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Schematic:
Analysis: (a) For the boiling process, the rate equation can be rewritten
as
_ q s" q'
h s /(Ts Tsat )
(Ts Tsat ) D
_
3150W / m W
h /(126 100)C 1.00 10 6 2 / 26 C 38,600W / m 2 .K
0.001m m
Note that heat flux is very close to qmax, and nucleate boiling exists.
(b) For nucleate boiling, the Rohsenow correlation may be solved for
Cs,f, to give
1
h g ( )
3
1/ 6
c p , Te
C s,f 'f ,g n
qs h f , g Pr
1/ 3 1/ 6
279 10 6 N .s / m 22257 10 3 J / kg 9.8m / s 2 (957.9 0.5955kg / m 3
C s, f
1.00 10 6 W / m 2 58.9 10 3 N / m
4217 J / kg.K 26 K
2257 10 3
J / kg 1.76
C s , f 0.017
Known: copper pan 150 mm in diameter and filled with water at 1atm,
maintained at 115C.
Find: the power required to boil the water and the evaporation rate;
ratio of the heat flux to the critical heat flux; pan temperature is
required to achieve the critical heat flux.
Schematic:
.
m
Electric range
element
qboil
Analysis: the power requirement for boiling and the evaporation rate
can be expressed as follows,
.
qboil q s" . As m qboil / h f , g
The heat flux for nucleate pool boiling can be estimated using the
Ronsenow Correlation.
3
g ( )
1/ 2
c p ,Te
q s h f , g
"
n
C s , f h f , g Pr
Selecting Cs , f =0.013 and n=1 from standard table for the polished
copper finish, find
1/ 6
279 10 6 N .s / m 2257 10 3 J / kg 9.8m / s 2 (957.9 0.5955kg / m 3
C s, f
58.9 10 3 N / m
4217 J / kg.K 26 K
2257 10 J / kg 1.76
3
C s , f 4.619 10 5 W / m 2
qboil 4.619 10 5 W / m 2 (0.150m) 2 8.16kW
4
.
m boil 8.16kW / 2257 10 3 J / kg 3.62 10 3 kg / s 13kg / h
Qmax=1.26MW/m2.
From the boiling curve, Te 30C will provide the maximum heat
flux
3. A silicon chip has a thickness L=25 mm and has thermal conductivity
ks=135W/m.K. The chip is cooled by boiling a saturated fluorocarbon
liquid (Tsat=57C) on its surface. The electronic circuits on the bottom
of the chip are perfectly insulated.
Schematic:
1/ 3
0.005(84,400 J / kg )9.011.7 5 10 4 W / m 2
Ts Tsat 6
1100 J / kg.K 440 10 kg / m.s 84,400 J / kg
1/ 6
8.1 10 3 kg / s 2
3
15.9C
9.807 m / s (1619.2 13.4)kg / m
2
(b) With the heat rate 90% of the critical heat flux (CHF)
1/ 4
g ( l v )
q "
max 0.149hfgv 0.149 84,400 J / kg 13.4kg / m 3
v 2
1/ 4
8.1 10 3 9.807 m / s 2 (1619.2 13.4)kg / m 3
13.4kg / m 3
"
q max 15.5 10 4 W / m 2 q "o 0.9q max
"
13.9 10 4 W/m 2
Comments: Pool boiling is not adequate for many VLSI chip design
4. Strip steel is made by rolling the strip on a set of rollers in a hot
rolling mill. As strip steel leaves the last set of rollers, it is quenched
by water jets before being coiled. Because the plate temperatures are
high, film boiling is achieved as a result.
Consider conditions for which the strip steel beneath the vapor blanket
is at a temperature of 907K and has an emissivity of 0.35. Neglecting
the effects of the strip and jet motions and assuming convection
within the film to be approximated by that associated with a large
horizontal cylinder of 1-m-diameter, estimate the rate of heat transfer
per unit surface area from the strip to the wall.
Schematic:
Wall jet
qs Water vapor
1/ 4
_ 9.8m / s 2 (957.9 175.4)kg / m 3 (2.02 10 7 J / kg )(1m) 3
N u D 0.62 6243
0.182 10 6 m 2 / s (0.155W / m.K )(907 373) K
hence,
_ _
h conv N u D k v / D 6243W / m 2 .K (0.155W / m.K / 1m) 968W / m 2 .K
_
h rad 24W / m2.K
_
hence, h 968W / m2.K (3 / 4)(24W / m2.K ) 986W / m2.K
Schematic:
. '
'
m q ' / h fg (1)
Where the heat rate follows from equation using overall heat transfer
coefficient
1
1 D /2 D D 1
U o o n o o (3)
ho k Di Di hi
1
1 0.0095m 19 19 1
Uo 2
n 2
6800W / m .K 110W / m.K 16.5 16.5 5200W / m .K
. '
m U oDo (Tsat Tm ) / h ' fg
. '
m 2627W / m 2 .K (0.019m)(320 303) K / 2410 10 3 J / kg 1.11 10 3 kg / s
Comments: (1) Note from evaluation of equation. (3) That the thermal
resistance of the brass tube is not negligible.
h 'fg 2410kJ / kg