Beruflich Dokumente
Kultur Dokumente
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 6
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin 2
or button style batteries
Mercury-containing components For example, mercury in lamps, display backlights, 0
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas 1
than 100 sq cm discharge lamps
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring 0
greater than 2.5 cm in diameter or height
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 0
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos 0
EL-MF877-00 Page 1
Template Revision B
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
Alicia Chien
Standard Operation Procedure
Document No. : CT12 FA DIS ASSY SOP Station : 1(1/1)
Name : Disassemble Battery Ver. : 0.1 Date : 2011/12/13
Step
Before
1. Slide the battery latch to the left, then remove
the battery. (Fig.1)
Battery Latch
1
Fig.1
After
Fig.2
Step
Before 2
1. Slide the cover latch to the left, then remove
the cover. (Fig.1)
Cover Latch
1
Fig.1
After
Fig.2
Before
Step
2 1. Loosen HDD set screw * 3. (Fig.1)
Fig.1
After
Fig.2
Step
1. Loosen screw (6052A0004501) * 2.
2
2. Remove the modem.
1
Step
Before
1. Pull out the CNTR, then remove the bluetooth
and cable.
Fig.1
After
Fig.2
Step
Before
1. Loosen FAN set screw * 2, then remove the
1
FAN. (Fig.1)
Fig.1
After
Fig.2
Step
Step
1. Pull out the stick point FFC and keyboard
FPC. (Fig.2/Fig.3)
Fig.1
Fig.2
Fig.3
Notes : If finding anything uncommon, notice foreman or assistant at once.
Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard) Qty
Step
Intel UMA
1. Loosen thermal screws.
4 2
2
2
4 4
Step
Before
1. Disassemble the CPU by slot screwdriver and
vacuum pen.
Fig.1
After
Fig.2
Step
1. Loosen BTCB screw * 4.
3 2 1
Step
1. Loosen ODD set screw * 1.
Step
1. Loosen the screw (6052B0101901)*2.
1 (Fig.1)
Fig.1
Fig.2
Step
1. Loosen Hinge screw (6052B0155201) * 4.
(Fig.1/Fig.2)
2
Fig.1
Fig.2
Step
1. Loosen BTCB screw (6052B0155201) *4.
1 4
2
3
Step
1. Loosen BTCB screw (6052B0155201) * 4.
1
2
Step
1. Disassemble the BTCB.
Fig.1
Fig.2
Step
1. Remove all DDRs.
Step
1. Loosen WWAN screw * 2.
Step
1. Loosen WLAN screw (6052A0004501) * 2.
Step
1. Pull out LCM CNTR and camera cable CNTR.
(Fig.1)
Fig.1
Fig.2
Step
1. Loosen M/B screw * 3. (Fig.1)
1
3 2. Take out the small battery from routing rib.
(Fig.2)
Fig.1
Fig.2
Step
1. Take out the M/B.
Step
1. Disassemble the 4 cables from routing rib.
(Fig.1)
Fig.1
2
1
Fig.2 Fig.3
Step
1. Have the hinge be vertical by wrench.
Fig.1
Fig.3
Fig.2
Step
1. Disassemble RJ11 cable.
Step
1. Loosen screw (6052A0004501) * 2.(Fig.2)
Fig.1
Fig.2
DO NOT PRESS
Step
1. Inspect the BTCB.
Check the latch. (Fig.1)
Check the bracket. (Fig.2)
Check the thermal pad. (Fig.3)
Fig.1
NO HOT MELT NG
Fig.2 Fig.3