Beruflich Dokumente
Kultur Dokumente
Contents
1 Component Placing (Primary Side) .............................................................................. 2
2 Component Placing (Secondary Side)........................................................................... 3
3 Component Baking ......................................................................................................... 4
4 PCB Components............................................................................................................ 5
5 Revision History.............................................................................................................. 6
D201*
D400
D800
N340
* N341
* D610 D620*
* D630 D600*
S660
X722
* CALIBRATION REQUIRED
131 22-2/FEA 209 544/90 E 2(6)
Company Internal Sony Ericsson Mobile Communications AB
Part List, Electrical
S700
J300
X501
X761
N652
S392
X700
J370
* N650
J650
* CALIBRATION REQUIRED
131 22-2/FEA 209 544/90 E 3(6)
Company Internal Sony Ericsson Mobile Communications AB
Part List, Electrical
3 Component Baking
Some components in this part list contain the following note in their comments column: MSL X; Part
must be baked prior to use. The presence of this note indicates that the component is moisture sensitive
and must be baked prior to use. There are different levels of moisture sensitivity at which a component may
be rated. Below is a list explaining the various levels of moisture sensitivity.
Level 1 unlimited floor life; does not require dry pack or re-baking.
Level 2 1 year floor life; </=30 C; 60% relative humidity (rh); shipped in dry pack; must be re-baked
after being opened if floor life is exceeded.
Level 2A 4 weeks floor life; </=30 C; 60% rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 3 168 hours floor life; </=30 C; 60% rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 4 72 hours floor life; </=30 C; 60% rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
More detailed information may be found in the most recent version of the IPC/JEDEC J-STD-033A
standard. The standard is available online at http://www.jedec.org/.
4 PCB Components
P = Primary Side, S = Secondary Side
Side Pos Description Part Number Comments
Ingela ROP1011101/2CR2A
ONLY for TAC
For use with P910i
number 35423400 and
and P910c 35423500 MSL 3; Part must be baked prior to
Karolina use
ROP1011191/1R1A
For use with P910a Calibration Required
P D201
Ingela BGA Equipment with Split Vision
For use with P910i ROP1013050/1 Required
and P910c ONLY for TAC
TAC number number 35582600
35582600 and and 35582700
35582700
MSL 3; Part must be baked prior to
use
P D600 RITA ROP1011186/1 Calibration Required
BGA Equipment with Split Vision
Required
MSL 3; Part must be baked prior to
use
P D630 HW SDRAM RYT119904/1 Calibration Required
BGA Equipment with Split Vision
Required
MSL 2; Part must be baked prior to
use
P D800 Irma RYT123907/6
BGA Equipment with Split Vision
Required
P H391 Green / Red LED RKZ433666/1
Rear Speaker
S J300 RPT79927/1
Connector
Front Speaker
P J303 RPT79940
Connector
S J370 SIM Connector RNK86043/1 Large Hot Air Device Required
S J650 System Connector RNV403180/1
MSL 3; Part must be baked prior to
use
P N260 MMIC PA GSM/DCS RYT 101 913/1
BGA Equipment with Split Vision
Required
MSL 3; Part must be baked prior to
use
P N340 Herta ROP1011120/7C
BGA Equipment with Split Vision
Required
MSL 3; Part must be baked prior to
use
P N341 Tjatte ROP1013010/CR1A Calibration Required
BGA Equipment with Split Vision
Required
5 Revision History
Rev. Date Changes / Comments
A 2004-08-10 Initial Release
B 2004-10-12 Display Assembly only available on Electrical level
C 2004-11-15 D400, D610 and D620 not available as spare part.
D 2004-12-20 Touch Screen added, to repair LCD Assembly (on mechanical level)
E 2005-02-08 New part added, D201 for TAC number 35582600 and 35582700