DIP d.

Hard, Strong, and Stiff Materials

e. Large modulus of elasticity and

- is the most common through-hole IC package
very strong bonds
youll encounter. These little chips have two
parallel rows of pins extending perpendicularly f. High melting temperature,
out of a rectangular, black, plastic or ceramic corrosion and reaction resistant
housing.

-Each of the pins on a DIP IC are spaced by 3. SIZES/EXAMPLES

0.1" (2.54mm), which is a standard spacing
and perfect for fitting into breadboards and a. DIL8
other prototyping boards. The overall - LM741
dimensions of a DIP package depend on its pin - 555
count, which may be anywhere from four to 64. - 4-Position DIP Switch
- LM 258
It was invented by Don Forbes, Rex Rice
and Bryant Rogers at Fairchild R&D in b. DIL14
1964. - LM324 (quad op-amp)
- LM339 (comparator)
It is usually referred to as a DIPn, where n
- IC 747 (dual op-amp)
is the total number of pins.
- LM380 (audio pow amp)

LEADLESS CHIP CARRIER (LCC)

1. FUNCTIONS/ADVANTAGES
a. Multi-pin I/O
b. Ultra-miniature packages
c. Packages suited to high density
ICs
- has no "leads", but instead has rounded pins
through the edges of the ceramic or
molded plastic package.
- Prototypes and devices intended for
extended temperature environments are
typically packaged in ceramic.
- Ceramic leadless chip carriers do not have
metallic external leads.

d. Improved heat resistance for CASTELLATIONS

use with reflow soldering - LCC's are soldered directly to PC boards by
techniques their solder pads called castellations.
e. High throughput speed
FEATURES/ADVANTAGES OF LCC
f. Improved heat dissipation
1. Compact Size
g. Lower cost per pin

2. Light weight
2. ADVANTAGES OVER PLASTIC DIP
3. Ability to adapt to multiple
a. Very versatile
functions.
b. Mechanical Properties
4. Ultra-miniature sizes for
c. Thermo Chemical Properties
mobile/wireless devices.
 5. Standard JEDEC body sizes for - The external lead frame is formed into a J-
conventional applications. shape so that it can be used as both a
surface-mount device on a PCB and in a
6. High reliability ceramic materials. pressure contact socket.

SIZES
7. Low loss for excellent electrical
performance at RF. 1. JLCC 28

8. Wide selection of industry 2. 44

standard case outlines. 3. 52

50 MIL CENTERS 4. 68
- The most widely used. 5. 84
- comes in square and rectangular
configurations.

40 MIL CENTERS Small Outline Integrated Circuit (SOIC)

- used by the military for high density - a type of IC that comes in rectangular shape
application. with the gull wing leads which are bent to
support the surface mount soldering process.
- are often used in high heat dissipation
applications.
USES - It is a lead-frame based, plastic
encapsulated package that is well suited for
1. Mil Spec applications requiring optimum performance
2. Aerospace in IC packaging.

3. High Temperature Applications Ceramic Small Outline Integrated Circuit

SIZES (CSOIC)

1. LCC 16 - CSOIC is a hermetic package consisting of a

multilayer ceramic surrounding a "gullwing"
2. 20
formed leadframe.
3. 28
- This package has leads extending from two
4. 32
sides of the package (dual).
5. 44
- The package is hermetically solder sealed at
6. 68
325 Centigrade.
7. 84
- These IC packages have proven surface
mount (SMT) performance characteristics and
J-LEADED CHIP CARRIER (JLCC) have been designed to adapt easily to ALL
- is a square or rectangular surface-mount SMT processes and lines.
ceramic package that has J-formed leads
around its periphery. The plastic-molded - Ceramic SOIC packages allows the ability
equivalent of the JLCC is the PLCC. and freedom to optimize systems and product
- are often used in high heat dissipation designs.
applications.
 Advantages/Benefits
- commonly used for applications requiring
high performance and high reliability.
- Excellent thermal characteristics for heat
sensitive applications
- ideal for extremely stress-sensitive
devices such as MEMs sensors.
- 37% smaller footprint than ceramic DIP
(Dual In-line Packages)
- 80% weight reduction of typical value
(actual reduction varies by package and
die type)
Sizes
- 8 Lead Ceramic SOIC
- 16 Lead Ceramic SOIC
- 20 Lead Ceramic SOIC
- 24 Lead Ceramic SOIC
- 28 Lead Ceramic SOIC
Pin Grid Array(PGA)
- often abbreviated PGA, is a type of
integrated circuit packaging. In a PGA, the
package is square or rectangular, and the pins
are arranged in a regular array on the
underside of the package. The pins are
commonly spaced 2.54 mm (0.1") apart, and
may or may not cover the entire underside of
the package.
Ceramic Pin Grid Array
- A ceramic pin grid array (CPGA) is a type of
packaging used by integrated circuits. This
type of packaging uses a ceramic substrate
with pins arranged in a pin grid array. Some
CPUs that use CPGA packaging are the AMD
Socket AAthlons and the Duron.
- A ceramic package capable of providing up
to several hundred pins, all located on its
underside. Used, for instance, to package
computer chips. The design seeks to minimize
the distance signals must travel from the chip
to each designated pin.
Uses
- high I/O signal carrying capacity
- excellent electrical performance
- high thermal heat dissipation
- low inductance and enhanced thermal
performance
Through-hole mount package
- is typically square in shape with gold-
plated pins brazed in a matrix pattern to
the bottom of the package.
Sizes
PGA 68
PGA 84
PGA 100
PGA 120
PGA 144
PGA 160
 PGA 180
PGA 208
PGA 224
Quad Flat Package
- Is a surface mount integrated circuit
package with gull wing leads extending
from each of the four sides. Socketing such
packages is rare and through-hole mounting is
not possible. Versions ranging from 32 to 304
pins with a pitch ranging from 0.4 to 1.0 mm
are common. Other special variants include
low profile QFP and thin QFP.
Ceramic Quad Flat Package
- is available with a wide range of Lead counts
and body sizes. The Cerquad is a hermetic
surface mount package. The
ceramic/leadframe/ceramic system is held
together hermatically by glass to create both
internal die connection and external board
connection.Some package are designed with a
window frame on the top of lead frame
providing added strength.
Uses
The Cerquad has a proven track record
and is still being used by semiconductor
technologies such as: Digital to Anolog
converters, Microwave, Logic, Memory,
Microcontrollers and Video controllers.
Ceramic Quad Flat Package (cerquadCQFP)
Features
- 14-304 Lead count,25-50 mil lead pitch
- Hermetic surface mount package
- Lead Form: Flat, Gull Wing, J-Bend
- Lead Plating: Gold, Solder Dip or Tin
- High thermal conductive ceramic
- JEDEC standard compliant
- Wide selection of available cavity
size to meet most die size needs
Applications
Along with the other standard industry
packages, the CQFP has a proven track
record and is still being used by
semiconductor technologies such as:
Digital to Analog converters, Microwave,
Logic, Memory, Microcontrollers, and Video
controllers. Some end applications are:
Military electronics, Commercial
electronics, Automotive and
Telecommunications.
Sizes
- CQFP 84
- CQFP 100
- CQFP 120
- CQFP 128
- CQFP 208
- CQFP 256