Beruflich Dokumente
Kultur Dokumente
3, AUGUST 1997
I. INTRODUCTION
important. This material handling function provides the critical design along this path. Banerjee and Zhou [12] designed a
exchange between sequential fabrication process steps [3]. directed, single loop machine layout by sequentially deter-
Furthermore, experimental data suggests that installation of an mining the flow sequence between machines and the layout
AMHS in a semiconductor fab can significantly reduce shocks of the machines. Yang and Peters [13] used a spacefilling
and vibrations from material handling and potentially increase curve approach to solve a facility layout design problem in
yield [4]. an FMS with a simple material flow loop configuration. They
The interactions between the facility layout and material then add shortcuts to the material handling loop using a one
handling system are widely recognized. The impact of these at a time procedure to attempt to reduce the material handling
factors on the performance of the manufacturing system is also cost. All of these methods could potentially be applied to the
widely acknowledged [5]. Hence, a good layout and material semiconductor fab design problem. However, each would re-
handling system design is required to achieve the benefits of quire manual adjustment to the resulting solution, as discussed
improved fab performance and justify the large investment above. Thus, the ultimate quality of the resulting layout would
costs of a semiconductor wafer fabrication facility. be suspect. Furthermore, none of these procedures exploit the
In this paper, a spacefilling curve (SFC) heuristic is pro- structure of the fab design problem, which allows a specialized
posed to solve the layout and material handling system design procedure to be developed that is both effective and efficient
integration problem. Section II reviews the literature pertinent at determining the fab layout and material handling system
to this integration design problem. The details of the proposed design.
procedures for the spine and perimeter configurations are Tong [14] and Tate and Smith [15] developed a sequential
discussed in Sections III and IV, respectively. Section V construction technique and a genetic search heuristic, respec-
contains empirical illustrations of the proposed approach. tively, to solve a flexible bay structure layout, which is similar
Conclusions and suggestions for future research are given in to the perimeter bay configuration shown in Fig. 2. This design
Section VI. allows a bay to contain more than two departments; hence,
it is possible, when this procedure is applied to a perimeter
configuration semiconductor fab, to have a department that
II. LITERATURE REVIEW cannot interface with the AMHS since it doesnt have a
Most of the literature related to design of semiconductor boundary on the perimeter of the layout.
fabrication facilities has concentrated on the material handling The current paper considers a directed material flow path
system, e.g., [1] and [2]. Most of these approaches have used but it also exploits the special structure of a semiconductor
simulation models to analyze alternative material handling fab configuration. It differs from previous literature in that it
system designs given a fab layout [2]. These approaches do integrates the layout and material handling system design by
not provide information on how to create a good design or considering shortcuts that result from the addition of crossover
how to integrate the design of the layout with the material turntables and generates a bay layout design that is customized
handling system. for a semiconductor fabrication facility.
There has also been previous research investigating facility
layout and material handling system design in applications
not specific to semiconductor manufacturing. For example, III. SPINE CONFIGURATION
Dowlatshahi [6] and Lacksonen [7] both provide broad frame-
works for integrating manufacturing system design issues.
However, detailed design procedures are not provided in these A. Overview
frameworks. When modeling the integrated design problem with a spine
Montreuil [8] proposed a modeling framework for inte- configuration, three interesting aspects are noted. First, the
grating layout and undirected flow network designs. Chhajed material handling system can be modeled as a single loop with
et al. [9] provided a detailed flow network design on an crossover points. Second, the bay layout arrangement with a
existing layout. Langevin et al. [10] solved a spine layout centralized spine material handling system requires that each
design problem with an undirected material flow network. department have exactly one boundary on the center spine of
Their procedure searches for a rectangular layout shape along the floor space in order to access the material handling system,
a central spine. While this method is effective at solving many which implies that exactly one department can be located in
manufacturing system design problems, it is not easily applied each bay.
to the fab design problem because its output must be modified Third, the bay height is usually constant across the entire
to fit the fab design criteria. These modification requirements, length of the facility. Typically, the bay height will be the
and their potential detrimental effect on performance, are due same in the upper row and the lower row, which implies
to two major reasons. First, the design objective considers an that the material handling system is in the center of the
undirected flow network, which is not typical of AMHS used facility. However, the procedures described in this paper allow
in semiconductor fabs. Second, it does not enforce the cell the upper and lower row heights to differ. We will assume,
geometry and exact P/D point positions, which are necessary however, that these heights are design parameters that are
and important components of the fab design problem. based on the desired bay configurations and available floor
Given a fixed single-loop material flow path, Wu and Egbelu space and, hence, are specified prior to solving the integrated
[11] developed a procedure to determine an optimal layout layout problem.
362 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 10, NO. 3, AUGUST 1997
TABLE I
SPINE CONFIGURATION COSTS
TABLE II
PERIMETER CONFIGURATION COSTS
TABLE III
DEPARTMENT AREA INFORMATION FOR 8-BAY PROBLEM
TABLE IV
FROM-TO DEPARTMENTAL FLOW MATRIX FOR THE 8-BAY PROBLEM
TABLE V
FLOW SEQUENCES FOR 8-BAY PROBLEM
Fig. 13. Perimeter configuration integrated design.
TABLE VI
DEPARTMENT AREA INFORMATION FOR 14-BAY PROBLEM
TABLE VII
FROM-TO DEPARTMENTAL FLOW MATRIX FOR THE 14-BAY PROBLEM
Let represent department areas in entire circuit and return to the crossover in order to get back
terms of number of unit rectangular blocks. For the example on the inner loop, which puts the vehicle exactly back where
in Fig. 8, the department area matrix is . it started. Therefore, in general there will be two or more
If the initial flow sequence is ( ), crossover turntables associated with the double-loop, perimeter
then the pairing results in three pseudo departments which AMHS configuration. The flow path from the P/D point of a
have departments 2 and 1 as the first pseudo department, department to the P/D point of another department will be the
departments 4 and 3 as the second pseudo department, and shortest path between the two vertices representing the actual
finally department 5 as the third pseudo department. Let pickup/deposit points (not the pseudo vertices used in circuit
be the area matrix of the pseudo departments, then II, although they may be intermediate vertices in the path).
for this example. The pseudo departments then fill The determination of the number and location of candidate
the floor space according to the SFC. If a pseudo department shortcuts is carried out as discussed in Section III-C with
is comprised of two departments, then the boundary between the integrated design problem formulated as a network flow
these two departments is determined by the ratio of their areas. problem so that it can be solved efficiently.
For example, in pseudo department 1, the bay is divided into
two regions with a 2:1 ratio in area for departments 2 and 1, D. Integrated Design Improvements
respectively. This procedure creates a flow sequence and then
Every potential flow sequence results in a potential layout,
places departments in the layout so that this flow sequence
with an objective function value representing the material
is maintained, given the perimeter-based material handling
handling cost. The SDPI heuristic discussed in Section III-
system.
D is used to improve an initial flow sequence and search for
the best solution. Note that after each interchange, the flow
C. Crossover Turntable Design
sequence and pseudo departments must be updated in order to
The problem of locating a crossover turntable can be trans- compute the resulting material handling cost.
formed to a standard network flow formulation and solved The integrated shortcut design formulation is the same as
efficiently. Since a departments P/D point can only interface (1)(5) and the improvement procedure is as shown in Fig. 7
with the inner AMHS loop, which we define as circuit I, any for the spine configuration, although now the calculation of
flow must move back to this circuit in order to pickup or the material handling distance is using the two circuit network
dropoff wafer lot boxes at a department. shown in Fig. 9. Therefore, the details of the design procedures
Thus, the double-loop, perimeter AMHS configuration can are not repeated here.
be mapped to two separate circuits as illustrated in Fig. 9
for the example from Fig. 8. At least one crossover turntable
is required to use the outer loop (circuit II). The addition V. EMPIRICAL ILLUSTRATIONS
of a crossover turntable adds an arc ( ) to connect the In order to demonstrate the proposed procedures, three
two circuits as shown in Fig. 9. For the outer loop to be example problems, with eight, 14, and 20 bays, are generated
useful, at least one additional crossover turntable is needed to using the data in Carpenter et al. [2] as a guide. The area
connect the inner and outer loop, e.g., arc ( ). Otherwise, information and inter-department flow densities are as shown
a vehicle can get on the outer loop but must complete the in Tables IIIXI. It is assumed that the minimum distance
PETERS AND YANG: INTEGRATED FACILITY LAYOUT AND MATERIAL HANDLING SYSTEM DESIGN 367
TABLE VIII
FLOW SEQUENCES FOR 14-BAY PROBLEM
TABLE IX
DEPARTMENT AREA INFORMATION FOR 20-BAY PROBLEM
TABLE X
FROM-TO DEPARTMENTAL FLOW MATRIX FOR THE 20-BAY PROBLEM
TABLE XI
FLOW SEQUENCES FOR 20-BAY PROBLEM
between a crossover turntable and a P/D point (or another discounted fixed cost per period for a crossover turntable is
crossover turntable) is equal to 0.6 distance units. 70; and 3) the length between the two bay rows in the spine
The proposed procedures are coded in C and imple- configuration is 2 distance units.
mented on an IBM RS/6000 computer. Each integrated short- Since the initial flow sequence impacts the solution quality
cut design formulation is solved using a combined network- for the SDPI procedure, each problem is repeated five times
dual simplex method optimizer provided by CPLEX [23] in with different initial flow sequences as shown in Tables V,
a callable library.
VIII, and XI. The experimental results are summarized in
Table I. The second column shows the lowest cost obtained
A. Spine Configuration from the five runs. The third and fourth columns are included
For the spine configuration, additional assumptions include: to illustrate the dependency of the algorithm on the initial
1) both and are equal to 5 distance units; 2) the flow sequence. As can be seen, the average is slightly higher,
368 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 10, NO. 3, AUGUST 1997
but the algorithm is able to achieve a good solution from a dures. Experimental results with the procedure were presented
variety of starting sequences, which is important for this type and are very encouraging.
of problem. Fig. 10 illustrates one of the integrated designs Since the bay configuration with an overhead monorail
determined by the procedure. material handling system is the trend for future semiconductor
The solution quality of this proposed integrated design facility designs, the procedure developed in this paper is an
procedure is demonstrated by comparing it with the solu- important step toward efficient and effective semiconductor
tion from an exact layout design formulation, a modified fab design in order to improve the system performance in
quadratic set covering formulation (QSCP). The modified terms of throughput, yield increases, WIP reduction, tool
QSCP formulation is capable of optimally solving the fab utilization, etc. In addition, this integrated design procedure
layout design problem with a simple flow path; however, it can be adapted to the intrabay integrated design problem,
is computationally prohibitive for a realistic size problem. which is a micro-version of the interbay design problem.
Readers are referred to Peters and Yang [24] for a detailed Therefore, the integrated design procedure is applicable to real
discussion of the QSCP formulation in the context of a more world problems facing the semiconductor industry.
general layout design problem.
Once the optimal layout design is found using the modified
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PETERS AND YANG: INTEGRATED FACILITY LAYOUT AND MATERIAL HANDLING SYSTEM DESIGN 369
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Station, July, 1995. with emphasis on semiconductor fabrication facili-
ties, and the integrated layout and material handling
system design problems.