit Breakers
9-45
Required Test Equipment 8-10, 8-27
Required Test Equipment, Tools, and
Materials 9-2
Routing and Connecting Clock Cables
7-20
Routing and Connecting Coaxial Cables
7-19
Routing and Connecting Ethernet Cables
7-19
Routing and Connecting Multicoax
Cables 7-18
Routing and Connecting Multipair Cables
7-17
Routing and Connecting Optical Fibers
7-6
I-10
Routing Guidelines for Type A ETSI

Rack 7-2
Routing in Standard Racks 7-5
S
Safety
ESD protection 1-26
general 1-27
personnel training 1-27
temporary EPA 1-28
work arrangements in temporary
EPA 1-30
general requirements 1-5
grounding 1-7
equipment grounding 1-10
laser 1-21
information 1-21
operating precautions 1-23
Raman amplifiers 1-25
training 1-22
warning labels 1-21
power supply 1-11
user-provided power distribution
panel 1-11
xRAP/xRAP-100 1-11
UL statutory warnings and
requirements 1-17
equipment grounding 1-18
grounded conductors 1-19
UL 1-17
UL overcurrent protection 1-18
warning label 1-17
Safety and Workmanship 9-43
Saving EMS-XDM Configuration Files
9-40
SDH Network Commissioning Tests
8-10
Security Test 8-39
Severity Assignment Test 8-21
SEVERITY IN Connector B-40
SEVERITY OUT Connector B-41
SHELF Alarm Connectors B-21
SHELF ALARM Connectors B-35
417006-2304-0H3-B02

Maintenance Manual
Index
Shelf connectors B-2

ALARMS B-3
DC input power B-2
RAP B-4
Shelf DC Input Power Connectors B-40
SHELF DC Power Connectors B-34
SHELF EXTERNAL
ALARM/CONTROL Connectors
B-28
Shelf View 9-4
SIO16
Site commissioning tests 8-5
installed cards and modules 8-5
optical level measurement 8-8
shelf power-up 8-10
Site Commissioning Tests 8-5
Site installation and physical inspection
4-1
racks 4-10
requirements 4-1
physical location 4-5
tools and test equipment 4-8
Site Preparation 4-1
Site Preparation and Rack Installation
4-1
Slot designation conversion table E-1
Slot Designation Conversion Table E-1
Specific safety precautions 7-13
Specific safety precautions for
OFA_R/RM/HRM cards 7-10
Stability Test 8-17, 8-30
Stages of a Typical Installation 3-3
Standard ODF A-29
Standard test conditions for DS-3 ports
8-11
8-10
8-11
Standard test conditions for SDH ports
8-11
417006-2304-0H3-B02
Standard test conditions for SONET ports

8-12
Standards and References F-1
Support xviii
System Recovery and Reset Test 8-30
T
T3_1/T4_1 and T3_2/T4_2 Connectors
B-6
Technical Assistance xviii
Technical support xviii
Test Sequence 8-12, 8-27
Test Setup and Required Test Equipment
8-32
Tests
commissioning tests 8-1
data network commissioning tests
8-27
management commissioning tests
8-39
network commissioning tests 8-10
optical network commissioning tests
8-31
site commissioning tests 8-5
Throughput and Latency Tests 8-28
Timing (clock) cable preparation 4-31
Timing (Clock) Cables 4-31
TMF
TeleManagement Forum F-14
Tools and Equipment 8-2
Tools and test equipment
extractor tool for optical connectors
4-8
traffic cable tools 4-8
unpacking 4-9
visual inspection after unpacking
4-9
Tools and Test Equipment 4-8
Tools for Traffic Cable Assembly 4-8
Traffic 9-31
Traffic cables
connecting to optical interfaces 7-2
tools 4-8
I-11
Index

Maintenance Manual
Traffic Cables 4-32

Trail Consistency Indication (TCI) Test
8-40
Trail Creation Test 8-40
Training for Laser Safety 1-22
Troubleshooting 9-11
ATS cards 9-33
card/module 9-13
DCC/management channel
malfunctions
management communication
9-39
DIO cards 9-20
EIS cards 9-19
electrical interface modules 9-16
optical OADM, mux/demux and
VMUX 9-17
optical transceivers 9-15
power problems 9-36
timing subsystem 9-38
transmission and traffic alarms 9-34
Troubleshooting Management
Communication 9-39
Troubleshooting Power Problems 9-36
Troubleshooting Procedure for Optical
OADM and Mux/DeMux 9-17
Troubleshooting Procedures for ATS
Cards 9-33
Troubleshooting Procedures for Aurora-G
Cards 9-26
Troubleshooting Procedures for DIO
Cards 9-20
Troubleshooting Procedures for DIOB
Cards 9-22
Troubleshooting Procedures for EIS
Cards 9-19
Troubleshooting Procedures for Electrical
Interface Modules 9-16
Troubleshooting Procedures for
MCS5/MCS10 Cards 9-23
Troubleshooting Procedures for ROADM
Cards 9-25
I-12
Troubleshooting the Timing Subsystem

9-38
Troubleshooting Transmission and
Traffic Alarms 9-34
Troubleshooting Using Component
Indicators 9-13
TUV Statutory Warnings and
Requirements 1-17
Typical Installation Setup A-2
Typical XDM Installations in Racks
4-20
U
UL
equipment grounding requirements
1-18
listing 1-17
overcurrent protection safety 1-18
requirements for grounded conductors
1-19
warning label 1-17
Understanding the Aurora-G LED
Indicators 6-85
Unpacking 4-9
Unpacking and Visual Inspection 4-9,
6-80
Upgrades and Expansions C-1
16-channel to 32-channel mux/demux
C-2
optical networks C-3
Upgrading and Expanding Optical
Networks C-3
Upgrading to an Optical Module with a
Removable SFP 6-19
Upgrading to Optical Modules with
Removable SFPs 6-15
Uploading the NE Database from the
XDM-500 9-40
Use of Temporary EPA 1-28
Using Electrical Interface Protection
Modules 6-9
Using XDM Equipment to Transport
SYNCOM Traffic D-2
417006-2304-0H3-B02

Maintenance Manual
Index
V
Visual Inspection and Mechanical Checks
8-6
Voltage test
xRAP 4-81
xRAP-100 4-89
W
Warning Definition 1-2
Warning Label 1-17
Warning labels 1-17
Warning Labels for Laser Products 1-21
Web Protocol Standards F-14
Weekly checklist 9-9, 9-10
Work Arrangements within a Temporary
EPA 1-30
X
XDM accessories
cable and fiber guides A-26
DDF A-33
ETSI rack 4-14
FST A-25
ODF A-29
ODF_HP A-31
xRAP A-4
XDM Accessories A-1
XDM integration in SYNCOM networks
D-1
network management D-5
network timing D-5
recommended integration procedures
D-8
XDM Product Lines 2-2
XDM Rack Alarm Panel See xRAP
XDM Rack Installation Options 4-10
XDM shelves 5-1
connecting cables 7-1
connecting DC power cables 4-87
installation 5-1
air filters 5-6
assembling in rack 5-2
grounding 5-3
417006-2304-0H3-B02
XDM-500 2-7
XDM-500 Installation Overview 3-1
XDM-500 Platform Installation 5-1
XDM-500 Slot Utilization 6-4
xECB connectors B-5
F-CHANNEL B-5
OHA B-8
OW B-7
T3_1/T4_1 B-6
T3_2/T4_2 B-6
xECB Connectors B-5
xMCP Redundancy Test 8-24
xMCP, installation 6-73
xRAP A-4
connecting power and bay alarm
cables to XDM shelves 5-11
connectors B-28
CONTROL CONNECTION
B-31
RAP B-30
SHELF EXTERNAL
ALARM/CONTROL B-28
installation 4-73, 4-77
alarm cables 4-81
circuit breakers 4-80, 9-45
connecting DC power cables
4-79
connecting input power cables
4-78
input power cables
preparation 4-76
grounding 4-77
xRAP Connector B-4
xRAP input power cables 4-28
xRAP-100 A-19
circuit breakers 9-46
connecting power and bay alarm
cables to XDM shelves 5-11
connectors B-28
ALARM IN/OUT B-36
SHELF ALARM B-35
SHELF DC power B-34
installation 4-82, 4-83
I-13
Index

Maintenance Manual
alarm cables 4-90

cable routes 4-82
circuit breakers 4-88
DC power cables
connecting 4-82, 4-87
connecting input power cables
4-85
preparation 4-83
grounding 4-84
performing a voltage test 4-89
I-14
xRAP-100 Connectors B-34

xRAP-B A-13
xRAP-D A-7
xRAP-D Connectors B-21
xRAP-HP A-16
xRAP-HP Connectors B-28
417006-2304-0H3-B02

XDM-500 IMM ETSI B02 8.3 en

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XDM-500

Installation and Maintenance Manual

XDM-500 (ETSI) Installation and Maintenance Manual

Copyright by ECI, 2004-2011. All rights reserved worldwide.

Installing XDM-500: Before You Start Safety Guidelines ..... 1-1

Introduction to the XDM Platform .......................................... 2-1

XDM-500 Installation Overview .............................................. 3-1

ECI Telecom Ltd. Proprietary

XDM-500 Installation and

Site Preparation and Rack Installation .................................. 4-1

XDM-500 Platform Installation ................................................ 5-1

Card and Module Installation ................................................. 6-1

Optical Fiber and Cable Installation and Routing................. 7-1

Commissioning Tests ............................................................. 8-1

ECI Telecom Ltd. Proprietary

XDM-500 Installation and

Maintenance ............................................................................. 9-1

XDM Accessories ................................................................... A-1

Typical Installation Setup ................................................................................. A-2

Connector Pin Assignments ................................................. B-1

Overview .......................................................................................................... B-1

Upgrades and Expansions .................................................... C-1

ECI Telecom Ltd. Proprietary

XDM-500 Installation and

Integrating XDM Equipment in SYNCOM Networks ............ D-1

Slot Designation Conversion Table .......................................E-1

Slot Designation Conversion Table .................................................................. E-1

Standards and References ..................................................... F-1

Overview .......................................................................................................... F-1

Index .......................................................................................... I-1

ECI Telecom Ltd. Proprietary

ECI Telecom Ltd. Proprietary

XDM-500 Installation and

Figure 4-25: Replacement spacer screw ..................................................................... 4-57

ECI Telecom Ltd. Proprietary

XDM-500 Installation and

ECI Telecom Ltd. Proprietary

XDM-500 Installation and

Figure 6-31: Identifying the optical transceiver plug-in (XFP) position in

ECI Telecom Ltd. Proprietary

XDM-500 Installation and

Figure 9-4: Replacing xRAP-100 circuit breakers ........................................................ 9-46

ECI Telecom Ltd. Proprietary

XDM-500 Installation and

ECI Telecom Ltd. Proprietary

XDM shelves circuit breaker rating...................................................... 1-11

Environmental requirements ................................................................. 4-2

Main equipment dimensions .................................................................. 4-2

Comparison deep vs. standard door ..................................................... 4-4

Maximum power consumption data....................................................... 4-6

Equipment rack data............................................................................ 4-11

Rack space requirements .................................................................... 4-12

Traffic cables, fibers, and mating connector data ............................... 4-32

xRAP input and output alarm allocation .............................................. 4-75

Connecting power and rack alarm cables ........................................... 5-12

Aurora-G cables .................................................................................. 6-80

Table 6-4: Serial port parameters ................................................................................ 6-86

IP address command line parameters................................................. 6-89

Card and module inventory ................................................................... 8-5

Visual inspection and mechanical checks ............................................. 8-7

Measured optical levels ......................................................................... 8-8

Signal characteristics at monitoring points ............................................ 8-9

Throughput and latency test results .................................................... 8-29