Advanced MEMS Packaging

NE 221 2 : 1
Tuesdays & Thursdays
09.00am to 10.00am.
First floor Multi Media Room
FF 11, CeNSE , IISc
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 CLASS 1, 2

Jan 5 and 10, 2017

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 MEMS An OVERVIEW
What are MEMS ?
Why MEMS ?
How & When to use MEMS ?
Some examples.
Some comparisons.with conventional ones .
Miniaturization .. Means what ?
Examples.

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 What are MEMS?

MEMS (Micro Electro Mechanical Systems)

The acronym first used in the late 1980s.

Other names: Microsystems (Europe),

Micromachines (Japan)

Characteristic features (3 Ms):

u Miniaturization

u Multiplicity
A human hair: 80~100 mm
u Microelectronics

A MEMS device
Red blood
White blood cell: 7.5 mm
cell: 13 mm
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 MICROSYSTEM
A solution to a growing trend of
miniaturisation?
Dr. Richard Feynman, a visionary Nobel
laureate in Physics coined the term
miniaturization in Science & Technology40
years ago... i.e., todays Nano Technology !
It makes great economic sense
Gives consumers Intelligent & multi-
functional products SMART ??
Ex: Mobile Phones --- All round the world !!!
Handle verbal telecommunications, e-mails,
inter net, still & video cameras, PC with colour
monitor, Thus packaging more sensors, 5
 Miniaturization Makes Engineering Sense!!!

all systems tend to move or stop more quickly due to low mechanical in
s thus ideal for precision movements and for rapid actuation.
iaturized systems encounter less thermal distortion and mechanical vib
to low mass.
niaturized devices are particularly suited for biomedical and aerospace
plications due to their minute sizes.
all systems have higher dimensional stability at high temperature due t
w thermal expansion.
aller size of the systems means less space requirements.
s allows the packaging of more functional components in a single device

ss material requirements mean low cost of production and transportatio

Ready mass production in batches.

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 MEMS

Is an Acronym for Micro Electro Mechanical Systems

Is a platform technology to create tiny devices
Is a off-shoot of semiconductor industry
Is an integrated microsystem on a chip
Is a new way of making complex, integrated
mechanical systems with electronics

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 MEMS: Miniaturization
TR
on Diced
IC chip Cell
phone
MEMS TV

10-6 10-5 10-4 10-3 10-2 10-1 100

101
Human
Dimension
hair
(meters)

Pump Human

Ants eye
segment Ant

MEMS
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 NEMS and nanotechnology

Nano manipulation
Nanotube NEMS
FET
CNT
10-10 10-9 10-8 10-7
10-6
Dimension
(meters)

DNA ATPase motor

Atom
Bacteria

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 .MEMS

Power
Supply Components of MEMS

Signal
v
Micro sensors
Transduction &
Processing
v
Microelectronics
Unit v
Micro-actuators
Sensor Actuator v
Micro-structures
Microsystem

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 MEMS Based Sensors

Is a microscopic Electromechanical structure fabricated

using Silicon as basic material

Structural Elements includes Cantilever, beams,

diaphragms, Cavities.. Which serve as mechanical
components

Embedded piezoresistors or deposited capacitance

electrodes serves as electrical component

The advantage of these sensor is that the signal

conditioning circuitry can be integrated along with the
sensor on a single chip or in hybrid package ( Smart
sensors)

Sensors are fabricated using micromachining techniques

similar to IC fabrication.
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 Micro Electro Mechanical Systems ( MEMS)

The novelty lies in the fact that the microelectronics

exploits only the electrical properties of silicon, whereas
micromechanics takes advantage of both electrical and
mechanical properties.
WHY SILICON ?

As Light as Aluminium with the strength of steel

Highly sensitive to stress and temperature and at the

same time can be coated with a variety of materials
to modify the surface properties.

With the present day technology in the IC industry,

it is possible to manufacture an array of devices on
one wafer.
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 .MEMS

Functions of MEMS Components

Micro sensors
v
Gather the information from environment
v
Chemical, Thermal, biological, optical, magnetic.,

Microelectronics
v
Processes the information derived from sensors
v
Direct the Actuators

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 .MEMS

Functions of MEMS Components

Micro Actuators
v
Respond to commands from microelectronics
v
moving, positioning, pumping, regulating..
v
i.e.,controlling the environment for a desired outcome

Microstructure
v
Packaged product a system

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 .MEMS

Advantages of MEMS

Can be manufactured using batch fabrication technique

similar to ICs.

Unprecedented level of functionality, reliability and

sophistication can be placed on a silicon chip.

Low cost i.e.. improved performance to cost ratio.

Miniaturized total system

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 .MEMS

MEMS
MEMS devices found application in every category of commercial
Application
and military products

Space

Biomedical

Chemical

Optical

Metrological

& Every other measurement and control
system.

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 .MEMS

MEMS Technology in use..

Micro motors
Force sensors

Micro robots
Micro heaters

Electromagnetic bearings
Micro mirrors

Micro suspension
Micro accelerometers
systems
Microspectrophotometer

Field emission devices

Biochips

Miniature camera
Stress Sensors

Gyroscopes
Thermal Sensors

Pressure sensors
etc..etc..

Level Sensors
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 Few Examples:
Sensor Type/Application Principle
Pressure Absolute Strain Gauge, LVDT,
Gauge or Relative Capacitance,
Differential Reluctance, Thin film,
Fibre Optic, MEMS,
NEMS
Load Cell, Force Sensor for Thrust Strain Gauge, LVDT,
Measurement Capacitance,

CeNSE, IISc
Strain Stress / Strain Reluctance, Thin film,
Measurement Fibre Optic, MEMS,
NEMS
Temperature Liquid Immersion ThermoCouple, Bulk
Atmospheric / Gas / Flame RTD, Thin film RTD,
Surface Thermistor, Si Diode,
Semi Cryo MEMS, CNT (Nano),
Cryo Fibre Optic (FBG)

Already In Use Development & Testing under advanced stages

R&D required and yet to be tested 18
 Few
Sensor
Examples
Type/Application
(Contd):
Principle
Level and Liquid Propellant Bulk Capacitance,
Depletion Semi Cryo Ultrasonic, PZT, Interdigital
Cryo MEMS, Continuous NEMS,
Fibre Optics, Reflex RADAR

Acoustic Static Test PZT, Capacitance, MEMS

Launch Pad Phone, NEMS

CeNSE, IISc
Flight CNT/PVDF/ZnO
Heat Flux Static Bulk Pt, Ni, Thin film, MEMS,
Flight NEMS and RTD
Acceleration Flight Capacitance, MEMS, NEMS,
Tunneling, Optical
Flow Gas Turbine type, Cantilever,
Liquid Ultrasonic, Diff. Pr, Coriolis,
Thin film MEMS

Already In Use Development & Testing under advanced stages

R&D required and yet to be tested 19
 Few
Sensor
Examples
Type/Application
(Contd):
Principle
Speed Turbine Magnetic, Capacitance,
Rotating system Optical, MEMS, NEMS
Radiation Atmospheric, Space MOSFET, Semiconductor,
Deep Space MEMS with Oxide Films
Vibration, Simulation PZT, Magnetic, MEMS,
Shock and Static NEMS, PVDF, Optical

CeNSE, IISc
Impact Dynamic
Gas Absorption Bulk Chemical, Thin Film,
Adsorption Oxide Films, ZnO with
H2 dopents
O2
Hydrazine
Altitude Absolute Aneroid Barometric, Bellows,
Vacuum, Capsule, MEMS,
NEMS

Already In Use Development & Testing under advanced stages

R&D required and yet to be tested 20
 Few Examples (Contd):
Sensor Type Principle
Proximity, Relative Inductive, Capacitive,
Motion, Dynamic Magnetic, MEMS, NEMS, PZT,
Displacement ZnO(MEMS+Nano), Fibre
Optics
Chemical Composition Chemical Analysis, pH,
Purity Conductivity, Capacitance,

CeNSE, IISc
Leak MEMS, Dielectric, Optical
Contamination
Concentration
Density
Viscosity

Already In Use Development & Testing under advanced stages

R&D required and yet to be tested 21
 Main Parameter from Ariane 5 [1]
PHYSICAL Minimal Maximal Units
PARAMETERS Range Range

Acceleration -500 500 m/s

Acoustic -40 40 dB

Constraint -10 10 %
deformation
Current 0 2 A

Voltage 0 45 V

Fluxmeter 20 1500 KW/m2

CeNSE, IISc
Angular speed -100 100 deg/s

Level 0 464 mm

Pressure 25 .10-3 500 bar

Power 0 30 W

Temperature -253 1473 C

Vibration / Shock -100000 100000 m/s

Rotation Speed 250 68000 rpm

1. Dr. Oudea Coumar, EADS, Potential applications of micro and nano

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technologies on space transportation systems Table 2
MEMS Pressure Sensor


DIGITAL PRESSURE SENSOR

for ISROs Automatic Weather Stations

Ref: TD &PG LPSC B , ISRO Bangalore.