Beruflich Dokumente
Kultur Dokumente
Order Information
Example:AC-9675-B-#
Example:AC-96 1 - 2 - 3
1 Hight (mm)
2 Anodising Color
B-Black
C-Clear
Z-Custom
MingFa recommends the use of a high thermal conductive interface between the LED
module and the LED cooler. Either thermal grease,a thermal pad or a phase change thermal pad
thickness 0.1-0.15mm is recommended.
Heat sink to ambient Heat sink to ambient Heat sink to ambient temperature rise Ths-amb(C) ta=25C
thermal resistance temperature rise
Pd = Pe x Rhs-amb (C/W) Ths-amb (C)
(1-L) 70
Heat sink rise above ambient(C)
AC-9675 AC-9675
60
50 0.24 13
50
75 0.24 19
Dissipated Power Pd(W)
40
100 0.24 25
30
120 0.24 35
20
150 0.24 38
10
175 0.24 44.2