Hispeed Dual Theory of Operation

GE Healthcare
gehealthcare.com
Technical
Publication
5116384
Revision 8
HiSpeed Dual, ProSpeed FII

Theory of Operation
Copyright 2004-2008 by General Electric Company
Operating Documentation

THEORY OF OPERATION
GE HEALTHCARE
REV 8
5116384
(ZH-CN)
VSTRAHA
(CS)
ADVARSEL
(DA)
WAARSCHUWING
(NL)
WARNING
(EN)
HOIATUS
(ET)
Tento provozn nvod existuje pouze v anglickm jazyce.

V ppad, e extern sluba zkaznkm potebuje nvod v jinm jazyce, je
zajitn pekladu do odpovdajcho jazyka kolem zkaznka.
Nesnate se o drbu tohoto zazen, ani byste si peetli tento provozn
nvod a pochopili jeho obsah.
V ppad nedodrovn tto vstrahy me dojt k porann pracovnka
prodejnho servisu, obslunho personlu nebo pacient vlivem elektrickho
proudu, respektive vlivem mechanickch i jinch rizik.
Denne servicemanual findes kun p engelsk.
Hvis en kundes tekniker har brug for et andet sprog end engelsk, er det
kundens ansvar at srge for oversttelse.
Forsg ikke at servicere udstyret medmindre denne servicemanual har vret
konsulteret og er forstet.
Manglende overholdelse af denne advarsel kan medfre skade p grund af
elektrisk, mekanisk eller anden fare for teknikeren, operatren eller patienten.
Deze onderhoudshandleiding is enkel in het Engels verkrijgbaar.
Als het onderhoudspersoneel een andere taal vereist, dan is de klant
verantwoordelijk voor de vertaling ervan.
Probeer de apparatuur niet te onderhouden voordat deze
onderhoudshandleiding werd geraadpleegd en begrepen is.
Indien deze waarschuwing niet wordt opgevolgd, zou het
onderhoudspersoneel, de operator of een patint gewond kunnen raken als
gevolg van een elektrische schok, mechanische of andere gevaren.
This Service Manual is available in English only.
If a customer's service provider requires a language other than English, it is the
customer's responsibility to provide translation services.
Do not attempt to service the equipment unless this service manual has been
consulted and is understood.
Failure to heed this warning may result in injury to the service provider,
operator, or patient, from electric shock or from mechanical or other hazards.
Kesolev teenindusjuhend on saadaval ainult inglise keeles.
Kui klienditeeninduse osutaja nuab juhendit inglise keelest erinevas keeles,
vastutab klient tlketeenuse osutamise eest.
rge ritage seadmeid teenindada enne eelnevalt
kesoleva teenindusjuhendiga tutvumist ja sellest aru saamist.
Kesoleva hoiatuse eiramine vib phjustada teenuseosutaja, operaatori vi
patsiendi vigastamist elektrilgi, mehaanilise vi muu ohu tagajrjel.
a

THEORY OF OPERATION
GE HEALTHCARE
VAROITUS
(FI)
ATTENTION
(FR)
WARNUNG
(DE)
(EL)
FIGYELMEZTETS
(HU)
Tm huolto-ohje on saatavilla vain englanniksi.

Jos asiakkaan huoltohenkilst vaatii muuta kuin englanninkielist materiaalia,
tarvittavan knnksen hankkiminen on asiakkaan vastuulla.
l yrit korjata laitteistoa ennen kuin olet varmasti lukenut ja ymmrtnyt
tmn huolto-ohjeen.
Mikli tt varoitusta ei noudateta, seurauksena voi olla huoltohenkilstn,
laitteiston kyttjn tai potilaan vahingoittuminen shkiskun, mekaanisen
vian tai muun vaaratilanteen vuoksi.
Ce manuel de service n'est disponible qu'en anglais.
Si le technicien du client a besoin de ce manuel dans une autre langue que
l'anglais, c'est au client qu'il incombe de le faire traduire.
Ne pas tenter d'intervenir sur les quipements tant que le manuel service n'a
pas t consult et compris
Le non-respect de cet avertissement peut entraner chez le technicien,
l'oprateur ou le patient des blessures dues des dangers lectriques,
mcaniques ou autres.
Diese Serviceanleitung existiert nur in Englischer Sprache.
Falls ein fremder Kundendienst eine andere Sprache bentigt, ist es aufgabe
des Kunden fr eine Entsprechende bersetzung zu sorgen.
Versuchen Sie nicht diese Anlage zu warten,
ohne diese Serviceanleitung gelesen und verstanden zu haben.
Wird diese Warnung nicht beachtet, so kann es zu Verletzungen des
Kundendiensttechnikers, des Bedieners oder des Patienten durch
stromschlge, Mechanische oder Sonstige gefahren kommen.
.

,
.

.
,
,
, .
Ezen karbantartsi kziknyv kizrlag angol nyelven rhet el.
Ha a vev szolgltatja angoltl eltr nyelvre tart ignyt, akkor a vev
felelssge a fordts elkszttetse.
Ne prblja elkezdeni hasznlni a berendezst, amg a karbantartsi
kziknyvben lertakat nem rtelmeztk.
Ezen figyelmeztets figyelmen kvl hagysa a szolgltat, mkdtet vagy a
beteg ramts, mechanikai vagy egyb veszlyhelyzet miatti srlst
eredmnyezheti.

THEORY OF OPERATION
GE HEALTHCARE
AVRUN
(IS)
AVVERTENZA
(IT)
(JA)
(KO)
BRDINJUMS
(LV)
essi jnustuhandbk er eingngu fanleg ensku.

Ef a jnustuveitandi viskiptamanns arfnast annas tungumls en ensku, er
a skylda viskiptamanns a skaffa tungumlajnustu.
Reyni ekki a afgreia tki nema a essi jnustuhandbk
hefur veri skou og skilin.
Brot sinna essari avrun getur leitt til meisla jnustuveitanda,
stjrnanda ea sjklings fr raflosti, vlrnu ea rum httum.
Il presente manuale di manutenzione disponibile soltanto in inglese.
Se un addetto alla manutenzione richiede il manuale in una lingua diversa, il
cliente tenuto a provvedere direttamente alla traduzione.
Si proceda alla manutenzione dell'apparecchiatura solo dopo aver consultato il
presente manuale ed averne compreso il contenuto
Il non rispetto della presente avvertenza potrebbe far compiere operazioni da
cui derivino lesioni all'addetto, alla manutenzione, all'utilizzatore ed al paziente
per folgorazione elettrica, per urti meccanici od altri rischi.

.
,
.

.
,
, .
apkalpes rokasgrmata ir pieejama tikai angu valod.
Ja klienta apkalpes sniedzjam nepiecieama informcija cit valod, nevis
angu, klienta pienkums ir nodroint tulkoanu.
Neveiciet aprkojuma apkalpi bez apkalpes rokasgrmatas izlasanas un
sapraanas.
brdinjuma neievroana var radt elektrisks strvas trieciena, mehnisku
vai citu risku izraistu traumu apkalpes sniedzjam, operatoram vai pacientam.

THEORY OF OPERATION
GE HEALTHCARE
SPJIMAS
(LT)
ADVARSEL
(NO)
OSTRZEENIE
(PL)
ATENO
(PT-BR)
ATENO
(PT-PT)
is eksploatavimo vadovas yra prieinamas tik angl kalba.

Jei kliento paslaug tiekjas reikalauja vadovo kita kalba ne angl, numatyti
vertimo paslaugas yra kliento atsakomyb.
Nemginkite atlikti rangos technins prieiros, nebent atsivelgte
eksploatavimo vadov ir j supratote.
Jei neatkreipsite dmesio perspjim, galimi sualojimai dl elektros oko,
mechanini ar kit pavoj paslaug tiekjui, operatoriui ar pacientui.
Denne servicehndboken finnes bare p engelsk.
Hvis kundens serviceleverandr trenger et annet sprk, er det kundens ansvar
srge for oversettelse.
Ikke forsk reparere utstyret uten at denne servicehndboken er lest og
forsttt.
Manglende hensyn til denne advarselen kan fre til at serviceleverandren,
operatren eller pasienten skades p grunn av elektrisk stt, mekaniske eller
andre farer.
Niniejszy podrcznik serwisowy dostpny jest jedynie w jzyku angielskim.
Jeli dostawca usug klienta wymaga jzyka innego ni angielski, zapewnienie
usugi tumaczenia jest obowizkiem klienta.
Nie prbowa serwisowa wyposaenia bez zapoznania si i zrozumienia
niniejszego podrcznika serwisowego.
Niezastosowanie si do tego ostrzeenia moe spowodowa urazy dostawcy
usug, operatora lub pacjenta w wyniku poraenia elektrycznego, zagroenia
mechanicznego bd innego.
Este manual de assistncia tcnica s se encontra disponvel em ingls.
Se qualquer outro servio de assistncia tcnica, que no a gems, solicitar
estes manuais noutro idioma, da responsabilidade do cliente fornecer os
servios de traduo.
No tente reparar o equipamento sem ter consultado ecompreendido este
manual de assistncia tcnica.
O no cumprimento deste aviso pode por em perigo a segurana do tcnico,
operador ou paciente devido a choques eltricos, mecnicos ou outros.
Este manual de assistncia tcnica s se encontra disponvel em ingls.
Se qualquer outro servio de assistncia tcnica, que no a gems, solicitar
estes manuais noutro idioma, da responsabilidade do cliente fornecer os
servios de traduo.
No tente reparar o equipamento sem ter consultado ecompreendido este
manual de assistncia tcnica.
O no cumprimento deste aviso pode colocar em perigo a segurana do
tcnico, do operador ou do paciente devido a choques elctricos, mecnicos
ou outros.

THEORY OF OPERATION
GE HEALTHCARE
ATENIE
(RO)
!
(RU)
UPOZORENJE
(SR)
UPOZORNENIE
(SK)
ATENCION
(ES)
Acest manual de service este disponibil numai n limba englez.

Dac un furnizor de servicii pentru clieni necesit o alt limb dect cea
englez, este de datoria clientului s furnizeze o traducere.
Nu ncercai s reparai echipamentul dect ulterior consultrii i nelegerii
acestui manual de service.
Ignorarea acestui avertisment ar putea duce la rnirea depanatorului,
operatorului sau pacientului n urma pericolelor de electrocutare, mecanice sau
de alt natur.

.

, - ,
.

.

, ,
,
.
Ovo servisno uputstvo je dostupno samo na engleskom jeziku.
Ako klijentov serviser zahteva neki drugi jezik, klijent je duan da obezbedi
prevodilacke usluge.
Ne pokuavajte da opravite uredaj ako niste procitali i razumeli ovo servisno
uputstvo.
Zanemarivanje ovog upozorenja moe dovesti do povredivanja servisera,
rukovaoca ili pacijenta usled strujnog udara ili mehanickih i drugih opasnosti.
Tento nvod na obsluhu je k dispozcii len v anglitine.
Ak zkaznkov poskytovate sluieb vyaduje in jazyk ako anglitinu,
poskytnutie prekladateskch sluieb je zodpovednosou zkaznka.
Nepokajte sa o obsluhu zariadenia skr, ako si nepretate nvod na obluhu
a neporozumiete mu.
Zanedbanie tohto upozornenia me vysti do zranenia poskytovatea
sluieb, obsluhujcej osoby alebo pacienta elektrickm prdom, do
mechanickho alebo inho nebezpeenstva.
Este manual de servicio slo existe en ingls.
Si el encargado de mantenimiento de un cliente necesita un idioma que no sea
el ingls, el cliente deber encargarse de la traduccin del manual.
No se deber dar servicio tcnico al equipo, sin haber consultado y
comprendido este manual de servicio.
La no observancia del presente aviso puede dar lugar a que el proveedor de
servicios, el operador o el paciente sufran lesiones provocadas por causas
elctricas, mecnicas o de otra naturaleza.

THEORY OF OPERATION
GE HEALTHCARE
VARNING
(SV)
DIKKAT
(TR)
(BG)
Den hr servicehandboken finns bara tillgnglig p engelska.

Om en kunds servicetekniker har behov av ett annat sprk n engelska
ansvarar kunden fr att tillhandahlla versttningstjnster.
Frsk inte utfra service p utrustningen om du inte har lst och frstr den
hr servicehandboken.
Om du inte tar hnsyn till den hr varningen kan det resultera i skador p
serviceteknikern, operatren eller patienten till fljd av elektriska sttar,
mekaniska faror eller andra faror.
Bu servis kilavuzunun sadece ingilizcesi mevcuttur.
Eer mteri teknisyeni bu kilavuzu ingilizce diinda bir baka lisandan talep
ederse, bunu tercme ettirmek mteriye der.
Servis kilavuzunu okuyup anlamadan ekipmanlara mdahale etmeyiniz.
Bu uyariya uyulmamasi, elektrik, mekanik veya dier tehlikelerden dolayi
teknisyen, operatr veya hastanin yaralanmasina yol aabilir.
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,
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,
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THEORY OF OPERATION
GE HEALTHCARE
REV 8
5116384
DAMAGE IN TRANSPORTATION
All packages should be closely examined at time of delivery. If damage is apparent write Damage In Shipment on ALL
copies of the freight or express bill BEFORE delivery is accepted or signed for by a GE representative or hospital receiving
agent. Whether noted or concealed, damage MUST be reported to the carrier immediately upon discovery, or in any event,
within 14 days after receipt, and the contents and containers held for inspection by the carrier. A transportation company
will not pay a claim for damage if an inspection is not requested within this 14 day period.
To file a report:
Fill out a report on http://egems.med.ge.com/edq/home.jsp
Contact the local service coordinator.
CERTIFIED ELECTRICAL CONTRACTOR STATEMENT

All electrical Installations that are preliminary to positioning of the equipment at the site prepared for the equipment shall be
performed by licensed electrical contractors. In addition, electrical feeds into the Power Distribution Unit shall be performed
by licensed electrical contractors. Other connections between pieces of electrical equipment, calibrations and testing shall
be performed by qualified GE Medical personnel. The products involved (and the accompanying electrical installations) are
highly sophisticated, and special engineering competence is required. In performing all electrical work on these products,
GE will use its own specially trained field engineers. All of GEs electrical work on these products will comply with the
requirements of the applicable electrical codes.
The purchaser of GE equipment shall only utilize qualified personnel (i.e., GEs field engineers, personnel of third-party
service companies with equivalent training, or licensed electricians) to perform electrical servicing on the equipment.
IMPORTANT! . . . X-RAY PROTECTION

X-ray equipment if not properly used may cause injury. Accordingly, the instructions herein contained should be thoroughly
read and understood by everyone who will use the equipment before you attempt to place this equipment in operation. The
General Electric Company, Medical Systems Group, will be glad to assist and cooperate in placing this equipment in use.
Although this apparatus incorporates a high degree of protection against x-radiation other than the useful beam, no practical
design of equipment can provide complete protection. Nor can any practical design compel the operator to take adequate
precautions to prevent the possibility of any persons carelessly exposing themselves or others to radiation.
It is important that anyone having anything to do with x-radiation be properly trained and fully acquainted with the
recommendations of the National Council on Radiation Protection and Measurements as published in NCRP Reports
available from NCRP Publications, 7910 Woodmont Avenue, Room 1016, Bethesda, Maryland 20814, and of the
International Commission on Radiation Protection, and take adequate steps to protect against injury.
The equipment is sold with the understanding that the General Electric Company, Medical Systems Group, its agents, and
representatives have no responsibility for injury or damage which may result from improper use of the equipment.
Various protective materials and devices are available. It is urged that such materials or devices be used.

THEORY OF OPERATION
GE HEALTHCARE
REV 8
5116384
LITHIUM BATTERY CAUTIONARY STATEMENTS
CAUTION
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by the manufacturer. Discard used batteries according to the manufacturers
instructions.
OMISSIONS & ERRORS

Customers, please contact your GE Sales or Service representatives.
GE personnel, please use the GEMS CQA Process to report all omissions, errors, and defects in this publication.

THEORY OF OPERATION
GE HEALTHCARE
REV 8
5116384
LIST OF EFFECTIVE PAGES

Tab - Section
3 (Table/Gantry)
General Description
1-1 to 1-3
Sub-Assembly Description
2-1 to 2-16
1-1
Detector
2-1 to 2-6
Data Acquisition System (MDAS)
3-1 to 3-12
Data Acquisition System (GDAS)
4-1 to 4-12
General Description - I
1-1 to 1-2
General Description - II
2-1 to 2-5
3-1
A-1 to A-4
Blank/Rear cover
Page
REV
Title page
Title page rear
8
blank
(Warning and other

important information)
a toh
(Revision Information)
A to B
1 (System)
General Description
1-1 to 1-8
Power Distribution
2-1 to 2-10
Scan Operation
3-1 to 3-9
General Description
1-1 to 1-7
Typical Signals
Host Processor
2-1 to 2-5
Connector Boards
3-1 to 3-6
4-1
2 (Operator Console)
Other OC Components
4 (DAS/Detector)
General Description
5 (X-ray Generator)
Appendix
Symbols and Classification

THEORY OF OPERATION
GE HEALTHCARE
REV 8
5116384
REVISION HISTORY
REV
Date
12/29/08
Primary Reason for Change

Warning
Added new languages for PT-BR (Portuguese-Brazil) and SR (Serbian).

Renamed PT to PT-PT (Portuguese-Portugal).
System
OC
Table/Gantry
DAS/Detector
Updated Figure for DAS Signal Connection (Flex Cables & Connectors) according to
PQR13206154. (Sec. 3 & Sec. 4)
X-ray Generator
10/24/07
OC
Added HP8400 information. (Sec. 1 & Sec. 2)
04/16/07
OC
Updated OC Block Diagram. (Sec. 1)
X-ray Generator
Updated illustration of Jedi Generator / Packaging Architecture. (Sec. 2)
OC
Updated VSPL Board as an option in 5114678-3 & 5114679-2 in Illustration 1-1 Operator Console
Block Diagram (Sec. 1)
09/11/06
05/14/06
System
Updated Illustration 1-2 System Block Diagram for GDAS (Sec. 1)
03/04/06
System
Updated Illustration 1-1 System Block Diagram (Sec. 1)
DAS/Detector
Added: Illustration of Detector Channel Distribution for GDAS (Sec. 2)

Added: A sec for GDAS (Sec. 4)
Add HPxw8200 Host CPU contents in OC section 2.
07/25/05
OC
10/15/04
Initial Release.

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384
SYSTEM
TABLE OF CONTENTS
SECTION
PAGE
SECTION 1 - GENERAL DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1
1-2
1-3
1-4
1-1
INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SYSTEM OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SYSTEM SPECIFICATIONS AND DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SYSTEM OPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-1
1-4
1-6
SECTION 2 - POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-1
POWER DISTRIBUTION UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-1-1
Power On/Off Timing Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SAFETY LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-7
2-9
SECTION 3 - SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
2-2
3-1
3-2
3-3
WARM-UP SCANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AXIAL SCANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-2-1
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-2-2
Scan Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-2-3
Asymmetric Scan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-2-4
Twin Cine Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-2-5
Auto mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SCOUT SCANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
3-4
3-4
3-4
3-6
3-8
3-8
3-9
SYSTEM

THEORY OF OPERATION
GE HEALTHCARE
SYSTEM

THEORY OF OPERATION
GE HEALTHCARE
REV 4
5116384
SECTION 1 - GENERAL DESCRIPTION

1-1
INTRODUCTION
The features of this CT (Computed Tomography) system, one of the CT scanners of this series, include the
following:
Workstation type information processing system,
Solid-state x-ray intensity detector,
Continuous rotation type gantry with slip rings and high frequency coupling.
This CT system is comprised of the following main components (called subsystems):
Operator Console (called OC)
Scanning Gantry (called gantry)

This subsystem further includes the following subsystems:
-
DAS/Detector
X-ray Generator (called XG)
Patient Table (called table)
Power Distribution Unit (called PDU)
The system may include some of the following customer option equipments:
1-2
Advantage Windows Image Workstation
Image Camera
SYSTEM OVERVIEW
Illustration 1-1 and Illustration 1-2 shows the system block diagram.
The operator console (OC) controls the entire system, according to the operators operations. The OC sends
instructions to the processor of the TGP board, which then controls the gantry and table subsystems according to
the instructions.
The TGP board processor also passes the OC instructions to the processor of the OGP board which is equipped on
the gantry rotative frame. The OGP board controls the DAS subsystem, the collimator aperture, or positioning lights
according to the passed instructions.
The OGP board processor also passes the instructions from the TGP board to the processor of the x-ray generator
subsystem. The XG processor controls the x-ray generator according to the instructions (originally from the OC).
Reversely, the OC receives status information from the TGP board or other processors (via the TGP board).
1-1
SYSTEM

THEORY OF OPERATION
GE HEALTHCARE
REV 4
5116384
Illustration 1-1
System Block Diagram (for system with MDAS)
Tube
PDU
High Voltage
JEDI
Auxiliary Unit
SR
AC115
XG Power
AC308-480
Power Unit
Gantry
Rotational
Temperature
Control
Twin Detector
TG/OC
AC115
Twin DAS
Step Motor
Z axial Photo Sensor
HSDCD
Receiver
Slip Ring
HSDCD
Transmitter
DCP2
Axial Drive
AC200
Cover
Boards
Tilt Pot.
Servo Motor
Servo
Amp.
Azimuth Encode
Twin Collimator
Gantry
Stationary
OGP
Board
Step Motor
Step Motor
Driver
Foot SW
Table
Board
Table
Connector
Board
Pump/Value for
Table Elevation
DASIFN
Cradle
Encoder
Speaker
Pump/Value
for Gantry tilt
Aperture Encoder
Step Motor
Power
Supply
Cover Switch
SUB
Board
TGP
Board
Touch Sensors
DBPCI 1
Host Processor
Key B'd
Latch Switch
Pot. For
Horizontal
DBPCI 0
Monitor
SCSI1
SCSI0-00 SCSI0-01
System Raw Data

HDD
Rear CN HDD
DASM
DVD
OC
Table
1-2
5" MOD (Option)
SYSTEM

THEORY OF OPERATION
GE HEALTHCARE
REV 4
5116384
Illustration 1-2
System Block Diagram (for system with GDAS)
Tube
PDU
High Voltage
JEDI
Auxiliary Unit
SR
AC115
XG Power
AC308-480
Power Unit
Gantry
Rotational
Temperature
Control
Twin Detector
TG/OC
AC115
HSDCD
Transmitter
DCP2
Step Motor
Z axial Photo Sensor
HSDCD
Receiver
Slip Ring
Twin DAS
Axial Drive
AC200
Cover
Boards
Tilt Pot.
Servo Motor
Servo
Amp.
Azimuth Encode
Twin Collimator
Gantry
Stationary
OGP
Board
Step Motor
Step Motor
Driver
Foot SW
Table
Board
Table
Connector
Board
Pump/Value for
Table Elevation
DASIFN
Cradle
Encoder
Speaker
Pump/Value
for Gantry tilt
Aperture Encoder
Step Motor
Power
Supply
Cover Switch
SUB
Board
TGP
Board
Touch Sensors
DBPCI 1
Host Processor
Key B'd
Latch Switch
Pot. For
Horizontal
DBPCI 0
Monitor
SCSI1
SCSI0-00 SCSI0-01
System Raw Data

HDD
Rear CN HDD
DASM
DVD
OC
Table
1-3
5" MOD (Option)
SYSTEM

THEORY OF OPERATION
GE HEALTHCARE
REV 4
1-3
5116384
SYSTEM SPECIFICATIONS AND DATA
The following tables describe system specifications and data.
Table 1-1
Scan Time
Scan Time [sec]

0.7 (Half scan)
1.0
1.5
2.0
3.0
5.0
Table 1-2
Scan/Recon/Cal FOV
Scan/Recon FOV
Cal FOV
P-Head (18)
Small (25)
Head (25)
Small (25)
Body (43)
Large (43)
Table 1-3
Image Spatial Resolution Related
No. of Actual Scan Views

Full Scan
Half Scan
No. of Detector
Active Channels
Recon Matrix
972
635
685 X 2
512 X 512
256 X 256
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SYSTEM SPECIFICATIONS AND DATA (CONTINUED)

Table 1-4
KV-MA Stations
KV
MA
120
10, 20, 30, 40, ..., 180, 190, 200

(in 5 mA increments)
140
10, 20, 30, 40, ..., 140, 150, 160

(in 5 mA increments)
Table 1-5
Slice Thickness
Slice Thickness [mm]

1i mode (1 image/rotation)
2i mode (2 images/rotation), or helical mode
1.2*, 2, 4, 6, 10
0.6*, 1, 2, 3, 5, 7, 10
Note *: available with 1.2mm or 0.6mm Option.

Table 1-6
Other Specifications
Exposure Start Angle (Axial

Scan)
0/90/180/270 deg.
1-5
SYSTEM

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5116384
SYSTEM OPTIONS
Table 1-7
Main System Options
Category
Name
Description
Helical scan
90 sec Helical
120 sec Helical
Collimator
0.6 mm Slice thickness

Asymmetric scan
Magnetic optical
disk drive (MOD)
5 inch MOD
5 MOD
Monitor
LCD monitor
22 inch CRT monitor
Filming
Laser camera
DASM VDB (Analog interface)

DASM LCAM (Digital interface)
Network
Ethernet
Advantage Windows
Software
3D Imaging
Denta Scan
SmartRecon
SmartPrep
Navigator
Others
Remote Tilt
Scan/Recon
Storage Device
1-6
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SECTION 2 - POWER DISTRIBUTION

Note
PDU stands for Power Distribution Unit. The part No. of it is 2298849 (400V) or 2298852 (200V).
2-1
POWER DISTRIBUTION UNIT
The power distribution unit (PDU) provides powers to all the subsystems.
Two types of PDUs are available: 400VPDU and 200VPDU. Either one of two types is used according to the mains
voltage (main power from the power distribution box of sites). (200VPDUs are used in Japan only.)
See Illustration 2-1 (400VPDU) or 2-2 (200VPDU). These illustrations describe the following:
All the powers except XG Power are output from the system transformer on the PDU.
(200VPDUs generate XG Power by a step-up transformer.)
XG Power powers the x-ray generator (XG) equipped on the gantry rotational block. Powers for x-ray
tube high voltage, x-ray tube anode rotation, XG control circuit boards, etc. are derived from this power.
However, the fan and pump for the x-ray tube are powered by SR115/120.
SR115/120 powers all the components equipped on the gantry rotational block except the x-ray
generator.
TG115 powers all the components equipped on the gantry stationary block except the axial motor. The
gantry tilt pump also is operated by this power. TG115 also powers the table subsystem.
TG200 powers the axial motor which rotates the gantry rotational block.
OC115 supplies power to the operator console.
2-1
SYSTEM

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REV 1
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5116384
POWER DISTRIBUTION UNIT (CONTINUED)

Illustration 2-1
Power Distribution to Subsystems (400VPDU)
Slip Rings
Mains
AC 380 V
480V
XG Power (AC 380 ~ 480 V)

Sys
tem
Trans
former
X-ray
Generator
SR115 (AC 115 V/120 V)

BRK1
Rotational Block
TG115 (AC 115 V)
(Stationary
Block)
SW1
TG200 (AC 200 V)
OC115 (AC 115 V)
400VPDU
BRK2
Axial
Motor
Gantry
Table
CB1
To Internal
and External
components
Noise
Filter
To DC Power
Suppliers
Operator Console (Big OC)
2-2
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5116384
POWER DISTRIBUTION UNIT(CONTINUED)

Illustration 2-2
Main s
Power Distribution to Subsystems (200VPDU)
Step-up
Trans
fo rmer
AC 200 V
Sys
tem
Trans
fo rmer
XG Power (AC 400V)
Slip Rings
X-ray
Generat or
SR115 (AC 115V/120V)

BRK1
Rotational Bloc k
SW1
(Stationary
Block)
TG115 (AC 115 V)

TG200 (AC 200 V)
OC115 (AC 115 V)
200VPDU
BRK2
Axial
Motor
Gantry
Table
CB1
Noise
Filter
To internal
com ponent s
Monitor
CB2
External
com ponent s
Operator Console (Small OC)
2-3
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Illustration 2-3 (400VPDU) or 2-4 (200VPDU) shows the simplified circuit diagram of the PDU.
As shown;
(400VPDU):
The voltage of mains power should be within a range of 380 V 480 V. The system transformer provides
terminals for 380 V, 400 V, ... , 480 V to connect power to the nearest voltage terminal.
(200VPDU):
The system transformer provides a terminal for 200 V to connect the mains power.
The SR115/120 output is not controlled by any relay contacts; the power is always present in the CT
system unless circuit breakers CB2 or CB5 are turned off.
The relay K1 is turned on some delay time later after K11 is turned on.
The resisters connected to the relay K11 suppress rush currents.
Circuit breakers CB1, CB2, ... , CB6 can turn OFF powers, as written below:
-
CB1: XG Power
CB2: TG200, TG115, SR115/120, OC115
CB3: TG200
CB4: TG115
CB5: SR115
CB6: OC115
CB7: PS
2-4
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Illustration 2-3
Inside of PDU (400VPDU)
Mains (3 Phase,
380 ~ 480 V)
K1
CB1
CB2
480
XG Power
K11
F1
System
Transformer
CB3
K2
TG200
200
460
440
120
415
115
CB5
SR115/120
400
380
CB4
K2
TG115
CB6
K3
OC115
CB1 ~ CB6: Circuit Breakers
P-ON
FAN AL
From
OC
E-OFF-O
RST-EM
RMT CNT
Board
K19
K1
K7
K3
K6
K2
K5
K11
SAFE-O
SAFE-G
From
Gantry
(The above means: for example,

When K6 is turned on, then K2
is turned on.)
RST-EMG
E-OFF-G
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5116384

Illustration 2-4
Inside of PDU (200VPDU)
Mains (3 Phase,
200 V)
K1
XG Power
Step-up
Transformer
CB1
CB2
200
K11
F1
System
Transformer
CB3
K2
TG200
200
120
SR115/120
CB5
115
CB4
K2
TG115
CB6
K3
OC115
CB1 ~ CB6: Circuit Breakers
P-ON
FAN AL
From
OC
E-OFF-O
RST-EM
RMT CNT
Board
K19
K1
K7
K3
K6
K2
K5
K11
SAFE-O
SAFE-G
From
Gantry
(The above means: for example,

When K6 is turned on, then K2
is turned on.)
RST-EMG
E-OFF-G
2-6
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5116384

Power On/Off Timing Chart
The power on/off controls of XG Power, TG200, TG115, etc. shown in Illustration 2-1 or 2-3 (or, 2-2 or 2-4, for
200VPDU) are shown in Illustration 2-5.
In the illustration;
E-OFF turns close or open when either E-OFF-O or E-OFF-G turns close or open.
That Safety Loop turns close or open means the system safety loop is closed or opened, including both SAFEO and SAFE-G turns close or open. (See the Safety Loop (2-2) description)
Reset Emergency turns close or open when either RST-EM or RST-EMG turns close or open.
2-7
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Illustration 2-5
Power On/Off Timing Chart
INPUT Control
PON SW
E-OFF
Safety-Loop
RESET Emer
FAN ALA
OUTPUT Control
OC115(K3)
XG400(K1)
Resistor(k11)
Timer1(Smart Gantry)
Pins 1 and 2 of JP1 are shorted on the RMT board

TG115(K2)
TG200(K2)
Timing2(general)
TG115(K2)
TG200(K2)
Note
Safety Loop is always closed in normal conditions after the system is switched ON or reset; this
means that XG Power is always supplied to the gantry in normal conditions.
2-8
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SAFETY LOOP
Illustration 2-6 shows a diagram of the system safety loop.

As shown, components on the gantry rotational block are not involved in the safety loop.
Illustration 2-6
Safety Loop
Switch on the
Gantry Rear Base
TGP
Board
SAFE-G
Gantry
RMT CNT
Board
PDU
Operator Console
Host
Processor
REAR CN1
Board
PCI Bus
DBPCI
Board
SAFE-O
K5
Relays
K1
XG Power
2-9
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5116384
SAFETY LOOP (CONTINUED)
Open of Safety Loop

The safety loop can be opened by any of the following:
Switch equipped on the gantry rear base.
Control by the TGP board:

The TGP board opens the safety loop in any of the following cases:
When the TGP board receives from the OGP board a safety loop open demand due to an
overtime of x-ray exposure.
When the TGP board detects abnormal communication with the OGP board or the operator
console (host processor) during x-ray exposure.
Control by the host processor (i.e., system software):

The host processor opens the safety loop in any of the following cases:
-
When the host processor receives a safety loop open demand from the TGP board.
When the host processor detects an overtime of x-ray exposure.
When the host processor detects an extra scan (other than scans which the host processor
instructed the TGP board to perform) performed.
Control by the DBPCI board:

While an x-ray exposure is performed, the board opens the safety loop to terminate the exposure if the
board detects that the host processor does not normally respond to interrupts issued by the board.
Signals such are E-OFF, FAN AL, etc.
2-10
SYSTEM

THEORY OF OPERATION
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SECTION 3 - SCAN OPERATION

3-1
WARM-UP SCANS
The system requires the Warmup scans to warmup the xray tube prior to starting the first scan after poweron,
or when more than two hours have elapsed since the last scan.
The warmup scans also have to be performed before performing phantom calibration which updates the calibration
files (CAL files), if more than three hours have elapsed since the last scan.
The operator selects either the Tube Warmup or Daily Calibration warmup scans, as listed in Table 3-1.
Table 3-1
Type
Tube Warm-up
Warm-up Scans
Purpose
No. of Scans
for x-ray tube warming
(Until the tube case temperature reaches 10%.)
for x-ray tube warming
(Until the tube case temperature reaches 30%.)
for calibration and x-ray

alignment
Daily Calibration
13 (Max.)
- Including 8 scans (calibration) + 5 scans (Xray alignment)
- Calibration scans contain 10mm, 7mm, 5mm, 3mm, 2mm,
1mm, 0.6mm, and Asymmetric scans. (0.6mm and Asymmetric
are optional.)
- Using 7 mm scan data, warmup error is analyzed.
6
for system diagnostics
(IQ Performance Measurement Scan)
- 1 scan for Offset Mean and SD

- 3 scans for Ratio
- 1 scan for A/B ratio
- 1 scan for Zaxis collimatorstep operation
The Tube Warmup type scans or the first series of scans of Daily Calibration warmup the xray tube.
This means that Tube Warmup only warms the xray tube.
During the scans for calibration (eight scans) the system collects data to analyze it, and update CAL files:
The system stores the data and checks whether the data falls within the specified range. If the data is out of range,
the system reports a WARMUP ERROR. If the data is within range, the system compares the data with the previous warmup data and calculates correction factors for CAL files, and updates them.
During the scans for xray alignment (three scans), the system collects data to analyze the xray alignment.
IIllustration 3-1 shows the warm-up scan sequence.
3-1
SYSTEM

THEORY OF OPERATION
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5116384
WARM-UP SCANS (CONTINUED)

Illustration 3-1
Warm-up Sequence
Start
Tube warm-up
scans
Error Message
Error &
Error code
Yes
Any error?
No
Raw Data Disk
Scans &
Data collection
Data check
Raw data
files
Error Message
Warm-up
Error
No
Within
range?
Yes
Calculates
correction
factors
CAL
files
System Disk
CAL files
correction
End
3-2
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WARM-UP SCANS (CONTINUED)
IQ Performance Measurement Scan

During the IQ Performance Measurement scans the system collects data to analyze it, and displays the result in
the Status column.
Analyzed data: Offset mean, Offset SD, Stability of air calibration, mAdependent DAS linearity variation, Scan
timedependent DAS linearity variation, A/B ratio.
For details, refer to the Home descriptions, in Section Service Tool, System tab, of the Diagnostics manual.
Warmup Error Analysis
The analysis for detecting warmup error is performed using 7 mm scan data:
Analysis Items
Descriptions
Specifications
Ref Count
Reference count after offset file correction
3000 ~ 60000
SD/MEAN
SD/Mean value after offset file and reference corrections
0 ~ 0.03
Ratio
Mean after offset file and reference correction / Mean at last

daily calibration
0.95 ~ 1.05
HPF (Ratio)
HPF of Ratio
0.01 ~ 0.01
Aperture Check
Ratio between [Channel data at the 1/4 intervals from 1st

view] and [Mean value of all views]
0.5 ~ 1.5
When you analyze a warmup calibration file, convert the related vector file into the Mean file, then use the Generic
System Analyzer of the Service tool.
3-3
SYSTEM

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3-2-1
5116384
AXIAL SCANS
General
Prior to the actual x-ray exposure, the system collects 256 views of offset data generated from the DAS. The offset
data is used to correct actual x-ray data.
The system performs a full 360 deg. scan (clockwise direction only) during 1.0, 1.5, 2.0, 3.0 or 5.0 sec. These are
called scan speeds or scan times, and not all of the them are available to all the systems; the available scan speeds
or times vary according to system models or options installed on the systems.
During a scan, the system collects 972 views of data. A view period differs according to the scan speed. The
following table shows this relation:
Scan Speed (sec)
View Period (sec/view)
1.0
1029
1.5
1543
2.0
2058
3.0
3086
5.0
5144
The view period is synchronized with the azimuth encoder pulse.

Axial scans are initiated from either 0 deg. or 180 deg. azimuth angle except for helical scans; during helical scans,
scans can be initiated from any azimuth angle.
The system knows gantry azimuth position by azimuth encoder pulse counts and the Gantry Pulse which indicates
that the gantry azimuth is at this moment at 0 deg., (i.e., home position).
3-2-2
Scan Sequence
Illustration 3-2 shows the axial scan sequence.
3-4
SYSTEM

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5116384
AXIAL SCANS (CONTINUED)

Illustration 3-2
Parameters
change?
Axial Scan Sequence
(Yes)
Scan parameters setting
(KV, MA, Slice Thickness, Scan Time, Slice Interval)
Cradle positioning
(Patient is moved into the gantry scan plane)
Rotor start
(The rotor is accelerated to operation speed)
Gantry acceleration
(Gantry is accelerated to the constant scan speed)
Offset data collection
(256 views of offset DAS data are collected )
High Voltage ON
(Start x-ray exposure)
Das enable
(DAS is enabled to collect data)
Data collection
(972 views of actual DAS data are collected;

view period is synchronized with gantry azimuth position)
(No)
High Voltage OFF

Gantry deceleration
(Yes)
Next scan?
(No)
End
3-5
SYSTEM

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5116384

Asymmetric Scan
Asymmetric Mode
In scanning, you can choose either symmetric or asymmetric slices from the twin-detector.
There are three choices in the Asymmetric Mode.
[OFF] mode: (Symmetric is OFF) acquires slices with the same thickness (symmetric).
[10:1] mode: acquires slices with different thickness (asymmetric).

-
[10:1]: provides 10mm and 1mm slices.
[10:2]: provides 10 mm and 2 mm slices.
[6:1]: provides 6 mm and 1 mm slices.
Illustration 3-3 shows how asymmetric slices are obtained.

In Asymmetric Mode, the slice, whose thickness is shown at the Axial Thickness field, asymmetrically straddles the
center of the twin-detector. This slices is called fused, whereas the other thinner slices is derived from one detector.
3-6
SYSTEM

THEORY OF OPERATION
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REV 1
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5116384

Illustration 3-3
Asymmetric Slice
Asymmetric slices of [10:1]

Collimator
Radiation area
Center between
detectors A and B
1mm slice
9mm
Detector B
Detector A
10mm slice

Collimator
Radiation area
Center between
detectors A and B
2mm slice
8mm
Detector B
Detector A
10mm slice

Collimator
Radiation area
Center between
detectors A and B
1mm slice
5mm
Detector B
Detector A
6mm slice
3-7
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5116384

Twin Cine Scan
In Cine Scan, continuous multiple 360-degree data acquisition is achieved without table travel or at the same location.
In Twin Cine Scan, images are displayed in the 1i mode during prospective recon; on the other hand, in retrospective
recon, images from Detector A and images from Detector B can be displayed alternately (2i mode).
The 1i mode display is also possible in retrospective recon.
3-2-5
Auto mA
The Auto mA feature enables the system to reduce mA and patient dose with negligible effect on image quality. The
system varies mA according to patient shape and a predetermined algorithm for scan location.
The Auto mA feature requires one Scout scan, either AP or LAT in the illustration below, to obtain necessary information on X-ray attenuation. (The last scout scan data is used for the Auto mA scan.)
The system automatically increases mA at the scan locations where X-ray attenuation is relatively high and decreases mA at the scan locations where X-ray attenuation is relatively low. In the example below, the mA is set low at the
start scan location (lung area), then the mA will increase at the location of liver area, and then it will decline at the
location of abdomen area.
Illustration 3-4
Auto mA
0degree Scout (AP)

Tube
Patient
90degree Scout (LAT)

Tube
Start
End
mA
Scan location
End
Start
3-8
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THEORY OF OPERATION
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5116384
SCOUT SCANS
Prior to the actual x-ray exposure, the system collects 64 views of offset data generated from the DAS. The offset
data is used to correct actual x-ray data.
The system advances the cradle and collects data from 685 active channels. The cradle speed is 75 mm/sec, and
data collection timing is synchronized with the cradle encoder pulse.
Illustration 3-5 shows the scout scan sequence.
Illustration 3-5
Scout Scan Sequence
Scan parameters setting
(KV, MA, Scan Range)
Cradle positioning
(Cradle is moved to the Start + 20 mm position)
Rotor start
(The rotor is accelerated to operation speed)
Offset data collection
(64 views of offset DAS data are collected )
Cradle acceleration
(Cradle is accelerated to the constant scan speed)
High Voltage ON
(Start x-ray exposure)
Das enable
(DAS is enabled to collect data)
Data collection
(Actual DAS data are collected;

view period is synchronized with cradle position)
High Voltage OFF

Cradle Stop
Start
position
Cradle
move start
Cradle stop
High
Voltage
ON
DAS
enable
Data collection
Cradle
acceleration
3-9
SYSTEM

THEORY OF OPERATION
GE HEALTHCARE
3-10
SYSTEM

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REV 7
5116384
OPERATOR CONSOLE
TABLE OF CONTENTS
SECTION
PAGE

1-1
1-2
1-3
1-1
OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MAIN COMPONENT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OPERATIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-5
1-7
SECTION 2 - HOST PROCESSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-1
2-2
OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BUILT-IN I/O (INPUT/OUTPUT) DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-4
SECTION 3 - CONNECTOR BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
3-1
3-2
CONNECTOR BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
REAR CN1 BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-2-1
Filter Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-2-2
Audio Mixer Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
3-1
3-1
3-3
SECTION 4 - OTHER OC COMPONENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-1
4-1
4-2
4-3
KEYBOARD, MOUSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DISPLAY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NAA1 (NP AUDIO AMPLIFIER) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-1
4-1
4-1
OPERATOR CONSOLE

THEORY OF OPERATION
GE HEALTHCARE
ii
OPERATOR CONSOLE

THEORY OF OPERATION
GE HEALTHCARE
REV 7
5116384

1-1
OVERVIEW
The information processing system (operator console) is based on the Intel 32 bit architecture.
The host processor of the operator IA console is a Linux computer, which is on the market.
(You connect it to a monitor, keyboard, and mouse to configure a working system.)
Illustration 1-1 shows a block diagram of the operator console of this CT system.
IA Host System Software
IA Host System Software is the standard Linux operating system software for the IA Host that come on the system
disk and on the DVD that you use in the event of a system crash.
PCI Bus
PCI stands for Peripheral Component Interconnect - a bus specification. The PCI bus is a high-performance local
bus used to connect peripherals to memory and a microprocessor. A wide range of vendors make devices that plug
into the PCI bus.
The PCI bus can be operated at its intended high-performance by using DMA transfers.
To perform DMA transfers with the PCI bus, a DMA controller should be equipped on the connected peripheral.
Address Map
For a PCI bus based computer system, memory address mapping and I/O address mapping of PCI devices are
determined during Configuration Cycle which the host processor generates when the system is powered on. Each
of the PCI devices requests its required address space size from the host processor during the cycle.
The PCI devices also (such are DBPCI, others) within this operator console are relocatable in the PCI address
space. This means that address mappings of the PCI devices are not fixed. The physical addresses assigned by
the host processor can be known by reading a set value on a base address register within configuration registers of
each PCI device. (With a VME bus, base addresses are determined by dip switches.)
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Illustration 1-1
Operator Console Block Diagram (for HP8000)
HIS/RIS
10/100/1000 Mbps
Analog
RGB
Video Card
SCSI1
DBPCI 0#
Monitor
DBPCI 1#
PS/2
Mouse
PS/2
Moxa Multi-port RS-232C

Serial Card
Host Processor
5" MOD
(Option)
PDU
SCSI0-00
System
Disk
Scan Panel
SCSI0-01
DVD
Laser Camera
Interface (DASM)
SCSI Tower
Raw Data
Disk
103 Keyboard
Keyboard
Service Key
Modem
Scan Room
TGP
NAA1
Gantry Mic
Table Speaker
OC Speaker
Includes Rear CN1 Board, Rear CN2

Board
DAS
DASIFN 2
Heart Gate
Trigger
Optical
Fiber
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Illustration 1-2
HIS/RIS
10/100/1000 Mbps
Analog
RGB
SCSI1
Video Card
DBPCI 0#
Monitor
PS/2
Host Processor
DBPCI 1#

Serial Card
Mouse
5" MOD
(Option)
Serial Port
PDU
SCSI0-00
System
Disk
Scan Panel
SCSI0-01
DVD
Laser Camera
Interface (DASM)
SCSI Tower
Raw Data
Disk
PS/2
103 Keyboard
Keyboard
Service Key
Modem
Scan Room
TGP
NAA1
Gantry Mic
Table Speaker
OC Speaker

Board
DAS
DASIFN 2
Heart Gate
Trigger
Optical
Fiber
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Illustration 1-3
HIS/RIS
10/100/1000 Mbps
Analog
RGB
SCSI1
Video Card
DBPCI2 0#
Monitor
PS/2
Host Processor
DBPCI2 1#

Serial Card
Mouse
5" MOD
(Option)
Serial Port
PDU
SATA-00
System
Disk
Scan Panel
SATA-01
DVD
Laser Camera
Interface (DASM)
SCSI Tower
Raw Data
Disk
PS/2
103 Keyboard
Keyboard
Service Key
Modem
Scan Room
TGP
NAA1
Gantry Mic
Table Speaker
OC Speaker

Board
DAS
DASIFN 2
Heart Gate
Trigger
Optical
Fiber
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MAIN COMPONENT DESCRIPTION
Host Processor
The host computer performs all of the following operations:
User interface
Image processings/display
Communication
Database control
Raw data/image data flow control
Image storage
Scan/recon control
Recon operation
System Disk
For HP8000/HP8200
SCSI, within the Host Processor
The Host Processor includes two ports. SCSI0-00 is connected to a hard disk drive which is used as the system
disk.
For HP8400
SATA, within the Host Processor
The Host Processor includes two ports. SATA-00 is connected to a hard disk drive which is used as the system disk.
This system disk mainly stores the followings:

System and application software
Images
Calibration files
System parameters
HP8000/HP8200 Capacity: 73 GB
Image Storage: >100000 images
HP8400 Capacity: 146 GB

Image Storage: >100000 images
DVD Drive (IDE; Outside the Host Processor by using SCSI Tower)
DVD drive is connected to the SCSI card through an SCSI to IDE Adapter.
Raw Data Disk (SCSI; within the Host Processor)
SCSI0-01 is connected to a hard disk drive which is a high-speed one for storing raw data.
Capacity: 146 GB
Raw Data Storage: >5000 Groups
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MAIN COMPONENT DESCRIPTION (CONTINUED)
DBPCI (DAS Buffer for PCI Bus) (two pieces for Dual slice, one piece for one slice)
This is a circuit board, serving as a ring buffer whose capacity is 4 MB. This buffer temporarily stores DAS data.
This board also includes control registers for the OC keyboard, safety loop, others.
DASIFN2 (DAS Interface for NP)
This is a circuit board which converts raw data sent from the gantry in optical serial signals into electric parallel
signals. During conversion, this board performs transfer error corrections.
This board also includes one channel for receiving Heart Gate Trigger inputs.
REAR CN1
This is a circuit board which mainly has two functions: Signal filtering and Audio control.
This board is connected to OC external components such are keyboard, TGP board on the gantry, or Power
Distribution Unit (PDU), and is also connected to OC internal components such are DBPCI board, NAA1 board, or
others.
Archive Equipment (MOD)
5 MOD is an option, it is used for archiving images.
Capacity: >2.3 GB
Images: DICOM format
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OPERATIONAL DESCRIPTION
Scan Data Main Flow

Illustration 1-4 shows:
Raw data acquired during scans is first buffered by DBPCI;
The raw data is then stored to a hard disk drive which is a high-speed type and exclusively used for raw data storage;
recon processing is performed to generate images.
The reconstructed images are then read by the host processor which converts the image data to video signal, as
well as stores the image data to the system disk, which also stores system software.
As shown, raw data and image data are mainly transferred over the PCI bus.
Illustration 1-4
Scan Data Main Flow
Monitor
Video Signal
Video Card
System/Image
Disk
Host
Processor
Image Data
PCI Bus
SCSI Bus
Raw Data
Raw Data
Disk
DBPCI # 0/1
Raw Data from DAS
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SECTION 2 - HOST PROCESSOR

2-1
OVERVIEW
The host processor is a Linux computer.

The host processor is the central unit within the operator console, performing various operations such are described
below:
Controls data transfer between data storage units and memory devices, etc.
Controls the entire scan sequence; it sends necessary instructions to relevant devices, and receives
status information from those devices.
Recon operation.
Performs graphics operations.
The host processor includes a DC power supply (>450 watts); it requires AC 115 V power input.
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OVERVIEW (CONTINUED)
Table 2-1 and 2-2 shows main specifications of the host processor.
Table 2-1
Host Processor Specifications (for HPxw8000)

Component
Central Processor
Specification
Model
Operating Frequency
Cache Memory
Other
Main Memory
Two Inter Xeon

2.66G
512 KB L2 Advanced Transfer Cache
533MHz System Bus
Hyper Threading Technology
Capacity (standard)
2 GB (512 MB X 4)
Type
DDR 266, with ECC
Hard Disk Drive

(System Disk)
Capacity
DVD
Type
Graphics Card
Resolution
Built-in Graphics
73GB (10K rpm) SCSI

Super format: DVD+R, DVD+RW, DVD-RAM, CD-R,
ATAPI/E-IDE
Integrated Geometry Engine
128-MB DDR memory; AGP 8X
N/A
Built-in I/O
(Input/Output)
PC (PS/2) compatible keyboard and mouse

1 x Serial 460 kbps (DB-9)
1284 Parallel (C miniature)
One 10/100/1000 Ethernet standard (RJ-45)
5 PCI slot
1AGP slot
Built-in Audio
Analog stereo input/output (YES)
Operating System
CTT Linux 1.8.12 or later
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Table 2-2

Component
Central Processor
Specification
Model
Operating Frequency
Cache Memory
Other
Main Memory
Capacity (standard)
Type
Two Intel R XeonTM processor

3.2GHz
1MB
800MHz System Bus
2 GB (512 MB X 4)
DDR-2 400MHz SDRAM, with ECC
Hard Disk Drive

(System Disk)
Capacity
73GB (10K rpm) SCSI
RawData Disk Drive
Capacity
146GB(10K rpm)SCSI
Graphics Card
Resolution
Built-in I/O
(Input/Output)
Front: Headphone, microphone, and 2 USB 2.0, 1 IEEE 1394

Rear: 6 USB, 1 standard serial port, 1 parallel port,
PS/2 keyboard and mouse, 1 RJ-45, 1 audio in, 1 audio out,
1 IEEE 1394
Operating System
Table 2-3
NVIDIA Quadro FX 1400 (PCI-E)

BIOS 5.41.02.17.24

Component
Central Processor
Specification
Model
Operating Frequency
Main Memory
Intel 510 Dual 2.0 GHz Dual core Xeon woodcrest

2.0GHz
Cache Memory
4MB Shared L2 Cache
Other
1333MHz System Bus
Capacity (standard)
Type
2 GB (1GB X 2)
DDR-2 667MHz, with ECC
Hard Disk Drive

(System Disk)
Capacity
146GB (7200 rpm) SATA
RawData Disk Drive
Capacity
146GB (7200 rpm) SATA
Graphics Card
Resolution
Built-in I/O
(Input/Output)
Front: Headphone, microphone, and 2 USB 2.0, 1 IEEE 1394

Rear: 6 USB, 1 standard serial port, 1 parallel port,
PS/2 keyboard and mouse, 1 RJ-45, 1 audio in, 1 audio out,
1 IEEE 1394
Operating System
NVIDIA Quadro FX 1500 (PCI-E)
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BUILT-IN I/O (INPUT/OUTPUT) DESCRIPTION
The host processor has input/output ports for the following:

Display Card (Graphics Card)
DVI signals are output from this port.
Keyboard/Mouse
A PS/2 keyboard and a mouse are connected these ports, respectively.
10/100/1000 Ethernet
A diagnostic console, an independent console, or an HIS/RIS is connected to this port.
DICOM compatible; the operator console can send (push) images to those devices using DICOM protocols at a 10
Mbits/sec maximum (the transfer speed varies according to receiver models, the size of transfer data, protocols,
etc.).
SCSI 0
This port is connected to the System Disk (00) and Raw Data Disk (01).
SCSI 1
This port is connected to external SCSI Tower.
SATA (only for HPxw8400)
SATA-00
This port is connected to harddisk.
SATA-01
This port is connected to harddisk.
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Built-in Audio
Audio in and Audio out is connected to RCN1 board.
PCI Bus Slot (HPxw8000 only)
The host processor is equipped with 5 PCI slot.
PCI
(32bit/33M)
DBPCI #1
PCI
(32bit/33M)
DBPCI #0
PCI-x
(64bit/133M)
empty
PCI-x
(64bit/100M)
MOXA multi-port serial card
PCI-x
(64bit/100M)
empty

The host processor is equipped with 7 PCI slot.
Slot1
PCI
DBPCI#1
Slot2
PCI-Express X16
Graphic card
Slot3
PCI
DBPCI# 0
Slot4
PCI-Express X4
empty
Slot5
PCI-X133
empty
Slot6
PCI-X100
MOXA multi-port serial card
Slot7
PCI-X100
empty

The host mainboard is equipped with 7 PCI slot.
Slot1
PCI
Moxa Multi-Port Serial Card
Slot2
PCI-Express X16
Graphic card
Slot3
PCI-Express X18
empty
Slot4
PCI-Express X16
empty
Slot5
PCI-X133
SCSI Card
Slot6
PCI-X100
DBPCI 2
Slot7
PCI-X100
DBPCI 2
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SECTION 3 - CONNECTOR BOARDS

3-1
CONNECTOR BOARDS
All the signal cables connected between the operator console (OC) and subsystems/components outside the OC
run through these connector boards.
The connector boards mainly include filters for each signal line to improve the EMC (Electro-Magnetic Compatibility)
performance of the OC. The REAR CN1 board also includes an audio mixer, relay for the safety loop, a video
amplifier for slave monitors, and others.
3-2
REAR CN1 BOARD
Illustration 3-1 (or Illustration 3-2) shows a block diagram of the REAR CN1 board.
The REAR CN1 board is connected to a slot of the connector box of the OC, and as shown in Illustration 3-1 (or
Illustration 3-2) , the board is connected to OC external components such are the keyboard, TGP board on the
gantry, or the Power Distribution Unit (PDU), and is connected to OC internal components such are DBPCI board,
NAA1 board, or others.
The board functionally consists of the following two blocks:
3-2-1
Filter Block
Audio Mixer Block
Filter Block
As shown in Illustration 1-1, this block includes the following interface circuits:
Keyboard Interface:
Mainly interfaces between the keyboard (including the scan buttons) and the host processor.
TGP Interface:
Mainly interfaces RS232/RS422 communications and Direct Lines between the TGP board located on
the gantry and the host processor or keyboard.
PDU Interface:
Mainly interfaces Power On/Off, Emergency, Safety Loop, or other signals between the Power
Distribution Unit (PDU) and the keyboard or the FRONT PNL board of the OC.
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REAR CN1 BOARD (CONTINUED)

Illustration 3-1
REAR CN1 Block Diagram (Linux Computer)
REAR CN1
RS232
RS232
Scan
Panel
Keyboard
RS232
KB R eset
Emergenc y Stop/Rest
Direc t Line
PS/2
Gantry
from/to Patient,
Auto Voice, Foot
SW, X-ray On
TGP Bo ard
Direc t Line
TGP Reset
X-ray On
PCI Bus
Filter Block
Talk On
Fan Alarm
Safety Loop
Power On
Ther mal
Guard
Power On
Shut down
Front
Panel
PCI Bus
DBPCI
Board
DBPCI
Board
X-ray On
Al ert On
CSA/WRA
ACKA
Addres s (4:0)
Data (7:0)
from Patient
to Patient
PDU
Fan Alarm
KB R eset
Safety Loop
Shut dow n
TGP Reset
X-ray LED
NAA2
Emergency Stop/Rest
Host
Processor
PS/2
RS422
Speak er on T abl e
MOXA Multi-port serial card
Audi o Mix
er Bloc k
Line OUT
Line IN
External
Speak er
(opt ion)
CD Line OUT
from Patient
DVD Drive
from Patient
3-2
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Audio Mixer Block
The audio mixer block of the REAR CN1 board Includes registers for audio function, and also includes an audio
amplifier for headphones or external speakers (which are not the OC speaker which is driven by the NAA1 board).
See Illustration 3-2.
As shown, audio signals from several sources are mixed in this block.
Audio Input Sources:

-
Microphone on the gantry (Intercom: From Patient)
Microphone on the OC keyboard (Intercom: To Patient)
Audio output on the host processor (Auto Voice play)
Synthesized sounds on the REAR CN1 board (X-ray On, Alert)

These are generated using a programmable timer which is controlled by software.
Audio Output Destinations:

-
Speaker on the gantry
Speaker on the OC
Audio input on the host processor (for recording Auto Voice messages)
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Audio Input Switch

As shown in Illustration 3-2, analog switches are used to switch audio input sources, and are controlled by the Talk
On button on the keyboard or a foot switch connected to the keyboard.
An intercom function is provided between the OC room and the gantry room. The Talk On button on
the keyboard switches communication direction, as described below:
-
While Talk On is pressed, communication of OC room gantry room is enabled; and both of
Auto Voice (both in the OC room and the gantry room) and sound from the CD-ROM drive (both
in the OC room and the gantry room) are disabled.
While Talk On is released, communication of gantry room OC room is enabled.
If a foot switch is provided, this also serves as the Talk On button.
The X-ray On sound and alert sounds in the OC room are always enabled, even when Talk On is
pressed.
Auto Voice messages can be recorded by using the microphone equipped on the keyboard while
pressing the Talk On button.
While Auto Voice is being played, communication of gantry room OC room can be disabled. This
prevents Auto Voice sound degradation on the OC side, because: Auto Voice is played both in the OC
room and the gantry room. If communication of gantry room OC room is enabled, the Auto Voice
messages are doubled on the OC side, which degrades the sounds.
Volume Control
The following two kinds of volume control are provided.
The following can be adjusted with the manual volumes on the keyboard:
-
Volume of communication of OC room gantry room (through the keyboard microphone)
Recording level of Auto Voice messages (through the keyboard microphone)
Auto Voice volume in the gantry room
Volume of communication of gantry room OC room (through the gantry microphone)
The electronic volumes are controlled by software, controlling the following:

-
Auto Voice volume in the OC room
Sound volume from the CD-ROM drive both in the gantry room and the OC room
Alert sounds in the OC room
X-ray On sound in the OC room
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Illustration 3-2
Audio Mixer Block

Stereo Signal
Monaural Signal
from/to DBPCI
Analog Switch
OP. Amp.
X-ray On/Off
Alert On
X-ray
Sound
Address (4:0)
Programmable
Timer
Modu
lation
Data (7:0)
Frequency &
Alert pulse
width controller
Alert Sound
(one shot)
Electronic
Volume
Sound Volume
Control Register
to Electronic
volume control
from CD Drive
from Host Processor
Line OUT
from Gantry Mic
from OC Mic
to Patient Volume
from Patient Volume
Lowpass
Filter
Auto Voice Volume
Scan Keyboard
Volumes
to Host Processor
Line IN
3-5
to Gantry
Speaker
to OC Speaker
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Audio Register Address Map

Illustration 3-3 shows an address map of audio control registers.
The addresses shown are mapped at an area within the DBPCI Input/Output address space of the host processor.
Registers mapped within the I/O register bases $50 $7F are located on the DBPCI board. These are controlled
by the host processor, and control signals only are sent from DBPCI to the REAR CN1 board.
Registers mapped within the I/O register bases $80 $FF are located on the REAR CN1 board. These registers
and the DBPCI board are connected via a dedicated bus.
Illustration 3-3
Audio Register Address Map

D0
D7
$b4
$b0
CD GA Volume Register
$ac
CD OC Volume Register
$a8
AV OC Volume Register
$a4
Alert Volume Register
$a0
X-ray Volume Register

PIT1 Register
$90
PIT0 Register
$80
$60
IO Register Base
AUX0
Auto Voice Playback Register
$54
Alert Sound Register
$50
X-ray On Sound Register
3-6
Note:
CD: CD-ROM Drive
GA: Gantry
OC: Operator Console
AV: Auto Voice
PIT: Sound Pulse Width Control
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SECTION 4 - OTHER OC COMPONENTS

4-1
KEYBOARD, MOUSE
The keyboard used for this operator console integrates the following components:
103 Keyboard, Mouse:

This 103 keyboard and the mouse have a PS/2 interface for connecting themselves to the host
processor.
Scan Keys, Microphone:

Keys used for scanning, and a microphone used for an intercom are incorporated into the keyboard.
These keys are connected to the host processor via RS-232C.
The keyboard and the TGP board are connected by Direct Lines for the remote cradle and gantry tilt control.
4-2
4-3
DISPLAY
CRT (22 color monitor): The resolution used for the CRT Display is 1280 x 1024 matrix. The refresh
rate used is 75 Hz.
LCD (18): The resolution used for LCD Displayis 1280x1024 matrix. The refresh rate used is 60-75 Hz.
NAA1 (NP AUDIO AMPLIFIER)
This is an amplifier board for the OC speaker. See the following block diagram.
Illustration 4-1
NAA1 Block Diagram

Power Amplifier
Preamplifier
+
+
OUT
OUT
CN2
-
From REAR CN1
CN1
To OC Speaker
Muting
Voltage Regulator
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TABLE/GANTRY
TABLE OF CONTENTS
SECTION
PAGE

1-1
1-2
1-3
1-1
INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COMPONENTS INTERCONNECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-2
1-3
SECTION 2 - SUB-ASSEMBLY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-1
2-2
2-3
2-4
2-5
OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
STATIONARY GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-2-1
TGP board Service Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-2-2
TGP Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ROTATIONARY GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SLIP RING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-4-1
MECHANISM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TABLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-2
2-9
2-10
2-12
2-14
2-14
2-15
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1-1
INTRODUCTION
The TGP (Table Gantry Processor) board is the main controller of the Table/Gantry subsystem. The TGP board
receives command from the Operator Console and sends control commands to Table, Stationary Gantry and
Rotating Gantry including OGP (On Gantry Processor), DAS and X-ray Generator. Although the DAS/Detector and
X-ray Generator are in the Gantry, they are not explained in this subsystem.
The Table/Gantry consists of the following components:
TGP board
OGP board
SUB board
Table board
Servo Amp/Servo Motor
Gantry Display
Gantry Switch
Collimator
Positioning Light
Hydraulic System (Gantry Tilt and Table elevation)
Touch Sensors
Cradle drive system
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COMPONENTS INTERCONNECTION
The illustration 1-1 shows the components of the Table/Gantry.

Illustration 1-1
Table/Gantry
GANTRY
SWITCH
PANEL
GANTRY DISPLAY
TILT POTENTIOMETER
TABLE HEIGHT
POTENTIOMETER
CRADLE POSITION
POTENTIOMETER
CRADLE ENCODER
AZIMUTH ENCODER
AXIAL MOTOR
TGP BOARD
OGP BOARD
SUB BOARD
SERVO AMP/MOTOR
STEPPING MOTOR
DRIVER
TABLE BOARD
CRASDLE DRIVER
TILT HYDRAULIC
SYSTEM
APERTURE
MOTOR
CRADLE
MOTOR
TABLE VALVE
SOLENOID
TABLE HY
DRAULIC SYSTEM
GANTRY PULSE
LOOK GUIDE
TABLE TOUCH SENSORS
APERTURE SENSORS
GANTRY TOUCH SENSORS

LATCH SWITCHES
EMERGENCY SWITCHES
FOOT SWITCHES
ZAXIS LIMIT SENSORS

DAS
ZAXIS MOTOR
1-2
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SPECIFICATIONS
The specifications of the Table/Gantry is as follows:

Gantry Rotation Speed
1.0, 1.5, 2.0, 3.0, 5.0 sec/rot.
Tilt Angle
20 deg. 1.0 deg.
Tilt Speed
Approx. 1 deg / sec.
Table Height
400 ~ 900 mm
UP/Down Speed
From 400 mm to 900 mm height: 24 -6+10 sec.
Cradle Speed
Slow 20 mm/sec
Fast 100 mm/sec
Scout 75 mm/sec
Home 100 mm/sec
1-3
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5116384
SECTION 2 - SUB-ASSEMBLY DESCRIPTION

2-1
OVERVIEW
The Table/Gantry consists of table and Gantry. The Gantry is divided into Stationary Gantry and Rotationary Gantry.
The communication between stationary and rotationary Gantry is made by slip-ring, a rotation mechanism that
permits electrical power and signals exchange.
The illustration 2-1 shows the Table/Gantry block diagram.
Illustration 2-1
Table/Gantry Block Diagram
GANTRY
PDU
STATIONARY GANTRY
ROTATIONARY GANTRY
POWER
GANTRY
DISPLAY
OC
TGP BOARD
GANTRY
SWITCH
COLLIMATOR
OGP BOARD
POSITIONING
LIGHT
GANTRY
TILT
VALVE
SUB BOARD
SLIP
RING
DAS
SERVO
MOTOR
SERVO AMP
TABLE
XG
CRADLE
IN/OUT
TABLE
BOARD
MAT
SWITCH
TOUCH
SENSORS
TABLE ELEVATION /
GANTRY TILT PUMP
AND TABLE VALVE
2-1
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-2
5116384
STATIONARY GANTRY
The stationary Gantry is mainly controlled by the TGP (Table Gantry Processor) board. The Illustration 2-2 shows
the main components of the stationary Gantry.
The TGP board communicates with Operator Console and Table via cables and with the OGP board located in
rotationary Gantry via cable and slipring.
Illustration 2-2
Stationary Gantry main components
OGP
(SLIP RING)
MICROPHONE
GANTRY SWITCH
115VAC
PS1
DISPLAY BOARD
FCV
BOARD
PS2
TOUCH SENSOR
BREATH NAVI
EMERGENCY SWITCH
PS 3
OC
MICROPHONE
TGP BOARD
GANTRY SWITCH
TABLE
XDISP BOARD
TOUCH SENSOR
RCV
BOARD
BREATH NAVI
EMERGENCY SWITCH
GANTRY TILT
PUMP & VALVE
TABLE ELEVATION
PUMP & VALVE
SIDE COVER
SWITCHES
SUB BOARD
AXIAL
MOTOR
M
FRONT AND
REAR
COVER
SWITCHES
The functions of the parts of the stationary Gantry are as follows:

PS1 and PS2
Supply power to TGP board and SUB board. PS1 supplies +5V, +12V and -12V. PS2 supplies +24V.
2-2
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-2
5116384
STATIONARY GANTRY (CONTINUED)
FCV (Front Cover) Board RCV (Rear Cover) Board

Contains connection circuitry to display board, touch sensors, breath navis and emergency switches.
See Illustration 2-3 and 2-4.
Illustration 2-3
FCV Block Diagram

FCV BD ASSY
CN1
TGP
+24V,+5V,GND,SHIELD,XLED,PLLED,
A0,A1,B0,B1,B2,B3,SL0,SL1,SL2
TGP BD
ASSY
(CN8)
+24V,+5V,SHIELD,FLED,SLED
CUNTL0,CUNTL1,
CUNTL2,CUNTL3,
CUNTH0,CUNTH1,
CUNTH2,CUNTH3
7seg DECORD
& DRIVE
CIRCUIT
GNTDISP
BD ASSY
CN5
LG
La,Lb,Lc,Ld,Le,Lf,Lg,
Ha,Hb,Hc,Hd,He,Hf,Hg
SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED
+5V
SWENBL*
CN2
DISP
CN3
LSW
LSW BD
ASSY
+5VSW
K1
FLG BD
ASSY
CN4
RSW
EMERGENCY SW
INR,OUTR,FAST,IMSR,INLMR,EXLMR,RANGE,
UPR,DNR,FWDR,BWDR,POSL,PRACTICE
EMERGENCY
TCH*
NAA2
ASSY
(CN2)
CN6
TSW
TSNS,CONECTOR
TOUCH SW
DETECT
CIRCUIT
CN8
MICOUT
TOUCH
SW ASSY
CN7
MIC
MIC+,MIC-,MICGND
2-3
MIC
ASSY
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-2
5116384

Illustration 2-4
RCV Block Diagram

R CV BD ASSY
CN1
TGP
+24V,+5V,GND,SHIELD,XLED,PLLED,
A0,A1,B0,B1,B2,B3,SL0,SL1,SL2
CN2
DISP
CN8
XDISP
TGP BD
ASSY
(CN9)
+24V,XLED,PLLED
XDISP
BD ASSY
+24V,+5V,SHIELD,FLED,SLED
CUNTL0,CUNTL1,
CUNTL2,CUNTL3,
CUNTH0,CUNTH1,
CUNTH2,CUNTH3
7seg DECORD
& DRIVE
CIRCUIT
CN5
LG
La,Lb,Lc,Ld,Le,Lf,Lg,
Ha,Hb,Hc,Hd,He,Hf,Hg
SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED
RLG BD
ASSY
CN3
RSW
+5VSW
TEMP+5V
+5V
SWENBL*
K2
K1
CN4
LSW
RENBL
POSL,INLMR,RANGE,PRACTICE (+5VSW)
INR,OUTR,FAST,EXLMR,UPR,DNR,FWDR,BWDR (TEMP+5V)
EMERGENCY
TCH*
NAA2
ASSY
(CN3)
TOUCH SW
DETECT
CIRCUIT
CN9
MICOUT
CN10
E-OFF
SW
CN6
TSW
TSNS,CONECTOR
TOUCH
SW ASSY
CN7
MIC
MIC+,MIC-,MICGND
2-4
MIC
ASSY
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-2
5116384
Display Board and XDISP board

Display board is the display located at middle upper side of the Gantry front cover.
XDISP board is the smaller display located at middle upper side of the Gantry rear cover.
Gantry Switches
Located at center of the front Gantry cover. These switches are used to tilt manage Gantry tilt, table and cradle
movement and positioning light.
Gantry Microphone
Located at upper portion of the entrance of the Gantry opening, at the front and the rear side.
Touch Sensor
Located at front and at rear upper side of the Gantry cover to protect patient during tilt. When touch sensor at the
front cover hit something during forward tilt, the tilt stops. When touch sensor at the rear cover hit something during
backward tilt, the tilt stops.
Breath Navi
Located at upper portion of the entrance of the Gantry opening, at the front and the rear side to notify patient to
breath, hold breath and show remaining scan time.
Emergency Switch
Located at left and right of both front Gantry cover.
SUB Board
The SUB board contains control circuitry for Gantry tilt, table elevation and servo amp for axial motor. Control these
functions according to the command received from TGP board. Contains also connection to Gantry cover switches.
See Illustration 2-5.
2-5
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1

SUB Board Block Diagram
TABLE DOWN
VALVE
GANTRY TILT(BWD)
VALVE
Illustration 2-5
TABLE UP & GANTRY

TILT(FWD) PUMP
2-2
5116384
2-6
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-2
5116384
TGP BOARD
There are three micro processors on the TGP Board. One controls the GANTRY Rotation, one controls the Table
and the other controls the arbitration of commands from the gantry processor, table processor, scan processor
(located on the OGP board) and the OC. See Illustration 2-6.
Processor A for GANTRY CONTROL (GP)
Processor B for TABLE CONTROL (TP)
Processor C for MANAGEMENT (MP)
The Management processor communicates with the OC through serial links. The other processors (Gantry
Processor and Table Processor) communicate with the Management Processor, and can receive commands from
the OC via the Management Processor. The Gantry Processor and Table Processor also contain a serial
communication port which is not used for communication between OC or other Processors, but rather is used for
Data correction from the sensor switches.
The TGP Board issues commands to and receives status from the components it controls. The TGP oversees the
following functions:
AXIAL Drive control
TILT Drive control
CRADLE IN/OUT Drive control
TABLE Elevation Drive control
GANTRY Display control
Breath Navi Display control
GANTRY panel switch
Error Detection
2-7
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-2
5116384

Illustration 2-6
TGP Block Diagram
TGP Bd
Emergency
PDU
PDU
Safety
Loop
Rot Safe
Gantry
Processor
(uPD78310)
G-Pulse
Rot Count
SRAM
Test 0,1
Reset SW
Dual
Port RAM
Reset
Patarn
OC
OC Comm
unication
OC
OC Direct
Line
G Test
SW
Management
Processor
(uPD78310)
SRAM
Flash
Memory
Flash
Memory
Dual
Port RAM
Rotate
Control
Flash
Memory
Status
LED
OC
12bit
DAC
Azimuth
Servo
AMP
M
Enc
Slice Count
DAS
Trig
Slip
Ring
9600bps
SIO
Slip
Ring
CT Lock
&Alarm
Control
Breath
Navi
Control
Relay
Breath
Navi
Service
SW
M Test
SW
Flash
Add Cont
Status
LED
Table
Processor
(uPD78310)
HIT Pot
TILT Pot
SRAM
Flash
Memory
T Test
SW
Status
LED
12bit
ADC
Cradle Pot
Cradle
Motor
Driver
Cradle
Control
M
Enc
Table
Control
Up/Dwn
Relay
Tilt
Control
Tilt
Relay
P,V
P,V
Display
Control
Gantry
Display
T/G SW
Port
Gantry
SW
Table
SW
Flash
Add Cont
Mat SW
Audio
Amp
Fluoro
SW
Mic
Spk
2-8
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-2-1
5116384
TGP board Service Switches
There are five service switches at right upper side of the TGP board which are used to control the Gantry Rotation
manually.
TGP Board Service Switches
MNL
SPD0
SLOW
HOME
SVE
FIX
CNT
FAST
SPD2
MID
ABT
OFF
SYS
SPD1
Illustration 2-7
90DEG
TGP BOARD
GANTRY LEFT SIDE
SYS : System Position. When the switch is in this position, the Gantry is controlled by the
Operator Console.
OFF
SYS
MNL
Disable the Gantry rotation. Servo Amplifier is disabled and Static brake activated.
MNL
Manual Position. When the switch is in this position, the Gantry rotation is controlled
manually, by the other switches described below.
ABT : Arbitrary Mode. This switch is a spring loaded switch that enables Gantry rotation
toward the direction selected by the rotation Direction switch (CNT/HOME/90DEG),
by the fixed speed of XXX seconds per revolution.
SVE
ABT
FIX
OFF
SVE : Servo Enable. Servo Amplifier is enabled and voltage command is 0 volts, that
means there is no rotation at this position.
FIX
: Rotates Gantry according to the selection of the Speed Selection switches

(SPD2/SPD1/SPD0 and FAST/MID/SLOW) and Direction switch (CNT/HOME/90DEG).
2-9
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384
2-2-1
TGP board Service Switches (continued)
SPD2
and
SPD0
These two switches sets the rotation speed

See table below
SLOW
CNT
SPD2/SPD1/SPD0
SPD2
SPD2
SPD2
SPD1
SPD1
SPD1
SPD0
SPD0
SPD0
FAST/MID/SLOW
FAST
MID
SLOW
FAST
MID
SLOW
FAST
MID
SLOW
SPEED (sec/rot)
1.0
1.0
1.0
1.5
10
15
HOME
CNT
: Clockwise rotation
HOME: Home position (X-ray tube at zero degree position)

90DEG: 90 degree position (X-ray tube at 90 degree position)
90DEG
2-2-2
MID
SPD1
FAST
TGP Processors
The TGP board contains three processors:

Management Processor (MP)
The Management Processor oversees the functions of the Table/Gantry. It communicates with OC and according
to the message received from OC, sends corresponding commands to Gantry processor, Table processor and OGP
board.
The main functions of the Management processor are:
Communication with OC - serial link
Communication with OGP - serial link through slipring
X-ray ON LED (on Gantry panel) control
Positioning Light ON LED (on Gantry panel) control
Look guide control
Practice Switch (for look guide) control
Tilt position, table height and cradle position adjustment. There is a ROM connected to management
processor that contains adjustment data. The management processor reads this data, compares with
the current positions and make adjustment as needed.
2-10
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-2-2
5116384
TGP Processors (continued)
Gantry Processor (GP)

The Gantry processor control the following functions:
Positioning light switch
Gantry rotation
Table Processor (TP)

The table processor control the following functions:
Cradle In/Out
Gantry Tilt
Table Up/Down
Gantry Display
Gantry Switch
Interlock
2-11
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-3
5116384
ROTATIONARY GANTRY
The Illustration 2-8 shows the main components of the rotationary Gantry.
The functions of the parts of the stationary Gantry are as follows:
OGP Board
The OGP (On Gantry Processor) performs the following functions:
X-ray exposure on/off control
DAS data transfer timing
Collimator control
Beam Tracking Control
Positioning light control
Scan control
The automatic shut-off of the Tube Fan/Pump Power Supply after 30 minutes when the OC has been
powered down.
Illustration 2-8
Rotationary Gantry main components
PHOTO
SENSOR
DAS
MOTOR
DRIVER
MOTOR
MOTOR
DRIVER
MOTOR
GPLS
TO TGP
(SLIP
RING)
COLLIMATOR
ENOCODER
OGP BOARD
POSITIONING
LIGHT
PHOTOSENSOR
RELAY
SWITCHING
POWER
SUPPLY
TEMP
CONT
ASSY
115VAC
TO DAS BUFFER
RF XMT
DCP2
DAS/DETECTOR
2-12
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-3
5116384
ROTATIONARY GANTRY (CONTINUED)
Switching Power Supply

Supply power to the OGP board, DCP2 board, RF transmitter, Temp cont, DAS, and positioning light.
Supply power to the DAS and Temperature Control Box.
Collimator
Located at the exposure window of the X-ray tube, controls the aperture of the X-ray beam by moving the blades.
The aperture can be 0.6, 1, 2, 3, 5, 7 or 10 mm in 2i mode.
Motor Driver
Generates five phase pulses to control the stepping motor of the collimator. Receives pulse command from OGP
board and convert it to other type of pulses.
Encoder
Sends the feedback pulse to the OGP to show the moved amount of the blades.
Photo Sensor
Detects when the collimator blades are in 1mm aperture
DAS
Data Acquisition System. Processes the data received from detector and send it to operator console. The detailed
explanations are in the DAS/Detector sections.
Temp Cont Assy
Device that controls the Detector temperature
DCP2
Receives parallel data from DAS and convert them to serial data. The detailed explanations are in the DAS/Detector
sections.
RF XMT
Converts Serial signal from DCP2 to RF signal.
GPLS
Notify TGP and OGP board when the Gantry is at zero degree tube position.
2-13
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-4
5116384
SLIP RING
The SLIP RING transfers the following signals;
2-4-1
DAS Data
DAS Trigger
TGP and OGP Communication message
Safety Loop
MECHANISM
This Gantry slip ring system utilizes:
Nine 480VAC power brushes (3 power lines x3 brushes)
Four 115VAC power brushed (2 power lines x2 brushes)
Three ground brushes (1 ground line x3 brushes)
Twenty-four signal brushes (6 signal lines x 4 brushes)
RF transmitter / receiver modules
Every slip ring has a corresponding terminator located on the opposite side of the transmitter terminal. See
illustration 2-9.
TERMINATE
RESISTOR
SIGNAL
SLIP
RING
Illustration 2-9
Slip Ring Terminator
The characteristic Impedance should be less than or equal to approx. 50 .
2-14
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-5
5116384
TABLE
The Illustration 2-10 shows the main components of the table.

The description of the parts of the Table follows:
Table board
This is an interface board between TGP board and servo amp, stepping motor driver, and table CONN board.
TBL CONN board
This is an interface between Table board and potentiometers, touch sensors and latch switches.
This board has only connectors. For detail information, see schematic diagrams.
Illustration 2-10
Table
HEIGHT
POTENTIOMETER
PUMP
FROM
SUB
BOARD
VALVE
TABLE UP/DOWN &
GANTRY TILT
HYDRAULIC
SYSTEM
MAT SWITCHES
FROM
TGP
BOARD
TABLE
CONN
BOARD
TABLE
BOARD
LATCH SWITCHES
TOUCH SENSORS
SPEAKER
E
FROM
GANTRY
NF2
STEP
MOTOR
(CRADLE)
SW
P.S.
STEP MOTOR
DRIVER
2-15
ENCODER
M
ENCODER
POTENTIOMETER
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 1
2-5
5116384
TABLE (CONTINUED)
Hydraulic System
Consists of pump, hose and cylinder. it is used for Table Up/Down and Gantry Tilt.
Cradle
Portion of the Table that executes longitudinal movement. It is controlled by step motor and motor driver.
Latch Switches
Positioned at both right and left sides of the Table, these switches release or latch the cradle. When both switches
are pressed, the cradle is latched. When one of the switches is depressed, the cradle is released. They are for safety
purpose.
Potentiometers
There are three potentiometers: Height potentiometer and Encoder (tilt) potentiometer. They are used for feedback
purpose.
Touch Sensors
Located at under surface of the Table. They are for safety purpose.
Mat Switches
Located at both right and left sides of the table base. The Gantry panel switch can be available with the mat switch
ON.
2-16
TABLE/GANTRY

THEORY OF OPERATION
GE HEALTHCARE
REV 3
5116384
DAS/DETECTOR
TABLE OF CONTENTS
SECTION
PAGE

1-1
1-1
OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
SECTION 2 - DETECTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HILIGHT DETECTOR MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CHANNEL DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DAS/DETECTOR CONNECTOR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
QCAL CHANNELS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AFTER GLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HEATER AND TEMPERATURE CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-1
2-2
2-3
2-5
2-6
2-6
2-7
SECTION 3 - DATA ACQUISITION SYSTEM (DAS) - MDAS. . . . . . . . . . . . . . . . . . . . . . . .
3-1
3-1
3-2
3-3
OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DATA FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCP2 BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-3-1
DCP2 Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-3-2
DCP2 Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CONVERTER BOARD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
3-5
3-6
3-6
3-7
3-11
SECTION 4 - DATA ACQUISITION SYSTEM (DAS) - GDAS . . . . . . . . . . . . . . . . . . . . . . . .
4-1
3-4
4-1
4-2
4-3
4-4
OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DATA FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCP CARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-3-1
DCP Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-3-2
DCP Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CONVERTER BOARD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-1
4-5
4-6
4-6
4-7
4-10
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
ii
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384

1-1
OVERVIEW
DAS/Detector subsystem consists of Solid State Detector and Data Acquisition System (DAS) that are located on
the rotationary Gantry. X-ray data acquired by the detector is converted to light, then to electrical signal in the
detector and then sent to DAS. The DAS digitizes, serializes and performs offset corrections on the signal and sends
to the Operator Console for image reconstruction.
The X-ray exposure through the scanning object is detected by these modules, converted to light, then converted
to electrical signal and sent to the DAS. The DAS digitizes and sends this data by slipring and fiber optics to the
Operator Console, where it is processed for image reconstruction.
Illustration 1-1
X-ray Exposure and Data Flow Block Diagram
OBJECT
X-RAY
X-RAY
TUBE
DATA
ACQUISITION
SYSTEM
DETECTOR
Illustration 1-2
DAS Data
DATA
PROCESSING
UNIT
X-ray Exposure and DAS/Detector
X-RAY TUBE
X-RAY BEAM
DETECTOR
DAS
1-1
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
1-2
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 3
5116384
SECTION 2 - DETECTOR
2-1
OVERVIEW
The detector consists of housing, collimator and detector modules. The detector module is made of scintillator
(lumex crystal), photo-diode and connector. When the X-ray exposure is performed, the X-ray enters through the
collimator and hits the scintillator. The scintillator is made of a material that emits light when hit by X-ray. The
scintillator is in contact with photo-diode so that the light generated by X-ray is converted into electrical current. The
generated current is sent to the DAS (Data Acquisition System) to be processed.
2-2
SPECIFICATIONS
Distance from Focus to ISO: 541 mm.

Distance from Focus to Detector surface: 949.075 mm.
Detector Channel Pitch: 1.15 mm.
Detector Channel angle: 0.06946 degree.
View Number:
Offset: 256 views
Active: 972 views
Channel Distribution:
MDAS
GDAS
Slice
A Slice
B Slice
A Slice
B Slice
Active Channel
685
685
685
685
Reference Channel
9+9
9+9
3+3
3+3
QCAL Channel
2-1
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 3
2-3
5116384
HILIGHT DETECTOR MODULE
The module consists of Scintillator cells, Collimator, Photo Diode, Reflex Films and Connector (illustration 2-1). The
X-ray enters through the collimator (tungsten plates) and is absorbed by the Scintillator. The Scintillator is made of
Lumex Crystal, the material that emits light when absorbs X-ray radiation. The Scintillator is optically coupled with
Photo Diode which converts light to electrical current. The Photo Diode is electrically connected to DAS through
the connector.
Illustration 2-1
DETECTOR MODULE
COLLIMATOR (IN THE

DETECTOR HOUSING)
XRAY
HILIGHT MODULE
LUMEX CRYSTAL
LIGHT
PHOTO DIODE
Slice B
Slice A
CONNECTOR (TO DAS)
2-2
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 3
2-4
5116384
CHANNEL DISTRIBUTION
The illustration 2-2 shows the channel distribution.

Illustration 2-2
DETECTOR CHANNEL DISTRIBUTION
MDAS
J01
J05
36~48
CH
49~51 52~61
CH
CH
62~64
CH
J44
J45
J46
J47
641~656 657~672 673~688 689~704

CH
CH
CH
CH
65~640
CH
GND
13~19
GND
3
3:1
13+
4CH 3CH
2:1
3:1
J51
2:1
13+
2:1
1:1
10
576CH
1:1
16
12+
4 2+
14
2:1
+10
3:1
3:1
3:1
1 MOD
17~19 20~32 33~35

CH
CH
CH
J08
1 MOD
3:1
J07
1 MOD
DAS
1:1
3 3
1 MOD
4~12
REF
1~3CH
QCAL
3CH
1 MOD
1 MOD
Detector
1 MOD
J06
1 MOD
REF REF REF
3:1
3:1
A Slice
1:1
3:1
3:1
2:1
3:1
2:1
2:1
1:1
1:1
2:1
3:1
3:1
3:1
3:1
3:1
B Slice
CH:
576
14
3:1
Three detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the three detector channel current.
2:1
Two detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the two detector channel current.
2-3
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 3
2-4
5116384
CHANNEL DISTRIBUTION (CONTINUED)

Illustration 2-2
DETECTOR CHANNEL DISTRIBUTION (CONTINUED)
GDAS
J01
J05
J07
49~51 52~61
CH
CH
62~64
CH
J45
J46
J47
641~656 657~672 673~688 689~704

CH
CH
CH
CH
65~640
CH
NC
1~3CH 4~12CH
QCAL REF
3CH
DAS
CH:
1:1
3 3
3:1
1:1
J51
NC NC
4CH 3CH
3:1
13+
2:1
2:1
13+
2:1
1:1
10
576CH
1:1
16
12+
4 2+
2:1
14
3:1
10
3:1
NC
1 MOD
REF REF REF
3:1
1 MOD
36~48
CH
J44
1 MOD
17~19 20~32 33~35

CH
CH
CH
J08
1 MOD
1 MOD
1 MOD
1 MOD
Detector
1 MOD
J06
3:1
1:1
3:1
$6OLFH
1:1
3:1
1:1
3:1
2:1
2:1
2:1
1:1
1:1
2:1
576
14
3:1
3:1
3:1
NC
3:1
1:1
3:1
Three detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the three detector channel current.
2:1
Two detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the two detector channel current.
2-4
3:1
%6OLFH
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 3
2-5
5116384
DAS/DETECTOR CONNECTOR
The detector module consists of 32 channels(A slice and B slice). The illustration 2-3 shows the flexible PWB that
connects detector modules to the DAS Converter Board and its pin configuration.
Illustration 2-3
DAS/DETECTOR CONNECTOR
48 PIN
CONNECTOR
D C B A
FLEXIBLE
PWB
1
2
3
4
5
6
7
8
9
10
11
12
2SG
2SG
2SG
2SG
2SG
2SG
2SG
2SG
A1ch B1ch A16ch B16ch
10
A8ch B8ch A9ch B9ch
11
FG
FG
FG
FG
12
FG
FG
FG
FG
Note
SG: Signal Ground
FG: Frame Ground
2-5
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 3
2-6
5116384
QCAL CHANNELS
The X-ray exposure can move along the Z-axis. It can be due to mechanical adjustment or to tube temperature (the
angle of the X-ray output can vary according to the temperature). There is three channels in the left most positioned
detector module that is used for Z-axis data correction. The outputs of the three channels are tied together so that
only one data is taken for three channels. The corresponding intensity according to the position of the X-ray
exposure along the Z-axis is detected (as can be seen at right side of the illustration 2-4), so that the system
recognizes the current X-ray position (along the Z-axis). There is a remaining data for Z-axis data correction in the
system. Therefore, the correction is made according to the data acquired by the Q-CAL channels.
Illustration 2-4
Q-CAL CHANNELS
QCAL CHANNELS
XRAY INTENSITY
DETECTED ACCORDING TO THE
BEAM POSITION
ALONG THE ZAXIS
A Slice
B Slice
A Slice
XRAY
EXPOSURE
XRAY
EXPOSURE
B Slice
QCAL CHANNELS
X
2-7
AFTER GLOW
The Lumex crystal scintillator has a property represented in the illustration 2-5. The scintillator continues emitting
light even after the X-ray radiation is stopped. This phenomenon is called AFTER GLOW. This remaining scintillation
provides incorrect data, but the system performs the error correction to eliminate this portion.
Illustration 2-5
AFTER GLOW
XRAY ON
scintillation
XRAY OFF
2-6
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 3
2-8
5116384
HEATER AND TEMPERATURE CONTROL
The detector comprises a heater unit. The heater keeps the detector temperature constant, what is needed for
detector accuracy. The heater is controlled by the Temperature Control Box which supplies power to the heater. The
detector also comprises a thermistor that feeds back the temperature information to the Temperature Control box.
Approximately three hours is needed after turning ON the power to the Temperature Control box to stabilize the
detector temperature. The temperature is controlled to 35 0.5 C. The illustration 2-6 shows its block diagram.
Illustration 2-6
TEMPERATURE CONTROL BLOCK DIAGRAM
Thermistor
DETECTOR
Heater
DC24V 60W
INPUT POW
ER 24V DC
Driver for
Heater
PS
(+12V -> +5V)
PS
(+24V -> +12V)
(OP Amp
Coparato)
CPU
Switch
ROM
LED indication
TEMPERATURE CONT BOX
2-7
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
5116384
SECTION 3 - DATA ACQUISITION SYSTEM (DAS) - MDAS

3-1
OVERVIEW
The DAS consists of the following boxes: RBB (Right Back Board), CBB (Center Back Board), and LBB (Left Back
Board). Each box contains the set of boards as follows:
RBB
- 2 Converter Boards
CBB
LBB
The Illustration 3-1 shows the DAS boxes.

DAS (RBB, CBB, LBB)
RBB ASSY
CBB ASSY
rter
nve
Co r d # 1
a
o
B
CONNECTER
(TO DETECTOR)
rter
nve
Co r d # 7
a
Bo
rter
nve
Co rd #2
a
o
B
Converter
Board #8
Converter
Board #3
DCP2 ASSY
Con
Boa verter
rd #
9
Con
Boa verter
rd #
4
Con
Boa verter
rd #
10
Con
Boa verter
rd #
5
LBB ASSY
rter
nve
Co rd #6
a
o
B
Illustration 3-1
DAS CONTROL BOARD
The DAS channels number is as follows:
Slice
A Slice
B Slice
Active Channel
685
685
Reference Channel
9+9
9+9
QCAL Channel
GND Channel
14
14
3-1
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
3-1
5116384
The Illustration 3-2 shows DAS block diagram.

The data coming from the detector is taken by the Converter Boards, sequentially channel by channel, digitized,
converted to parallel, then sent to the Operator Console. The DCP2 receives control and timing signals, and
generates the timing signals for data gathering. The DCP2 Board also generates the test pattern.
Illustration 3-2
DAS/Detector Structure
#45
#35
#5
#10
#27
#4
#26
#9
#19
#3
#18
#8
#11
#2
#10
#7
#1
#1
#6
DC+/-12V Analog
DC+/-5V Analog
Converter
Boards
DC+5V
Digital
Data Flow
Data Flow
POWER
SUPPLY
#34
DCP2
Data Flow
BOARD
Control Signal
3-2
DAS/DETECTOR
110V AC
N
3-3
1A
1A
2A
AC
AC
AC
AC
AC
AC
+5V
DIGITAL
+/- 5 V
ANALOG
+/- 12 V
ANALOG
+
COM
-
+
COM
6
7
8
3
4
5
1
2
4
5
6
1
2
3
7
8
CN81
5
6
1
2
3
7
8
......
......
DCP2
DIGITAL GND
+5V DIGITAL
-5V ANALOG
ANALOG GND
+5V ANALOG
-12V ANALOG
ANALOG GND
+12V ANALOG
6
7
8
3
4
5
1
2
JP3
8-8
JP4
JP3 1-1 JP5

2-2
JP1
8-8
LBB
CBB
Illustration 3-3
CN80
JP1 1-1 JP4

2-2
3-1
RBB
GE HEALTHCARE
THEORY OF OPERATION
REV 8
5116384
DAS Power Connection
JP5
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
DAS Signal Connection
LBB ASSY
FC45
J51
Converter
Board #5
FC44
J47
Converter
Board #10
FC35
J38
CN45
CN44
CN35
JS4
CBB ASSY
Converter
JS3
Board #4
J37
4onverter
Board #9
FC34
CN34
Converter
Board #3
Converter
Board #8
Converter
Board #2
FC11
Converter J14
Board #7 JS2
RBB ASSY
CN11
DETECTOR
OGP ASSY
Illustration 3-4
DCP2 ASSY
3-1
5116384
JS1
FC10
J13
CN10
Converter
Board #1
Converter
Board #6
FC2
J5
FC1
J1
3-4
CN2
CN1
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
3-2
5116384
DATA FLOW
The illustration 3-5 shows the data flow. The Detector generates an electrical current proportional to X-ray intensity.
The electrical current is converted to voltage signal in the Converter board. The voltage signal is amplified to an
appropriate level, converted to digital data (serial). The data is then sent to to DCP2 board where it is converted
back to serial, conditioned and then sent to Operator Console through the RF Slipring.
Illustration 3-5
DAS block diagram
DAS
FPGA
DETECTOR
Electrical
Current
Analog
Data
A/D
Converter
Data
Control
DCP Board
3-5
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
3-3
3-3-1
5116384
DCP2 BOARD
DCP2 Functions
The DCP2 board performs the following functions:
Interfaces with the OGP for Rx reception and scan completion via RS422 bus
Sets up gain and offset trim and controls the converter cards, via the converter CAN interface
Receives triggers and starts acquisitions with the converter cards
Performs serial-to-parallel conversion on data streams from the converter cards, does parity checking
on the data, and runs it through a translation table for view data ordering
Adds Forward Error Correction (FEC) to the channel data and sends it across the slipring to the Scan
Reconstruction Unit (SRU) via the high-speed serial data interface
Detects jitter and timeouts in the view trigger signal
Monitors the power supply voltages to make sure they are within the software programmable limits
Acquires the kV and mA values for each scan
Monitors the DAS subsystem for various faults
Makes the DAS data to 972view/rot format
Z-axis beam tracking: controls the X-ray intensity between the Converters A and B Slices
3-6
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
3-3-2
5116384
DCP2 Interface
The DCP2 is the main control board for Data Acquisition System (DAS). It packages all the converter card data into
a single high-speed serial data stream, compatible with the receive function on the DASIFN2 on OC. Illustration 36 shows the interface of DCP2.
Illustration 3-6
DCP2 Interface
DCP2
Fiber Optical
Cable
FW LMT
BW LMT
BW-
BW+
FW-
FW+
Collimator & Driver
3-7
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
3-3-2
5116384
DCP2 Interface (Continued)
Inputs
From Converter Boards:
Inner Row Serial Data Streams
Outer Row Serial Data Streams
Converter CAN Bus communication for status, faults, chassis temperature readings, and serial number
information
Converter Board Fault Line
From OGP:
RS422 Bus communication for scan control information
Input View Triggers
Input gantry home position trigger
Input X-ray on/off signal
Input DAS enable signal
Input Offset scan and active scan signal
Input reset signal
From JEDI:
KV & MA analog signals
From Collimator
Forward Limited positive signal
Backward Limited positive signal
3-8
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
3-3-2
5116384
DCP2 Interface (Continued)
Outputs
To Converter Boards:
Shift clock
Trigger signal
Converter CAN Bus communication for control information
Reset signal
Analog test voltage (for MDAS compatibility) or external reference current (for GDAS compatibility)
To OGP:
RS422 Bus communication for DAS status, error, or scan complete information
To Slip-ring (and then on to the Scan Reconstruction Unit (SRU) ):
High-speed serial data stream containing the view data with embedded FEC CRC.
To Collimator
Forward Pulse output positive signal
Forward Pulse output negative signal
Backward Pulse output positive signal
Backward Pulse output negative signal
3-9
DAS/DETECTOR
OGP
Interface
Converter
Interface
3-10
Collimator
Control
Collimator
Dual Port
Control
Control
Trig
Dual Port
RAM
A/D Data
KV mA
Pre AMP
A/D
FEC
Control
Data
Receiver
AT 55800A
AT 55800A
Bus Interface Core Controller
Data & Address & Signal Bus
FEC
TAXI
Serial
Data
Output
Illustration 3-7
Serial Serial To Parallel

Adder
Parallel
LUT
3-3
FPGA
GE HEALTHCARE
THEORY OF OPERATION
REV 8
5116384
DCP2 BOARD (CONTINUED)

DCP2 board block diagram
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
3-4
5116384
CONVERTER BOARD
The Converter board performs the following functions:
Conversion of electrical current signals from the detector to voltage signals.
Signal level conditioning
Analog to Digital conversion
Generation of the timing signals for data gathering
The signal from the detector with the level proportional to the X-ray intensity is fed to the Converter board. The
signal go through the electrical current to voltage signal conversion and conditioning circuits then is fed to the
Analog/Digital(A/D) converter. The A/D converts analog signal to 16 bits digital serial data.
Illustration 3-8
Preamplifier Architecture
150 pF
C_EXI
C_EXO
V_Ref
A_GND
72 pF
36 pF
18 pF
9 pF
R_N_red
A_IN
+
TEST_V_IN
R_h
C_h
18 pF
From 7
Other
Channel
Outputs
A_GND
OP_COM
S_GND
A_OUT
A_GND
3-11
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
3-4
5116384
CONVERTER BOARD (CONTINUED)

Illustration 3-9
TEST_V +/-
Converter Board Block Diagram
PREAMPLIFIERS
Chan_1
Odd # Channels
Chan_127
Chan_2
O
U
T
P
U
T
Anti-Alias
Filter
Resetable
Integrator
With S/H
2
2
2
2
M
U
X
Even # Channels
Chan_128
VOLTAGE
REFERENCES (2)
Diff. Rcvr & Filter
(16 X 8 CH.)
I
N
P
U
T
M
U
X
E
S
ADC's
FPA's
FLOATING
POINT
AMPLIFIERS
ANALOG
TO
DIGITAL
CONVERTERS
4
(4)
(4)
S_DAT
D_IN_ODD +/D_IN_EVN +/S_TRIG +/-
PECL
Differential
Receivers
SH_CK +/-
PECL
Differential
SEQUENCER
Drivers
D_OUT_ODD +/D_OUT_EVN +/-
(FPGA or ASIC)
X_PRG*
CV_FLT*
CV_RST
CVB_ADDR
6
CON_HI
CONVERTER
CON_LO
I/F
I2C
TEMPERATURE
SENSOR
2
MICROCONTROLLER
SCC
I2C I/F
I2C
SERIAL
EEPROM
WR_PRTCT
3-12
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
5116384
SECTION 4 - DATA ACQUISITION SYSTEM (DAS) - GDAS

4-1
OVERVIEW
The DAS consists of the following boxes: RBB (Right Back Board), CBB (Center Back Board), and LBB (Left Back
Board). Each box contains the set of boards as follows:
RBB - 2 Converter Boards
CBB - 6 Converter Boards
LBB - 2 Converter Boards
The Illustration 4-1 shows the DAS boxes.
DAS (RBB, CBB, LBB)
LBB ASSY
rter
nve
Co rd #7
a
Bo
rter
nve
Co rd #2
a
o
B
Converter
Board #8
Converter
Board #3
DAS CONTROL BOARD
Con
Boa verter
rd #
9
Con
Boa verter
rd #
4
SS
Con
Boa verter
rd #
10
PA
rter
nve
Co r d # 1
a
o
B
CONNECTER
(TO DETECTOR)
DC
Con
Boa verter
rd #
5
RBB ASSY
CBB ASSY
rter
nve
Co rd #6
a
o
B
Illustration 4-1
The DAS channels number is as follows:
GDAS
Slice
A Slice
B Slice
Active Channel
685
685
Reference Channel
3+3
3+3
QCAL Channel
GND Channel
26
26
4-1
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
4-1
5116384
The illustration 4-2 shows DAS block diagram.

The data coming from the detector is taken by the Converter boards, sequentially channel by channel, digitized,
converted to parallel, go through offset correction, then sent to the Operator Console. The DCP Card is an interface
with OGP (On Gantry Processor) receiving control and timing signals, and generates the timing signals for data
gathering. The DCP Card performs offset correction and generates the test pattern.
Illustration 4-2
DAS/Detector Structure
#45
#35
#5
#10
#27
#4
#26
#9
#19
#3
#18
#8
#11
#2
#10
#7
#1
#1
#6
DC+/-5V Analog
Converter
Boards
DC+5V
Digital
Data Flow
DCP
Card
Data Flow
POWER
SUPPLY
#34
Data Flow
Control Signal
4-2
DAS/DETECTOR
110V AC
N
15A
4-3
AC
AC
AC
AC
+5V
DIGITAL
+/- 5 V
ANALOG
+
COM
-
5
6
1
2
3
7
8
4
6
7
8
3
4
5
1
2
......
......
DIGITAL GND
+5V DIGITAL
-5V ANALOG
ANALOG GND
+5V ANALOG
6
7
8
3
4
5
1
2
JP3
8-8
JP4
JP3 1-1 JP5

2-2
JP1
8-8
LBB
CBB
Illustration 4-3
CN80
JP1 1-1 JP4

2-2
4-1
RBB
GE HEALTHCARE
THEORY OF OPERATION
REV 8
5116384
DAS Power Connection
JP5
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
DAS Signal Connection
LBB ASSY
DCP
OGP
J51
J47
FC45
FC44
CN45
CN44
Converter
Board #5
Converter
Board #10
J38
FC35
CN35
JS4
CBB ASSY
Converter
JS3
Board #4
J37
4onverter
Board #9
FC34
CN34
Converter
Board #3
Converter
Board #8
Converter
Board #2
Converter J14
Board #7 JS2
RBB ASSY
FC11
CN11
DETECTOR
Collimator
Illustration 4-4
Collimator Driver
4-1
5116384
JS1
J13
FC10
CN10
Converter
Board #1
Converter
Board #6
J5
J1
4-4
FC2
FC1
CN2
CN1
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
4-2
5116384
DATA FLOW
The illustration 4-5 shows the data flow. The Detector generates an electrical current proportional to X-ray intensity.
The electrical current is converted to voltage signal in the Converter board. The voltage signal is amplified to an
appropriate level, converted to digital data (serial). The data is then sent to DCP Card where it is converted back to
serial, conditioned and then sent to Operator Console through the RF Slipring.
Illustration 4-5
DAS
DAS block diagram
Offset
Trim
DAC
FPGA
DETECTOR
Electrical
Current
Fold
Control
4-5
DCP Board
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
4-3
4-3-1
5116384
DCP CARD
DCP Functions
The DCP Card performs the following functions:
Interfaces with the OGP for Rx reception and scan completion via RS422 bus.
Sets up gain and offset trim and controls the converter cards, via the converter CAN interface.
Receives triggers and starts acquisitions with the converter cards.
Performs serial-to-parallel conversion on data streams from the converter cards, does parity checking
on the data, and runs it through a translation table for view data ordering.
Adds Forward Error Correction (FEC) to the channel data and sends it across the slip ring to the OC via
the high speed serial data interface.
It provides the A/D converter chip, it acquires the kV and mA values for each scan.
Monitors the DAS subsystem for various faults.
Communication with Detector Heater Control Board to monitor the Detector Temperature.
Trigger jitter detection.
4-6
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
4-3-2
5116384
DCP Interface
The DCP is the main control board for Data Acquisition System (DAS). It is applicable for GDAS converter cards.
It packages all the converter cards data into a single high speed serial data stream to OC, compatible with the receive function on the DASIFN at 95/110 Mbps slip ring communication. Illustration shows the interface of DCP.
Illustration 4-6
DCP Interface
SDCOM/+-
CAN_LO
DSCOM/+-
CAN_HI
DATA 2_ODD/+-
OGP
DASTRIG/+-
DATA 2_EVEN/+-
GPLS2/+-
DATA 1_ODD/+-
XRON/+-
DATA 1_EVEN/+-
AC/OFF/+-
STRIG/+-
DCP
RESET/+-
DAS
SH_CK/+-
DASENABLE/+-
CN_FLT
CVTR
CN_RST
X-PROG
POWER
SUPPLY
RAW+5VA
W-PRTCT
RAW-5VA
IREF.EXT
RAW+5VL
AGND
AGND
LGND
Fibre Optical
Cable
From JEDI
0~10V
Slip Ring
KV Signal
mA Signal
FW LMT
BW LMT
BW-
BW+
FW-
FW+
Collimator & Driver
4-7
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
4-3-2
5116384
DCP Interface (Continued)
Inputs
From Converter Boards:
2 Inner Row Serial Data Streams (Differential Pairs)
Converter CAN Bus communication for status, faults, chassis temperature readings, and serial number
information (CAN)
Converter Board Fault Line (TTL)
From OGP:
Input View Triggers (Optical Isolated)
Active/Offset (Optical Isolated)
High Voltage on to X-ray tube (Optical Isolated)
DAS enable signal (Optical Isolated)
Gplus2 signal (Optical Isolated)
OGP reset to DCP (Optical Isolated)
TG CMD send/receive serial port (Optical Isolated)
From Collimator:
Collimator forward and backward position limit feedback (TTL)
From Generator (JEDI):
KV & MA analog signals
From Backplane:
Power Supply
Outputs
To Converter Boards:
Shift clock (Differential Pairs)
Trigger signal (Differential Pairs)
Converter CAN Bus communication for control information (CAN Differential Pairs)
Reset signal (TTL)
External reference current (Analog)
To OGP:
TG CMD transmits serial port (RS422)
4-8
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
4-3-2
5116384
DCP Interface (Continued)
To Collimator:
Beam tracking control pulse output (Differential pairs)
To Slip-ring (OC):
High-speed serial data stream containing the view data with embedded FEC (High speed optical fiber
link).
Illustration 4-7
DCP Card block diagram
CLK
GDAS DCP
CARD ASSY
Fiber
32MHz
Reset
ARM
JTAG
RAM
RAM
ARM
AT91
TG com
Flash-ROM
PLL CLK
30MHz
Pulse/
status
FEC
FPGA
TAXI
CY9689A
Cyclone
CFG
CAN
ADC
LVDS
LVDS
Iref
AD977
Mx9129
Ds032
Ref200
KV/mA
DHCBCollimator
OGP
JEDI
CVTR
JTAG
+5V_Logic
+5V_Analog
-5V_Analog
Power Supply
Left Backplane Board
4-9
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
4-4
5116384
CONVERTER BOARD
The Converter board performs the following functions:
Conversion of electrical current signals from the detector to voltage signals.
Signal level conditioning
Analog to Digital conversion
Generation of the timing signals for data gathering
The signal from the detector with the level proportional to the X-ray intensity is fed to the Converter board. The
signal go through the electrical current to voltage signal conversion and conditioning circuits then is fed to the
Analog/Digital(A/D) converter. The A/D converts analog signal to 16 bits digital serial data.
Illustration 4-8
Preamplifier Architecture
4-10
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 8
4-4
5116384
CONVERTER BOARD (CONTINUED)

Illustration 4-9
Converter Board Block Diagram
VOLTAGE
REFERENCE
IREF_INT
IREF_EXT
GDAS ASIVS (2)
..
.
Chan_127
Anti_Alias
Filter
..
.
Chan_128
(2 x 64 CH.)
Chan_1
Odd # Chan
CHARGE TO
DIGITAL
CONVERTERS
Chan_2
10
Even # Chan
D0:D9
ASIC/FPGA INTERFACE
10
D_IN_ODD +/D_IN_EVN +/S_TRIG +/SH_CK +/-
LVDS
Differential
Receivers
2.5 VOLT BANK

LVDS
Differential
Drivers
GAB
3.3
V
O
L
T
(FPGA or ASIC)
1.5V Core
2.5, 3.3 VIO
7
CVB_ADDR
CAN_HI
CAN_LO
B
A
N
K
CAN
I/F
D_OUT_ODD +/D_OUT_EVN +/-
3.3
V
O
L
T
B
A
N
K
CV_FLT*
I C I/F
2
I C
TEMPERATURE
SENSOR
3.3 VOLT BANK

DSP INTERFACE
SHARC DSP
SDRAM
Flash Boot
Prom
CPLD
INTERFACE
CV_RST
CPLD
14 Pin JTAG
HEADER
4-11
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
4-12
DAS/DETECTOR

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384
X-RAY GENERATOR
TABLE OF CONTENTS
SECTION
PAGE
SECTION 1 - GENERAL DESCRIPTION - I. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1
1-2
1-1
GLOSSARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JEDI HIGH LEVEL BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-2
SECTION 2 - GENERAL DESCRIPTION - II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-1
2-2
2-3
2-4
INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
STANDARD FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-4-1
Kernel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-4-2
Options Depending on the Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-4-3
A Packaging Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-1
2-2
2-3
2-3
2-3
2-4
SECTION 3 - TYPICAL SIGNALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
3-1
JEDI TYPICAL SIGNALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
ii
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384
SECTION 1 - GENERAL DESCRIPTION - I

1-1
GLOSSARY
Glossary of terms used in this document:
Term
Definition
ABC
Automatic Brightness Control. Regulation loop which makes the

measured brightness equal to brightness demand
AEC
Automatic Exposure Control. Exposure cut off technique which uses

the brightness signal to cut the exposure
CAN
Controller Area Network. A network used for localized control.
CPU
Control Processor Unit. Microprocessor and peripherals which run

the software/firmware
EPLD
Erasable Programmable Logic Device.
EMC
Electro Magnetic Compatibility. The EMC function prevents the generator from polluting the power source.
FPGA
Field Programmable Gate Array. It is programmed by the CPU core

after the reset and handles all the exposure control logic including
the system interface realtime lines.
HV Ripple
High voltage variations due to inverter current pulses. Typically a

few percent.
State Machine
Software or hardware function which handles the state of a system

and authorize to go to the next state upon reception of specific
events.
IGBT
Insulated gate bipolar transistor. A type of power switch
Ilp
HV power inverter parallel resonant current; current in the parallel

inductor
Ilr
HV power inverter serial resonant current; current in the serial

inductor.
MOS
Metal Oxide Semiconductor. A type of power switch
OGP
On Gantry Processor. Unit which drives the generator in CT systems
PDU
Power Distribution Unit
RMS
Root Mean Square
1-1
X-RAY GENERATOR
1-2
Inverter
Tank
heater supply
bus
HV Cables
DC Bus
Heater
High Voltage
Control Bus
kV Control
High Voltage
1 phase
3 phase power
tube cooling
input
input
Filter
EMC
System
Interface
X-Ray Tube 1
Low Voltage
Power
Supply
rotation phases
Rotation
Illustration 1-1
AC/DC
System
1-2
JEDI GENERATOR / TWIN FUNCTIONAL ARCHITECTURE
GE HEALTHCARE
THEORY OF OPERATION
REV 1
5116384
JEDI HIGH LEVEL BOLCK DIAGRAM

Jedi Generator / TWIN Functional Architecture
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
REV 6
5116384
SECTION 2 - GENERAL DESCRIPTION - II

2-1
INTRODUCTION
Jedi is the engineering name for a family of compact high frequency X-Ray generators. This generator
family covers a wide range of applications from mobile equipment up to vascular systems:
JEDI 12-25 kW:
Mobile applications
JEDI 24-48 kW:
CT applications
JEDI 32-50 kW:
RAD applications
JEDI 50-65-80 kW: RF applications
JEDI 100 kW:
VASCULAR applications
2-2
STANDARD FEATURES
Jedi is a family of 150 kV generators operating from 12 kW up to 100 kW for all the major radiological,
fluoroscopic and CT applications. The family handles 1 ms to continuous exposures with tube currents
ranging from 0mA up to 1000 mA.
The generators feature the very latest technology available:
Constant potential independent of line voltage variations
Power generation by a high-frequency converter (High voltage ripple: 40 kHz-140 kHz)
Distributed micro-processor controlled functions (CAN bus)
Other features include:
Single phase, three phase or battery power source
Very low kV and mA ripple, excellent accuracies and dose reproducibility
Compatible with a wide range of tubes, high speed or low speed, can supply up to 3 different tubes.
Thermal load interactive integrator ensuring optimum use of the heat protection curve of the x-ray
tube
Available in various packaging configurations: gantry, under-table, cabinet
Serviceability: high reliability, fast installation (no generator calibration), application error codes
ensure fast troubleshooting
Meets CE marking (and in particular EMC), IEC, UL, CSA, MHW regulations (if required)
Optional pulsed fluoroscopy
2-1
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
REV 6
2-3
5116384
APPLICATIONS
RAD
Surgery
RF
Vascular/
Cardiac
3 Points Mode
2 Points Mode
1 Point Mode
x
x
0 Point Mode
AEC
Tomography
AET
Continuous/Pulsed Fluoroscopy
Rad Exposures
Cinema 30 fr/s
Cinema 90 fr/s
CT
ABC
Variable mA Scans
Low mA Fluoroscopy
Legend:
-
AEC - Automatic Exposure Control
AET - Automatic Tomographic Exposure
ABC - Automatic Brightness Control in fluoroscopy
2-2
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
REV 6
2-4
5116384
ARCHITECTURE
The Jedi family is composed of 3 elements:

2-4-1
Kernel
High voltage chain composed of kV control, HV power inverter and HV tank

Anode rotation function
Tube filaments heater function
Control bus for communication between the functions
DC bus for power distribution to each function
Input voltage to DC conversion: AC/DC function
Low voltage power supply
Application software, running on the kV control board
These functions are the Jedi core. They are present in all versions of the generator.
A function can be unique for all products, or can have several different releases based on product specification.
Examples:
The anode rotation function is available in 2 releases:
low speed rotation for applications where the tube has a max rotation of 3000 rpm
high speed/low speed rotation for applications where at least one of the tubes can use
8000-10000 rpm
The control bus is unique.
2-4-2
Options Depending on the Application
A System Interface which can be:

-
CT interface
RAD interface (console interface, room interface, AEC management present or not)
- ATLAS interface
EMC function
Grid function (RF, vascular)
Bias function (RF, vascular)
Tube management (2 tubes or 3 tubes option)
2-3
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
REV 6
2-4-3
5116384
A Packaging Architecture
The packaging architecture consists in a set of boxes which can be put together in several ways to make
Jedi fit either in a cabinet, or a console foot, or a table foot. The boxes can also be split in 2 units distant
of several meters (example: CT gantry).
The boxes normally consist of the following:
Auxiliaries Box
Rotation function
Heater function
Low voltage power supply (which can also be in the AC/DC box)
This box is always present.

Power Box
HV tank
HV power inverter
kV control
System interface (for the less complex system interface)

AC/DC Box
MC filter (optional)
AC/DC function
Low voltage power supply (which can also be in the auxiliaries box)
2-4
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
REV 6
5116384
Illustration 2-1
Jedi Generator / Packaging Architecture
Inverter Assembly
Dual Snub
AC/DC
Board
Tube
Gate Command
Board
HV
+ KV Measure
CT
Inter
face
HV Tank
Rectifier
Block
KV Control Board
EMC Filter
AC/DC BOX
POWER BOX
LVPS
Board
Heater Board
Rotation
Capacitor
Rotation Board
Rotation
Capacitor
AUXILIARIES BOX
2-5
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
2-6
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384
SECTION 3 - TYPICAL SIGNALS

3-1
JEDI TYPICAL SIGNALS
The following table describes the main signals of the generator. For each of them, typical values are presented for the main applications:
Signal/Application
PoSpeed AII/EII/FII Values
Anode Rotation:
Phase P current during high speed run
2 A peak / 144 Hz
Phase A current during high speed run
2 A peak / 144 Hz
Filament Drive:
Inverter current in standby 2.5 A
3.3 A peak / 35 kHz
Heater DC input voltage in standby
160V
kV Control:
DC bus measure at 400 VAC
560 V
ILR at full power at 400 VAC
300 A peak / 50 kHz
ILR at min power at 400 VAC
80 A peak / 25 kHz
ILP at full power at 400 VAC
150 A peak / 50 kHz
ILP at min power at 400 VAC
150 A peak / 25 kHz
3-1
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
3-2
X-RAY GENERATOR

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384
APPENDIX A - SYMBOLS AND CLASSIFICATION

Symbol
Publication
Description
417-5032
Alternating Current
335-1
Three-phase Alternating Current
335-1
Three-phase Alternating Current with neutral

conductor
3N
Direct Current
417-5019
Protective Earth (Ground)
348
Attention, consult ACCOMPANYING DOCUMENTS
417-5008
OFF (Power: disconnection from the mains)
417-5007
ON (Power: connection to the mains)
Warning, HIGH VOLTAGE
Emergency Stop
A-1

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384
Symbol
Publication
Description
Type B
417-5339
X-ray Source Assembly Emitting
417-5009
Standby
Start
Table Set
Abort
Intercom
(on Operator Console)

Power On: light on
Standby: light off
Warning sign :
Radiation of Laser Apparatus
A-2

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384
Symbol
Description
Microphone (Mic)
Contrast
Brightness
50C
System storage prior to installation:

Maintain storage temperature between -10 C and +50 C
-10C
System storage prior to installation:

Maintain non-condensing storage
humidity below 90%
DO NOT store system longer than 90 days
Humidity 5-95%
Excluding Condensation
Air Pressure
700-1060hPa
System storage and shipment:

Maintain Air Pressure between 700 and 1060hPa
A-3

THEORY OF OPERATION
GE HEALTHCARE
REV 1
5116384
CLASS 1 EQUIPMENT
Any permanently installed equipment containing operator or patient accessible surfaces must provide backup
protection against electric shock,in case the BASIC INSULATION fails. In addition to BASIC INSULATION,Class1
equipment contains a direct connection to a PROTECTIVE(EARTH) CONDUCTOR which prevents shocks when a
person touches a broken piece of equipment or touches two different equipment surfaces simultaneously.
TYPE B EQUIPMENT
CLASS I, II, or III EQUIPMENT or EQUIPMENT with INTERNAL ELECTRICAL POWER SOURCES provide an
adequate degree of protection against electric shock arising from (allowable) LEAKAGE CURRENTS or a
breakdown in the reliability of the protective earth connection.
ORDINARY EQUIPMENT
Enclosed EQUIPMENT without protection against the ingress of water.
OPERATION 0f EQUIPMENT
CONTINUOUS OPERATION WITH INTERMITTENT LOADING.
Operation in which EQUIPMENT is connected continuously to the SUPPLY MAINS.The stated permissible loading
time is so short that the long term on-load operating temperature is not attained.The ensuing interval in loading is,
however, not sufficiently long for cooling down to the long term no-load operating temperature.
EQUIPMENT not suitable for use in the presence of a FLAMMABLE ANESTHETIC MIXTURE WITH AIR or WITH
OXYGEN or NITROUS OXIDE
CLEANING
The system is NOT WATERPROOF. It is NOT designed to protect internal components against the ingress of
liquids.Clean external system surfaces(Gantry,table,consoles and accessories)with a soft cloth dipped in hot water
and wrung DAMP/DRY. (NOT dripping!) IF NECESSARY, use only mild (dish washing liquid) soap to remove dirt.
NOTICE
Avoid damage to equipment! Some spray and wipecleaners etch and permanently cloud
clear plastic surfaces!! Use only warm water and mild liquid soap to clean surfaces.
A-4
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Hispeed Dual Theory of Operation

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GE Healthcare

HiSpeed Dual, ProSpeed FII

Copyright 2004-2008 by General Electric Company

HiSpeed Dual, ProSpeed FII

Tento provozn nvod existuje pouze v anglickm jazyce.

HiSpeed Dual, ProSpeed FII

Tm huolto-ohje on saatavilla vain englanniksi.

HiSpeed Dual, ProSpeed FII

essi jnustuhandbk er eingngu fanleg ensku.

HiSpeed Dual, ProSpeed FII

is eksploatavimo vadovas yra prieinamas tik angl kalba.

HiSpeed Dual, ProSpeed FII

Acest manual de service este disponibil numai n limba englez.

HiSpeed Dual, ProSpeed FII

Den hr servicehandboken finns bara tillgnglig p engelska.

HiSpeed Dual, ProSpeed FII

CERTIFIED ELECTRICAL CONTRACTOR STATEMENT

IMPORTANT! . . . X-RAY PROTECTION

HiSpeed Dual, ProSpeed FII

LITHIUM BATTERY CAUTIONARY STATEMENTS

OMISSIONS & ERRORS

HiSpeed Dual, ProSpeed FII

LIST OF EFFECTIVE PAGES

Data Acquisition System (MDAS)

Data Acquisition System (GDAS)

(Warning and other

HiSpeed Dual, ProSpeed FII

Primary Reason for Change

Added new languages for PT-BR (Portuguese-Brazil) and SR (Serbian).

Added HP8400 information. (Sec. 1 & Sec. 2)

Updated OC Block Diagram. (Sec. 1)

Updated illustration of Jedi Generator / Packaging Architecture. (Sec. 2)

Updated Illustration 1-2 System Block Diagram for GDAS (Sec. 1)

Updated Illustration 1-1 System Block Diagram (Sec. 1)

Added: Illustration of Detector Channel Distribution for GDAS (Sec. 2)

HiSpeed Dual, ProSpeed FII

SECTION 1 - GENERAL DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SECTION 2 - POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

POWER DISTRIBUTION UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SECTION 3 - SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

HiSpeed Dual, ProSpeed FII

HiSpeed Dual, ProSpeed FII

SECTION 1 - GENERAL DESCRIPTION

Operator Console (called OC)

Scanning Gantry (called gantry)

X-ray Generator (called XG)

Patient Table (called table)

Power Distribution Unit (called PDU)

Advantage Windows Image Workstation

HiSpeed Dual, ProSpeed FII

System Block Diagram (for system with MDAS)

Z axial Photo Sensor

System Raw Data

5" MOD (Option)

HiSpeed Dual, ProSpeed FII

System Block Diagram (for system with GDAS)

Z axial Photo Sensor

System Raw Data

5" MOD (Option)

HiSpeed Dual, ProSpeed FII

SYSTEM SPECIFICATIONS AND DATA

The following tables describe system specifications and data.

Scan Time [sec]

Image Spatial Resolution Related