Beruflich Dokumente
Kultur Dokumente
Processing Equipment
Essentials
Some practical tips regarding the design and fabrication of piping systems and equipment for
high-purity applications are presented here
W. M. (Bill) Huitt
W.M. Huitt Co.
IN BRIEF
THE PURITY QUOTIENT
ELECTRONICS
CHEMICALS
PERSPECTIVE
HIGH-PURITY
EQUIPMENT
CLEANROOM
CLASSIFICATIONS
DESIGNING FOR HIGH
PURITY
FINAL REMARKS
44
WWW.CHEMENGONLINE.COM
JANUARY 2017
GF Piping Systems
Weld bead
GF Piping Systems
dth
wi
ea
s
eld
ID
Having such specific quantitativepurity values creates definable parameters for determining the degree
of chemical purity that needs to be
specified, procured and receipt-verified for use in electronics chemicals
where purity is a critical factor.
Application of the terms high purity,
PROFILING A PROCESS
24
Powerchangesreectviscositychanges
Goodbatcheswilltthenormalprolefor
thatproduct
POWER DECREASE
SHOWS BATCH
IS DONE
22
20
18
POWER
SENSOR
16
14
12
10
DRY MIX
HIGH SPEED
ADD LIQUID
LOW SPEED
MIXER
MOTOR
BEGIN HIGH
SPEED MIX
6
4
2
0
BATCH 1
BATCH 2
BATCH 3
WWW.CHEMENGONLINE.COM
JANUARY 2017
45
GF Piping Systems
purity values.
The primary industries that use
such purity terms, as mentioned
previously, include the electronics and bioprocessing industries.
The electronics chemicals industry,
which includes the semiconductor
sector, typically refers to its purity
needs and requirements in utilizing each of the three purity terms.
Whereas the bioprocessing industry, which includes the pharmaceutical sector, typically refers to its purity needs and requirements simply
as high purity. As we move forward
with this article we will be focusing more specifically on electronics chemicals. So rather than continue to make reference to all three
terms in a somewhat indiscriminate
manner we will, for this discussion,
simplify things by grouping all three
terms into the single catch-all term
high purity.
Electronics chemicals
The electronics industry covers the
manufacture of a wide range of sophisticated components and end
products, including silicon wafers,
integrated circuits, printed circuit
boards, compound semiconductors,
optoelectronics (a subset of photonics), solar panels and flat-panel
display products. In discussing this
topic I will make every effort to avoid
being drawn into the many sidebar
subjects this topic harbors. We will
instead stay focused on essential
criteria and considerations necessary for various chemical processing
equipment used in the manufacture
of electronics chemicals.
CHEMICAL ENGINEERING
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
Purity or Grade
Absolv (Tedia designation)
Accugen (Anachemia trademark)
Acculute (Anachemia trademark)
Accusolv (Anachemia trademark)
Accutin (Anachemia trademark)
ACS (American Chemical Society)
Anhydrosolv (Tedia designation)
AR (MBI trademark)
AR Select (MBI trademark)
AR Select Plus (MBI trademark)
BIO (Tedia designation)
CP (Chemically Pure)
ChromAR (MBI trademark)
DriSolv (EMD trademark)
Environmental Grade (Anachemia trademark)
Environmental Grade Plus (Anachemia
trademark)
FCC (Food Chemicals Codex)
GenAR (MBI trademark)
Guaranteed Reagent (GR; EMD trademark)
HPLC/Spectro (Tedia designation)
HR-GC OmniSolv Grade Solvents (EDM
trademark)
Laboratory
Labboratory Grade
Nanograde (MDI trademark)
NF (National Formulary)
OmniSolv Biosynthesis (EMD trademark)
OmniSolv Grade Solvents
OmniSolv HPLC Grade Solvents (EMD
trademark)
OmniTrace Grade Acids (EMD trademark)
OR (MBI trademark)
Practical
Primary Standard
Purified
Reagent
Residue Grade Solvents
ScintillAR (MBI trademark)
SilicAR (MBI trademark)
SpectrAR (MBI trademark)
StandARd (MBI trademark)
Standardized Solutions
Suprapur Grade Acids (EMD trademark)
Technical
Tracemetal (Tedia designation)
Tracemetal Plus (Tedia designation)
UltimAR (MBI trademark)
USP (U.S. Pharmacopeia)
USP/GenAR (MBI trademark)
WWW.CHEMENGONLINE.COM
JANUARY 2017
Bases
Ammonium hydroxide
Potassium hydroxide
Sodium hydroxide
Solvents
1,2-Ethylenediamine
Acetone
Cyclohexanone
Ethylene glycol
Hexamethyldisilazine
Isopropanol dilutes
Methylethylketone
Methanol
n-Butyl acetate
N-Methylpyrrolidone
Negative resist developer
PBR
Propylene glycol
Methyl ester acetate
Xylene
Performance
Acetic Copper Clean
Ammonium fluoride
Hydrogen peroxide
Proprietary etching formulations
Perspective
The semiconductor industry, back in
the early 1970s, was creating chipdesign pattern etchings, or fabrications, at the 10 micrometer (m)
level. In working at such microscopic
levels, the required chemical purity,
while it had to meet a higher-thannormal standard of purity, was not
a major issue. However, in todays
semiconductor world, they are working at the 10 nanometer (nm) level.
And by 2021, it is expected that the
semiconductor industry will be working at the 5-nm level.
The implication here is that any
secondary debris or erroneous particulate matter entrained in a liquid
or gas at even the 10-nm size coming in contact with a fabrication can
take a work-piece out of specifications, making it rejectable. And this
is where the demand for high-purity
chemicals comes from. Creating the
ability and sophistication to manufacture such components brings with it
the need for other related industries,
such as the chemical industry, to up
Circle 20 on p. 62 or go to adlinks.chemengonline.com/66424-20
CHEMICAL ENGINEERING
WWW.CHEMENGONLINE.COM
JANUARY 2017
47
Flammable
Butane
Halocarbons
Carbon tetrachloride
Hydrides
Ammonia
Helium
Cyclopropane
Hexafluoroethane
Arsine
Krypton
Deuterium
Perfluoropropane
Germane
Neon
Nitrogen
Xenon
Ethane
Hydrogen
Methane
Propane
High-purity piping
Referring back to Mosbys definition
of chemical purity, we can make the
claim that purification, as it relates to
fluids, is the physical aspect of separating a chemical substance from that
of any resident foreign substance
considered a contaminant or impurity.
Achieving and maintaining a high degree of purity for any fluid, gas or liquid, requires that all process contact
surfaces within the high-purity envelope, or boundary limits, meet or exceed a set of stringent requirements
pertaining to materials of construction
and fabrication of processing equipment, filtration, instrumentation and
distribution systems.
Such specific criteria, as mentioned previously, involves proper
material selection, unique welding
requirements, mechanical joint design, product contact-surface finish,
piping and equipment installation parameters, and a dogmatic approach
to quality management throughout
48
Hydride/inert
Arsine
(110%)
Germane
(110%)
Phosphine
(110%)
Phosphine
Silane
Corrosive
Boron
Other
Acetylene
Chlorine
Carbon dioxide
Dichlorosilane
Carbon monoxide
Hydrogen bromide
Hydrogen fluoride
Silicon tetrachloride
Boron trichloride
Trichlorosilane
Dimethyl ether
Nitric oxide
Nitrous oxide
Oxygen
Sulfur hexafluoride
WWW.CHEMENGONLINE.COM
JANUARY 2017
0.1 m
10
100
1,000
1,236
10,000
12,360
100,000
1,000,000
0.2 m
2
24
237
247
2,370
2,649
23,700
26,485
237,000
4
35
35
352
353
3,529
3,531
35,200
35,314
352,000
353,140
3,520,000
3,531,400
35,200,000
5.0 m
8
83
35
832
353
8,320
3,531
83,200
35,314
832,000
353,140
8,320,000
29
35
293
353
2,930
3,531
29,300
35,314
293,000
Notes:
1. A comparison between ISO 14644 and FS209E standards for maximum allowed particles by size
2. Federal Standard (FS) 209E, Airborne Particulate Cleanliness Classes in Cleanrooms and Clean Zones was withdrawn on November 29, 2001
3. The FS209E micron class values have been transposed from ft3 to m3
Cleanroom classifications
Cleanroom requirements and classifications were initially issued on
September 11, 1992 under FS
(Federal Standard) 209E. This program was accepted and adopted
on an international basis for cleanroom standardization up until November 29, 2001. On that date,
the U.S. General Services Administration (www.gsa.gov) issued, in
part, the following notice regarding FS Airborne Particulate Cleanliness Classes in Cleanrooms and
Clean Zones: Federal Standard
209E dated September 11, 1992 is
hereby canceled and superseded
by International Organization for
Standardization (ISO) Standards.
International Standards for Cleanrooms and associated controlled
environments, ISO 14644-1 Part 1:
Classification of air cleanliness; and
ISO 14644-2 Part 2: Specifications
for testing and monitoring to prove
continued compliance with ISO
WWW.CHEMENGONLINE.COM
JANUARY 2017
14644-1. [2]
With that notification, ISO 14644-1
and 14644-2 became the de facto
international standard for cleanroom
requirements. Cleanroom classification designations thereby changed
from the 10, 100, 1,000, and so on
classifications to the ISO 1, 2, 3, 4,
and so on classifications, as reflected
in Table 4. This table compares and
contrasts both the FS and ISO standards, because there are many companies, catalogs, and specifications
that still specify the classifications
referred to in the old superseded FS
209E standard.
with no flat surfaces, an internal material surface finish specified to reduce interfacial tensions between a
liquid and the process contact surface, and piping systems installed for
drainability with slope, no pockets,
and an internal material surface finish
also specified to reduce interfacial
tensions between a liquid and the
process contact surface.
Welding. Aside from establishing an
appropriate surface finish for process contact surfaces of equipment
and piping, the joining of piping
becomes a critical design element
in the cleanability aspect of a system. While mechanical-type joints
are necessary, they are inherently
more prone to capture and release
impurities in a system than that of
a properly made welded joint. And
for that reason, whether for metallic
or nonmetallic material, the welded
joint should be the default type joint,
and mechanical-type joints used
very selectively where breakout sections or equipment connections demand otherwise.
Welding metallic materials. In selecting a metallic material for piping
and equipment, the welding method
most widely used and selected for
high-purity systems is the autogenous automatic GTAW (TIG) method
performed with an orbital welder.
Both the ASME BPE standard and
SEMI standards F78-0304 Practice for Gas Tungsten Arc (GTA)
Welding of Fluid Distribution Systems
in Semiconductor Manufacturing Applications and F81-1103 Specification for Visual Inspection and Acceptance of Gas Tungsten Arc (GTA)
Welds in Fluid Distribution Systems
in Semiconductor Manufacturing Applications provide criteria for weld
acceptance as well as guidance for
examinations of the welds.
An autogenous weld is one in which
no filler material is introduced to the
weld. The weld, as shown in Figure
2, is made by fusing together only the
base material of two components.
This is done by programming
the welder with essential elements
of the tubing that is to be welded.
Once the essential parameters are
programmed into the welding machine, a weld coupon is made and
examined. Upon approval of the
50
Standards to consult
In order to properly specify, design,
procure, fabricate and handle highpurity piping, tubing, fittings, other
wetted components and equipment,
it will be necessary to comply with or
adopt a set of standards that meet
your specific needs. To do that, it
is recommended that the following
standards be consulted:
ASME Bioprocessing Equipment
(BPE) Standard. BPE is a standard
that is focused on the high-purity re-
WWW.CHEMENGONLINE.COM
JANUARY 2017
References
1. Jonas, Wayne B., Mosbys Dictionary of Complementary and Alternative Medicine, Elsever Health Sciences,
Amsterdam, the Netherlands, 2005.
2. U.S. General Services Administration, Preparing Activity:
GSA-FSS, FSC 3694, Washington, D.C., 2001.
3. The piping material in the photos is GF Piping Systems
Sygef Standard and Sygef Plus PVDF pipe and fittings,
which are produced using Kynar resins.
4. ASME BPE, www.asme.org/products/codes-standards/bpe-2014-bioprocessing-equipment.
5. ISO, www.iso.org/iso/home/store/catalogue_tc/catalogue_tc_browse.htm?commid=54874.
6. SEMI, www.semi.org/en/store/P001204.
7. IEST, www.iest.org/Standards-RPs/RecommendedPractices.
Author
William M. (Bill) Huitt has been
involved in industrial piping design,
engineering and construction since
1965. Positions have included design engineer, piping design instructor, project engineer, project
supervisor, piping department supervisor, engineering manager and
president of piping consulting firm
W.M. Huitt Co. (P.O. Box 31154, St.
Louis, MO 63131-0154; Phone: 314-966-8919; Email:
mhuitt@aol.com; URL: www.wmhuittco.com), which he
founded in 1987. His experience covers both the engineering and construction fields crossing industry lines to
include work on petroleum refining, chemical, petrochemical, pharmaceutical, pulp & paper, nuclear power,
biofuel and coal gasification. In addition to writing numerous specifications, guidelines, papers and magazine articles on the topic of piping design and engineering, he has
also authored Bioprocessing Piping and Equipment Design A companion guide for the ASME BPE Standard,
which is considered the companion guide on the ASME
Bioprocessing Equipment standard. Huitt is a past member of ISPE and CSI, and is a current member of ASME. He
is a member of the B31.3 section committee, B31.3 Subgroup H on High Purity Piping, a member of four ASMEBPE subcommittees and several Task Groups, ASME
Board on Conformity Assessment for BPE Certification
where he serves as vice chair, a member of the API Task
Group for RP-2611, and he serves on two corporate
specification review boards. Huitt also authored the training program and provides training to ASME consultants
wishing to audit applicants for ASME BPE Certification.
Final remarks
Manufacturing and fabricating highpurity components and equipment is
a highly specialized field that requires
technically qualified and disciplined
personnel and procedures at all levels. It is suggested that when looking
CHEMICAL ENGINEERING
WWW.CHEMENGONLINE.COM
JANUARY 2017
51