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5

L4

L35
2
C96

RS1K_SMD

+12V

1
10U/1A_SMD

100UF/25V

R10

100UF/25V

10K

MIC12V

R9
1K/0805

P+5V
R7
10K

3
4

R8

2
EC1
10uF/400V

EC3

GND
GND

STBY

STBY

12
D15

10uF/400V

FB

2
C1
101

T2
1

4K7

Q2
3904

FB7

STANDBY

EEL19

L2
1mH/0.05A/6X8

MIC12V

15.7mA-19mA

L28
FB0805

Q3
8550

C95

BR1
GB206
1

STB12V

D12

NC/FB0805

R163

C99

100K/0.5W

222/1KV

1
2

4.7U/1A_0805
L3

L30

5V

+5V

1
10UH/2A

C87

SR360

1000UF/16V

L36

BC11

C39

0.1UF

470UF/16V

1206

P+5V
BC6

L6

P+5V

0.8A-1.3A

0.1UF

NC/FB0805

11

D16

3
R11

USB/DIGI AUDIO/RGBCVBS/IR

STB12V

A+5V

2
Q4
8050/DIP

RS1K_SMD

3
1K/0805

R3
100R/0805

10
F+

3
D

2
BP

EN

U10
9

TNY-275PN
S

R4
20

0R/0.5W/1206

GND
R154

+
C

EC4
10uF/25V

F+

AC:200mA-1.4mA
DC:140mA-93mA

C97

C106

100UF/35V

0.1UF

R20 STB-25V
1K

F2
T2AL/250V

Q7

D13
3

R21
10K

F-

F-

BT8550

C98

R152

RS1K_SMD

2K

7.5V/1W_SMD

L8
NC/FB0805

D14

CON2
ON/OFF Button(SW)

L5
2

6
RS1K_SMD

C101

L7

1
10UH/1A_SMD

100UF/50V

C102
100UF/50V

NC/FB0805

0.1UF

510R/0805
R22
-12V
Z1

R23
Q5

10K

3
5551

R19

Q6
5401

12V/1W_SMD

C94

L1

P-12V

FB0805

P-12V

11mA-19mA

100UF/25V

10K
1

STB-25V

C109

AC:200mA-1.4mA
DC:140mA-93mA

100UF/35V

Z2

CON1

R13

~AC100-240V INPUT VOLTAGE

STB12V

10K
R18
100K
B

U12 PC817

R5

680R

100

5V

R150

+5V

R153
R6

R79

1K

4.7K

100K
R151

C104

1K

0.1UF

IC1
1
TL431
Y1

component shall be replaced only by the


component specitied in the circuit for safety reasons

4.7K

222/400V

Note:Damage rquring service,unplug this produce


from the wall oulet and refer servicing
A

R149

Ajacent to relevant component demoting specific

to qualifled service presonal when


replacement parts are required sure
the service

technician has used replacement parts specified


by the manufactruer or have the same
characteristics,as the original
parts
Unauthorized substitution may result in
fire,electric shock or other hazards
upon
completion of any service or repairs this
product,Ask the service thechnician to perform
safety check to determinw that product is in
proper operatin condition

Design:

MODEL: DV5312

TITLE:

Checked:

PART NO.:

DWG NO.:DV5312-YL01-03

Apprd:

EMC PART

SHEET:

1 OF 5

AC TO DC

VER: A

SHEN ZHEN MTC MULTIMEDIA CO.,LTD


5

CVBS_C

P+12V

SCART CFG
4:3

CON12
D

Cr/YC-Y_OUT
YUV-Y
Cb/YC-C_OUT
RGB/CVBS
CVBS
16:9/TV
LMAIN-OUT
RMAIN-OUT

TP80
TP79
TP78
TP77
TP76
TP75
TP83

01

TV

10

16:9

LMAIN-OUT
RMAIN-OUT

FS2

C148
150pF

J1

AUDIO 6CH

R207
1K2
TP7
R248

R247
Y_R_V

R202
1K5

CVBS

0R

7
D

TP8

NC

RMAIN-OUT

CVBS_G_Y

C143
150pF
Q1
BT3904

SL-OUT

YUV-Y

CVBS_G_Y

R176
75R

TP13
4

SR-OUT

FS3

Cr/YC-Y_OUT

TP9
P+5V

TP73
TP72

Cr/YC-Y

R1
22

9PIN/2.0

Y_R_V

C132
150pF

Q24
BT3904

LMAIN-OUT

16:9/TV

1
2
3
4
5
6
7
8
9

CVBS

CVBS_C

P+12V

FS1: H=RGB L=CVBS


FS2 FS3
00

Q23
BT3904

1
2
3
4
5
6
7
8
9
9PIN/2.0

-25V
F+
FP+5V
DATA
CLK
STB
IRRCV

Cb/YC-C

Cb/YC-C_OUT

C138
150pF

LMAIN-OUT

TP14
5

CEN-OUT

NC

0R

R234

TP19
6

LFE-OUT

4K7
P+5V
Y_C_CVBS

SCART config circuit


R230
10K

CON3

C_B_U

TP12
TP11
TP10
TP17
TP67
TP48
TP49
TP50
TP47

C_B_U
RGB/CVBS

FS1

R250

R249

R229
10K

R204
10K

C174
150pF

R239
2.2K

-25V
FF+

J3

P+5V

R205

75R
R201 75R
R192 75R

FPC_DOUT
FPC_CLK
FPC_STB
IRRCV

TP3

C158 C193 C194 C195


101
101
101
101

Cr/YC-Y_OUT

COAX_SPDIF

AV4

J2
TP4

2
4

1
3
6

CVBS

TP20

Cb/YC-C

TP22

TP5

YUV-Y

Cb/YC-C_OUT

Cr/YC-Y

TP23

TP6
SVIDEO&CVBS

TP81
TP82

D5V
R210
S/PDIF_OUT

S/PDIF_OUT

C121
0.1uF

Q22

BT3904

CON13

Close to Q22

OPTICAL_SPDIF
D5V

R217
P+5V

56R

2R/0805

1
2
3
3PIN/2.0

R164 33R
R214
27R
R155
56R
R14

C153
COAX_SPDIF
0.1uF
C152

22R

22pF

Design:

MODEL: DV5312

Checked:

PART NO.:

Apprd:

SHEET:

5 OF

TITLE: JACK+VIDEO+SCART
DWG NO.:DV5312-YL01-03
5

VER: A

SHEN ZHEN MTC MULTIMEDIA CO.,LTD


5

TP1
TP18
TP2
TP71
TP70

CON10
MIC12V

MIC12V

MIC1

R254

47K

R218

2.2K

MIC2

5P/2.0

R220
MIC1

R262
2K7

MIC2

R263
2K7

R311 0R

LRIN

43K

C128

APWM_L-

160pF

R221
D2
NC/4148

-12VA
U7A
LM4558
1

43K

APWM_L+

2
3

NC/4148
1

R199

1K

LMAIN-OUT

+12VA
R252
47K

0R/NC

R251
10K

NC/1K

D1
R272

C163
1.5nF
R271

LMAIN-OUT

1
2
3
4
5

MUTE

R186

Q27
BT3904

C131
1nF

2K2
DSPVCC33

R257

47K
R242 2.2K
160pF
4
6

R274

APWM_R+

U7B
LM4558

-12VA

R231

1K/NC

1K

RMAIN-OUT
R232
10K MUTE

+12VA
8

R255
47K

RMAIN-OUT

C123
C192
1.5nF
R219 43K

MIC_VOCAL

R243 43K
APWM_R-

R273
NC/1K
R12
NC/0R

MIC_VOCAL

R198

Q25
BT3904

C124
1nF

2K2

R290
R285 43K
ADCVCC33

C206
104

10u/16V

+ C209

DGND
MCLK
LRCLK
NOHP
AGND
AVDD
LIN

R286 43K

14
13
12
11
10
9
8

AMCLK
ALRCLK

AMCLK
ALRCLK

APWM_SL+

U8A
LM4558
1

R280 1k

R310
0R

ADCVCC33
LRIN

FB6

DSPVCC33

FB

R288
47K

ADCVCC33

+ C211

CE2632

100U/16V

10U/16V

Q32
BT3904

C217
1nF
+12VA

R260
C198

R284 43K

C229

C228

0.1uF

0.1uF

0.1uF

C184

C226

C227

33R

P+12V

P+12V

+
C200
47uF/16V

47K

R278
C214

160pF

-12VA

2.2K
C278
1.5nF

R283 43K

APWM_SR+

R261

33R

P-12V

-12VA
U8B
LM4558
7

R277 1k

0.1uF

0.1uF

0.1uF

P-12V

+
C201
47uF/16V

Q31
BT3904
C215
1nF

SR-OUT

MUTER279 2K2 1

R291
10K

+12VA
R287
47K

3.3K

R43

R282 2K2
1

C212

APWM_SR-

4.7K

MUTE

104

R289

R253

SL-OUT

R292
10K

+12VA

DVDD
SDOUT
BCLK
FMT
CAP
VREF
RIN

1
2
3
4
5
6
7

+ C208

ABCLK

ABCLK

160pF
-12VA
2

AIN

C219
1.5nF

NC/0R

AIN

C216

APWM_SL-

R309
U11

R269
NC/10K

47K
R281 2.2K

DSPVCC33

Q28
BT3904

C197
10uF/16V

P-12V

P-12V
R306

47K

+12V D5V

10K

3
Q29
BT8550

R297 2.2K
C222

APWM_CENR159
100K

APWM_CEN+

+12VA
R304
47K

C231
100uF/16V

R259
2K

U9A
LM4558
1

R296 1K

CEN-OUT

R308
10K

MUTE

R298

Q34
BT3904

C223
1nF

2K2

R256
100K

R258
47K

MUTE

D22
LL4148

BT8550
3

Q20
2

160pF
-12VA

C225
1.5nF
R302 43K

R200

R301 43K
2

LL4148
2
100K

D23
1
R182

AMUTE or MUTE_CTL:
Hi:
Mute.

MUTE_CTL MUTE_CTL

R305
R300 43K

47K
R294 2.2K
C220

APWM_LFE-

160pF
4

C224
1.5nF

R299 43K
APWM_LFE+

-12VA
U9B
7 LM4558

LFE-OUT
R293
1K
R307
10K

MUTE

R295

Q33
BT3904

2K2

C221
1nF

R303
47K

+12VA

C196
47uF/25V

Design:

MODEL: DV5312

TITLE:

Checked:

PART NO.:

DWG NO.:DV5312-YL01-03

SHEET:

VER: A

Apprd:

4 OF 5

AUDIO+KARAOKE

SHEN ZHEN MTC MULTIMEDIA CO.,LTD


5

DSPVCC33

+ C179
100uF/16V

R175
4.7R

Q26
8550

Others
4.7R
4.7R

C146
1nF

CN201 is used for Sanyo/Samsung/Sony OPUs

C141
1nF

R189
4.7R

C136
C130 470P
470P
Q21
8550

R167

OPU_HFM

OPU5V
VC1

CDLD
VR_DVD
VR_CD
RF_E

OPU5V
VC1

C134
1nF

CDLD
VR_DVD
VR_CD

R202=300R, for HOP1200W only

DVDLD

R15

2.1V

33R

220R

Others
4.7R
4.7R

BEMF
Current Type(Default)

R216

2R/0805

R177

SP_M-

R161=300R, for HOP1200W only


include arima , R161=0R

LD_CD

R161

OPU_HFM

SPDL_SENS-

2K

R222
1R

P+5V

0R

D24

+ C230
220uF/16V

D21
SP_MOT-

VC

RFA5V

SPDL_SENS-

DSPVCC33

4148
1

PDIC Control:
DVD=LOW
CD=HIGH

2
4148

R168

SPDL_SENS+

2K

SPDL_SENS+

2.1V

1N4002
D19

3V3_DRV

0R
R223

1V8_DRV0R
R226

Close to motor driver.

U5
AM5888S
(value) is for AM5888s
FOCUS_S
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1

TACTTACT+
FACTFACT+

MD_DVD

OPU_HFM
VR_DVD
DVDLD
CDLD
VR_CD
R17

MD_CD

TP60
TP88
TP59
TP87
TP58
TP86
TP57

FOCUS_S
SLED_S
TRACK_S
SPDL_S

FOCUS_S
SLED_S
TRACK_S
SPDL_S

CLOSE

TP56
TP85
TP55

OPEN

CD_DVD
RF
RF_C
RF_B
RF_A
RF_D
RF_F
RF_E

3V3_DRV

CFCERR1(TRB_1)

1V8_FB

CFCERR2(REGO2)

SLED_S

VINSL+

3V3_FB

VINSL-(REGO1)

CLOSE

VOSL(FWD)

OPEN

VNFFC(REV)

VCC

STBY

28

BIAS

27

VINTK

26

CTKERR1(TRB_2)

25

CTKERR2(NC)

24

VINLD

23

PREGND

22

P+5V

PVCC2

21

+
C175
220uF/16V
TP61
TP39

C156
0.1uF

DSPVCC33

VC2
TRACK_S
1V8_DRV

R160
1K 1%

1.25V

1V8_FB

R225
12K 1%

1.25V
R228
10K

R165
33K

SPDL_S

LOAD-

PVCC1(LOAD-)

VNFTK(NC)

20

LOAD+

10

PGND(LOAD+)

PGND(VCC2)

19

SL_MOT+

11

VOSL-(VOSL+)

VOLD-

18

SL_MOT-

12

VOSL+(VOSL-)

VOLD+

17

SP_MOT+

FACT-

13

VOFC-

VOTK-

16

TACT-

FACT+

14

VOFC+

VOTK+

15

TACT+

C129
0.1uF

R240
1K 1%

SP_M-

29
30

24P/0.5

3V3_FB

DSPVCC18

R227
4K3 1%

DRVSB

P+5V

TP54

0R CD_DVD
RF
RF_C
RF_B
RF_A
RF_D
RF_F
RF_E
OPU5V
VC1

VINFC

GND
GND1

TRTR+
FOFO+
MD(DVD)
VCC/NC
VR(DVD)
GND(DVD)
LD(DVD)
LD(CD)
VR(CD)
GND(CD)
MD(CD)
NC/SEL
V-RF
V-C
V-B
V-A
V-D
V-F
V-E
Vcc
Vs
GND

Q38
8550

R224
20K 1%

Q35
8550

1
1

DSPVCC33

CON9

2
Q36
8550

+ C188
47uF/16V

C166
0.1uF

C147
0.1uF

D18
1N4002
2

Q37
8550

CD_DVD

CD_DVD

RF_D
RF_C

TACTTACT+
FACT+
FACT-

P+5V

PDIC Control:
DVD=LOW
CD=HIGH

R317
3.3K

RF_F
RF_B
RF_A
RF

GND

24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1

OPU
HD65PS
R175: 3.3R
R189: 3.3R

25

26

GND

GND-LD
DVD-LD
NC
HFM
MD
CD-LD
VR-DVD
VR-CD
NC
E
VCC
VC(VREF)
GND/PD
F
B
A
RF
CD/DVD_SW
D
C
TT+
F+
F-

LD_DVD

+ C178
100uF/16V

DVDLD
CON14
24Pin OPU connector

220R

DSPVCC33

OPU
HD65PS
R221: 3.3R
R224: 3.3R

R181

1
3

TP46
TP62
TP51
TP63
TP52
TP64
TP53
TP84

VR_CD

R244

VR_DVD

R245

MD_DVD
MD_CD
R236
NC

CON7
R185
NC

SLSL+
HOMESW
GND
SP+
SP-

100R
100R

1
2
3
4
5
6

SL_MOTSL_MOT+
HOMESW

TP68
TP69
TP27

SP_MOT+
SP_MOT-

TP40
TP41

6P 2.0: SLED & SPINDLE Con


R235
100R

R187
100R

DSPVCC33
CON8

LOAD+
LOADOUTSW
GND
INSW

5
4
3
2
1

LOAD+
LOAD-

TP42
TP44
TP65

R172
4.7K

R162
4.7K

R197
4.7K
HOMESW
IN_OUT_SW
INSW

5p 2.0: TRAY_Con

HOMESW
IN_OUT_SW
INSW

TP66
A

Design:
Checked:
5

Apprd:

VDDPWM

FOCUS_S
TRACK_S

R206
R213

51K
51K

SPDL_S
SLED_S

R209
R211

22K
51K

FB5
VDD1AFE

NC/0R

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52

MEMADD16
CON6
2
4
6
8
10
12
14
16

TP38

FCU_WAIT#

2
4
6
8
10
12
14
16

1
3
5
7
9
11
13
15

FCU_SCLK
DSPVCC33
MEMDAT12

1
3
5
7
9
11
13
15

FCU_RST
FCU_CS2#
FCU_CS3#

MEMADD15
MEMADD14
MEMADD13
MEMADD12
MEMADD11
MEMADD10
MEMADD9
MEMADD8
MEMWR#
MEMADD18
MEMADD17
MEMADD7
MEMADD6

TP24
TP25
TP32
TP43
TP45
TP33

SD/MMC/MS

MEMADD5
MEMADD4
MEMADD3
R157

0R

FCU_IOWR# R156

0R

FCU_IORD#

MEMADD2
MEMADD1
MEMADD19

CON5
1
2

USB_DP
USB_DN

2PIN/2.0

RAMADD4
RAMADD3
RAMADD5
RAMADD2
RAMADD6
RAMADD1
RAMADD7

DSPVCC33
MEMADD1

RF_B
RF_A

RF_F
SPDL_SENS+
RF_E
SPDL_SENSRF_D
RF_C

MIC_VOCAL

15.4K 1%
0.1uF
VC

RF_F
SPDL_SENS+
RF_E
SPDL_SENSRF_D
RF_C

RFN
RFP

RF_B
RF_A
VDDAFE

VDD1AFE

RESOUT
VREF
VC

R233
C182

LD_DVD
LD_CD
MD_DVD
MD_CD

SLED_PWM

FOCUS_PWM
LD_DVD
LD_CD
MD_DVD
MD_CD
VDDAFE

GNDDACBS2
RSET
DAC1
VDDDAC
DAC2
DAC3
VDDDAC
DAC4
GNDDAC_D
DAC5
XIN
XO
VDDPLL
GNDPLL
RESET#
GNDC
VDDC
GPIO[48]/DUPRD1
GPIO[47]/DUPTD1
GPIO[46]/DUPRD0
GPIO[45]/PWMCO[5]/DUPTD0
VDDP
IGPIO[44]
GPIO[43]/TDO
GPIO[42]/TCK
GPIO[41]/TDI/NMI
GPIO[40]
GPIO[39]
GPIO[38]
IGPIO[37]/TMS/NMI
GPIO[36]
GPIO[35]
GPIO[34]/RAMCKE/SPDIFIN
GPIO[33]/AIN/SPDIFIN
GPIO[32]/SPDIFO
GPIO[31]/ABCLK
GPIO[30]/ALRCLK
VDDP
GPIO[29]/AMCLK
GNDC
GPIO[28]/AOUT[0]/APWM0GPIO[27]/APWM0+
GPIO[26]/AOUT[1]/APWM1GPIO[25]/APWM1+
GPIO[24]/AOUT[2]/APWM2IGPIO[23]/APWM2+
GNDAPWM
GPIO[22]/AOUT[3]/APWM3GPIO[21]/APWM3+
GPIO[20]/APWM4GPIO[19]/PWMCO[5]/APWM4+
VDDAPWM

ZR36962

53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104

R212
1K

C137

OSCIN

DSPVCC18
+ C180
100uF/16V

33pF

Close to Vaddis!

DSPVCC33

156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105

R16
390 Ohm 1%

Close to
Vaddis

C_B_U
Y_R_V
CVBS_C

Y_R_V
CVBS_C

VDDDAC
CVBS_G_Y
Y_C_CVBS
OSCIN
OSCOUT
VDDPLL
RESET#
DUPRD1
DUPTD1
DUPRD0
DUPTD0
IRRCV
FPC_DOUT
FPC_CLK
FPC_STB
INSW
CD_DVD''
DRVSB
IN_OUT_SW
CLOSE
OPEN
HOMESW
AIN
S/PDIF_OUT
ABCLK
ALRCLK
R270
33R

IRRCV
FPC_DOUT
FPC_CLK
FPC_STB
INSW

RESET#
C191
10uF/16V

CVBS_G_Y
Y_C_CVBS

UART:
For customer model, please just keep
test point close to Vaddis.
DUPRD1

R191

10K

MUTE_CTL

DUPTD1
DUPRD0
DUPTD0

R2
R203
R180

1K5
10K
180R

FS3
FS2
FS1

MUTE_CTL
FS3
FS2
FS1

ADD FOR (D)


DSPVCC33

MUX GPIOs

CD_DVD
FB8
MBW2012-221

C279
1nF

R25

RESET#
Q8
BT3904

4k7

D20

R24
15K

4148

APWM_LAPWM_L+
APWM_RAPWM_R+
APWM_SLAPWM_SL+

APWM_SRAPWM_SR+
APWM_CENAPWM_CEN+

C2
0.1UF

EEPROM

APWM_SRAPWM_SR+
APWM_CENAPWM_CEN+

U6
8
7
6
5

DSPVCC33

DSPVCC33
R246

R26
10K
+

10uF/16V

CD_DVD

AMCLK

APWM_LAPWM_L+
APWM_RAPWM_R+
APWM_SLAPWM_SL+

VDDAPWM

DSPVCC33

C191

DRVSB
IN_OUT_SW
CLOSE
OPEN
HOMESW
AIN
S/PDIF_OUT
ABCLK
ALRCLK

AMCLK

R241
4k7

D20
LL4148

C_B_U

VDDDAC

R179

4R7

2K

R178
2K

C154
104

VCC
WP
SCL
SDA

A0
A1
A2
GND

1
2
3
4

NC/24C02
C126
0.1uF

C177
100uF/16V

I2C_CLK
I2C_DAT

Close to pin 105

APWM_LFE+
APWM_LFE-

STBY

RAMCKE
OK_DET

STBY

RAMDAT14
RAMDAT1
RAMDAT15
RAMDAT0

RAMDAT13
RAMDAT2

RAMDAT10
RAMDAT5
RAMDAT11
RAMDAT4
RAMDAT12
RAMDAT3

IPCLK

RAMDAT8
RAMDAT7
RAMDAT9
RAMDAT6

JP1
NC

IPCLK

1
2

JP1
OPEN
CLOSE

RAMADD0
RAMADD8
RAMADD10

BOOTSEL
Play
Download

Y4
27.000MHz

VDDPLL
C183
104

Vaddis 9

RAMWERAMDQM

TP35

MEMDAT13
FCU_IRQ

MEMDAT[2]
MEMDAT[10]/GPIO[0]
MEMDAT[3]
MEMDAT[11]/GPIO[1]
MEMDAT[4]
MEMDAT[12]/GPIO[2]
MEMDAT[5]
MEMDAT[13]/GPIO[3]
MEMDAT[6]
MEMDAT[14]/GPIO[4]
GNDC
MEMDAT[7]
MEMDAT[15]
VDDC
VDDP
MEMADD[16]
MEMCS1#/GPIO[5]
MEMADD[15]
MEMADD[14]
MEMADD[13]
MEMADD[12]
MEMADD[11]
MEMADD[10]
MEMADD[9]
MEMADD[8]
MEMWR#
MEMADD[18]/GPIO[6]
MEMADD[17]
MEMADD[7]
MEMADD[6]
GNDC
MEMADD[5]
MEMADD[4]
MEMADD[3]
VDDP
MEMADD[2]
MEMADD[1]
MEMADD[19]/IGPIO[7]
USBVDD
USBDP/GPO[67]
USBDN/GPO[68]
USBGND
RAMADD[4]
RAMADD[3]
RAMADD[5]
VDDIP
GNDC
RAMADD[2]
RAMADD[6]
RAMADD[1]
RAMADD[7]
VDDC

RAMADD9
RAMADD11
RAMCS0RAMBA
RAMCS1RAMRASRAMCAS-

TP36
TP37

R158
1M

FB

MEMDAT2
MEMDAT10
MEMDAT3
MEMDAT11
MEMDAT4
MEMDAT12
MEMDAT5
MEMDAT13
MEMDAT6
MEMDAT14

FLASHVCC

MEMDAT7
MEMDAT15

FB2

R169

Close to Vaddis!

+ C187
100uF/16V

P+5V

0R

33pF

DSPVCC33

FB
C127
104

U1A

MEMCS0#
MEMADD0

R188

C135

DSPVCC33

R194
0R
NC

VDDDAC

RF

75R 1%
75R 1%
75R 1%
75R 1%
75R 1%

R195
NC
0R

RF
C142
33pF

RAMADD[0]
RAMADD[8]
RAMADD[10]
VDDP
GNDC
RAMADD[9]
RAMADD[11]/GPO[64]
RAMCS0#
RAMBA
RAMCS1#/GPO[65]
RAMRAS#
RAMCAS#
VDDP
GNDC
RAMWE#
RAMDQM
GNDPCLK
PCLK
VDDPCLK
RAMDAT[8]
RAMDAT[7]
RAMDAT[9]
RAMDAT[6]
VDDP
GNDC
RAMDAT[10]
RAMDAT[5]
RAMDAT[11]
RAMDAT[4]
RAMDAT[12]
RAMDAT[3]
VDDP
GNDC
RAMDAT[13]
RAMDAT[2]
VDDC
RAMDAT[14]
RAMDAT[1]
RAMDAT[15]
RAMDAT[0]
VDDP
RAMDQM2/RAMCKE/GPO[66]
GNDC
RAMCKE/SDI_PSC/GPIO[10]
GPAIO/IGPIO[11]
APWM7+/GPIO[12]
APWM7-/GPIO[13]
APWM6+/GPIO[14]
APWM6-/GPIO[15]
APWM5+/GPIO[16]
APWM5-/GPIO[17]
AIN/SPDIFIN/IO[18]

[39VF400/800/160]

PH1

FB4
C168 1nF

R173
R215
R208
R174
R193

Close to Pin37 of U15

Use it to connect the shell of the crystal with ground.

C186
100uF/16V

C181 1nF

DSPVCC33

SST39VF800

Flash select
Intel
AMD/SST

100R
100R

MEMDAT9
MEMDAT1
MEMDAT8
MEMDAT0
MEMRD#
MEMCS0#
MEMADD0

R190
R184

DSPVCC18

C125
104

208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157

C150
104

FLASHVCC

OSCOUT

VDDP
GPIO[9]/MEMDAT[9]
MEMDAT[1]
GPIO[8]/MEMDAT[8]
MEMDAT[0]
MEMRD#
MEMCS0#
MEMADD[0]
GPIO[63]/MEMCS2#
GPIO[62]/FCU_IORD#
GPIO[61]/FCU_IOWR#
GPIO[60]/FCU_SCLK
GPIO[59]/FCU_CS2#
GPIO[58]/FCU_CS3#
GPIO[57]/FCU_WAIT#
GPIO[56]/FCU_RST
IGPIO[55]/FCU_IRQ
GNDC
VDDC
IGPIO[54]/PWMCO[5]
GPIO[53]/PWMCO[4]
GPIO[52]/PWMCO[3]
GPIO[51]/PWMCO[2]
GNDPWM
GPIO[50]/PWMCO[1]
VDDPWM
GPIO[49]/PWMCO[0]
DVD_LD
CD_LD
DVD_MD
CD_MD
VDDSAFE
GNDREF
RESOUT
VREF
VC
GND1AFE
H
G
GNDAFE
F
K
E
J
D
C
VDDAFE
B
A
VDD1AFE
RFN
RFP

FLASHVCC
R194
NC
MEMADD18
MEMADD17
MEMADD7
MEMADD6
MEMADD5
MEMADD4
MEMADD3
MEMADD2
MEMADD1

RESET#

TP181
TP182

C155
10nF

MEMWR#

MEMDAT15
MEMDAT7
MEMDAT14
MEMDAT6
MEMDAT13
MEMDAT5
MEMDAT12
MEMDAT4
FLASHVCC
MEMDAT11
MEMDAT3
MEMDAT10
MEMDAT2
MEMDAT9
MEMDAT1
MEMDAT8
MEMDAT0
MEMRD#

MEMADD19

MEMADD16

VDDPWM

27nF

I2C_DAT
I2C_CLK

27nF

SPDL_PWM

1nF

TRACK_PWM

1nF

DSPVCC33

FB

MIC_VOCAL

C164 C159 C161 C160

U2
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25

Crystal

FB3

FB

VDDAFE

Flash speed <= 70 nS.


If plan to use 90ns Flash, it needs to be verified by s/w.

A16
VCCQ
GND
DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
GND
CE#
A0

+ C185
100uF/16V

Close to Vaddis!
SPDL_S
SLED_S

A15
BYTE#
A14
A13
A12
A11
A10
A9
A8
NC A19
A20
WE#
RP#
VPP NC
WP# NC
A19 RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1

DSPVCC33

FB
C133
104

FOCUS_S
TRACK_S

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24

FB1

51K
51K
22K
51K

FCU_IORD#
FCU_IOWR#
FCU_SCLK
FCU_CS2#
FCU_CS3#
FCU_WAIT#
FCU_RST
FCU_IRQ

R206
R213
R209
R211

While using AM5888S

MEMADD15
MEMADD14
MEMADD13
MEMADD12
MEMADD11
MEMADD10
MEMADD9
MEMADD8
R195
0R

Important power supply!

Note: While using different OPU,


use the same parameter for
AM5888S

TP31
TP29
TP30

APWM_LFE+
APWM_LFE-

R183
56R
PCLK

CON4

500mA for device


P+5V
CON11

C139
NC/5PF

TP26
TP28
TP34

Close to
Vaddis

P+5V
DUPTD0
DUPRD0

1
2
3
4

P+5V
USB_DN
USB_DP

R238
15K

4
3
2
1
2.0X4USB

R237
15K

4PIN/2.0

ADD FOR STB REALLY

C162
104

C144
104

RAMADD11
RAMADD9
RAMADD8
RAMADD7
RAMADD6
RAMADD5
RAMADD4

RAMDQM
PCLK

RAMDAT8

RAMDAT10
RAMDAT9

RAMDAT12
RAMDAT11

54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28

SDRAM3.3V

+ C189
220uF/16V

U4

VSS
A4
A5
A6
A7
A8
A9
NC
CKE
CLK
UDQM
NC
VDDQ
DQ8
DQ9
VSSQ
DQ10
DQ11
VDDQ
DQ12
DQ13
VSSQ
DQ14
DQ15
VSS

U3

16Mbit: K4S161622C-TC/L70

NM

[64Mbit:K4S641632H-UC70]

SDRAM configuration:
1X16Mbit: CS0# = Low;
1X64Mbit: CS1# = Low; CS0#=BA1
SDRAM speed <=7ns
Tras <=44.4ns
Trp
<=22.2ns

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27

25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1

VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
VDD
DQML
WE#
CAS#
RAS#
CS#
BA0
BA1
A10
A0
A1
A2
A3
VDD

VDD
A3
A2
A1
A0
A10/AP
BA
CS
RAS
CAS
WE
LDQM
VDDQ
DQ7
DQ6
VSSQ
DQ5
DQ4
VDDQ
DQ3
DQ2
VSSQ
DQ1
DQ0
VDD

RAMDQM
RAMWERAMCASRAMRASRAMCS1RAMBA
RAMCS0RAMADD10
RAMADD0
RAMADD1
RAMADD2
RAMADD3

RAMDAT7

RAMDAT5
RAMDAT6

RAMDAT1
RAMDAT2

RAMDAT0

RAMDAT3
RAMDAT4

RAMDAT1
RAMDAT0

RAMDAT3
RAMDAT2

RAMDAT5
RAMDAT4

RAMADD3
RAMADD2
RAMADD1
RAMADD0
RAMADD10
RAMBA
RAMCS0RAMRASRAMCASRAMWERAMDQM

SDRAM3.3V
RAMDAT7
RAMDAT6

C157
104

RAMCKE

26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50

DSPVCC18
C145
104

10K

DSPVCC33

+ C173
220uF/16V

RAMDAT15

C170
104

VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
VSS
NC
DQMH
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
VSS

C202
104

RAMDAT14
RAMDAT15

C169
104

RAMDAT12
RAMDAT13

C122
104

RAMDAT10
RAMDAT11

C165
104

RAMDAT8
RAMDAT9

C199
104

PCLK
RAMDQM

C167
104

RAMADD4
RAMADD5
RAMADD6
RAMADD7
RAMADD8
RAMADD9

C151
104

RAMDAT14
RAMDAT13

R170

DSPVCC33
C171
104

Design:

MODEL: DV5312

TITLE: DSP+SDRAM+FLASH

Checked:

PART NO.:

DWG NO.:DV5312-YL01-03

Apprd:

SHEET:

2 OF 5

VER: A

SHEN ZHEN MTC MULTIMEDIA CO.,LTD


5

FLASH
16M

SDRAM
1*16M/4*16M

CD
ARIMA
+12V

PH681

DSP

S-VIDEO/CVBS OUTPUT
VIDEO

+5V

MOTOR-DRIVER

ZR36962

D5888S

U5

YUV OUTPUT
VIDEO

T2

100-240V

PORT

U1

EEL19

AC IN

PORT

+1.8V

PWM POWER
TNY275PN

DIGTAL COAXIAL OUTPUT


COAXIAL

+3.3V

IC1

PORT

USB1.1 INPUT
USB

+5V
B

VFD DRIVER

-21V

PORT

OPERATIONAL AMPLIFIER

5.1CH AUDIO OUTPUT

NJM4558

AUDIO PORT

U7/U8/U9

VFD
DISPLAY

Design:

MODEL: DV5312

TITLE: DSP+SDRAM+FLASH

Checked:

PART NO.:

DWG NO.:DV5312-YL01-03

Apprd:

SHEET:

1 OF 1

VER: A

SHEN ZHEN MTC MULTIMEDIA CO.,LTD


QR-RD-016A
5

Design:

MODEL: DV5312(ZORAN)

Checked:

PART NO.:

Apprd:

SHEET: 6

TITLE: Cover page

DWG NO.:DV5312-YL01-03

pages

VER: A

SHEN ZHEN MTC MULTIMEDIA CO.,LTD


QR-RD-016A

TNY274-280

TinySwitch-III Family

Energy Efcient, Off-Line Switcher with


Enhanced Flexibility and Extended Power Range
Product Highlights
Lowest System Cost with Enhanced Flexibility
Simple ON/OFF control, no loop compensation needed
Selectable current limit through BP/M capacitor value
- Higher current limit extends peak power or, in open
frame applications, maximum continuous power
- Lower current limit improves efciency in enclosed
adapters/chargers
- Allows optimum TinySwitch-III choice by swapping
devices with no other circuit redesign
Tight I2f parameter tolerance reduces system cost
- Maximizes MOSFET and magnetics power delivery
- Minimizes max overload power, reducing cost of
transformer, primary clamp & secondary components
ON-time extension extends low line regulation range/
hold-up time to reduce input bulk capacitance
Self-biased: no bias winding or bias components
Frequency jittering reduces EMI lter costs
Pin-out simplies heatsinking to the PCB
SOURCE pins are electrically quiet for low EMI
Enhanced Safety and Reliability Features
Accurate hysteretic thermal shutdown protection with
automatic recovery eliminates need for manual reset
Improved auto-restart delivers <3% of maximum power
in short circuit and open loop fault conditions
Output overvoltage shutdown with optional Zener
Line under-voltage detect threshold set using a single
optional resistor
Very low component count enhances reliability and
enables single-sided printed circuit board layout
High bandwidth provides fast turn on with no overshoot
and excellent transient load response
Extended creepage between DRAIN and all other pins
improves eld reliability

EcoSmart Extremely Energy Efcient


Easily meets all global energy efciency regulations
No-load <150 mW at 265 VAC without bias winding,
<50 mW with bias winding
ON/OFF control provides constant efciency down to
very light loads ideal for mandatory CEC regulations
and 1 W PC standby requirements
Applications
Chargers/adapters for cell/cordless phones, PDAs, digital
cameras, MP3/portable audio, shavers, etc.

+
DC
Output

Wide-Range
HV DC Input

EN/UV
BP/M

TinySwitch-III
S

PI-4095-082205

Figure 1. Typical Standby Application.

OUTPUT POWER TABLE


230 VAC 15%

PRODUCT3

85-265 VAC

Peak or
Peak or
Adapter1 Open Adapter1 Open
Frame2
Frame2

TNY274 P or G
TNY275 P or G
TNY276 P or G
TNY277 P or G
TNY278 P or G
TNY279 P or G
TNY280 P or G

6W
8.5 W
10 W
13 W
16 W
18 W
20 W

11 W
15 W
19 W
23.5 W
28 W
32 W
36.5 W

5W
6W
7W
8W
10 W
12 W
14 W

8.5 W
11.5 W
15 W
18 W
21.5 W
25 W
28.5 W

Table 1. Notes: 1. Minimum continuous power in a typical nonventilated enclosed adapter measured at 50 C ambient. Use of an
external heatsink will increase power capability 2. Minimum peak
power capability in any design or minimum continuous power in an
open frame design (see Key Application Considerations). 3. Packages:
P: DIP-8C, G: SMD-8C. See Part Ordering Information.

PC Standby and other auxiliary supplies


DVD/PVR and other low power set top decoders
Supplies for appliances, industrial systems, metering, etc.

Description
TinySwitch-III incorporates a 700 V power MOSFET, oscillator,
high voltage switched current source, current limit (user
selectable) and thermal shutdown circuitry. The IC family uses
an ON/OFF control scheme and offers a design exible solution
with a low system cost and extended power capability.
February 2006

TNY274-280
BYPASS/
MULTI-FUNCTION
(BP/M)

DRAIN
(D)

REGULATOR
5.85 V
LINE UNDER-VOLTAGE

115 A

25 A

FAULT
PRESENT
AUTORESTART
COUNTER
6.4 V

RESET

BYPASS PIN
UNDER-VOLTAGE

+
-

5.85 V
4.9 V

CURRENT
LIMIT STATE
MACHINE

VI

LIMIT

CURRENT LIMIT
COMPARATOR
ENABLE

JITTER
CLOCK

1.0 V + VT

DCMAX

THERMAL
SHUTDOWN

OSCILLATOR
ENABLE/
UNDERVOLTAGE
(EN/UV)

1.0 V
S

LEADING
EDGE
BLANKING

SOURCE
(S)
PI-4077-013106

Figure 2. Functional Block Diagram.

Pin Functional Description


DRAIN (D) Pin:
This pin is the power MOSFET drain connection. It provides
internal operating current for both start-up and steady-state
operation.
BYPASS/MULTI-FUNCTION (BP/M) Pin:
This pin has multiple functions:
1. It is the connection point for an external bypass capacitor
for the internally generated 5.85 V supply.
2. It is a mode selector for the current limit value, depending
on the value of the capacitance added. Use of a 0.1 F
capacitor results in the standard current limit value. Use of
a 1 F capacitor results in the current limit being reduced to
that of the next smaller device size. Use of a 10 F capacitor
results in the current limit being increased to that of the next
larger device size for TNY275-280.
3. It provides a shutdown function. When the current into the
bypass pin exceeds 5.5 mA, the device latches off until the
BP/M voltage drops below 4.9 V, during a power down.
This can be used to provide an output overvoltage function

E
2/06

P Package (DIP-8C)
G Package (SMD-8C)
EN/UV

BP/M

PI-4078-080905

Figure 3. Pin Conguration.

with a Zener connected from the BP/M pin to a bias winding


supply.
ENABLE/UNDER-VOLTAGE (EN/UV) Pin:
This pin has dual functions: enable input and line under-voltage
sense. During normal operation, switching of the power

TNY274-280
MOSFET is controlled by this pin. MOSFET switching is
terminated when a current greater than a threshold current is
drawn from this pin. Switching resumes when the current being
pulled from the pin drops to less than a threshold current. A
modulation of the threshold current reduces group pulsing. The
threshold current is between 60 A and 115 A.
The EN/UV pin also senses line under-voltage conditions through
an external resistor connected to the DC line voltage. If there is
no external resistor connected to this pin, TinySwitch-III detects
its absence and disables the line under-voltage function.
SOURCE (S) Pin:
This pin is internally connected to the output MOSFET source
for high voltage power return and control circuit common.

TinySwitch-III Functional
Description
TinySwitch-III combines a high voltage power MOSFET switch
with a power supply controller in one device. Unlike conventional
PWM (pulse width modulator) controllers, it uses a simple
ON/OFF control to regulate the output voltage.
The controller consists of an oscillator, enable circuit (sense and
logic), current limit state machine, 5.85 V regulator, BYPASS/
MULTI-FUNCTION pin under-voltage, overvoltage circuit, and
current limit selection circuitry, over- temperature protection,
current limit circuit, leading edge blanking, and a 700 V power
MOSFET. TinySwitch-III incorporates additional circuitry for
line under-voltage sense, auto-restart, adaptive switching cycle
on-time extension, and frequency jitter. Figure 2 shows the
functional block diagram with the most important features.

600
500
VDRAIN
400

PI-2741-041901

Oscillator
The typical oscillator frequency is internally set to an average
of 132 kHz. Two signals are generated from the oscillator: the

300
200
100
0
136 kHz
128 kHz

10

maximum duty cycle signal (DCMAX) and the clock signal that
indicates the beginning of each cycle.
The oscillator incorporates circuitry that introduces a small
amount of frequency jitter, typically 8 kHz peak-to-peak, to
minimize EMI emission. The modulation rate of the frequency
jitter is set to 1 kHz to optimize EMI reduction for both average
and quasi-peak emissions. The frequency jitter should be
measured with the oscilloscope triggered at the falling edge of
the DRAIN waveform. The waveform in Figure 4 illustrates
the frequency jitter.
Enable Input and Current Limit State Machine
The enable input circuit at the EN/UV pin consists of a low
impedance source follower output set at 1.2 V. The current
through the source follower is limited to 115 A. When the
current out of this pin exceeds the threshold current, a low
logic level (disable) is generated at the output of the enable
circuit, until the current out of this pin is reduced to less than
the threshold current. This enable circuit output is sampled
at the beginning of each cycle on the rising edge of the clock
signal. If high, the power MOSFET is turned on for that cycle
(enabled). If low, the power MOSFET remains off (disabled).
Since the sampling is done only at the beginning of each cycle,
subsequent changes in the EN/UV pin voltage or current during
the remainder of the cycle are ignored.
The current limit state machine reduces the current limit by
discrete amounts at light loads when TinySwitch-III is likely to
switch in the audible frequency range. The lower current limit
raises the effective switching frequency above the audio range
and reduces the transformer ux density, including the associated
audible noise. The state machine monitors the sequence of
enable events to determine the load condition and adjusts the
current limit level accordingly in discrete amounts.
Under most operating conditions (except when close to no-load),
the low impedance of the source follower keeps the voltage on
the EN/UV pin from going much below 1.2 V in the disabled
state. This improves the response time of the optocoupler that
is usually connected to this pin.
5.85 V Regulator and 6.4 V Shunt Voltage Clamp
The 5.85 V regulator charges the bypass capacitor connected
to the BYPASS pin to 5.85 V by drawing a current from the
voltage on the DRAIN pin whenever the MOSFET is off. The
BYPASS/MULTI-FUNCTION pin is the internal supply voltage
node. When the MOSFET is on, the device operates from the
energy stored in the bypass capacitor. Extremely low power
consumption of the internal circuitry allows TinySwitch-III to
operate continuously from current it takes from the DRAIN
pin. A bypass capacitor value of 0.1 F is sufcient for both
high frequency decoupling and energy storage.

Time (s)

Figure 4. Frequency Jitter.


E
2/06

TNY274-280
In addition, there is a 6.4 V shunt regulator clamping the
BYPASS/MULTI-FUNCTION pin at 6.4 V when current
is provided to the BYPASS/MULTI-FUNCTION pin
through an external resistor. This facilitates powering of
TinySwitch-III externally through a bias winding to decrease
the no-load consumption to well below 50 mW.
BYPASS/MULTI-FUNCTION Pin Under-Voltage
The BYPASS/MULTI-FUNCTION pin under-voltage circuitry
disables the power MOSFET when the BYPASS/MULTIFUNCTION pin voltage drops below 4.9 V in steady state
operation. Once the BYPASS/MULTI-FUNCTION pin voltage
drops below 4.9 V in steady state operation, it must rise back
to 5.85 V to enable (turn-on) the power MOSFET.
Over Temperature Protection
The thermal shutdown circuitry senses the die temperature. The
threshold is typically set at 142 C with 75 C hysteresis. When
the die temperature rises above this threshold the power MOSFET
is disabled and remains disabled until the die temperature falls
by 75 C, at which point it is re-enabled. A large hysteresis of
75 C (typical) is provided to prevent overheating of the PC
board due to a continuous fault condition.
Current Limit
The current limit circuit senses the current in the power MOSFET.
When this current exceeds the internal threshold (ILIMIT), the
power MOSFET is turned off for the remainder of that cycle. The
current limit state machine reduces the current limit threshold
by discrete amounts under medium and light loads.

300

PI-4098-082305

The leading edge blanking circuit inhibits the current limit


comparator for a short time (tLEB) after the power MOSFET is
turned on. This leading edge blanking time has been set so that
current spikes caused by capacitance and secondary-side rectier
reverse recovery time will not cause premature termination of
the switching pulse.

DRAIN

200

Auto-Restart
In the event of a fault condition such as output overload, output
short circuit, or an open loop condition, TinySwitch-III enters
into auto-restart operation. An internal counter clocked by the
oscillator is reset every time the EN/UV pin is pulled low. If the
EN/UV pin is not pulled low for 64 ms, the power MOSFET
switching is normally disabled for 2.5 seconds (except in the
case of line under-voltage condition, in which case it is disabled
until the condition is removed). The auto-restart alternately
enables and disables the switching of the power MOSFET until
the fault condition is removed. Figure 5 illustrates auto-restart
circuit operation in the presence of an output short circuit.
In the event of a line under-voltage condition, the switching of
the power MOSFET is disabled beyond its normal 2.5 seconds
until the line under-voltage condition ends.
Adaptive Switching Cycle On-Time Extension
Adaptive switching cycle on-time extension keeps the cycle
on until current limit is reached, instead of prematurely
terminating after the DCMAX signal goes low. This feature
reduces the minimum input voltage required to maintain
regulation, extending hold-up time and minimizing the size
of bulk capacitor required. The on-time extension is disabled
during the startup of the power supply, until the power supply
output reaches regulation.
Line Under-Voltage Sense Circuit
The DC line voltage can be monitored by connecting an external
resistor from the DC line to the EN/UV pin. During power-up or
when the switching of the power MOSFET is disabled in autorestart, the current into the EN/UV pin must exceed 25 A to
initiate switching of the power MOSFET. During power-up, this
is accomplished by holding the BYPASS/MULTI-FUNCTION
pin to 4.9 V while the line under-voltage condition exists. The
BYPASS/MULTI-FUNCTION pin then rises from 4.9 V to
5.85 V when the line under-voltage condition goes away. When the
switching of the power MOSFET is disabled in auto-restart mode
and a line under-voltage condition exists, the auto-restart counter
is stopped. This stretches the disable time beyond its normal
2.5 seconds until the line under-voltage condition ends.
The line under-voltage circuit also detects when there is
no external resistor connected to the EN/UV pin (less than
~1 A into the pin). In this case the line under-voltage function
is disabled.

100
0
10

TinySwitch-III Operation

V
DC-OUTPUT

5
0

2500

Time (ms)
Figure 5. Auto-Restart Operation.

E
2/06

5000

TinySwitch-III devices operate in the current limit mode. When


enabled, the oscillator turns the power MOSFET on at the
beginning of each cycle. The MOSFET is turned off when the
current ramps up to the current limit or when the DCMAX limit is
reached. Since the highest current limit level and frequency of
a TinySwitch-III design are constant, the power delivered to the

TNY274-280
load is proportional to the primary inductance of the transformer
and peak primary current squared. Hence, designing the supply
involves calculating the primary inductance of the transformer
for the maximum output power required. If the TinySwitch-III
is appropriately chosen for the power level, the current in the
calculated inductance will ramp up to current limit before the
DCMAX limit is reached.

not to proceed with the next switching cycle. The sequence of


cycles is used to determine the current limit. Once a cycle is
started, it always completes the cycle (even when the EN/UV
pin changes state half way through the cycle). This operation
results in a power supply in which the output voltage ripple
is determined by the output capacitor, amount of energy per
switch cycle and the delay of the feedback.

Enable Function
TinySwitch-III senses the EN/UV pin to determine whether or

The EN/UV pin signal is generated on the secondary by


comparing the power supply output voltage with a reference
voltage. The EN/UV pin signal is high when the power supply
output voltage is less than the reference voltage.

V
EN

In a typical implementation, the EN/UV pin is driven by an


optocoupler. The collector of the optocoupler transistor is
connected to the EN/UV pin and the emitter is connected to
the SOURCE pin. The optocoupler LED is connected in series
with a Zener diode across the DC output voltage to be regulated.
When the output voltage exceeds the target regulation voltage
level (optocoupler LED voltage drop plus Zener voltage), the
optocoupler LED will start to conduct, pulling the EN/UV pin
low. The Zener diode can be replaced by a TL431 reference
circuit for improved accuracy.

CLOCK
DC

MAX

I DRAIN

V DRAIN

PI-2749-082305

Figure 6. Operation at Near Maximum Loading.

ON/OFF Operation with Current Limit State Machine


The internal clock of the TinySwitch-III runs all the time. At
the beginning of each clock cycle, it samples the EN/UV pin to
decide whether or not to implement a switch cycle, and based
on the sequence of samples over multiple cycles, it determines
the appropriate current limit. At high loads, the state machine
sets the current limit to its highest value. At lighter loads, the
state machine sets the current limit to reduced values.

V
EN

V
EN

CLOCK

CLOCK

DC

DC

MAX

I DRAIN

MAX

I DRAIN

V DRAIN

V DRAIN

PI-2377-082305

PI-2667-082305

Figure 7. Operation at Moderately Heavy Loading.

Figure 8. Operation at Medium Loading.


E
2/06

TNY274-280

V
EN

PI-2381-1030801

200
V
DC-INPUT

100
0

CLOCK

10

DC

MAX

BYPASS

I DRAIN

400
200

DRAIN

0
0

Time (ms)
V DRAIN

PI-2661-082305

200
V
DC-INPUT

100

At near maximum load, TinySwitch-III will conduct during


nearly all of its clock cycles (Figure 6). At slightly lower load,
it will skip additional cycles in order to maintain voltage
regulation at the power supply output (Figure 7). At medium
loads, cycles will be skipped and the current limit will be reduced
(Figure 8). At very light loads, the current limit will be reduced
even further (Figure 9). Only a small percentage of cycles will
occur to satisfy the power consumption of the power supply.
The response time of the ON/OFF control scheme is very fast
compared to PWM control. This provides tight regulation and
excellent transient response.
PI-2383-030801

200
V
DC-INPUT

100

0
400
300

0
0

200

300

400

200

DC-INPUT

V
DRAIN

100

DRAIN

Time (ms)

Figure 10. Power-Up with Optional External UV Resistor (4 M)


Connected to EN/UV Pin.

400

BYPASS

Time (s)

10

200

.5

Figure 12. Normal Power-Down Timing (without UV).

100

DRAIN

100

200

PI-2395-030801

Figure 9. Operation at Very Light Load.

PI-2348-030801

Figure 11. Power-Up Without Optional External UV Resistor


Connected to EN/UV Pin.

E
2/06

2.5

Time (s)

Figure 13. Slow Power-Down Timing with Optional External


(4 M) UV Resistor Connected to EN/UV Pin.

TNY274-280
Power Up/Down
The TinySwitch-III requires only a 0.1 F capacitor on the
BYPASS/MULTI-FUNCTION pin to operate with standard
current limit. Because of its small size, the time to charge this
capacitor is kept to an absolute minimum, typically 0.6 ms. The
time to charge will vary in proportion to the BYPASS/MULTIFUNCTION pin capacitor value when selecting different current
limits. Due to the high bandwidth of the ON/OFF feedback,
there is no overshoot at the power supply output. When an
external resistor (4 M) is connected from the positive DC
input to the EN/UV pin, the power MOSFET switching will
be delayed during power-up until the DC line voltage exceeds
the threshold (100 V). Figures 10 and 11 show the power-up
timing waveform in applications with and without an external
resistor (4 M) connected to the EN/UV pin.

Functional Description above). This has two main benets.


First, for a nominal application, this eliminates the cost of a
bias winding and associated components. Secondly, for battery
charger applications, the current-voltage characteristic often
allows the output voltage to fall close to zero volts while still
delivering power. TinySwitch-III accomplishes this without a
forward bias winding and its many associated components. For
applications that require very low no-load power consumption
(50 mW), a resistor from a bias winding to the BYPASS/
MULTI-FUNCTION pin can provide the power to the chip.
The minimum recommended current supplied is 1 mA. The
BYPASS/MULTI-FUNCTION pin in this case will be clamped
at 6.4 V. This method will eliminate the power draw from the
DRAIN pin, thereby reducing the no-load power consumption
and improving full-load efciency.

Under startup and overload conditions, when the conduction time


is less than 400 ns, the device reduces the switching frequency
to maintain control of the peak drain current.

Current Limit Operation


Each switching cycle is terminated when the DRAIN current
reaches the current limit of the device. Current limit operation
provides good line ripple rejection and relatively constant power
delivery independent of input voltage.

During power-down, when an external resistor is used, the


power MOSFET will switch for 64 ms after the output loses
regulation. The power MOSFET will then remain off without
any glitches since the under-voltage function prohibits restart
when the line voltage is low.
Figure 12 illustrates a typical power-down timing waveform.
Figure 13 illustrates a very slow power-down timing waveform
as in standby applications. The external resistor (4 M) is
connected to the EN/UV pin in this case to prevent unwanted
restarts.
No bias winding is needed to provide power to the chip
because it draws the power directly from the DRAIN pin (see

BYPASS/MULTI-FUNCTION Pin Capacitor


The BYPASS/MULTI-FUNCTION pin can use a ceramic
capacitor as small as 0.1 F for decoupling the internal power
supply of the device. A larger capacitor size can be used to adjust
the current limit. For TNY275-280, a 1 F BP/M pin capacitor
will select a lower current limit equal to the standard current
limit of the next smaller device and a 10 F BP/M pin capacitor
will select a higher current limit equal to the standard current
limit of the next larger device. The higher current limit level of
the TNY280 is set to 850 mA typical. The TNY274 MOSFET
does not have the capability for increased current limit so this
feature is not available in this device.

E
2/06

TNY274-280

C5
2.2 nF
250 VAC
VR1
P6KE150A

J1
85-265
VAC

F1
3.15 A

D1
1N4007

D2
1N4007

R2
100

C1
6.8 F
400 V

RV1
275 VAC

C2
22 F
400 V

D4
1N4007

C4
10 nF
1 kV

R1
1 k

C10
1000 F
25 V

R7
4 20
2

D6
UF4003

5
C6
1 F
60 V
R3
47
1/8 W

C7 is configurable to adjust
U1 current limit, see circuit
description

D
S

TinySwitch-III
U1
TNY278P

+12 V, 1 A
J3
C11
100 F
25 V J4
RTN

VR2
1N5255B
28 V

L1
1 mH

*R5 and R8 are optional


components

L2
Ferrite Bead
3.5 7.6 mm

D7
BYV28-200

D5
1N4007GP

R5*
3.6 M

J2
D3
1N4007

NC

T1

R8*
21 k
1%
EN/UV

VR3
BZX79-C11
11 V

R6
390
1/8 W
U2
PC817A

BP/M

C7
100 nF
50 V

R4
2 k
1/8 W

PI-4244-021406

Figure 14. TNY278P, 12 V, 1 A Universal Input Power Supply.

Applications Example
The circuit shown in Figure 14 is a low cost, high efciency,
yback power supply designed for 12 V, 1 A output from
universal input using the TNY278.
The supply features under-voltage lockout, primary sensed
output overvoltage latching shutdown protection, high
efficiency (>80%), and very low no-load consumption
(<50 mW at 265 VAC). Output regulation is accomplished using
a simple zener reference and optocoupler feedback.
The rectied and ltered input voltage is applied to the primary
winding of T1. The other side of the transformer primary is
driven by the integrated MOSFET in U1. Diode D5, C2, R1,
R2, and VR1 comprise the clamp circuit, limiting the leakage
inductance turn-off voltage spike on the DRAIN pin to a safe
value. The use of a combination a Zener clamp and parallel
RC optimizes both EMI and energy efciency. Resistor R2
allows the use of a slow recovery, low cost, rectier diode by
limiting the reverse current through D5. The selection of a
slow diode also improves efciency and conducted EMI but
should be a glass passivated type, with a specied recovery
time of 2 s.
The output voltage is regulated by the Zener diode VR3. When
the output voltage exceeds the sum of the Zener and optocoupler

E
2/06

LED forward drop, current will ow in the optocoupler LED.


This will cause the transistor of the optocoupler to sink current.
When this current exceeds the ENABLE pin threshold current
the next switching cycle is inhibited. When the output voltage
falls below the feedback threshold, a conduction cycle is allowed
to occur and, by adjusting the number of enabled cycles, output
regulation is maintained. As the load reduces, the number of
enabled cycles decreases, lowering the effective switching
frequency and scaling switching losses with load. This provides
almost constant efciency down to very light loads, ideal for
meeting energy efciency requirements.
As the TinySwitch-III devices are completely self-powered,
there is no requirement for an auxiliary or bias winding on the
transformer. However by adding a bias winding, the output
overvoltage protection feature can be congured, protecting
the load against open feedback loop faults.
When an overvoltage condition occurs, such that bias voltage
exceeds the sum of VR2 and the BYPASS/MULTIFUNCTION
(BP/M) pin voltage (28 V+5.85 V), current begins to ow into the
BP/M pin. When this current exceeds 5 mA the internal latching
shutdown circuit in TinySwitch-III is activated. This condition
is reset when the BP/M pin voltage drops below 2.6 V after
removal of the AC input. In the example shown, on opening
the loop, the OVP trips at an output of 17 V.

TNY274-280
For lower no-load input power consumption, the bias winding
may also be used to supply the TinySwitch-III device. Resistor
R8 feeds current into the BP/M pin, inhibiting the internal high
voltage current source that normally maintains the BP/M pin
capacitor voltage (C7) during the internal MOSFET off time.
This reduces the no-load consumption of this design from
140 mW to 40 mW at 265 VAC.
Under-voltage lockout is congured by R5 connected between
the DC bus and EN/UV pin of U1. When present, switching
is inhibited until the current in the EN/UV pin exceeds 25 A.
This allows the startup voltage to be programmed within the
normal operating input voltage range, preventing glitching of
the output under abnormal low voltage conditions and also on
removal of the AC input.
In addition to the simple input pi lter (C1, L1, C2) for
differential mode EMI, this design makes use of E-Shield
shielding techniques in the transformer to reduce common
mode EMI displacement currents, and R2 and C4 as a damping
network to reduce high frequency transformer ringing. These
techniques, combined with the frequency jitter of TNY278,
give excellent conducted and radiated EMI performance with
this design achieving >12 dBV of margin to EN55022 Class
B conducted EMI limits.
For design exibility the value of C7 can be selected to pick one
of the 3 current limits options in U1. This allows the designer
to select the current limit appropriate for the application.

Standard current limit (ILIMIT) is selected with a 0.1 F BP/M


pin capacitor and is the normal choice for typical enclosed
adapter applications.
When a 1 F BP/M pin capacitor is used, the current
limit is reduced (ILIMITred or ILIMIT-1) offering reduced RMS
device currents and therefore improved efciency, but at
the expense of maximum power capability. This is ideal
for thermally challenging designs where dissipation must
be minimized.
When a 10 F BP/M pin capacitor is used, the current
limit is increased (ILIMITinc or ILIMIT+1), extending the power
capability for applications requiring higher peak power or
continuous power where the thermal conditions allow.

Further exibility comes from the current limits between adjacent


TinySwitch-III family members being compatible. The reduced
current limit of a given device is equal to the standard current
limit of the next smaller device and the increased current limit is
equal to the standard current limit of the next larger device.

Key Application Considerations


TinySwitch-lll Design Considerations
Output Power Table
The data sheet output power table (Table 1) represents the
minimum practical continuous output power level that can be
obtained under the following assumed conditions:
1. The minimum DC input voltage is 100 V or higher for
85 VAC input, or 220 V or higher for 230 VAC input or
115 VAC with a voltage doubler. The value of the input
capacitance should be sized to meet these criteria for AC
input designs.
2. Efciency of 75%.
3. Minimum data sheet value of I2f.
4. Transformer primary inductance tolerance of 10%.
5. Reected output voltage (VOR) of 135 V.
6. Voltage only output of 12 V with a fast PN rectier diode.
7. Continuous conduction mode operation with transient KP*
value of 0.25.
8. Increased current limit is selected for peak and open frame
power columns and standard current limit for adapter
columns.
9. The part is board mounted with SOURCE pins soldered to
a sufcient area of copper and/or a heatsink is used to keep
the SOURCE pin temperature at or below 110 C.
10. Ambient temperature of 50 C for open frame designs and
40 C for sealed adapters.
*Below a value of 1, KP is the ratio of ripple to peak primary
current. To prevent reduced power capability due to premature
termination of switching cycles a transient KP limit of 0.25
is recommended. This prevents the initial current limit (IINIT)
from being exceeded at MOSFET turn on.
For reference, Table 2 provides the minimum practical power
delivered from each family member at the three selectable current
limit values. This assumes open frame operation (not thermally
limited) and otherwise the same conditions as listed above.
These numbers are useful to identify the correct current limit
to select for a given device and output power requirement.
Overvoltage Protection
The output overvoltage protection provided by TinySwitch-III
uses an internal latch that is triggered by a threshold current
of approximately 5.5 mA into the BP/M pin. In addition to an
internal lter, the BP/M pin capacitor forms an external lter
providing noise immunity from inadvertent triggering. For the
bypass capacitor to be effective as a high frequency lter, the
capacitor should be located as close as possible to the SOURCE
and BP/M pins of the device.

E
2/06

TNY274-280
OUTPUT POWER TABLE
PRODUCT

85-265 VAC

230 VAC 15%


ILIMIT-1

ILIMIT

ILIMIT+1

ILIMIT-1

ILIMIT

ILIMIT+1

TNY274 P or G

10.9

9.1

7.1

8.5

7.1

TNY275 P or G

10.8

12

15.1

8.4

9.3

11.8

TNY276 P or G

11.8

15.3

19.4

9.2

11.9

15.1

TNY277 P or G

15.1

19.6

23.7

11.8

15.3

18.5

TNY278 P or G

19.4

24

28

15.1

18.6

21.8

TNY279 P or G

23.7

28.4

32.2

18.5

22

25.2

TNY280 P or G

28

32.7

36.6

21.8

25.4

28.5

Table 2. Minimum Practical Power at Three Selectable Current Limit Levels.

For best performance of the OVP function, it is recommended


that a relatively high bias winding voltage is used, in the range of
15 V-30 V. This minimizes the error voltage on the bias winding
due to leakage inductance and also ensures adequate voltage
during no-load operation from which to supply the BP/M pin
for reduced no-load consumption.

practically eliminates audible noise. Vacuum impregnation


of the transformer should not be used due to the high primary
capacitance and increased losses that result. Higher ux densities
are possible, however careful evaluation of the audible noise
performance should be made using production transformer
samples before approving the design.

Selecting the Zener diode voltage to be approximately 6 V


above the bias winding voltage (28 V for 22 V bias winding)
gives good OVP performance for most designs, but can be
adjusted to compensate for variations in leakage inductance.
Adding additional ltering can be achieved by inserting a low
value (10 to 47 ) resistor in series with the bias winding
diode and/or the OVP Zener as shown by R7 and R3 in
Figure 14. The resistor in series with the OVP Zener also limits
the maximum current into the BP/M pin.

Ceramic capacitors that use dielectrics such as Z5U, when used


in clamp circuits, may also generate audio noise. If this is the
case, try replacing them with a capacitor having a different
dielectric or construction, for example a lm type.

Reducing No-load Consumption


As TinySwitch-III is self-powered from the BP/M pin capacitor,
there is no need for an auxillary or bias winding to be provided
on the transformer for this purpose. Typical no-load consumption
when self-powered is <150 mW at 265 VAC input. The addition
of a bias winding can reduce this down to <50 mW by supplying
the TinySwitch-III from the lower bias voltage and inhibiting the
internal high voltage current source. To achieve this, select the
value of the resistor (R8 in Figure 14) to provide the data sheet
DRAIN supply current. In practice, due to the reduction of the
bias voltage at low load, start with a value equal to 40% greater
than the data sheet maximum current, and then increase the value
of the resistor to give the lowest no-load consumption.
Audible Noise
The cycle skipping mode of operation used in TinySwitch-III
can generate audio frequency components in the transformer.
To limit this audible noise generation the transformer should
be designed such that the peak core ux density is below
3000 Gauss (300 mT). Following this guideline and using the
standard transformer production technique of dip varnishing

10

E
2/06

TinySwitch-lll Layout Considerations


Layout
See Figure 15 for a recommended circuit board layout for
TinySwitch-III.
Single Point Grounding
Use a single point ground connection from the input lter capacitor
to the area of copper connected to the SOURCE pins.
Bypass Capacitor (CBP)
The BP/M pin capacitor should be located as near as possible
to the BP/M and SOURCE pins.
Primary Loop Area
The area of the primary loop that connects the input lter
capacitor, transformer primary and TinySwitch-III together
should be kept as small as possible.
Primary Clamp Circuit
A clamp is used to limit peak voltage on the DRAIN pin at turn
off. This can be achieved by using an RCD clamp or a Zener
(~200 V) and diode clamp across the primary winding. In all
cases, to minimize EMI, care should be taken to minimize the
circuit path from the clamp components to the transformer and
TinySwitch-III.

TNY274-280

TOP VIEW

Input Filter
Capacitor
Y1Capacitor

HV DC
INPUT

T
r
a
n
s
f
o
r
m
e
r

S S S S
CBP
TinySwitch-III

EN/UV BP/M D

Output Filter
Capacitor

Optocoupler

Maximize hatched copper


areas (
) for optimum
heatsinking

DC
OUT

PI-4278-013006

Figure 15. Recommended Circuit Board Layout for TinySwitch-III with Under-Voltage Lock Out Resistor.

Thermal Considerations
The four SOURCE pins are internally connected to the IC lead
frame and provide the main path to remove heat from the device.
Therefore all the SOURCE pins should be connected to a copper
area underneath the TinySwitch-III to act not only as a single
point ground, but also as a heatsink. As this area is connected
to the quiet source node, this area should be maximized for
good heatsinking. Similarly for axial output diodes, maximize
the PCB area connected to the cathode.
Y-Capacitor
The placement of the Y-capacitor should be directly from the
primary input lter capacitor positive terminal to the common/
return terminal of the transformer secondary. Such a placement
will route high magnitude common mode surge currents away
from the TinySwitch-III device. Note if an input (C, L, C)
EMI lter is used then the inductor in the lter should be placed
between the negative terminals of the input lter capacitors.

Optocoupler
Place the optocoupler physically close to the TinySwitch-III
to minimizing the primary-side trace lengths. Keep the high
current, high voltage drain and clamp traces away from the
optocoupler to prevent noise pick up.
Output Diode
For best performance, the area of the loop connecting the
secondary winding, the output diode and the output lter
capacitor, should be minimized. In addition, sufcient copper
area should be provided at the anode and cathode terminals
of the diode for heatsinking. A larger area is preferred at the
quiet cathode terminal. A large anode area can increase high
frequency radiated EMI.

E
2/06

11

TNY274-280
Quick Design Checklist
As with any power supply design, all TinySwitch-III designs
should be veried on the bench to make sure that component
specications are not exceeded under worst case conditions. The
following minimum set of tests is strongly recommended:
1. Maximum drain voltage Verify that VDS does not exceed
650 V at highest input voltage and peak (overload) output
power. The 50 V margin to the 700 V BVDSS specication
gives margin for design variation.
2. Maximum drain current At maximum ambient temperature,
maximum input voltage and peak output (overload) power,
verify drain current waveforms for any signs of transformer
saturation and excessive leading edge current spikes at

12

E
2/06

startup. Repeat under steady state conditions and verify that


the leading edge current spike event is below ILIMIT(Min) at the
end of the tLEB(Min). Under all conditions, the maximum drain
current should be below the specied absolute maximum
ratings.
3. Thermal Check At specied maximum output power,
minimum input voltage and maximum ambient temperature,
verify that the temperature specications are not exceeded
for TinySwitch-III, transformer, output diode, and output
capacitors. Enough thermal margin should be allowed for
part-to-part variation of the RDS(ON) of TinySwitch-III as
specied in the data sheet. Under low line, maximum power,
a maximum TinySwitch-III SOURCE pin temperature of
110 C is recommended to allow for these variations.

TNY274-280
ABSOLUTE MAXIMUM RATINGS(1,5)
DRAIN Voltage ................................................-0.3 V to 700 V
DRAIN Peak Current: TNY274.......................400 (750) mA(2)
TNY275.....................560 (1050) mA(2)
TNY276.....................720 (1350) mA(2)
TNY277.....................880 (1650) mA(2)
TNY278...................1040 (1950) mA(2)
TNY279 ................. 1200 (2250) mA(2)
TNY280 ................. 1360 (2550) mA(2)
EN/UV Voltage ................................................... -0.3 V to 9 V
EN/UV Current ........................................................... 100 mA
BP/M Voltage .................................................. ....-0.3 V to 9 V
Storage Temperature ......................................-65 C to 150 C
Operating Junction Temperature(3) .................-40 C to 150 C

Lead Temperature(4) ....................................................... 260 C


Notes:
1. All voltages referenced to SOURCE, TA = 25 C.
2. The higher peak DRAIN current is allowed while the
DRAIN voltage is simultaneously less than 400 V.
3. Normally limited by internal circuitry.
4. 1/16 in. from case for 5 seconds.
5. Maximum ratings specied may be applied one at a time,
without causing permanent damage to the product.
Exposure to Absolute Maximum Rating conditions for
extended periods of time may affect product reliability.

THERMAL IMPEDANCE
Notes:
Thermal Impedance: P or G Package:
1. Measured on the SOURCE pin close to plastic interface.
(JA) ........................... 70 C/W(2); 60 C/W(3)
2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.
(JC)(1) ............................................... 11 C/W
3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.

Conditions

Parameter

Symbol

SOURCE = 0 V; TJ = -40 to 125 C


See Figure 16
(Unless Otherwise Specied)

Min

Typ

Max

124

132

140

Units

CONTROL FUNCTIONS
Output Frequency
in Standard Mode
Maximum Duty
Cycle

fOSC
DCMAX

EN/UV Pin Upper


Turnoff Threshold
Current

IDIS

EN/UV Pin
Voltage

VEN
IS1

DRAIN Supply
Current

IS2

Average

TJ = 25 C
See Figure 4

Peak-Peak Jitter
S1 Open

8
62

65

-150

-115

-90

IEN/UV = 25 A

1.8

2.2

2.6

IEN/UV = -25 A

0.8

1.2

1.6

EN/UV Current > IDIS (MOSFET Not


Switching) See Note A

EN/UV Open
(MOSFET
Switching at fOSC)
See Note B

kHz
%

290

TNY274

275

360

TNY275

295

400

TNY276

310

430

TNY277

365

460

TNY278

445

540

TNY279

510

640

TNY280

630

760

E
2/06

13

TNY274-280
Conditions

Parameter

Symbol

SOURCE = 0 V; TJ = -40 to 125 C


See Figure 16
(Unless Otherwise Specied)

Min

Typ

Max

Units

TNY274

-6

-3.8

-1.8

TNY275-279

-8.3

-5.4

-2.5

TNY280

-9.7

-6.8

-3.9

TNY274

-4.1

-2.3

-1

TNY275-279

-5

-3.5

-1.5

TNY280

-6.6

-4.6

-2.1

5.6

5.85

6.15

0.80

0.95

1.20

IBP = 2 mA

6.0

6.4

6.7

TJ = 25 C

22.5

25

27.5

CONTROL FUNCTIONS (cont.)


ICH1

BP/M Pin Charge


Current
ICH2

BP/M Pin Voltage

VBP/M

BP/M Pin Voltage


VBP/MH
Hysteresis
BP/M Pin Shunt
VSHUNT
Voltage
EN/UV Pin Line
ILUV
Under-Voltage
Threshold
CIRCUIT PROTECTION

Standard Current
Limit (BP/M
Capacitor =
0.1 F)
See Note D

Reduced Current
Limit (BP/M
Capacitor = 1 F)

14

E
2/06

ILIMIT

ILIMITred

VBP/M = 0 V,
TJ = 25 C
See Note C, D
VBP/M = 4 V,
TJ = 25 C
See Note C, D

See Note C

TNY274
TJ = 25 C

di/dt = 50 mA/s
See Note E

233

250

267

TNY275
TJ = 25 C

di/dt = 55 mA/s
See Note E

256

275

294

TNY276
TJ = 25 C

di/dt = 70 mA/s
See Note E

326

350

374

TNY277
TJ = 25 C

di/dt = 90 mA/s
See Note E

419

450

481

TNY278
TJ = 25 C

di/dt = 110 mA/s


See Note E

512

550

588

TNY279
TJ = 25 C

di/dt = 130 mA/s


See Note E

605

650

695

TNY280
TJ = 25 C

di/dt = 150 mA/s


See Note E

698

750

802

TNY274
TJ = 25 C

di/dt = 50 mA/s
See Note E

196

210

233

TNY275
TJ = 25 C

di/dt = 55 mA/s
See Note E

233

mA

mA

mA
250

277

TNY274-280
Conditions

Parameter

Symbol

SOURCE = 0 V; TJ = -40 to 125 C


See Figure 16
(Unless Otherwise Specied)

Min

Typ

Max

Units

CIRCUIT PROTECTION (cont.)

Reduced Current
Limit (BP/M
Capacitor = 1 F)
See Note D

Increased Current
Limit (BP/M
Capacitor = 10 F)
See Note D

ILIMITred

ILIMITinc

TNY276
TJ = 25 C

di/dt = 70 mA/s
See Note E

256

275

305

TNY277
TJ = 25 C

di/dt = 90 mA/s
See Note E

326

350

388

TNY278
TJ = 25 C

di/dt = 110 mA/s


See Note E

419

450

499

TNY279
TJ = 25 C

di/dt = 130 mA/s


See Note E

512

550

610

TNY280
TJ = 25 C

di/dt = 150 mA/s


See Note E

605

650

721

TNY274
TJ = 25 C

di/dt = 50 mA/s
See Note E, F

196

210

233

TNY275
TJ = 25 C

di/dt = 55 mA/s
See Note E

326

350

388

TNY276
TJ = 25 C

di/dt = 70 mA/s
See Note E

419

450

499

TNY277
TJ = 25 C

di/dt = 90 mA/s
See Note E

512

550

610

TNY278
TJ = 25 C

di/dt = 110 mA/s


See Note E

605

650

721

TNY279
TJ = 25 C

di/dt = 130 mA/s


See Note E

698

750

833

TNY280
TJ = 25 C

di/dt = 150 mA/s


See Note E

791

850

943

Standard
Current Limit

0.9
I2f

I2f

1.12
I2f

Reduced or
Increased
Current Limit

0.9
I2f

I2f

1.16
I2f

I2f = ILIMIT(TYP)2
fOSC(TYP)

Power Coefcient

I2f

Initial Current Limit

IINIT

See Figure 19
TJ = 25 C, See Note G

0.75
ILIMIT(MIN)

Leading Edge
Blanking Time

tLEB

TJ = 25 C
See Note G

170

Current Limit
Delay

tILD

TJ = 25 C
See Note G, H

Thermal Shutdown
Temperature

TSD

135

mA

mA

A2Hz

mA
215

ns

150

ns

142

150

E
2/06

15

TNY274-280
Conditions

Parameter

Symbol

SOURCE = 0 V; TJ = -40 to 125 C


See Figure 16
(Unless Otherwise Specied)

Min

Typ

Max

Units

CIRCUIT PROTECTION (cont.)


Thermal Shutdown Hysteresis

TSDH

BP/M Pin Shutdown Threshold


Current

ISD

75

5.5

7.5

mA

1.6

2.6

3.6

TJ = 25 C

28

32

TJ = 100 C

42

48

TJ = 25 C

19

22

TJ = 100 C

29

33

TJ = 25 C

14

16

TJ = 100 C

21

24

TJ = 25 C

7.8

9.0

TJ = 100 C

11.7

13.5

TJ = 25 C

5.2

6.0

TJ = 100 C

7.8

9.0

TJ = 25 C

3.9

4.5

TJ = 100 C

5.8

6.7

TJ = 25 C

2.6

3.0

TJ = 100 C

3.9

4.5

BP/M Pin PowerUp Reset Thresh- VBP/M(RESET)


old Voltage
OUTPUT
TNY274
ID = 25 mA
TNY275
ID = 28 mA
TNY276
ID = 35 mA

ON-State
Resistance

RDS(ON)

TNY277
ID = 45 mA
TNY278
ID = 55 mA
TNY279
ID = 65 mA
TNY280
ID = 75 mA

OFF-State Drain
Leakage Current

IDSS1

IDSS2

Breakdown
Voltage
DRAIN Supply
Voltage

16

E
2/06

BVDSS

VBP/M = 6.2 V
VEN/UV = 0 V
VDS = 560 V
TJ = 125 C
See Note I

TNY274-276

50

TNY277-278

100

TNY279-280

200

VBP/M = 6.2 V
VEN/UV = 0 V

VDS = 375 V,
TJ = 50 C
See Note G, I

VBP = 6.2 V, VEN/UV = 0 V,


See Note J, TJ = 25 C

15
700

50

TNY274-280
Conditions

Parameter

Symbol

SOURCE = 0 V; TJ = -40 to 125 C


See Figure 16
(Unless Otherwise Specied)

Min

Typ

Max

Units

OUTPUT (cont.)
Auto-Restart
ON-Time at fOSC
Auto-Restart
Duty Cycle

tAR

TJ = 25 C
See Note K

64

ms

DCAR

TJ = 25 C

NOTES:
A. IS1 is an accurate estimate of device controller current consumption at no-load, since operating frequency is so
low under these conditions. Total device consumption at no-load is the sum of IS1 and IDSS2.
B Since the output MOSFET is switching, it is difcult to isolate the switching current from the supply current at the
DRAIN. An alternative is to measure the BP/M pin current at 6.1 V.
C. BP/M pin is not intended for sourcing supply current to external circuitry.
D. To ensure correct current limit it is recommended that nominal 0.1 F / 1 F / 10 F capacitors are used. In
addition, the BP/M capacitor value tolerance should be equal or better than indicated below across the ambient
temperature range of the target application. The minimum and maximum capacitor values are guaranteed by
characterization.
Nominal BP/M
Pin Cap Value

Tolerance Relative to Nominal


Capacitor Value
Min

MAX

0.1 F

-60%

+100%

1 F

-50%

+100%

10 F

-50%

NA

E. For current limit at other di/dt values, refer to Figure 23.


F. TNY274 does not set an increased current limit value, but with a 10 F BP/M pin capacitor the current limit is the
same as with a 1 F BP/M pin capacitor (reduced current limit value).
G. This parameter is derived from characterization.
H. This parameter is derived from the change in current limit measured at 1X and 4X of the di/dt shown in the ILIMIT
specication.
I. IDSS1 is the worst case OFF state leakage specication at 80% of BVDSS and maximum operating junction
temperature. IDSS2 is a typical specication under worst case application conditions (rectied 265 VAC) for no-load
consumption calculations.
J. Breakdown voltage may be checked against minimum BVDSS specication by ramping the DRAIN pin voltage up
to but not exceeding minimum BVDSS.
K. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to
frequency).
E
2/06

17

TNY274-280
470
5W

S2
470

S1

S
S
S

2 M
50 V

BP/M
EN/UV

10 V
0.1 F

150 V

NOTE: This test circuit is not applicable for current limit or output characteristic measurements.
PI-4079-080905

Figure 16. General Test Circuit.

DCMAX

(internal signal)
tP

EN/UV
tEN/UV

VDRAIN
tP =

1
fOSC
PI-2364-012699

Figure 18. Output Enable Timing.

PI-4279-013006

Figure 17. Duty Cycle Measurement.

0.8

Figure 19. Current Limit Envelope.

18

E
2/06

TNY274-280

Typical Performance Characteristics

1.0

PI-4280-012306

1.2

Output Frequency
(Normalized to 25 C)

PI-2213-012301

Breakdown Voltage
(Normalized to 25 C)

1.1

1.0
0.8
0.6
0.4
0.2
0

0.9
-50 -25

25

50

-50

75 100 125 150

0.8
0.6
0.4
0.2
0
100

1.0
0.8
TNY274
TNY275
TNY276
TNY277
TNY278
TNY279
TNY280

0.6
0.4
0.2

100
TCASE=25 C
TCASE=100 C

1000

PI-4083-082305

Scaling Factors:
TNY274 1.0
TNY275 1.5
TNY276 2.0
TNY277 3.5
TNY278 5.5
TNY279 7.3
TNY280 11

Figure 23. Current Limit vs. di/dt.

Drain Capacitance (pF)

PI-4082-082305

Drain Current (mA)

Note: For the


normalized current
limit value, use the
typical current limit
specified for the
appropriate BP/M
capacitor.

Normalized di/dt

300

50

Normalized
di/dt = 1
50 mA/s
55 mA/s
70 mA/s
90 mA/s
110 mA/s
130 mA/s
150 mA/s

150

Figure 22. Standard Current Limit vs. Temperature.

150

100 125

1.2

Temperature (C)

200

75

PI-4081-082305

250

50

1.4

Normalized Current Limit

PI-4102-010906

Standard Current Limit


(Normalized to 25 C)

1.2

50

25

Figure 21. Frequency vs. Temperature.

Figure 20. Breakdown vs. Temperature.

Junction Temperature (C)

Junction Temperature (C)

-50

-25

100

Scaling Factors:
TNY274 1.0
TNY275 1.5
TNY276 2.0
TNY277 3.5
TNY278 5.5
TNY279 7.3
TNY280 11

10

0
0

DRAIN Voltage (V)


Figure 24. Output Characteristic.

10

100

200

300

400

500

600

Drain Voltage (V)


Figure 25. COSS vs. Drain Voltage.
E
2/06

19

TNY274-280

Typical Performance Characteristics (cont.)

30
20
10

200

400

DRAIN Voltage (V)


Figure 26. Drain Capacitance Power.

E
2/06

PI-4281-012306

1.0
0.8
0.6
0.4
0.2

20

1.2

Under-Voltage Threshold
(Normalized to 25 C)

Scaling Factors:
TNY274 1.0
TNY275 1.5
TNY276 2.0
TNY277 3.5
TNY278 5.5
TNY279 7.3
TNY280 11

40

Power (mW)

PI-4084-082305

50

600

-50

-25

25

50

75

100 125

Junction Temperature (C)


Figure 27. Under-Voltage Threshold vs. Temperature.

TNY274-280
PART ORDERING INFORMATION
TinySwitch Product Family
Series Number
Package Identier
G

Plastic Surface Mount SMD-8C

Plastic DIP-8C

Lead Finish
N

Pure Matte Tin (Pb-Free)

Tape & Reel and Other Options


Blank Standard Congurations

TNY 278 G N - TL

TL

Tape & Reel, 1000 pcs min./mult., G Package only

DIP-8C
-E-

D S

.004 (.10)

.240 (6.10)
.260 (6.60)

Pin 1
-D-

.367 (9.32)
.387 (9.83)
.057 (1.45)
.068 (1.73)
(NOTE 6)

.125 (3.18)
.145 (3.68)

-T-

Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clockwise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.

.015 (.38)
MINIMUM

SEATING
PLANE

.120 (3.05)
.140 (3.56)

.100 (2.54) BSC


.014 (.36)
.022 (.56)

.048 (1.22)
.053 (1.35)

T E D

.137 (3.48)
MINIMUM

S .010 (.25) M

.008 (.20)
.015 (.38)
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)

P08C
PI-3933-100504

E
2/06

21

TNY274-280

SMD-8C
D S .004 (.10)

.046 .060

.060 .046

-E-

.080
.086
.186

.372 (9.45)
.388 (9.86)
E S .010 (.25)

.240 (6.10)
.260 (6.60)

Pin 1

.286

Pin 1
.100 (2.54) (BSC)

.137 (3.48)
MINIMUM

Solder Pad Dimensions

.367 (9.32)
.387 (9.83)

-D-

.057 (1.45)
.068 (1.73)
(NOTE 5)

.125 (3.18)
.145 (3.68)

.032 (.81)
.037 (.94)

.420

Notes:
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
3. Pin locations start with Pin 1,
and continue counter-clockwise to Pin 8 when viewed
from the top. Pin 3 is omitted.
4. Minimum metal to metal
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
5. Lead width measured at
package body.
6. D and E are referenced
datums on the package
body.

.048 (1.22)
.053 (1.35)

.004 (.10)
.009 (.23)

.004 (.10)
.012 (.30)

.036 (0.91)
.044 (1.12)

0- 8

G08C
PI-4015-013106

22

E
2/06

TNY274-280

E
2/06

23

TNY274-280
Revision Notes

Date

Release nal data sheet.

1/06

Corrected gure numbers and references.

2/06

For the latest updates, visit our website: www.powerint.com


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any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY
DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.
PATENT INFORMATION
The products and applications
and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents
may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm.
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POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:
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when properly used in accordance with instructions for use, can be reasonably expected to result in signicant injury or death to the user.
2. A critical component is any c
support device or system, or to affect its safety or effectiveness.

The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, EcoSmart, Clampless, E-Shield, Filterfuse,
PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies.
Copyright 2006, Power Integrations, Inc.

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24

E
2/06

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World Wide +1-408-414-9760


Specifications number

DSF-P0027 Ver. 0.1

Creation day

'07.02.14

CHKD. APPD.
Kachi Terajima

'07.02.14 '07.02.14 '07.02.14

Ver.

RoHS

DWN.
Haneda

Specifications

1.0

Record of Revision

Description of Revision

Date

REVD

CHKD

APPD

Haneda

Kachi

Terajima

Gold-plated connector is used.

Specifications

Product name

OPA-681PH-NH

Parts name

OPA-681PH-NH-2

Parts number

APPROVED BY (CHOP MARK AND SIGNATURE)

Please approve after understanding clause 4.-(11) on sheet 14.


It is considered that it was approved when there is an order before returning this specifications.

Contents explanation

CONTENTS

Scope and field of Application

Test Conditions

Characteristics

Reliability

Reliability test conditions

Mechanical specifications

There is a possibility for change of specification for the improvement.


There is a possibility for change of parts within a range of specification for the improvement.

SUPPLIER
R&D

QA

General
Manager

Arima Devices Japan Inc.


Design & Development Division
Haneda

Kachi

Terajima

Yasuda Bldg.No.4, 2-26-2, Tsuruyacho,


Kanagawa-ku, Yokohama 221-0835, JAPAN

Arima Devices Japan Inc.

Safety Standerd of Main Parts

Dimensions

Schematic diagram

APC circuit diagram

Optical path diagram

Precautions for handling

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

1-1. Scope and field of Application


DVD
This specification apply to the optical pickup for DVD.

2-1. Characteristics
2-1-(1) Basic specifications
Type
Optical pickup

1-2. Test Conditions


(1) Standard test environment
Temperature 233
Humidity 605%RH

In case that doubt does not happen to determination measurement does not matter even
the following condition.
Temperature 2510
Humidity 6525%RH

Application

DVD , CD-DA(Compact Disc Digital Audio) , VCD(Video CD)

Method

DVD
DVD Light source

Laser diode
Wavelength650Min.655Typ.660Max. nm
TypeADL-65075GR

ManufacturerArima Optoelectronics Corporation

CD
CD Light source

Laser diode
Wavelength770Min.790Typ.805Max. nm
TypeADL-78031FR

ManufacturerArima Optoelectronics Corporation

Photo detector

PDIC 6 Divided PDIC


TypePH9119A4NF1
NEC
ManufacturerNEC corporation

Actuator

44-wire type

Focus error

Astigmatic method

Tracking error

DVDDPD method

Objective lens

DVDf=3.05mm NA=0.60 WD=1.67mm

(2) Test posture

The object lens axis makes gravity direction.


(3) Mechanical installation, circuit

It shall not ensure suspicion from the evaluation of the test results.
(4) Test disc
CD:
A-BEX TCD-782For test, use A-BEX TCD-782.
DVD:
A-BEX TDV-520CFor test, use A-BEX TDV-520C
(5) Standard test conditions

Except specified, test under the following conditions.


[a] Mechanical condition
Skew

Radial skew 0 deg, Tangential skew 0 deg.


Height
9.5mm
The distance to a guide shaft center and the undersurface of a disc is 9.5mm.
[b] Electric offset
VccVcc Voltage
5.0V
VcVc Voltage
2.5V
Focusing offset

Adjusted to the best focusing point.


Radial offset
D.C. 0V
APCAPC circuit
3-3 APC
See section 3-3. Fig..3 APC circuit diagram
(6) Evaluation Disc speed
Nomal speed

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

CD33-beam method
Optical

CDf=3.07mm NA=0.47 WD=1.30mm

Emitting light output at objective lens

Operating environment

Non-operating
environment

Sheet

1080 %RH

DVD 0.6 mW max


CD 0.5 mW max

Continuous
Continuous

-1060
-3070

Avoid dew caused by rapid thermal change.

Dimensions
Appearance
Weight

3-1
See section 3-1 Fig.1
15g(Nom.)

Use attitude

45
The angle that tracking direction does with gravity direction
recommends 45 or more degree.

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

Items
2-1-(2) Electrical performance

Items
(DVD)
Laser diode

Maximum ratings

Po
Light output power

Vrl,Vrd
Reverse voltage

Electrical characteristics

Iop
Operating current

Vop
Operating voltage
(CD)
Laser diode

Maximum ratings

Po
Light output power

Vrl,Vrd
Reverse voltage

Electrical characteristics

Iop
Operating current

Vop
Operating voltage

Condition

(PDIC)
Photo detector

Maximum ratings

Vcc
Power supply voltage

Specifications

Tc=25
10 mW

CW

Condition
Tc=25
6 V

ADL-65075GR

PD
Allowable dissipation

2 V
30 V

Laser diode
Monitor pin photo diode

Po=7mW

35 mA max

25 mA typ

ADL-65075GR

Po=7mW

2.5 V max

2.2 V typ

ADL-65075GR

Electrical characteristics
VoM
Maximum output voltage

Tc=25
5 mW

2 V
30 V

240 mW
Vcc
Vc

Recommended power
supply voltage range

Tc=25

CW

Specifications

fc
Cut off frequency

Laser diode
Monitor pin photo diode

+4.5 +5.5 V
+1.5 Vcc-2.0 V

Tc=25
Vcc=5.0V, Vc=2.5V
RL=3k, CL=10pF(NEC)
Pi=10W
=780nm

AD 195 mV min
EF 350 mV min
RF
330 mV min

260 mV typ
470 mV typ
440 mV typ

325 mV max
590 mV max
550 mV max

Pi=10W
=650nm

AD 205 mV min
EF 370 mV min
RF
345 mV min

275 mV typ
495 mV typ
460 mV typ

345 mV max
620 mV max
575 mV max

from 100kHz, -3dB


=650nm, 780nm

AD 65 MHz min
EF 0.5 MHz min
RF
60 MHz min

100 MHz typ


2 MHz typ
90 MHz typ

max
max
max

Tc=25
Po=3mW

55 mA max

45 mA typ

ADL-78031FR

Po=3mW

2.3 V max

1.8 V typ

ADL-78031FR

Actuator

Focusing coil current

Continuous

150 mA rms max

0mA
0mA for tracking

Tracking coil current

Continuous

150 mA rms max

0mA
0mA for focusing

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

2-1-(3)
Actuator characteristics

Items

Condition

Focusing

Movable distance

Coil resistance

Phase delay

Resonance freq. (fo)

Resonance peak value (Q)

Higher-order
resonance frequency

Peak intersection
frequency

Specifications

From focus center position

0.7 mm

D.C.
at 25

5.57.5 ohm

Reliability
spec.

or more
B30%

at 15 KHz

max 25 deg

C10deg

Frequency of amplitude peak

Amplitude value in
resonance frequency
Q = Gain(fo) - Gain(5Hz)

5060 Hz

+5Hz
C -8Hz
C5dB

Frequency of amplitude peak

18 KHz

or more

A 18 KHz
or more

The intersection of a higher-order


resonance peak and a middle range
gain

10 KHz

or more

A 10 KHz
or more

5Hz
Sensitivity(5Hz)
200Hz
Sensitivity(200Hz)

max 14 dB

0.811.09 mm/V

B30%

4460 m/V

B30%

Items

Condition

Tracking

Movable distance

Reliability
spec.

From free position

0.4 mm

Coil resistance

D.C.
at 25

4.05.4 ohm

B30%

Phase delay

Resonance freq. (fo)

Resonance peak value (Q)

at 15 KHz

max 15 deg

C10deg

Frequency of amplitude peak

Amplitude value in
resonance frequency
Q = Gain(fo) - Gain(5Hz)

5060 Hz

Frequency of amplitude peak

18 KHz

or more

A 18 KHz
or more

The intersection of a higher-order


resonance peak and a middle range
gain

10 KHz

or more

A 10 KHz
or more

Higher-order
resonance frequency

Peak intersection
frequency
5Hz
Sensitivity(5Hz)
200Hz
Sensitivity(200Hz)
Tilt accuracy

Tangential direction

*Measurements in terminal of ACT PCB


*The above-mentioned data is without FPC and FFC

Specifications

Radial direction

or more

+5Hz

C -8Hz

max 14 dB

C5dB

0.570.93 mm/V

B30%

3446 m/V

B30%

Focus 0.5
0.3 deg
DVD
From focus center position for DVD
0.3 deg
Tracking 0.3

From free position

A0.3deg
A0.3deg

*Measurements in terminal of ACT PCB


*The above-mentioned data is without FPC and FFC

Direction of objective lens movement


Focusing direction
Fo+
When positive voltage applied to Fo+ pin, the objective lens moves toward the disc.
Tracking direction
TR+
When positive voltage applied toTR+ pin, the objective lens moves toward the inner of disc.

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

2-1-(4)
Electrical characteristics

2-2. Reliability

Items

Condition

RFRF signal

Signal level

Jitter

DVD14T(p-p)
DVDp-p level of 14T signal.
CD11T(p-p)
CDp-p level of 11T signal.
Gain 1X(A+B+C+D) output

Reliability spec.
Non-operating
Operating

Specifications

DVD 1.080.22 Vp-p B40%

B25%

CD 0.650.15 Vp-p B25%

B25%

DVD
DVD 10.5 % max.
DVDData to the standard clock
CD 26 nsec max.
CD3T
CDStandard deviation of 3T jitter

Items

Condition

Focusing error signal FE=(A+C)-(B+D)

S(p-p)
Signal level
p-p level of S-curve

A 32nsec max.

A 32nsec max.

DVD 1.250.35 Vp-p


CD 0.790.26 Vp-p

Signal balance

Deviation of signal

Detecting range

S(p-p)
S-curve p-p range

Defocus

DVD 20 %

CD 17 %
Distance of best jitter position and
standard position

Polarity

(A+C)-(B+D)<0
If (A+C)-(B+D)<0,disc closer than focalpoint.

CD Tracking error signal TE=E-F

(p-p)
Signal level
Signal p-p level

A 14% max.

Specifications

17 %
Less than

Reliability
spec.

C20%

Test method

Low temperature

Temperature: -30
Time: 24H

High humidity

Temperature: 40
Humidity: 90%
Time: 48H

Temperature cycle

Temperature: -20,60
Cycle: 5 cycles

Operating test

Temperature: 60
High temperature

Low temperature

Temperature: -10

C20%
C17%

72
16

Leave the non-operating pickup under each condition


and leave under standard environment for 72 hours
and measure.
If there are no suspicion, it may be measured after
16 hours regarding to the temperature test.
.4h

1h

1h

1h

.6h
+60
+25
-20

4
10
RF
Before applying the following test, leave the pickup
under the condition mentioned in the left for more
than 4 hours and operate the unit for 10 minutes
under the same condition.
Test items: jitter, RF signal level

2-2-(2) Transit test

0.120.06 Vp-p

B30%

Deviation of signal

30 %

C20%

Grating adjustment

Subtract 180 from phase


shift between E and F signal
Position: approx. 37.5mm from
center of disc

45 deg

C15deg

Polarity

E-F>0
If E-F>0,the spots are slipped off the track to the inside.

Specifications number:

Arima Devices Japan Inc.

Condition

4 hours

DVD 6.0 m Design value


CD 6.0 m Design value

OPA-681PH-NH

Items

B30%
B30%

Signal balance

Product name:

Non-operating test

Temperature: 70
High temperature
Time: 24H

A 14% max.

2-2-(1) Environment test

DSF-P0027

Sheet

Items

Condition

Test method

Vibration test

Acceleration: 2.4G constant


Frequency: 1050Hz
Sweep time: 5 minutes( up & down)
direction: 3 directions(X, Y, Z)
Time: 0.5 hour X 3 directions, total 1.5 hours
Use vibration test machine.

Shock test

Acceleration: 80G, 6 msecond


Direction: 3 directions 6 faces(X, Y, Z)
3 times X 6 faces, total 18 times.
Use shock test machine.

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

2-3. Reliability test conditions

2-5. Safety Standerd of Main Parts

(1)Test condition, posture

2-5-1. Connector

The reliability test shall be conducted at the same conditions as the standard test.

LD03T2-24ND-01 : Manufactured by SUMIKO TEC CO LTD


Parts
Material Manufacture
Material Generic Material
Name
Type
DSM JAPAN ENGINEERING
Socket Housing
PA4/6
TS250F6D
PLASTIC K.K

(2)Measuring instrument, disc

The same measuring instrument and disc of equvalent as used in the standard test shall be used.
But the instrument and disc shall not be entered into a specific environment exept in case of inevitable.

Slider Housing

POLYPLASTICS CO., LTD.

PPS

UL Flame
Class

1140-A1

94V-0

E172082

94V-0

E109088

FPC0.5H-SMT-24P G : Manufactured by SHANGHAI YUESHEN ELECTRONIC CO LTD


Parts
Material Generic Material
Material Manufacture
UL Flame
Name
Class
Type
DSM JAPAN ENGINEERING
TS250F4D
94V-0
PA4/6
Socket Housing
PLASTIC K.K
1140-A6
Slider Housing POLYPLASTICS CO., LTD.
PPS
94V-0
HF2000

(3)Measurements

The electric and mechanical measurements of this test shall take place as they were initially measured at the
standard test conditions.
(4)Specifications

See the column of reliability specifications and classification (A, B, C).


A: Absolute value
B: Ratio to initial value
C: Difference from initial value

UL File
No

UL File
No
E172082
E109088

2-5-2. Printed circuit boards


Parts

(5)Dew condensation

The dew condensation under test implementation is strict prohibition.

Material Manufacture

Type

UL Flame Class

UL File No.

ELEMENT DENSHI CO LTD

E36

94V-0

E69115

Towa Devices Corp.

1, CM

94V-0

E220250

Ya Hsin Industrial Co., Ltd.

GT10T

94V-0

E226898

Shenzhen Flexcircuits Co., Ltd.

FPC1020

94V-0

E160353

PCB-ACT

(6)Objective lens

Clean and measure it when object lens is dirty.

FPC-OPT

2-4. Mechanical specifications


(1)3-1
Dimension, feed parts attachment part: 3-1 Fig.1 Dimensions
(2)3-2
Connector wiring: 3-2 Fig.2 Schematic diagram
(3)Feed guide bearing.
Master bearing: 2-3(+0.015, -0.000) mm
Sub bearing: 3(+0.020, +0.005) mm
2.998 X 2
Set the pickup to jig and the pickup shall fall free.

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

10

3-1. Fig.1

Dimensions

3-2. Fig..2 Schematic diagram

Connector pin layout

View from the objective lens side

*(Lead spot): F
*FPC Connection: pitch=0.5mm
*Vcc=5V , Vc=2.5V
*FPC/FFC Connection: pitch=0.5mm

contact side

connector

Connector Spec.


Plating
Manufacturer Type

Plating thickness [m]

priming Ni
Au
Min
Typ
Max
Min
Typ
Max
SUMIKO TEC
Au
0.056 0.0864 0.105
1.795
2.0764 2.320
LD03T2-24ND-01
YUESHEN
FPC0.5H-SMT-24P G
Au
0.076 0.1016 0.127
1.270
2.1590 3.048
*1 The plating thickness is a measurement value by the connector manufacturer. (n=100)

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

11

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

*1

Sheet

12

3-3. Fig..3 APC

APC circuit diagram

4. Precautions for handling



LD
ITV
Laser light is emitted from an object lens. Never look directly into the LD or observe the laser beam through another
lens or mirror. If you need to view the beam, use an infrared viewer or an ITV camera.

Take precaution against static electricity for handling the pickup, because laser diode may be destroyed by static
electricity. Spread conductive rubber sheet to floor and desk and connect to ground through high impedance
resistor (about 1M). Use wrist band and connect to ground through high impedance resistor (about 1M).


The terminal of laser diode is shorted with solder for protecting laser diode. Open the terminal by solder iron quickly
after connecting circuit. Use solder iron that metal part of iron is earth connected or insulations resistance is over
10M(500V D.C.) at working and temperature of heater chip is less than 320 degree(30W).
on-off

When tuning on or off the APC circuit, use power source which generate no spike current, because laser diode may be
broken by over current. Take precautions not to operate laser diode over rated output level by over current.

Tel03-3573-1884 CDB4
Use lens-blower carefully to blow dust on the objective lens. Please pay attention so as not to attach the dirt of
fingerprint etc. to the object lens, especially to the handling. If the objective lens got dirty, wipe slightly with lens
cleaning paper moistened with cleaning liquid (B4) made by JCB INDUSTRY Ltd.

The storage and transport of the pickup about, the object lens please do as downward, or master bearing becomes
downward. Do not store under high temperature and high humidity, low temperature and dusty environment.
LDGaAs+GaAlAsAsAs2O3
AsCl31200C

The LD chip is manufactured from GaAs and GaAlAs, which contains toxic As(Arsenic). The toxicity of As in this form
is far lower than other As compounds such as As2O3 and AsCl3,and the As content of one chip is very small.
However, avoid putting the chip in an acid or alkali solution, heating it over 200C, or putting it your mouth. Defective
LDs from the production line and parts removed in servicing should be disposed of with due care.

VR
This pickup is already adjusted precisely. Do not decompose or readjust. Pay attention not to drop or not to shock due
to rough handling. Do not touch and do not give force to following parts of the unit:
a. The objective lens b. The actuator c. The variable resistor d.The laser module

Due to strong magnetic circuit, pay attention not to close magnetic materials like iron. Take care of not entering small
pieces of substance into the opening of the cover.
DVD-LD

The high frequency is superimposed to DVD-LD for the noise decrease to the laser by the return light.
It is not the one to guarantee to suppress the radiation noise from customer's product in regulations though measures
for the radiation level decrease are done. Do the evaluation and the examination needed in customer's product
to check the symptom and the situation not predictable.
FPCFFCFPCFFC

Make the surface treatment in the FPCFFC contact part a gold plating when the connector for FPCFFC is a
gold-plated specification.
Avoid the combination of dissimilar. Otherwise, the point of contact corrodes and it causes the loose connection.

DVD Vref=0.18V

CD Vref=0.18V

DVD-LD power supply ON procedure


SW2 OFF SW1 DVD ON SW2 DVD-LD ON
DVD-LD power supply OFF procedure
SW2 OFF SW1 OFF
3-4. Fig..4

Optical path diagram

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

13

Product name:

Specifications number:

OPA-681PH-NH
Arima Devices Japan Inc.

DSF-P0027

Sheet

14

5
4

02

03

04

05

06

07

08

09

10

11

12

13

14

15

16

17

front panel mirror

front panel

open button

spring

lightening ring

control button

control board

power button

cd door mirror

cd door

loader

bottom

SCART board

decoding board

back panel

top cover

Part Numer

Date

USB cover

Item

Prepare

Date

01

Scale

Authorize

Date

Qty
Version

Sheet

Approval

Description
DV3101

Material

Unit

B
Exploded View

Qty

Model
Name

DV3101-JG01-01

Shenzhen MTC Co., Ltd

Number

View

QR-RD-014B

PDF "pdfFactory Pro" www.fineprint.com.cn

Procedimiento para cambiar la Zona


All of the DVDs we default all region in firmware ,If need change pls following below way
1, Current region display:
Open the loader , press 9735 on remote and press 9

2, Change region
Open the loader, press 9735 and" Region code " Such as 1 ,or 2,or 3....
It can change region which you want .

file:///I|/Manuales%20de%20Service/Electronica/A%20LLENAR/OEM/DVA808(Admiral)/Free%20Zone%20setting.txt22/07/2009 01:55:53 p.m.