Beruflich Dokumente
Kultur Dokumente
MDU1931
Single N-channel Trench MOSFET 80V, 100A, 3.6m
D
D D D D D D D D
G
S S S G G S S S
PDFN56 S
Thermal Characteristics
Characteristics Symbol Rating Unit
(1)
Thermal Resistance, Junction-to-Ambient RJA 50 o
C/W
Thermal Resistance, Junction-to-Case RJC 1.3
Note :
1. Surface mounted FR-4 board by JEDEC (jesd51-7). Continuous current at TC=25 is silicon limited
2. EAS is tested at starting Tj = 25, L = 1.0mH, IAS = 22.0A, VGS = 10V.
3. T < 10sec.
80 5.0V
3.5
ID, Drain Current [A]
6.0V
70
60 VGS = 10V
VGS = 10V
50 3.0
40
4.0V
30
2.5
20
10
0 2.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 10 20 30 40 50 60 70 80 90 100
1.8 10
Notes : Notes :
1. VGS = 10 V 9
ID = 50.0A
1.6 2. ID = 50.0 A
Drain-Source On-Resistance
Drain-Source On-Resistance
8
RDS(ON), (Normalized)
7
1.4
RDS(ON) [m ],
1.2 5
TA = 25
4
1.0
3
2
0.8
1
0.6 0
-50 -25 0 25 50 75 100 125 150 4 5 6 7 8 9 10
90 100
Notes : Notes :
VGS = 0V
80 VDS = 10V
IDR, Reverse Drain Current [A]
70
ID, Drain Current [A]
60
10
TA=25
50
40 TA=25
30
1
20
10
0
0 1 2 3 4 5 6 7 8 0.0 0.3 0.6 0.9 1.2 1.5
4000
Capacitance [pF]
6
Coss
3000
Notes ;
4 1. VGS = 0 V
2000 2. f = 1 MHz
2 1000 Crss
0
0 0 5 10 15 20 25 30 35 40
0 10 20 30 40 50 60 70
10
3 140
120
10
2 1 ms
100
ID, Drain Current [A]
ID, Drain Current [A]
1s
10s 40
10
0
DC
Single Pulse 20
TJ=Max rated
TC=25
-1
10 0
-1 0 1 2 25 50 75 100 125 150
10 10 10 10
Fig.9 Maximum Safe Operating Area Fig.10 Maximum Drain Current vs.
Case Temperature
10 D=0.5
0
Z JA(t), Thermal Response
0.2
0.1
-1
10 0.05
0.02
-2 0.01
10 Notes :
Duty Factor, D=t 1/t2
single pulse PEAK TJ = PDM * Z JC* R JC(t) + TC
-3
10
-4 -3 -2 -1 0 1 2 3
10 10 10 10 10 10 10 10
t1, Rectangular Pulse Duration [sec]
PDFN56 (5x6mm)
Dimensions are in millimeters, unless otherwise specified
MILLIMETERS
Dimension
Min Max
A 0.90 1.10
b 0.33 0.51
C 0.20 0.34
D1 4.50 5.10
D2 - 4.22
E 5.90 6.30
E1 5.50 6.10
E2 - 4.30
e 1.27BSC
H 0.41 0.71
K 0.20 -
L 0.51 0.71
0 12
DISCLAIMER:
The Products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power
generation, medical appliances, and devices or systems in which malfunction of any Product can reasonably be
expected to result in a personal injury. Sellers customers using or selling Sellers products for use in such
applications do so at their own risk and agree to fully defend and indemnify Seller.
MagnaChip reserves the right to change the specifications and circuitry without notice at any time. MagnaChip does not consider responsibility
for use of any circuitry other than circuitry entirely included in a MagnaChip product. is a registered trademark of MagnaChip
Semiconductor Ltd.