art. no.

HEATSINKS & CASES SURFACES

The information given in this catalogue were established and examined
carefully. Nevertheless, mistakes or printing errors, and especially art. no. HEATSINKS & CASES SURFACES
The information
technical given in and
modifications this catalogue
updating andwereimprovement
established and
of our examined
products,
carefully.
cannot beNevertheless,
excluded. All mistakes or are
printing errors,even
andif especially
technical modifications and
trade marks
updating No
recognised
andidentification
improvementdoes of our
they are not AL raw degreased aluminium
specifically identified or mentioned. notproducts,
imply that
cannot be excluded. All trade marks are recognised even if
a product or trademark is not registered. No part of this catalogue they are not
may AL raw degreased aluminium
specifically identified
be reproduced or mentioned.
or distributed No identification
without prior writtendoes not imply
consent that
of Fischer
a Elektronik.
product or All
trademark is not registered.
data contained No part of in
in this catalogue, thistexts,
catalogue may
illustrations,
BZ raw pickled aluminium
bedocuments
reproduced or distributed without prior written consent of Fischer
Elektronik.
and descriptions are subject to copyright and the provisions
All16016.
data contained in this catalogue, in texts, illustrations,
BZ raw pickled aluminium
of DIN ISO All rights reserved.
documents and descriptions are subject to copyright and the provisions LP outside black lacquered RAL 9005/transparent passivated
ofDIN ISO 16016.
Copyright AllElektronik
Fischer rights reserved.
1969 ... 2014
LP outside black lacquered RAL 9005/transparent passivated
Copyright Fischer Elektronik 1969 ... 2014 ME clear anodised
ME clear anodised
MI solderable surface
MI solderable surface
SA black anodised
SA black anodised
TP chrome-free transparent passivated

TP chrome-free transparent passivated

art. no. CONNECTOR CONTACT SURFACE FINISH

art. no. CONNECTOR CONTACT SURFACE FINISH
G gold-plated
G gold-plated
S selective gold-plated
S selective gold-plated
Z tin-plated
Z tin-plated
Fischer Elektronik GmbH & Co. KG
Postfach 1590
Fischer D-58465
Elektronik Ldenscheid
GmbH & Co. KG
Hausadresse/House
Postfach 1590 D-58465 Address/Adresse
Ldenscheidde domicile
art. no. RAL COLOURS ARTICLES
Nottebohmstr. 28 D-58511
Hausadresse/House Address/Adresse Ldenscheid
de domicile art. no. RAL COLOURS ARTICLES
Telefon: 0 23 51 / 4 35 - 0
Nottebohmstr. 28 D-58511 Ldenscheid
Telefax:
Telefon: 0 23 51 / 4 35 - 0 GO 6026 opal green system cases RackCase/shell cases
Verkauf / sales / ventes
Telefax: GO 6026 opal green system cases RackCase/shell cases
0 23 51 / 4 57 54
Verkauf / sales / ventes K 7032 gravel grey bench cases
Einkauf / purchasing / achats
0 23 51 / 4 57 54
Fischer
0 23 51 / Elektronik
Einkauf
45 94 33
/ purchasing / achats GmbH & Co. KG K 7032 gravel grey bench cases
Export
P.O. / exports
Box 1590 / exports LG 7035 light grey shell cases
Fischer
0 23 51 / Elektronik
45 94 33 GmbH & Co. KG
0 23 51 /Ldenscheid
D-58465 43 51 85
Export
P.O. Box/ exports
1590 / exports LG 7035 light grey shell cases
info@fischerelektronik.de
0 23 51 /Ldenscheid
D-58465 43 51 85
House Address
www.fischerelektronik.de NB 5022 night blue system cases RackCase/shell cases
info@fischerelektronik.de
Nottebohmstr. 28 night blue system cases RackCase/shell cases
House Address
www.fischerelektronik.de
Fischer Elektronik NB 5022
D-58511 Ldenscheid
Nottebohmstr. 28 S 9005 deep black bench cases/shell cases/system cases RackCase
sterreich
Fon:
Fischer +49Ges.
(0) 23m.b.H.
Elektronik 51 4 35 - 0
D-58511 Ldenscheid
Firmiangasse
Fax: sales +4949 - 51
(0) 23 51A -1130 Wien
4 57 54 S 9005 deep black bench cases/shell cases/system cases RackCase
sterreich +49Ges.
(0) 23m.b.H.
f.cool.e 08-2014

Fon: 51 4 35 - 0
Telefon: 01 +49
purchasing / 8 76(0) 62
23 27
51 45 94 33
Firmiangasse
Fax: sales +49 49 (0)
- 5123 51A -1130 Wien
4 57 54 TB 5018 turquoise blue system cases RackCase/shell cases
f.cool.e 08-2014

exports 01 +49
Telefax: / 8 76(0) 62
23 27-11
51 43 51 85
Telefon:
purchasing01 +49
/ 8 76
(0) 62
23 27
51 45 94 33
info@fischerelektronik.de
online@fischerelektronik.co.at TB 5018 turquoise blue system cases RackCase/shell cases
exports 01 +49
Telefax: (0) 62
/ 8 76 23 27-11
51 43 51 85
www.fischerelektronik.de
www.fischerelektronik.at UL 5002 ultramarine blue Plusline/shell cases
info@fischerelektronik.de
online@fischerelektronik.co.at
www.fischerelektronik.de
www.fischerelektronik.at UL 5002 ultramarine blue Plusline/shell cases
Quotations for Fischer Elektronik 3
C-print on Alu Dibond 65,5 x 98 cm

from:
Thomas Kellner
www.thomaskellner.com
 A1
A
A 140

B1
B
B 62

C1
C
C 22

D1
D
D 36

E1
E
E 52

F1
F
F 28

G1
G
G 84

H1
H
H 12

I1
I
I 28

K1
K
K 28

L1
L
L 10

M1
M
M 56

N1
N
N 80
 A1
Extruded profiles:
extruded heatsinks, extruded heatsinks with solder pins, fin coolers, fluid coolers, high-performance heatsinks A
A 140

B1
Heatsinks for processors and LED:
heatsinks and fan coolers for universal PGA/BGA, DIL, PLCC, Intel Pentium Xeon, Intel Pentium IV, heatsinks for LED B
B 62

Board level heatsinks: C1

finger-shaped heatsinks, heatsinks for transistors in plastic case, attachable heatsinks, small heatsinks, C
copper heatsinks for D PAK and others
C 22

Cooling aggregates: D1
miniature cooling aggregates, heatsink cooling aggregates, high capacity cooling aggregates, D
multi module cooling aggregates, hollow-fin aggregates
D 36

Accessories for electronic components: E1

mounting parts for heatsinks, thermal transfer compound, thermally conductive material, aluminium oxide and E
mica wafers, silicone washers, guide rails, solder stop plug, clip fastening for mounting rail
E 50

F1
Sockets:
IC-sockets for DIL, PLCC, sockets for transistors, LED displays, crystal oscillators and connector-sleeves F
F 28

G1
PCB connectors and accessories:
male and female headers, grid spacing 2.54, 2.00 and 1.27 mm, high precision contact strips, jumpers G
G 84

H1
IDC connectors:
design DIL, single and double row female headers, lockable connectors, ribbon cable H
H 12

D-Sub connectors: I1
male and female headers, connectors with mounting angle, connectors for ribbon cable, I
SMD and mixed layout, D-Sub shells, cut-out covers
I 28

K1
Brackets:
brackets for PC and PCI with or without fixing tab, retainer for ISA versions K
K 32

Optoelectronics: L1
LED-holders for front panel assembly, LED-holder without LED, LED-holder with mounted LED, L
light pipes for SMDs
L 10

Cases: M1
desk consoles, shell cases, extruded assembled cases, combination cases, tube cases, miniature aluminium cases, M
design cases, cooling cases, ventilation frames, feet and bushings, special front panels, sheet constructions
M 56

19 Extension systems: N1
plug-in chassis, subracks, bench cases, system cases, insert modules, part front panels, rack handles, N
PC-board holder, extender cards
N 80
Alphanumerical product list

art. no. page art. no. page art. no. page art. no. page
ABM 2550 E 38 DR 135 V0 E 40 FK 232 220 C8 FS 6 100 E 27
ABM 3050 E 38 DR 140 V0 E 40 FK 233 220 C8 FS 6 110 E 27
ABM 4070 E 38 DR 145 V0 E 40 FK 234 SA L 1 C4 FS 6 120 E 27
ABM 5080 E 38 DR 150 V0 E 40 FK 234 SA L 2 C4 FS 6 130 E 27
ABM TE 04 E 39 DR 710 V0 E 40 FK 234 SA L 3 C4 FS 85 E 28
ABM TE 04 DIN E 39 DR 711 V0 E 40 FK 234 SA L 4 C4 FS 85 50 E 28
ABM TE 06 E 39 DR 712 V0 E 40 FK 235 MI L 1 C4 FS 85 60 E 28
ABM TE 06 DIN E 39 DR 713 V0 E 40 FK 235 MI L 2 C4 FS 85 70 E 28
ABM TE 08 E 39 DR 714 V0 E 40 FK 235 SA L 1 C4 FS 100 E 27
ABM TE 08 DIN E 39 DR 715 V0 E 40 FK 235 SA L 2 C4 FS 109 E 27
ABP 2550 E 38 DR 720 V0 E 40 FK 236 220 C9 FS 151 P E 26
ABP 3060 E 38 DR 725 V0 E 40 FK 236 CB C9 FS BF 06 E 29
ABP 4080 E 38 DR 730 V0 E 40 FK 237 SA 220 H C 14 FS BF 07 E 29
AHG K 27 E 31 DR 735 V0 E 40 FK 237 SA 220 O C 13 FS BF 10 E 29
AHG K 28 E 31 DR 740 V0 E 40 FK 237 SA 220 V C 14 FS BF 11 E 29
AHG L 7 E 31 DR 745 V0 E 40 FK 237 SA 220 VL C 14 FS BF 13 E 29
AHG V 14 E 31 DR 750 V0 E 40 FK 238 SA L 1 C8 FS BF 15 E 29
AHG V 17 E 31 DR 760 V0 E 40 FK 239 SA 32 C6 FS BF 19 E 29
AHM 3260 E 39 DR 810 V0 E 40 FK 240 SA 220 H C 14 FS BF 20 E 29
AHM 4380 E 39 DR 811 V0 E 40 FK 240 SA 220 O C 13 FS BT 06 E 29
AKK 127 A 125 DR 812 V0 E 40 FK 240 SA 220 V C 14 FS BT 08 E 29
AKK 191 A 125 DR 813 V0 E 40 FK 240 SA 220 VL C 14 FS BT 10 E 29
AOS 3 E 17 DR 814 V0 E 40 FK 241 SA 218 V C 11 FS BT 11 E 29
AOS 3 P E 17 DR 815 V0 E 40 FK 242 SA 220 H C 14 FS BT 13 E 29
AOS 3 P 2 E 17 DR 820 V0 E 40 FK 242 SA 220 O C 13 FS BT 15 E 29
AOS 3 P SL E 17 DR 825 V0 E 40 FK 242 SA 220 V C 14 FS BT 16 E 29
AOS 5 E 17 DR 830 V0 E 40 FK 242 SA 220 VL C 14 FS BT 19 E 29
AOS 18 E 17 DR 835 V0 E 40 FK 243 MI 247 H C 12 FS BT 20 E 29
AOS 32 E 17 DR 840 V0 E 40 FK 243 MI 247 O C 12 FSF 52 P E 20
AOS 66 E 17 DR 845 V0 E 40 FK 243 MI 247 V C 12 FS LP 05 E 30
AOS 93 E 17 DR 850 V0 E 40 FK 244 08 D2 PAK C 21 FS LP 07 E 30
AOS 127 E 17 DR 860 V0 E 40 FK 244 08 D3 PAK C 21 FS LP 08 E 30
AOS 218 247 E 17 ELS 3 A 88 FK 244 08 D PAK C 21 FS LP 10 E 30
AOS 218 247 1 E 17 EPN 1 E 44 FK 244 13 D2 PAK C 21 FS LP 11 E 30
AOS 220 E 17 FK 201 SA C2 FK 244 13 D3 PAK C 21 FS LP 13 E 30
AOS 220 3 E 17 FK 201 SA 3 C2 FK 244 13 D PAK C 21 FS LP 15 E 30
AOS 220 4 E 17 FK 201 SA CB C2 FK 245 MI 247 H C 12 FS LP 16 E 30
AOS 220 SL E 17 FK 202 SA C2 FK 245 MI 247 O C 12 FS LP 17 E 30
AOS 247 E 17 FK 202 SA 3 C2 FK 245 MI 247 V C 12 FS LP 22 E 30
AOS P 1 E 18 FK 202 SA CB C2 FK 247 220 C7 FS LP 30 E 30
AOS P 1.1 E 18 FK 205 SA L C2 FK 248 SA 220 C 11 FS S 06 2 E 29
AOS P 2 E 18 FK 206 SA L C2 FK 249 SA 220 C5 FS S 07 2 E 29
AOS P 3 E 18 FK 207 SA L C2 FK 250 06 LF PAK C 22 FS S 08 2 E 29
AOS P 4 E 18 FK 208 SA L C2 FK 250 08 LF PAK C 22 FS S 10 2 E 29
AOS P 5 E 18 FK 209 SA 32 C6 FK 250 10 LF PAK C 22 FS S 11 2 E 29
AOS P 6 E 18 FK 210 SA CB C6 FK 251 06 LF PAK C 22 FS S 12 2 E 29
AOS P 7 E 18 FK 211 32 C7 FK 251 08 LF PAK C 22 FS S 13 2 E 29
AOS P 8 E 18 FK 212 CB C7 FK 251 10 LF PAK C 22 FS S 15 2 E 29
AOS P 9 E 18 FK 213 SA 32 C6 FK 252 SA 220 H C 15 FS S 16 2 E 29
AOS P 10 E 18 FK 214 SA CB C6 FK 252 SA 220 O C 15 FS S 19 3 E 29
CLIP 151 E 26 FK 215 32 C7 FK 252 SA 220 V C 15 FS S 20 3 E 29
DR 071 V0 E 40 FK 216 CB C7 FK 252 SA 220 VL C 15 FS S 21 2 E 29
DR 072 V0 E 40 FK 217 SA CB 2 C3 FK 253 C 16 FS S 21 3 E 29
DR 073 V0 E 40 FK 218 32 C8 FK 254 SA 3 C2 FS U 06 E 30
DR 074 V0 E 40 FK 219 CB 1 C9 FK 255 C 16 FS U 11 E 30
DR 075 V0 E 40 FK 219 CB 2 C9 FK 256 C 22 FS U 20 E 30
DR 076 V0 E 40 FK 219 CB 3 C9 FK 257 C 16 GBM 2550 E 37
DR 077 V0 E 40 FK 220 SA 220 C 10 FK 258 SA 220 C 10 GBM 3050 E 37
DR 078 V0 E 40 FK 222 C7 FK 318 SA C2 GBM 4070 E 37
DR 079 V0 E 40 FK 222 THF C7 FK 318 SA 3 C2 GBM 5080 E 37
DR 081 V0 E 40 FK 223 SA C3 FL 0,55 A 128 GBP 3060 E 37
DR 082 V0 E 40 FK 223 SA 3 C3 FL 1,1 A 128 GBP 4080 E 37
DR 083 V0 E 40 FK 223 SA CB C3 FLKI 80 A 131 GEL ... E 12
DR 084 V0 E 40 FK 224 ... 218 1 C 11 FLKI 80 G 200 A 132 GEL G ...
DR 085 V0 E 40 FK 224 ... 218 2 C 11 FLKI 80 G 300 A 132 GEL 27 S ... E 15
DR 086 V0 E 40 FK 224 ... 220 1 C 11 FLKI 80 G 500 A 132 GEL 28 ... E 13
DR 087 V0 E 40 FK 224 ... 220 2 C 11 FLKR 1 A 133 GEL 28 G ...
DR 088 V0 E 40 FK 224 ... P SIP C 10 FLKU 140 A 131 GEL 45 ... E 14
DR 089 V0 E 40 FK 225 SA L 1 C5 FLKU 140 G 200 A 132 GEL 45 G ...
DR 105 V0 E 40 FK 225 SA L 2 C5 FLKU 140 G 300 A 132 GEL 60 ... E 15
DR 110 V0 E 40 FK 227 SA L 1 C8 FLKU 140 G 500 A 132 GEL 60 G ...
DR 115 V0 E 40 FK 228 SA L 1 C5 FS 6 065 E 27 GEL F 15 ... E 11
DR 120 V0 E 40 FK 229 SA L 1 C5 FS 6 070 E 27 GEL F 15 G ...
DR 125 V0 E 40 FK 230 SA L 1 C5 FS 6 080 E 27 GS 3 E 19
DR 130 V0 E 40 FK 231 SA 220 C6 FS 6 090 E 27 GS 3 P E 19
Alphanumerical product list

art. no. page art. no. page art. no. page art. no. page
GS 3 P SL E 19 ICK LED R 23,5 x 14 G B 35 ICK S 10 x 10 x 12,5 B 21 ICK SMD K 10 SA B 54
GS 32 P E 19 ICK LED R 27 x 10 B 35 ICK S 10 x 10 x 18,5 B 22 ICK SMD K 13 B 54
GS 66 P E 19 ICK LED R 27 x 10 G B 35 ICK S 14 x 14 x 6,5 B 22 ICK SMD K 17 B 54
GS 218 E 19 ICK LED R 28 x 15 B 35 ICK S 14 x 14 x 10 B 22 ICK SMD K 19 B 54
GS 220 4 E 19 ICK LED R 28 x 15 G B 36 ICK S 14 x 14 x 12,5 B 22 ICK SMD K 21 B 54
GS 220 C E 19 ICK LED R 29 x 11,5 B 36 ICK S 14 x 14 x 18,5 B 22 ICK SMD M 8 SA B 54
GS 220 P E 19 ICK LED R 29 x 11,5 G B 36 ICK S 17 x 17 x 15 B 22 ICK SMD M 10 SA B 54
IB 1 E 52 ICK LED R 32 x 14 B 36 ICK S 17 x 17 x 20 B 23 ICK SMD M 17 MI B 54
IB 2 E 52 ICK LED R 32 x 14 G B 36 ICK S 18 x 18 x 6,5 B 23 ICK SMD M 19 SA B 54
IB 3 E 52 ICK LED R 33 x 10 B 36 ICK S 18 x 18 x 10 B 23 ICK SMD M 21 SA B 54
IB 4 E 52 ICK LED R 33 x 10 G B 36 ICK S 22 x 22 x 10 B 23 ICK SMD N 8 B 55
IB 5 E 52 ICK LED R 33 x 16,5 B 37 ICK S 22 x 22 x 18,5 B 23 ICK SMD N 10 B 55
IB 6 E 52 ICK LED R 33 x 16,5 G B 37 ICK S 25 x 25 x 6,5 B 23 ICK SMD N 17 B 55
IB 7 E 52 ICK LED R 35 x 10 B 37 ICK S 25 x 25 x 12,5 B 24 ICK SMD N 19 B 55
IB 8 E 52 ICK LED R 35 x 10 G B 37 ICK S 25 x 25 x 18,5 B 24 ICK SMD N 21 B 55
IB 9 E 52 ICK LED R 36 x 12 B 37 ICK S 29 x 29 x 10 B 24 ICK SMD N 26 B 55
IB 10 E 52 ICK LED R 36 x 12 G B 37 ICK S 29 x 29 x 20 B 24 ICK S R 28,5 x 6,5 B 29
IB 11 E 52 ICK LED R 40 x 10 B 37 ICK S 29 x 29 x 30 B 24 ICK S R 28,5 x 10 B 29
IB 12 E 52 ICK LED R 40 x 10 G B 38 ICK S 32 x 32 x 10 B 24 ICK S R 28,5 x 12,5 B 29
IB 13 E 52 ICK LED R 40 x 27 B 38 ICK S 32 x 32 x 20 B 25 ICK S R 28,5 x 18,5 B 29
IB 14 E 52 ICK LED R 40 x 27 G B 38 ICK S 36 x 36 x 10 B 25 ICK S R 32,5 x 10 B 29
IB 15 E 52 ICK LED R 45,7 x 16,5 B 38 ICK S 36 x 36 x 15 B 25 ICK S R 32,5 x 20 B 29
IB 16 E 52 ICK LED R 45,7 x 16,5 G B 38 ICK S 36 x 36 x 20 B 25 ICK S R 32,5 x 30 B 30
IB 17 E 52 ICK LED R 50,8 x 16,5 B 39 ICK S 36 x 36 x 30 B 25 ICK S R 32,5 x 40 B 30
IB 18 E 52 ICK LED R 50,8 x 16,5 G B 39 ICK S 40 x 40 x 10 B 25 ICK S R 32,5 x 50 B 30
IBT 1 E 52 ICK LED R 50 x 10 B 38 ICK S 40 x 40 x 20 B 26 ICK S R 36,5 x 20 B 30
IBT 2 E 52 ICK LED R 50 x 10 G B 39 ICK S 40 x 40 x 25 B 26 ICK S R 40 x 10 B 30
IBT 3 E 52 ICK LED R 54 x 20 B 39 ICK S 45 x 45 x 10 B 26 ICK S R 40 x 20 B 30
IBT 4 E 52 ICK LED R 54 x 20 G B 39 ICK S 45 x 45 x 20 B 26 ICK S R 40 x 30 B 31
IBT 6 E 52 ICK LED R 66 x 40 B 39 ICK S 50 x 50 x 20 B 26 ICK S R 40 x 50 B 31
IBT 7 E 52 ICK LED R 75 x 10 B 40 ICK S 50 x 50 x 25 B 26 ICK S R 45 x 30 B 31
IBT 8 E 52 ICK LED R 84 x 40 B 40 ICK S 50 x 50 x 40 B 27 ICK S R 45 x 45 B 31
IBT 9 E 52 ICK LED R 100 x 40 B 40 ICK S 50 x 50 x 50 B 27 ICK S R 50 x 10 B 31
IBT 10 E 52 ICK LED R 160 x 40 B 40 ICK S 98 x 98 x 30 B 27 ICK S R 50 x 20 B 32
IBT 11 E 52 ICK LED R 200 x 40 B 41 ICK S 98 x 98 x 45 B 27 ICK S R 50 x 30 B 32
IBT 12 E 52 ICK PEN 3 FC B 57 ICK S D 12 x 12 x 7,5 B 28 ICK S R 50 x 45 B 32
IBT 14 E 52 ICK PEN 3 XE B 56 ICK S D 18 x 12 x 7,5 B 28 ICK S R 54 x 20 B 32
IBT 15 E 52 ICK PEN 3 XE 1 B 56 ICK S D 24 x 18 x 7,5 B 28 ICK S R 54 x 30 B 32
IBT 18 E 52 ICK PEN 38 F B 57 ICK S D 98 x 98 x 10 B 28 ICK S R 54 x 45 B 33
ICK 6 8 L B 52 ICK PEN 38 W B 57 ICK SMD A 5 B 53 ICK S R 70 x 30 B 33
ICK 14 16 B B 52 ICK PEN 45 W B 57 ICK SMD A 8 B 53 ICK S R 70 x 50 B 33
ICK 14 16 L B 52 ICK PGA 6 x 6 x 14 B 11 ICK SMD A 10 B 53 ICK S R 85 x 30 B 33
ICK 14 H B 52 ICK PGA 8 x 8 x 12 B 11 ICK SMD A 13 B 53 ICK S R 85 x 45 B 33
ICK 16 H B 52 ICK PGA 9 x 9 B 11 ICK SMD A 17 B 53 ICK S R 98 x 30 B 34
ICK 18 H B 52 ICK PGA 11 x 11 B 11 ICK SMD A 22 B 53 ICK S R 98 x 50 B 34
ICK 20 L B 52 ICK PGA 11 x 11 x 8 B 11 ICK SMD B 5 B 53 ICK S R A 40 x 20 B 31
ICK 24 B B 52 ICK PGA 11 x 11 x 12 B 12 ICK SMD B 7 SA B 53 IK 3 E 51
ICK 28 B B 52 ICK PGA 14 x 14 B 12 ICK SMD B 10 SA B 53 IK 341 3 E 51
ICK 35 SA A 124 ICK PGA 14 x 14 x 10 B 12 ICK SMD B 13 SA B 53 IS 1 E 49
ICK 36 B B 52 ICK PGA 14 x 14 x 12 B 12 ICK SMD B 19 B 53 IS 2 E 49
ICK 40 B B 52 ICK PGA 14 x 14 x 14 B 12 ICK SMD BOX 1 B 55 IS 3 E 49
ICK 1000 B B 52 ICK PGA 15 x 15 B 12 ICK SMD C 7 SA B 53 IS 4 E 49
ICK 1000 H B 52 ICK PGA 16 x 16 x 8 B 13 ICK SMD C 10 SA B 53 IS 5 E 49
ICK BGA 10 x 10 B 17 ICK PGA 16 x 16 x 10 B 13 ICK SMD C 17 B 53 IS 6 E 49
ICK BGA 10 x 10 x 10 B 17 ICK PGA 16 x 16 x 12 B 13 ICK SMD E 15 SA B 54 IS 7 E 50
ICK BGA 14 x 14 B 17 ICK PGA 17 x 17 B 13 ICK SMD E 22 SA B 54 IS 8 E 50
ICK BGA 14 x 14 x 10 B 17 ICK PGA 17 x 17 x 8 B 13 ICK SMD E 29 SA B 54 IS 53 A 127
ICK BGA 21 x 21 B 18 ICK PGA 17 x 17 x 12 B 13 ICK SMD F 8 B 54 ISAB 3 A E 32
ICK BGA 23 x 23 B 18 ICK PGA 18 x 18 B 14 ICK SMD F 10 B 54 ISAB 3 B E 33
ICK BGA 23 x 23 x 10 B 18 ICK PGA 19 x 19 B 14 ICK SMD F 17 SA B 54 ISAB 3 C E 33
ICK BGA 27 x 27 B 18 ICK PGA 19 x 19 x 12 B 14 ICK SMD F 19 B 54 ISAB 4 A E 32
ICK BGA 27 x 27 x 10 B 18 ICK PGA 20 x 20 B 14 ICK SMD F 21 B 54 ISAB 4 B E 33
ICK BGA 27 x 27 x 14 B 18 ICK PGA 20 x 20 K B 15 ICK SMD F 26 B 54 ISAB 4 C E 33
ICK BGA 27 x 27 x 22 B 19 ICK PGA 20 x 20 x 8 B 15 ICK SMD G 8 MI B 54 ISAB 5 B E 33
ICK BGA 31 x 31 B 19 ICK PGA 20 x 20 x 10 B 14 ICK SMD G 10 B 54 ISAB 5 C E 33
ICK BGA 31 x 31 x 10 B 19 ICK PGA 20 x 20 x 12 B 15 ICK SMD G 13 SA B 54 ISAB 6 A E 32
ICK BGA 35 x 35 B 19 ICK PGA 21 x 21 B 15 ICK SMD G 17 SA B 54 ISAB 6 B E 33
ICK BGA 35 x 35 x 10 B 19 ICK PGA 22 x 22 B 15 ICK SMD G 19 SA B 54 ISAB 6 C E 33
ICK BGA 37 x 37 x 6 B 19 ICK PGA 25 x 25 B 16 ICK SMD G 21 B 54 ISAB 25 A E 32
ICK BGA 37 x 37 x 10 B 20 ICK PLCC 28 B 52 ICK SMD H 8 B 54 ISAB 25 B E 33
ICK BGA 40 x 40 B 20 ICK PPC 51 B 56 ICK SMD H 10 B 54 ISAB 25 C E 33
ICK BGA 40 x 40 x 10 B 20 ICK PRO 40 W B 57 ICK SMD H 17 B 54 ISAM 2 A E 34
ICK BGA 42,5 x 45 B 20 ICK R B 52 ICK SMD H 19 SA B 54 ISAM 2 B E 34
ICK EM 25 B 56 ICK S 10 x 10 x 6,5 B 21 ICK SMD H 25 B 54 ISAM 2 C E 34
ICK LED R 23,5 x 14 B 35 ICK S 10 x 10 x 10 B 21 ICK SMD K 8 B 54 ISAM 3 A E 34
Alphanumerical product list

art. no. page art. no. page art. no. page art. no. page
ISAM 3 B E 34 LA 2 09 D7 LA V 11 D 18 SFP 054 A 135
ISAM 3 C E 34 LA 2 10 D7 LA V 14 D 20 SFP 057 A 135
ISAS 25 A E 35 LA 4 D 14 LA V 15 D 20 SFP 058 A 135
ISAS 25 B E 36 LA 5 D 14 LA V 17 D 22 SFP 060 A 135
ISAS 25 C E 36 LA 6 D 15 LA V 18 D 22 SFP 067 A 135
ISAS 30 A E 35 LA 7 D 15 LA V 21 D 24 SFP 074 A 135
ISAS 30 B E 36 LA 8 D 15 LA V 22 D 24 SFP 076 A 135
ISAS 30 C E 36 LA 9 D 17 LA V 24 D 25 SFP 079 A 135
ISAS 40 A E 35 LA 10 D 17 LS 101 E 43 SFP 090 A 135
ISAS 40 B E 36 LA 11 D 17 LS 102 E 43 SFP 100 A 135
ISAS 40 C E 36 LA 14 D 19 LS 103 E 43 SFP 106 A 135
ISAS 50 A E 35 LA 15 D 19 LS 104 E 43 SFP 112 A 135
ISAS 50 B E 36 LA 17 D 21 LS 105 E 43 SK 01 A 66
ISAS 50 C E 36 LA 18 D 21 LS 106 E 43 SK 02 A 66
ISAS 60 A E 35 LA 20 D 34 LS 107 E 43 SK 03 A 66
ISAS 60 B E 36 LA 21 D 23 LSD 07520 E 42 SK 04 A 64
ISAS 60 C E 36 LA 22 D 23 LSD 08910 E 42 SK 05 A 62
ISP 218 E 45 LA 25 D 33 LSD 08920 E 42 SK 06 A 79
ISP 220 E 45 LA 26 D 33 LSD 13510 E 42 SK 07 A 72
ISP 220 V E 45 LA 27 K D 13 LSD 13520 E 42 SK 08 A 73
ISP 247 E 45 LAGI 40 D 36 MD A 04 E 48 SK 09 A 59
K 0,55 A 128 LAGI 60 D 36 MD A 06 E 48 SK 11 A 79
K 1,1 A 128 LAGI 80 D 36 MD A 07 E 48 SK 12 A 123
K3 A 126 LAGI 92 D 36 MD A 09 E 48 SK 12 SA 2 x 32 A 124
K3T A 126 LAGI 119 D 36 MD A 12 E 48 SK 12 SA 32 A 124
K5 A 126 LA HL 1 D 27 MD B 07 E 48 SK 13 A 123
K9 A 126 LA HL 2 D 27 MD B 10 E 48 SK 13 35 SA 220 A 124
K 15 A 127 LA HL 3 D 27 MD B 11 E 48 SK 13 35 SA 220 3,2 A 124
KAP 1 P E 16 LAHL D 1 D 29 MD B 12 E 48 SK 13 35 SA 220 3,5 A 124
KAP 3 G E 16 LAHLR 1 500 D 35 MD B 15 E 48 SK 14 A 67
KAP 3 K E 16 LA HLV 1 D 28 MD C 13 E 48 SK 15 A 77
KAP 218 E 16 LA HLV 2 D 28 MD C 22 E 48 SK 16 A 72
KAP 218 O E 16 LA HLV 3 D 28 MLW 32 E 47 SK 18 A 62
KAP 220 G E 16 LA ICK 15 x 15 F 05 B 58 MLW 44 E 47 SK 19 A 63
KAP 220 K E 16 LA ICK 15 x 15 F 12 B 58 MLW 51 E 47 SK 20 A 68
KAP 220 O E 16 LA ICK 17 x 17 F 12 B 58 MRL 20 E 47 SK 21 A 70
KAP 247 O E 16 LA ICK 17 x 17 F 12 A B 58 MS 34 518 E 46 SK 23 A 79
KF 5/10 C 18 LA ICK 17 x 17 W 05 B 58 MS 53 3 E 46 SK 25 A 61
KF 5/15 C 18 LA ICK 17 x 17 W 12 B 58 MS 53 7 E 46 SK 28 A 63
KF 5/5 C 18 LA ICK 18 x 18 F 12 B 58 MS 53 25 E 46 SK 30 A 67
KK 1 3,96 C 17 LA ICK 18 x 18 W 12 B 58 MS 54 25 E 46 SK 31 A 72
KK 1 6,35 C 17 LA ICK 21 x 21 F 05 B 58 MS 56 15 E 46 SK 32 A 76
KK 1 12,7 C 17 LA ICK 21 x 21 F 12 B 58 MS 58 5 E 46 SK 33 A 42
KK 1 19,05 C 17 LA ICK 21 x 21 W 05 B 58 MS 58 7 E 46 SK 34 A 67
KK 32 C 19 LA ICK 21 x 21 W 12 B 58 MS 58 15 E 46 SK 36 A 66
KK 92 C 19 LA ICK PEN 2 K 12 B 60 MS 84 4 E 46 SK 39 A 67
KK 562 GS C 18 LA ICK PEN 3 XE B 60 MS 183 7 E 46 SK 40 A 82
KL 35 50 E 25 LA ICK PEN 4 1 K B 60 MS 183 25 E 46 SK 42 A 49
KL 35 75 E 25 LA ICK PEN 8 F 05 B 59 MS 183 35 E 46 SK 44 A 90
KL 35 100 E 25 LA ICK PEN 8 F 12 B 59 MS 184 7 E 46 SK 45 A 63
KL 35 K 40 E 25 LA ICK PEN 8 W 05 B 59 MS 184 25 E 46 SK 46 B 43
KL 35 K 50 E 25 LA ICK PEN 8 W 12 B 59 MS 184 35 E 46 SK 47 A 49
KL 35 K 75 E 25 LA ICK PEN 16 K 12 B 59 MS 510 15 E 46 SK 48 A 73
KL 35 K 100 E 25 LA ICK PEN 16 W 12 B 59 MS 923 25 E 46 SK 49 A 51
KTE 1 A 129 LA ICK PEN 16 W 12 A B 59 MS 3518 25 E 46 SK 50 A 37
KTE 2 A 129 LA ICK PEN 18 W 12 B 59 MS 3518 35 E 46 SK 51 A 61
KTE R B 47 LA ICK PEN 38 W 12 B 59 MS 4016 E 46 SK 52 A 74
LA 1 01 D5 LA ICK PRO 25 F 12 B 59 MSHV 90 E 28 SK 53 A 74
LA 1 02 D5 LA LED 40 x 30 B 49 MST 3 E 44 SK 55 A 83
LA 1 03 D5 LA LED 50 x 20 B 49 MST 220 E 44 SK 56 A 54
LA 1 04 D5 LA LED 50 x 45 B 49 MSTS 3 E 44 SK 57 A 64
LA 1 05 D5 LA LED 68 B 50 MSTS 220 E 44 SK 58 A 45
LA 1 06 D5 LAM 1 D9 MSVL 50 E 28 SK 59 A 60
LA 1 07 D5 LAM 2 D9 MSVL 60 E 28 SK 60 A 74
LA 1 08 D5 LAM 3 D 10 MSVL 70 E 28 SK 61 A 82
LA 1 09 D5 LAM 3 K D 10 MSVL 85 E 28 SK 63 A 62
LA 1 10 D5 LAM 4 D 11 MSVL 100 E 27 SK 64 A 70
LA 2 01 D7 LAM 4 K D 11 SFP 005 A 135 SK 65 A 70
LA 2 02 D7 LAM 5 D 12 SFP 006 A 135 SK 66 A 55
LA 2 03 D7 LAM 5 K D 12 SFP 007 A 135 SK 67 A 69
LA 2 04 D7 LA V 6 D 16 SFP 016 A 135 SK 68 A 89
LA 2 05 D7 LA V 7 D 16 SFP 028 A 135 SK 69 A 71
LA 2 06 D7 LA V 8 D 16 SFP 029 A 135 SK 71 A 64
LA 2 07 D7 LA V 9 D 18 SFP 037 A 135 SK 72 A 63
LA 2 08 D7 LA V 10 D 18 SFP 046 A 135 SK 73 A 64
Alphanumerical product list

art. no. page art. no. page art. no. page art. no. page
SK 74 A 71 SK 119 A 47 SK 185 37,5 STS TO 220 A 104 SK 447 A 26
SK 75 25 A 105 SK 120 A 45 SK 185 37,5 TO 220 A 104 SK 448 A 27
SK 75 25 STS TO 220 A 105 SK 121 A 42 SK 185 50 C TO 220 A 104 SK 448 20 1 x M3 L A 111
SK 75 25 TO 220 A 105 SK 122 A 60 SK 185 50 STC TO 220 A 104 SK 448 40 2 x M3 L A 111
SK 75 37,5 A 105 SK 124 A 71 SK 185 50 STS TO 220 A 104 SK 448 60 3 x M3 L A 111
SK 75 37,5 STS TO 220 A 105 SK 125 A 91 SK 185 50 TO 220 A 104 SK 450 A 34
SK 75 37,5 TO 220 A 105 SK 126 25 A 107 SK 187 A 76 SK 451 A 91
SK 75 50 A 105 SK 126 25 2 x M3 A 107 SK 189 A 32 SK 452 A 27
SK 75 50 STS TO 220 A 105 SK 126 25 STS TO 220 A 107 SK 190 A 52 SK 452 20 1 x M3 A 96
SK 75 50 TO 220 A 105 SK 126 25 TO 220 A 107 SK 191 A 56 SK 452 20 2 x M3 A 96
SK 75 75 A 105 SK 126 37,5 A 107 SK 193 A 50 SK 452 40 2 x M3 A 96
SK 75 1000 A 105 SK 126 37,5 2 x M3 A 107 SK 194 A 81 SK 452 40 4 x M3 A 96
SK 76 25 A 105 SK 126 37,5 STS TO 220 A 107 SK 195 A 71 SK 452 60 3 x M3 A 96
SK 76 25 STS TO 220 A 105 SK 126 37,5 TO 220 A 107 SK 197 A 65 SK 452 60 6 x M3 A 96
SK 76 25 TO 220 A 105 SK 126 1000 A 107 SK 198 A 53 SK 452 80 4 x M3 A 96
SK 76 37,5 A 105 SK 128 A 91 SK 199 A 51 SK 452 80 8 x M3 A 96
SK 76 37,5 STS TO 220 A 105 SK 129 ... STC A 103 SK 400 A 28 SK 452 100 5 x M3 A 96
SK 76 37,5 TO 220 A 105 SK 129 ... STIC SK 400 20 1 x M3 L A 111 SK 452 100 10 x M3 A 96
SK 76 50 A 105 SK 129 ... STCB SK 400 40 2 x M3 L A 111 SK 453 A 33
SK 76 50 STS TO 220 A 105 SK 129 ... STS A 103 SK 400 60 3 x M3 L A 111 SK 454 A 24
SK 76 50 TO 220 A 105 SK 129 ... STIS SK 401 A 63 SK 454 20 1 x M3 A 96
SK 76 75 A 105 SK 129 ... STSB SK 402 A 62 SK 454 20 1 x M3 L A 111
SK 76 1000 A 105 SK 130 A 56 SK 403 A 64 SK 454 20 2 x M3 A 96
SK 78 A 61 SK 132 A 44 SK 404 A 65 SK 454 40 2 x M3 A 96
SK 79 A 73 SK 133 A 44 SK 405 A 47 SK 454 40 2 x M3 L A 111
SK 80 A 74 SK 134 A 28 SK 406 A 38 SK 454 40 4 x M3 A 96
SK 81 A 41 SK 135 A 39 SK 407 A 39 SK 454 60 3 x M3 A 96
SK 82 A 75 SK 136 A 48 SK 408 A 40 SK 454 60 3 x M3 L A 111
SK 83 A 79 SK 138 A 91 SK 409 ... STC A 100 SK 454 60 6 x M3 A 96
SK 84 A 68 SK 139 A 53 SK 409 ... STIC SK 454 80 4 x M3 A 96
SK 85 A 46 SK 140 A 77 SK 409 ... STCB SK 454 80 8 x M3 A 96
SK 86 A 75 SK 144 A 82 SK 409 ... STS A 100 SK 454 100 5 x M3 A 96
SK 88 A 73 SK 145 A 59 SK 409 ... STIS SK 454 100 10 x M3 A 96
SK 89 A 77 SK 145 25 STC A 106 SK 409 ... STSB SK 455 A 33
SK 90 A 48 SK 145 25 STS TO 220 A 106 SK 410 A 44 SK 456 A 30
SK 91 A 52 SK 145 30 STC A 106 SK 411 A 42 SK 456 20 1 x M3 L A 111
SK 92 A 41 SK 145 37,5 STS TO 220 A 106 SK 412 A 47 SK 456 40 2 x M3 L A 111
SK 93 A 56 SK 145 50 STC A 106 SK 413 A 43 SK 456 60 3 x M3 L A 111
SK 94 A 49 SK 145 50 STS TO 220 A 106 SK 414 A 90 SK 458 D 30
SK 95 15 A 108 SK 147 A 74 SK 415 A 90 SK 459 ... STC A 101
SK 95 15 SOT 32 S A 108 SK 148 A 68 SK 416 A 47 SK 459 ... STIC
SK 95 15 STS SOT 32 S A 108 SK 149 A 53 SK 417 A 46 SK 459 ... STCB
SK 95 25 A 108 SK 150 A 61 SK 418 A 58 SK 459 ... STS A 101
SK 95 25 1 x M2,5 1 x M3 A 108 SK 153 A 83 SK 419 A 70 SK 459 ... STIS
SK 95 25 2 x M3 A 108 SK 154 A 46 SK 420 A 31 SK 459 ... STSB
SK 95 25 SOT 32 A 108 SK 155 A 45 SK 421 A 47 SK 459 25 2 x TO 220 A 102
SK 95 25 STS SOT 32 A 108 SK 156 A 36 SK 422 A 32 SK 459 25 M A 102
SK 95 25 STS TO 220 A 108 SK 157 A 54 SK 423 A 32 SK 459 37,5 2 x TO 220 A 102
SK 95 25 TO 220 A 108 SK 158 A 58 SK 424 A 34 SK 459 37,5 M A 102
SK 95 1000 A 108 SK 159 A 58 SK 425 A 34 SK 459 50 2 x TO 220 A 102
SK 96 A 91 SK 160 A 58 SK 426 A 36 SK 459 50 M A 102
SK 97 A 62 SK 161 A 58 SK 427 A 36 SK 460 25 A 112
SK 98 A 65 SK 162 A 58 SK 429 A 37 SK 460 37,5 A 112
SK 99 A 37 SK 163 A 78 SK 431 1 A 124 SK 460 50 A 112
SK 100 A 38 SK 165 A 61 SK 431 2 A 124 SK 461 D 30
SK 101 A 54 SK 166 A 48 SK 431 3 A 124 SK 463 A 43
SK 102 A 50 SK 168 A 50 SK 432 A 82 SK 464 A 39
SK 104 ... LS A 98 SK 172 A 81 SK 433 A 41 SK 466 A 43
SK 104 ... STC A 97 SK 173 A 59 SK 434 A 35 SK 467 A 33
SK 104 ... STIC SK 174 A 30 SK 435 A 81 SK 468 A 36
SK 104 ... STCB SK 175 A 83 SK 436 A 37 SK 469 A 23
SK 104 ... STS A 97 SK 176 A 78 SK 437 A 24 SK 469 ... STS A 110
SK 104 ... STIS SK 177 A 27 SK 437 ... STC A 109 SK 470 A 22
SK 104 ... STSB SK 178 A 28 SK 437 ... STC 2 A 109 SK 470 25 STS A 110
SK 105 A 90 SK 179 A 30 SK 437 ... STS A 109 SK 470 30 STS A 110
SK 106 A 31 SK 180 A 36 SK 437 ... STS 2 A 109 SK 470 35 STS A 110
SK 107 A 60 SK 181 A 60 SK 438 A 52 SK 470 50 STS A 110
SK 108 A 80 SK 181 94 C 3 x TO 220 A 60 SK 439 A 55 SK 471 A 29
SK 109 A 80 SK 182 A 40 SK 440 D 30 SK 472 A 31
SK 110 A 80 SK 184 A 68 SK 441 D 30 SK 473 A 25
SK 111 A 81 SK 185 A 73 SK 442 A 42 SK 475 A 35
SK 112 A 89 SK 185 25 STC TO 220 A 104 SK 443 A 59 SK 476 A 24
SK 113 A 48 SK 185 25 STS TO 220 A 104 SK 444 A 38 SK 477 A 24
SK 115 A 123 SK 185 25 TO 220 A 104 SK 445 A 34 SK 478 A 23
SK 118 A 51 SK 185 37,5 STC TO 220 A 104 SK 446 A 53 SK 479 A 55
Alphanumerical product list

art. no. page art. no. page art. no. page art. no. page
SK 480 A 84 SK 547 A 31 SK 617 A 88 THFK 247 A 116
SK 481 A 85 SK 548 A 34 SK 618 B 42 THFM A 116
SK 482 A 86 SK 549 A 29 SK 619 B 42 THFMG A 116
SK 483 A 87 SK 550 A 27 SK 620 B 42 THFU 1 A 119
SK 484 A 110 SK 551 A 25 SK 621 A 56 THFU 2 A 119
SK 485 A 38 SK 552 A 23 SK DC 2 1 76 SA A 114 THFU 3 A 120
SK 486 A 25 SK 553 A 44 SK DC 4 1 117 SA A 113 THFU 4 A 120
SK 487 A 87 SK 554 A 26 SK DC 5 1 59 SA A 114 THFU 5 A 120
SK 489 A 85 SK 555 A 51 SK DC 5 59 SA A 114 THFU 6 A 121
SK 490 A 84 SK 556 A 77 SK DC 6 1 60 SA A 113 THFU 7 A 121
SK 492 A 84 SK 557 A 50 SK DC 7 1 117 SA A 114 UK 14 SA 220 A 123
SK 493 A 28 SK 558 A 23 SK DC 7 117 SA A 114 UK 14 SA 220 3,2 A 123
SK 494 A 83 SK 559 A 25 SK DC 8 1 60 SA A 113 UK 14 SA M3 A 123
SK 495 A 87 SK 560 A 26 SK DC 8 60 SA A 113 US 58 4 E 46
SK 496 A 22 SK 561 A 26 SK DC 10 60 SA A 113 US 512 4 E 46
SK 497 D 30 SK 562 A 29 SKK 56 C 19 WB 3 E4
SK 498 D 30 SK 563 A 30 SKK 58 C 19 WB 3 P E4
SK 499 A 87 SK 564 A 30 SKK 510 C 19 WBT 30 E4
SK 500 A 72 SK 565 A 22 SK LED 1 B 48 WBT 300 E4
SK 501 A 54 SK 566 A 26 SK LED 2 B 48 WG 3 E4
SK 502 A 49 SK 567 A 35 SK LED 3 B 48 WG 3 P E4
SK 503 A 46 SK 568 A 54 SK LED BOX 1 B 51 WGT 300 E4
SK 504 A 45 SK 569 B 43 SMP 410 A E 41 WK 3 E4
SK 505 A 41 SK 570 B 44 SMP 410 B E 41 WK 3 P E4
SK 507 A 40 SK 571 B 44 SMP 410 C E 41 WK 3/4 E4
SK 508 A 41 SK 572 B 44 SMP 415 A E 41 WKT 24 E4
SK 509 A 29 SK 573 A 85 SMP 415 B E 41 WKT 300 E4
SK 510 A 46 SK 574 A 86 SMP 415 C E 41 WL 0,55 A 128
SK 511 A 32 SK 575 A 84 SMP 515 A E 41 WL 1,1 A 128
SK 512 A 84 SK 576 A 85 SMP 515 B E 41 WLFG 9010 R 25 E9
SK 513 A 31 SK 577 B 43 SMP 515 C E 41 WLFG 9010 R 50 E9
SK 514 A 86 SK 578 B 43 STP 4 A 136 WLFG 9010 R 100 E9
SK 515 05 10 A 94 SK 579 A 55 STP 5 A 136 WLFG 9015 R 25 E9
SK 515 05 10 S A 94 SK 580 A 51 SU 02 A 135 WLFG 9015 R 50 E9
SK 515 05 23,5 A 94 SK 581 A 28 SU 03 A 135 WLFG 9015 R 100 E9
SK 515 05 23,5 S 2 A 94 SK 582 A 25 SU 05 A 135 WLFG 9020 R 25 E9
SK 515 05 37 A 94 SK 583 A 53 SU 09 A 135 WLFG 9020 R 50 E9
SK 515 05 37 S 3 A 94 SK 584 B 44 SU 16 A 135 WLFG 9020 R 100 E9
SK 515 10 S TO 220 A 94 SK 585 ... B 42 SU 27 A 135 WLFG S 900 K R 25 E9
SK 515 10 TO 220 A 94 SK 586 A 22 SU 29 A 135 WLFG S 900 K R 50 E9
SK 515 23,5 S 2 x TO 220 A 94 SK 587 A 29 SU 32 A 135 WLFG S 900 K R 100 E9
SK 515 23,5 TO 220 A 94 SK 588 A 45 SVP 01 A 136 WLFT 88 ... E8
SK 515 37 S 3 x TO 220 A 94 SK 589 A 86 SVP 04 A 136 WLFT 404 ... / E7
SK 515 37 TO 220 A 94 SK 590 B 46 SVP 10 A 136 WLFT 405 .../
SK 516 15 S TO 218 A 94 SK 591 A 49 SVP 12 A 136 WLFT 414 ...
SK 516 15 TO 218 A 94 SK 592 B 45 SVP 13 A 136 WLFT 8943 ... E6
SK 516 33 S 2 x TO 218 A 94 SK 593 A 87 SWP 02 A 135 WLK 5 E 23
SK 517 A 93 SK 594 A 38 SWP 06 A 135 WLK 10 E 23
SK 518 A 93 SK 595 A 43 SWP 10 A 135 WLK 30 E 23
SK 519 A 48 SK 596 A 76 SWP 15 A 135 WLK 120 E 23
SK 520 A 50 SK 597 A 27 SWP 23 A 135 WLK DK 4 E 24
SK 521 A 24 SK 598 B 42 SWP 25 A 135 WLK DK 10 E 24
SK 522 A 23 SK 599 B 45 SWP 29 A 135 WLK DK 50 E 24
SK 523 A 55 SK 600 ... STC A 99 SWP 36 A 135 WLK M 4 E 24
SK 524 A 52 SK 600 ... STIC SWP 40 A 135 WLK M 50 E 24
SK 525 15 A 95 SK 600 ... STCB SWP 55 A 135 WLK P E 24
SK 525 15 ST A 95 SK 600 ... STS A 99 SWP 57 A 135 WLP 004 E 21
SK 525 20 ST A 95 SK 600 ... STIS TF 3 2 E 50 WLP 035 E 21
SK 525 25 ST A 95 SK 600 ... STSB THF 104 A 115 WLP 300 S E 21
SK 525 30 A 95 SK 601 A 44 THF 129 TO 220 A 115 WLP 500 E 21
SK 525 30 ST A 95 SK 602 B 43 THF 220 A 115 WLP 500 S E 21
SK 526 30 ST A 95 SK 603 D 31 THF 220 17 A 115 WLPF 05 E 21
SK 527 A 35 SK 604 D 31 THF 247 A 115 WLPF 10 E 21
SK 530 A 57 SK 605 D 31 THF 247 4 A 115 WLPF 20 E 21
SK 531 A 57 SK 606 D 31 THF 249 A 115 WLPF 50 E 21
SK 533 A 57 SK 607 D 31 THF 409 220 1 A 115 WLPF 300 S E 21
SK 535 A 57 SK 608 D 31 THF 409 220 2 A 115 WLPK 3 E 22
SK 536 A 57 SK 609 A 92 THF 409 SOT 32 A 115 WLPK 5 E 22
SK 537 A 57 SK 610 A 92 THF 409 TO 220 A 115 WLPK 10 E 22
SK 538 A 57 SK 611 A 92 THF 600 A 115 WP 4030 100 A 125
SK 539 A 57 SK 612 A 39 THFA 1 A 117 WP 4030 100 3 A 125
SK 540 A 57 SK 613 A 43 THFA 2 A 117 WS 3 E4
SK 544 A 76 SK 614 A 52 THFA 3 A 117 WS 3 M E4
SK 545 A 39 SK 615 B 45 THFA 4 A 117 WS 3 P E4
SK 546 A 40 SK 616 A 22 THFK 220 A 116 WS 3/4 E4
Alphanumerical product list

art. no. page

WSC-220 E4
WSF 16 E 10
WSF 32 E 10
WSF 635 E 10
WSFS 635 E 10
WSI 220 210 E5
WSI 220 225 E5
WSI TO 3 PL E5
WSI TOP 3 235 E5
WSI TOP 3 280 E5
WSM-220 E4
WST 30 E4
WST 36 E4
WST 85 E4
Index

Active heatsinks for processors B 58-61

Aluminium flat-, quadrangular-, angled-, U- & T-profiles A 135-136
Aluminium oxide wafers E 17-18
Attachable heatsink C 10-16
Cooling aggregates with axial fan D 13-29
Cooling aggregates with radial fan D 33-35
Die-cast heatsinks A 125-128
Distance sleeves and spacers E 32-40
Extruded heatsinks for DC/DC converter A 113-114
Extruded heatsinks for lock-in retaining spring A 84-88
Extruded heatsinks for PCB mounting A 89-112
Fastening for mounting rail E 25
Fin coolers A 129
Finger shaped heatsinks C 2-9
Fluid coolers A 131-134
Guide rails E 26-31
Heat conductive foam and gel foils E 10-15
Heatsinks for BGAs B 17-20
Heatsinks for DIL-IC, PLCC and SMD B 52-55
Heatsinks for D PAK and others C 21-22
Heatsinks for LEDs B 35-51
Heatsinks for PGA B 11-16
High-performance heatsinks D 30-32
High thermoconducting graphite foils E 9
Insulating caps and insolater sleeves E 51-52
Insulating clamping parts for power transistors E 45
Kapton insulator washers E 16
Mica wafers E 19
Miniature cooling aggregates D 9-12
Mounting kits for insulation of power transistors E 44
Mounting parts for heatsinks E 49-50
Mounts E 46-48
Passive heatsinks for processors B 56-57
Pin heatsinks B 21-34
Protection grid for fans D 36
Retaining springs for transistors A 115-122
Segment cooling aggregates D 5-9
Small heatsinks C 17-20
Standard extruded heatsinks A 22-83
Thermal conductive foil one-sided adhesive E 6
Thermally conductive adhesive E 23-24
Thermally conductive foil both sides adhesive E 7-8
Thermally conductive foil made of siliconelastomer E 2-5
Thermal transfer compound and thermal interface film E 20-22
U-Extruded heatsinks A 123-124
Vibration dampers and solder terminals E 41-43
certified quality management

own tool-making department

foresighted storekeeping
 efficient special machines

precise punching department

up-to-date milling technology

 foyer of the company

motivated employees committed field service

innovative product development

Quality-Management System
DIN EN ISO 9001

We are certified to DINENISO9001.

This process-directed quality management system implies a
constant focus on satisfying the demands of customers, and
this is the major objective of our company.

The implementation and further development of our quality

management system demonstrably ensures
guaranteed customer satisfaction and thus the success of
our company,
compliance with customers requirements at all times
through defined processes,
early detection and prevention of errors, and
checking of both process effectiveness and efficiency on a
regular basis together with steady improvement.

It is through constant vigilance and the provision of evidence

that we deliver flawless products, which fully comply with
quality requirements, that we maintain our quality certifica-
tion.
In order to secure lasting company success and to meet our
customers expectations now and in the future, we define
measurable objectives within the framework of our quality
system, which are regularly checked and developed.
We are committed to constant measurement and improve-
ment of our performance.

Our quality management system applies to all processes

carried out by our company.

Environmental Management System

DIN EN ISO 14001

Fischer Elektronik considers protection of the environment

and saving of natural resources entrepreneurial tasks of high
priority.

Aware of this, Fischer Elektronik was the first German heat-

sink manufacturer to implement, in 1998, the environmental
management system in accordance with DIN EN ISO 14001.

Our entrepreneurial responsibility comprises preventing

accidents, safeguarding against occupational diseases,
designing workplaces to suit human requirements, develo-
ping products which are safe to use, saving resources and
avoiding environmental impact to the maximum extent
possible.

We already consider environmental compatibility at the

product and process development stage. The environmental
impact of our activities is documented, assessed and in a
continuous improvement process reduced to a minimum.

Implementation and consistent working on and with the

environmental management system is a vital process and
a constant challenge but finally it will always lead to better
results.
BIAS, Milan I

Electronica, Tel Aviv IL PCIM, Nuremberg D

Electro Salon, Budapest HU Elkom, Helsinki FI

We exhibit

Paris F Hamburg D Bregenz A

16. 9. - 18. 9. 2014 23. 9. - 26. 9. 2014 30. 9. - 2. 10. 2014
www.enova-event.com www.windenergyhamburg.com www.led-professional.com
hall 7.2 hall B 7, stand 537

Paris F Munich D London GB

14. 10. - 15. 10. 2014 11. 11. - 14. 11. 2014 19. 11. - 20. 11. 2014
www.forumled.com www.electronica.de www.luxlive.co.uk
stand B 10 hall B 1, stand 155 hall A 32

Nuremberg D Nuremberg D Stockholm S

24. 2. - 26. 2. 2015 20. 5. - 22. 5. 2015 19. 4. - 21. 4. 2016
www.embedded-world.de www.pcim.de www.see-event.se
stand 4 A - 311
Explanations references printings
... index area: ... index area:
shows topics/categories shows topics/categories
A current B following

... page number

D 15
Standard aluminium profiles A 135 - 136 ... footnotes, give references to pages with
Technical explanations A 2-8 combinable or similar products
Extruded heatsinks A 22 - 83
Assignment table A 18 - 22

SA = black anodised ... option for surface finishing

MI = solderable surface
ME = clear anodised
TP = chrom-free transparent passivated

... link to page

A 10

... length on stock in mm

... hole pattern

... symbol of heatsink geometry

... thermal resistance in K/W

Rth
... thickness of sheet/plate

... air/speed in m/s

v
Imprinting of cardholders - Your and our time is expensive
An order for imprinting must state the font, the font size and the exact position of the imprint with dimensions, taking due
account of countersunk holes etc.. When placing the first order, the company logo must be supplied as a vector file. If these
conditions are not complied with, the order for imprinting may have to be turned down, or additional costs will have to be
charged.
Compliance with the following criteria ensures smooth handling:
Adobe Illustrator (.ai/.eps) without half-tone images, fonts transformed into paths or supplied
CorelDraw (.cdr)
Adobe Acrobat (.pdf)
QuarkXPress (.qxd) all fonts enclosed; half-tone images colour-separated (full-tone or scale colours) and
InDesign (.indd) with correct resolution (300 dpi colour, black / white 600 dpi), no RGB
All this takes additional time and consequently incurs extra costs.
The usability must be checked by our printing shop:
screen formats (.jpg, .gif, .png) and paper copies, stickers and the like are not suitable for preparing printers copies!
Copies that definitely cannot be used:
Imperfect copies such as fax copies / Microsoft Office files (.doc, .xls, .ppt) can only be used for information or for transmitting
texts.
Please always add dimensional drawings (.dxf) to the parts to be imprinted! Please note as a general rule:
Retouching work extending beyond the standard time will be invoiced additionally at cost price.

No part of this catalogue may be reproduced or distributed without prior written consent of Fischer Elektronik.
All data contained in this catalogue, in texts, illustrations, documents and descriptions are subject to copyright
and the provisions of DIN ISO 16016. All rights reserved.
Copyright Fischer Elektronik 1969 ... 2014

Machined heatsinks
several hundreds of extrusion profiles available
future orientated stockkeeping of heatsink profiles in a
fully automatic honeycomb warehouse
precise milling treatments in highest quality
effective heat spreading by means of heatsinks
with grouted copper areas
designs and modifications according to your demand
Lamella heatsinks
compact lamella heatsinks with a big surface
special design for forced convection
thermotechnical optimal fitted lamellas
precise milled flat semiconductor mounting surface
single and double sided bottom plate made of aluminium
or copper
production according to customer specified demands
Machined heatsinks
Fluid heatsinks
Lamella heatsinks
Extruded heatsink with solder pins
Fluid heatsinks
fluid heatsinks for dissipation of big heat flow volumes
compact design with internal lamella structure
thick bottom plates for optimal heat dissipation
I- and U streamed versions
water connection or mounting flange for your special
application
customized treatments and solutions
Extruded heatsinks with solder pins
solid pressed in soldering pins and threaded bolts for a
direct pcb-mounting
for horizontal and vertical mounting position
standard drilling patterns and transistor retaining springs
for various semi-conductive elements
soldering pins with insulation for spacing help
variations and modifications according to drawing
 A
Technical introduction
1. General points
In order to provide optimum performance of semi-conducting devices it is essential not to exceed the maximum junction temperature
indicated by the manufacturer.
B
Generally this maximum junction temperature can only be maintained without exceeding it by running the device concerned at lower
power outputs.

At outputs approaching the maximum ratings semi-conductor devices have to be cooled by so called heatsinks, sometimes called
dissipators.
C
The thermal performance of these heatsinks primarily depends on the thermal conductivity of the material from which they are made,
size of surface area and mass.

In addition, surface colour, mounting position,temperature, ambient air velocity and mounting place all have varying influence on the
final performance of the heatsink from one application to another..
D
However, a figure for thermal resistance can be experimentally determined in a reliable manner and used in the equations that follow
in part 2.

There are no agreed international standard methods for testing electronic cooling systems or for the determination of the thermal
resistance.
E
Therefore the diagrams and values given in our catalogue have been determined under practical operating conditions and therefore
allow the most suitable heatsink from the range to be selected.

We expressly point out that all information and data is given to the best of our knowledge and belief. The user is solely responsible for
the proper use of our products and he should check their suitability for the intended application.
F
Fischer Elektronik do not assume any warranty, whether expressed or implied, for the suitability, function or merchantibility of their
products in specific or general applications, and they cannot be held liable for accidental or consequential damage due to non-obser-
vance of the above.

Furthermore Fischer Elektronik reserve the right to carry out technical modifications to their products at any time.
G
All orders are subject to the General Sales Conditions of Fischer Elektronik.
2. The determination of thermal resistance
The thermal resistance is the parameter that is the most important in cooler selection, apart from mechanical considerations.

For determination of the thermal resistance the following equation applies: H

Equation 1: i u
RthK = ( RthG + RthM ) = RthGM
P P
In case of an application where the maximum junction temperature is not exceeded the temperature has to be verified.
When the case temperature has been measured the use of the following equation will enable the maximum junction temperature to be I
calculated:
Equation 2: i = G + P x RthG
The meaning of the determinants:

i = maximum junction temperature in C of the device as indicated by manufacturer. K

As a safety factor this should be reduced by 20-30 C.

u = ambient temperature in C.
The rise in temperature caused by radiant heat of the heatsink should be increased by a margin of 10-30 C.

= difference between maximum junction temperature and ambient temperature. L

G = measured temperature of device case (equation 2).

P = maximum power rating of device in watts

Rth = thermal resistance in K/W M

RthG = internal thermal resistance of semiconductor device (as indicated by manufacturer)

Heatsinks profile-overview A 13 - 17 Heatsinks for SSR A 11 - 12

Heatsink special design A 137 - 138 Die-cast heatsinks A 125
Special profiles A 140 Assigment table A 18 - 20 A2 N
Heatsink as visual & decor-parts A 10 Order example A 21
A
Technical introduction

RthM = thermal resistance of mounting surface. For TO 3 cases the following approximate values apply:
B 1. dry, without insulatar 0.05 - 0.20 K/W
2. with thermal compound/without insulator 0.005 - 0.10 K/W
3. Aluminium oxide wafer with thermal compound 0.20 - 0.60 K/W
4. Mica wafer (0.05 mm thick) with thermal compound 0.40 - 0.90 K/W
RthK = thermal resistance of heatsink, which can be directly taken from the diagrams
RthGM = sum of RthG and RthM. For parallel connections of several transistors the value RthGM can be determined by the following
C equation:

Equation 3: 1 = 1 1 + ... + 1
+
RthGM ges. RthG1 + RthM1 RthG2 + RthM2 RthGn + RthMn

The result can be substituted into equation 1.

D
K = Kelvin, which is the standard measure of temperature differences, measured in C, therefore 1C = 1 K.
K/W = Kelvin per watt, the unit of thermal resistance.
Calculation examples:

E 1. A TO 3 power transistor with 60 watt rating has a maximum junction temperature of 180 C and an internal resistance of
0.6 K/W at an ambient of 40 C with aluminium oxide wafers.
What thermal resistance is required for the heatsink?

given:
P = 60 W RthG = 0.6 K/W
F i = 180 C - 20 C =160 C (for safety margin)
u = 40 C
RthM = 0.4 K/W (average value)

-
find: RthK using equation 1 RthK = i u (RthG + RthM) =160 C - 40 C (0.6 K/W + 0.4 K/W) = 1,0 K/W
P 60 W
2. Same conditions as above but for three devices with equally distributed power ratings.
G 1 = 1 + 1 + 1 =3
RthGM ges. 0.6 + 0.4 K/W 0.6 + 0.4 K/W 0.6 + 0.4 K/W 1 W/K
solution use equation 1 and equation 3

RthGM ges. = 1 K/W = 0.33 K/W

3
H
substitute into Equation 1 gives: RthK = 160 C 40 C _ 0.33 K/W = 1.67 K/W
60 W
With these values determined, the tabulation on page A 13 - 17 can be used to give a choice of possible heatsink profiles.
Then by examination of the drawings and curves the final choice can be made.
I 3. A transistor with power rating of 50 W and internal thermal resistance of 0.5 K/W has a case temperature of 40 C.
What is the actual value of junction temperature?

given:
P = 50 W RthG = 0.5 K/W G = 40 C
K find: i using equation 2

i = G + (P RthG) i = 40 C + (50 W 0.5 K/W) = 65 C

L Thermal resistances of any profiles with forced convection a 1

0,8
RthKf a RthK
RthKf = thermal resistance with forced convection 0,6
RthK = thermal resistance with natural convection 0,4
a = factor of proportion
M 0,2
0
0 1 2 3 4 5 6 v [m/s]

Standard aluminium profiles A 135 - 136 Thermal conductive material E 2 - 24

Extruded heatsinks A 22 - 83 Hole pattern A 21
N A3 Lamella heatsinks A 129 - 130 Drilling pattern for SSR A 12
Fluid coolers A 131 - 133 Technical introduction A2-8
 A
Technical introduction
Computer based thermal simulation for optimal cooling concepts
Performance, service life and reliability of electronic semiconductor devices are significantly determined by the thermal load B
to which the devices are exposed. An exceeding of the maximum operating temperature leads to malfunctions. An exceeding
of the permissible junction temperature leads to a destruction of the semiconductor. To make it worse there is an advancing
trend in the semiconductor industry for continuous increasing integration- and power densities of electronic devices. For the
solution of thermal problems the first question is which kind of heat dissipation has to be considered. For this there are different
processes available: by means of free convection (passive) with different heatsink solutions, by means of forced convection C
(active with help of fans, cooling aggregates) or by means of fluid media (fluid cooling).

However, electronic devices and systems have many

different boundary and installation conditions. There-
fore the choice of the optimum thermal management
is often difficult. There are surely possibilities to D
find the right heat dissipation concept by using the
thermal resistance for calculations or by testing and
verifying prototypes directly in the application, but
nowadays customer specified mechanical adjust-
ments are requested and demanded more than ever. E
Small mechanical post-machinings, such as additio-
nal integrated threads or drilling can be considered
in the calculation with safety reserves in the tempera-
ture of the thermal resistance, but extensive modifi-
cations demand a repeated inspection of the thermal
circumstances. F
To facilitate the determination of passive heat dissipation concepts Fischer Elektronik offers a computer based thermal simu-
lation as a kind of service.

Considered factors in the thermal simulation G

With help of the computer based thermal simulation
the necessary characteristics of the cooling concept
can be determined exactly. Based on physical con-
cepts such as mass, energy and impulse the software
especially considers the thermal requirements for free
H
or forced convection. Simultaneously the system is alig-
ned to thermal dissipation by means of fluid. Moreover
the thermal simulation calculates physical effects such
as thermal radiation and turbulences. The emission
factor of the different surfaces also plays its role. As a I
result the simulation software delivers a precise cooling
solution for the application and is a big help for the
decision-making and interpretation of the electronic
design.
K

Advantages of a computer based simulation

The computer based thermal simulation is already used for the prototype development. Herewith the development cycles of
heat dissipation concepts is reduced considerably. Unsuitable concepts can be discarded quickly and without big costs of
material. A lot of features and options of the simulation system also reduce the temporary and apparatuses efforts compa- L
red to a conventional simulation in the measurement chamber.

We will be happy to advise you in detail about the theme thermal simulation.

Heatsinks profile-overview A 13 - 17 Heatsinks for SSR A 11 - 12

Heatsink special design A 137 - 138 Die-cast heatsinks A 125
Special profiles A 140 Assigment table A 18 - 20 A4 N
Heatsink as visual & decor-parts A 10 Order example A 21
A
Technical introduction
Remarks:
1. The values indicated in the diagrams apply only for heatsinks with black anodised surface, mounted vertically and
B natural convection.

Correction factors: natural surface: +10 to 15 % for horizontal mounting: +15 to 20 %

2. Heatsink profiles are extruded to European standard DIN EN 12020 (former DIN 17615).
For profiles exceeding a circumscribed circle of 350 mm, the tolerances to DIN EN 755 (former DIN 1748) apply.
C
Important note:
Manufacturers of certain electronic components, especially modules with a large surface area, IGBT etc., specify installation surfaces
for heatsinks etc. with an flatness, which is beyond standard tolerances. Such perfect flatness can only be achieved by milling the
installation surface. Furthermore, it should be noted that threaded wire inserts may be required in order to reach higher tightening
torques in aluminium (e.g. Heli-Coil or similar.). Please observe the semiconductor manufacturers information.
D 3. The mentioned heatsink profiles in our catalogue contain so called extrusion marks between the fins for a profile identification.
To avoid misuse the operator has to check the size and position for the mechanical treatment or placement of the components.

4. Profile extruded threaded channels are no threads conforming to standards, as they have no thread pitch.
The thread pitch is imitated by staggered webs (ribs). The customer is responsible for appropriate use.
E 5. Machining of our extruded and non extruded profiles conforms to requirements of DIN ISO 2768 m - unless otherwise stated.
For all ICK S types DIN ISO 2768c is valid.

6. The lengths of extruded profiles [ ] and the pin layouts [ ] indicate only the standard range. We offer every profile cut to
customers exact length and machining requirement made to drawing or sample. We bore, countersink, mill, saw, grind and cut
F threads into your heat sink to meet your specific requirements. With our modern machine tools including CNC machining centres,
multispindled drills (up to 26 drillings/threads at the same time) and digital milling and stamping tools plus our own in house tool
room we are able to manufacture competetively priced prototypes as well as batch and mass produced parts with short lead times.

7. The standard material of our heatsinks is warm age-hardened aluminium alloy according to EN AW 6060 T66
(former AlMgSi05 F22 acc. to DIN 1748). Our standard surface treatments are raw degreased aluminium (Al) and
G black anodised (SA). On request, we anodise clear natural (ME) or decorative in any colour that is technically possible.

8. If you cannot find a suitable profile within our range of approx. 400 profiles, 13 small heatsinks and 50 finger shaped heatsinks,
we can design and produce to your requirements. Please contact us at the start of your next project so that we can work together,
either directly or through our representatives. Remember that we have the ability to find the solution for your cooling problem.

H 9. Note on tolerances

All dimensions given in this cataloque for products, items and machined parts are acc. to DIN ISO 2768 m if not otherwise stated.
Not included are items like extruded profiles, diecasts, handles, vibration dumpers etc. for which different standards apply.

I Update - August 2014

The information given in this catalogue were established and examined carefully.
Nevertheless, mistakes or printing errors, and especially technical modifications and updating and improvement of our products,
cannot be excluded. All trade marks are recognised even if they are not specifically identified or mentioned. No identification does not
imply that a product or trademark is not registered. No part of this catalogue may be reproduced or distributed without prior written
K consent of Fischer Elektronik. All data contained in this catalogue, in texts, illustrations, documents and descriptions are subject to
copyright and the provisions of DIN ISO 16016. All rights reserved.

Copyright Fischer Elektronik 1969 ... 2014

Standard aluminium profiles A 135 - 136 Thermal conductive material E 2 - 24

Extruded heatsinks A 22 - 83 Hole pattern A 21
N A5 Lamella heatsinks A 129 - 130 Drilling pattern for SSR A 12
Fluid coolers A 131 - 133 Technical introduction A2-8
 A
Technical introduction
General information
Blind holes are produced after anodising. Through holes are produced before anodising. With completely visual parts, additional B
painting is recommended. The sections are extruded according to DIN EN 12020. For sections that exceed a circumscribed circle of
300 mm, DIN EN 755 apply. The machining tolerances are specified according to DIN ISO 2768 m.

Visual parts: Please indicate at which place clamp points are allowed! We recommend e.g. supplementary laquering.

zero point 15 3 x M 3 - 6/8 deep

+
200 1.2 5 and/or continuous
D

5
24.7
44.7
49.7
E

face counterbore
12/0.5 deep
6.5
zero point A 3.4
C M6 F
A B C D

11.6
9.6
G
break-through 8

4.5
B D
M4
H
49.7
39.7

6.4
8.4
24.7

3.2
10

4
33.4 8
I
zero point 50.4
65 plunge-through and
counterbore with 8
135
149.6
166.6
196
K

Heatsinks profile-overview A 13 - 17 Heatsinks for SSR A 11 - 12

Heatsink special design A 137 - 138 Die-cast heatsinks A 125
Special profiles A 140 Assigment table A 18 - 20 A6 N
Heatsink as visual & decor-parts A 10 Order example A 21
A
Technical introduction
Information for dimensioning, shown on SK 47 general:

B The deflection can be up to 0.8 mm concave, 0.2 mm convex. If a certain flatness of the bottom surface is required the bottom
thickness can be decreased by a maximum of approx. 0.8 mm by means of face-milling. This situation must be taken into
consideration with the bore hole depths for blind holes.
Counterbores and bore hole diameters are to be produced according to DIN 74, if not explicitly stated otherwise.
The depth of thread should be calculated as follows.

C Example M 5:
thread: <M> 5 x 1.6 mm = 8 mm core bore: 8 mm + 2 mm = 10 mm
Examples:
cutout A: Through-hole according to DIN 74 A m 3, counterbore bottom side, undercut of the fins.
cutout B: Through hole with break-through of the fins according to DIN 74 H m 4, counterbore on fin side.
cutout C: Thread M 6. Depth of thread 1.6 x 6 mm = 9.6 mm, bore depth 9.6 mm + 2 mm = 11.6 mm.
D Bore hole on fin base is plunged through. Face counterbore dia. 12 x 0.5 on bottom side.
cutout D: Blind thread M 4. Depth of thread 1.6 x 4 mm = 6.4 mm, bore depth 6.4 mm + 2 mm = 8.4 mm.

Extrusion tolerances production tolerances

There is often the problem, that the production tolerances cannot be adhered to, due to the extrusion tolerances. The two examples
E show how the production tolerances can be cut in half by means of suitable dimensioning (here: extension of the zero point from the
outer edge to the center of the section).
When taking unfavourable extrusion tolerances into consideration a difference of 1.1 mm
arises between the two types of dimensioning with respect to the axis of symmetry.

.75
SK 82 extrusion tolerance 3.5 mm R220
F
440

G 55
165
275
385

H 437.8
1.93

zero point
I
55
165
275
K 385
1.1

0.83

zero point
55 55
M 165 165

437.8

Standard aluminium profiles A 135 - 136 Thermal conductive material E 2 - 24

Extruded heatsinks A 22 - 83 Hole pattern A 21
N A7 Lamella heatsinks A 129 - 130 Drilling pattern for SSR A 12
Fluid coolers A 131 - 133 Technical introduction A2-8
 A
Technical introduction
SK 34
B
extrusion tolerance 0.8 mm

125 0.8 C

124.20

D
dimensioning set to the outer edges

zero point
4.2 58.3 E
120.8
0.4
124.20

F
dimensioning set to the center

zero point G
58.3 58.3

When taking unfavourable extrusion tolerances into consideration, a difference of 0.4 mm arises between the two types of
dimensioning with respect to the axis of symmetry. H

Milling
If, when milling heatsinks, cooling aggregates, etc., the milling tool diameter is smaller than the area being milled for production
reasons, so called milling grooves with steps or edges are produced (see sketch). Even if the roughness depth value for the surface
I
is observed, it is a good idea to specify the area of the component in which no milling edges are allowed.

milling groove
K
milling tool
milling groove
milling tool

milling tool bigger than milled

surface
(no milling edge) milling tool smaller than milled surface
L

Heatsinks profile-overview A 13 - 17 Heatsinks for SSR A 11 - 12

Heatsink special design A 137 - 138 Die-cast heatsinks A 125
Special profiles A 140 Assigment table A 18 - 20 A8 N
Heatsink as visual & decor-parts A 10 Order example A 21

Decorative aluminium milled parts
high quality, very precise milled, decorative
aluminium parts
exact radii and sharp-edged cutouts
precision ground surfaces
natural colour and black anodized
Surface refinements
corrosion resistant and decorative anodize layers
lacquerings and durable powder coatings in all current
RAL colours
anti-glare surfaces, Nextel-Suide Coating
electrically conductive surfaces, chromate VI free
prevention of clamp marks by means of special
contacting systems
Precision machining and
highly decorative surfaces
Chromium plating and gold plating
chromium plating and gold plating of front panels,
extruded profiles and construction parts
qualitative constant and reproducible, high
quality surfaces
various gloss levels by means of different polishing
processes
processing of brass, aluminium and steel
Development and construction
compentent partner with experience of more
than 40 year
Innovative product development, product-specific
support by means of application engineers
design assistance, feasibility analyses and product
optimizations
construction support and preparation of drawings
 A
Heatsinks for decorative purposes and as visual parts

G
Anodising (also known as ELOXAL: ELectrically OXidised ALuminium) is used in many cases for decorative surface protection of alumi-
nium. In this process, the aluminium parts to be treated are connected to the positive pole of a direct-current source (anode) in a suitable
electrolyte where aluminium, in so doing, forms the negative pole (cathode). The flowing direct current now causes a migration of oxy-
gencontaining ions, with electrically negative charge, to the anode in order to deposit the oxygen. At this point, the aluminium reacts with
this oxygen, forming aluminium oxide. A non-porous, electrically insulating, abrasion free, oxide barrier, or eloxallayer, then develops. H
The development and therefore thickness of this layer can be controlled by the amount of current flow.

For process handling, secure transportation and electrical connection, the parts to be anodised must be placed on racks (figure 1).
As excellent electrical contact is necessary and the parts being processed must be mounted on the carrying racks in a totally secure man-
ner a high clamping force is required especially for those large and heavy heatsinks (figure 2). This will mean that clamp marks are
visible. These are mere bare points in the case of small and light weight heatsinks with black anodising (figure 3) but for heavy parts the I
clamping pressures and current can cause deformation of the surface (figure 4). Any such deformations on large heatsinks is unavoidable
and varies with each part (figure 5).

If heat sinks are used as visual parts, in other words parts whose surface must be blemish-free in appearance, it is suggested that the cus-
tomer will define specific areas which should have no clamp marks. If, for technical production reasons, it is not possible to place clamps
on the remaining points then consideration should be either given to the construction of separate specialpurpose frames which will allow K
processing (figure 6). Existing or additional threaded holes may possibly also be used for screwing on fixing angles, upon which the
clamps may then be placed (figure 7). Furthermore, there is always the possibility to remove the clamp marks by hand finishing, although
some slight indentation may still be visible. Alternatively, instead of using the anodising process there are various paint finishes available.

With visual parts and mouldings, both discussion of all technical details and determination of the desired design in cooperation with the
manufacturer - even at the initial enquiry stage - are imperative for the smooth completion of orders to the satisfaction of the L
customer.

Our experts are at your disposal for all technical advice.

Standard aluminium profiles A 135 - 136 Drilling pattern for SSR A 12

Technical introduction A 2-8 Die-cast heatsinks A 125
Extruded heatsinks A 22 - 83 High capacity heatsinks D 30 - 32 A 10 N
Assigment table A 18 - 20 Heatsinks for PCB A 89 - 112
A
Heatsinks for solid state relays

F universal clip fastening, suitable for all 35 mm mounting rails

according to DIN EN 50 022, rail thickness from 1 to 2.3 mm E 25
fast and simple asssembly of heatsinks by means of snapping them onto the mounting rail
secure hold due to a stable extruded profile with integral stainless steel spring
G special lengths (40 mm) and drillings on request

7.4

H
35

35

1 1.5 2.3 35
37.5
50

3.5
I 7.5 15 15

Examples of mounting rail versions suitable for KL 35

8.5

surface: finish clear anodised

Distance sleeves E 32 - 39 Spacers E 40

Fastening for mounting rail E 25 Mica wafers E 19
N A 11 Guide rails for PCBs E 26 - 30 Aluminium oxide wafers E 17 - 18
Mounting material f. semiconduct. E 44 - 48 Technical introduction A2-8
 A
Heatsinks for solid state relays

perforations with KL 35 without KL 35

drilling pattern rotated by 90 fixing of the SSR by means
of screws with the help of
fixing of the SSR by means
of screws with the help of
fixing of the SSR by means B
as well as further drilling of screws with the help of
patterns upon request insert nuts in the heatsink tapped holes in the heatsink tapped holes in the heatsink

art. no. art. no. art. no.

SSR 1 SK 172 75 KL SSR 1 SK 89 75 KL SSR 1 SK 04 75 SSR 1 C

SK 89 100 KL SSR 1 SK 33 75 SSR 1
SK 111 75 KL SSR 1 SK 453 75 SSR 1
SK 434 75 KL SRR 1 SK 455 75 SSR 1
SK 453 75 KL SRR 1 SK 467 75 SRR 1
SK 467 75 KL SRR 1 SK 507 75 SRR 1
47.5

D
57

SK 507 75 KL SSR 1
M4

45

SSR 2 SK 89 100 KL SSR 2 SK 04 150 SSR 2 E

47.6 SK 89 150 KL SSR 2 SK 33 75 SSR 2
SK 176 100 KL SSR 2 SK 507 100 SSR 2
SK 176 150 KL SSR 2 SK 507 150 SSR 2
SK 194 75 KL SSR 2
SK 507 100 KL SSR 2
F
104.5

92

G
M4

73.5

SSR 3 SK 187 75 KL SSR 3 SK 111 75 KL SSR 3 SK 48 50 SSR 3

H
30.2
38.1

M4

17

SSR 4 SK 172 150 KL SSR 4 SK 455 100 KL SSR 4 SK 455 100 SSR 4
I
SK 467 100 SSR 4

M4

K
94

80

L
34

Distance sleeves E 32 - 39 Spacers E 40

Fastening for mounting rail E 25 Mica wafers E 19
Guide rails for PCBs E 26 - 30 Aluminium oxide wafers E 17 - 18 A 12 N
Mounting material for semiconduct E 44 - 48 Mounting parts for heatsinks A2-8
A
Heatsink-chart
SK 440 D 30 SK 441 D 30 SK 458 D 30 SK 461 D 30 SK 497 D 30 SK 498 D 30

SK 47 A 49 SK 49 A 51 SK 56 A 54 SK 66 A 55 SK 90 A 48 SK 91 A 52

SK 93 A 56 SK 101 A 54 SK 102 A 50 SK 130 A 56 SK 139 A 53

SK 149 A 53 SK 154 A 46 SK 155 A 45 SK 157 A 54 SK 158 A 58

E
SK 159 A 58 SK 160 A 58 SK 161 A 58 SK 162 A 58

F
SK 168 A 50 SK 190 A 52 SK 191 A 56 SK 193 A 50

G
SK 198 A 53 SK 199 A 51 SK 416 A 47 SK 418 A 58 SK 438 A 52

H
SK 439 A 55 SK 446 A 53 SK 466 A 43 SK 479 A 55

I
SK 501 A 54 SK 502 A 49 SK 507 A 40 SK 510 A 46 SK 520 A 50 SK 523 A 55

K
SK 524 A 52 SK 530 A 57 SK 531 A 57 SK 533 A 57

L
SK 535 A 57 SK 536 A 57 SK 537 A 57 SK 538 A 57

Heatsink-chart classified in categories of thermal resistance at 75 mm length

N A 13
 A
Heatsink-chart
SK 539 A 57 SK 540 A 57 SK 553 A 44 SK 555 A 51 SK 557 A 50

SK 568 A 54 SK 579 A 55 SK 580 A 51 SK 588 A 45 SK 591 A 49 SK 601 A 44

SK 613 A 43 SK 614 A 52 SK 621 A 56 SK 57 A 64 SK 30 A 67 SK 53 A 74

SK 82 A 75 SK 86 A 75 SK 15 A 77 SK 163 A 78 SK 556 A 77

E
SK 83 A 79 SK 108 A 80 SK 109 A 80 SK 110 A 80 SK 435 A 81 SK 144 A 82 SK 584 B 44 SK 590 B 46 SK 592 B 45

F
SK 615 B 45 SK 33 A 42 SK 42 A 49 SK 58 A 45 SK 85 A 46 SK 92 A 41

G
SK 94 A 49 SK 113 A 48 SK 118 A 51 SK 119 A 47

H
SK 120 A 45 SK 121 A 42 SK 132 A 44 SK 133 A 44 SK 135 A 39 SK 136 A 48 SK 411 A 42

I
SK 412 A 47 SK 413 A 43 SK 429 A 37 SK 463 A 43 SK 467 A 33 SK 503 A 46

K
SK 504 A 45 SK 519 A 48 SK 583 A 53 SK 595 A 43 SK 71 A 64 SK 98 A 65 SK 197 A 65

L
SK 404 A 65 SK 02 A 66 SK 34 A 67 SK 67 A 69 SK 148 A 68 SK 88 A 73 SK 80 A 74 SK 147 A 74

< 1 K/W 1-1,5 K/W 1,5-2 K/W 2-2,5 K/W

A 14 N
2,5-3 K/W 3-4 K/W 4-5 K/W > 5 K/W
A
Heatsink-chart
SK 89 A 77 SK 140 A 77 SK 06 A 79 SK 23 A 79 SK 194 A 81 SK 40 A 82 SK 61 A 82 SK 415 A 90 SK 569 B 43

SK 570 B 44 SK 571 B 44 SK 572 B 44 SK 577 B 43 SK 578 B 43 SK 599 B 45 SK 602 B 43 SK 50 A 37 SK 100 A 38

SK 166 A 48 SK 408 A 40 SK 410 A 44 SK 417 A 46

SK 421 A 47 SK 433 A 41 SK 442 A 42 SK 453 A 33 SK 455 A 33 SK 464 A 39 SK 527 A 35

E
SK 04 A 64 SK 72 A 63 SK 401 A 63 SK 403 A 64 SK 14 A 67 SK 39 A 67 SK 20 A 68 SK 84 A 68

F
SK 184 A 68 SK 74 A 71 SK 124 A 71 SK 195 A 71 SK 500 A 72 SK 08 A 73 SK 60 A 74

G
SK 176 A 78 SK 172 A 81 SK 432 A 82 SK 46 B 43 SK 598 B 42 SK 407 A 39 SK 436 A 37 SK 450 A 34 SK 505 A 41

H
SK 508 A 41 SK 612 A 39 SK 73 A 64 SK 97 A 62 SK 03 A 66 SK 419 A 70

I
SK 16 A 72 SK 79 A 73 SK 187 A 76 SK 11 A 79 SK 111 A 81 SK 44 A 90 SK 81 A 41

K
SK 189 A 32 SK 405 A 47 SK 406 A 38 SK 434 A 35 SK 445 A 34 SK 05 A 62 SK 18 A 62 SK 25 A 61

L
SK 28 A 63 SK 63 A 62 SK 402 A 62 SK 01 A 66 SK 64 A 70 SK 48 A 73 SK 52 A 74 SK 32 A 76

Heatsink-chart classified in categories of thermal resistance at 75 mm length

N A 15
 A
Heatsink-chart
SK 544 A 76 SK 596 A 76 SK 175 A 83 SK 105 A 90 SK 484 A 110 SK 487 A 87 SK 499 A 87 SK 514 A 86

SK 593 A 87 SK 617 A 88 SK 99 A 37 SK 106 A 31 SK 134 A 28 SK 182 A 40 SK 424 A 34 SK 425 A 34 SK 426 A 36

SK 475 A 35 SK 545 A 39 SK 546 A 40 SK 567 A 35 SK 594 A 38 SK 19 A 63

SK 45 A 63 SK 51 A 61 SK 165 A 61 SK 181 A 60 SK 36 A 66 SK 21 A 70 SK 65 A 70

E
SK 69 A 71 SK 07 A 72 SK 55 A 83 SK 68 A 89 SK 112 A 89 SK 128 A 91 SK 414 A 90

F
SK 481 A 85 SK 482 A 86 SK 483 A 87 SK 489 A 85 SK 495 A 87 SK 517 A 93 SK 518 A 93 SK 585 ... B 42 SK 589 A 86

G
SK 610 A 92 SK 618 B 42 SK 619 B 42 SK 620 B 42 SK 156 A 36 SK 174 A 30 SK 179 A 30 SK 180 A 36 SK 422 A 32

H
SK 444 A 38 SK 468 A 36 SK 472 A 31 SK 485 A 38 SK 566 A 26 SK 78 A 61 SK 107 A 60 SK 122 A 60 SK 150 A 61

I
SK 173 A 59 SK 185 A 73 LA LED 68 B 50 SK 96 A 91 SK 138 A 91 SK 451 A 91 SK 490 A 84 SK 573 A 85 SK 574 A 86

K
SK 576 A 85 SK 611 A 92 SK LED 2 B 48 SK LED 3 B 48 SK 177 A 27 SK 178 A 28 SK 400 A 28 SK 420 A 31 SK 423 A 32

L
SK 427 A 36 SK 437 A 24 SK 447 A 26 SK 448 A 27 SK 452 A 27 SK 454 A 24 SK 456 A 30 SK 469 A 23

< 1 K/W 1-1,5 K/W 1,5-2 K/W 2-2,5 K/W

A 16 N
2,5-3 K/W 3-4 K/W 4-5 K/W > 5 K/W
A
Heatsink-chart
SK 470 A 22 SK 471 A 29 SK 473 A 25 SK 476 A 24 SK 477 A 24 SK 478 A 23 SK 486 A 25 SK 493 A 28 SK 496 A 22

SK 509 A 29 SK 511 A 32 SK 513 A 31 SK 521 A 24 SK 522 A 23 SK 547 A 31 SK 548 A 34 SK 549 A 29 SK 550 A 27

SK 551 A 25 SK 552 A 23 SK 554 A 26 SK 558 A 23 SK 559 A 25 SK 560 A 26 SK 561 A 26 SK 562 A 29 SK 563 A 30

SK 564 A 30 SK 565 A 22 SK 581 A 28 SK 582 A 25 SK 586 A 22 SK 587 A 29 SK 597 A 27 SK 616 A 22 SK 09 A 59

E
SK 59 A 60 SK 145 A 59 SK 443 A 59 SK 31 A 72 SK 153 A 83 SK 494 A 83 ICK ... B B 52 ICK ... H B 52 ICK ... L B 52

F
SFP A 135 SK 12 A 123 SK 13 A 123 SK 75 A 105 SK 76 A 105 SK 95 A 108 SK 115 A 123 SK 125 A 91 SK 126 A 107

G
SK 431 ... A 124 SK 480 A 84 SK 492 A 84 SK 512 A 84 SK 515 A 94 SK 515 05 A 94 SK 516 A 94 SK 575 A 84 SK 609 A 92

H
SK LED 1 B 48 STP A 136 SU A 135 SVP A 136 SWP A 135 UK 14 SA ... A 123

Heatsink-chart classified in categories of thermal resistance at 75 mm length

N A 17
 A
Assignment table of transistor heatsinks

TO 3 TO 66 SOT 9 TO 220 SOT 32

B

extruded profiles SK 01 SK 01 SK 01 SK 09 SK 01
SK 02 SK 02 SK 02 SK 59 SK 02 C
SK 03 SK 03 SK 03 SK 145 SK 03
SK 04 SK 04 SK 04 SK 04
SK 05 SK 05 SK 05 SK 05
SK 07 SK 07 SK 07 SK 07
SK 08 SK 08 SK 08 SK 08
SK 14 SK 14 SK 14 SK 14 D
SK 16 SK 16 SK 16 SK 16
SK 18 SK 18 SK 18 SK 18
SK 19 SK 19 SK 19 SK 19
SK 20 SK 20 SK 20 SK 20
SK 21 SK 21 SK 21 SK 21
SK 28 SK 28 SK 28 SK 28 E
SK 30 SK 30 SK 30 SK 30
SK 31 SK 31 SK 31 SK 31
SK 34 SK 34 SK 34 SK 34
SK 36 SK 36 SK 36 SK 36
SK 39 SK 39 SK 39 SK 39
SK 45 SK 45 SK 45 SK 45 F
SK 48 SK 48 SK 48 SK 48
SK 52 SK 52 SK 52 SK 52
SK 53 SK 53 SK 53 SK 53
SK 55 SK 55 SK 55 SK 55
SK 60 SK 60 SK 60 SK 60
SK 63 SK 63 SK 63 SK 63 G
SK 67 SK 69 SK 69 SK 69
SK 69 SK 71 SK 71 SK 71
SK 71 SK 72 SK 72 SK 72
SK 72 SK 73 SK 73 SK 73
SK 73 SK 74 SK 74 SK 74
SK 74 SK 78 SK 78 SK 78 H
SK 78 SK 79 SK 79 SK 79
SK 79 SK 80 SK 80 SK 80
SK 80 SK 122 SK 122 SK 122
SK 84 SK 147 SK 147 SK 147
SK 88 SK 148 SK 148 SK 148
SK 97 SK 150 SK 150 SK 150 I
SK 122 SK 165 SK 165 SK 165
SK 124 SK 185 SK 185 SK 185
SK 147 SK 195 SK 195 SK 195
SK 148 SK 197 SK 197 SK 197
SK 150 SK 401 SK 401 SK 401
SK 165 SK 402 SK 402 SK 402 K
SK 185 SK 404 SK 404 SK 404
SK 195
SK 197
SK 401
SK 402
SK 404 L

Extruded heatsinks A 22 - 83 Die-cast heatsinks A 125

Heatsinks f. printed circuit boards A 89 - 111 Reating springs for transistors A 115 - 117
Thermal conductive material E 2 - 24 Lock-in transistor fixing spring A 84 - 88 A 18 N
Mount. material f. semiconductors E 44 - 48 Technical introduction A 2-8
A
Assignment table of transistor heatsinks

TO 3 TO 66 SOT 9 TO 5 TO 247 TO 3 P
B

extruded heatsink SK 126 SK 104

C with solder pins
SK 145 SK 129

SK 437 SK 400

SK 459 SK 409
D SK 484 SK 448

SK 456

SK 484

E extruded
heatsinks
WP 4030 SK 126 SK 452

SK 452
set-up/clip-on AKK 127 FK 243
heatsinks
AKK 191 FK 245
F finger-shaped FK 201 FK 201 FK 201
heatsinks FK 202 FK 202 FK 202

FK 205 FK 205 FK 205

FK 206 FK 206 FK 206

G
FK 223 FK 207 FK 207

FK 236 FK 208 FK 208

FK 217 FK 217
H FK 225 FK 234

FK 234 FK 236

FK 236
small heatsinks KF
I
KK 562

SKK

Extruded heatsinks A 22 - 83 Die-cast heatsinks A 125

Heatsinks f. printed circuit boards A 89 - 112 Reating springs for transistors A 115 - 117
N A 19 Thermal conductive material E 2 - 24 Lock-in transistor fixing spring A 84 - 88
Mount. material f. semiconductors E 44 - 48 Technical introduction A 2-8
 A
Assignment table transistor heatsinks

TO 218 TO 220 SOT 32 DIL PLCC P-SIP PGA/BGA

B

U-heatsinks ICK 35 SK 12 assignment

SK 13 table C
SK 431 B 2 - 10
UK 14

extruded heatsink SK 145 SK 75 SK 104 SK 459

with solder pin SK 437 SK 104 SK 129 SK 460
SK 459 SK 129 SK 409 D
SK 460 SK 145 SK 459
SK 185 SK 469
SK 409 SK 470
SK 459
SK 460

extruded heatsinks SK 126 SK 95 SK 95 ICK...B ICK PLCC

E
SK 452 SK 126 SK 454 ICK..H ICK R
SK 452 ICK...L
SK 454
SK 517
SK 518 F
set-up/clip-on FK 224 FK 220 FK 224
heatsinks FK 241 FK 224 FK 241
SK 516 FK 237
SK 515

finger-shaped FK 224 FK 205 FK 201 FK 224 G

heatsinks FK 243 FK 206 FK 205
FK 245 FK 207 FK 206
FK 208 FK 207
FK 210 FK 208
FK 212
FK 214
FK 209
FK 210
H
FK 216 FK 211
FK 217 FK 212
FK 218 FK 213
FK 219 FK 214
FK 220
FK 222
FK 215
FK 216
I
FK 225 FK 217
FK 227 FK 218
FK 228 FK 219
FK 229 FK 223
FK 230
FK 231
FK 234
FK 235
K
FK 232 FK 236
FK 233 FK 239
FK 234
FK 235
FK 247 L
small heatsinks KK 32
KK 92

Extruded heatsinks A 22 - 83 Die-cast heatsinks A 125

Heatsinks f. printed circuit boards A 89 - 112 Reating springs for transistors A 115 - 117
Thermal conductive material E 2 - 24 Lock-in transistor fixing spring A 84 - 88 A 20 N
Mount. material f. semiconductors E 44 - 48 Technical introduction A 2-8
A
Heatsinks

Hole pattern
B
CB TO3 S TO 3

10.9 33,5
4.2
13.2
13.2

13.2
C 4.7
7
10

30.2
3
32

15.1
3.6

10.9

15.1
10.9
14.9

5.6
30.2
6

4.2 4.2
4.2

CB = TO 3 + SOT 9 + TO 66 + SOT 32
D at 37.5 mm oblique drilling TO 3 oblique drilling for 37.5 mm TO 3 exceeding 50 mm

TO 220 SOT 32 K

E 3.2
M 2.5
3.2

37.5 (50)
14.75

24.4
4
10
4 x10

14.8
4.5
5

F 9

13

SOT 32 / TO 220 exceeding 37.5 mm

Standard hole pattern are processed as complete pin layouts, centered on the length of the heatsink.
Other positions of the pin layout on the heatsink, multiple drillings or changes of the drillings are processed according to customers
G requirements.
For heatsinks exceeding 75 mm standard hole pattern can be supplied in multiple design.

Fixing slots
H
[mm] number of fixing slots
18.75

37.5 2
6.4

75 4

I
9

[mm] number of fixing slots

25

50 2
6.4

K 9 100 4

Heatsinks with the following shape and a standard hole pattern have these fixing slots as part of the serial production

Order example
L
SK 01 50 SA TO3

profile length surface pin layout

M Surface treatment for heatsinks with standard drilling: black anodised (SA).

Raw degreased aluminium (AL) and clear natural anodise (ME) on request.

Extruded heatsinks A 22 - 83 Die-cast heatsinks A 125

Heatsinks for printed circuit boards A 89 - 112 Reating springs for transistors A 115 - 117
N A 21 Thermal conductive material E 2 - 24 Lock-in transistor fixing spring A 84 - 88
Mount. material for semiconductors E 44 - 48 Technical introduction A 2-8
 A
Standard extruded heatsinks
Rth [K/W]
art. no.
40
35
30
B

6
25
20
8

2
15

SK 586 ... 50 100 150 200 [mm]

please indicate: ... C

37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
40
35
30
D

6
25
20
8

2
15

SK 616 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm E
art. no. Rth [K/W]
32
30
28
6

26
24
F
1,8

10 22

SK 496 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
art. no. Rth [K/W] G
32
30
10

28
26
24
10
1,8

22
H
SK 565 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
art. no. Rth [K/W]
30
I
25
8

20

15
11,8
2,5

10
K
50 100 150 200 [mm]
SK 470 ... extruded heatsinks for PCB mounting A 110
please indicate: ... ... (optional)
25 37.5 50 75 100 1000 mm SOT 32; TO 220
L

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 22 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
36
B 6,3

1,3
33

6,5
30

3,9
27
10,6
12,6 24

C SK 522 ... 15 30 45 60 [mm]

please indicate: ...

15 25 37.5 50 1000 mm
art. no. Rth [K/W]
14

D 12

3,5
15,24
10

6
13,5

E SK 469 ... extruded heatsinks for PCB mounting A 110

50 100 150 200 [mm]

please indicate: ... ... (optional)

25 37.5 75 100 1000 mm SOT 32; TO 220
art. no. Rth [K/W]
32
F 30

28
6

26

14 24
1,8

G SK 478 ... 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 1000 mm
Rth [K/W]
art. no.
20

H 16
10

12

14 4
1,8

I SK 552 ... 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 100 1000 mm
art. no. Rth [K/W]
25

K 20

15
14

10

5
14
2,5

SK 558 ... 50 100 150 200 [mm]

L please indicate: ...
25 37.5 50 75 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 23 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
26

24 B
22

8
3
20

15,3 18

SK 521 ... 50 100 150 200 [mm] C

please indicate: ...
25 37.5 50 75 100 1000 mm
art. no. Rth [K/W]
1,4 24
2,5
20 D
16
3,5

16
12

5
8

16
SK 437 ... extruded heatsinks for PCB mounting A 109
50 100 150 200 [mm]
E
please indicate: ... ... (optional)
100 1000 mm TO 218; TO 220; TO 247; TO 248
art. no. Rth [K/W]
26

24
F
22
6

20
21 18
1,8

SK 476 ... 50 100 150 200 [mm] G

please indicate: ...
37.5 50 75 100 1000 mm
art. no. Rth [K/W]
12

10 H
19

8
3

4
21,45
50 100 150 200 [mm] I
SK 454 ... extruded heatsinks for PCB mounting A 96
please indicate: ... ... (optional)
37.5 50 75 100 150 1000 mm SOT 32; TO 220
Rth [K/W]
art. no.
24 K
22

20
6

18

23 16
1,8

L
SK 477 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 24 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
24
B 22

10
20

18

23 16

1,8
C SK 582 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
art. no. Rth [K/W]
14

D 12

2,5
12,3
10

23 6

E SK 559 ... 50 100 150 200 [mm]

please indicate: ...

37.5 75 100 1000 mm
art. no. Rth [K/W]
12,5

F 10,0
12,3

7,5

5,0

24,2 2,5
3,5

SK 551 ...
G 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
16
14

H 12
8

10
3

8
6
25,8 4
2
SK 486 ... 50 100 150 200 [mm]
I please indicate: ...
37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
20

18

K
6

16

14
1,8

27 12

SK 473 ... 50 100 150 200 [mm]

please indicate: ...

L 37.5 50 75 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 25 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
12,5

10,0
B

10
7,5

5,0
27

1,8
2,5

SK 554 ... 50 100 150 200 [mm] C

please indicate: ...
37.5 50 75 100 1000 mm
art. no. Rth [K/W]
10

8 D
6

10
4

3
27 2

SK 447 ... 50 100 150 200 [mm] E

please indicate: ...
37.5 1000 mm
Rth [K/W]
art. no.
10

8 F
14

2
27
2,5

SK 560 ... 50 100 150 200 [mm]

G
please indicate: ...
37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
10

8
H
22

27
3,5

SK 566 ... 50 100 150 200 [mm]

please indicate: ...

I
37.5 50 75 100 1000 mm
art. no. Rth [K/W]
20

16

12
K
8

27,95 4
2,5

SK 561 ... 50 100 150 200 [mm]

please indicate: ... L

37.5 50 75 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 26 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
12
B 10

12,5
8

27,95 4

3,5
C 50 100 150 200 [mm]

SK 448 ... extruded heatsinks for PCB mounting A 111

please indicate: ...
37.5 50 75 mm
Rth [K/W]
art. no.
D 10

3,5
15,24
6

2
E SK 177 ...
27,95
50 100 150 200 [mm]

please indicate: ...

50 75 100 1000 mm
art. no. Rth [K/W]
11
F 10
11,5

8
29
3,5

G SK 550 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
12

H 10
25

8
3,5

4
29
I SK 452 ...
50 100 150 200 [mm]

extruded heatsinks for PCB mounting A 96

please indicate: ... ... (optional)
37.5 100 1000 mm TO 218; TO 220; TO 247; TO 248; TO 3 P
art. no. Rth [K/W]

K 12

10
17,5

6
3

SK 597 ... 30 4
L please indicate: ...
50 100 150 200 [mm]

37.5 50 75 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 27 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
Rth [K/W]
art. no.
20

16 B
12

6
8

1,8
31 4

SK 493 ... 50 100 150 200 [mm] C

please indicate: ...
37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
20

16
D

10
12

1,8
31 4

SK 581 ... 50 100 150 200 [mm]

please indicate: ...

E
37.5 50 75 100 1000 mm
art. no. Rth [K/W]
12

10

8 F
10
3

33 4

50 100 150 200 [mm]

SK 400 ... extruded heatsinks for PCB mounting A 111 G
please indicate: ...
37.5 50 75 100 1000 mm
art. no. Rth [K/W]
10

8
H
16,5

4
5

34,5
SK 178 ... 50 100 150 200 [mm]

please indicate: ...

I
37.5 75 100 1000 mm
art. no.

K
Rth [K/W]
50

3
L
2

1
5

SK 134 ... 34,5 50 100 150 200 [mm]

please indicate: ...

37.5 50 100 1000 mm
M

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 28 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
Rth [K/W]
art. no.
18

B 16

14

6
12

1,8
10
35
SK 471 ...
C 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 1000 mm
art. no. Rth [K/W]
16

D 14

10
12

10

1,8
35 8

SK 587 ...
E please indicate: ...
50 100 150 200 [mm]

37.5 50 75 100 1000 mm

art. no. Rth [K/W]
9

8
F
10
7

6
35
2,5

SK 549 ... 50 100 150 200 [mm]

G please indicate: ...

37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
8

7
14

H 6

4
35
2,5

SK 562 ... 50 100 150 200 [mm]

please indicate: ...

I 37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
10

8
12,3

6
K 4

2
36
3,5

SK 509 ... 50 100 150 200 [mm]

please indicate: ...

L 37.5 50 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 29 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
16

14 B
12

6
10

37 8

1,8
SK 563 ... 50 100 150 200 [mm] C
please indicate: ...
37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
20

16 D

10
12

37 4

1,8
SK 564 ... 50 100 150 200 [mm]
E
please indicate: ...
37.5 50 75 100 1000 mm
art. no. Rth [K/W]
10

8
F
30

4
12
10

2
6

SK 174 ... 38 50 100 150

please indicate: ...

200 [mm]
G
75 1000 mm
art. no. Rth [K/W]
10

8
H
3,5
16,5

2
38,1
SK 179 ... 50 100 150 200 [mm]

please indicate: ... I

37.5 50 100 1000 mm
Rth [K/W]
art. no.
16

14

K
6

12

10
40
1,8

50 100 150 200 [mm]

SK 456 ... extruded heatsinks for PCB mounting A 111
please indicate: ...
L
37.5 50 75 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 30 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
14

B 12

8
10

8
40

3,5
6

C SK 420 ... 50 100 150 200 [mm]

please indicate: ...

37.5 75 1000 mm
art. no. Rth [K/W]
15

D 12

10
9

6
40

1, 8
3

E SK 513 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
art. no. Rth [K/W]
16

F 14
10

12

10
40
2,5

G SK 547 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
art. no. Rth [K/W]
10

H 8
27

2
5

I SK 106 ... 40 50 100 150 200 [mm]

please indicate: ...

50 75 1000 mm
art. no. Rth [K/W]
6
K 5
22

4
8

L SK 472 ... 41,5

50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 31 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no.

Rth [K/W] B
5

34
3

2
C

8
1

41,5 50 100 150 200 [mm]

SK 189 ...
please indicate: ...
37.5 50 75 100 1000 mm
art. no. Rth [K/W] D
14

12

10

8
3
8

43,1 6 E
SK 423 ... 50 100 150 200 [mm]

please indicate: ...

100 1000 mm
art. no. Rth [K/W]
7
F
6
16,51

4
4

43,1
3
G
SK 422 ... 50 100 150 200 [mm]

please indicate: ...

50 1000 mm
art. no. Rth [K/W]
15 H
12
6

6
45
1,8

SK 511 ...
I
50 100 150 200 [mm]

please indicate: ...

50 75 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 32 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no.

60
Rth [K/W]
5

2
D

10
1

SK 453 ... 45 50 100 150 200 [mm]

please indicate: ... ... (optional)

37.5 75 mm SSR 1
E art. no. 5

F 80

Rth [K/W]
3,0
2,5
G 2,0
1,5

1,0
12

0,5

SK 455 ... 45 50 100 150 200 [mm]

H please indicate: ... ... (optional)
75 mm SSR 4
art. no. 5

K
85

Rth [K/W]
3,0

2,5

2,0

L 1,5

1,0
12

0,5

SK 467 ... 45 50 100 150 200 [mm]

M please indicate: ...

37.5 50 75 100 1000 mm
... (optional)
SSR 1; SSR 4

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 33 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
Rth [K/W]
art. no.
6
B

16,51
5

4
3

SK 424 ... 45,7

50 100 150 200 [mm]

please indicate: ... C

75 1000 mm
Rth [K/W]
art. no.
6

16,51
5

4 D

4
3

48,3
SK 425 ... 50 100 150 200 [mm]

please indicate: ...

75 mm
art. no.
E

Rth [K/W]
5
38
4 F
3

2
5

SK 445 ... 49,5 50 100 150 200 [mm] G

please indicate: ...
100 1000 mm
art. no.

H
50

Rth [K/W]
3,0

2,4
I
1,8

1,2
7

0,6

SK 450 ... 49,5 50 100 150 200 [mm]

K
please indicate: ...
75 1000 mm
art. no. Rth [K/W]

10
L
10

6
50
2,5

SK 548 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm M

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 34 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
Rth [K/W]
art. no.
5

B 4

4,5
25
3

SK 567 ... 50
C 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
art. no.

D Rth [K/W]
5

40
4

E 2

10
1

SK 434 ... 50 50 100 150 200 [mm]

please indicate: ... ... (optional)

50 75 100 1000 mm SSR 1
F art. no.

Rth [K/W]

4,0
G
45

3,5

3,0

2,5
3,5

2,0

H SK 475 ... 50 50 100 150 200 [mm]

please indicate: ...

37.5 50 100 1000 mm
art. no.

I
60

K
Rth [K/W]
5

L 2
10

SK 527 ... 50 50 100 150 200 [mm]

please indicate: ...

50 75 100 1000 mm
M

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 35 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
Rth [K/W]
art. no.
12

10 B

8
8

3
6
50,8 4

SK 427 ... 50 100 150 200 [mm] C

please indicate: ...
50 75 1000 mm
Rth [K/W]
art. no.
6

5
D

16,51
4

4
2
50,8
SK 426 ... 50 100 150 200 [mm]

please indicate: ... E

37.5 50 75 100 1000 mm
art. no. Rth [K/W]
10

8
12
6 F
5

51 2

SK 156 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
G
Rth [K/W]
art. no.
7,5

6,5
12,3

5,5

4,5
H
51
3,5
3,5

SK 468 ... 50 100 150 200 [mm]

please indicate: ...
37.5 75 1000 mm I
art. no. Rth [K/W]
10

8
16,5

4 K
5

2
53,3
SK 180 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
L

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 36 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
5

B 4

20
3

4
1
54
C SK 99 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 150 1000 mm
art. no. 5,5

6,3

3
Rth [K/W]
M3
2,2 1,5 3,5

55
3,0
22

19
2,5
E
6
4

2,0
M3 M3
1,5
35,6 5,2
7,5
SK 429 ... 54 50 100 150 200 [mm]

please indicate: ...

F 37.5 50 75 100 1000 mm
art. no. Rth [K/W]
3,5

3
55

2,5

G 2
22,6

16,8

1,5

SK 436 ... 58 50 100 150 200 [mm]

please indicate: ...

75 1000 mm
H
art. no.
55

Rth [K/W]
I
20,5

3
30

1
K 6,4
SK 50 ... 58 50 100 150 200 [mm]

please indicate: ...

75 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 37 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
10

8 B

8,9
6

4
61

3,7
2

SK 485 ... 50 100 150 200 [mm] C

please indicate: ...
50 75 100 1000 mm
art. no. Rth [K/W]
6

5
D
4

20
3
62,5 2

3,5
SK 444 ... 50 75 100 150 [mm]

please indicate: ...

E
37.5 50 75 1000 mm
Rth [K/W]
art. no.
5

4
4,5

F
25

1
6

63
SK 406 ... 50 100 150 200 [mm]

please indicate: ... G

37.5 50 75 100 1000 mm
art. no. Rth [K/W]
5

H
40

2
10

SK 100 ... 66
50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 150 1000 mm I
Rth [K/W]
art. no.
5

4
25

2
K
5

75 1

SK 594 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm L

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 38 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
Rth [K/W]
art. no.
5

B 4

10
2
80

2,5
1

C SK 545 ... 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
art. no. Rth [K/W]
5

D 4

32
3

5
1
82
SK 612 ... 50 100 150 200 [mm]
E please indicate: ...
37.5 50 75 100 150 1000 mm
art. no. 85

F Rth [K/W]
2,2

1,8
69

1,4
10

1,0
8

G 0,6

50 100 150 200 [mm]

SK 135 ... 82

please indicate: ...

50 100 1000 mm
H art. no. Rth [K/W]
5

4
4,2
25

I 83 1

SK 407 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
Rth [K/W]
art. no.
K 5

4
40

2
10

1
L 84
SK 464 ... 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 39 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
Rth [K/W]
art. no.
5

4 B
3

10
2

2
89 1

SK 182 ... 50 100 150 200 [mm] C

please indicate: ...
37.5 50 75 100 150 200 1000 mm
art. no.

100
Rth [K/W]
1,8

1,4 E
1,0

12 0,6

0,2

SK 507 ... 90 50 100 150 200 [mm] F

please indicate: ... ... (optional)
37.5 75 100 1000 mm SSR 1; SSR 2
art. no. Rth [K/W]
5

4
G
40

3
5,5

1
98
SK 408 ... 50 100 150 200 [mm] H
please indicate: ...
50 75 100 150 1000 mm
art. no. Rth [K/W]
5

4 I
3
10

2
100
2,5

SK 546 ... 50 100 150 200 [mm] K

please indicate: ...
37.5 50 75 100 150 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 40 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
5

B 4

15
3

2
100

4
1

C SK 81 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
art. no. Rth [K/W]
5,0

D 4,0

3,0

15
2,0
100

4
1,0

E SK 505 ... weight reduced like SK 81

50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 150 1000 mm
art. no. Rth [K/W]
4,0
F 4,3
3,0
25
2,0

1,0
100

G SK 508 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
art. no. Rth [K/W]
2,5

H 2,0
40

1,5

1,0
10

0,5

100
SK 92 ...
I 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
art. no. Rth [K/W]
3,0

K 2,5
7,6

2,0
33

1,5

1,0

111,1
SK 433 ... 50 100 150 200 [mm]
L please indicate: ...
37.5 50 75 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 41 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no.
Rth [K/W]

2,5
B

67,5
2,0

1,5

10,5
1,0

0,5 C
SK 121 ... 112 50 100 150 200 [mm]

please indicate: ...

75 100 150 1000 mm
art. no.
D

70
E

114,5
Rth [K/W]

2,5

2,0

1,5

F
44,5
1,0
31,8

108,2 0,5

50 100 150 200 [mm]

SK 33 ... 114,2

please indicate: ...

50 75 100 1000 mm
... (optional)
SSR 1
G
art. no. Rth [K/W]
2,5

2,0
50

1,5

1,0
H
15

0,5

SK 411 ... 116,5 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm I
art. no. 4 Rth [K/W]
2,5

2,0
10,3
40

1,5

1,0 K
0,5
6
SK 442 ... 120 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
L

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 42 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
2,5
B 2,0

60
1,5

1,0

0,5

9
C SK 595 ... 120 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
Rth [K/W]
art. no.
2,5
D

4,2
2,0

25
1,5

1,0

130 0,5

E SK 463 ... 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
art. no.

F Rth [K/W]

2,5
84
2,0

1,5

G 1,0

0,5
15

SK 613 ... 130 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 150 1000 mm
H art. no. Rth [K/W]
2,5

2,0
50
10,2

1,5

1,0
I 0,5

SK 466 ... 138 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
K art. no. 120,25
Rth [K/W]
2,5

2,0
7,9
33,3

1,5

1,0

L 0,5

141,05
SK 413 ... 50 100 150 200 [mm]

please indicate: ...

100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 43 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
8

6 B

9
4

2
149,6

4
SK 601 ... 50 100 150 200 [mm]

please indicate: ... C

50 75 100 150 1000 mm
art. no. Rth [K/W]
3,7

3,0

2,2
D

19
1,5

0,7
150

6
SK 553 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 150 1000 mm E
Rth [K/W]
art. no.
2,5

2,0

4,5
25
1,5

1,0
F
0,5
150
SK 132 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 150 1000 mm
G
art. no. Rth [K/W]
2,5

2,0
4,7

1,5
25

1,0
H
0,5
150
SK 410 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 150 1000 mm
art. no. Rth [K/W]
I
2,5

2,0
27

1,5
5

1,0

0,5
K
150
SK 133 ... 50 100 150 200 [mm]

please indicate: ...

50 75 100 1000 mm
L

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 44 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
Rth [K/W]
art. no.
2,5

B 2,0

27
1,5

5
1,0

0,5
150
C SK 58 ... 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
art. no. Rth [K/W]
1,7

D 1,5

5
27
1,3

1,1

0,9
150

E SK 504 ...
50 100 150 200 [mm]

weight reduced like SK 58

please indicate: ...
37.5 50 75 100 150 1000 mm
art. no. Rth [K/W]
2,5
F 2,0

39,5
1,5

9 1,0

0,5

G SK 588 ... 150

50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
art. no. Rth [K/W]
2,5

H 2,0
40

1,5
4,5

1,0

0,5

150
I SK 120 ... 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
art. no. Rth [K/W]
2,5

K 2,0
50

1,5

1,0
15

0,5

SK 155 ... 150

L please indicate: ...
50 100 150 200 [mm]

75 100 150 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 45 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no.

B
Rth [K/W]
1,0

71
0,8
11
0,6
C

3
0,4

0,2
8 4
SK 154 ... 156 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 mm D
art. no. Rth [K/W]
5

19
3

2
E

6
160 1

SK 417 ... 50 100 150 200 [mm]

please indicate: ...

75 100 150 1000 mm F
Rth [K/W]
art. no.
2,5

2,0
40

1,5

1,0 G
10

0,5

160
SK 85 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 150 1000 mm
art. no. Rth [K/W]
H
1,4

1,2
40

1,0

0,8
I
10

0,6
160
50 100 150 200 [mm]
SK 503 ... weight reduced like SK 85
please indicate: ...
75 100 1000 mm K
art. no. Rth [K/W]
2,5

2,0
50

1,5

1,0
L
9

0,5

SK 510 ... 160 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm M

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 46 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
2,5

B 2,0

50
1,5

1,0

10
0,5

C SK 416 ... 160 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
art. no. Rth [K/W]
2,0

D 1,6

1,2

25
4
0,8

0,4
162
SK 119 ...
E please indicate: ...
50 100 150 200 [mm]

50 75 100 150 1000 mm

art. no. Rth [K/W]
2,0

1,6
F

40
1,2

0,8

10 0,4

SK 412 ... 163

50 100 150 200 [mm]
G please indicate: ...
50 75 100 150 1000 mm
art. no. Rth [K/W]
2,5

2,0

H
15

1,5

1,0
167
4,5

0,5

SK 421 ... 50 100 150 200 [mm]

I please indicate: ...

50 75 100 150 200 1000 mm
Rth [K/W]
art. no.
5

4
2,5

3
K
10

169
2

SK 405 ... 50 100 150 200 [mm]

please indicate: ...
L 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 47 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
2,0

1,6 B

9,8
40
1,2

0,8

0,4

177,5
SK 519 ... 50 100 150 200 [mm] C
please indicate: ...
50 100 1000 mm
art. no. Rth [K/W]
1,0

0,8
D

50
0,6

5
0,4

0,2

SK 90 ... 190
please indicate: ...
50 100 150 200 [mm]
E
50 75 100 1000 mm
art. no. Rth [K/W]
2,5

2,0
F
15
1,5

200 1,0
3,5

0,5

SK 136 ... 50 100 150 200 [mm]

please indicate: ... G

75 100 150 1000 mm
art. no. Rth [K/W]
2,5

2,0
H
15

1,5

1,0
200
3,5

0,5

SK 166 ... 50 100 150 200 [mm]

please indicate: ... I

1000 mm
art. no. Rth [K/W]
2,5

2,0

K
20

1,5

1,0

200
4

0,5

SK 113 ... 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 1000 mm
L

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 48 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
2,5
B 2,0

1,5

25
1,0

0,5
200

4
C SK 42 ... 50 100 150 200 [mm]

please indicate: ...

50 75 100 150 200 1000 mm
art. no. Rth [K/W]

200 2,5

D 2,0

2,2
25
1,5

1,0

3,7 5,7 0,5

4

1,5
188,3
SK 94 ...
E 50 100 150 200 [mm]

please indicate: ...

1000 mm
art. no. Rth [K/W]
1,3

F 1,1

9,2
39,9
0,9

0,7

0,5
200
50 100 150 200 [mm]
G SK 502 ... weight reduced like SK 47
please indicate: ...
37.5 50 75 100 150 1000 mm
art. no. Rth [K/W]
1,2
H 1,0
40

0,8
10

0,6

0,4
200
I SK 47 ... 50 100 150 200 [mm]

please indicate: ...

75 100 150 1000 mm
art. no.
Rth [K/W]

K 2,0
1,6

1,2
60

0,8

0,4
10

L SK 591 ... 200

50 100 150 200 [mm]

please indicate: ...

75 100 150 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 49 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
1,0

0,8
B

16,5
83
0,6

0,4

0,2

SK 520 ... 200 50 100 150 200 [mm] C

please indicate: ...
75 100 150 1000 mm
art. no. Rth [K/W]
1,0

0,8
D

10
40
0,6

0,4

0,2
213
SK 193 ... 50 100 150 200 [mm] E
please indicate: ...
100 150 1000 mm
Rth [K/W]
art. no.
1,0

0,8 F
77
0,6

0,4

0,2
17

SK 557 ... 216 50 100 150 200 [mm]

G
please indicate: ...
75 100 150 1000 mm
art. no. Rth [K/W]
1,0

0,8
H
83

0,6

0,4

0,2
15

SK 102 ... 216 50 100 150 200 [mm]

I
please indicate: ...
75 100 150 1000 mm
art. no. Rth [K/W]
13,5 104,5 80 15 1,2

13,5 1,0

0,8
K
7,6
40

0,6

0,4

SK 168 ... 226,5 50 100 150 200 [mm]

please indicate: ... L

1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 50 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
1,0
B 0,8

60
0,6

0,4

8
0,2

C SK 580 ... 235

50 100 150 200 [mm]

please indicate: ...

75 100 150 200 1000 mm
art. no. Rth [K/W]
1,2

D 1,0

5
25
0,8

0,6

245 0,4

E SK 118 ... 50 100 150 200 [mm]

please indicate: ...

75 100 150 1000 mm
art. no. Rth [K/W]
2,5

F 2,0

6
28
1,5

1,0

0,5
250
SK 49 ...
G 50 100 150 200 [mm]

please indicate: ...

50 75 150 200 1000 mm
art. no. Rth [K/W]
1,0

0,8
H
40

0,6
6

0,4

0,2
250
SK 555 ... 50 100 150 200 [mm]
I please indicate: ...
75 100 150 1000 mm
art. no. Rth [K/W]
1,0

0,8

K
40

0,6
6

0,4

0,2
250
SK 199 ... 50 100 150 200 [mm]

L please indicate: ...

75 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 51 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
Rth [K/W]
art. no.
1,1

0,9 B

10
40
0,7

0,5

250 0,3

SK 524 ... 50 100 150 200 [mm] C

please indicate: ...
75 100 150 1000 mm
art. no. Rth [K/W]
250 1,0

0,8 D
10

3,4
40
0,6

0,4

0,2
1,9

230,5
SK 91 ... 4 7,5 50 100 150 200 [mm]
E
please indicate: ...
75 100 150 1000 mm
art. no. Rth [K/W]
0,6

0,5
F
83
0,4

0,3

0,2
15

SK 438 ... 250 50 100 150 200 [mm]

G
please indicate: ...
75 100 150 1000 mm
art. no. Rth [K/W]
252
1,0

0,8
H
0,6
40
6
2

0,4

0,2
5
6

258
SK 190 ...
please indicate: ...
50 100 150 200 [mm]
I
150 1000 mm
art. no. Rth [K/W]
1,0

0,8
K
67,5
11,5

0,6

0,4

0,2

260
SK 614 ... 50 100 150 200 [mm]

please indicate: ...

L
75 100 150 200 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 52 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
2,5
B 2,0

50
1,5

6
1,0

0,5
265
C SK 149 ... 50 100 150 200 [mm]

please indicate: ...

200 1000 mm
art. no. Rth [K/W]
1,0

D 0,8

54
74

0,6
6,5

10
0,4

20
15
0,2

3,5
10,7

E SK 139 ... 265 9 50 100 150 200 [mm]

please indicate: ...

100 150 200 1000 mm
Rth [K/W]
art. no.
1,3

F 6 1,1

0,9

28
0,7
6

0,5
282
SK 583 ...
G 50 100 150 200 [mm]

please indicate: ...

100 150 200 1000 mm
art. no. Rth [K/W]

1,2

H
3,9

1,0
15

0,8

0,6
300
0,4
SK 198 ... 50 100 150 200 [mm]
I please indicate: ...
100 150 1000 mm
Rth [K/W]
art. no.
1,2
6,5

1,0
K
27

0,8

0,6
300
0,4
SK 446 ... 50 100 150 200 [mm]

L please indicate: ...

75 100 150 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 53 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
1,0

0,8 B
10 0,6

40
0,4

0,2
300
SK 56 ... 50 100 150 200 [mm] C
please indicate: ...
75 100 150 200 1000 mm
art. no. Rth [K/W]
0,6

0,5 D
10

0,4

40
0,3

0,2
300

SK 501 ...
50 100 150 200 [mm]
E
weight reduced like SK 56
please indicate: ...
37.5 50 75 100 150 200 1000 mm
art. no. Rth [K/W]
0,5
F
0,4

0,3
60
0,2
12

0,1

SK 568 ...
300
50 100 150 200 [mm]
G
please indicate: ...
75 100 150 200 1000 mm
art. no. Rth [K/W]
0,5

0,4
H
83,5

0,3
12

0,2
40

0,1

SK 157 ... 300 50 100 150 200 [mm] I

please indicate: ...
100 150 200 1000 mm
art. no. Rth [K/W]
1,0

0,8
K
4,5

39,5

0,6

0,4
304 0,2

SK 101 ... 50 100 150 200 [mm] L

please indicate: ...
75 100 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 54 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth [K/W]
2,0

B 1,6

4
1,2

20
0,8
320 0,4

C SK 579 ... 50 100 150 200 [mm]

please indicate: ...

75 100 150 200 1000 mm
art. no. Rth [K/W]
338 1,0
285
D 0,8

32
0,6

0,4
5

8 0,2

5
SK 66 ... 126 126
E please indicate: ...
50 100 150 200 [mm]

75 100 1000 mm
art. no. Rth [K/W]
0,7

0,6
F

40
0,5

0,4

350 0,3

7,2
SK 523 ... 50 100 150 200 [mm]

G please indicate: ...

100 150 200 1000 mm
art. no. Rth [K/W]
8 0,8

0,7
25

H 0,6

380 0,5
5

0,4

SK 439 ... 50 100 150 200 [mm]

I please indicate: ...

100 150 1000 mm
art. no. Rth [K/W]
1,0

0,8

K
40

0,6

0,4

400 0,2
9,2

SK 479 ... 50 100 150 200 [mm]

please indicate: ...

L 75 100 150 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
N A 55 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
1,0
400
0,8
B
10

40
0,6

0,4

0,2

3,4
1,9

380,5
SK 93 ... 4 7,5 50 100 150 200 [mm] C
please indicate: ...
75 100 150 1000 mm
art. no. Rth [K/W]
1,0

0,8 D

40
0,6

0,4
420

6
0,2

SK 130 ... 50 100 150 200 [mm]

E
please indicate: ...
200 1000 mm
art. no. Rth [K/W]
1,0

0,8
F
57,5
0,6

0,4

426,4 0,2
10,5

SK 621 ... 50 100 150 200 [mm]

please indicate: ...

G
75 100 150 200 1000 mm
Rth [K/W]
art. no.
1,0
33,5

0,8
11,4
0,6
H
0,4

0,2
482,8 = 19"
8

50 100 150 200 [mm]

SK 191 ... suitable heatsink for rear panal in 19'' cases I
please indicate: ...
75 100 150 200 1000 mm

High decorative surfaces A 9 Heatsinks for Solid State Relay A 11 12

Order example A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 56 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Welded high perfomance heatsinks
optimum fin geometry and fin quantity for free convection
well suited for forced convection
B flat milled base (not SK 530, SK 531)
* = welded joint (not SK 530, SK 531)
length according customers details
customer specific versions and machining on request
Rth

C [K/W] 0,40

0,38

0,36

0,34

0,32
D 0,30

0,28

0,26

0,24

E 0,22

0,20
SK 530
0,18
12,5
0,16

F 0,14
SK 531
0,12
C

0,10 SK 533

0,08 SK 535
SK 536
A

0,06 SK 537
SK 538
G < Rz10
< 0,1 100
0,04
SK 539
SK 540

*
B 100 200 300 400
[mm]
art. no. number of fins dim. [mm]
H A B C
SK 530 ... 14 15 0.7 200 0.7 84 0.7
SK 531 ... 22 15 0.7 300 1 84 0.7
SK 533 ... 30 16 +0/ -1.5 400 +0.6/ -1.6 84 +0/ -1.5
SK 535 ... 38 16 +0/ -1.5 500 +0.6/ -1.6 84 +0/ -1.5
I SK 536 ... 42 16 +0/ -1.5 550 +0.6/ -1.6 84 +0/ -1.5
SK 537 ... 46 16 +0/ -1.5 600 +0.6/ -1.6 84 +0/ -1.5
SK 538 ... 50 16 +0/ -1.5 650 +0.6/ -1.6 84 +0/ -1.5
SK 539 ... 54 16 +0/ -1.5 700 +0.6/ -1.6 84 +0/ -1.5
K SK 540 ... 58 16 +0/ -1.5 750 +0.6/ -1.6 84 +0/ -1.5
please indicate: ...
200 300 400 500 600 mm

High decorative surfaces A 9 heatsinks for Solid State Relais A 11 12

Heatsink profile-overview A 21 Special heatsink design A 137 138
N A 57 Heatsink as visual & decor-parts A 10 Special profiles A 140
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
 A
High performance heatsinks with press-in fins
other length according to customers details
customer specific versions and machining upon request
art. no. 4 B
R 0,3 6,2

R 1

4
71

3, 6

12,5 Rth [K/W]

C
0,35
6 0,3
7,5
8

0,25

0,2 D

84 0,6
0,15

12
0,1

16
0,05

SK 418 ... 200 1,2 100 150 200 250 300 350 400 [mm] E
please indicate: ...
100 150 200 1000 mm
Rth 0,35
[K/W]
4,8 0,3
F
0,25
R 0,4
0,2

R 1,1 0,15
SK 158
69

5,2 0,1
13,5

SK 159
SK 160 G
5

0,05 SK 161
SK 162

100 150 200 250 300 350 400 [mm]

4,8 12,5 v = 5 m/s

Rth 0,08
[K/W] 0,07
H
0,06
0,05
+ 1,2
83,5 1

0,04
0,03 SK 158
I
A

0,02 SK 159
SK 160
0,01 SK 161
15

B SK 162

100 150 200 250 300 350 400 [mm]

art. no. number of fins dim. [mm]
A B K
SK 158 ... 22 20 300 2
SK 159 ... 30 20 400 2
SK 160 ... 38 20 500 2.5
SK 161 ... 46 20 600 3 L
SK 162 ... 58 20 750 4
please indicate: ...
200 300 400 500 600 mm

High decorative surfaces A 9 heatsinks for Solid State Relais A 11 12

Heatsink profile-overview A 21 Special heatsink design A 137 138
Heatsink as visual & decor-parts A 10 Special profiles A 140 A 58 N
Drilling pattern for Solid State Relais A 12 Technical introduction A 28
A
Standard extruded heatsinks
art. no. SK 09 37,5 TO 220 1
SK 09 37,5 TO 220 SK 09 50 TO 220 SK 09 20 TO 220
SK 09 50,0 TO 220 1
B 3,2
3,2 3,2 3,2

9,6 14,8

20
7

17
11,3 14,75
4,5

37,5

4,5

14,75
50
29
C

4,5
Rth [K/W]

17,7
3,2 16
7
29 29 14
7 12
12 29
10
D

2,5
8

11,5
6
20 37,5 50 75 100
[mm]
SK 09 ... 29
please indicate: ... ... (optional)
E 20 37.5 50 1000 mm K; TO 220
art. no. SK 145 20 TO 220 SK 145 37,5 TO 220 SK 145 50 TO 220 SK 145 25 TO 220

3,2 3,2 3,2 3,2

F
20

25
17

4,5

11,3 14,75

4,5
37,5

5,1
14,75
50

14,75
29 7
4,5

29
7 17,7 Rth [K/W]
29 14
G 7 12
15,5 29
10
12

8
3

6
25,4
H SK 145 ... 29 50 100 150 200 [mm]

please indicate: ... ... (optional)

20 25 37.5 50 1000 mm TO 220
art. no. Rth [K/W]
3,6
3,6 20
3,5
I 16
2,5

12
12,5

11,7 4

SK 443 ... 30,1

K 50 100 150 200 [mm]

please indicate: ...

37.5 75 100 1000 mm
art. no. Rth [K/W]
10
37,5

L 8
6,7

6
39

2
44,5
SK 173 ... 76,2 50 100 150 200 [mm]
M please indicate: ...
1000 mm

Hole pattern A 21 Screw mounted guide rails E 26 27

Profiles for PCB components A 91 Thermal conductive material E 2 24
N A 59 Heatsinks for PCB A 89 Heatsink-cooling aggregates D 14
Profiles for PCB mounting A 89 112 Technical introduction A28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
10
19,5
8 B

2,5

12,5
6

2
42,7
SK 59 ... 50 100 150 200 [mm] C
please indicate: ... ... (optional)
37.5 50 75 100 1000 mm TO 220
art. no. Rth [K/W]
27,4 8

6 D

12,5
4

2
45
SK 122 ... 50 100 150 200 [mm]

please indicate: ... ... (optional)

37.5 50 mm TO 3; CB E
art. no. Rth [K/W]
7
32
6

5
F
4
25

24
2,4

3
4

46 1

SK 107 ... 50 100 150 200 [mm]

G
please indicate: ...
50 75 100 1000 mm
Rth [K/W]
art. no.
5

11 7,5 4 H
3
20
2,5

SK 181 ... 50
50 100 150 200 [mm] I
please indicate: ...
50 75 100 1000 mm
art. no. 2xM3 11 7,5
20

K
2,5

20

83,82
94
50
16,5
4,2 4,2 Rth [K/W]
5
3xM3
4
L
50
4

3
17,25

2
8

1
19,06 27,94 27,94
SK 181 94 C 3 50 100 150 200 [mm] M
x TO 220 retaining spring for transistor THF 409 TO 220 A 115

Hole pattern A 21 Screw mounted guide rails E 26 27

Profiles for PCB components A 91 Thermal conductive material E 2 24
Heatsinks for PCB A 89 Heatsink-cooling aggregates D 14 A 60 N
Profiles for PCB mounting A 89 112 Technical introduction A28
A
Standard extruded heatsinks
art. no. Rth [K/W]
10
B 33
8

15
4
4

2
60
C SK 78 ... 50 100 150 200 [mm]

please indicate: ... ... (optional)

37.5 50 75 100 1000 mm TO 3; CB
Rth [K/W]
art. no.
10

D 35,5 8

20
3,5
4

SK 51 ...
E 60 50 100 150 200 [mm]

please indicate: ... ... (optional)

37.5 50 75 100 1000 mm TO 3; CB
art. no. Rth [K/W]
5

F 34 4

17,5
3
4

SK 165 ... 62
50 100 150 200 [mm]
G please indicate: ... ... (optional)
37.5 50 75 1000 mm TO 3; CB
art. no.
1,7

Rth [K/W]
5

H 4
28,5

29 3

2
9,2

28
I 63,2 50 100 150 200 [mm]

SK 25 ... with slots for cover plates or PCBs

please indicate: ...
37.5 50 1000 mm
art. no. 25,4
Rth [K/W]

K 10

8
2,6
2

12,1

6
5

3,2
1,5

57,4 2

L SK 150 ... 63,8

50 100 150 200 [mm]

please indicate: ...

1000 mm

Hole pattern A 21 Screw mounted guide rails E 26 27

Profiles for PCB components A 91 Thermal conductive material E 2 24
N A 61 Heatsinks for PCB A 89 Heatsink-cooling aggregates D 14
Profiles for PCB mounting A 89 112 Technical introduction A28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
33 5

4 B

24
3

4
2

SK 18 ... 65 50 100 150 200 [mm] C

please indicate: ... ... (optional)
37.5 50 75 1000 mm TO 3; CB
art. no. Rth [K/W]
29 5

4 D

27
3

4
2

SK 63 ... 65 50 100 150 200 [mm]

E
please indicate: ... ... (optional)
37.5 50 75 100 1000 mm TO 3; CB
art. no.
1,7

Rth [K/W]
5

4
F
25

29
28,5
3,7

65 50 100 150 200 [mm] G

SK 05 ... with slots for cover plates or PCBs
please indicate: ... ... (optional)
50 75 1000 mm TO 3; CB
art. no. 27,1
Rth [K/W] H
5
33,8

2
4

1
I
SK 402 ... 71,1 50 100 150 200 [mm]

please indicate: ... ... (optional)

100 mm TO 3; CB
art. no. Rth [K/W] K
5
37,8
4
23,5

1 L
72
4,5

SK 97 ... 50 100 150 200 [mm]

please indicate: ... ... (optional)

37.5 50 75 100 1000 mm TO 3
M

Hole pattern A 21 Screw mounted guide rails E 26 27

Profiles for PCB components A 91 Thermal conductive material E 2 24
Heatsinks for PCB A 89 Heatsink-cooling aggregates D 14 A 62 N
Profiles for PCB mounting A 89 112 Technical introduction A28
A
Standard extruded heatsinks
art. no. Rth [K/W]

5
B 31,5 4

15
3

1
79
C SK 45 ... 50 100 150 200 [mm]

please indicate: ... ... (optional)

37.5 50 75 100 1000 mm TO 3; CB
Rth [K/W]
art. no.
5

D 35
4

14,5
3

1
94
SK 19 ... 50 100 150 200 [mm]
E please indicate: ... ... (optional)
37.5 50 75 100 1000 mm TO 3; CB
Rth [K/W]
art. no.
5

4
36
F 3
3,5

20
2

94,5
SK 28 ... 50 100 150 200 [mm]

G please indicate: ...

37.5 50 75 1000 mm
... (optional)
TO 3; CB
art. no. Rth [K/W]
5
33 4

H
25

3
4

SK 401 ... 95 50 100 150 200 [mm]

please indicate: ... ... (optional)

I 100 1000 mm TO 3; CB
art. no. Rth [K/W]
5

33 4
25

3
24

K
4

SK 72 ... 97
50 100 150 200 [mm]

please indicate: ... ... (optional)

L 37.5 50 75 100 1000 mm TO 3; CB

Hole pattern A 21 Screw mounted guide rails E 26 27

Profiles for PCB components A 91 Thermal conductive material E 2 24
N A 63 Heatsinks for PCB A 89 Heatsink-cooling aggregates D 14
Profiles for PCB mounting A 89 112 Technical introduction A28
 A
Standard extruded heatsinks
art. no. Rth [K/W]

1,6
5
B

3
4

3
36

25
4
2

97 50 100 150 200 [mm] C

SK 04 ... with slots for cover plates or PCBs
please indicate: ... ... (optional)
37.5 50 75 100 1000 mm SSR 1; SSR 2; TO 3; CB
art. no.
38 Rth [K/W]
5
D

40
4

10
3

1 E
SK 403 ... 104 50 100 150 200 [mm]

please indicate: ...

1000 mm
art. no. Rth [K/W]
5 F
4
30,6
23
3,5

105
1
G
SK 73 ... 50 100 150 200 [mm]

please indicate: ... ... (optional)

50 75 1000 mm TO 3; CB
art. no. Rth [K/W]
34 2,5
H
2,0
37

1,5
6

1,0

0,5

SK 71 ... 120
50 100 150 200 [mm]
I
please indicate: ... ... (optional)
37.5 50 75 100 1000 mm TO 3
art. no.
K
10

Rth [K/W]
2,5
1,6

50

2,0

36 1,5
8

1,0
L
0,5

120 50 100 150 200 [mm]

SK 57 ... with slots for cover plates or PCBs
please indicate: ...
37.5 75 100 1000 mm M

Hole pattern A 21 Screw mounted guide rails E 26 27

Profiles for PCB components A 91 Thermal conductive material E 2 24
Heatsinks for PCB A 89 Heatsink-cooling aggregates D 14 A 64 N
Profiles for PCB mounting A 89 112 Technical introduction A28
A
Standard extruded heatsinks
art. no. Rth [K/W]
2,5

B 35
2,0

32,6

2,35
4,7
1,4
1,5

1,0

3,85 5,85 0,5

125,65
C SK 197 ... 145 50 100 150 200 [mm]

please indicate: ... ... (optional)

37.5 1000 mm TO 3; CB
art. no. 32 0,5 Rth [K/W]
2,5

D 2,0

1,6

29
1,5

40
1,0

6
0,5

150
E SK 98 ... with slots for cover plates or PCBs
50 100 150 200 [mm]

please indicate: ...

100 150 mm
art. no. 15,4 52,9 Rth [K/W]
1,4
F 1,2
10

40
1,0

0,8

0,6

G SK 404 ... 160 50 100 150 200 [mm]

please indicate: ... ... (optional)

50 75 1000 mm TO 3; CB

Hole pattern A 21 Screw mounted guide rails E 26 27

Profiles for PCB components A 91 Thermal conductive material E 2 24
N A 65 Heatsinks for PCB A 89 Heatsink-cooling aggregates D 14
Profiles for PCB mounting A 89 112 Technical introduction A28
 A
Standard extruded heatsinks
art. no. 69,4 Rth [K/W]
5
37
4 B
3

26
2

4
1

88 50 100 150 200 [mm] C

SK 36 ... mounting parts IS 1, IS 2, IS 3 E 49
please indicate: ... ... (optional)
50 75 1000 mm TO 3; CB
art. no. 93 Rth [K/W]

36 5
D
4

4
3

26
2

115
E
50 100 150 200 [mm]
SK 01 ... mounting parts IS 1, IS 2, IS 3 E 49
please indicate: ... ... (optional)
37.5 50 75 100 1000 mm TO 3; CB
art. no. 92
38,5
F
1,6
10

G
4

Rth [K/W]
63

2,5

2,0
36 1,5

1,0
H
2

0,5

115 50 100 150 200 [mm]

SK 02 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49

please indicate: ...
37.5 50 75 100 1000 mm
... (optional)
TO 3; CB
I
art. no. 100
3

1,6

Rth [K/W]
5
4

4
K
3
32

2
2

36 1

120 50 100 150 200 [mm]

SK 03 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49 L
please indicate: ... ... (optional)
50 75 100 1000 mm TO 3; CB

Thermal conductive material E 25 Order example A 21

Mounting material for semiconduct. E 44 48 Guide rails for PCBs E 26 27
Mounting parts for heatsinks E 49 50 Heatsink-cooling aggregates D 14 A 66 N
Distance sleeves for PCBs in HP grid E 39 Technical introduction A28
A
Standard extruded heatsinks
art. no. 100 Rth [K/W]

1,7
5
B

5
4,8
4

31,4
2

34 1

C 121,3 50 100 150 200 [mm]

SK 39 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49
please indicate: ... ... (optional)
75 100 1000 mm TO 3; CB
art. no. 100,6
D
10
Rth [K/W]

4,8
2,5
1,6

2,0

67
1,5
E 33,8 1,0

0,5

122 50 100 150 200 [mm]

SK 30 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49

F please indicate: ... ... (optional)
75 100 1000 mm TO 3; CB
art. no. 104
10

Rth [K/W]

G 2,5
1,6

2,0
65

1,5

1,0

36 0,5

H 125 50 100 150 200 [mm]

SK 34 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49
please indicate: ... ... (optional)
50 75 100 1000 mm TO 3; CB

I art. no. 106

10

Rth [K/W]
2,5
1,7

2,0
66

K 1,5

1,0

34 0,5

125 50 100 150 200 [mm]

SK 14 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49
L
please indicate: ... ... (optional)
50 75 100 mm TO 3; CB

Thermal conductive material E 25 Order example A 21

Mounting material for semiconduct. E 44 48 Guide rails for PCBs E 26 27
N A 67 Mounting parts for heatsinks E 49 50 Heatsink-cooling aggregates D 14
Distance sleeves for PCBs in HP grid E 39 Technical introduction A28
 A
Standard extruded heatsinks
art. no. 34

4,5
4
Rth [K/W]
B

28
5

7
4

1,6

2,5
89
1 C
100 50 100 150 200 [mm]
SK 20 ... with slots for cover plates or PCBs; mounting parts IS 5, IS 8 E 49
please indicate: ... ... (optional)
37.5 75 100 1000 mm TO 3; CB
art. no. 4
D
50,5
Rth [K/W]

5,5
5
5

38
E

8,4
3
17,5

SK 184 ... 106,4 50 100 150 200 [mm]

please indicate: ...

100 1000 mm
F
art. no. 34
5,8
5

Rth [K/W]
3,5

2,5
5
1,8

2,0 G
50

1,5

1,0

0,5
119
132 50 100 150 200 [mm] H
SK 148 ... with slots for cover plates or PCBs
please indicate: ... ... (optional)
37.5 100 1000 mm TO 3; CB
art. no. Rth [K/W]

35,5
2,5
I
2,0
4

1,5
25

1,0

0,5
142
SK 84 ... 50 100 150 200 [mm]
K
please indicate: ... ... (optional)
50 150 1000 mm TO 3

Guide rails for PCBs E 26 30 Order example A 21

Mounting material for semiconduct. E 44 48 Assignment table A 18 20
Mounting parts for heatsinks E 49 50 Hole pattern A 21 A 68 N
Heatsink-cooling aggregates D 14 Technical introduction A 28
A
Standard extruded heatsinks
art. no. 34
Rth [K/W]
2,5

B 2,0

40
1,5

6,5
1,0

145 0,5

C 164 50 100 150 200 [mm]

SK 67 ... mounting part IS 6 E 49
please indicate: ... ... (optional)
37.5 50 100 1000 mm TO 3

Guide rails for PCBs E 26 30 Order example A 21

Mounting material for semiconduct. E 44 48 Assignment table A 18 20
N A 69 Mounting parts for heatsinks E 49 50 Hole pattern A 21
Heatsink-cooling aggregates D 14 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. 46
10
B

18,75
1xM3
4

22,5

37,5
3,5

2xM3
14

37,5
5

75
37,5
12
38
C

18,75
54

14
37,5 mm 5,5 K/W 75 mm 3,6 K/W

SK 65 ... for cases SOT 32

please indicate: ...
37.5 75 mm
... (optional)
1xM3; 2xM3
D
art. no. 62
12

18,75
1xM3
37,5
25
4

3,5

13

2xM3
37,5
37,5

75
5

17
54

18,75
70

13
37,5 mm 4,1 K/W 75 mm 2,7 K/W
F
SK 64 ... for cases TO 220, TOP 3
please indicate: ... ... (optional)
37.5 75 mm 1xM3; 2xM3
art. no. 78 G
4,3
4

Rth [K/W]
26,5

3,0

2,5
H
9

2,0

1,5

25,1 1,0
47
SK 419 ... 77 50 100 150 200 [mm]
I
please indicate: ...
1000 mm
art. no. 36
Rth [K/W]
5
3

4
K
21

3
1,6

1
120
50 100 150 200 [mm]
SK 21 ... with slots for cover plates or PCBs; mounting parts IS 1, IS 2, IS 3 E 49 L
please indicate: ... ... (optional)
37.5 1000 mm TO 3; CB

Mounting for TO 3 angle A 125 Insulting clamping parts E 45

Order example A 21 Mica wafers E 19
Special heatsink design A 137 138 Insulator sleeves E 52 A 70 N
Heatsinks for DC/DC converter A 113 114 Technical introduction A28
A
Standard extruded heatsinks
art. no. Rth [K/W]
5
100
B 34 4

1,5
3

11,7
2

1
120,5

C SK 69 ...
50 100 150 200 [mm]
mounting parts IS 1, IS 2, IS 3 E 49
please indicate: ... ... (optional)
50 75 100 1000 mm TO 3; CB
art. no. Rth [K/W]
31,5 5
D 4

5,5

22
3

1
127
E SK 74 ... 50 100 150 200 [mm]

please indicate: ... ... (optional)

37.5 100 1000 mm TO 3; CB
art. no. Rth [K/W]
38 2,5

F 2,0

33
8

1,5

1,0

0,5
140
G SK 124 ... 50 100 150 200 [mm]

please indicate: ... ... (optional)

50 100 150 1000 mm TO 3
art. no. 165 Rth [K/W]
2,5
60
H 2,0
5,1

2,8
1,5

25

1,5

1,0
4,2 7,6
0,5
32,5 85 32,5
SK 195 ... 185
I 50 100 150 200 [mm]

please indicate: ... ... (optional)

75 100 mm TO 3; CB

Mounting for TO 3 angle A 125 Insulting clamping parts E 45

Order example A 21 Mica wafers E 19
N A 71 Special heatsink design A 137 138 Insulator sleeves E 52
Heatsinks for DC/DC converter A 113 114 Technical introduction A28
 A
Standard extruded heatsinks
art. no. Rth [K/W]
10

29 8 B

3
6

12
4

2
50
SK 31 ... 50 100 150 200 [mm] C
please indicate: ... ... (optional)
37.5 50 75 1000 mm TO 3; CB
art. no. Rth [K/W]
5
36
4 D

3,2

15
3

1
70
SK 07 ... 50 100 150 200 [mm]
E
please indicate: ... ... (optional)
37.5 50 75 1000 mm TO 3; CB
art. no. Rth [K/W]
5
34
4
F
25,4
4,7

104,8
50 100 150 200 [mm]
SK 16 ... mountingpart IS 3 E 49 G
please indicate: ... ... (optional)
75 1000 mm TO 3; CB
art. no. 39 Rth [K/W]
3,0

2,5
H
39

2,0
8

1,5

1,0

105
I
SK 500 ... 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm

Special heatsink design A 137 138 Hole pattern A 21

Mounting for TO 3 angle A 125 Profiles for lock-in fixing spring A 84 88
Special profiles A 140 Extruded heatsinks A 22 83 A 72 N
Fin coolers A 129 Technical introduction A 28
A
Standard extruded heatsinks
art. no. Rth 8
30 [K/W] 7
B 6
2,7

18
2
5

34,4 4

4,5
65
50 100 150 200 [mm]
C SK 185 ... extruded heatsink for PCB mounting A 104
please indicate: ... ... (optional)
37.5 50 1000 mm TO 3; CB
art. no. Rth 5

30 [K/W] 4

D 3

20
2

1
65
SK 48 ... 50 100 150 200 [mm]

E please indicate: ... ... (optional)

37.5 50 75 100 1000 mm SSR 3; TO 3; CB
art. no. 30 Rth 5
3,5

[K/W] 4

3
F
4,5

2
25
1,7

88 50 100 150 200 [mm]

SK 79 ... with slots for cover plates or PCBs

G please indicate: ... ... (optional)
37.5 50 75 100 1000 mm TO 3; CB
30 Rth 5
art. no.
[K/W] 4
1,6

3
35
15

H
5

88 50 100 150 200 [mm]

SK 08 ... with slots for cover plates or PCBs
please indicate: ... ... (optional)
I 37.5 50 75 100 1000 mm TO 3; CB
art. no. Rth
30
[K/W]
1,6

2,5

2,0

K
50

1,5
30

1,0
6

0,5

100 50 100 150 200 [mm]

L SK 88 ... with slots for cover plates or PCBs

please indicate: ... ... (optional)
37.5 50 75 100 1000 mm TO 3

Assignment table A 18 20 Retaining springs for transistors A 115 117

Standard aluminium profiles A 135 136 Thermal. conductive silicone foam foil E 10
N A 73 Extruded heatsinks A 22 83 Thermal conductive foil E7
High capacity cooling aggregat. D 26 28 Technical introduction A28
 A
Standard extruded heatsinks
Rth [K/W]
art. no.
5
28 26,5 28
4 B

4,6
3

19
2

1
105
SK 52 ... 50 100 150 200 [mm] C
please indicate: ... ... (optional)
37.5 50 75 100 1000 mm 2xTO 3; 2xCB
art. no. 135
Rth [K/W]
2,5

32,5 34 32,5 2,0 D

1,5

2,2
1,5
25

4
1,0

0,5
3,7 5,7
SK 60 ... 125
50 100 150 200 [mm]
E
please indicate: ... ... (optional)
50 75 100 1000 mm 2xTO 3; 2xCB
art. no. 10 10
Rth [K/W]
2,5
29 34 29
2,0

1,5
F
2,5

30
25
4

1,0

0,5

135
SK 147 ... 50 100 150 200 [mm]

please indicate: ... ... (optional) G

50 150 1000 mm 2xTO 3; 2xCB
art. no. Rth [K/W]
2,5
37 32 37
2,0

1,5 H
4

20

1,0

0,5
179
SK 80 ... 50 100 150 200 [mm]

please indicate: ... ... (optional) I

75 100 1000 mm 2xTO 3; 2xCB
art. no. 68 38
Rth [K/W]
38
2,5

2,0

1,5 K
48

1,0
5

0,5

SK 53 ... 180 50 100 150 200 [mm]

please indicate: ... ... (optional) L

50 75 100 150 1000 mm 2xTO 3; 2xCB

Hole pattern A 21 Heatsink as visual & decor-parts A 10

Standard aluminium profiles A 135 136 Assignment table A 18 20
Extruded heatsinks A 22 83 Kapton insulator washers E 16 A 74 N
Thermal conductive material E25 Technical introduction A28
A
Standard extruded heatsinks
art. no. Rth [K/W]
2,5
B 29 28 29 28 29 28 29
2,0

1,5

4,5

38
1,0

0,5
232
C SK 86 ... 50 100 150 200 [mm]

please indicate: ...

100 150 1000 mm
art. no. Rth [K/W]
110 110 110 1,0

D 30
0,8

28
0,6

0,4

0,2
440
SK 82 ...
E 50 100 150 200 [mm]

please indicate: ...

100 1000 mm

Hole pattern A 21 Heatsink as visual & decor-parts A 10

Standard aluminium profiles A 135 136 Assignment table A 18 20
N A 75 Extruded heatsinks A 22 83 Kapton insulator washers E 16
Thermal conductive material E25 Technical introduction A28
 A
Standard extruded heatsinks
art. no. 8
Rth [K/W]

12
B

9
10

45
6

26
4

17
2 C
SK 596 ... 5 3 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 100 1000 mm
art. no. 30
3
Rth [K/W]
D
6

5
45

E
29

1
2

8
11,4
SK 544 ... 25 50 100 150 200 [mm]

please indicate: ...

50 75 100 1000 mm F
art. no. 38
8
Rth [K/W]
5

4 G
54

3
26

1
6
SK 32 ... 20 50 100 150 200 [mm]
H
please indicate: ...
37.5 50 75 100 1000 mm
art. no. 30,5
4,5 6,5

I
3

Rth [K/W]
59

K
6

6,5 1
10,5
20
SK 187 ... 40 50 100 150 200 [mm]

please indicate: ... ... (optional)

75 1000 mm SSR 3
L

Hole pattern A 21 heatsinks for Solid State Relais A 11 12

Standard aluminium profiles A 135 136 Assignment table A 18 20
Extruded heatsinks A 22 83 Kapton insulator washers E 16 A 76 N
Thermal conductive material E25 Technical introduction A28
A
Standard extruded heatsinks
art. no. 72

10
B Rth [K/W]
2,5

94
2,0

1,5

C 1,0

7
0,5
8,5
SK 140 ... 13,5

3
22 50 100 150 200 [mm]

please indicate: ...

1000 mm
D art. no.
Rth [K/W]
5,3

1,2

1,0

94,3
0,8
E 0,6

0,4
4

0,2

SK 556 ... 72 50 100 150 200 [mm]

please indicate: ...

F 75 100 150 1000 mm
art. no.
14

48
30
35

62

G Rth [K/W]
1,2
124

1,0
0,8
0,6

0,4

H 0,2

SK 15 ... 72 50 100 150 200 [mm]

please indicate: ...

75 1000 mm
art. no.
I 80 Rth [K/W]
1,4

1,2
6
78,6
14,5

1,0

0,8

K 1
0,6

58,5 50 100 150 200 [mm]

SK 89 ... with slots for cover plates or PCBs
please indicate: ... ... (optional)
100 150 1000 mm SSR 1; SSR 2
L

Hole pattern A 21 heatsinks for Solid State Relais A 11 12

Standard aluminium profiles A 135 136 Assignment table A 18 20
N A 77 Extruded heatsinks A 22 83 Kapton insulator washers E 16
Thermal conductive material E25 Technical introduction A28
 A
Standard extruded heatsinks
art. no. 80

8
B

Rth [K/W]

160
1,2 C
1,0

0,8

0,6

0,4
D
8

SK 163 ... 71 9 50 100 150 200 [mm]

please indicate: ...

100 150 1000 mm
art. no. 82
25
8
Rth [K/W]
1,8
E
1,6
58

1,4

1,2

16
1,0 F
SK 176 ... 78 50 100 150 200 [mm]

please indicate: ... ... (optional)

75 100 150 1000 mm SSR 2

Hole pattern A 21 heatsinks for Solid State Relais A 11 12

Standard aluminium profiles A 135 136 Assignment table A 18 20
Extruded heatsinks A 22 83 Kapton insulator washers E 16 A 78 N
Thermal conductive material E25 Technical introduction A28
A
Standard extruded heatsinks
art. no. Rth [K/W]
5
B

2
4

52

0
3

55 +
,
2

12
1

C 52 50 100 150 200 [mm]

SK 11 ... threads, through holes and fixing according to your demand; mounting parts IS 1, IS 2, IS 3 E 49
please indicate: ...
1000 mm
art. no. 11
D 30
Rth [K/W]
2,5

11

6
2,0
70

1,5

3,5
1,0
6

E 0,5

10 6
SK 83 ... 87,9 50 100 150 200 [mm]

please indicate: ...

100 1000 mm
art. no.
F 50

Rth [K/W]
6,4

2,5
107

2,0

G 1,5
40,3

1,0

0,5

107 50 100 150 200 [mm]

SK 06 ... mounting part IS 4 E 49

H please indicate: ...
75 1000 mm
art. no. 119
105

I
1,5

3,6

Rth [K/W]
55 2,5

2,0
105
119

1,5

K
7,8

1,0

0,5

50 100 150 200 [mm]

SK 23 ... with slots for cover plates or PCBs; equipped with fan and endplates = LA 4 D 14
L please indicate: ...
75 mm

Profiles for PCB components A 91 heatsinks for lock-in retaining spring A 85 88

High capacity heatsinks A 57 58 Heatsink-cooling aggregates D 14
N A 79 Mounting for TO 3 angle A 125 Special heatsink design A 137 138
Heatsinks for PCB A 89 112 Technical introduction A28
 A
Standard extruded heatsinks
art. no. 22 76,9 8,5
70,5
B

8
52,5
50

13

8,3
Rth [K/W]

120
12

15
1,0

0,8
C
0,6

0,4

12,4
0,2
52,5
SK 110 ... 120,5 50 100 150 200 [mm] D
please indicate: ...
150 200 1000 mm
art. no. 125
80
6

5,3 E
4,2
101,5
115

96

135

F
Rth [K/W]
1,0
4,2

2,2 0,8

0,6
15,2
13

G
2,2

0,4
96
5,3 0,2
101,5
110 50 100 150 200 [mm]
SK 109 ... with slots for cover plates or PCBs
please indicate: ...
100 150 200 1000 mm
H
art. no. 126
80 6,5
8,3
5,2 4

I
2,5
4,7
20

101,5

136
115
96

Rth [K/W] K
1,2
7,2
4,2

4,5

2,2 1,0

0,8
13

14

0,6
L
8,5

8,3 5,2
15,2

0,4
101,5
110 50 100 150 200 [mm]

SK 108 ... with slots for cover plates or PCBs

please indicate: ...
100 1000 mm M

Profiles for PCB components A 91 heatsinks for lock-in retaining spring A 85 88

High capacity heatsinks A 57 58 Heatsink-cooling aggregates D 14
Mounting for TO 3 angle A 125 Special heatsink design A 137 138 A 80 N
Heatsinks for PCB A 89 112 Technical introduction A28
A
Standard extruded heatsinks
art. no. Rth [K/W]

81 2,8
B 2,4

2,0

38
40
4
1,6

1,2

C SK 111 ... 58
50 100 150 200 [mm]

please indicate: ... ... (optional)

75 100 1000 mm SSR 1; SSR 3
art. no. 76
Rth [K/W]

7
5

2
2,5

12
20,5
2,0
41

1,5

1,0
4,3
5,3

5,3
47,6 0,5
80
E SK 172 ... 96 50 100 150 200 [mm]

please indicate: ... ... (optional)

50 75 100 150 1000 mm SSR 1; SSR 4
art. no. 145
Rth [K/W]

F 2,5

2,0
75

8,4

1,5
5,3
8

1,0

0,5
7
G
7

SK 194 ... 120 50 100 150 200 [mm]

please indicate: ... ... (optional)

75 1000 mm SSR 2
art. no. 200
10,3 6,5 Rth [K/W]
H 1,0
20

0,8
77

0,6
8,3
5,3

8,5

0,4

I
17

0,2

SK 435 ... 215 50 100 150 200 [mm]

please indicate: ...

150 200 1000 mm

High capacity heatsinks A 57 58 Extruded heatsinks A 22 83

Heatsinks for DC/DC converter A 113 114 Die-cast heatsinks A 125
N A 81 heatsinks for lock-in retaining spring A 85 88 High decorative surfaces A 9
Heatsink profile-overview A 13 17 Technical introduction A 28
 A
Standard extruded heatsinks
art. no. 76,2

5,1
1,8
4,4 21,5 Rth [K/W]
7,3 4,0 B

16,65
3,2

2,2

41
1,85
4,4 2,4

1,6

4,4
7,3
5,1
4,4 7,3
47,6
0,8
C
87 50 100 150 200 [mm]

SK 432 ... with slots for cover plates or PCBs

please indicate: ...
100 1000 mm
art. no. 108
Rth [K/W]
D
12,5
6,5
1,4

6,5
27
19

1,2

9,6 6,5

63,5
1,0
6,5
E

12,5
0,8

0,6

46,8
SK 40 ... 127 50 100 150 200 [mm]

please indicate: ...

100 1000 mm
art. no.
F
6,4

103
91
Rth [K/W]
1,5
2

2,5
2,4

2,0
G
80

91
1,5
8
28

1,0

0,5
72,5
130
143 50 100 150 200 [mm]
SK 61 ... with slots for cover plates or PCBs; cooling case M 29 H
please indicate: ...
75 100 150 1000 mm
art. no. 175
13,5 8,5
I
12

48
13,5
8,5

Rth [K/W]
108

1,0

0,8

0,6
K
25

0,4

8,5 102 0,2

13,5
122
SK 144 ... 240 50 100 150 200 [mm]

please indicate: ...

L
1000 mm

High capacity heatsinks A 57 58 Extruded heatsinks A 22 83

Heatsinks for DC/DC converter A 113 114 Die-cast heatsinks A 125
heatsinks for lock-in retaining spring A 85 88 High decorative surfaces A 9 A 82 N
Heatsink profile-overview A 13 17 Technical introduction A 28
A
Standard extruded heatsinks
art. no. M3 Rth [K/W]
3,5 40
B 38
36
34

36,5
32
30
28
26
SK 494 ... 6 50 100 150 200 [mm]
C please indicate: ...
25 37.5 50 75 100 1000 mm
art. no.

Rth [K/W]
19
D 30

25

1,6
20

21,2
2,5

15

10

E 10,7 50 100 150 200 [mm]

SK 153 ...
please indicate: ...
50 mm
F art. no. Rth [K/W]
5

71 4
35
3
4

20

2
10

G 1
41
SK 55 ... 50 100 150 200 [mm]

please indicate: ... ... (optional)

37.5 1000 mm TO 3; CB
H art. no. 10
7
22

7
4

Rth [K/W]
39,9

3,5
7

69,8

3,0

I 2,5

2,0

1,5
12
6

SK 175 ... 9,5

80 50 100 150 200 [mm]

K please indicate: ...

50 1000 mm

High capacity heatsinks A 57 58 Extruded heatsinks A 22 83

Heatsinks for DC/DC converter A 113 114 Die-cast heatsinks A 125
N A 83 heatsinks for lock-in retaining spring A 85 88 High decorative surfaces A 9
Heatsink profile-overview A 13 17 Technical introduction A 28
 A
Extruded heatsinks for lock-in retaining spring
art. no.

B
Rth 10

50
[K/W] 8

30,5
6

25
4

2
C
M3
2,5
SK 575 ... 6 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 100 1000 mm
art. no.
10,3
Rth 40 D
[K/W]
30

20

20
14,5
10

8
E
SK 512 ... 50 100 150 200 [mm]

please indicate: ...

25 50 100 1000 mm
art. no. Rth 14
10,3
[K/W]
12 F
10
8
28
22,8

6
4
2
M3
SK 480 ... 8 50 100 150 200 [mm] G
please indicate: ...
25 37.5 50 75 84 100 1000 mm
art. no. 11 M3

Rth 10
H
[K/W] 8
50

6
31,8

4
21,7

2 I
SK 490 ... M3 50 100 150 200 [mm]

please indicate: ...

37.5 50 75 84 100 1000 mm
art. no. 16,8 Rth

[K/W] 12
14
K
10
26

8
20
20

SK 492 ... 12
M3
50 100 150 200 [mm]
L
please indicate: ...
25 37.5 50 75 84 100 1000 mm

please note: profile threads A 5

M

Mounting parts for heatsinks E 49 50 Heatsinks for PCB A 89

Insulating caps E 51 Profiles for PCB components A 91
Mounting pads E 46 Heatsinks with threaded rail A 93 A 84 N
Lock-in retaining spring for transistors A 119 121 Technical introduction A 28
A
Extruded heatsinks for lock-in retaining spring
art. no. 29,4

B Rth 10

[K/W] 8

45
6

27,4
12 4

2
C M3
SK 489 ... 8 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 100 1000 mm
Rth [K/W]
art. no. 25
D 8
7
6
5

30
3,5
19,9
4
3

6
2
E M3 1
7
SK 573 ... 8 12 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 100 1000 mm
art. no. Rth [K/W]
F 8
7
6
5
45

4
3
19,25

2
G 1
M3
SK 576 ... 19 6 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 100 1000 mm
art. no. 30
H Rth [K/W]
7
6
5
45

4
25,6

3
I 2
8

1
M3
SK 481 ... 8 17 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 100 1000 mm
K
please note: profile threads A 5

Mounting parts for heatsinks E 49 50 Heatsinks for PCB A 89

Insulating caps E 51 Profiles for PCB components A 91
N A 85 Mounting pads E 46 Heatsinks with threaded rail A 93
Lock-in retaining spring for transistors A 119 121 Technical introduction A 28
 A
Extruded heatsinks for lock-in retaining spring
art. no. 30

B
Rth [K/W]

52
6

25,6
4

3 C

8
2

M3 1

2
3,4
SK 514 ... 8 17 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 100 1000 mm D
art. no. Rth [K/W]
32,3 8
7
6

14
5
4 E
28
19,9
3,5

3
2

M3 1
7
SK 574 ... 8 22 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 100 1000 mm
F
art. no. 33
M3

G
Rth [K/W]
7
66,5

6
5
4
31

3
2
H
8

1
M3
SK 589 ... 9 12 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 100 1000 mm
10,3
I
art. no. Rth [K/W]
7
6
5
35

4
22,8

3
K
12,5

2
1
M3
SK 482 ... 8 25 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 100 1000 mm
L
please note: profile threads A 5

Mounting parts for heatsinks E 49 50 Heatsinks for PCB A 89

Insulating caps E 51 Profiles for PCB components A 91
Mounting pads E 46 Heatsinks with threaded rail A 93 A 86 N
Lock-in retaining spring for transistors A 119 121 Technical introduction A 28
A
Extruded heatsinks for lock-in retaining spring
art. no. 47,8 Rth [K/W]
36,75 M3 7

B 5
6

33
3

21,2
21,2
2
1

4
35,6 M3
C SK 495 ... 43,1 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 100 1000 mm
art. no. 50,7 Rth [K/W]
7
6
D 5

33
26,1
26,1
4
3

3,5
2
1
M3
35,6
SK 499 ... 46
E please indicate: ...
50 100 150 200 [mm]

25 37.5 50 75 100 1000 mm

art. no. 52,3 Rth [K/W]
10

8
F
28

6
22,5

12,5
4

2
M3
SK 487 ... 8 42 50 100 150 200 [mm]

G please indicate: ...

25 37.5 50 75 84 100 1000 mm
art. no. 57 Rth [K/W]
7
6
5

H
28
22,5

4
3
14

2
1
M3
SK 483 ... 8 47 50 100 150 200 [mm]

please indicate: ...

I 25 37.5 50 75 84 100 1000 mm
art. no. 75,5
50

Rth [K/W]
K 7
6
60

5
4
26,4

3
2

L 50
1

SK 593 ... 57,5 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 100 1000 mm

please note: profile threads A 5

M

Mounting parts for heatsinks E 49 50 Heatsinks for PCB A 89

Insulating caps E 51 Profiles for PCB components A 91
N A 87 Mounting pads E 46 Heatsinks with threaded rail A 93
Lock-in retaining spring for transistors A 119 121 Technical introduction A 28
 A
Extruded heatsinks for lock-in retaining spring
art. no. 75,5
50
B
Rth [K/W]
7

65,8
6

50
5
4 C

29,5
3
2
1
50
SK 617 ... 57,5 50 100 150 200 [mm]

please indicate: ...

25 37.5 50 75 84 94 100 1000 mm
D
please note: profile threads A 5

Screw-in solder pin ELS 3

screw in solder pin made of brass E
easy mounting
secure hold
surface coating suitable for soldering
suitable for all heatsinks with M3 profile thread
position in the threaded channel as required
specific designs upon customers request F
art. no.
M3
7,5

G
1

12,5
4

0,8
2,3
0,8

ELS 3 6

Mounting parts for heatsinks E 49 50 Heatsinks for PCB A 89

Insulating caps E 51 Profiles for PCB components A 91
Mounting pads E 46 Heatsinks with threaded rail A 93 A 88 N
Lock-in retaining spring for transistors A 119 121 Technical introduction A 28
A
Extruded heatsinks for PCB mounting
Heatsinks for printed circuit boards
matching cylindrial screws according to DIN 84 with zinc coated surface
B M 3 thread diameter: 2.90 ... 2.94 mm (art. no.: SZ M 3 x 8)
screw-in solder pin M 3 (art. no.: ELS 3)
art. no. M3
36,75
M3

C Rth [K/W]

33
6

31

M3
5

22
4
M 2,5
17
4

2
35,6
M3 M3
D SK 68 ... 46
46
50 100 150 200 [mm]

art. no.
34

Rth [K/W]

33
31
6

E 5

8
3

28 2
M3
SK 112 ... 35,6 50 100 150 200 [mm]

please indicate: ...

F 37.5 50 75 94 100 1000 mm

please note: profile threads A 5

Lock-in retaining spring for transistors A 119 121 Miniature distance sleeves E 34
Profiles for PCB components A 91 Thermal conductive glue E 23 24
N A 89 Vibration dampers E 41 Thermal conductive paste E 21 22
Heatsinks with threaded rail A 93 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
Heatsinks for printed circuit boards
the heatsinks SK 414, SK 105, SK 44 and SK 415 are especially suitable for printed circuit board heatsinks for 19'' plug in units
art. no.
B
Rth [K/W]
5

15
3

2 C
99
1

50 100 150 200 [mm]

SK 414 ...
please indicate: ...
100 233.4 1000 mm D
art. no.
Rth [K/W]
5

4
E

10
3

2
159
1

50 100 150 200 [mm]

SK 105 ...
please indicate: ... F
37.5 50 75 100 150 200 233.4 1000 mm
art. no.
Rth [K/W]
5

4
G
4

3
15

159 1

50 100 150 200 [mm]

SK 44 ... H
please indicate: ...
50 75 100 150 200 233.4 1000 mm
art. no.
Rth [K/W]
5

4
I
4

15

2
219 1

50 100 150 200 [mm] K

SK 415 ...
please indicate: ...
37.5 100 150 1000 mm

Lock-in retaining spring for transistors A 119 121 Thermal conductive material E 2 23
Heatsink profile overview A 13 17 Profiles for lock-in fixing spring A 84 88
Heatsinks for PCB A 89 Retaining springs for transistors A 115 117 A 90 N
Heatsinks with threaded rail A 93 Technical introduction A28
A
Extruded heatsinks for PCB mounting
Heatsinks for printed circuit boards
for use on eurocards
B art. no. Rth [K/W]
10

4
C 2

50 100 150 200 [mm]

SK 125 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3
Rth [K/W]
art. no.
D 10

10

14
8
28
6
M3 47 4

2
M3
E 4
55 50 100 150 200 [mm]
SK 96 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3
please indicate: ...
50 84 94 1000 mm
art. no. Rth [K/W]
F 10

2
G
SK 138 ... 50 100 150 200 [mm]

art. no.
Rth [K/W]
7,0

H 5,6

4,2

2,8

1,4

50 100 150 200 [mm]

I SK 451 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3
art. no.
Rth [K/W]
10

K 6

50 100 150 200 [mm]

L SK 128 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3
please indicate: ...
50 84 94 1000 mm

M
please note: profile pressed threads A 5

Lock-in retaining spring for transistors A 119 121 Thermal conductive material E 2 23
Heatsink profile overview A 13 17 Profiles for lock-in fixing spring A 84 88
N A 91 Heatsinks for PCB A 89 Retaining springs for transistors A 115 117
Heatsinks with threaded rail A 93 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
30
art. no. 6,5 Rth [K/W]
10 B
8

31

M3
6

23
4

14
8
2

4
M3 C
8 50 100 150 200 [mm]
SK 609 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3
55
art. no. 6,5 Rth [K/W]
10

8 D
31

M3

6
23

14
8

2
M3
4
8 50 100 150 200 [mm] E
SK 610 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3
art. no. 50
6,5
Rth [K/W]
7,0

5,6
F
31

M3

4,2
23

12,5

2,8
8

1,4
M3
4
8 50 100 150 200 [mm]
SK 611 ... screws M 3: art. no.: SZ M 3 x 8; screw-in solder pin: art. no.: ELS 3 G
please indicate: ...
50 84 94 1000 mm

M
please note: profile pressed threads A 5

Lock-in retaining spring for transistors A 119 121 Thermal conductive material E 2 23
Heatsink profile overview A 13 17 Profiles for lock-in fixing spring A 84 88
Heatsinks for PCB A 89 Retaining springs for transistors A 115 117 A 92 N
Heatsinks with threaded rail A 93 Technical introduction A28
A
Extruded heatsinks for PCB mounting
Heatsink for PCB with threaded rail
transistor mounting onto the heatsink using a slide-in rail with M 3 thread
B easy positioning using a grid 6.35mm
other rail grids upon request
suitable for TO 220, TO 218, TO 247 and similar
suitable screws M 3 (art. no.: SZ M 3 x 8)
screw-in solder pin M 3 (art. no.: ELS 3)
specific versions upon customers request
C 55

6
28
18 2 M3 6,35

14
D M3
-1

8 47

art. no. [mm] Rth [K/W] version

SK 517 50 GS 50 5.0 TO 220 with threaded rail
SK 517 75 GS 75 3.9 TO 220 with threaded rail
E SK 517 84 GS 84 3.6 TO 220 with threaded rail
SK 517 50 50 5.0 without threaded rail
SK 517 75 75 3.9 without threaded rail
SK 517 84 84 3.6 without threaded rail
F 30
45

6
2 M3 6,35
G -1
18

M3
8 17

art. no. [mm] Rth [K/W] version

H SK 518 50 GS 50 4.3 TO 220 with threaded rail
SK 518 75 GS 75 3.3 TO 220 with threaded rail
SK 518 84 GS 84 3.0 TO 220 with threaded rail
SK 518 50 50 4.3 without threaded rail
SK 518 75 75 3.3 without threaded rail
I SK 518 84 84 3.0 without threaded rail

please note: profile threads A 5

surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 93 Thermal conductive material E25 Thermal conductive paste E 21
Lock-in retaining spring for transistors A 119 121 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
Attachable heatsinks for transistors
compact heatsink in transistor dimensions
for horizontal and vertical transistors B
can be screwed or glued
specific versions upon customers request
SK 515 23,5 S 2 x TO 220 SK 515 37 S 3 x TO 220
10,7 2,8 2,8 2,8

3,1

3,1

3,1
15
8,4

10
3,2
5 13,5 5 13,5 13,5
SK 515 10 S TO 220 23,5 37
art. no. [mm] Rth [K/W] version D
SK 515 10 S TO 220 10.0 30.0 TO 220 for screw fastening M2.5
SK 515 23,5 S 2 x TO 220 23.5 27.5 2xTO 220 for screw fastening M2.5
SK 515 37 S 3 x TO 220 37.0 26.1 3xTO 220 for screw fastening M2.5
SK 515 10 TO 220 10.0 30.0 without screw fastening
E
SK 515 23,5 TO 220 23.5 27.5 without screw fastening
SK 515 37 TO 220 37.0 26.1 without screw fastening
SK 516 15 S TO 218 SK 516 33 S 2 x TO 218
10 3,5 3,5
4,6

F
4,6
21
12,45

3,5 15 7,5 18
33
art. no. [mm] Rth [K/W] version G
SK 516 15 S TO 218 15 28.4 TO 218 for screw fastening M3
SK 516 33 S 2 x TO 218 33 26.9 2xTO 218 for screw fastening M3
SK 516 15 TO 218 15 28.4 without screw fastening
surface: black anodised
H
Attachable extruded heatsinks for transistors with thin bottom plate (0.5 mm)
SK 515 05 23,5 S 2 SK 515 05 37 S 3
10,7 2,8 2,8
2,8
3,1

3,1

3,1

I
15
8,4

10
3,95
5 13,5 5 13,5 13,5
SK 515 05 10 S 23,5
37

art. no. [mm] Rth [K/W] version

SK 515 05 10 S 10.0 30.0 TO 220 for screw fastening M2.5
K
SK 515 05 23,5 S 2 23.5 27.5 2xTO 220 for screw fastening M2.5
SK 515 05 37 S 3 37.0 26.1 3xTO 220 for screw fastening M2.5
SK 515 05 10 10.0 30.0 without screw fastening
SK 515 05 23,5 23.5 27.5 without screw fastening L
SK 515 05 37 37.0 26.1 without screw fastening
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 94 N
Lock-in retaining spring for transistors A 119 121 Technical introduction A28
A
Extruded heatsinks for PCB mounting
Attachable heatsinks for transistors
extruded heatsink with intergrated spring locking function
B simple assembly by pushing the heatsink onto the transistor
optimum heat transfer between component and heatsink
solderable pin for PCB mounting
specific versions upon customers request

19,4 25 30
C

28

32,5
4
4,8

D
1

2,1 = =
4 5 15
4,5
2,3 25,4
2,7 3,3
13,5

art. no. for transistor [mm] Rth [K/W] spring force [N] version
E SK 525 15 TO 220 15 13.3 54 without solder pins
SK 525 30 TO 220 30 7.8 100 without solder pins
SK 525 15 ST TO 220 15 13.3 54 with 1 solder pin
SK 525 20 ST TO 220 20 10.7 70 with 1 solder pin
SK 525 25 ST TO 220 25 9.0 85 with 2 solder pins
F SK 525 30 ST TO 220 30 7.8 100 with 2 solder pins
22
30
35

G
4,5
1
4,8

4,5

2,1
4 2,3 25,4

H 2,7
15
3,3

art. no. for transistor [mm] Rth [K/W] spring force [N] version
SK 526 30 ST TO 247 30 6.3 100 with 2 solder pins
surface: black anodised
I

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 95 Thermal conductive material E25 Thermal conductive paste E 21
Attachable heatsinks C 10 16 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
Extruded heatsinks for transistors
compact PCB heatsink
effective heat dissipation for single and double row transistor mounting B
profile SK 454 A 24
profile SK 452 A 27
specific versions upon customers request

M 3 bei TO 220 M 3 bei SOT 32

1xM3 2xM3
C

19
3

16

10
21,45 10 20 20 20 10

D
art. no. [mm] Rth [K/W]
SK 454 20 1 x M3 ... 20 10.8 SOT 32/ TO 220
SK 454 60 3 x M3 ... 60 7.7 SOT 32/ TO 220
SK 454 20 2 x M3 ... 20 10.8 SOT 32/ TO 220
SK 454 40 4 x M3 ... 40 9.4 SOT 32/ TO 220
E
SK 454 60 6 x M3 ... 60 7.7 SOT 32/ TO 220
SK 454 40 2 x M3 TO 220 40 9.4 TO 220
SK 454 80 4 x M3 TO 220 80 6.5 TO 220
SK 454 100 5 x M3 TO220 100 5.9 TO 220 F
SK 454 80 8 x M3 TO 220 80 6.5 TO 220
SK 454 100 10xM3 TO220 100 5.9 TO 220
please indicate: ...
SOT 32; TO 220
G
1xM3 2xM3 M3
3,5
25

19

29 10 20 20 20 10 H

art. no. [mm] Rth [K/W]

SK 452 20 1 x M3 20 11.1 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 452 40 2 x M3 40 7.5 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P I
SK 452 60 3 x M3 60 5.9 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 452 80 4 x M3 80 4.9 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 452 100 5 x M3 100 4.3 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 452 20 2 x M3 20 11.1 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
K
SK 452 40 4 x M3 40 7.5 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 452 60 6 x M3 60 5.9 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 452 80 8 x M3 80 4.9 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 452 100 10 x M3 100 4.3 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
surface: black anodised L

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 96 N
Attachable heatsinks C 10 16 Technical introduction A28
A
Extruded heatsinks for PCB mounting
for semiconductor clip-mounting
special lengths and transistor drillings upon request
B P = raised retaining stud, E = mounting method

34,9 3,2
16

1,5
P
C

12,7

18,3

6,5
25,4 10,8
E 25,4
4,5 max.

6 max.
D

6,5
1,5
3
STC STIC STCB
2,3 max. 6 7
2,3 max. M3

art. no. [mm] Rth [K/W]

E
SK 104 25,4 ... 25.4 14 TO 220
SK 104 38,1 ... 38.1 11 TO 220
SK 104 50,8 ... 50.8 9 TO 220
SK 104 63,5 ... 63.5 8 TO 220
F please indicate: ... mounting method
STC = with solder pin
STIC = with solder pin and insulating washer
STCB = with threaded bolt M 3, brass
surface: black anodised
G for semiconductor screw-mounting
special lengths and transistor drillings on request
E = mounting method
3,2
34,9 3,2

H 16
1,5

25,4

25,4
12,7

18,3

18,3
13,5

13,5
6,5

6,5

25,4
I 10,8
25,4
10,8
25,4
E
4,5 max.

6 max.

6,5
1,5
3

STS STIS STSB

K 2,3 max. 6
2,3 max.
7
M3

art. no. [mm] Rth [K/W]

SK 104 25,4 ... 25.4 14 SOT 32/ TO 220/ TO 3 P
SK 104 38,1 ... 38.1 11 SOT 32/ TO 220/ TO 3 P
L SK 104 50,8 ... 50.8 9 SOT 32/ TO 220/ TO 3 P
SK 104 63,5 ... 63.5 8 SOT 32/ TO 220/ TO 3 P
please indicate: ... mounting method
STS = with solder pin
STIS = with solder pins and insulating washer
M STSB = with threaded bolt M 3, brass
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 97 Thermal conductive material E25 Thermal conductive paste E 21
Attachable heatsinks C 10 16 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
horizontal for semiconductor screw-mounting
special lengths and transistor drillings on request

34,9
3,2 3,2 B
15,9

1,5

25,4
25,4
12,7

18,3
18,3
13,5

13,5
C

9,5
9,5
25,4

10,8 10,8

art. no. [mm] Rth [K/W]

SK 104 25,4 LS 25.4 14 SOT 32/ TO 220/ TO 3 P
SK 104 38,1 LS 38.1 11 SOT 32/ TO 220/ TO 3 P
D
SK 104 50,8 LS 50.8 9 SOT 32/ TO 220/ TO 3 P
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 98 N
Attachable heatsinks C 10 16 Technical introduction A28
A
Extruded heatsinks for PCB mounting
for semiconductor clip-mounting
special lengths and transistor drillings on request
B P = raised retaining stud, E = mounting method
35 3,2
17

25,4
P
C

18,3
6,5
2,5
25,4 10,8
4,5 max. 25,4

6 max.
D E

6,5
1,5
3
STC STIC STCB
2,3 max. 6 7
2,3 max. M3

art. no. [mm] Rth [K/W]

E SK 600 25,4 ... 25.4 11.0 TO 218/ TO 220/ TO 247/ TO 3 P
SK 600 38,1 ... 38.1 9.0 TO 218/ TO 220/ TO 247/ TO 3 P
SK 600 50,8 ... 50.8 7.3 TO 218/ TO 220/ TO 247/ TO 3 P
SK 600 63,5 ... 63.5 6.5 TO 218/ TO 220/ TO 247/ TO 3 P
F please indicate: ... mounting method
STC = with solder pin
STIC = with solder pin and insulating washer
STCB = with threaded bolt M 3, brass
surface: black anodised

G for semiconductor screw-mounting

special lengths and transistor drillings on request
E = mounting method
35 3,2
3,2
17

25,4
25,4
25,4

18,3

18,3
13,5

13,5
6,5
6,5
2,5

10,8 10,8
I 25,4
25,4
4,5 max.

6 max.

E
6,5
1,5
3

STS STIS STSB

2,3 max. 6 7
K 2,3 max. M3

art. no. [mm] Rth [K/W]

SK 600 25,4 ... 25.4 11.0 TO 218/ TO 220/ TO 247/ TO 3 P
SK 600 38,1 ... 38.1 9.0 TO 218/ TO 220/ TO 247/ TO 3 P
SK 600 50,8 ... 50.8 7.3 TO 218/ TO 220/ TO 247/ TO 3 P
L SK 600 63,5 ... 63.5 6.5 TO 218/ TO 220/ TO 247/ TO 3 P
please indicate: ... mounting method
STS = with solder pin
STIS = with solder pins and insulating washer
STSB = with threaded bolt M 3, brass
M surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 99 Thermal conductive material E25 Thermal conductive paste E 21
Attachable heatsinks C 10 16 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
for semiconductor clip-mounting
special lengths and transistor drillings on request
P = raised retaining stud, E = mounting method B
2,8
P
45
26,2

18,3
3

14
C

9
6
12,7
15
16,5 E
25,8
35,5
4,5 max.

6 max.

6,5
1,5
D

3
STC STIC STCB

2,3 max. 6 7
2,3 max. M3
art. no. [mm] Rth [K/W]
SK 409 25,4 ... 25.4 8.2 TO 220/ TO 3 P E
SK 409 38,1 ... 38.1 7.0 TO 220/ TO 3 P
SK 409 50,8 ... 50.8 6.2 TO 220/ TO 3 P
SK 409 63,5 ... 63.5 5.6 TO 220/ TO 3 P
please indicate: ... mounting method
STC = with solder pin F
STIC = with solder pin and insulating washer
STCB = with threaded bolt M 3, brass
surface: black anodised

for semiconductor screw-mounting

special lengths and transistor drillings on request G
E = mounting method
3,2

45
26,2
H
25,4
3

18,3

12,5
12,7

15
35,5 E
4,5 max.

6 max.

I
6,5
1,5
3

STS STIS STSB

2,3 max. 6 7
2,3 max. M3
art. no. [mm] Rth [K/W]
SK 409 25,4 ... 25.4 8.2 TO 220/ TO 3 P
K
SK 409 38,1 ... 38.1 7.0 TO 220/ TO 3 P
SK 409 50,8 ... 50.8 6.2 TO 220/ TO 3 P
SK 409 63,5 ... 63.5 5.6 TO 220/ TO 3 P
please indicate: ... mounting method L
STS = with solder pin
STIS = with solder pins and insulating washer
STSB = with threaded bolt M 3, brass
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 100 N
Attachable heatsinks C 10 16 Technical introduction A28
A
Extruded heatsinks for PCB mounting
for semiconductor clip-mounting
special lengths and transistor drillings on request
B E = mounting method
30,8
25,33

5 5

20
12,22
8,5

0,72
C

10,5
11,7 11,7
3,1 20
30,3 30,3 E
50

4,5 max.

6 max.

6,5
D

1,5
3
STC STIC STCB
2,3 max. 6 7
2,3 max. M3

art. no. [mm] Rth [K/W]

E SK 459 25 ... 25.0 7.9 TO 218/ TO 220/ TO 247/ TO 248
SK 459 37,5 ... 37.5 6.3 TO 218/ TO 220/ TO 247/ TO 248
SK 459 50 ... 50.0 5.6 TO 218/ TO 220/ TO 247/ TO 248
please indicate: ... mounting method
STC = with solder pin
F STIC = with solder pin and insulating washer
STCB = with threaded bolt M 3, brass
surface: black anodised

for semiconductor screw-mounting

special lengths and transistor drillings on request
G E = mounting method
30,8
25,33

M3
20
12,22

0,72

H
8,5

21,2
11,7 11,7
3,1
30,3
50 30,3 E
4,5 max.

6 max.

I
6,5
1,5
3

STS STIS STSB

2,3 max. 6 7
2,3 max. M3

art. no. [mm] Rth [K/W]

K SK 459 25 ... 25.0 7.9 TO 218/ TO 220/ TO 247/ TO 248
SK 459 37,5 ... 37.5 6.3 TO 218/ TO 220/ TO 247/ TO 248
SK 459 50 ... 50.0 5.6 TO 218/ TO 220/ TO 247/ TO 248
please indicate: ... mounting method
L STS
STIS
= with solder pin
= with solder pins and insulating washer
STSB = with threaded bolt M 3, brass
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 101 Thermal conductive material E25 Thermal conductive paste E 21
Attachable heatsinks C 10 16 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
for semiconductor screw-mounting
special lengths and transistor drillings on request
E = mounting method B
30,8
25,33

M3

20
12,22
8,5

0,72

3
C

18
11,7 11,7
3,1
30,3
30,3
50 E

4,5 max.

6 max.

6,5
1,5
D

3
STS STIS STSB
2,3 max. 6 7
2,3 max. M3

art. no. [mm] Rth [K/W]

SK 459 25 M ... 25.0 7.9 SIP-Multiwatt E
SK 459 37,5 M ... 37.5 6.3 SIP-Multiwatt
SK 459 50 M ... 50.0 5.6 SIP-Multiwatt
please indicate: ... mounting method
STS = with solder pin
STIS
STSB
= with solder pins and insulating washer
= with threaded bolt M 3, brass
F
surface: black anodised

for semiconductor screw-mounting

with combination-hole pattern for mounting of 2 x TO 220 or 2 x SOT 32
special lengths and transistor drillings on request G
E = mounting method
30,8
25,33

M3 M3
20
12,22

H
8,5

0,72

18
11,7 11,7
3,1 18,9
30,3
50 30,3 E
4,5 max.

6 max.

I
6,5
1,5
3

STS STIS STSB

2,3 max. 6 7
2,3 max. M3

art. no. [mm] Rth [K/W]

SK 459 25 2 x TO 220 ... 25.0 7.9 2xSOT 32/ 2xTO 220
K
SK 459 37,5 2 x TO 220... 37.5 6.3 2xSOT 32/ 2xTO 220
SK 459 50 2 x TO 220 ... 50.0 5.6 2xSOT 32/ 2xTO 220
please indicate: ... mounting method
STS
STIS
= with solder pin
= with solder pins and insulating washer
L
STSB = with threaded bolt M 3, brass
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 102 N
Attachable heatsinks C 10 16 Technical introduction A28
A
Extruded heatsinks for PCB mounting
for semiconductor clip-mounting
special lengths and transistor drillings on request
B P = raised retaining stud, E = mounting method
42
2,8
17 P

1,8
25

19,5
8 4
C
10

4,5 max.
25,4

6 max.
E

6,5
1,5
3
STC STIC STCB

D 2,3 max. 6 7
2,3 max. M3

art. no. [mm] Rth [K/W]

SK 129 25,4 ... 25.4 7.8 TO 220
SK 129 38,1 ... 38.1 6.5 TO 220
E SK 129 50,8 ... 50.8 5.3 TO 220
SK 129 63,5 ... 63.5 4.5 TO 220
please indicate: ... mounting method
STC = with solder pin
STIC = with solder pin and insulating washer
F STCB = with threaded bolt M 3, brass
surface: black anodised

for semiconductor screw-mounting

special lengths and transistor drillings on request
G E = mounting method
42 3,2 3,2
17
1,8

25,4

25,4
18,3
25

13,5

18,3
13,5
H 2,3 max.
25,4 25,4 E
4,5 max.

6 max.

6,5
1,5
3

STS STIS STSB

I 2,3 max. 6 7
2,3 max. M3

art. no. [mm] Rth [K/W]

SK 129 25,4 ... 25.4 7.8 SOT 32/ TO 220/ TO 3 P
SK 129 38,1 ... 38.1 6.5 SOT 32/ TO 220/ TO 3 P
K SK 129 50,8 ... 50.8 5.3 SOT 32/ TO 220/ TO 3 P
SK 129 63,5 ... 63.5 4.5 SOT 32/ TO 220/ TO 3 P
please indicate: ... mounting method
STS = with solder pin
STIS = with solder pins and insulating washer
L STSB = with threaded bolt M 3, brass
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 103 Thermal conductive material E25 Thermal conductive paste E 21
Attachable heatsinks C 10 16 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
for semiconductor clip-mounting
profile SK 185 A 73
special lengths and drillings on request B
L = solderable pins

10,25
5

4
21,5
3,1 max.
34,4

art. no. [mm] Rth [K/W] version D

SK 185 25 STC TO 220 25.0 7.9 TO 220 with solder pins
SK 185 37,5 STC TO 220 37.5 6.4 TO 220 with solder pins
SK 185 50 STC TO 220 50.0 4.9 TO 220 with solder pins
SK 185 50 C TO 220 50.0 4.9 TO 220 without solder pins
surface: black anodised E
for semiconductor screw-mounting
profile SK 185 A 73
special lengths and drillings on request
L = solderable pins
F
3,2
30

2,7
4

2
18

18,3
4,5

G
4

34,4
3,1 max.
65 L
34,4

art. no. [mm] Rth [K/W] version

SK 185 25 STS TO 220 25.0 7.9 TO 220 with solder pins
SK 185 37,5 STS TO 220 37.5 6.4 TO 220 with solder pins
H
SK 185 50 STS TO 220 50.0 4.9 TO 220 with solder pins
SK 185 25 TO 220 25.0 7.9 TO 220 without solder pins
SK 185 37,5 TO 220 37.5 6.4 TO 220 without solder pins
SK 185 50 TO 220 50.0 4.9 TO 220 without solder pins I
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 104 N
Attachable heatsinks C 10 16 Technical introduction A28
A
Extruded heatsinks for PCB mounting
for semiconductor screw-mounting
hole pattern is centered to the total length of the heatsink
B special lengths and drillings on request
*1 = versions with solder pins; *2 = versions without solder pins
L = solderable pins

3,2
*1 3,2 *2
15

=
3

14

4 max.

14,75
5

18,3
13

5
17,78

=
32
1,3 L
D art. no. [mm] Rth [K/W] version
SK 75 25 STS TO 220 25.0 12.5 TO 220/*1 with solder pins
SK 75 37,5 STS TO 220 37.5 10.0 TO 220/*1 with solder pins
SK 75 50 STS TO 220 50.0 8.5 TO 220/*1 with solder pins
E SK 75 25 25.0 12.5 without solder pins
SK 75 25 TO 220 25.0 12.5 TO 220/*2 without solder pins
SK 75 37,5 37.5 10.0 without solder pins
SK 75 37,5 TO 220 37.5 10.0 TO 220/*2 without solder pins
SK 75 50 50.0 8.5 without solder pins
F SK 75 50 TO 220 50.0 8.5 TO 220/*2 without solder pins
SK 75 75 75.0 7.0 without solder pins
SK 75 1000 1000.0 without solder pins
3,2

15
*1 3,2 *2
G

=
4 max.
4

20

14,75
18,3

13
7

17,78 5

=
32
1,3 L
H
art. no. [mm] Rth [K/W] version
SK 76 25 STS TO 220 25.0 10.0 TO 220/*1 with solder pins
SK 76 37,5 STS TO 220 37.5 8.0 TO 220/*1 with solder pins
SK 76 50 STS TO 220 50.0 7.0 TO 220/*1 with solder pins
I
SK 76 25 25.0 10.0 without solder pins
SK 76 25 TO 220 25.0 10.0 TO 220/*2 without solder pins
SK 76 37,5 37.5 8.0 without solder pins
SK 76 37,5 TO 220 37.5 8.0 TO 220/*2 without solder pins
K SK 76 50 50.0 7.0 without solder pins
SK 76 50 TO 220 50.0 7.0 TO 220/*2 without solder pins
SK 76 75 75.0 5.9 without solder pins
SK 76 1000 1000.0 without solder pins
surface: black anodised
L

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 105 Thermal conductive material E25 Thermal conductive paste E 21
Attachable heatsinks C 10 16 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
for semiconductor clip-mounting
profile SK 145 A 73
special lengths and drillings on request B
L = solderable pins
20,5

4,5

15
4,5
2,8 max. L
25,4

art. no. [mm] Rth [K/W] version D

SK 145 25 STC 25 13.5 TO 218/ TO 220/ with solder pins
TO 247/ TO 248
SK 145 30 STC 30 12.4 TO 218/ TO 220/ with solder pins
TO 247/ TO 248
SK 145 50 STC 50 10.0 TO 218/ TO 220/ with solder pins E
TO 247/ TO 248
surface: black anodised

for semiconductor screw-mounting

profile SK 145 A 73
special lengths and drillings on request F
L = solderable pins

3,2
15,5

G
18,3
12
3

25,4

4,5
29 2,8 max.
L 25,4

art. no. [mm] Rth [K/W] version H

SK 145 25 STS TO 220 25.0 13.5 TO 218/ TO 220/ with solder pins
TO 247/ TO 248
SK 145 37,5 STS TO 220 37.5 12.0 TO 218/ TO 220/ with solder pins
TO 247/ TO 248
SK 145 50 STS TO 220 50.0 10.0 TO 218/ TO 220/ with solder pins I
TO 247/ TO 248
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 106 N
Attachable heatsinks C 10 16 Technical introduction A28
A
Extruded heatsinks for PCB mounting
special lengths and drillings on request
L = solderable pins
B SK 126 25 TO 220 SK 126 25 STS TO 220 SK 126 25 2 x M 3
SK 126 37,5 TO 220 SK 126 37,5 STS TO 220 SK 126 37,5 2 x M 3
8

M3
C

12,7

6,35

6,35
3
34,5

D
M3 M3 M3

18,3
18,3

18,3

8
E
4,5 max.
M3
2,3 L

art. no. [mm] Rth [K/W] version

SK 126 25 STS TO 220 25.0 8.0 TO 218/ TO 220/ with solder pin and thread M3
TO 247/ TO 248
F SK 126 37,5 STS TO 220 37.5 6.5 TO 218/ TO 220/ with solder pin and thread M3
TO 247/ TO 248
SK 126 25 TO 220 25.0 8.0 TO 218/ TO 220/ ohne Ltstift, mit M3-Gewinde
TO 247/ TO 248
SK 126 25 2 x M3 25.0 8.0 TO 218/ TO 220/ ohne Ltstift, mit M3-Gewinde
G TO 247/ TO 248
SK 126 37,5 TO 220 37.5 6.5 TO 218/ TO 220/ ohne Ltstift, mit M3-Gewinde
TO 247/ TO 248
SK 126 37,5 2 x M3 37.5 6.5 TO 218/ TO 220/ ohne Ltstift, mit M3-Gewinde
TO 247/ TO 248
H SK 126 25 25.0 8.0
SK 126 37,5 37.5 6.5
SK 126 1000 1000.0
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 107 Thermal conductive material E25 Thermal conductive paste E 21
Attachable heatsinks C 10 16 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
special lengths and drillings on request
L = solderable pins
B
M3
M3

25

25
18,3
1,1
4,4

13,5
M3

15

11
C

6,5

3,5 max.

3,5 max.

3,5 max.
3,9
1,3 6,3 L L L
10,6 1,3 1,3 1,3
12,6

SK 95 15 STS SOT 32 S SK 95 25 STS TO 220 SK 95 25 STS SOT 32

art. no. [mm] Rth [K/W] D
SK 95 15 STS SOT 32 S 15 38.5 SOT 32
SK 95 25 STS SOT 32 25 36.0 SOT 32
SK 95 25 STS TO 220 25 36.0 TO 220
4,4 SK 95 25 1 x M2,5 1 x M3
E
1,3

2,6
6,5
1,1

M2,5 M3

2,6
10,6
12,6
M3 M3
M3
M3 M3
F

25
25

M3
25

25
18,3

18,3

18,3
13,5
15

M3
11

7
SK 95 15 SOT 32 S SK 95 25 SOT 32 SK 95 25 TO 220 SK 95 25 2 x M3
art. no. [mm] Rth [K/W] G
SK 95 15 SOT 32 S 15 38.5 SOT 32
SK 95 25 SOT 32 25 36.0 SOT 32
SK 95 25 TO 220 25 36.0 TO 220
SK 95 25 1x M2,5 1x M3 25 36.0 1xM2.5/ 1xM3 (TO 220)
SK 95 25 2 x M3 25 36.0 2xM3 (TO 220)
H
SK 95 15 15 38.5
SK 95 25 25 36.0
SK 95 1000 1000
surface: black anodised I
type of thread: not anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 108 N
Attachable heatsinks C 10 16 Technical introduction A28
A
Extruded heatsinks for PCB mounting
single solder pin
profile SK 437 A 24
B special lengths and drillings on request
L = solderable pin

14,5
10,5
C

4,5 max.
L
2,55

art. no. [mm] Rth [K/W]

SK 437 25 STC 25 24 TO 218/ TO 220/ TO 247/ TO 248
D SK 437 30 STC 30 22 TO 218/ TO 220/ TO 247/ TO 248
SK 437 35 STC 35 18 TO 218/ TO 220/ TO 247/ TO 248
SK 437 50 STC 50 14 TO 218/ TO 220/ TO 247/ TO 248
M3
3,5

E
16

20
5

4,5 max.
16
L
2,55

art. no. [mm] Rth [K/W]

F SK 437 25 STS 25 24 TO 218/ TO 220/ TO 247/ TO 248
SK 437 30 STS 30 22 TO 218/ TO 220/ TO 247/ TO 248
SK 437 35 STS 35 18 TO 218/ TO 220/ TO 247/ TO 248
SK 437 50 STS 50 14 TO 218/ TO 220/ TO 247/ TO 248
G surface: black anodised

double solder pin

profile SK 437 A 24
special lengths and drillings on request
L = solderable pin
H 14,5
10,5
4,5 max.

L L
1,45
I art. no. [mm] Rth [K/W]
SK 437 25 STC 2 25 24 TO 218/ TO 220/ TO 247/ TO 248
SK 437 30 STC 2 30 22 TO 218/ TO 220/ TO 247/ TO 248
SK 437 35 STC 2 35 18 TO 218/ TO 220/ TO 247/ TO 248
K
3,5

M3
16

20
4,5 max.

10
16 L L
L art. no. [mm] Rth [K/W]
1,45

SK 437 25 STS 2 25 24 TO 218/ TO 220/ TO 247/ TO 248

SK 437 30 STS 2 30 22 TO 218/ TO 220/ TO 247/ TO 248
SK 437 35 STS 2 35 18 TO 218/ TO 220/ TO 247/ TO 248
M surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 109 Thermal conductive material E25 Thermal conductive paste E 21
Attachable heatsinks C 10 16 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
special versions on customers request
L = solderable pin
B
M3

1,25
2,5

18
8
C

3,5 max.
5,9
L
11,8
1,3

art. no. [mm] Rth [K/W]

SK 470 25 STS 25 29.0 SOT 32/ TO 220
SK 470 30 STS 30 27.2 SOT 32/ TO 220
D
SK 470 35 STS 35 25.6 SOT 32/ TO 220
SK 470 50 STS 50 23.2 SOT 32/ TO 220

M3 E
15,24
1,75

18
3,5

3,5 max.
6,75
13,5
L
1,3
F
art. no. [mm] Rth [K/W]
SK 469 25 STS 25 15.3 SOT 32/ TO 220
SK 469 30 STS 30 14.3 SOT 32/ TO 220
SK 469 35 STS 35 13.0 SOT 32/ TO 220 G
SK 469 50 STS 50 10.6 SOT 32/ TO 220
surface: black anodised

as mounting- and connecting piece

for clamp mounting of the transistors
H
triple unit can be seperated
solder pin mounting possible
special versions on customers request

2,6 20,4 20,4 20,4 I

11,5
5,2

20 15 20 15 20 2

94 K
art. no. [mm] Rth [K/W]
SK 484 25 25.0 6.0 TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P
SK 484 37,5 37.5 4.5 TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P
SK 484 50 50.0 3.7 TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P L
SK 484 75 75.0 2.8 TO 218/ TO 220/ TO 247/ TO 264/ TO 3 P

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 110 N
Attachable heatsinks C 10 16 Technical introduction A28
A
Extruded heatsinks for PCB mounting
compact PCB heatsinks
especially suitable for vertical PCB mounting in housings, racks etc.
B easy solder fixing
special versions on customers request
L = solderable pin

SK 454 20 1 x M 3 L SK 454 40 2 x M 3 L SK 454 60 3 x M 3 L

20 10 20 10 10 20 20 10
C
21,45

17,8
M3 M3 M3 M3 M3 M3

17,8

17,8
9,5 L
2,3 max

3,9
3,9
3,9
19 2,3 max 2,3 max

art. no. [mm] Rth [K/W]

D SK 454 20 1 x M3 L 20 10.1 SOT 32/ TO 220
SK 454 40 2 x M3 L 40 8.8 SOT 32/ TO 220
SK 454 60 3 x M3 L 60 7.5 SOT 32/ TO 220
SK 448 20 1 x M 3 L SK 448 40 2 x M 3 L SK 448 60 3 x M 3 L
E 20 10 20 10 10 20 20 10
27,95

M3 M3 M3 M3 M3 M3
20,6

20,6
20,6
L
6,25

5,6
5,6

2,3 max

5,6
12,5 2,3 max 2,3 max

art. no. [mm] Rth [K/W]

SK 448 20 1 x M3 L 20 11.8 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 448 40 2 x M3 L 40 9.8 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 448 60 3 x M3 L 60 7.1 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
G SK 400 20 1 x M 3 L SK 400 40 2 x M 3 L SK 400 60 3 x M 3 L
20 10 20 10 10 20 20 10

M3 M3 M3 M3 M3 M3
33

22,5

22,5
22,5

H 5 L
10 2,3 max 2,3 max 2,3 max
4

4
art. no. [mm] Rth [K/W]
SK 400 20 1 x M3 L 20 11.6 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
I SK 400 40 2 x M3 L 40 8.2 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 400 60 3 x M3 L 60 7.2 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 456 20 1 x M 3 L SK 456 40 2 x M 3 L SK 456 60 3 x M 3 L
20 10 20 10 10 20 20 10

K
40

M3 M3 M3 M3 M3 M3
20,3

20,3

20,3

L
5

3,4
6 2,3 max 2,3 max 2,3 max
5
5

L art. no. [mm] Rth [K/W]

SK 456 20 1 x M3 L 20 13.0 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 456 40 2 x M3 L 40 10.5 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P
SK 456 60 3 x M3 L 60 8.5 TO 218/ TO 220/ TO 247/ TO 248/ TO 3 P

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
N A 111 Thermal conductive material E25 Thermal conductive paste E 21
Attachable heatsinks C 10 16 Technical introduction A28
 A
Extruded heatsinks for PCB mounting
for semiconductor clip-mounting
special lengths and transistor drillings on request
E = mounting method B

20
5,1

14,54
C

7,1
18,16
34
2,25
E 18,16
4,5 max.

6 max.

6,5
1,5
3
D
2,3 max. 6 7
2,3 max. M3

STC STIC STCB

art. no. [mm] Rth [K/W]
SK 460 25 ... 25.0 9.0 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 E
SK 460 37,5 ... 37.5 7.9 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248
SK 460 50 ... 50.0 7.0 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248
please indicate: ... mounting method
STC = with solder pin
STIC = with solder pin and insulating washer F
STCB = with threaded bolt M 3, brass
surface: black anodised

for semiconductor screw-mounting

special lengths and transistor drillings on request
E = mounting method
G

M3
20

H
5,1

18,16 21,2
34
4,5 max.

E
6 max.

18,16
3

I
2,3 max. 6
2,3 max.
STS STIS
art. no. [mm] Rth [K/W]
SK 460 25 STS 25.0 9.0 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248 K
SK 460 37,5 STS 37.5 7.9 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248
SK 460 50 STIS 50.0 7.0 SIP-Multiwatt/ TO 218/ TO 220/ TO 247/ TO 248
surface: black anodised

Profiles for lock-in fixing spring A 84 88 Mica wafers E 19

Assignment table A 18 20 Kapton insulator washers E 16
Thermal conductive material E25 Thermal conductive paste E 21 A 112 N
Attachable heatsinks C 10 16 Technical introduction A28
A
Extruded heatsinks for DC/DC converter
special versions on customers request
art. no. Rth [K/W]
B 7 3,3

8,0

3,5
16,51
6,0

32,3
4,0
38,1
C 2,0

0
0 1 2 3 4 5 6
SK DC 10 60 SA 13,5 16,5 16,5 13,5 V [m/s]
art. no. 7 3,3 Rth [K/W]

D 8,0

1,8
6,0
6

32,3
4,0
40
2,0

E 0
0 1 2 3 4 5 6
SK DC 8 60 SA 13,5 16,5 16,5 13,5 V [m/s]

art. no. 7 3,3 Rth [K/W]

8,0
1,8

F 6,0
6

32,3
4,0
40
2,0

0
G SK DC 8 1 60 SA 13,5 16,5 16,5 13,5
0 1 2 3 4 5 6
V [m/s]

art. no. 3,8 Rth [K/W]

4,0

3,0

H
10

53,3

2,0
61
2

1,0

0
12,8 0 1 2 3 4 5 6
SK DC 4 1 117 SA 12,8 45,7 45,7
I V [m/s]

art. no. 3,8 Rth [K/W]

5,0

4,0
3,5
20

3,0
53,3

K 62,5 2,0

1,0

0
13,5 16,5 16,5 13,5 0 1 2 3 4 5 6
SK DC 6 1 60 SA V [m/s]

L surface: black anodised

Heatsink profile-overview A 13 17 Standard aluminium profiles A 135 136

Drilling pattern for Solid State Relais A 12 Extruded heatsinks A 22 83
N A 113 Heatsinks for Solid State Relais A 11 12 Profiles for PCB mounting A 89 112
Special profiles A 140 Technical introduction A 28
 A
Extruded heatsinks for DC/DC converter
special versions on customers request
art. no.
3,8 Rth [K/W]
B
4,0

3,5
3,0

20

53,3
2,0
62,5
1,0
C
0
0 1 2 3 4 5 6
12,8 45,7 45,7 12,8
V [m/s]
SK DC 7 117 SA
art. no. 3,8
R th [K/W]
D
4,0
3,5

3,0
20

53,3
2,0
62,5
1,0
E
0
0 1 2 3 4 5 6
12,8 45,7 45,7 12,8
SK DC 7 1 117 SA V [m/s]

art. no. Rth [K/W]

F
6,0
5,0
3

3,2 4,0
8

30,5

3,0
50,8
2,0
1,0
G
66 0
76,2 0 1 2 3 4 5 6
SK DC 2 1 76 SA V [m/s]
art. no. Rth [K/W]

4,0 H
3,5

3,2
20

3,0
50,8

62,5 2,0

1,0

0 I
48,3 0 1 2 3 4 5 6
59
SK DC 5 59 SA V [m/s]

art. no. Rth [K/W]

4,0
3,5

3,2
3,0 K
20

50,8

2,0
62,5
1,0

0
48,3 0 1 2 3 4 5 6 L
SK DC 5 1 59 SA 59 V [m/s]

surface: black anodised

Heatsink profile-overview A 13 17 Standard aluminium profiles A 135 136

Drilling pattern for Solid State Relais A 12 Extruded heatsinks A 22 83
Heatsinks for Solid State Relais A 11 12 Profiles for PCB mounting A 89 112 A 114 N
Special profiles A 140 Technical introduction A 28
A
Retaining springs for transistors
art. no. for transistor- suitable for plate thick- material
housing heatsinks ness [mm]
B THF 129 TO 220 TO 220 FK 219/ 1-2 spring steel,
FK 222/ corrosion protec-

13,8

4
11,3
10
SK 129 ted 4 4

6,6
13,2 3,1

THF 104 TO 220/ SK 104 1-2 stainless steel

C TO 247/

7,8
TO 248/ 31,3
4

38,5
TO 3 P
THF 409 TO 220 TO 220/ SK 409 1.5-3.0 stainless steel
TO 247/

13,3

5
9,2
D TO 248/
16,5

4,6
4,25 4,25
18 3
TO 3 P
THF 409 SOT 32 TO 126/ SK 409 2-3 stainless steel
SOT 32/

5
11,4
7,2
SOT 82 16,5

4,5
4,25 4,25

E 18,2 3

THF 220 TO 220 FK 219/ 1-2 spring steel,

7,15
7,5
FK 222 corrosion protec-

3,9
4,6
11,5

4,6
ted 1,5 2,2
2,45 12,1 3,1

THF 247 TO 220/ SK 484 2 stainless steel

F TO 247/

14,1

5,5
TO 248/

4,5
3,5 29,5 3,5

TO 3 P 30,4 5

THF 247 4 TO 218/ SK 460 4 stainless steel 32,9

TO 220/
G

5,5
16,1

TO 247/ 6,9 29,5

4,3
TO 248/ 31,3 5
3,5 3,5

TO 3 P
THF 220 17 TO 218/ UK 35 1.0-1.5 stainless steel
17,4
TO 220/
9,2

8,8

3,9
H TO 247/
3,5

4,5

16,5
TO 248/ 3 16,9
1,8 1,5
3,6
TO 3 P
THF 409 220 1 TO 218/ SK 409/ 2-3 stainless steel
TO 220/ SK 459 5
12,3

4,6

TO 247/
I
3,2

TO 248/ 21,6 3
20

TO 3 P
THF 409 220 2 TO 218/ SK 145/ 4 stainless steel
TO 220/ SK 185/ 5
15,5
11,3

TO 247/ SK 437
K
4,5

TO 248/ 18
3
21,5

TO 3 P
THF 249 TO 220 FK 249 1.0-1.5 spring steel, 16,4

corrosion protec-
4
11

ted
6,3

3 15 3
L 12 3,7

THF 600 TO 218/ SK 600 2.5 spring steel,

TO 220/ corrosion protec-
14,4

TO 247/ ted
TO 3 P 37,1
7,54

Mica wafers E 19 Thermal conductive material E25

Kapton insulator washers E 16 Insulating caps E 51
N A 115 Heatsinks for PCB A 89 112 Thermal conductive paste E 21
Profiles for lock-in fixing spring A 84 88 Technical introduction A28
 A
Retaining springs for transistors
universal retaining spring for transistor housings types TO 218, TO 220, TO 247, TO 264, SOT 32 and various SIP Multiwatt etc.
utility patent 200 14 739.0
fast and easy mounting of the transistors B
number of retaining spring elements can be chosen (n = max. 10)
THFMG with thread M 4
specific versions and modifications on customers request
art. no. for transistor- spring material
housing force [N]
THFM ... TO 218/ 60 5 stainless steel n (max. 172,5 mm)
C
TO 220/ 25 17,5
10,4 n x 3,2
7,5
TO 247/
TO 264/

8
SOT 32/

30

3,25
SIP Multiwatt D
15 11 3,5
14 6,5
THFMG ... TO 218/ 60 5 stainless steel n (max. 172,5 mm)
TO 220/ 25 17,5
10,4 M4
TO 247/
TO 264/
7,5
E

8
SOT 32/

30

3,25
SIP Multiwatt
15 11 3,5
14 6,5

please indicate: ... number of retaining-spring elements

F
1 - 10

art. no. for transistor- spring material

housing force [N]
THFK 220 TO 220 79 stainless steel G
0,6

4,2
5,1

12
16,5
3,4 22,5
29,7
H
THFK 247 TO 218/ 119 stainless steel
0,6

4,2
TO 247
18
5,9

15,5
3,4 23,5
30,55
I

Mica wafers E 19 Thermal conductive material E25

Kapton insulator washers E 16 Insulating caps E 51
Heatsinks for PCB A 89 112 Thermal conductive paste E 21 A 116 N
Profiles for lock-in fixing spring A 84 88 Technical introduction A28
A
Retaining springs for transistors
able to slide on the transistor and mounting plate
easy mounting
B high pressure force and firm grip
specific versions upon customers request
art. no. for transistor- plate thick- hold- material
housing ness [mm] ing
force
C [N]
THFA 1 TO 220 2 20 stainless 10,7 10,2
steel

22,1
0,6

D
2,5
7,9

THFA 2 TO 220 6.5 20 spring steel,

E corrosion
13,2 10

protected
0,5

26,5
F
6,3
13,1

THFA 3 TO 220 5.5 33 spring steel,

corrosion 12,2 10
G protected
0,6

17,7
4
H 8,5

THFA 4 TO 218/ 6.5 59 spring steel, 13,2 15

TO 247 corrosion
protected 0,5
I 26,5

6,3
13,1
K

Mica wafers E 19 Thermal conductive material E25

Lock-in retaining spring for transistors A 119 121 Mounting parts for heatsinks E 49 50
N A 117 Heatsinks for PCB A 89 91 Thermal conductive paste E 21 22
Mounting material for semiconduct. E 44 48 Technical introduction A28
 A
Retaining springs for transistors

universal lock-in retaining spring for types TO 218, TO 220, TO 247, TO 264 and various SIP-Multiwatt etc. transistor housings
clip fastening also for power transistors without holes, MAX types etc. B
easy assembly and secure hold when using a special groove geometry in heatsinks, housing parts etc.
optimal heat transfer between component and cooling element
various spring clip shapes available for fastening the components (see sketch)
the range of suitable heat sinks is continuously extended
versions specifically designed to meet customers requirements on request
C
Installation

THFU 1
A
D

insert the lock-in retaining spring for transistors THFU 1 (A)

into the groove of the profile E
push transistor (B) below the springinu

THFU 2, THFU 3, THFU 4, THFU 5, THFU 6, THFU 7

A G

place transistor (B) onto the mounting area

press the lock-in retaining spring for transistors THFU 2 - 7 (A) into the
groove of the profile (a suitable installation aid will facilitate pressing in) H
B

Once in place, the spring will keep its position and fix the transistor with a high contact
pressure on the installation surface (the spring remains in its position and it can neither be
moved in a lengthwise direction nor fall it can out of the groove in a cross direction).
L

material: stainless steel M

material thickness: 0.8 mm

Mica wafers E 19 Thermal conductive material E25

Lock-in retaining spring for transistors A 119 121 Mounting parts for heatsinks E 49 50
Heatsinks for PCB A 89 91 Thermal conductive paste E 21 22 A 118 N
Mounting material for semiconduct. E 44 48 Technical introduction A28
A
Lock-in retaining spring for transistors
art. no. for transistor- suitable for spring materi-
housing heatsinks force [N] al
B THFU 1 TO 218/ SK 480/ 60 5 stain-
TO 220/ SK 481/ less
TO 247/ SK 482/ steel
TO 262/ SK 483/
TO 3 P/ SK 487/
C SOT 199/ SK 489/
SOT 429 SK 490/
SK 492/
SK 495/
SK 499/ 10,3

D SK 512/

14
17,2
SK 514/ 0,8
SK 573/
SK 574/ 2,9 10
SK 575/
SK 576/
E SK 589/
SK 593/
SK 617/
LAM 3 K/
LAM 4 K/
F LAM 5 K/
LA 27 K
THFU 2 TO 218/ SK 480/ 60 5 stain-
TO 220/ SK 481/ less
TO 247/ SK 482/ steel
TO 262/ SK 483/
G TO 3 P/ SK 487/
SOT 199/ SK 489/
SOT 429 SK 490/
SK 492/
SK 495/
H SK 499/ 10,5

SK 512/
14,4
17,7

0,8
SK 514/
SK 573/
SK 574/ 2,5 10

I SK 575/
SK 576/
SK 589/
SK 593/
SK 617/
LAM 3 K/
K LAM 4 K/
LAM 5 K/
LA 27 K

Heatsinks for PCB A 89 93 Mounting parts for heatsinks E 49 50

Heatsink profile-overview A 13 17 Profiles for PCB mounting A 89 112
N A 119 Assignment table A 18 20 Thermal conductive material E 2 24
Profiles for lock-in fixing spring A 84 88 Technical introduction A28
 A
Lock-in retaining spring for transistors
art. no. for transistor- suitable for spring materi-
housing heatsinks force [N] al
THFU 3 TO 218/ SK 480/ 50 5 stain-
B
TO 220/ SK 481/ less
TO 247/ SK 482/ steel
TO 262/ SK 483/
TO 3 P/ SK 487/
SOT 199/ SK 489/ C
SOT 429 SK 490/
SK 492/
SK 495/ 10,4
SK 499/
SK 514/ D

17
20,5
0,8
SK 573/
SK 574/
2,8 10
SK 575/
SK 576/
SK 589/
SK 593/ E
SK 617/
LAM 3 K/
LAM 4 K/
LAM 5 K/
LA 27 K F
THFU 4 TO 218/ SK 480/ 32 5 stain-
TO 202/ SK 481/ less
TO 220/ SK 482/ steel
TO 248/ SK 483/
TO 262/ SK 487/
TO 264/ SK 489/ 10,4
G
TO 3 P/ SK 490/
19,7

SOT 199 SK 495/

23,6

0,8
SK 499/
SK 514/
SK 575/ 1 10 H
SK 589/
SK 593/
SK 617/
LAM 5 K/
LA 27 K I
THFU 5 TO 218/ SK 490/ 25 5 stain-
TO 202/ SK 589/ less 10,4
TO 220/ SK 617/ steel
TO 247/ LAM 5 K/
23,7

TO 248/ LA 27 K
27,8

TO 262/
0,8 K
TO 264/
TO 3 P/ 1,4 10
SOT 199/
SOT 429
L

Heatsinks for PCB A 89 93 Mounting parts for heatsinks E 49 50

Heatsink profile-overview A 13 17 Profiles for PCB mounting A 89 112
Assignment table A 18 20 Thermal conductive material E 2 24 A 120 N
Profiles for lock-in fixing spring A 84 88 Technical introduction A28
A
Lock-in retaining spring for transistors
THFU for transistors with low component height
art. no. for transistor- suitable for spring materi-
B housing heatsinks force [N] al
THFU 6 TO 126/ SK 480/ 65 5 stain-
TO 218/ SK 481/ less
TO 220/ SK 482/ steel
TO 225/ SK 483/
C TO 247/ SK 487/
TO 248/ SK 489/
TO 251/ SK 490/
TO 3 P/ SK 492/
SOT 32 SK 495/ 10,5
D SK 499/
SK 512/

14,7
17,5
SK 514/ 0,8
SK 573/
SK 574/
1,5 10
SK 575/
E SK 576/
SK 589/
SK 593/
SK 617/
LAM 3 K/
F LAM 4 K/
LAM 5 K/
LA 27 K
THFU 7 eSIP SK 480/ 46 5 stain-
SK 482/ less
SK 483/ steel 10,4
G SK 487/
SK 490/
16,9
20,25

SK 492/ 0,8

SK 495/
SK 573/
H SK 574/ 3,6 10

SK 576/
LAM 3 K

Heatsinks for PCB A 89 93 Mounting parts for heatsinks E 49 50

Heatsink profile-overview A 13 17 Profiles for PCB mounting A 89 112
N A 121 Assignment table A 18 20 Thermal conductive material E 2 24
Profiles for lock-in fixing spring A 84 88 Technical introduction A28
A

N
A
U-Extruded heatsinks
art. no. Rth [K/W]

25
9
B 20

15
1,5

15
10

5
12
C SK 12 ... 25 50 75 100 [mm]

please indicate: ...

1000 mm
art. no.

D Rth [K/W]

25
14 20

15
1,5
13

10

E 17
5

25 50 75 100 [mm]

SK 13 ...
please indicate: ...
F 25 35 mm
art. no. 12
Rth [K/W]

10

8
4
40

G 6

SK 115 ... 50 100 150 200 [mm]

please indicate: ...

H 37.5 50 1000 mm

UK 14 SA 220 UK 14 SA 220 3,2 UK 14 SA M3

M 2,5 1,8 4 3,2 1,8 4 M3 1,8 4
I 1,5
5

5
15

5 5 5
14 12,5 12,5 12,5
20
25 20 20
25 25
K
art. no. Rth [K/W]
UK 14 SA 220 20 TO 220
UK 14 SA 220 3,2 20 TO 220
L UK 14 SA M3 20 TO 220
surface: black anodised

Profiles for PCB components A 91 Profiles for PCB mounting A 89 112

Heatsink profile-overview A 13 17 Extruded heatsinks A 22 83
N A 123 Heatsinks for PCB A 89 91 Retaining springs for transistors A 115 117
Hole pattern A 21 Technical introduction A 28
 A
U-Extruded heatsinks

1,2
3 x 3,2
4 B

1,2
9,5
15
18,5 14,8
35
27,5

C
art. no. Rth [K/W]
ICK 35 SA 15 TO 220

SK 12 SA 32 SK 12 SA 2 x 32
1,5 M 2,5 4,5 M 2,5 3 D

8
4
15

10 10
12 20 20
25 35
45
50
E
art. no. Rth [K/W]
SK 12 SA 32 30 1xSOT 32
SK 12 SA 2 x 32 15 2xSOT 32
SK 13 35 SA 220 SK 13 35 SA 220 3,2 SK 13 35 SA 220 3,5
F
M3 5 3,2 5 3,5 5
1,5
13

8
8
17 10,1 10,1 10,1
24,85 24,85
35
24,85
35 35 G
art. no. Rth [K/W]
SK 13 35 SA 220 17 TO 220
SK 13 35 SA 220 3,2 17 TO 220
SK 13 35 SA 220 3,5 17 TO 220
H
SK 431 1 SK 431 2 SK 431 3
3,8 3,2

3,2
2
11

11

12
11
12

12
9
11

5,5

8 8 2,5
I
16 21 17 17
25 25 25
art. no. Rth [K/W]
SK 431 1 18 TO 220
SK 431 2 18 TO 220 K
SK 431 3 18 TO 220
surface: black anodised

Profiles for PCB components A 91 Profiles for PCB mounting A 89 112

Heatsink profile-overview A 13 17 Extruded heatsinks A 22 83
Heatsinks for PCB A 89 91 Retaining springs for transistors A 115 117 A 124 N
Hole pattern A 21 Technical introduction A 28
A
Die-cast heatsinks
Setup heatsinks and angle for TO 3
B

4,2
27
12,7
C 22
24 30,2
40
art. no. [mm] Rth [K/W]
AKK 127 27 14
D

4,2
27
19,1

3,5
0,8
8,6

E 22
30,2
24 40
art. no. [mm] Rth [K/W]
AKK 191 27 12
F surface: black lacquered
material: die-casting aluminium

40
4,2 33

11
,2 ,5
30 17 4,2
G
30

13

7
10

5
41 9 41
,9

4,5 5,56

art. no. [mm] Rth [K/W]

H
WP 4030 100 ... 100 3.7
WP 4030 100 3 ... 100 3.7 TO 3
please indicate: ... surface
SA = black anodised
AL = raw degreased aluminium
I
socket: TF 3 2 E 50

Mounting for TO 3 angle A 125 Heatsinks for DC/DC converter A 113 114
Order example A 21 Profiles for lock-in fixing spring A 84 88
N A 125 Standard aluminium profiles A 135 136 Heatsink profile-overview A 13 17
Heatsinks for PCB A 89 112 Technical introduction A 28
 A
Die-cast heatsinks
Die-cast acc. to german standard DIN 41882
other lengths and drillings on request
art. no.
B
2,8 K/W

40

71

60,5
59,5
4,5
M6

30
M6
20,1
82
K 3 ... for mounting use insulator: art. no.: IS 53 D
please indicate: ... semiconductor retaining thread
M 6, M 8, M 10, M 12, 1/4"-28 UNF
art. no.
2,8 K/W
E

40

71

60,5
59,5
4,5
M6
F

30
M6
20,1
82
Cathode lug insulator with an additional insulated connection (M 3).
K 3 T ... for mounting use insulator: art. no.: IS 53
please indicate: ... semiconductor retaining thread G
M 6, M 8
art. no.
5 K/W

H
53,5
35

44
4

30

M5
M6
20,1
61

K 5 ... for mounting use insulator: art. no.: IS 53

I
please indicate: ... semiconductor retaining thread
M 5, M 6, M 8, 1/4"-28 UNF
art. no. 55
9 K/W M4
K
41,5

33,5
20

3

30

M4
M4
K 9 ... 14
55 L
please indicate: ... semiconductor retaining thread
M 4, M 5
surface: black lacquered

Mounting for TO 3 angle A 125 Heatsinks for DC/DC converter A 113 114
Special profiles A 21 Profiles for lock-in fixing spring A 84 88
Standard aluminium profiles A 135 136 Heatsink profile-overview A 13 17 A 126 N
Heatsinks for PCB A 89 112 Technical introduction A 28
A
Die-cast heatsinks
Die-cast acc. to german standard DIN 41882
other lengths and drillings on request
B art. no. 53
15 K/W

34,5

27,5
20

3

30
C M4 M4
14
K 15 ... 37

please indicate: ... semiconductor retaining thread

M 4, M 5

D surface: black lacquered

Mounting parts for heatsinks

art. no. 25,5

16,3
13,3
E
9,7
50 37

6,5
F
27
31

25,5

IS 53
G

Mounting for TO 3 angle A 125 Heatsinks for DC/DC converter A 113 114
Special profiles A 21 Profiles for lock-in fixing spring A 84 88
N A 127 Standard aluminium profiles A 135 136 Heatsink profile-overview A 13 17
Heatsinks for PCB A 89 112 Technical introduction A 28
 A
Die-cast heatsinks
completely milled mounting surface for semiconductors with square bottom plates
the mounting surface can be equipped with threads for fastening semiconductors with screwed glands (semiconductor thread tapping)
threads from M 4 to M 32 x 1.5 or 4 x threads for semiconductors with clamping plate mounting are available B
strap fastening thread M 8
delivery without anode strap
other lengths and drillings on request
5xM8

39

50
135

50
0,55 K/W 61

36 36
100
D
art. no. [mm] Rth [K/W]
K 0,55 ... 120 0.55
please indicate: ... semiconductor retaining thread
M 12, M 24 x 1,5
E
3xM8

75
90
100
94

42
1,1 K/W
F
25
50
68

art. no. [mm] Rth [K/W]

K 1,1 ... 90 1.1
please indicate: ... semiconductor retaining thread
G
M 8, M 12, M 16 x 1,5
surface: black lacquered

Accessories
anode end strap made of tin-plated cathode copper H
52 FL 0,55 42 FL 1,1
8,5
9,4
1,5
2

86 65
I
art. no. art. no.
FL 0,55 FL 1,1
WL 0,55 WL 1,1
52
13,5
42 11,4
K
9,5 8,5
95

1,5

55
45
80
2

80

art. no.
90
art. no.
L
WL 0,55 WL 1,1

Mounting for TO 3 angle A 125 Heatsinks for DC/DC converter A 113 114
Special profiles A 21 Profiles for lock-in fixing spring A 84 88
Standard aluminium profiles A 135 136 Heatsink profile-overview A 13 17 A 128 N
Heatsinks for PCB A 89 112 Technical introduction A 28
A
Standard fin coolers for thermoelectrical elements

fin coolers in special design

especially suitable for thermoelectric elements (Peltier-elements) and similar power modules
F compact design with reduced volume
large surface, therefore more efficient than extruded profiles
particularly low heat resistance with forced air cooling
ideally fitted fins from a heat engineers point of view
accurately flat milled surfaces
very low roughness
G machining for module mounting according to drawing
heat bridges (spacing bridges) on request
lapped surface on request
customer specific special design
32 x 3 = 96 mm
Rth [K/W] KTE 1 Rth [K/W] KTE 2
H 0,8
0,9
0,8
0,9
0,8
0,7 0,7
0,6 0,6
0,5 0,5
0,4 0,4
0,3 0,3
8

0,2
I 2 Rz10 0,05 100 0,1
0,2
0,1
0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
100 V [m/s] V [m/s]

art. no. [mm] art. no. [mm]

KTE 1 58 KTE 2 46
K material: aluminium, construction with copper on request

Fluid coolers A 131 133 Drilling pattern for Solid State A 12

Standard aluminium profiles A 135 136 Special heatsink design A 137 138
N A 129 High capacity cooling aggregat. D 26 29 Special profiles A 140
Heatsink profile-overview A 13 17 Technical introduction A 28
 A
Fin coolers KTE/KTED custom design

KTE
B

C
B
C
D E Rz10 0,05 100

possible dimensions: A F

dimensions [mm]
A B C D E F D
max. 400 max. 30 max. 150 0.8 / 1 / 1.5 / 2 min. 2 max. 400

please indicate with your order:

dimensions [mm]
A B C D E F
E

material: aluminium, construction with copper upon request

F
Rz10 0,2 100

B1
C
G
KTED
fin coolers in special design
B

for forced convection, thus particularly low thermal D E 0,2 100

resistance
Rz10
F
H
two opposite bottom plates as mounting surfaces
for power modules and similar A
mounting surfaces precisely flat milled
compact design with reduced volume
ideally fitted fins from a heat engineering point of view
lapped finish on request I
additional machining according to customers requirements
fan versions on request
special constructions to customers indications
possible dimensions:
dimensions [mm
K
A B B1 C D E F
max. 400 max. 30 max. 30 max. 150 0.8 / 1 / 1.5 / 2 min. 2 max. 400

please indicate with your order:

dimensions [mm] L
A B B1 C D E F
max. 400 max. 30 max. 30 max. 150 0.8 / 1 / 1.5 / 2 min. 2 max. 400

material: aluminium, construction with copper upon request M

Fluid coolers A 131 133 Drilling pattern for Solid State A 12

Standard aluminium profiles A 135 136 Special heatsink design A 137 138
High capacity cooling aggregat. D 26 29 Special profiles A 140 A 130 N
Heatsink profile-overview A 13 17 Technical introduction A 28
A
Fluid coolers for power modules
w [l/h]
V
w [mbar]
B [W]
Q
1000
900
U-flow (FLKU 140) 500
FLKI 80

2600 800 400

2400 700 FLKU 140
2200 U-flow (FLKU 140) 600 300
2000 I-flow (FLKI 80) 500
1800 400 I-flow (FLKI 80) 200

C 1600
1400
300
200 100
1200 100
1000 0
0 100 200 300 400 500 600 700 800 900 1000 0 100 200 300 400 500 600 700 800 900 1000 0 .... 24 33 42 51 60
[l/h]
Vw [l/h]
Vw Temperatur [C]

water-gycol mixture (60/40); inlet temperature approx. 26 C

D Fluid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable
for water pH 6.5-8.5 with anticorrosives, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure
for particularly good heat transfer to the fluid; minimised flow pressure losses (see diagram); operating pressure up to 2
bar possible; thick base plate for optimum heat distribution and to secure the heat-emmiting elements; mounting flange for the
cooler according to customer's instructions; precisely face milled surface of component mounting area with very good flatness
E and low roughness depth; dimensionally accurate adjustment to given mounting conditions; connections using hole ports
12 mm in diameter with reinforcing seam to DIN 71550 or installation flange to customers instuctions; I- or U-throughflow or multiple
throughflow versions; max. drilling depth in the base plate: 7 mm
To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%)
anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible
consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice
F or approval of the cooling fluids.

dimensions and designs using customer's instructions

art. no.
_2
+ DIN 71550
500
G 12 x 1,5

_1
+
68
80
40
580
Rz10 0,1 100

11,5
H
8,5

16

FLKI 80
art. no. _2
+
500 DIN 71550
I
12 x 1,5
_ 1,5

119
+
140

40
K Rz10
540
0,1 100
11,5
8,5

16

FLKU 140
material: EN AW 6060 (AlMgSi 0.5)
L

Fin coolers A 129 Special heatsink design A 137 138

Cooling aggregates with axial fan D 13 25 Special profiles A 140
N A 131 High capacity cooling aggregat. D 26 29 Hole pattern A 21
Heatsink profile-overview A 13 17 Technical introduction A 28
 A
Fluid coolers for power modules

1 = FLKI 80 G 500 2 = FLKI 80 G 300 3 = FLKI 80 G 200 1 = FLKU 140 G 500 2 = FLKU 140 G 300 3 = FLKU 140 G 200
B
w [l/h]
V w [l/h]
V
w [mbar] w [mbar] 3 2 1
1000 500 1000 500
900 900
800 400 800 400
700
600 3 300
700
600 300
C
2
500 500
400
1 200 400 200 3
300
3 300 2
200 100 2 200 100
100
1 100 1
0 0
0 100 200 300 400 500 600 700 800
[l/h]
Vw
0 .... 24 33 42 51
Temperatur [C]
0 100 200 300 400 500 600 700 800
[l/h]
Vw
0 .... 24 33 42 51
Temperatur [C]
D
water-gycol mixture (60/40); inlet temperature approx. 26 C

Fluid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable
for water pH 6.5-8.5 with anticorrosive, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure
for particularly good heat transfer to the fluid; minimised flow pressure losses; operating pressure up to 2 bar possible; E
thick base plate for optimum heat distribution and to secure the heat-emitting elements; mounting flange for the cooler according
to customer's instructions; precisely face milled surface of component mounting area with very good eveness and low roughness
depth; for power modules like IGBT-module, Thyristor-module, SCR diode module, bridge amplifiers and others;
dimensionally accurate adjustment to given mounting conditions; conncetions with thread muffle 1/8" or mounting flange
according to customer's instructions; I- or U-throughflow or multiple throughflow versions; max. drilling depth in the base
plate: 17 mm F

To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%)
anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible
consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice
or approval of the cooling fluids. G
dimensions and designs using customer's instructions
Q [W]
20 2600

20 2400
2200
H
15

0,1 100 2000

Rz10 FLKI 80 G 500
80

1800 FLKI 80 G 300

60

1600 FLKI 80 G 200

1400
1200
20
29

20

1/8 1000
0 100 200 300 400 500 600 700 800 900 1000
[l/h]
Vw
I
art. no. [mm] art. no. [mm]
FLKI 80 G 200 200 FLKI 80 G 500 500
FLKI 80 G 300 300
[W]
Q

20
2600
2400
K
2200 FLKU 140 G 500
20
2000 FLKU 140 G 300
15

0,1 100 1800 FLKU 140 G 200

140
100

Rz10 1600
1400
1200

1/8
1000
0 100 200 300 400 500 600 700 800 900 1000 L
20

20
29

[l/h]
Vw
art. no. [mm] art. no. [mm]
FLKU 140 G 200 200 FLKU 140 G 500 500
FLKU 140 G 300 300
material: EN AW 6060 (AlMgSi 0.5) M

Fin coolers A 129 Special heatsink design A 137 138

Cooling aggregates with axial fan D 13 25 Special profiles A 140
High capacity cooling aggregat. D 26 29 Hole pattern A 21 A 132 N
Heatsink profile-overview A 13 17 Technical introduction A 28
A
Recooling systems for liquid coolers
recooling system for all types of liquid coolers
cools up to 2,600 watts thermal power loss
B consists of pump and recooler
pump as normally aspirating, single-stage centrifugal pump with spiral housing in block construction
recooler with liquid-conducting tube system with air lamella and electrically driven fan motor
further information free of charge under: FLK R1-Info
notes: anticorrosive agents are required when water is used as coolant (eg. water/glykol - 60/40)
the hose systems used (NOT in scope of delivery) must be resistant to anticorrosive agents (eg. material EPDM according to DIN 73411,
C ISO 4081)

To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%)
anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible
consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice
or approval of the cooling fluids.
D art. no.
25
225
1/8

64
E

120
75

56
90
82 90
106

F
276 177

G
288

3/4
H
FLKR 1
thermal cooling capacity: max. 2.600 W
pump: single-phase 230 V AC, 120 W
recooler: single-phase 230 V AC, 120 W/ three-phase 400 V AC, 90 W
I type of delivery: pump and recooler

Fin coolers A 129 Special heatsink design A 137 138

Cooling aggregates with axial fan D 13 25 Special profiles A 140
N A 133 High capacity cooling aggregat. D 26 29 Hole pattern A 21
Heatsink profile-overview A 13 17 Technical introduction A 28
A

N
A
Standard aluminium profiles
length, drilling and surface finishes to customer's instructions
other standard profiles on request
B
U-profiles
D

C
C B
art. no. A [mm] B [mm] C [mm] D [mm] art. no. A [mm] B [mm] C [mm] D [mm]
SU 02 20 40 20 2.5 SU 16 30 30 30 2.0
SU 03 20 40 20 2.0 SU 27 40 40 40 2.5
SU 05 30 20 30 2.0 SU 29 40 40 40 4.0
D
SU 09 20 20 20 1.5 SU 32 30 30 30 3.0
tolerances: EN 755
material: EN AW 6060 (AlMgSi 0.5)

flat profiles
E B

A
art. no. A [mm] B [mm] art. no. A [mm] B [mm]
SFP 005 40 15 SFP 058 40 8
F SFP 006 30 8 SFP 060 80 8
SFP 007 40 5 SFP 067 30 15
SFP 016 70 15 SFP 074 70 10
SFP 028 40 10 SFP 076 60 30
G SFP 029 30 10 SFP 079 90 100
SFP 037 55 10 SFP 090 120 15
SFP 046 25 5 SFP 100 100 15
SFP 054 50 10 SFP 106 40 20
SFP 057 115 100 SFP 112 100 25
H tolerances: EN 755
material: EN AW 6060 (AlMgSi 0.5)

angled profile

I
C
B

art. no. A [mm] B [mm] C [mm] art. no. A [mm] B [mm] C [mm]
SWP 02 80 80 8 SWP 29 15 10 2
K SWP 06 80 40 6 SWP 36 75 50 5
SWP 10 30 20 2 SWP 40 40 30 5
SWP 15 40 20 4 SWP 55 40 40 5
SWP 23 20 15 2 SWP 57 60 30 5
L SWP 25 50 30 5
tolerances: EN 755
material: EN AW 6060 (AlMgSi 0.5)

Hole pattern A 21 Construction parts made of aluminium A 139

Extruded heatsinks A 22 83 Heatsink as visual & decor-parts A 10
N A 135 Mounting for TO 3 angle A 125 126 Special profiles A 140
High capacity heatsinks A 57 58 Technical introduction A 28
 A
Standard aluminium profiles
quadrangular profile

B
A

art. no. A [mm] B [mm] art. no. A [mm] B [mm]

SVP 01 8 8 SVP 12 50 50 C
SVP 04 25 25 SVP 13 55 55
SVP 10 10 10
tolerances: EN 755
material: EN AW 6060 (AlMgSi 0.5)
D
T-profile

C
B A

E
art. no. A [mm] B [mm] C [mm] art. no. A [mm] B [mm] C [mm]
STP 4 60 60 6 STP 5 20 20 2
tolerances: EN 755
material: EN AW 6060 (AlMgSi 0.5)
F

Hole pattern A 21 Construction parts made of aluminium A 139

Extruded heatsinks A 22 83 Heatsink as visual & decor-parts A 10
Mounting for TO 3 angle A 125 126 Special profiles A 140 A 136 N
High capacity heatsinks A 57 58 Technical introduction A 28

Streamlined omnidirectional fin geometrie
Customer specified CNC treatments of cooling profiles
latest CNC machining centres for highest
quality demands
profile treatments for seizes up to 1600 mm
future orientated stockkeeping of the aluminium profiles
in fully automated honeycomb warehouses
batch size optimized production flow
special profiles, modifications and surfaces according
to your special demand
Extruded heatsinks with pressed-in fins
for highest thermal dissipation losses
channelled fin geometrie for increasing the surface
thermotechnical optimized connection between fin and
bottom plate
deliverable in widths of 200 up to 750 mm
customer specific versions and treatments
CNC treatments of cooling profiles
Heatsinks with pressed-in fins
Precise milled flat surfaces
Streamlined omnidirectional fin geometrie
free-standing cooling fingers for forced cooling
incident flow of the heatsinks by means of fans from all
sides (omnidirectional)
no direction-oriented installation position
fin spacings according to your demand
special designs, treatments and versions according to
customers request
Precise milled flat surfaces
very small depth of roughness and unevenness
individually milled flat semi-conductor mounting surfaces
for minimizing the heat-transmission resistances
millings on the already anodized heatsinks
protective foil avoid scratching of the high-quality
mounting surface
special designs according to customers drawing

Surface labelling
durable and high quality labeling by means of
YAG-laser, silk screen-, pad- and digital printing
print layout preparation by means of in-house repro
department
precise in contrast, precise engraved fonts and contours
by means of CNC-controlled treatment systems
labeling of aluminium, Plexiglas and plastics
Heatsinks with integrated sealing
foamed sealing applied on the profile as a permanent
element of the heatsink
also usable for front plates or milled parts
groove filled or stacked
permanently elastic and CFC-free
adaption of the sealing properties to the specific
application
Surface labelling
Additional equipments
Heatsinks with integrated sealing
19 compliant CNC-treatment
Additional equipments
fractional semi-conductor mounting surfaces made of
copper for heat dissipation
pressed-in or screwed distance sleeves made of metal
and plastics
threaded bolts with internal and external thread
support rail mountings made of metal or plastics
according to DIN EN 50022
19 compliant CNC-treatment
milled heatsink side or back panels for 19 cases,
19 plug in boxes, subracks and insert modules
pressing in or welding of threaded bolts
customer specified modifications, designs
surfaces and printing upon request

Welded high performance heatsinks
optimal fin geometry with channelled structure for free
convection
production of heatsink widths outside of the
press-technical production possibilities
removing of the welding line by means of precise milled
flat surfaces
individual surface design
Construction- and milled parts made of aluminium
according to customer specifications
precise milled contours and surfaces
inserting of holes and cut-outs, cutting or milling of
threads
turning in of wire thread inserts for high- and
wear-resistant threads
simple data exchange by means of up to date
CAD- / CAM-systems
Welded high perfomance heatsinks
Welded heatsinks
Construction- and milled parts
Cases and contour milled parts
Welded heatsinks
homogeneous connection of the materials by means of
special welding methods
welding on additional mounting levels which are situated
diagonally to the pressing direction of the profiles
production of prototypes
application-based special designs and treatments
according to your demand
Cases and contour milled parts made of aluminium
customer specific cases and construction parts
precise mechanical treatments for highest quality
demands
all requested surface designs
modifications and versions, special requirements,
treatments and designs according to your drawing
specification
 A
Special profiles

Whenever you cannot find the ideal solution for your problem from the wide range of standard extrusions on offer or a solution
constitutes a compromise between the use of the space available and the weight, as long as the quantity is correct a special section
B
is the answer.

Released from the dimensional restrictions of the standard profiles, special extrusions are tailored to your design requirements, and
offer considerable benefits in terms of machining time and use of space.

Furthermore your calculation will be influenced positively by the optimised material use and shorter machining times. C
You can determine the combination of the desired thermal properties and the design element yourself, by the use of a special profile.
We are not allowed to publish many of our customer-specific Profiles, because they are subject to non disclosure agreements.
Therefore we only show some examples for customer profiles in the industry.
All figures are illustrations. Changes reserved.

D
27.5

70
98
E
22

200

120
F

70
50

G
107
200

18
H
50

59

107 15

220.8
I
22

120
7.5
25

K
26.8

138
85

44.3

L
66
80

70
65.5

M
222.9 37.1 40

If required please send your request.

A 140 N

Heatsinks and coolers for processors
Round and pin heatsinks
streamlined omnidirectional fin geometrie
excellent thermal conductivity due to special aluminium
alloys
suitable for free and forced convection
no direction bounded installation position
flat semiconductor mounting surfaces
contour also as milled parts according to your demands
Heatsinks for all current PL CC, DIL-IC and SMD
transistor types
effective heat dissipation at a low profile and low weight
direct mounting of the component by means of a
double-sided adhesive thermal foil or glue
solderable versions of the surface
special packaging such as tape & reel, magazine or tray
upon request
Round and pin heatsinks
Heatsinks for LEDs
Heatsinks for all transistor types
Heatsinks for LEDs
various heatsink geometries adjusted to all current
LED-types and light-engines
star shaped heatsinks for the use as a LED-lamp housing
LED mounting by means of screws, thermal conductive
adhesive foil or thermal conductive glue
customer specified versions with application based
thermal management
Heatsinks and coolers for processors
passive and active product solutions
effective heat dissipation due to optimal conception of
fan and heatsink
long lifetime and high operating safety due to
high quality fans
versions for screw, glue and clip mounting
customer specific solutions and fans
 A
Heatsinks for IC processor
art. no. page Rth dissipation way of fixation socket suitable for processor
[K/W] loss type
[W] B
ICK PGA 6 x 6 x 14 B 11 20 6.4 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 8 x 8 x 12 B 11 14.8 8.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 9 x 9 B 11 14 3 therm. conductive foil/ universal universal C
therm. cond. adhesive
ICK PGA 11 x 11 x 8 B 11 16 7.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 11 x 11 B 11 10.9 4.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 11 x 11 x 12 B 12 12.3 3.9 therm. conductive foil/ universal universal
D
therm. cond. adhesive
ICK PGA 14 x 14 B 12 10 4.9 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 14 x 14 x 10 B 12 10.5 11.2 therm. conductive foil/ universal universal
therm. cond. adhesive E
ICK PGA 14 x 14 x 14 B 12 9.6 12.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 14 x 14 x 12 B 12 9.8 5.3 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 15 x 15 B 12 9.4 5.9 therm. conductive foil/ universal universal F
therm. cond. adhesive
ICK PGA 16 x 16 x 8 B 13 14 4.9 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 16 x 16 x 10 B 13 10.5 12.9 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 16 x 16 x 12 B 13 9.3 6.2 therm. conductive foil/ universal universal G
therm. cond. adhesive
ICK PGA 17 x 17 B 13 8.6 6.9 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 17 x 17 x 8 B 13 13.2 5.2 therm. conductive foil/ universal universal
therm. cond. adhesive H
ICK PGA 17 x 17 x 12 B 13 9 6.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 18 x 18 B 14 8.4 7.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 19 x 19 B 14 8.6 7.6 therm. conductive foil/ universal universal
therm. cond. adhesive
I
ICK PGA 19 x 19 x 12 B 14 9 6.9 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 20 x 20 x 10 B 14 8.5 15.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 20 x 20 B 14 7.6 8.3 therm. conductive foil/ universal universal K
therm. cond. adhesive
ICK PGA 20 x 20 K B 15 7.6 8.3 fixing clamp socket 7/ IDT W2A/
socket 370 AMD K6-III/
AMD K6-2/
MMX/ L
IDT C6/
Intel Pentium
ICK PGA 20 x 20 x 8 B 15 12 6.3 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 20 x 20 x 12 B 15 8 8.1 therm. conductive foil/ universal universal
therm. cond. adhesive
M

very good thermal efficiency

aerodynamic imnidirectional fin geometry
simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue B2 N
customer specified designs, surfaces and modifications upon request
A
Heatsinks for IC processor
art. no. page Rth dissipation way of fixation socket suitable for processor
[K/W] loss type
B [W]
ICK PGA 21 x 21 B 15 7 8.6 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK PGA 22 x 22 B 15 6.2 8.9 therm. conductive foil/ universal universal
therm. cond. adhesive
C ICK PGA 25 x 25 B 16 5 11.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 10 x 10 B 17 30 1.8 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 10 x 10 x 10 B 17 28.5 1.9 therm. conductive foil/ universal universal
therm. cond. adhesive
D ICK BGA 14 x 14 B 17 30 2.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 14 x 14 x 10 B 17 27.4 2.3 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 21 x 21 B 18 24.3 2.5 therm. conductive foil/ universal universal
E therm. cond. adhesive
ICK BGA 23 x 23 B 18 22.5 2.8 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 23 x 23 x 10 B 18 21.5 2.9 therm. conductive foil/ universal universal
therm. cond. adhesive
F ICK BGA 27 x 27 B 18 20 3.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 27 x 27 x 10 B 18 18.5 3.3 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 27 x 27 x 14 B 18 13.5 9.5 therm. conductive foil/ universal universal
therm. cond. adhesive
G ICK BGA 27 x 27 x 22 B 19 10.5 9.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 31 x 31 B 19 18.6 3.4 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 31 x 31 x 10 B 19 17 3.7 therm. conductive foil/ universal universal
H therm. cond. adhesive
ICK BGA 35 x 35 B 19 16.5 3.7 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 35 x 35 x 10 B 19 15.7 3.8 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 37 x 37 x 6 B 19 15.7 9.5 therm. conductive foil/ universal universal
I therm. cond. adhesive
ICK BGA 37 x 37 x 10 B 20 14 10.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 40 x 40 B 20 14.6 4.3 therm. conductive foil/ universal universal
therm. cond. adhesive
K ICK BGA 40 x 40 x 10 B 20 13.8 4.4 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK BGA 42,5 x 45 B 20 13.6 4.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 10 x 10 x 6,5 B 21 25 2.5 therm. conductive foil/ universal universal
L therm. cond. adhesive
ICK S 10 x 10 x 10 B 21 23.75 2.6 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 10 x 10 x 12,5 B 21 22.5 2.8 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 10 x 10 x 18,5 B 22 21.75 3 therm. conductive foil/ universal universal
M therm. cond. adhesive

very good thermal efficiency

aerodynamic imnidirectional fin geometry
N B3 simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue
customer specified designs, surfaces and modifications upon request
 A
Heatsinks for IC processor
art. no. page Rth dissipation way of fixation socket suitable for processor
[K/W] loss type
[W] B
ICK S 14 x 14 x 6,5 B 22 9 5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 14 x 14 x 10 B 22 8.8 5.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 14 x 14 x 12,5 B 22 8.1 5.4 therm. conductive foil/ universal universal C
therm. cond. adhesive
ICK S 14 x 14 x 18,5 B 22 7.9 5.6 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 17 x 17 x 15 B 22 8.36 5.95 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 17 x 17 x 20 B 23 7.89 6.3 therm. conductive foil/ universal universal
D
therm. cond. adhesive
ICK S 18 x 18 x 6,5 B 23 7 7.7 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 18 x 18 x 10 B 23 6.8 8 therm. conductive foil/ universal universal
therm. cond. adhesive E
ICK S 22 x 22 x 10 B 23 5.9 8.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 22 x 22 x 18,5 B 23 5 10 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 25 x 25 x 6,5 B 23 5.8 12.9 therm. conductive foil/ universal universal F
therm. cond. adhesive
ICK S 25 x 25 x 12,5 B 24 5.3 14.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 25 x 25 x 18,5 B 24 5.2 14.4 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 29 x 29 x 10 B 24 5.7 13.1 therm. conductive foil/ universal universal G
therm. cond. adhesive
ICK S 29 x 29 x 20 B 24 3.7 20.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 29 x 29 x 30 B 24 2.9 21 therm. conductive foil/ universal universal
therm. cond. adhesive H
ICK S 32 x 32 x 10 B 24 5.4 13.8 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 32 x 32 x 20 B 25 3.7 20.4 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 36 x 36 x 10 B 25 4.7 16 therm. conductive foil/ universal universal
therm. cond. adhesive
I
ICK S 36 x 36 x 15 B 25 3.9 19.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 36 x 36 x 20 B 25 3.2 22 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 36 x 36 x 30 B 25 2.5 23.4 therm. conductive foil/ universal universal K
therm. cond. adhesive
ICK S 40 x 40 x 10 B 25 4.6 16.3 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 40 x 40 x 20 B 26 3.5 21.4 therm. conductive foil/ universal universal
therm. cond. adhesive L
ICK S 40 x 40 x 25 B 26 3.1 23.7 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 45 x 45 x 10 B 26 4.7 16 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 45 x 45 x 20 B 26 4.4 17 therm. conductive foil/ universal universal
therm. cond. adhesive
M

very good thermal efficiency

aerodynamic imnidirectional fin geometry
simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue B4 N
customer specified designs, surfaces and modifications upon request
A
Heatsinks for IC processor
art. no. page Rth dissipation way of fixation socket suitable for processor
[K/W] loss type
B [W]
ICK S 50 x 50 x 20 B 26 2.7 27.7 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 50 x 50 x 25 B 26 2.4 31.2 therm. conductive foil/ universal universal
therm. cond. adhesive
C ICK S 50 x 50 x 40 B 27 6.05 13.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 50 x 50 x 50 B 27 4.05 14.32 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S 98 x 98 x 30 B 27 2.4 35 therm. conductive foil/ universal universal
therm. cond. adhesive
D ICK S 98 x 98 x 45 B 27 3.5 42 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S D 12 x 12 x 7,5 B 28 10.85 4.6 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S D 18 x 12 x 7,5 B 28 9 5.4 therm. conductive foil/ universal universal
E therm. cond. adhesive
ICK S D 24 x 18 x 7,5 B 28 8.5 5.85 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S D 98 x 98 x 10 B 28 4.88 10.25 therm. conductive foil/ universal universal
therm. cond. adhesive
F ICK S R 28,5 x 6,5 B 29 5.82 15.6 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 28,5 x 10 B 29 5.65 16 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 28,5 x 12,5 B 29 5.53 16.3 therm. conductive foil/ universal universal
therm. cond. adhesive
G ICK S R 28,5 x 18,5 B 29 4.25 20.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 32,5 x 10 B 29 5.54 9 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 32,5 x 20 B 29 5.6 8.9 therm. conductive foil/ universal universal
H therm. cond. adhesive
ICK S R 32,5 x 30 B 30 4.2 11 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 32,5 x 40 B 30 3.2 15 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 32,5 x 50 B 30 2.7 18 therm. conductive foil/ universal universal
I therm. cond. adhesive
ICK S R 36,5 x 20 B 30 6.41 18 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 40 x 10 B 30 11.04 8.4 therm. conductive foil/ universal universal
therm. cond. adhesive
K ICK S R 40 x 20 B 30 10.32 8.8 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R A 40 x 20 B 31 11.62 8.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 40 x 30 B 31 9.77 16 therm. conductive foil/ universal universal
L therm. cond. adhesive
ICK S R 40 x 50 B 31 2 25 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 45 x 30 B 31 8 9.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 45 x 45 B 31 6 9.2 therm. conductive foil/ universal universal
M therm. cond. adhesive

very good thermal efficiency

aerodynamic imnidirectional fin geometry
N B5 simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue
customer specified designs, surfaces and modifications upon request
 A
Heatsinks for IC processor
art. no. page Rth dissipation way of fixation socket suitable for processor
[K/W] loss type
[W] B
ICK S R 50 x 10 B 31 5.28 9.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 50 x 20 B 32 8.55 9.8 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 50 x 30 B 32 8.26 10 therm. conductive foil/ universal universal C
therm. cond. adhesive
ICK S R 50 x 45 B 32 6.32 12.7 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 54 x 20 B 32 8.11 10.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 54 x 30 B 32 6.95 11.57 therm. conductive foil/ universal universal
D
therm. cond. adhesive
ICK S R 54 x 45 B 33 5.37 15.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 70 x 30 B 33 1.8 27 therm. conductive foil/ universal universal
therm. cond. adhesive E
ICK S R 70 x 50 B 33 1.5 33 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 85 x 30 B 33 2 25 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 85 x 45 B 33 1.8 27 therm. conductive foil/ universal universal F
therm. cond. adhesive
ICK S R 98 x 30 B 34 1.65 30 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK S R 98 x 50 B 34 1.4 35 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 23,5 x 14 B 35 18.58 6.5 therm. conductive foil/ universal universal G
therm. cond. adhesive
ICK LED R 23,5 x 14 G B 35 19.16 6.3 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 27 x 10 B 35 17.69 6.7 therm. conductive foil/ universal universal
therm. cond. adhesive H
ICK LED R 27 x 10 G B 35 18.24 6.6 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 28 x 15 B 35 15.24 7.8 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 28 x 15 G B 36 15.72 7.6 therm. conductive foil/ universal universal
therm. cond. adhesive
I
ICK LED R 29 x 11,5 B 36 17.26 8.2 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 29 x 11,5 G B 36 17.8 8 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 32 x 14 B 36 15.23 7.8 therm. conductive foil/ universal universal K
therm. cond. adhesive
ICK LED R 32 x 14 G B 36 15.23 7.6 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 33 x 10 B 36 17.6 6.8 therm. conductive foil/ universal universal
therm. cond. adhesive L
ICK LED R 33 x 10 G B 36 18.15 6.6 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 33 x 16,5 B 37 13.87 8.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 33 x 16,5 G B 37 14.3 8.3 therm. conductive foil/ universal universal
therm. cond. adhesive
M

very good thermal efficiency

aerodynamic imnidirectional fin geometry
simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue B6 N
customer specified designs, surfaces and modifications upon request
A
Heatsinks for IC processor
art. no. page Rth dissipation way of fixation socket suitable for processor
[K/W] loss type
B [W]
ICK LED R 35 x 10 B 37 16.9 9.35 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 35 x 10 G B 37 17.5 9.2 therm. conductive foil/ universal universal
therm. cond. adhesive
C ICK LED R 36 x 12 B 37 12.88 10 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 36 x 12 G B 37 13.28 8.9 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 40 x 10 B 37 12.28 9.45 therm. conductive foil/ universal universal
therm. cond. adhesive
D ICK LED R 40 x 10 G B 38 12.66 9.3 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 40 x 27 B 38 9.41 12.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 40 x 27 G B 38 9.71 11.9 therm. conductive foil/ universal universal
E therm. cond. adhesive
ICK LED R 45,7 x 16,5 B 38 10.46 11.05 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 45,7 x 16,5 G B 38 10.49 10.8 therm. conductive foil/ universal universal
therm. cond. adhesive
F ICK LED R 50 x 10 B 38 10.57 10.5 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 50 x 10 G B 39 10.9 10.3 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 50,8 x 16,5 B 39 10.17 11.1 therm. conductive foil/ universal universal
therm. cond. adhesive
G ICK LED R 50,8 x 16,5 G B 39 10.49 10.9 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 54 x 20 B 39 9.48 12.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 54 x 20 G B 39 9.78 11.9 therm. conductive foil/ universal universal
H therm. cond. adhesive
ICK LED R 66 x 40 B 39 3.2 21 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 75 x 10 B 40 5.2 12.1 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 84 x 40 B 40 2.5 14.5 therm. conductive foil/ universal universal
I therm. cond. adhesive
ICK LED R 100 x 40 B 40 2 27 therm. conductive foil/ universal universal
therm. cond. adhesive
ICK LED R 160 x 40 B 40 1.4 42 therm. conductive foil/ universal universal
therm. cond. adhesive
K ICK LED R 200 x 40 B 41 1 51 therm. conductive foil/ universal universal
therm. cond. adhesive

very good thermal efficiency

aerodynamic imnidirectional fin geometry
N B7 simple mounting by means fo fixing clamp, thermal conductive adhesive film or thermal conductive glue
customer specified designs, surfaces and modifications upon request
 A
Fan coolers for IC processor
art. no. page Rth dissipation way of fixation socket suitable for processor
[K/W] loss type
[W] B
LA LED 40 x 30 B 49 1.4 35 therm. conductive foil/ universal universal
therm. cond. adhesive
LA LED 50 x 20 B 49 1.25 40 therm. conductive foil/ universal universal
therm. cond. adhesive
LA LED 50 x 45 B 49 0.9 50 therm. conductive foil/ universal universal C
therm. cond. adhesive
ICK PPC 51 B 56 8.1 14 screw fastening Power PC
ICK PEN 3 XE B 56 2 31.3 screw fastening Slot 2 Intel Pentium
III-XeonTM Slot II
Format
ICK PEN 3 XE 1 B 56 1.8 33.6 screw fastening Slot 2 Intel Pentium
D
III-XeonTM Slot II
Format
ICK EM 25 B 56 3.9 20.4 screw fastening Q7 Board
ICK PEN 38 F B 57 4 15.1 therm. conductive foil socket 7/ AMD K6-III/
socket 370 IDT W2A/ E
MMX/
IDT C6/
Intel Pentium/
AMD K6-2
ICK PEN 38 W B 57 4 15.1 therm. cond. adhesive socket 7/ AMD K6-III/ F
socket 370 IDT W2A/
MMX/
IDT C6/
Intel Pentium/
AMD K6-2
ICK PEN 45 W B 57 3.5 21 therm. cond. adhesive socket 7/ AMD K6-III/ G
socket 370 IDT W2A/
MMX/
IDT C6/
Intel Pentium/
AMD K6-2 H
ICK PRO 40 W B 57 2.7 22 therm. cond. adhesive socket 8 Intel Pentium PRO
ICK PEN 3 FC B 57 3.5 22 fixing clamp socket 7/ Intel Pentium III FC
socket 370 PGA (Mendocino,
Coppermine)
LA
LA
ICK
ICK
15
15
x
x
15
15
F 05
F 12
B 58
B 58
2.3
2.3
22.2
22.2
therm. conductive foil
therm. conductive foil
universal
universal
universal
universal
I
LA ICK 17 x 17 F 12 B 58 1.6 35.8 therm. conductive foil universal universal
LA ICK 17 x 17 F 12 A B 58 1.6 35.8 therm. conductive foil universal universal
LA ICK 17 x 17 W 05 B 58 1.6 35.8 therm. cond. adhesive universal universal
LA ICK 17 x 17 W 12 B 58 1.6 35.8 therm. cond. adhesive universal universal
LA ICK 18 x 18 F 12 B 58 1.5 41.7 therm. conductive foil universal universal K
LA ICK 18 x 18 W 12 B 58 1.5 41.7 therm. cond. adhesive universal universal
LA ICK 21 x 21 F 05 B 58 1.4 46.3 therm. conductive foil universal universal
LA ICK 21 x 21 F 12 B 58 1.4 46.3 therm. conductive foil universal universal
LA ICK 21 x 21 W 05 B 58 1.4 46.3 therm. cond. adhesive universal universal
LA ICK 21 x 21 W 12 B 58 1.4 46.3 therm. cond. adhesive universal universal L

high-quality industrial design

compact design with high mechanical stability
fan with doubled ball bearing axis B8 N
optimal thermotechnical design of fan and heatsink
A
Fan coolers for IC processor
art. no. page Rth dissipation way of fixation socket suitable for processor
[K/W] loss type
B [W]
LA ICK PEN 8 F 05 B 59 2.5 23.4 therm. conductive foil socket 7/ AMD K6-III/
socket 370 IDT W2A/
Cyrix MII and similar/
MMX/
C IDT C6/
Intel Pentium/
AMD K6-2
LA ICK PEN 8 F 12 B 59 2.5 23.4 therm. conductive foil socket 7/ AMD K6-III/
socket 370 IDT W2A/
Cyrix MII and similar/
D MMX/
IDT C6/
Intel Pentium/
AMD K6-2
LA ICK PEN 8 W 05 B 59 2.5 23.4 therm. cond. adhesive socket 7/ AMD K6-III/
E socket 370 IDT W2A/
Cyrix MII and similar/
MMX/
IDT C6/
Intel Pentium/
F AMD K6-2
LA ICK PEN 8 W 12 B 59 2.5 23.4 therm. cond. adhesive socket 7/ AMD K6-III/
socket 370 IDT W2A/
Cyrix MII and similar/
MMX/
IDT C6/
G Intel Pentium/
AMD K6-2
LA ICK PEN 16 K 12 B 59 1.2 51.1 fixing clamp socket 7/ AMD K6-III/
socket 370 IDT W2A/
Cyrix MII and similar/
H MMX/
IDT C6/
Intel Pentium/
AMD K6-2
LA ICK PEN 16 W 12 B 59 1.2 51.1 therm. cond. adhesive socket 7/ AMD K6-III/
socket 370 IDT W2A/
I Cyrix MII and similar/
MMX/
IDT C6/
Intel Pentium/
AMD K6-2
K LA ICK PEN 16 W 12 A B 59 1.2 51.1 therm. cond. adhesive socket 7/ AMD K6-III/
socket 370 IDT W2A/
Cyrix MII and similar/
MMX/
IDT C6/
L Intel Pentium/
AMD K6-2

high-quality industrial design

compact design with high mechanical stability
N B9 fan with doubled ball bearing axis
optimal thermotechnical design of fan and heatsink
 A
Fan coolers for IC processor
art. no. page Rth dissipation way of fixation socket suitable for processor
[K/W] loss type
[W] B
LA ICK PEN 18 W 12 B 59 1.6 38.6 therm. cond. adhesive socket 7/ AMD K6-III/
socket 370 IDT W2A/
Cyrix MII and similar/
MMX/
IDT C6/ C
Intel Pentium/
AMD K6-2
LA ICK PEN 38 W 12 B 59 1.1 53.6 therm. cond. adhesive socket 7/ AMD K6-III/
socket 370 IDT W2A/
Cyrix MII and similar/
MMX/
D
IDT C6/
Intel Pentium/
AMD K6-2
LA ICK PRO 25 F 12 B 59 0.97 60 therm. conductive foil socket 8 Intel Pentium PRO
LA ICK PEN 2 K 12 B 60 1.2 58 Slot A/ Intel Pentium II/ E
Slot 1 AMD Athlon
LA ICK PEN 3 XE B 60 0.8 61.8 screw fastening Slot 2 Intel Pentium
III-XeonTM
LA ICK PEN 4 1 K B 60 0.6 85 fixing clamp socket 463/ Intel Pentium IV

socket 423 F

high-quality industrial design

compact design with high mechanical stability
fan with doubled ball bearing axis B 10 N
optimal thermotechnical design of fan and heatsink
A
Heatsinks for PGA

D double-sided adhesive thermal conductive foil WLF ... E 7

surface: black anodised
art. no. Rth 20
[K/W] 16

14
12

E 14 14
8

2,5
4

ICK PGA 6 x 6 x 14 0
0 1 2 3 4 5 6
WLF ... 14 x 14 v [m/s]
art. no. Rth 15
12,3
[K/W] 12
F 9
23 23 6
2,5

3
ICK PGA 8 x 8 x 12 0
0 1 2 3 4 5 6
WLF ... 23 x 23 v [m/s]
G art. no. Rth 14
[K/W] 12
12,3

10
8
24,2 24,2
3,5

6
4
H 2
ICK PGA 9 x 9 0
0 1 2 3 4 5 6
WLF ... 24 x 24 v [m/s]
art. no. Rth 20
[K/W] 16
8

I 24,76 27,95 12
2,5

8
4
0
ICK PGA 11 x 11 x 8 0 1 2 3 4 5 6
WLF ... 24 x 27 v [m/s]

K art. no. Rth 14

[K/W] 12
15,24

10

24,76 27,95 8
3,5

6
4
L 2
0
ICK PGA 11 x 11 0 1 2 3 4 5 6
WLF ... 24 x 27 v [m/s]

Mounts E 44 48 Pin heatsinks for IC B 21 27

Heatsinks for PLCC B 52 SMD-heatsinks B 53 54
N B 11 Thermal conductive paste E 21 24 Heatsinks for PGA B 11 16
Thermal conductive glue E 23 24 Technical introduction A28
 A
Heatsinks for PGA
art. no.
Rth 14
[K/W] 12 B

12,5
10
24,76 27,95 8

3,5
6
4
2
0
C
ICK PGA 11 x 11 x 12 0 1 2 3 4 5 6
WLF ... 24 x 27 v [m/s]

art. no. Rth 14

[K/W] 12

16,51
10
D

5
31,34 34,5 8
6
4
2
0
ICK PGA 14 x 14
WLF ... 31 x 34
0 1 2 3 4 5 6
v [m/s]
E
art. no.
Rth 12
[K/W] 10
10

8
35 35
F
2,5

6
4
2
0
0 1 2 3 4 5 6
ICK PGA 14 x 14 x 10 v [m/s]
WLF ... 35 x 35
art. no. G
Rth 12
[K/W] 10
14

8
35 35 6
2,5

4
2
H
0
ICK PGA 14 x 14 x 14 0 1 2 3 4 5 6
v [m/s]
WLF ... 35 x 35
art. no. Rth 14
I
12,3

[K/W] 12
10
36 36
3,5

8
6
4
2
0
K
ICK PGA 14 x 14 x 12 0 1 2 3 4 5 6
WLF ... 36 x 36 v [m/s]

art. no. Rth 14

[K/W] 12
16,51

38,1
10
8
L
37,92
3,5

6
4
2
0
ICK PGA 15 x 15 0 1 2 3 4 5 6
WLF ... 37 x 37 v [m/s]
M

Mounts E 44 48 Pin heatsinks for IC B 21 27

Heatsinks for PLCC B 52 SMD-heatsinks B 53 54
Thermal conductive paste E 21 24 Heatsinks for PGA B 11 16 B 12 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Heatsinks for PGA
art. no. Rth 14
[K/W] 12
B

8
10
40 40
8

3,5
6
4
2

C ICK PGA 16 x 16 x 8 0
0 1 2 3 4 5 6
WLF ... 40 x 40 v [m/s]

art. no.
Rth 12
[K/W] 10

10
D 40 40
8
6

2,5
4
2
0
ICK PGA 16 x 16 x 10 0 1 2 3 4 5 6
v [m/s]
E WLF ... 40 x 40
art. no. Rth 14
[K/W] 12
10
40 40 8
3,5
12,3 6
F 4
2
0
ICK PGA 16 x 16 x 12 0 1 2 3 4 5 6
WLF ... 40 x 40 v [m/s]

G art. no. Rth 14

[K/W] 12
16,51

10
43,1 43,1 8
4

6
4
H 2
0
ICK PGA 17 x 17 0 1 2 3 4 5 6
WLF ... 43 x 43 v [m/s]

art. no. Rth 14

[K/W] 12
I
8

10
43,1 43,1
8
3

6
4
2

K ICK PGA 17 x 17 x 8
0
0 1 2 3 4 5 6
WLF ... 43 x 43 v [m/s]

art. no. Rth 14

[K/W] 12
10

L 43,6 43,6 8
12,3
3,5

6
4
2
0
ICK PGA 17 x 17 x 12 0 1 2 3 4 5 6

M WLF ... 43 x 43 v [m/s]

Mounts E 44 48 Pin heatsinks for IC B 21 27

Heatsinks for PLCC B 52 SMD-heatsinks B 53 54
N B 13 Thermal conductive paste E 21 24 Heatsinks for PGA B 11 16
Thermal conductive glue E 23 24 Technical introduction A28
 A
Heatsinks for PGA
art. no. Rth 14
[K/W] 12

16,51
10 B
45,7 45,7 8

4
6
4
2

ICK PGA 18 x 18
0
0 1 2 3 4 5 6 C
WLF ... 45 x 45 v [m/s]

art. no. Rth 14

[K/W] 12

16,51
10
48,3 48,3 8 D
6

4
4
2
0
ICK PGA 19 x 19 0 1 2 3 4 5 6
WLF ... 48 x 48 v [m/s]
E
art. no. Rth 14
[K/W] 12
10
47,3 47,3 8
12,3
3,5

6
4
F
2
0
ICK PGA 19 x 19 x 12 0 1 2 3 4 5 6
WLF ... 47 x 47 v [m/s]

art. no. Rth 14 G

[K/W] 12
10

50 10
50
8
2,5

6
4
2 H
0
ICK PGA 20 x 20 x 10 0 1 2 3 4 5 6
WLF ... 48 x 48 v [m/s]

art. no. Rth 14

16,51

[K/W] 12
10
I
50,8 50,8
8
4

6
4
2

ICK PGA 20 x 20
0
0 1 2 3 4 5 6
K
WLF ... 50 x 50 v [m/s]

Mounts E 44 48 Pin heatsinks for IC B 21 27

Heatsinks for PLCC B 52 SMD-heatsinks B 53 54
Thermal conductive paste E 21 24 Heatsinks for PGA B 11 16 B 14 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Heatsinks for PGA
art. no.

16,51
B Rth 14
50,8 50,8 [K/W] 12

4
10
8
6
4
C 2
0
0 1 2 3 4 5 6

ICK PGA 20 x 20 K v [m/s]

WLF ... 50 x 50 with fixing clamp for socket 7 and socket 370
D art. no.
Rth 14

8
50,8 50,8 [K/W] 12

3
10
8

E 6
4
2
ICK PGA 20 x 20 x 8 0
0 1 2 3 4 5 6
WLF ... 50 x 50 v [m/s]

F art. no.
Rth 14
51 51 [K/W] 12
10
12,3
3,5

G 6
4
2
0
ICK PGA 20 x 20 x 12 0 1 2 3 4 5 6
WLF ... 50 x 50 v [m/s]

H art. no.
Rth 14
16,5

[K/W] 12
53,3 53,3 10
5

8
6
I 4
2
0
ICK PGA 21 x 21 0 1 2 3 4 5 6
WLF ... 53 x 53 v [m/s]

K art. no.
Rth 14
20

[K/W] 12
54 54 10
4

8
6
L 4
2
0
ICK PGA 22 x 22 0 1 2 3 4 5 6
WLF ... 54 x 54 v [m/s]

Mounts E 44 48 Pin heatsinks for IC B 21 27

Heatsinks for PLCC B 52 SMD-heatsinks B 53 54
N B 15 Thermal conductive paste E 21 24 Heatsinks for PGA B 11 16
Thermal conductive glue E 23 24 Technical introduction A28
 A
Heatsinks for PGA
art. no.

20
Rth 14
[K/W] 12
B
62,5 62,5
10

3,5
8
6
4
2 C
0
0 1 2 3 4 5 6
ICK PGA 25 x 25
v [m/s]
WLF ... 62 x 62

Mounts E 44 48 Pin heatsinks for IC B 21 27

Heatsinks for PLCC B 52 SMD-heatsinks B 53 54
Thermal conductive paste E 21 24 Heatsinks for PGA B 11 16 B 16 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Heatsinks for BGAs

C
particularly suited for Ball Grid Arrays
heatsink dimensions match the respective BGA-type
can be glued directly on the BGA component
double-sided adhesive thermal conductive foil WLF ... E 7
D surface: black anodised
art. no. Rth 35
[K/W] 30
25

6
20
E 10 10 15

1,8
10
5
0
ICK BGA 10 x 10 0 1 2 3 4 5 6
WLF ... 10 x 10 v [m/s]
F art. no. Rth 30
[K/W]
24
10

18
10 10
12
1,8

G 6

0
ICK BGA 10 x 10 x 10 0 1 2 3 4 5 6
WLF ... 10 x 10 v [m/s]
art. no. Rth 35

H [K/W] 30
25
6

20
14 14
15
1,8

10
5
I 0
ICK BGA 14 x 14 0 1 2 3 4 5 6
WLF ... 14 x 14 v [m/s]

art. no. Rth 30

[K/W]
24
K
10

18

14 14 12
1,8

0
ICK BGA 14 x 14 x 10
L WLF ... 14 x 14
0 1 2 3 4 5
v [m/s]
6

Mounts E 44 48 Thermal conductive glue E 23 24

SMD-heatsinks B 53 55 Hole pattern A 21
N B 17 Thermally conductive foil E 5 15 Processor overview B 2 10
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for BGAs
art. no. Rth 25
[K/W]
20
B

6
15
21 21

1,8
10

0
ICK BGA 21 x 21
WLF ... 21 x 21
0 1 2 3 4 5 6 C
v [m/s]
art. no. Rth 25
[K/W]
20

6
15
23 23
D

1,8
10

0
ICK BGA 23 x 23 0 1 2 3 4 5 6
WLF ... 23 x 23 v [m/s]
art. no. Rth 24 E
[K/W]

10
18

23 23 12
1,8

6
F
0
ICK BGA 23 x 23 x 10 0 1 2 3 4 5 6
WLF ... 23 x 23 v [m/s]
art. no. Rth 25
[K/W]
20 G
6

27 27 15
1,8

10

ICK BGA 27 x 27
0
0 1 2 3 4 5 6
H
WLF ... 27 x 27 v [m/s]

art. no. Rth 20

[K/W]
10

16

27 27
12 I
1,8

0
ICK BGA 27 x 27 x 10 0 1 2 3 4 5 6

WLF ... 27 x 27 v [m/s] K

art. no. Rth 14
[K/W] 12
14

10
27 27 8
L
2,5

6
4
2
0
ICK BGA 27 x 27 x 14 0 1 2 3 4 5 6
WLF ... 27 x 27 v [m/s]
M

Mounts E 44 48 Thermal conductive glue E 23 24

SMD-heatsinks B 53 55 Hole pattern A 21
Thermally conductive foil E 5 15 Processor overview B 2 10 B 18 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Heatsinks for BGAs
art. no.
Rth 14
B

22
[K/W] 12
10

27 27 8
6

3,5
4

C 2
0
ICK BGA 27 x 27 x 22 0 1 2 3 4 5 6
WLF ... 27 x 27 v [m/s]

art. no. Rth 20

[K/W]
16

6
D 31 31 12

1,8
8

0
E ICK BGA 31 x 31 0 1 2 3 4 5 6
WLF ... 31 x 31 v [m/s]

art. no. Rth 20

[K/W]

10
16

12
F 31 31 1,8
8

0
0 1 2 3 4 5 6
ICK BGA 31 x 31 x 10
G WLF ... 31 x 31 v [m/s]

art. no. Rth 20

[K/W]
6

16
35 35 12
1,8

H 8

0
ICK BGA 35 x 35 0 1 2 3 4 5 6
WLF ... 35 x 35 v [m/s]
I art. no. Rth 20
[K/W]
10

16

35 35 12
1,8

K 4

0
ICK BGA 35 x 35 x 10 0 1 2 3 4 5 6
WLF ... 35 x 35 v [m/s]

art. no. Rth 20

[K/W]
L 16
6

37 37 12
1,8

M ICK BGA 37 x 37 x 6
0
0 1 2 3 4 5 6
WLF ... 37 x 37 v [m/s]

Mounts E 44 48 Thermal conductive glue E 23 24

SMD-heatsinks B 53 55 Hole pattern A 21
N B 19 Thermally conductive foil E 5 15 Processor overview B 2 10
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for BGAs
art. no. Rth 14

10
[K/W] 12
10
B
37 37

1,8
8
6
4
2

ICK BGA 37 x 37 x 10
0
0 1 2 3 4 5 6
C
v [m/s]
WLF ... 37 x 37
art. no. Rth 20

6
[K/W]
16
40 40
D

1,8
12

0
ICK BGA 40 x 40 0 1 2 3 4 5 6
WLF ... 40 x 40 v [m/s]
E
art. no. Rth 20
[K/W]

10
16
40 40
12
1,8

8 F
4

0
ICK BGA 40 x 40 x 10 0 1 2 3 4 5 6
v [m/s]
WLF ... 40 x 40
G
art. no. Rth 15
6

[K/W]
12
42,5 45
1,8

6
H
3

0
ICK BGA 42,5 x 45 0 1 2 3 4 5 6

WLF ... 42,5 x 45 v [m/s]

Mounts E 44 48 Thermal conductive glue E 23 24

SMD-heatsinks B 53 55 Hole pattern A 21
Thermally conductive foil E 5 15 Processor overview B 2 10 B 20 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Pin heatsinks

arrangement and number of pins for optimum air flow

suitable for forced and free convection
E excellent thermal conductivity by the alloy material (Al99,5; 220 W/mK) and homogeneous arrangement of materials
constant heat dissipation in the base and the pins in the direction of heat flow
low weight achieved by optimised geometry
components fastened using glue, adhesive foil or clamps
customer-specific modifications and special designs
other pin-lengths and surfaces on request
F surface: Al-natural
art. no. Rth 30
[K/W] 25
6,5

20
2

G 10 10 15
10
5
ICK S 10 x 10 x 6,5
WLF ... 10 x 10 0 1 2 3 4 5
weight: 1g v [m/s]
H art. no.
Rth 30
[K/W] 25
10

20
2

10 10 15

I 10
5
ICK S 10 x 10 x 10
WLF ... 10 x 10
0 1 2 3 4 5
weight: 1g v [m/s]
art. no. 30
Rth
K [K/W] 25
12,5

20
2

10 10 15
10

L ICK S 10 x 10 x 12,5 5

WLF ... 10 x 10
0 1 2 3 4 5
weight: 1.3g v [m/s]

Processor overview B 2 10 Thermal conductive paste E 21 22

Mounts E 44 48 Thermal conductive glue E 23 24
N B 21 SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 48
Thermally conductive foil E 5 15 Technical introduction A28
 A
Pin heatsinks
art. no. 30
Rth
[K/W] 25
B

18,5
20
15

2
10 10 10
5
ICK S 10 x 10 x 18,5
WLF ... 10 x 10 C
0 1 2 3 4 5
weight: 1.3g v [m/s]
art. no.
Rth 12
[K/W] 10

6,5
14 14
8
6
D

2
4
2
ICK S 14 x 14 x 6,5 0
WLF ... 14 x 14 0 1 2 3 4 5
weight: 1.5g v [m/s] E
art. no.
Rth 12
[K/W] 10
10

8
14 14
6
2

4 F
2
ICK S 14 x 14 x 10 0
WLF ... 14 x 14 0 1 2 3 4 5
weight: 1.9g v [m/s]
art. no. G
Rth 12
12,5

[K/W] 10
8
14 14
6
2

ICK S 14 x 14 x 12,5
2 H
0
WLF ... 14 x 14 0 1 2 3 4 5
weight: 2g v [m/s]
art. no.
Rth 12
I
18,5

[K/W] 10
8

14 14 6
2

4
2
ICK S 14 x 14 x 18,5 0
WLF ... 14 x 14 0 1 2 3 4 5 K
weight: 2.4g v [m/s]
art. no.
Rth 12
3,5
15

[K/W] 10
8 L
17,3 17,3 6
4
2
ICK S 17 x 17 x 15
0
WLF ... 17 x 17 0 1 2 3 4 5
weight: 4.7g v [m/s] M

Processor overview B 2 10 Thermal conductive paste E 21 22

Mounts E 44 48 Thermal conductive glue E 23 24
SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 48 B 22 N
Thermally conductive foil E 5 15 Technical introduction A28
A
Pin heatsinks
art. no.
Rth 12

B [K/W] 10

3,5
20
8
6
17,3 17,3 4
2
ICK S 17 x 17 x 20 0
C WLF ... 17 x 17 0 1 2 3 4 5
weight: 5.6g v [m/s]

art. no.
Rth 12
[K/W] 10

6,5
D 18 18
8
6

2
4
2
ICK S 18 x 18 x 6,5 0
WLF ... 18 x 18 0 1 2 3 4 5
E weight: 2.5g v [m/s]

art. no.
Rth 12
[K/W] 10

10
8
18 18 6
F
2

4
2
ICK S 18 x 18 x 10
0
WLF ... 18 x 18 0 1 2 3 4 5
weight: 3.1g v [m/s]

G art. no.
Rth 12
[K/W] 10
10

8
22 22 6
2

4
H ICK S 22 x 22 x 10
2
0
WLF ... 22 x 22 0 1 2 3 4 5
weight: 4g v [m/s]

art. no. 6
Rth 5
I
18,5

[K/W]
4

22 22 3
2

2
1
ICK S 22 x 22 x 18,5
K WLF ... 22 x 22 0 1 2 3 4 5
weight: 5.4g v [m/s]

art. no. 6
Rth
[K/W]
6,5

5
4
L 25 25
2

3
2
1
ICK S 25 x 25 x 6,5
WLF ... 25 x 25
0 1 2 3 4 5
M weight: 4g v [m/s]

Processor overview B 2 10 Thermal conductive paste E 21 22

Mounts E 44 48 Thermal conductive glue E 23 24
N B 23 SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 48
Thermally conductive foil E 5 15 Technical introduction A28
 A
Pin heatsinks
art. no. 6
Rth

12,5
[K/W] 5
4
25 25

2
3
2

ICK S 25 x 25 x 12,5 1

WLF ... 25 x 25 C
0 1 2 3 4 5
weight: 6g v [m/s]
art. no. 6
Rth
[K/W] 5

18,5
4
3
D
25 25

2
2
1
ICK S 25 x 25 x 18,5
WLF ... 25 x 25
0 1 2 3 4 5
weight: 7g v [m/s] E
art. no. 6
Rth
[K/W] 5
10
4
29 29
3,5

3
2
F
1
ICK S 29 x 29 x 10
WLF ... 29 x 29
0 1 2 3 4 5
weight: 11g v [m/s]
art. no. 6 G
Rth
[K/W] 5
20

29 29 3
3,5

ICK S 29 x 29 x 20 1 H
WLF ... 29 x 29
0 1 2 3 4 5
weight: 15g v [m/s]
art. no. 6
Rth
[K/W]
I
30

5
4

29 29 3
3,5

2
1
ICK S 29 x 29 x 30
WLF ... 29 x 29
0 1 2 3 4 5
K
weight: 15.4g v [m/s]
art. no. 6
Rth
[K/W]
10

5
4
32,7 32,7
L
3,5

3
2
1
ICK S 32 x 32 x 10
WLF ... 32 x 32
0 1 2 3 4 5
weight: 14g v [m/s] M

Processor overview B 2 10 Thermal conductive paste E 21 22

Mounts E 44 48 Thermal conductive glue E 23 24
SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 48 B 24 N
Thermally conductive foil E 5 15 Technical introduction A28
A
Pin heatsinks
art. no. Rth 6

B [K/W] 5

20
4

32,7 32,7 3

3,5
2
1
ICK S 32 x 32 x 20
C WLF ... 32 x 32
0 1 2 3 4 5
weight: 19g v [m/s]
art. no. 6
Rth

10
[K/W] 5

D 36,4 36,4 4

3,5
3
2
1
ICK S 36 x 36 x 10
WLF ... 36 x 36
0 1 2 3 4 5
E weight: 17g v [m/s]
art. no. 6
Rth
[K/W] 5

15
4
36,4 36,4 3,5
3
F 2
1
ICK S 36 x 36 x 15
WLF ... 36 x 36
0 1 2 3 4 5
weight: 20g v [m/s]

G art. no. 6
Rth
[K/W] 5
20

4
36,4 36,4 3
3,5

2
H ICK S 36 x 36 x 20 1

WLF ... 36 x 36
0 1 2 3 4 5
weight: 24g v [m/s]
art. no. 6
Rth

I
30

[K/W] 5
4
36,4 36,4 3
3,5

ICK S 36 x 36 x 30 1

K WLF ... 36 x 36
0 1 2 3 4 5
weight: 24.4g v [m/s]
art. no. 6
Rth
10

[K/W] 5
40 40 4
L
3,5

3
2
1
ICK S 40 x 40 x 10
WLF ... 40 x 40
0 1 2 3 4 5
M weight: 21g v [m/s]

Processor overview B 2 10 Thermal conductive paste E 21 22

Mounts E 44 48 Thermal conductive glue E 23 24
N B 25 SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 48
Thermally conductive foil E 5 15 Technical introduction A28
 A
Pin heatsinks
art. no. 6
Rth
[K/W] 5 B

20
4
40 40 3

3,5
2

ICK S 40 x 40 x 20 1

WLF ... 40 x 40 C
0 1 2 3 4 5
weight: 29g v [m/s]
art. no. 6
Rth
[K/W]

25
5

40 40
4
3
D

3,5
2
1
ICK S 40 x 40 x 25
WLF ... 40 x 40
0 1 2 3 4 5
weight: 37g v [m/s] E
art. no. 6
Rth
[K/W]
10
5
45 45 4
3,5

3
2
F
1
ICK S 45 x 45 x 10
WLF ... 45 x 45
0 1 2 3 4 5
weight: 26g v [m/s]
art. no. 6 G
Rth
[K/W] 5
20

4
45 45
3
3,5

ICK S 45 x 45 x 20 1 H
WLF ... 45 x 45
0 1 2 3 4 5
weight: 36g v [m/s]
art. no. 6
Rth
[K/W] 5 I
20

4
50 50
3,5

3
2
1
ICK S 50 x 50 x 20
WLF ... 50 x 50
0 1 2 3 4 5
K
weight: 43g v [m/s]
art. no.
Rth 6
[K/W]
25

50 50
4
3
L
3,5

ICK S 50 x 50 x 25 1

WLF ... 50 x 50
0 1 2 3 4 5
weight: 49g v [m/s] M

Processor overview B 2 10 Thermal conductive paste E 21 22

Mounts E 44 48 Thermal conductive glue E 23 24
SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 48 B 26 N
Thermally conductive foil E 5 15 Technical introduction A28
A
Pin heatsinks
art. no. Rth 6
[K/W] 5
B

40
4
50 50 3

3,5
2
1
ICK S 50 x 50 x 40
C WLF ... 50 x 50 0 1 2 3 4 5
weight: 80.05g v [m/s]
art. no.
Rth 6

50
[K/W] 5

D 50 50
4
3

3,5
2
1
ICK S 50 x 50 x 50
WLF ... 50 x 50
0 1 2 3 4 5
E weight: 95.51g v [m/s]
art. no.
Rth 6
[K/W] 5

30
4
98 98
F 5 3
2
1
0
0 1 2 3 4 5
ICK S 98 x 98 x 30
v [m/s]
WLF ... 98 x 98
G weight: nullg
art. no.
Rth 6
45

[K/W] 5
4
H 98 98 3
5

2
1
0
0 1 2 3 4 5
ICK S 98 x 98 x 45
v [m/s]
WLF ... 98 x 98
I weight: 301.3g

Processor overview B 2 10 Thermal conductive paste E 21 22

Mounts E 44 48 Thermal conductive glue E 23 24
N B 27 SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 48
Thermally conductive foil E 5 15 Technical introduction A28
 A
Pin heatsinks
Dome
art. no.
Rth 12
B
[K/W] 10

7,5
8
12 12 6

2,5
4

ICK S D 12 x 12 x 7,5
2 C
0
WLF ... 12 x 12 0 1 2 3 4 5
weight: 1.8g v [m/s]
art. no.
Rth 12
[K/W] 10 D

7,5
8
18
12 6

2,5
4
2
ICK S D 18 x 12 x 7,5 0
WLF ... 12 x 18 0 1 2 3 4 5 E
weight: 2.7g v [m/s]

art. no. Rth 12

7,5

[K/W] 10
8
18 24
F
2,5

6
4
2
0
ICK S D 24 x 18 x 7,5 0 1 2 3 4 5
WLF ... 18 x 24 v [m/s]
weight: 4.4g G
art. no.
Rth 12

98 98 [K/W] 10
10
5

8
6
4 H
2
0
0 1 2 3 4 5
ICK S D 98 x 98 x 10 v [m/s]
WLF ... 98 x 98
weight: 154g I

Processor overview B 2 10 Thermal conductive paste E 21 22

Mounts E 44 48 Thermal conductive glue E 23 24
SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 48 B 28 N
Thermally conductive foil E 5 15 Technical introduction A28
A
Pin heatsinks
Round
B art. no. Rth 6
[K/W] 5
28,5 4

2
6,5
3
2
ICK S R 28,5 x 6,5 1
C WLF ... D 28,5 0
0 1 2 3 4 5 v [m/s]
weight: 4.41g
art. no. Rth 6

10
[K/W] 5

D 28,5 4

2
3
2

ICK S R 28,5 x 10 1

WLF ... D 28,5 0

0 1 2 3 4 5 v [m/s]
weight: 5.16g
E
art. no.
Rth 6
[K/W] 5
28,5 4
2
12,5
3
F 2
ICK S R 28,5 x 12,5 1
WLF ... D 28,5 0
0 1 2 3 4 5 v [m/s]
weight: 5.7g
art. no.
G Rth 6
18,5

[K/W] 5
4
28,5
2

3
2
1
ICK S R 28,5 x 18,5
H WLF ... D 28,5
0
0 1 2 3 4 5 v [m/s]
weight: 6.98g
art. no.
Rth 6
I
10

[K/W] 5
32,5 4
3

3
2
ICK S R 32,5 x 10 1
WLF ... D 32 0
K weight: 9.7g 0 1 2 3 4 5 v [m/s]

art. no.
Rth 6
[K/W] 5
20

4
L 32,5 3
3

2
1
ICK S R 32,5 x 20 0
WLF ... D 32 0 1 2 3 4 5 v [m/s]

M weight: 13.8g

Thermal conductive glue E 23 24 Mounting material for semiconduct. E 44 48

Thermal conductive paste E 21 22 Thermally conductive foil E 5 15
N B 29 SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 51
Processor overview B28 Technical introduction A28
 A
Pin heatsinks
art. no.
Rth
[K/W]
6
5
B

30
4
3
32,5
2

3,5
1
ICK S R 32,5 x 30 0 C
WLF ... D 32 0 1 2 3 4 5 v [m/s]

weight: 20.6g
art. no.
Rth 6
D

40
[K/W] 5
4
3
32,5
2

3,5
1
ICK S R 32,5 x 40 0
WLF ... D 32 0 1 2 3 4 5 v [m/s] E
weight: 24.61g
art. no.
Rth 6
[K/W] 5
F
50

4
3
2
32,5
1
3,5

ICK S R 32,5 x 50 0
WLF ... D 32 0 1 2 3 4 5 v [m/s] G
weight: 28.62g
art. no.
Rth 7
[K/W] 6
20

5
36,5 4
H
3,5

ICK S R 36,5 x 20 2

WLF ... D 36,5 1

0 1 2 3 4 5 v [m/s]
weight: 17.59g
art. no. I
Rth 12
10

[K/W] 10
40 8
3,5

ICK S R 40 x 10
4
2
K
WLF ... D 40 0
0 1 2 3 4 5 v [m/s]
weight: 15.85g
art. no. Rth 12

L
20

[K/W] 10

40 8
3,5

6
4
ICK S R 40 x 20
2
WLF ... D 40
0
weight: 21.96g 0 1 2 3 4 5 v [m/s] M

Thermal conductive glue E 23 24 Mounting material for semiconduct. E 44 48

Thermal conductive paste E 21 22 Thermally conductive foil E 5 15
SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 51 B 30 N
Processor overview B28 Technical introduction A28
A
Pin heatsinks
art. no. Rth 12

20
B [K/W] 10
8
40

3,5
6
4
ICK S R A 40 x 20 2
WLF ... D 40 0
C weight: 22.18g 0 1 2 3 4 5 v [m/s]
art. no. Rth 12

30
[K/W] 10
8
40
6

3,5
4
D ICK S R 40 x 30
2
WLF ... D 40
0
weight: 29.24g 0 1 2 3 4 5 v [m/s]
art. no.

50
Rth 12
[K/W] 10
8
40
3,5 6
4
ICK S R 40 x 50
F WLF ... D 40
2
0
weight: 47.96g 0 1 2 3 4 5 v [m/s]
art. no. Rth 12
30

[K/W] 10
8
45
G 6
3,5

4
ICK S R 45 x 30
2
WLF ... D 45
0
weight: 37.78g 0 1 2 3 4 5 v [m/s]
Rth 8
art. no.
H [K/W] 7
45

6
5
4
45
3,5

3
2
I ICK S R 45 x 45
1
WLF ... D 45
0
weight: 50.67g 0 1 2 3 4 5 v [m/s]

art. no. Rth 6

10

[K/W] 5
50
K 4
3

3
2
ICK S R 50 x 10
1
WLF ... D 50
0
weight: 22g 0 1 2 3 4 5 v [m/s]

Thermal conductive glue E 23 24 Mounting material for semiconduct. E 44 48

Thermal conductive paste E 21 22 Thermally conductive foil E 5 15
N B 31 SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 51
Processor overview B28 Technical introduction A28
 A
Pin heatsinks
art. no. Rth 9
[K/W] 8
B

20
6

50 5

3,5
4
3
ICK S R 50 x 20 2
WLF ... D 50
weight: 34.39g
1
0
C
0 1 2 3 4 5 v [m/s]
art. no. Rth 9
[K/W] 8

30
6

50
5
D

3,5
4
3
2
ICK S R 50 x 30
1
WLF ... D 50
0
weight: 45.28g 0 1 2 3 4 5 v [m/s]

art. no.
E
Rth 8
[K/W] 7
45 6
5
50 4
F
3,5

ICK S R 50 x 45 2
1
WLF ... D 50
0
weight: 61.59g 0 1 2 3 4 5 v [m/s]
art. no. Rth
[K/W]
8
7
G
20

6
5
54
3,5

4
3

ICK S R 54 x 20 2 H
1
WLF ... D 54
0
weight: 40.94g 0 1 2 3 4 5 v [m/s]
art. no. Rth 8
[K/W] 7
30

6 I
54 5
3,5

4
3
ICK S R 54 x 30 2

WLF ... D 54 1

weight: 54.11g 0
0 1 2 3 4 5 v [m/s]
K

Thermal conductive glue E 23 24 Mounting material for semiconduct. E 44 48

Thermal conductive paste E 21 22 Thermally conductive foil E 5 15
SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 51 B 32 N
Processor overview B28 Technical introduction A28
A
Pin heatsinks
art. no.

45
Rth 6
[K/W] 5
54 4

3,5
3
C 2
1
ICK S R 54 x 45
0
WLF ... D 54 0 1 2 3 4 5 v [m/s]
weight: 73.86g
art. no.
D

30
Rth 6
[K/W] 5
70

5
4
3

E ICK S R 70 x 30
2
1
WLF ... D 70 0
weight: 92.8g 0 1 2 3 4 5 v [m/s]

art. no.

F 50

Rth 6
[K/W] 5
70
5

4
3

G ICK S R 70 x 50
2
1
WLF ... D 70 0
weight: 135.56g 0 1 2 3 4 5 v [m/s]

art. no.
H
30

Rth 6
85
[K/W] 5
5

4
3

I ICK S R 85 x 30
2
1
WLF ... D 85 0
weight: nullg 0 1 2 3 4 5 v [m/s]

art. no.

K
45

85 Rth 6
[K/W] 5
5

4
3
L ICK S R 85 x 45
2
1
WLF ... D 85 0
weight: nullg 0 1 2 3 4 5 v [m/s]

Thermal conductive glue E 23 24 Mounting material for semiconduct. E 44 48

Thermal conductive paste E 21 22 Thermally conductive foil E 5 15
N B 33 SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 51
Processor overview B28 Technical introduction A28
 A
Pin heatsinks
art. no.

30
Rth 6
98
[K/W] 5

5
4
3

ICK S R 98 x 30
2
1
C
WLF ... D 98 0
weight: nullg 0 1 2 3 4 5 v [m/s]

art. no.

50
Rth 6
98
[K/W] 5

5
4
3

ICK S R 98 x 50
2 E
1
WLF ... D 98 0
weight: 194.23g 0 1 2 3 4 5 v [m/s]

Thermal conductive glue E 23 24 Mounting material for semiconduct. E 44 48

Thermal conductive paste E 21 22 Thermally conductive foil E 5 15
SMD-heatsinks B 53 55 Heatsinks for LEDs B 35 51 B 34 N
Processor overview B28 Technical introduction A28
A
Heatsinks for LEDs

suitable for free or forced convection

heat sink dimensions are fitted to the respective LED typ
D simple mounting by using thermally conductive adhesive foil, glue or screw mounting
specific versions on customers request
double-sided adhesive thermal conductive foil WLF ... E 7
special design, surfaces and modification to customer specification on request
surface: black anodised
E art. no.

14
23,5 Rth = 18,58 K/W
2,5

F
ICK LED R 23,5 x 14
WLF ... D 23
art. no. Rth 20
[K/W] 16
14

G 23,5
12
8
2,5

4
ICK LED R 23,5 x 14 G 0
0 1 2 3 4 5 6
WLF ... D 23 v [m/s]
art. no.
H
10

27 Rth = 17,69 K/W

3

ICK LED R 27 x 10
WLF ... D 27
I art. no. Rth 20
[K/W] 16
10

12
27 8
3

K ICK LED R 27 x 10 G
WLF ... D 27
0
0 1 2 3 4 5 6
v [m/s]
art. no.

Rth = 15,24 K/W

L 27,95
15,24
3,5

ICK LED R 28 x 15
WLF ... D 28

Pin heatsinks B 29 33 Thermal conductive glue E 23 24

Mounts E 44 48 Hole pattern A 21
N B 35 Thermally conductive foil E 5 15 Heatsink profile-overview A 13 17
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for LEDs
art. no. Rth 20
[K/W] 16
12 B
27,95 8

3,5
15,24
4
0
ICK LED R 28 x 15 G 0 1 2 3 4 5 6
WLF ... D 28 v [m/s]

art. no. C
29 Rth = 17,26 K/W

11,5
3,5
ICK LED R 29 x 11,5
WLF ... D 29 D
art. no. Rth 20
[K/W] 16
12
29
8

3,5
11,5
4 E
0
ICK LED R 29 x 11,5 G 0 1 2 3 4 5 6
WLF ... D 29 v [m/s]

art. no.
F
14

32 Rth = 15,23 K/W

2,5

ICK LED R 32 x 14
WLF ... D 32
G
art. no. Rth 20
[K/W] 16
14

12
32
8
2,5

4
0
H
ICK LED R 32 x 14 G 0 1 2 3 4 5 6
WLF ... D 32 v [m/s]

art. no.
10

33
Rth = 17,6 K/W I
3

ICK LED R 33 x 10
WLF ... D 33
art. no. Rth 20 K
10

[K/W] 16
33 12
3

8
4
0
ICK LED R 33 x 10 G 0 1 2 3 4 5 6 L
WLF ... D 33 v [m/s]

Pin heatsinks B 29 33 Thermal conductive glue E 23 24

Mounts E 44 48 Hole pattern A 21
Thermally conductive foil E 5 15 Heatsink profile-overview A 13 17 B 36 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Heatsinks for LEDs
art. no.

16,5
B
33 Rth = 13,87 K/W

3,5
ICK LED R 33 x 16,5
C WLF ... D 33
art. no. Rth 20

16,5
[K/W] 16
12
33

3,5
8
D 4
0
ICK LED R 33 x 16,5 G 0 1 2 3 4 5 6
WLF ... D 33 v [m/s]

art. no.
E

10
35 Rth = 16,9 K/W

2,5
ICK LED R 35 x 10
WLF ... D 35
F
art. no. Rth 20
[K/W] 16
10

12
35
2,5

8
4
G 0
ICK LED R 35 x 10 G 0 1 2 3 4 5 6
v [m/s]
WLF ... D 35
art. no.
12,3

H 36 Rth = 12,88 K/W

3,5

ICK LED R 36 x 12
WLF ... D 36
art. no.
I Rth 20
12,3

[K/W] 16

36 12
3,5

8
4
0
K ICK LED R 36 x 12 G
0 1 2 3 4 5 6
v [m/s]
WLF ... D 36
art. no.
10

40
L Rth = 12,28 K/W
2,5

ICK LED R 40 x 10
WLF ... D 40

Pin heatsinks B 29 33 Thermal conductive glue E 23 24

Mounts E 44 48 Hole pattern A 21
N B 37 Thermally conductive foil E 5 15 Heatsink profile-overview A 13 17
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for LEDs
art. no.
Rth 20
B

10
[K/W] 16
40 12

2,5
8
4
0
ICK LED R 40 x 10 G 0 1 2 3 4 5 6
WLF ... D 40 v [m/s]
C
art. no.

27
40 Rth = 9,41 K/W
D

5
ICK LED R 40 x 27
WLF ... D 40
art. no.
Rth 12
E

27
[K/W] 10
8
40 6
5

4
2

ICK LED R 40 x 27 G
0
0 1 2 3 4 5 6
F
WLF ... D 40 v [m/s]

art. no.
16,51

45,7 Rth = 10,46 K/W G

4

ICK LED R 45,7 x 16,5

WLF ... D 45
H
art. no. Rth 12
[K/W] 10
16,51

8
45,7 6
4

4
2
I
0
0 1 2 3 4 5 6
ICK LED R 45,7 x 16,5 G v [m/s]
WLF ... D 45
art. no.
K
10

50
2,5

Rth = 10,57 K/W

ICK LED R 50 x 10 L
WLF ... D 50

Pin heatsinks B 29 33 Thermal conductive glue E 23 24

Mounts E 44 48 Hole pattern A 21
Thermally conductive foil E 5 15 Heatsink profile-overview A 13 17 B 38 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Heatsinks for LEDs
art. no. Rth 12

10
B 50
[K/W] 10
8

2,5
6
4
2
0
ICK LED R 50 x 10 G
C WLF ... D 50
0 1 2 3 4 5 6
v [m/s]

art. no.

16,51
50,8
D

4
Rth = 10,17 K/W

ICK LED R 50,8 x 16,5

WLF ... D 50
E art. no.

16,51
Rth 12
[K/W] 10
50,8 8

4
6
4
F 2
0
ICK LED R 50,8 x 16,5 G 0 1 2 3 4 5 6
v [m/s]
WLF ... D 50
art. no.
G
20

54
4

Rth = 9,48 K/W

H
ICK LED R 54 x 20
WLF ... D 54
art. no.
Rth 12
I
20

[K/W] 10
4

54 8
6
4
2

K ICK LED R 54 x 20 G
0
0 1 2 3 4 5 6
WLF ... D 54 v [m/s]

art. no.
40

L
10

66
Rth = 3,2 K/W

M ICK LED R 66 x 40
WLF ... D 66

Pin heatsinks B 29 33 Thermal conductive glue E 23 24

Mounts E 44 48 Hole pattern A 21
N B 39 Thermally conductive foil E 5 15 Heatsink profile-overview A 13 17
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for LEDs
art. no.

10
75 B

2,5
Rth = 5,2 K/W

ICK LED R 75 x 10 C
WLF ... D 75
art. no.

40
D

10
84

Rth = 2,5 K/W

E
ICK LED R 84 x 40
WLF ... D 84
art. no.

40
10
100

Rth = 2 K/W G

ICK LED R 100 x 40 H

WLF ... D 100
art. no.
40

160
I
10

Rth = 1,4 K/W

K
ICK LED R 160 x 40
WLF ... D 160

Pin heatsinks B 29 33 Thermal conductive glue E 23 24

Mounts E 44 48 Hole pattern A 21
Thermally conductive foil E 5 15 Heatsink profile-overview A 13 17 B 40 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Heatsinks for LEDs
art. no.

40
200

10
C Rth = 1 K/W

D
ICK LED R 200 x 40
WLF ... D 200

Pin heatsinks B 29 33 Thermal conductive glue E 23 24

Mounts E 44 48 Hole pattern A 21
N B 41 Thermally conductive foil E 5 15 Heatsink profile-overview A 13 17
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for LEDs
special design, surfaces and modification to customer specification on request
up from a profile length of 25 mm: optional adapter plate LA LED 68 ... B 50 suitable for LED modules:
Bridgelux Vero, Citizen CitiLED, Cree XLamp, Edison Edilex, GE Infusion, Luga Shop und Industrial, Lustrous Lustron, Megaman Teco, B
Osram PrevaLED und Soleriq, Philips Fortimo und Luxeon, Prolight Opto, Sharp Mega Zenigata, Toshiba E-Core, Tridonic Stark, Vexica
Lumaera, Vossloh Schwabe
art. no.
Rth [K/W]
7,5

13,6 6,0
C

12
4,5

3,0

1,5

SK 585 ... 20 50 100 150 200 [mm] D

art. no. Rth [K/W]
7,5

6,0

4,5
E
18
30

3,0

1,5

50 100 150 200 [mm]

SK 620 ...
art. no. Rth [K/W] F
5

4
25
45

1 G
6,75 50 100 150 200 [mm]
SK 618 ...
please indicate: ...
10 15 20 25 37.5 50 1000 mm
surface: black anodised
H
art. no. Rth [K/W]
5

4
30
46

3
I
2

50 100 150 200 [mm]

SK 619 ...
art. no. Rth [K/W] K
5

4
46

30

1 L
5,73 50 100 150 200 [mm]
SK 598 ...
please indicate: ... ... adapter (optional)
10 15 20 25 37.5 50 1000 mm AD = adapter plate
surface: black anodised
M

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
Special heatsink design A 137 138 Thermal conductive glue E 23 24 B 42 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Heatsinks for LEDs
art. no. Rth [K/W]
5
B 4

50

30
3

C SK 602 ... 6,5 50 100 150 200 [mm]

art. no. Rth [K/W]
2,5

2,0
50

30
1,5
D 1,0

0,5

SK 577 ... 6,76 50 100 150 200 [mm]

art. no.
Rth [K/W]
E 2,5

2,0
26
51

1,5

1,0

0,5
F
51,5
SK 46 ... 50 100 150 200 [mm]

art. no.
Rth [K/W]
2,5
G 2,0
60

30

1,5

1,0

0,5

H SK 578 ... 5,73 50 100 150 200 [mm]

art. no.
Rth [K/W]
2,5
60

2,0
40

I 1,5

1,0

0,5

8,1 50 100 150 200 [mm]

SK 569 ...
K please indicate: ... ... adapter (optional)
10 15 20 25 37.5 50 1000 mm AD = adapter plate
surface: black anodised

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
N B 43 Special heatsink design A 137 138 Thermal conductive glue E 23 24
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for LEDs
art. no.
Rth [K/W] B
2,5

2,0

50
70
1,5

1,0

0,5 C
50 100 150 200 [mm]
9,1
SK 570 ...
art. no.
Rth [K/W]
2,5
D
2,0
70

35
1,5

1,0

0,5 E
SK 571 ... 50 100 150 200 [mm]

art. no.

Rth [K/W] F
2,5
85

50

2,0

1,5

1,0

0,5
G
50 100 150 200 [mm]
SK 572 ...
please indicate: ... ... adapter (optional)
10 15 20 25 37.5 50 1000 mm AD = adapter plate H
surface: black anodised
art. no.

Rth [K/W] I
2,5

2,0
105

70

1,5

1,0

0,5 K
50 100 150 200 [mm]

SK 584 ...
L
please indicate: ...
10 15 20 25 37.5 50 1000 mm
surface: black anodised
M

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
Special heatsink design A 137 138 Thermal conductive glue E 23 24 B 44 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Heatsinks for LEDs
art. no.

B
Rth [K/W]
2,5

2,0
120

C 1,5

60
1,0

0,5

50 100 150 200 [mm]

D
SK 615 ...
art. no.

E
Rth [K/W]
2,5

2,0
120

1,5
65

F 1,0

0,5

50 100 150 200 [mm]

G
10
SK 599 ...
art. no.
H

Rth [K/W]
2,5

I 2,0
145

85

1,5

1,0

0,5

K 50 100 150 200 [mm]

SK 592 ...
please indicate: ...
10 15 20 25 37.5 50 75 100 150 1000 mm
L
surface: black anodised

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
N B 45 Special heatsink design A 137 138 Thermal conductive glue E 23 24
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for LEDs
art. no.

Rth [K/W]
2,5

2,0
C
178

80
1,5

1,0

0,5

50 100 150 200 [mm]

D

SK 590 ...
please indicate: ... E
10 15 20 25 37.5 50 75 100 150 1000 mm
surface: black anodised

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
Special heatsink design A 137 138 Thermal conductive glue E 23 24 B 46 N
Thermal conductive paste E 21 22 Technical introduction A28
A
LED fin cooler KTE R customised

individual LED heatsinks acc. to customers requests

E adaptable to all common LED modules and sizes
integration possibility of reflectors or fans by using special sheet metal design
entry core for heat dissipation made of copper upon request
other dimensions, sheet metal geometries, surfaces and mechanical machinings upon request
G
H
F KTE R
D

G C

A

H
F

possible dimensions:
dim. [mm]
I A B C D E F G H
B + 20 to 200 35 30 0.8 32 max. 400 max. 800 max. 200
40 35 1 36
55 50 1.5 50
80 75 2 72
K 90 85 84
100 95 92
E max. number of grooves at D = 0.8 mm

please indicate with your order:

L dim. [mm]
A B C D E F G H

please indicate: ... surface

SA = black anodised
ME = clear anodised
M material: aluminium

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
N B 47 Special heatsink design A 137 138 Processor overview B 2 10
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for LEDs
heatsink specially made for flexible and fixed LED Line Modules
insertion possibility of metal sheets and sheets of Plexiglas
customer specified designs, lengths and treatments upon request B
art. no. 24,8
20,8
18,4
16

2,2
R th [K/W ]

1,2
C
10
7

8,7
1,8
8

5
17

2
6

18
50 100 150 200 [mm] D
SK LED 1 36
art. no.

35
33 6
,2
,
R th [K/W ] E
32
30 , 2
,
26 8 8
,2
6
,6

,8
34,4

10

17

2 F
50 100 150 200 [mm]
30

53,9
SK LED 2
art. no. G
57,2
42,55
41,8
39,4 R th [K/W ]
37
5
H
1,2

4
9,4

19,2

3
15,5
12,2
2,2
1,8

5,6
2,3

2
40

50 100 150 200 [mm]

I
SK LED 3 39

please indicate: ... ... surface

50 75 100 150 1000 mm SA = black anodised
ME = clear anodised K

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
Special heatsink design A 137 138 Processor overview B 2 10 B 48 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Active heat dissipation of LEDs
40

10
31,4
30
3,5
C
40

art. no. Rth [K/W]

LA LED 40 x 30 1.4

D 40
10

3,5
22,4
20

E
50

art. no. Rth [K/W]

LA LED 50 x 20 1.25
F 40
10

G
46,4
45
3,5

H 50

art. no. Rth [K/W]

LA LED 50 x 45 0.9

Technical data of the fans

I
LF 40B12
circuit voltage 12 V
bearing type two-way plain bearing
cur. consumpt. 50 mA
K max. iuitial current 160 mA
max. volume flow 157 l/min - 9.4 m3/h
max. static pressure 3.4 mmH2O - 33 Pa
noise level 26 dB(A), 1 m lateral

L temperature range -20C... +60C

failure rate (L10) 60,000 h
MTBF 1,900,000 h (20C)
Type rotor speed 6,600 min-1
weight 10 g
M

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
N B 49 Special heatsink design A 137 138 Processor overview B 2 10
Thermal conductive paste E 21 22 Technical introduction A28
 A
Active heat dissipation of LEDs

active heat dissipation of LED modules

Zhaga compliant mounting possibility
integrated low noise fan D
optional adapter plate suitable for LED modules:
Bridgelux Vero, Citizen CitiLED, Cree XLamp, Edison Edilex, GE Infusion, Luga Shop und Industrial, Lustrous Lustron, Megaman Teco,
Osram PrevaLED und Soleriq, Philips Fortimo und Luxeon, Prolight Opto, Sharp Mega Zenigata, Toshiba E-Core, Tridonic Stark, Vexica
Lumaera, Vossloh Schwabe
art. no. M2x0,4 - 6H (3x) Rth [K/W]
68,5
2,5 E
2,0

1,5
35

1,0

0,5
F
LA LED 68 ... M3x0,5 - 6H (2x) 50 100 150 200 [mm]

please indicate: ... ... surface ... adapter (optional)

50 75 100 mm SA = black anodised AD = adapter plate
ME = clear anodised
G
Technical data of the fans

LF 40B12
circuit voltage 12 V
bearing type two-way plain bearing
cur. consumpt. 50 mA
H
max. iuitial current 160 mA
max. volume flow 157 l/min - 9.4 m3/h
max. static pressure 3.4 mmH2O - 33 Pa
noise level 26 dB(A), 1 m lateral I
temperature range -20C... +60C
failure rate (L10) 60,000 h
MTBF 1,900,000 h (20C)
Type rotor speed 6,600 min-1
weight 10 g K

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
Special heatsink design A 137 138 Processor overview B 2 10 B 50 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Sample box LED Heatsinks
Sample box for verification of the thermal management for LEDs
Contains a choice of different extruded heatsinks, LED extruded heatsinks in round design, LED pin heatsinks and extruded profiles for
B LED-Line modules
for thermal contacting or mounting of LED a high-performance thermal conductive graphite foil is also enclosed (WLFG, sample strips
25x150mm), a high-performance thermal conductive (silicone-free) ceramic-filled thermal conductive paste (WLPK, syringe), a
double-sided sticky thermal conductive foil (WLFT 404, sample strips 25x150mm) and a thermal conductive epoxy based two-component
adhesive (WLK DK, syringe)

art. no.
SK LED BOX 1
G

Pin heatsinks B 29 33 Mounts E 44 48

Hole pattern A 21 Thermally conductive foil E 5 15
N B 51 Special heatsink design A 137 138 Processor overview B 2 10
Thermal conductive paste E 21 22 Technical introduction A28
 A
Heatsinks for DIL-IC and PLCC
Heatsinks for DIL-IC
other length on request
B

4,8
1
6,3

art. no. for cases [mm] Rth [K/W] art. no. for cases [mm] Rth [K/W]
ICK 6 8 L 6/8 contacts 8.5 83 ICK 20 L 20 contacts 25.0 34 C
ICK 14 16 L 14/16 contacts 19.0 46

4,8
1
19
D
art. no. for cases [mm] Rth [K/W] art. no. for cases [mm] Rth [K/W]
ICK 14 16 B 14/16 contacts 6.3 54.0 ICK 36 B 36 contacts 47.0 16.5
ICK 24 B 24 contacts 33.0 19.4 ICK 40 B 40 contacts 51.0 15.8
ICK 28 B 28 contacts 37.0 18.5 ICK 1000 B 1000.0
surface: black anodised
E
with clip
other length on request

F
16
14,8

G
1

2,45 7,1
12

art. no. for cases [mm] Rth [K/W] art. no. for cases [mm] Rth [K/W]
ICK 14 H 14 contacts 18.0 20 ICK 18 H 18 contacts 23.0 16
ICK 16 H 16 contacts 20.5 18 ICK 1000 H 1000.0
surface: black anodised
H
Heatsinks for PLCC
16

I
8,5

12

10
16

25

10

art. no. Rth [K/W]

K
ICK R 19
8
2,5

11,8 L
art. no. [mm] Rth [K/W]
ICK PLCC 28 11.8 25
surface: black anodised
M

Extruded heatsinks A 22 83 Thermally conductive foil E 5 15

Pin heatsinks for IC B 21 28 Thermal conductive paste E 21 22
Insulting clamping parts E 45 Hole pattern A 21 B 52 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Heatsinks for SMD

particularly suitable for SMD components

E low profile
reduced weight
effective heat dissipation
can be glued directly onto the component
solderable versions
customer specific versions on request
F special packaging like tape and real, bar magazin, tray etc. on request
1
4,8

6,3
G art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W]
ICK SMD A 5 ... 5 123 ICK SMD A 13 ... 13 63
ICK SMD A 8 ... 8 87 ICK SMD A 17 ... 17 51
ICK SMD A 10 ... 10 75 ICK SMD A 22 ... 22 34
H
1
4,8

19

art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W]
I
ICK SMD B 5 ... 5 56 ICK SMD B 13 SA 13 29
ICK SMD B 7 SA 7 47 ICK SMD B 19 ... 19 22
ICK SMD B 10 SA 10 35
30
2,8

K
7,5

17

art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W]
ICK SMD C 7 SA 7 33 ICK SMD C 17 ... 17 17
L
ICK SMD C 10 SA 10 26
please indicate: ... surface
SA = black anodised
MI = solderable surface

Extruded heatsinks A 22 83 Thermally conductive foil E 5 15

ICK S 10 x 10 x 6,5 B 21 28 Thermal conductive paste E 21 22
N B 53 Insulting clamping parts E 45 Hole pattern A 21
Thermal conductive glue E 23 24 Technical introduction A28
 A
Heatsinks for SMD

8
B B

3
art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W]
ICK SMD E 15 SA 15.3 27 ICK SMD E 29 SA 29.0 18
ICK SMD E 22 SA 22.3 21 C

6
2
8

art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W] D
ICK SMD F 8 ... 8 74 ICK SMD F 19 ... 19 37
ICK SMD F 10 ... 10 71 ICK SMD F 21 ... 21 33
ICK SMD F 17 SA 17 42 ICK SMD F 26 ... 26 26

E
6
1,8
10

art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W]
ICK SMD G 8 MI 8 73 ICK SMD G 17 SA 17 41
ICK SMD G 10 ... 10 70 ICK SMD G 19 SA 19 36
F
ICK SMD G 13 SA 13 61 ICK SMD G 21 ... 21 32
8

11,8 G
2,5

art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W]
ICK SMD H 8 ... 8 33.0 ICK SMD H 19 SA 19 23.0
ICK SMD H 10 ... 10 29.0 ICK SMD H 25 ... 25 20.0
ICK SMD H 17 ... 17 24.5 H
3,5

15,24

13,5
I
art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W]
ICK SMD K 8 ... 8 25.6 ICK SMD K 17 ... 17 19.4
ICK SMD K 10 SA 10 23.4 ICK SMD K 19 ... 19 18.0
ICK SMD K 13 ... 13 21.5 ICK SMD K 21 ... 21 16.5
K
6
1,8

14
art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W]
ICK SMD M 8 SA 8 72 ICK SMD M 19 SA 19 35
ICK SMD M 10 SA 10 66 ICK SMD M 21 SA 21 31
L
ICK SMD M 17 MI 17 40
please indicate: ... surface
SA = black anodised
MI = solderable surface
M

Extruded heatsinks A 22 83 Thermally conductive foil E 5 15

ICK S 10 x 10 x 6,5 B 21 28 Thermal conductive paste E 21 22
Insulting clamping parts E 45 Hole pattern A 21 B 54 N
Thermal conductive glue E 23 24 Technical introduction A28
A
heatsink for SMD

6
8

2
art. no. [mm] Rth [K/W] art. no. [mm] Rth [K/W]
ICK SMD N 8 ... 8 74 ICK SMD N 19 ... 19 37
ICK SMD N 10 ... 10 71 ICK SMD N 21 ... 21 33
C
ICK SMD N 17 ... 17 42 ICK SMD N 26 ... 26 26
please indicate: ... surface
SA = black anodised
MI = solderable surface

D Sample box SMD heatsinks

contains an assortment of SMD heatsinks with anodised and solderable surface as well as thermally conductive glue (WLK) and
double-sided adhesive thermal foil (WLF)

F art. no.
ICK SMD BOX 1

Extruded heatsinks A 22 83 Thermally conductive foil E 5 15

ICK S 10 x 10 x 6,5 B 21 28 Thermal conductive paste E 21 22
N B 55 Insulting clamping parts E 45 Hole pattern A 21
Thermal conductive glue E 23 24 Technical introduction A28
 A
Passive heatsinks for processors
4,2 R 6,5

1,3

12

51
48
5
51

48

art. no. Rth [K/W] suitable for processor type

C
ICK PPC 51 8.1 Power PC
4,2

8,5
Rth [K/W]
D
3,0

107
25 2,0

1,0
4,2

0
0 1 2 3 4 5 6 E
130 v [m/s]

art. no. Rth [K/W] suitable for processor type

ICK PEN 3 XE 2 Intel Pentium III-XeonTM Slot II Format
4,2

8,5
F
Rth [K/W]

3,0

107
25

2,0

1,0
G
4,2

0
0 1 2 3 4 5 6
130 v [m/s]

art. no. Rth [K/W] suitable for processor type

ICK PEN 3 XE 1 1.8 Intel Pentium III-XeonTM Slot II Format
H
Heatsink specially for Q7 "Embedded-Boards"
3

2,9

6,5 I
70
25

52

75
18
5

2,5

56,5 K
art. no. Rth [K/W] suitable for processor type
ICK EM 25 3.9 Q7 Board

Fan cooler for Intel PentiumIIIXeon B 60 Heatsinks for Q7 "Embedded-Boards" B 56

Fan cooler, universal B 58 Heatsinks for BGA B 17 20
Attachable heatsinks C 10 16 Heatsinks for PGA B 11 16 B 56 N
Thermal conductive material E 2 24 Technical introduction A28
A
Passive heatsinks for processors
customer specific versions and modifications on request
ICK PEN 38
B Rth [K/W]

4
3
2

1
C 0
0 1 2 3 4 5 6

B
C
v [m/s]
Rth [K/W] ICK PEN 45

D
3

2
D A 1

0
0 1 2 3 4 5 6
v [m/s]

art. no. Rth [K/W] suitable for processor type dim. [mm]
E A B C D
ICK PEN 38 F 4.0 AMD K6-III/ IDT W2A/ MMX/ IDT C6/ 49.5 49.5 38 5.0
Intel Pentium/ AMD K6-2
ICK PEN 38 W 4.0 AMD K6-III/ IDT W2A/ MMX/ IDT C6/ 49.5 49.5 38 5.0
Intel Pentium/ AMD K6-2
F ICK PEN 45 W 3.5 AMD K6-III/ IDT W2A/ MMX/ IDT C6/ 50.0 50.0 45 3.5
Intel Pentium/ AMD K6-2
Rth [K/W]

G 2
B
C

1
D

0
0 1 2 3 4 5 6
A v [m/s]
H art. no. Rth [K/W] suitable for processor type dim. [mm]
A B C D
ICK PRO 40 W 2.7 Intel Pentium PRO 65 67.5 40 4.5

F = with double-sided thermally conductive adhesive foil

W = for thermally conductive adhesive (please order separately)
I WLK ... E 23
Rth [K/W]

3
63
14

K 2
25

0
4,5

70 0 1 2 3 4 5 6
v [m/s]
art. no. Rth [K/W] suitable for processor type
L ICK PEN 3 FC 3.5 Intel Pentium III FC PGA (Mendocino, Copper-
mine)
fixing method: K = with fixing clamp (incl. one-sided adherent thermal foil)

Fan cooler for Intel PentiumIIIXeon B 60 Heatsinks for Q7 "Embedded-Boards" B 56

Fan cooler, universal B 58 Heatsinks for BGA B 17 20
N B 57 Attachable heatsinks C 10 16 Heatsinks for PGA B 11 16
Thermal conductive material E 2 24 Technical introduction A28
 A
Active heatsinks for processors
A

B
art. no. Rth [K/W] suitable for processor type dim. [mm] C
A B C
LA ICK 15 x 15 F 05 2.3 universal 37.92 38.10 20
LA ICK 15 x 15 F 12 2.3 universal 37.92 38.10 20
LA ICK 17 x 17 F 12 1.6 universal 43.10 43.10 20
LA ICK 17 x 17 F 12 A 1.6 universal 43.10 43.10 20
D
LA ICK 17 x 17 W 05 1.6 universal 43.10 43.10 20
LA ICK 17 x 17 W 12 1.6 universal 43.10 43.10 20
LA ICK 18 x 18 F 12 1.5 universal 45.70 45.70 20
LA ICK 18 x 18 W 12 1.5 universal 45.70 45.70 20 E
LA ICK 21 x 21 F 05 1.4 universal 53.34 53.34 20
LA ICK 21 x 21 F 12 1.4 universal 53.34 53.34 20
LA ICK 21 x 21 W 05 1.4 universal 53.34 53.34 20
LA ICK 21 x 21 W 12 1.4 universal 53.34 53.34 20
F
used fans:
5 Volt = Sepa MFB 25 F 05 L / MFB 40 H 05 / MFB 40 H 05 A;
12 Volt = Sepa MFB 25 F 12 / MFB 40 H 12 / MFB 40 H 12 A

F = with double-sided thermally conductive adhesive foil

W = for thermally conductive adhesive (please order separately) WLK ... E 23 G
A = alarm exit

Heatsinks for BGA B 17 20 Heatsinks for P II-Mobile Module B 56

Heatsinks for Q7 "Embedded-Boards" B 56 Fan cooler for Pentium IV B 60
Fan cooler, universal B 58 Thermal conductive material E 2 24 B 58 N
Heatsinks for Pentium PRO B 57 Technical introduction A28
A
Active heatsinks for processors

C easy assembly on ZIF socket by fixing clamp

B
D

D
C
A
art. no. Rth [K/W] suitable for processor type dim. [mm]
A B C D
E LA ICK PEN 8 F 05 2.50 AMD K6-III/ IDT W2A/ Cyrix MII and similar/ 50.8 50.8 8.00 9.00
MMX/ IDT C6/ Intel Pentium/ AMD K6-2
LA ICK PEN 8 F 12 2.50 AMD K6-III/ IDT W2A/ Cyrix MII and similar/ 50.8 50.8 8.00 9.00
MMX/ IDT C6/ Intel Pentium/ AMD K6-2
LA ICK PEN 8 W 05 2.50 AMD K6-III/ IDT W2A/ Cyrix MII and similar/ 50.8 50.8 8.00 9.00
F MMX/ IDT C6/ Intel Pentium/ AMD K6-2
LA ICK PEN 8 W 12 2.50 AMD K6-III/ IDT W2A/ Cyrix MII and similar/ 50.8 50.8 8.00 9.00
MMX/ IDT C6/ Intel Pentium/ AMD K6-2
LA ICK PEN 16 K 12 1.20 AMD K6-III/ IDT W2A/ Cyrix MII and similar/ 50.8 50.8 16.51 26.51
MMX/ IDT C6/ Intel Pentium/ AMD K6-2
G LA ICK PEN 16 W 12 1.20 AMD K6-III/ IDT W2A/ Cyrix MII and similar/ 50.8 50.8 16.51 26.51
MMX/ IDT C6/ Intel Pentium/ AMD K6-2
LA ICK PEN 16 W 12 A 1.20 AMD K6-III/ IDT W2A/ Cyrix MII and similar/ 50.8 50.8 16.51 26.51
MMX/ IDT C6/ Intel Pentium/ AMD K6-2
LA ICK PEN 18 W 12 1.60 AMD K6-III/ IDT W2A/ Cyrix MII and similar/ 50.8 50.8 8.00 18.00
H MMX/ IDT C6/ Intel Pentium/ AMD K6-2
LA ICK PEN 38 W 12 1.10 AMD K6-III/ IDT W2A/ Cyrix MII and similar/ 49.5 49.5 38.00 48.00
MMX/ IDT C6/ Intel Pentium/ AMD K6-2
LA ICK PRO 25 F 12 0.97 Intel Pentium PRO 63.5 67.5 25.00 35.00
I used fans: 5 Volt = Sepa MFB 50 E 05; 12 Volt = Sepa MFB 50 E 12/ Sepa MFB 50 E 12 A;
LA ICK PEN 8: 5 Volt = Sepa HFB 44 X 05 A; 12 Volt = Sepa HFB 44 B 12 A
K = with fixing clamp (incl. one-sided adherent conductive foil)
F = with double-sided thermally conductive adhesive foil
W = for thermally conductive adhesive (please order separately) WLK ... E 23

K A = alarm exit

Heatsinks for BGA B 17 20 Heatsinks for P II-Mobile Module B 56

Heatsinks for Q7 "Embedded-Boards" B 56 Fan cooler for Pentium IV B 60
N B 59 Fan cooler, universal B 58 Thermal conductive material E 2 24
Heatsinks for Pentium PRO B 57 Technical introduction A28
 A
Active heatsinks for processors
incl. one-sided adherent thermal foil

52
3,5

27
4
125 C
art. no. Rth [K/W] suitable for processor type
LA ICK PEN 2 K 12 ... 1.2 Intel Pentium II/ AMD Athlon
please indicate: ... accessory (optional)
SM = molex connection plug
D
utilized fans: 12 Volt = Sepa MFB 40 H 12

E
28,4

107
4

F
130
art. no. Rth [K/W] suitable for processor type
LA ICK PEN 3 XE 0.8 Intel Pentium III-XeonTM
G
please indicate: ... accessory (optional)
A = alarm exit
SM = molex connection plug

fixing method: SB= screw fixing

utilized fans: 12 Volt = Sepa MFB 50 E 12 H
with copper base plate
customer specific designs and modifications on request

I
63,5
70
45
7,7

K
7 80

art. no. Rth [K/W] suitable for processor type

LA ICK PEN 4 1 K 0.6 Intel Pentium IV
please indicate: ... accessory (optional)
SM = molex connection plug L
fixing method: K = with fixing clamp
operating voltage of the fan motor: 12 Volt (Papst 612 NHH)

Heatsinks for BGA B 17 20 Heatsinks for P II-Mobile Module B 56

Heatsinks for Q7 "Embedded-Boards" B 56 Fan cooler for Pentium IV B 60
Fan cooler, universal B 58 Thermal conductive material E 2 24 B 60 N
Heatsinks for Pentium PRO B 57 Technical introduction A28
A

N
 A
Technical data of the fans

molex crimp case series: 6471; molex crimp terminals: 2759

Sepa-fan 24 h BURN-IN tested

C
5 volt fan
Sepa Sepa Sepa Sepa Sepa ebmpapst
MFB 25 F 05 L MFB 40 H 05 MFB 40 H 05 A MFB 50 E 05 HFB 44 X 05 A 405 F
circuit voltage 4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC 4.5...5.5 V DC
bearing type double ball bearing double ball bearing double ball bearing double ball bearing ball bearing double slide D
bearing
fan dimensions 25x25x10 mm 40x40x10 mm 40x40x10 mm 50x50x10 mm 44x44x6.2 mm 40x40x10 mm
cur. consumpt. 90 mA 90 mA 90 mA 50 mA 90 mA 140 mA
max. iuitial current 170 mA 250 mA 250 mA 120 mA 160 mA
max. volume flow 46 l/min 184 l/min 184 l/min 169 l/min 50 l/min 132 l/min
2.8 m3/h 11 m3/h 11 m3/h 10.1 m3/h 3 m3/h 8 m3/h E
max. static pressure 2.2 mmH2O 3.1mm H2O 3.1mm H2O 1.6mm H2O 2.6mm H2O 3.06mm H2O
22 Pa 30.5 Pa 30.5 Pa 15.6 Pa 25.5 Pa 30 Pa
noise level 18 dB(A), 1 m lateral 24 dB(A), 1 m lateral 24 dB(A), 1 m lateral 17 dB(A), 1 m lateral 28 dB(A), 1 m lateral 22.1 dB(A), 1 m
lateral
temperature range -10C ... +85C -40C... +80C -40C... +80C -10C... +70C -40C... +80C -20C... +70C
failure rate (L10) 95,000 h 95,000 h 95,000 h 95,000 h 95,000 h 45,000 h (20C) F
MTBF 280,000 h (20C) 280,000 h (20C) 280,000 h (20C) 280,000 h (20C) 280,000 h (20C)
weight 8g 13 g 13 g 19 g 7g 17 g
cases plastic PBT plastic PBT plastic PBT plastic PBT plastic PBT plastic PBT
(UL E54695) (UL E54695) (UL E54695) (UL E54695) (UL E54695) (UL E38324)

12 volt fan G
Sepa Sepa Sepa Sepa Sepa ebmpapst
MFB 25 F 12 MFB 40 H 12 MFB 40 H 12 A MFB 50 E 12 HFB 44 B 12 A 412 F
circuit voltage 10.2...13.8 V DC 10.2...13.8 V DC 10.2...13.8 V DC 10.2...13.8 V DC 10.2...13.8 V DC 10-14 V DC
bearing type double ball bearing double ball bearing double ball bearing ball bearing ball bearing double slide
bearing
fan dimensions 25x25x10 mm 40x40x10 mm 40x40x10 mm 50x50x10 mm 44x44x6.2 mm 40x40x10 mm
H
cur. consumpt. 70 mA 50 mA 50 mA 60 mA 40 mA 60 mA
max. iuitial current 150 mA 130 mA 130 mA 140 mA 70 mA
max. volume flow 70 l/min 173 l/min 173 l/min 238 l/min 50 l/min 132 l/min
4.1 m3/h 10.3 m3/h 10.3 m3/h 14.3 m3/h 3 m3/h 8 m3/h
max. static pressure 2.24mm H2O
41.5 Pa
2.9 mmH2O
28.5 Pa
2.9 mmH2O
28.5 Pa
2.7mm H2O
26.9 Pa
2.6mm H2O
25.5 Pa
3.06mm H2O
30 Pa
I
noise level 23 dB(A), 1 m lateral 24 dB(A), 1 m lateral 21 dB(A), 1 m lateral 22 dB(A), 1 m lateral 28 dB(A), 1 m lateral 22.1 dB(A), 1 m
lateral
temperature range -40C... +80C -40C... +80C -40C... +80C -10C... +70C -40C... +80C -20C... +70C
failure rate (L10) 95,000 h 95,000 h 95,000 h 95,000 h 95,000 h 45,000 h (20C)
MTBF
weight
280,000 h (20C)
8g
280,000 h (20C)
13 g
280,000 h (20C)
13 g
280,000 h (20C)
19 g
280,000 h (20C)
20 g 17 g
K
cases plastic PBT plastic PBT plastic PBT plastic PBT steel/aluminium (UL plastic PBT
(UL E54695) (UL E54695) (UL E54695) (UL E54695) E54695) (UL E38324)

Fans with pulse output - Technical data of fans with pulse output:

pulse output for activation of the alarm control L

pulse similar to a square pulse with three times the frequency of the rotor speed
when the rotor is blocked, the output signal may be L (0.8 V) or H (Vcc-1 V)
the pulse output must not be connected to GND or Vcc withoutb protective resistor (>10 K)
in order to avoid short circuits, the pulse output not being used must be insulated

B 62 N
 Finger shaped heatsinks for
power semiconductors
Attachable heatsinks
Finger shaped heatsinks for transistors
Miniature heatsinks

Finger shaped heatsinks for power semiconductors Attachable heatsinks

specially compatible for power semiconductors in
a TO-case
made as a bent sheet metal part or die cast heatsink
made of aluminium
aligned heatsink contours for the best heat dissipation
direct screwing of the component to the heatsink on
the PCB
made of aluminium or copper material
solderable surface coating
integrated spring clip for easy and fast mounting of
the transistor
secure hold of the component due to optimized spring
force and geometry
customer specific version upon request

Finger shaped heatsinks for transistors Miniature heatsinks

effective heat dissipation of transistors
efficient radiation of heat at a horizontal or vertical
mounting position
component fastening by means of screws or special
transistor retaining springs
solder mounting by means of integrated solder pins and
solderable surfaces
for TO 5, SOT 82, D PAK and similar semiconductors
made of aluminium, phosphorus bronze or copper
simple mounting by direct plugging or soldering
of the heatsink
special types of packaging such as tape & reel,
magazine or tray upon request
versions and designs for your application
 A
Finger shaped heatsinks for power semiconductors

3,7

13

30
B

,2

,2
2
4,
38,1
4,5

46

,9
10
38,1
C
46

art. no. [mm] Rth [K/W]

FK 254 SA 3 25.4 5.8 TO 3
FK 318 SA 31.8 4.8 without
FK 318 SA 3 31.8 4.8 TO 3
D
material: die-casting aluminium
surface: black lacquered

2
3

4,
TO 3 CB

15 ,2

30

13
,1

,2
13

30
,2

,2
2
4,

3,
2,5

6
45
40
45
35

,9

F
10

5, ,2
4
6
9, 0
5 1
1

13 4,9

,9
10
,1
art. no. [mm] Rth [K/W]
FK 201 SA 25.4 6 without G
FK 201 SA 3 25.4 6 TO 3
FK 201 SA CB 25.4 6 CB
FK 202 SA 12.7 8 without
FK 202 SA 3 12.7 8 TO 3
H
FK 202 SA CB 12.7 8 CB

30,1
L (TO 3 SOT 9 + TO 66 SOT 32 TO220) 23,1
16,9
1,5 13
I
5,4

4,2
4,2
2,5

10,9

33

3,6
41,6 K
art. no. [mm] Rth [K/W]
FK 205 SA L 31.8 9.0 L
FK 206 SA L 25.4 10.5 L
FK 207 SA L 19.1 12.0 L L
FK 208 SA L 12.7 14.0 L
material: aluminium
surface: black anodised

Attachable heatsinks C 10 14 Mounts E 44 48

Heatsinks for TO 5 and TO 18 C 17 19 Insulating caps E 51
Heatsinks for D PAK C 21 117 Thermal conductive material E 2 24 C2 N
Aluminium oxide wafers E 17 18 Technical introduction A28
A
Finger shaped heatsinks for power semiconductors

FK 223 SA 3 FK 223 SA CB
B

13

30
,2
,9

,2
13

30

10
,2

,2

1,

4,

8
3

32
42

,9

5, ,2
2
10

4,

4
6
3,
6
C

9,
5
10
1,5

13
,1
art. no. [mm] Rth [K/W]
FK 223 SA 17 6.8 without
D FK 223 SA 3 17 6.8 TO 3
FK 223 SA CB 17 6.8 CB
4 M 2,5 M3

28,3
8,5
1,5

10
14,75
35,5

F art. no. [mm] Rth [K/W]

FK 217 SA CB 2 13 16 CB 2 (SOT 32; TO 220)
material: aluminium
surface: black anodised

Attachable heatsinks C 10 14 Mounts E 44 48

Heatsinks for TO 5 and TO 18 C 17 19 Insulating caps E 51
N C3 Heatsinks for D PAK C 21 117 Thermal conductive material E 2 24
Aluminium oxide wafers E 17 18 Technical introduction A28
 A
Heatsinks for transistors in plastic case
for semiconductor screw-assembly, horizontal

FK 234 SA L 1 FK 234 SA L 2 B
28 28
3 3

3,8 3,2

8
18,50,5
11,50,5 C
14,75 10
20 20

1,5 FK 234 SA L 3 FK 234 SA L 4

28 28 D
8 10

3,2 3,8 3,8 3,8

12,5 20
E
art. no. [mm] Rth [K/W]
FK 234 SA L 1 15 17 TO 220
FK 234 SA L 2 15 17 SOT 32
FK 234 SA L 3 15 17 CB
F
FK 234 SA L 4 15 17 CB
material: aluminium
surface: black anodised

for semiconductor screw-assembly, vertical G

FK 235 ... L 1 FK 235 ... L 2
28 28
18,50,5 18,3
13,5
H
2
2

11,50,5
3,8 3,2

10,16
10,16
1,5

4 4
I
art. no. [mm] Rth [K/W]
FK 235 MI L 1 15 16 TO 220
FK 235 MI L 2 15 16 SOT 32
FK 235 SA L 1 15 16 TO 220
K
FK 235 SA L 2 15 16 SOT 32
material: aluminium
surface: solderable surface/ black anodised

Attachable heatsinks C 10 14 Mounts E 44

Heatsinks for TO 5 and TO 18 C 17 19 Insulating caps E 51
Heatsinks for D PAK C 21 Thermal conductive material E 2 24 C4 N
Aluminium oxide wafers E 17 18 Technical introduction A28
A
Heatsinks for transistors in plastic case
art. no. 38 26
18
B
9,9 K/W

22
1,5
TO 220
13
FK 225 SA L 1 19 24,5
C
art. no. 38
26
8

3,6
18

10
9,9 K/W

22
D TO 220
6,9
16,5 2,5 24,5
FK 225 SA L 2 31,2
art. no. 19 21
13
E 30 K/W

11,5
4
TO 220
6,5 18,5

1,5
FK 228 SA L 1
art. no.
F 19
21
13
27 K/W

13,5
4

TO 220
6,5 18,5
G

1,5
FK 229 SA L 1
art. no.
21
13
19

21 K/W

19,5
H
4

TO 220
6,5 18,5
1,5
FK 230 SA L 1
material: aluminium
I surface: black anodised

art. no. 30,4 12,5

5,1

3,8
31,2

K
4
15,2

17 K/W
7

TO 220
5

15 1,2
3 0,8 1,9
FK 249 SA 220 24,2 11,1

L material: aluminium
surface: black passivated, solder pins tin plated

Attachable heatsinks C 10 14 Mounts E 44 48

Heatsinks for TO 5 and TO 18 C 17 19 Insulating caps E 51
N C5 Heatsinks for D PAK C 21 Thermal conductive material E 2 24
Aluminium oxide wafers E 17 18 Technical introduction A28
 A
Heatsinks for transistors in plastic case
art. no. 12,2

3,8
B

25,4
25 K/W

1
SOT 32
18

FK 209 SA 32 available without hole pattern as well C

art. no. 22,4
12,2

3,8
8

25,4
18 K/W
D

1
CB (SOT 32 + TO 220)

30
FK 210 SA CB available without hole pattern as well
art. no. 12,2

3,8
E

13

25,4
21 K/W
1
SOT 32
18
FK 213 SA 32 available without hole pattern as well F
art. no. 22,4
12,2

3,8

13

25,4
15 K/W

G
1

CB (SOT 32 + TO 220)

30
FK 214 SA CB available without hole pattern as well
art. no.
13,5
H
9,5

11,5
13,5
3,8

24 K/W

TO 220
1

19
FK 231 SA 220
art. no. 13,34 I
9,5

19,05

16,45

24 K/W
3,8

SOT 32
1,3

FK 239 SA 32 19,5 K
material: aluminium
surface: black anodised

Attachable heatsinks C 10 14 Mounts E 44 48

Heatsinks for TO 5 and TO 18 C 17 19 Insulating caps E 51
Heatsinks for D PAK C 21 Thermal conductive material E 2 24 C6 N
Aluminium oxide wafers E 17 18 Technical introduction A28
A
Heatsinks for transistors in plastic case
art. no. 12,2

1,2

3,8
B

1
25,4
8
25 K/W

1
SOT 32
18 3
FK 211 32 ... available without hole pattern as well
C art. no. 22,4
12,2

1,2

3,8

1
25,4
8
18 K/W

1
D CB (SOT 32 + TO 220) 18,2
30 3
FK 212 CB ... available without hole pattern as well
12,2
art. no.

3,8
1,2
E

1
25,4
13
21 K/W

1
SOT 32
18 3
FK 215 32 ... available without hole pattern as well
F art. no. 1,2
22,4
12, 2

3,8

1
13

25,4
15 K/W
1

G CB (SOT 32 + TO 220)
18, 2
30 3
FK 216 CB available without hole pattern as well
art. no. 3,8 5,2 14,4
2,5

3,8
12,7

25,4
20 K/W
1

30 TO 220
5,5

FK 222 ... available without hole pattern as well

art. no. 5,2
I 3,8 14,4
2,2

8
2,5

3,8
12,7

25,4
12

20 K/W
1

30 TO 220
5,5

FK 222 THF ...

1,6

4
K art. no. 19,1
1,5

3,8

16,8
7,9

1,5

22 K/W
1,95

TO 220
FK 247 220 ... 23,5 4,5
L please indicate: ... surface
SA = black anodised
MI = solderable surface
material: aluminium

Attachable heatsinks C 10 14 Mounts E 44

Heatsinks for TO 5 and TO 18 C 17 19 Insulating caps E 51
N C7 Heatsinks for D PAK C 21 Thermal conductive material E 2 24
Aluminium oxide wafers E 17 18 Technical introduction A28
 A
Heatsinks for transistors in plastic case
17,8
art. no.

3,6
18 B

9,8

45
9

7
22 K/W
20

1
TO 220
FK 227 SA L 1 4,3

art. no. 36,6

C

3,7
1
18

45
9,5
12 K/W
20

FK 238 SA L 1
TO 220
12,2 10,2 D
material: aluminium
surface: black anodised

art. no.
21 K/W 4
35,6
19,3 12,3
E

3,2
1,6
6,7

SOT 32

22
TO 220

19,4
1,2
F
3,5

FK 218 32 ...
art. no.
24,5
7

3,6
20,5
3,2

21 K/W
G
1,2
13

24
TO 220
4
17
FK 232 220 ...
art. no.
7
33 H
3,6
29
3,2

20,2 K/W
1,2

27
16

TO 220
4

FK 233 220 ...

20 I
please indicate: ... surface
SA = black anodised
MI = solderable surface
material: aluminium
K

Attachable heatsinks C 10 14 Mounts E 44

Heatsinks for TO 5 and TO 18 C 17 19 Insulating caps E 51
Heatsinks for D PAK C 21 Thermal conductive material E 2 24 C8 N
Aluminium oxide wafers E 17 18 Technical introduction A28
A
Heatsinks for transistors in plastic case
FK 219 CB 1 ... FK 219 CB 2 ...

2,5

2,5
B 50,8

3,2

3,2
50,8

35,1
16,6
35,1
16,6

22,9

10,8
1,2
C 7,1 9,7
18,3 14,8
25,4 4,8 21 4,8

art. no. [mm] Rth [K/W]

FK 219 CB 1 ... 12.6 14 CB 1 (TO 220)
D FK 219 CB 2 ... 12.6 14 CB 2 (TO 220)

2,5
50,8
6

1,5
3,2
E

35,1
16,6

22,9
11,5
1,2

1,8
3,9 7,1

18,3
F 25,4 4,8

art. no. [mm] Rth [K/W]

FK 219 CB 3 ... 12.6 14 CB 3 (TO 220)
FK 236 CB ... FK 236 220 ...
G 32
22
3,8
32 3,8
1,9

18

1,9
12 22
1

22,8
22,8

23,4
23,4

3,3
3,3
3,3

12

16
12

16

H
28,5 28,5
30,8 30,8 5
5

art. no. [mm] Rth [K/W]

FK 236 220 ... 5 18 TO 220
I FK 236 CB ... 5 18 CB
please indicate: ... surface
SA = black anodised
MI = solderable surface
material: aluminium
K

Retaining springs for transistors A 115 117 Heatsinks for TO 5 and TO 18 C 17 19

Lock-in retaining spring for transistors A 119 Attachable heatsinks C 10 14
N C9 Profiles for lock-in fixing spring A 84 Mounting material for semiconductors E 46
Profiles for PCB mounting A 89 112 Technical introduction A28
 A
Attachable heatsinks

25 7
B

20,5
0,6 C
art. no. Rth [K/W]
FK 220 SA 220 25 TO 220
material: aluminium
surface: black anodised
D
for transistiors with thin bottom thickness (0.5 mm)

25 7

E
20,5

0,6

F
art. no. Rth [K/W]
FK 258 SA 220 25 TO 220
material: aluminium
surface: black anodised
G
25
18 8,3
25,4

1,2
4

1,2 22,5 1,3

art. no. Rth [K/W]

I
FK 224 ... P SIP 18 P SIP
please indicate: ... surface
SA = black anodised
MI = solderable surface
material: aluminium K

Heatsinks for D PAK C 21 Vibration dampers E 41

Heatsinks for transistors C49 U-shaped heatsink A 123 124
Kapton insulator washers E 16 Aluminium oxide wafers E 17 18 C 10 N
Vibration dampers E 41 Technical introduction A28
A
Attachable heatsinks
FK 224 ... 218 1 FK 224 ... 218 2
25
B 25
18 8,3
18
4 8,3

25,4

25,4
14,5
C

4
15,5 15,5

4
1,2 1,3 1,2 1,3

FK 224 ... 220 1 FK 224 ... 220 2

25
D 25
18 8,3
18
4 8,3

25,4

25,4
14,5
E
10,5 10,5
4

4
15,5 15,5
1,2 1,3 1,2 1,3

art. no. Rth [K/W] art. no. Rth [K/W]

FK 224 ... 218 1 18 TO 218 FK 224 ... 220 1 18 TO 220
F
FK 224 ... 218 2 18 TO 218 FK 224 ... 220 2 18 TO 220
please indicate: ... surface
SA = black anodised
MI = solderable surface

G material: aluminium

art. no.

3,4
2
0,81
22,86

25,4

12,7
H
7,6

3,81
31 5,3
1,27
FK 241 SA 218 V with tin-plated soldering lug for direct soldering onto circuit board, for vertical installation
art. no.
I 20 20

9,8 K/W
28

1,4
17,2

TO 220

K
8

1,2
20,1
FK 248 SA 220
material: aluminium
surface: black anodised, solder pins tin plated
L

Heatsinks for D PAK C 21 Vibration dampers E 41

Heatsinks for transistors C49 U-shaped heatsink A 123 124
N C 11 Kapton insulator washers E 16 Aluminium oxide wafers E 17 18
Vibration dampers E 41 Technical introduction A28
 A
Attachable heatsinks
universal clip on heatsinks for type TO 218, TO 229, TO 247, TO 248, SIP-Muliwatt and similar
easy assembly by pushing the heatsink onto the component
for vertical and horizontal fastening by soldering B
fin height variations on request
special design accord. to customized specification
art. no. 20,2 K/W
0,6
10
C

16

8,5

9
27 1,2 20

FK 245 MI 247 O without soldering lug

art. no. 20,5 K/W D
0,6
10

3,2

16

8,5

9
0,6 1
27 1,2 20
FK 245 MI 247 H with soldering lug for horizontal mounting E
art. no. 19,7 K/W
4,85

0,6
10
0,6

16

8,5

9
F
1,1

1 27
4 1,2 20

FK 245 MI 247 V with soldering lug for vertical mounting

art. no. 18,4 K/W

16
0,6
10
G

13
27 1,2 8,5 20

FK 243 MI 247 O without soldering lug

art. no. H
19 K/W
0,6
10
3,2

13
16

8,5

0,6
27 1,2 20
1
I
FK 243 MI 247 H with soldering lug for horizontal mounting
art. no.
18,4 K/W
4,85

0,6
10 K
13
0,6

8,5
16
1,1

1 27
4 1,2 20

FK 243 MI 247 V with soldering lug for vertical mounting

material: copper (Cu) L
surface: solderable surface
material thickness: 0.6 mm

Heatsinks for D PAK C 21 Vibration dampers E 41

Heatsinks for transistors C49 U-shaped heatsink A 123 124
Kapton insulator washers E 16 Aluminium oxide wafers E 17 18 C 12 N
Vibration dampers E 41 Technical introduction A28
A
Attachable heatsinks

* 2
B 1

TO 220
C

D
narrow version with better thermal resistance
max. 14.5 mm wide
3 different lengths for varied dissipation power
takes less space than any other attachable heatsink
simple assembly by pushing the heatsink onto the TO 220 housing
E the cooling fingers form spring clamps (1+2), which pushes the TO 220 and it's mounting flange onto the heatsink (3)
optimum heat transfer due the constant pressure on the entire contact surface of the TO 220 cases
effective heat emmision with horizontal and vertical mounting
* = touch in edge of transistor
art. no.
F max. 14,5 *
26 K/W

12,7

ca. 8,5
0,81 15,24
G
FK 242 SA 220 O without soldering lug
art. no.
max. 14,5 *

H 21 K/W
12,7

ca. 8,5
19,05
0,81

I FK 237 SA 220 O without soldering lug

art. no.
16 K/W
max. 14,5 *
12,7

K
ca. 8,5

38,1
0,81

FK 240 SA 220 O without soldering lug

L material: aluminium
surface: black anodised, solder pins tin plated

Heatsinks for D PAK C 21 Vibration dampers E 41

Heatsinks for transistors C49 U-shaped heatsink A 123 124
N C 13 Kapton insulator washers E 16 Aluminium oxide wafers E 17 18
Vibration dampers E 41 Technical introduction A28
 A
Attachable heatsinks
art. no.
max. 14,5 *
B

0,81
12,7
26 K/W

8,5
ca.
4,05
0,81 0,81
1,27 11,8
6,4 15,24
FK 242 SA 220 H with tinned soldering lug for direct soldering onto circuit board, for horizontal installation C
art. no. *
max. 14,5
21 K/W

0,81
4,05

12,7
D

8,5
ca.
0,81 0,81
1,27 4,6
6,4 19,05
FK 237 SA 220 H with tinned soldering lug for direct soldering onto circuit board, for horizontal installation
art. no. 16 K/W
max. 14,5
* E

4,05

0,81
12, 7

8,5
ca.
0,81
0,81
1,27 4,6
6,4 38,1
FK 240 SA 220 H with tinned soldering lug for direct soldering onto circuit board, for horizontal installation
F
material: aluminium
surface: black anodised, solder pins tin plated

with tinned soldering lug for direct soldering onto circuit board, for vertical installation
max. 14,5 * G
0,81
1,62

12,7

ca.
8,5
0,81 9
6,4 A 15,24
H
art. no. A [mm] Rth [K/W] art. no. A [mm] Rth [K/W]
FK 242 SA 220 V 6.35 26 FK 242 SA 220 VL 9.53 26
*
max. 14,5
0,81
1,62

12,7

I
ca.
8,5

12,8
0,81
6,4 A 19,05

art. no. A [mm] Rth [K/W] art. no. A [mm] Rth [K/W]
FK 237 SA 220 V 6.35 21 FK 237 SA 220 VL 9.53 21 K
max. 14,5
*
0,81
1,62

12,7

ca.
8,5

6,4
0,81
A 38,1
31,8
L
art. no. A [mm] Rth [K/W] art. no. A [mm] Rth [K/W]
FK 240 SA 220 V 6.35 16 FK 240 SA 220 VL 9.53 16
material: aluminium
surface: black anodised, solder pins tin plated M

Heatsinks for D PAK C 21 Vibration dampers E 41

Heatsinks for transistors C49 U-shaped heatsink A 123 124
Kapton insulator washers E 16 Aluminium oxide wafers E 17 18 C 14 N
Vibration dampers E 41 Technical introduction A28
A
Attachable heatsinks for TO 220 with a bottom plate thickness of 0.5 mm

D
narrow version with better thermal resistance
max. 14.5 mm wide
takes less space than any other attachable heatsink
simple assembly by pushing the heatsink onto the TO 220 housing
the cooling fingers form spring clamps (1+2), which pushes the TO 220 and it's mounting flange onto the heatsink (3)
E optimum heat transfer due the constant pressure on the entire contact surface of the TO 220 cases
effective heat emmision with horizontal and vertical mounting
* = touch in edge of transistor

art. no.
F max
14,5
*
21 K/W

12,7

8,4
ca.
12,7 0,81 19,05

G FK 252 SA 220 O without soldering lug

art. no. max
14,5
*
21 K/W
12,7

H
4,1

0,81

8,4
ca.
1,27 0,81
6,35 19,05
12,7
FK 252 SA 220 H with tinned soldering lug for direct soldering onto circuit board, for horizontal installation
material: aluminium
I surface: black anodised

with tinned soldering lug for direct soldering onto circuit board, for vertical installation

max. *
14,5

K
0,81
12,7

8,4
ca.

1,27
12,7 0,81 19,05 A

art. no. A [mm] Rth [K/W] art. no. A [mm] Rth [K/W]
L FK 252 SA 220 V 6.35 21 FK 252 SA 220 VL 9.53 21
material: aluminium
surface: black anodised

Heatsinks for D PAK C 21 Vibration dampers E 41

Heatsinks for transistors C49 U-shaped heatsink A 123 124
N C 15 Kapton insulator washers E 16 Aluminium oxide wafers E 17 18
Vibration dampers E 41 Technical introduction A28
 A
Attachable heatsinks

11,1

19
10,7 19

22
C
art. no. Rth [K/W]
FK 253 23.7 TO 220

D
11,1

19,05
11,7 19,05
24,8

art. no. Rth [K/W]

E
FK 255 16.8 TO 220
4,19 0,13

F
10,2

19,05
12,2 0,6 19,05
21,84

art. no. Rth [K/W]

G
FK 257 21.2 TO 220
material: aluminium
surface: black anodised
H

Heatsinks for D PAK C 21 Vibration dampers E 41

Heatsinks for transistors C49 U-shaped heatsink A 123 124
Kapton insulator washers E 16 Aluminium oxide wafers E 17 18 C 16 N
Vibration dampers E 41 Technical introduction A28
A
Small heatsinks
art. no.

B
40 K/W

10,1
TO 5
8
0,6 3,96 6,35
21,4
C KK 1 3,96
art. no.

38 K/W

10,1
D TO 5
8
0,6 6,35 6,35
21,4

KK 1 6,35
E art. no.
35 K/W
TO 5

10,1
F
8
0,6 12,7 6,35
21,4
KK 1 12,7
art. no.
31 K/W
G
TO 5
10,1

8
H KK 1 19,05 21,4
0,6 19,05 6,35

material: aluminium
surface: black anodised

Finger-shaped heatsinks C 23 Thermal conductive material E 2 24

Heatsinks for transistors C 49 Mounting material for semiconductors E 46 48
N C 17 Attachable heatsinks C 10 16 Extruded heatsinks A 22 83
Heatsinks for D PAK C 21 22 Technical introduction A28
 A
Small heatsinks
art. no.

57 K/W
25
B

7,9
5
TO 5

KF 5/5
art. no. C
25
46 K/W

7,9
10
TO 5

KF 5/10
D
art. no.
25
40 K/W

7,9
15
TO 5 E
KF 5/15
material: brass
surface: blackened
F
art. no.
7,8 60 K/W

19
F T
8

TO 5
G
KK 562 GS T = gap; F = spring loaded
material: special bronze CuZn 15
material thickness: 0.3 mm
surface: blackened
H

Finger-shaped heatsinks C 23 Thermal conductive material E 2 24

Heatsinks for transistors C 49 Mounting material for semiconductors E 46 48
Attachable heatsinks C 10 16 Extruded heatsinks A 22 83 C 18 N
Heatsinks for D PAK C 21 22 Technical introduction A28
A
Small heatsinks
art. no.
max. 12,7
B 1+0,5
-0,2
63 K/W

6
TO 5
8,10,1
SKK 56
C art. no.
max. 12,7
1+0,5
-0,2
55 K/W

8
TO 5
D SKK 58
8,10,1

art. no.
max. 12,7
1+0,5
-0,2
44 K/W

10
E
TO 5
8,10,1
SKK 510
material: aluminium
surface: etched (other surfaces on request)
F
art. no.
80 K/W
3,5

TO 126

15
SOT 32
G 9,5
SOT 82
KK 92
art. no. 13
3,3
2,4

H 60 K/W
2,2
TO 126 30
SOT 32
0,5

11

10

SOT 82
4
I KK 32 8,8
material: special bronze CuZn 6
surface: blackened

Finger-shaped heatsinks C 23 Thermal conductive material E 2 24

Heatsinks for transistors C 49 Mounting material for semiconductors E 46 48
N C 19 Attachable heatsinks C 10 16 Extruded heatsinks A 22 83
Heatsinks for D PAK C 21 22 Technical introduction A28
A

N
A
Heatsinks for D PAK and others

C
copper heatsinks with excellent heat conductivity
direct mounting on printed circuit through solderable surface
especially suitable for SMD components of type D PAK (TO 252), D PAK (TO 263), D PAK (TO 268), SOT 669 LF PAK,
SO IC-8 FL MP, Power SO-8, Power SO-10, Power SO-20, Power SO-36, SO-14, SO-16, SOT 223 etc
D available standard packing: bulk parts or reel
special packing like magazine, tray etc. on request; - special versions according to customers specifications
tape width: 44 mm, reel diameter: 330 mm, quantity: FK 244 08 = 450, FK 244 13 = 200
art. no.

10

8
8
E 23
FK 244 08 D PAK ... 10

weight: 2g 14,8 31,5 K/W

art. no.

10
8

13
F
FK 244 13 D PAK ... 10
23
weight: 3.3g 14,8 25 K/W
art. no.
10
8

8
G
13 26
FK 244 08 D2 PAK ...
weight: 2.2g 17,8 29,3 K/W
art. no.
10

H
8

13
13
FK 244 13 D2 PAK ... 26
weight: 3.6g 17,8 22,8 K/W
art. no.
I
10

8
8

FK 244 08 D3 PAK ... 18 31

weight: 2.5g 22,8 26 K/W

art. no.
K
10

13
8

FK 244 13 D3 PAK ... 18

31
weight: 3.9g 22,8 19,5 K/W

L please indicate: ... packing (optional)

TR = tape and reel
surface: solderable surface
material: copper (Cu)
material thickness: 0.6 mm
M

Heatsink profile-overview A 13 17 Attachable heatsinks C 10 16

Assignment table A 18 20 Heatsinks for TO 5 and TO 18 C 17 19
N C 21 Finger-shaped heatsinks C23 Thermal conductive material E 2 24
Heatsinks for transistors C49 Technical introduction A28
 A
Heatsinks for D PAK and others
tape width: 24 mm, reel diameter: 330 mm, quantity: FK 250 06 = 450, FK 250 08 = 450, FK 250 10 = 350
tape width: 24 mm, reel diameter: 330 mm, quantity: FK 251 06 = 450, FK 251 08 = 350, FK 251 10 = 250
art. no. B

6,5
4,5

8
FK 250 06 LF PAK ... 7 15
weight: 1g 11,4
37 K/W
art. no. C

8
8
6
FK 250 08 LF PAK ... 7 15
weight: 1.1g 11,4 34,8 K/W
art. no. D

10

8
8
7 15
FK 250 10 LF PAK ...
11,4 28,8 K/W
weight: 1.2g
art. no.
E

13
6,5
4,5

FK 251 06 LF PAK ... 7

11,4 15
weight: 1.3g 32 K/W
art. no. F

13
8
6

FK 251 08 LF PAK ... 7

15
weight: 1.4g 11,4 29,8 K/W
art. no. G
10

13
8

FK 251 10 LF PAK ... 7

15
weight: 1.5g 11,4 24 K/W
please indicate: ... packing (optional) H
TR = tape and reel
surface: solderable surface
material: copper (Cu)
material thickness: 0.6 mm
I
art. no. 11 K/W
11,43

19,38

15,24 0,6 19,38

FK 256
25,4
11,43 K
surface: solderable surface
material: aluminium
material thickness: 0.6 mm

Heatsink profile-overview A 13 17 Attachable heatsinks C 10 16

Assignment table A 18 20 Heatsinks for TO 5 and TO 18 C 17 19
Finger-shaped heatsinks C23 Thermal conductive material E 2 24 C 22 N
Heatsinks for transistors C49 Technical introduction A28

Segment cooling aggregates
modular assembly consisting of different circle- and
length segments
electrical and thermal insulation of the single cooling
segment sections
standard drilling patterns TO 3 and pressfit
segment profile also sold by the meter
other fan types and fan voltages upon request
Hollow fin cooling aggregates
flow-optimized hollow fin geometry
precise milled flat semiconductor mounting surface,
single- and double-sided
laminar airflow and noise reduction by means of
harmonized chamber systems
additional treatments, modifications and designs
according to customers specifications
Segment cooling aggregates
Miniature cooling aggregates
Hollow fin cooling aggregates
High performance heatsinks
Miniature cooling aggregates
compact construction for dissipating high power losses
on smallest installation space
heatsink geometries and fixed length optimal adjusted
to the fan being used
homogeneous heat dissipation
mounting of the semi-conductor by means of sliding nut
chanels or specific snap-to-retaining springs for
transistors
High performance heatsinks
exclusive for forced convection
for radial- and tangential fans
flow-optimized design, best heat dissipation by means
of especially thick bottom plates
precise milled flat semiconductor mounting surfaces
mechanical treatments, special designs and surface
coating for your application
 A
Order example (see drawing on the right)
Semiconductor cooling package, consisting of 4 heatsinks LA 1 -2 A (segment C), 1 heatsink LA 1 - 8 A (segment D),
8 heatsinks LA 1 - 1 A (segment E) and 2 heatsinks LA 1- 4 A (segment F).
Total dissipation 1280 W. B
How to tick off?
C F
1. Tick on the left hand side the circles corresponding to an eight element long package,
D E
and also at the end of each row of the segments C, D, E and F to define the length.
2. For segment C: 4 marks for four double length elements, insulated from each other. This indicates 4 units LA 1 - 2.
3. For segment D: 1 mark for one single length of heatsink, 290.5 mm long. This indicates 1 unit LA 1 - 8. C
4. For segment E: 8 marks for 8 elements of the standard length (35 mm) each insulated from the other. This indicates 8 units LA 1 - 1.
5. For segment F: 2 marks for each two heatsinks of 144.5 mm length, each insulated from the other. This indicates 2 units LA 1 - 4.
6. For each segment the profile types, either A or B, must be indicated for aggregate LA 1.
7. In the rectangle corresponding to the heatsink elements, the pin layouts for the transistor should also be indicated.
8. In the order form please indicate whether the cooling-aggregate is to be supplied with a fan and whether this is equipped with a
protection-grid, or if it is to be supplied without a fan. D
Upon request, it is possible to supply fans for special voltages and higher temperatures.

LA 1 LA 2
date:
p le E
pieces p. order:
x a m
r e
rde
company:
name/dept.:
town:
O
street:
F
signature:

with fan 230 Volt ...... Volt

protection grid voltage:
without fan ~ =
C F
segment: segment: segment: segment:
G
length units:
mm

Typ. A B Typ. A B Typ. A B Typ. A B

D E
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
35.0 1
cable connection
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole

H
pressfit hole pressfit hole pressfit hole pressfit hole
71.5 2

Typ. A B Typ. A B Typ. A B Typ. A B

TO-3 holder TO-3 Fassung TO-3 holder TO-3 holder
TO-3 hole TO-3 Lochung TO-3 hole TO-3 hole
pressfit hole Prefit-Bohrg. pressfit hole pressfit hole
108.0 3

Typ. A B Typ. A B Typ. A B Typ. A B

TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole

I
144.5 4
The segment-line C-D-E-F is
Typ. A B Typ. A B Typ. A B Typ. A B shown against air-escape
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole orifice, thus on the other side
pressfit hole pressfit hole pressfit hole pressfit hole of the axial fan.
181.0 5 From this view also tick off
cable terminal with axial fan.
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
217.5 6

Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
K
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
254.0 7

Typ. A B Typ. A B Typ. A B Typ. A B

TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
290.5 8

Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
L
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
327.0 9

Typ. A B Typ. A B Typ. A B Typ. A B

TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
363.5 10

C D E F M
Please check off here total length of the cooling aggregate.

POB 1590 D - 58465 Ldenscheid info@fischerelektronik.de

Nottebohmstrae 28 D - 58511 Ldenscheid www.fischerelektronik.de
Tel.: +49 (0) 23 51 / 4 35-0 Fax: +49 (0) 23 51 / 4 57 54 www.facebook.de/fischerelektronik D2 N
A
Order / inquiry

LA 1 LA 2
B date:

pieces p. order:
company:

name/dept.:
C town:
street:
signature:

D with fan
protection grid
230 Volt ...... Volt
voltage:
without fan ~ =
C F
length units: segment: segment: segment: segment:

E
mm

Typ. A B Typ. A B Typ. A B Typ. A B

D E
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
35.0 1
cable connection
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
F 71.5 2
pressfit hole pressfit hole pressfit hole pressfit hole

Typ. A B Typ. A B Typ. A B Typ. A B

TO-3 holder TO-3 Fassung TO-3 holder TO-3 holder
TO-3 hole TO-3 Lochung TO-3 hole TO-3 hole
pressfit hole Prefit-Bohrg. pressfit hole pressfit hole
108.0 3

G Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
144.5 4
The segment-line C-D-E-F is
Typ. A B Typ. A B Typ. A B Typ. A B shown against air-escape
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole orifice, thus on the other side
of the axial fan.
H
pressfit hole pressfit hole pressfit hole pressfit hole
181.0 5 From this view also tick off
cable terminal with axial fan.
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
217.5 6

I
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
254.0 7

Typ. A B Typ. A B Typ. A B Typ. A B

TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole

K 290.5 8

Typ. A B Typ. A B Typ. A B Typ. A B

TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
327.0 9

Typ. A B Typ. A B Typ. A B Typ. A B

L TO-3 holder
TO-3 hole
pressfit hole
TO-3 holder
TO-3 hole
pressfit hole
TO-3 holder
TO-3 hole
pressfit hole
TO-3 holder
TO-3 hole
pressfit hole
363.5 10

C D E F
M Please check off here total length of the cooling aggregate.

POB 1590 D - 58465 Ldenscheid info@fischerelektronik.de

Nottebohmstrae 28 D - 58511 Ldenscheid www.fischerelektronik.de
N D3 Tel.: +49 (0) 23 51 / 4 35-0 Fax: +49 (0) 23 51 / 4 57 54 www.facebook.de/fischerelektronik
 A
Order / inquiry

LA 1 LA 2
date: B
pieces p. order:
company:

name/dept.:
town:
C
street:
signature:

with fan
protection grid
230 Volt ...... Volt
D
voltage:
without fan ~ =
C F
length units: segment: segment: segment: segment:
mm

Typ. A B Typ. A B Typ. A B Typ. A B

D E E
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
35.0 1
cable connection
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
71.5 2
pressfit hole pressfit hole pressfit hole pressfit hole
F
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 Fassung TO-3 holder TO-3 holder
TO-3 hole TO-3 Lochung TO-3 hole TO-3 hole
pressfit hole Prefit-Bohrg. pressfit hole pressfit hole
108.0 3

Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
Typ. A B
TO-3 holder
Typ. A B
TO-3 holder G
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
144.5 4
The segment-line C-D-E-F is
Typ. A B Typ. A B Typ. A B Typ. A B shown against air-escape
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole orifice, thus on the other side
of the axial fan.
H
pressfit hole pressfit hole pressfit hole pressfit hole
181.0 5 From this view also tick off
cable terminal with axial fan.
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
217.5 6

I
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
254.0 7

Typ. A B Typ. A B Typ. A B Typ. A B

TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
290.5 8
K
Typ. A B Typ. A B Typ. A B Typ. A B
TO-3 holder TO-3 holder TO-3 holder TO-3 holder
TO-3 hole TO-3 hole TO-3 hole TO-3 hole
pressfit hole pressfit hole pressfit hole pressfit hole
327.0 9

Typ. A B Typ. A B Typ. A B Typ. A B

TO-3 holder
TO-3 hole
pressfit hole
TO-3 holder
TO-3 hole
pressfit hole
TO-3 holder
TO-3 hole
pressfit hole
TO-3 holder
TO-3 hole
pressfit hole
L
363.5 10

C D E F
Please check off here total length of the cooling aggregate.
M

POB 1590 D - 58465 Ldenscheid info@fischerelektronik.de

Nottebohmstrae 28 D - 58511 Ldenscheid www.fischerelektronik.de
Tel.: +49 (0) 23 51 / 4 35-0 Fax: +49 (0) 23 51 / 4 57 54 www.facebook.de/fischerelektronik D4 N
A
Segment cooling aggregates

A-Type B-Type
84
B 48

62
42

,7
58,5
35

6,5
C 58,5
[mm WS ] [PA]
170 9 90
129 Y 35 [INCHES H2 O]

p
105 38 8 80
30

60 Hz
7 70 50 Hz

D
25
6 60
20
5 50

4 40

119
105
129

15
86

3 30
10

2 20

E 1 10
05

20 40 60 80 100 [CFM]
0
0 20 40 60 80 100 120 140 160 180 200
.
[m33/h]
VV[m /h]

7,5
1,5

X
6,2 0 0,5 1 1,5 2 2,5
.
3
100 V [m 3 3 /min]
/min]
V [m
F art. no. L [mm] dim. [mm] art. no. L [mm] dim. [mm]
X Y X Y
LA 1 01 ... 35.0 26.0 88.6 LA 1 06 ... 217.5 208.5 271.1
LA 1 02 ... 71.5 62.5 125.1 LA 1 07 ... 254.0 245.0 307.6
LA 1 03 ... 108.0 99.0 161.6 LA 1 08 ... 290.5 281.5 344.1
G
LA 1 04 ... 144.5 135.5 198.1 LA 1 09 ... 327.0 318.0 380.6
LA 1 05 ... 181.0 172.0 234.6 LA 1 10 ... 363.5 354.5 417.1

... for A-types: please add an "A", for B-types: please add a "B".
L: unit lengths of the segments incl. insulation; X: mounting distance; Y: length of the cooling aggregate incl. fan
H
24 V DC fan on request
In case of order please use order form.
segments also available in meter length:
art. no. for A-type: LA 1 1000 A; art. no. for B-type: LA 1 1000 B
Other fan types and fan voltages on request.
I
Technical data of the fans

... 230
type ebmpapst, ball bearing
K dimensions 119x119x38 mm
tension 230 V AC
power inout 19 W
max. air volume 160 m3/h
temperature range -40C... +85C
L noise level 47 dB(A)
speed 2,650 min-1
weight 550 g
failure rate (L10) L10 < 37,500 h (40C)
M

Miniature cooling aggregates D 9 11 Order example D2

Protection grid for axial fans D 36 Order form D34
N D5 Thermal conductive material E 2 29 Mounting parts for heatsinks E 49 50
Heatsinks with hollow fin profile D 30 Technical introduction A28
 A
Thermal resistance LA 1

The thermal resistance in the following diagrams is given on the base of a total dissipation of 40 Watt per heatsink of the
A-type. When using B-types this value increases by 3 %. B
K/W
1. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A.
Total dissipation 160 W.

K/W
2. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A and 2 x 1 heatsink LA 1 - 2 A. D
Total dissipation 320 W.

E
K/W
3. Cooling aggregate consisting of 4 heatsinks LA 1 - 1 A, 2 heatsinks
LA 1 - 2 A and 2 x 1 heatsink LA 1 - 4 A. Total dissipation 640 W.
F

K/W G
4. Cooling aggregate consisting of 6 heatsinks LA 1 - 1 A, 3 heatsinks
LA 1 - 2 A and 2 x 1 heatsink LA 1 - 6 A. Total dissipation 960 W.

H
K/W
5. Cooling aggregate consisting of 8 heatsinks LA 1 - 1 A, 4 heatsinks LA 1 - 2 A,
2 heatsinks LA 1 - 4 A and 1 heatsink LA 1 - 8 A. Total dissipation 1280 W.
I

K
K/W
6. Cooling aggregate consisting of 10 heatsinks LA 1 1 A, 2 heatsinks LA 1 5 A,
and 2 x 1 heatsink LA 1 10 A. Total dissipation 1600 W.

Miniature cooling aggregates D 9 11 Order example D2

Protection grid for axial fans D 36 Order form D34
Thermal conductive material E 2 29 Mounting parts for heatsinks E 49 50 D6 N
Heatsinks with hollow fin profile D 30 Technical introduction A28
A
Segment cooling aggregates
72,5
22
B 33,8

45,5
30

C
148
Y
100 38

D
100

92
72

E .
V [m3/h]
75 X 5
M4
.
V [m3/min]

art. no. L [mm] dim. [mm] art. no. L [mm] dim. [mm]
F X Y X Y
LA 2 01 ... 35.0 54.2 92.0 LA 2 06 ... 217.5 236.7 274.5
LA 2 02 ... 71.5 90.7 128.5 LA 2 07 ... 254.0 273.2 311.0
LA 2 03 ... 108.0 127.2 165.0 LA 2 08 ... 290.5 309.7 347.5
G LA 2 04 ... 144.5 163.7 201.5 LA 2 09 ... 327.0 346.2 384.0
LA 2 05 ... 181.0 200.2 238.0 LA 2 10 ... 363.5 382.7 420.5

L: unit lengths of the segments incl. insulation; X: mounting distance; Y: length of the cooling aggregate incl. fan

24 V DC fan on request
H In case of order please use order form.
segments also available in meter length: art. no. for A-type: LA 1 1000 A; art. no. for B-type: LA 2 1000 B
Other fan types and fan voltages on request.

Technical data of the fans

I ... 230
type ebmpapst, ball bearing
dimensions 92x92x38 mm
tension 230 V AC

K power inout 12 W
max. air volume 75 m3/h
temperature range -40C... +75C
noise level 37 dB(A)
speed 2,700 min-1
L weight 420 g
failure rate (L10) L10 < 52,500 h (40C)

Miniature cooling aggregates D 9 11 Order example D2

Protection grid for axial fans D 36 Order form D34
N D7 Thermal conductive material E 2 29 Mounting parts for heatsinks E 49 50
Heatsinks with hollow fin profile D 30 Technical introduction A28
 A
Thermal resistance LA 2

The thermal resistance in the following diagrams is given on the base of a total dissipation of 40 Watt per heatsink of the
A-type. B
K/W
1. Cooling aggregate consisting of 4 heatsinks LA 2 - 1. Total dissipation 160 W
maximal.

K/W
2. Cooling aggregate consisting of 4 heatsinks LA 2 - 1 and 2 x 1 heatsink LA 2 - 2.
D
Total dissipation 320 W.

K/W
3. Cooling aggregate consisting of 4 heatsinks LA 2 - 1, 2 heatsinks LA 2 - 2
and 2 x 1 heatsink LA 2 - 4. Total dissipation 640 W.
F

K/W
G
4. Cooling aggregate consisting of 6 heatsinks LA 2 - 1, 3 heatsinks LA 2 - 2
and 2 x 1 heatsink LA 2 - 6. Total dissipation 960 W.

K/W
5. Cooling aggregate consisting of 8 heatsinks LA 2 - 1, 4 heatsinks LA 2 - 2, 2
heatsinks LA 2 - 4 and 1 heatsink LA 2 - 8. Total dissipation 1280 W. I

K/W
6. Cooling aggregate consisting of 10 heatsinks LA 2 - 1, 2 heatsinks LA 2 - 5,
and 2 x 1 heatsink LA 2 - 10. Total dissipation 1600 W.
L

Miniature cooling aggregates D 9 11 Order example D2

Protection grid for axial fans D 36 Order form D34
Thermal conductive material E 2 29 Mounting parts for heatsinks E 49 50 D8 N
Heatsinks with hollow fin profile D 30 Technical introduction A28
A
Miniature cooling aggregates
made for dissipation of high power within a very small space
approximate length is optimised to the fan motor
B slide-nut channels for M3 nuts for mounting the transistors and circuit boards
other fan types and fan voltages on request
art. no.
75
50

3,5
1

4
C 25

140 mm

75
50
15
0,3 K/W

3,1
D

5,5
LAM 1
art. no.
E 50
32

3,5
1

4
13

F
32
50

11
100 mm
0,73 K/W

3,1
5,5
LAM 2
surface: natural colour anodised
G
Technical data of the fans

LAM 1 LAM 2
type ebmpapst 612 NHH-118 ebmpapst 412 F
H dimensions 60x60x25 mm 40x40x10 mm
tension 12 V DC 12 V DC
power inout 2.9 W 0.7 W
max. air volume 56 m3/h 8 m3/h
temperature range -20C... +70C -20C... +70C
I noise level 41 dB(A) 22.1 dB(A)
speed 6,800 min-1 5,400 min-1
weight 66 g 17 g
failure rate (L10) L10 < 60,000 h (40C) L10 < 45,000 h (20C)
K

Retaining springs for transistors A 115 117 Fluid coolers A 131 133
Special heatsink design A 137 138 Protection grid for axial fans D 36
N D9 Hollow-fin cooling aggregates D 15 25 Thermally conductive foil E 5 15
High capacity cooling aggregat. D 26 35 Technical introduction A28
 A
Miniature cooling aggregates
compact design
homogeneous heat dissipation
mounting possible on any side B
powerful axial-fan motor
other lengths, special designs and processing according to customers requirements
other surfaces treatment, fan types and fan voltages on request
art. no. 0,15 4 x
3 Rth [K/W]
1,6 C
1,4

24
30
1,2

3
5 V DC
1,0
12 V DC
0,8
24
LAM 3 ... 30 10 25 50 75 100 125 150 [mm]
please indicate: ... ... fan type D
50 75 100 125 150 mm 5 = 5 V DC
12 = 12 V DC
surface: natural colour anodised

with grooves for lock-in retaining spring for transistors THFU A 119
compact design
E
homogeneous heat dissipation
mounting possible on any side
powerful axial-fan motor
other lengths, special designs and processing according to customers requirements
other surfaces treatment, fan types and fan voltages on request
0,15 2 x
F
art. no. 3
Rth [K/W]
0,1 2 x

1,6
1,4
30
24

1,2
20

5 V DC
1,0

24
0,8
12 V DC
G
LAM 3 K ...
3

30 10 25 50 75 100 125 150 [mm]

please indicate: ... ... fan type
50 75 100 125 150 mm 5 = 5 V DC
12 = 12 V DC
surface: natural colour anodised H
Technical data of the fans

... 5 ... 12
type Sepa, ball bearing Sepa, ball bearing
dimensions 30x30x10 mm 30x30x10 mm
I
tension 5 V DC 12 V DC
max. air volume 6.8 m3/h 7.7 m3/h
cur. consumpt. 130 mA 70 mA
temperature range -10C... +70C -10C... +70C K
noise level 21 dB(A) 23 dB(A)
speed 8,500 min-1 9,100 min-1
weight 8g 8g
failure rate (L10) L10 < 95,000 h (20C) L10 < 95,000 h (20C)
MTBF < 280,000 h (20C) MTBF < 280,000 h (20C) L

Retaining springs for transistors A 115 117 Fluid coolers A 131 133
Special heatsink design A 137 138 Protection grid for axial fans D 36
Hollow-fin cooling aggregates D 15 25 Thermally conductive foil E 5 15 D 10 N
High capacity cooling aggregat. D 26 35 Technical introduction A28
A
Miniature cooling aggregates
compact design
homogeneous heat dissipation
B mounting possible on any side
powerful axial-fan motor
other lengths, special designs and processing according to customers requirements
other surfaces treatment, fan types and fan voltages on request
art. no. 0,15 4 x Rth [K/W]
3
C 1,6
1,4
1,2

32
40

40
1,0 5 V DC

3
0,8 12 V DC
0,6 24 V DC
32 0,4
40 20 25 50 75 100 125 150 [mm]
D LAM 4 ... (25)

please indicate: ... ... fan type

50 75 100 125 150 mm 5 = 5 V DC
12 = 12 V DC
24 = 24 V DC

E surface: natural colour anodised

with grooves for lock-in retaining spring for transistors THFU A 119
compact design
homogeneous heat dissipation
mounting possible on any side
F

powerful axial-fan motor
other lengths, special designs and processing according to customer's requirements
other surfaces treatment, fan types and fan voltages on request
art. no.
0,15 2 x Rth [K/W]
3
1,6
0,1 2 x

G 1,4
1,2
40
32
40

1,0 5 V DC
26,5
3

0,8 12 V DC
0,6 24 V DC
32 20 0,4
40 (25) 25 50 75 100 125 150 [mm]
LAM 4 K ...
H please indicate: ... ... fan type
50 75 100 125 150 mm 5 = 5 V DC
12 = 12 V DC
24 = 24 V DC
surface: natural colour anodised
I
Technical data of the fans

... 5 ... 12 ... 24

type ebmpapst 405 ebmpapst 412 JHH ebmpapst 414 JHH
dimensions 40x40x20 mm 40x40x25 mm 40x40x25 mm
K tension 5 V DC 12 V DC 24 V DC
power inout 0.9 W 3.3 W 3.6 W
max. air volume 10 m3/h 24 m3/h 24 m3/h
temperature range -20C... +70C -20C... +60C -20C... +60C
L noise level 18 dB(A) 46 dB(A) 46 dB(A)
speed 6,000 min-1 13,000 min-1 13,000 min-1
weight 27 g 50 g 50 g
failure rate (L10) L10 < 50,000 h (40C) L10 < 57,500 h (40C) L10 < 57,500 h (40C)
L10 < 20,000 h (tmax) L10 < 35,000 h (tmax) L10 < 35,000 h (tmax)
M

Retaining springs for transistors A 115 117 Fluid coolers A 131 133
Special heatsink design A 137 138 Protection grid for axial fans D 36
N D 11 Hollow-fin cooling aggregates D 15 25 Thermally conductive foil E 5 15
High capacity cooling aggregat. D 26 35 Technical introduction A28
 A
Miniature cooling aggregates
compact design
homogeneous heat dissipation
mounting possible on any side B
powerful axial-fan motor
other lengths, special designs and processing according to customers requirements
other surfaces treatment, fan types and fan voltages on request
art. no. 0,15 4 x Rth [K/W]
4,5
1,4
1,2 C
1,0

42
50

50
0,8 5 V DC

4,5
0,6 12 V DC
0,4
24 V DC
0,2
42
50 10
LAM 5 ... (15) 25 50 75 100 125 150 [mm]
D
please indicate: ... ... fan type
50 75 100 125 150 mm 5 = 5 V DC
12 = 12 V DC
24 = 24 V DC
surface: natural colour anodised
E
with grooves for lock-in retaining spring for transistors THFU A 119
compact design
homogeneous heat dissipation
mounting possible on any side
powerful axial-fan motor
other lengths, special designs and processing according to customers requirements F
other surfaces treatment, fan types and fan voltages on request
art. no. 4,5
0,2 4 x Rth [K/W]
1,4
1,2
1,0
G
50
42
50

0,8 5 V DC
4,5

27,1

0,6 12 V DC
0,4
24 V DC
0,2
42 10
LAM 5 K ... 50 (15) 25 50 75 100 125 150 [mm]
please indicate: ... ... fan type
50 75 100 125 150 mm 5 = 5 V DC H
12 = 12 V DC
24 = 24 V DC
surface: natural colour anodised

Technical data of the fans I

... 5 ... 12 ... 24
type Sepa, ball bearing Sepa, ball bearing ebmpapst
dimensions 50x50x10 mm 50x50x10 mm 50x50x15 mm
tension 5 V DC 12 V DC 24 V DC K
max. air volume 10 m3/h 14.3 m3/h 20 m3/h
temperature range -10C... +70C -10C... +70C -20C... +70C
speed 3,400 min-1 4,800 min-1 5,000 min-1
noise level 17 dB(A) 22 dB(A) 30 dB(A)
weight 19 g 19 g 27 g L
failure rate (L10) L10 < 95,000 h (20C) L10 < 95,000 h (20C) L10 50,000 h (20C)
MTBF < 280,000 h (20C) MTBF < 280,000 h (20C)
alarm output with with

Retaining springs for transistors A 115 117 Fluid coolers A 131 133
Special heatsink design A 137 138 Protection grid for axial fans D 36
Hollow-fin cooling aggregates D 15 25 Thermally conductive foil E 5 15 D 12 N
High capacity cooling aggregat. D 26 35 Technical introduction A28
A
Cooling aggregates with axial fan
Heatsink-cooling aggregates
with grooves for lock-in retaining springs THFU A 119
B screw-in solder pin M 3 (art. no.: ELS 3)
different lengths, special designs and machinings according to customer specifications
different surfaces, fan types and fan voltages upon request
75,5
art. no. 50 12 V DC
Rth [K/W]
24 V DC

C 2,0

1,6

65,8
50
1,2

0,8

29,5
0,4

D 50
LA 27 K ... 57,5 50 100 150 200 [mm]

please indicate: ... ... fan type

50 75 84 94 100 125 150 mm 12 = 12 V DC
24 = 24 V DC

E
Technical data of the fans

... 12 ... 24
type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 60x60x25 mm 60x60x25 mm
F tension 12 V DC 24 V DC
power inout 2.9 W 2.9 W
max. air volume 56 m3/h 56 m3/h
temperature range -20C... +70C -20C... +70C
noise level 41 dB(A) 41 dB(A)
G
speed 6,800 min-1 6,850 min-1
weight 66 g 66 g
failure rate (L10) L10 < 60,000 h (40C) L10 < 60,000 h (40C)

Cooling aggreg. in segment mount. D57 Extruded heatsinks A 22 83

Miniature cooling aggregates D 9 11 Cooling aggregates with radial fan D 33 35
N D 13 Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
Thermal conductive material E 2 29 Technical introduction A28
 A
Cooling aggregates with axial fan
Heatsink-cooling aggregates
especially suitable for IGBT, SSR, semiconductor modules, high performance transistors etc.
effective construction with axial fans B
good thermal performance
additional machining according to customer's instructions
cooling aggregates also available without fans
other fan types and fan voltages on request
art. no. C
55
Rth [K/W]

8
1,0

119
105
0,8

0,6
D
0,4
230 V AC
0,2 24 V DC

105
LA 4 ... 119 50 100 150 [mm]

art. no.
Rth [K/W] E
1,0

2
0,8
116

0,6

10,5
F
57

0,4
230 V AC
0,2 24 V DC

112 50 100 150 [mm]

LA 5 ... * for one segment
please indicate: ... ... fan type
75 100 150 mm 24 = 24 V DC G
230 = 230 V AC

Technical data of the fans

... 24 ... 230

H
type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 119x119x38 mm 119x119x38 mm
tension 24 V DC 230 V AC
power inout 11 W 19 W
max. air volume 237 m3/h 160 m3/h I
temperature range -30C ... +70C -40C... +85C
noise level 57 dB(A) 47 dB(A)
speed 4,400 min-1 2,650 min-1
weight 390 g 550 g
failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C) K

Cooling aggreg. in segment mount. D57 Extruded heatsinks A 22 83

Miniature cooling aggregates D 9 11 Cooling aggregates with radial fan D 33 35
Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30 D 14 N
Thermal conductive material E 2 29 Technical introduction A28
A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
geometry of hollow fin opimising the air flow
B particularly effective heat dissipation
compact construction
milled flat semiconductor mounting surface
other fan types and fan voltages on request
art. no. 0,1 100
12 V DC
Rz10
C Rth [K/W]
24 V DC

0,30

11,5 0,5
0,25

74 0,5

1,2
1,2
50
0,20

0,15

D 0,10
50
62 0,5 100 200 300 [mm]
LA 6 ... without air flow chamber
art. no. Rz10 0,1 100 12 V DC
Rth [K/W]
24 V DC
E 0,25

0,20
74 0,5

0,15

0,10

0,05

1,2
1,4
125 0,5 100 200 300 [mm]
LA 7 ... without air flow chamber
art. no. Rz10 0,1 100
12 V DC
Rth [K/W]
24 V DC
0,25

G 0,20
74 0,5

0,15

0,10

0,05

188 0,5 100 200 300 [mm]

H LA 8 ... without air flow chamber

please indicate: ... ... fan type
100 150 200 250 300 mm 12 = 12 V DC
24 = 24 V DC

I Technical data of the fans

... 12 ... 24
type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 60x60x25 mm 60x60x25 mm
tension 12 V DC 24 V DC
K power inout 2.9 W 2.9 W
max. air volume 56 m3/h 56 m3/h
temperature range -20C... +70C -20C... +70C
noise level 41 dB(A) 41 dB(A)
L speed 6,800 min-1 6,850 min-1
weight 66 g 66 g
failure rate (L10) L10 < 60,000 h (40C) L10 < 60,000 h (40C)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
N D 15 Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24
High capacity heatsinks A 57 58 Technical introduction A28
 A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
geometry of hollow fin optimising the air flow
particularly effective heat dissipation B
compact construction
milled flat semiconductor mounting surface
other fan types and fan voltages on request
art. no. Rz10 0,1 100 Rth [K/W]
12 V DC

0,30
24 V DC
C
0,25

11,5 0,5

74 0,5
74 0,5
0,20

50

60
0,15

0,10

50 100 200 300 [mm]

D
62 0,5 25 30
LA V 6 ... with air flow chamber
art. no. 0,1 100 Rth [K/W] 12 V DC
Rz10 24 V DC
0,20

0,16 E
0,12
74 0,5

0,08

0,04

100 200 300 [mm]

LA V 7 ...
125 0,5
F
with air flow chamber
art. no. 0,1 100 12 V DC
Rz10 Rth [K/W]
24 V DC
0,12

0,10

0,08 G
74 0,5

0,06

0,04

188 0,5 100 200 300 [mm]

LA V 8 ... with air flow chamber

H
please indicate: ... ... fan type
100 150 200 250 300 mm 12 = 12 V DC
24 = 24 V DC

Technical data of the fans

I
... 12 ... 24
type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 60x60x25 mm 60x60x25 mm
tension 12 V DC 24 V DC
power inout 2.9 W 2.9 W K
max. air volume 56 m3/h 56 m3/h
temperature range -20C... +70C -20C... +70C
noise level 41 dB(A) 41 dB(A)
speed 6,800 min-1 6,850 min-1
weight 66 g 66 g
L
failure rate (L10) L10 < 60,000 h (40C) L10 < 60,000 h (40C)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24 D 16 N
High capacity heatsinks A 57 58 Technical introduction A28
A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
geometry of hollow fin opimising the air flow
B particularly effective heat dissipation
compact construction
milled flat semiconductor mounting surface
other fan types and fan voltages on request
art. no. 0,1 100 Rth [K/W]
Rz10
C 0,30

0,5
0,25

11,5
0,20

0,5
230 V AC
0,15

83
24V DC
0,10
0,05
D +1
80 0,5 100 200 300 [mm]

LA 9 ... without air flow chamber

art. no. 0,5 Rz10 0,1 100 Rth [K/W]

0,20
11

0,18
E

0,5
0,14

83
0,10
230 V AC
0,06 24 V DC
0,02
+1,5
160 1 100 200 300 [mm]
LA 10 ... without air flow chamber
F
0,5

art. no.
Rth [K/W]
0,1 100
10

Rz10
0,12

0,10

0,08
0,5
G 83 0,06
0,04
230V AC
24V DC

+2 100 200 300 [mm]

240 0,5
LA 11 ... without air flow chamber
please indicate: ... ... fan type
H 100 150 200 250 300 mm 24 = 24 V DC
230 = 230 V AC

Technical data of the fans

... 24 ... 230

I type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 80x80x32 mm 80x80x38 mm
tension 24 V DC 230 V AC
power inout 6W 12 W
K max. air volume 80 m3/h 50 m3/h
temperature range -20C... 75C -40C... +90C
noise level 48 dB(A) 31 dB(A)
speed 5,000 min-1 2,800 min-1
weight 170 g 490 g
L failure rate (L10) L10 < 55,000 h (40C) L10 < 52,500 h (40C)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
N D 17 Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24
High capacity heatsinks A 57 58 Technical introduction A28
 A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
geometry of hollow fin optimising the air flow
particularly effective heat dissipation B
compact construction
milled flat semiconductor mounting surface
other fan types and fan voltages on request
art. no. Rz10 0,1 100
Rth [K/W]
0,30 C
0,25

83 0,5
11,5 0,5

83 0,5
0,20

80
0,15 230 V AC
0,10 24 V DC
+1
80 0,5
38 30 100 200 300 [mm]
D
LA V 9 ... with air flow chamber
art. no. Rz10 0,1 100 Rth [K/W]
0,25

0,20
E
11 0,5

83 0,5
0,15

0,10 230 V AC
24 V DC
0,05

+1,5
160 1 100 200 300 [mm]
LA V 10 ... with air flow chamber
art. no. 0,1 100 Rth [K/W]
F
Rz10
0,12

0,10

0,08
10 0,5

83 0,5
0,06 230 V AC
0,04 24 V DC G
+2
240 0,5 100 200 300 [mm]
LA V 11 ... with air flow chamber
please indicate: ... ... fan type
100 150 200 250 300 mm 24 = 24 V DC
230 = 230 V AC H
Technical data of the fans

... 24 ... 230

type ebmpapst, ball bearing ebmpapst, ball bearing I
dimensions 80x80x32 mm 80x80x38 mm
tension 24 V DC 230 V AC
power inout 6W 12 W
max. air volume 80 m3/h 50 m3/h
temperature range -20C... 75C -40C... +90C K
noise level 48 dB(A) 31 dB(A)
speed 5,000 min-1 2,800 min-1
weight 170 g 490 g
failure rate (L10) L10 < 55,000 h (40C) L10 < 52,500 h (40C)
L

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24 D 18 N
High capacity heatsinks A 57 58 Technical introduction A28
A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
extremly low losses due to optimised hollow fin geometry
B particularly effective heat dissipation
compact design with axial fan
milled flat semiconductor mounting surface
addtional design to customer's intructions
other fan types and fan voltages on request

C art. no. Rz10 0,1 100

Rth [K/W]
0,25

0,20

0,5
0,5
0,15

15
120
0,10 230V AC
D 0,05
24V DC

0,8 100 200 300 [mm]

120
LA 14 ... without air flow chamber
art. no. Rz10 0,1 100 Rth [K/W]
E 0,10

0,08
0,5

0,06

0,5
120

230V AC

15
0,04
24V DC

F 0,02

+1,4 100 200 300 [mm]

240 -1,2
LA 15 ... without air flow chamber
please indicate: ... ... fan type
100 150 200 250 300 400 mm 24 = 24 V DC
G 230 = 230 V AC

Technical data of the fans

... 24 ... 230

H type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 119x119x38 mm 119x119x38 mm
tension 24 V DC 230 V AC
power inout 11 W 19 W
max. air volume 237 m3/h 160 m3/h
I temperature range -30C ... +70C -40C... +85C
noise level 57 dB(A) 47 dB(A)
speed 4,400 min-1 2,650 min-1
weight 390 g 550 g
failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C)
K

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
N D 19 Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24
High capacity heatsinks A 57 58 Technical introduction A28
 A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
extremly low losses due to optimised hollow fin geometry
particularly effective heat dissipation B
compact design with axial fan
milled flat semiconductor mounting surface
addtional design to customer's intructions on request
other fan types and fan voltages on request
art. no. C

15 0,5
Rz10 0,1 100
Rth [K/W]

0,25

0,20

120 0,5
120 0,5

119
0,15

0,10
230 V AC
D
0,05 24 V DC

100 200 300 [mm]

120 0,8 38 30

LA V 14 ... with air flow chamber

art. no.
E
15 0,5

Rz10 0,1 100

Rth [K/W]

0,10

0,08

120 0,5
0,06

230 V AC
F
0,04
24 V DC
0,02

100 200 300 [mm]

+1,4
240 1,2
LA V 15 ... with air flow chamber G
please indicate: ... ... fan type
100 150 200 250 300 400 mm 24 = 24 V DC
230 = 230 V AC

Technical data of the fans H

... 24 ... 230
type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 119x119x38 mm 119x119x38 mm
tension 24 V DC 230 V AC
power inout 11 W 19 W
I
max. air volume 237 m3/h 160 m3/h
temperature range -30C ... +70C -40C... +85C
noise level 57 dB(A) 47 dB(A)
speed 4,400 min-1 2,650 min-1 K
weight 390 g 550 g
failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24 D 20 N
High capacity heatsinks A 57 58 Technical introduction A28
A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
extremly low losses due to optimised hollow fin geometry
B effective heat dissipation
compact construction with axial fans
two oposite mounting surfaces are milled flat
additional treatment upon customer's request
other fan types and fan voltages on request

C art. no. Rz10 0,1 100 Rth [K/W]

0,15

0,12

0,5
0,09

0,5

10
230 V AC

120
0,06
24 V DC
D 0,03

0,5
100 200 300 [mm]

10
Rz10
0,1 100
0,8
122
LA 17 ... without air flow chamber
E art. no. 0,1 100
Rz10 Rth [K/W]

0,07

0,06

10 0,5
0,5

0,05
F 230 V AC
120

0,04

0,03
24 V DC
0,02

10 0,5
Rz10
0,1 100 100 200 300 [mm]
1,5
243
G LA 18 ... without air flow chamber
please indicate: ... ... fan type
100 150 200 250 300 400 mm 24 = 24 V DC
230 = 230 V AC

H Technical data of the fans

... 24 ... 230

type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 119x119x38 mm 119x119x38 mm
I tension 24 V DC 230 V AC
power inout 11 W 19 W
max. air volume 237 m3/h 160 m3/h
temperature range -30C ... +70C -40C... +85C
noise level 57 dB(A) 47 dB(A)
K speed 4,400 min-1 2,650 min-1
weight 390 g 550 g
failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
N D 21 Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24
High capacity heatsinks A 57 58 Technical introduction A28
 A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
extremly low losses due to optimised hollow fin geometry
effective heat dissipation B
compact construction with axial fans
two oposite mounting surfaces are milled flat
additional treatment upon customer's request
other fan types and fan voltages on request
art. no. Rz10 0,1 100
Rth [K/W]
C
0,15

10 0,5
0,12

120 0,5

120 0,5
119
0,09

0,06 230 V AC
D

10 0,5
24 V DC
0,03

Rz10
0,1 100 100 200 300 [mm]
38 30
122 0,8
LA V 17 ... with air flow chamber
art. no. E
119

F
38 30

Rz10 0,1 100 Rth [K/W]

0,06

0,05

G
10 0,5

0,04 230 V AC
0,5

0,03
120

24 V DC
0,02

0,01
10 0,5

Rz10
300 [mm]

243 1,5
0,1 100 100 200
H
LA V 18 ... with air flow chamber
please indicate: ... ... fan type
100 150 200 250 300 400 mm 24 = 24 V DC
230 = 230 V AC
I
Technical data of the fans

... 24 ... 230

type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 119x119x38 mm 119x119x38 mm K
tension 24 V DC 230 V AC
power inout 11 W 19 W
max. air volume 237 m3/h 160 m3/h
temperature range -30C ... +70C -40C... +85C
noise level 57 dB(A) 47 dB(A) L
speed 4,400 min-1 2,650 min-1
weight 390 g 550 g
failure rate (L10) L10 < 70,000 h (40C) L10 < 37,500 h (40C)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24 D 22 N
High capacity heatsinks A 57 58 Technical introduction A28
A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
extremly low losses due to optimised hollow fin geometry
B effective heat dissipation
compact construction with axial fans
two oposite mounting surfaces are milled flat
additional treatment upon customer's request
other fan types and fan voltages on request

C art. no. Rz10 0,1 100 Rth [K/W]

9,5 0,5
0,20

0,16

93 0,5
0,12

9,5 0,5
230 V AC
0,08 24 V DC

Rz10 100 200 300 [mm]

0,1 100
92 0,8
LA 21 ... without air flow chamber
E art. no. Rz10 0,1 100
Rth [K/W]

0,15

0,12

0,5
0,5

9
0,09
93

230 V AC
F 0,06
24 V DC

0,03
Rz10
0,5
0,1 100 100 200 300 [mm]
184 1,25 9
LA 22 ... without air flow chamber
G please indicate: ... ... fan type
100 150 200 250 300 400 mm 24 = 24 V DC
230 = 230 V AC

Technical data of the fans

H ... 24 ... 230
type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 92x92x32 mm 92x92x38 mm
tension 24 V DC 230 V AC

I power inout 5W 12 W
max. air volume 107 m3/h 75 m3/h
temperature range -20C... 75C -40C... +75C
noise level 47 dB(A) 37 dB(A)
speed 4,000 min-1 2,700 min-1
K weight 190 g 420 g
failure rate (L10) L10 < 57,500 h (40C) L10 < 52,500 h (40C)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
N D 23 Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24
High capacity heatsinks A 57 58 Technical introduction A28
 A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
extremly low losses due to optimised hollow fin geometry
effective heat dissipation B
compact construction with axial fans
two oposite mounting surfaces are milled flat
additional treatment upon customer's request
other fan types and fan voltages on request
art. no. Rz10
0,1 100 Rth [K/W]
0,20
C

0,5
9,5
0,16

0,5

92
0,12

93
D

0,5
0,08 230 V AC
24 V DC

9,5
Rz10
0,1 100 32 30 100 200 300 [mm]
0,8 (38)
92
LA V 21 ... with air flow chamber
art. no.
E
92

32
30
(38)
0,1 100
F
Rz10 Rth [K/W]

0,15

0,12
0,5

0,5

0,09
93

G
9

230 V AC
0,06
24 V DC
0,03
Rz10
0,5

0,1 100
100 200 300 [mm]
9

1,25
184
LA V 22 ... with air flow chamber
please indicate: ... ... fan type
H
100 150 200 250 300 400 mm 24 = 24 V DC
230 = 230 V AC

Technical data of the fans

I
... 24 ... 230
type ebmpapst, ball bearing ebmpapst, ball bearing
dimensions 92x92x32 mm 92x92x38 mm
tension 24 V DC 230 V AC
power inout 5W 12 W K
max. air volume 107 m3/h 75 m3/h
temperature range -20C... 75C -40C... +75C
noise level 47 dB(A) 37 dB(A)
speed 4,000 min-1 2,700 min-1
weight 190 g 420 g
L
failure rate (L10) L10 < 57,500 h (40C) L10 < 52,500 h (40C)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24 D 24 N
High capacity heatsinks A 57 58 Technical introduction A28
A
Cooling aggregates with axial fan
Hollow-fin cooling aggregates
extremly low losses due optimised hollow fin geometry
B especially effective heat dissipation
compact construction with axial fans
two oposite mounting surfaces are miled flat
additional treatment upon customer's request
other fan types and fan voltages on request

C art. no. Rz10 0,1 100

Rth [K/W]

12 0,5
0,08
0,07
0,06

12 0,5
0,05

150
158 0,5
0,04
230 V AC
D 0,03
24 V DC
0,02
0,01

Rz10 200 300 400 500 [mm]

0,1 100
1 38 30
155
E LA V 24 ... with air flow chamber
(55)

please indicate: ... ... fan type

200 300 400 mm 24 = 24 V DC
230 = 230 V AC

F Technical data of the fans

... 24 ... 230

type ebmpapst, ball bearing, with grid ebmpapst, ball bearing, with grid
dimensions 150x38 mm 150x55 mm
G tension 24 V DC 230 V AC
power inout 19 W 47 W
max. air volume 420 m3/h 380 m3/h
temperature range -25C... +72C -30C... +60C
noise level 59 dB(A) 60 dB(A)
H speed 3,350 min-1 2,700 min-1
weight 620 g 1,100 g
failure rate (L10) L10 < 75,000 h (40C) L10 < 40,000 h (40C)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
N D 25 Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24
High capacity heatsinks A 57 58 Technical introduction A28
 A
Cooling aggregates with axial fan
High performance cooling aggregate
B

D
extremely low losses of air flow as compared to cooling aggregates with extruded aluminium
compact dimensions, that means high performance density due to large heat-conducting surfaces
maximum heat flow due to brazing or thermal adhesion
high performance cooling aggregates are only effective with forced ventilation by means of the fan, but not with free convection E
other fan types and fan voltages on request

material: solder-plated aluminium sheet, thus minimal weight due to the thickness of the material

An optimised unit for any application can be produced from the wide range of existing components upon request.
The specific capacity will be determined by a test run upon customers request. F
Technical data of the fans

... 230
type ebmpapst, ball bearing
G
dimensions 119x119x38 mm
tension 230 V AC
power inout 19 W
max. air volume 160 m3/h
temperature range -40C... +85C H
noise level 47 dB(A)
speed 2,650 min-1
weight 550 g
failure rate (L10) L10 < 37,500 h (40C)
I

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24 D 26 N
High capacity heatsinks A 57 58 Technical introduction A28
A
Cooling aggregates with axial fan
High performance cooling aggregate
B 150 mm v = 6 m/s LA HL 1 ... 3 v = 6 m/s
Rth [K/W] Rth [K/W]

0,18
0,100 + 0,096
0,14

119

115
0,075
C 0,050
+ 0,061 0,10
1
0,06 2
0,025 + 0, 28
0,02 3
1 2 3 50 100 150 200 250 [mm]
38 1050 max.

D art. no. 129 1

104,8 150 mm
Rz16 0,2 100
Rth [K/W]

0,18

0,14
E
115 1
104,8
0,10

ca. 6
0,06

0,02

1 2 3 4 5 6 v [m/s]
ca. 2 Rz16
0,2 100
F LA HL 1 ... without air flow chamber
art. no. 258 1
33,2
104,8 104,8
Rz16 0,2 100

G
115 1
104,8

ca. 6

H
ca. 2 Rz16
0,2 100
LA HL 2 ... without air flow chamber
art. no. 387 1,5
104,8 29,2
I Rz16 0,3 100
ca. 6
115 1
104,8

K
ca. 2 Rz16 0,3 100

LA HL 3 ... without air flow chamber

L please indicate: ...
100 150 200 250 300 400 mm

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
N D 27 Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24
High capacity heatsinks A 57 58 Technical introduction A28
 A
Cooling aggregates with axial fan
High performance cooling aggregate
150 mm v = 6 m/s LA HL V 1 ... 3 v = 6 m/s B
30
Rth [K/W] Rth [K/W]

0,18
0,100 + 0,09
0,14

119
0,075

115
+ 0,059 0,10
0,050
0,06
1 C
+ 0,027 2
0,025
0,02 3
1 2 3 50 100 150 200 250 [mm]
38 1050 max.

art. no. 129 1 D

104,8 150 mm
Rz16 0,2 100 Rth [K/W]

0,18

0,14

E
115 1
104,8

0,10

ca. 6
0,06

0,02

1 2 3 4 5 6
Rz16 v [m/s]
ca. 2 0,2 100

LA HLV 1 ... with air flow chamber

F
art. no. 258 1
33,2
104,8 104,8
Rz16 0,2 100

G
115 1
104,8

ca. 6

H
ca. 2 Rz16
0,2 100

LA HLV 2 ... with air flow chamber

art. no. 387 1,5
104,8 29,2
Rz16 0,3 100 I
ca. 6
115 1
104,8

ca. 2 Rz16 0,3 100

LA HLV 3 ... with air flow chamber

please indicate: ... L
100 150 200 250 300 400 mm

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24 D 28 N
High capacity heatsinks A 57 58 Technical introduction A28
A
Cooling aggregates with axial fan
High performance cooling aggregate
innovative, efficient heatsink design
B thick multiwall sheets for maximum heat dissipation
specially formed laminated structures ensure optimum heat exchange with the air flow
powerful mixed axial fan for highly effcient heat dissipation
reduced noise output achieved by an optimised adaption of fan and heatsink
additional treatment and modifications upon customer's request
double and triple versions upon request
C art. no. Rth [K/W]
0,10
0,08
0,06
12 V DC
0,04 24 V DC
0,02

D 0
100 200 300 [mm]
129 1
104,8
Rz16 0,2 100 30

115 1
104,8

119

115
ca. 6
Rz16 1050
0,2 100 max.
F LAHL D 1 ... ca. 2 38

please indicate: ... ... fan type

100 150 200 250 300 400 mm 12 = 12 V DC
24 = 24 V DC

G Technical data of the fans

... 12 ... 24
type ebmpapst, ball bearing, with grid ebmpapst, ball bearing, with grid
dimensions 119x119x38 mm 119x119x38 mm
H tension 12 V DC 24 V DC
power inout 21 W 19.5 W
max. air volume 310 m3/h 310 m3/h
temperature range -20C... +65C -20C... +65C
noise level 65 dB(A) 65 dB(A)
I speed 6,000 min-1 6,000 min-1
weight 390 g 390 g
failure rate (L10) L10 > 60,000 h (40C) L10 > 65,000 h (40C)
L10 > 37,500 h (tmax) L10 > 37,500 h (tmax)

Miniature cooling aggregates D 9 11 Special heatsink design A 137 138

Protection grid for axial fans D 36 Heatsinks with hollow fin profile D 30
N D 29 Drilling pattern for Solid State Relais A 12 Thermal conductive material E 2 24
High capacity heatsinks A 57 58 Technical introduction A28
 A
High-performance heatsinks
High performance heatsinks with hollow-fin profile
high performance heatsinks for fan operation
exclusively for forced convection B
preferably for radial or tangential fans
hollow fin geometry optimises the air flow
particularly effective heat dissipation
milled flat base (except length 1000 mm)
art. no. Rth [K/W] v = 5 m/s
C
0,08
8
0,07
0,06

84 0,5
0,05
0,04

64
0,03
0,02
D

17
0,01
Rz10 0,1 100
100 200 300 400
5,2
SK 497 ... 165 1 [mm]
art. no. Rth [K/W] v = 5 m/s
E
0,08
6,5
0,07
0,06

76 0,5
0,05
75 0,04

60
0,03
0,02
F
15

0,01
Rz10 0,1 100
5 100 200 300 400
SK 498 ... 215 1,2 [mm]

please indicate: ... ... surface

150 200 250 300 1000 mm SA = black anodised G
AL = raw degreased aluminium

v = 5 m/s
8,5 Rth [K/W]
0,08
H
0,07

0,06

0,05
A

71

0,04
SK 440
0,03 SK 458 I
SK 441
0,02
SK 461
C

0,01
B 6
100 200 300 [mm]

art. no. number of fins dim. [mm] K

A B C
SK 440 ... 15 84 1 200 1.2 16
SK 458 ... 19 84 1 250 1.4 16
SK 441 ... 23 84 1 300 1.6 16
SK 461 ... 31 88 1 400 2 20 L
please indicate: ... ... surface
150 200 300 1000 mm SA = black anodised
AL = raw degreased aluminium

High capacity cooling aggregat. D 26 29 Heatsink-cooling aggregates D 14

Cooling aggregates with radial fan D 33 35 Cooling aggreg. in segment mount. D5
Heatsinks with hollow fin profile D 30 31 Miniature cooling aggregates D 9 11 D 30 N
Hollow-fin cooling aggregates D 15 25 Technical introduction A28
A
High performance heatsinks with hollow-fin profile
high capacity heatsinks for fan operation preferably for radial- or tangential fan motors
universal modular design
B exclusively for forced convection
flow-optimized hollow fin geometry
minimum order quantity: 1000 kg, samples on request

112
81,5

23
20
70
62

D
52
43

5 5 5 5 5 5

art. no. number of fins dim. [mm]

E A
SK 603 ... 25 200
SK 604 ... 32 250
SK 605 ... 39 300
SK 606 ... 45 350
F SK 607 ... 52 400
SK 608 ... 65 500
please indicate: ... fin height ... ... surface
430 = 43 mm 200 300 400 500 mm SA = black anodised
520 = 52 mm ME = clear anodised
G 620 = 62 mm
700 = 70 mm
815 = 81.5 mm
1120 = 112 mm

SK 603
H Rth [K/W] v = 11 m/s

0,06

0,05

0,04
I 0,03
SK 603 430
SK 603 520
SK 603 620
0,02 SK 603 700
SK 603 815
0,01 SK 603 1120

100 150 200 250 300 350 400 450 500

K [mm]

SK 604
Rth [K/W] v = 11 m/s

0,05

L 0,04

0,03 SK 604 430

SK 604 520
0,02 SK 604 620
SK 604 700
SK 604 815
0,01 SK 604 1120

M 100 150 200 250 300 350 400 500

[mm]

High capacity cooling aggregat. D 26 29 Heatsink-cooling aggregates D 14

Cooling aggregates with radial fan D 33 35 Cooling aggreg. in segment mount. D5
N D 31 Heatsinks with hollow fin profile D 30 31 Miniature cooling aggregates D 9 11
Hollow-fin cooling aggregates D 15 25 Technical introduction A28
 A
High performance heatsinks with hollow-fin profile
SK 605
Rth [K/W] v = 11 m/s
B
0,040

0,035

0,030

0,025
C
0,020 SK 605 430
SK 605 520
0,015 SK 605 620
SK 605 700
SK 605 815
0,010 SK 605 1120
100 150 200 250 300 350 400 450 500
D
[mm]

SK 606
Rth [K/W] v = 11 m/s

0,035 E
0,030

0,025

0,020
SK 606 430
0,015 SK 606 520
SK 606 620
SK 606 700
F
0,01
SK 606 1120 SK 606 815
100 150 200 250 300 350 400 450 500
[mm]

SK 607
Rth [K/W] v = 11 m/s G
0,020

0,015 SK 607 430

SK 607 520
0,010 SK 607 620

0,005
SK 607 815
SK 607 1120
SK 607 700
H
200 250 300 350 400 450 500 550 600
[mm]

SK 608
Rth [K/W] v = 11 m/s I
0,016

0,014

0,012 K
0,010 SK 608 430
SK 608 520
0,008 SK 608 620
SK 608 700
0,006 SK 608 815
SK 608 1120
200 250 300 350 400 450 500 550 600
[mm]
L

High capacity cooling aggregat. D 26 29 Heatsink-cooling aggregates D 14

Cooling aggregates with radial fan D 33 35 Cooling aggreg. in segment mount. D5
Heatsinks with hollow fin profile D 30 31 Miniature cooling aggregates D 9 11 D 32 N
Hollow-fin cooling aggregates D 15 25 Technical introduction A28
A
Cooling aggregates with radial fan
High performance cooling aggregate
optimised air flow due to hollow fin geometrie
B very good thermal performance
optimized high performance construction with radial fan
milled flat mounting surface for semiconductor
cover plate for fin side upon request
additional customized treatment upon request
fan condenser: art. no. LAHLR K 2
C art. no. Rth [K/W]
0,10
0,08
0,06
0,04
0,02
D 100 200 300 400 500 600 [mm]

0,1 100

11 0,5
Rz10

165
E

83 0,5
160 +1,5 162 1000 max.
LA 25 ... 1

F art. no. Rth [K/W]

0,08
0,06
0,04
0,02

G 100 200 300 400 500 600 [mm]

17 0,5

Rz10 0,1 100

165
84 0,5

H
165 0,5 162 1000 max.
LA 26 ...
please indicate: ...
I 200 300 400 500 600 mm

Technical data of the fans

... 230
type ebmpapst, radial blower with grid, double sided absorbtion
K bearing type ball bearing
discharge air flow 435 m3/h
rotation speed 1,950 min-1
power inout 87 W
L current consumption 0.39 A
temperature range -25C... +40C
circuit voltage 230 V AC
motor condenser 2 F/400 V
noise level 58 dB(A)
M weight 1,500 g

Drilling pattern for Solid State Relais A 12 Miniature cooling aggregates D 9 12

Mounting for TO 3 angle A 125 128 heatsinks for Solid State Relais 135 136
N D 33 High capacity heatsinks A 57 58 Hole pattern A 21
Cooling aggreg. in segment mount. D57 Technical introduction A28
 A
Cooling aggregates with radial fan
High performance cooling aggregate
optimised air flow due to hollow fin geometrie
very good thermal performance B
optimized high performance construction with radial fan
milled flat mounting surface for semiconductor
cover plate for fin side upon request
additional customized treatment upon request
fan condenser: art. no. LA 20 K 6
art. no. Rth [K/W]
C
0,035

0,025

0,015
D
0,005

100 200 300 400 500 600 [mm]

276
E
27 1
Rz10 0,1 100

241
126 1,6

F
LA 20 ... 300 1,6
225 (1000 max.)

please indicate: ...

200 300 400 500 600 mm

Technical data of the fans G

... 230
bearing type ball bearing
type ebmpapst, radial blower with grid, double sided absorbtion
discharge air flow 1,310 m3/h
rotation speed
H
1,350 min-1
power inout 185 W
current consumption 0.81 A
circuit voltage 230 V AC
temperature range -25C... +70C I
motor condenser 6 F
noise level 64 dB(A)
weight 5,900 g

Drilling pattern for Solid State Relais A 12 Miniature cooling aggregates D 9 12

Mounting for TO 3 angle A 125 128 heatsinks for Solid State Relais 135 136
High capacity heatsinks A 57 58 Hole pattern A 21 D 34 N
Cooling aggreg. in segment mount. D57 Technical introduction A28
A
Cooling aggregates with radial fan
High performance cooling aggregate
other lengths upon request
B fan condenser: art. no. LAHLR K 2
art. no. Rth [K/W]

0,09

0,07

C
0,05

100 200 300 400 500 600 [mm]

D Rz16 0,5

165
70 1
LAHLR 1 500 170 1 162 500 2 max.

E construction: solid frame construction with inner animation and carrier plates, thermally connected by
soldering
weight: 6,300 g
material: aluminium alloy
surface: blanc, milled flat
F
Technical data of the fans

... 230
type ebmpapst, radial blower with grid, double sided absorbtion
G bearing type ball bearing
discharge air flow 435 m3/h
rotation speed 1,950 min-1
power inout 87 W
current consumption 0.39 A
H temperature range -25C... +40C
circuit voltage 230 V AC
motor condenser 2 F/400 V
noise level 58 dB(A)
weight 1,500 g
I

Drilling pattern for Solid State Relais A 12 Miniature cooling aggregates D 9 12

Mounting for TO 3 angle A 125 128 heatsinks for Solid State Relais 135 136
N D 35 High capacity heatsinks A 57 58 Hole pattern A 21
Cooling aggreg. in segment mount. D57 Technical introduction A28
 A
Protection grid for fans
protection against contact as per EN 294
aerodynamic contruction
minimized noise modification B
only low modification of the air flow
32 0,4 1,5 +0,3
0,8
29

4 +0,3 4,7 +1 C
art. no. suitable for cooling aggregate
LAGI 40 LAM 2/ LAM 4/ LAM 4 K
50 0,6 1,5 +0,3
1
53 D

4 +0,3 4,7 +1

art. no. suitable for cooling aggregate

LAGI 60 LAM 1/ LA (V) 6/ LA (V) 7/ LA (V) 8/ LA 27 K E
0,6
71,5
1,5 +0,3

1,2
75

F
4 + 0,3 4,7 +1

art. no. suitable for cooling aggregate

LAGI 80 LA (V) 9/ LA (V) 10/ LA (V) 11 G
82,5 0,6 +0,3
1,5

1,5
89

4 +0,3 4,7 +1

art. no. suitable for cooling aggregate I

LAGI 92 LA 2/ LA (V) 21/ LA (V) 22
104,8 0,8
1,5 +0,3

1,5
5,4
11 K

4 +0,3 4,7 +1
L
art. no. suitable for cooling aggregate
LAGI 119 LA 1/ LA 4/ LA 5/ LA (V) 14/ LA (V) 15/ LA (V) 17/ LA (V) 18/ LA HL (V) 1/ LA HL (V) 2/ LA HL (V) 3 /
LA HL D1
material: steel wire, nickel-plated M

High capacity cooling aggregat. D 26 29 Heatsink-cooling aggregates D 14

Cooling aggregates with radial fan D 33 35 Cooling aggreg. in segment mount. D5
Heatsinks with hollow fin profile D 30 Miniature cooling aggregates D 9 11 D 36 N
Hollow-fin cooling aggregates D 15 25 Technical introduction A28
 Thermal conductive material
Guide rails for PCBs
Mounting material for semiconductors-
Mounting material for
mechanical components

Thermal conductive material Guide rails for PCBs

large standard programme for thermal conductive pastes for horizontal and vertical assembly
and glues, silicone-, GEL-, and foam foils (Gap Filler), suitable for sheet thicknesses of 0.5 - 1.85 mm
cuts, tapes, tubes and caps with and without lock mechanism
thermal conductive electrically insulating foils slim an wide designs
customer specific productions made in our screwable and snapable versions, extractors with locking
in-house punching shop pin fixing
special designs upon request

Mounting material for semiconductors Mounting material for mechanical components

mounting disc for discrete devices such as transistors,
capacitors and LEDs
electrically insulating mounting of the transistors
simple and fast assembly
insulating clamping pins for various semiconductors for
increasing the dielectric strength
cover and insulating cap for transistors
distance bolts made of metal and plastics with inner or
outer thread
clamp mounting made of aluminium and plastics for
mounting the heatsinks and cases on the mounting rail
acc. to DIN EN 50022
anti-vibration device for minimizing the noise and
resonance
 A
Silicon-rubber insulating material for semiconductors

A: washer
F
B: insulating cap
C: insulating tube
D: cuts

Our thermal conduction wafers effect following advantages:

G
good surface contact as material is flexible
reduced production costs as a matter of mounting without thermal conducting paste (clean and fast)
spring-back of the elastic material protects the transistor against damage
free of any toxic substances
H
Customer specific versions:
punching and cuts of our thermal conductive foil according to drawing
sold per sheet or by the meter
other foils, plastics, papers, etc. upon request
I
The thermal details refer to an area of 1 inch2 (6.45 cm2).

Thermal conductive foil E 7 10 Heatsinks for PCB A 89 112

GEL thermal conductive foils E 12 15 Heatsinks for BGA B 17 20
Thermal conductive paste E 21 22 Extruded heatsinks A 22 83 E2 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Silicone rubber insulating material for semiconductors
other cuttings on request

B
2
2 x 3,1 2 2 x 2
2 x 4,2

10,9
28,2
29
11

11
36
5,5

5,5

4,2
R 10 16,9
R 14,5
2 x 1,5

30 R 18
30

2x2
R6 30
42
42
D 50

E 3,1 3,1
3,1
3,9

7,5
17,5
17,5

17,1
4

22
11
24
16,5
15 15 5,5 16
F 20,5 20,5
10
17,4
20
20

G
3

21 3,1
15
6
18

24
13,5

18
17

H
13 21
3,2

I
7,5 15 15 15 7,5 3,1
2,5
4

8
9
18
3,2

K 5,5 7,3

11 11
60

Thermal conductive foil E 7 10 Heatsinks for PCB A 89 112

GEL thermal conductive foils E 12 15 Heatsinks for BGA B 17 20
N E3 Thermal conductive paste E 21 22 Extruded heatsinks A 22 83
Thermal conductive glue E 23 24 Technical introduction A28
 A
Thermally conductive foil made of siliconelastomer
foil type foil WS foil WG foil WK foil WB
material silicone foil, standard silicone foil, GF rein- silicone foil, GF rein- silicone foil, GF rein-
forced forced, one-sided self- forced
B
adhesive
Washer
TO-3 WS 3 WG 3 WK 3 WB 3
TO-3 M WS 3M
TO-3/4 WS 3/4 WK 3/4
C
TO-3 PF WS 3P WG 3 P WK 3 P WB 3 P
3158 WS 3158 WK 3158 WB 3158
TOP 3 WS TOP 3
TOP 3/1 WS TOP 3/1 WK TOP 3/1 D
TO 218 (Multiwatt) WG 218
TO 247 WS 247 WK 247
TO 220 WS 220 WG 220 WK 220 WB 220
4 X TO 220 WS 4 220
3159 WS 3159 WK 3159 WB 3159 E
TO 126 WK 126
SOT 32 WK 32
TO 247/1 WS 247/1
Insulating tube
TO-220 11 mm, WSC-220 F
length 25 mm
TO-3 PF 13.5 mm, WSC-3 P
length 25 mm
TO-247 14.5 mm, WSC-247
length 30 mm G
Insulating tube as meterpiece
TO-220 11 mm WSM-220
TO-3 PF 13.5 mm WSM-3 P
Tape material (width)
H
24 mm WKT 24
30 mm WST 30 WBT 30
36 mm WST 36
85 mm WST 85
300 mm WGT 300 WKT 300 WBT 300 I
Foil WS Foil WG Foil WK Foil WB
material thickness 0.3 mm 0.2 mm 0.15 mm
material hardness 75 Shore A 87 Shore A 90 Shore A
dielectric strength 10 kV 6.5 kV 3 kV
thermal resistance 0.4 K/W 0.42 K/W 0.45 K/W 0.34 K/W
K
thermal conductivity 1.22 W/mK 1.13 W/mK 0.92 W/mK 1.43 W/mK
insulation resistance 2.91015 cm 5.71015 cm 1.61015 cm
extensibility 100 % 2% 4%
temperature range -60C... +180C L
class of flammibility UL 94 V-0

Thermal conductive foil E 7 10 Heatsinks for PCB A 89 112

GEL thermal conductive foils E 12 15 Heatsinks for BGA B 17 20
Thermal conductive paste E 21 22 Extruded heatsinks A 22 83 E4 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Insulating cap

B
C A
C

art. no. type dim. [mm]

A B C D
WSI 220 210 TO 220 11 21.0 5.0 0.9
WSI 220 225 TO 220 11 22.5 5.0 0.3
D WSI TOP 3 235 TOP 3 18 23.5 5.0 0.9
WSI TOP 3 280 TO 3 PL/TO 247 16 28.0 5.0 0.3
WSI TO 3 PL TO 3 PL/TO 247 22 34.0 5.5 0.9

Foil WSI Foil WSI

E material thickness 0.9 mm 0.3 mm
material hardness 75 Shore A
dielectric strength 15 kV 10 kV
thermal resistance 0.96 K/W 0.4 K/W
thermal conductivity 1.22 W/mK
F insulation resistance 2.91015 cm
extensibility 100 %
temperature range -60C... +180C
class of flammibility UL 94 V-0
G

Thermal conductive foil E 7 10 Heatsinks for PCB A 89 112

GEL thermal conductive foils E 12 15 Heatsinks for BGA B 17 20
N E5 Thermal conductive paste E 21 22 Extruded heatsinks A 22 83
Thermal conductive glue E 23 24 Technical introduction A28
 A
Thermal conductive foil one-sided adhesive

one-sided acrylate adhesive coating, silicone-free carrier material

good thermal characteristics with high operating temperature

thin material thickness for optimal thermal resistance
D
high dielectric strength, electrically insulating
cuttings and customised cut-outs acc. to customer specific requirements
art. no. type of delivery
WLFT 8943 plates, usable area 300x200mm
E
WLFT 8943
description one-sided adhesive, filled Copolymer
overall thickness 0.17 mm
filling material ceramic
specific thermal resistance 4.7C cm2/W
F
thermal conductivity 0.4 W/mK
temperature range -40C... +150C
volume resistance 2.51013 /cm
dielectric strength 62,7 kV/mm
G
peel strength at ambient temperat- 6 N/cm
ure and 24 h
class of flammibility UL 94 V-0

Thermal conductive material E25 GEL thermal conductive foils E 12 15

Heatsinks for PCB A 89 93 Spacers E 40
Profiles for PCB mounting A 89 112 Insulating distance sleeves E 32 33 E6 N
Heatsinks for transistors C49 Technical introduction A28
A
Thermally conductive foil both sides adhesive

good thermal charactaristics

double-sided adhesive layers
replaces mechanical fastenings
D cuttings and cut-outs upon request
art. no. width type of delivery art. no. width type of delivery
[mm] [mm]
WLFT 404 R25 25 sold by the meter WLFT 414 R100 100 sold by the meter
WLFT 404 R50 50 sold by the meter WLFT 414 R200 200 sold by the meter
E WLFT 404 R100 100 sold by the meter WLFT 405 R25 25 sold by the meter
WLFT 404 R200 200 sold by the meter WLFT 405 R50 50 sold by the meter
WLFT 414 R25 25 sold by the meter WLFT 405 R100 100 sold by the meter
WLFT 414 R50 50 sold by the meter WLFT 405 R200 200 sold by the meter
F
art. no. dimensions [mm] type of deliv- art. no. dimensions [mm] type of deliv-
ery ery
WLFT 404 100x100 100x100 plate WLFT 414 200x200 200x200 plate
WLFT 404 100x200 100x200 plate WLFT 405 100x100 100x100 plate
G WLFT 404 200x200 200x200 plate WLFT 405 100x200 100x200 plate
WLFT 414 100x100 100x100 plate WLFT 405 200x200 200x200 plate
WLFT 414 100x200 100x200 plate

WLFT 404 WLFT 414 WLFT 405

H description insulating, double sided adhesive non insulating, double-sided
adhesive
overall thickness 0.127 mm 0.03 0.15 mm 0.03
truss material polyimide (Kapton MT) 0.025mm aluminium foil 0.05mm
glue layer acrylate (pressure sensitive) double-sided
I thermal conductivity 0.4 W/mK 0.5 W/mK
specific thermal resistance 3.7C cm2/W 3.4C cm2/W
temperature range -30C... +125C
holding force (overlapping) 0.86 MPa 0.93 MPa
holding force (shear rate) Al 25C 0.897 [MPa]/ Al Al 25C 0.897 [MPa]/ Al Al 25C 0.86 [MPa]/ Al
K 150C 0.345 [MPa]/ Cu 150C 0.345 [MPa] 150C 0.38 [MPa]/ Cu 25C
25C 0.828 [MPa]/ Cu 1.1 [MPa]/ Cu 150C 0.48
150C 0.31 [MPa]/ Al2O3 [MPa]/ Al2O3 25C 1.0
25C 1.17 [MPa]/ Al2O3 [MPa]/ Al2O3 150C 0.41
150C 0.34 [MPa] [MPa]
dielectric strength 5 kV (AC)
L class of flammibility UL 94 V-0

Thermal conductive material E25 GEL thermal conductive foils E 12 15

Heatsinks for PCB A 89 93 Spacers E 40
N E7 Profiles for PCB mounting A 89 112 Insulating distance sleeves E 32 33
Heatsinks for transistors C49 Technical introduction A28
 A
Thermally conductive foil both sides adhesive

double sided adhesive layer

optimal adhesion of different substrates E
very good thermal conductivity, electrical insulating
easy handling due to double sided protection foil
optimized surface moistening and excellent impact strength
cutouts and different punchings according to customer drawing
art. no. type of delivery
WLFT 8805 plates, usable area 300x200mm
F
WLFT 8810 plates, usable area 300x200mm
WLFT 8815 plates, usable area 300x200mm
WLFT 8820 plates, usable area 300x200mm
WLFT 8940 plates, usable area 300x200mm G
WLFT 8805 WLFT 8810 WLFT 8815 WLFT 8820 WLFT 8940
description double sided adhesive, filled acrylic polymer
overall thickness 0.13 mm 0.25 mm 0.38 mm 0.5 mm 0.19 mm
filling material ceramic H
protection cover silicone treated polyester, 37.5 - 50 m
thermal conductivity 0.6 W/mK 0.9 W/mK
specific thermal resistance 3.1C cm2/W 5.7C cm2/W 7.6C cm2/W 9.7C cm2/W
temperature range permanent up to 100C permanent up to
150C I
volume resistance 5.21011 /cm 3.91011 /cm 3.81011 /cm 2.51013 /cm
dielectric strength 37 kV/mm 55 kV/mm
peel strength at ambient temperat- 5.8 N/cm 8.3 N/cm 9.8 N/cm 11.9 N/cm 6 N/cm
ure and 72 h
class of flammibility UL 746 C UL 94 V-0 K

Thermal conductive material E25 GEL thermal conductive foils E 12 15

Heatsinks for PCB A 89 93 Spacers E 40
Profiles for PCB mounting A 89 112 Insulating distance sleeves E 32 33 E8 N
Heatsinks for transistors C49 Technical introduction A28
A
High thermoconducting graphite foils

D high-compressed anisotropic natural graphite

very good thermal characteristics
optimal for heat spreading
high operating temperature range
different material thicknesses and coatings upon request
customer specified cuttings and stampings acc. to drawing
E art. no. width type of delivery art. no. width type of delivery
[mm] [mm]
WLFG 9010 R 25 25 sold by the meter WLFG 9020 R 25 25 sold by the meter
WLFG 9010 R 50 50 sold by the meter WLFG 9020 R 50 50 sold by the meter
WLFG 9010 R 100 100 sold by the meter WLFG 9020 R 100 100 sold by the meter
F WLFG 9015 R 25 25 sold by the meter WLFG S 900 K R 25 25 sold by the meter
WLFG 9015 R 50 50 sold by the meter WLFG S 900 K R 50 50 sold by the meter
WLFG 9015 R 100 100 sold by the meter WLFG S 900 K R 100 100 sold by the meter

WLFG 9010 WLFG 9015 WLFG 9020 WLFG S 900 K

G description base film made of graphite foil, electrically conductive
graphite, electrically
conductive
version adherent layer on one side
overall thickness 0.15 mm 0.2 mm 0.25 mm 0.175 mm
H thermal resistance 0,09 K/W 0,07 K/W 0,23 K/W 0,08 K/W
thermal conductivity z (x/y) 5.5 (55) W/mK 6 (55) W/mK 4 (55) W/mK 7.5 (<450) W/mK
specific thermal resistance 36C mm2/W 28.8C mm2/W 72C mm2/W 34C mm2/W
temperature range -40C... +500C
hardness range 30 Shore D
I tensile strength 5.5 N/mm2 6 N/mm2 5.5 N/mm2 10 N/mm2
elongation at break 10 % 5%
tightness 1 g/cm3 <1.6 g/cm3
class of flammibility UL 94 V-0
K

Thermal conductive material E25 GEL thermal conductive foils E 12 15

Heatsinks for PCB A 89 93 Spacers E 40
N E9 Profiles for PCB mounting A 89 112 Insulating distance sleeves E 32 33
Heatsinks for transistors C49 Technical introduction A28
 A
Heat conductive silicon foam foil

C
elastomer foam with closed cell structure
good heat conductor e.g. between components, heatsinks and casing parts
electrical insulating
can be compressed even with a low contact pressure
absorbs shocks and vibrations D
art. no. material thickness [mm]
WSF 16 1.60 0.4
WSF 32 3.20 0.8
WSF 635 6.35 1.2
WSFS 635 6.35 1.2
E
Thermal resistance at 3.2 mm material thickness:
compression % contact 10 25 50
contact pressure PSI >1 5 12 34
Rth K/W (1 in2 x 3.2 mm) 6 4.5 2.5 1 F
heat conductivity W/mK 0.3 0.4 0.45 0.65

WSFS 635 double sided adhesive and WSF adhesive upon request
according to NASA gas emission requirements
G
WSF WSFS 635
version no adhesive one-sided self-adhesive
thermal conductivity 0.108 W/mK (substrate)
hardness range 13 Shore D
compression, 25% 18 PSI H
temperature range -62C... +205C
extensibility 150 %
tensile strength 120 PSI
dielectric strength 4 kV/mm
tightness 1.118 g/cm3
I
class of flammibility UL 94 V-1 (at thickness 3.2mm)
type of delivery plates 914x914mm/ cuttings on customer's requirements

Thermal conductive material E 25 Kapton insulator washers E 16

GEL thermal conductive foils E 12 15 Heatsinks for PGA B 11 16
Thermal conductive paste E 21 22 Heatsinks for BGA B 17 20 E 10 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Silicone free thermal adhesive foils

C
silicone free gap-filler with good thermal characteristics
smooth, compressible and elastic
cut outs, punchings and modifications according to customer specification
other material thicknesses upon request
D art. no. material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa)
ness [mm] [C in2/W] [C cm2/W] ness [mm] [C in2/W] [C cm2/W]
GEL F 15 10 1.0 0.2 1.06 6.56 GEL F 15 G 10 1.0 0.2 1.16 7.55
GEL F 15 15 1.5 0.2 1.44 8.01 GEL F 15 G 15 1.5 0.2 1.52 9.22
GEL F 15 20 2.0 0.3 1.83 11.26 GEL F 15 G 20 2.0 0.3 1.93 10.89
E
GEL F 15 GEL F 15 G
version standard polyamide film mash reinforced
thermal conductivity 1.5 W/mK
volume resistance 2 103 M/m
F hardness range 53 Shore 00
temperature range -40C... +105C
extensibility 150 %
dielectric constant 9,12 [50 Hz] / 8,55 [1 kHz] / 5,83 [1 MHz]

G dielectric loss factor 0,152 [50 Hz] / 0,135 [1 kHz] / 0,034 [1 MHz]
dielectric strength 11 kV/mm
tightness 2.1 g/cm3
class of flammibility UL 94 V-0
type of delivery on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on
H customer's requirements

Thermal conductive material E 25 Extruded heatsinks A 22 83

Thermal conductive foil E 7 15 Heatsinks for LEDs B 35 48
N E 11 Thermal conductive paste E 21 22 Heatsink profile-overview A 13 17
Thermal conductive glue E 23 24 Technical introduction A28
 A
Gel thermal conducting foils

C
highly heat-conductive silocon foil
smooth, elastic and compressible
equals uneven surfaces very well (Gap-Filler)
art. no. material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa)
ness [mm] [C in2/W] [C cm2/W] ness [mm] [C in2/W] [C cm2/W]
D
GEL 05 0.5 0.1 0.69 4.45 GEL G 05 0.5 0.1 0.63 4.04
GEL 10 1.0 0.2 1.03 6.64 GEL G 1 1.0 0.2 1.17 7.56
GEL 15 1.5 0.2 1.39 8.96 GEL G 15 1.5 0.2 1.59 10.27
GEL 20 2.0 0.3 1.52 9.78 GEL G 2 2.0 0.3 2.07 13.33 E
GEL 25 2.5 0.3 2.10 13.58 GEL G 25 2.5 0.3 2.61 16.81
GEL 30 3.0 0.3 2.35 15.15 GEL G 3 3.0 0.3 2.89 18.66
GEL 35 3.5 0.3 2.56 16.51 GEL G 35 3.5 0.3 3.35 21.63
GEL 40 4.0 0.4 3.25 20.95 GEL G 4 4.0 0.4 3.56 22.96
GEL 45 4.5 0.4 3.38 21.82 GEL G 45 4.5 0.4 3.89 25.10 F
GEL 50 5.0 0.5 3.52 22.70 GEL G 5 5.0 0.5 4.22 27.23

GEL GEL G 05 - 25 GEL G 3 - 5

version standard polyamide film mash reinforced, adherent layer on one side
thermal conductivity 1.5 W/mK G
volume resistance 1106 M/m
hardness range 49 Shore 00
temperature range -60C ... +200C
extensibility 100 % 60 %
dielectric constant 5.8 [50 Hz]/ 5.6 [1 KHz]/ 5.5 [1 MHz]
H
dielectric loss factor 0.048 [50 Hz]/ 0.015 [1 KHz]/ 0.003 [1 MHz]
dielectric strength 14 kV/mm (AC) 8 kV/mm (AC)
tightness 2.6 g/cm3
class of flammibility UL 94 V-0 UL 94 V-1 UL 94 V-0
I
type of delivery on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on
customer's requirements

Thermal conductive material E 25 Extruded heatsinks A 22 83

Thermal conductive foil E 7 15 Heatsinks for LEDs B 35 48
Thermal conductive paste E 21 22 Heatsink profile-overview A 13 17 E 12 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Gel thermal conducting foils

C
GEL thermal conductive foils with very good thermical characteristics
for balancing non-planarities and differences in components (Gap Filler)
soft, elastic and compressible
customer specific cuts and punchings according to drawing
D art. no. material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa)
ness [mm] [C in2/W] [C cm2/W] ness [mm] [C in2/W] [C cm2/W]
GEL 28 05 0.5 0.15 0.23 1.48 GEL 28 G 05 0.5 0.15 0.29 1.85
GEL 28 10 1.0 0.2 0.44 2.76 GEL 28 G 10 1.0 0.2 0.47 2.99
GEL 28 15 1.5 0.2 0.61 3.82 GEL 28 G 15 1.5 0.2 0.72 4.53
E GEL 28 20 2.0 0.3 0.80 5.00 GEL 28 G 20 2.0 0.3 0.97 6.07
GEL 28 25 2.5 0.3 0.90 5.65 GEL 28 G 25 2.5 0.3 1.15 7.23
GEL 28 30 3.0 0.3 1.10 6.90 GEL 28 G 30 3.0 0.3 1.23 7.69
GEL 28 35 3.5 0.3 1.27 7.97 GEL 28 G 35 3.5 0.3 1.35 8.46
F GEL 28 40 4.0 0.3 1.39 8.69 GEL 28 G 40 4.0 0.3 1.67 10.47
GEL 28 50 5.0 0.3 1.67 10.47 GEL 28 G 50 5.0 0.3 1.92 12.02

GEL 28 GEL 28 G
version standard polyamide film mash reinforced
thermal conductivity 2.5 W/mK
G volume resistance 3.6104 M/m
hardness range 50 Shore 00 55 Shore 00
temperature range -60C ... +200C
extensibility 64 % 32 %
H dielectric constant 8,98 [50 Hz] / 8,63 [1 kHz] / 8,05 [1 MHz]
dielectric loss factor 0.0826 [50 Hz]/0.0300 [1 kHz]/0.0052 [1 MHz]
dielectric strength 15 kV/mm
tightness 2.7 g/cm3
class of flammibility UL 94 V-0
I type of delivery on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions
upon request

Thermal conductive material E 25 Extruded heatsinks A 22 83

Thermal conductive foil E 7 15 Heatsinks for LEDs B 35 48
N E 13 Thermal conductive paste E 21 22 Heatsink profile-overview A 13 17
Thermal conductive glue E 23 24 Technical introduction A28
 A
Thermal adhesive foils

C
gap filler with exceptionally good thermal conductivity and low outgassing
especially smooth, compressible and elastic
cut outs, punchings and modifications according to customer specification
other material thicknesses upon request
art. no. material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa)
ness [mm] [C in2/W] [C cm2/W] ness [mm] [C in2/W] [C cm2/W]
D
GEL 45 05 0.5 0.15 0.61 3.94 GEL 45 G 05 0.5 0.15 0.64 4.17
GEL 45 10 1.0 0.2 0.96 6.27 GEL 45 G 10 1.0 0.2 0.97 6.28
GEL 45 15 1.5 0.2 1.30 8.42 GEL 45 G 15 1.5 0.2 1.71 11.06
GEL 45 20 2.0 0.3 1.52 9.85 GEL 45 G 20 2.0 0.3 1.71 11.06 E
GEL 45 25 2.5 0.3 1.71 11.08 GEL 45 G 25 2.5 0.3 2.03 13.11
GEL 45 30 3.0 0.3 1.94 12.52 GEL 45 G 30 3.0 0.3 2.28 14.76
GEL 45 35 3.5 0.35 2.20 14.20 GEL 45 G 35 3.5 0.35 2.54 16.40
GEL 45 40 4.0 0.4 2.46 15.88 GEL 45 G 40 4.0 0.4 2.80 18.12
GEL 45 45 4.5 0.45 2.68 17.34 GEL 45 G 45 4.5 0.45 3.03 19.56 F
GEL 45 50 5.0 0.5 2.84 17.34 GEL 45 G 50 5.0 0.5 3.22 20.82

GEL 45 GEL 45 G
version standard polyamide film mash reinforced
thermal conductivity 4.5 W/mK G
volume resistance 1.4105 /cm
hardness range 45 Shore 00
temperature range -60C ... +200C
extensibility 50 %
dielectric constant 8,98 [50 Hz] / 8,63 [1 kHz] / 8,05 [1 MHz]
H
dielectric loss factor 0,0249 [50 Hz] / 0,0219 [1 kHz] / 0,00675 [1 MHz]
dielectric strength 11 kV/mm
tightness 3.2 g/cm3
class of flammibility UL 94 V-0 I
type of delivery on both sides covered with protective foil/ plates, usable area 300x200mm/ cuttings on
customer's requirements

Thermal conductive material E 25 Extruded heatsinks A 22 83

Thermal conductive foil E 7 15 Heatsinks for LEDs B 35 48
Thermal conductive paste E 21 22 Heatsink profile-overview A 13 17 E 14 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Gel thermal conducting foils
GEL silicone foils with especially high thermal conductivity
balances non-planarities and differences in components (Gap Filler)
B soft, elastic and compressible
cuts, punchings and special designs according to customer specifications
art. no. material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa)
ness [mm] [C in2/W] [C cm2/W] ness [mm] [C in2/W] [C cm2/W]
GEL 60 05 0.5 0.1 0.20 1.30 GEL 60 G 05 0.5 0.1 0.21 1.37
C GEL 60 10 1.0 0.2 0.33 2.11 GEL 60 G 10 1.0 0.2 0.31 1.99
GEL 60 15 1.5 0.2 0.53 3.45 GEL 60 G 15 1.5 0.2 0.48 3.08
GEL 60 20 2.0 0.3 0.61 3.91 GEL 60 G 20 2.0 0.3 0.62 4.00
GEL 60 25 2.5 0.3 0.72 4.67 GEL 60 G 25 2.5 0.3 0.77 4.96

D GEL 60 GEL 60 G
version standard polyamide film mash reinforced
thermal conductivity 6 W/mK
volume resistance 1106 M/m
hardness range 52 Shore 00
E temperature range -60C ... +200C
extensibility 80 %
dielectric constant 6.4 [50 Hz]/6.4 [1 kHz]/6.4 [1 MHz]
dielectric loss factor 0.035 [50 Hz]/0.005 [1 kHz]/0.001 [1 MHz]

F dielectric strength 13 kV/mm

tightness 3.2 g/cm3
class of flammibility UL 94 V-0
type of delivery on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions
upon request
G

H especially soft design

levels smallest air gaps and unevennesses
cuts and contours with cutouts according to customer specifaction
art. no. material thick- Rth (100 kPa) Rth (100 kPa) art. no. material thick- Rth (100 kPa) Rth (100 kPa)
ness [mm] 2
[C in /W] [C cm /W]2 ness [mm] [C in2/W] [C cm2/W]
I GEL 27 S 25 2.5 0.94 6.05 GEL 27 S 50 5.0 1.69 10.91
version: standard
thermal conductivity: 2.7 W/mK
volume resistance: 2107 M/m
K hardness range: 53 Shore 00
temperature range: -60C ... +200C
extensibility: 45 %
dielectric strength: 15 kV/mm
tightness: 3 g/cm3
L class of flammibility: UL 94 V-0
type of delivery: on both sides covered with protective foil/ plates, usable area 300x200mm/ other dimensions
upon request

Thermal conductive material E 25 Extruded heatsinks A 22 83

Thermal conductive foil E 7 15 Heatsinks for LEDs B 35 48
N E 15 Thermal conductive paste E 21 22 Heatsink profile-overview A 13 17
Thermal conductive glue E 23 24 Technical introduction A28
 A
Kapton insulator washers
very low thermal resistance
optimised heat conductivity
best mechanical charactaristics B
polyimide-carrier foil with silicone-free phase changing thermal conductive layer completely coated on both sides
clean processing, no abrasion of the coating
stacked foils do not stick together
good resistance against cleening agents
no cold flow
low pressure force necessary, thus particularly applicable for spring-fixing of semiconductors C
cuttings and special versions according to customer's requirements
the thermal details refer to an area of 1 inch2 (6.45 cm2)

3,1

D
10000,5

21

18

13

21
23 18
24 18
6
24 E
3050,5
art. no. art. no. art. no. art. no. art. no.
KAP 1 P KAP 247 O KAP 218 O KAP 220 O KAP 218
suitable for pre-cut parts (plate) TO 248/ TO 218/ TO 247 TO 218 TO 220 TO 248/ TO 218/ TO 247
1,5 1,5
F
4,2 4,2
4,2 4,2
3,1 3,1

5,5
34

29
11
13
18

5,5
G
16 4,5 13,5
7
18 17
23
13 17 8,5 30
47 42

art. no. art. no. art. no. art. no. H

KAP 220 G KAP 220 K KAP 3 G KAP 3 K
TO 220 TO 220 TO 3 TO 3

KAP
material polyimide-carrier foil with silicone-free phase changing thermal conductive layer completely
coated on both sides
I
material thickness 0.077mm (substrate 0.05mm)
thermal conductivity 0.45 W/mK (substrate)
insulation resistance 1014
thermal resistance 0.15 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (KAP 3)] K
temperature range -40C... +150C
phase change temperature 52 C
extensibility 30 %
dielectric strength 7.8 kV
class of flammibility UL 94 V-0 L

Profiles for PCB components A 91 Finger-shaped heatsinks C23

Heatsinks for PCB A 89 93 Distance sleeves for PCBs in HP grid E 39
Profiles for PCB mounting A 89 112 Spacers E 40 E 16 N
Heatsinks for transistors C49 Technical introduction A28
A
Aluminium oxide wafers
other thicknesses and versions on request
= thickness; = flatness
B

3,6
16 3,1
4 4

20

17,5
21

21

20
C 23
7 18 7 18
23 15
25 25 20,5
art. no. art. no. art. no. art. no. art. no.
AOS 247 AOS 218 247 AOS 218 247 1 AOS 3 P 2 AOS 3 P SL
1 mm 0.02 mm 3 mm 0.15 mm 1.5 mm 0.02 mm 1 mm 0.15 mm 1.5 mm 0.15 mm

D 3,7 3,2 4 3,1 3,1

12
14

12
14

8
14,5 14 4 14 4 14 4 7,3 3,7
E 19,3 18 18 18 11

art. no. art. no. art. no. art. no. art. no.
AOS 220 3 AOS 220 SL AOS 220 4 AOS 220 AOS 32
1.6 mm 0.11 mm 4.5 mm 0.054 mm 1.5 mm 0.054 mm 1.5 mm 0.054 mm 1.5 mm 0.033 mm

10,9 8
F 4
3,1 5,1
9,5
3,2 2,5
1,1

O,9
4
21

17,5

R 7,5

18 15
G 25 20,5

art. no. art. no. art. no. art. no. art. no.
AOS 127 AOS 3 P AOS 5 AOS 93 AOS 18
3 mm 0.076 mm 1.5 mm 0.061 mm 1.5 mm 0.032 mm 2.3 mm 0.03 mm 1.5 mm 0.023 mm

4,9 4,9
H 4,3 4,3
4,2
26,2

19,2
11

5,1

13,2 16,9 9,7 14,7

I 40,5 33,3

art. no. art. no.

AOS 3 AOS 66
2.9 mm 0.123 mm 2.5 mm 0.10 mm

K AOS
material AL2O3 - ceramics
thermal resistance 0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)]
specific electrical resistance >1014 /cm
thermal conductivity 25 W/mK
L dielectric constant 9
linear expansion coefficient ~810-6/K
snap through stability 10 kV/mm

Thermal conductive material E 25 Thermal conductive foil E 7 10

GEL thermal conductive foils E 12 15 Kapton insulator washers E 16
N E 17 Thermal conductive paste E 21 22 Mica wafers E 19
Thermal conductive glue E 23 24 Technical introduction A28
 A
Aluminium oxide wafers according to customer's instructions
laser-cut versions with outer dimensions and cutouts according to customer's requirements
other plate dimensions upon request
max. plate dimension 180 x 180 mm B

G
material thickness [mm] outer dimensions [mm]
2.000 114x114
2.540 114x114
H
1.500 114x114
1.270 114x114
1.000 114x114/ 165x115/ 160x113
0.800 114x114/ 165x115/ 160x113
0.635 106.5x106.5/ 114x114/ 165x115/ 160x113 I
0.500 106.5x106.5/ 114x114
0.400 106.5x106.5/ 114x114
0.300 106.5x106.5/ 114x114
0.250 106.5x106.5/ 114x114
K

Thermal conductive material E 25 Thermal conductive foil E 7 10

GEL thermal conductive foils E 12 15 Kapton insulator washers E 16
Thermal conductive paste E 21 22 Mica wafers E 19 E 18 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Mica wafers

4,1

B 3,1 3,7 4

21

17,5
11

12
13,5
20 4
15 5,3
18
C 24
18 20,5 18

art. no. art. no. art. no. art. no. art. no.
GS 220 C GS 218 GS 3 P SL GS 66 P GS 220 4
TO 220 TO 218 TOP 3 TO 66 TO 220
D
4,2 2
3,1 3,1
3,1

10,9
17,5

30
12

4
8

E 3,7
4 11 15
18 20,5
13,2 17
43

art. no. art. no. art. no. art. no.

F GS 220 P GS 32 P GS 3 P GS 3
TO 220 SOT 32 TOP 3 TO 3

GS
material muskovit
G material thickness 0.05 mm
thermal resistance (GS 3) 0.4 K/W
insulation resistance 31017 cm
snap through stability 5 kV

Thermal conductive material E 25 Thermal conductive glue E 23 24

Thermal conductive foil E 7 10 Kapton insulator washers E 16
N E 19 GEL thermal conductive foils E 12 15 Aluminium oxide wafers E 17 18
Thermal conductive paste E 21 22 Technical introduction A28
 A
Free standing film

self-supporting differential phase changing thermal interface material, contains no substrate (Free Standing Film)
materials with phase change temperature at 52 C;
best thermal conductivity, exceeding phase change temperature point, material flows into all gaps between components and heatsink
thixotropic, does not migrate from the interface area D
no lowering of thermal conductivity though thermal cycling
application with very low contact pressure, due to non elastomeric material, particularly suitable for clamp mounting of components
electrically non-conductive, but not an insulator
self adhering characteristics, also suitable for large areas
no toxic ingredients
custom required shapes on request E
all with protection foil on both sides
art. no. basin dimensions [mm]
FSF 52 P plate, protection foil on both sides 330x343x0.127 0.025

FSF 52 P F
phase change temperature 52 C
colour white
tightness 2 g/cm3
thermal conductivity 0.9 W/mK
thermal resistance (1 in2, TO 3) at 0.03 K/W G
contact pressure of 0.031 N/mm2
temperature range +200C
adhesive holding force 0.35 N/mm2
class of flammibility UL 94 V-0
dielectric constant 3.8 [1 kHz] H
3.4 [1 MHz]

Mica wafers E 19 Thermal conductive material E25

Thermal conductive foil E 7 10 Insulating caps E 51
Thermal conductive paste E 21 22 Aluminium oxide wafers E 17 18 E 20 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Thermal transfer compounds
Silicon thermal transfer compound
thermal transfer compound used to reduce the thermal transmission resistance between semiconductor and heatsink
B

C
art. no. basin delivery quantity [g]
WLP 004 box 4
WLP 035 box 35
D WLP 500 box 500
WLP 300 S cartridge (310 ml) 300
WLP 500 S cartridge (310 ml) 500

Silicone-free thermal transfer compound

E thermal transfer compound used to reduce the thermal transmission resistance between semiconductor and heatsink

G art. no. basin delivery quantity [ml] delivery quantity [g]

WLPF 05 syringe 2
WLPF 10 syringe 5
WLPF 20 syringe 10
WLPF 50 syringe 20
H WLPF 300 S cartridge (310 ml) 300

WLP WLPF
composition silicone oil, inorganic filling material silicone free synthetic liquid. Metal oxide
filling.
I consistance pastey
colour white white-grey
tightness 1.1 g/cm3 approx. 2 g/cm3
thermal conductivity 0.61 W/mK >0.7 W/mK
specific electrical resistance >1012 /cm
K flashpoint none (DIN 53213) of the basic oil >280C (ISO 2592)
drop point >260C
thermal resistance no bleeding at (4 h/200C) <1% (96 h/200C)
temperature range -40C ... +250C -40C... +150C
acid number < 0.01 mg KOH/g
L solubility in water insoluble

Mica wafers E 19 Thermal conductive material E25

Thermal conductive foil E 7 10 Insulating caps E 51
N E 21 Thermal conductive paste E 21 22 Aluminium oxide wafers E 17 18
Thermal conductive glue E 23 24 Technical introduction A28
 A
Thermal transfer compounds
Ceramic filled, silicone-free thermal conductive paste with high thermal conductivity
suitable especially for silicone-sensitive applications
no drying out, hardening or melting of the thermal conductive paste B
high long-term stability
further package sizes, container types such as cans, cartridge, etc. upon request

art. no. basin delivery quantity [ml]

WLPK 3 syringe 3
WLPK 5 syringe 5
E
WLPK 10 syringe 10

WLPK
composition silicone-free, synthetic fluid ceramic filled
consistance pastey F
colour silver
tightness 1.4 g/cm3
thermal conductivity 10 W/mK
dielectric strength not applicable, because conducting
temperature range -60C ... +150C
G
solubility in water insoluble

Mica wafers E 19 Thermal conductive material E25

Thermal conductive foil E 7 10 Insulating caps E 51
Thermal conductive paste E 21 22 Aluminium oxide wafers E 17 18 E 22 N
Thermal conductive glue E 23 24 Technical introduction A28
A
Thermally conductive adhesive
thermally conductive, electrically non-conductive adhesive
two part epoxy resin adhesive, metaloxide filled
B fully replaces mechanical fastenings
excellent function and application characteristics
to be stored at a cool and dark place

D
art. no. composition art. no. composition
WLK 5 5 g resin/0.5 g hardener WLK 10 10 g resin/1 g hardener

F
art. no. composition art. no. composition
WLK 30 30 g resin/3 g hardener WLK 120 120 g resin/12 g hardener

G WLK
thermal conductivity 0.836 W/mK
specific thermal resistance 1.2 mK/W
volume resistance 1016 /cm
temperature range -56C... +149C
H hardening time 20C approx. 16-24h / 25C approx. 8 h / 120C approx. 20 min
glue layer Epoxid
mixture proportion 10:1

Thermal conductive material E 25 Thermal conductive glue E 23 24

Thermal conductive foil E 7 10 fan cooler for Pentium and MMX B 59
N E 23 GEL thermal conductive foils E 12 15 heatsinks for Pentium III FC PGA B 57
Thermal conductive paste E 21 22 Technical introduction A28
 A
Thermally conductive adhesive
solvent-free and thermal conductive two part adhesive
epoxy based filled with aluminium oxide
composition of hardener and resin (1:1) with statical mixing tube B
lockability of the container via Luer-Lock System
good usage and working properties

art. no. basin contents of delivery

WLK DK 4 syringe 1x 4 ml syringe / 3x mixer WLK M4
E
WLK DK 10 syringe 1x 10 ml syringe / 3x mixer WLK M4
WLK DK 50 cartridge 1x 50 ml cartridge / 3x mixer WLK M50

WLK DK
thermal conductivity 1 W/mK F
specific thermal resistance 118C cm/W
volume resistance 81011 /cm
temperature range -50C... +145C
working life at room temperature approx. 30 min
hardening time 25C approx. 4 h/50C approx. 1 h/85C approx. 10 min/125C approx. 2 min
G
glue layer Epoxid
mixture proportion 1:1

Accessories
more package sizes and container types upon request H
store cool and dry
art. no. contents of delivery
WLK M 4 10x mixer fr 4 & 10 ml syringe (packing unit 10 pieces)
WLK M 50 10x mixer fr 50 ml cartridge (packing unit 10 pieces)
WLK P 1x applicator gun for 50 ml cartridge
I

Thermal conductive material E 25 Thermal conductive glue E 23 24

Thermal conductive foil E 7 10 fan cooler for Pentium and MMX B 59
GEL thermal conductive foils E 12 15 heatsinks for Pentium III FC PGA B 57 E 24 N
Thermal conductive paste E 21 22 Technical introduction A28
A
Fastening for mounting rail

C universal, solid plastic clip fastening for all 35 mm mounting rails

suitable for rail material thicknesses from 1 to 2.3 mm according to DIN EN 60 715 (formerly DIN EN 50 022)
registrated design DE 200 07 435.0
fast and easy mounting of heatsinks, casings etc. due to direct snap up on the mounting rail

D
safe hold due to a stable extruded plastic profile with integrated spring back
electroconductive material or surface on request
special lengths and treatments on customer's request
* = examples of mounting rail versions suitable for KL 35 K
E 13,5
*
43,7

35
35

35
1 1,5 2,3
5,6
2,7

F 2,7
7,5 15 15
12,9
art. no. dim. [mm] art. no. dim. [mm]

G KL 35 K 40 40 KL 35 K 75 75
KL 35 K 50 50 KL 35 K 100 100
material: rigid PVC
heat distortion: -30C ... +80C
colour: anthracite grey
H class of flammibility: UL 94 V-0

safe hold due to a stable extuded profile with integrated stainless steel spring
special lengths (40mm), treatments and surfaces on request
* = examples of mounting rail versions suitable for KL 35

I
7,4

*
12,1
17

35
35

35
50

K 37,5
1 1,5 2,3

3,5

7,5 15 15
5

8,5

L
art. no. dim. [mm] art. no. dim. [mm] art. no. dim. [mm]

KL 35 50 50 KL 35 75 75 KL 35 100 100
material: aluminium
M surface: clear anodised

Distance sleeves for PCBs in HP grid E 39 Mounting pads for transistors E 47

Extractors for guide rails E 30 Mounting parts for heatsinks E 49
N E 25 Insulting clamping parts E 45 Vibration dampers E 41
Vibration dampers E 41 Technical introduction A28
 A
Guide rails
Screw-on type
for eurocards
connectors according to DIN 41612 or VG 95324 mountable B
high stability through inner reinforcements
stable foot mounting trough inserted brass- thread inserts
groove depth: 2.2 mm, groove width 1.9 mm
suitable for PCB thicknesses from 0.5 to 1.85 mm
* = printed circuit board
116,5
C
108
90

2,8
M4 x 7,5

7,8
5
100
D

12
E
A

10,2 10,2
10
F
119,5

4,05

90
2,75
37,5

1,5
11
16,4 15
B

art. no. dim. [mm]

H
A B
FS 151 P 151 2.5

art. no.
I
2,5
10,35

1,2
9,5
7,5

2,6

20
24,25 10
15
8 27,5
K
CLIP 151 only for FS 151 P
material: polycarbonate, GF reinforced
temperature range: -40C... +125C
class of flammibility: UL 94 V-0 L

Solder pins E 43 Distance sleeves for PCBs in HP grid E 39

Snap-in guide rails E 29 30 Mounting pads for transistors E 47
Extractors for guide rails E 30 Vibration dampers E 41 E 26 N
Insulting clamping parts E 45 Technical introduction A28
A
Guide rails
Screw-on type
B 6 A

M3

1,8

6
2,4

3 8 B C

art. no. dim. [mm]

C A B C
FS 6 065 65 50 7
FS 6 070 70 50 12
FS 6 080 80 67 5
D FS 6 090 90 67 15
FS 6 100 100 84 8
FS 6 110 110 84 18
FS 6 120 120 84 28
FS 6 130 130 84 38
E material: polycarbonate, GF reinforced
temperature range: -20C... +130C
thread nut: brass nickel-plated
class of flammibility: UL 94 V-0

F art. no. 109

18
2
3
8,5

4
2

G 5
14

FS 109
art. no.

2,5
12,5 100
93
2
H
M3
9

22
7

8
7
8,5 92
9

FS 100
I art. no.
2,2

12,5 100
1

* 92
8,5
5
M3

2,2
2

8
K 7
85

5,5

1,8

L MSVL 100 * = position of snap-in slot

material: polyamide, GF reinforced
temperature range: -40C... +205C
class of flammibility: UL 94 V-0

Solder pins E 43 Distance sleeves for PCBs in HP grid E 39

Snap-in guide rails E 29 30 Mounting pads for transistors E 47
N E 27 Extractors for guide rails E 30 Vibration dampers E 41
Insulting clamping parts E 45 Technical introduction A28
 A
Guide rails
Lockable mounting rails
lockable by pushing the plastic pin or the metal button
no conductive connection to the PCB B
the PCB requires a snap-in slot in accordance to the drawing
other position with locking device on request
* = position of snap-in slot

2
3,1 C
6

A
6
12,7 9,5

18,8
D
art. no. version dim. [mm] art. no. version dim. [mm]
L A L A
FS 85 50 without bolting 50 42 FS 85 70 without bolting 70 62
device device E
FS 85 60 without bolting 60 52 FS 85 without bolting 85 76
device device
8,5 5

* 1 5,5
2,2

2 F
3,1
3

2,2

1,8
7
6
L
A

G
6

9,5
12,7
18,8

3
art. no. version dim. [mm] art. no. version dim. [mm]
L A L A H
MSVL 50 with bolting device 50 42 MSVL 70 with bolting device 70 62
MSVL 60 with bolting device 60 52 MSVL 85 with bolting device 85 76
material: polyamide, GF reinforced
temperature range: -40C... +205C
class of flammibility: UL 94 V-0
I
the guide bars have got mounting holes for vertical and horizontal assembly of printed circuits
they can also be stacked together horizontally or vertically using pins and treatments
90
80 65 7
K
2

2,5 8
3
4,5

4
10
3,5

22
13,9

9
7

10 3
2,8 4
2,5

art. no.
L
MSHV 90
material: polyamide, GF reinforced
class of flammibility: UL 94 V-0
M

Solder pins E 43 Distance sleeves for PCBs in HP grid E 39

Snap-in guide rails E 29 30 Mounting pads for transistors E 47
Extractors for guide rails E 30 Vibration dampers E 41 E 28 N
Insulting clamping parts E 45 Technical introduction A28
A
Guide rails
Snap-in
narrow version
B
L

2
6,2

4,4
1,2 ... 2,2
C
3,2

1,2
3,2
6,4 B
A R 1,5

3
3,4 3,2 5,5

art. no. dim. [mm] art. no. dim. [mm]

D L A L A B
FS S 06 2 63.5 50.8 FS S 15 2 152.4 139.7
FS S 07 2 76.2 63.5 FS S 16 2 165.1 152.4
FS S 08 2 88.9 76.2 FS S 19 3 190.5 177.8 88.9
E FS S 10 2 101.6 88.9 FS S 20 3 203.2 190.5 95.2
FS S 11 2 114.3 101.6 FS S 21 2 215.9 203.2
FS S 12 2 127.0 114.3 FS S 21 3 215.9 203.2 101.6
FS S 13 2 139.7 127.0
material: nylon, natural coloured
F temperature range: -40C... +120C
class of flammibility: UL 94 V-2

wide version

G
L L
1,9

1,9
7,9

7,9

FS BT ... FS BF ...
1,2 ... 2,3

1,2 ... 2,3

H
4,4

4,5

12,7 A

R 2,2
1,9
3,2

3,2

4,3
4,3

4,6
5,7
art. no. version dim. [mm] art. no. version dim. [mm]
I L A L A
FS BT 06 deep groove 63.5 38.1 FS BF 06 shallow groove 63.5 38.1
FS BT 08 deep groove 88.9 63.5 FS BF 07 shallow groove 76.2 50.8
FS BT 10 deep groove 101.6 76.2 FS BF 10 shallow groove 101.6 76.2
FS BT 11 deep groove 114.3 88.9 FS BF 11 shallow groove 114.3 88.9
K FS BT 13 deep groove 139.7 114.3 FS BF 13 shallow groove 139.7 114.3
FS BT 15 deep groove 152.4 127.0 FS BF 15 shallow groove 152.4 127.0
FS BT 16 deep groove 165.1 139.7 FS BF 19 shallow groove 190.5 165.1
FS BT 19 deep groove 190.5 165.1 FS BF 20 shallow groove 203.2 177.8
L FS BT 20 deep groove 203.2 177.8
material: nylon, natural coloured
temperature range: -40C... +120C
class of flammibility: UL 94 V-2

Solder pins E 43 Distance sleeves for PCBs in HP grid E 39

Snap-in guide rails E 29 30 Mounting pads for transistors E 47
N E 29 Extractors for guide rails E 30 Vibration dampers E 41
Insulting clamping parts E 45 Technical introduction A28
 A
Guide rails
Ejectors
low profile
suitable for ejectors art. no. AHG V 14 und AHG V 17 B

2
7,9
C

1,2 ... 2,3

12,7 B

D
A
4

2,6 2,6

4,4 3 3,4 D

4,4

4,4
C

art. no. dim. [mm] art. no. dim. [mm]

L A C D L A B C D
FS LP 05 50.8 25.8 2.0 3.2 FS LP 15 152.4 127.4 2.0 3.2
FS LP 07 76.2 38.5 2.0 3.2 FS LP 16 165.1 127.4 2.0 3.2 E
FS LP 08 88.9 38.5 2.0 3.2 FS LP 17 177.8 153.2 2.0 3.2
FS LP 10 101.6 76.6 2.0 3.2 FS LP 22 228.6 191.3 95.7 2.0 3.6
FS LP 11 114.3 76.6 2.0 3.2 FS LP 30 304.8 267.9 134.0 2.4 4.0
FS LP 13 139.7 76.6 2.0 3.2
material: polyamide, GF reinforced F
temperature range: -40C... +120C
class of flammibility: UL 94 V-0

deep guideway
bevelled entrance zone G
6,35
2

3,3
6,35
L

H
11,3

A
6,35
1,27

6,35

4,75
I
1,2 ... 2,3
1,3

4,62

R 2,3
4,8 6,4

12,7 B

art. no. dim. [mm] K

L A B
FS U 06 63.5 38.1
FS U 11 114.3 88.9
FS U 20 203.2 177.8 88.9
material: polyamide, GF reinforced
L
temperature range: -40C... +120C
class of flammibility: UL 94 V-0

Solder pins E 43 Distance sleeves for PCBs in HP grid E 39

Snap-in guide rails E 29 30 Mounting pads for transistors E 47
Extractors for guide rails E 30 Vibration dampers E 41 E 30 N
Insulting clamping parts E 45 Technical introduction A28
A
Ejectors
art. no.

B 6,4
2,2

3,2 28,7
PCB 7,9
6,4 6,9

10,8
7,6
14,3

14,3
FS LP
*
C

2
3,2
1,6
14,3
6,4 0,76 2,4

6,4
2,8

AHG V 14 * = mounting dimensions; locking in FS LP

D art. no. 2,2
6,4

3,2
28,4
7,9
3,2
PCB 6,4 19,8
6,9

10,8
14,3
14,3

FS LP

7,6
E *

2
3,2
1,6
0,76 14,3
6,4 2,4
2,8
6,4

AHG V 17 * = mounting dimensions; locking in FS LP

art. no.
3,2

F 6,4 27,9

6,4
R 3,2

2,4
R 3,6

AHG K 27 1,6 9,5

G art. no. 9,5

6,4

28,6
6,4

6,4
12,7

R 3,2

R 3,6

AHG K 28 2,3
H 1,6 11,1
6,4
50,8
45
37,5
4,7

2,8
A 6,6
6,4

16,6

11
1,2

15
6,1

I
12,4
4

1,9
7,6 2,3
art. no. dim. [mm]
A
K AHG L 7 7.4
material: nylon
temperature range: -40C... +120C
class of flammibility: UL 94 V-2

L type of delivery: all ejectors with matching spring pin

Solder pins E 43 Distance sleeves for PCBs in HP grid E 39

Snap-in guide rails E 29 30 Mounting pads for transistors E 47
N E 31 Extractors for guide rails E 30 Vibration dampers E 41
Insulting clamping parts E 45 Technical introduction A28
 A
Insulating spacers with internal and external thread

field of applications:
E
insulated assembly of stacked PCB
insulated assembly of stacked heatsinks with varying capacities
insulated assembly of chassis plates in cases
insulated supports in the wiring
mechanicaly very stable as threads are made of brass
other lengths on request
F
dimensions = nominal size: deviation 0.5 mm
... please indicate length "L"

P L P
G
D'
A
D

art. no. dim. [mm] H

A D/D' L P/P'
ISAB 25 A ... 8.0 M2.5/M2.5 10/ 15/ 20/ 25 6.0
ISAB 3 A ... 8.0 M3/M3 10/ 20 6.0
ISAB 4 A ... 8.0 M4/M4 15/ 20 6.0
ISAB 6 A ... 12.7 M6/M6 25 12.7 I
dielectric strength: 27 kV/mm
creeping current resistance: CTI 600
thread inserts: brass
temperature range: -30C... +85C (short term +200C)
K
surface: raw
plastic body: polyamide 66
colour: natural (opaque)

Spacers E 40 Mounting material for semiconduct. E 44 48

Screw mounted guide rails E 26 30 Mounting parts for heatsinks E 49 50
Ejectors E 31 Thermal conductive material E 2 24 E 32 N
Vibration dampers E 41 Technical introduction A28
A
Insulating spacers with internal and external thread

L P'
B P

D'
A
D
C art. no. dim. [mm]
A D/D' L P/P'
ISAB 25 B ... 8.0 M2.5/M2.5 10/ 13/ 15/ 18/ 20/ 25/ 30 6.0
ISAB 3 B ... 8.0 M3/M3 10/ 13/ 15/ 18/ 20/ 25/ 30/ 35/ 40 6.0
ISAB 4 B ... 8.0 M4/M4 15/ 20/ 25/ 30/ 40 6.0
D ISAB 5 B ... 9.5 M5/M5 20/ 30/ 40 10.0
ISAB 6 B ... 12.7 M6/M6 25/ 30/ 35/ 40/ 50 12.7

dimensions = nominal size: deviation 0.5 mm; at ISAB 3 C ... L=10 => P/P'=3.5

E L
P P'

D'
A
D

F
art. no. dim. [mm]
A D/D' L P/P'
ISAB 25 C ... 8.0 M2.5/M2.5 10/ 13/ 15/ 18/ 20/ 25/ 30 6.0
ISAB 3 C ... 8.0 M3/M3 10/ 13/ 15/ 18/ 20 6.0
G ISAB 4 C ... 8.0 M4/M4 15/ 35 6.0
ISAB 5 C ... 9.5 M5/M5 20 10.0
ISAB 6 C ... 12.7 M6/M6 25 12.0
ISAB 6 C ... 12.7 M6/M6 30 12.7
dielectric strength: 27 kV/mm
H creeping current resistance: CTI 600
thread inserts: brass
temperature range: -30C... +85C (short term +200C)
surface: raw
I plastic body: polyamide 66
colour: natural (opaque)

Spacers E 40 Mounting material for semiconduct. E 44 48

Screw mounted guide rails E 26 30 Mounting parts for heatsinks E 49 50
N E 33 Ejectors E 31 Thermal conductive material E 2 24
Vibration dampers E 41 Technical introduction A28
 A
Miniature spacers with threads

allows compact, insulated constructions D

reduced volume in case of stack assembly
insulated mounting of heatsinks, PCB, housingparts etc.
very good mechanical stability due to brass inserts
dimensions = nominal size: deviation 0.5 mm
... please indicate length "L"

6
+0,5
L
+0,5
6 S
E

G
art. no. dim. [mm] F
S type of thread L max. diameter
of the bushing
ISAM 2 A ... 6 M2.5 4/ 5/ 7/ 9/ 11/ 12 6
ISAM 3 A ... 7 M3 4/ 5/ 7/ 8/ 9/ 10 7
6
+0,5
L -0,3 S
G
4

art. no. dim. [mm] H

S type of thread L max. diameter
of the bushing
ISAM 2 B ... 6 M2.5 8/ 9/ 10/ 11 6
ISAM 3 B ... 7 M3 7/ 8/ 9/ 10/ 11/ 12 7

-0,3
L
4
-0,3 S I
4

art. no. dim. [mm] K

S type of thread L max. diameter
of the bushing
ISAM 2 C ... 6 M2.5 9 6
ISAM 3 C ... 7 M3 9/ 10/ 12 7
dielectric strength: 28 kV/mm L
creeping current resistance: CTI 600
thread inserts: brass
temperature range: -30C... +85C (short term +200C)
surface: raw
plastic body: polyamide 6 M
colour: natural (opaque)

Spacers E 40 Mounting material for semiconduct. E 44 48

Screw mounted guide rails E 26 30 Mounting parts for heatsinks E 49 50
Ejectors E 31 Thermal conductive material E 2 24 E 34 N
Vibration dampers E 41 Technical introduction A28
A
Distance hexagonal bolts insulating

E field of applications:
insulated assembly of stacked PCBs
insulated assembly of stacked heatsinks with varying capacities
insulated assembly of chassis plates in cases
insulated supports in the wiring
mechanicaly very stable, as threads are made of brass
F other lengths on request
dimensions = nominal size: deviation 0.5 mm
... please indicate length "L"

P L P
A
G
D
D

H art. no. dim. [mm]

A D/D' L P/P'
ISAS 25 A ... 6.35 M2.5/M2.5 15/ 20/ 25/ 30/ 35/ 40 6.0
ISAS 30 A ... 6.35 M3/M3 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 6.0
ISAS 40 A ... 8.00 M4/M4 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 6.0
I ISAS 50 A ... 9.50 M5/M5 20/ 25/ 30/ 35/ 40/ 45/ 50 10.0
ISAS 60 A ... 12.70 M6/M6 25/ 30/ 35/ 40/ 45/ 50/ 60 12.7
dielectric strength: 27 kV/mm
creeping current resistance: CTI 600
thread inserts: brass
K temperature range: -30C... +85C (short term +200C)
surface: raw
plastic body: polyamide 66
colour: natural (opaque)

Spacers E 40 Mounting material for semiconduct. E 44 48

Screw mounted guide rails E 26 30 Mounting parts for heatsinks E 49 50
N E 35 Ejectors E 31 Thermal conductive material E 2 24
Vibration dampers E 41 Technical introduction A28
 A
Distance hexagonal bolts insulating

P L
A
P B

D
D
art. no. dim. [mm] C
A D/D' L P/P'
ISAS 25 B ... 6.35 M2.5/M2.5 15/ 20/ 25/ 30/ 35/ 40 6.0
ISAS 30 B ... 6.35 M3/M3 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 6.0
ISAS 40 B ... 8.00 M4/M4 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 6.0
ISAS 50 B ... 9.50 M5/M5 20/ 25/ 30/ 35/ 40/ 45/ 50 10.0
D
ISAS 60 B ... 12.70 M6/M6 25/ 30/ 35/ 40/ 45/ 50/ 60 12.7
L
A P
P
E

D
D

art. no. dim. [mm]

A D/D' L P/P'
ISAS 25 C ... 6.35 M2.5/M2.5 15/ 20/ 25/ 30/ 35/ 40 6.0 F
ISAS 30 C ... 6.35 M3/M3 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 6.0
ISAS 40 C ... 8.00 M4/M4 15/ 20/ 25/ 30/ 35/ 40/ 45/ 50 6.0
ISAS 50 C ... 9.50 M5/M5 20/ 25/ 30/ 35/ 40/ 45/ 50 10.0
ISAS 60 C ... 12.70 M6/M6 25/ 30/ 35/ 40/ 45/ 50/ 60 12.7 G
dielectric strength: 27 kV/mm
creeping current resistance: CTI 600
thread inserts: brass
temperature range: -30C... +85C (short term +200C)
surface: raw H
plastic body: polyamide 66
colour: natural (opaque)

Spacers E 40 Mounting material for semiconduct. E 44 48

Screw mounted guide rails E 26 30 Mounting parts for heatsinks E 49 50
Ejectors E 31 Thermal conductive material E 2 24 E 36 N
Vibration dampers E 41 Technical introduction A28
A
Spacers with internal and external thread
other lengths and threads on request
... please indicate length "L"
B L 0,1
P P

D
D
C H
art. no. dim. [mm]
H D/D' L P P'
GBM 2550 ... 5 M2.5 5 6 2.5
D GBM 2550 ... 5 M2.5 10 6 5.0
GBM 2550 ... 5 M2.5 15/ 20 6 8.0
GBM 2550 ... 5 M2.5 25/ 30/ 35 8 10.0
GBM 3050 ... 5 M3 5 8 2.5
GBM 3050 ... 5 M3 10/ 12/ 14 8 5.0
E GBM 3050 ... 5 M3 15/ 18/ 20 8 10.0
GBM 3050 ... 5 M3 25/ 30/ 35/ 40/ 45/ 50 10 10.0
GBM 4070 ... 7 M4 5 8 2.5
GBM 4070 ... 7 M4 10 8 5.0
GBM 4070 ... 7 M4 15 8 8.0
F GBM 4070 ... 7 M4 20 8 10.0
GBM 4070 ... 7 M4 25/ 30/ 35/ 40/ 45/ 50 10 10.0
GBM 5080 ... 8 M5 10 8 5.0
GBM 5080 ... 8 M5 15/ 20 8 6.0
G GBM 5080 ... 8 M5 25/ 30/ 35/ 40/ 45/ 50 10 10.0
material: brass
surface: 6 m nickel-plated, solderable

other lengths and threads on request

... please indicate length "L"
H
L 0,1
P P
D
D

I
H
art. no. dim. [mm]
H D/D' L P P'
GBP 3060 ... 6 M3 10 8 7
K GBP 3060 ... 6 M3 12 8 8
GBP 3060 ... 6 M3 15/ 18/ 20/ 25/ 30 8 10
GBP 4080 ... 8 M4 10 8 7
GBP 4080 ... 8 M4 12 8 9
GBP 4080 ... 8 M4 15/ 18/ 20/ 25/ 30/ 35/ 40/ 45 8 10
L material: polyamide, GF reinforced
temperature range: -30C... +110C
colour: black

Spacers E 40 Mounting material for semiconduct. E 44 48

Screw mounted guide rails E 26 30 Mounting parts for heatsinks E 49 50
N E 37 Ejectors E 31 Thermal conductive material E 2 24
Vibration dampers E 41 Technical introduction A28
 A
Distance sleeves with internal thread
other lengths and threads on request
... please indicate length "L"
L 0,1
B
P P

D
H
C
art. no. dim. [mm]
H D/D' L P P'
ABM 2550 ... 5 M2.5 5/ 8/ 10/ 12/ 15 =L
ABM 2550 ... 5 M2.5 18 8 8 D
ABM 2550 ... 5 M2.5 20/ 25/ 30/ 35/ 40/ 45/ 50 10 10
ABM 3050 ... 5 M3 5/ 8/ 9/ 10/ 12/ 13/ 15 =L
ABM 3050 ... 5 M3 16/ 18/ 19 8 8
ABM 3050 ... 5 M3 20/ 25/ 29/ 30/ 35/ 40/ 45/ 50 10 10
ABM 4070 ... 7 M4 5/ 8/ 10/ 12/ 15 =L E
ABM 4070 ... 7 M4 18 9 9
ABM 4070 ... 7 M4 20/ 25/ 30/ 35/ 40/ 45/ 50 10 10
ABM 5080 ... 8 M5 5/ 12/ 15 =L
ABM 5080 ... 8 M5 20/ 30/ 40/ 50 10 10
F
material: brass
surface: 6 m nickel-plated, solderable

other lengths and threads on request

... please indicate length "L"
L 0,1
G
P P
D

H
H
art. no. dim. [mm]
H D/D' L P P'
ABP 2550 ... 5 M2.5 10 =L
ABP 2550 ... 5 M2.5 15/ 20/ 25/ 30 6 6 I
ABP 3060 ... 6 M3 10/ 12/ 15 =L
ABP 3060 ... 6 M3 20 8 8
ABP 3060 ... 6 M3 25/ 30 10 10
ABP 4080 ... 8 M4 10/ 15/ 20 =L
ABP 4080 ... 8 M4 30/ 40 10 10 K
material: polyamide, GF reinforced
temperature range: -30C... +110C
colour: black

Spacers E 40 Mounting material for semiconduct. E 44 48

Screw mounted guide rails E 26 30 Mounting parts for heatsinks E 49 50
Ejectors E 31 Thermal conductive material E 2 24 E 38 N
Vibration dampers E 41 Technical introduction A28
A
Distance sleeves for PCB in HP grid

C
these internally threaded distance sleeves mount PCBs to the correct pitch for insertion into subracks
ABM TE: spacer between two PC boards
ABM TE ... DIN:spacer between two PC boards, one of them equipped with DIN-connector resp. A front panal/PCB Interconnection
D deviece VS 1
spacers with internal and external thread to HP grid on request

art. no. suitable for TE dim. [mm]

F L P/P'
ABM TE 04 4 18.72 8
ABM TE 06 6 28.88 8
ABM TE 08 8 39.04 8

H
art. no. suitable for TE dim. [mm]
L P
ABM TE 04 DIN 4 12.72 =L
I ABM TE 06 DIN 6 22.88 8
ABM TE 08 DIN 8 33.04 8
material: brass
surface: 8 m nickel-plated, solderable

... please indicate length "L"

K L 0,1
D

L art. no. dim. [mm]

A D L
AHM 3260... 6 3.2 1/ 2/ 3/ 4/ 5/ 6/ 7/ 8/ 9/ 10/ 12/ 15/ 18/ 25/ 30
AHM 4380... 8 4.3 2/ 3/ 4/ 5/ 6/ 7/ 8/ 9/ 10/ 12/ 15/ 18/ 20
material: brass
M surface: 8 m nickel-plated, solderable

Spacers E 40 Mounting material for semiconduct. E 44 48

Screw mounted guide rails E 26 30 Mounting parts for heatsinks E 49 50
N E 39 Ejectors E 31 Thermal conductive material E 2 24
Vibration dampers E 41 Technical introduction A28
 A
Distance spacers
special lengths on request

art. no. C [mm] art. no. C [mm] art. no. C [mm]

DR 071 V0 1 DR 079 V0 9 DR 725 V0 25
DR 072 V0 2 DR 710 V0 10 DR 730 V0 30
C
DR 073 V0 3 DR 711 V0 11 DR 735 V0 35
DR 074 V0 4 DR 712 V0 12 DR 740 V0 40
DR 075 V0 5 DR 713 V0 13 DR 745 V0 45
DR 076 V0 6 DR 714 V0 14 DR 750 V0 50 D
DR 077 V0 7 DR 715 V0 15 DR 760 V0 60
DR 078 V0 8 DR 720 V0 20

E
art. no. C [mm] art. no. C [mm] art. no. C [mm]
DR 081 V0 1 DR 089 V0 9 DR 825 V0 25
DR 082 V0 2 DR 810 V0 10 DR 830 V0 30
DR 083 V0 3 DR 811 V0 11 DR 835 V0 35 F
DR 084 V0 4 DR 812 V0 12 DR 840 V0 40
DR 085 V0 5 DR 813 V0 13 DR 845 V0 45
DR 086 V0 6 DR 814 V0 14 DR 850 V0 50
DR 087 V0 7 DR 815 V0 15 DR 860 V0 60 G
DR 088 V0 8 DR 820 V0 20

H
art. no. C [mm] art. no. C [mm] art. no. C [mm]
DR 105 V0 5 DR 125 V0 25 DR 140 V0 40
DR 110 V0 10 DR 130 V0 30 DR 145 V0 45
DR 115 V0 15 DR 135 V0 35 DR 150 V0 50
DR 120 V0 20
I
material: polyamide
heat distortion: 180C
temperature range: +180C
colour: black K
class of flammibility: UL 94 V-0

Spacers E 40 Mounting material for semiconduct. E 44 48

Screw mounted guide rails E 26 30 Mounting parts for heatsinks E 49 50
Ejectors E 31 Thermal conductive material E 2 24 E 40 N
Vibration dampers E 41 Technical introduction A28
A
Contructional elements to vibration damping and insulation
universal applicable round metal, antivibration buffers for solving vibration problems
other lengths and hardness range on request
B ... please indicate height "H"

Field of applications:
reduction of dynamic component stress
vibration insulation for disc drives and motors
C impact reducing on sensitive instruments
reduction of the noise level
prevention of vibration resonance phenomena (amplified effect)
compensation of mechanical inbalances
G

L
D

H
L
D

art. no. dim. [mm]

H type of thread D L
E SMP 410 A 10 M4 10 10
SMP 415 A 15 M4 15 10
SMP 515 A 15 M5 15 12

L
G

H
F
L
D

art. no. dim. [mm]

H type of thread D L' L
SMP 410 B 10 M4 10 4 10
G SMP 415 B 15 M4 15 4 10
SMP 515 B 15 M5 15 5 12
L

G
H

H D

art. no. dim. [mm]

H type of thread D L'
SMP 410 C 15/ 20 M4 10 4
SMP 415 C 15/ 20 M4 15 4
I SMP 515 C 20 M5 15 5
material: rubber-metal connection
rubber: natural rubber (NR according to ISO)
hardness range: ~ 50 Shore A
extensibility and tebsile strength: very good
K colour: black
metall parts: steel tin-plated
temperature range: -40C... +80C (short term +90C)

Screw mounted guide rails E 26 28 Insulting clamping parts E 45

Ejectors E 31 Mounting parts for heatsinks E 49 50
N E 41 Insulating distance sleeves E 32 39 Mounting material for semiconduct. E 44
Spacers E 40 Technical introduction A28
 A
Solder terminals
art. no.
2,4

1,2 B

7,5
1,2

1
3,5
1, 5
3,8
4,4
LSD 07520 C
art. no. 2

2,5
1

1,5
8,9
D

3,5

1
3,8
LSD 08910 4,4
art. no. 2
E

2,5
1

8,9

1
3,5
1,5
3,8
LSD 08920 4,4 F
art. no. 2
1
2,5
13,5

G
3,5

1,5
1

3,8
4,7

1,5
LSD 13510 4,4
art. no. 2
1 H
2,5
13,5

1
3,5

1,5
4,7

3,8

LSD 13520
1,5
I
4,4
material: insulating body: PTFE (teflon)
contact pin: brass, 2 m Ni, 4 m Ag
temperature range: -200C ... +260C
K

Screw mounted guide rails E 26 28 Insulting clamping parts E 45

Ejectors E 31 Mounting parts for heatsinks E 49 50
Insulating distance sleeves E 32 39 Mounting material for semiconduct. E 44 E 42 N
Spacers E 40 Technical introduction A28
A
Solder pins

3 3,5 2,8 2,8

3
B 2,2

1,2 1,4 1,2 0,95

8,5
1,3

11,3
11,3

10

2,9

13
4

7
5

6,6
1,2 1,4 1,4 1,4 1,1
C
art. no. art. no. art. no. art. no. art. no.
LS 101 LS 102 LS 103 LS 104 LS 105
0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.5 mm

3,8
D 2,8 2,8

1,4
1,4
10,5

16
3,5

E 1,2 1,4

art. no. art. no.

LS 106 LS 107
0.8 mm 0.5 mm

F
= thickness

LS
material brass, 6 m Sn
G

Solder terminals E 42 Miniature distance sleeves E 34

Distance sleeves for PCBs in HP grid E 39 Mounting material for semiconduct. E 44 48
N E 43 Spacers E 39 40 Mounting parts for heatsinks E 49 50
Insulting clamping parts E 45 Technical introduction A28
 A
Mounting kits for insulation of power transistors

art. no. for transistor version contents of delivery D

MST 3 TO 3 with mica wafer GS 1 mica wafer, 2 insulator sleeves, 1 tin-plated solder lug, 2 cheese
3 head screws, nickel-plated, 2 screw nuts M3 nickel-plated
MSTS 3 TO 3 with silicone wafer 1 silicone wafer, 2 insulator sleeves, 1 tin-plated solder lug, 2
WS 3 cheese head screws, nickel-plated, 2 screw nuts M3 nickel-plated
MST 220 TO 220 with mica wafer GS 1 mica wafer, 1 tin-plated solder lug, 1 cheese head screw, nickel- E
220 plated, 1 screw nut M3 nickel-plated
MSTS 220 TO 220 with silicone wafer 1 silicone wafer, 1 insulator sleeve, 1 tin-plated solder lug, 1
WS 220 cheese head screw, nickel-plated, 1 screw nut M3 nickel-plated

Snap rivet for quick fastening of TO 220

detachable plastic snap rivet for quick fastening of transistors onto heatsinks and cooling plates (e.g. FK 212-CB, FK 216-CB, FK F
222-220. FK 232. FK 233. FK 235-L 1)
suitable for material thickness: 1 1.5 mm
suitable for hole diameter: 3.5 4 mm
* = bottom view, pin not inserted

G
0,85

6,4 4,6
1,6

*
4,5

H
6,1

3,5

art. no. for transistor

EPN 1 TO 220 I
material: polysulphone, GF reinforced
temperature range: -70C... +180C (5s+260C)
class of flammibility: UL 94 V-0

Mounting parts for heatsinks E 49 50 Vibration dampers E 41

Spacers E 40 Thermal conductive material E 2 24
Guide rails for PCBs E 26 30 Retaining springs for transistors A 115 117 E 44 N
Finger-shaped heatsinks C23 Technical introduction A28
A
Insulating clamping parts for power transistors
Plastic insulating clamping parts for mounting transistors in cases TO 220, TO 218 and TO 247 for enhanced
dielectric stengths
B electrically insulating assembly of the transistor by means of a plastic clamping part
pin reaching into the hole of the transistor plate
fastening of clamping part onto the mounting plate by screws, no electroinsulating connection to the transistor
dielectric strength only determined by the insulating washer between transistor and mounting surface
no insulating bush necessary, thus no dielectric breakdown
art. no.
C
15,2

3,7
3,4

3,4
3
3,7

10,1
8,5
D 4 6,5

ISP 220
art. no.

E 17,7 3,4
5,6

3,7

12,1
10
4,6 6,4
F
ISP 220 V
art. no.

18,5 3,5
5,8

3,7
G
15,2
0,9

12,1
3,8 7

ISP 218
H
art. no.

24
3,7
2

20

I
7

3,8 13,1

ISP 247
material: polyamide 6, GF reinforced
K dielectric strength: <27 kV/mm
heat distortion: 205C (1.8 MPa); 135C (8 MPa)
dielectric constant: 8 [100 Hz]/4.5 [1 MHz]
dielectric loss factor: 1300 [100 Hz] 450 [1 MHz]
L specific volume resistance: >1013 cm
colour: black
class of flammibility: UL 94 V-0

Profiles for PCB components A 91 Insulating distance sleeves E 32 34

Heatsinks for PCB A 89 Vibration dampers E 41
N E 45 Profiles for PCB mounting A 89 112 Aluminium oxide wafers E 17 18
Thermal conductive material E 2 23 Technical introduction A28
 A
Mounts
9,4 3 9,2 9,2
9,2 9 5
2,5 2,5 5,08 3
5,08 7 5,08
5,08
5
1
1 B
5,08

0,8
8

0,8

0,8
0,

0,8

art. no. art. no. art. no. art. no. art. no.
MS 53 3 MS 53 7 MS 53 25 MS 54 25 MS 58 5 C
TO 5 TO 5 TO 5 TO 5 TO 5-8 p.
1,5 1,5 9,5 1,5 5,08
9,2 9,5 9,5
5,08 2,54
1 2,5
5,08 7 5,08 1 1
5 1,5
5,08
0,8

9
D
0,8
0,

0,8
8

art. no. art. no. art. no. art. no. art. no.
MS 58 7 MS 56 15 MS 58 15 MS 510 15 MS 3518 25
TO 5-8 p. TO 5-6 p. TO 5-8 p. TO 5-10 p. TO 5/ TO 18
9,0 3,5 9,2 5,4 2,5 5,5 E
0,8

5,08 2,5 5,08 3,5 5,4 2,54 3,5

2,5 2,5
2,5 1
0,8

2,5 2,5
1

1
1
1
0,7

0,
2,54

5
art. no. art. no. art. no. art. no. art. no.
MS 3518 35 MS 34 518 MS 183 25 MS 184 25 MS 183 35
TO 5/ TO 18 TO 5/TO 18 TO 18 TO 18 TO 18
5,5 5,4 10 2,5
2,54 3,5 5,4
7 7 5,1 1,75
2,54 7,1
2,54 4
G
0,8

2,5 5 5

2,5
0,8

1
0,8

0,8
0,
5

art. no. art. no. art. no. art. no. art. no.
MS 184 35 MS 183 7 MS 184 7 MS 84 4 MS 923 25 H
TO 18 TO 18 TO 18 TO 8 TO 92
5,08
1,3 9,9 2,54 4
5,08 3,6
3,2

4
1,5

7,62
2,54

9,9

0,9 2,5
I
art. no. art. no. art. no.
MS 4016 US 58 4 US 512 4
max. 16 contacts TO 5 TO 5

* = transfer washer: the US-pads convent the TO 5 pin circle to a pitch of 2.54 mm
K

material: polyamide 6, GF reinforced

temperature range: -40C... +205C
class of flammibility: UL 94 V-0 (at thickness 3mm), UL 94 V-1 L

Mounting parts for heatsinks E 49 50 Insulating distance sleeves E 32 34

Heatsinks for PCB A 89 93 Finger-shaped heatsinks C23
Profiles for PCB mounting A 89 112 Retaining springs for transistors A 115 117 E 46 N
Thermal conductive material E 2 24 Technical introduction A28
A
Mounts
Mounts for power transistors
for TO 220, TO 219, TO 202 and similar
B for vertical and horizontal mounting
also suitable as mounting bracket for angled connections

1,3
10,8 1

3,2

5,6

1
C A

B
1,5 C

art. no. colour dim. [mm]

A B C
D MLW 32 white 3.2 7.1
MLW 44 white 4.4 1.3 7.1
MLW 51 white 5.1 1.9 7.1
material: polyamide 6 (nylon)
E temperature range: -40C... +120C
class of flammibility: UL 94 V-2

Mounts for rectangular LEDs

for LED 2x4 mm oder 2x5 mm
symmetric version for easy assembly
F self-adhesive
0,813

5,2
1,3 2,5
4,2
1,25

B
2,3 max.

G A
C

0,64
1,1
0,51

H art. no. colour dim. [mm]

A B C
MRL 20 white 2 0.5 1
material: polyamide 6 (nylon)
temperature range: -40C... +120C
I class of flammibility: UL 94 V-2

Mounting parts for heatsinks E 49 50 Insulating distance sleeves E 32 34

Heatsinks for PCB A 89 93 Finger-shaped heatsinks C23
N E 47 Profiles for PCB mounting A 89 112 Retaining springs for transistors A 115 117
Thermal conductive material E 2 24 Technical introduction A28
 A
Mounts for discrete components
suitable for various components e.g. resistors, capacitors etc.
D
A
B
1,1

B
C

F
E

art. no. dim. [mm] art. no. dim. [mm] C

A B C D E F A B C D E F
MD A 04 2.5 1.1 0.55 1.3 4.6 2.3 MD A 09 7.6 1.1 0.66 3.6 9.9 2.3
MD A 06 3.8 1.1 0.55 2.3 6.9 3.2 MD A 12 10.2 1.1 0.76 4.8 12.4 2.3
MD A 07 5.1 1.1 0.55 2.3 7.4 2.3
0,81 B
D
1,3
0,64

0,89

2,5

2,5
1,7
0,76

A
E
art. no. dim. [mm] art. no. dim. [mm]
A B A B
MD B 07 7.6 5.1 MD B 12 12.7 10.2
MD B 10 10.2 7.6 MD B 15 15.2 12.7
MD B 11 11.4 8.9 F
2,3
5,1

30

1,1
A

2,3
7,4
G
art. no. dim. [mm] art. no. dim. [mm]
A A B
MD C 13 1.3 MD C 22 2.2 0.89
material: polyamide 6 (nylon) H
temperature range: -30C... +110C
class of flammibility: UL 94 V-2

Profiles for PCB components A 91 Insulating distance sleeves E 32 34

Heatsinks for PCB A 89 Finger-shaped heatsinks C23
Profiles for PCB mounting A 89 112 Retaining springs for transistors A 115 117 E 48 N
Thermal conductive material E 2 23 Technical introduction A28
A
Mounting parts for heatsinks
art. no. 7

4,2
10 4 10
7,3
B

7,3

26
2

20
9 4

4
4,2 4

4,2
5 25,7 5
C 35,7
IS 1 for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69; heatsink length: 50 mm
art. no. 7

4,2
10 4 10
7,3
4,2

7,3
D

26
2

20
9 4
7

4,2
4

2
4
5 19,5 5
29,5
IS 2
E for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69; heatsink length: 37.5 75 100 mm
art. no.
10
9,3
4,2

6,9
10
222

F
5,5

IS 3 for SK 01, 02, 03, 11, 14, 21, 30, 34, 36, 39, 46, 69
art. no. 16 14,6
12,5 1,8
G
34,5

4,2

11,6
14

7,3 2,7
8,6
H IS 4 for SK 06
art. no.
7
3

M2,5
2

I
10
7

IS 5 for SK 20
art. no.
K 6,2
12
3
13
14,5

25
4
2,5
2,5

L M5
5
15

IS 6 for SK 67
material: polyamide 6, GF reinforced
class of flammibility: UL 94 V-0
M

Heatsink profile-overview A 13 17 Insulting clamping parts E 45

Profiles for PCB mounting A 89 112 Mounting pads for transistors E 47
N E 49 Heatsinks for PCB A 89 93 Mounting pads for single components E 48
Insulating distance sleeves E 32 34 Technical introduction A28
 A
Mounting parts for heatsinks
art. no. 13
6,2 3
B

13,5

24,5
6
3,5
M5 5
10,5
IS 7
C
art. no. 6,8 13
4,2 3

10
2
19,5

3
D

9,5
M3 5

IS 8 for SK 20
material: polyamide 6, GF reinforced
class of flammibility: UL 94 V-0 E
Sockets for power transistors TO 3
30,2
5,5 17
39,8
6,4

1,5

0,8
11,4
5,5 F

10,9
17,5

4
5,9
14,6

3,3
art. no. no. of contacts
G
TF 3 2 3
insulating body material: stanyl PA 4.6
contact: CuSn-alloy, CuSn 6; Ni 1-2m, Au 0.2m
current rating: 15 A max. H
contact resistance: <10 m
temperature range: -65C ... +290C
capacity: 1 pF
test voltage: 1650 V
class of flammibility: UL 94 V-0 I

Heatsink profile-overview A 13 17 Insulting clamping parts E 45

Profiles for PCB mounting A 89 112 Mounting pads for transistors E 47
Heatsinks for PCB A 89 93 Mounting pads for single components E 48 E 50 N
Insulating distance sleeves E 32 34 Technical introduction A28
A
Insulating caps
different transistor flange levels will be by the sleeves
art. no.
B

29

11
C 30,2 3,2
43,6
IK 341 3
art. no.

26,5
11,6
41,3 12,3
E
IK 3
material: polyamide, GF reinforced
pressed-in sleeves: brass, nickel-plated
class of flammibility: UL 94 V-0
F

Mica wafers E 19 Aluminium oxide wafers E 17 18

Thermal conductive material E25 Thermal conductive paste E 21 22
N E 51 Mounting for TO 3 angle A 125 Thermal conductive glue E 23 24
Die-cast heatsinks A 125 128 Technical introduction A28
 A
Insulating bush

7,1
9,3 6,3 4,2
9,2 B

1,8
1,5

2,6
1,05

1,2

4,2
1,4

1,9

2,2
4,7

2,5
3,2 2,6 3,1
4
3,1 4,4 3 4
6,3
3,9 6,2

C
art. no. art. no. art. no. art. no. art. no.
IB 1 / IBT 1 IB 2 / IBT 2 IB 3 / IBT 3 IB 4 / IBT 4 IB 5

8
6 D
1,6

6 6
6,4

1
1

1,2
1

2,2

2,3
3,5
7,5

4
3,1 3,1
3,1 3,05 3,8
3,5
3,3 3,5 3,55
4,3
E
art. no. art. no. art. no. art. no. art. no.
IB 6 / IBT 6 IB 7 / IBT 7 IB 8 / IBT 8 IB 9 / IBT 9 IB 10 / IBT 10
6,5
7
F
1,7

7,1 8 7,5

1,5
6,2

1
2,1

7,7
1

4,5
3,5

4,4

6
3,1 2,6 3,1
3,1 3
3,8 3 3,9
3,85 4
4,15
G
art. no. art. no. art. no. art. no. art. no.
IB 11 / IBT 11 IB 12 / IBT 12 IB 13 IB 14 / IBT 14 IB 15 / IBT 15
10

H
5,8

7
6
1

3,5

1,4
1

3,1
1,4

3,1 3,5
4

3,5

3,1
3,5
I
art. no. art. no. art. no.
IB 16 IB 17 IB 18 / IBT 18

IB 1 - IB 7 / 18 IBT 1 - IBT 15 / 18 IB 8 - IB 17
material polyamide 4.6, GF reinforced PTFE (teflon) thermoplastic resin K
form stability -40C ... +250C -260C ... +250C -40C ... +200C
(1.8 MPa)
dielectric strength 30 kV/mm 40 kV/mm 38 kV/mm
class of flammibility UL 94 V-0
L

Mica wafers E 19 Aluminium oxide wafers E 17 18

Thermal conductive material E25 Thermal conductive paste E 21 22
Mounting for TO 3 angle A 125 Thermal conductive glue E 23 24 E 52 N
Insulating distance sleeves E 32 128 Technical introduction A28
High quality surface treatment
for electronic components
Gold-plating
properties: high resistance to wear, good
corrosion resistance, temperature
stability and solderability
process: drum technology
materials: non-ferrous metals
coating system: copper/nickel/gold
Anodising
performance: fabrication of corrosion resistant,
decorative oxide films
process: anodic oxidation in fully
automated equipment
materials: aluminium and aluminium alloys
max. component size: 1500 x 2000 x 450 mm
colour: natural aluminium or black
Tin-plating
properties: solderable layers with improved
tarnishing and corrosion resistance
process: drum technology
materials: non-ferrous metals
coating system: copper/nickel/tin
Degreasing
performance: degreasing of oily or greasy
metallic surfaces
process: steam degreasing using chlorina-
ted hydro-carbons in hermetically
sealed equipment
material: aluminium and aluminium alloys
min. component size: 30 x 30 x 30 mm
max. component size: 600 x 400 x 380 mm
max. component weight: 80 kg
High quality surface treatment
for electronic components

Transparent passivating Vibratory grinding

(surface free from chromium VI)
characteristics: environmental compatibility due to chrome
free passivation of the aluminium surfaces
process: fabrication of conversion coatings by
immersion process
materials: aluminium und aluminium alloys
max. component size: 1500 x 2000 x 450 mm
colour: natural aluminium or black
characteristics: deburring, removing of sharp edges,
rough and fine grinding
process: treatment using vibration technique and
grinding tools (trowalization)
materials: metallic, aluminium favourized
max. component size: 230 x 200 mm

Anodisation facility
economization of water by using spray-rinsing,
automized ion exchange installation, cascade water
guided system and recirculation of splash water
reduction of electrical energy by means of current
density regulation
reduction of chemicals by recirculation of the
dragged-off chemicals using a compensation of the
evaporation losses
recycling of the sulphuric acid out of the anodizing bathes
General Business conditions
1. General provisions
Our deliveries are exclusively subject to
the conditions set forth herein which shall
be deemed to be explicitly accepted by the
purchaser. No conditions which may appear
on the purchasers order shall be binding on
us, even without our express contradiction.
2. Quotations and orders
Our quotations are not binding on us. This
applies also to information contained in
price lists, leaflets etc.. Delivery dates stated
in our quotations or given to the purchaser
by any other means are approximate, and
we endeavour to keep to them. Delays in
delivery shall give no right to claims, unless we
have explicitly confirmed such delivery dates
and an adequate period of grace granted to
us has expired. Orders shall only be binding
on us when they are explicitly confirmed in
writing, regardless of the form in which they
have been placed with us. Furthermore the
characteristics of our samples cannot be
regarded as guaranteed characteristics.
3. Prices
Prices shall be valid only when confirmed by
us in writing. They are exclusive of VAT at the
current rate and incidentals such as postage
and packing, freight, insurance etc.. If delive-
ry is made more than 4 months after the date
of order, we shall be entitled to invoice the pri-
ce valid at the date of despatch, even though
different prices were initially confirmed. The
price valid at the date of despatch shall also
apply if the order was confirmed without
prices. When an order on call is placed,
partial deliveries shall be invoiced at the price
valid at the date of despatch. Any request by
the purchaser for subsequent modifications
shall give us the right to amend prices.
4. Conditions of payment
Payment of the invoice amount shall
become due following receipt of the invoice.
Payments made within 14 days of the date of
invoice give the right to a 2% cash discount.
Payments 30 days after the date of invoice
shall be made without any deduction. If the
purchaser is in default with any payment, we
are entitled to claim interest for such default at
the normal rate for current accounts. If greater
damage can be demonstrated to have been
caused by the delay, we are entitled to request
compensation for such damage.
5. Set-off, right to retention
Only uncontested or legally binding counter-
claims may be offset against our invoices.
Any right to a retention to be exercised by
the purchaser in connection with our claims is
explicitly excluded.
6. Delivery
Delivery of our goods is explicitly made on
behalf of and at the risk of the purchaser.
The risk shall pass on to the purchaser when
the ordered goods leave our premises. The
same applies if goods are collected in our
premises after notification of their readi-ness.
We decide at our discretion on the most
economical delivery method without as-
suming any liability for the chosen means of
delivery.
7. Specially manufactured goods
Components made according to a sample
or a drawing or by special request must be
taken over and paid for, unless they have
a defect we are answerable for and which
makes the components completely unfit for
the purchasers purposes. If their fitness for
the purchasers purposes is only reduced,
the purchaser may request a reduction of
payment but the contract shall not be
cancelled.
8. Quantities
We are entitled to supply quantities which
are above or below the ordered quantities by
up to 10%. Such deviations are usual in this
trade and the deliveries are deemed as being
in compliance with the contract.If delivery
quantities fall below the ordered quantities
there shall be no right to subsequent delivery
of the missing quantity.
9. Reservation of proprietary rights
9.1. All goods supplied shall remain our
property until all of our claims resulting
from the contract have been paid in full.
The purchaser is entitled to dispose of the
purchased goods in the ordinary course
of business transactions. Reservation of
proprietary rights also applies to products
resulting from processing, mixing up or
combining our goods with goods of third
parties, in which case we are considered as
manufacturers. In the case where our goods
are processed, mixed up or combined with
goods of third parties, and the proprietary
rights of such third parties remain in force,
we are entitled to co-ownership according
to the proportion of the amount invoiced for
such processed goods. Such right to
coownership shall be safeguarded by the
purchaser.
9.2. The purchaser shall transfer to us, as a
security, his claims against third parties
resulting from the re-sale of our goods in
full or in the proportion of our co-ownership
(see subparagraph 9.1). He is entitled to
collect the amount of such claims on our
behalf until revoked or until cessation of
his payments made to us. The purchaser is
not entitled to assign these claims to third
parties.
9.3. The purchaser is not entitled to mortgage
or transfer the goods which are subject to
reservation by way of security.
9.4. The purchaser shall advise us immediately
at any seizure of our goods or of any
infringement of our rights by third parties.
9.5. In case of a default in payment or a
deterioration in the financial situation, we
are entitled to request immediate handing
over of the goods which are subject to
reservation. Any time limited claims shall
immediately become due.
9.6. If the value of the securities exceeds our
claims by more than 20%, securities to a
corresponding amount will be released by
us on request at our discretion.
10. Warranty
10.1. We expressly point out that all information
and data is given to the best of our
knowledge and belief. The user is solely
responsible for the proper use of our
products and he should check their
suitability for the intended application.
Fischer Elektronik do not assume any
warranty, whether expressed or implied, for
the suitability, function or merchantibility of
their products in specific or general appli-
cations, and they cannot be held liable for
accidental or consequential damage due to
non-observance of the above.
10.2. Claims for defects can only be
considered if the purchaser has complied
with his obligation to check and put for-
ward a complaint as per 377 HGB.
10.3. If goods have a defect attributable to us,
we are obliged to provide subsequent
fulfilment, excluding the purchasers right
to withdraw from the contract or to reduce
the purchase price (abatement), unless we
are entitled to refuse subsequent fulfilment
by virtue of legal provisions. The purchaser
shall grant us an adequate period of
grace for subsequent fulfilment. Subsequent
fulfilment may at our discretion be an
elimination of the defect (rectification) or the
supply of new products.
10.4. If rectification of the defect has failed, the
purchaser shall be entitled to request a
reduction in the purchase price (abatement)
or to withdraw from the contract. Rectifica-
tion shall be deemed to have failed after the
second vain attempt, unless further attempts
are reasonable in view of the object of the
contract and can be reasonably imposed on
the purchaser.
10.5. The purchasers right to put forward further
claims for damages shall remain unaffected
by this.
10.6. The purchasers warranty claims shall
come under the limitation of time which is
12 months from the delivery of the goods to
the purchaser, unless we have fraudulently
concealed the defect. In this case, the legal
provisions shall apply.
10.7 The purchasers claims for damages shall
come under the limitation of time which is
12 months from the delivery of the goods.
This does not apply if the threat to life,
bodily injury or injury to health is
imputable to us, our legal representatives
or other vicarious agents, or if we or our
legal representatives have been grossly
negligent, or if our vicarious agents have
acted deliberately.
11. Withdrawal
When delivery in accordance with the
contract is not possible for reasons beyond
our control, we are entitled to withdraw from
the contract. Such withdrawal shall not entitle
the purchaser to assert any right against us.
12. Place of performance, place of venue,
applicable law
12.1. The place of performance and the place of
venue for deliveries and payments and for
any litigation arising between us and the
purchaser shall be the headquarters of our
company.
12.2. The relations between the parties to the
contract shall be exclusively governed by
the law of the Federal Republic of Germany.
The application of the UN Conventions on
contracts for the international sale of goods
is excluded.
If any provision herein is or will become invalid,
such provision shall not affect the validity of the
remaining provisions. The invalid provision shall
be replaced by a valid provision which shall meet
as closely as possible the legal and commercial
purpose of the original one.
As at: 1. 1. 2014
How to find us

Fischer Elektronik GmbH und Co. KG

Nottebohmstrae 28
D 58511 Ldenscheid
Telefon: +49 (0) 23 51 / 4 35 - 0
Telefax: +49 (0) 23 51 / 4 57 54 N
info@fischerelektronik.de
www.fischerelektronik.de
www.facebook.de/fischerelektronik

exit
Ldenscheid

town centre

exit
Ldenscheid-Sd
 art. no. HEATSINKS & CASES SURFACES
The information given in this catalogue were established and examined
carefully. Nevertheless, mistakes or printing errors, and especially art. no. HEATSINKS & CASES SURFACES
The information
technical given in and
modifications this catalogue
updating andwereimprovement
established and
of our examined
products,
carefully.
cannot beNevertheless,
excluded. All mistakes or are
printing errors,even
andif especially
technical modifications and
trade marks
updating No
recognised
andidentification
improvementdoes of our
they are not AL raw degreased aluminium
specifically identified or mentioned. notproducts,
imply that
cannot be excluded. All trade marks are recognised even if
a product or trademark is not registered. No part of this catalogue they are not
may AL raw degreased aluminium
specifically identified
be reproduced or mentioned.
or distributed No identification
without prior writtendoes not imply
consent that
of Fischer
a Elektronik.
product or All
trademark is not registered.
data contained No part of in
in this catalogue, thistexts,
catalogue may
illustrations,
BZ raw pickled aluminium
bedocuments
reproduced or distributed without prior written consent of Fischer
Elektronik.
and descriptions are subject to copyright and the provisions
All16016.
data contained in this catalogue, in texts, illustrations,
BZ raw pickled aluminium
of DIN ISO All rights reserved.
documents and descriptions are subject to copyright and the provisions LP outside black lacquered RAL 9005/transparent passivated
ofDIN ISO 16016.
Copyright AllElektronik
Fischer rights reserved.
1969 ... 2014
LP outside black lacquered RAL 9005/transparent passivated
Copyright Fischer Elektronik 1969 ... 2014 ME clear anodised
ME clear anodised
MI solderable surface
MI solderable surface
SA black anodised
SA black anodised
TP chrome-free transparent passivated

TP chrome-free transparent passivated

art. no. CONNECTOR CONTACT SURFACE FINISH

art. no. CONNECTOR CONTACT SURFACE FINISH
G gold-plated
G gold-plated
S selective gold-plated
S selective gold-plated
Z tin-plated
Z tin-plated
Fischer Elektronik GmbH & Co. KG
Postfach 1590
Fischer D-58465
Elektronik Ldenscheid
GmbH & Co. KG
Hausadresse/House
Postfach 1590 D-58465 Address/Adresse
Ldenscheidde domicile
art. no. RAL COLOURS ARTICLES
Nottebohmstr. 28 D-58511
Hausadresse/House Address/Adresse Ldenscheid
de domicile art. no. RAL COLOURS ARTICLES
Telefon: 0 23 51 / 4 35 - 0
Nottebohmstr. 28 D-58511 Ldenscheid
Telefax:
Telefon: 0 23 51 / 4 35 - 0 GO 6026 opal green system cases RackCase/shell cases
Verkauf / sales / ventes
Telefax: GO 6026 opal green system cases RackCase/shell cases
0 23 51 / 4 57 54
Verkauf / sales / ventes K 7032 gravel grey bench cases
Einkauf / purchasing / achats
0 23 51 / 4 57 54
Fischer
0 23 51 / Elektronik
Einkauf
45 94 33
/ purchasing / achats GmbH & Co. KG K 7032 gravel grey bench cases
Export
P.O. / exports
Box 1590 / exports LG 7035 light grey shell cases
Fischer
0 23 51 / Elektronik
45 94 33 GmbH & Co. KG
0 23 51 /Ldenscheid
D-58465 43 51 85
Export
P.O. Box/ exports
1590 / exports LG 7035 light grey shell cases
info@fischerelektronik.de
0 23 51 /Ldenscheid
D-58465 43 51 85
House Address
www.fischerelektronik.de NB 5022 night blue system cases RackCase/shell cases
info@fischerelektronik.de
Nottebohmstr. 28 night blue system cases RackCase/shell cases
House Address
www.fischerelektronik.de
Fischer Elektronik NB 5022
D-58511 Ldenscheid
Nottebohmstr. 28 S 9005 deep black bench cases/shell cases/system cases RackCase
sterreich
Fon:
Fischer +49Ges.
(0) 23m.b.H.
Elektronik 51 4 35 - 0
D-58511 Ldenscheid
Firmiangasse
Fax: sales +4949 - 51
(0) 23 51A -1130 Wien
4 57 54 S 9005 deep black bench cases/shell cases/system cases RackCase
sterreich +49Ges.
(0) 23m.b.H.
f.cool.e 08-2014

Fon: 51 4 35 - 0
Telefon: 01 +49
purchasing / 8 76(0) 62
23 27
51 45 94 33
Firmiangasse
Fax: sales +49 49 (0)
- 5123 51A -1130 Wien
4 57 54 TB 5018 turquoise blue system cases RackCase/shell cases
f.cool.e 08-2014

exports 01 +49
Telefax: / 8 76(0) 62
23 27-11
51 43 51 85
Telefon:
purchasing01 +49
/ 8 76
(0) 62
23 27
51 45 94 33
info@fischerelektronik.de
online@fischerelektronik.co.at TB 5018 turquoise blue system cases RackCase/shell cases
exports 01 +49
Telefax: (0) 62
/ 8 76 23 27-11
51 43 51 85
www.fischerelektronik.de
www.fischerelektronik.at UL 5002 ultramarine blue Plusline/shell cases
info@fischerelektronik.de
online@fischerelektronik.co.at
www.fischerelektronik.de
www.fischerelektronik.at UL 5002 ultramarine blue Plusline/shell cases