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Q.1 The fundamental period of the discrete time signal given below is
a. 6
b. 3
c. 2
d. none of these
Q.3
A discrete time system has impulse response The
system is
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Q.4
a.
b.
c.
d.
Q.5 Two discrete time sequences h1(n) and h2(n) have lengths 3 and 7
respectively. The maximum length of the sequence h3(n) = h1(n) h2(n)
(where denotes convolution) is
a. 10
b. 11
c. 9
d. 7
a. low pass
b. high pass
c. band pass
d. band reject
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Q.7 A discrete time signal x(n) has DTFT X(ej ). The DTFT of nx(n) is
a.
b.
c.
d.
Q.8 A discrete time signal x(n) has DFT X(k). If x(n) = {1, 2, 1, 3}, then X(2) is
(Assume 4-point DFT)
a. 4
b. 5
c. 6
d. 7
Q.9 Which one of the following windows has maximum main lobe width
a. Hamming
b. Hanning
c. Rectangular
d. Blackman
a. S1 and S2 only
b. S1 and S3 only
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c. S2 and S3 only
d. S1, S2 and S3
Q.11 Consider the following statements regarding the memory addressing of 8051
microcontroller.
S1: The address range 80 H - FF H of on-chip RAM is assigned to special
function registers.
S2: The address range 80 H - FF H of on-chip RAM is accessible only with
direct addressing mode.
S3: The address range 00 H - 7F H of on-chip RAM is accessible with direct or
indirect mode of addressing.
Select the correct statements using the codes given below.
a. S1 and S2 only
b. S1 and S3 only
c. S2 and S3 only
d. S1, S2 and S3
Q.12
Consider the analog filter The digital filter equivalent using
a.
b.
c.
d.
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a. S1 and S2 only
b. S1 and S3 only
c. S2 and S3 only
d. S1, S2 and S3
a. S1 and S2 only
b. S1 and S3 only
c. S2 and S3 only
d. S1, S2 and S3
Q.16 If the minimum thickness of the oxide layer for 1.5 m technology is 25 nm,
then the minimum thickness of the oxide layer required for the 0.13 m
technology will be
a. 20 nm
b. 288.5 nm
c. 2.167 nm
d. 3.25 nm
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Q.17 Select the correct statement regarding the Oxide layer formation using the
processes chemical-vapor deposition (CVD) and Dry Oxidation.
a. Oxide layer through CVD process has good electrical characteristics than that of
thermally grown oxide layer.
b. CVD process requires large temperature than dry oxidation.
c. CVD process is faster than dry oxidation and requires a low temperature.
d. Oxide layer through CVD process has very high relative permittivity.
a. S1 only
b. both S1 and S2
c. S2 only
d. neither S1 nor S2
a. S1 and S2 only
b. S1 and S3 only
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c. S2 and S3 only
d. S1, S2 and S3
Q.21 Consider the following statements regarding the single crystal growing
techniques namely, Czochralski crystal growing process (CZ process) and
Float Zone technique (FZ process).
S1: Growth speed is higher in FZ process compared to CZ process.
S2: Heat-Up and Cool-Down times are longer in FZ process compared to CZ
process.
S3: Metallic impurity content is higher in CZ process compared to FZ
process.
Select the correct statements using the codes given below.
a. S1 and S2 only
b. S1 and S3 only
c. S2 and S3 only
d. S1, S2 and S3
Q.23 Select the wrong statement regarding the Molecular Beam Epitaxy (MBE)
process.
Q.24 Which one of the following lithography techniques can be used to get very
high resolution?
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a. Photolithography
b. Electron beam lithography
c. X-ray lithography
d. Ion beam lithography
Q.25 Which one of the following VLSI design styles is preferred to get high
performance of the product?
a. Full-custom design
b. Semi-custom design
c. Field programmable gate array design
d. Gate array design
Q.26 Consider the following statements regarding Field Programmable Gate Array
(FPGA) design and Complex Programmable Logic Device (CPLD) design.
S1: The functionality of FPGA-based design is implemented by lookup table.
S2: The functionality of CPLD-based design is implemented by PAL-like
structures.
S3: Both FPGA and CPLD design styles can be used for high density
designs.
Select the correct statements using the codes given below.
a. S1 and S2 only
b. S1 and S3 only
c. S2 and S3 only
d. S1, S2 and S3
Q.28 Select the correct one of the following statements regarding the finite state
machines.
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a.
b.
c.
d.
Q.30 Which one of the following Flags is not used in 8051 Microcontroller?
a. Carry flag
b. Parity flag
c. Zero flag
d. Overflow flag
Q.31 Which one of the following ports of 8051 microcontroller can be used as
Address bus to external memory?
a. Port-0
b. Port-1
c. Port-2
d. Port-3
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Q.32 What will happen, when the instruction MOV R0, 89 H is executed in 8051
microcontroller?
Q.33 Which one of the following interrupt sources of 8051 microcontroller has the
highest priority?
a. Timer-0
b. Timer-1
c. External INT-0
d. External INT-1
Q.34 Which one of the following special function registers of 8051 microcontroller
is not bit addressable?
Q.35 Assertion (A): Aluminium has been discarded as gate metal in MOSFET.
Reason (R): Aluminium cannot withstand high temperature.
a. A
b. B
c. C
d. D
Q.36 Assertion (A): Silicon is mainly used for making ICs and not Germanium.
Reason (R): In Silicon, SiO2 layer can be formed very easily. Corresponding
oxide layer cannot be formed in Germanium.
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a. A
b. B
c. C
d. D
a. A
b. B
c. C
d. D
a. A
b. B
c. C
d. D
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