Name : Joshua R.

Hernandez Course : BS Electronics

Engineering
CYS : ECE43 School : De La Salle University -
Dasmarias
Company : Deca Technologies

WEEKLY ACCOMPLISHMENT REPORT

Week 1

DAY ACTIVITIES

Tape & Reel And Laser Mark Processes spare parts

May 14
documentation
Monday
PVD Sputter documentation

May 15 Entered the FAB

Tuesday Wafer, cassettes, and test machines introduction

May 16
Wednesda Plasma Descum Documentation
y
May 17
Cure Oven Documentation
Thursday
May 18
Ball Attach Documentation
Friday
May 19
Satudray Coater Tool Documentation
(half day)
KNOWLEDGE ACQUIRED

Monday. I was tasked to help in the spare parts documentation of the tape
& reel and laser mark processes. I have learned that tape and reel is a
process of packing surface mount devices by loading them into individual
pockets comprising what is known as a pocket tape or carrier tape. The units
are sealed in the carrier tape with a cover tape, usually by heat or pressure.
The carrier tape is wound around a reel for convenient handling and
transport. The reel is enclosed in a reel box before it is finally shipped to the
customer. I was also tasked to document the PVD Sputter operating
procedure, process specification, and recipe definition. I have learned that
the machine (not disclosed) is capable to do Plasma Etch, copper Physical
Vapor Deposition and TiW Physical Vapor Deposition. I have learned about
the wafer color codes, classifying defining which are unoccupied,
unprocessed, fully etched,has fault problem during deposition, has alarm
problem during depostion, good waferprocessing complete which is
green color, a dummy, and finally skipped.

Tuesday. I entered the FAB and saw the machines that were described in the
manuals I was documenting. It was a sight to see. It was easier to learn in
the actual than by merely just reading. An assistant of my boss assisted me
and showed me around the area. She was kind enough to show me her work.
I have noticed that wafers were enclosed inside a cassette, a container
specifically designed for the wafer. The machines holes were rubber sealed
because the wafers will be frozen if air penetrates within the machine. The
machine is bundled with a program which is GUI and is controlled through a
touch panel.
Wednesday. Today I was tasked to document Plasma Descum process. It is a
process removing residues (scum) from a substrate through gentle plasma
cleaning is known as descumming. Plasma as a cleaning agent is an
environmentally friendly they said, safe alternative to traditional wet
chemical cleaning methods since it doesn't require use of hazardous
solvents. The machine they are using is capable of cleaning residues from a
substrate through gentle plasma cleaning. The machine is using a human-
machine interface (HMI) Touch Screen. During operation, the information
displayed on the screen is monitored by the PLC. The machine software
provides several user interface screens, used to control the operation
process, program recipes, and perform process engineering, maintenance,
and troubleshooting procedures. Refer to chapters later in this manual for
descriptions and usage of these screens

Thursday. I documented Cure Oven for today. Curing ovens are designed to
cause a chemical reaction in a substance once a specific temperature is
reached. Powder coating is one common curing oven use. The equipment
they use is designed for use with volatile or explosive materials unless it is
equipped with the solvent venting package and specifically stated in the
oven specifications. Loading of such materials may result in explosion or fire
so this must be really handled in care.

Friday. Today I was assigned to do a modification of their Ball Attach

manual. Basically, a method and apparatus of attaching solder balls for
semiconductor packages. The manual is all about the manual operations. It
tackles how to power up and initialize, wafer loading and unloading.
Saturday. Today I showed up half day because of a personal and urgent
matter that the practicumer had to face. I was asked to document the Coater
Tool Operations Procedure, Process Specification, and Recipe Definition. The
Wafer Coater Tool is designed to quickly take a semiconductor wafer from the
FOUP (Front Opening Unified Pod), center the wafer, clean the wafer, coat
the wafer, bake the resist, and put the wafer in the outgoing FOUP. The Tool
is capable of processing wafers at more than 35 wafers per hour, depending
upon customer-selected coating parameters.

Engr. Allan G.
Beltran