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LM2675
SNVS129F MAY 2004 REVISED JUNE 2016
Typical Application
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2675
SNVS129F MAY 2004 REVISED JUNE 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.1 Overview ................................................................. 10
2 Applications ........................................................... 1 8.2 Functional Block Diagram ....................................... 10
3 Description ............................................................. 1 8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 11
4 Revision History..................................................... 2
5 Description (continued)......................................... 3 9 Application and Implementation ........................ 12
9.1 Application Information............................................ 12
6 Pin Configuration and Functions ......................... 3
9.2 Typical Application .................................................. 13
7 Specifications......................................................... 4
10 Power Supply Recommendations ..................... 24
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4 11 Layout................................................................... 25
11.1 Layout Guidelines ................................................. 25
7.3 Recommended Operating Conditions....................... 4
11.2 Layout Examples................................................... 25
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics 3.3 V .............................. 5 12 Device and Documentation Support ................. 27
7.6 Electrical Characteristics 5 V ................................. 5 12.1 Documentation Support ........................................ 27
7.7 Electrical Characteristics 12 V ............................... 5 12.2 Receiving Notification of Documentation Updates 27
7.8 Electrical Characteristics Adjustable...................... 6 12.3 Community Resources.......................................... 27
7.9 Electrical Characteristics All Output Voltage 12.4 Trademarks ........................................................... 27
Versions ..................................................................... 6 12.5 Electrostatic Discharge Caution ............................ 27
7.10 Typical Characteristics ............................................ 7 12.6 Glossary ................................................................ 27
7.11 Typical Characteristics Fixed Output Voltage 13 Mechanical, Packaging, and Orderable
Versions ..................................................................... 9 Information ........................................................... 27
8 Detailed Description ............................................ 10
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
Deleted all instances of the computer design software LM267X Made Simple (version 6.0) ................................................ 1
5 Description (continued)
A family of standard inductors for use with the LM2675 are available from several different manufacturers. This
feature greatly simplifies the design of switch-mode power supplies using these advanced ICs. Also included in
the data sheet are selector guides for diodes and capacitors designed to work in switch-mode power supplies.
Other features include 1.5%-tolerance on output voltage within specified input voltages and output load
conditions, and 10% on the oscillator frequency. External shutdown is included, featuring typically 50-A stand-
by current. The output switch includes current limiting, as well as thermal shutdown for full protection under fault
conditions.
D or P Package
8-Pin SOIC or PDIP NHN Package
Top View 16-Pin WSON
Top View
CB 1 8 VSW
CB 1 16 VSW
NC 2 7 VIN
NC 2 15 VSW
NC 3 6 GND
NC 3 14 VIN
FB 4 5 ON/OFF
NC 4 13 NC
DAP
Not to scale NC 5 12 GND
NC 6 11 GND
NC 7 10 NC
FB 8 9 ON/OFF
Not to scale
Pin Functions
PIN
I/O DESCRIPTION
NAME D, P NHN
Boot-strap capacitor connection for high-side driver. Connect a high quality
CB 1 1 I
470-nF capacitor from CB to VSW pin.
Feedback sense input pin. Connect to the midpoint of feedback divider to set
FB 4 8 I VOUT for adjustable version or connect this pin directly to the output capacitor
for a fixed output version.
Power ground pins. Connect to system ground. Ground pins of CIN and COUT.
GND 6 11, 12
Path to CIN must be as short as possible.
2, 3, 4, 5,
NC 2, 3 No connect pins.
6, 7, 10, 13
Enable input to the voltage regulator. High = ON and low = OFF. Pull this pin
ON/OFF 5 9 I
high or float to enable the regulator.
Supply input pin to collector pin of high side FET. Connect to power supply and
VIN 7 14 I input bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN
and GND must be as short as possible.
Source pin of the internal High Side FET. This is a switching node. Attached this
VSW 8 15, 16 O
pin to an inductor and the cathode of the external diode.
7 Specifications
7.1 Absolute Maximum Ratings
over recommended operating junction temperature range of 40C to 125C (unless otherwise noted) (1) (2)
MIN MAX UNIT
Supply voltage 45 V
ON/OFF pin voltage, VSH 0.1 6 V
Switch voltage to ground 1 V
Boost pin voltage VSW + 8 V
Feedback pin voltage, VFB 0.3 14 V
Power dissipation Internally limited
Vapor phase (60 s) 215
D package
Infrared (15 s) 220
Lead temperature C
P package (soldering, 10 s) 260
NHN package See AN-1187
Maximum junction temperature, TJ 150 C
Storage temperature, Tstg 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human-body model is a 100-pF capacitor discharged through a 1.5-k resistor into each pin.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) Thermal resistances were simulated on 4-layer JEDEC board.
(3) Junction-to-ambient thermal resistance with approximately 1 square inch of printed-circuit board copper surrounding the leads.
Additional copper area lowers thermal resistance further. See Application Information in the application note accompanying this data
sheet. The value RJA for the WSON (NHN) package is specifically dependent on PCB trace area, trace material, and the number of
layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to AN-1187 Leadless
Leadframe Package (LLP).
(1) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator performance. When the LM2675 is used as shown in Figure 19 test circuits, system performance is as specified by
the system parameters section of Electrical Characteristics.
(2) All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits
at temperature extremes are specified through correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
(3) Typical numbers are at 25C and represent the most likely norm.
(1) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator performance. When the LM2675 is used as shown in Figure 19 test circuits, system performance is as specified by
the system parameters section of Electrical Characteristics.
(2) All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits
at temperature extremes are specified through correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
(3) Typical numbers are at 25C and represent the most likely norm.
(1) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator performance. When the LM2675 is used as shown in Figure 19 test circuits, system performance is as specified by
the system parameters section of Electrical Characteristics.
(2) All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits
at temperature extremes are specified through correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
(3) Typical numbers are at 25C and represent the most likely norm.
(1) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator performance. When the LM2675 is used as shown in Figure 19 test circuits, system performance is as specified by
the system parameters section of Electrical Characteristics.
(2) All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits
at temperature extremes are specified through correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
(3) Typical numbers are at 25C and represent the most likely norm.
(1) All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits
at temperature extremes are specified through correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25C and represent the most likely norm.
Figure 11. Feedback Pin Bias Current Figure 12. Peak Switch Current
Figure 13. Dropout Voltage, 3.3-V Option Figure 14. Dropout Voltage, 5-V Option
VSW pin voltage, 10 V/div VIN = 20 V, VOUT = 5 V, VSW pin voltage, 10 V/div VIN = 20 V, VOUT = 5 V,
Inductor current, 0.5 A/div ILOAD = 1 A, L = 47 H, Inductor current, 0.5 A/div ILOAD = 300 mA, L = 15 H,
Output ripple voltage, COUT = 68 F, Output ripple voltage, COUT = 68 F (2),
20 mV/div AC-coupled COUTESR = 50 m 20 mV/div AC-coupled COUTESR = 25 m
Figure 15. Continuous Mode Switching Waveforms, Figure 16. Discontinuous Mode Switching Waveforms,
Horizontal Time Base: 1 s/div Horizontal Time Base: 1 s/div
Output voltage, 100 mV/div, VIN = 20 V, VOUT = 5 V, Output voltage, 100 mV/div, VIN = 20 V, VOUT = 5 V,
AC-coupled ILOAD = 1 A, L = 47 H, AC-coupled L = 47 H,
Load current: 200-mA COUT = 68 F, Load current: 100-mA COUT = 68 F (2),
to 1-A load pulse COUTESR = 50 m to 400-mA load pulse COUTESR = 50 m
Figure 17. Load Transient Response for Continuous Mode, Figure 18. Load Transient Response for Discontinuous
Horizontal Time Base: 50 s/div Mode, Horizontal Time Base: 200 s/div
8 Detailed Description
8.1 Overview
The LM2675 provides all of the active functions required for a step-down (buck) switching regulator. The internal
power switch is a DMOS power MOSFET to provide power supply designs with high current capability, up to 1 A,
and highly efficient operation. The LM2675 is part of the SIMPLE SWITCHER family of power converters. A
complete design uses a minimum number of external components, which have been predetermined from a
variety of manufacturers. Using either this data sheet or TI's WEBENCH design tool, a complete switching
power supply can be designed quickly. See LM2670 SIMPLE SWITCHER High Efficiency 3A Step-Down
Voltage Regulator with Sync for additional application information.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Figure 20. RMS Current Ratings for Low ESR Electrolytic Capacitors (Typical)
For an aluminum electrolytic capacitor, the voltage rating must be at least 1.25 times the maximum input voltage.
Caution must be exercised if solid tantalum capacitors are used. The tantalum capacitor voltage rating must be
twice the maximum input voltage. Table 3 shows the recommended application voltage for AVX TPS and
Sprague 594D tantalum capacitors. TI also recommends that they be surge current tested by the manufacturer.
The TPS series available from AVX, and the 593D and 594D series from Sprague are all surge current tested.
Another approach to minimize the surge current stresses on the input capacitor is to add a small inductor in
series with the input supply line.
Use caution when using ceramic capacitors for input bypassing, because it may cause severe ringing at the VIN
pin.
The important parameters for the input capacitor are the input voltage rating and the RMS current rating. With a
maximum input voltage of 12 V, an aluminum electrolytic capacitor with a voltage rating greater than 15 V
(1.25 VIN) would be needed. The next higher capacitor voltage rating is 16 V.
The RMS current rating requirement for the input capacitor in a buck regulator is approximately the DC load
current. In this example, with a 1-A load, a capacitor with a RMS current rating of at least 500 mA is needed. The
curves shown in Figure 20 can be used to select an appropriate input capacitor. From the curves, locate the 16-V
line and note which capacitor values have RMS current ratings greater than 500 mA.
For a through hole design, a 330-F, 16-V electrolytic capacitor (Panasonic HFQ series, Nichicon PL, Sanyo MV-
GX series or equivalent) would be adequate. Other types or other manufacturers' capacitors can be used
provided the RMS ripple current ratings are adequate. Additionally, for a complete surface mount design,
electrolytic capacitors such as the Sanyo CV-C or CV-BS and the Nichicon WF or UR and the NIC Components
NACZ series could be considered.
For surface-mount designs, solid tantalum capacitors can be used, but caution must be exercised with regard to
the capacitor surge current rating and voltage rating. In this example, checking Table 5, and the Sprague 594D
series data sheet, a Sprague 594D 15-F, 25-V capacitor is adequate.
Figure 21. LM2675, 3.3-V Output Figure 22. LM2675, 5-V Output
where
VREF = 1.21 V (1)
Select R1 to be 1 k, 1%. Solve for R2 using Equation 2.
V 20 V
R2 R1 OUT 1 1k: 1
VREF 1.23 V (2)
Select a value for R1 between 240 and 1.5 k. The lower resistor values minimize noise pickup in the sensitive
feedback pin. For the lowest temperature coefficient and the best stability with time, use 1% metal film resistors
with Equation 3.
V
R 2 R1 OUT 1
VREF (3)
R2 = 1k (16.53 1) = 15.53 k, closest 1% value is 15.4 k.
R2 = 15.4 k.
where
VSAT = internal switch saturation voltage = 0.25 V
VD = diode forward voltage drop = 0.5 V (4)
Calculate the inductor Volt microsecond constant (E T) with Equation 5.
20 0.5 1000
E u T (28 20 0.25) u u (V u Ps)
28 0.25 0.5 260
20.5
E u T (7.75) u u 3.85(V u Ps)
28.25 (5)
Use the E T value from the previous formula and match it with the E T number on the vertical axis of the
inductor value selection guide in Figure 25. E T = 21.6 (V s).
On the horizontal axis, select the maximum load current (ILOAD(max) = 1 A).
Identify the inductance region intersected by the E T value and the maximum load current value. Each region is
identified by an inductance value and an inductor code (LXX). From the inductor value selection guide shown in
Figure 25, the inductance region intersected by the 21.6 (V s) horizontal line and the 1-A vertical line is
68 H, and the inductor code is L30.
Select an appropriate inductor from the four manufacturer's part numbers listed in Table 2. For information on the
different types of inductors, see the inductor selection in the fixed output voltage design procedure. From
Table 2, locate line L30, and select an inductor part number from the list of manufacturers' part numbers.
Select an appropriate capacitor value and voltage rating, using the capacitor code, from the output capacitor
selection table in Table 8. There are two solid tantalum (surface mount) capacitor manufacturers and four
electrolytic (through hole) capacitor manufacturers to choose from. TI recommends using both the manufacturers
and the manufacturer's series that are listed in Table 8. From Table 8, choose a capacitor value (and voltage
rating) that intersects the capacitor code(s) selected in section A, C20. The capacitance and voltage rating
values corresponding to the capacitor code C20 are the surface mount and through hole.
Surface mount:
33-F, 25-V Sprague 594D Series
33-F, 25-V AVX TPS Series
Through hole:
33-F, 25-V Sanyo OS-CON SC Series
120-F, 35-V Sanyo MV-GX Series
120-F, 35-V Nichicon PL Series
120-F, 35-V Panasonic HFQ Series
Other manufacturers or other types of capacitors may also be used, provided the capacitor specifications
(especially the 100-kHz ESR) closely match the characteristics of the capacitors listed in the output capacitor
table. See the capacitor manufacturers' data sheet for this information.
Use caution when using ceramic capacitors for input bypassing, because it may cause severe ringing at the VIN
pin.
The important parameters for the input capacitor are the input voltage rating and the RMS current rating. With a
maximum input voltage of 28 V, an aluminum electrolytic capacitor with a voltage rating of at least 35 V (1.25
VIN) would be needed.
The RMS current rating requirement for the input capacitor in a buck regulator is approximately the DC load
current. In this example, with a 1-A load, a capacitor with a RMS current rating of at least 500 mA is needed. The
curves shown in Figure 20 can be used to select an appropriate input capacitor. From the curves, locate the 35-V
line and note which capacitor values have RMS current ratings greater than 500 mA.
For a through hole design, a 330-F, 35-V electrolytic capacitor (Panasonic HFQ series, Nichicon PL, Sanyo MV-
GX series or equivalent) would be adequate. Other types or other manufacturers' capacitors can be used
provided the RMS ripple current ratings are adequate. Additionally, for a complete surface mount design,
electrolytic capacitors such as the Sanyo CV-C or CV-BS, and the Nichicon WF or UR and the NIC Components
NACZ series could be considered.
For surface mount designs, solid tantalum capacitors can be used, but caution must be exercised with regard to
the capacitor surge current rating and voltage rating. In this example, checking Table 5, and the Sprague 594D
series data sheet, a Sprague 594D 15-F, 50-V capacitor is adequate.
11 Layout
12.4 Trademarks
E2E is a trademark of Texas Instruments.
SIMPLE SWITCHER is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
LDA16A (REV A)
www.ti.com
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