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MAX232E
SLLS723C APRIL 2006 REVISED AUGUST 2016
5V POWER
2 2 DOUT
DIN TX
RS-232
2 2 RIN
ROUT RX
RS-232
Copyright 2016, Texas Instruments Incorporated
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MAX232E
SLLS723C APRIL 2006 REVISED AUGUST 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.1 Overview ................................................................... 9
2 Applications ........................................................... 1 8.2 Functional Block Diagram ......................................... 9
3 Description ............................................................. 1 8.3 Feature Description................................................... 9
8.4 Device Functional Modes........................................ 10
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3 9 Applications and Implementation ...................... 11
9.1 Application Information............................................ 11
6 Specifications......................................................... 4
9.2 Typical Application .................................................. 11
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4 10 Power Supply Recommendations ..................... 13
6.3 Recommended Operating Conditions....................... 4 11 Layout................................................................... 13
6.4 Thermal Information .................................................. 4 11.1 Layout Guidelines ................................................. 13
6.5 Electrical Characteristics........................................... 5 11.2 Layout Example .................................................... 13
6.6 Electrical Characteristics: Driver ............................... 5 12 Device and Documentation Support ................. 14
6.7 Electrical Characteristics: Receiver .......................... 5 12.1 Receiving Notification of Documentation Updates 14
6.8 Switching Characteristics: Driver .............................. 5 12.2 Community Resources.......................................... 14
6.9 Switching Characteristics: Receiver.......................... 6 12.3 Trademarks ........................................................... 14
6.10 Typical Characteristics ............................................ 6 12.4 Electrostatic Discharge Caution ............................ 14
7 Parameter Measurement Information .................. 7 12.5 Glossary ................................................................ 14
8 Detailed Description .............................................. 9 13 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Deleted "30-V Input Levels" from Features ......................................................................................................................... 1
Deleted Ordering Information table; see POA at the end of the data sheet ......................................................................... 1
Added MIN value 3 to "Receiver input voltage (RIN1, RIN2) row in Recommended Operating Conditions ....................... 4
Changed RJA values in Thermal Information ......................................................................................................................... 4
Deleted table note 3 from Receiver Section Electrical Characteristics ................................................................................. 5
Added a new row to the Function Table for Each Receiver ................................................................................................ 10
D, DW, N, or PW Package
Add 16-Pin SOIC, PDIP, or TSSOP
Top View
C1+ 1 16 VCC
VS+ 2 15 GND
C1 3 14 DOUT1
C2+ 4 13 RIN1
C2 5 12 ROUT1
VS 6 11 DIN1
DOUT2 7 10 DIN2
RIN2 8 9 ROUT2
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
1 C1+ Positive lead of C1 capacitor
2 VS+ O Positive charge pump output for storage capacitor only
3 C1 Negative lead of C1 capacitor
4 C2+ Positive lead of C2 capacitor
5 C2 Negative lead of C2 capacitor
6 VS O Negative charge pump output for storage capacitor only
7 DOUT2 O RS-232 line data output (to remote RS-232 system)
8 RIN2 I RS-232 line data input (from remote RS-232 system)
9 ROUT2 O Logic data output (to UART)
10 DIN2 I Logic data input (from UART)
11 DIN1 I Logic data input (from UART)
12 ROUT1 O Logic data output (to UART)
13 RIN1 I RS-232 line data input (from remote RS-232 system)
14 DOUT1 O RS-232 line data output (to remote RS-232 system)
15 GND Ground
16 VCC Supply voltageconnect to external 5-V power supply
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
(2)
VCC Input supply voltage 0.3 6 V
VS+ Positive output supply voltage VCC 0.3 15 V
VS Negative output supply voltage 0.3 15 V
Driver 0.3 VCC + 0.3
VI Input voltage V
Receiver 30
DOUT VS 0.3 VS+ + 0.3
VO Output voltage V
ROUT 0.3 VCC + 0.3
Short-circuit duration DOUT Unlimited
TJ Operating virtual junction temperature 150 C
Tstg Storage temperature 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) Maximum power dissipation is a function of TJ(max), RJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) TA)/RJA. Operating at the absolute maximum TJ of 150C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
4 Submit Documentation Feedback Copyright 20062016, Texas Instruments Incorporated
8 0.8
7 VOH
6 VOL
5
4 0.6
DOUT Voltage (V)
Figure 1. Driver Output Voltage vs Load Resistance Figure 2. Receiver Low Output Voltage vs Load Current
6 12
DIN
10
DOUT
5 8 ROUT
6
ROUT Voltage (V)
4
Waveform (V)
4
2
3
0
-2
2
-4
1 -6
-8
0 -10
0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20
ROUT Current (mA) D003
Time (us) D004
Figure 3. Receiver High Output Voltage vs Load Current Figure 4. Loopback Waveforms
Data Rate 120 kbit/s
RL = 1.3 kW
CL = 50 pF
(see Note B)
TEST CIRCUIT
10 ns 10 ns
3V
90% 90%
Input 50% 50%
10% 10%
0V
500 ns
tPLH
tPHL
VOH
Output 1.5 V 1.5 V
VOL
WAVEFORMS
A. The pulse generator has the following characteristics: ZO = 50 , duty cycle 50%.
B. CL includes probe and jig capacitance.
C. All diodes are 1N3064 or equivalent.
Figure 5. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements
TEST CIRCUIT
10 ns 10 ns
3V
90% 90%
Input 50% 50%
10% 10%
0V
5 ms
tPLH
tPHL
90% VOH
90%
Output
10% 10%
VOL
tTHL tTLH
0.8 (V V ) 0.8 (V V )
OH OL OL OH
SR or
t t
TLH THL
WAVEFORMS
A. The pulse generator has the following characteristics: ZO = 50 , duty cycle 50%.
B. CL includes probe and jig capacitance.
Figure 6. Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-s Input)
Pulse
Generator DIN DOUT
RS-232 Output
(see Note A)
3 kW CL = 2.5 nF
TEST CIRCUIT
10 ns 10 ns
Input
90% 90%
10% 1.5 V 1.5 V 10%
20 ms
tTLH
tTHL
VOH
3V 3V
Output
3 V 3 V
VOL
6V
SR
tTHL or t TLH
WAVEFORMS
A. The pulse generator has the following characteristics: ZO = 50 , duty cycle 50%.
Figure 7. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-s Input)
8 Detailed Description
8.1 Overview
The MAX232E device is a dual driver and receiver that includes a capacitive voltage generator using four
capacitors to supply TIA/EIA-232-F voltage levels from a single 5-V supply. All RS-232 pins have 15-kV HBM
and IEC61000-4-2 Air-Gap discharge protection. RS-232 pins also have 8-kV IEC61000-4-2 contact discharge
protection. Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels. These receivers have shorted
and open fail safe. The receiver can accept up to 30-V inputs and decode inputs as low as 3 V. Each driver
converts TTL/CMOS input levels into TIA/EIA-232-F levels. Outputs are protected against shorts to ground.
5V POWER
2 2 DOUT
DIN TX
RS-232
2 2 RIN
ROUT RX
RS-232
Copyright 2016, Texas Instruments Incorporated
11 14
DIN1 DOUT1
10 7
DIN2 DOUT2
12 13
ROUT1 RIN1
9 8
ROUT2 RIN2
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
5V
+
CBYPASS = 1 mF
16
C3 1 mF
VCC
1 2
C1+ 8.5 V
C1 1 mF 3 VS+
C1
4 6
C2+ VS 8.5 V
C2 1 mF 5 C4 1 mF
C2 +
11 14
RS-232 Output
From CMOS or TTL
10 7
RS-232 Output
12 13
RS-232 Input
To CMOS or TTL
9 8
RS-232 Input
0V
15
GND
C3 can be connected to VCC or GND.
Copyright 2016, Texas Instruments Incorporated
4
2
0
-2
-4
-6
-8
-10
0 5 10 15 20
Time (us) D005
11 Layout
Ground
C3
1 C1+ VCC 16 VCC
PF
C1 2 V+ GND 15 Ground
3 C1- DOUT1 14
4 C2+ RIN1 13
C2
5 C2- ROUT1 12
Ground 6 V- DIN1 11
C4
7 DOUT2 DIN2 10
8 RIN2 ROUT2 9
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 11-Mar-2016
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 11-Mar-2016
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
MAX232EIDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232EI
& no Sb/Br)
MAX232EIN ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 85 MAX232EIN
(RoHS)
MAX232EINE4 ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 85 MAX232EIN
(RoHS)
MAX232EIPW ACTIVE TSSOP PW 16 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB232EI
& no Sb/Br)
MAX232EIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB232EI
& no Sb/Br)
MAX232EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB232EI
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 11-Mar-2016
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2016
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2016
Pack Materials-Page 2
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