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Atmel-0896E-FPGA-AT40K05-10-20-40-Datasheet_062013
Table 1. AT40K Series Family(1)
Rows x Columns 16 x 16 24 x 24 32 x 32 48 x 48
1. Description
The AT40K is a family of fully PCI-compliant, SRAM-based FPGAs with distributed 10ns programmable
synchronous/asynchronous, dual-port/single-port SRAM, eight global clocks, Cache Logic ability (partially or fully
reconfigurable without loss of data), automatic component generators, and range in size from 5,000 to 50,000 usable
gates. I/O counts range from 128 to 384 in industry standard packages ranging from 84-pin PLCC to 352-ball Square
BGA, and support 5V designs for AT40K.
The AT40K is designed to quickly implement high-performance, large gate count designs through the use of synthesis,
and schematic-based tools used on a PC or Sun platform. Atmels design tools provide seamless integration with
industry standard tools such as Synplicity, ModelSim, Exemplar and Viewlogic.
The AT40K can be used as a coprocessor for high-speed (DSP/processor-based) designs by implementing a variety of
computation intensive, arithmetic functions. These include adaptive finite impulse response (FIR) filters, fast Fourier
transforms (FFT), convolvers, interpolators and discrete-cosine transforms (DCT) that are required for video
compression and decompression, encryption, convolution, and other multimedia applications.
RV = Vertical Repeater
RH = Horizontal Repeater
= Core Cell
RH RH RH RH
RH RH RH RH
RH RH RH RH
RH RH RH RH
RH RH RH RH
RH RH RH RH
RH RH RH RH
RH RH RH RH
RH RH RH RH
RH RH RH RH
RH RH RH RH
RH RH RH RH
Note: 1. Repeaters regenerate signals and can connect any bus to any other bus (all pathways are legal) on the
same plane. Each repeater has connections to two adjacent local-bus segments and two express-bus
segments. This is done automatically using the Integrated Development System (IDS) tool.
Horizontal and
Cell Output Enable Local 5
Vertical
= Row Repeater
Express Express
Bus Local Bus
Bus
Plane 5
Plane 4
Plane 3
Plane 2
Plane 1
CELL CELL CELL
Plane 5
Plane 4
Horizontal
Plane 3
Busing Plane
Plane 2
Plane 1
WXYZL
W
X
Y CELL
CELL CELL CELL Z
L
Diagonal Vertical
Direct Connect Busing Plane
5. The Cell
Figure 5-1 depicts the AT40K cell. Configuration bits for separate muxes and pass gates are independent. All
permutations of programmable muxes and pass gates are legal. Vn (V1 V5) is connected to the vertical local bus in
plane n. Hn (H1 H5) is connected to the horizontal local bus in plane n. A local/local turn in plane n is achieved by
turning on the two pass gates connected to Vn and Hn. Pass gates are opened to let signals into the cell from a local bus
or to drive a signal out onto a local bus. Signals coming into the logic cell on one local bus plane can be switched onto
another plane by opening two of the pass gates. This allows bus signals to switch planes to achieve greater route ability.
Up to five simultaneous local/local turns are possible.
The AT40K FPGA core cell is a highly configurable logic block based around two 3-input LUTs (8 x 1 ROM), which can
be combined to produce one 4-input LUT. This means that any core cell can implement two functions of three inputs or
one function of four inputs. There is a Set/Reset D flip-flop in every cell, the output of which may be tri-stated and fed
back internally within the core cell. There is also a 2-to-1 multiplexer in every cell, and an upstream AND gate in the front
end of the cell. This AND gate is an important feature in the implementation of efficient array multipliers.
With this functionality in each core cell, the core cell can be configured in several modes. The core cell flexibility makes
the AT40K architecture well suited to most digital design application areas, see Figure 5-2.
X W Y
Z X W Y
FB
OUT OUT
"1"
"0" "1"
V1 V2 V3 V4 V5
H1 H2 H3 H4 H5
1 0 Pass gates
Z "1" OEH OEV L
D CLOCK
Q RESET/SET
X Y
NW NE SE SW N E S W
LUT
B Q (Registered)
C DQ tools generally will produce as their output large amounts
D and/or of random logic functions. Having a 4-input LUT structure
Q gives efficient random logic optimization without the
delays associated with larger LUT structures. The output
of any cell may be registered, tri-stated and/or fed back
into a core cell.
SUM Arithmetic Mode is frequently used in many designs.
As can be seen in the figure, the AT40K core cell can
LUT
or
implement a 1-bit full adder (2-input adder with both Carry
A In and Carry Out) in one core cell. Note that the sum
DQ SUM (Registered)
B output in this diagram is registered. This output could then
C and/or be tri-stated and/or fed back into the cell.
LUT
CARRY
CARRY
CARRY
CLK
CLK
CLK
CLK
Din Dout
Ain Aout
32 x 4 RAM
WEN
OEN CLK
Reading and writing of the 10ns 32 x 4 dual-port FreeRAM are independent of each other. Reading the 32 x 4 dual-port
RAM is completely asynchronous. Latches are transparent; when Load is Logic 1, data flows through; when Load is
Logic 0, data is latched. These latches are used to synchronize Write Address, Write Enable Not, and Din signals for a
synchronous RAM. Each bit in the 32 x 4 dual-port RAM is also a transparent latch. The front-end latch and the memory
latch together form an edge-triggered flip flop. When a nibble (bit = 7) is (Write) addressed and LOAD is Logic 1 and WE
is Logic 0, data flows through the bit. When a nibble is not (Write) addressed or LOAD is logic 0 or WE is Logic 1, data is
latched in the nibble. The two CLOCK muxes are controlled together; they both select CLOCK (for a synchronous RAM)
or they both select 1 (for an asynchronous RAM). CLOCK is obtained from the clock for the sector-column immediately
to the left and immediately above the RAM block. Writing any value to the RAM clear byte during configuration clears the
RAM (see the AT40K Configuration Series application note at www.atmel.com).
0 1 1 0
Load
5
Ain Read Address
5 Load
Aout Latch Write Address
32 x 4
Dual-port
Load RAM 1 OE
WEN Latch Write Enable NOT
4 Load 4
Din Latch Din Dout Dout
Clear
RAM-Clear Byte
Figure 6-3 shows an example of a RAM macro constructed using the AT40Ks FreeRAM cells. The macro shown is a
128 x 8 dual-ported asynchronous RAM. Note the very small amount of external logic required to complete the address
decoding for the macro. Most of the logic cells (core cells) in the sectors occupied by the RAM will be unused: they can
be used for other logic in the design. This logic can be automatically generated using the macro generators.
Din(0) Dout(0)
Din(1) Dout(1)
Din(2) Dout(2)
Din(3) Dout(3)
Din Dout Din Dout Din Dout Din Dout
Ain Aout Aout Ain Ain Aout Aout Ain
Din(4) Dout(4)
Din(5) Dout(5)
Din(6) Dout(6)
Din(7) Dout(7)
Din Dout Din Dout Din Dout Din Dout
Ain Aout Aout Ain Ain Aout Aout Ain
Local Buses
WEN WEN WEN WEN
OEN OEN OEN OEN
Express Buses
Dedicated Connections
Atmel-0896E-FPGA-AT40K05-10-20-40-Datasheet_062013
Atmel AT40K Series FPGA [DATASHEET]
13
7. Clocking Scheme
There are eight Global Clock buses (GCK1 GCK8) on the AT40K FPGA. Each of the eight dedicated Global Clock
buses is connected to one of the dual-use Global Clock pins. Any clocks used in the design should use global clocks
where possible: this can be done by using Assign Pin Locks to lock the clocks to the Global Clock locations. In addition to
the eight Global Clocks, there are four Fast Clocks (FCK1 FCK4), two per edge column of the array for PCI
specification.
Each column of an array has a Column Clock mux and a Sector Clock mux. The Column Clock mux is at the top of
every column of an array and the Sector Clock mux is at every four cells. The Column Clock mux is selected from one of
the eight Global Clock buses. The clock provided to each sector column of four cells is inverted, non-inverted or tied off to
0, using the Sector Clock mux to minimize the power consumption in a sector that has no clocks. The clock can either
come from the Column Clock or from the Plane 4 express bus, see Figure 7-1. The extreme-left Column Clock mux has
two additional inputs, FCK1 and FCK2, to provide fast clocking to left-side I/Os. The extreme-right Column Clock mux
has two additional inputs as well, FCK3 and FCK4, to provide fast clocking to right-side I/Os.
The register in each cell is triggered on a rising clock edge by default. Before configuration on power-up, constant 0 is
provided to each registers clock pins. After configuration on power-up, the registers either set or reset, depending on the
users choice.
The clocking scheme is designed to allow efficient use of multiple clocks with low clock skew, both within a column and
across the core cell array.
Express Bus
(Plane 4; Half Length at Edge)
1
Repeater
Sector Clock Mux
Repeater
1
Express Bus
(Plane 5; Half Length at Edge)
9.1 PAD
The I/O pad is the one that connects the I/O to the outside world. Note that not all I/Os have pads: the ones without pads
are called Unbonded I/Os. The number of unbonded I/Os varies with the device size and package. These unbonded I/Os
are used to perform a variety of bus turns at the edge of the array.
9.2 PULL-UP/PULL-DOWN
Each pad has a programmable pull-up and pull-down attached to it. This supplies a weak 1 or 0 level to the pad pin.
When all other drivers are off, this control will dictate the signal level of the pad pin.
The input stage of each I/O cell has a number of parameters that can be programmed either as properties in schematic
entry or in the I/O Pad Attributes editor in IDS.
9.3 TTL/CMOS
The threshold level can be set to either TTL/CMOS-compatible levels.
9.4 SCHMITT
A Schmitt trigger circuit can be enabled on the inputs. The Schmitt trigger is a regenerative comparator circuit that adds
1V hysteresis to the input. This effectively improves the rise and fall times (leading and trailing edges) of the incoming
signal and can be useful for filtering out noise.
9.5 DELAYS
The input buffer can be programmed to include four different intrinsic delays as specified in the AC timing characteristics.
This feature is useful for meeting data hold requirements for the input signal.
9.6 DRIVE
The output drive capabilities of each I/O are programmable. They can be set to FAST, MEDIUM or SLOW (using IDS
tool). The FAST setting has the highest drive capability (20mA at 5V) buffer and the fastest slew rate. MEDIUM produces
a medium drive (14mA at 5V) buffer, while SLOW yields a standard (6mA at 5V) buffer.
9.7 TRI-STATE
The output of each I/O can be made tri-state (0, 1, or Z), open source (1 or Z) or open drain (0 or Z) by programming an
I/Os Source Selection mux. Of course, the output can be normal (0 or 1), as well.
CELL
TRI-STATE
0
1
VCC
DRIVE
0
PULL-UP
PAD 1
CELL
PULL-DOWN
SOURCE
SELECT MUX
TTL/CMOS
SCHMITT
DELAY
GND
CELL
0
1
VCC
CELL
DRIVE
PULL-UP 0
1
PAD
PULL-DOW
TTL/CMOS
SCHMITT
DELAY
CELL
CELL
TRI-STATE
0
1
VCC
DRIVE
0
PULL-UP
1
PAD
CELL
PULL-DOWN
SOURCE SELECT MUX
TTL/CMOS
SCHMITT
DELAY
GND
0
1
VCC
DRIVE
CELL
PULL-UP 0
1
PAD
PULL-DOWN
SOURCE SELECT MUX
TTL/CMOS
SCHMITT
DELAY
GND
CELL
PULL-DOWN
PULL-DOWN
PULL-UP
PULL-UP
PAD PAD
TTL/CMOS TTL/CMOS
DRIVE DRIVE
SCHMITT SCHMITT
TRI-STATE TRI-STATE
DELAY DELAY
0
1
0
1
0
1
1
TRI-STATE
0
1
VCC
DRIVE
0
PULL-UP
1
PAD
CELL CELL
PULL-DOWN
TTL/CMOS
SCHMITT
DELAY
GND
CELL
Operating Temperature . . . . . . . . . . . . . . . . . . -55C to 125C *Notice: Stresses beyond those listed under
Absolute Maximum Ratings may cause
Storage Temperature . . . . . . . . . . . . . . . . . . . -65C to 150C permanent damage to the device. This is a
stress rating only and functional operation
Voltage on Any Pin of the device at these or any other
with Respect to Ground . . . . . . . . . . . . . . . . -0.5V to VCC 7.0V conditions beyond those listed under
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V operating conditions is not implied.
Exposure to Absolute Maximum Rating
Maximum Soldering Temp. (10 sec. @ 1/16 in.) . . . . . . 250C conditions for extended periods of time may
affect device reliability.
ESD (RZAP = 1.5K, CZAP = 100pF) . . . . . . . . . . . . . . . . . 2000V
High (VIHC) 70% to 100% VCC 70% to 100% VCC 70% to 100% VCC
Input Voltage Level (CMOS)
Low (VILC) 0 to 30% VCC 0 to 30% VCC 0 to 30% VCC
Ind. = 3.15
IOH = 6mA
4.0 V
VCC = VCC Minimum
Con = 3.325
Ind. = 3.15
IOH = 14mA
VOH High-level Output Voltage 4.0 V
VCC = VCC Minimum
Con = 3.325
IOL = -6mA
Commercial = 4.75V 0.4 V
Industrial/Military = 4.5V
IOL = -14mA
VOL Low-level Output Voltage Commercial = 4.75V 0.4 V
Industrial/Military = 4.5V
IOL = -20mA
Commercial = 4.75V 0.4 V
Industrial/Military = 4.5V
Standby Current
ICC Standby, unprogrammed 0.6 1.0 mA
Consumption
Core
Repeaters
All input IO characteristics measured from a VIH of 50% at the pad (CMOS threshold) to the internal VIH of 50% of VCC.
All output IO characteristics are measured as the average of tPDLH and tPDHL to the pad VIH of 50% of VCC.
IO
Async RAM
Sync RAM
tWEL
WE
tAWS
tAWH
0 1 2 3
ADDR
tOH
OE
tOXZ tDS tDH tOZX tAD
DATA
tWECYC
tWEL tWEH
WE
tAWS
tAWH
0 1 2
WR ADDR
tDH
PREV. NEW
WR DATA
tDD
RD ADDR = WR ADDR 1
tWD
RD ADDR 0 1
OE
tOZX tAD tOXZ
DATA
tCLKH
CLK
tWCS tWCH
WE
tACS tACH
ADDR 0 1 2 3
OE
tOXZ tOZX tAD
tDCS tDCH
DATA
tCYC
tCLKH tCLKL
CLK
tWCS tWCH
WE
tACS tACH
WR ADDR 0 1 2
tDCS tDCH
WR DATA
RD ADDR = WR ADDR 1
tCD
RD DATA
RD ADDR 0 1
OE
tOZX tAD tOXZ
DATA
GND
I/O7
I/O8
I/O9 D25
I/O10 F23
I/O13
I/O14
GND
I/O19
I/O20
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. On-chip tri-state.
GND
I/O31
I/O32
I/O33 J26
I/O34 L23
VCC VCC(1)
I/O37
I/O38
GND
I/O45
I/O46
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. On-chip tri-state.
I/O51
I/O52
GND
I/O59
I/O60
VCC VCC(1)
I/O63
I/O64
I/O65 T24
I/O66 U25
GND
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. On-chip tri-state.
I/O77
I/O78
GND
I/O79
I/O80
I/O87
I/O88
GND
I/O91 AD26
I/O92 AC25
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. On-chip tri-state.
M1 M1 M1 M1 30 25 22 34 38 48 58 231 AB23
M0 M0 M0 M0 32 27 24 36 40 50 60 229 AD24
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. On-chip tri-state.
M2 M2 M2 M2 34 29 26 38 42 56 62 227 AC23
GND
I/O103
I/O104
I/O105 AC21
I/O106 AD21
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package.
They have no direct connection to any specific package pin.
2. This package has an inverted die.
I/O113
I/O114
GND
I/O77 I/O115
I/O78 I/O116
GND
I/O127
I/O128
I/O129 AC16
I/O130 AD16
VCC VCC(1)
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package.
They have no direct connection to any specific package pin.
2. This package has an inverted die.
GND
I/O139
I/O140
I/O141
I/O142
I/O147
I/O148
I/O149
I/O150
GND
VCC VCC(1)
I/O159 AE10
I/O160 AC11
I/O161
I/O162
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package.
They have no direct connection to any specific package pin.
2. This package has an inverted die.
GND
I/O173
I/O174
GND
I/O175
I/O176
I/O185 AE4
I/O186 AC6
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package.
They have no direct connection to any specific package pin.
2. This package has an inverted die.
GND
I/O187
I/O188
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package.
They have no direct connection to any specific package pin.
2. This package has an inverted die.
GND
I/O201
I/O202
I/O209
I/O210
GND
I/O211
I/O212
GND
I/O223 T4
I/O224 T3
I/O225
I/O226
VCC VCC(1)
I/O229
I/O230
GND
I/O237
I/O238
I/O243
I/O244
GND
I/O251
I/O252
VCC VCC(1)
I/O255 K2
I/O256 L4
I/O257
I/O258
GND
I/O177 I/O265 94 H2
I/O178 I/O266 93 H3
I/O269
I/O270
GND
I/O275
I/O276
I/O279 D1
I/O280 C1
I/O281
I/O282
GND
I/O187 I/O283 84 D2
I/O188 I/O284 83 F4
I/O293
I/O294
GND
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. Shared with TSTCLK. No Connect.
I/O295 C5
I/O296 B4
I/O199 I/O299 68 B5
I/O200 I/O300 67 A4
I/O305 C8
I/O306
GND
I/O307
I/O308
I/O208 I/O312 59 C9
I/O213 I/O317 51 A9
GND
I/O319
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. Shared with TSTCLK. No Connect.
I/O320
I/O321 C11
I/O322 B10
VCC VCC(1)
GND
I/O331
I/O332
I/O333
I/O334
I/O339
I/O340
I/O341
I/O342
GND
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. Shared with TSTCLK. No Connect.
VCC VCC(1)
I/O351 D16
I/O352 A18
I/O353
I/O354
GND
I/O365
I/O366
GND
I/O367
I/O368
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. Shared with TSTCLK. No Connect.
I/O375 A24
I/O376 B23
I/O377
I/O378
GND
VCC VCC VCC VCC 11 3 100 144 160 205 240 1 VCC(1)
Notes: 1. Pads labeled GND or VCC are internally bonded to Ground or VCC planes within the package. They have no direct
connection to any specific package pin.
2. This package has an inverted die.
3. Shared with TSTCLK. No Connect.
Package Type
144AA 144-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP)
Industrial
AT40K05-2BQJ(1) 144AA 5,000 10,000 5.0V 2
(-40C to 85C)
D1 D
e
E1 E
b
Top View Bottom View
C 0~7
COMMON DIMENSIONS
A1 A2 A
L
Side View (Unit of Measure = mm)
10/19/2011
TITLE GPC DRAWING NO. REV.
Package Drawing Contact: 144AA, 144-lead, 20 x 20 x 1.4mm Body, 0.50mm
packagedrawings@atmel.com lead pitch, 2.0mm footprint, Low-profile Plastic Quad AEI 144AA D
Flat Package (LQFP)
D1
A2
L1 A1
E1 Side Vi ew
Top Vi ew
D
COMMON DIMENSIONS
(Unit of Measure = mm)
D1
D
E1 E
A1 e
b
L1
COMMON DIMENSIONS
Side View (Unit of Measure = mm)
11/5/08
TITLE GPC DRAWING NO. REV.
Package Drawing Contact: 240Q1, 240-lead, 32 x 32 mm Body,
packagedrawings@atmel.com 2.6 Form Opt, Plastic Quad Flat Pack (PQFP) QSW 240Q1 B
0896C 04/2002
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